U.S. patent application number 13/867567 was filed with the patent office on 2013-11-07 for cartridge for multiple thermoelectric modules.
This patent application is currently assigned to Phononic Devices, Inc.. The applicant listed for this patent is PHONONIC DEVICES, INC.. Invention is credited to Jesse W. Edwards, M. Sean June, James Barton Summers, III, Robert Joseph Therrien, Abhishek Yadav.
Application Number | 20130291560 13/867567 |
Document ID | / |
Family ID | 49511510 |
Filed Date | 2013-11-07 |
United States Patent
Application |
20130291560 |
Kind Code |
A1 |
Therrien; Robert Joseph ; et
al. |
November 7, 2013 |
CARTRIDGE FOR MULTIPLE THERMOELECTRIC MODULES
Abstract
Embodiments of the present disclosure relate to controlling
multiple Thermoelectric Coolers (TECs) to maintain a set point
temperature of a chamber. In one embodiment, a controller receives
temperature data corresponding to a temperature of the chamber.
Based on the temperature data, the controller selectively controls
two or more subsets of the TECs to maintain the temperature of the
chamber at a desired set point temperature. In this manner, the
controller is enabled to control the TECs such that the TECs
operate to efficiently maintain the temperature of the chamber at
the set point temperature. In another embodiment, the controller
selects one or more control schemes enabled by the controller based
on temperature data and a desired performance profile. The
controller then independently controls one or more subsets of the
TECs according to the selected control scheme(s).
Inventors: |
Therrien; Robert Joseph;
(Cary, NC) ; June; M. Sean; (Raleigh, NC) ;
Edwards; Jesse W.; (Cary, NC) ; Summers, III; James
Barton; (Raleigh, NC) ; Yadav; Abhishek;
(Raleigh, NC) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
PHONONIC DEVICES, INC. |
Durham |
NC |
US |
|
|
Assignee: |
Phononic Devices, Inc.
Durham
NC
|
Family ID: |
49511510 |
Appl. No.: |
13/867567 |
Filed: |
April 22, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13836525 |
Mar 15, 2013 |
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13867567 |
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61643622 |
May 7, 2012 |
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61643625 |
May 7, 2012 |
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61643628 |
May 7, 2012 |
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61643631 |
May 7, 2012 |
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61643635 |
May 7, 2012 |
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61643640 |
May 7, 2012 |
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61643644 |
May 7, 2012 |
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61643646 |
May 7, 2012 |
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61643649 |
May 7, 2012 |
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61716882 |
Oct 22, 2012 |
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61716885 |
Oct 22, 2012 |
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61739239 |
Dec 19, 2012 |
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Current U.S.
Class: |
62/3.3 ;
62/3.7 |
Current CPC
Class: |
F25B 2321/0212 20130101;
F25B 21/02 20130101; F25B 2321/025 20130101; F25B 2321/021
20130101; F25B 2700/2104 20130101; F25B 2321/023 20130101; F25B
21/04 20130101; Y02B 30/00 20130101 |
Class at
Publication: |
62/3.3 ;
62/3.7 |
International
Class: |
F25B 21/04 20060101
F25B021/04 |
Claims
1. A cartridge for a plurality of thermoelectric modules,
comprising: an interconnect board comprising: one or more
conductive traces; and one or more openings through the one or more
conductive traces from a first surface of the interconnect board to
a second surface of the interconnect board, the one or more
openings defining locations at which the plurality of
thermoelectric modules are to be mounted on the interconnect
board.
2. The cartridge of claim 1 wherein the one or more conductive
traces are a single conductive trace, and the one or more openings
are one or more openings through the single conductive trace from
the first surface of the interconnect board to the second surface
of the interconnect board that define locations at which the
plurality of thermoelectric modules are to be mounted on the
interconnect board such that the plurality of thermoelectric
modules are connected in series by the single conductive trace.
3. The cartridge of claim 1 wherein the one or more conductive
traces are a plurality of conductive traces, and, for each
conductive trace of the plurality of conductive traces, at least
one of the one or more openings defines one or more locations at
which one or more thermoelectric modules of the plurality of
thermoelectric modules are to be mounted on the interconnect board
such that the one or more thermoelectric modules are connected in
series by the conductive trace.
4. The cartridge of claim 3 wherein, for each conductive trace of
at least one of the plurality of conductive traces, at least one of
the one or more openings defines locations at which two or more
thermoelectric modules of the plurality of thermoelectric modules
are to be mounted on the interconnect board such that the two or
more thermoelectric modules are connected in series by the
conductive trace.
5. The cartridge of claim 3 wherein the plurality of conductive
traces and the one or more openings define locations at which two
or more different subsets of the plurality of thermoelectric
modules are to be mounted on the interconnect board such that the
two or more different subsets of the plurality of thermoelectric
modules can be independently controlled by controlling current
through the plurality of conductive traces.
6. The cartridge of claim 1 further comprising the plurality of
thermoelectric modules, wherein each thermoelectric module of the
plurality of thermoelectric modules is mounted over a corresponding
one of the one or more openings and electrically connected in
series with a corresponding one of the one or more conductive
traces.
7. The cartridge of claim 6 wherein, for each thermoelectric module
of the plurality of thermoelectric modules, the thermoelectric
module comprises a first contact that is electrically connected to
the corresponding one of the one or more conductive traces on one
side of the corresponding one of the one or more openings and a
second contact that is electrically connected to the corresponding
one of the one or more conductive traces on an opposite side of the
corresponding one of the one or more openings.
8. The cartridge of claim 6 wherein, for each thermoelectric module
of the plurality of thermoelectric modules, a hot side of the
thermoelectric module is exposed through the corresponding one of
the one or more openings.
9. The cartridge of claim 6 wherein, for each thermoelectric module
of the plurality of thermoelectric modules, a cold side of the
thermoelectric module is exposed through the corresponding one of
the one or more openings.
10. The cartridge of claim 6 wherein the one or more conductive
traces are a single conductive trace, the one or more openings are
one or more openings through the single conductive trace from the
first surface of the interconnect board to the second surface of
the interconnect board, and the plurality of thermoelectric modules
are mounted over the one or more openings such that the plurality
of thermoelectric modules are electrically connected in series by
the single conductive trace.
11. The cartridge of claim 10 wherein hot sides of the plurality of
thermoelectric modules are exposed through the one or more
openings.
12. The cartridge of claim 10 wherein cold sides of the plurality
of thermoelectric modules are exposed through the one or more
openings.
13. The cartridge of claim 6 wherein the one or more conductive
traces is a plurality of conductive traces, and, for each
conductive trace of the plurality of conductive traces, one or more
thermoelectric modules in a different subset of the plurality of
thermoelectric modules are mounted over at least one of the one or
more openings such that the one or more thermoelectric modules are
electrically connected in series by the conductive trace.
14. The cartridge of claim 13 wherein hot sides of the plurality of
thermoelectric modules are exposed through the one or more
openings.
15. The cartridge of claim 13 wherein cold sides of the plurality
of thermoelectric modules are exposed through the one or more
openings.
16. The cartridge of claim 6 wherein the one or more conductive
traces and the one or more openings define locations at which two
or more different subsets of the plurality of thermoelectric
modules are mounted on the interconnect board such that the two or
more different subsets of the plurality of thermoelectric modules
can be independently controlled by controlling current through the
plurality of conductive traces.
17. The cartridge of claim 16 wherein hot sides of the plurality of
thermoelectric modules are exposed through the one or more
openings.
18. The cartridge of claim 16 wherein cold sides of the plurality
of thermoelectric modules are exposed through the one or more
openings.
19. The cartridge of claim 6 wherein: the one or more conductive
traces comprise a first conductive trace; and the plurality of
thermoelectric modules comprise a first thermoelectric module
mounted over one of the one or more openings that passes through
the first conductive trace.
20. The cartridge of claim 19 wherein the plurality of
thermoelectric modules further comprise a second thermoelectric
module mounted over one of the one or more openings that passes
through the first conductive trace such that the second
thermoelectric module is electrically connected in series with the
first thermoelectric module via the first conductive trace.
21. The cartridge of claim 20 wherein: the one or more conductive
traces further comprise a second conductive trace; and the
plurality of thermoelectric modules further comprise a third
thermoelectric module mounted over one of the one or more openings
that passes through the second conductive trace.
22. The cartridge of claim 21 wherein the first and second
conductive traces enable the first and second thermoelectric
modules to be controlled independently from the third
thermoelectric module.
Description
RELATED APPLICATIONS
[0001] This application is a Continuation of U.S. application Ser.
No. 13/836,525 entitled THERMOELECTRIC REFRIGERATION SYSTEM CONTROL
SCHEME FOR HIGH EFFICIENCY PERFORMANCE, filed Mar. 15, 2013, the
disclosure of which is hereby incorporated herein by reference in
its entirety. This application also claims the benefit of: [0002]
Provisional Application Ser. No. 61/643,622, filed May 7, 2012;
[0003] Provisional Application Ser. No. 61/643,625, filed May 7,
2012; [0004] Provisional Application Ser. No. 61/643,628, filed May
7, 2012; [0005] Provisional Application Ser. No. 61/643,631, filed
May 7, 2012; [0006] Provisional Application Ser. No. 61/643,635,
filed May 7, 2012; [0007] Provisional Application Ser. No.
61/643,640, filed May 7, 2012; [0008] Provisional Application Ser.
No. 61/643,644, filed May 7, 2012; [0009] Provisional Application
Ser. No. 61/643,646, filed May 7, 2012; [0010] Provisional
Application Ser. No. 61/643,649, filed May 7, 2012; [0011]
Provisional Application Ser. No. 61/716,882, filed Oct. 22, 2012;
[0012] Provisional Application Ser. No. 61/716,885, filed Oct. 22,
2012; and [0013] Provisional Application Ser. No. 61/739,239, filed
Dec. 19, 2012; the disclosures of which are hereby incorporated
herein by reference in their entireties.
FIELD OF THE DISCLOSURE
[0014] The present disclosure relates to a thermoelectric
refrigeration system and more particularly relates to controlling
thermoelectric devices to efficiently maintain a desired set point
temperature in a thermoelectric refrigeration system.
BACKGROUND
[0015] Today, many refrigeration systems are vapor compression
based and utilize a thermostatically regulated duty cycle control.
However, typical vapor compression based refrigeration systems are
not dynamic enough to meet both the steady state and transient
demand, such as during pull down or recovery. Thus, vapor
compression based refrigeration systems tend to have excess cooling
capabilities that far exceed heat extraction demands required
during steady state operation. While the extra capacity provided by
the excess cooling capabilities allows improved pull down
performance, large current surges prevalent during start-up
requires higher capacity and consequently more expensive components
to handle the loads. Moreover, the large current surges and loads
incurred by duty cycle control excessively wear the components,
thereby potentially causing premature failure. Further, by the very
nature of their control, thermodynamic limits, and product
performance demands, vapor compression based refrigeration systems
are less efficient than optimum.
[0016] The sub-optimum efficiency disadvantage of vapor compression
based refrigeration systems relates to precisely controlling the
temperature within a cooling chamber. Typically, when a temperature
within a cooling chamber exceeds a certain value, the vapor
compression based refrigeration system activates and continues to
run until the temperature in the cooling chamber is below the
certain value. Once the cooling chamber reaches a temperature below
the certain value, the vapor compression based refrigeration system
shuts off. Nonetheless, in addition to excessive wear as noted
above, this type of control scheme will typically have a relatively
large control band and a relatively large internal temperature
stratification in an effort to minimize energy consumption and
allow for operation in varied ambient conditions. This regime is
most often utilized because throttling or capacity variation is
difficult and expensive to implement into the vapor compression
cycle and provides limited efficacy as volumetric efficiency
falls.
[0017] Accordingly, what is needed is a system and method for
precisely controlling the temperature within a cooling chamber
where the efficiency of the components used to extract heat from
the cooling chamber is maximized. Furthermore, what is needed is a
system and method that allow for individually selecting components,
and thereby capacity, within a refrigeration system based on the
cooling demands of a cooling chamber.
SUMMARY
[0018] Embodiments of the present disclosure relate to controlling
multiple Thermoelectric Coolers (TECs) to maintain a set point
temperature of a chamber. In one embodiment, a controller receives
temperature data corresponding to a temperature of the chamber.
Based on the temperature data, the controller selectively controls
two or more subsets of the TECs to maintain the temperature of the
chamber at a desired set point temperature. Each subset includes
one or more different TECs. In one embodiment, the controller
selectively controls the two or more subsets of the TECs by, for
each subset of the TECs, independently activating or deactivating
the subset of the TECs, independently controlling a current
supplied to the subset of the TECs, and/or independently
controlling a duty cycle of the subset of the TECs. In this manner,
the controller is enabled to control the TECs such that the TECs
operate to efficiently maintain the temperature of the chamber at
the set point temperature.
[0019] In another embodiment, a thermoelectric refrigeration system
includes one or more subsets of TECs and a controller configured to
selectively control the one or more subsets of TECs. In order to
selectively control the one or more subsets of TECs, the controller
is configured to select one or more control schemes based on
temperature data and a desired performance profile and control the
one or more subsets of TECs according to the one or more control
schemes. The one or more control schemes are selected by the
controller from a set of control schemes of the controller, where
the set of control schemes of the controller includes two or more
of a group consisting of: independently controlling an activation
and deactivation of each subset of TECs in the one or more subsets
of TECs, independently controlling a current provided to each
subset of TECs in the one or more subset of TECs, and independently
controlling a duty cycle of each subset of TECs in the one or more
subsets of TECs. Each subset of TECs includes one or more different
TECs.
[0020] Those skilled in the art will appreciate the scope of the
present disclosure and realize additional aspects thereof after
reading the following detailed description of the preferred
embodiments in association with the accompanying drawing
figures.
BRIEF DESCRIPTION OF THE DRAWING FIGURES
[0021] The accompanying drawing figures incorporated in and forming
a part of this specification illustrate several aspects of the
disclosure, and together with the description serve to explain the
principles of the disclosure.
[0022] FIG. 1 illustrates a thermoelectric refrigeration system
having a cooling chamber, a heat exchanger including a cartridge
that includes multiple Thermoelectric Coolers (TECs) disposed
between a cold side heat sink and a hot side heat sink, and a
controller that controls the TECs to maintain a set point
temperature within the cooling chamber in accordance with one
embodiment of the present disclosure;
[0023] FIG. 2 is a graph that illustrates a cooling capacity and
cooling efficiency of a TEC to an input current of the TEC;
[0024] FIG. 3 is a more detailed illustration of the cartridge of
FIG. 1 in which the cartridge includes the TECs disposed on an
interconnect board that enables selective control of multiple
different subsets of the TECs in the array of TECs in accordance
with one embodiment of the present disclosure;
[0025] FIG. 4 is a more detailed illustration of the cartridge of
FIG. 1 in which the cartridge includes the TECs disposed on an
interconnect board that enables selective control of multiple
different subsets of the TECs in the array of TECs in accordance
with another embodiment of the present disclosure;
[0026] FIG. 5 is a more detailed illustration of the cartridge of
FIG. 1 in which the cartridge includes the TECs disposed on an
interconnect board that enables selective control of multiple
different subsets of the TECs in accordance with another embodiment
of the present disclosure;
[0027] FIG. 6 is a more detailed illustration of the cartridge of
FIG. 1 in which the cartridge includes a single TEC disposed on an
interconnect board in accordance with another embodiment of the
present disclosure;
[0028] FIG. 7 is a more detailed illustration of the cartridge of
FIG. 1 in which the cartridge includes four TECs disposed on an
interconnect board in accordance with another embodiment of the
present disclosure;
[0029] FIG. 8 is a more detailed illustration of the cartridge of
FIG. 1 in which the cartridge includes six TECs disposed on an
interconnect board in accordance with another embodiment of the
present disclosure;
[0030] FIG. 9 shows the interconnect board of FIG. 3 without the
TECs in accordance with one embodiment of the present
disclosure;
[0031] FIG. 10 illustrates the interconnect board of FIG. 4 without
the TECs in accordance with another embodiment of the present
disclosure;
[0032] FIG. 11 shows the interconnect board of FIG. 5 without the
TECs in accordance with another embodiment of the present
disclosure;
[0033] FIG. 12 illustrates the interconnect board of FIG. 6 without
the TEC in accordance with another embodiment of the present
disclosure;
[0034] FIG. 13 illustrates the interconnect board of FIG. 7 without
the TECs in accordance with another embodiment of the present
disclosure;
[0035] FIG. 14 shows the interconnect board of FIG. 8 without the
TECs according to another embodiment of the present disclosure;
[0036] FIG. 15 illustrates an example of one system component
layout detailing various operating states, inputs, and outputs of
the controller of FIG. 1 according to one embodiment of the present
disclosure;
[0037] FIG. 16 is a more detailed illustration of the operation of
the controller of FIG. 1 when operating in the various operating
states of FIG. 15 according to one embodiment of the present
disclosure;
[0038] FIG. 17 illustrates a method of operating the controller of
FIG. 1 to maintain the temperature of the cooling chamber at a set
point temperature in accordance with one embodiment of the present
disclosure;
[0039] FIG. 18 illustrates a method of operating the controller of
FIG. 1 to maintain the temperature of the cooling chamber at a set
point temperature in accordance with another embodiment of the
present disclosure;
[0040] FIG. 19 illustrates a method of operating the controller of
FIG. 1 to monitor a temperature of one or more components of the
heat exchanger of FIG. 1 to detect an over-temperature condition
and, in response, take action to lower the temperature of the one
or more components of the heat exchanger in accordance with one
embodiment of the present disclosure;
[0041] FIGS. 20A through 20C illustrate a thermoelectric
refrigeration system having multiple parallel heat exchangers in
accordance with another embodiment of the present disclosure;
[0042] FIG. 21 illustrates a thermoelectric refrigeration system
that includes two cooling chambers each having separate,
thermally-coupled heat sinks in accordance with another embodiment
of the present disclosure;
[0043] FIG. 22 is a more detailed illustration of the heat
exchanger of FIG. 1 in accordance with one embodiment of the
present disclosure;
[0044] FIGS. 23 and 24 graphically illustrate a thermal diode
effect of the accept loop and the reject loop coupled to the heat
exchanger of FIG. 22 according to one embodiment of the present
disclosure;
[0045] FIG. 25 illustrates a thermal diode effect of a hybrid heat
exchanger in accordance with one embodiment of the present
disclosure;
[0046] FIGS. 26 through 29 are schematics illustrating a
configuration of a cold side heat sink of the heat exchangers of
FIGS. 1 and 21 in accordance with one embodiment of the present
disclosure;
[0047] FIG. 30 illustrates a heat exchanger having physically
separated hot side and cold side heat sinks that are thermally
coupled via a heat conduit according to one embodiment of the
present disclosure;
[0048] FIG. 31 is a schematic illustrating heat flow in the heat
exchanger of FIG. 30 according to one embodiment of the present
disclosure;
[0049] FIGS. 32 and 33 illustrate embodiments of a thermoelectric
refrigeration system that utilizes the heat exchanger of FIG. 30;
and
[0050] FIG. 34 is a block diagram for the controller of FIG. 1 in
accordance with one embodiment of the present disclosure.
DETAILED DESCRIPTION
[0051] The embodiments set forth below represent the necessary
information to enable those skilled in the art to practice the
embodiments and illustrate the best mode of practicing the
embodiments. Upon reading the following description in light of the
accompanying drawing figures, those skilled in the art will
understand the concepts of the disclosure and will recognize
applications of these concepts not particularly addressed herein.
It should be understood that these concepts and applications fall
within the scope of the disclosure and the accompanying claims.
[0052] It will be understood that, although the terms first,
second, etc. may be used herein to describe various elements, these
elements should not be limited by these terms. These terms are only
used to distinguish one element from another. For example, a first
element could be termed a second element, and, similarly, a second
element could be termed a first element, without departing from the
scope of the present disclosure. As used herein, the term "and/or"
includes any and all combinations of one or more of the associated
listed items.
[0053] Relative terms such as "below" or "above" or "upper" or
"lower" or "horizontal" or "vertical" may be used herein to
describe a relationship of one element, layer, or region to another
element, layer, or region as illustrated in the Figures. It will be
understood that these terms and those discussed above are intended
to encompass different orientations of the device in addition to
the orientation depicted in the Figures.
[0054] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the disclosure. As used herein, the singular forms "a," "an," and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises," "comprising," "includes," and/or
"including" when used herein specify the presence of stated
features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components, and/or
groups thereof.
[0055] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
disclosure belongs. It will be further understood that terms used
herein should be interpreted as having a meaning that is consistent
with their meaning in the context of this specification and the
relevant art and will not be interpreted in an idealized or overly
formal sense unless expressly so defined herein.
[0056] FIG. 1 illustrates a thermoelectric refrigeration system 100
according to one embodiment of the present disclosure. As
illustrated, the thermoelectric refrigeration system 100 includes a
cooling chamber 102, a heat exchanger 104, and a controller 106
that controls cooling within the cooling chamber 102. The heat
exchanger 104 includes a hot side heat sink 108, a cold side heat
sink 110, and a cartridge 112 including multiple Thermoelectric
Coolers (TECs), where each TEC has a cold side that is thermally
coupled with the cold side heat sink 110 and a hot side that that
is thermally coupled with the hot side heat sink 108. The TECs are
preferably thin film devices. When one or more of the TECs are
activated by the controller 106, the activated TEC(s) operates to
heat the hot side heat sink 108 and cool the cold side heat sink
110 to thereby facilitate heat transfer to extract heat from the
cooling chamber 102. More specifically, when one or more of the
TECs are activated, the hot side heat sink 108 is heated to thereby
create an evaporator and the cold side heat sink 110 is cooled to
thereby create a condenser.
[0057] Acting as a condenser, the cold side heat sink 110
facilitates heat extraction from the cooling chamber 102 via an
accept loop 114 coupled with the cold side heat sink 110. The
accept loop 114 is thermally coupled to an interior wall 115 of the
thermoelectric refrigeration system 100. The interior wall 115
defines the cooling chamber 102. In one embodiment, the accept loop
114 is either integrated into the interior wall 115 or integrated
directly onto the surface of the interior wall 115. The accept loop
114 is formed by any type of plumbing that allows for a cooling
medium (e.g., a two-phase coolant) to flow or pass through the
accept loop 114. Due to the thermal coupling of the accept loop 114
and the interior wall 115, the cooling medium extracts heat from
the cooling chamber 102 as the cooling medium flows through the
accept loop 114. The accept loop 114 may be formed of, for example,
copper tubing, plastic tubing, stainless steel tubing, aluminum
tubing, or the like.
[0058] The condenser formed by the cold side heat sink 110 and the
accept loop 114 operates according to any suitable heat exchange
technique. In one preferred embodiment, the accept loop 114
operates in accordance with thermosiphon principles (i.e., acts as
a thermosiphon) such that the cooling medium travels from the cold
side heat sink 110 through the accept loop 114 and back to the cold
side heat sink 110 to thereby cool the cooling chamber 102 using
two-phase, passive heat transport. In particular, passive heat
exchange occurs through natural convection between the cooling
medium in the accept loop 114 and the cooling chamber 102. In one
embodiment, the cooling medium is in liquid form when the cooling
medium comes into thermal contact with the cooling chamber 102.
Specifically, passive heat exchange occurs between the environment
in the cooling chamber 102 and the cooling medium within the accept
loop 114 such that the temperature in the cooling chamber 102
decreases and the temperature of the cooling medium increases
and/or undergoes a phase change. When the temperature of the
cooling medium increases, the density of the cooling medium
decreases, such as through evaporation. As a result, the cooling
medium moves in an upward direction via buoyancy forces in the
accept loop 114 towards the heat exchanger 104 and specifically
towards the cold side heat sink 110. The cooling medium comes into
thermal contact with the cold side heat sink 110, where heat
exchange occurs between the cooling medium and the cold side heat
sink 110. When heat exchange occurs between the cooling medium and
the cold side heat sink 110, the cooling medium condenses and again
flows through the accept loop 114 via gravity in order to extract
additional heat from the cooling chamber 102. Thus, in some
embodiments, the accept loop 114 functions as an evaporator when
cooling the cooling chamber 102.
[0059] As noted above, the heat exchanger 104 includes the
cartridge 112 disposed between the hot side heat sink 108 and the
cold side heat sink 110. The TECs in the cartridge 112 have hot
sides (i.e., sides that are hot during operation of the TECs) that
are thermally coupled with the hot side heat sink 108 and cold
sides (i.e., sides that are cold during operation of the TECs) that
are thermally coupled with the cold side heat sink 110. The TECs
within the cartridge 112 effectively facilitate heat transfer
between the cold side heat sink 110 and the hot side heat sink 108.
More specifically, when heat transfer occurs between the cooling
medium in the accept loop 114 and the cold side heat sink 110, the
active TECs transfer heat between the cold side heat sink 110 and
the hot side heat sink 108.
[0060] Acting as an evaporator, the hot side heat sink 108
facilitates rejection of heat to an environment external to the
cooling chamber 102 via a reject loop 116 coupled to the hot side
heat sink 108. The reject loop 116 is thermally coupled to an outer
wall 118, or outer skin, of the thermoelectric refrigeration system
100. The outer wall 118 is in direct thermal contact with the
environment external to the cooling chamber 102. Further, the outer
wall 118 is thermally isolated from the accept loop 114 and the
interior wall 115 (and thus the cooling chamber 102) by, for
example, appropriate insulation. In one embodiment, the reject loop
116 is integrated into the outer wall 118 or integrated onto the
surface of the outer wall 118. The reject loop 116 is formed of any
type of plumbing that allows a heat transfer medium (e.g., a
two-phase coolant) to flow or pass through the reject loop 116. Due
to the thermal coupling of the reject loop 116 and the external
environment, the heat transfer medium rejects heat to the external
environment as the heat transfer medium flows through the reject
loop 116. The reject loop 116 may be formed of, for example, copper
tubing, plastic tubing, stainless steel tubing, aluminum tubing, or
the like.
[0061] The evaporator formed by the hot side heat sink 108 and the
reject loop 116 operates according to any suitable heat exchange
technique. In one preferred embodiment, the reject loop 116
operates in accordance with thermosiphon principles (i.e., acts as
a thermosiphon) such that the heat transfer medium travels from the
hot side heat sink 108 through the reject loop 116 and back to the
hot side heat sink 108 to thereby reject heat using two-phase,
passive heat transport. In particular, the hot side heat sink 108
transfers the heat received from the cold side heat sink 110 to the
heat transfer medium within the reject loop 116. Once heat is
transferred to the heat transfer medium, the heat transfer medium
changes phase and travels through the reject loop 116 and comes
into thermal contact with the outer wall 118 such that heat is
expelled to the environment external to the cooling chamber 102.
When the heat transfer medium within the reject loop 116 is in
direct thermal contact with the outer wall 118, passive heat
exchange occurs between the heat transfer medium in the reject loop
116 and the external environment. As is well known, the passive
heat exchange causes condensation of the heat transfer medium
within the reject loop 116, such that the heat transfer medium
travels back to the heat exchanger 104 by force of gravity. Thus,
the reject loop 116 functions as a condenser when rejecting heat to
the environment external to the cooling chamber 102.
[0062] As discussed below in detail, in one preferred embodiment,
the heat exchanger 104 is not in direct thermal contact with the
cooling chamber 102 and is instead thermally isolated from the
cooling chamber 102. Likewise, the heat exchanger 104 is not in
direct thermal contact with the outer wall 118 and is instead
thermally isolated from the outer wall 118. Accordingly, as will be
detailed below, the heat exchanger 104 is thermally isolated from
both the cooling chamber 102 and the outer wall 118 of the
thermoelectric refrigeration system 100. Importantly, this provides
a thermal diode effect by which heat is prevented from leaking back
into the cooling chamber 102 when the TECs are deactivated.
[0063] The controller 106 operates to control the TECs within the
cartridge 112 in order to maintain a desired set point temperature
within the cooling chamber 102. In general, the controller 106
operates to selectively activate/deactivate the TECs, selectively
control an input current of the TECs, and/or selectively control a
duty cycle of the TECs to maintain the desired set point
temperature. Further, in preferred embodiments, the controller 106
is enabled to separately, or independently, control one or more
and, in some embodiments, two or more subsets of the TECs, where
each subset includes one or more different TECs. Thus, as an
example, if there are four TECs in the cartridge 112, the
controller 106 may be enabled to separately control a first
individual TEC, a second individual TEC, and a group of two TECs
(i.e., a first and a second individual TEC and a group of two
TECs). By this method, the controller 106 can, for example,
selectively activate one, two, three, or four TECs independently,
at maximized efficiency, as demand dictates.
[0064] Continuing this example, the controller 106 may be enabled
to separately and selectively control: (1) activation/deactivation
of the first individual TEC, an input current of the first
individual TEC, and/or a duty cycle of the first individual TEC;
(2) activation/deactivation of the second individual TEC, an input
current of the second individual TEC, and/or a duty cycle of the
second individual TEC; and (3) activation/deactivation of the group
of two TECs, an input current of the group of two TECs, and/or a
duty cycle of the group of two TECs. Using this separate selective
control of the different subsets of the TECs, the controller 106
preferably controls the TECs to enhance an efficiency of the
thermoelectric refrigeration system 100. For example, the
controller 106 may control the TECs to maximize efficiency when
operating in a steady state mode, such as when the cooling chamber
102 is at the set point temperature or within a predefined steady
state temperature range. However, during pull down or recovery, the
controller 106 may control the TECs to achieve a desired
performance such as, for example, maximizing heat extraction from
the cooling chamber 102, providing a tradeoff between pull
down/recovery times and efficiency, or the like.
[0065] Before proceeding, a brief discussion of a cooling capacity
versus an input current characteristic and efficiency versus an
input current characteristic of a TEC is beneficial. In this
regard, FIG. 2 is a graph that illustrates cooling capacity (Q) and
cooling efficiency (COP) of a TEC versus an input current of a TEC.
The cooling efficiency is more specifically represented by a
Coefficient of Performance (COP). As illustrated in FIG. 2, as the
input current (I) of the TEC increases, the cooling capacity of the
TEC also increases. The point on the cooling capacity (Q) curve
that represents where a maximum amount of heat is being removed by
the TEC is denoted as Q.sub.max. Thus, when the TEC is operating at
Q.sub.max, the TEC is removing the greatest amount of heat
possible. The TEC operates at Q.sub.max when a corresponding
maximum current I.sub.max is provided to the TEC. FIG. 2 also
illustrates the COP of the TEC as a function of current. For
cooling applications, the COP of a TEC is a ratio of heat removed
over an amount of work input to the TEC to remove the heat. The
amount of heat, or capacity, (Q) at which the COP of the TEC is
maximized is denoted as Q.sub.COPmax. The TEC operates at
Q.sub.COPmax when a current I.sub.COPmax is provided to the TEC.
Thus, the efficiency, or COP, of the TEC is maximized when the
current I.sub.COPmax is provided to the TEC such that the TEC
operates at Q.sub.COPmax.
[0066] As discussed below in detail, in preferred embodiments, the
controller 106 controls the TECs within the cartridge 112 such
that, during steady state operation, one or more of the TECs are
activated and operated at Q.sub.COPmax and the remaining TECs are
deactivated to thereby maximize efficiency. The number of TECs
activated, and conversely the number of TECs deactivated, is
dictated by demand. Conversely, during pull down or recovery, one
or more and possibly all of the TECs within the cartridge 112 are
activated and operated according to a desired performance profile.
One example of the desired performance profile is that all of the
TECs are activated and operated at Q.sub.max in order to minimize
pull down or recovery time. However, the desired performance
profile may alternatively provide a tradeoff between pull down or
recovery time and efficiency where, for example, all of the TECs
are activated and are operated at a point between Q.sub.COPmax and
Q.sub.max. Note that, as discussed below, control of the TECs is
not limited to these examples.
[0067] As noted above, FIG. 2 illustrates the cooling capacity and
cooling efficiency of a single TEC. Increasing the number of TECs
linearly increases the heat removal capacity without affecting the
operating COP of the thermoelectric refrigeration system 100
employing the TECs. Thus, if the thermoelectric refrigeration
system 100 includes four TECs, then the heat removal capacity of
the thermoelectric refrigeration system 100 is increased fourfold
in comparison to an embodiment of the thermoelectric refrigeration
system 100 that includes a single TEC while allowing the entire
system to, in some preferred embodiments, operate between off,
Q.sub.COPmax, and Q.sub.max.
[0068] It should be noted that while the application of electrical
current to a TEC and FIG. 2 are discussed in the context of
cooling, the same principles apply in the context of heat
recovery/power generation, where the TECs are used to generate
power, or current, in response to heat.
TEC Cartridge
[0069] Before discussing the details of the operation of the
controller 106 to separately and selectively control the TECs, it
is beneficial to discuss embodiments of the cartridge 112 of FIG. 1
that enable separate and selective control of the TECs. Note that
while the following discussion of the cartridge 112 is with respect
to the thermoelectric refrigeration system 100 of FIG. 1, the
cartridge 112 is not limited to use in the thermoelectric
refrigeration system 100 of FIG. 1 nor thermoelectric refrigeration
in general. For instance, the cartridge 112 may be utilized in heat
recovery or power generation applications.
[0070] As noted above, the TECs in the cartridge 112 are used to
regulate the temperature of the cooling chamber 102. In order to
meet desired cooling capacity for many refrigeration applications,
the thermoelectric refrigeration system 100 utilizes multiple TECs.
The use of multiple TECs is beneficial over the use of a single
large TEC because the multiple TECs can be separately controlled to
provide the desired performance under varying conditions. In
contrast, a single over-sized TEC that is designed to provide a
maximum desired capacity for pull down or recovery does not provide
this flexibility. For example, during steady state conditions, the
single over-sized TEC would typically operate at a low capacity
point that corresponds to a low COP value. In other words, the
over-sized TEC would operate inefficiently. In contrast, the
controller 106 is enabled to separately control subsets of the TECs
in the cartridge 112 in order to maximize efficiency during steady
state conditions.
[0071] FIGS. 3 through 5 illustrate embodiments of the cartridge
112 that enable the controller 106 to separately and selectively
control different subsets of the TECs according to a desired
control scheme. Note, however, that the embodiments of FIGS. 3
through 5 are only examples. The cartridge 112 may be configured to
hold any number of TECs and to allow any number of subsets of the
TECs to be separately controlled. Each subset generally includes
one or more TECs. Further, the different subsets may include the
same number or different numbers of TECs.
[0072] In the embodiment of FIG. 3, the cartridge 112 includes TECs
120a through 120f (more generally referred to herein collectively
as TECs 120 and individually as TEC 120) disposed on an
interconnect board 122. The TECs 120 are thin film devices. Some
non-limiting examples of thin film TECs are disclosed in U.S. Pat.
No. 8,216,871, entitled METHOD FOR THIN FILM THERMOELECTRIC MODULE
FABRICATION, which is hereby incorporated herein by reference in
its entirety. The interconnect board 122 includes electrically
conductive traces 124a through 124d (more generally referred to
herein collectively as traces 124 and individually as trace 124)
that define four subsets of the TECs 120a through 120f. In
particular, the TECs 120a and 120b are electrically connected in
series with one another via the trace 124a and, as such, form a
first subset of the TECs 120. Likewise, the TECs 120c and 120d are
electrically connected in series with one another via the trace
124b and, as such, form a second subset of the TECs 120. The TEC
120e is connected to the trace 124d and, as such, forms a third
subset of the TECs 120, and the TEC 120f is connected to the trace
124c and, as such, forms a fourth subset of the TECs 120. The
controller 106 (FIG. 1) can, in no particular order, selectively
control the first subset of TECs 120 (i.e., the TECs 120a and 120b)
by controlling a current applied to the trace 124a, selectively
control the second subset of the TECs 120 (i.e., the TECs 120c and
120d) by controlling a current applied to the trace 124b,
selectively control the third subset of the TECs 120 (i.e., the TEC
120e) by controlling a current applied to the trace 124d, and
selectively control the fourth subset of the TECs 120 (i.e., the
TEC 120f) by controlling a current applied to the trace 124c. Thus,
using the TECs 120a and 120b as an example, the controller 106 can
selectively activate/deactivate the TECs 120a and 120b by either
removing current from the trace 124a (deactivate) or by applying a
current to the trace 124a (activate), selectively increase or
decrease the current applied to the trace 124a while the TECs 120a
and 120b are activated, and/or control the current applied to the
trace 124a in such a manner as to control a duty cycle of the TECs
120a and 120b while the TECs 120a and 120b are activated (e.g.,
Pulse Width Modulation of the current).
[0073] The interconnect board 122 includes openings 126a and 126b
(more generally referred to herein collectively as openings 126 and
individually as opening 126) that expose bottom surfaces of the
TECs 120a through 120f. When disposed between the hot side heat
sink 108 (FIG. 1) and the cold side heat sink 110 (FIG. 1), the
openings 126a and 126b enable the bottom surfaces of the TECs 120a
through 120f to be thermally coupled to the appropriate heat sink
108 or 110.
[0074] In accordance with embodiments of the present disclosure,
during operation, the controller 106 can selectively activate or
deactivate any combination of the subsets of the TECs 120 by
applying or removing current from the corresponding traces 124a
through 124d. Further, the controller 106 can control the operating
points of the active TECs 120 by controlling the amount of current
provided to the corresponding traces 124a through 124d. For
example, if only the first subset of the TECs 120 is to be
activated and operated at Q.sub.COPmax during steady state
operation, then the controller 106 provides the current
I.sub.COPmax to the trace 124a to thereby activate the TECs 120a
and 120b and operate the TECs 120a and 120b at Q.sub.COPmax and
removes current from the other traces 124b through 124d to thereby
deactivate the other TECs 120c through 120f.
[0075] In the embodiment shown with reference to FIG. 3, the
cartridge 112 includes the TECs 120a through 120f. In accordance
with embodiments of the present disclosure, the cartridge 112 may
include any number of TECs 120. For example, in the embodiment
shown with reference to FIG. 4, the cartridge 112 includes the
interconnect board 122 having only two TECs 120, the TECs 120e and
120f. In this embodiment, the controller 106 (FIG. 1) can
individually control the TECs 120e and 120f by controlling the
currents provided to the corresponding traces 124d and 124c,
respectively. As another example, the cartridge 112 can include
only four TECs 120, such as the TECs 120c through 120f, as shown
with reference to FIG. 5. In this embodiment, the interconnect
board 122 includes the traces 124b through 124d, which provide
current to the TECs 120c through 120f, respectively. Moreover, the
corresponding subsets of the TECs 120 can be controlled by the
controller 106 by providing the appropriate currents to the traces
124b through 124d.
[0076] While FIGS. 3 through 5 illustrate embodiments of the
cartridge 112 that enable selective control of different TECs on
the cartridge 112, FIGS. 6 through 8 illustrate embodiments of the
cartridge 112 that may be utilized if selective control is not
needed. In these embodiments, the input current of the TECs and/or
a duty cycle of the TECs may be varied to provide a desired
capacity, a desired efficiency, or some tradeoff between capacity
and efficiency. In particular, FIG. 6 illustrates an embodiment of
the cartridge 112 that includes an interconnect board 128 and a
single TEC 130 disposed on the interconnect board 128. An opening
131 in the interconnect board 128 exposes a bottom surface of the
TEC 130. The controller 106 (FIG. 1) can control the capacity and
efficiency of the TEC 130 by controlling a current input to the TEC
130 via an electrically conductive trace 132 on the interconnect
board 128.
[0077] FIG. 7 illustrates an embodiment of the cartridge 112 that
is similar to that of FIG. 6 but where the cartridge 112 includes
four TECs. More specifically, the cartridge 112 includes an
interconnect board 134 and four TECs 136 disposed on the
interconnect board 134. There are openings 137 in the interconnect
board 134 to expose bottom surfaces of the TECs 136. Again, the
controller 112 can control a capacity and efficiency of the TECs
136 by controlling a current input to the TECs 136 and/or a duty
cycle of the TECs 136 via an electrically conductive trace 138 on
the interconnect board 134.
[0078] FIG. 8 illustrates yet another example of the cartridge 112
that is similar to that of FIGS. 6 and 7 but where the cartridge
112 includes six TECs. More specifically, the cartridge 112
includes an interconnect board 140 and six TECs 142 disposed on the
interconnect board 140. There are openings 143 in the interconnect
board 140 to expose bottom surfaces of the TECs 142. Again, the
controller 112 can control a capacity and efficiency of the TECs
142 by controlling a current input to the TECs 142 and/or a duty
cycle of the TECs 142 via an electrically conductive trace 144 on
the interconnect board 140. Note that the embodiments of FIGS. 6
through 8 are only examples. The cartridge 112 may be configured to
include any number of TECs or conductive traces in series or
parallel configuration.
[0079] FIGS. 9 through 14 illustrate the interconnect boards 122,
128, 134, and 140 of FIGS. 3 through 8, respectively, but without
TECs attached to the interconnect boards. FIGS. 9 through 14 more
clearly illustrate the openings 126, 131, 137, and 143 in the
interconnect boards that expose the bottom surfaces of the TECs or,
in other words, enable thermal coupling between the bottom surfaces
of the TECs and the appropriate heat sink 108 or 110. FIGS. 9
through 14 also illustrate contacts 146, 148, 150, and 152 that
enable electrical and mechanical connection between the
interconnect boards 122, 128, 134, and 140 and corresponding
TECs.
Selectively Controlling the TECs
[0080] The following is a detailed discussion of embodiments of the
operation of the controller 106 of FIG. 1. For this discussion, it
is assumed that the cartridge 112 is the cartridge 112 of FIG. 3,
which enables selective control of multiple different subsets of
the TECs 120. Note, however, that the use of the cartridge 112 of
FIG. 3 is only an example.
[0081] FIG. 15 illustrates the operation of the controller 106
according to one embodiment of the present disclosure. As
illustrated, the controller 106 receives temperature data from
temperature inputs 154 and 156. The temperature inputs 154 and 156
can be any type of temperature sensors. The temperature data
includes a temperature (T.sub.CH) of the cooling chamber 102 and a
temperature (T.sub.R) on the reject side, or hot side, of the heat
exchanger 104. The reject side of the heat exchanger 104 is the hot
side of the heat exchanger 104. Thus, for example, the temperature
(T.sub.R) may be a temperature of the hot side heat sink 108. Based
on the temperature data, the controller 106 determines a current
mode of operation of the thermoelectric refrigeration system 100.
In this embodiment, the current mode of operation is one of a pull
down mode 158, a steady state mode 160, an over temperature mode
162, and a recovery mode 163. The pull down mode 158 generally
occurs when the thermoelectric refrigeration system 100 is first
powered on. The steady state mode 160 occurs when the temperature
of the cooling chamber 102 is at or near the desired set point
temperature. In particular, the temperature of the cooling chamber
102 is at or near the desired set point temperature when the
temperature of the cooling chamber 102 is within a predefined
steady state range that includes the set point temperature (e.g.,
the set point temperature of the cooling chamber 102.+-.2 degrees).
The over temperature mode 162 is when the temperature on the reject
side of the heat exchanger 104 is above a predefined maximum
allowable temperature. The over temperature mode 162 is a safety
mode during which the temperature of the reject side of the heat
exchanger 104, and thus the hot side temperature of the TECs 120,
is reduced in order to protect the TECs 120 from damage. Lastly,
the recovery mode 163 is when the temperature of the cooling
chamber 102 increases outside of the steady state range due to, for
example, heat leak into the cooling chamber 102, opening of the
door of the cooling chamber 102, or the like.
[0082] The operation of the controller 106 in the different modes
158, 160, 162, and 163 in one embodiment of the present disclosure
is illustrated in FIG. 16. As illustrated in FIG. 16, when
operating in the pull down mode 158, the controller 106 controls
the currents to all of the TECs 120 such that all of the TECs 120
operate at a power level between Q.sub.COPmax and Q.sub.max as the
desired performance profile dictates. In other words, the
controller 106 causes a current between I.sub.COPmax and I.sub.max
to be provided to all of the TECs 120. The controller 106
determines when the thermoelectric refrigeration system 100 is in
the pull down mode 158 based on, for example, being initially
powered on, such as when the thermoelectric refrigeration system
100 is first purchased or after the thermoelectric refrigeration
system 100 is powered on after becoming disconnected from a power
source. The controller 106 maintains all of the TECs 120 at a power
level between Q.sub.COPmax and Q.sub.max until the temperature of
the cooling chamber 102 is pulled down to the set point temperature
or within an acceptable range of the set point temperature, as
shown with reference to 164. Once the cooling chamber 102 is pulled
down to the set point temperature, the controller 106 controls the
operation of the TECs 120 such that all of the TECs 120 operate at
Q.sub.COPmax by causing the current I.sub.COPmax to be provided to
all of the TECs 120. Moreover, the controller 106 may reduce the
number of TECs 120 that are activated once the cooling chamber 102
is pulled down to the set point temperature.
[0083] As noted above, based on the temperature data, the
controller 106 also determines when the thermoelectric
refrigeration system 100 is in the steady state mode 160. The
thermoelectric refrigeration system 100 is in the steady state mode
160 if the temperature of the cooling chamber 102 is equal to the
set point temperature or within a predetermined range of the set
point temperature. When in the steady state mode 160, the
controller 106 sets the required number of the TECs 120 to
Q.sub.COPmax as required by demand. In this example, all of the
TECs 120 are operated at Q.sub.COPmax in the steady state mode 160.
During the steady state mode 160, if Q.sub.COPmax>Q.sub.leak as
shown with reference to 166, the temperature of the cooling chamber
102 will continue to decrease. In this case, the controller 106
reduces the duty cycle of the activated TECs 120 as shown with
reference to 168. Conversely, if Q.sub.COPmax<Q.sub.leak as
shown with reference to 170, the temperature of the cooling chamber
102 will increase. In this case, the controller 106 increases the
number of active TECs 120 as available and then the current
provided to the active TECs 120 to a value between I.sub.COPmax and
I.sub.max as shown with reference to 172. Notably, Q.sub.leak
refers to the amount of heat leaking into the cooling chamber 102,
such as heat passing through a seal of a door of the cooling
chamber 102, natural heat conduction through the cooling chamber
102, or the like.
[0084] As mentioned above, the controller 106 also determines if
the cooling chamber 102 is in the over temperature mode 162 based
on the temperature data from the temperature input 156. During
operation of the thermoelectric refrigeration system 100, the
temperature at the reject side of the heat exchanger 104 is
monitored to ensure that the temperature at the reject side of the
heat exchanger 104 does not exceed the predetermined maximum
allowable temperature. The temperature of the reject side of the
heat exchanger 104 may exceed the predetermined maximum allowable
temperature when, for example, the cooling chamber 102 does not
cool down, such as if the door to the cooling chamber 102 is not
properly closed, or the like.
[0085] If the controller 106 determines that the temperature at the
reject side of the heat exchanger 104 exceeds the predetermined
maximum allowable temperature, in an operation 174, the controller
106 decreases the temperature at the reject side of the heat
exchanger 104 by deactivating some or all of the TECs 120 that are
facilitating cooling or by reducing the current being provided to
the TECs 120. For example, if all of the TECs 120 are operating,
either at Q.sub.COPmax or Q.sub.max, the controller 106 may
deactivate one or more of the TECs 120 or preferably all of the
TECs 120. In another example, if the TECs 120a, 120b, 120e, and
120f are operating at Q.sub.max, the controller 106 may deactivate
the TECs 120e and 120f such that only the TECs 120a and 120b are
operating at Q.sub.max and facilitating heat extraction from the
cooling chamber 102. In another example, if the TECs 120a through
120d are operating at Q.sub.COPmax, the controller 106 may
deactivate the TECs 120c and 120d and then also activate the TEC
120e in order to maintain the temperature of the cooling chamber
102 as close as to the set point temperature as possible without
harming the cartridge 112. It should be noted that the controller
106 may deactivate any number of active TECs 120 and activate any
number of the inactive TECs 120 in response to determining that the
temperature of the heat exchanger 104 exceeds the maximum allowable
temperature.
[0086] As noted above, if the controller 106 determines that the
temperature of the heat exchanger 104 exceeds the predetermined
maximum allowable temperature, the controller 106 may reduce the
current being provided to the TECs 120 in addition to or as an
alternative to deactivating some or all of the TECs 120. To further
illustrate this functionality, if all of the TECs 120 are
operating, either at Q.sub.COPmax or Q.sub.max, the controller 106
may decrease the amount of current being provided to each of the
TECs 120. For example, if all of the TECs 120 are operating at
Q.sub.max, the controller 106 may reduce the current from I.sub.max
to a value that is between I.sub.COPmax and I.sub.max. In addition,
if all of the TECs 120 are operating at Q.sub.COPmax or Q.sub.max,
the controller 106 may only reduce the current provided to some of
the TECs 120 in order to reduce the temperature of the heat
exchanger 104. In a further embodiment, the controller 106 may also
deactivate some of the TECs 120 and simultaneously decrease the
current to some or all of the TECs 120 that are still activated if
the temperature of the heat exchanger 104 exceeds the predetermined
maximum allowable temperature.
[0087] When in the recovery mode 163, the controller 106 switches
the active TECs 120 from operating at Q.sub.COPmax to operating at
Q.sub.max as shown at operation 175. The recovery mode 163 occurs
when, during steady state operation, the controller 106 receives
temperature data from the temperature input 154 indicating that the
temperature within the cooling chamber 102 has significantly
increased above the set point temperature within a short period of
time. Specifically, the thermoelectric refrigeration system 100 may
enter the recovery mode 163 when the temperature within the cooling
chamber 102 increases above an upper threshold of the steady state
range of temperatures (e.g., increases above the set point
temperature plus some predefined value that defines the upper
threshold of the desired steady state range).
[0088] It should be noted that the controls 164, 166, 168, 170,
172, 174, and 175 illustrated in FIG. 16 for the different modes
158, 160, 162, and 163 are only examples. The manner in which the
controller 106 controls the TECs 120 in each of the modes 158, 160,
162, and 163 may vary depending on the particular implementation.
In general, as discussed above, the controller 106 controls the
TECs 120 to reduce the temperature of the cooling chamber 102 when
in either the pull down mode 158 or the recovery mode 163. The
exact manner in which this is done may vary. For example, if the
performance profile is that a minimum pull down or recovery time is
desired, the controller 106 can activate all of the TECs 120 at
Q.sub.max with a 100% duty cycle (always on). Conversely, if a
trade-off between pull down or recovery time and efficiency is
desired, the controller 106 can, for example, activate all of the
TECs 120 at Q.sub.COPmax with a 100% duty cycle (always on) or at
anywhere in between Q.sub.COPmax and Q.sub.max. When in the steady
state mode 160, the controller 106 generally operates to maintain
the set point temperature in an efficient manner. For example, the
controller 106 can operate the required number of the TECs 120
(e.g., all of the TECs 120 or less than all of the TECs 120) at
Q.sub.COPmax based on load. This predetermined number of the TECs
120 is a number of the TECs 120 that is required to maintain the
set point temperature by operating at or near Q.sub.COPmax. If not
all of the TECs 120 are needed during the steady state mode 160,
then the unneeded TECs 120 are deactivated. The controller 106 can
fine tune the operation of the activated TECs 120 to precisely
maintain the set point temperature by, for example, slightly
increasing or decreasing the input current of the activated TECs
120 such that the activated TECs 120 operate slightly above
Q.sub.COPmax or by increasing or decreasing the duty cycle of the
activated TECs 120 to compensate for Q.sub.leak.
[0089] Returning to FIG. 15, the thermoelectric refrigeration
system 100 also includes a user interface (UI) 176, a power source
178, an accessory (acc) 180, and power electronics 182. The user
interface 176 allows a user to input various control parameters
associated with the thermoelectric refrigeration system 100. These
control parameters include the set point temperature of the cooling
chamber 102. In some embodiments, the control parameters may
additionally include values for the steady state range of
temperatures. Note that, in some embodiments, the user interface
176 may additionally allow the user or a manufacturer of the
thermoelectric refrigeration system 100 to define the maximum
allowable temperature for the reject side of the heat exchanger
104, the current values associated with I.sub.COPmax and I.sub.max,
and/or the like. However, it should be noted that some or all of
the control parameters may be programmed or hard-coded into the
controller 106.
[0090] The power source 178 provides power to the controller 106,
the accessory 180, and the power electronics 182. The accessory 180
may be a chamber light or a communication module for expanded
capabilities. In an embodiment where the accessory 180 is a
communication module, the accessory 180 may communicate with remote
devices, such as, but not limited to: a cellular telephone, a
remotely located computing device, or even other appliances and
thermoelectric refrigeration systems. In an embodiment where the
accessory 180 communicates with a cellular telephone or a remotely
located computing device, the accessory 180 can provide operational
parameters (e.g., the temperature data) of the thermoelectric
refrigeration system 100 and the cooling chamber 102 to a remote
device or entity. In an embodiment where the accessory 180
communicates with other thermoelectric refrigeration systems, the
accessory 180 may communicate operational parameters of the
thermoelectric refrigeration system 100 to the other thermoelectric
refrigeration systems, such as the set point temperature, upper and
lower thresholds of the set point temperature, a maximum allowable
temperature of the cooling chamber 102, the maximum allowable
temperature of the reject side of the heat exchanger 104, or the
like.
[0091] The power electronics 182 generally operate to provide
current to the TECs 120 in response to control inputs from the
controller 106. More specifically, the power electronics 182
independently provide current to each of the subsets of the TECs
120. In one embodiment, the duty cycles of the different subsets of
the TECs 120 are also controlled. In this case, the power
electronics 182 may provide a pulse width modulation function by
which the duty cycles of the different subsets of the TECs 120 are
controlled.
[0092] With reference to FIG. 17, a method of operation of the
controller 106 to maintain the cooling chamber 102 at the set point
temperature is illustrated in accordance with one embodiment of the
present disclosure. Initially, the temperature data corresponding
to the temperature within the cooling chamber 102 and the
temperature at the reject side of the heat exchanger 104 is
received (step 1000). For example, a thermocouple, or any other
type of temperature sensor, may be used to determine the
temperature of the cooling chamber 102 and provide the temperature
as temperature data to the controller 106 in step 1000 via the
temperature input 154. Furthermore, a thermocouple, or any other
type of temperature sensor, may be used to determine the
temperature of the reject side of the heat exchanger 104 and
provide the temperature as temperature data to the controller 106
in step 1000 via the temperature input 156.
[0093] In response to receiving the temperature data, the
controller 106 selectively controls the TECs based on the
temperature data (step 1002). In general, the controller 106
selectively controls one or more and, in some preferred
embodiments, two or more different subsets of the TECs based on the
temperature data and the set point temperature for the cooling
chamber 102. Using the TECs 120 in the cartridge 112 of FIG. 3 as
an example, the controller 106 selectively, or separately, controls
the different subsets of the TECs 120. More specifically, as
discussed above, the controller 106 determines whether the
thermoelectric refrigeration system 100 is in the pull down mode
158, the steady state mode 160, or the recovery mode 163 based on
the temperature data and the set point temperature for the cooling
chamber 102. If the controller 106 determines that the
thermoelectric refrigeration system 100 is in either the pull down
mode 158 or the recovery mode 163, the controller 106 controls the
TECs 120 to decrease the temperature of the cooling chamber 102 by
either activating TECs 120 that are currently deactivated,
increasing the current provided to the activated TECs 120, and/or
increasing the duty cycle of the activated TECs 120. If the
controller 106 determines that the thermoelectric refrigeration
system 100 is in the steady state mode 160, the controller 106
controls the TECs 120 to maintain the set point temperature. In the
steady state mode 160, the controller 106 may, for example,
activate or deactivate the different subsets of the TECs 120,
increase or decrease the current provided to the different subsets
of the activated TECs 120, and/or increase or decrease the duty
cycle of the different subsets of the activated TECs 120 as needed
to maintain the set point temperature.
[0094] As an example, if the temperature data indicates that the
thermoelectric refrigeration system 100 is in the recovery mode 163
while the TECs 120a, 120b, and 120e operate at Q.sub.COPmax during
steady state operation, the controller 106 may activate additional
subsets of the inactive TECs 120c, 120d, and 120f and operate the
newly activated TECs 120 at Q.sub.COPmax. If further cooling
capacity is needed, the controller 106 may then increase the
current provided to the active TECs 120a, 120b, 120c, 120d, 120e,
and 120f up to I.sub.max in order to pull the temperature of the
cooling chamber 102 down to the set point temperature as soon as
possible. After the controller 106 selectively controls the TECs
120 to operate at Q.sub.max, the method returns to step 1000 and
the controller 106 once again receives the temperature data.
Returning to the example, if the temperature data received in step
1000 indicates that the cooling chamber 102 has been cooled to the
set point temperature, the controller 106 decreases the current
provided to the TECs 120a, 120b, and 120e from I.sub.max to
I.sub.COPmax such that the TECs 120a, 120b, and 120e operate at
Q.sub.COPmax for the steady state mode 160 in step 1002. In
addition, the controller 120 deactivates the TECs 120c, 120d, and
120f, which in this example are unused in the steady state mode
160. The controller 106 continually repeats this process to
maintain the set point temperature in the cooling chamber 102.
[0095] In other words, in one embodiment, the controller 106 is
configured or enabled to control the TECs 120 according multiple
control schemes. The control schemes include independently
controlling activation and deactivation of the different subsets of
the TECs 120, independently controlling a current provided to each
subset of the TECs 120, and/or independently controlling a duty
cycle of each subset of the TECs 120. In operation, the controller
106 selects one or more control schemes based on the temperature of
the cooling chamber 102 and, in some embodiments, the temperature
at the reject side of the heat exchanger 104, as well as a desired
performance profile. The desired performance profile may be
programmable or hard-coded into the controller 106. The desired
performance profile dictates how the TECs 120 are controlled (e.g.,
maximum efficiency, maximum capacity, or somewhere between maximum
efficiency and maximum capacity) for the different modes of
operation. Once the control scheme(s) are selected, the controller
106 controls the different subsets of the TECs 120 according to the
selected control scheme(s). Thus, the controller 106 can control
any combination of activation/deactivation, current, and duty cycle
for each mode of operation.
[0096] For example, for the steady state mode 160, the controller
106 may select the control scheme of activation/deactivation of the
TECs 120 based on the temperature of the cooling chamber 102 and a
desired performance profile of maximizing efficiency during the
steady state mode 160. In this case, the controller 106 then
activates one or more of the subsets of TECs 120 and, in some
embodiments, deactivates one or more other subsets of the TECs 120.
In addition, the controller 106 may choose to control the current
and/or duty cycle of the activated TECs 120 during the steady state
mode 160, in which case the controller 106 independently controls
the current provided to each of the activated subsets of TECs 120
and/or the duty cycle of each of the activated subsets of TECs 120.
Continuing this example, for the recovery mode 163 or the pull down
mode 158, the controller 106 may select the control scheme of
activation/deactivation of the TECs 120 based on the temperature of
the cooling chamber 102 and a desired performance profile (e.g.,
minimizing pull down or recovery time). In this case, the
controller 106 activates additional subsets of the TECs 120 not
activated during the steady state mode 160. In addition, the
controller 106 may choose to control the current and/or duty cycle
of the activated subsets of TECs 120 for the pull down mode 158 or
the recovery mode 163, in which case the controller 106
independently controls the current of each of the activated subsets
of TECs 120 and/or the duty cycle of each of the activated subsets
of TECs 120.
[0097] FIG. 18 is a flow chart that illustrates a method of
operation of the controller 106 to maintain the cooling chamber 102
at the set point temperature according to another embodiment of the
present disclosure. Initially, the temperature data for the cooling
chamber 102 and the reject side of the heat exchanger 104 is
received (step 1100). After the temperature data is received, the
controller 106 determines whether the temperature of the cooling
chamber 102 is greater than an upper threshold of the steady state
range for the temperature of the cooling chamber 102 (step 1102).
The steady state range is an acceptable temperature range for the
cooling chamber 102 that includes the set point temperature. As an
example, the steady state range may be the set point temperature
plus or minus a predefined offset (e.g., 2 degrees). If the
temperature of the cooling chamber 102 is not greater than the
upper threshold of the steady state range, the controller 106
determines whether the temperature of the cooling chamber 102 is
greater than a lower threshold of the steady state range (step
1104).
[0098] If the temperature of the cooling chamber 102 is not greater
than the lower threshold of the steady state range, the process
returns to step 1100. However, if the temperature of the cooling
chamber 102 is below the lower threshold of the steady state range,
the controller 106 controls the TECs 120 to increase the
temperature of the cooling chamber 102 (step 1106). Depending on
the particular embodiment, the controller 106 increases the
temperature of the cooling chamber 102 by deactivating one or more
of the TECs, decreasing the current input to one or more of the
TECs 120, and/or decreasing the duty cycle of one or more of the
TECs 120. Since the controller 106 can selectively control the
different subsets of the TECs 120, the controller 106 has
substantial flexibility in how the temperature of the cooling
chamber 102 is increased. After controlling the TECs 120 to
increase the temperature of the cooling chamber 102, the process
returns to step 1100 and is repeated.
[0099] Returning to step 1102, if the temperature of the cooling
chamber 102 is greater than the upper threshold of the steady state
range, the controller 106 then determines whether the temperature
of the cooling chamber 102 is greater than a predetermined maximum
allowable temperature for the cooling chamber 102 (step 1108). If
so, the process proceeds to step 1112. If not, the controller 106
controls the TECs 120 to decrease the temperature of the cooling
chamber 102 (step 1110). The controller 106 controls the TECs 120
to decrease the temperature of the cooling chamber 102 by
activating one or more previously deactivated TECs 120, increasing
the current input to one or more of the activated TECs 120 from
I.sub.COPmax to a value that is greater than I.sub.COPmax (e.g.,
I.sub.max), and/or increasing the duty cycle of one or more of the
activated TECs 120. Using the TECs 120 in the embodiment of the
cartridge 112 of FIG. 3 as an example, the controller 106
independently controls the different subsets of the TECs 120. So,
for example, if prior to step 1110 the first subset of the TECs
(i.e., the TECs 120a and 120b) are activated and operating at
Q.sub.COPmax but the remaining TECs 120 are deactivated, the
controller 106 can decrease the temperature of the cooling chamber
102 by increasing the current input to the first subset of the TECs
120 from I.sub.COPmax to a value greater than I.sub.COPmax (e.g.,
I.sub.max), increasing a duty cycle of the first subset of the TECs
120, activating the second subset of the TECs 120 to operate at
Q.sub.COPmax or a capacity greater than Q.sub.COPmax with a desired
duty cycle (e.g., always on), activating the third subset of the
TECs 120 to operate at Q.sub.COPmax or a capacity greater than
Q.sub.COPmax with a desired duty cycle (e.g., always on), and/or
activating the fourth subset of the TECs 120 to operate at
Q.sub.COPmax or a capacity greater than Q.sub.COPmax with a desired
duty cycle (e.g., always on).
[0100] Next, whether proceeding from the "yes" branch of step 1108
or step 1110, the controller 106 determines whether the temperature
at the reject side of the heat exchanger 104 is greater than the
predetermined maximum allowable temperature for the reject side of
the heat exchanger 104 (step 1112). If so, the controller 106
controls the TECs 120 to lower the temperature of the heat
exchanger components (step 1114). Specifically, the controller 106
controls the TECs 120 to lower the temperature of the components of
the heat exchanger 104 at the reject side (e.g., the hot side heat
sink 108). Lowering the temperature of the components of the heat
exchanger 104 may be accomplished by deactivating some or all of
the TECs 120, reducing the current provided to some or all of the
TECs 120, or a combination thereof. The process then returns to
step 1100 and is repeated.
[0101] However, if the temperature at the reject side of the heat
exchanger 104 is not greater than the predetermined maximum
allowable temperature, the controller 106 controls the TECs to
decrease the temperature of the cooling chamber 102 (step 1116). As
discussed above, the controller 106 controls the TECs 120 to
decrease the temperature of the cooling chamber 102 by activating
one or more previously deactivated TECs 120, increasing the current
input to one or more of the activated TECs 120 from I.sub.COPmax to
a value that is greater than I.sub.COPmax (e.g., I.sub.max), and/or
increasing the duty cycle of one or more of the activated TECs 120.
For example, if prior to step 1116 the first subset of the TECs
(i.e., the TECs 120a and 120b) are activated and operating at
Q.sub.COPmax but the remaining TECs 120 are deactivated, the
controller 106 can decrease the temperature of the cooling chamber
102 by increasing the current input to the first subset of the TECs
120 from I.sub.COPmax to a value greater than I.sub.COPmax (e.g.,
I.sub.max), increasing a duty cycle of the first subset of the TECs
120, activating the second subset of the TECs 120 to operate at
Q.sub.COPmax or a capacity greater than Q.sub.COPmax with a desired
duty cycle (e.g., always on), activating the third subset of the
TECs 120 to operate at Q.sub.COPmax or a capacity greater than
Q.sub.COPmax with a desired duty cycle (e.g., always on), and/or
activating the fourth subset of the TECs 120 to operate at
Q.sub.COPmax or a capacity greater than Q.sub.COPmax with a desired
duty cycle (e.g., always on). After decreasing the temperature of
the cooling chamber 102 in step 1116, the process returns to step
1100 and is repeated.
[0102] As an example, assume that the temperature data indicates
that the cooling chamber 102 is at 0.9.degree. C. and the reject
side of the heat exchanger 104 is at 19.degree. C. In addition, for
this example, the set point temperature for the cooling chamber 102
is 2.2.degree. C., the upper threshold of the steady state range is
5.0.degree. C., the lower threshold of the steady state range is
1.0.degree. C., the maximum allowable temperature in the cooling
chamber 102 is 15.degree. C., and the maximum allowable temperature
at the reject side of the heat exchanger 104 is 20.degree. C. Using
this example, the controller 106 first determines that the
temperature of the cooling chamber 102 (0.9.degree. C.) does not
exceed the upper threshold value of the steady state range
(5.0.degree. C.). Thus, the controller 106 performs step 1104 where
the controller 106 determines that the temperature of the cooling
chamber 102 (0.9.degree. C.) is less than the lower threshold of
the steady state range (1.0.degree. C.). Therefore, the controller
106 performs step 1106 to increase the temperature of the cooling
chamber 102. After performing step 1106, the controller 106 returns
to step 1100 to thereby receive updated temperature data and
continue the process.
[0103] As another example, assume that the temperature data
indicates that the temperature of the cooling chamber 102 is
14.degree. C. and the temperature at the reject side of the heat
exchanger 104 is 18.degree. C. In addition, for this example, the
set point temperature for the cooling chamber 102 is 2.2.degree.
C., the upper threshold of the steady state range is 5.0.degree.
C., the lower threshold of the steady state range is 1.0.degree.
C., the maximum allowable temperature in the cooling chamber 102 is
15.degree. C., and the maximum allowable temperature at the reject
side of the heat exchanger 104 is 20.degree. C. Using this example,
the controller 106 determines that the temperature of the cooling
chamber 102 (14.degree. C.) is greater than the upper threshold of
the steady state range (5.0.degree. C.). Therefore, the controller
106 performs step 1108, where the controller 106 determines that
the temperature of the cooling chamber 102 (14.degree. C.) is less
than the maximum allowable temperature of the cooling chamber 102
(15.degree. C.). Accordingly, the controller 106 performs step 1110
to thereby decrease the temperature of the cooling chamber 102.
[0104] In a third example, the temperature data indicates that the
temperature of the cooling chamber 102 is 17.degree. C. and the
temperature of the heat exchanger 104 is 22.degree. C. In addition,
for this example, the set point temperature for the cooling chamber
102 is 2.2.degree. C., the upper threshold of the steady state
range is 5.0.degree. C., the lower threshold of the steady state
range is 1.0.degree. C., the maximum allowable temperature in the
cooling chamber 102 is 15.degree. C., and the maximum allowable
temperature at the reject side of the heat exchanger 104 is
20.degree. C. In step 1102, the controller 106 determines that the
temperature of the cooling chamber 102 is greater than the upper
threshold of the steady state range. Therefore, the controller 106
performs step 1108, where the controller 106 determines that the
temperature of the cooling chamber 102 (17.degree. C.) exceeds the
maximum allowable temperature within the cooling chamber 102
(15.degree. C.). Accordingly, the controller 106 performs step
1112, where the controller 106 determines whether the temperature
at the reject side of the heat exchanger 104 exceeds the maximum
allowable temperature at the reject side of the heat exchanger 104.
In accordance with an embodiment of the present disclosure, the
maximum allowable temperature at the reject side of the heat
exchanger 104 is a temperature beyond which components of the heat
exchanger 104 may overheat and become damaged. An example of when
the temperature at the reject side of the heat exchanger 104
exceeds the maximum allowable temperature at the reject side of the
heat exchanger 104 is when there is great amount of heat leak
through the cooling chamber 102, such as when a door of the cooling
chamber 102 is left open. In the scenario where the door of the
cooling chamber 102 is left open, the thermoelectric refrigeration
system 100 is trying to pull down the temperature of the cooling
chamber 102 to the set point temperature. Here, as there is a great
amount of heat leak, the components of the heat exchanger 104 may
not be able to pull down the temperature of the cooling chamber 102
and instead become overworked, thereby overheating (i.e., exceeding
the maximum allowable temperature at the reject side of the heat
exchanger 104). Another example of when the temperature at the
reject side of the heat exchanger 104 exceeds the maximum allowable
temperature at the reject side of the heat exchanger 104 is when
proper heat transfer is not occurring between the accept loop 114
and the cooling chamber 102, such as if there is a clog in the
accept loop 114, if there is an issue with the cooling medium
within the accept loop 114, or the like. In the third example, the
temperature at the reject side of the heat exchanger 104
(22.degree. C.) exceeds the maximum allowable temperature at the
reject side of the heat exchanger 104 (20.degree. C.). Accordingly,
the controller 106 performs step 1114, where the controller 106
cools the temperature of the components of the heat exchanger
104.
[0105] FIG. 19 is a flow chart that illustrates a method of
operation of the controller 106 to monitor the temperature at the
reject side of heat exchanger 104 in accordance with one embodiment
of the present disclosure. Initially, the controller 106 receives
temperature data (step 1200). In one embodiment, the temperature
data corresponds to the temperature at the reject side of the heat
exchanger 104. After receiving the temperature data, the controller
106 determines whether the temperature at the reject side of the
heat exchanger 104 exceeds the maximum allowable temperature at the
reject side of the heat exchanger 104, as described above with
reference to step 1112 of FIG. 18 (step 1202). If the temperature
at the reject side of the heat exchanger 104 does not exceed the
maximum allowable temperature, the process returns to step 1200 and
is repeated. However, if the temperature at the reject side of the
heat exchanger 104 exceeds the maximum allowable temperature at the
reject side of the heat exchanger 104, the controller 106 controls
the TECs 120 to thereby reduce the temperature at the reject side
of the heat exchanger 104 (step 1204).
Multi Parallel Heat Exchange Systems
[0106] In the embodiments described above, the thermoelectric
refrigeration system 100 includes a single heat exchange system
(i.e., a single heat exchanger 104, a single accept loop 114, and a
single reject loop 116). FIGS. 20A through 20C illustrate another
embodiment of the thermoelectric refrigeration system 100 that
includes two parallel heat exchange systems. Note that while two
parallel heat exchange systems are illustrated in the embodiment of
FIGS. 20A through 20C, any number of two or more parallel heat
exchange systems may be used. As illustrated in FIG. 20A, the two
parallel heat exchange systems are the same as the heat exchange
system of FIG. 1. In particular, the first heat exchange system
includes a heat exchanger 104a that includes a hot side heat sink
108a, a cold side heat sink 110a, a cartridge 112a disposed between
the hot side and cold side heat sinks 108a and 110a, an accept loop
114a coupled to the cold side heat sink 110a, and a reject loop
116a coupled to the hot side heat sink 108a. The cartridge 112a
includes one or more TECs and preferably multiple TECs that are
selectively controlled by the controller 106. In some preferred
embodiments, the TECs are disposed on an interconnect board that
enables selective and independent control of one or more, and
preferably two or more, subsets of the TECs in the manner described
above with respect to the cartridge 112 of FIG. 1. Likewise, the
second heat exchange system includes a heat exchanger 104b that
includes a hot side heat sink 108b, a cold side heat sink 110b, a
cartridge 112b disposed between the hot side and cold side heat
sinks 108b and 110b, an accept loop 114b coupled to the cold side
heat sink 110b, and a reject loop 116b coupled to the hot side heat
sink 108b. The cartridge 112b includes one or more TECs and
preferably multiple TECs that are selectively controlled by the
controller 106. In some preferred embodiments, the TECs are
disposed on an interconnect board that enables selective and
independent control of one or more, and preferably two or more,
subsets of the TECs in the manner described above with respect to
the cartridge 112 of FIG. 1. The operation of the two parallel heat
exchange systems of FIG. 20A and the control of the TECs in the
cartridges 112a and 112b is the same as that described above with
respect to the corresponding heat exchange system and the cartridge
112 of FIG. 1. As such, the details are not repeated.
[0107] The parallel heat exchange systems provide an additional
degree of freedom for the controller 106 when controlling the TECs
in the cartridges 112a and 112b. More specifically, in addition to
selectively and independently controlling one or more, and
preferably two or more, subsets of TECs in the cartridge 112a, the
controller 106 is also enabled to selectively and independently
control one or more, and preferably two or more, subsets of TECs in
the cartridge 112b independently from the subset(s) of TECs in the
cartridge 112a. As one example, during steady state operation, the
controller 106 may activate some or potentially all of the TECs in
the cartridge 112a preferably at or near (e.g., slightly above or
potentially below) Q.sub.COPmax and deactivate all of the TECs in
the cartridge 112b, as illustrated in FIG. 20B. Conversely, during
pull down or recovery, the controller 106 may activate any
previously deactivated TECs in the cartridge 112a and activate some
or potentially all of the TECs in the cartridge 112b, as
illustrated in FIG. 20C. During pull down or recovery, the
activated TECs are preferably operated at Q.sub.COPmax, Q.sub.max,
or some value between Q.sub.COPmax and Q.sub.max.
[0108] One non-limiting advantage of the parallel heat exchangers
104a and 104b is the ability to completely isolate large numbers of
TEC subsets while at the same time providing for large recovery
capacity without suffering from parasitic losses associated with
deactivated TECs located in the same heat exchanger 104a, 104b as
the active TECs. Another non-limiting advantage of the parallel
heat exchangers 104a and 104b is related to maximizing efficiency
by better balancing of the different control regimes to the
relevant heat exchanger volume/dissipation area.
Cascaded Heat Sinks
[0109] In a further embodiment of the present disclosure, arrays of
TECs may be cascaded in order to maintain different cooling
chambers at different set point temperatures. In one embodiment, a
single thermoelectric refrigeration system may have a first cooling
chamber and a second cooling chamber each having different set
point temperatures. In one embodiment, a first set of TECs (e.g.,
TECs in a first cartridge) provide cooling for the first cooling
chamber. In addition, a second set of TECs (e.g., TECs in a second
cartridge) provide cooling for the second cooling chamber, where
the set point temperature of the second cooling chamber is lower
than that of the first cooling chamber. In this embodiment, the
first and second sets of the TECs are thermally coupled to one
another via cascaded heat sinks. In this embodiment, during cooling
of the first cooling chamber, the first set of TECs extract heat
from the first cooling chamber and operate to reject the extracted
heat to an environment external to the first cooling chamber. In
this embodiment, during cooling of the second cooling chamber, the
second set of TECs extract heat from the second cooling chamber and
then operate to reject the extracted heat to the first set of TECs.
Here, the first set of TECs operates to reject the heat extracted
from the second cooling chamber to an environment external to the
first and second cooling chambers. In this embodiment, the first
set of TECs may operate independently of the second set of TECs. In
particular, the first set point temperature may be different from
the second set point temperature. Further, there may be different
modes of operation for each of the cooling chambers (e.g., the
first cooling chamber may be in pull down while the second cooling
chamber is in steady state due to opening of a door of the first
cooling chamber).
[0110] In this regard, FIG. 21 illustrates a thermoelectric
refrigeration system 184 having cooling chambers 186 and 188 in
accordance with an embodiment of the present disclosure. In this
embodiment, the cooling chambers 186 and 188 have different set
point temperatures. For example, if the thermoelectric
refrigeration system 184 is a household refrigerator, the cooling
chamber 186 may correspond to a freezer and the cooling chamber 188
may correspond to a refrigerator. The thermoelectric refrigeration
system 184 also includes a heat exchanger 190 in accordance with
another embodiment of the present disclosure. Here, the heat
exchanger 190 includes a hot side heat sink 192 and two cold side
heat sinks, namely, a cold side heat sink 194 and a cold side heat
sink 196. The hot side heat sink 192 thermally couples with a
reject loop 198 and operates to reject heat from the cooling
chambers 186 and 188 in a manner similar to that described above
with respect to the cooling chamber 102, the hot side heat sink
108, and the reject loop 116 of FIG. 1. In this example, the heat
exchanger 190 is between an interior wall 200 that defines the
cooling chamber 188 and an outer wall 202 of the thermoelectric
refrigeration system 184.
[0111] The heat exchanger 190 also includes cartridges 204 and 206.
The cartridge 204 thermally couples with both the cold side heat
sink 194 and the cold side heat sink 196. The cartridge 204
includes TECs as described above with reference to the cartridge
112 of FIG. 1 where a cold side of the TECs is thermally coupled to
the cold side heat sink 194 and a hot side of the TECs is thermally
coupled to the cold side heat sink 196. Moreover, the TECs disposed
within the cartridge 204 may have any number of TECs, as described
above with reference to FIGS. 3 through 8. The TECs within the
cartridge 204 facilitate the transfer of heat between the cold side
heat sink 194 and the cold side heat sink 196. The heat that is
transferred between the cold side heat sink 194 and the cold side
heat sink 196 is heat extracted from the cooling chamber 186 via an
accept loop 208.
[0112] The cartridge 206 is disposed between the hot side heat sink
192 and the cold side heat sink 196. The cartridge 206 includes
TECs as described above with reference to the cartridge 112 of FIG.
1 where a cold side of the TECs is thermally coupled to the cold
side heat sink 196 and a hot side of the TECs is thermally coupled
to the hot side heat sink 192. The TECs in the cartridge 206
facilitate heat transfer between the cold side heat sink 196 and
the hot side heat sink 192. Moreover, the TECs disposed within the
cartridge 206 may have any number of TECs, as described above with
reference to FIGS. 3 through 8. In this embodiment, the heat
transferred between the cold side heat sink 196 and hot side heat
sink 192 is heat extracted from the cooling chamber 188 via an
accept loop 210 and, if TECs in the cartridge 204 are activated,
heat extracted from the cooling chamber 186 via the accept loop
208.
[0113] Each of the accept loops 208 and 210 operate in a manner
similar to that described above with reference to the accept loop
114 of FIG. 1. In particular, as described above with reference to
the accept loop 114, each of the accept loops 208 and 210
facilitate the extraction of heat from a cooled chamber (i.e., the
cooling chambers 186 or 188, respectively). The TECs in the
cartridges 204 and 206 are separately controllable. Thus, in other
words, subsets of the TECs in each of the cartridges 204 and 206
are separately controllable to maintain the set point temperatures
in the cooling chambers 186 and 188.
[0114] As noted above, each of the cartridges 204 and 206 includes
TECs having the functionality described above. In one embodiment of
the present disclosure, the cartridge 206 has a greater number of
TECs than the cartridge 204 such that the cartridge 206 may
facilitate transferring heat from both of the accept loops 208 and
210. For example, if one or more subsets of the TECs in the
cartridge 204 are activated, then the TECs in the cartridge 206
must be controlled to have sufficient capacity to transfer the heat
extracted by the accept loop 208 as well as any heat extracted by
the accept loop 210. For example, if four TECs in the cartridge 204
are operating at Q.sub.COPmax, then more than four TECs in the
cartridge 206 should also be operating at Q.sub.COPmax in order to
provide sufficient capacity to transfer the heat transferred by the
activated TECs in the cartridge 204. In addition, if heat is also
to be extracted by the accept loop 210, the TECs in the cartridge
206 are further controlled to provide additional capacity to
extract the desired amount of heat via the accept loop 210.
[0115] During operation of the thermoelectric refrigeration system
184, a controller 212 controls the TECs disposed within the
cartridges 204 and 206 to maintain the desired set point
temperatures in the cooling chambers 186 and 188. In particular, in
order to maintain the desired set point temperature within the
cooling chamber 186, the controller 212 controls the TECs disposed
within the cartridges 204 and 206 based on the temperature within
the cooling chamber 186 and, in some embodiments, the temperature
at the reject side of the heat exchanger 190 as described above
with respect to FIGS. 15 through 19. Therefore, in one embodiment,
the controller 212 receives temperature data relating to both the
cooling chamber 186 and the reject side of the heat exchanger 190
and selectively controls the TECs disposed within the cartridges
204 and 206 to maintain the desired set point temperature for the
cooling chamber 186. In general, the controller 212 detects the
mode of operation (i.e., steady state, recovery, pull down, etc.)
and then activates/deactivates the TECs in the cartridges 204 and
206, increases or decreases duty cycles of the TECs in the
cartridges 204 and 206, and/or increases or decreases currents
provided to the TECs in the cartridges 204 and 206 according to the
mode of operation.
[0116] For example, if the cooling chamber 186 is at the set point
temperature, the controller 212 controls the TECs within the
cartridge 204 such that a predetermined number of the TECs needed
for steady state operation for the cooling chamber 186 operate at
Q.sub.COPmax. In this example, the cartridge 204 has four TECs and
three of the four TECs are operating at Q.sub.COPmax. In addition,
during steady state operation for the cooling chamber 186, the
controller 212 controls three or more of the TECs within the
cartridge 206 such that the active TECs within the cartridge 206
operate at Q.sub.COPmax in conjunction with and in support of the
three TECs in the cartridge 204 that operate at Q.sub.COPmax. In
this example, if the controller 212 subsequently detects that the
cooling chamber 186 is in recovery, the controller 212 selectively
controls the TECs within the cartridge 204 in order to pull the
temperature of the cooling chamber 186 down to the set point
temperature. For example, the controller 212 may activate all four
TECs in the cartridge 204 such that all the TECs in the cartridge
204 operate at Q.sub.max. Moreover, when the controller 212
activates all four TECs in the cartridge 204 at Q.sub.max, the
controller 212 also activates more TECs in the cartridge 206 to
support the additional capacity provided by the newly activated
TECs in the cartridge 204.
[0117] As noted above, the thermoelectric refrigeration system 184
also includes the cooling chamber 188 where the accept loop 210
facilitates the extraction of heat from the cooling chamber 188, as
described above with reference to the accept loop 114 of FIG. 1.
The accept loop 210 thermally couples with the cold side heat sink
196 such that the cold side heat sink 196 transfers heat extracted
from the cooling chamber 188 to the reject loop 198 via the
cartridge 206 and the TECs disposed therein. Thus, the reject loop
198 operates to reject heat extracted from the cooling chamber 186
and the cooling chamber 188. As noted above, the cartridge 206
includes TECs that work in conjunction with the TECs disposed
within the cartridge 204. Here, the cartridge 206 includes
additional TECs that facilitate the transfer of heat extracted from
the cooling chamber 188 to the hot side heat sink 192.
[0118] In addition to controlling the TECs disposed within the
cartridge 206 to support heat transfer by the activated TECs
disposed within the cartridge 204, the controller 212 selectively
controls the TECs disposed within the cartridge 206 to maintain the
desired set point temperature within the cooling chamber 188 in
accordance with the methods of FIGS. 15 through 19 described above.
Thus, the controller 212 receives temperature data for the cooling
chamber 188 and selectively controls the TECs disposed within the
cartridge 206 accordingly. For example, during steady state
operation, the controller 212 selects TECs within the cartridge 206
that are not facilitating heat transfer associated with the cooling
chamber 186 such that the selected TECs operate at Q.sub.COPmax.
Continuing this example, when the controller 212 detects that the
cooling chamber 188 is in recovery, in one embodiment, the
controller 212 controls the selected TECs such that the selected
TECs operate at Q.sub.max. In addition, the controller 212 may
select additional TECs that are not activated such that these
additional TECs operate at Q.sub.max or at some point between
Q.sub.COPmax and Q.sub.max. In this scenario, if the cartridge 206
includes ten TECs and four of the TECs facilitate heat transfer
associated with the cooling chamber 186, during steady state
operation of the cooling chamber 188, of the six remaining TECs,
the controller 212 may select three of the remaining TECs to
operate at Q.sub.COPmax. However, when the cooling chamber 188 is
in recovery and the controller 212 needs to pull the temperature of
the cooling chamber 188 down to the set point temperature, the
controller 212 may control the three TECs operating at Q.sub.COPmax
such that these TECs operate at Q.sub.max and then, of the three
remaining TECs that are not activated, the controller 212 may
activate one or more additional TECs to also operate at
Q.sub.max.
[0119] In the above scenario, of the activated TECs in the
cartridge 206, four were operating at Q.sub.COPmax in order to
facilitate the transfer of heat from the cooling chamber 186. It
should be noted that in the scenario above when the cooling chamber
188 was in recovery, in accordance with embodiments of the present
disclosure, the controller 212 may have controlled the four TECs
that were assisting with the heat transfer of the heat extracted
from the cooling chamber 186 such that these four TECs operated at
Q.sub.max. Here, the four TECs would still work to maintain the
cooling chamber 186 at the set point temperature (since the TECs
need only operate at Q.sub.COPmax) while at the same time assisting
with pulling down the temperature of the cooling chamber 188 to the
set point temperature (the additional heat that may be extracted
between the point associated with Q.sub.COPmax and Q.sub.max as
shown with reference to FIG. 2). It should be noted that all the
TECs in the cartridge 206 may be controlled to operate at Q.sub.max
when the cooling chamber 186 and the cooling chamber 188 are in
recovery.
Thermal Diode Effect and Thermal Isolation of Heat Exchange
System
[0120] In some preferred embodiments of the present disclosure, the
heat exchange system(s) disclosed herein also provide a thermal
diode effect and thermal isolation of the heat exchanger from the
cooling chamber(s) and the external environment. This is beneficial
because the thermal diode effect and the thermal isolation of the
heat exchanger(s) prevent, or at least minimize, heat leak back
from the external environment, through the heat exchanger(s), to
the cooling chamber(s). In this regard, FIG. 22 illustrates one
embodiment of the heat exchanger 104 of FIG. 1 wherein the heat
exchanger 104 is thermally isolated from the cooling chamber 102
and the outer wall 118 of the thermoelectric refrigeration system
100 such that heat leak back from the heat exchanger 104 to the
cooling chamber 102 does not occur when the heat exchanger 104 is
not actively facilitating the extraction of heat from the cooling
chamber 102 (i.e., when all of the TECs are inactive).
[0121] As noted above with respect to FIG. 1, the heat exchanger
104 includes the cold side heat sink 110 and the hot side heat sink
108 where the cartridge 112 is disposed between the cold side heat
sink 110 and the hot side heat sink 108. As illustrated in FIG. 22,
in order to provide thermal isolation of the heat exchanger 104,
the heat exchanger 104 is physically separated from, and physically
attached to, the interior wall 115 via standoffs 220. In
particular, the standoffs 220 couple with the cold side heat sink
110 and the interior wall 115 such that the standoffs 220
physically and thermally isolate the heat exchanger 104 from the
interior wall 115 while at the same time mount the heat exchanger
104 within the thermoelectric refrigeration system 100. In
accordance with one embodiment of the present disclosure, the
standoffs 220 may be formed from any type of material that
minimizes thermal conductance, such as any low thermal conductivity
material, including ceramic, plastic, or the like. Moreover, as may
be seen with respect to FIG. 22, the heat exchanger 104 is disposed
between the interior wall 115 and the outer wall 118 (and thus the
cooling chamber 102), where the heat exchanger 104 is also
thermally isolated from the interior wall 115 and the outer wall
118 by insulation 222.
[0122] When the thermal isolation of the heat exchanger 104 is
combined with a thermal diode effect provided by the accept and
reject loops 114 and 116, heat leak back from the external
environment and the heat exchanger 104 into the cooling chamber 102
when the TECs disposed within the cartridge 112 are all deactivated
or are in an "off" state during duty cycle control. In one
embodiment, the accept and reject loops 114 and 116 operate
according to thermosiphon principles (i.e., are thermosiphons) and,
as such, provide a thermal diode effect. This thermal diode effect
is illustrated with respect to FIGS. 23 and 24. FIG. 23 illustrates
heat transfer through the heat exchange system when one or more
TECs in the heat exchanger 104 are activated or in the "on" state
during duty cycle control. As illustrated, when one or more of the
TECs are on, the cooling medium in the accept loop 114 is condensed
by the cold side heat sink 110 of the heat exchanger 104 such that
the condensed cooling medium flows through the accept loop 114 via
gravity forces. When flowing through the accept loop 114, the
cooling medium extracts heat from the cooling chamber 102. The
extracted heat evaporates the cooling medium. The evaporated
cooling medium then returns to the cold side heat sink 110 of the
heat exchanger 104 via buoyancy forces. This process continues to
facilitate heat extraction from the cooling chamber 102.
Conversely, at the reject side, the heat exchange medium in the
reject loop 116 is evaporated by the hot side heat sink 108 of the
heat exchanger 104. The evaporated heat exchange medium flows
through the reject loop 116 via buoyancy forces such that heat is
rejected to the external environment. Due to the heat rejection,
the heat exchange medium is condensed, and the condensed heat
exchange medium returns to the hot side heat sink 108 via gravity.
The process continues to provide heat rejection to the external
environment.
[0123] Once the TECs in the heat exchanger 104 are all deactivated
or in the "off" state during duty cycle control, the accept and
reject loops 114 and 116 prevent the transfer of heat through the
accept and reject loops 114 and 116 toward the cooling chamber 102
as illustrated in FIG. 24. More specifically, when all of the TECs
are deactivated or in the "off" state during duty cycle control,
the cold side heat sink 110 of the heat exchanger 104 is no longer
sufficiently cold to condense the cooling medium in the accept loop
114. As such, the cooling medium in the accept loop 114 evaporates
and collects at the cold side heat sink 110, thereby preventing
further heat transfer through the accept loop 114. Therefore, it
can be seen that the accept loop 114 provides heat transfer away
from the cooling chamber 102 (i.e., heat extraction) but prevents
heat transfer toward the cooling chamber 102 (i.e., heat leak back
into the cooling chamber 102). In this manner, the accept loop 114
provides a thermal diode effect. In a similar manner, the hot side
heat sink 108 is no longer sufficiently hot to evaporate the heat
exchange medium in the reject loop 116. As such, the heat exchange
medium in the reject loop 116 condenses and collects at the hot
side heat sink 108, thereby preventing further heat transfer
through the reject loop 116. Therefore, it can be seen that the
reject loop 116 provides heat transfer away from the heat exchanger
104 (i.e., heat rejection) but prevents heat transfer toward the
heat exchanger 104 (i.e., heat leak back from the external
environment to the heat exchanger 104). In this manner, the reject
loop 116 provides a thermal diode effect. Importantly, the thermal
insulation of the heat exchanger 104 and the thermal diode effect
of the accept and reject loops 114 and 116 enable: (1) deactivation
of all of the TECs in the heat exchanger 104 with no or minimal
heat leak back into the cooling chamber 102 and (2) duty cycle
control of the TECs in the heat exchanger 104 with no or minimal
heat leak back into the cooling chamber 102.
[0124] Notably, while the heat exchange system of FIG. 1 includes
both the accept and reject loops 114 and 116, the present
disclosure is not limited thereto. The heat exchange system may
alternatively be a hybrid system that includes the accept loop 114
on the accept side of the heat exchanger 104 and an alternative
heat exchange mechanism (e.g., fins and a fan) on the reject side
of the heat exchanger 104. In this alternative embodiment, the
accept loop 114 still provides a thermal diode effect that prevents
heat leak back into the cooling chamber 102 when all of the TECs in
the heat exchanger 104 are deactivated or in the "off" state during
duty cycle control, as illustrated in FIG. 25. As another
alternative, the heat exchange system may be a hybrid system that
includes the reject loop 116 on the reject side of the heat
exchanger 104 and an alternative heat exchange mechanism (e.g.,
fins and a fan) on the accept side of the heat exchanger 104. In
this alternative embodiment, the reject loop 116 provides a thermal
diode effect that prevents heat leak back from the external
environment to the heat exchanger 104.
[0125] FIG. 26 illustrates thermal isolation of the heat exchanger
190 of FIG. 21 in accordance with one embodiment of the present
disclosure. Here, the heat exchanger 190 interfaces with the
interior wall 200 that defines the cooling chamber 188 via the
standoffs 220. In particular, the standoffs 220 couple with the
cold side heat sink 194 and the interior wall 200 such that the
standoffs 220 physically and thermally isolate the heat exchanger
190 from the cooling chamber 188 while at the same time mount the
heat exchanger 190 within the thermoelectric refrigeration system
184. The insulation 222 around the heat exchanger 190 thermally
isolates the heat exchanger 190 from the cooling chamber 188 and
the outer wall 202. Further, in a manner similar to that described
above, the reject loop 198 and the accept loops 208 and 210 each
provide a thermal diode effect. Notably, in this embodiment, there
are two accept loops, namely the accept loops 208 and 210, that
each provide a thermal diode effect that prevents heat leak back
into the corresponding cooling chambers 186 and 188. Accordingly,
when the heat exchanger 190 is not actively extracting heat from
the cooling chamber 186 or 188, heat leak back into the cooling
chambers 186 and 188 does not occur via the heat exchanger 190.
Heat Sink Configuration
[0126] As noted above with respect to FIG. 1, the accept loop 114
transfers heat extracted from the cooling chamber 102 to the cold
side heat sink 110 and the hot side heat sink 108 transfers the
extracted heat to the reject loop 116. FIG. 27 is a schematic
illustrating a configuration of the cold side heat sink 110 in
accordance with one embodiment of the present disclosure. It should
be noted that while this discussion focuses on the cold side heat
sink 110, this discussion is equally applicable to the cold side
heat sinks 194 and 196 and the hot side heat sinks 108 and 192. The
cold side heat sink 110 includes two inlet/outlet ports 226/228
through which the cooling medium enters and exits the cold side
heat sink 110 after heat transfer with the cooling chamber 102
and/or one of the activated TECs of the array of TECs 120 in the
cartridge 112. Specifically, when the cooling medium enters the
inlet/outlet ports 226/228, the cooling medium includes heat
extracted from the cooling chamber 102. Heat extracted from the
cooling chamber 102 is transferred to the cooling medium via
thermal convection, conduction, and radiation and then to the cold
side heat sink 110 via thermal convection, conduction, and
radiation between the cooling medium and the cold side heat sink
110. The extracted heat is then transferred to the array of TECs
120 via fins 230 disposed on the cold side heat sink 110 to a plate
232 as shown with respect to FIG. 28, which is thermally coupled to
the array of TECs 120.
[0127] As shown with reference to FIG. 27, each of the fins 230 has
an elongated shape and respectively spans a length L.sub.1 through
L.sub.4. Moreover, as may be seen with respect to FIG. 28, the fins
230 extend a height h and are spaced apart from each other a width
w. Thus, each of the fins 230 has an effective surface area for
transferring heat that is a function of the length L.sub.1 through
L.sub.4 and the height h. It should be noted that while the cold
side heat sink 110 is described as having the fins 230 having the
configuration and dimensions noted above, the cold side heat sink
110 may have fins of any configuration and may have any dimensions
dependent on heat loads and space constraints. In some embodiments,
the configuration and dimensions of the fins 230 may be a function
of the type of cooling medium used in the accept loop 114 and a
temperature differential between the cooling chamber 102, the heat
exchanger 104, and an ambient temperature. Moreover, the dimensions
and configuration of the fins 230 may also be a function of the
fluid pressures within the accept loop 114 and the reject loop 116
and any heat leak within the thermoelectric refrigeration system
100.
[0128] FIG. 29 illustrates another embodiment of the cold side heat
sink 110 that includes a heat sink 234. In one embodiment, the
thermoelectric refrigeration system 100 does not include the reject
loop 116 but instead the heat sink 234 where the thermoelectric
refrigeration system 100 includes a fan (not shown) that evacuates
the heat absorbed by the heat sink 234 to an environment external
to the thermoelectric refrigeration system 100. Moreover, in a
further embodiment of the present disclosure, the thermoelectric
refrigeration system 100 may include both the heat sink 234 and the
reject loop 116, thereby forming a hybrid configuration where both
the heat sink 234 and the reject loop 116 operate to reject heat
extracted from the cooling chamber 102 to an environment external
to the thermoelectric refrigeration system 100.
Divorced Heat Exchanger
[0129] Some embodiments of the present disclosure maximize, or at
least increase, the heat extraction capabilities of a
thermoelectric refrigeration system by increasing the available
surface area of an interior wall of the cooling chamber and/or the
available surface area of an outer wall that is usable for heat
transfer via the accept and reject loops, respectively. In general,
these embodiments provide a heat exchanger having physically
separated, or divorced, hot side and cold side heat sinks that are
thermally coupled by a heat conduit. In one embodiment, the
cartridge containing the TECs is physically attached to the cold
side heat sink, where the heat conduit thermally couples a hot side
of the TECs to the hot side heat sink. In another embodiment, the
cartridge containing the TECs is physically attached to the hot
side heat sink, where the heat conduit thermally couples the cold
side of the TECs to the cold side heat sink.
[0130] In this regard, FIG. 30 illustrates one embodiment of a heat
exchanger that includes a heat conduit 236 that enables physical
separation of the cold side heat sink 110 from the hot side heat
sink 108. In accordance with embodiments of the present disclosure,
the heat conduit 236 may be any device suitable for conducting heat
between the cold side heat sink 110 and the hot side heat sink 108.
Examples of devices that may be used for the heat conduit 236
include a traditional heat pipe, where the heat pipe allows for the
passive movement of heat in a downward direction from the cold side
heat sink 110 to the hot side heat sink 108.
[0131] In an alternative embodiment, the heat conduit 236 may
comprise a convective coupling that works in conjunction with a
plenum to facilitate heat transfer between the cold side heat sink
110 and the hot side heat sink 108. Moreover, in another
embodiment, the heat conduit 236 may include a fluid loop having a
heat transfer fluid where a pump pumps the heat transfer fluid
between the cold side heat sink 110 and the hot side heat sink 108.
In an embodiment where the heat conduit 236 includes a fluid loop,
the heat transfer fluid carries heat from the cold side heat sink
110 to the hot side heat sink 108. Additionally, the heat conduit
236 may transfer heat via direct conduction, where the heat conduit
236 conductively transfers heat from the cold side heat sink 110 to
the hot side heat sink 108.
[0132] The heat conduit 236 is physically and thermally coupled to
the cartridge 112 using any well-known technique, such as a
spreader plate, where the spreader plate interfaces with the TECs
120 disposed within the cartridge 112. As noted above, during
cooling of the cooling chamber 102, heat from the cooling chamber
102 thermally transfers to the accept loop 114. The heat from the
accept loop 114 is then thermally transferred to the TECs 120
disposed within the cartridge 112, also as described above. The
heat is transferred from the TECs 120 to the heat conduit 236, and
the heat conduit 236 transfers the heat to the hot side heat sink
108. Moreover, the heat conduit 236 physically and thermally
couples with the hot side heat sink 108 using any well-known
technique, such as a mechanical assembly 237 where the heat conduit
236 couples directly to the hot side heat sink 108. Note that, in
an alternative embodiment, the heat conduit 236 is directly
connected to the hot side heat sink 108 such that the mechanical
assembly 237 is not needed. It should be noted that while the
cartridge 112 is shown being thermally coupled to the cold side
heat sink 110 such that the heat conduit 236 thermally couples with
the cartridge 112 and the hot side sink 108, the cartridge 112 may
be thermally coupled with the hot side heat sink 108 such that the
heat conduit 236 may directly thermally couple with the cold side
heat sink 110 and the cartridge 112 when the cartridge 112 is
coupled with the hot side heat sink 108. It should be noted that
any methodology may be used to divorce the cold side heat sink 110
from the hot side heat sink 108 where the cold side heat sink 110
and the hot side heat sink 108 are thermally coupled with each
other. For example, the cold side heat sink 110 and the hot side
heat sink 108 may be conductively and convectively coupled with
each other. Moreover, the cold side heat sink 110 and the hot side
heat sink 108 may be thermally coupled using a pumped loop or may
be radiatively coupled with each other.
[0133] FIG. 31 is a schematic illustrating heat flow for the heat
exchanger 104 of FIG. 30 in accordance with one embodiment of the
present disclosure. In particular, heat is extracted from the
cooling chamber 102 as denoted by Q.sub.ACCEPTIN and then
transferred to the heat conduit 236 as indicated by
Q.sub.ACCEPTOUT. The heat conduit 236 then transfers the heat to
the reject loop 116 as denoted by Q.sub.REJECTIN, where the heat is
ultimately expelled to an environment external to the cooling
chamber 102, as shown by Q.sub.REJECTOUT.
[0134] In embodiments where the heat conduit 236 separates the cold
side heat sink 110 from the hot side heat sink 108, the cold side
heat sink 110 is spaced away from the hot side heat sink 108 such
that, in one embodiment, the cold side heat sink 110 is at an upper
portion of the thermoelectric refrigeration system 100 and the hot
side heat sink 108 is at a lower portion of the thermoelectric
refrigeration system 100, as shown with reference to FIGS. 32 and
33. In embodiments where the cold side heat sink 110 is disposed at
an upper portion of the thermoelectric refrigeration system 100, an
accept loop 238 may envelope a greater surface area of the cooling
chamber 102 such that a greater amount of heat transfer occurs
between the cooling chamber 102 and the cooling medium within the
accept loop 238 by virtue of the greater surface area between the
cooling chamber 102 and the accept loop 238. More specifically, as
the accept loop 238 thermally communicates with a greater portion
of the cooling chamber 102, the accept loop 238 may facilitate the
extraction of a greater amount of heat, thereby increasing the
overall heating efficiency of a device implementing the accept loop
238.
[0135] In addition, in embodiments where the hot side heat sink 108
is disposed at a bottom portion of the thermoelectric refrigeration
system 100, a reject loop 240 may extend from the bottom portion of
the thermoelectric refrigeration system 100 to the top portion of
the thermoelectric refrigeration system 100 as shown with respect
to FIGS. 32 and 33 such that the reject loop 240 has a greater
amount of surface area exposed to the environment external to the
cooling chamber 102. Here, a greater amount of heat transfer may
occur between the reject loop 240 and the environment external to
the cooling chamber 102 again, by virtue of the greater amount of
surface area between the reject loop 240 and the environment that
is external to the cooling chamber 102. It should be noted that
while FIGS. 32 and 33 illustrate the cold side heat sink 110
disposed at the upper portion on the thermoelectric refrigeration
system 100 and the hot side heat sink 108 disposed at the bottom
portion on the thermoelectric refrigeration system 100, in
embodiments including the heat conduit 236, the cold side heat sink
110 may be disposed at any location on the thermoelectric
refrigeration system 100 and the hot side heat sink 108 may
disposed at any location on the thermoelectric refrigeration system
100, where the distance between the cold side heat sink 110 and the
hot side heat sink 108 is maximized relative to the physical
dimensions of a device implementing embodiments of the present
disclosure. With regards to the heat conduit 236, while the heat
conduit 236 has been shown and described with reference to the
thermoelectric refrigeration system 100, the heat conduit 236 may
also be used with the thermoelectric refrigeration system 184,
where the heat conduit 236 thermally couples between the cold side
heat sink 196 and the hot side heat sink 192 such that the cold
side heat sinks 194 and 196 are disposed on a first side of the
thermoelectric refrigeration system 184 (i.e., near a top portion
of the thermoelectric refrigeration system 184) and the hot side
heat sink 192 is disposed on a second side of the thermoelectric
refrigeration system 184 (i.e., near the bottom of the
thermoelectric refrigeration system 184), opposite the first
side.
[0136] FIG. 34 is a block diagram of the controller 106 in
accordance with one embodiment of the present disclosure. The
discussion is equally applicable to the controller 212. In this
embodiment, the controller 106 includes a hardware processor 242
and memory 244 associated with the hardware processor 242. In one
embodiment, the memory 244 stores instructions that allow the
hardware processor 242 to perform the operations noted above in
accordance with the various embodiments of the present
disclosure.
[0137] It should be noted that while the thermoelectric
refrigeration systems 100 and 184 have been described with
reference to cooling the cooling chambers 102 and 196, the
thermoelectric refrigeration systems 100 and 184 may also be used
for heat recovery/power generation where the operation of the TECs
120 is reversed such that instead of taking heat from a cooling
medium within the accept loops 114, 202, and 204, the TECs 120 are
provided with heat in order to generate current through the TECs
120. More specifically, the TEC systems disclosed with reference to
the thermoelectric refrigeration systems 100 and 184 are completely
reversible thermodynamic processes as defined by the Peltier and
Seebeck processes, such that the thermoelectric refrigeration
systems 100 and 184 described above may be used for heat
recovery/power generation applications. Moreover, it should be
noted that while the processes discussed above have been described
with reference to the thermoelectric refrigeration system 100, they
may also be used with the thermoelectric refrigeration system 184.
Thus, the methods detailed above with respect to FIGS. 17 through
19 may be used with the thermoelectric refrigeration system
184.
[0138] Those skilled in the art will recognize improvements and
modifications to the preferred embodiments of the present
disclosure. All such improvements and modifications are considered
within the scope of the concepts disclosed herein and the claims
that follow.
* * * * *