Wafer Polishing Pad Holder Template

Abstract

A system for processing wafers that will reduce the amount of time required for polishing wafers, increase worker safety while performing the process and increase the percentage of acceptable wafers after processing.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates generally to wafer polishing pads and, more specifically, to a wafer polishing pad holder having a cavity for placing one or more polishing pad disc(s) components in the cavity. The components comprise spacer disc(s) and polishing pad disc(s) with the cavity also retaining aqueous solutions ranging from water to abrasive slurries.

[0003] The walls of the holder cavity are designed with any numbers of recesses so that the spacer disc(s) and polishing pad disc(s) can be manufactured with or without peripheral tabs of substantially similar shape as the recesses thereby providing spacer disc(s) and polishing pad disc(s) that will rotate during the polishing process or not rotate during the process.

[0004] 2. Description of the Prior Art

[0005] There are other polishing pads designed for polishing wafers. While these devices may be suitable for the purposes for which they where designed, they would not be as suitable for the purposes of the present invention as heretofore described.

[0006] It is thus desirable to provide a polishing pad holder having a base with a peripheral wall where disc components of the polishing process can be placed therein.

[0007] It is further desirable to provide recesses with the interior of the peripheral wall so that the polishing pad components can be manufactured as rotative or non-rotative disc components of the polishing process.

SUMMARY OF THE PRESENT INVENTION

[0008] Polishing wafers to millimeter thicknesses is fraught with pitfalls beyond the operators' control. Simply because it is a mechanical process involving fluid dynamic and the rotational speed of the article to be polished that easily results in a small percentage of acceptable wafers. Currently, assembling a polishing pad for mounting workpieces thereto mandates diligence, care and man hours.

[0009] The present invention provides a system that will reduce man hours required, increase worker safety by not having to attach a polishing pad to the polishing table or plate for each wafer polishing cycle.

[0010] The system of the present invention provides a polishing pad holder having a cavity where components of the polishing process are mounted within the cavity to effect a predetermined result on the wafer workpieces.

[0011] Furthermore, the system provides for rotating and non rotating disc components within the cavity. Again providing the ability to vary the polishing process applied to the wafer depending on the type of wafer material and the desired result.

[0012] A primary object of the present invention is to provide a polishing pad holder having a base with a peripheral wall rising therefrom for receiving at least one polishing pad component therein.

[0013] Another object of the present invention is to provide a polishing pad holder where the peripheral wall has a plurality of recesses therein.

[0014] Yet another object of the present invention is to provide a polishing pad holder that will retain aqueous solutions within said cavity during a wafer polishing process.

[0015] Still yet another object of the present invention is to provide spacers and polishing pads with and without peripheral tabs of similar shape as the peripheral wall recesses so that said spacers and polishing pad can be rotating or non-rotating within said cavity during the polishing process.

[0016] Additional objects of the present invention will appear as the description proceeds.

[0017] The present invention overcomes the shortcomings of the prior art by providing a system for processing wafers that will reduce the amount of time required for polishing wafers, increase worker safety while performing the process and increase the percentage of acceptable wafers after processing.

[0018] The foregoing and other objects and advantages will appear from the description to follow. In the description reference is made to the accompanying drawings, which forms a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments will be described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that structural changes may be made without departing from the scope of the invention. In the accompanying drawings, like reference characters designate the same or similar parts throughout the several views.

[0019] The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is best defined by the appended claims.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

[0020] In order that the invention may be more fully understood, it will now be described, by way of example, with reference to the accompanying drawing in which:

[0021] FIG. 1 is an illustrative view of the present invention in use.

[0022] FIG. 2 is a perspective view of the base of the polishing pad holder of the present invention.

[0023] FIG. 3 is a perspective bottom view of the base of the polishing pad holder.

[0024] FIG. 5 is an illustrative view of the assembled polishing pad holder.

[0025] FIG. 6 is an illustrative view of the polishing pad holder having slurry held therein.

[0026] FIG. 7 is an illustrative view of the polishing pad holder having water held therein.

[0027] FIG. 8 is an illustrative view of the polishing pad holder.

[0028] FIG. 9 is an illustrative view of the polishing pad holder.

[0029] FIG. 10 is an illustrative view of the present invention.

[0030] FIG. 11 is an illustrative view of the present invention.

[0031] FIG. 12 is an illustrative view of the present invention.

[0032] FIG. 13 is an illustrative view of the present invention.

[0033] FIG. 14 is an illustrative view of the present invention.

[0034] FIG. 15 is an illustrative view of one partially assembled embodiment of a

[0035] FIG. 16 is an illustrative view of an assembled embodiment of the present invention.

[0036] FIG. 17 is an illustrative view of the present invention.

DESCRIPTION OF THE REFERENCED NUMERALS

[0037] Turning now descriptively to the drawings, in which similar reference characters denote similar elements throughout the several views, the figures illustrate the Wafer Polishing Pad Holder Template of the present invention. With regard to the reference numerals used, the following numbering is used throughout the various drawing figures.

[0038] 10 Wafer Polishing Pad Holder Template of the present invention

[0039] 12 rotating head

[0040] 14 workpiece template

[0041] 16 polishing machine

[0042] 18 polishing pad

[0043] 20 pad holder base

[0044] 21 top peripheral side of 20

[0045] 22 bottom of 20

[0046] 24 milled island of 20

[0047] 25 ribs of 20

[0048] 26 milled recessed notch

[0049] 27 non-spin disc tab

[0050] 28 inside pocket

[0051] 30 adhesive layer of 20

[0052] 32 paper cover of 30

[0053] 34 polishing pad holder ring

[0054] 35 bottom side of 34

[0055] 36 double side tape of 34

[0056] 38 paper backing of 36

[0057] 40 cavity

[0058] 42 non-metallic material

[0059] 44 clear, shiny Mylar disc

[0060] 46 slurry

[0061] 48 water

[0062] 50 non-spin polishing disc

[0063] 52 red disc surface

[0064] 54 black disc surface

[0065] 56 double sided polishing pad accessory

[0066] 58 Napcon material film

[0067] 60 non-spin spacer

[0068] 62 top of 34

[0069] 64 plastic surface disc

[0070] 66 hard polishing pad

[0071] 68 soft polishing pad

[0072] 70 spin spacer or disc

[0073] 72 polishing pad material one

[0074] 74 polishing pad material two

[0075] 76 milled disc

[0076] 78 process one assembly

[0077] 80 process two assembly

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0078] The following discussion describes in detail one embodiment of the invention (and several variations of that embodiment). This discussion should not be construed, however, as limiting the invention to those particular embodiments, practitioners skilled in the art will recognize numerous other embodiments as well. For definition of the complete scope of the invention, the reader is directed to appended claims.

[0079] FIG. 1 is an illustrative view of the present invention in use. The present invention is a revolutionary polishing pad holder template 10 that achieves quick change of pad, quick pad dressing process, less labor, lower injury occurrence, reduces down time and provides better polishing results. The special design of "quick change" polishing pad allows the ability to stock polishing pad and final polishing pad on the same machine. Shown is the rotating head 12, workplace template 14, polishing machine 16 and polishing pad 18.

[0080] FIG. 2 is a perspective view of the base of the polishing pad holder of the present invention. Shown is the pad holder base 20 manufactured of non metal material or any fiberglass material with a bottom peripheral side 22, a grid-like plurality of ribs 23 defining milled island(s) 24 forming the inside pocket 28 of the pad holder for back pressure relief. The milled islands 24 can be cut in any desired shape and size with the number of milled notches 26 a design consideration and can be more or less than the number depicted serving to prevent ring spin-off.

[0081] FIG. 3 is a perspective bottom view of the polishing pad holder base 20. Shown is an adhesive layer 30 on the back side 22 of the pad holder base 20 having a peelable removable paper liner 32 so that when removed the adhesive layer 30 on the base will adhere to any polishing machine table or platen.

[0082] FIG. 4 is an illustrative view of the bottom side 35 of the polishing pad holder ring 34. Shown is the polishing pad holder ring 34 having double sided tape 36 with a peelable removable paper backing 38 so that when removed it can be fixedly attached to the aforementioned polishing pad holder base. The ring is also preferably manufactured from a non-metallic material 42. As illustrated, a predetermined plurality of milled notches 26 are disposed within the interior ring wall so that when mounted to the holder base forms a cavity 40 for mounting rotating and non-rotating spacer discs, milled disc(s), mylar disc(s) and polishing disc(s) therein and to retain aqueous solutions within the cavity during a wafer polishing process.

[0083] FIG. 5 is an illustrative view of the assembled polishing pad holder. Illustrated is the polishing pad holder 10 comprising a polishing pad holder base 20 with a top side 21 secured to the bottom of said polishing pad holder ring 34 together forming a centralized cavity 40 having a plurality of interior periphery wall notches 26. The cavity 40 will help in retaining the slurry (chemical and water) inside the cavity 40 longer during a polishing process. Also shown is a single side adhesive Mylar disc 44 fixed to the top side of the holder base with the non adhesive (shiny) side up. The assembled base, ring and Mylar form a completed polishing pad holder ready for use.

[0084] FIG. 6 is an illustrative view of the polishing pad holder 10 having slurry 46 held within the cavity 40 formed by the polishing pad holder base 20, the polishing pad holder ring 34 and the Mylar disc 44.

[0085] FIG. 7 is an illustrative view of the polishing pad holder 10 having water 48 held within the cavity 40 formed by the polishing pad holder base 20, the polishing pad holder ring 34 and the Mylar disc 44.

[0086] FIG. 8 is an illustrative view of the polishing pad holder 10. Shown is the polishing pad holder 10 having a spacer disc or non-spin polishing pad disc 50 with a contour substantially conforming to the polishing pad holder cavity 40 formed by the polishing pad holder base 20 and the polishing pad holder ring 34 thereby preventing independent rotation of the spacer disc or polishing pad disc held therein. The plurality of recessed notches 26 within the cavity 40 into which the disc tabs 27 reside is a design consideration and therefore may be more or less than depicted. The non spin spacer or polishing pad material protects the cavity 40 from being worn out and can be removed and replaced when worn out or not needed. The thickness of the spacer or polishing pad material can vary as required. It is also envisioned by the present invention that color can be used to identify a specific thickness, shown as red 52 in the illustration, which will expedite in changing to a desired thickness through color coding.

[0087] FIG. 9 is an illustrative view of the polishing pad holder 10. Shown is the polishing pad holder 10 having a spacer disc or non-spin polishing disc 50 having a contour substantially conforming to the polishing pad holder cavity 40 formed by the polishing pad holder base 20 and the polishing pad holder ring 34 thereby preventing independent rotation of the spacer disc or non-spin polishing disc 50 held therein. The plurality of recessed notches 26 within the cavity 40 is a design consideration and therefore may be more or less than depicted. The non spin spacer disc or polishing disc 50 protects the cavity 40 from being worn out and can be removed and replaced when worn out or not needed. The thickness of the spacer disc or polishing disc 50 can vary as required. It is also envisioned by the present invention that color can be used to identify a specific thickness, shown as black 54 in the illustration, which will expedite in changing to a desired thickness through color coding.

[0088] FIG. 10 is an illustrative view of the polishing pad holder 10 of the present invention. Shown is a double sided polishing pad accessory 56 with Mylar 58 on top of the non spin spacer or polishing disc 50. The polishing pad holder 10 is ready to be used. Different accessories can be utilized with the polishing pad holder 10 for different polishing processes. The polishing pad holder 10 can be of any size, thickness and cavity (pocket) depth from two inches and up.

[0089] FIG. 11 is an illustrative view of the present invention. Shown is the Napcon material film 58 on top of the non spin spacer 60 or polishing pad material. The polishing pad holder 10 is ready to be used. Different accessories can be utilized with the polishing pad holder for different polishing processes. The polishing pad holder can be of any size, thickness and cavity 40 (pocket) depth from two inches and up as determined by the top 62 of the pad holder ring 34.

[0090] FIG. 12 is an illustrative view of the present invention. Shown are plastic material surface disc 64 with milled islands on both sides, Mylar material, hard polishing pad 66 and soft polishing pad 68. Different materials can mount in the same disc. It can become a single or a double side polishing pad depending on what material it is mounted on double side polishing pad can be used to polish on the same machine by selecting the right pad by flipping over from disc surface 1 and 2 or exchange a disc surface pad in minutes.

[0091] FIG. 13 is an illustrative view of the present invention. Shown is the Napcon material film 58 on top of the spin spacer or disc 70 within the cavity 40 formed by the polishing pad ring 34. The polishing pad holder 10 is ready to be used. Different accessories can be utilized with the polishing pad holder template for different polishing processes. The polishing pad holder template can be of any size, thickness and cavity (pocket) depth from two inches and up.

[0092] FIG. 14 is an illustrative view of the present invention. Shown, completed double side polishing pad 56 layered inside the cavity (pocket) 40 of the polishing pad holder 10. If the disc surface pad is mounted with spacers, the formation is a double side spacer disc.

[0093] FIG. 15 is an illustrative view of one partially assembled embodiment of a double sided polishing pad 56 of the present invention. Shown is Mylar material used as a non spin spacer 60. The spacer is placed within the holder cavity to extend the life expectancy of the holder. It can be removed or changed to different thickness to accommodate the height adjustment of the polishing pad. Also shown is a milled disc 76 having polishing pad material one 72 on one side with polishing pad material two 74 placed on the other side of the milled disc 76.

[0094] FIG. 16 is an illustrative view of an assembled embodiment of the present invention. Shown are the wafer polishing spin components 70 comprising wafer polishing pad holder assembly 10 ready to run process one 78.

[0095] FIG. 17 is an illustrative view of the present invention. Shown, complete polishing holder assembly 10 ready to use for process two 80.

It will be understood that each of the elements described above, or two or more together may also find a useful application in other types of methods differing from the type described above.

[0096] While certain novel features of this invention have been shown and described and are pointed out in the annexed claims, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.

[0097] Without further analysis, the foregoing will so fully reveal the gist of the present invention that others can, by applying current knowledge, readily adapt it for various applications without omitting features that, from the standpoint of prior art, fairly constitute essential characteristics of the generic or specific aspects of this invention.

Claims

1. A wafer polishing pad holder comprising: a) a substantially circular pad holder base having a top peripheral side, a bottom side and a grid-like plurality of ribs defining a plurality of milled islands; b) a polishing pad holder ring substantially conforming to said pad holder base with a peripheral top and bottom side that along with said pad holder base forms a cavity therein; c) means for adhesively securing said pad holder base to a work surface; d) means for adhesively securing said pad holder ring to said pad holder base; and e) at least one disc for insertion into said cavity.

2. The wafer polishing pad holder according to claim 1, wherein said pad holder base and said pad holder ring include corresponding milled recess notches disposed interiorly therein.

3. The wafer polishing pad holder according to claim 1, wherein said means for securing said pad holder base to a work surface is adhesive tape adhesively secured to said bottom of said pad holder base and covered by a removable paper liner until ready for use.

4. The wafer polishing pad holder according to claim 1, wherein said means of securing said pad holder ring to said pad holder base is double sided adhesive tape shaped to conform to and disposed on said bottom peripheral side of said ring with a paper backing to protect the opposing layer of adhesive until ready for installation onto said base.

5. The wafer polishing pad holder according to claim 1, wherein said polishing pad holder ring is manufactured of a non-metallic material.

6. The wafer polishing pad holder according to claim 1, wherein said at least one disc is a polishing disc.

7. The wafer polishing pad holder according to claim 6, wherein said at least one polishing disc is a plurality of polishing discs having a plurality of thicknesses and textures of abrasiveness.

8. The wafer polishing pad holder according to claim 7, wherein said at least one polishing disc is a non-spin disc having a plurality of disc tabs projecting outwardly therefrom conforming to said milled recess notches to prevent the casual rotation thereof within said cavity during the polishing process.

9. The wafer polishing pad holder according to claim 7, wherein said polishing pad disc is double sided having differing textures on each side thereby enabling the user to simply turn over said disc according to the task to be performed.

10. The wafer polishing pad holder according to claim 1, wherein said at least one said disc is a spacer disc for placement beneath said polishing disc to enable the user to selectively raise and lower the level of said polishing disc.

11. The wafer polishing pad holder according to claim 1, wherein said cavity is at least two inches deep.

12. The wafer polishing pad holder according to claim 11, wherein a quantity of water or abrasive slurry is introduced into said cavity and retained therein.

13. The wafer polishing pad holder according to claim 1, wherein said at least one disc is a clear, shiny non-adhesive Mylar disc disposed within said cavity to reduce wear and extend the usable life of said base.

14. The wafer polishing pad holder according to claim 1, wherein said at least one disc is a plastic material surface disc with milled islands on both sides.

15. The wafer polishing pad holder according to claim 7, wherein said at least one polishing disc is at least one spinning disc and spacer disc that has a substantially circular configuration and rotates within said cavity.

16. The wafer polishing pad holder according to claim 7, wherein said at least one disc is color coded to indicate the thickness and texture of said disc.

17. The wafer polishing pad holder according to claim 1, wherein said at least one disc includes a similarly configured Napcon material film frictionally engaged with the top side thereof.

18. The wafer polishing pad holder according to claim 17, wherein the user introduces said water or said abrasive slurry into said cavity along with selected polishing discs and spacer discs and said wafer polishing pad holder is ready for application.