U.S. patent application number 13/860494 was filed with the patent office on 2013-10-24 for biometric sensing.
The applicant listed for this patent is PicoField Technologies Inc.. Invention is credited to Fred G. Benkley, III, David Joseph Geoffroy.
Application Number | 20130279769 13/860494 |
Document ID | / |
Family ID | 49328139 |
Filed Date | 2013-10-24 |
United States Patent
Application |
20130279769 |
Kind Code |
A1 |
Benkley, III; Fred G. ; et
al. |
October 24, 2013 |
Biometric Sensing
Abstract
An novel sensor is provided having a plurality of substantially
parallel drive lines configured to transmit a signal into a surface
of a proximally located object, and also a plurality of
substantially parallel pickup lines oriented proximate the drive
lines and electrically separated from the pickup lines to form
intrinsic electrode pairs that are impedance sensitive at each of
the drive and pickup proximal locations.
Inventors: |
Benkley, III; Fred G.;
(Andover, MA) ; Geoffroy; David Joseph; (Amherst,
MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
PicoField Technologies Inc. |
Andover |
MA |
US |
|
|
Family ID: |
49328139 |
Appl. No.: |
13/860494 |
Filed: |
April 10, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61622474 |
Apr 10, 2012 |
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Current U.S.
Class: |
382/124 |
Current CPC
Class: |
G06K 9/001 20130101;
G06F 3/0412 20130101; H01L 27/323 20130101; G06F 3/03547 20130101;
G06T 7/73 20170101; G06K 9/52 20130101; G06F 2203/0338 20130101;
G06K 9/00026 20130101; G06K 9/00013 20130101; G06F 3/041661
20190501; G06K 9/0002 20130101; G06F 3/0445 20190501; G06F 3/0446
20190501 |
Class at
Publication: |
382/124 |
International
Class: |
G06K 9/00 20060101
G06K009/00 |
Claims
1. An impedance sensor, comprising: a plurality of substantially
parallel drive lines configured to transmit a signal to a
proximally located object; and a plurality of substantially
parallel pickup lines configured to receive a resultant signal and
oriented substantially perpendicular to the drive lines and
physically separated from the pickup lines on a different layer by
a substantially incompressible dielectric located between the drive
lines and pickup lines to form a two dimensional array of intrinsic
electrode pairs that are impedance sensitive to detect ridge and
valley features of a proximally located finger when driven by
circuitry located outside the sensing area which is connected to
each drive and pickup line of the array in order to activate one or
more junctions formed at individual dive and pickup line crossovers
where the circuitry compromises a driver or drive multiplexor
connected to each drive line, and buffer, switch or input
multiplexor attached to each pickup line, and at least one
differencing amplifier configured to receive it's inputs from the
input buffers or input multiplexor where a signal proportional to
impedance about each drive line and pickup crossover location can
be differenced with a signal proportional to impedance about
another drive line and pickup crossover location to differentiate
impedance values in order to determine relative object proximity.
Description
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Application No. 61/622,474, filed Apr. 10, 2012, which is hereby
incorporated herein in its entirety.
BACKGROUND
[0002] The embodiments are generally related to electronic sensing
devices, and, more particularly, to sensors for sensing objects
located near or about the sensors for use in media navigation,
fingerprint sensing and other operations of electronic devices and
other products.
[0003] In the electronic sensing market, there are a wide variety
of sensors for sensing objects at a given location. Such sensors
are configured to sense electronic characteristics of an object in
order to sense presence of an object near or about the sensor,
physical characteristics of the object, shapes, textures on
surfaces of an object, material composition, biological
information, and other features and characteristics of an object
being sensed.
[0004] Sensors may be configured to passively detect
characteristics of an object, by measuring such as temperature,
weight, or various emissions such as photonic, magnetic or atomic,
of an object in close proximity or contact with the sensor, or
other characteristic. An example of this is a non-contact infrared
thermometer that detects the black body radiation spectra emitted
from an object, from which its temperature can be computed.
[0005] Other sensors work by directly exciting an object with a
stimulus such as voltage or current, then using the resultant
signal to determine the physical or electrical characteristics of
an object. An example of this is a fluid detector consisting of two
terminals, one that excites the medium with a voltage source, while
the second measures the current flow to determine the presence of a
conductive fluid such as water.
[0006] Since a single point measurement of an object often does not
provide enough information about an object for practical
applications, it is often advantageous to collect a two-dimensional
array of measurements. A two dimensional array of impedance may be
created by moving a line sensing array over the surface of an
object and then doing a line by line reconstruction of a two
dimensional image like a fax machine does. An example of this is a
swiped capacitive fingerprint sensor that measures differences in
capacitance between fingerprint ridges and valleys as a finger is
dragged across it. The swiping motion of the fingerprint by a user
allows the one-dimensional line of sensor points to capture a large
number of data points from the user's fingerprint surface. Such
sensors reconstruct a two dimensional fingerprint image after the
fact using individual lines of the captured data points. This
reconstruction process requires a great deal of processing by a
device, and is subject to failure if the swipe movement and
conditions are not optimum.
[0007] A more user friendly way to obtain a two dimensional image
is to create a two dimensional sensing array that can capture a
user's fingerprint data while the user holds the fingerprint
surface still on the sensor surface, rather than swipe across a
sensor. Such sensors however can be prohibitive in cost due to the
large number of sensing points needed in the array. An example of
this is a two dimensional capacitive fingerprint sensor. A number
of these are currently manufactured. These sensors, however, are
based use 150 mm.sup.2 or more of silicon area and are therefore
cost prohibitive for many applications. They are also delicate and
fragile. They are sensitive to impact and even temperature changes,
and thus are simply not durable enough for most applications, such
as smart phones and other mobile electronic devices that are
handled and sometimes dropped by users.
[0008] These different types of electronic sensors have been used
in various applications, such as biometric sensors for measuring
biological features and characteristics of people such as
fingerprints, medical applications such as medical monitoring
devices, fluid measuring monitors, and many other sensor
applications. Typically, the sensing elements of the various
devices are connected to a processor configured to process object
information and to enable interpretations for object features and
characteristics. Examples include ridges and valleys of a
fingerprint, temperature, bulk readings of presence or absence, and
other features and characteristics.
[0009] There are many applications for two dimensional image
sensors as a particular example, and innovators have struggled with
state of the art technology that has come short of desired features
and functions. Fingerprint sensors, for example, have been in
existence for many years and used in many environments to verify
identification, to provide access to restricted areas and
information, and many other uses. In this patent application,
different types of fingerprint sensors will be highlighted as
examples of sensor applications where the embodiment is applicable
for simplicity of explanations, but other types of applications are
also relevant to this background discussion and will also be
addressed by the detailed description of the embodiment. These
placement sensors may be configured to sense objects placed near or
about the sensor, such as a fingerprint placement sensor that is
configured to capture a full image of a fingerprint from a user's
finger and compare the captured image with a stored image for
authentication. Alternatively, sensors may be configured to sense
the dynamic movement of an object about the sensor, such as a
fingerprint swipe sensor that captures partial images of a
fingerprint, reconstructs the fingerprint image, and compares the
captured image to a stored image for authentication.
[0010] In such applications, cost, though always a factor in
commercial products, has not been so critical--accuracy and
reliability have been and still remain paramount factors.
Typically, the placement sensor, a two-dimensional grid of sensors
that senses a fingerprint image from a user's fingerprint surface
all at once, was the obvious choice, and its many designs have
become standard in most applications. Once the fingerprint image is
sensed and reproduced in a digital form in a device, it is compared
against a prerecorded and stored image, and authentication is
complete when there is a match between the captured fingerprint
image and the stored image. In recent years, fingerprint sensors
have been finding their way into portable devices such as laptop
computers, hand held devices, cellular telephones, and other
devices. Though accuracy and reliability are still important, cost
of the system components is very important. The conventional
placement sensors were and still are very expensive for one primary
reason: they all used silicon sensor surfaces (this is excluding
optical sensors for this example, because they are simply too large
and require more power than a portable device can afford to
allocate, among other reasons, and thus they are generally not
available in most commercially available devices). These silicon
surfaces are very expensive, as the silicon material is as
expensive as the material to make a computer chip. Computer chips,
of course, have become smaller over the years to reduce their cost
and improve their performance. The reason the fingerprint silicon
could not be made smaller: they need to remain the size of the
average fingerprint, and the requirement for full scanning of the
users' fingerprints simply cannot be compromised. Substantially the
full print is required for adequate security in authentication.
[0011] Enter the fingerprint swipe sensor into the market. Swipe
sensors are fundamentally designed with a line sensor configured to
sense fingerprint features as a user swipes their finger in a
perpendicular direction with respect to the sensor line. The cost
saver: swipe sensors need much less silicon, only enough to
configure a line sensor with an array of pixel sensors. The width
is still fixed based on the average fingerprint width, but the
depth is substantially smaller compared to the placement sensor.
Some swipe sensors are capacitive sensors, where capacitance of the
fingerprint surface is measured and recorded line by line. Others
send a small signal pulse burst into the surface of the fingerprint
surface and measure a response in a pickup line, again recording
fingerprint features line by line. In either case, unlike the
placement sensors, the full fingerprint image needs to be
reconstructed after the user completes the swipe, and the
individual lines are reassembled and rendered to produce a full
fingerprint image. This image is compared with a fingerprint image
stored in the laptop or other device, and a user will then be
authenticated if there is an adequate match.
[0012] For the capacitive swipe sensors, the first generation
sensors were constructed with direct current (DC) switched
capacitor technology (for example U.S. Pat. No. 6,011,859). This
approach required using two plates per pixel forming a capacitor
between them, allowing the local presence of a finger ridge to
change the value of that capacitor relative to air. These DC
capacitive configurations took images from the fingerprint surface,
and did not penetrate below the finger surface. Thus, they were
easy to spoof, or fake a fingerprint with different deceptive
techniques, and they also had poor performance when a user had dry
fingers. RF (Radio Frequency) sensors were later introduced,
because some were able to read past the surface and into inner
layers of a user's finger to sense a fingerprint. Different radio
frequencies have been utilized by various devices along with
different forms of detection including amplitude modulation (AM)
and, phase modulation (PM). There are also differing configurations
of transmitters and receivers, one type (for example U.S. Pat. No.
5,963,679) uses a single transmitter ring and an array of multiple
low quality receivers that are optimized for on chip sensing. In
contrast another type (for example U.S. Pat. No. 7,099,496) uses a
large array of RF transmitters with only one very high quality
receiver in a comb like plate structure optimized for off chip
sensing.
[0013] One key impediment to the development of low cost placement
sensors has been the issue of pixel density, and the resultant
requirement for a large number of interconnections between layers
of the sensor device. A typical sensor for a fingerprint
application will be on the order of 10 mm.times.10 mm, with a
resolution of 500 dpi. Such a sensor array would be approximately
200 rows by 200 columns, meaning there would need to be 200 via
connections between layers in the device. While semiconductor vias
can be quite small, the cost for implementing a sensor in silicon
has proven to be prohibitive, as mentioned above.
[0014] In order to produce a placement sensor at a low enough cost
for mass market adoption, lower cost processes such as circuit
board etching must be employed. The current state of the art in
circuit board via pitch is on the order of 200 um, vs. the 50 um
pitch of the sensor array itself. Additionally, the added process
steps required to form vias between layers of a circuit board
significantly increase the tolerances for the minimum pitch of
traces on each of the layers. Single-sided circuits may be readily
fabricated with high yield with line pitch as low as 35 um, whereas
double sided circuits require a minimum line pitch on the order of
60 um or more, which is too coarse to implement a full 500 dpi
sensor array. One further consideration is that at similar line
densities, double-sided circuits with vias are several times more
expensive per unit area than single sided, making high-density
double sided circuits too expensive for low cost sensor
applications.
[0015] For laptop devices, adoption of the swipe sensor was driven
by cost. The swipe sensor was substantially less expensive compared
to the placement sensors, and most manufacturers of laptops adopted
them based solely on price. The cost savings is a result of using
less silicon area. More recently a substitute for the silicon
sensor arose, using plastic Kapton.TM. tape with etched sensing
plates on it, connected to a separate processor chip (for example
U.S. Pat. No. 7,099,496). This allowed the silicon portion of the
sensor to be separated from the sensing elements and the silicon to
follow Moore's law, shrinking to an optimal size, in length, width
and depth in proportion to advances in process technology. Although
this advance in the art enabled cheap durable Swipe Sensors, it did
not overcome the basic image reconstruction and ergonomics issues
resulting from changing from a simple two dimensional placement
format. In addition to Swipe Sensors being cheaper, they take up
less real estate in a host device, whether it is a laptop or a
smaller device, such as a cellular phone or personal data
device.
[0016] In most swipe class sensors, the fingerprint reconstruction
process turned out to be a greater ergonomic challenge to users and
more of a burden to quality control engineers than initially
expected. Users needed to be trained to swipe their finger in a
substantially straight and linear direction perpendicular to the
sensor line as well as controlling contact pressure. Software
training programs were written to help the user become more
proficient, but different environmental factors and the inability
of some to repeat the motion reliably gave Swipe Sensors a
reputation for being difficult to use. Initial data from the field
indicated that a large number of people were not regularly using
the Swipe Sensors in the devices that they had purchased and opted
back to using passwords. Quality control engineers who tried to
achieve the optimum accuracy and performance in the matching
process between the captured and reconstructed image found that the
number of False Rejects (FRR), and False Acceptances (FAR), were
much higher in Swipe Sensors than in placement sensors. Attempts to
improve these reconstruction algorithms failed to produce
equivalent statistical performance to placement sensors.
[0017] Development of sensors that take up less space on devices
have been tried without much success. Various ramps, wells and
finger guides had to be incorporated into the surfaces of the host
devices to assist the user with finger placement and swiping. These
structures ended up consuming significant space in addition to the
actual sensor area. In the end, swipe sensors ended up taking up
almost as much space as the placement sensors. This was not a big
problem for full size laptops, but is currently a substantial
problem for smaller laptops and netbooks, mobile phones, PDAs, and
other small devices like key fobs.
[0018] Real estate issues have become even more of an issue with
mobile device manufacturers who now require that the fingerprint
sensor act also as a navigation device, like a mouse or touch-pad
does in a laptop. The swipe sensor has proved to be a poor
substitute for a mouse or touch pad due to the fact that they are
constructed with an asymmetric array of pixels. Swipe sensors do a
good job of detecting motion in the normal axis of the finger swipe
but have difficulty accurately tracking sideways motion. Off axis
angular movements are even more difficult to sense, and require
significant processor resources to interpolate that movement with
respect to the sensor line, and often have trouble resolving large
angles. The byproduct of all this is a motion that is not fluid and
difficult to use.
[0019] It is clear that low cost two dimensional fingerprint sensor
arrays would serve a market need, but present art has not been able
to fill that need. Conventional capacitive fingerprint sensors
typically use distinct electrode structures to form the sensing
pixels array. These electrode structures are typically square or
circular and can be configured in a parallel plate configuration
(for example U.S. Pat. Nos. 5,325,442 and 5,963,679) or a coplanar
configuration (for example U.S. Pat. No. 6,011,859 and U.S. Pat.
No. 7,099,496).
[0020] These prior art approaches cannot be configured into a low
cost two dimensional array of sensing elements. Many capacitive
fingerprint sensors (for example U.S. Pat. Nos. 5,963,679 and
6,011,859) have plate structures that must be connected to the
drive and sense electronics with an interconnect density that is
not practical for implementation other than using the fine line
multilayer routing capabilities of silicon chips and therefore
require lots of expensive silicon die are as stated before. Other
sensors (for example U.S. Pat. No. 7,099,496) use off chip sensing
elements on a cheap polymer film, but the sensor cell architecture
is inherently one dimensional and cannot be expanded into a two
dimensional matrix.
[0021] Another application for capacitive sensing arrays has been
in the area of touch pads and touch screens. Because touchpad and
touch screen devices consist of arrays of drive and sense traces
and distinct sense electrodes, they are incapable of resolutions
below a few hundred microns, making this technology unsuitable for
detailed imaging applications. These devices are capable of
detecting finger contact or proximity, but they provide neither the
spatial resolution nor the gray-scale resolution within the body of
the object being sensed necessary to detect fine features such as
ridges or valleys.
[0022] Conventional art in the touchpad field utilizes a series of
electrodes, either conductively (for example U.S. Pat. No.
5,495,077) or capacitively (for example US publication
2006/0097991). This series of electrodes are typically coupled to
the drive and sense traces. In operation these devices produce a
pixel that is significantly larger in scale than the interconnect
traces themselves. The purpose is to generally sense presence and
motion of an object to enable a user to navigate a cursor, to
select an object on a screen, or to move a page illustrated on a
screen. Thus, these devices operate at a low resolution when
sensing adjacent objects.
[0023] Thus, there exists a need in the art for improved devices
that can provide high quality and accurate placement sensors for
use in different applications, such as fingerprint sensing and
authentication for example, and that may also operate as a
navigation device such as a mouse or touch pad in various
applications. As will be seen, the embodiment provides such a
device that addresses these and other needs in an elegant manner.
Given the small size and functional demands of mobile devices,
space savings are important. Thus, it would also be useful to be
able to combine the functions of a sensor with that of other
components, such as power switches, selector switches, and other
components, so that multiple functions are available to a user
without the need for more components that take up space.
[0024] Still further, it would be also useful for different
embodiments of a touch sensor to provide various alternatives for
providing biometric sensors that are easy to use and feasible in
different applications.
[0025] Even further, it would be useful for sensors to not only act
as image capturing components, but to also provide navigation
operations for viewing and exploring various media, such as with
touch-screens used in many smart phones, such as the iPad.TM.,
iPod.TM., iPhone.TM. and other touch-sensitive devices produced by
Apple Corporation.TM., the Galaxy.TM. and its progeny by Samsung
Corporation.TM., and other similar devices.
BRIEF DESCRIPTION OF DRAWINGS
[0026] FIG. 1 shows a diagrammatic view of one embodiment showing
the drive and pickup plate structures with an insulating dielectric
layer separating the drive and pickup lines.
[0027] FIG. 2 shows a basic diagrammatic view of one embodiment
showing the basic electrical field operation without an object in
close proximity to the drive and pickup plate structures with one
drive plate excited by a voltage source.
[0028] FIG. 3 shows a basic diagrammatic view of one embodiment
showing the basic electrical field operation with an object in
close proximity to the drive and pickup plate structures with one
drive plate excited by a voltage source.
[0029] FIG. 4 shows a basic diagrammatic view of one embodiment of
the sensor showing the differences in field intensity with and
without an object in close proximity to the drive and pickup plate
structures with one drive plate excited by a voltage source.
[0030] FIG. 5 shows a basic diagrammatic view of one embodiment
showing the basic electrical field operation with an object in
close proximity of the drive and pickup plate structures with the
selected pickup plate amplified and all inactive drive and pickup
plates grounded.
[0031] FIG. 6a shows a basic diagrammatic view of one embodiment
showing the basic electrical field operation with a finger or
object containing a ridge surface feature in close proximity to the
active electrode pair.
[0032] FIG. 6b shows a basic diagrammatic view of one embodiment
showing the basic electrical field operation with a finger or
object containing a valley surface feature in close proximity to
the active electrode pair.
[0033] FIG. 7 shows a diagrammatic view of an x-y grid of plate
rows and columns depicted by lumped circuit components that
represent the electric field couplings of the sensor at each
drive/pickup crossover.
[0034] FIG. 8 shows an example of an embodiment of the placement
embodiment using a differential amplifier to take the signal from
the selected pickup plate and subtract it from a reference signal
plate for noise reduction purposes.
[0035] FIG. 9a shows the drive and sense multiplexing circuitry of
an embodiment that incorporates a tank circuit to compensate for
input loading effects.
[0036] FIG. 9b shows the drive and sense multiplexing circuitry of
an embodiment that incorporates cascaded buffers to minimize input
loading effects.
[0037] FIG. 9c shows the drive and sense multiplexing circuitry of
an embodiment that incorporates dedicated buffers for each sense to
minimize loading effects.
[0038] FIG. 10 shows an embodiment that incorporates an analog
receiver to process the sensed signal, and processing circuitry to
perform the drive and sense line scanning function.
[0039] FIG. 11 shows an embodiment that incorporates a direct
digital conversion receiver to process the sensed signal, and
processing circuitry to perform the drive and sense line scanning
function.
[0040] FIG. 12A shows one example of a layout of the drive and
sense traces for an embodiment that incorporates the folded aspect
of the embodiment laid out flat prior to folding.
[0041] FIG. 12B shows one example of a layout of the drive and
sense traces for an embodiment that incorporates the folded aspect
of the embodiment laid out flat prior to folding.
[0042] FIG. 13a shows the layer stack-up of an embodiment that
incorporates the folding aspect subsequent to folding.
[0043] FIG. 13b shows an embodiment that incorporates the folding
aspect subsequent to folding and assembly into a rigid module.
[0044] FIG. 14 shows a sensor system configured according to the
embodiment for the purpose of sensing features of an object.
[0045] FIG. 15 shows an example of the sensing of a fingerprint
features.
[0046] FIG. 16 shows the process flow steps required to collect a
2-dimensional image with a sensor system configured according to
one embodiment.
[0047] FIG. 17a shows the process flow steps required to
authenticate a user with a fingerprint sensor system configured
according one embodiment.
[0048] FIG. 17b shows the process of template extraction from a
fingerprint image typically utilized in user authentication
applications.
[0049] FIGS. 18A-18D show an example of a fingerprint sensor system
having an integrated switch to allow a user to contact a
fingerprint sensor and to actuate a switch simultaneously.
[0050] FIGS. 19A-J show another example of a fingerprint sensor
system having an integrated switch, a dome switch in this example,
to allow a user to contact a fingerprint sensor and to actuate a
switch simultaneously.
[0051] FIG. 20 shows a top view of an embodiment of a switch formed
on the same substrate as the fingerprint sensor.
[0052] FIGS. 21A and B are detailed views which show the operation
of the embedded switch depicted in FIG. 20.
[0053] FIGS. 22A-26C illustrate other embodiments of the
invention.
[0054] FIGS. 27-29 illustrate a method for integrating a folded
flex fingerprint sensor directly onto a touch-screen device.
[0055] FIGS. 30-32 illustrate a fingerprint sensor integrated onto
the same substrate layers as a conventional touch-screen.
[0056] FIGS. 33 and 34 illustrate a novel "Dual Grid"
touch-screen.
[0057] FIGS. 35-37 illustrate a fully integrated Dual Grid
touch-screen and fingerprint sensor, which advantageously share a
common drive and sense circuit.
[0058] FIGS. 38-40 illustrated a fully integrated display with
integral touch-screen and fingerprint sensing over the entire
display area.
[0059] FIGS. 41-50 illustrate how the dual grid finger motion
tracking process operates.
[0060] FIG. 51 illustrates a flexible fingerprint sensor integrated
with a touchscreen.
[0061] FIG. 52 illustrates an embodiment of a fingerprint sensor
sharing a substrate layer with a touchscreen.
[0062] FIG. 53 illustrates a sensor and a touchscreen implemented
on common substrate layers utilizing a common controller chip.
DETAILED DESCRIPTION
[0063] As discussed in the background, there are many applications
for a two dimensional impedance sensor, and the embodiments
described herein provide broad solutions to shortcomings in the
prior art for many applications. The underlying technology finds
application in many different sensor features for use in many types
of products, including mobile phones, smart phones, flip phones,
tablet computers such as Apple.TM. iPads.TM. and Samsung.TM.
Galaxy.TM. devices, point of entry devices such as door knobs,
fence, drug cabinets, automobiles, and most any device, venue or
thing that may be locked and require authentication to access.
[0064] Generally, one embodiment is directed to a two-dimensional
sensor, and may also be referred to as a placement sensor, touch
sensor, area sensor, or 2D sensor, where a substantial area of an
object such as a user's fingerprint is sensed rather than a point
or line like portion of space that may or may not yield a
characteristic sample that is adequate for identification. The
sensor may have sensor lines located on one or more substrates,
such as for example a flexible substrate that can be folded over on
itself to form a grid array with separate sensor lines orthogonal
to each other. The sensor lines may alternatively be formed on
separate substrates. In either or any configuration, the crossover
locations of different sensor lines create sensing locations for
gathering information of the features and/or characteristics of an
object, such as the patterns of ridges and valleys of a fingerprint
for example.
[0065] Other embodiments provide a touch sensor having common
electrical connections with a touch screen. For example, touch
screen circuitry that resides under protective glass, such as
Gorilla Glass.TM. used in many touch screen devices, may share
common electrical connections with a two dimensional sensor used
for navigation, and/or fingerprint sensing, or other operations.
This provides benefits for manufacturing a device with both a touch
screen and a fingerprint sensor, and may simplify the electrical
layout of such a device. Exemplary configurations are described
below and illustrated herein.
[0066] Other embodiments provide novel approaches to
two-dimensional sensors integrated with a touch screen to provide
the ability to capture a fingerprint image in one mode, and to
operate as a conventional touch-screen when in another mode. In one
example, a sensor grid may act as a touch screen by sensing
presence of a user's finger or fingers and also movement of the
fingers from one location to another together with speed to
determine a swipe direction and speed. In another mode, the same
sensor lines may act as drive lines and pickup lines, where a
signal is transmitted from the screen to the user's finger or
fingers, and the resulting signal is received by a pickup line and
measured to determine the impedance of the fingerprint surface.
Impedance values of fingerprint ridges are different than the
impedance measurement of fingerprint valleys, and thus the
fingerprint image may be mapped once the impedance values are
captured of a two dimensional surface of a fingerprint surface. The
resulting fingerprint image may then be compared to a stored
fingerprint image to authenticate the user, much in the same way a
simple password is compared to a stored password when users
authenticate themselves with electronic devices using numerical and
alphanumeric passwords with devices. The difference is that the use
of a fingerprint in place of a password is much more secure.
[0067] A two dimensional sensor may be configured in different
ways, such as for example a component that may be integrated on a
portable device, a sensor integrated with a touch-screen used to
provide touch sensitive surfaces for navigation of electronic
content and operations in a portable device, or as a stand-alone
component that may be electrically connected to a system or device
to transmit and receive information for authentication, activation,
navigation and other operations.
[0068] In one embodiment, the drive lines and pickup lines are not
electrically intersecting or connected in a manner in which they
would conduct with each other, they form an impedance sensing
electrode pair with a separation that allows the drive lines to
project an electrical field and the pickup lines to receive an
electrical field, eliminating the need for distinct electrode
structures. The two lines crossing with interspersed dielectric
intrinsically creates an impedance sensing electrode pair. Thus,
the sensor is configured to activate two one-dimensional sensor
lines to obtain one pixel of information that indentifies features
and/or characteristics of an object. Unlike conventional sensors, a
sensor configured according to certain embodiments may provide a
two dimensional grid that is capable of capturing multiple pixels
of information from an object by activating individual pairs of
drive and pickup lines and capturing the resultant signal. This
signal can be processed with logic or processor circuitry to define
presence and absence of an object, features and/or characteristics
of an object.
[0069] In yet another embodiment, a touch screen may operate as a
sensor configured in one mode to capture information on a nearby
object, such as information for forming an image of a fingerprint,
and may operate in another mode to perform navigation or other
operations when another mode. In one example, an OLED touch screen
is configured to operate in at least two modes, one as a touch
screen, and another as a fingerprint sensor, where a fingerprint
may be captured in any part of the OLED touch screen desired, and
even multiple fingerprints from two or more user fingers may be
captured.
[0070] In examples described herein, these sensors may be
configured to capture information of a nearby object, and the
information may be used to produce renderings of an object, such as
a fingerprint, and compare the renderings to secured information
for authentication.
[0071] According to one embodiment, and in contrast to conventional
approaches, a device can utilize the intrinsic impedance sensing
electrode pair formed at the crossings between the drive and pickup
lines. In operation, the electric fields may be further focused by
grounding drive and pickup lines near or about the area being
sensed by the particular crossover location at one time. This
prevents interference that may occur if other drive and pickup
lines were sensing electric fields simultaneously. More than one
electrode pair may be sensed simultaneously. However, where
resolution is an important factor, it may be preferred to avoid
sensing electrode pairs that are too close to each other to avoid
interference and maintain accuracy in sensing object features at a
particular resolution. For purposes of this description, "intrinsic
electrode pair" refers to the use of the impedance sensing
electrode pairs that are formed at each of the drive and pickup
line crossover locations. Due to the fact that the embodiments use
each intrinsic electrode pair at each crossover as a sensing
element, no differentiating geometric features exist at individual
sensing nodes to distinguish them from the interconnect lines. As a
result, the alignment between the drive layers and sense layers is
non-critical, which significantly simplifies the manufacturing
process.
[0072] Grounding the adjacent inactive drive and pickup lines
restricts the pixel formed at each intrinsic electrode pair without
requiring complex measures such as the dedicated guard rings
employed in prior art (for example U.S. Pat. No. 5,963,679).
Instead, guard grounds around the pixel are formed dynamically by
switching adjacent inactive drive and pickup lines into ground
potential. This allows the formation of high density pixel fields
with relatively low resolution manufacturing processes, as the
minimum pixel pitch for a given process is identical to the minimum
feature spacing. This, in turn, enables the use of low cost
manufacturing process and materials, which is the key to creating a
low cost placement sensor.
[0073] In one example, the sensor lines may consist of drive lines
on one layer and pickup lines on another layer, where the layers
are located over each other in a manner that allows the separate
sensor lines, the drive and pickup lines, to cross over each other
to form impedance sensing electrode pairs at each crossover
location. These crossover locations provide individually focused
electrical pickup locations or pixels, or electrode pairs where a
number of individual data points of features and/or characteristics
of an object can be captured. The high degree of field focus is due
to the small size of the intrinsic electrode pairs, as well as the
high density of the neighboring ground provided by the inactive
plates. The flexible substrate may have a second substrate
configured with logic or processor circuitry for sending and
receiving signals with the sensor lines to electronically capture
information related to the object. Alternatively, there may be two
separate substrates carrying the separate sensor lines and layered
on each other, and yet connected to a third substrate for
connection to logic or processor circuitry.
[0074] The utilization of the crossover locations between
perpendicular lines on adjacent layers for the pickup cell greatly
reduces the alignment requirements between the layers. Since there
are no unique features at a sensor pixel location to align, the
only real alignment requirement between the layers is maintaining
perpendicularity. If the sense cell locations had specific
features, such as the parallel plate features typical of prior art
fingerprint sensors, the alignment requirements would include X and
Y position tolerance of less than one quarter a pixel size, which
would translate to less than +/-12 um in each axis for a 500 DPI
resolution fingerprint application.
[0075] In operation, a drive line is activated, with a current
source for example, and a pickup line is connected to a receiving
circuit, such as an amplifier/buffer circuit, so that the resulting
electric field can be captured. An electric field extends from the
drive line to the pickup line through the intermediate dielectric
insulating layer. If an object is present, some or all of the
electric field may be absorbed by the object, changing the manner
in which the electric field is received by the pickup line. This
changes the resulting signal that is captured and processed by the
pickup line and receiving circuit, and thus is indicative of the
presence of an object, and the features and characteristics of the
object may be sensed and identified by processing the signal. This
processing may be done by some form of logic or processing
circuitry.
[0076] In other embodiments, the signal driving the drive line may
be a complex signal, may be a varying frequency and/or amplitude,
or other signal. This would enable a sensor to analyze the features
and/or characteristics of an object from different perspectives
utilizing a varying or complex signal. The signal may include
simultaneous signals of different frequencies and/or amplitudes
that would produce resultant signals that vary in different manners
after being partially or fully absorbed by the object, indicating
different features and characteristics of the object. The signal
may include different tones, signals configured as chirp ramps, and
other signals. Processing or logic circuitry may then be used to
disseminate various information and data points from the resultant
signal.
[0077] In operation, the varying or complex signal may be applied
to the drive line, and the pickup line would receive the resulting
electric field to be processed. Logic or processing circuitry may
be configured to process the resulting signal, such as separating
out different frequencies if simultaneous signals are used, so that
features and/or characteristics of the object may be obtained from
different perspectives.
[0078] Given the grid of pixels that can be activated at individual
pairs, each pixel may be captured in a number of ways. In one
embodiment, a drive line may be activated, and pickup lines may be
turned on and off in a sequence to capture a line of pixels. This
sequencing may operate as a scanning sequence. Here a first drive
line is activated by connecting it to a signal source, and then one
pickup line is connected to amplifier/buffer circuitry at a time,
the information from the pixel formed at the crossing of the two
lines is captured, and then disconnected. Then, a next pixel is
processed in sequence, then another, then another, until the entire
array of pickup lines is processed. The drive line is then
deactivated, and another drive line is activated, and the pickup
lines are again scanned with this active drive line. These may be
done one at a time in sequence, several non-adjacent pixels may be
processed simultaneously, or other variations are possible for a
given application. After the grid of pixels is processed, then a
rendering of object information will be possible.
[0079] Referring to FIG. 1, a diagrammatic view of one embodiment
of a sensor 100 configured according to one embodiment is
illustrated. In this configuration, pickup lines or top plates
102a[m], 102b[m+1] are located on a insulating dielectric substrate
layer 104 and configured to transmit a signal into a surface of an
object located in close proximity to the sensor lines. Drive lines
or bottom plates 106a[n], 106b[n+1] are juxtaposed and
substantially perpendicular to the drive lines or plates and are
located on an opposite side of the a insulating dielectric
substrate to form a type of a grid. The pickup lines are configured
to receive the transmitted electromagnetic fields modified by the
impedance characteristics on an object placed within the range of
those electric fields.
[0080] Referring to FIG. 2, a diagrammatic view of a sensor 200 is
shown having pickup lines or top plates 202a, 202b and insulating
layer 204, and drive lines or bottom plates 206a, 206b. The Figure
further illustrates how electromagnetic fields 208a, 208b extend
between the drive lines and pickup plates through the substrate.
Without an object within proximity, the electric field lines are
uniform within the sensor structure and between the different
lines. When an object is present, a portion of the electric field
lines are absorbed by the object and do not return to the pickup
plates through the insulating layer.
[0081] Referring to FIG. 3, an object 310 is illustrated proximate
the sensor 300. The sensor 300 has pickup lines or top plates 302a,
302b, an insulating dielectric layer 304, and drive lines or bottom
plates 306a, 306b. In operation, the drive lines and pickup lines
of this device example may be individually activated, where a drive
line/pickup line pair is activated to produce an active circuit.
The result is a circuit that transmits electric field from active
drive plate 316 into the combined dielectric of the insulating
layer 304 and object 310 via electric field lines, 306a, 306b, and
received by the active pickup plate. As the illustration shows,
some of the field lines are captured by the object when it is
placed about the active electrode pair. The variations in an
object, such as peaks and valleys and other features of an object
surface, can be detected and captured electronically by capturing
and recording the resulting electric field variations occurring at
different crossover locations of the drive and pickup lines.
Similar to common capacitance based placement sensors, the sensor
can capture a type of image of the object surface electronically,
and generate a representation of the features and characteristics
of an object, such as the features and characteristics of a
fingerprint in the fingerprint sensor example described below.
[0082] In this configuration of FIG. 3, only one active electrode
pair is illustrated. However, the embodiment is not limited to this
particular configuration, where one single electrode pair, several
electrode pairs, or even all electrode pairs may be active at one
time for different operations. In practice, it may be desirable for
less than all of the electrode pairs to be active at a given time,
so that any interference that may occur between close-by pixels
would be minimized. In one embodiment, a drive line may be
activated, and the pickup lines may be scanned one or more at a
time so that a line of pixels can be captured along the drive line
and pickup lines as they are paired along a line at the crossover
locations. This is discussed in more detail below in connection
with FIG. 5.
[0083] In general, in operation, each area over which a particular
drive line overlaps a pickup line with a separation of the a
insulating dielectric substrate is an area that can capture and
establish a sensing location that defines characteristics or
features of a nearby object about that area. Since there exist
multiple sensing locations over the area of the sensor grid,
multiple data points defining features or characteristics of a
nearby object can be captured by the sensor configuration. Thus,
the sensor can operate as a planar two-dimensional sensor, where
objects located on or about the sensor can be detected and their
features and characteristics determined.
[0084] As described in the embodiments and examples below, the
embodiment is not limited to any particular configuration or
orientation described, but is only limited to the appended claims,
their equivalents, and also future claims submitted in this and
related applications and their equivalents. Also, many
configurations, dimensions, geometries, and other features and
physical and operational characteristics of any particular
embodiment or example may vary in different applications without
departing from the spirit and scope of the embodiment, which,
again, are defined by the appended claims, their equivalents, and
also future claims submitted in this and related applications and
their equivalents.
[0085] In the following description, numerous specific details are
set forth in order to provide a thorough understanding of the
embodiment. However, it will be apparent to one skilled in the art
that the embodiment can be practiced without these specific
details. In other instances, well known circuits, components,
algorithms, and processes have not been shown in detail or have
been illustrated in schematic or block diagram form in order not to
obscure the embodiment in unnecessary detail. Additionally, for the
most part, details concerning materials, tooling, process timing,
circuit layout, and die design have been omitted inasmuch as such
details are not considered necessary to obtain a complete
understanding of the embodiment and are considered to be within the
understanding of persons of ordinary skill in the relevant art.
Certain terms are used throughout the following description and
claims to refer to particular system components. As one skilled in
the art will appreciate, components may be referred to by different
names. This document does not intend to distinguish between
components that differ in name, but not function. In the following
discussion and in the claims, the terms "including" and
"comprising" are used in an open-ended fashion, and thus should be
interpreted to mean "including, but not limited to . . . "
[0086] Embodiments of the embodiment are described herein. Those of
ordinary skill in the art will realize that the following detailed
description of the embodiment is illustrative only and is not
intended to be in any way limiting. Other embodiments of the
embodiment will readily suggest themselves to such skilled persons
having the benefit of this disclosure. Reference will be made in
detail to implementations of the embodiment as illustrated in the
accompanying drawings. The same reference indicators will be used
throughout the drawings and the following detailed description to
refer to the same or like parts.
[0087] In the interest of clarity, not all of the routine features
of the implementations described herein are shown and described. It
will, of course, be appreciated that in the development of any such
actual implementation, numerous implementation-specific decisions
must be made in order to achieve the developer's specific goals.
Moreover, it will be appreciated that such a development effort
might be complex and time-consuming, but would nevertheless be a
routine undertaking of engineering for those of ordinary skill in
the art having the benefit of this disclosure.
[0088] In one embodiment, a sensor device includes drive lines
located on or about an insulating dielectric substrate and
configured to transmit a signal onto a surface of an object being
sensed. Pickup lines are located near or about the drive lines and
configured to receive the transmitted signal from the surface of an
object. In order to keep a separation between the drive lines and
pickup lines, the substrate may act as an insulating dielectric or
spacing layer. The substrate may be for example a flexible polymer
based substrate. One example is Kapton.TM. tape, which is widely
used in flexible circuits such as those used in printer cartridges
and other devices. The package may include such a flexible
substrate, where the drive lines may be located on one side of the
substrate, and the pickup lines may be located on an opposite side
of the substrate.
[0089] The drive lines may be orthogonal in direction with respect
to the pickup lines, and may be substantially perpendicular to the
pickup lines. According to one embodiment, a device may be
configured with drive lines and pickup lines located on or about
opposite sides of an insulating dielectric substrate, where the
combination of these three components provides capacitive
properties. The drive lines may be activated to drive an electric
field onto, into or about an object. The pickup lines can receive
electronic fields that originated from the drive lines, and these
electronic fields can be interpreted by processing or logic
circuitry to interpret features or characteristics of the object
being sensed.
[0090] Thus, in one embodiment the layer separating the drive lines
from the pickup lines can provide a capacitive property to the
assembly. If some or all of the drive lines are substantially
perpendicular to the pickup lines, either entirely or in portions,
then a grid may be formed. In such a configuration, from a three
dimensional view, the drive lines are located and oriented
substantially in parallel with respect to each other about a first
plane. One surface of the substrate is located about the drive
lines in a second plane that is substantially parallel relative to
the drive lines. The pickup lines are located and oriented
substantially in parallel with respect to each other about a third
plane that is substantially parallel to the first and second planes
and also located about another substrate surface that is opposite
that of the drive lines, such that the substrate is located
substantially between the drive lines and the pickup lines.
[0091] In this description, including descriptions of embodiments
and examples, there will be references to the terms parallel,
perpendicular, orthogonal and related terms and description. It is
not intended, nor would it be understood by those skilled in the
art that these descriptions are at all limiting. To the contrary,
the embodiment extends to orientations and configurations of the
drive lines, the pickup lines, the substrate or related structure,
and also various combinations and permutations of components, their
placement, distance from each other, and order in different
assemblies of a sensor. Though the embodiment is directed to a
sensor configured with plurality of drive and pickup lines that
generally cross over each other at a pixel location and are
configured to detect presence and other features and
characteristics of a nearby object, the embodiment is not limited
to any particular configuration or orientation, but is only limited
to the appended claims, their equivalents, and also future claims
submitted in this and related applications and their
equivalents.
[0092] Also, reference will be made to different orientations of
the geometric planes on which various components will lie, such as
the drive and pickup lines and the substrate that may be placed in
between the sets of drive and pickup lines. If flexible substrates
are used for example, the use of such a structure will allow for
planes to change as a flexible structure is flexed or otherwise
formed or configured. In such embodiment will be understood that
certain aspects of the embodiment are directed to the drive lines
and pickup lines being configured on opposite sides of a substrate
and in a manner that enables the sensing of particular features
and/or characteristics of a nearby object at each crossover
location of a drive line and a pickup line. Thus, the orientation
of the planes (which may be deformable, and thus may be sheets
separated by a substantially uniform distance) of groups of
components (such as drive lines or pickup lines for example) or
substrates may vary in different applications without departing
from the spirit and scope of the embodiment.
[0093] Also, reference will be made to pickup lines, pickup plates,
drive lines, drive plate, and the like, but it will be understood
that the various references to lines or plates may be used
interchangeably and do not limit the embodiment to any particular
form, geometry, cross-sectional shape, varying diameter or
cross-sectional dimensions, length, width, height, depth, or other
physical dimension of such components. Also, more sophisticated
components may be implemented to improve the performance of a
device configured according to the embodiment, such as for example
small 65, 45, 32 or 22 nanometer conduction lines or carbon
nano-tubes that may make an assembly more easily adapted to
applications where small size and shape as well as low power are
desired characteristics and features. Those skilled in the art will
understand that such dimensions can vary in different applications,
and even possibly improve the performance or lower power
consumption in some applications, without departing from the spirit
and scope of the embodiment.
[0094] Reference will also be made to various components that are
juxtaposed, layered, or otherwise placed on each other. In one
example of an embodiment, a plurality of drive lines are juxtaposed
on one surface of a generally planar substrate, and a plurality of
pickup lines are juxtaposed on an opposite surface of the planar
substrate. The drive lines are substantially orthogonal to the
pickup lines, and may be described as substantially perpendicular
to the pickup lines. The distance between the drive lines and
pickup lines may be filled with a substrate or insulating material
that will provide for a capacitive configuration. Here the drive
lines on one side of the substrate forms one capacitive plate, and
the pickup lines on an opposite side for the corresponding
capacitive plate. In operation, when the drive plate is activated,
an electrical field is generated between the drive lines and pickup
lines and through the substrate to form a plurality of capacitive
elements. These capacitive elements are located at an area at each
cross-section of a drive line and a pickup line with a portion of
the substrate located between the areas. This is a location where
the respective drive lines and pickup lines overlap each other. In
any particular application, these areas in which the three
components interact during operation define a data location at
which a sensor reading can be made.
[0095] Reference will also be made to sensor lines, such as sensor
drive lines and sensor pickup lines, and their orientation amongst
themselves and each other. For example, there will be described
substantially parallel drive lines. These drive lines are intended
to be described as parallel conductive lines made up of a
conductive material formed, etched, deposited or printed onto the
surface such as copper, tin, silver and gold. Those skilled in the
art will understand that, with the inherent imperfections in most
any manufacturing process, such conductive lines are seldom
"perfect" in nature, and are thus not exactly parallel in practice.
Therefore, they are described as "substantially parallel".
Different applications may configure some of the drive lines even
non-parallel, such that the lines may occur parallel for a portion
of the line, and the line may necessarily deviate from parallel in
order to connect with other components for the device to operate,
or in order to be routed on or about the substrate on which it is
formed or traced. Similarly, the separate array of lines may be
described as orthogonal or perpendicular, where the drive lines are
substantially orthogonal or perpendicular to the pickup lines.
Those skilled in the art will understand that the various lines may
not be perfectly perpendicular to each other, and they may be
configured to be off-perpendicular or otherwise crossed-over in
different angles in particular applications. They also may be
partially perpendicular, where portions of drive lines may be
substantially perpendicular to corresponding portions of pickup
lines, and other portions of the different lines may deviate from
perpendicular in order to be routed on or about the substrate or to
be connected to other components for the device to operate.
[0096] These and other benefits provided by the embodiment will be
described in connection with particular examples of embodiments of
the embodiment and also descriptions of intended operational
features and characteristics of devices and systems configured
according to the embodiment.
[0097] In operation, generally, the drive lines can transmit an
electromagnetic field toward an object that is proximal to the
device. The pickup lines may receive a signal originating from the
drive lines and then transmitted through the object and through the
substrate and onto the pickup lines. The pickup lines may
alternatively receive a signal originating from the drive lines
that were then transmitted through the substrate and onto the
pickup lines without passing through the object. This electric
field can vary at different locations on the grid, giving a
resultant signal that can be interpreted by some type of logic or
processor circuitry to define features and/or characteristics of an
object that is proximate the assembly.
[0098] The drive lines and pickup lines may be controlled by one or
more processors to enable the transmission of the signal to an
object via the drive lines, to receive a resultant signal from an
object via the pickup lines, and to process the resultant signal to
define an object image. One or more processors may be connected in
one monolithic component, where the drive lines and pickup lines
are incorporated in a package that includes the processor. In
another embodiment, the drive lines, pickup lines and substrate may
be assembled in a package by itself, where the package can be
connected to a system processor that controls general system
functions. This way, the package can be made part of the system by
connecting with a system's input/output connections in order to
communicate with the system. This would be similar in nature for
example to a microphone connected to a laptop, where the audio
signals are received by the system processor for use by the laptop
in receiving sounds from a user. According to this embodiment, the
sensor can be connected as a stand-alone component that
communicates with the system processor to perform sensor operations
in concert with the system processor.
[0099] In another embodiment, a sensor may be configured to drive
signals at different frequencies since the impedance of most
objects, especially human tissue and organs, will greatly vary with
frequency. In order to measure complex impedance at one or more
frequencies of a sensed object, the receiver must be able also to
measure phase as well as amplitude. In one embodiment, the
resulting signal generated from a given impedance sensing electrode
pair may result from varying frequencies, known in the art as
frequency hoping, where the receiver is designed to track a random,
pseudo-random or non-random sequence of frequencies. A variation of
this embodiment could be a linear or non-linear frequency sweep
known as a chirp. In such an embodiment one could measure the
impedance of a continuous range frequencies very efficiently.
[0100] In yet another embodiment, a grid sensor as described above
may be configured to also operate as a pointing device. Such a
device could perform such functions as well known touch pads, track
balls or mice used in desktops and laptop computers.
[0101] In one example of this embodiment, a two dimensional
impedance sensor that can measure the ridges and valleys of a
finger tip may be configured to track the motion of the fingerprint
patterns. Prior art swiped fingerprint sensors can perform this
function, but due to the physical asymmetry of the array and the
need to speed correct, or "reconstruct" the image in real time make
these implementations awkward at best. The sensor could also double
as both a fingerprint sensor and a high quality pointing
device.
[0102] One device configured according to the embodiment includes a
first array of sensor lines on a flexible substrate, and a second
array of sensor lines on a flexible substrate, and also a processor
configured to process fingerprint data from the first and second
arrays of sensor lines. When folded upon itself in the case of a
single flexible substrate or when juxtaposed in the case of
separate substrates, the separate sensor lines cross each other
without electrically shorting to form a grid with cross-over
locations that act as pixels from which fingerprint features can be
sensed. In one embodiment, an array of substantially parallel
sensor drive lines is located on a surface of the flexible
substrate. These drive lines are configured to sequentially
transmit signal into a surface of a user's finger activating a line
at a time. A second array of sensor lines is similar to the first,
consisting of substantially parallel sensor pickup lines that are
substantially perpendicular to the drive lines. These pickup lines
are configured to pick up the signal transmitted from the
first.
[0103] In the configuration where the first and second set of
sensor lines, the drive and the pickup lines for example, are
located on different sections of an extended surface of the
flexible substrate, the flexible substrate is further configured to
be folded onto itself to form a dual layer configuration. Here, the
first array of sensor drive lines becomes substantially
perpendicular to the second array of pickup sensor lines when the
flexible substrate is folded onto itself. This folding process
creates crossover locations between these separate arrays of sensor
lines--though they must not make direct electrical contact so that
they operate independently. These crossover locations represent
impedance sensing electrode pairs configured to sense pixels of an
object and its sub-features juxtaposed relative to a surface of the
flexible substrate. The scanning of these pixels is accomplished by
activating individual rows and columns sequentially. Once a drive
column is activated with drive signal the perpendicular pickup rows
are scanned one at a time over the entire length of the selected
driver. Only one row is electrically active (high impedance) at a
time, the non active rows are either shorted to ground or
multiplexed to a state where they do not cross couple signal. When
a finger ridge is placed above an array crossover location that is
active, it interrupts a portion of the electric field that
otherwise would be radiated through the surface film from the
active drive column to the selected row pickup. The placement of an
object's subfeature, such as a ridge or valley in the case of a
fingerprint sensor, over an impedance sensing electrode pair
results in a net signal decrease since some of the electric field
is conducted to ground through the human body. In a case of a
fingerprint sensor the placement of a fingerprint ridge/valley over
an impedance sensing electrode pair, the valley affects the
radiation of electric field from the selected drive line to the
selected pickup line much less than a ridge would. By comparing the
relative intensity of signals between the pixels ridges and
valleys, a two dimensional image of a finger surface can be
created.
[0104] Referring again to FIG. 1, this general example of the grid
sensor will be now used to illustrate how such a sensor configured
according to the embodiment can be implemented as a fingerprint
sensor, where the object would simply be the surface of the
fingerprint on the user's finger. This example will be carried
through the following Figures for illustration of the benefits and
novel features of the impedance sensor configured according to the
embodiment. However, it will be appreciated by those skilled in the
art, however, that any object may be sensed by a device configured
according to the embodiment. Again, the example and description are
intended only for illustration purposes.
[0105] In operation, the sensor can be configured to detect the
presence of a finger surface located proximate to the sensor
surface, where the drive lines can drive an active electromagnetic
field onto the finger surface, and the pickup lines can receive a
resulting electromagnetic field signal from the pickup lines. In
operation, the drive lines can generate an electric field that is
passed onto the surface of the finger, and the different features
of the fingerprint, such as ridges and valleys of the fingerprint
surface and possibly human skin characteristics, would cause the
resulting signal to change, providing a basis to interpret the
signals to produce information related to the fingerprint
features.
[0106] In one embodiment of a fingerprint sensor, referring again
to FIG. 1 in the context of a fingerprint sensor, a flexible
substrate is used as the insulating dielectric layer 104, to allow
for beneficial properties of durability, low cost, and flexibility.
The drive lines or plates 106a, 106b, are located on the flexible
substrate and configured to transmit a signal into a surface of a
user's fingerprint features and structures, such as ridges and
valleys, placed on or about the sensor lines. The pickup lines
102a, 102b are configured to receive the transmitted signal from
the user's finger surface. A processor (not shown) can be
configured to collect and store a fingerprint image based on the
received signal from the pickup lines.
[0107] Referring to FIG. 4, an example a sensor 400 configured as
an object sensor, where the top plates or pickup lines 402a, 402b,
. . . , 402n are located on one side of insulating dielectric layer
or substrate 404. Bottom plates or pickup lines 406a, 406b, . . . ,
406n are located on an opposite side of the substrate 404. Electric
fields 408a, 408b extend from bottom plates or drive lines 406a,
406b through the insulating layer or substrate 404 and onto active
top plate 402a. According to the embodiment, these drive lines may
be activated one at a time to reduce any interference effects, but
the electric field results illustrated here are intended to
illustrate a contrast between electric fields that are partially or
fully absorbed by the object with electric fields that are not
absorbed the object at all. This information may be collected from
drive and pickup plate electrode pairs at each crossover location
to sense features and characteristics of the object that is
proximate the sensor lines. Partially covered top plate or pickup
line 402b is connected to voltmeter 417, and uncovered top plate
402a is connected to voltmeter 418. Active drive line or bottom
plate 406b is connected is connected to AC signal source 416,
causing an electric field to radiate from active plate 406b.
According to a particular application, the number of drive lines
and pickup lines can vary depending on the application, and it may
depend on the cost and resolution desired. As can be seen, the
electric field lines 408a is partially captured by the pickup lines
402a and 402b, and part is captured by the object, in this case
finger 410. Also, in order to illustrate that the pickup lines will
exhibit different reading when an object or object feature is
present or not present or proximate to a given crossover location,
volt meter 417 illustrates the response to the top plate or drive
line 402b, and voltmeter 418 illustrates the response of top plate
or drive line 402a. The difference in the deflections of voltmeter
417 in comparison 418 show the delta in electric field intensity
between the two electrode pair locations, one with a finger present
the other without.
[0108] Referring to FIG. 5, another example of a sensor configured
according to the embodiment is illustrated the Drive and pickup
configuration when detecting the presence of an object. The sensor
500 is illustrated, where the top plates or pickup lines 502a,
502b, . . . , 502n are located on one side of insulating layer or
substrate 504, and bottom plates or drive lines 506a, 506b, . . . ,
506n are located on an opposite side of the substrate 504. Again,
the pickup lines are shown on the layer closest to the object being
sensed for maximum sensitivity, and the drive lines shown on the
opposite side of the substrate. Electric fields 508a, 508b extend
from bottom plates or drive lines 506a, 506b through the insulating
layer or substrate 504 and onto active top plate 502b. Other
configurations are possible, perhaps having drive plates on the
top, and pickup plates on the bottom. The embodiment, however, is
not limited to any particular configuration that is insubstantially
different than the examples and embodiments disclosed and claimed
herein.
[0109] FIG. 5, further shows a snapshot of one selected individual
electrode pair located at the crossover of pickup line 502b and
drive line 506b, where the remaining pickup and drive lines are not
active, shown grounded in FIG. 5. Drive line 506b is connected to
AC voltage source 516, and pickup line 502b is connected to
amplifier/buffer 514. Once activated as shown here, electric field
lines 508a, 508b are generated, and they radiate from drive line
506b and are sensed by pickup line 502b, sending the resultant
signal into amplifier/buffer 514, and are later processed by analog
and digital circuit functions. Grounding the inactive adjacent
drive and pickup lines focuses the electric fields 508a and 508b at
the crossover location between the active the drive and pickup
plates, limiting crosstalk from adjacent areas on the object being
sensed. As the sensing operation proceeds in this embodiment,
different drive line/pickup line crossover pairings may be
activated to capture different pixels of information from the
object. In the case of an object sensor, it can capture information
on the shape of the object, and, if the electrical characteristics
are non-uniform across its surface, it's composition. Again, the
embodiment is not limited to this particular configuration, where
one single electrode pair, several electrode pairs, or even all
electrode pairs may be active at one time for different operations.
In practice, it may be preferable for less than all of the
impedance sensing electrode pairs to be active at a given time, so
that any interference that may occur between close-by pixels would
be minimized. In one embodiment, a drive line may be activated, and
the pickup lines may be scanned one or more at a time so that a
line of pixels can be captured along the drive line and pickup
lines as they are paired along a line at the crossover locations.
Thus, and still referring to FIG. 5, the AC voltage source 516 may
remain connected to drive line 506b, and the connection of the
amplifier/buffer 516 may cycle or scan over to sequential pickup
lines, so that another pixel of information can be captured from
another pickup line crossover paired with drive line 506b. Once
substantially all the pickup lines 506a-n have been scanned drive
line 506b can be deactivated, than another drive line in sequence
can be activated with the AC voltage source, and a new scanning can
commence through the pickup lines. Once substantially all drive
line/pickup line pairings have been scanned to capture the full
two-dimensional array of pixels, then a two dimensional image or
rendering of the object features and characteristics can be made,
such as a rendering of the shape of the object, and potentially a
composition map.
[0110] As another example of a sensor that can benefit from the
embodiment, a reduced cost fingerprint swipe sensor could be
configured using the same innovation provided by the embodiment. In
this embodiment, a reduced number of pickup lines could be
configured with a full number of orthogonal drive lines. Such a
configuration would create a multi-line swipe sensor that would
take the form of pseudo two-dimensional sensor, and when a finger
was swiped over it would create a mosaic of partial images or
slices. The benefit of this would be to reduce the complexity of
image reconstruction task, which is problematic for current
non-contact silicon sensors that rely on one full image line and a
second partial one to do speed detection.
[0111] The tradeoff would be that this pseudo two dimensional array
would have to be scanned at a much faster rate in order to keep up
with the varying swipe speeds of fingers that have to be swiped
across it.
[0112] FIGS. 6a and 6b illustrate the operation of the sensor when
detecting surface features of an object such as fingerprint ridges
and valleys. The sensor is configured identically to the previous
example in FIG. 5, but in this case is interacting with a textured
surface such as a fingerprint.
[0113] Referring to FIGS. 6a and b, another example of a sensor
configured according to the embodiment is illustrated. The sensor
600 is illustrated, where the top plates or pickup lines 602a-n are
located on one side of insulating layer or substrate 604, and
bottom plates or drive lines 606a-n are located on an opposite side
of the substrate 604. For maximum sensitivity pickup lines are
shown on the layer closest to the object being sensed, and the
drive lines shown on the opposite side of the substrate. FIG. 6a
shows electric field lines 620 as they interact with a proximally
located object's valley and FIG. 6b shows electric field lines 621
as the interact with a proximally located object's peaks, extending
from bottom plate drive line 606b through the insulating layer or
substrate 604 and onto active drive line 606b. In the case of
sensing a fingerprint, the corresponding ridges and valleys over
the fingerprint surface can be captured by the grid of drive
line/pickup line crossover points, and the resulting data can be
used to render an image of the fingerprint. A stored fingerprint
can then be compared to the captured fingerprint, and they can be
compared for authentication. This is accomplished using any one of
many fingerprint matching algorithms which are available from
vendors as stand alone products. Such vendors include Digital
Persona, BioKey, and Cogent Systems, to name just a few.
[0114] Also illustrated in FIGS. 6a and b, is the individual sensor
line pairing of pickup line 602b and drive line 606b. Their
crossover forms the active electrode pair, and the remaining pickup
and drive lines are not active, and will nominally be grounded by
electronic switches. Drive line 606b is connected to AC voltage
source 616, and pickup line 602b is connected to amplifier/buffer
605. Once activated as shown here, electric field lines 620 and 621
are created as shown in FIGS. 6a and 6b respectively, and they
emanate between the drive line 606b and pickup line 602b, sending a
resultant signal that is radiated onto pickup line 602b and
connected to amplifier/buffer 605, and later processed by analog
and digital processing circuitry. As the sensing operation proceeds
in this embodiment, different drive line/pickup line crossover
pairs may be activated to capture different pixels of information
from the object. In the case of a fingerprint, it can capture
information on different features and characteristics of the
fingerprint and even the body of the finger itself. Again, the
embodiment is not limited to this particular configuration, where
one electrode pair, several electrode pairs, or even all electrode
pairs may be active at one time for different operations. In
practice, it may be preferable for less than all of the electrode
pairs to be active at a given time, so that any interference that
may occur between close-by pixels would be minimized. In one
embodiment, a drive line may be activated, and the pickup lines may
be scanned one or more at a time so that a line of pixels can be
captured along the drive line and pickup lines as they are paired
along a line at the crossover points. Thus, and still referring to
FIG. 6a, the voltage source 616 may remain connected to drive line
606b, and the connection to buffer/amplifier 605 may cycle or scan
over to another pickup line, so that another pixel of information
can be captured from another electrode pair using driveline
606b.
[0115] In the snapshot shown in FIGS. 6a and 6b drive plate 606b
remains excited by AC signal source 616 until an entire column of
pixels is scanned, while unused drive plates (606a,c-n etc.), are
switched to ground for isolation purposes. Likewise, in one
embodiment only one pickup plate is active at a time and some or
substantially all other pickup plates are switched to ground to
minimize crosstalk.
[0116] The scanning process continues beyond the snapshot shown in
FIGS. 6a and 6b, with the next column in sequence being activated,
606c, (although the sequence could be arbitrary), Once the entire
sequence of Pickup Plates 602a-n is scanned, the next driver line
606d would activated, until all, or substantially all of the drive
lines 606a-n have been sequenced. Once all the drive columns have
been activated and the pickup plates scanned for each column, one
will have collected a complete two dimensional array of pixels
equal to the number of driver rows times the number of pickup
columns. For a 500 DPI sensor that would create a 10.times.10 mm
array or 100 mm.sup.2, consisting of 40,000 individual pixels.
Depending on the application, all of the drive lines may be
sequenced, or possibly some or most of them may be sequenced.
[0117] Referring again to FIGS. 6a and 6b, the two conductive
layers Drive layer 606 and Pickup layer 602, are separated by an
electrically insulating layer 604. This insulating layer 604 has
high DC resistance and has a dielectric constant greater than one
to allow the transmission of high frequency electric fields through
it. In one embodiment this layer 602 is created by folding a single
sided flexible printed circuit board back onto itself. In another
embodiment it is created by placing a dielectric layer between two
electrically active layers to form a double sided circuit
board.
[0118] FIG. 7 shows an example of an x-y grid of plate rows and
columns depicted by lumped circuit components that represent the
electric field couplings of the sensor at each drive/pickup
crossover.
[0119] The bottom plates 701a,b,c etc. are driven one at a time by
AC signal source 716 via switch matrix 740a-n. FIG. 7 shows a scan
snapshot where one drive switch 740b in the on condition connecting
the corresponding plate to the signal source. This activates one
entire row 740b with AC signal over the entire length of the plate
that is equal to the sensor width in one dimension. Correspondingly
each column plate 703a,b,c etc. will pickup up AC signal through
insulating layer 704 and coupling capacitors 761a,b,c . . . n. Only
one pickup plate at a time is active being switched into the buffer
amplifier 716. Top Plate 702b is shown as the active plate in FIG.
7, while all or substantially all other pickups are shorted to
ground via switch matrix 730a-n, thus the information from one x-y
pixel is captured.
[0120] A single row remains active only as long as it takes the
entire number of pickup plates/columns to be scanned. Scan time per
pixel will depend on the frequency of operation and the settling
time of the detection electronics, but there is no need to scan
unduly fast as is typical with prior art swipe sensors. On the
other hand prior art swipe sensors must scan at a very high pixel
rate in order not to lose information due to undersampling relative
to the finger speed that can be greater than 20 cm/sec. This
reduction in capture speed relative to a swipe sensor relaxes the
requirements of the analog electronics and greatly reduces the data
rate that a host processor must capture in real time. This not only
reduces system cost but allows operation by a host device with much
less CPU power and memory. This is critical especially for mobile
devices.
[0121] Once an entire row 706b has been scanned by all or
substantially all of its corresponding pickup plates 702a-n, then
the next row in the sequence is activated through switch matrix
740. This process continues until all or substantially all of the
rows and columns are scanned.
[0122] The amount of signal that is coupled into the buffer
amplifier 716 is a function of how much capacitance is formed by
the insulating layer and the finger ridge or valley in close
proximity. The detailed operation of how these electric fields
radiate is shown in FIGS. 6a and b. The total coupling capacitance
is a series combination of the insulating layer capacitance 704
that is fixed for a given thickness, and the variable topological
capacitance of the object being sensed. The variable portion of
this is shown in FIG. 7 as a series of variable capacitors numbered
760a-n, 761a-n, 762a-n etc., forming a two dimensional array.
[0123] FIG. 8 shows an example of an embodiment of the placement
sensor using a differential amplifier 880 to take the signal from
the selected pickup plate (802a-n), and subtract it from the
reference signal of plate 805. The electrical subtraction of these
signals performs several functions: first wide band common mode is
subtracted out; second, subtracting against reference plate 805
provides a relative reference signal equivalent to an ideal ridge
valley; third, common mode carrier signal that couples into both
plates other than through a finger is also subtracted out. First
order carrier cancellation of etch variation in the pickup plates
also occurs when we subtract out carrier that is coupled in by
other means than through fingers placed on the sensor. This is
critical for high volume manufacturing at a low cost.
[0124] Reference plate 805 is intentionally located outside of the
finger contact area of the sensor, separated from pickup plates
802a-n by Gap 885, Gap 885 is much larger that the nominal gap
between the pickup plates that is typically 50 um. In a real world
embodiment plate 805 would be positioned under the plastic of a
bezel to prevent finger contact, placing it at least 500 um apart
from the other pickup plates.
[0125] Each one of the pickup plates 802a-n is scanned sequentially
being switched through pickup switches 830a-n connecting them to
Differential Amplifier 880. During the scanning process of an
entire pickup row, the positive leg of the differential amplifier
remains connected to reference plate 805 to provide the same signal
reference for all of the pickup plates.
[0126] FIG. 9a shows a circuit diagram of an example of a front end
for the placement sensor in a topology that uses a bank of Single
Pole Double Throw Switches or SPDTs to scan the pickup plate rows
and a bank of Single Pole Single Throw switches to multiplex the
pickup plate columns.
[0127] In FIG. 9a we see a snapshot of the analog switches as the
scanning process begins. Only the first SPDT switch 1044a is shown
in the "on" position, which allows pickup plate 902a to conduct its
plate signal into Differential Amplifier 980. The remaining pickup
plates are shorted to ground via switches 944a-944n, preventing any
pickup signal received by them from entering into differential
amplifier 980.
[0128] Each SPDT has a Parasitic Capacitance 945, due to the fact
that real world switches to not give perfect isolation. In fact the
amount of isolation decreases with frequency, typically modeled by
a parallel capacitor across the switch poles. By using a SPDT
switch we can shunt this capacitance to ground when an individual
plate is not active. Since there is a large array of switches equal
to the number of pickup plates, typically 200 for a 500 dpi sensor,
the effective shunt capacitance to ground is multiplied by that
number. So if a given switch has 0.5 picofarads of parasitic
capacitance and there where 200 pickups, that would add up to 100
picofarads of total shunt capacitance.
[0129] In order to prevent this large capacitance from diverting
most of the received signal from the active pickup to ground, it is
desirable in this example to use a compensating circuit. This is
accomplished by using resonating inductor 939, forming a classic
bandpass filter circuit in conjunction with parasitic capacitors
945 (one per switch) and tuning capacitors 934 and 937. A two step
null & peak tuning calibration procedure is used where tuning
capacitor 934 and 937 are individually tuned with inductor 939
using the same drive signal on both the plus and minus inputs to
differential amplifier 980. The two bandpass filters formed with
inductor 1039 and resonating capacitors 934, and 937 respectively,
will be tuned to the same center frequency when there is zero
signal out of differential amplifier 980. Next capacitors 934 and
937 and inductor 939 are tuned together using a differential input
signal with opposite 180 degrees phases on the plus and minus
inputs to the differential amplifier 980. They are incremented in
lock step until the exact drive carrier frequency is reached, this
occurs when the output of differential amplifier 980 is at its
peak, making the center frequency equal to the exact frequency of
the carrier drive signal 916.
[0130] In a systems implementation, a calibration routine would be
performed before each fingerprint scan to minimize drift of this
filter with time and temperature. The resonating inductor 939 needs
to have a Q or Quality Factor of at least 10 to give the filter the
proper bandwidth characteristics necessary to optimize the signal
to noise ratio.
[0131] Alternately, carrier source 916 may be a variable frequency
source, and capicitors (937 and 934) may be fixed values. In this
embodiment, tuning is accomplished by varying the frequency of
source 916) until peak output is obtained from differential
amplifier 980
[0132] FIG. 9b shows an alternate example of a device employing
multiple banks of plates grouped together, each with their own
differential amplifiers.
[0133] Dividing up the large number of parallel pickup plates into
groups each containing a smaller number of plates is an alternate
architecture that would not require the use of a tuned bandpass
filter in the front end because the parasitic switch capacitances
would be greatly reduced. This would have two possible advantages,
first lower cost, and second the ability to have a frequency agile
front end. In this Figure we have a snapshot of the front end where
the first switch 944a of bank 907a is active. All other switch
banks 907a-907n are shown inactive, shorting their respective
plates to ground. Therefore, only voltage or current differential
amplifier 980a has any plate signal conducted into it, voltage or
current differential amplifiers 980b-980n have both their positive
and negative inputs shorted to ground through their respective
switches 945a-n and 945r, preventing any signal from those banks
making a contribution to the overall output.
[0134] Each of the differential amplifiers 980a-980n is summed
through resistors 987a-987n into summing amplifier 985. Only the
differential amplifier 980a in this snapshot has plate signal
routed into it, so it independently produces signal to the input of
summing amplifier 985. This process is repeated sequentially until
all or substantially all of the switch banks 907a-n, and switch
plates 944a-n, 945a-n, etc, of the entire array are fully scanned.
In different embodiments, all or substantially all of the array may
be scanned, or less than the entire array may be scanned in
different applications. In some applications, a lower resolution
may be desired, so all of the array may not need to be scanned. In
other applications, a full image may not be necessary, such as a
navigation application, where limited images may be used to detect
movement of speed, distance and/or direction to use as input for a
pointing device, such as directing a cursor on a display similar to
a computer touch-pad or a mouse.
[0135] By splitting the pickup array up, the capacitive input load
on each plate is reduced from that of the full array of switches to
the number of switches within a given plate group. If we were to
divide for example 196 potential pickup plates into 14 banks of 14
plates, resulting in a capacitance load equal to the parasitic
capacitance of 14 switches (944), plus the capacitive load of the
differential amplifier. If analog switches 944 are constructed with
very low parasitic capacitance then the overall input load would be
small enough not to need a bandpass circuit in the front end in
order to resonate out the load capacitance. As integrated circuit
fabrication techniques improve we would be able design smaller
switches with less parasitic capacitance, making this approach
become more attractive.
[0136] FIG. 9c illustrates another example of a front end circuit
using individual plate buffers that are multiplexed into a second
stage differential amplifier.
[0137] Buffers 982a through 982n as illustrated are special buffers
that are designed to have very low input capacitance. In one
embodiment, these buffers could be configured as single stage
cascoded amplifiers in order to minimize drain-to-gate Miller
capacitance and die area. To better maximize plate to plate
isolation, two sets of switches could be used for each input.
Analog switches 930a-930n are included in this example to multiplex
each selected buffer into differential amplifier 980. Switches 932
are included to shut down the power simultaneously to all the other
input buffers that are not selected. This effectively puts them at
ground potential. An alternate embodiment would be to put input
analog switches in front of each amplifier to allow a short of the
unused plates directly to ground. One effect of this approach may
be an increase in input load capacitance for each plate.
[0138] FIG. 9c shows a snapshot of the scanning process where top
plate 902a is being sensed though buffer 982a that has power
supplied to it through switch 932a. Analog switch 930a is closed,
routing it to differential amplifier 980. All other buffer outputs
are disconnected from the differential amplifier 980 via analog
switches 930b-n and power switches 982b-n
[0139] The positive input to differential amplifier 980 is always
connected to the reference plate 902r, providing an "air" signal
reference to the amp. The differential amplifier 980 serves to
subtract out noise and common mode carrier signal in addition to
providing a "air" reference carrier value.
[0140] FIG. 10 shows a particular embodiment of a placement sensor
implemented with traditional analog receiver technology. The analog
front end begins with Differential Amplifier 1080 where selected
Pickup Plate 1002a-n is subtracted from Reference Plate 1005, which
is located outside the finger contact area providing a reference
signal equivalent to an ideal finger valley. A programmable gain
stage or PGA 1090 follows the Differential Amplifier 1090, but
could be integrated into the same block providing both gain an
subtraction in a single stage. PGA 1090 is designed to have a gain
range wide enough to compensate for production variations in plate
etching and solder mask thickness between the layers.
[0141] Control processor 1030 orchestrates the scanning of the two
dimensional sensor plate array. Drive plates/columns 1002a-1002n
are scanned sequentially by the Drive Plate Scanning Logic 1040 in
the Control Processor 1030. When a selected drive plate is
activated it is connected to carrier signal source 1016. All
inactive drive plates are connected to ground. Before activating
the next drive plate in the sequence the active drive plate remains
on long enough for the entire row of Pickup Plates 1002a-n to be
scanned by Pickup Plate Logic 1045.
[0142] Analog mixer 1074 multiplies the gained up plate signal
against the reference carrier 1013. The result is a classic
spectrum of base band plus harmonic products at multiples of the
carrier frequency. An analog low pass filter 1025 is employed to
filter out the unwanted harmonics and must have a sharp enough roll
of to attenuate the information associated with of the second
harmonic without losing base band information.
[0143] Following the low pass filter is an A/D Converter 1074 that
must sample at a least twice the pixel rate to satisfy the Nyquist
criteria. Memory buffer 1032 stores the A/D samples locally with
sufficient size to keep up with the worst case latency of the host
controller. The A/D Sample Control Line 1078 provides a sample
clock for the converter to acquire the sequential pixel information
that is created by the sequencing of the plate rows and
columns.
[0144] FIG. 11 shows an example of one embodiment of a placement
sensor implemented with direct digital conversion receiver
technology. In this example, the analog front end begins with
Differential Amplifier 1180 where selected Pickup Plate 1102a-n is
subtracted from Reference Plate 1105, which is located outside the
finger contact area providing a reference signal equivalent to an
ideal finger valley. The electrical subtraction of these signals
performs several functions: first wide band common mode is
subtracted out; second, subtracting against reference plate 1105
provides a relative reference signal equivalent to an ideal ridge
valley; third, common mode carrier signal that couples into both
plates other than through a finger is also subtracted out.
Elimination of common mode is particularly important in high RF
noise environments. First order carrier cancellation of etch
variation in the pickup plates also occurs when we subtract out
carrier that is coupled in by other means than through fingers
placed on the sensor. This is critical for high volume
manufacturing at a low cost.
[0145] A programmable gain stage or PGA 1190 follows the
Differential Amplifier, which could easily be combined into a
single differential amplifier including programmable gain as is
commonly done in modern integrated circuit design PGA 1190 is
designed to have a gain range wide enough to compensate for
production variations in plate etching and solder mask thickness
between the layers.
[0146] Control processor 1130 orchestrates the scanning of the two
dimensional sensor plate array. Drive plates/columns 1102a-1102n
are scanned sequentially by the Drive Plate Scanning Logic 1140 in
the Control Processor 1130. When a selected drive plate is
activated it is connected to carrier signal source 1116. All
inactive drive plates are connected to ground. Before activating
the next drive plate in the sequence the active drive plate remains
on long enough for the entire row of Pickup Plates 1102a-n to be
scanned by Pickup Plate Logic 1145 and captured by the A/D
converter 1125.
[0147] The A/D Converter 1125 is sampled at a rate of at least
twice the carrier frequency to satisfy the Nyquist criteria. The
A/D Sample Control Line 1107 provides a sample clock for the
converter to acquire the sequential pixel information that is
created by the sequencing of the plate rows and columns.
[0148] Following the A/D converter is a Digital Mixer 1118 that
digitally multiplies the A/D output that is at the carrier
frequency against the reference carrier generated by the Digitally
Controlled Oscillator 1110. The result is that the signal is down
converted to the base band with the carrier removed. There are
other unwanted spectral components created by this process, namely
a double time carrier side band, but these can easily be filtered
out.
[0149] A combination decimator and digital filter 1120 follows the
Digital Mixer 1118. This block performs sampling down conversion,
reducing the sample rate from at least twice the carrier frequency
to at least twice the pixel rate that is much lower. The digital
filter would typically include a Cascaded Integrator Comb, or CIC
filter, which removes the unwanted spectral byproducts of mixing as
well as improving the receiver signal to noise. A CIC filter
provides a highly efficient way to create a narrow passband filter
after mixing the signal down to baseband with the digital mixer.
The CIC filter may be followed by a FIR filter running at the
slower decimated rate to correct passband droop.
[0150] With a reduction of sample rate in the order of 100:1 a
relatively small Control Processor Buffer (1132) could be used to
capture and entire fingerprint. For example a 200.times.200 array
producing 40 k pixels could be stored in a 40 kb buffer. This is in
contrast to a swipe sensor that must scan the partial image frames
at a rate fast enough to keep up with the fastest allowable swipe
speed, usually around 200 ms. At the same time, a slow swipe of two
seconds must also be accommodated, requiring ten times the amount
of memory as the fastest one. Various techniques have been
developed to throw away redundant sample lines before storage, but
even with that the real time storage requirements are much greater
for swipe sensors. This is a critical factor in Match on Chip
applications where memory capacity is limited. In addition, a
placement sensor has no real-time data acquisition or processing
requirements on the host processor beyond the patience of the user
for holding their finger in place.
[0151] Referring to FIG. 12A, and example of a sensor layout 1200
configured according to one embodiment is illustrated in a
configuration that is known in the semiconductor industry as a Chip
on Flex (CoF). Chip on Flex is a configuration where a processor
chip is attached to a flexible substrate, such as Kapton.TM. tape,
and that is electrically connected to conductive lines and possibly
other components located on the flexible substrate. In this
example, the sensor layout 1200 is shown within the borders of
Kapton tape having pitch rails 1202, 1204 with slots 1206 located
along both rails. These slots are used in the manufacturing process
to feed the tape through the process while lines and possibly
components are formed on the tape. The pitch of a device refers to
the length of Kapton tape required to form a device on the CoF. The
distance "d" 1208, measured here between slots 1207 and 1209, is
substantially constant throughout each rail, and the pitch is a
shorthand method of determining the length of flex that a device
covers. For the device shown in this example, the pitch 1212 shows
a span between slot 1207 and 1214 of eight slots, and thus would be
characterized as an 8-pitch device. The example sensor device
shown, which may be a fingerprint sensor or other type of
placement, 2D or area sensor, illustrates an integrated circuit
1210, which may be a logic circuit formed on a silicon substrate, a
microprocessor, or other circuit for processing pixel information
captured from a sensor circuit. The example may also be formed or
otherwise manufactured on a substrate other than flexible substrate
or Kapton tape, in fact it may be formed on a silicon substrate,
rigid board, or other substrate configured for various
applications.
[0152] If configured as a fingerprint sensor or other placement
sensor, integrated circuit 1210 may be a mixed signal chip that
enables all or some of the functions described in FIG. 16 below. In
one embodiment, it has enough inputs and outputs to drive a 200 by
200 line array of drive and pickup lines, and may have more or less
of either lines. The top layer 1220 is formed by an array of pickup
lines connected directly to integrated circuit 1210. This may be a
flip chip mounted directly to the flex substrate without bond
wires. In this example, the bottom layer is formed by folding the
single layer back onto itself along the folding axis 1230 to create
double layer active sensor area 1255. The drive lines fold to
create the bottom layer 1225. The drive lines in this example are
split into left and right groups 1240 and 1242 respectively for the
sake of layout balance, but could be all on the left or right side
of the sensing area. The left drive plate bundles 1240, and right
drive plate bundles 1242 are inter-digitated with alternating left
and right feeds to form a continuous line array on bottom layer
1225.
[0153] Flexible substrate based connector 1235 routes power, ground
and interface signals out to an external host or onto another
substrate that contains system level components, such as those
illustrated in FIG. 16 and described below. These components may
include but are not limited to a processor with memory, logic
enabling imbedded matching algorithm(s) and encrypting/decrypting
functions. In an alternative example, connector 1235 may be
attached to the host substrate using conductive adhesive otherwise
known as anisotropic conductive film (ACF attach), which may be
labeled as "high density" in some products.
[0154] Referring to FIG. 12B, another example of a sensor 1250 is
shown having a different orientation and configuration on a
substrate. Similar to the above example, the sensor 1250 is a
placement sensor, and is configured to be folded onto itself along
the folding axis 1251 to create two layers, the bottom layer 1252
with drive lines 1256, and top layer 1254, with pickup lines 1257,
integrated circuit 1258, flex external connections 1262, and
processor connections 1260 that may be used to connect the
integrated circuit to external devices, such as for manufacturing
testing for example. This configuration, however, has a much
smaller pitch, again where the distance "d" is the distance between
each pair of slots 1206, and the pitch in this example is between
slots 1270 and 1272, making this device a 5-pitch device. This
example device takes up 5 pitches of Kapton tape compared to the
other example device 1200 (FIG. 12A) taking up 8 pitches of Kapton
tape. This device performs substantially the same function as that
of example 1200, FIG. 12A, yet takes up less Kapton tape, saving in
material costs. The device may take up even less pitches of tape if
the size of the resulting sensor surface were reduced, allowing the
space needed to accommodate the pickup lines, drive lines, and
other components to be reduced. In this example, the effective
sensor surface may be ten square millimeters, and could be reduced
to nine or even eight millimeters, and the structures could be
reduced accordingly to reduce the overall area of the device,
likewise reducing the area of substrate required to accommodate the
overall device.
[0155] As will be appreciated by those skilled in the art, given
these examples, different designs may be accomplished to optimize
different aspects of the invention, including size is the substrate
used for a device, and both the size and pixel density of the
sensing area. The invention, however, is not limited to a
particular optimization done by others, and indeed the invention
should inspire others to improve upon the design using well known
and alternative processes, materials, and know-how available to
them. The scope of the invention is only limited by claims that are
either appended or submitted for examination in the future, and not
by information that is extemporaneous to this specification.
[0156] Referring to FIG. 13a, an illustration of a flex layout
structure 1300 is illustrated. As shown, the flex layer structure
1300 includes an imaging area 1350, in which drive lines form
crossover locations with pickup lines, where the crossover
locations are formed by folding the top layer 1370 over bottom
layer 1372, folding the flexible substrate upon itself about flex
bend radius 1374. From a side view, the top flex 1364 is layered
over top soldermask 1362, which is layered upon top copper or
pickup lines 1360. Bottom layer solder mask 1370 is folded under
top copper 1360, and bottom copper 1372 is formed under solder mask
1370 and over bottom flex 1375.
[0157] Referring to FIG. 13b, an example of a module structure 1301
is shown for mounting the flex layer structure 1300 of FIG. 13a.
Those skilled in the art will understand that the structure of a
particular module may vary according to the embodiment, and that
this example, though it shows a substantially complete example of a
module that can be used to base a practical implementation, is but
one example and is not intended and should not be considered as
limiting the embodiment in any way. The example structure 1301
includes rigid substrate 1330 that receives the flex top layer 1370
on its top layer with flex locating pins or plastic frame 1337
configured to ensure alignment of the drive plates with the pickup
plates. Because the sensing electrode pairs are formed by
crossovers of the drive and pickup lines on the two layers, the x-y
alignment tolerance requirements may be on the order of several
pixels, rather than the sub-pixel alignment tolerances that would
be required if there were features to be matched between the two
layers. The four mounting holes (1337) on each layer are sufficient
to ensure angular and x-y alignment. Also illustrated is driver
chip 1310 and imaging area 1350.
[0158] Referring to FIG. 14, an illustration is provided of an
example system 1400 incorporating a sensor system 1402 generally
configured according to the embodiment. A sensor device may be
incorporated into a system, or may be configured as a stand-alone
product. As a stand-alone product, the sensor components may be
encased in a housing (not shown), and electrical connections
exposed for connection to a device or system that would utilize
such a device. Those skilled in the art will immediately see how a
sensor configured according to the embodiment as described herein
can be incorporated into a housing such as those that widely used
in different industry sectors. Thus, for example, in a system, the
mechanical connections, designs and structures may necessarily vary
according to a particular application. For example, if incorporated
into a laptop for use as a fingerprint sensor, a surface mounting
module would need to be employed to expose the sensor grid lines to
a user. If incorporated into a mobile phone, personal data
assistant (PDA) or the like, another type of mounting module would
be needed to conform to the particular device design while
providing the operational capability of the sensor. Again, FIG. 14
illustrates a diagrammatic representation of a system 1400 that
incorporates a sensor 1402 configured according to the embodiment
with the folded flexible or rigid substrate 1404 having a top layer
1406 and a bottom layer 1408, and each having either pickup lines
or plates and drive lines or plates respectively depending on the
application, though not shown here. The two-dimensional sensing
area 1411 is shown with an object 1410 on top, which may be a
finger in the case of a fingerprint sensor, or another object in
another application. The top layer's pickup plates or lines (not
shown) communicate with top plate processing circuitry 1410 via
communication link 1412 to send resultant signals received. Drive
lines or plates are located but not shown here on bottom layer
1408, and receive drive signals from bottom plate processing
circuitry 1414 via communication line 1416. The top plate
processing circuitry 1410 includes front end buffers and amplifiers
1416 configured to receive, amplify and/or buffer or store a
resultant signal received from the pickup plates or lines. A switch
array 1418 such as that illustrated in FIG. 9 is configured to
receive the signal from the front end 1416 and send the switched
signal to analog to digital (A/D) converter 1420 for conversion to
a digital signal. Digital signal processor (DSP) 1422 is configured
to receive the digital signal from A/D converter 1420 and process
the signal for transmission.
[0159] Bottom plate processing circuitry 1414 is configured to
produce a drive signal for use by drive plates or lines located on
the bottom layer 1408 of the sensor substrate 1404, and includes
drivers and scanning logic 1424 for producing the signal, and
programmable frequency generate 1426 for programmable setting the
frequency in which the drive signal is set. The bottom plate
processing circuitry 1414 includes communication link 1428,
likewise, top plate circuitry has communication link 1420 for
communicating with system buss 1432 for sending and receiving
communications among the system, such as to processors, memory
modules, and other components. System buss 1432 communicates with
persistent memory 1434 via communication link 1436 for storing
algorithms 1428, application software 1440, templates 1442, and
other code for persistent and frequent use by processor 1444.
Processor 1444 includes processor logic having logic and other
circuitry for processing signals received from the system buss and
originating from the sensor 1402, and also includes arithmetic
logic unit 1450 configured with logical circuits for performing
basic and complex arithmetic operations in conjunction with the
processor. Processor memory 1452 is configured for local storage
for the processor 1444, for example for storing results of
calculations and retrieval for further calculations.
[0160] In operation, drive signals are controlled by processor
1444, and parameters for the drive signals originating from bottom
plate processing circuitry 1414 are set in the bottom plate
processing circuitry 1414 by the processor 1444. Drive signals are
generated by logic 1424 within the parameters set in generator 1426
and sent to bottom plate 1408 via communication link 1416. These
signals generate electromagnetic fields that extend to pickup lines
on top layer 1406 about the sensing area 1411. These signals are
cycled through different pixel electrode pairs on the sensor grid
(not shown here, but described above), and some of these
electromagnetic fields are absorbed by the object 1410 (such as a
fingerprint for example). The resultant signal is picked up by the
pickup plates or lines located on top layer 1406 about the sensing
area (not shown here, but described above). The resultant signal is
then transmitted to top plate processing circuitry 1410 via
communication line 1412, and the signal is processed and
transmitted to storage or processor 1444 for further processing.
Once the drivers and scanning logic have cycled through the pixels
on the grid sensor, data related to features and characteristics of
the object can be defined and utilized by the system. For example,
in a fingerprint sensor system, the image may be a fingerprint
image that can be compared to a stored fingerprint image, and, if
there is a match, it can be used to validate a user.
[0161] FIG. 15 Illustrates how a device configured according to the
embodiment may be applied to a fingerprint sensing application. A
user places a finger with fingerprint (1510) over the sensor grid,
which is formed by the crossover locations of the drive plates
(1506a-1506n) and the pickup plates (1502a-1502m). Image pixel
1561a senses the fingerprint area above the electrode pair of drive
plate 1506a and pickup plate 1502a, pixel 1561a senses the
crossover of drive 1506n and pickup 1502a, and pixel 1562n senses
the area above the crossover of drive 1506n and pickup 1502m
[0162] FIG. 16 illustrates the steps required to collect the
fingerprint image as shown in FIG. 15, using the embodiment shown
in FIGS. 11 and 14. Image capture begins at step 1601. As part of
the initialization a row counter is initialized to 1 at step 1602.
Step 1603 is the beginning of a row scan sequence. At the beginning
of each row, a column counter is set to 1 at step 1603. In step
1604, the top plate scanning logic 1145 activates the appropriate
analog switch (one of 1103a through 1103n) for the selected row. In
Step 1605 the sense of an individual pixel begins when the bottom
plate scanning logic 1140 activates the appropriate drive plate
(one of 1106a through 1106n) with the carrier signal 1116. At step
1606 the signal from differential amplifier 1180 is sampled
repeatedly by A/D converter 1125 after processing through
programmable gain amplifier 1190. Digital mixer 1118 mixes the
samples down to the baseband frequency set by digital oscillator
1110. The baseband signal is then filtered by digital decimating
filter 1120 to produce a signal level value for the current pixel.
The functions performed for this step in the embodiment of FIG. 11
could alternatively be performed by the corresponding analog
receiver shown in FIG. 10, or other functionally similar
arrangements. In step 1607 the signal level value derived in step
1606 is stored in the appropriate position in memory buffer 1132
that corresponds to the currently selected row and column. In step
1608 the column number is incremented, and in step 1609 the column
number is tested to determine whether the current row collection
has been completed. If the row has not been completed, we return to
step 1605 to collect the next pixel in the row. If the row is
complete, we proceed to step 1610 and increment the row number. In
step 1611, we test the row number to determine if all the rows have
been scanned. If not, flow returns to 1603 to start the next row
back at the first column. Once all the rows have been scanned,
image capture is complete, and we proceed to step 1612, at which
point the image is ready for further processing or transfer to long
term storage.
[0163] Those skilled in the art will recognize that row and column
scanning order may not correspond directly to physical position in
the array, as some implementations may more optimally be sampled in
interleaved fashions.
[0164] In FIG. 17, an example of the example as shown in FIG. 14 in
a user authentication application. In step 1701a system level
application 1440 on processor 1444 requires user authentication. At
step 1702 the user is prompted to provide a finger for
verification. The system waits for finger presence to be detected
in step 1703. This can be performed by collecting a reduced size
image as described in FIG. 16 and testing for finger image, or via
other dedicated hardware. Once finger presence is detected, a
complete image is collected in step 1704, using the method
described in FIG. 16 or other substantially similar method. This
image is then stored and in step 1705 converted into a template
1712 as shown in FIG. 17B, typically consisting of a map of minutia
point locations and types (such as bifurcations 1710, and
terminations 1711), or possibly of ridge frequency and orientation,
or some combination of both. In step 1707 the template is then
compared against one or more enrollment templates that were
retrieved from persistent template storage 1142 in step 1706. If a
match is found, the user is authenticated in step 1708 and granted
access to the application. If no match is found, the user is
rejected in step 1709, and access is denied.
[0165] In an authentication system such as described by FIGS. 16
and 17A-B, there can be a tradeoff between security and operational
speed. A device such as a smartphone may have differing security
and convenience (speed) requirements for differing operating modes,
as well. These tradeoffs may be governed by the value of security
for different types of information. As an example, users may place
a low value on security for simply powering up their smartphone or
other device. But, they may place a much higher value on performing
a financial transaction or other sensitive transfer. They may want
to lock out the ability to access personal contact information or
customer lists, or may also want to lock out the ability for others
to make local calls, long distance calls, access personal photos,
access social networking websites, sent and receive text messages
or emails, and they may want to have different security protocols
for the access to different information. Users having conventional
systems without the benefit of biometrics will typically lock their
telephone handset with a four-digit PIN, which is a fairly low
level of security. Securing a financial transaction over the same
device, a new development that is desired in the industry, would
cause a user to desire a much higher level of security. Conversely,
the amount of time a user would find acceptable to unlock the phone
for a simple call would be much shorter than the time they would
wait to secure a high value transaction, where a user may be more
tolerant of a higher time demand for authenticating the user for a
financial transaction.
[0166] Embodiments described herein facilitate supporting both of
these requirements by providing variable captured image resolution
and matching algorithm security level. In one example, when
operating in high security mode (such as when enrolling a user or
validating a high-value transaction) the image capture procedure
described in FIG. 16 and the match procedure described in FIG.
17A-B may operate in full resolution mode. When operating in
`convenience` mode (such as unlocking the phone, looking at photos,
surfing the internet or switching users), the fingerprint image may
be acquired in a half-resolution mode by skipping every other
column and every other row--for example where steps 1608 and 1610
would increment the Column and Row counters, respectively, by two
instead of one. This may result in an image with half the
resolution in each axis compared to the high security mode, and
one-fourth the size. This could cut by a factor of four both the
time required to acquire the image (FIG. 16) and the time required
to extract the template from the image (step 1705). Due to the
reduced resolution of the image, and the relaxed security
requirements for this convenience mode, the matching threshold
applied in step 1707 may be accordingly reduced.
[0167] Referring to FIGS. 18A-D, another embodiment of a sensor
module or assembly is illustrated as a sensor 1800, first shown in
an expanded view in FIG. 18A, made up of a folded flex sensor 1802,
a module folding base 1804 and mounting board 1806. In this
embodiment, a switch having a plunger 1812 and base 1813 is
incorporated into a sensor assembly that allows the integration of
the sensor operations, such as fingerprint sensor operations,
together with other operations of a device. Still further, this
assembly allows for the configuration of a personalization switch
for use on a device, such as a mobile telephone or smart phone for
example, that has extended functions including biometric
operations. If used together with a power or selector switch, such
as for example a modular replacement for the main selection switch
on an iPhone.TM. manufactured by Apple Computer Corporation or a
navigation selection switch used on a BlackBerry.TM. smartphone
manufactured by Research in Motion (RIM.TM.) next to the display
screen of these devices, a fingerprint sensor can be used for
authentication while using these personal devices. The
authentication can be used to access the device entirely, access
different levels of information such as different information that
a user wishes to protect, or could be used for authentication of
the user for financial transactions that require a higher level of
security. These settings may be preset by the manufacturer, may be
reset by the user, may be set by a financial institution associated
with the user or the device, or may be configurable by anyone with
an interest in protecting the information.
[0168] Still referring to FIG. 18A, the folded flex sensor 1802 may
be folded at 1805 and 1807 respectively to fit about the module
folding base 1804 at mounting locations loop brace 1805-A and
folding edge 1807-A respectively, along with placement holes 1808
to aid in placing the flex about the module and holding it in
place. If the embodiments of the flex sensor circuit formed or
otherwise configure on a substrate according to the examples of
FIG. 12A or 12B, different mounting operations may be required to
accommodate these or other designs that requires a different
folding or forming of the substrate. The sensor 1802 may include
processor 1810 as described in similar embodiments above. Mounting
board 1806 includes a switch 1813 mounted about switch opening 1811
to accommodate plunger 1812, and may also have a processor opening
1814 configured to accommodate processor 1810.
[0169] Referring to FIG. 18B, another expanded view of the sensor
of FIG. 18A is shown from another angle, where one side of the flex
sensor 1802 shows more clearly the openings 1808 and processor
1810, where the openings 1808 are configured to receive placement
or mounting pegs 1816 for holding the sensor 1802 substrate in
place and then received by mounting openings 1818. The placement or
mounting pegs 1820 are received by mounting openings 1822. Switch
base opening 1824 is configured to receive switch base 1813. In
another embodiment, the opening for the plunger 1812 and the base
1813 may be a single sized opening that will accept the entire
switch, or the switch may have base with the same diameter as the
plunger so that a single cylindrical or rectangular or other shaped
opening may be sufficient to accommodate the switch.
[0170] FIG. 18C shows a side cut away view of the assembled sensor
assembly with the sensor substrate 1802 mounted on module folding
base 1804 and mounted on base 1806, and with the openings 1811 and
1824 accommodating the switch plunger 1812 and switch base 1813
respectively. FIG. 18D shows a close-up view of the side view of
FIG. 18C.
[0171] FIGS. 19A-J show an alternative sensor/switch assembly where
a dome switch is used for the underlying switch that is integrated
in the assembly. Referring to FIG. 19A, the assembly 1900 includes
a dome switch 1912 integrated with module folding base 1904 mounted
on mounting board 1906. In this embodiment, a switch having a domed
shaped plunger 1912 and base 1913 (FIG. 19C) is incorporated into a
sensor assembly that allows the integration of the sensor
operations, such as fingerprint sensor operations, together with
other operations of a device.
[0172] Referring to FIGS. 19A, B and C, the folded flex sensor 1902
may be folded at 1905 and 1907 respectively to fit about the module
folding base 1904 at mounting locations loop brace 1905-A and
folding edge 1907-A respectively, along with placement holes 1908
(FIG. 19D) to aid in placing the flex about the module and holding
it in place. If the embodiments of the flex sensor circuit formed
or otherwise configure on a substrate according to the examples of
FIG. 12A or 12B, different mounting operations may be required to
accommodate these or other designs that requires a different
folding or forming of the substrate. The sensor 1902 may include
processor 1910 as described in similar embodiments above. Mounting
board 1906 includes a switch 1913 mounted below plunger 1912, and
may also have a processor opening 1914 configured to accommodate
processor 1910 (FIG. 19D).
[0173] Referring to FIGS. 19G, H and I, side views of the sensor is
shown, showing the flex sensor 1902 and the openings 1908 and
processor 1910, where the openings 1908 are configured to receive
placement or mounting pegs 1916 for holding the sensor 1902
substrate in place and then received by mounting openings 1918. The
placement or mounting pegs 1920 are received by mounting openings
1922. Switch base opening 1924 is configured to receive switch base
1913. In another embodiment, the opening for the plunger 1912 and
the base 1913 may be a single sized opening that will accept the
entire switch, or the switch may have base with the same diameter
as the plunger so that a single cylindrical or rectangular or other
shaped opening may be sufficient to accommodate the switch.
[0174] FIGS. 19E,F, and J show a normal, cutaway, and expanded cut
away views of the sensor assembly mounted in a device such as a
smartphone, with the sensor substrate 1902 mounted on module
folding base 1904 and mounted on base 1906, and with the openings
1911 and 1924 accommodating the switch dome plunger 1912 and switch
base 1913 respectively. The sensor area 1901 is accessed by a bezel
opening 1909 which is incorporated into the finished case 1925 of
the device. When the user places a finger on sensor surface 1901
they will simultaneously depress switch plunger 1912.
[0175] FIG. 20 illustrates a perspective view of one embodiment of
an embedded switch 2000 that can provide a means to electronically
connect a top conductive layer 2002 through insulating layer 2004
to conductive layer 2006 upon the touch of a user on the surface of
the sensor, not shown here, but it may be a layer above conductor
2002. The three layers may be embedded within a fingerprint sensor
as described above, allowing for a switch located within the
double-layered fingerprint sensor, so that a user can activate a
function upon touch, such as power, select, initiate, enter, or
other switch functions in a device. The three layers may be placed
on a surface 2006 of module 2008, where the module is located on
the surface 2010 of a substrate 2012.
[0176] FIGS. 21A and 21B FIG. 21A shows an embodiment where a
switch is formed on the same substrate as the sensor. The figures
show the folded flex stack-up consisting of flex substrates 2102
and 2103, typically but not limited to Kapton.COPYRGT., metalized
layers 2104 and 2105 are typically etched or formed copper traces
and insulating layers 2106 and 2107 are typically solder mask.
Insulating layers 2106 and 2107 have a cutout section 2110 out
exposing the conductive layers 2104 and 2105. When no vertical
pressure is applied over the gap 2110 conductive layers 2104 and
2105 are not electrically in contact with each other and are in the
off position.
[0177] FIG. 21B shows the flex top layer 2103 and conductive layer
2112 mechanically depressed by a contacting object such as a
finger. Top conductive layer 2107 can be pushed physically into
electrical contact with conductive layer 2106 at pressure focal
point 2112. This forms an embedded flex switch, which is shown in
the on position.
[0178] FIGS. 22A-26C illustrate alternative embodiments and further
examples. These examples may be configured using different
materials and structures, and they may further be oriented or
integrated in different structures such as power buttons in mobile
devices, stationary devices, computers, laptops, access devices
(doorknobs, entryways, or the like). Note that in these figures and
the number of plates is greatly reduced to simplify the drawings,
and the size of individual drive and pickup plates are increased
for simplicity as well. In practice, both drive and pickup plates
may be formed at fixed or variable pitch, and unlike the drawings,
the spacing between plates may be greater or less than the
individual plate size.
[0179] FIG. 22 depicts an embodiment where the drive and detection
electronics are implemented on separate silicon components. This
configuration minimizes interconnect between layers by directly
mounting the drive die on the substrate layer for the drive lines,
and directly mounting the pickup die on the substrate for the
pickup plates. The rigid substrate for the drive plates also serves
as a common base layer which provides interconnect for
synchronizing signals between the two subsystems, as well as power
and communications to the host device.
[0180] In this particular example, the common substrate (2201) is a
two layer rigid circuit board, which also provides a mechanical
base for the sensor. The drive circuitry is implemented in
integrated circuit die (2204) which is mounted on rigid drive
substrate (2201). The die is connected to the circuit on the rigid
substrate by a number of bonding pads (2206) using standard
flip-chip mounting processes. A large number of drive lines
(typically more than 100) are connected to the drive plates (2209),
which are formed on the top side of the rigid substrate.
[0181] A dielectric layer (2208) separates drive plates (2209) from
pickup plates (2210). In this instance dielectric layer (2208) is
provided by a solder mask layer applied to the drive plates (2209)
and rigid substrate (2201).
[0182] Pickup substrate assembly (2202) with pre-attached pickup
circuit die (2205) is mounted on top of drive substrate (2201). The
die is connected to the circuit on the flexible substrate by a
number of bonding pads (2216) using standard flip-chip mounting
processes. Because substrate (2202) is flexible, attach pads (2211)
can mate with their corresponding pads (2212) on base substrate
(2201). A cutout (2203) is provided in base substrate (2201) to
accommodate pickup chip (2205) so the assembly lies flat. Attach
pads (2211) provide interconnect to the mating pads (2212) on the
substrate layer (2201).
[0183] Interconnect traces (2214) formed on the top layer of base
substrate (2201) provide synchronizing signals between the
integrated circuits (2204) and (2205).
[0184] Interconnect traces (2215) in the base substrate (2201)
route signals to interconnect pads (2213) for power, ground, and
communications interconnect to the host system.
[0185] FIGS. 23a-f illustrates an example of an assembly stackup of
the two-chip. FIG. 23a shows the rigid base (2201) with the drive
plates (2209), host interconnect traces (2215) and contact pads
(2213), pickup communications traces (2214) and contact pads
(2212). Cutout (2203) is mad in base (2201) to accommodate the
pickup IC which will be attached in a subsequent step.
[0186] Rigid base (2201) could be fabricated from standard circuit
board materials, such as FR4, in which case plates (2209),
interconnect (2213 and 2214) and pads (2213 and 2212) would
typically be formed from copper by use of circuit board etching
techniques. Rigid base (2201) could also be formed from glass, in
which case plates (2209), interconnect traces (2213 and 2214), and
pads (2212 and 2213) would typically be formed from a transparent
conductive material such as Indium-Tin Oxide (ITO).
[0187] FIG. 23b shows drive electronics die (2204) attached to the
traces on the assembly from FIG. 23a. The die is shown attached to
the traces via standard flip-chip mounting processes.
[0188] FIG. 23c shows the exemplary assembly after the addition of
dielectric layer 2208. This dielectric layer may be formed by a
standard soldermask process, such as LPI, or by applying a piece of
dielectric such as Kapton film.
[0189] FIG. 23d shows a cutaway view of the exemplary flexible
substrate (2202) with pickup plates (2210) and pickup
communications pads (2211) formed on it. Flexible substrate (2202)
may be formed from a Kapton film, in which case the plates (2210),
traces, and pads (2211) would likely be formed of copper by
standard etching techniques. Flexible substrate (2202) could also
be made of a transparent material, such as polyester, with plates,
traces, and pads formed from by depositing a film of a transparent
conductive material such as ITO.
[0190] FIG. 23e shows the cutaway view of the exemplary flexible
substrate with the addition of pickup electronics die (2205).
Electrical connections between the die and elements on the flex are
made by bonding interconnect bumps (2216) on the die to contacts
(2217) on the flex assembly, as shown in FIG. 22e. Interconnect
bumps (2216) are typically made of gold, while contacts (2217) are
features formed of the same material as the plates and traces.
[0191] FIG. 23f shows a cutaway view of the exemplary completed
assembly, as the flex assembly is mounted onto the rigid assembly.
Electrical connection between the two sub-assemblies is made by
mating flex assembly pads (2211) to rigid assembly pads (2212).
[0192] FIG. 24 shows an example of steps required to assemble the
exemplary embodiment shown in FIGS. 22 and 23. In Step 2401 traces
2214 and 2215, host contact pads 2213, layer interconnect pads
2212, and drive plates 2209 are all formed by an etching process on
substrate 2201. A number of instances of the substrate assemblies
may be formed at the same time by repeating the pattern across a
large panel of base material. In Step 2402 cutout 2203 is formed in
substrate 2203 by a standard circuit board routing process. This
may take place at the same time that the multiple instances of
substrate 2201 are separated by cutting out the substrate outline
from the common panel. In Step 2403 dielectric layer 2208 is
created by applying a layer of material such as LPI solder mask to
substrate 2201 and drive plates 2209. In Step 2404 pickup plates
2210, interconnect pads 2211, and bonding pads 2217 are formed on
substrate 2202 by an etching process. In Step 2405, drive
electronics die 2204 is mounted onto the substrate assembly 2201
using a standard chip-on-board flip-chip bonding process. In Step
2406, pickup electronics die 2205 is mounted onto substrate
assembly 2202 using standard flip-clip chip-on-flex bonding
process. In Step 2407, flex substrate assembly 2202 is mounted onto
base substrate assembly 2201. In Step 2408 pads 2211 and 2212 are
electrically connected using an anisotropic conducting film (ACF)
attach process.
[0193] FIG. 25 shows an embodiment where the drive and detection
electronics are implemented on separate structures, such as
separate silicon components for example. This configuration
minimizes interconnect between layers by directly mounting the
drive die on the substrate layer for the drive lines, and directly
mounting the pickup die on the substrate for the pickup plates. The
drive and pickup layers may be both connected to a common base
layer which provides interconnect for synchronizing signals between
the two subsystems, as well as power and communications to the host
device. In this particular example, the common substrate (2500) may
be a two layer rigid circuit board, which may also provide a
mechanical base for the sensor. The drive circuitry may be
implemented in integrated circuit die (2504) that is mounted on
flexible drive substrate (2501). The die may be connected to the
circuit on the flexible substrate by a number of bonding pads
(2506) using standard flip-chip mounting processes or other
mounting processes known in the art. A large number of drive lines
(possibly 100 or more) may be connected to the drive plates (2509),
which may or may not be formed on the same flexible substrate.
Attach pads (2511) can provide interconnect to the mating pads
(2512) on the substrate layer (2500). Substrate (2500) may
incorporate a cutout (2513). In one example, the cutout may be
configured so that when the drive substrate (2501) is attached
drive electronics chip (2504) will not contact substrate (2501),
and the assembly lies flat or planar. In another embodiment, a
surface may not be entirely planar or even molded over an object
such as a power button, the different layers my have a cutout to
accommodate different structures such as the drive electronics.
Pickup substrate assembly (2502) with pre-attached pickup circuit
die (2505) may be mounted on top of both drive substrate (2501) and
base substrate (2500). In this embodiment, drive substrate (2501)
provides the dielectric layer between the drive and pickup plates,
without the need for a separate dielectric layer as in previously
discussed embodiments. If substrate (2502) is flexible, attach pads
(2507a) may be able to mate with their corresponding pads (2507b)
on base substrate (2500). A cutout (2503) may be provided in base
substrate (2500) to accommodate pickup chip (2505) so the assembly
lies flat. Interconnect traces (2514) formed on the top layer of
base substrate (2500) may be included to provide synchronizing
signals between the integrated circuits (2504) and (2505). Vias
(2507c) or other openings in the base substrate (2500) may be used
to route signals to the bottom layer, where lower layer traces
(2509) may connect the signals to interconnect pads (2508) for
possibly power, ground, communications interconnect to the host
system, and other connections.
[0194] FIG. 26 shows an exemplary embodiment where the drive and
detection electronics are both provided by a single integrated
circuit. In one example, substrate (2601) may be composed of a
dielectric material which separates the drive (2602) and pickup
(2603) plates. Substrate (2601) may be a flexible material, such as
Kapton, or a thin rigid material, such as an aramid laminate layer
in a FlipChip package, or it may be another material. Integrated
circuit die (2604) incorporates contact pads (2611) which are
mounted onto bonding pads (2605) the bottom layer of the substrate.
The bonding pads provide connections from die (2604) to
interconnect traces (2606), drive plates (2602), and pickup
interconnect traces (2607), A number of vias (2609) electrically
connect pickup interconnect (2607) on the bottom layer to pickup
plates (2602), which may be located on the top layer. Interconnect
traces (2606) may connect die (2604) to host connector pads (2608).
A dielectric layer (2610) may be formed atop pickup plated (2603)
to prevent direct contact of the finger with the pickup plates. The
dielectric layer (2610) may be formed from a number of materials,
including but not limited to an LPI soldermask material, an ink, or
a top kapton coversheet. In another embodiment, a surface may not
be entirely planar or even molded over an object such as a power
button,
[0195] FIGS. 27-29 illustrate a method for integrating a folded
flex fingerprint sensor directly onto a touch-screen device. An
unfolded Chip on Flex (COF) substrate is shown in FIG. 28 and is
folded back onto itself as is shown in FIG. 27 callouts
(2701-2705). Host interface tab (2705) connects the sensor to the
host using a connector that accepts the etched flex tab directly or
is attached to the host circuit board using an industry standard
conductive adhesive referred to as ACF. FIG. 28 shows a COF layout
where the substrate is folder end-over-end but could also be
reconfigured to fold on another axis such as side-by-side.
[0196] FIGS. 30-32 illustrate a fingerprint sensor integrated onto
the same substrate layers as a conventional touch-screen.
[0197] FIG. 51 illustrates a method for integrating a folded flex
fingerprint sensor with a touchscreen device that utilizes a
protective cover layer. Display substrate (5106) is a conventional
display assembly, which may optionally incorporate a touchscreen.
Flexible substrate (5120) has driver receiver chip (5104) mounted
on it, and provides a substrate for both the drive and pickup lines
of the fingerprint sensor. Substrate (5120) is then folded and
mounted on top of display substrate (5106). Host interface
connector (5205) provides data and control interconnect between the
fingerprint sensor assembly and the host device. An optically
transparent dielectric spacer (5130) is placed on top of the
display substrate. This dielectric spacer is the same thickness as
the stacked fingerprint sensor substrate (5112). A cutout (5108) in
the dielectric spacer allows the fingerprint sensor sensing area
(5112) to sit flush with the top of dielectric spacer. Top layer
(5107) may be made of a protective material such as Corning Gorilla
Glass or a protective polymer film. This top layer has a cutout
(5109) which allows direct finger contact with finger sensing area
(5112).
[0198] FIG. 52 illustrates a method for integrating a fingerprint
sensor on the same substrate layers as a touchscreen. Display
substrate (5206) contains a standard LDC module. The lower layer
plates (5211) of the fingerprint sensor are formed or etched on top
of the display substrate, from a conductive material such as Indium
Tin Oxide (ITO). Flexible substrate (5520) has driver receiver chip
(5204) mounted on it. Connections from the driver receiver chip
(5502) are made to the lower layer plates (5211) through a lower
layer edge connector (5210). This connector may be attached through
anisotropic conductive film (ACF) or other means. An optically
transparent dielectric spacer (5230) is placed on top of the
display substrate. The spacer has a cutout (5209) to accommodate
lower edge connector (5510) and upper edge connector (5221). Top
layer (5210) is fabricated from a thin glass or transparent polymer
film. This layer (5510) has upper layer sensor plates (5212) formed
or etched on its lower surface made of a conductive material such
as Indium Tin Oxide (ITO). Flexible substrate 5520 connects signals
from driver receiver chip (5204) through upper edge connector
(5221), again through ACF or other means.
[0199] FIG. 53 illustrates a configuration where the fingerprint
sensor and a touchscreen are implemented on common substrate layers
utilizing a common controller chip. Driver receiver chip (5304) is
mounted to flexible substrate (5320) which provides interconnect
between the chip and the host through a host interface connector
(5305). Display substrate (5306) is the upper surface of a display
module. Both the lower touchscreen plates (5330) and the lower
layer fingerprint sensor plates (5311) are formed or etched on top
of display substrate (5306). These plates mat be etched or formed
from a transparent material such as Indium Tin Oxide (ITO) or other
suitable conductive material. Upper fingerprint sensor plates
(5312) and upper touchscreen plates (5331) are both etched or
formed on the lower side of top layer (5307). A dielectric layer
(5330) separates the lower sets of plates for the two sensors from
the upper sets of plates. Flexible substrate provides signal
interconnect between driver/receiver chip (5304) to the lower sets
of plates through lower edge connector (5310) and interconnect to
the upper plate sets through upper edge connector 5321. These edge
connectors may be electrically connected through an Anisotropic
Conductive Film (ACF) bond or other suitable means.
[0200] FIGS. 33 and 34 illustrate a novel "Dual Grid"
touch-screen.
[0201] User motion tracking is required in touchscreen devices for
a number of functions, including icon selection and movement,
control selection, gesture recognition, text selection, and so on.
Many motion tracking functions only require coarse position
determination, but may be done at high speed. This is especially
true of gesture recognition. Other functions may require much finer
position determination, but these generally are performed at low
speeds of motion to allow the user more precise control. Such
functions include text selection and drawing tasks.
[0202] While it may be difficult to precisely track motion at high
speeds due to the high number of positions that need to be sampled
at high speed, in practice high speed and high precision are not
needed simultaneously.
[0203] Given the relative large size of fingers compared to the
size of pixels on a typical touchscreen, it is difficult to
accurately determine the precise position of a finger. In practice,
users actually do not rely on exact finger placement determination
to perform precise tasks. Instead, they place their finger on the
touchscreen at the approximate location of interest, and then rely
on visual feedback from the screen to complete fine positioning
tasks.
[0204] The important characteristics for a touchscreen display
input, then, are good high speed coarse absolute position
determination, and highly responsive high resolution low-speed
relative motion determination.
[0205] This invention addresses the need for high speed coarse
absolute positioning and responsive high resolution slow speed
motion tracking by providing a dual resolution sensing system. A
primary grid is formed at a spacing equal to that used by
commercially available touch screens with a spacing of 5-10 per
inch while a secondary grid is formed about the primary lines with
a much finer resolution equal to that of a commercial fingerprint
sensor at 500 lines per inch. The result is a sensor that is
capable of detecting macro finger movements using the primary grid
as well as small incremental movements using the secondary grid
which tracks the movements of fingerprint ridge and valley
features.
[0206] FIG. 33 shows one embodiment of this dual grid concept in a
touchscreen application where the cover layer has been omitted. The
touchscreen consists of a matrix of passive capacitance sensing
junctions formed at the crossover points of each row an column
arranged in a pattern to facilitate both coarse absolute position
detection and high resolution relative motion tracking. The
illustration shows a simplified embodiment where the sense and
drive lines are configured to provide a regularly space series of
3.times.3 pixel high resolution patches, where the high resolution
pixels are spaced in a manner to detected localized features of a
fingerprint. These pixels within the cluster would typically be
spaced approximately 50 to 100 microns apart. The clusters of
pixels are spaced in a manner to provide several contact points
within a finger, leading to a typical cluster spacing of 1 to 3
millimeters apart. Active circuitry is located on the periphery of
the array outside the sensing area and is used to make the
individual crossovers impedance sensitive to a proximally located
object as well as scan the entire array
[0207] FIG. 34 is an exploded view of the embodiment shown in FIG.
33, showing the stack up of the substrate, with the drive lines
atop that, and the chip with the processing electronics mounted to
routing lines which feed the drive plates, as well as feed lines
with connect to the sense lines on the upper layers and host
interconnect. A dielectric layer separated the drive and pickup
lines. The dielectric has cutouts to allow the interconnect pads to
feed the pickup signals back to the processing electronics. A thin
protective layer, typically of a polymer film or very thin glass is
mounted on top of the sense plates.
[0208] FIGS. 35-37 illustrate a fully integrated Dual Grid
touch-screen and fingerprint sensor, which advantageously share a
common drive and sense circuit. In this embodiment, a dedicated
area of high density pixels if provided to create a fingerprint
sense area for user authentication or other similar purposes,
adjacent to a dual-grid touchscreen array configured as in FIG. 33.
FIGS. 36 and 37 are exploded views of the embodiment shown in FIG.
35.
[0209] FIGS. 38-40 illustrated a fully integrated display with
integral touch-screen and fingerprint sensing over the entire
display area. In this embodiment, the drive plates are formed below
the OLED emissive pixels, while the pickup plates are formed of
transparent conductors, such as ITO, in a layer above the OLED
emissive layer.
[0210] FIGS. 41-46 illustrate how the dual grid finger motion
tracking process operates.
[0211] FIGS. 41 and 42 show the location of a finger on the dual
grid sensor before and after a coarse position change. Coarse
position finding and fast motion tracking is performed by
activating all the pixels in a cluster simultaneously and taking a
single measurement to determine if the cluster is covered by a
finger. FIG. 43 is a flowchart for this coarse scan process. FIG.
44 illustrates the computation of the centroid locations for the
finger in the two samples collected before and after the move. If
the coarse coverage changes between two scans, then the finger is
moving quickly, and fine position tracking is not needed. In this
case the device will report a new absolute position for each sensed
finger to the host system.
[0212] If the coarse finger position has not changed, then it is
possible that the user is performing a fine positioning task. FIG.
45 illustrates a sequence of images taken at a single high
resolution cluster as a finger moves over it. It can be seen that a
coarse centroid measurement would not detect the motion of the
finger, but examination of the ridge pattern at a fine pixel
resolution can detect this relative motion. FIG. 46 shows the local
images collected at three different high resolution clusters before
and after a very fine motion. For this example, we examine a
4.times.4 cluster of high resolution pixels at each location on the
coarse grid. The advantage provided by taking samples at multiple
locations is demonstrated by examining the results from each cell
individually. Assuming sufficient sample rate to capture any motion
of one pixel or less, there are nine possible relative locations
that must be examined when comparing two sequential samples to
determine the motion of the finger between the samples. For each
possible adjacent move, we compute a match score by shifting the
image to the adjacent location, and then counting pixels which
match in the overlap region. The number of pixels matched is
divided by the total number of pixels that in the overlap region
between the shifted and unshifted images to produce a relative
match score. A score of 1 indicates a perfect match. When we apply
this method to cell #1 in the example (FIG. 47) and cell #2 (FIG.
48) a single location receives a strong score relative to the other
possibilities. When we apply the method to cell #3 (FIG. 49)
however, there are three equally high scoring possible final
positions. This outcome for a localized area can be quite common
when tracking regular patterns such as fingerprints. The example in
FIG. 49 demonstrates that a ridge tracking system can be locally
insensitive to movement that is parallel to the local ridge
orientation. In order to reliably track motion of fingerprints,
therefore, it is strongly advantageous to sample the finger at
several different locations. The dual grid configuration enables
this by dispersing the pixel clusters widely about the finger, so
that it samples the finger at locations with a variety of local
orientations, without requiring the resources to cover the entire
finger area at a high resolution. FIG. 50 shows the combination of
results from the three measurement cells to produce a single robust
score to determine if the pattern has remained stationary or moved.
If motion is detected, the previously computed position (initially
from the coarse position) is adjusted by the detected motion, and
the updated position is transmitted to the host.
[0213] It should be noted that many operating modes of a device may
only require coarse location information from the touch sensor. In
these cases the system can advantageously omit the fine motion
tracking operations of the position sensor in order to save
power.
[0214] While certain exemplary embodiments have been described and
shown in the accompanying drawings, it is to be understood that
such embodiments are merely illustrative of and not restrictive on
the broad embodiment, and that this embodiment is not limited to
the specific constructions and arrangements shown and described,
since various other modifications may occur to those ordinarily
skilled in the art. Hence, alternative arrangements and/or
quantities of, connections of various sorts, arrangements and
quantities of transistors to form circuits, and other features and
functions can occur without departing from the spirit and scope of
the embodiment. Similarly, components not explicitly mentioned in
this specification can be included in various embodiments of this
embodiment without departing from the spirit and scope of the
embodiment. Also, different process steps and integrated circuit
manufacture operations described as being performed to make certain
components in various embodiments of this embodiment can, as would
be apparent to one skilled in the art, be readily performed in
whole or in part to make different components or in different
configurations of components not explicitly mentioned in this
specification without departing from the spirit and scope of the
embodiment. Accordingly, the specification and drawings are to be
regarded in an illustrative rather than a restrictive sense.
[0215] While certain exemplary embodiments have been described and
shown in the accompanying drawings, it is to be understood that
such embodiments are merely illustrative of and not restrictive on
the broad embodiment, and that this embodiment is not limited to
the specific constructions and arrangements shown and described,
since various other modifications may occur to those ordinarily
skilled in the art. Accordingly, the specification and drawings are
to be regarded in an illustrative rather than a restrictive
sense.
[0216] Again, the embodiment has application in many areas,
particularly in biometric sensors. Fingerprint sensors, for
example, and other biometric sensors are gaining increasing
acceptance for use in a wide variety of applications for security
and convenience reasons. Devices, systems and methods configured
according to the embodiment will have improved security of the
biometric verification process without increasing the cost of the
system. Furthermore, the embodiment may extend to devices, systems
and methods that would benefit from validation of components. As
discussed above, the embodiment includes the ability for the host
and sensor to include any combination or subset of the above
components, which may be arranged and configured in the manner most
appropriate for the system's intended application. Those skilled in
the art will understand that different combinations and
permutations of the components described herein are possible within
the spirit and scope of the embodiment, which is defined by the
appended Claims, their equivalents, and also Claims presented in
related applications in the future and their equivalents.
[0217] The embodiment may also involve a number of functions to be
performed by a computer processor, such as a microprocessor. The
microprocessor may be a specialized or dedicated microprocessor
that is configured to perform particular tasks according to the
embodiment, by executing machine-readable software code that
defines the particular tasks embodied by the embodiment. The
microprocessor may also be configured to operate and communicate
with other devices such as direct memory access modules, memory
storage devices, Internet related hardware, and other devices that
relate to the transmission of data in accordance with the
embodiment. The software code may be configured using software
formats such as Java, C++, XML (Extensible Mark-up Language) and
other languages that may be used to define functions that relate to
operations of devices required to carry out the functional
operations related to the embodiment. The code may be written in
different forms and styles, many of which are known to those
skilled in the art. Different code formats, code configurations,
styles and forms of software programs and other means of
configuring code to define the operations of a microprocessor in
accordance with the embodiment will not depart from the spirit and
scope of the embodiment.
[0218] Within the different types of devices, such as laptop or
desktop computers, hand held devices with processors or processing
logic, and also possibly computer servers or other devices that
utilize the embodiment, there exist different types of memory
devices for storing and retrieving information while performing
functions according to the embodiment. Cache memory devices are
often included in such computers for use by the central processing
unit as a convenient storage location for information that is
frequently stored and retrieved. Similarly, a persistent memory is
also frequently used with such computers for maintaining
information that is frequently retrieved by the central processing
unit, but that is not often altered within the persistent memory,
unlike the cache memory. Main memory is also usually included for
storing and retrieving larger amounts of information such as data
and software applications configured to perform functions according
to the embodiment when executed by the central processing unit.
These memory devices may be configured as random access memory
(RAM), static random access memory (SRAM), dynamic random access
memory (DRAM), flash memory, and other memory storage devices that
may be accessed by a central processing unit to store and retrieve
information. During data storage and retrieval operations, these
memory devices are transformed to have different states, such as
different electrical charges, different magnetic polarity, and the
like. Thus, systems and methods configured according to the
embodiment as described herein enable the physical transformation
of these memory devices. Accordingly, the embodiment as described
herein is directed to novel and useful systems and methods that, in
one or more embodiments, are able to transform the memory device
into a different state. The embodiment is not limited to any
particular type of memory device, or any commonly used protocol for
storing and retrieving information to and from these memory
devices, respectively.
[0219] The term "machine-readable medium" should be taken to
include a single medium or multiple media (e.g., a centralized or
distributed database, and/or associated caches and servers) that
store the one or more sets of instructions. The term
"machine-readable medium" shall also be taken to include any medium
that is capable of storing, encoding or carrying a set of
instructions for execution by the machine and that causes the
machine to perform any one or more of the methodologies of the
present embodiment. The machine-readable medium includes any
mechanism that provides (i.e., stores and/or transmits) information
in a form readable by a machine (e.g., a computer, PDA, cellular
telephone, etc.). For example, a machine-readable medium includes
memory (such as described above); magnetic disk storage media;
optical storage media; flash memory devices; biological electrical,
mechanical systems; electrical, optical, acoustical or other form
of propagated signals (e.g., carrier waves, infrared signals,
digital signals, etc.). The device or machine-readable medium may
include a micro-electromechanical system (MEMS), nanotechnology
devices, organic, holographic, solid-state memory device and/or a
rotating magnetic or optical disk. The device or machine-readable
medium may be distributed when partitions of instructions have been
separated into different machines, such as across an
interconnection of computers or as different virtual machines.
[0220] While certain exemplary embodiments have been described and
shown in the accompanying drawings, it is to be understood that
such embodiments are merely illustrative of and not restrictive on
the broad embodiment, and that this embodiment not be limited to
the specific constructions and arrangements shown and described,
since various other modifications may occur to those ordinarily
skilled in the art. Accordingly, the specification and drawings are
to be regarded in an illustrative rather than a restrictive
sense.
[0221] Reference in the specification to "an embodiment," "one
embodiment," "some embodiments," or "other embodiments" means that
a particular feature, structure, or characteristic described in
connection with the embodiments is included in at least some
embodiments, but not necessarily all embodiments. The various
appearances "an embodiment," "one embodiment," or "some
embodiments" are not necessarily all referring to the same
embodiments. If the specification states a component, feature,
structure, or characteristic "may", "might", or "could" be
included, that particular component, feature, structure, or
characteristic is not required to be included. If the specification
or Claim refers to "a" or "an" element, that does not mean there is
only one of the element. If the specification or Claims refer to
"an additional" element, that does not preclude there being more
than one of the additional element.
[0222] The methods, systems and devices include improved security
operations and configurations with a novel approach to biometric
systems. Such systems would greatly benefit from increased security
features, particularly in financial transactions. Although this
embodiment is described and illustrated in the context of devices,
systems and related methods of validating biometric devices such as
fingerprint sensors, the scope of the embodiment extends to other
applications where such functions are useful. Furthermore, while
the foregoing description has been with reference to particular
embodiments of the embodiment, it will be appreciated that these
are only illustrative of the embodiment and that changes may be
made to those embodiments without departing from the principles of
the embodiment, the scope of which is defined by the appended
Claims and their equivalents.
* * * * *