U.S. patent application number 13/864409 was filed with the patent office on 2013-10-17 for cooling device.
This patent application is currently assigned to Molex Incorporated. The applicant listed for this patent is MOLEX INCORPORATED. Invention is credited to Rinkou Fukunaga, Kousuke TAKETOMI.
Application Number | 20130269920 13/864409 |
Document ID | / |
Family ID | 49149480 |
Filed Date | 2013-10-17 |
United States Patent
Application |
20130269920 |
Kind Code |
A1 |
TAKETOMI; Kousuke ; et
al. |
October 17, 2013 |
COOLING DEVICE
Abstract
A heat-transferring member is mounted on one side of a circuit
board. A heat sink is arranged farther away from the circuit board
than the heat-transferring member in the thickness direction of the
circuit board. The heat sink has a plurality of fins each extending
in the direction of the circuit board and separated from each other
by a space. Also, the heat sink includes a support portion
extending in the direction of the plurality of fins and supporting
the plurality of fins. A plurality of heat pipes is connected to
the heat-transferring member and separated from each other by a
space, each extending in the thickness direction of the circuit
board and connecting to the support portion.
Inventors: |
TAKETOMI; Kousuke; (Yamato,
JP) ; Fukunaga; Rinkou; (Kagoshima, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MOLEX INCORPORATED |
Lisle |
IL |
US |
|
|
Assignee: |
Molex Incorporated
Lisle
IL
|
Family ID: |
49149480 |
Appl. No.: |
13/864409 |
Filed: |
April 17, 2013 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H05K 7/20418 20130101;
F28D 15/0275 20130101; F28F 3/02 20130101; F28D 2021/0028 20130101;
F28F 1/12 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 3/02 20060101
F28F003/02 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 17, 2012 |
JP |
2012-094163 |
Claims
1. A cooling device, the cooling device comprising: a
heat-transferring member, the heat-transferring member being
mounted on one side of a panel-shaped heat-generating body; a heat
sink, the heat sink being arranged farther away from the
heat-generating body than the heat-transferring member in the
thickness direction of the heat-generating body, the heat sink
including a plurality of fins and a support portion, each fin
extending in the direction of the heat-generating body and
separated from each other by a space, the support portion extending
in the direction of the fins and connecting to and supporting the
fins; and a plurality of heat-transferring columns, each
heat-transferring column being connected to the heat-transferring
member and separated from each other by a space, and extending in
the thickness direction of the heat-generating body and connecting
to the support portion.
2. The cooling device of claim 1, further comprising a plurality of
heat sinks
3. The cooling device of claim 2, wherein each heat sink is
arranged in the thickness direction of the heat-generating
body.
4. The cooling device of claim 3, wherein each heat sink has the
same shape.
5. The cooling device of claim 4, wherein each heat sink is offset
in the circumferential direction with respect to an adjacent heat
sink.
6. The cooling device of claim 5, wherein each heat sink is
centered on the centerline of the heat-generating body in the
thickness direction.
7. The cooling device of claim 6, wherein the support portion for
each heat sink includes a first extended portion extending in the
direction of the heat-generating body.
8. The cooling device of claim 7, wherein the support portion for
each heat sink further includes a second extended portion extending
in a direction intersecting the direction of extension of the first
extended portion.
9. The cooling device of claim 8, wherein a portion of the fins on
each heat sink projects from the first extended portion.
10. The cooling device of claim 9, wherein a portion of the fins on
each heat sink projects from the second extended portion.
11. The cooling device of claim 10, wherein the second extended
portion includes at least two extended portions arranged
symmetrically with respect to the centerline of the first extended
portion.
12. The cooling device of claim 11, wherein the plurality of each
heat-transferring columns comprises at least three
heat-transferring columns.
13. The cooling device of claim 12, wherein the support portion
comprises at least three connecting portions.
14. The cooling device of claim 13, wherein each connecting portion
is connected to one heat-transferring column and arranged at equal
intervals in the circumferential direction centered on the
centerline of the heat-generating body in the thickness
direction.
15. The cooling device of claim 14, wherein each heat sink includes
a first half body and a second half body.
16. The cooling device of claim 15, wherein both bodies including a
support portion and a plurality of fins and being arranged
symmetrically with respect to a straight line running along the
heat-generating body.
17. The cooling device of claim 16, wherein an air passage is
formed between the first half body and the second half body.
18. The cooling device of claim 17, wherein the air passage extends
radially from the centerline running through the heat-generating
body in the thickness direction.
19. The cooling device of claim 18, wherein the air passage is
linked to the outside of each heat sink.
20. The cooling device of claim 19, wherein the fins in the first
half body extend in the direction of the second half body, the fins
in the second half body extend in the direction of the first half
body, and the air passage is formed between the fins of the first
half body and the fins of the second half body.
Description
REFERENCE TO RELATED APPLICATIONS
[0001] The Present Disclosure claims priority to prior-filed
Japanese Patent Application No. 2012-094163, entitled "Cooling
Device," filed on 17 Apr. 2012 with the Japanese Patent Office. The
content of the aforementioned Patent Application is incorporated in
its entirety herein.
BACKGROUND OF THE PRESENT DISCLOSURE
[0002] The Present Disclosure relates, generally, to a cooling
device including a heat sink.
[0003] A cooling device has been disclosed in Japanese Patent
Application No. 2008-134115, which is used to radiate the heat of a
heat-generating body in an electronic device. In this cooling
device, a plurality of overlapping heat sinks (comb-shaped fins in
the '115 Application) are arranged, and these are connected by a
column-shaped base pin which transfers the heat.
[0004] In the '115 Application, a plurality of fins extend radially
from a single base pin in each heat sink. Because it is difficult
to increase the number of base pins using this structure, it is
difficult to improve the heat transfer efficiency from the
heat-generating body to the heat sinks
SUMMARY OF THE PRESENT DISCLOSURE
[0005] A purpose of the Present Disclosure is to provide a cooling
device able to improve the efficiency with which heat is
transferred from a heat-generating body to a heat sink.
[0006] In the cooling device of the Present Disclosure, a
heat-transferring member is mounted on one side of a panel-shaped
heat-generating body. A heat sink is arranged farther away from the
heat-generating body than the heat-transferring member in the
thickness direction of the heat-generating body. The heat sink
includes a plurality of fins extending in the direction of the
heat-generating body and separated from each other by a space, and
a support portion extending in the direction of the fins, and
connecting to and supporting the fins. A plurality of
heat-transferring columns is connected to the heat-transferring
member and separated from each other by a space, with the
heat-transferring columns each extending in the thickness direction
of the heat-generating body and connecting to the support portion.
In this way, the efficiency with which heat is transferred from a
heat-generating body to a heat sink can be improved.
[0007] In one aspect of the Present Disclosure, the cooling may
further comprise a plurality of heat sinks arranged in the
thickness direction of the heat-generating body with each
functioning as a heat sink. In this way, the cooling performance of
the cooling device can be improved.
[0008] In one aspect of the Present Disclosure, each of the
plurality of heat sinks may have the same shape. In this way, the
manufacturing productivity of the cooling device can be
improved.
[0009] In one aspect of the Present Disclosure, each of the
plurality of heat sinks may be offset in the circumferential
direction with respect to the adjacent heat sinks and centered on
the centerline of the heat-generating body in the thickness
direction. In this way, the air receiving heat from the
heat-generating body in each portion of the heat sinks may be
discharged more readily.
[0010] In one aspect of the Present Disclosure, the support portion
for each of the plurality of heat sinks may include a first
extended portion extending in the direction of the heat-generating
body and a second extended portion extending in a direction
intersecting the direction of extension of the first extended
portion. Also, each of the plurality of heat sinks may include, as
the plurality of fins, a plurality of fins projecting from the
first extended portion, and a plurality of fins projecting from the
second extended portion. In this way, the cooling performance of
the cooling device can be improved.
[0011] In one aspect of the Present Disclosure, the support portion
for each of the plurality of heat sinks may include, as the second
extended portion, at least two extended portions arranged
symmetrically with respect to the centerline of the first extended
portion. In this way, the cooling performance of the cooling device
can be improved.
[0012] In one aspect of the Present Disclosure, the plurality of
heat-transferring columns may include at least three
heat-transferring columns, the support portion may include at least
three connecting portions connected to at least three
heat-transferring columns, and at least three connecting portions
may be arranged at equal intervals in the circumferential direction
centered on the centerline of the heat-generating body in the
thickness direction. In a structure in which a plurality of heat
sinks are offset in the circumferential direction, each of the
heat-transferring columns can be connected to all of the heat
sinks
[0013] In one aspect of the Present Disclosure, each of the
plurality of heat sinks may include a first half body having a
support portion and a plurality of fins, and a second half body
having a support portion and a plurality of fins. Here, the first
half body and the second half body may be arranged symmetrically
with respect to a straight line running along the heat-generating
body. This allows the size of each heat sink to be increased. As a
result, the cooling performance of the cooling device can be
improved.
[0014] In one aspect of the Present Disclosure, an air passage may
be formed between the first half body and the second half body, and
the air passage may extend radially from the centerline running
through the heat-generating body in the thickness direction and be
connected to the outer side of the plurality of heat sinks. In this
way, the air can be sent through an air passage between the first
half body and the second half body, which further improves cooling
performance.
[0015] In one aspect of the Present Disclosure, the plurality of
fins in the first half body may extend in the direction of the
second half body, the plurality of fins in the second half body may
extend in the direction of the first half body, and the air passage
may be formed between the plurality of fins of the first half body
and the plurality of fins of the second half body. In this way, the
air can be sent to the fins through the air passage between the
first half body and the second half body, which further improves
cooling performance.
BRIEF DESCRIPTION OF THE FIGURES
[0016] The organization and manner of the structure and operation
of the Present Disclosure, together with further objects and
advantages thereof, may best be understood by reference to the
following Detailed Description, taken in connection with the
accompanying Figures, wherein like reference numerals identify like
elements, and in which:
[0017] FIG. 1 is a perspective view of the cooling device of the
Present Disclosure;
[0018] FIG. 2 is a perspective view of the cooling device of FIG.
1, where a section of the heat sink half body has been removed for
ease in viewability;
[0019] FIG. 3 is a side view of the lighting device containing the
cooling device of FIG. 1;
[0020] FIG. 4 is a top view of the heat sink constituting the
cooling device of FIG. 1;
[0021] FIG. 5 is a bottom view of the cooling device of FIG. 1;
[0022] FIG. 6 is a perspective view of a heat sink of the Present
Disclosure, in which a plurality of heat sinks are arranged in the
thickness direction of the circuit board; and
[0023] FIG. 7 is a top view of the heat sinks shown in FIG. 6.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0024] While the Present Disclosure may be susceptible to
embodiment in different forms, there is shown in the Figures, and
will be described herein in detail, specific embodiments, with the
understanding that the Present Disclosure is to be considered an
exemplification of the principles of the Present Disclosure, and is
not intended to limit the Present Disclosure to that as
illustrated.
[0025] As such, references to a feature or aspect are intended to
describe a feature or aspect of an example of the Present
Disclosure, not to imply that every embodiment thereof must have
the described feature or aspect. Furthermore, it should be noted
that the description illustrates a number of features. While
certain features have been combined together to illustrate
potential system designs, those features may also be used in other
combinations not expressly disclosed. Thus, the depicted
combinations are not intended to be limiting, unless otherwise
noted.
[0026] In the embodiments illustrated in the Figures,
representations of directions such as up, down, left, right, front
and rear, used for explaining the structure and movement of the
various elements of the Present Disclosure, are not absolute, but
relative. These representations are appropriate when the elements
are in the position shown in the Figures. If the description of the
position of the elements changes, however, these representations
are to be changed accordingly.
[0027] Referring to the Figures, and, specifically, as shown in
FIG. 5, the cooling device 1 has a heat-transferring member 20 in
the bottom portion. In this example, the heat-transferring member
20 has a plurality of heat-dissipating plates 21. In this example,
four heat-dissipating plates 21 are arranged on the same plane, and
together constitute a rectangular heat-transferring member 20. The
heat-dissipating plates of the heat-transferring member 20 do not
have to be divided into four heat-dissipating plates 21. The
heat-transferring member 20 may have any number of heat-dissipating
plates corresponding to the size of the four heat-dissipating
plates 21. The heat-dissipating plates 21 can be metal plates made
of a thermally conductive metal. Coolant passages may also be
formed so that coolant may circulate inside these containers.
[0028] The heat-transferring member 20 may be mounted on one side
of a panel-shaped heat-generating body such as an integrated
circuit, a printed circuit board on which integrated circuits have
been mounted, an IC chip, or an active/passive element. In the
example explained here and shown in FIG. 3, the heat-generating
body is a circuit board 90, and the heat-transferring member 20 is
mounted on one side of the circuit board 90. A plurality of
electronic components are mounted on the other side of the circuit
board 90. The cooling device 1 in this example is a device used in
a lighting device 100. Here, a plurality of Light Emitting Diodes
(LEDs) 91 are mounted on the circuit board 90. As shown in FIG. 5,
the LEDs 91 are arranged in a grid-like pattern and are positioned
in the central portion of the heat-transferring member 20. The heat
from the LEDs 91 is dissipated by the heat-dissipating plates 21 in
the entire heat-transferring member 20. In the lighting device 100
shown in FIG. 3, the light from the LEDs 91 is directed downward.
The electronic components are not limited to LEDs. For example, the
electronic components can be light-emitting bodies such as
incandescent lamps. Here, other components such as integrated
circuits may be mounted on the circuit board 90.
[0029] As shown in FIG. 3, the cooling device 1 has a heat sink 10.
The heat sink 10 is arranged so as to be farther away from the
circuit board 90 than the heat-transferring member 20 in the
thickness direction of the circuit board 90 (direction Z1-Z2 in the
Figure). In other words, the heat sink 10 is arranged on the other
side of the interposed heat-transferring member 20 from the circuit
board 90. In this example, the cooling device 1 has a plurality of
heat sinks 10. These heat sinks 10 are arranged away from the
heat-transferring member 20 in the thickness direction of the
circuit board 90. As a result, air can flow towards the heat sinks
10 through the space between the heat sinks 10 and the
heat-transferring member 20. As mentioned above, the cooling device
1 used in the lighting device 100 has the heat-transferring member
20 on the bottom end. As a result, the warm air inside the heat
sinks 10 is directed upwards.
[0030] As shown in FIG. 3, the cooling device 1 in this example has
four heat sinks 10. The four heat sinks 10 are arranged in the
thickness direction of the circuit board 90 (that is, in the
thickness direction of the heat-dissipating plates 21, or direction
Z1-Z2). The two adjacent heat sinks 10 make contact with each other
so that there is no space between the four heat sinks 10. Space may
also be formed between the four heat sinks 10. Moreover, the number
of heat sinks 10 is not limited to four.
[0031] As shown in FIGS. 1-2, each heat sink 10 has a support
portion 12 and a plurality of fins 13. The fins 13 in this example
are wall-like and are erected on a plane parallel to the circuit
board 90. Each fin 13 extends in the direction of the circuit board
90. In this example, each fin 13 extends linearly in a direction
parallel to the circuit board 90.
[0032] A space is formed between each of the plurality of fins 13,
and the support portion 12 extends in the arrangement direction of
the fins 13 and is connected to them. In this way, the plurality of
fins 13 are supported by the support portion 12. Like the fins 13,
the support portion 12 is wall-like and is erected on a plane
parallel to the circuit board 90. In other words, the support
portion 12 is wall-like and has vertical lines that are parallel to
the circuit board 90. Each of the fins 13 projects from the side
face of the support portion 12, and is formed orthogonally with
respect to the support portion 12.
[0033] As explained below and as shown in FIGS. 1-2, the support
portion 12 in this example has a portion extending in direction
X1-X2, which is orthogonal with respect to the thickness direction
of the circuit board 90 (direction Z1-Z2), and a portion extending
in direction Y1-Y2, which is orthogonal to direction Z1-Z2 and
direction X1-X2. For example, the support portion 12 of the
uppermost heat sink 10 has a first extended portion 12a extending
in direction X1-X2, and second extended portions 12b, 12c extending
in direction Y1-Y2. A plurality of fins 13 is formed in each of the
extended portions 12a-12c. Therefore, each heat sink 10 includes
fins 13 extending in direction X1-X2 and fins 13 extending in
direction Y1-Y2. The fins 13 are formed so that the entire heat
sink 10 has a circular shape. The shape of the heat sinks 10 is not
limited to a circular shape. They may also be rectangular. The four
heat sinks 10 have the same shape. As explained below, two adjacent
heat sinks 10 are arranged at a 90.degree. angle with respect to
each other in the circumferential direction with reference to the
centerline C1.
[0034] As shown in FIG. 2, the cooling device 1 has
heat-transferring columns for transferring heat. The cooling device
1 has a plurality of heat-transferring columns, and these are
arranged apart from each other. The heat-transferring columns in
the example explained here are heat pipes 31. The heat-transferring
columns do not have to be heat pipes. The heat-transferring columns
can be any column-shaped member made of a thermally conductive
material such as copper or aluminum.
[0035] As shown in FIG. 2, each heat pipe 31 is connected to the
heat-transferring member 20. In this example, the heat-transferring
member 20 has a plurality of sockets 22 each of which is attached
to a heat-dissipating plate 21. The heat pipes 31 are connected
thermally to the heat-dissipating plates 21 via these sockets 22.
More specifically, each socket 22 is a hole formed at a position
corresponding to a heat pipe 31. The end portion of each heat pipe
31 is inserted into a hole. The end portion of the heat pipe 31 is
mounted in the socket 22 using solder or an adhesive, or is
forcibly inserted. The sockets 22 are attached to heat-dissipating
plates 21 using, for example, screws. The sockets 22 may also be
attached to heat-dissipating plates 21 using solder or an
adhesive.
[0036] As shown in FIG. 2, the sockets 22 in this example are
frame-shaped with a hole 22a formed on the inside. Also, each
socket 22 has protruding portions 22b positioned away from each
other, and a hole is formed in each protruding portion 22b for the
insertion of a heat pipe 31. In other words, there is a recessed
portion between two protruding portions 22b for the mounting of two
heat pipes 31. I n this way, air can flow to the heat sinks 10 via
the recess between the two protruding portions 22b. In this
example, the sockets 22 are rectangular, and sized in accordance
with the heat-dissipating plates 21. Protruding portions 22b are
formed on the four sides of the sockets 22. The sockets 22 may also
be integrally molded with the heat-dissipating plates 21.
[0037] As shown in FIG. 2, each heat pipe 31 extends in the
thickness direction of the circuit board 90 and is connected to the
support portion 12 for four heat sinks 10. In other words, each
heat pipe 31 is connected to the support portion 12 for four heat
sinks 10. In this way, heat from the LEDs 91 is transmitted to the
support portion 12 via the heat-dissipating plates 21, the sockets
22, and the heat pipes 31. In other words, the heat from the LEDs
91 is distributed to four heat sinks 10. The heat is then
transferred to the fins 13 via the support portion 12.
[0038] In this example, as shown in FIG. 4, a connecting hole H is
formed in the support portion 12 through each heat sink 10 in the
thickness direction of the circuit board 90, and a heat pipe 31 is
passed through each connecting hole H. In FIG. 4, numbers 1-4 are
appended to H denoting connecting holes. Here H1 through H4 are
used to indicate specific connecting holes. In other situations,
the connecting holes are denoted simply by the letter H. The heat
pipes 31 are fixed to the support portion 12 using solder, an
adhesive, or forcible insertion. The heat pipes 31 are tube-shaped
members that are closed at both ends to seal a coolant inside. In
this example, the heat pipes 31 are linear. These are easier to
manufacture and cost less than bent heat pipes.
[0039] As shown in FIG. 4, each heat sink 10 includes two separate
heat sink half bodies 11. These heat sink half bodies 11 are
referred to below as heat sink half bodies. Each heat sink half
body 11 has the support bodies 12 and fins 13 described above. Two
heat sink half bodies 11 constituting a single heat sink 10 are
arranged on the same plane. In other words, the two heat sink half
bodies 11 are positioned at the same distance from the
heat-transferring member 20. An air passage S is formed between the
two heat sink half bodies 11 which extends in the direction of the
plane on which the half portions are arranged (in the direction of
the circuit board 90) and is linked to the outside of the heat
sinks 10. In other words, a space is formed between the two heat
sink half bodies 11, and this space functions as the air passage S.
In this way, air F can be sent into heat sink 10 via the air
passage S.
[0040] In this example, the heat sinks 10 are divided into two heat
sink half bodies 11. In other words, as shown in FIG. 4, the two
heat sink half bodies 11 are not linked. As a result, both ends of
the two air passages S are open to the outside of the heat sink 10.
In this way, air can be efficiently sent to the various portions of
the heat sink 10. Also, the air passages S travel along the
centerline C1 of the heat sink 10 extending in the thickness
direction of the circuit board 90. As a result, air can be sent to
the portions of the heat sink 10 near the centerline C1.
[0041] In this example, the eight heat sink half bodies 11
constituting the four heat sinks 10 have the same shape. This
improves the manufacturing productivity of the heat sinks 10.
Because the two heat sink half bodies 11 constituting a single heat
sink 10 are divided, the heat sink 10 is easy to manufacture even
when the heat sink is large. The two heat sink half bodies 11
constituting a single heat sink 10 are arranged symmetrically along
the centerline C1 and a line orthogonal to the centerline C1. Each
heat sink half body 11 is an integrally molded member. The heat
sink half bodies 11 can be extrusion molded or cast in the
thickness direction of the circuit board 90.
[0042] The four heat sinks 10 are offset in the circumferential
direction with respect to adjacent heat sinks 10 and are centered
on the centerline C1. In this example, as shown in FIGS. 1-2, two
adjacent heat sinks 10 are arranged at 90.degree. angles to each
other in the circumferential direction with respect to the
centerline C1. As a result, the air flowing upward from the
heat-transferring member 20 is easily distributed to each portion
of the fins 13, and the cooling performance can be improved. In
this example, an air passage S is formed between the two heat sink
half bodies 11 constituting a single heat sink 10. Because the two
adjacent heat sinks 10 are offset in the circumferential direction,
the air passages S do not overlap in the thickness direction of the
circuit board 90. As a result, the air flowing into an air passage
S is also supplied to the fins 13 of the adjacent heat sink 10, and
the fins 13 can be cooled more efficiently. The offset angle of the
heat sinks 10 is not limited to 90.degree.. For example, the offset
angle can be 45.degree. or 120.degree. as described below. The
angle can be altered based on the structure of the heat sink half
bodies 11.
[0043] As mentioned above, a plurality of connecting holes H are
formed in the heat sinks 10 for insertion of heat pipes 31. As
shown in FIG. 4, the positions of the connection holes H are laid
out so as to be rotationally symmetrical to the centerline C1. In
other words, the connecting holes H are positioned along a circle
centered on the centerline C1 at the offset angle of the two
adjacent heat sinks 10 (90.degree. in this example). In this way,
the four heat sinks 10 can have the same shape, and each heat pipe
31 can be connected to the four heat sinks 10. In this example and
as shown in FIG. 4, the four connecting holes H1 are arranged on
circle Cr1 at 90.degree. intervals. Another four connecting holes
H2 are arranged on circle Cr1 at 90.degree. intervals. Connecting
holes H3 and H4 are arranged on circle C2 which has a larger
diameter than circle Cr1 which includes connecting holes H1 and H2.
Four connecting holes H3 are arranged at 90.degree. intervals, and
four connecting holes H4 are arranged at 90.degree. intervals. The
support portion 12 is formed so as to pass through the positions of
connecting holes H1-H4 (the positions of the heat pipes 31). The
heat sink half bodies 11 can be arranged at the desired angle,
which is a multiple of 90.degree., in accordance with the layout of
the connecting holes H1-H4.
[0044] As shown in FIG. 1, the support portion 12 includes a first
extended portion 12a. As mentioned above, in this example, two
adjacent heat sinks 10 are arranged at a 90.degree. angle with
respect to each other in the circumferential direction from the
centerline C1. As a result, the first extended portion 12a in one
heat sink 10 of the two heat sinks 10 extends in the X1-X2
direction, and the first extended portion 12a of the other heat
sink 10 extends in the Y1-Y2 direction (see FIG. 2). The first
extended portion 12a is a slender wall-shaped member erected on a
plane parallel to the circuit board 90, and a line orthogonal to
the extended portion is parallel to the circuit board 90.
[0045] As explained above, a single heat sink 10 has two heat sink
half bodies 11. As shown in FIG. 4, the first extended portions 12a
face each other with the centerline C1 interposed between them. A
plurality of fins 13 arranged in the extension direction of the
first extended portion 12a are formed on both side surfaces of the
first extended portion 12a. The plurality of fins 13 extend from
the first extended portion 12a towards the heat sink half body 11
on the opposite side (the fins denoted by 13-1 in FIGS. 1 and 4).
The air passage S described above is formed between the fins 13-1
on one heat sink half body 11 and the fins 13-1 on the other heat
sink half body 11. In this structure, the fins 13-1 can be cooled
efficiently by air flowing through the air passage S.
[0046] Also, the support portion 12 has extended portions
intersecting the first extended portion 12a, and fins 13 are formed
on these two extended portions. In this example, as shown in FIG.
4, the support portion 12 has a second extended portion 12b
intersecting the first extended portion 12a, and a third extended
portion 12c intersecting the first extended portion 12a. In this
example, the second extended portion 12b and the third extended
portion 12c are orthogonal to the first extended portion 12a.
[0047] As mentioned above, two adjacent heat sinks 10 are arranged
at a 90.degree. angle with respect to each other. Therefore, the
second extended portion 12b and the third extended portion 12c on
one heat sink 10 of the two adjacent heat sinks 10 extend in
direction X1-X2, and the second extended portion 12b and the third
extended portion 12c on the other heat sink 10 extend in direction
Y1-Y2 (see FIG. 2).
[0048] As shown in FIGS. 1-2, the second extended portion 12b
extends in the opposite direction from the first extended portion
12a. In other words, the second extended portion 12b includes a
portion extending towards the air passage S, and a portion
extending in the opposite direction. Similarly, the third extended
portion 12c extends in the opposite direction from the first
extended portion 12a. In other words, the third extended portion
12c includes a portion extending towards the air passage S, and a
portion extending in the opposite direction.
[0049] The support portion 12 in this example has two second
extended portions 12b and two third extended portions 12c. The two
second extended portions 12b are formed symmetrically with respect
to the center of the first extended portion 12a. Similarly, the two
third extended portions 12c are formed symmetrically with respect
to the center of the first extended portion 12a. The two third
extended portions 12c are formed at the two ends of the first
extended portion 12a.
[0050] As shown in FIGS. 1-2, the second extended portions 12b and
the third extended portions 12c, like the first extended portion
12a, are slender wall-like members which are erected on a plane
parallel to the circuit board 90. A plurality of fins 13 extend
from the side surface of a second extended portion 12b and are
arranged in the direction of extension. The fins 13 on the second
extended portion 12b extend opposite the fins 13 on the first
extended portion 12a. In a third extended portion 12c, a plurality
of fins 13 extend from the side surface of the third extended
portion 12c and are arranged in the direction of extension. The
fins 13 on the third extended portion 12c extend opposite the fins
13 on the second extended portion 12b.
[0051] As shown in FIG. 4, the second extended portions 12b on the
two heat sink half bodies 11 are not linked to each other. Instead,
an air passage S is formed between them. The third extended
portions 12c on the two heat sink half bodies 11 are also not
connected to each other. Here, too, an air passage S is formed
between them. In this way, air can smoothly pass between the fins
13-1 formed on the first extended portion 12a and the fins 13
formed on the second extended portion 12b.
[0052] As shown in FIG. 4, two connecting holes H are formed some
distance from each other in the first extended portion 12a. Two
connecting holes H are also formed in the second extended portion
12b, and these are arranged opposite those in the first extended
portion 12a with the first extended portion 12a interposed in
between. In addition, connecting holes H are formed in the third
extended portion 12c. In this way, connecting holes H are
distributed throughout the support portion 12. In this way, the
cooling function of the heat sink 10 does not depend as much on the
heat pipes 31.
[0053] As mentioned above, the heat-transferring member 20 includes
four heat-dissipating plates 21. In this example, the four
heat-dissipating plates 21 are arranged in two rows and two columns
(see FIG. 5). As shown in FIG. 1, a plurality of heat pipes 31
(eight in this example) connected to two adjacent heat-dissipating
plates 21 are fixed to a single heat sink half body 11. In other
words, eight heat pipes 31 pass through eight connecting holes H in
each heat sink half body 11. In this way, two adjacent
heat-dissipating plates 21 can be connected via a heat sink half
body 11. Also, as mentioned above, two adjacent heat sinks 10 are
arranged at a 90.degree. angle with respect to each other in the
circumferential direction with reference to the centerline C1. As a
result, four heat-dissipating plates 21 are connected via a heat
sink 10.
[0054] The cooling device 1 can be assembled in the following
manner. First, the end portions of heat pipes 31 are fixed to four
heat-transferring members 20. In other words, the end portions of
the heat pipes 31 are inserted into holes formed in the sockets 22
of the heat-transferring members 20. The ends of the heat pipes 31
are fixed to the sockets 22 using soldering, an adhesive, or forced
insertion. Four heat-transferring members 20 are arranged in two
rows and two columns. Afterwards, the plurality of heat pipes 31
are inserted into the plurality of connecting holes H in the first
heat sink 10. The heat sink 10 is then soldered or bonded to the
heat pipes 31. Next, the second heat sink 10 is rotated 90.degree.
with respect to the first heat sink 10, and inserted into the
plurality of heat pipes 31. The second heat sink 10 is then fixed
to the heat pipes 31. The third heat sink 10 and the fourth heat
sink 10 are inserted into the heat pipes 31 in the same manner.
[0055] As explained above, the cooling device 1 has a
heat-transferring member 20 mounted on one side of a circuit board
90, a panel-shaped heat-generating body, and has a heat sink 10
arranged closer to the heat-transferring member 20 than the circuit
board 90 in the thickness direction of the circuit board 90. The
heat sink 10 has a plurality of fins 13 extending in the direction
of the circuit board 90 with space formed between them. Also, the
heat sink 10 includes a support portion 12 which extends in the
arrangement direction of the fins 13, and which connects to and
supports the plurality of fins 13. The cooling device 1 has a
plurality of heat pipes 31 arranged at some distance from each
other and connected to a heat-transferring member 20. Each heat
pipe 13 extends in the thickness direction of the circuit board 90
and is connected to the support portion 12. In this way, heat can
be transferred efficiently to the heat sink 10.
[0056] FIGS. 6-7 illustrate a modified example of heat sinks The
three heat sinks 110 shown in FIG. 6 are arranged opposite the
circuit board with the heat-transferring member 20 interposed
between them. These are arranged in the thickness direction of the
circuit board (direction Z in FIG. 6). As shown in FIG. 7, each
heat sink 110 has a plurality of fins 13 extending in the direction
of the circuit board with space formed between them. Also, each
heat sink 110 has a support portion 112 extending in the
arrangement direction of the plurality of fins 13 and connected to
them. Each heat sink 10 is composed of two half bodies (referred to
as heat sink half portions A below), and each of the heat sink half
portions A includes a support portion 112 and a plurality of fins
13. Two support portions 112 extend from their shared end portion
and an acute angle (specifically, a 60.degree. angle) is formed
between them. The heat sink half portions A include a plurality of
fins 113 extending towards the inside of the two support portions
112, and a plurality of fins 113 extending towards the outside of
the two support portions 112. The fins 13 give the heat sink 110 a
circular-shape overall. The two heat sink half portions A are
connected by the shared end portion of the support portions
112.
[0057] A plurality of connecting holes H are formed in the two
support portions 112 (three in this example). As in the cooling
device 1, a heat-transferring column (for example, a heat pipe) is
passed through each connecting hole H. In this way, the support
portions 112 of the three heat sinks 110 are connected by a
plurality of heat-transferring columns.
[0058] As shown in FIG. 7, an air passage S is formed between two
heat sink half portions A which extends in the thickness direction
of the circuit board and is linked to the outside of the heat sink
110. In this way, air can be sent to both heat sink half portions A
via the air passage S. In this example, an air passage S is formed
between fins 113 extending inward from one support portion 112 and
fins 113 extending inward from another support portion 112. In this
way, air can be sent to the fins 113.
[0059] As shown in FIG. 6, three heat sinks 110 are arranged so
that two adjacent heat sinks 110 are offset in the circumferential
direction with respect to the centerline C2. In this example, the
two adjacent heat sinks 110 are offset 120.degree. in the
circumferential direction with respect to the centerline C2. As a
result, the air passages S of two adjacent heat sinks 110 do not
overlap in the thickness direction of the circuit board.
[0060] As mentioned above, a plurality of connecting holes H are
formed in the support portion 112 for the insertion of heat pipes.
As shown in FIG. 7, the positions of the connecting holes H are
rotationally symmetrical with respect to the centerline C2. In
other words, the connecting holes H are arranged on a circle
centered on centerline C2 at the offset angle of two adjacent heat
sinks 110 (120.degree. in this example). Here, the three heat sinks
110 have the same shape, and each heat pipe is connected to the
three heat sinks 110. In this example, connecting holes H are
formed in the shared end of two support portions 112. Connecting
holes H are also formed at the same positions on the opposite side
of the support portions 112. In this way, three connecting holes H
are positioned at the vertices of an equilateral triangle. This
concludes the explanation of the heat sinks 110.
[0061] In the cooling device 1, the heat sink half bodies 11 of the
heat sinks 10 all have the same shape. However, the heat sink half
bodes 11 do not have to have the same shape. For example, the two
heat sink half bodies constituting a single heat sink 10 can have
different shapes.
[0062] While a preferred embodiment of the Present Disclosure is
shown and described, it is envisioned that those skilled in the art
may devise various modifications without departing from the spirit
and scope of the foregoing Description and the appended Claims.
* * * * *