U.S. patent application number 13/916149 was filed with the patent office on 2013-10-17 for transport method and transport apparatus.
The applicant listed for this patent is Hidehiro Maeda, Kazuya Okamoto, Yasuaki Tanaka. Invention is credited to Hidehiro Maeda, Kazuya Okamoto, Yasuaki Tanaka.
Application Number | 20130274915 13/916149 |
Document ID | / |
Family ID | 40156310 |
Filed Date | 2013-10-17 |
United States Patent
Application |
20130274915 |
Kind Code |
A1 |
Maeda; Hidehiro ; et
al. |
October 17, 2013 |
Transport Method and Transport Apparatus
Abstract
Provided is a transport method comprising judging whether there
is a possibility that misalignment greater than or equal to a
threshold value occurs between substrates to be layered that are
held by a pair of substrate holders aligned and stacked by an
aligning section, the misalignment occurring when the pair of
substrate holders is transported from the aligning section to a
pressure applying section; and if the judgment indicates that there
is the possibility of misalignment, transporting the pair of
substrate holders to a region other than the pressure applying
section. Whether there is the possibility of misalignment may be
judged based on acceleration of the substrate holders. Whether
there is the possibility of misalignment may be judged based on
acceleration of a transporting section that transports the
substrate holders. Whether there is the possibility of misalignment
may be judged based on relative positions of the substrate holders.
Whether there is the possibility of misalignment may be judged
based on relative positions of (i) a transporting section that
transports the pair of substrate holders and (ii) one of the pair
of substrate holders.
Inventors: |
Maeda; Hidehiro;
(Yokohama-shi, JP) ; Okamoto; Kazuya;
(Yokohama-shi, JP) ; Tanaka; Yasuaki;
(Odawara-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Maeda; Hidehiro
Okamoto; Kazuya
Tanaka; Yasuaki |
Yokohama-shi
Yokohama-shi
Odawara-shi |
|
JP
JP
JP |
|
|
Family ID: |
40156310 |
Appl. No.: |
13/916149 |
Filed: |
June 12, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13548287 |
Jul 13, 2012 |
8489227 |
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13916149 |
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12644615 |
Dec 22, 2009 |
8244399 |
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13548287 |
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PCT/JP2008/061267 |
Jun 19, 2008 |
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12644615 |
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Current U.S.
Class: |
700/228 |
Current CPC
Class: |
H01L 21/68 20130101;
H01L 2924/00014 20130101; H01L 21/677 20130101; H01L 21/67259
20130101; Y10T 156/10 20150115; H01L 24/34 20130101; H01L 21/67092
20130101; H01L 2924/00014 20130101; H01L 2224/84 20130101; H01L
2224/37099 20130101 |
Class at
Publication: |
700/228 |
International
Class: |
H01L 21/677 20060101
H01L021/677 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 21, 2007 |
JP |
JP 2007-164081 |
Claims
1-26. (canceled)
27. A method comprising: detecting a possibility of misalignment
between a plurality of layered substrates during a transporting
period.
28. The method of claim 27, wherein the detecting during the
transport period includes detecting during a period from when the
plurality of layered substrates have completed alignment by an
aligning section until an operation of one of applying pressure to
and heating the plurality of layered substrates.
29. The method of claim 27, further comprising judging whether a
misalignment between the plurality of layered substrates has
occurred based on the possibility of misalignment.
30. The method of claim 29, further comprising: transporting the
plurality of layered substrates to a region other than a pressure
applying section when the misalignment has occurred; and
transporting the plurality of layered substrates to the pressure
applying section when the misalignment has not occurred.
31. The method of claim 29, wherein the judging is based on a
relative position between at least two of the plurality of layered
substrates, a first substrate holder that holds the plurality of
layered substrates, a second substrate holder that holds the
plurality of layered substrates, and a transporting section that
transports the plurality of layered substrates.
32. The method of claim 29, wherein the judgment is based on
whether the possibility of misalignment is greater than or equal to
a threshold value.
33. The method of claim 32, wherein the judging is based on an
acceleration of at least one of the plurality of layered
substrates, a substrate holder that holds the plurality of layered
substrates, and a transporting section that transports the
plurality of layered substrates.
34. An apparatus comprising: a control section operable to detect a
possibility of misalignment between a plurality of layered
substrates during a transporting period.
35. The apparatus of claim 34, wherein the transport period
includes a period from when the plurality of layered substrates
have completed alignment by an aligning section until an operation
of one of applying pressure to and heating the plurality of layered
substrates.
36. The apparatus of claim 34, wherein the control section is
further operable to judge whether a misalignment between the
plurality of layered substrates has occurred based on the
possibility of misalignment.
37. The apparatus of claim 36, further comprising a transporting
section operable to transport the plurality of layered substrates
to a region other than a pressure applying section when the
misalignment has occurred, and transport the substrate holder to
the pressure applying section when the misalignment has not
occurred.
38. The apparatus of claim 36, wherein the control section is
further operable to judge based on a relative position between at
least two of the plurality of layered substrates, a first substrate
holder which holds the plurality of layered substrates, a second
substrate holder which holds the plurality of layered substrates,
and a transporting section which transports the plurality of
layered substrates.
39. The apparatus of claim 38, further comprising a gap sensor
mounted on at least one of the first substrate holder, the second
substrate holder, and the transporting section, the gap sensor
operable to detect the relative position.
40. The apparatus or claim 36, wherein the control section is
further operable to judge based on whether the possibility of
misalignment is greater than or equal to a threshold value.
41. The apparatus of claim 40, further comprising: a servo control
section in communication with the control section, the servo
control section including an encoder operable to detect an
acceleration of at least one of the plurality of layered substrates
and a substrate holder which holds the plurality of substrates,
wherein the control section is further operable to judge based on
the acceleration.
42. The apparatus of claim 40, further comprising: an acceleration
sensor mounted on at least one of a substrate holder which holds
the plurality of substrates and a transporting section which
transports the plurality of layered substrates, the acceleration
sensor operable to detect an acceleration, wherein the control
section is further operable to judge based on the acceleration.
43. A non-transitory computer-readable medium having instructions
stored thereon which, when executed by at least one processor,
cause the at least one processor to perform operations comprising:
detecting a possibility of misalignment between a plurality of
layered substrates during a transporting period.
44. The computer-readable medium of claim 43, wherein the operation
of detecting during the transport period includes detecting during
a period from when the plurality of layered substrates have
completed alignment by an aligning section until an operation of
one of applying pressure to and heating the plurality of layered
substrates.
45. The computer-readable medium of claim 43, further comprising an
instruction that, when executed by the at least one processor,
causes the at least one processor to perform a further operation of
judging whether a misalignment between the plurality of layered
substrates has occurred based on the possibility of
misalignment.
46. The computer-readable medium of claim 45, further comprising
instructions that, when executed by the at least one processor,
cause the at least one processor to perform further operations of:
transporting the plurality of layered substrates to a region other
than a pressure applying section when the misalignment has
occurred; and transporting the plurality of layered substrates to
the pressure applying section when the misalignment has not
occurred.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present invention relates to a transport apparatus and a
transport method. In particular, the present invention relates to a
transport method of a substrate holder during manufacturing of a
layered 3-dimensional semiconductor apparatus and an apparatus that
realizes this transport method. The present patent application
claims priority based on Japanese Patent Publication Application
No. 2007-164081 filed on Jun. 21, 2007, the contents of which are
incorporated herein by reference.
[0003] 2. Related Art
[0004] Techniques are advancing for bonding substrates, wafers, and
the like to each other during manufacturing of a device having a
stereoscopic structure such as a MEMS or a layered 3-dimensional
semiconductor apparatus having layered wafer levels. The
development of apparatuses used for this purpose is also
progressing. For example, see Japanese Patent Application
Publication No. 2005-302858. With such a bonding apparatus, when
transporting a temporarily fixed layered wafer body, transportation
conditions are adopted so as not to cause misalignment between the
wafers.
[0005] Regarding the transport conditions of the bonding apparatus,
if misalignment is caused for some reason after two wafers are
aligned and the misaligned wafers then undergo electrode bonding by
a pressure applying and heating process, the resulting layered
semiconductor apparatus does not function properly, which causes a
drop in the yield when manufacturing semiconductor apparatuses.
Therefore, transport of the aligned wafers without causing
misalignment is desired, and so is detection of misalignment
between the wafers prior to the pressure applying and heating
process.
SUMMARY
[0006] Therefore, according to a first aspect related to the
innovations herein, one exemplary transport method may comprise
judging whether there is a possibility that misalignment greater
than or equal to a threshold value occurs between substrates to be
layered that are held by a pair of substrate holders aligned and
stacked by an aligning section, the misalignment occurring when the
pair of substrate holders is transported from the aligning section
to a pressure applying section; and if the judgment indicates that
there is the possibility of misalignment, transporting the pair of
substrate holders to a region other than the pressure applying
section.
[0007] According to a second aspect related to the innovations
herein, one exemplary transport apparatus may include a transport
apparatus that transports a pair of substrate holders, which are
aligned and stacked by an aligning section and hold substrates to
be layered, from the aligning section to a pressure applying
section, comprising a control section that (i) judges whether there
is a possibility of misalignment greater than or equal to a
threshold value occurring between the substrates, the misalignment
occurring during transport from the aligning section to the
pressure applying section, and (ii) if the judgment indicates the
possibility of misalignment, causes the pair of substrate holders
to be transported to a region other than the pressure applying
section.
[0008] According to a third aspect related to the innovations
herein, one exemplary transport method may comprise judging whether
there is a possibility that misalignment greater than or equal to a
threshold value occurs between substrates aligned and stacked by an
aligning section, the misalignment occurring when the pair of
substrates is transported from the aligning section to a pressure
applying section; and if the judgment indicates that there is the
possibility of misalignment, transporting the pair of substrates to
a region other than the pressure applying section.
[0009] According to a fourth aspect related to the innovations
herein, one exemplary transport apparatus may include a transport
apparatus that transports a pair of substrates, which are aligned
and stacked by an aligning section, from the aligning section to a
pressure applying section, comprising a control section that (i)
judges whether there is a possibility of misalignment greater than
or equal to a threshold value occurring between the substrates, the
misalignment occurring during transport from the aligning section
to the pressure applying section, and (ii) if the judgment
indicates the possibility of misalignment, causes the pair of
substrates to be transported to a region other than the pressure
applying section.
[0010] The summary clause does not necessarily describe all
necessary features of the embodiments of the present invention. The
present invention may also be a sub-combination of the features
described above. The above and other features and advantages of the
present invention will become more apparent from the following
description of the embodiments taken in conjunction with the
accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a flow chart showing the manufacturing process of
a layered 3-dimensional semiconductor apparatus.
[0012] FIG. 2A is a schematic view of one step performed by the
manufacturing apparatus.
[0013] FIG. 2B is a schematic view of one step performed by the
manufacturing apparatus.
[0014] FIG. 2C is a schematic view of one step performed by the
manufacturing apparatus.
[0015] FIG. 3A is a schematic view of one step performed by the
manufacturing apparatus.
[0016] FIG. 3B is a schematic view of one step performed by the
manufacturing apparatus.
[0017] FIG. 3C is a schematic view of one step performed by the
manufacturing apparatus.
[0018] FIG. 4 is a schematic view of one step performed by the
manufacturing apparatus.
[0019] FIG. 5A shows the transport apparatus 42 as seen from the
side when the block 27 is loaded therein.
[0020] FIG. 5B shows the transport apparatus 42 as seen from the
direction indicated by A in FIG. 5A when the block 27 is loaded
therein.
[0021] FIG. 6 is a graph showing the correlation between the
acceleration imparted by the transport apparatus 42 and the amount
of misalignment occurring between the wafers 11.
[0022] FIG. 7 shows a first modification of the present
embodiment.
[0023] FIG. 8 shows the transport apparatus 42 according to the
second embodiment, as viewed from the side in a state where the
block 27 is loaded therein.
[0024] FIG. 9 shows the transport apparatus 42 according to the
third embodiment, as viewed from the side in a state where the
block 27 is loaded therein.
[0025] FIG. 10 is a schematic view of a control section 80 and the
transport apparatus 42 according to the fourth embodiment.
[0026] FIG. 11 is a side view of the transport apparatus 42
according to the fifth embodiment when the block 27 is loaded
therein.
DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0027] Hereinafter, some embodiments of the present invention will
be described. The embodiments do not limit the invention according
to the claims, and all the combinations of the features described
in the embodiments are not necessarily essential to means provided
by aspects of the invention.
[0028] FIG. 1 is a flow chart showing the manufacturing process of
a layered 3-dimensional semiconductor apparatus. FIGS. 2A, 2B, 2C,
3A, 3B, 3C, and 4 each show a manufacturing apparatus and work
occurring at each stage of the manufacturing process shown in FIG.
1. The following uses these Figures to described the process of
FIG. 1.
[0029] Wafer Preparation Step (S1):
[0030] In the wafer preparation step, a wafer 11 is prepared on
which is formed circuit elements implemented in the final chip
form, as shown in FIG. 2A. In this step, a wafer 11 is created on
which is formed a semiconductor apparatus 13 including transistors,
resistors, capacitors, wiring, via-electrodes, and the like, using
mainly a lithography technique and also an impurity expansion
technique, an etching technique, a thin-film forming technique, or
the like.
[0031] The wafer 11 is prepared so as to have a number of layers
required for forming an IC chip to be ultimately used. Layering of
the wafer 11 may begin after the desired number of layers is
prepared, or a portion of the layering step may be performed in
parallel with the preparation.
[0032] Wafer Holding Step (S2):
[0033] In the wafer holding step (S2), the wafer 11 is held on a
wafer holder 21 by electrostatic adsorption, as shown in FIG. 2B.
By holding another wafer 11 in another wafer holder 21, the wafer
holders 21 can hold a wafer 11 pair made of two stacked wafers 11.
The method for holding the wafers 11 is not limited to
electrostatic adsorption, and may instead be vacuum suction or the
like, One of the held wafers 11 may already have a 3-dimensional
structure formed by layering and bonding a plurality of
substrates.
[0034] In the wafer holding step (S2), the positional relationship
between the each pair of a wafer holder 21 and a wafer 11 is
recorded by using a microscope or the like to measure an alignment
mark 23 on the wafer 11 held by the wafer holder 21 and a reference
mark 25 on the wafer bolder 21. This record is used in the
following step. Furthermore, as described further below, this
record is also used when judging whether there is a possibility of
misalignment between the wafer 11 and the wafer holder 21.
[0035] Wafer Stacking Step (S3):
[0036] In the wafer stacking step (S3), the wafers held by the
wafer holders 21 are brought near each other with their surfaces
opposed to each other, as shown in FIG. 2C. The positional
relationship between the reference marks 25 of the wafer holders 21
is monitored by a microscope 31 to measure the positional
relationship between corresponding reference marks 25 on the wafer
holders 21.
[0037] By referencing the positional relationships between the
wafer holders 21 and the wafers 11 recorded in the previous step,
the relative positions of the reference marks 25 of the wafer
holders 21 and the alignment mark 23 of the wafers 11 can be
obtained. By moving one of the wafer holders 21 by an appropriate
amount relative to the other wafer holder 21 based on these
relative positions, the alignment marks 23 on a pair of wafers 11
can be brought into alignment with each other. Each reference mark
25 on each wafer holder 21 is formed on a substrate that is thinly
layered over a concave portion 33 formed in the wafer holder 21,
such that reference mark 25 can be observed by the microscope 31 or
the like from a back surface of the wafer holder 21.
[0038] Wafer Temporary Fixing Step (S4):
[0039] In the wafer temporary fixing step (S4), the space between
two aligned wafers 11 is narrowed, such that the two wafers 11 are
stacked in contact. After stacking the wafers, the pair of wafer
holders 21 temporarily affix the wafers 11 to each other by
inserting a plurality of temporary fixing apparatuses 41 into
concave portions 29 formed on the periphery of the wafer holders
21, as shown in FIG. 3A.
[0040] Each temporary fixing apparatus 41 exerts a force
perpendicular to the surfaces of the wafers on the wafer holders
21, but does not exert any force parallel to these surfaces. In
this way, the two wafers 11 are aligned with each other, and a
block 27 is achieved by temporarily fixing the wafers 11 to each
other in a contacting state.
[0041] Transportation Step and Detection of Misalignment Between
Wafers (S5):
[0042] As shown in FIG. 3B, in the manufacturing apparatus 40 that
manufactures the semiconductor apparatus, the temporarily fixed
block 27 is transported from the stacking step executing section 45
to the pressure applying and heating step executing section 47. The
transport of the block 27 is performed by the transport arm 43 of
the transport apparatus 42. During the transport period, that is,
the period from when the block 27 begins being transported from the
stacking step executing section 45 to when the block 27 arrives at
the pressure applying and heating step executing section 47 and the
pressure applying and heating step begins, a method described
further below is used to detect the possibility of misalignment
occurring between the two wafers 11.
[0043] The transport apparatus 42 controls the operation of the
transport arm 43 such that misalignment does not occur between the
wafer holders 21 and the wafers 11 in the transported block 27.
Even so, misalignment might be caused by sudden stoppage of the
transport apparatus 42 when a control system above the transport
apparatus 42 detects some kind of abnormality.
[0044] In this case, the movement of the transport arm 43 is
stopped suddenly regardless of the transport apparatus 42, causing
a large acceleration of the wafer holders 21 and wafers 11 during
transport. Also, if the power supply is suddenly cut for some
reason, the control of the transport apparatus 42 is disabled,
causing the transport arm 43 to stop and resulting in a large
acceleration of the wafer holders 21 and wafers 11.
[0045] If the transport apparatus 42 is provided with a plurality
of independently controlled actuators, each actuator is controlled
such that wafer holder 21 misalignment does not occur. However,
there are cases where the tolerance of each actuator is overlapped
such that the transported wafer holders 21 accelerate beyond a
setting amount, which causes a large acceleration of the block
27.
[0046] In such a case, the transport arm tip 60 is provided with an
acceleration sensor 64, for example, that can detect the
possibility of misalignment by detecting the acceleration actually
imparted to the block 27. On the other had, if a control system of
the transport apparatus 42 detects an abnormality of some sort, the
output of the acceleration sensor 64 can be referenced to detect
whether the abnormality affects the block 27.
[0047] Misalignment Possibility Judging Step (S6):
[0048] In the misalignment possibility judging step (S6), a
judgment is made concerning the detected possibility of
misalignment. If the detected acceleration is below a threshold
value indicating that there is no possibility of misalignment, the
process moves to the pressure applying and heating step (S7). In
other words, the judgment concerning the possibility of
misalignment based on acceleration may be performed immediately
prior to the initiation of the pressure applying and heating step.
As a result, the performance of the pressure applying and heating
step on a misaligned block 27 is prevented, thereby preventing a
drop in the yield.
[0049] On the other hand, if the detection result indicates there
is a possibility that the two wafers 11 are misaligned and the
alignment precision necessary for the layered bonding is not
ensured, the pressure applying and heating step (S7) is performed
after returning the block 27 to the stacking step executing section
45 and repeating the steps from S3 to S5. As a result, precise
alignment of the wafers 11 can be ensured.
[0050] The actual transport of a block 27 that is possibly
misaligned to the pressure applying and heating step executing
section 47 may be stopped. Instead of stopping transport of the
block 27, the operation of the pressure applying and heating step
executing section 47 may be stopped. Therefore, a block 27 that is
possibly misaligned is removed from the transportation path and
instead transported to a different region that is described further
below.
[0051] Such a block 27 may be transported to a region other than
the pressure applying and heating step executing section 47 by the
transport apparatus 42. In this case, the block 27 may accumulate
the possibly-misaligned wafers in a wafer cassette or the like
designed for this purpose, without performing the pressure applying
and heating step. Furthermore, if the possibly-misaligned blocks 27
are transported to a region other than the pressure applying and
heating step executing section 47, the steps from S3 to S5 may be
performed for other wafers 11.
[0052] Even if the possibility of misalignment is detected, that
does not actually mean that the block 27 is misaligned. Such a
block 27 that is not actually misaligned is examined to detect
whether misalignment has occurred, and can move to the pressure
applying and heating step without repeating the stacking step. As a
result, the number of times that the stacking step is repeated can
be decreased, thereby enhancing the throughput when manufacturing
layered semiconductor apparatuses.
[0053] If a state of a wafer 11 changes during the stacking step,
e.g. if surface quality of the bonded surface changes, it might be
impossible to re-perform the stacking step for the misaligned block
27 in this state. In such a case, the stacking step is re-performed
after a process is performed to polish the surface of the wafer 11,
for example. As a result, the quality of the block 27 on which the
stacking step is re-performed is improved, thereby further
increasing the yield when manufacturing layered semiconductor
apparatuses.
[0054] Pressure Applying and Heating Step (S7):
[0055] The block 27 transported to the pressure applying and
heating step executing section 47 is loaded in the pressure
applying and heating step executing section 47, the degree of
parallelization between the upper pressure applying plate 49 and
the lower pressure applying plate 48 of the pressure applying and
heating step executing section 47 is adjusted, and the upper
pressure applying plate 49 is pressed toward the lower pressure
applying plate 48 using a hydraulic cylinder, for example, as shown
in FIG. 3C. After the two wafers 11 have been pressed by the wafer
holders 21, the wafers 11 are heated by heaters housed in the wafer
holders 21 and the electrodes are bonded to form the layered wafer
body 50, as shown in FIG. 4
[0056] An adhesive agent or the like may be used when affixing the
wafers 11 to each other in the pressure applying and heating step.
In such a case, the heating of the block 27 by the pressure
applying and heating step executing section 47 can be omitted.
[0057] The pressure applying and heating step executing section 47
may have a configuration for transporting the block 27 internally.
As a result, even after the block 27 is transported into the
pressure applying and heating step executing section 47,
misalignment might occur in the block 27. Therefore, a step may be
included to detect the possibility of misalignment prior to the
initiation of the pressure applying process.
[0058] When the possibility of misalignment is detected in this
step, the operation of the pressure applying and heating step
executing section 47 may be stopped and the block 27 may be
transported to another region without undergoing the pressure
applying and heating step. In the same manner as described above,
the transported blocks 27 may be realigned or may be transported
and accumulated in a prescribed region after being examined. As a
result, the manufacturing yield of layered semiconductor
apparatuses is improved.
[0059] Dicing Step (S8):
[0060] The layered wafer body 50, which is formed by layering a
prescribed number of wafers 11 and bonding the electrodes, is diced
to be separated into individual chips 51, as shown in FIG. 4. The
dicing can be realized by cutting the layered wafer body 50 along
the dotted lines shown in FIG. 4, for example, using a widely known
dicing blade.
[0061] As described above, by using the layered 3-dimensional
semiconductor apparatus manufacturing apparatus and manufacturing
method according to the embodiments of the invention, a drop in the
yield of layered 3-dimensional semiconductor apparatuses due to
bonding defects caused by misalignment during transport can be
prevented by changing the steps when the possibility of
misalignment between transported stacked wafers 11 is detected.
[0062] Therefore, a transport method is realized in which, when
wafers 11 to be stacked are held by a pair of wafer holders 21,
which are aligned by the stacking step executing section 45, and
transported from the stacking step executing section 45 to the
pressure applying and heating step executing section 47, a judgment
can be made concerning the possibility that misalignment greater
than a threshold amount occurs between the wafers 11. If this
possibility is judged to be high, the pair of wafer holders 21 are
transported to a region other than the stacking step executing
section 45.
[0063] The following is a description, referencing Figures, of
embodiments of the transport method and transport apparatus for
detecting the possibility of misalignment. In the following
description, components that have appeared previously are given the
same reference numerals and redundant explanation is omitted.
First Embodiment
[0064] FIGS. 5A and 513 show the transport apparatus 42 that
detects misalignment according to the first embodiment. FIGS. 5A
and 5B show the transport apparatus 42 when a block 27 is loaded
therein, as shown in FIG. 3B. FIG. 5A shows the transport apparatus
42 as seen from the side, and FIG. 5B shows the transport apparatus
42 as seen from the direction indicated by A in FIG. 5A.
[0065] In the state shown by FIGS. 5A and 5B, a block 27 is loaded
into the transport arm tip 60. This block 27 is obtained by the
temporary fixing apparatus 41 temporarily fixing two wafers 11
being aligned by the stacking step executing section 45 and having
surfaces contacting each other, as shown in FIG. 3B.
[0066] The transport arm tip 60 includes a lower support plate 61,
an upper support plate 62, and a support pillar 63 that supports
the lower support plate 61 and the upper support plate 62. The
upper support plate 62 moves in a direction indicated by the arrows
near the support pillar 63 in FIG. 5A, i.e. an up and down
direction when viewing the plane of FIG. 5A.
[0067] The two wafers 11 to be layered are each held by the
corresponding wafer holder 21 using electrostatic adsorption,
vacuum suction, or the like, and the two wafers 11 are aligned
using the steps described above.
[0068] After the wafers 11 are aligned, the wafer holders 21 are
temporarily fixed by the temporary fixing apparatus 41 to form the
block 27. The block 27 is fixed to the lower support plate 61 of
the transport arm tip 60 by electrostatic adsorption or vacuum
suction.
[0069] After the block 27 is fixed to the lower support plate 61,
the upper support plate 62 applies a pressing force from above
while the block 27 is being sandwiched. As a result, the block 27
is pressed into the state shown in FIG. 3B, in which the block 27
can be transported from the stacking step executing section 45 to
the pressure applying and heating step executing section 47. While
the block 27 is sandwiched between the lower support plate 61 and
the upper support plate 62, the block 27 may be fixed to the upper
support plate 62 by electrostatic adsorption or vacuum suction.
[0070] When the transport arm 43 (see FIG. 3B) transports the block
27, the block 27 is accelerated when movement begins, during
movement, and when movement stops. If the block 27 experiences a
large amount of acceleration, the possibility of misalignment
occurring between the two wafers 11 in the temporarily-fixed block
27 becomes more likely, as described further below in relation to
FIG. 6. If misaligned wafers 11 are bonded, the bonding is fixed
without a connection being achieved between the electrodes of the
wafers 11. Such a bonding decreases the yield of the 3-dimensional
semiconductor apparatuses. To prevent this, the first embodiment
detects misalignment based on the acceleration during
transport.
[0071] In the first embodiment, the acceleration sensor 64 for
detecting the acceleration of the transport arm tip 60 during
transport is provided near the support pillar 63 on the surface of
the lower support plate 61 onto which the block 27 is loaded. The
acceleration sensor 64 detects the acceleration experienced by the
block 27 during transport. The acceleration detected by the
acceleration sensor 64 is transmitted to a control apparatus, and
the possibility of misalignment is judged by the control apparatus
based on the relation between acceleration and misalignment amount
measured previously, as shown in FIG. 6.
[0072] FIG. 6 is a graph showing the correlation between the
acceleration imparted by the transport arm 43 of the transport
apparatus 42 and the amount of misalignment occurring between the
wafers, based on experimentally measured results. As shown in FIG.
6, there is a correlation between the acceleration experienced by
the block 27 and misalignment. Accordingly, the possibility of
misalignment in the block 27 can be detected by comparing the
acceleration detected by the acceleration sensor 64 to a threshold
value.
[0073] The possibility of misalignment can be detected by comparing
the detected acceleration to the threshold value of the
acceleration detected during transport, based on the relationship
between the acceleration and misalignment measured in advance. If
there is a possibility of misalignment, the pressure applying and
heating step (S7) is not performed for the block 27. A
possibly-misaligned block 27 is transported to a region other than
the pressure applying and heating step executing section 47, and is
examined with regard to whether misalignment has occurred, for
example.
[0074] If the examination indicates no misalignment, the block 27
is transported to the pressure applying and heating step executing
section 47 and the pressure applying and heating step (S7) is
performed thereon. If the examination indicates misalignment, the
stacking step is performed again to prevent a drop in yield due to
misalignment. Furthermore, the misaligned block 27 can be
dismantled, and the stacking step can then be performed again after
some type of processing, such as polishing of the wafers 11, has
been performed.
[0075] In addition, the yield of the manufactured product is
further improved. A block 27 that is not misaligned can undergo the
pressure applying and heating step without being re-stacked,
thereby increasing the throughput when manufacturing the layered
3-dimensional semiconductor apparatuses. In this way, a decrease in
the yield due to wafer 11 misalignment occurring during transport
from the stacking step executing section 45 to the pressure
applying and heating step executing section 47 can be
prevented.
[0076] The acceleration during transport can be detected as long as
the acceleration sensor 64 is provided on at least one of the two
lower support plates 61. The acceleration sensor 64 can achieve the
same result by being provided on components other than the lower
support plates 61, such as the support pillar 63 or the upper
support plate 62. Furthermore, in addition to acceleration in an
x-y direction parallel to the plane of FIG. 3B, the acceleration
sensor 64 may detect acceleration in the z-direction, which is
perpendicular to the plane of FIG. 3B.
[0077] The misalignment possibility judgment (S6) can be performed
any time prior to initiation of the pressure applying and heating
step (S7). Therefore, if the detection results are constantly
monitored and acceleration that might cause misalignment is
detected before the block 27 reaches the pressure applying and
heating step executing section 47, the transport of the block 27 to
the pressure applying and heating step executing section 47 can be
stopped and the block 27 can be immediately examined or transported
to undergo the stacking step again.
First Modification
[0078] FIG. 7 shows a first modification of the present embodiment.
Aside from the points described below, the first modification has
the same configuration as the first embodiment, and therefore
redundant explanation is omitted.
[0079] In the first modification, the acceleration sensor 64 is
provided on an outer periphery of at least one of the two wafer
holders 21 forming the block 27. FIG. 7 shows an example in which
both of the wafer holders 21 are provided with the acceleration
sensor 64.
[0080] The present modification, in the same manner as described
above, detects the possibility of misalignment corresponding to
detected acceleration based on the relationship between
acceleration and misalignment amount shown in FIG. 6, which is
stored in the control apparatus. Therefore, the transport apparatus
42 of the present modification can prevent a drop in yield caused
by misalignment during transport.
[0081] The acceleration sensor 64 used in the first embodiment and
first modification may be a widely known acceleration sensor such
as a device using semiconductor distortion resistance elements.
However, if the acceleration sensor 64 is provided to the wafer
holders 21, the acceleration sensor 64 desirably has a high heat
resistance since the acceleration sensor 64 is also heated during
the pressure applying and heating step (S7). The relationship
between acceleration and misalignment amount shown in FIG. 6 may be
stored in a memory of the control apparatus as a conversion table
or as an approximation function.
Second Embodiment
[0082] FIG. 8 shows the transport apparatus 42 that can detect
misalignment according to the second embodiment, as viewed from the
side in a state where the block 27 is loaded in the transport
apparatus 42 as shown in FIG. 3B. The transport apparatus 42 show
in FIG. 8 has the same configuration as the transport apparatus 42
according to the first embodiment, and therefore redundant
explanation is omitted.
[0083] In the second embodiment, there are two wafer holders 71 and
72, and a reference surface 73 is formed on the wafer holder 71.
The reference surface 73 is provided with a gap sensor 75 for
measuring a space between the reference surface 73 and a reference
surface 74 of the other wafer holder 72. The gap sensor 75 is a
sensor that detects a change in a gap according to a change in
electrostatic capacitance, for example, and may be a widely known
sensor such as an optical sensor using triangulation.
[0084] The second embodiment can use the gap sensor 75 to directly
measure the relative misalignment between the two stacked wafers
11, and therefore has a lower misalignment measurement error than
the first embodiment.
[0085] If the misalignment detected by the gap sensor 75 is greater
than or equal to a threshold value, the block 27 is returned to the
stacking step executing section 45 and is then transported to the
pressure applying and heating step executing section 47 after the
realignment is performed, thereby preventing a drop in the
yield.
[0086] In the first embodiment, the first modification, and the
second embodiment, the misalignment between the two wafer holders
21 forming the block 27 can be detected continuously during
transport of the block 27 from the stacking step executing section
45 to the pressure applying and heating step executing section 47,
and the block 27 can be returned to the stacking step executing
section 45 and realigned as soon as the misalignment amount exceeds
the threshold value. Therefore, the time necessary for realignment
when misalignment occurs is shortened, thereby minimizing the drop
in processing ability.
Third Embodiment
[0087] FIG. 9 shows the transport apparatus 42 that can detect
misalignment according to the third embodiment, as viewed from the
side in a state where the block 27 is loaded in the transport
apparatus 42 as shown in FIG. 3B. The transport apparatus 42 show
in FIG. 9 has the same configuration as the transport apparatus 42
according to the first embodiment, and therefore redundant
explanation is omitted.
[0088] In FIG. 9, the positional relationship between the wafers is
obtained by monitoring the reference marks 25 on the wafer holders
21 when two wafers 11 are stacked as described in FIG. 2C, and the
relative positions of the wafers 11 are adjusted. In the third
embodiment, the misalignment between the two wafers 11 during
transport is detected by using a microscope 76 provided to the
pressure applying and heating step executing section 47 to monitor
the positional relationship between the two reference marks 25 used
for alignment after transportation from the stacking step executing
section 45 to the pressure applying and heating step executing
section 47. This method simply involves providing the pressure
applying and heating step executing section 47 with the microscope
76, and therefore has the benefit of lower cost.
Fourth Embodiment
[0089] FIG. 10 shows a schematic view of a control section 80 and
the transport apparatus 42 according to the fourth embodiment. The
configuration of the transport apparatus 42 is the same as the
configuration of the transport apparatus 42 of any of the other
embodiments, and therefore redundant explanation is omitted. As
shown in FIG. 10, the transport apparatus 42 is provided with the
control section 80 and a transport arm drive section 90.
[0090] The control section 80 includes a servo control section 82,
an acceleration calculating section 84, a judging section 86, and a
target position holding section 88. The transport arm drive section
90 includes an actuator 92 that causes each part of the transport
arm 43 to operate and an encoder 94 that measures a movement amount
of the actuator 92. The actuator 92 is driven by pressure of a
working fluid or electricity. The encoder 94 may be formed using a
linear encoder, a rotary encoder, or the like.
[0091] In the control section 80, the target position holding
section 88 holds information indicating a position to be reached by
the transport arm 43. The servo control section 82 makes a
comparison between a target position acquired from the target
position holding section 88 and the movement amount of the actuator
92 received from the encoder 94, and supplies the actuator 92 with
drive power. In this way, the actuator 92 can ensure that the
transport arm 43 arrives at the target position.
[0092] In the control section 80, the acceleration calculating
section 84 also receives the movement amount of the actuator 92
from the encoder 94. The acceleration calculating section 84 can
calculate the acceleration caused by the transport arm 43 by
differentiating the information indicating the movement amount, for
example. The judging section 86 can judge whether there is the
possibility of misalignment between the wafers 11 in the block 27
transported by the transport arm 43 based on the acceleration of
the transport arm 43 received from the acceleration calculating
section 84.
[0093] If the judging section 86 detects that the acceleration
exerted on the block 27 by the transport arm 43 is greater than a
prescribed threshold value, the judging section 86 sets the target
position in the target position holding section 88 to be a region
other than the pressure applying and heating step executing section
47. In this way, the block 27 can be transported to a region where
examination, re-processing, disposal, or the like can be
performed.
[0094] The control section 80 described above can be further
provided with the acceleration sensor 64 described in the first
embodiment. In other words, the servo control section 82 can
control the transport arm drive section 90 to move the transport
apparatus 42 within a range of acceleration in which misalignment
does not occur between the wafers 11 of the block 27. It should be
noted that the transport apparatus 42 includes a plurality of
movable joints and the like, and so the acceleration of the
transport arm tip 60 does not necessarily match the acceleration
predicted by the servo control section 82.
[0095] Therefore, even if the servo control section 82 performs the
correct control, the acceleration of the transport arm tip 60 might
exceed the acceleration at which misalignment of the wafers 11
begins to occur. To solve this problem, the acceleration sensor 64
is provided to the transport arm tip 60 to detect the actual
acceleration of the transport arm tip 60.
[0096] In this case, even if the output of the acceleration
calculating section 84 is not above the threshold value, the
judging section 86 judges that there is possible misalignment when
the value detected by the acceleration sensor 64 is above the
threshold value. Furthermore, even when the output of the
acceleration calculating section 84 is above the threshold value,
the judging section 86 judges that there is no possible
misalignment when the value detected by the acceleration sensor 64
is not above the threshold value, so that the pressure applying and
heating step can be initiated. In this way, even if an abnormality,
including an abnormality in the transport, is detected, the pair of
wafer holders 21 may still be transported to the pressure applying
and heating step executing section 47 if there is judged to be no
possibility of misalignment. Therefore, the possibility of
misalignment can be more accurately judged.
[0097] FIG. 11 is a side view of the transport apparatus 42
according to the fifth embodiment when the block 27 is loaded
therein. Explanations of portions of the fifth embodiment common to
other embodiments are omitted. As shown in FIG. 11, the transport
apparatus 42 includes reference marks 96 on the top surface of the
lower support plate 61. Therefore, misalignment of the wafers 11
can be detected by detecting the relative positions of the
reference marks 96 on the lower support plate 61 and the reference
marks 25 of the wafer holders 21 loaded in the transport arm tip
60.
[0098] Detecting the relative positions of the reference marks 25
and 96 can be performed using a microscope 31, in the same manner
as described in the third embodiment for detecting the relative
positions of the reference marks 25 of the two wafer holders 21. In
other words, the misalignment of the block 27 caused by the
transport can be detected by measuring the relative positions of
the reference marks 25 and 96 both before the transport apparatus
42 begins transporting the block 27 and after the transportation.
In this way, the possibility of misalignment between the wafers 11
of the block 27 can be known.
[0099] The reference marks 96 provided to the transport arm tip 60
are not limited to mark patterns such as the alignment marks 23 of
the wafers 11 that can be detected by a microscope. Instead of the
microscope 31 detecting the reference marks 96, the reference marks
96 can be detected by a magnetic sensor, an electric field sensor,
am electrostatic capacitance sensor, an interferometer, or the like
using magnetism, electrodes, reflection, or the like. Furthermore,
using an image capturing apparatus instead of the microscope 31
enables detection of the relative positions based on an image of
the transport arm tip 60 itself.
[0100] As described above, a judgment is made concerning the
possibility of misalignment between two wafers 11 due to transport,
and if the judgment indicates the possibility of misalignment, an
operator is informed of this fact and the alignment is checked, for
example, prior to the process performed by the pressure applying
and heating step executing section 47, thereby preventing a drop in
the yield of layered 3-dimensional semiconductor apparatuses due to
misalignment. Furthermore, since blocks 27 having no possibility of
misalignment can continue to be processed, the throughput of the
semiconductor apparatus manufacturing apparatus is improved.
[0101] Therefore, by detecting the misalignment between wafers
caused by transport, the drop in yield due to bonding defects
between wafers in a manufactured semiconductor apparatus can be
prevented. The above description involves stacking semiconductor
apparatuses, but it is obvious that the same method and apparatus
can be used to bond substrates other than semiconductor
apparatuses.
[0102] While the embodiments of the present invention have been
described, the technical scope of the invention is not limited to
the above described embodiments. It is apparent to persons skilled
in the art that various alterations and improvements can be added
to the above-described embodiments. It is also apparent from the
scope of the claims that the embodiments added with such
alterations or improvements can be included in the technical scope
of the invention.
* * * * *