U.S. patent application number 13/537263 was filed with the patent office on 2013-09-26 for heat dissipation module and method of using the heat dissipation module.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is CHIH-SHENG HSIEH, CHUNG-JEN HUNG, PEI-CHUN KO, GIN-ZEN TING, WEI-DE WANG, WEN-CHIEH WANG, CHUN-SHENG YU. Invention is credited to CHIH-SHENG HSIEH, CHUNG-JEN HUNG, PEI-CHUN KO, GIN-ZEN TING, WEI-DE WANG, WEN-CHIEH WANG, CHUN-SHENG YU.
Application Number | 20130248161 13/537263 |
Document ID | / |
Family ID | 49210695 |
Filed Date | 2013-09-26 |
United States Patent
Application |
20130248161 |
Kind Code |
A1 |
KO; PEI-CHUN ; et
al. |
September 26, 2013 |
HEAT DISSIPATION MODULE AND METHOD OF USING THE HEAT DISSIPATION
MODULE
Abstract
A heat dissipation module includes a heat sink. A plurality of
grooves are defined in a bottom surface of the heat sink, a heat
pipe is accommodated in each groove of the heat sink, and a heat
conducting pad made of phase change material is adhered to the
bottom surface of the heat sink to cover the grooves and the heat
pipes. The heat conducting pad is a solid material at an ambient
room temperature. When heated to a temperature higher than a
transition temperature of the heat conducting pad, the heat
conducting pad softens to fill spaces between the heat conducting
pad, the heat sink, and the heat pipes.
Inventors: |
KO; PEI-CHUN; (Tu-Cheng,
TW) ; YU; CHUN-SHENG; (Tu-Cheng, TW) ; WANG;
WEI-DE; (Tu-Cheng, TW) ; HSIEH; CHIH-SHENG;
(Tu-Cheng, TW) ; HUNG; CHUNG-JEN; (Tu-Cheng,
TW) ; TING; GIN-ZEN; (Tu-Cheng, TW) ; WANG;
WEN-CHIEH; (Tu-Cheng, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
KO; PEI-CHUN
YU; CHUN-SHENG
WANG; WEI-DE
HSIEH; CHIH-SHENG
HUNG; CHUNG-JEN
TING; GIN-ZEN
WANG; WEN-CHIEH |
Tu-Cheng
Tu-Cheng
Tu-Cheng
Tu-Cheng
Tu-Cheng
Tu-Cheng
Tu-Cheng |
|
TW
TW
TW
TW
TW
TW
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
49210695 |
Appl. No.: |
13/537263 |
Filed: |
June 29, 2012 |
Current U.S.
Class: |
165/181 |
Current CPC
Class: |
Y02E 60/14 20130101;
Y02E 60/145 20130101; H01L 23/467 20130101; F28D 15/0275 20130101;
F28D 20/02 20130101; H01L 23/427 20130101; H01L 2924/0002 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/181 |
International
Class: |
F28F 1/20 20060101
F28F001/20 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 26, 2012 |
TW |
101110317 |
Claims
1. A heat dissipation module, comprising: a heat sink defining a
plurality of grooves in a bottom surface of the heat sink; a
plurality of heat pipes accommodated in the grooves of the heat
sink; and a heat conductive pad adhered to the bottom surface of
the heat sink to cover the grooves and the heat pipes, wherein the
heat conductive pad is a tacky, flexible solid at an ambient room
temperature, and softens when heated to a temperature higher than a
transition temperature of the heat conductive pad fill spaces
between the heat conductive pad, the heat sink, and the heat
pipes.
2. The heat dissipation module of claim 1, wherein the heat sink
comprises a base plate and a plurality of fins perpendicularly
extending from a top surface of the base plate, the embedded
grooves are defined in a bottom surface of the base plate.
3. A method of dissipating heat, comprising: providing a heat sink
defining a plurality of grooves in a bottom surface of a heat sink;
providing a plurality of heat pipes correspondingly accommodated in
the grooves of the heat sink; providing a heat conductive pad made
of phase change material adhered to the bottom surface of the heat
sink to cover the grooves and the heat pipes; mounting the heat
sink on an electronic component, with a bottom surface of the heat
conductive pad opposite to the heat sink and abutting against a top
surface of the electronic component; and softening the heat
conductive pad by heating to fill spaces between the heat sink, the
heat pipes, and the heat conductive pad.
4. The method of claim 1, wherein the softening step comprises
heating the heat conductive pad to a temperature higher than a
transition temperature of the heat conductive pad.
5. The method of claim 4, wherein the heat conductive pad is heated
by heat generated by the electronic component.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to a heat dissipation module
for an electronic component and a method using the heat dissipation
module.
[0003] 2. Description of Related Art
[0004] To get a good balance between heat dissipation effectiveness
and cost, a heat dissipation module for an electronic component,
such as a central processing unit, may comprise an aluminum heat
sink, and a plurality of copper heat pipes fitted in grooves
defined in a bottom side of the heat sink. However, because of the
size of the heat pipes and assembly tolerances, when the heat
dissipation module is seated on an electronic component, there may
be spaces between the electronic components and the bottom side of
the heat sink and the heat pipes. The spaces do not allow contact
between the pipe and the heat sink and reduces the efficiency of
head dissipation from the electronic component.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the views.
[0006] FIG. 1 is an exploded, isometric view of an exemplary
embodiment of a heat dissipation module.
[0007] FIG. 2 shows the heat dissipation module in use.
[0008] FIGS. 3 and 4 are sectional views taken along the line
III-III of FIG. 2, but respectively showing before and after the
heat dissipation module being heating.
[0009] FIG. 5 is a flowchart of an exemplary embodiment of a method
using the heat dissipation module of FIG. 2.
DETAILED DESCRIPTION
[0010] The disclosure, including the accompanying drawings, is
illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references can mean "at least one."
[0011] FIG. 1, is an exemplary embodiment of a heat dissipation
module. The heat dissipation module includes a heat sink 10, a
plurality of heat pipes 20, and a heat conductive pad 30 made of
phase change material.
[0012] The heat sink 10 includes a base plate 11 and a plurality of
fins 12 perpendicularly extending from a top surface of the base
plate 11. A plurality of grooves 112 is defined in a bottom surface
of the base plate 11 opposite to the fins 12.
[0013] Each heat pipe 20 has a rounded cross section.
[0014] The heat conductive pad 30 is a flexible solid material at
ambient room temperature. A top surface of the heat conductive pad
30 is adhesive and covered with a protective film (not shown)
before use. The heat conductive pad 30 softens when heated to a
phase-transition temperature of the heat conductive pad 30.
[0015] Referring to FIGS. 2 and 3, in assembly, the heat pipes 20
are forced to be deformed to be tightly engaged in the
corresponding grooves 112 of the heat sink 10. The protective film
of the heat conductive pad 30 is removed, and then the heat
conductive pad 30 is adhered to the bottom surface of the base
plate 11 of the heat sink 10 to cover the grooves 112 and the heat
pipes 20. Due to geometric differences, there will be spaces 1020
between the heat conductive pad 30, the bottom surface of the heat
sink 10, and the heat pipes 20.
[0016] FIGS. 3-5, shows a method to use the heat dissipation module
of FIG. 2. The method for dissipating heat for an electronic
component 200 includes the following steps.
[0017] In step S01, a heat sink 10 with a plurality of grooves 12
defined in a bottom surface of the heat sink 20 is provided.
[0018] In step S02, providing a plurality of heat pipes 20. The
plurality of heat pipes 20 correspondingly engage in the grooves 12
of the heat sink 10.
[0019] In step S03, providing a heat conductive pad 30 made of
phase change material.
[0020] The heat conductive pad 30 is adhered to the bottom surface
of the heat sink 10 covering the grooves 12 and the heat pipes
20;
[0021] In step S04, the heat sink is seated on the electronic
component 200, with a bottom surface of the heat conductive pad 30
opposite to the heat sink 10 abutting against a top surface of the
electronic component 200.
[0022] In step S05, the heat conductive pad 30 is softened by
heating the heat conductive pad 30 to a temperature greater than
the phase-transition temperature of the heat conductive pad 30.
Since the electronic component 200 generates heat in operation, in
one embodiment, the heat conductive pad 30 is heated by heat
generated by the electronic component 200.
[0023] It is to be understood, however, that even though numerous
characteristics and advantages of the embodiments have been set
forth in the foregoing description, together with details of the
structures and functions of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
the matters of arrangement of parts within the principles of the
present disclosure to the full extent indicated by the broad
general meaning of the terms in which the appended claims are
expressed.
* * * * *