U.S. patent application number 13/873484 was filed with the patent office on 2013-11-07 for heat dissipating device.
This patent application is currently assigned to MICROTIPS ELECTRONICS CO., LTD.. The applicant listed for this patent is MICROTIPS ELECTRONICS CO., LTD.. Invention is credited to Hsin-Hung Lin, Takeshi Omori.
Application Number | 20130292092 13/873484 |
Document ID | / |
Family ID | 49511660 |
Filed Date | 2013-11-07 |
United States Patent
Application |
20130292092 |
Kind Code |
A1 |
Omori; Takeshi ; et
al. |
November 7, 2013 |
Heat Dissipating Device
Abstract
A heat dissipating device includes a heat conducting member and
a coolant storing unit. The heat conducting member includes a
surrounding wall that defines an internal space and that is adapted
to be placed in contact with a heat source, and a plurality of heat
conducting plates that are spacedly disposed in the internal space,
that are connected to the surrounding wall, and that cooperate with
the surrounding wall to define a plurality of flow channels. The
coolant storing unit stores a coolant and is in fluid connection
with the heat conducting member. The flow channels extend upwardly,
and the coolant flows along the flow channels when the heat of the
heat source is transmitted to the coolant.
Inventors: |
Omori; Takeshi; (Kaohsiung
City, TW) ; Lin; Hsin-Hung; (Pingtung City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MICROTIPS ELECTRONICS CO., LTD. |
Kaohsiung |
|
TW |
|
|
Assignee: |
MICROTIPS ELECTRONICS CO.,
LTD.
Kaohsiung
TW
|
Family ID: |
49511660 |
Appl. No.: |
13/873484 |
Filed: |
April 30, 2013 |
Current U.S.
Class: |
165/104.11 |
Current CPC
Class: |
H01L 23/473 20130101;
F28D 15/0266 20130101; H01L 2924/0002 20130101; F28F 3/00 20130101;
H01L 2924/00 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/104.11 |
International
Class: |
F28F 3/00 20060101
F28F003/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 2, 2012 |
TW |
101115573 |
Claims
1. A heat dissipating device for dissipating heat from a heat
source, said heat dissipating device comprising: a heat conducting
unit including a heat conducting member made from a heat conducting
material, said heat conducting member including a surrounding wall
that defines an internal space and that is adapted to be placed in
contact with the heat source, and a plurality of heat conducting
plates that are spacedly disposed in said internal space, that are
connected to said surrounding wall, and that cooperate with said
surrounding wall to define a plurality of flow channels; and a
coolant storing unit for storing a coolant and in fluid connection
with said heat conducting member; wherein said heat conducting unit
is disposed to extend upwardly such that said flow channels extend
upwardly, and said coolant flows along said flow channels of said
heat conducting unit when the heat of the heat source is
transmitted to said coolant through said heat conducting unit.
2. The heat dissipating device as claimed in claim 1, wherein said
coolant storing unit includes two modules in fluid connection with
each other, each of said modules including a first coolant storage
member, a second coolant storage member, a plurality of conduit
members fluidly connecting said first coolant storage member and
said second coolant storage member, and a plurality of heat
dissipating fins connected between adjacent pairs of said conduit
members; wherein said first coolant storage members of said two
modules are in fluid connection with each other.
3. The heat dissipating device as claimed in claim 2, wherein said
first coolant storage members of said two modules are disposed side
by side with each other, and a distance between said second coolant
storage members of said two modules is greater than a distance
between said first coolant storage members of said two modules;
wherein each of said flow channels of said heat conducting member
has a lower end in fluid connection with said second coolant
storage member of one of said two modules, and an upper end in
fluid connection with said second coolant storage member of the
other one of said two modules; and wherein said heat conducting
member extends between said second coolant storage members of said
two modules and cooperates with said coolant storing unit to
configure said heat dissipating device to have a substantially
triangular shape.
4. The heat dissipating device as claimed in claim 2, wherein said
first coolant storage members of said two modules are disposed side
by side with each other, and a distance between said second coolant
storage members of said two modules is greater than a distance
between said first coolant storage members of said two modules;
wherein each of said flow channels of said heat conducting member
has a lower end in fluid connection with said first coolant storage
member of one of said two modules, and said heat conducting unit is
disposed to extend upwardly from said first coolant storage member
of said one of said two modules and cooperates with said coolant
storing unit to configure said heat dissipating device to have a
substantially inverted Y shape; and wherein each of said flow
channels of said heat conducting member further has an upper end,
and said heat conducting member further includes a cover body
disposed to seal said upper ends of said flow channels of said heat
conducting member, said cover body having a groove in fluid
connection with said flow channels.
5. The heat dissipating device as claimed in claim 4, wherein said
heat conducting member further includes a plurality of heat
dissipating plates extending outwardly from said surrounding
wall.
6. The heat dissipating device as claimed in claim 8, wherein said
heat conducting unit further includes a fan disposed on said heat
dissipating plates.
7. The heat dissipating device as claimed in claim 1, wherein said
coolant storing unit includes a module, said module including a
first coolant storage member, a second coolant storage member, and
a plurality of conduit members fluidly connecting said first
coolant storage member and said second coolant storage member;
wherein said first coolant storage member is disposed above said
second coolant storage member; wherein each of said flow channels
of said heat conducting member has a lower end in fluid connection
with said first coolant storage member, and said heat conducting
unit is disposed to extend upwardly from said first coolant storage
member; and wherein each of said flow channels of said heat
conducting member further has an upper end, and said heat
conducting member further includes a cover body disposed to seal
said upper ends of said flow channels of said heat conducting
member, said cover body having a groove in fluid connection with
said flow channels.
8. The heat dissipating device as claimed in claim 5, wherein said
heat conducting member further includes a plurality of heat
dissipating plates extending outwardly from said surrounding
wall.
9. The heat dissipating device as claimed in claim 6, wherein said
heat conducting unit further includes a fan disposed on said heat
dissipating plates.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority of Taiwanese application
no. 101115573, filed on May 2, 2012.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a heat dissipating
device.
[0004] 2. Description of the Related Art
[0005] Referring to FIG. 1, a heat dissipating device 1 according
to R.O.C. patent no. M261972 is shown to include a base 10 and a
heat dissipating unit 11 disposed on the base 10. As illustrated in
FIG. 2, the base 10 has a plurality of channels 101 intersecting
each other for coolant 100 to flow horizontally therewithin. When
in use, a heat source (not shown) is placed in contact with the
base 10. The coolant 100 absorbs the heat produced by the heat
source, and the heat is dissipated by the heat dissipating unit 11.
Normally, the coolant 100 is converted between gaseous and liquid
states for heat dissipation and coolant circulation of itself.
However, since the above-mentioned heat dissipating device 1 can
only enable the coolant 100 to flow horizontally due to the lack of
space for the conversion between gaseous and liquid states of the
coolant 100 is limited, such that the efficiency of heat
dissipation is relatively poor.
SUMMARY OF THE INVENTION
[0006] The object of the present invention is to provide a heat
dissipating device for dissipating heat from a heat source with
greater efficiency.
[0007] According to the present invention, there is provided a heat
dissipating device. The heat dissipating device includes a heat
conducting unit, which includes a heat conducting member made from
a heat conducting material. The heat conducting member includes a
surrounding wall that defines an internal space and that is adapted
to be placed in contact with the heat source, and a plurality of
heat conducting plates that are spacedly disposed in the internal
space, that are connected to the surrounding wall, and that
cooperate with the surrounding wall to define a plurality of flow
313.
[0008] The heat dissipating device further includes a coolant
storing unit for storing a coolant and in fluid connection with the
heat conducting member.
[0009] The heat conducting unit is disposed to extend upwardly such
that the flow channels extend upwardly, and the coolant flows along
the flow channels of the heat conducting unit when the heat of the
heat source is transmitted to the coolant through the heat
conducting unit.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Other features and advantages of the present invention will
become apparent in the following detailed description of the
preferred embodiments with reference to the accompanying drawings,
of which:
[0011] FIG. 1 is elevation perspective view of a conventional heat
dissipating device;
[0012] FIG. 2 is a horizontal sectional view of the conventional
heat dissipating device;
[0013] FIG. 3 is a perspective view of a heat dissipating device
according to a first preferred embodiment of the present
invention;
[0014] FIG. 4 is a perspective view of a heat conducting unit in
the first preferred embodiment of the present invention;
[0015] FIG. 5 is a schematic side view of the heat dissipating
device in the first preferred embodiment of the present
invention;
[0016] FIG. 6 is a perspective view of a heat dissipating device
according to a second preferred embodiment of the present
invention;
[0017] FIG. 7 is a schematic side view of the heat dissipating
device in the second preferred embodiment of the present invention;
and
[0018] FIG. 8 is a schematic side view of a heat dissipating device
according to a third preferred embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Referring to FIG. 3, a heat dissipating device 2 according
to the first preferred embodiment of this invention includes a heat
conducting unit 3 and a coolant storing unit 4 for storing a
coolant and in fluid connection with the heat conducting unit 3.
The coolant storing unit 4 includes two modules 41 in fluid
connection with each other. Each module 41 includes a first coolant
storage member 411, a second coolant storage member 412, a
plurality of conduit members 413 fluidly connecting the first
coolant storage member 411 and the second coolant storage member
412, and a plurality of heat dissipating fins 414 connected between
adjacent pairs of the conduit members 413. The first coolant
storage members 411 of the two modules 41 are disposed side by side
with each other. A distance between the second coolant storage
members 412 of the two modules 41 is greater than a distance
between the first coolant storage members 411 of the two modules
41. In this preferred embodiment, the first coolant storage members
411 of the two modules 41 are interconnected fluidly at both ends
using a pair of tubes 415. However, interconnection at only one end
of the first coolant storage members 411 of the two modules 41
using only one tube 415 may be employed in other embodiments of the
invention.
[0020] Referring to FIGS. 3 and 4, the heat conducting unit 3
includes a heat conducting member 31 made from a heat conducting
material. The heat conducting member 31 includes a surrounding wall
311 that defines an internal space and that is adapted to be placed
in contact with a heat source 9, a plurality of heat conducting
plates 312 that are spacedly disposed in the internal space and
that are connected to the surrounding wall 311, and a plurality of
flow channels 313 cooperately defined by the surrounding wall 311
and the heat conducting plates 312.
[0021] Referring to FIGS. 3 and 5, by virtue of the distance
between the second coolant storage members 412 of the two modules
41 being greater than the distance between the first coolant
storage members 411 of the two modules 41, the heat conducting unit
3 and the flow channels 313 are able to be disposed so as to extend
upwardly. Each of the flow channels 313 of the heat conducting
member 31 has a lower end in fluid connection with the second
coolant storage member 412 of one of the two modules 41, and an
upper end in fluid connection with the second coolant storage
member 412 of the other one of the two modules 41. The heat
conducting member 31 extends between the second coolant storage
members 412 of the two modules 41 and cooperates with the coolant
storing unit 4 to configure the heat dissipating device 2 to have a
substantially triangular shape in this embodiment.
[0022] When in use, the heat source 9 is placed in contact with the
surrounding wall 311 of the heat conducting member 31. The coolant
is in the form of a liquid when in a cooled state and is received
in the module 41 that is placed horizontally. When the heat of the
heat source 9 is transferred via the heat conducting member 31 to
the module 41 that is placed horizontally by conduction, the
coolant will absorb the heat and transform from being in a liquid
form to a gaseous form. The coolant in the gaseous form then moves
up along the flow channels 313 of the heat conducting member 31
from the second coolant storage member 412b of the module 41 that
is placed horizontally into the first coolant storage member 412a
of the other module 41, and then enters the first coolant storage
member 411a of the other module 41 through the plurality of conduit
members 413. As the coolant is passing through the conduit members
413, the heat will be dissipated by the heat dissipating fins 414
and the gaseous coolant will transform from the gaseous form back
into the liquid form and then enters the first coolant storage
member 411a. The liquid coolant then enters the first coolant
storage member 411b of the module 41 that is placed horizontally
through the tubes 415, enabling the coolant to flow between the
heat conducting member 31 and the two modules 41. To sum up, the
coolant circulates in the direction of the second coolant storage
member 412b, the flow channels 313 (see FIG. 4), the second coolant
storage member 412a, the first coolant storage member 411am the
first coolant storage member 411b and back to the second coolant
storage member 412b, as illustrated by the arrows in FIG. 5.
[0023] By virtue of the design mentioned above, the heat
dissipating device 2 provides enough space for the coolant to
transform between gaseous and liquid forms, and enables the coolant
to circulate between the heat conducting member 31 and the modules
41, thereby increasing the efficiency of transformation of the
coolant between gaseous and liquid forms and increasing the
efficiency of heat dissipation.
[0024] The second preferred embodiment of the heat dissipating
device 2 according to this invention is illustrated in FIGS. 6 and
7. In this embodiment, the first coolant storage members 411 of the
two modules 41 are both located above the second coolant storage
members 412, and a distance between the second coolant storage
members 412 of the two modules 41 is greater than a distance
between the first coolant storage members 411 of the two modules
41. Each of the flow channels 313 of the heat conducting member 31
has a lower end in fluid connection with the first coolant storage
member 411 of one of the two modules 41, and the heat conducting
unit 3 is disposed to extend upwardly from the first coolant
storage member 411 of the one of the two modules 41, and cooperates
with the coolant storing unit 4 to configure the heat dissipating
device 2 to have a substantially inverted Y shape. The heat
conducting member 31 further includes a cover body 314 disposed to
seal upper ends of the flow channels 313 of the heat conducting
member 31, and a plurality of heat dissipating plates 315 extending
outwardly from the surrounding wall 311. The cover body 314 has a
groove 316 in fluid connection with the flow channels 313.
[0025] When the heat of the heat source 9 is conducted from the
heat conducting member 31 to the modules 41, the liquid coolant
will absorb the heat and become gaseous coolant. The gaseous
coolant will move upwards from the second coolant storage members
412, enters the flow channels 313 of the heat conducting member 31
via the first coolant storage members 411, and circulates in the
flow channels 313 by passing through the groove 316 of the cover
body 314. When the gaseous coolant is flowing in the flow channels
313, the heat of the gaseous coolant is dissipated by the heat
dissipating plates 315, the gaseous coolant becomes a liquid
coolant and flows downwards towards the first coolant storage
members 411. The liquid coolant then flows back into the second
coolant storage members 412 through the plurality of conduit
members 413, whereby the remaining heat in the liquid coolant is
further dissipated by the plurality of heat dissipating fins 414
connected between adjacent pairs of the conduit members 413. By
virtue of such design, the coolant can be circulated within the
heat dissipating device 2, and the efficiency of heat dissipation
can be improved.
[0026] The third preferred embodiment of the heat dissipating
device 2 according to this invention is illustrated in FIG. 8,
wherein only one module 41 is connected to the heat conducting
member 31. The heat conducting unit 3 can further include a fan 317
disposed on the heat dissipating plates 315. With such an
arrangement, the coolant can still be circulated, and the fan 317
can further promote the efficiency of heat dissipation.
[0027] While the present invention has been described in connection
with what are considered the most practical and preferred
embodiments, it is understood that this invention is not limited to
the disclosed embodiments but is intended to cover various
arrangements included within the spirit and scope of the broadest
interpretation so as to encompass all such modifications and
equivalent arrangements.
* * * * *