U.S. patent application number 13/803892 was filed with the patent office on 2013-10-10 for composite prosthetic devices.
This patent application is currently assigned to ZEUS INDUSTRIAL PRODUCTS, INC.. The applicant listed for this patent is ZEUS INDUSTRIAL PRODUCTS, INC.. Invention is credited to Bruce L. Anneaux, Robert L. Ballard, Joshua Manasco, Sabrina D. Puckett.
Application Number | 20130268062 13/803892 |
Document ID | / |
Family ID | 49292939 |
Filed Date | 2013-10-10 |
United States Patent
Application |
20130268062 |
Kind Code |
A1 |
Puckett; Sabrina D. ; et
al. |
October 10, 2013 |
COMPOSITE PROSTHETIC DEVICES
Abstract
The present disclosure provides composite prosthetic devices
comprising two or more layers of electrospun polymers and methods
of preparation thereof. In some embodiments, the two or more layers
can be porous and in other embodiments, one or more components is
nonporous. The composite prosthetic devices can comprise various
materials and the properties of the prosthetic devices can be
tailored for use in a range of different applications.
Inventors: |
Puckett; Sabrina D.;
(Lexington, SC) ; Manasco; Joshua; (West Columbia,
SC) ; Ballard; Robert L.; (Orangeburg, SC) ;
Anneaux; Bruce L.; (Lexington, SC) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ZEUS INDUSTRIAL PRODUCTS, INC. |
Orangeburg |
SC |
US |
|
|
Assignee: |
ZEUS INDUSTRIAL PRODUCTS,
INC.
Orangeburg
SC
|
Family ID: |
49292939 |
Appl. No.: |
13/803892 |
Filed: |
March 14, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61620633 |
Apr 5, 2012 |
|
|
|
61724731 |
Nov 9, 2012 |
|
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Current U.S.
Class: |
623/1.44 ;
156/190 |
Current CPC
Class: |
D01D 10/02 20130101;
D04H 1/728 20130101; D01F 6/12 20130101; A61L 31/10 20130101; D01D
5/003 20130101; A61L 31/10 20130101; A61F 2/0077 20130101; A61F
2002/0086 20130101; C08L 83/04 20130101; C08L 75/04 20130101; A61L
31/146 20130101; A61F 2/07 20130101; A61L 31/10 20130101; C08L
27/18 20130101; A61L 2400/12 20130101; A61F 2002/072 20130101; D10B
2321/042 20130101; A61F 2/06 20130101; A61L 2420/08 20130101; A61F
2/86 20130101; A61L 31/10 20130101; D10B 2509/06 20130101 |
Class at
Publication: |
623/1.44 ;
156/190 |
International
Class: |
A61F 2/06 20060101
A61F002/06; A61F 2/86 20060101 A61F002/86 |
Claims
1. A multi-layered tubular composite prosthetic device comprising
at least one porous layer comprising electrospun
poly(tetrafluoroethylene) and at least one porous layer comprising
a second electrospun polymer.
2. The composite prosthetic device of claim 1, wherein the second
electrospun polymer comprises a solution-electrospun polymer.
3. The composite prosthetic device of claim 1, wherein the second
electrospun polymer comprises a thermoplastic polymer or a
thermoset polymer.
4. The composite prosthetic device of claim 1, wherein the second
electrospun polymer layer comprises a polyurethane or a
silicone.
5. The composite prosthetic device of claim 1, wherein the second
electrospun polymer is selected from the group consisting of
polyether block amide, a polyamide, ultra-high molecular weight
polyethylene, a polyester, fluorinated ethylene propylene,
polyvinylidene fluoride, perfluoroalkoxy, a
tetrafluoroethylene/hexafluoropropylene/vinylidene fluoride
copolymer, poly(ethylene-co-tetrafluoroethylene), ethylene
chlorotrifluoroethylene, polychlorotrifluoroethylene, and
copolymers, blends, and derivatives thereof.
6. The composite prosthetic device of claim 1, wherein the second
electrospun polymer comprises poly(tetrafluoroethylene).
7. The composite prosthetic device of claim 1, wherein the porous
layer comprising a second electrospun polymer penetrates the pores
of the porous layer comprising electrospun
poly(tetrafluoroethylene).
8. The composite prosthetic device of claim 1, further comprising a
structural frame.
9. The composite prosthetic device of claim 8, wherein the
structural frame comprises a stent.
10. The composite prosthetic device of claim 8, wherein the
structural frame comprises open spaces through which the second
electrospun polymer penetrates.
11. The composite prosthetic device of claim 1, wherein the device
comprises at least two porous layers comprising electrospun
poly(tetrafluoroethylene).
12. The composite prosthetic device of claim 1, wherein the device
comprises at least two porous layers comprising a second
electrospun polymer.
13. The composite prosthetic device of claim 1, wherein at least
one of the inner diameter and the outer diameter of the tubular
device comprises a porous layer comprising electrospun
poly(tetrafluoroethylene).
14. The composite prosthetic device of claim 1, wherein the device
further comprises a non-porous polymeric layer.
15. The composite prosthetic device of claim 1, wherein the
cross-section of the device comprises: a lumen surrounded by a
first porous layer comprising electrospun poly(tetrafluoroethylene)
on the device inner diameter surface; a structural frame embedded
in the porous layer comprising electrospun
poly(tetrafluoroethylene); a second porous layer comprising electro
spun poly(tetrafluoroethylene) on the device outer diameter
surface; and a third layer between said first and second layers,
comprising a different electrospun polymer.
16. The composite prosthetic device of claim 1, wherein the
cross-section of the device comprises: a lumen surrounded by a
first porous layer comprising electrospun poly(tetrafluoroethylene)
on the inner diameter surface; a structural frame embedded in the
porous layer comprising electrospun poly(tetrafluoroethylene); a
second porous layer comprising electrospun
poly(tetrafluoroethylene) on the device outer diameter surface; and
at least two alternating layers of electrospun
poly(tetrafluoroethylene) and a different electrospun polymer,
between said first and second layers.
17. The composite prosthetic device of claim 1, wherein the
cross-section of the device comprises: a lumen surrounded by a
first porous layer comprising electrospun poly(tetrafluoroethylene)
on the device inner diameter surface; a structural frame embedded
in the porous layer comprising electrospun
poly(tetrafluoroethylene); and a second porous layer comprising a
second electrospun polymer on the device outer diameter
surface.
18. The composite prosthetic device of claim 1, wherein the
cross-section of the device comprises: a lumen surrounded by a
first porous layer comprising electrospun poly(tetrafluoroethylene)
on the device inner diameter surface; a structural frame situated
around and adjacent to said first porous layer; a second porous
layer comprising electrospun poly(ethylene terephthalate) on the
device outer diameter surface; and a third layer between said
structural frame and said second layer comprising a different
electrospun polymer, wherein the structural frame comprises open
spaces through which the different electrospun polymer
penetrates.
19. The composite prosthetic device of claim 1, wherein the
cross-section of the device comprises: a lumen surrounded by a
first porous layer comprising electrospun poly(tetrafluoroethylene)
on the device inner diameter surface; a structural frame situated
around and adjacent to said first porous layer; a second porous
layer comprising electrospun poly(tetrafluoroethylene) on the
device outer diameter surface; and at least two alternating layers
of electrospun poly(tetrafluoroethylene) and a different
electrospun polymer between said first and second layers, wherein a
layer comprising the different electrospun polymer is adjacent to
the structural frame and the structural frame comprises open spaces
through which the different electrospun polymer penetrates.
20. The composite prosthetic device of claim 1, wherein the
cross-section of the device comprises: a lumen surrounded by a
first porous layer comprising electrospun poly(tetrafluoroethylene)
on the device inner diameter surface; a second porous layer
comprising electrospun poly(tetrafluoroethylene) on the device
outer diameter surface; and a third layer between said first and
second layers, comprising a different electrospun polymer, wherein
a structural frame is embedded in the third layer.
21. A method for producing a composite prosthetic device
comprising: combining at least one porous layer comprising
electrospun poly(tetrafluoroethylene) and at least one porous layer
comprising a second electrospun polymer to give a composite
prosthetic device precursor; and applying pressure, heat, or both
pressure and heat to the composite prosthetic device precursor to
provide a composite prosthetic device.
22. The method of claim 21, further comprising placing a structural
frame around the porous layer comprising electrospun
poly(tetrafluoroethylene).
23. The method of claim 22, wherein the structural frame is a
stent.
24. The method of claim 22, wherein the structural frame comprises
open spaces through which the second electrospun polymer
penetrates.
25. The method of claim 21, wherein the combining comprises
wrapping the porous layer comprising a second electrospun polymer
around the porous layer comprising electrospun
poly(tetrafluoroethylene).
26. The method of claim 21, wherein the combining comprises
electrospinning the porous layer comprising a second electrospun
polymer onto the porous layer comprising electrospun
poly(tetrafluoroethylene).
27. The method of claim 21, wherein the second electrospun polymer
comprises a solution-electrospun polymer.
28. The method of claim 21, wherein the second electrospun polymer
comprises a thermoplastic polymer or a thermoset polymer.
29. The method of claim 21, wherein the second electrospun polymer
layer comprises a polyurethane or a silicone.
30. The method of claim 21, wherein the second electrospun polymer
is selected from the group consisting of polyether block amide, a
polyamide, ultra-high molecular weight polyethylene, a polyester,
fluorinated ethylene propylene, polyvinylidene fluoride,
perfluoroalkoxy, tetrafluoroethylene/hexafluoropropylene/vinylidene
fluoride copolymer, poly(ethylene-co-tetrafluoroethylene), ethylene
chlorotrifluoroethylene, polychlorotrifluoroethylene, and
copolymers, blends, and derivatives thereof.
31. The method of claim 21, wherein the second electrospun polymer
comprises unsintered poly(tetrafluoroethylene) and the method
further comprising sintering the composite prosthetic device
following the applying step.
32. The method of claim 21, wherein the applying step comprises
applying pressure, heat, or both pressure and heat for a time
sufficient to result in the penetration of the second electrospun
polymer into the pores of the at least one porous layer comprising
electrospun poly(tetrafluoroethylene).
33. The method of claim 21, wherein both pressure and heat are
applied, sequentially or simultaneously.
34. The method of claim 21, wherein the pressure is between about
500 and about 1500 PSI and the temperature is between about
100.degree. C. and about 400.degree. C.
35. The method of claim 21, wherein the applying step is conducted
in a pressure vessel.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims priority to U.S. provisional
patent application No. 61/620,633, filed Apr. 5, 2012 and U.S.
provisional patent application No. 61/724,731, filed Nov. 9, 2012,
which are both incorporated herein by reference in their
entireties.
FIELD OF THE INVENTION
[0002] The invention is generally related to prosthetic devices and
to methods of making and using such prosthetic devices.
BACKGROUND
[0003] The successful use of extruded tubes of expanded
polytetrafluoroethylene (ePTFE) as synthetic implantable vascular
prostheses or tubular grafts is well known and documented. ePTFE,
which has been validated through numerous clinical studies, is
particularly suited for this purpose as it exhibits superior
bio-compatibility and can be mechanically manipulated to form a
well-defined porous microstructure known to promote
endothelialization. Further, ePTFE has been proven to exhibit a low
thrombogenic response in vascular applications. When seeded or
infused with an active agent, the microporous structure of ePTFE,
comprising nodes and fibrils, controls natural tissue ingrowth and
cell endothelialization when implanted in the vascular system. This
ability contributes to patency of the tubular graft and long term
healing.
[0004] In U.S. Pat. No. 6,436,135 to Goldfarb, the microstructure
of a synthetic vascular prostheses formed of ePTFE is defined by
irregularly spaced nodes interconnected by elongated fibrils. The
methods by which these types of structures are produced have been
known for more than three decades. In such a structure, the
distance between the node surfaces spanned by the fibrils is
defined as the inter-nodal distance (IND).
[0005] An ePTFE-based vascular prosthesis having a specific IND
range can be developed with a given porosity and/or pore size range
to enhance tissue ingrowth and cell endothelialization along the
inner and outer surface of the prosthesis. The IND range is
generally small enough to prevent transmural blood flow and
thrombosis but is generally not less than the maximum dimension of
the average red blood cell (e.g., between about 6 and 8 .mu.m).
Vascular prostheses based on ePTFE are thus inherently porous. The
porosity of an ePTFE vascular prosthesis is controlled by the
mechanical formation of the IND and/or the microporous structure of
the tube.
[0006] One exemplary vascular prosthesis is a stent, which is a
medical device commonly used to restore and maintain body passages,
such as blood vessels. Often, biocompatible materials can be
provided on the inner and/or outer surfaces of the stent to reduce
reactions associated with contact between the stent and the body.
However, it is difficult with conventional devices to manipulate
certain properties such as mechanical properties, cellular
proliferation, cellular permeability, fluid permeability, adhesion
to a structural frame, and/or incorporation of one or more active
therapeutic components. Although coverings can sometimes be used to
alter the properties of devices, stents generally have complex
geometries that cannot be readily covered with covering materials
such as ePTFE. Thus, a need exists for materials and processes that
address these concerns. Specifically, it would be beneficial to
provide methods of providing implantable prosthetic devices,
including stents, with properties that can be tailored for various
purposes.
SUMMARY OF THE INVENTION
[0007] In accordance with certain embodiments of the present
disclosure, composite prosthetic devices comprising one or more
porous layers of electrospun polymeric materials are provided. Such
porous layers can be, for example, on the inner diameter surface of
a tubular prosthetic device, on the outer diameter surface of a
tubular prosthetic device, or on both the inner diameter surface
and outer diameter surfaces of a tubular prosthetic device.
Composite devices can be provided having 2 layers, 3 layers, 4
layers, 5 layers, or more. In certain embodiments, a structural
frame (e.g., a stent or other device) can be incorporated within
the structure. At least one layer within the composite prosthetic
device can, in some embodiments, comprise electrospun
poly(tetrafluoroethylene) (PTFE). Advantageously, in certain
embodiments, the composite prosthetic device exhibits some degree
of porosity.
[0008] In one aspect of the disclosure is provided a multi-layered
tubular composite prosthetic device comprising at least one porous
layer comprising electrospun poly(tetrafluoroethylene) and at least
one porous layer comprising a second electrospun polymer. The
makeup of the second electrospun polymer can be, for example, a
solution-electrospun polymer (e.g., a thermoplastic polymer or a
thermoset polymer, such as polyurethane, a silicone (e.g., PDMS),
polyether block amide (PEBA), a polyamide, ultra-high molecular
weight polyethylene (UHMWPE), a polyester, fluorinated ethylene
propylene (FEP), polyvinylidene fluoride (PVDF), perfluoroalkoxy
(PFA), a tetrafluoroethylene/hexafluoropropylene/vinylidene
fluoride copolymer (THV), poly(ethylene-co-tetrafluoroethylene)
(ETFE), ethylene chlorotrifluoroethylene (ECTFE), PCTFE
(polychlorotrifluoroethylene), or a copolymer, blend, or
derivatives thereof). In other embodiments, the second electrospun
polymer can be a dispersion-electrospun polymer, e.g.,
poly(tetrafluoroethylene). Advantageously, in some embodiments, the
porous layer comprising a second electrospun polymer penetrates the
pores of the porous layer comprising electrospun
poly(tetrafluoroethylene).
[0009] Although the second electrospun polymer as described herein
typically exhibits some degree of porosity, for certain
applications, it may be desirable to provide one or more non-porous
layers. Such non-porous layers may in some embodiments, be prepared
by electrospinning or by other methods as described herein.
Accordingly, in certain embodiments of the application are provided
a multi-layered tubular composite prosthetic device comprising at
least one porous layer comprising electrospun
poly(tetrafluoroethylene) and at least one non-porous layer
comprising a second electrospun polymer. The preparation and use of
non-porous as well as porous electrospun polymers will be described
more thoroughly herein.
[0010] In certain embodiments, the composite prosthetic devices
described herein can further comprise a structural frame (e.g., a
stent). Preferably, such structural frames can comprise open spaces
and, in some embodiments, the second electrospun polymer can
penetrate through the open spaces of the structural frame.
[0011] The number of layers of the devices described herein can
vary. In some embodiments, a device is provided which comprises at
least two porous layers comprising electrospun
poly(tetrafluoroethylene). In some embodiments, a device is
provided which comprises at least two porous layers comprising the
second electrospun polymer. In certain embodiments, at least one of
the inner diameter and the outer diameter of the tubular device
comprises a porous layer comprising electrospun
poly(tetrafluoroethylene). In certain embodiments, the device can
further comprise a non-porous polymeric layer.
[0012] Certain specific embodiments are described as follows. In
one embodiment is provided a tubular composite prosthetic device,
wherein the cross-section of the device comprises: a lumen
surrounded by a first porous layer comprising electrospun
poly(tetrafluoroethylene) on the device inner diameter surface; a
structural frame embedded in the porous layer comprising
electrospun poly(tetrafluoroethylene); a second porous layer
comprising electrospun poly(tetrafluoroethylene) on the device
outer diameter surface; and a third layer between said first and
second layers, comprising a different electrospun polymer.
[0013] In one embodiment is provided a tubular composite prosthetic
device, wherein the cross-section of the device comprises: a lumen
surrounded by a first porous layer comprising electrospun
poly(tetrafluoroethylene) on the inner diameter surface; a
structural frame embedded in the porous layer comprising
electrospun poly(tetrafluoroethylene); a second porous layer
comprising electrospun poly(tetrafluoroethylene) on the device
outer diameter surface; and at least two alternating layers of
electrospun poly(tetrafluoroethylene) and a different electrospun
polymer, between said first and second layers.
[0014] In another embodiment is provided a tubular composite
prosthetic device, wherein the cross-section of the device
comprises: a lumen surrounded by a first porous layer comprising
electrospun poly(tetrafluoroethylene) on the device inner diameter
surface; a structural frame embedded in the porous layer comprising
electrospun poly(tetrafluoroethylene); and a second porous layer
comprising a second electrospun polymer on the device outer
diameter surface.
[0015] In a further embodiment is provided a tubular composite
prosthetic device, wherein the cross-section of the device
comprises: a lumen surrounded by a first porous layer comprising
electrospun poly(tetrafluoroethylene) on the device inner diameter
surface; a structural frame situated around and adjacent to said
first porous layer; a second porous layer comprising electrospun
poly(ethylene terephthalate) on the device outer diameter surface;
and a third layer between said structural frame and said second
layer comprising a different electrospun polymer, wherein the
structural frame comprises open spaces through which the different
electrospun polymer penetrates.
[0016] In a still further embodiment is provided a tubular
composite prosthetic device, wherein the cross-section of the
device comprises: a lumen surrounded by a first porous layer
comprising electrospun poly(tetrafluoroethylene) on the device
inner diameter surface; a structural frame situated around and
adjacent to said first porous layer; a second porous layer
comprising electrospun poly(tetrafluoroethylene) on the device
outer diameter surface; and at least two alternating layers of
electrospun poly(tetrafluoroethylene) and a different electrospun
polymer between said first and second layers, wherein a layer
comprising the different electrospun polymer is adjacent to the
structural frame and the structural frame comprises open spaces
through which the different electrospun polymer penetrates.
[0017] In one additional embodiment is provided a tubular composite
prosthetic device, wherein the cross-section of the device
comprises: a lumen surrounded by a first porous layer comprising
electrospun poly(tetrafluoroethylene) on the device inner diameter
surface; a second porous layer comprising electrospun
poly(tetrafluoroethylene) on the device outer diameter surface; and
a third layer between said first and second layers, comprising a
different electrospun polymer, wherein a structural frame is
embedded in the third layer.
[0018] In another aspect of the invention is provided a method for
producing a composite prosthetic device comprising: combining at
least one porous layer comprising electrospun
poly(tetrafluoroethylene) and at least one porous layer comprising
a second electrospun polymer to give a composite prosthetic device
precursor; and applying pressure, heat, or both pressure and heat
to the composite prosthetic device precursor to provide a composite
prosthetic device.
[0019] The combining step can, in some embodiments, comprise
wrapping the porous layer comprising the second electrospun polymer
around the porous layer comprising the electrospun
poly(tetrafluoroethylene). The combining step can, in some
embodiments, comprise electrospinning the porous layer comprising a
second electrospun polymer onto the porous layer comprising
electrospun poly(tetrafluoroethylene).
[0020] The methods described herein can provide composite
prosthetic devices with varying compositions and properties. In
some embodiments, the second electrospun polymer comprises a
solution-electrospun polymer. In some embodiments, the second
electrospun polymer comprises unsintered poly(tetrafluoroethylene).
Advantageously, where the composite device comprises unsintered
poly(tetrafluoroethylene), the method further comprises sintering
the composite prosthetic device following the applying step.
[0021] The applying step can, in some embodiments, comprise
applying heat, pressure, or both heat and pressure for a time
sufficient to result in the penetration of the second electrospun
polymer into the pores of the at least one porous layer comprising
electrospun poly(tetrafluoroethylene). In some embodiments, heat
and pressure are applied sequentially or simultaneously. The
pressure and/or temperature can vary. In certain embodiments, the
pressure is between about 200 and about 2000 PSI (e.g., between
about 500 PSI and about 1500 PSI) and the temperature is between
about 100.degree. C. and about 400.degree. C. The applying step can
be conducted, for example, in a pressure vessel. Further exemplary
discussion of materials and methods as disclosed herein is provided
in U.S. provisional patent application No. 61/620,633, filed Apr.
5, 2012 and U.S. provisional patent application No. 61/724,731,
filed Nov. 9, 2012, which are both incorporated herein by reference
in their entireties.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] A full and enabling disclosure, directed to one of ordinary
skill in the art, is set forth more particularly in the remainder
of the specification, which makes reference to the appended figures
in which:
[0023] FIG. 1 is a schematic cross-sectional view of a wall of a
mono-component composite device in accordance with the present
disclosure;
[0024] FIG. 2 is a schematic cross-sectional view of a wall of a
mono-component composite device comprising a structural frame in
accordance with the present disclosure;
[0025] FIG. 3 is a schematic cross-sectional view of a wall of a
multi-component composite device in accordance with the present
disclosure;
[0026] FIG. 4 is a schematic cross-sectional view of a wall of a
multi-component composite device comprising a structural frame in
accordance with the present disclosure;
[0027] FIG. 5 is a schematic cross-sectional view of a wall of a
multi-component composite device in accordance with the present
disclosure;
[0028] FIG. 6 is a schematic cross-sectional view of a wall of a
multi-component composite device comprising a structural frame in
accordance with the present disclosure;
[0029] FIGS. 7A-F are schematic cross-sectional views of exemplary
multi-component composite devices comprising structural frames in
accordance with the present disclosure;
[0030] FIG. 8 is a schematic illustrating one exemplary process for
the preparation of the exemplary composite devices of FIG. 7A
and/or FIG. 7B;
[0031] FIG. 9 is a schematic illustrating one exemplary process for
the preparation of the exemplary composite device of FIG. 7C;
[0032] FIG. 10 is a schematic illustrating one exemplary process
for the preparation of the exemplary composite devices of FIGS. 7D
and 7E; and
[0033] FIG. 11 is a schematic illustrating one exemplary process
for the preparation of the exemplary composite device of FIG.
7F.
DETAILED DESCRIPTION OF THE INVENTION
[0034] The present invention will now be described more fully
hereinafter with reference to the accompanying figures, in which
some, but not all embodiments of the inventions are shown. Indeed,
these inventions may be embodied in many different forms and should
not be construed as limited to the embodiments set forth herein;
rather, these embodiments are provided so that this disclosure will
satisfy applicable legal requirements. Each example is provided by
way of explanation of the disclosure, and is not intended to be
limiting of the disclosure. In fact, it will be apparent to those
skilled in the art that various modifications and variations can be
made in the present disclosure without departing from the scope or
spirit of the invention. For instance, features illustrated or
described as part of one embodiment can be used in the context of
another embodiment to yield a further embodiment. Thus, it is
intended that the present disclosure covers such modifications and
variations as come within the scope of the disclosed embodiments
and their equivalents.
Overview of Composite Prosthetic Devices According to the Present
Disclosure
[0035] Generally, the present disclosure provides composite
prosthetic devices comprising one or more layers of electrospun
(also referred to herein as "espun") fibers around a central lumen
and methods of preparation thereof, wherein at least one layer
comprises a dispersion-spun polymer. In some embodiments, the one
or more layers of espun fibers can comprise the inner diameter
surface, the outer diameter surface, or both the inner and outer
diameter surfaces of a tubular composite prosthetic device. The
focus of the application is on multi-layered structures comprising
at least one layer of espun fibers on the inner diameter surface
and at least one layer of espun fibers on the outer diameter
surface; however, the disclosure is intended to also relate to
structures comprising only one of these. For example, a structural
frame having a single layer of espun fibers on the inner diameter
surface is intended to be encompassed by the present disclosure and
a structural frame having a single layer of espun fibers on the
outer diameter surface is also intended to be encompassed by the
present disclosure.
[0036] The composite prosthetic devices described herein can, in
certain embodiments, offer a number of advantages over conventional
devices. For example, in certain embodiments, the composite
prosthetic devices provided herein advantageously exhibit one or
more of: 1) the ability to incorporate layers with vastly different
pore structures and sizes (allowing for the manipulation of various
properties such as mechanical properties, cellular proliferation,
cellular permeability, fluid permeability, adhesion to a structural
frame, and/or possible incorporation of one or more active
therapeutic components within different structural layers); 2) the
ability to make a composite construction comprising at least two
different components (even vastly different components, thus
enabling a broad range of therapeutic uses and structures); 3)
improved bonding between various layers, including the one or more
espun layers, the optional structural frame, and/or other optional
layers of the composite device; 4) the inclusion of a material
(e.g., electrospun poly(tetrafluoroethylene) (PTFE)) that closely
mimics that of the extracellular matrix, thus affording greater
control of cellular response; and 5) the ability to provide a
covering (layer) on devices having both simple and complex
geometries, which can pose a challenge for covering with
conventional materials.
[0037] The type of prosthetic device provided according to the
present invention can vary and the device can be tailored so as to
be used for any given purpose. Generally, prosthetic devices as
intended herein are tubular prosthetic devices. By "tubular
prosthetic device" is meant that the device has a 3-dimensional
shape and this term is intended to cover devices of varying sizes
(e.g., length, thickness, and/or diameter), shapes, and
compositions. Such tubular prosthetic devices are generally
characterized as having a central lumen. A tubular prosthetic
device can generally be described as having both an inner diameter
("ID") and an outer diameter ("OD"). "Tubular devices" is intended
to be broadly construed to include stents, grafts, and stent grafts
having typical cylindrical-shaped structures as well as structures
having shapes including, but not limited to, non-linear-shaped,
petal-shaped, saddle-shaped, Y-shaped, mushroom-shaped, flared
shaped, bell-shaped, single horn-shaped, double horn-shaped,
hourglass-shaped, single cup-mouth shaped, twin cup-mouth shaped,
cup mouth-ball shaped, and the like. One or both ends of the
prosthetic device can be coiled or otherwise shaped to prevent
migration of the device within the body.
[0038] Generally, prosthetic devices are devices that can be placed
into an artery, blood vessel, or other duct to hold the duct open
or to redirect blood flow within the duct, or the like. In certain
embodiments, the present disclosure is directed to vascular
prosthetic devices (also referred to herein as "vascular
prostheses"). Such devices can be vascular stents or vascular stent
grafts. Representative vascular prostheses include coronary stents,
coronary artery by-pass grafts, blood vessel stents, artificial
by-pass grafts, by-pass shunts, arteriovenous grafts, homografts,
pulmonary allografts, and/or pulmonary shunts. Other tubular
prosthetic devices that may be provided according to the invention
include, but are not limited to, hemodialysis tubes, ureteral
stents, urethral or prostatic stents, prostatic/sphincter stents,
esophageal stents, laryngeal stents, tracheal stents, biliary
stents, duodenal stents, colonic stents, pancreatic stents,
tracheobronchial stents, and gastrointestinal stents.
[0039] The composite prosthetic devices of the present disclosure
can have varying compositions. Generally, the composite prosthetic
devices described herein comprise one or more electrospun layers
(including two or more electrospun layers). Electrospun layers are
understood to be polymeric layers prepared via an electrospinning
process as described herein. Electrospun layers typically comprise
a plurality of fibers, which in some embodiments are in random
orientation with respect to one another. In certain embodiments,
electrospun layers can be described as fibrous and/or porous. The
diameter of the fibers within an espun mat according to the present
disclosure can vary. In certain embodiments, espun layers can
comprise fibers having average diameters of at least about 0.01
.mu.m. For example, the average diameter of fibers in each of the
one or more espun layers of the composite devices can, in some
embodiments, range from about 10 nm to about 2000 nm in size. In
some embodiments, one or more of the espun layers, in final form,
have fibers deposited in a density such that there is a range of
distances of about 0.1 .mu.m to about 50 .mu.m between points of
contact.
[0040] Further, the pore size of a given layer and of the composite
device as a whole can vary. As used herein in reference to the
espun layers, "pore size" is intended to refer to effective pore
size (rather than actual pore size) as measured, for example, by
air flow and/or water flow (e.g., as defined by ASTM F316 Pore Size
Characterization by Bubble Point, which is incorporated herein by
this reference). It is noted that, given the nature of the espun
fiber mats, it is generally not possible to measure actual pore
size of such materials using microscopy methods. The effective pore
size of a given espun layer within a composite device as described
herein can range from about 0.0 .mu.m (e.g., a non-porous film) to
about 50 .mu.m, e.g., from about 0.05 .mu.m to about 20 .mu.m.
Advantageously, the effective pore size of each layer is greater
than about 0.0 .mu.m as, in certain embodiments, it is desired to
provide a composite device exhibiting some degree of porosity. It
is noted that, in some embodiments, the effective pore size of a
given layer may not be accurately known, such as, for example,
where layers are applied and subsequently compressed and/or
sintered within the composite device.
[0041] In some embodiments, the individual layers comprising a
composite prosthetic device as described herein can have varying
thicknesses. For example, in some embodiments, each layer can have
an average thickness ranging from about 0.0001 inches to about 0.25
inches. In some embodiments, layers with thicknesses at the low end
of this range are desirable (e.g., about 0.0001 inches to about
0.0010 inches, such as about 0.0003 inches to about 0.0005 inches)
The thickness of a given layer can depend, in part, on the method
of preparation of the layer and on the makeup of the layer. For
example, in some embodiments, very thin espun layers of PU (e.g.,
between about 0.0001 inches and about 0.0005 inches) are readily
obtained. Very thin espun layers of PTFE (e.g., about 0.0001
inches) are generally achieved only through direct application to a
construct (i.e., by spin coating, as described below) although
sheets of PTFE for lamination onto constructs as described herein
may, for example, be prepared with thicknesses as low as about
0.0005 inches. Sheets or tubes prepared by electrospinning
typically cannot exhibit such low thicknesses and generally exhibit
thicknesses of about 0.0008 inches or greater. In preferred
embodiments, the thickness of a given layer is relatively uniform
throughout. The thickness of a given layer can also depend on the
method by which the composite device is produced. For example, a
polymeric sheet can be wrapped once, twice, three times, four
times, five times, or more times around the device (or on the
interior of the device) to obtain varying thicknesses of that
layer.
[0042] Given this range of possible layer thicknesses, the wall
thickness of the composite devices disclosed herein can vary
accordingly, depending on the number of layers and on the thickness
of each layer. For example, based on the layer thicknesses noted
above, a 2-layer composite device can have a wall thickness ranging
from about 0.0002 inches to about 0.50 inches, such as from about
0.001 inches to about 0.05 inches, including from about 0.003
inches to about 0.02 inches. It is to be understood that layers of
varying thicknesses can be combined within the device. In preferred
embodiments, the overall wall thickness of the composite device is
relatively uniform throughout the length of the device and around
the circumference of the device. However, in embodiments comprising
a structural frame, the frame typically comprises an open structure
formed from wires or struts and having spaces in between, and it is
noted that the wire or strut diameter can impact the wall thickness
where the wire or strut is present. Thus, for example, in
considering the uniformity of a given composite, the layer
thickness at one position on a composite must be compared to the
layer thickness at a comparable position on that composite (i.e.,
by comparing a point at which the wire or strut is present with
another point at which the wire or strut is present, or by
comparing two points at which the wire or strut is not present).
Further, it is understood that, in some embodiments, a seam may be
present where one or more layers is wrapped around the device,
which can be dependent on the processing conditions used to produce
the composite device. Accordingly, in some embodiments, there may
be one or more indentations (e.g., lines) or raised portions (e.g.,
lines) on the outer diameter surface of the device, and such
embodiments are intended to be encompassed by "substantially
uniform" as described herein.
[0043] The overall outer diameter of the device can vary. For
example, the overall outer diameter can, in certain embodiments,
range from about 0.005 inches to about 2 inches, although larger
and smaller composites can be prepared without departing from the
present disclosure. The final length can vary greatly as the
composites can be produced as sheets or tubes at continuous roll
lengths.
[0044] The composite devices described herein can have varying
numbers of polymeric layers (e.g., 2-layered, 3-layered, 4-layered,
5-layered, 6-layered, 7 layered, 8-layered, 9-layered, 10-layered,
or having even more layers). In certain embodiments, a layer on the
inner diameter surface of a composite device may comprise between
about 1 and about 5 wrappings (e.g., about 2 wrappings). In certain
embodiments, a layer on the outer diameter surface of a composite
device may comprise between about 2 and about 10 wrappings (e.g.,
about 4-8 wrappings or about 5-7 wrappings). It is noted that,
although the components of the composite prosthetic devices
described herein are described as comprising "layers," these layers
may not always be discrete layers. For example, although layers are
advantageously continuous layers, in some embodiments, they may not
always be continuous layers. Further, in some embodiments, the
composites may exhibit some ingress of one "layer" into another
"layer." These scenarios are still intended to be encompassed by
the term "layered."
[0045] Generally, at least one layer within the composite
prosthetic devices described herein functions as a "tie layer." A
tie layer is a layer that is incorporated into the composite device
in a form such that it serves to adhere and/or bond two or more
layers together. To fulfill this requirement, the tie layer
component must exhibit some degree of flow, tackiness, and/or
moldability at ambient temperature and/or at elevated temperature
when it is incorporated within the device. Typically, a composite
prosthetic device precursor, comprising all layers to be included
in the final device, is prepared and the precursor is treated
before use (i.e., by applying heat and/or pressure) such that the
tie layer may not maintain these properties in the final composite
device provided herein. In some embodiments, the tie layer
comprises the same polymer type as the one or more layers adjacent
thereto and, in some layers, the tie layer comprises a different
polymer type. The tie layer can comprise, for example, any of the
polymer types and in certain embodiments, may comprise PTFE, PU, or
a silicone (e.g., PDMS). In certain embodiments, the tie layer
penetrates the pores of one or both of the layers with which it is
in contact and thus can provide a mechanical-type connection
between the layers. In certain embodiments, the tie layer
advantageously can penetrate at least a portion of the open spaces
in a structural frame, where present. Where a frame is present, a
tie layer may, in some embodiments, serve to connect and/or bond
the material comprising the inner diameter surface of the composite
device to the outer diameter surface (e.g., through the structural
frame). The incorporation of such a layer will be described in
greater detail herein.
[0046] As the presently described devices comprise two or more
polymeric layers, a wide range of composite devices having varying
properties are provided. By incorporating layers with different
properties (e.g., composition, thickness, effective pore size,
fiber size, etc.), devices with various combinations of properties
are afforded. Means for adjusting these and other properties are
described further herein. Further, the chemical makeup of the
individual layers can provide an additional degree of tailoring.
Due to the layered, "sandwich"-type construction of the composite
devices of the present disclosure, physical properties such as
thickness and pore size can vary from layer to layer within the
cross section of the composite device, depending on the
construction. An example would be an asymmetrical construction
where pores change in size from large to small based on layer
evaluations from surface to surface throughout the material.
[0047] As noted, the specific compositions of the composite
prosthetic devices provided according to the present disclosure can
vary, as described in greater detail herein. However, in all
composite prosthetic devices disclosed herein, at least one layer
of the device generally comprises a fibrous mat prepared via
dispersion-based electrospinning (i.e., a "dispersion-spun
component"). Exemplary materials and methods involved in
dispersion-based electrospinning are described in greater detail
below.
[0048] In certain embodiments, the fibrous mat prepared via
dispersion-based electrospinning (i.e., the dispersion-spun
component) is an electrospun fibrous mat comprising a fluorinated
polymer (e.g., poly(tetrafluoroethylene) (PTFE)). Although much of
the description of electrospinning provided herein focuses
specifically on electrospinning PTFE and on electrospun mats
comprising PTFE, it is noted that the methods and materials
described herein may employ an alternative polymer in place of the
PTFE. Exemplary fluorinated polymers that can be incorporated as a
dispersion-spun component of the composite prosthetic devices
described herein include, but are not limited to, fluorinated
ethylene propylene (FEP), polyvinylidene fluoride (PVDF),
perfluoroalkoxy (PFA), a copolymer of tetrafluoroethylene,
hexafluoropropylene and vinylidene fluoride (THV),
poly(ethylene-co-tetrafluoroethylene) (ETFE), ethylene
chlorotrifluoroethylene (ECTFE), PCTFE
(polychlorotrifluoroethylene), and copolymers, blends, and
derivatives thereof. Further, although the application as written
is directed to embodiments wherein the dispersion-spun component
comprises a fluorinated polymer, it is noted that other polymers
that can be spun from a dispersion can alternatively or
additionally be employed as a dispersion-spun component.
[0049] In some embodiments, a composite prosthetic device is
provided wherein the two or more electrospun layers consist of one
type of material, i.e., the same type of material (giving a
"mono-component composite" prosthetic device), optionally in
combination with a structural frame (e.g., a stent). In such
embodiments, the composite prosthetic device comprises two or more
layers of a dispersion-spun polymeric component. The tie layer of
such devices thus consists of the same type of polymeric material
as that of the one or more additional layers. For example, in one
particular embodiment, an electrospun PTFE-based composite device
is provided, wherein each of the two or more polymeric layers of
the composite prosthetic device comprises electrospun PTFE. In such
embodiments, the properties (e.g., thickness, pore size, fiber
diameter, etc.) of each layer can vary such that different PTFE
layers of the composite device can exhibit different properties.
Although PTFE is exemplified, it is noted that other prosthetic
composites consisting of or consisting essentially of one polymeric
material other than PTFE may also be provided according to the
present disclosure.
[0050] Exemplary mono-component composite prosthetic devices are
illustrated in FIGS. 1 and 2. FIG. 1 illustrates a cross-sectional
view of a wall of a composite prosthetic device 10, wherein the
coverings on the inner (12) and outer (16) diameter surfaces of the
device comprise the same dispersion-spun polymer (e.g., PTFE).
Layer 14 is a tie layer, comprising the same type of polymer (e.g.,
PTFE), but layer 14 is initially incorporated into the structure in
unsintered (tacky and moldable) form. It is noted that device 10
will be subjected to heat and/or pressure prior to use to provide
layer 14 in sintered, fibrous form and to promote adhesion between
layers (e.g., via penetration of layer 14 into the pores of layer
12 and/or layer 16). FIG. 2 illustrates a cross-sectional view of a
wall of a composite prosthetic device 20, which is similar but
further incorporates a structural frame 24. Again, layers 22, 26,
and 28 comprise the same type of polymer (e.g., PTFE) and the tie
layer (26) is initially incorporated in unsintered form. Here, the
application of heating and pressure to the device precursor
preferably causes the tie layer 26 to penetrate through interstices
in structural frame 24, as well as into the pores of layer 22
and/or 28. In some embodiments, the application of heating and
pressure can cause tie layer 26 to bond the material comprising the
inner diameter surface of the composite device to the material
comprising the outer diameter surface of the device. Again, the
composite device precursor is preferably heated prior to use to
provide layer 26 in sintered form in the final composite device
(e.g., where the layer comprises PTFE).
[0051] In contrast, multi-component composite devices have at least
two types of electrospun polymeric layers and can have any number
of different types of polymeric materials therein (e.g., at least
2, at least 3, or at least 4). Each polymer type within the
multi-component composite devices as described herein can be
represented in one layer or more than one layer. For example, a
composite device can have: one layer of a given first electrospun
material and one layer of a given second electrospun material; two
or more layers of a given first electrospun material and one layer
of a given second electrospun material; or two or more layers of a
given first electrospun material and two or more layers of a given
second electrospun material. The multi-component composite devices
provided herein, in addition to comprising one or more
dispersion-spun layers, comprise one or more additional layers,
which can be prepared via dispersion-based electrospinning,
melt-based electrospinning, and/or solution-based
electrospinning.
[0052] In certain embodiments, the one or more additional
electrospun layers of the prosthetic device comprise an electrospun
thermoplastic or thermoset polymer. A thermoplastic is understood
to be any polymer that becomes moldable above a specific
temperature and returns to a solid state upon cooling. A thermoset
is understood to be a polymeric material that is initially
moldable, but can cured (usually irreversibly) to give a solid
(e.g., by the application of heat or radiation). In some
embodiments, the thermoplastic or thermoset polymer is an
elastomer. An elastomer is a polymer that can be repeatedly
stretched and/or deformed without permanently deforming the shape
thereof.
[0053] Certain exemplary polymers that can be incorporated as
electrospun layers in the multi-component prosthetic devices
disclosed herein are polyurethanes (PU) and silicones, e.g.,
polydimethylsiloxane (PDMS). Other polymers useful for this purpose
include, but are not limited to, polyether block amide (PEBA, e.g.,
PEBAX.RTM.), polyamides, polyethylene (e.g., ultra-high molecular
weight polyethylene, UHMWPE), polyesters, and copolymers, blends,
and derivatives thereof. Additionally, certain fluorinated polymers
such as fluorinated ethylene propylene (FEP), polyvinylidene
fluoride (PVDF), perfluoroalkoxy (PFA), a copolymer of
tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride
(THV), poly(ethylene-co-tetrafluoroethylene) (ETFE), ethylene
chlorotrifluoroethylene (ECTFE), PCTFE
(polychlorotrifluoroethylene), and copolymers, blends, and
derivatives thereof which can be electrospun can be used.
Generally, any thermoplastic or thermoset polymer that forms fibers
upon electrospinning can be used in this regard as an additional
polymeric component (in addition to the one or more dispersion-spun
layers). Preferably, the additional polymeric component is selected
such that the electrospun mat produced therefrom retains some
degree of porosity when it is combined with the other component(s)
of the multi-component composite device and when the resulting
device precursor is treated (i.e., when it is exposed to elevated
temperature and/or pressure) to provide a final composite device.
However, in certain embodiments, it may be desirable to provide a
final composite device that is non-porous. In such embodiments, one
or more polymeric layers is a non-porous layer (which can be
prepared in various ways as described herein, including, but not
limited to, by electrospinning and/or by film formation).
[0054] Certain multi-component devices described herein exhibit
enhanced properties relative to commercially available devices
and/or to mono-component devices described herein. Properties that
may be enhanced in certain embodiments, include, but are not
limited to, robustness, flexibility, strength (e.g., radial
strength and burst strength), crush/bend/kink resistance, and
compression resistance, for example, as evaluated by testing
methods including, but not limited to, air flow testing, torsion
testing, tension/compression testing, abrasion resistance testing,
burst strength testing, WEP testing, radial force expansion
testing, kink resistant testing, 3-point bend testing, flex
testing, crush resistance testing, recoil testing, and general
physical evaluation.
[0055] Exemplary multi-component composite prosthetic devices are
illustrated in FIGS. 3 and 4. FIG. 3 illustrates a cross-sectional
view of a wall of a composite prosthetic device 30, wherein the
coverings on the inner (32) and outer (36) diameter surfaces of the
device comprise the same electrospun polymer (e.g., PTFE). Layer 34
is a tie layer, which comprises a different electrospun polymer
than layers 32 and 36 (e.g., PU or PDMS). If layer 34 is a
dispersion-spun material, layer 34 is initially incorporated into
the structure in unsintered (tacky and moldable) form and must be
sintered before the composite device is used. If layer 34 is a
solution-spun or melt-spun material, no sintering is required prior
to use. However, in all embodiments, the device 30 will be
subjected to heat and/or pressure prior to use to promote adhesion
between layers (e.g., via penetration of layer 34 into the pores of
layer 32 and/or layer 36). FIG. 4 illustrates a cross-sectional
view of a wall of a composite prosthetic device 40, which is
similar but further incorporates a structural frame 44. Layers 42
and 48 comprise the same electrospun polymer (e.g., PTFE) and the
tie layer (46) comprises a different material. Again, if tie layer
46 is a dispersion-spun material, layer 46 is initially
incorporated into the structure in unsintered (tacky and moldable)
form and must be sintered before the composite device is used. If
tie layer 46 is a solution-spun or melt-spun material, no sintering
is required prior to use. However, in all embodiments, the device
precursor will be subjected to heat and/or pressure prior to use to
promote adhesion between layers (e.g., via penetration of layer 46
into the pores of layer 42 and/or layer 48).
[0056] Further exemplary multi-component composite prosthetic
devices are illustrated in FIGS. 5 and 6. FIG. 5 illustrates a
cross-sectional view of a wall of a composite prosthetic device 50,
wherein the coverings on the inner (52) and outer (56) diameter
surfaces of the device comprise different polymers. Layer 54 is a
tie layer, which may comprise the same polymer as layer 52 or 56 or
may comprise a different material. If layer 54 is a dispersion-spun
material, layer 54 is initially incorporated into the structure in
unsintered (tacky and moldable) form and must be sintered before
the composite device is used. If layer 34 is a solution-spun or
melt-spun material, no sintering is required prior to use. However,
in all embodiments, the device 50 will be subjected to heat and/or
pressure prior to use to promote adhesion between layers (e.g., via
penetration of layer 54 into the pores of layer 52 and/or layer
56). FIG. 6 illustrates a cross-sectional view of a wall of a
composite prosthetic device 60, which is similar but further
incorporates a structural frame 64. Layers 62 and 68 comprise
different polymers and the tie layer (66) can comprise the same
polymer as layer 62 or 68 or may comprise a different material.
Again, if tie layer 64 is a dispersion-spun material (e.g., PTFE),
layer 64 is initially incorporated into the structure in unsintered
(tacky and moldable) form and must be sintered before the composite
device is used. If tie layer 64 is a solution-spun or melt-spun
material, no sintering is required prior to use. However, in all
embodiments, the device precursor will be subjected to heat and/or
pressure prior to use to promote adhesion between layers (e.g., via
penetration of layer 64 into the pores of layer 62 and/or layer
68).
[0057] FIGS. 7A-7F are schematic cross-sections of representative
multi-component prosthetic devices according to the present
disclosure, having greater than two layers. In each of these
embodiments, two polymeric components are present; the grey layers
represent the dispersion-spun component (e.g., PTFE) and the black
layers represent a different type of polymeric material (e.g., PU
or PDMS). The dashed lines represent structural frames. As
exemplified in FIGS. 7A-7F, a wide range of embodiments having
different cross-sections can be provided according to the methods
and materials disclosed herein.
[0058] The structural frame, where present in the mono-component
composite or multi-component composite, can vary. Structural frames
can take various forms including, but not limited to, stents,
occlusion coils or frames, regenerative medicine scaffolds,
structural reinforcements, pacing or monitoring leads, tissue
anchors or tacks, biological stimulation devices, biomimetic
implants, signal receivers or transmitters, orthopedic fixation
devices or any other metallic, polymeric, ceramic or other
therapeutic devices. Various stent types and stent constructions
may be employed in the present disclosure, including, but not
limited to, self-expanding stents and balloon expandable stents. In
certain embodiments, the stents may be capable of radially
contracting as well. Self-expanding stents include those that have
a spring-like action which causes the stent to radially expand, or
stents which expand due to the memory properties of the stent
material for a particular configuration at a certain
temperature.
[0059] The makeup of the structural frame, where present, can vary.
In some embodiments, the structural frame is a metal structural
frame, which can generally comprise any biocompatible metal. In
certain embodiments, the metal structural frame can comprise
stainless steel, platinum, gold, titanium, or a mixture thereof. In
certain embodiments, the metal structural frame can comprise
cobalt, chrome, or magnesium alloy. Nickel titanium alloy
("Nitinol") is one material which has the ability to perform well
while both in spring-like mode, as well as in a memory mode based
on temperature and thus may be useful in certain embodiments of the
invention. In other embodiments, the structural frame can comprise
another type of material, such as a ceramic.
[0060] The configuration of the structural frame (e.g., stent) may
also be chosen from any suitable geometry. For example, wire stents
can be fastened into a continuous helical pattern, with or without
a wave-like feature or zig-zag in the wire, to form a radially
deformable stent. Individual rings or circular members can be
linked together by struts, sutures, welding, or interlacing or
locking to form a single tubular stent. Individual rings or
circular members may have no link and thus may serve as individual
units in the composite that is provided upon the combination of
such a frame with one or more layers of polymeric material
according to the invention. In such cases, multiple ring segments
are embedded and held in place by the composite material to
comprise a single tubular composite device. Tubular prosthetic
devices useful in the present invention also include those formed
by etching or cutting a pattern from a tube. Such devices are often
referred to as "slotted" devices (e.g., slotted stents).
Furthermore, devices may be formed by etching a pattern into a
material or mold and depositing device material in the pattern,
such as by chemical vapor deposition or the like. As will be
apparent based on the disclosure herein, there may be some limit on
the configuration of a structural frame in order to achieve
enhanced bonding between adjacent polymeric layers through the
structural frame in certain embodiments.
[0061] It is noted that the examples provided herein and the
embodiments illustrated in FIG. 7A-7F contain a structural frame;
however, this is not necessary. In some embodiments, a 100%
electrospun polymer-based device is provided. In other embodiments,
a device is provided consisting only of a structural frame and
electrospun polymeric layers. Composite devices comprising
additional types of materials, however, are not intended to be
excluded from the present disclosure. It is possible according to
the present invention to incorporate various additional
non-electrospun components into the mono-component prosthetic
devices and multi-component prosthetic devices described herein.
For example, such further components include, but are not limited
to, melt-processable polymers, e.g., polyamides, polyurethanes, and
the like (including, but not limited to, perfluoroalkoxy (PFA),
fluorinated ethylene propylene (FEP), ethylene tetrafluoroethylene
(ETFE), or tetrafluoroethylene hexafluoropropylene vinylidene
fluoride (THV)) (which can provide a non-porous layer, e.g., as a
self-sealing thermoplastic or elastomeric film); woven or nonwoven
fabrics of natural or man-made fibers; plastic or ceramic
membranes; metal, ceramic, or plastic meshes; expanded PTFE (ePTFE)
layers as discussed for example in U.S. Patent Application
Publication Nos. 2011/0030885 and 2011/0031656 to Anneaux et al.,
which are both incorporated herein by this reference in their
entireties or combinations thereof.
[0062] Additionally, in some embodiments, the composite devices
provided herein can comprise one or more bioactive agents. Examples
of such bioactive agents that can be utilized in connection with
the devices of the present disclosure include, but are not limited
to: antibiotics, antifungals, and antivirals (such as erythromycin,
tetracycline, aminoglycosides, cephalosporins, quinolones,
penicillins, sulfonamides, ketoconazole, miconazole, acyclovir,
ganciclovir, azidothymidine, and interferons); vitamins;
anticonvulsants (such as phenytoin and valproic acid);
antidepressants (such as amitriptyline and trazodone);
antiparkinsonism drugs; cardiovascular agents (such as calcium
channel blockers, antiarrhythmics, and beta blockers);
antineoplastics (such as cisplatin and methotrexate),
corticosteroids (such as dexamethasone, hydrocortisone,
prednisolone, and triamcinolone); NSAIDs (such as ibuprofen,
salicylates, indomethacin, and piroxicam); hormones (such as
progesterone, estrogen, and testosterone); growth factors; carbonic
anhydrase inhibitors (such as acetazolamide); prostaglandins;
antiangiogenic agents; neuroprotectants; neurotrophins; growth
factors; cytokines; chemokines; cells (such as stem cells, primary
cells, and genetically engineered cells); tissues; other agents
known to those skilled in the art; and combinations thereof.
Bioactive agents can, in some embodiments, be as described in U.S.
application Ser. No. 13/272,412 to Ballard et al., filed Oct. 13,
2011, which is incorporated herein by this reference in its
entirety. The amount of optional bioactive agent incorporated
within the tubular composite devices can vary but is generally that
amount sufficient to elicit a desired response in the patient in
whom the device is to be implanted. In some embodiments, a
bioactive agent can be incorporated within only one layer or within
more than one layer of the composite prosthetic device. The
properties and characteristics of the final composite prosthetic
devices of the present disclosure are a compilation of the
properties of the one or more espun polymer layers and any other
optional material(s) contained within the composite device (e.g.,
the optional one or more additional espun polymeric layers and the
optional structural frame). The final composite devices of the
present disclosure can, in certain embodiments, be prepared with
controlled fiber sizes and the mechanical properties of the device
can be tailored so as to improve such features as bond strength
between components (e.g., layers) of the device, elongation
properties, and tensile strength. Moreover, different pore sizes of
the layers can be targeted for different intended application.
Advantageously, the individual layers exhibit little to no
delamination, indicative of strong adhesion of layers to each
other. The composite devices of the present disclosure can, in some
embodiments, exhibit additional desirable characteristics of
enhanced radial tensile strength, suture hole tearing resistance
and enhanced axial tear resistance as compared with commercially
available products.
[0063] The ability to tailor such properties of the composite
device of the present disclosure can have implications in designing
prosthetic devices for particular applications. Advantageously, the
properties of individual layers of the composite device can be
modified to tailor the overall properties of the composite device
for a given application. For example, modifying the pore sizes
and/or thicknesses of the polymeric layers can serve to enhance or
inhibit cellular ingrowth or attachment. For example, the device
interior surface, or ID surface (generally the fluid-, e.g.,
blood-contacting region) and the device exterior surface, or OD
surface (which is generally the tissue-contacting region) may, in
certain embodiments, have different effective pore sizes. In
certain embodiments, it may be desirable to enhance cellular
ingrowth and/or attachment on the exterior of a composite device,
whereas it may be desirable to inhibit such activity on the
interior of a composite device to allow fluid to freely pass
therethrough. Thus, in some embodiments, a composite can comprise a
layer having a large pore size on the exterior of the device to
facilitate ingrowth and a layer having a smaller pore size on the
interior of the device. In some embodiments, the inverse is desired
(i.e., a composite with minimal to no ingrowth on the exterior and
enhanced ingrowth on the interior), which can be achieved by
providing a composite comprising a layer having a small pore size
on the exterior of the device and a layer having a larger pore size
on the interior of the device.
Electrospinning Process
[0064] Electrospun mats useful according to the present disclosure
can be prepared by drawing material by electrical charge from a
polymer solution, from a polymer suspension/dispersion, or from a
polymer melt. The fibers thus produced are typically collected in a
random fashion to produce nonwoven materials. Various specific
techniques are known for the production of electrospun fibers and
electrospun materials (e.g., mats and/or coverings).
[0065] Dispersion-spun layers (e.g., PTFE and other fluorinated
polymers discussed herein) can be prepared, for example, according
to the following procedure. A dispersion comprising the desired
polymeric particles is provided or prepared. The solids content of
PTFE resins is preferably between 50% to about 80% by weight, and
more preferably between about 55% and about 65% by weight. In one
specific embodiment, an exemplary commercially available PTFE
dispersion, Daikin D 210 PTFE, is used, which comprises about 59-61
wt % PTFE solids (measured according to ASTM D 4441), 6.0-7.2% wt %
surfactant, a pH at 25.degree. C. of 8.5 to 10.5, a specific
gravity of 1.50 to 1.53 and a Brookfield viscosity maximum of 35
cP. The properties of the PTFE (e.g., molecular weight,
polydispersity index, particle size, particle size distribution)
can vary. In some embodiments, the average particle size of the
PTFE can be between about 0.05 .mu.m and about 1 .mu.m (for
example, between about 0.1 .mu.m and about 0.5 .mu.m). In some
embodiments, the average particle size is less than about 0.5
.mu.m, less than about 0.4 .mu.m, less than about 0.3 .mu.m, or
less than about 0.2 .mu.m. For example, the average particle size
in certain embodiments may be about 0.13 .mu.m, about 0.16 .mu.m,
about 0.23 .mu.m, or about 0.25 .mu.m. The solvent can be any
solvent suitable for creating a dispersion; suitable such solvents
include, but are not limited to, aqueous solutions or alcohol
solutions (e.g., methanol, ethanol, or isopropanol).
[0066] A fiberizing polymer is typically added to the dispersion to
facilitate fiber formation and is generally removed following the
espinning process. The fiberizing polymer (or polymers) are
typically selected such that they have a high solubility in the
solvent of the dispersion (e.g., where the dispersion comprises
water, any water-soluble polymer can be used, including, but not
limited to, poly(ethylene oxide)). The amount of fiberizing polymer
present in the dispersion can vary; for example, in certain
embodiments, the dispersion comprises about 1% to about 10% by
weight of a fiberizing polymer, based on the total weight of the
dispersion. In certain embodiments, the weight ratio of fiberizing
polymer to PTFE varies. For example, the amount of fiberizing
polymer can be about 3.0% to about 5.5% that of the PTFE in the
dispersion by weight. The amount of fiberizing polymer required
according to the present invention may vary depending on the
chemical makeup of the polymer.
[0067] In preferable embodiments, the viscosity of the dispersion
is within a certain desirable range to allow for the formation of
uniform and consistent fibers therefrom (e.g., greater than about
50,000 cP, such as between about 50,000 cP and about 300,000 cP or
between about 70,000 cP and about 150,000 cP, as measured with a
Brookfield Viscometer. The desired viscosity of the dispersion may
vary depending on whether a free surfaced-based apparatus or an
orifice (needle)-based apparatus (which requires a somewhat higher
viscosity) is used. In one embodiment, free surface electrospinning
from a wire, a cylinder in a trough (i.e., open bath), spike, sharp
edge, or similar geometry spinning electrode or the like is used.
For the open bath unit, the ejection volume is dependent upon the
viscosity of the dispersion, the conductivity of the dispersion,
the surface tension of the dispersion, the distance from bath to
target, and the voltage. These factors can also affect the
thickness of the fabric and the fiber diameter. The charge source
is preferably connected to the positive side of a precision DC
power supply. The negative side of the power supply is preferably
connected to the collection surface. Alternatively, the collection
surface can be at ground. The polarity can be reversed but this is
not preferred. Voltage is applied (e.g., typically from about
40,000 volts to about 120,000 volts (e.g., about 40,000 to about
80,000 volts) over a typical collection distance of about 100 to
about 400 mm) to uniformly draw out the dispersion and attract it
to a collection surface. In a free surface electrospinning
apparatus, the collection surface/target can be placed, for
example, above the cylinder in the dispersion trough or the
dispersion-coated wire and is typically moved in at least one
direction such that the entire surface or the desired portion
thereof becomes uniformly covered with fibers.
[0068] In other embodiments, orifice or needle spinning is used.
This method is similar to that described above; however, the
polymeric dispersion passes through one, two, or several orifices
and forms espun fibers and fabrics in this way. The voltage on the
power supply is increased to the desired voltage (usually from
about 2,000 to about 20,000 volts) to uniformly draw out the
dispersion and attract it to the collection surface. The collection
surface is preferably placed perpendicular to the orifice and is
rotated such that the entire surface is uniformly covered, with the
fibers drawn towards the collection surface.
[0069] General information related to processes for processing and
electrostatic spinning from dispersion (e.g., of PTFE from aqueous
and other dispersions) is provided, for example, in U.S. Pat. Nos.
4,323,525 to Bornat and 4,044,404 to Martin et al., which are
incorporated herein by reference in their entireties. In certain
embodiments, electrospinning of PTFE may be based at least in part,
on the process described in detail in U.S. Patent Appl. Publ. Nos.
2010/0193999 to Anneaux et al. and 2012/0114722 to Ballard et al.,
which are both incorporated herein by reference in their
entireties. Various parameters of the nanofiber production process
can be modified to alter the properties of the resulting
dispersion-spun (e.g., PTFE) material. For example, increasing the
length of time generally increase the thickness of the espun
material.
[0070] As described above, the composite devices described herein
can, in some embodiments be multi-component composite devices
comprising at least one solution-spun or melt-spun component.
Solution electrospinning is generally known in the art and, in some
embodiments, can be conducted in a similar way as the
dispersion-based electrospinning described above. Similar to
dispersion-based electrospinning, an electrical charge is used to
draw polymeric fibers from the solution, which are deposited,
generally in a random fashion, on a collection surface.
[0071] In solution-based electrospinning, the solvent in which the
polymer is dissolved and the parameters required to produce fibrous
mats via electrospinning can vary, depending upon the nature of the
polymer. For example, where the polymer is PU, any solution in
which the polymer is dissolvable (e.g., tetrahydrofuran (THF),
dimethylformamide (DMF), dimethylacetamide (DMAc), and combinations
thereof) can be used. In some embodiments, it may be useful to use
a combination of solvents such that one solvent evaporates more
quickly than the other as the fibers are produced. The
concentration of polymer in the solution can vary, but is generally
relatively low (e.g., less than about 25% by weight, less than
about 10% by weight, such as between about 1% and about 10% by
weight).
[0072] Parameters such as makeup of the solution (e.g., the
solvent, the composition and molecular weight of the polymer used,
any additives, the concentration of the polymer in the solution,
the solubility of the polymer in the solvent, etc.), the charge
applied to the solution, the time period of electrospinning, etc.
can impact the fibrous mat thus produced. Exemplary methods are
described, for example, in U.S. Pat. Nos. 1,975,504; 2,160,962; and
2,187,306, all to Formhals; Demi et al., Polymer 43: 3303-3309
(2002); Greiner et al., Angew. Chem. Int. Ed. Engl. 46(30:
5670-5703 (2007), and Bhardwaj et al., Biotech. Adv. 28(3):
325-327, which are all incorporated herein by reference in their
entireties. These and other methods for the preparation of
electrospun mats from solution can be used according to the present
disclosure.
[0073] Melt electrospinning is similar to dispersion and solution
electrospinning, but involves electrospinning fibers from melted
polymer. Any polymer that can be placed in melt form has the
potential to be electrospun by this method. A melted polymer sample
to be spun can be prepared, for example, by heating from resistance
heating, circulating fluids, air heating, or lasers. The
temperature at which melt spinning is conducted will vary depending
upon the melting point of the polymer or polymers used.
[0074] In all types of electrospinning (i.e., solution-based,
dispersion-based, and melt-based electrospinning, the collection
surface onto which the spun fibers are deposited can vary and can
be dependent upon the type of electrospinning setup used. In
certain embodiments, the collection surface is a sheet, the surface
of which can be, e.g., any metal or polymeric material, with
stainless steel being a particularly preferred material. In other
embodiments, the collection surface is a tubular prosthetic device
(e.g., in the form of a stent, stent-graft, or graft). In certain
embodiments, the collection surface is a drum (i.e., a cylinder
around which a collection sheet can be wrapped), which may be
rotated during collection to generate a tubular structure. The
tubular structure can be cut along the length of the tube to
provide a sheet. In certain embodiments, the collection surface is
a rod or tube (i.e., a mandrel around which a collection sheet may
be wrapped or on which the fibers may be collected directly) which
may be rotated during the collection to generate a tubular
structure. Such a tubular structure can, in certain embodiments, be
directly used in its tubular form.
[0075] Electrospun materials produced via solution and melt
spinning are generally sufficient for manipulation immediately
following production and generally do not require any further
treatment to provide the desired fiber characteristics. However, in
dispersion-based electrospinning, the polymeric (e.g., PTFE)
mat/sheet, tube, or covered device is generally somewhat fragile
and typically must be heated and/or sintered to provide a
sufficiently strong and durable material for use as a component of
a prosthetic device according to the invention. Heating generally
serves to dry the material, volatilize and remove the fiberizing
polymer, and/or to sinter the PTFE particles (e.g., by fusion of
individual PTFE particles to produce a nonwoven, PTFE-based
material). The sintering of the material generally results in the
formation of a stronger, more durable material. The level of
sintering can vary. During heating, the material can be monitored
to evaluate the sintering level by various methods (e.g.,
calorimetry and/or visual inspection).
[0076] The material can be heated in place (i.e., by placing the
entire collection surface in an oven) or by removing the
electrospun material from the collection surface prior to heating
and placing the free electrospun material in an oven. As will be
described in greater detail herein, the PTFE sheet or tube or
PTFE-covered device can be heated and sintered alone, or in certain
embodiments, it may be combined with other components of the
composite device prior to heating. Thus, the heating and sintering
can occur at any stage of the process of assembly of the composite
prosthetic device. It is noted that the components of the composite
structure must be considered to ensure that the other components
can withstand the conditions required to sinter the PTFE (or other
dispersion-spun polymer).
[0077] The time and temperature at which the material is heated can
vary. For example, in typical embodiments, to sinter a PTFE
material (e.g., sheet, tube, or covered device), the temperature of
the oven is between about 250.degree. C. and about 800.degree. C.,
such as between about 300.degree. C. and about 500.degree. C.
(e.g., between about 350.degree. C. and about 485.degree. C.). The
(or other dispersion-spun polymeric material) is generally exposed
for a period of time such that any remaining water is evaporated
and the fiberizing polymer undergoes decomposition and subsequent
elimination of the residual material. It is noted that, in some
embodiments, PTFE can be sintered in combination with one or more
additional materials. This advantageously is only conducted where
the characteristics of the one or more additional materials are
such that the material or materials can withstand the high
temperatures required for PTFE heating/sintering). It is important
to distinguish sintering and heating steps. Sintering is generally
used only where unsintered espun PTFE (or similar dispersion-espun
polymer) is present and must be conducted in the absence of other
material that may be negatively affected by the high temperatures
required for sintering.
[0078] The time for which a dispersion-espun material is heated to
sinter the material may depend, in part, on the temperature of the
oven. In some embodiments, the material is sintered for a period of
about an hour or less, about 30 minutes or less, about 20 minutes
or less, about 15 minutes or less, or about 10 minutes or less. For
example, in certain embodiments, the sintering is conducted for a
time of between about 2 and about 30 minutes, preferably between
about 5 and about 20 minutes. It is noted that more time may be
required for sintering at lower temperature and less time may be
required for sintering at a higher temperature. The time required
for drying and sintering can also depend on the thickness of the
material, with thicker materials requiring more time to dry and/or
sinter.
[0079] The drying, volatilizing, and sintering of a dispersion-spun
material can occur simultaneously or in a series of steps. While
not intended to be limited by any theory, it is believed that some
drying (i.e., removal of the solvent) may occur upon completion of
electrospinning. It is further believed that some small degree of
fiber rearrangement may occur at this point. Then when the material
is heated, preferably, the majority of the solvent and the
fiberizing polymer (e.g., greater than about 80%, preferably
greater than about 90% or 95%, and most preferably greater than
about 98 or 99%) is removed from the PTFE material. It is
understood that espun fabric generally undergoes shrinkage upon
heating/sintering. While not limited to any theory, the shrinkage
is believed to occur in two steps: the initial drying and fiber
rearrangement following the electrospinning process, and the
removal of solvent and fiberizing polymer by heating/sintering.
Preparation and Use of Composite Prosthetic Devices
[0080] There are various means for producing the components of the
composite prosthetic devices described herein and for combining the
components to form composite devices, which will be described in
further detail herein. In general, the method comprises assembling
the one or more layers to be incorporated within the composite and
applying heat and/or pressure to provide a composite prosthetic
device.
[0081] Depending on the chemical makeup of the components and the
physical form of the one or more electrospun materials (i.e.,
whether in a sheet form, tubular form, or as a covering directly
spun onto a device) to be incorporated within the composite device,
the means by which the final structure is assembled can vary.
[0082] In certain embodiments, an electrospun polymer sheet or tube
is produced independently and then combined with the one or more
additional layers to form a composite structure. The polymer sheet
can be a single polymer sheet (e.g., a sintered PTFE mat, a PU mat,
a PDMS mat, etc.). In other embodiments, a multi-layered espun
polymer sheet ("combination sheet") can be provided. For example,
in certain embodiments, an espun PTFE mat is produced and sintered.
Another polymer is then directly electrospun onto the sintered
espun PTFE mat, producing a two-layered mat of electrospun polymer.
For example, in the preparation of mono-component composites, one
espun PTFE mat can be prepared and another espun PTFE layer can be
deposited directly thereon. In the preparation of multi-component
composites, one espun PTFE mat can be prepared and another type of
polymer can be directly electrospun thereon (e.g., PU or PDMS).
Such combination mats can be provided with varying combinations of
espun polymeric layers and with varying numbers of such layers.
[0083] A mat (a single electrospun mat or a combination sheet) can,
in certain embodiments, be "laminated" onto another material (e.g.,
onto a polymeric tube, a structural frame, or onto a covering
thereon), e.g., by wrapping the mat around the other material. This
process generally involves layering or wrapping the espun mat or
mats directly onto or around the material to be covered, giving a
prosthetic composite device precursor, and applying heat and/or
pressure thereto to provide a prosthetic composite device. The
layering or wrapping can be performed such that the sheet/layer is
wrapped one time around a construct or multiple times around the
construct (e.g., two times, three times, four times, or more
times). In some embodiments, (i.e., where a single electrospun mat
is wrapped), the number of wrappings of each sheet can affect the
thickness of that layer of the final composite. For example, a
device wherein a given electrospun mat is wrapped twice around a
construct will give a thicker layer of that electrospun material in
the final device than in a device wherein that electrospun mat is
wrapped only once around the construct. The overall wall thickness
of a device having a greater number of wrappings will thus be
thicker as well. Where a combination sheet is used, the number of
wraps will alter the number of layers of the two (or more)
components comprising the combination sheet. For example, a
combination sheet wrapped once around a construct adds two
additional layers (i.e., having different compositions from the two
polymers comprising the combination sheet). A combination sheet
wrapped twice around a construct adds four additional layers (i.e.,
alternating the two compositions from the two polymers comprising
the combination sheet). FIGS. 7A and 7B and FIGS. 7D and 7E are
comparable to one another except that the number of wrappings of
the outer two components are different, as will be described in
greater detail below.
[0084] Although in certain embodiments, the wrapping methods
described above are useful in preparing mono-component and
multi-component prosthetic devices according to the present
disclosure, the disclosure is not intended to be limited to such
methods of preparation. In some embodiments, a polymer is directly
spun onto another component of the composite prosthetic device. For
example, electrospinning can be conducted such that a polymer
covering is directly spun onto a construct (e.g., a polymeric tube
or a structural frame, such as a stent). In certain embodiments,
two or more methods can be combined (e.g., a covering can be
applied to a structural frame by directly electrospinning the
covering thereon and the resulting device can be subsequently
wrapped with a second covering and treated as described herein or a
covering can be applied to a structural frame by wrapping and a
second covering can be applied to the covered structural frame by
directly electrospinning the second covering thereon).
[0085] As noted above, the composite prosthetic devices of the
present disclosure generally incorporate at least one tie layer,
which can be incorporated within the device precursor as an
unsintered dispersion-spun layer (which is subsequently sintered
prior to use of the device) or which can be a solution-spun or
melt-spun layer (which does not require sintering prior to use of
the device). The tie layer can be applied using any of the methods
described herein. The tie layer can serve as a "glue" to bind to
another layer and preferably can be used to bind multiple layers
together. In embodiments wherein a structural frame is present, the
tie layer can penetrate the open spaces in the structural frame and
bond to the material on the other side of the structural frame
(e.g., where the tie layer is provided on the outer surface of the
structural frame, it can penetrate the frame and bond to the
material comprising the inner diameter surface of the structural
frame which may, in some embodiments, be a porous electrospun
polymeric layer). Thus, in certain embodiments, the tie layer may
serve to bond and/or connect the material on the inner diameter
surface of the composite device to the material on the outer
diameter surface of the composite device. In some embodiments, a
significant advantage to the presence of such a tie layer is that
it can serve to create a better bond and/or seal between various
layers of the composite device following the application of heat
and/or pressure to the composite device precursor. This bonding can
be characterized, for example, by an enhanced peel strength between
certain layers.
[0086] For example, in certain embodiments, the preparation of
composite devices of the present disclosure involves the
incorporation of an unsintered PTFE tie layer. The stage at which
any unsintered PTFE present in the composite device is sintered
must be such that no material is present that will be negatively
affected by the temperatures required for the sintering of the
PTFE. For example, where PU is to be included in a multi-component
composite device, any unsintered PTFE layer(s) applied to the
device should be sintered prior to the application of the PU to
avoid destroying the porous PU layer(s) during the sintering of the
PTFE layer(s). For this reason, it is noted that an unsintered PTFE
layer is generally useful as a tie layer in composites only where
the adjacent layers of the device precursor comprise PTFE or
another, similar polymer (and not in composites wherein a PU or
other, similar polymer is adjacent to the unsintered PTFE).
[0087] In certain embodiments, the preparation of composite devices
of the present disclosure involves the incorporation of a
solution-spun tie layer (e.g., including, but not limited to, PU or
PDMS). Such tie layers, which do not require sintering prior to use
of the composite device, can be advantageous as the processing of
the device does not require the structural frame, where present, to
be exposed to the high temperatures required for sintering (as
required for, e.g., a PTFE tie layer). In certain embodiment,
avoidance of such high temperatures can serve to keep the
mechanical properties and integrity of the device more intact.
[0088] The amounts and relative amounts of material in the layers
of the composite prosthetic devices described herein can vary. It
is noted that, with regard to the tie layer, in embodiments wherein
a structural frame is present, the wire/strut diameter, spacing
between the wires/struts struts, and/or the processing conditions
may impact the amount of material required to ensure sufficient
bonding of the tie layer to other layers and/or to the structural
frame. For example, large wire or strut diameters or thicknesses
may need more of the tie-layer espun polymer material as compared
to smaller wire or strut diameters (which can be provided, e.g., by
using a thicker espun sheet and/or by wrapping a sheet more times
around the device). It is noted that a structural frame with
minimal spacing between the wire or strut lattice may not perform
as well due to minimal inner diameter and outer diameter contact,
resulting in a poorly secured and embedded structural frame.
However, even structural frames with minimal spacing between the
wire or strut lattice can perform well if enough tie layer espun
polymer material is used and enough heat and/or pressure is applied
to ensure that the tie layer espun polymer can penetrate the open
spaces in the lattice. Generally, there is a certain amount of tie
layer material that must be applied to the structural frame, a
certain amount of processing (e.g., temperature and/or pressure)
that must be applied to the structural frame, there must be a
sufficient amount of open space in the frame to ensure that the
frame is not "floating" within the composite and is adequately
affixed onto or within the other layers of the composite, and the
tie layer material must have sufficient properties (e.g.,
flowability and/or tackiness) to enable it to effectively penetrate
the open spaces of the structural frame.
[0089] Following the wrapping or other means of applying one or
more layers (including one or more tie layers) to produce a
mono-component or multi-component composite prosthetic device
precursor, the device precursor is subjected to heat and/or
pressure. The application of heat and/or pressure to the precursors
as intended herein generally results in some degree of fusion
and/or merging of the various layers of the composite device
precursor (e.g., via the tie layer penetrating through the open
spaces in a structural frame and/or penetrating the pores of at
least one of the adjacent layers). In some embodiments, the
application of heat and/or pressure can also ensure that the inner
diameter surface of a composite device is bonded to the outer
diameter surface of the composite device. In embodiments wherein a
structural frame is present, application of heat and/or pressure
can advantageously seal the frame within the composite device so
that there is no delamination and/or so that the frame is
completely covered by one or more polymeric layers. In certain
embodiments, application of heat and/or pressure can result in a
decrease in effective pore size of the individual layers and/or
composite as a whole and/or can result in a decrease in individual
layer thickness and/or wall thickness of the composite as a
whole.
[0090] The amount of heat and the method by which the heat is
applied to the device precursor can also vary. In certain
embodiments, heat can be applied by heating the device precursor in
various types of chambers (e.g., heating vessel or clamshell) or by
heating the device in an oven. Where a multi-component prosthetic
device precursor is provided, heat applied at this stage is
typically significantly lower than the heat required to sinter the
dispersion-spun component or components (e.g., PTFE). The
temperature applied can vary depending on the makeup of the device
precursor, as discussed in greater detail below. Thus, in certain
embodiments, the one or more dispersion-spun components are present
in sintered form when the heat and/or pressure is applied to the
multi-component device precursor. Where a mono-component prosthetic
device precursor is provided, having one or more unsintered,
dispersion-spun layers therein, the heating step can include
sintering. In such embodiments, heat and/or pressure is applied to
the device precursor to cause the unsintered dispersion-spun tie
layer to penetrate the pores of one or both of the adjacent layers
(and, optionally, to penetrate through the open pores of the
structural frame, where present) and the heat applied can
advantageously be sufficient to sinter the one or more unsintered
dispersion-spun component. Although, in such embodiments, the heat
and/or pressure required to ensure penetration of one or more
layers as described herein may be insufficient to sinter the
unsintered dispersion-spun component, it is advantageous in some
embodiments to apply heat and/or pressure and sinter
simultaneously, i.e., by ensuring that the heat applied is
sufficient to sinter the dispersion-spun component.
[0091] In some embodiments, pressure can be applied by using a flat
press, constricting wrap, and/or mechanical nip roller. In certain
embodiments, physical pressure is applied to the device precursor
by wrapping the construct with a constricting wrap and applying
pressure, either directly or indirectly. In some embodiments, the
constricting wrap is maintained on the covered construct and the
entire device precursor, including the constricting wrap, is
heated; subsequently, the constriction wrap is removed to provide a
compressed composite device. In some embodiments, pressure can be
applied to the device precursor in a pressure vessel. Pressure
vessels of varying design and size can be useful according to the
methods provided herein. In some embodiments, the pressure vessel
can be a heated pressure vessel, allowing heat and pressure to be
applied to a device precursor simultaneously. The pressure rating
of the vessel can vary, so long as sufficient pressure may be
applied to the device precursor to allow the tie layer to penetrate
through the open spaces in a structural frame and/or to penetrate
the pores of at least one of the adjacent layers. Exemplary
pressure vessels include, but are not limited to, Non-Stirred
Pressure Vessels from Parr Instrument Company (Moline, Ill.). Other
means for the application of pressure are intended to be
encompassed herein as well. Due to the porosity of the composite
device precursors described herein, it may be necessary, in certain
embodiments, to enclose the device precursor in a non-porous
material prior to introducing it into the chamber. It is to be
understood that selection of the non-porous material must be based
on the conditions to which the device precursor will be subjected
in the chamber. For example, the non-porous material must be
capable of withstanding the elevated pressure and/or temperature
conditions within the chamber without negatively impacting the
enclosed composite device precursor and/or device.
[0092] In embodiments wherein both heat and pressure are applied to
the device precursor, it is not necessary for the heat and pressure
to be applied simultaneously, but in some embodiments, they may be
applied simultaneously (e.g., in a heated pressure vessel).
Further, it is noted that the application of pressure and/or heat
may be conducted at various stages of construction of the composite
prosthetic device. In some embodiments, pressure is applied,
followed by the application of pressure and heat. In some
embodiments, the entire device is assembled and pressure and/or
heat are applied to provide the final device. In other embodiments,
the application of pressure and/or heat can be conducted at one or
more stages during the assembly process.
[0093] The amount of heat and/or pressure advantageously applied to
prepare the composite device precursor can depend on the makeup of
the layers of the device. In specific embodiments, the applied
pressure is between about 500 and about 1500 PSI and the
temperature is at least about 50.degree. C. or at least about
100.degree. C. (e.g., between about 75.degree. C. and about
400.degree. C. or between about 100.degree. C. and about
300.degree. C.). It is understood that the time and temperature are
related, i.e., increasing the temperature at which the device
precursor is treated may allow for a decrease in the pressure
applied (particularly where the temperature and pressure are
applied simultaneously). The temperature can also depend on the
makeup of the composite device precursor. For example, where at
least one component of the precursor comprises unsintered PTFE, the
composite device is preferably heated at a temperature sufficient
to sinter the unsintered PTFE (e.g., about 385.degree. C.). Where
no unsintered espun PTFE is present in the device (e.g., where the
tie layer comprises PU or PDMS), the temperature applied is
advantageously significant lower (e.g., between about 100.degree.
C. and about 200.degree. C.).
[0094] The time at which heat and/or pressure is applied can also
vary; generally, the device precursor must be exposed to the heat
and/or pressure for a sufficient period of time to ensure that the
tie layer can penetrate through the open spaces in a structural
frame and/or can penetrate the pores of at least one of the
adjacent polymeric layers (e.g., at least about 3 minutes, at least
about 5 minutes, or at least about 7 minutes, including between
about 3 and about 20 minutes, between about 5 and about 15 minutes,
between about 5 and about 10 minutes, and between about 5 and about
7 minutes). Although such times are noted to be useful, it is
understood that in some embodiments, the composite device can be
heated for lesser or more amounts of time. Generally, the heat
and/or pressure should be applied for a period of time sufficient
for bonding. The time is also related to the heat and/or pressure,
such that in some embodiments, treatment of the device precursor at
a higher temperature and/or pressure may require less time than
treating that same device precursor at a lower temperature and/or
pressure. It is understood, however, that there is some minimum
temperature and/or pressure that will be required to ensure the
device exhibits penetration of the tie layer through the open
spaces in a structural frame and/or to ensure penetration of the
tie layers into the pores of at least one of the adjacent layers
(e.g., in certain embodiments, ensuring bonding between the inner
diameter surface of the composite device and the outer diameter
surface of the device).
[0095] In some embodiments, the melt flow characteristics of a tie
layer polymer may affect the choice of heat and/or pressure to be
applied. For example, a tie layer comprising a polymer with a
higher melt flow rate may require less heat and/or pressure to
ensure that the tie layer effectively penetrate the pores of at
least one of the adjacent layers, whereas a polymer with a tie
layer comprising a lower melt flow rate may require more. Further,
the presence of a structural frame may impact the amount of heat
and/or pressure to be applied to the device precursor. In some
embodiments, greater heat and/or pressure may be required to ensure
that the tie layer can penetrate through the open spaces in the
frame.
[0096] Additionally, a composite device comprising a structural
frame with a thick wire or strut may not be prepared in the same
way as a device comprising a structural frame with a thin wire or
strut. For example, in some embodiments, a frame with a thick wire
or strut or a frame with narrow spaced wires or struts may require
more electrospun polymeric material (e.g., a thicker covering), may
require the use of an electrospun polymeric material having a
greater ability to flow and penetrate the open spaces (e.g., a
polymer having a higher melt flow rate), and/or may require greater
heating and/or pressure applied thereto to ensure that the covering
can penetrate the open spaces within the frame. The spacing between
wires or struts of a structural frame may similarly affect the
materials and parameters of the methods used to form a composite
device comprising the frame. For example, in some embodiments,
where the structural frame has widely-spaced wires or struts (e.g.,
with amplitudes spaced relatively far apart and/or having fewer
wires or struts), less heat and/or pressure may be required than
for a comparable embodiment wherein the structural frame closely
spaced wires or struts (e.g., with amplitudes closer together
and/or having more wires or struts).
[0097] In embodiments wherein a thermoset polymer is employed
(e.g., as a tie layer) in the composite prosthetic device
precursor, the thermoset polymer is advantageously heat-cured
during the application of heat and/or pressure as described above.
In some embodiments, this curing requires a higher temperature than
those noted above, e.g., at least about 200.degree. C. In some
embodiments, a thermoset polymer is employed that is cured through
radiation. Advantageously, in embodiments wherein a thermoset
polymer is used, it is not cured until during or after the heat
and/or pressure treatment described above, such that it can flow
into the pores of one or more adjacent layers in uncured form and
subsequently be cured to provide a composite prosthetic device.
[0098] The layered approach to preparing the composite devices
described herein provides the ability to tailor devices for
particular applications. Tailoring as used herein refers to the
ability to produce and use various materials with various
properties. In some embodiments, tailoring relates to the process
conditions used in espinning; by varying the parameters of the
method, polymeric sheets, tubes, or covered constructs having
different physical properties can be obtained. For example, where a
thicker polymeric mat/tube (or a thicker covering directly spun
onto a construct) is desired, the espinning process can be
conducted for a longer period of time to deposit more material. As
another example, where a polymeric mat with smaller pore size is
desired, a thicker mat can be prepared, which typically results in
a decreased pore size. In some embodiments, a smaller pore size can
be obtained by decreasing the targeted fiber diameter. In some
embodiments, tailoring relates to the method of assembly of the
composite device. For example, where a thicker polymeric layer
within the device is desired, a given polymeric mat can be wrapped
around the composite device precursor a greater number of times.
Thus, tailoring the properties of a given layer of the composite
device can be done in various ways, relating to the production of
the espun layer and/or the application of the espun layer to the
composite device. In further embodiments, where a device having one
or more impermeable portions is desired, a thermoplastic polymeric
film may be incorporated within the composite device.
[0099] Further, as noted above, various additives, e.g., bioactive
agents, can be included in one or more of the layers of the device.
Such optional bioactive agents can be incorporated within composite
devices in a variety of ways. For example, in some embodiments, the
one or more bioactive agents can be directly incorporated into the
fibrous mats by including them in a dispersion, solution, or melt
that is espun, or the one or more bioactive agents can be
incorporated into a layer or into the composite device after the
fibers are prepared, e.g., by applying the bioactive agents, e.g.,
in solution form, onto/into the layer or device. Certain exemplary
means for the incorporation of bioactive agents are described in
U.S. application Ser. No. 13/272,412 to Ballard et al., filed Oct.
13, 2011, which is incorporated herein by this reference in its
entirety. Although the referenced application is directed to the
incorporation of antimicrobial agents, the antimicrobial agent
could be replaced with the desired bioactive agent in the methods
described herein.
[0100] The properties and characteristics of the final composite
prosthetic device produced may be impacted by the application of
heat and/or pressure. For example, the degree of heating (i.e.,
time and temperature), the amount of pressure applied, and the
method by which the pressure is applied may affect the overall
quality of the final composite. If there is not enough heat and/or
pressure, poor bonding and delamination may occur, resulting in
weak adhesion of the layers to each other. Additionally, without
sufficient heat and/or pressure, some portion of the structural
frame, where present, may be exposed (i.e., uncovered), which in
certain embodiments is not desirable. Further, without sufficient
heat and/or pressure, the structural frame, where present, may move
within the composite device, which is typically undesirable.
[0101] The application of heat and/or pressure can have varying
impacts on the composite prosthetic device. Generally, the
application of heat and/or pressure results in some degree of
fusion and/or merging of the various layers of the composite
device. Advantageously, heat and/or pressure can serve to aid in
the penetration of the material comprising the tie layer of the
composite into the pores of one or both of the layers adjacent
thereto. Where a structural frame is present, the heat and/or
pressure can, in some embodiments, cause the tie layer to penetrate
the open spaces in the frame. The heat and/or pressure is thus
preferably such that the tie layer of the prosthetic device
precursor is moldable or flows to some extent into the pores of
adjacent layers (and, optionally, through the open spaces of a
structural frame, where present). Where the tie layer of the
composite device precursor comprises an unsintered, dispersion-spun
fibrous mat (e.g., PTFE), additional heating is generally required
to sinter the material. However, where the tie layer of the
composite device precursor comprises a solution-spun material
(e.g., PU or PDMS), such high temperatures are not required to
provide the final product.
[0102] Use of a tie layer as described above (for example, in the
form of an unsintered dispersion electrospun fibrous layer (e.g.,
PTFE) or a solution-spun fibrous layer (e.g., PU or PDMS)) between
two or more other layers (and optionally through the open spaces of
a structural frame) can provide significantly increased bonding
between those layers following the application of heat and/or
pressure (and, optionally, sintering, in the case of PTFE). This is
especially noted in embodiments incorporating a tie layer adjacent
to a structural frame, where the tie layer can bond to an
additional polymeric layer (of various types) through the
structural frame, in some embodiments, encapsulating the structural
frame within the device. For example, a tie layer can, in certain
embodiments, bond through a structural frame to a porous
electrospun polymeric layer comprising the internal diameter
surface covering of the composite device. The tie layer can also,
in some embodiments, bond to an additional porous electrospun layer
adjacent thereto, e.g., by penetrating the pores thereof. The
composite devices described herein can, in certain embodiments,
exhibit greater peel strengths between adjacent layers, which can
result in enhanced performance of the resulting composite.
[0103] In certain embodiments, the application of heat and/or
pressure to the composite prosthetic device precursor can result in
a decrease in effective pore size of the walls of the device and/or
can result in a decrease in the overall wall thickness of the
device. In certain embodiments, the heat and/or pressure applied to
the device precursor may impact the pore size and/or the thickness
of one or more individual espun layers. An increase in pressure
and/or temperature may be associated with a decrease in pore size
and/or a decrease in the layer thickness. For example, a PU or
other meltable polymer would be expected to flow to some extent
upon the application of heat and/or pressure, thus reducing the
effective pore size of the PU layer relative to the PU layer prior
to the application of heat and/or pressure. However, polymers
electrospun from solution (e.g., PU and PDMS), when incorporated
within the composite structures by any of the means described
herein, unexpectedly can exhibit some degree of porosity, even
after the application of heat and/or pressure to ensure sufficient
fusion between the layers of the final device. The effective pore
sizes of certain layers can thus be controlled to some extent by
both electrospinning conditions used to prepare the electrospun
layer and by the treatment to which the layers are subjected within
the composite device. In some embodiments, the effective pore size
of the composite as a whole may not be reflective of the
combination of effective pore sizes of the individual layers.
Consequently, in some embodiments, the methods described herein
provide devices incorporating thermoplastic polymers or thermoset
polymers which exhibit some overall degree of porosity.
[0104] In some embodiments, varying the materials as well as the
temperature and/or pressure at which the device is processed can
provide devices exhibiting varying degrees of porosity, as
evidenced by the ability to obtain effective pore size measurements
of the device as a whole. As, in many embodiments, it is desirable
to maintain pores in the final device, the materials and methods
can be selected so as to ensure that porosity is maintained. The
retention of some degree of porosity in an electrospun mat can be
impacted, for example, by the melting point of the polymer and/or
by the melt flow viscosity. Various parameters can affect these
parameters including, but not limited to, the molecular weight of
the polymer and the degree of branching within the polymer
backbone. Consequently, a wide range of polymers can be tailored
and optimized for use according to the present invention by varying
these and other parameters and/or by blending two or more different
types of polymers.
[0105] Exemplary preparation methods for certain composite
prosthetic devices according to the present disclosure are further
described and exemplified below. It is noted that these categories
are not intended to be exclusive. In other words, two composite
devices can, in certain embodiments, be separately prepared and
combined. Accordingly, in some embodiments, two composites devices
or components thereof can be separately prepared; subsequently, one
composite can be wrapped around or inserted into another composite,
and pressure and/or heat can be applied the entire combined
composite structure to form a single composite prosthetic device.
As another example, a polymer-based composite can be combined with
a composite prosthetic device including a structural frame, e.g.,
by separately preparing the two device types and wrapping the
polymer-based composite around the composite prosthetic device
including a structural frame or inserting it into the inner
diameter of the composite prosthetic device including a structural
frame. Again, heat and/or pressure can then be applied to the
entire structure to form a single composite prosthetic device. All
combinations, as well as singular composite prosthetic devices as
described herein are intended to be encompassed by the present
disclosure.
[0106] Certain exemplary composite devices of the present
disclosure and representative methods for preparing each are
provided in FIGS. 7-11. These are only exemplary constructions and
exemplary means for preparing such constructions. These schematics
provided in the figures and described herein are presented only to
give exemplary means by which the principles described herein can
be applied to certain specific components (to generate the
representative constructs illustrated in FIGS. 7A-7F).
[0107] FIG. 8 illustrates an exemplary preparation of the composite
devices illustrated in FIGS. 7A and 7B. Briefly, an electrospun
PTFE mat is prepared, sintered, and wrapped, e.g., around a
hypotube, to form a tubular structure 70. A structural frame 72 is
applied around structure 70, giving a frame-containing structure
74. An unsintered mat of espun PTFE 76 is wrapped around the
structural frame (e.g., to serve as a tie layer) and a sintered
espun PTFE mat 78 is wrapped around unsintered mat 76. Pressure and
heat are applied to the resulting composite device precursor 80,
sufficient to sinter the unsintered PTFE of tie layer 76, giving a
mono-component device 82.
[0108] Independently, an electrospun PTFE sheet 84 is prepared and
sintered; a combination PU/PTFE sheet 86 is prepared by
electrospinning PU directly onto sheet 84. The combination sheet is
wrapped around mono-component construct 82, with the PU layer laid
directly against the outer surface of construct 82. The entire
device precursor is then simultaneously subjected to pressure and
heat. The multi-component cross-section on the left (88) depicts
the result of the above process wherein the combination sheet is
wrapped twice around the construct and the multi-component
cross-section on the right (90) depicts the result of the above
process wherein the combination sheet is wrapped once around the
construct.
[0109] As such, in one embodiment, the present disclosure provides
a method for producing a composite prosthetic device comprising:
applying a structural frame over a porous electrospun
poly(tetrafluoroethylene) tubular structure; wrapping an unsintered
poly(tetrafluoroethylene) mat around the structural frame (one or
more times); wrapping a sintered poly(tetrafluoroethylene) mat
around the unsintered poly(tetrafluoroethylene) mat (one or more
times); and heating the resulting construct to sinter the
unsintered poly(tetrafluoroethylene). In certain embodiments, such
a method can further comprise preparing a combination electrospun
mat by electrospinning a different polymer onto a sintered
poly(tetrafluoroethylene) mat; wrapping the combination electrospun
mat around the construct (one or more times, with the different
polymer surface of the mat in contact with the construct) to give a
precursor; and applying heat and pressure to provide a composite
prosthetic device.
[0110] FIG. 9 illustrates an exemplary preparation of the composite
device illustrated in FIG. 7C. The method is initially identical to
that described above with regard to the method illustrated in FIG.
8. However, a single PU sheet 92 is independently prepared and
wrapped around mono-component construct 82, rather than the
combination sheet depicted in FIG. 8. The entire device precursor
is then subjected to pressure and heat to give a multi-component
composite device 94.
[0111] As such, in one embodiment, the present disclosure provides
a method for producing a composite prosthetic device comprising:
applying a structural frame over a porous electrospun
poly(tetrafluoroethylene) tubular structure; wrapping an unsintered
poly(tetrafluoroethylene) mat around the structural frame (one or
more times); wrapping a sintered poly(tetrafluoroethylene) mat
around the unsintered poly(tetrafluoroethylene) mat (one or more
times); heating the resulting construct to sinter the unsintered
poly(tetrafluoroethylene); wrapping an electrospun mat comprising a
different polymer around the construct (one or more times) to give
a precursor; and applying heat and pressure to provide a composite
prosthetic device.
[0112] FIG. 10 illustrates an exemplary preparation of the
composite device illustrated in FIGS. 7D and 7E. As in the methods
of FIGS. 8 and 9, a frame-containing structure 74 is prepared by
combining a sintered PTFE tube and a structural frame.
Independently, an electrospun PTFE sheet 84 is prepared and
sintered; a combination PU/PTFE sheet 86 is prepared by
electrospinning PU directly onto sheet 84. The combination sheet is
wrapped around structure 74, with the PU layer laid directly
against the outer surface (i.e., the structural frame) of structure
74. The entire device precursor is then subjected to pressure and
heat simultaneously. The cross-section on the left (96) depicts the
result of the above process wherein the combination sheet is
wrapped once around the construct and the multi-component
cross-section on the right (98) depicts the result of the above
process wherein the combination sheet is wrapped twice around the
construct.
[0113] As such, in one embodiment, the present disclosure provides
a method for producing a composite prosthetic device comprising:
applying a structural frame over a porous electrospun
poly(tetrafluoroethylene) tubular structure; preparing a
combination electrospun mat by electrospinning a different polymer
onto a sintered poly(tetrafluoroethylene) mat; wrapping the
combination electrospun mat around the construct (one or more
times, with the different polymer mat surface in contact with the
construct) to give a precursor; and applying heat and pressure to
provide a composite prosthetic device.
[0114] FIG. 11 illustrates an exemplary preparation of the
composite device illustrated in FIG. 7F. An electrospun PTFE sheet
100 is prepared and sintered; a combination PU/PTFE sheet 102 is
prepared by electrospinning PU directly onto sheet 100. Combination
sheet 102 is wrapped to form a tubular structure (with the PTFE on
the interior of the structure), which is then compressed to give
structure 104. A structural frame 72 is applied around the
compressed, tubular material to give frame-containing structure
106. Independently, an additional espun PTFE sheet 84 is prepared
and sintered and a second combination PU/PTFE sheet 86 is prepared
by electrospinning PU directly onto sheet 84. Sheet 86 is then
wrapped around structure 106, with the PU layer laid directly
against the outer surface (i.e., the structural frame) of structure
106. The resulting device precursor is subjected to pressure and
heat to give multi-component prosthetic device 108.
[0115] As such, in one embodiment, the present disclosure provides
a method for producing a composite prosthetic device comprising:
preparing a combination electrospun mat by electrospinning a
different polymer onto a sintered poly(tetrafluoroethylene) mat;
forming the combination electrospun mat into a tubular structure
having two or more alternating layers, wherein the
poly(tetrafluoroethylene) surface of the mat is on the inner
surface of the tubular structure and the different polymer surface
of the mat is on the outer surface of the tubular structure;
applying a structural frame over the outer surface of the tubular
structure; preparing a second combination electrospun mat by
electrospinning a different polymer onto a sintered
poly(tetrafluoroethylene) mat; wrapping the combination electrospun
mat around the construct (one or more times, with the different
polymer mat surface in contact with the construct) to give a
precursor; and applying heat and pressure to provide a composite
prosthetic device.
EXAMPLES
Mono-Component Devices
Example 1
Espun PTFE/Espun PTFE/Espun PTFE
[0116] An espinning dispersion based on a mixture of 5.2%
(PEO/PTFE) 300,000 amu polyethylene oxide and Daikin DX-9030, 60%
PTFE dispersion in water is prepared, allowed to homogenize, and
turned and filtered to achieve a smooth consistency. A 0.002''
thick stainless steel foil sheet (15.5''.times.17.5'') is mounted
on a conductive fabric. The stainless foil is passed into the
espinning chamber where PTFE fibers are to be deposited. The
dispersion is espun using a total potential of 80 kV to facilitate
formation of PTFE fibers, which collect in random formation on the
stainless steel foil. The stainless steel foil containing the PTFE
membrane is removed from the fabric and sintered at 385.degree. C.
until fully sintered (e.g., about 5 minutes).
[0117] The 0.0008'' sintered espun PTFE sheet, removed from the
stainless foil, is wrapped twice around a 0.50'' exterior diameter
(OD) stainless steel hypotube. The electrospinning process is
repeated to give a second espun PTFE sheet. The espun PTFE sheet, a
0.0018'' unsintered espun PTFE sheet, is removed from the stainless
foil and wrapped twice around the sintered espun PTFE layer. The
electrospinning process is repeated to give a third espun PTFE
sheet, which is then sintered. The third espun PTFE sheet, a
0.0018'' sintered espun PTFE sheet, is removed from the stainless
foil after sintering and wrapped twice around the unsintered espun
PTFE layer to create a tube assembly consisting of sintered espun
PTFE/unsintered espun PTFE/sintered espun PTFE. The entire
construction is then compressed together and heated/sintered at
385.degree. C. for about 5-15 minutes (until fully bonded, as
evidenced by lack of delamination), followed by water quenching as
a means to cool down the sample. The composite device is then
removed from the hypotube and tested for specified properties. The
thickness of the construction was found to be approximately 0.005''
and the effective pore size was found to be approximately 1.5
.mu.m.
Example 2
Espun PTFE/Stent/Espun PTFE/Espun PTFE
[0118] Example 2 is made similarly to Example 1 with the addition
of a wire stent frame as an additional layer of the composite. An
espinning dispersion based on a mixture of 5.2% (PEO/PTFE) 300,000
amu polyethylene oxide and Daikin DX-9030, 60% PTFE dispersion in
water is prepared, allowed to homogenize, and turned and filtered
to achieve a smooth consistency. A 0.002'' thick stainless steel
foil sheet (15.5''.times.17.5'') is mounted on a conductive fabric.
The stainless foil is passed into the espinning chamber where PTFE
fibers are to be deposited. The dispersion is espun using a total
potential of 80 kV to facilitate formation of PTFE fibers, which
collect in random formation on the stainless steel foil. The
stainless steel foil containing the PTFE membrane is removed from
the fabric and sintered at 385.degree. C. for 5 minutes.
[0119] The 0.0008'' sintered espun PTFE sheet, removed from the
stainless foil, is wrapped twice around a 0.50'' exterior diameter
(OD) stainless steel hypotube. A metal stent frame is then applied
over this 0.0008'' sintered espun PTFE sheet. The electrospinning
process is repeated to give a second espun PTFE sheet. The espun
PTFE sheet, a 0.0018'' unsintered espun PTFE sheet, is removed from
the stainless foil and wrapped twice around the stent. The
electrospinning process is repeated to give a third espun PTFE
sheet, which is then sintered. The third espun PTFE sheet, a
0.0018'' sintered espun PTFE sheet, is removed from the stainless
foil after sintering and wrapped twice around the unsintered espun
PTFE layer to create a tube assembly consisting of sintered espun
PTFE/stent/unsintered espun PTFE/sintered espun PTFE. The entire
construction is then compressed together and heated/sintered at
385.degree. C. for 15 minutes, followed by water quenching as a
means to cool down the sample. The composite device is then removed
from the hypotube and tested for specified properties. The
thickness of such a construction is found to approximately 0.005''
and the effective pore size was found to be approximately 1.5
.mu.m.
Multi-Component Devices
Example 3
Espun PTFE/Espun PVDF/Espun PTFE
[0120] An espinning dispersion based on a mixture of 5.2%
(PEO/PTFE) 300,000 amu polyethylene oxide and Daikin DX-9030, 60%
PTFE dispersion in water is prepared, allowed to homogenize, and
turned and filtered to achieve a smooth consistency. A 0.002''
thick stainless steel foil sheet (15.5''.times.17.5'') is mounted
on a conductive fabric roll with a payoff and take-up mounted above
a spinning electrode. A total potential of 80 kV is employed to
facilitate formation of PTFE fibers, which collect in random
formation on the stainless steel foil. The stainless steel foil
containing the PTFE membrane is removed from the fabric and
sintered (if desired) at 385.degree. C. for 5 minutes.
[0121] A 0.0015'' thick stainless foil sheet 17''.times.18.5'' is
wrapped around a rotating drum. The drum assembly is placed into a
rotating chuck such that it is positioned to allow espinning along
the entire length of the turning drum assembly. An espinning
solution based on a mixture of 25% Atofina Kynar 740 polyvinylidene
fluoride (PVDF) and a 50/50 (by volume) mixture of acetone and
dimethyl formamide is allowed to dissolve and mix using a heated
stir plate set to 75.degree. C. at 500 rpm for 1 hour. A voltage of
15.0 kV is employed to facilitate formation of PVDF fibers, which
collect in random formation on the stainless foil sheet. The
stainless soil sheet containing the PVDF mat is removed from the
drum and dried for 1 hour at room temperature.
[0122] A 0.001'' sintered espun PTFE sheet, removed from the
stainless foil, is wrapped twice around a 0.50'' exterior diameter
(OD) stainless steel hypotube. The 0.001'' espun PVDF sheet,
removed from the stainless foil, is wrapped twice around the
sintered espun PTFE layer. Finally, a 0.001'' sintered espun PTFE
sheet is wrapped twice around the espun PVDF layer to create a tube
assembly consisting of sintered espun PTFE/espun PVDF/sintered
espun PTFE. The entire construction is then compressed together
prior to heating/sintering at 370.degree. C. for 15 minutes
followed by water quenching as a means to cool down the sample. The
composite is then removed from the hypotube and tested for
specified properties.
Example 4
Espun PTFE/Stent/Espun PVDF/Espun PTFE
[0123] Example 4 is made similarly to Example 3 with the addition
of a wire stent frame as another support layer. An espinning
dispersion based on a mixture of 5.2% (PEO/PTFE) 300,000 amu
polyethylene oxide and Daikin DX-9030, 60% PTFE dispersion in water
is prepared, allowed to homogenize, and turned and filtered to
achieve a smooth consistency. A 0.002'' thick stainless steel foil
sheet (15.5''.times.17.5'') is mounted on a conductive fabric roll
with a payoff and take-up mounted above a spinning electrode. A
total potential of 80 kV is employed to facilitate formation of
PTFE fibers, which collect in random formation on the stainless
steel foil. The stainless steel foil containing the PTFE membrane
is removed from the fabric and sintered (if desired) at 385.degree.
C. for 5 minutes.
[0124] A 0.0015'' thick stainless foil sheet 17''.times.18.5'' is
wrapped around a rotating drum. The drum assembly is placed into a
rotating chuck such that it is positioned to allow espinning along
the entire length of the turning drum assembly. An espinning
solution based on a mixture of 25% Atofina Kynar 740 polyvinylidene
fluoride (PVDF) and a 50/50 (by volume) mixture of acetone and
dimethyl formamide is allowed to dissolve and mix using a heated
stir plate set to 75.degree. C. at 500 rpm for 1 hour. A voltage of
15.0 kV is employed to facilitate formation of PVDF fibers, which
collect in random formation on the stainless foil sheet. The
stainless soil sheet containing the PVDF mat is removed from the
drum and dried for 1 hour at room temperature.
[0125] A 0.001'' sintered espun PTFE sheet, removed from the
stainless foil, is wrapped twice around a 0.50'' exterior diameter
(OD) stainless steel hypotube. A metal stent frame is then applied
over this 0.001'' sintered espun PTFE sheet. The 0.001'' espun PVDF
sheet, removed from the stainless foil, is wrapped twice around the
metal stent. Finally, a 0.001'' sintered espun PTFE sheet is
wrapped twice around the espun PVDF layer to create a tube assembly
consisting of sintered espun PTFE/stent/espun PVDF/sintered espun
PTFE. The entire construction is then compressed together prior to
heating/sintering at 370.degree. C. for 15 minutes followed by
water quenching as a means to cool down the sample. The composite
is then removed from the hypotube and tested for specified
properties.
Example 5
Espun PTFE/Stent/Espun PU/Espun PTFE
[0126] A sintered espun PTFE sheet, prepared as described herein,
is wrapped twice (could be more or less) around a metal hypotube
(of any diameter) and sintered at 385.degree. C. for 5 minutes (to
prevent the PTFE layers from delaminating from one another) to form
a sintered, espun PTFE tube (inner diameter surface) around the
metal hypotube. This represents the ID surface of the device. A
structural frame may or may not be applied over this sintered espun
PTFE tube. The OD surface consists of a wrapped sheet, wrapped
twice (as shown in FIG. 7E, but could be more or less) around the
metal frame or sintered espun PTFE tube (if no metal frame is
present). The wrapped sheet is a combination sheet that consists of
PU espun (from solution) onto an espun PTFE sheet (prepared by
spinning a dispersion), whereby the PU is in direct contact with
the metal frame or sintered espun PTFE tube (if no metal frame is
present). Thus, the OD surface is a sandwich of alternating layers
of PU and PTFE (the number of layers dependent on the number of
wraps). The espun PU can be either porous (more fiber-like) or
non-porous (more film-like) depending on run conditions. The espun
PU layer can also range in thickness, being as thin as 0.0001''.
Pressure and heat are then applied simultaneously to the device to
bond all layers into one component. The thickness of the composite
is based on the number of wraps and the thickness of the input
material. The pore size is dependent on the processing of the input
material as well as number of wraps.
Example 6
Espun PTFE/Stent/Espun PDMS/Espun PTFE
[0127] A sintered espun PTFE sheet, prepared as described herein,
is wrapped twice (could be more or less) around a metal hypotube
(of any diameter) and sintered at 385.degree. C. for 5 minutes (to
prevent the PTFE layers from delaminating from one another) to form
a sintered, espun PTFE tube (inner diameter surface) around the
metal hypotube. This represents the ID surface of the device. A
structural frame may or may not be applied over this sintered espun
PTFE tube. The OD surface consists of a sheet wrapped twice (could
be more or less) around the metal frame or sintered espun PTFE tube
(if no metal frame is present). The wrapped sheet consists of PDMS
espun (from solution) onto an espun PTFE sheet (prepared by
spinning a dispersion), whereby the PDMS is in direct contact with
the metal frame or sintered espun PTFE tube (if no metal frame is
present). Thus, the OD is a sandwich of alternating layers of PDMS
and PTFE (the number of layers dependent on the number of wraps).
The espun PDMS can be either porous (more fiber-like) or non-porous
(more film-like) depending on run conditions. The espun PDMS layer
can also range in thickness, being as thin as 0.0001''. Pressure
and heat are then applied simultaneously to the device to bond all
layers into one component. The thickness of the composite is based
on the number of wraps and the thickness of the input material. The
pore size is dependent on the processing of the input material as
well as number of wraps.
[0128] Many modifications and other embodiments of the invention
will come to mind to one skilled in the art to which this
disclosure pertains having the benefit of the teachings presented
in the foregoing description. Therefore, it is to be understood
that the invention is not to be limited to the specific embodiments
disclosed and that modifications and other embodiments are intended
to be included within the scope of the appended claims. Although
specific terms are employed herein, they are used in a generic and
descriptive sense only and not for purposes of limitation.
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