U.S. patent application number 13/888595 was filed with the patent office on 2013-09-19 for power and ground vias for power distribution systems.
This patent application is currently assigned to International Business Machines Corporation. The applicant listed for this patent is INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Tae Hong Kim, Sang Y. Lee, Nam H. Pham.
Application Number | 20130239408 13/888595 |
Document ID | / |
Family ID | 44901801 |
Filed Date | 2013-09-19 |
United States Patent
Application |
20130239408 |
Kind Code |
A1 |
Kim; Tae Hong ; et
al. |
September 19, 2013 |
POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS
Abstract
A system for providing power and ground vias for power
distributions systems includes first and second conductive layers
on a microelectronic package. The conductive layers may include one
or more conductive components such as, but not limited to, power
planes, ground planes, pads, traces, and the like for electrically
connecting to electronic components. A via may electrically connect
the first and second conductive layers. The via may have a
cross-section of at least three partially-overlapping shapes. Each
of the shapes partially overlaps at least two of the other shapes.
The shapes may be, for example, circular, triangular, rectangular,
square, polygonal, rhomboidal shape, or any other shape.
Inventors: |
Kim; Tae Hong; (Round Rock,
TX) ; Lee; Sang Y.; (Austin, TX) ; Pham; Nam
H.; (Round Rock, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
Armonk |
NY |
US |
|
|
Assignee: |
International Business Machines
Corporation
Armonk
NY
|
Family ID: |
44901801 |
Appl. No.: |
13/888595 |
Filed: |
May 7, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12776888 |
May 10, 2010 |
8488329 |
|
|
13888595 |
|
|
|
|
Current U.S.
Class: |
29/852 |
Current CPC
Class: |
H05K 2201/09854
20130101; H05K 3/40 20130101; H05K 1/0265 20130101; Y10T 29/49165
20150115; H01L 2924/19105 20130101; H05K 1/115 20130101; H01L
2224/16225 20130101; Y10T 29/49155 20150115 |
Class at
Publication: |
29/852 |
International
Class: |
H05K 3/40 20060101
H05K003/40 |
Claims
1.-13. (canceled)
14. A method comprising: providing a power source including a
terminal; providing one of a power plane and a ground plane; and
forming a via filled with a conductive material that forms a
conductive pathway that connects the terminal of the power source
to the one of the power plane and the ground plane, wherein the via
has a cross-section of at least three partially-overlapping shapes,
and wherein each of the shapes partially overlaps at least two of
the other shapes.
15. The method of claim 14, wherein the shapes are each
circular.
16. The method of claim 15, wherein the shapes have a diameter
between about 8 mils and about 18 mils.
17. The method of claim 14, wherein forming the via comprises:
forming at least-three partially-overlapping circular holes to
define an aperture between the terminal of the power source and the
one of the power plane and the ground plane; and substantially
filling the aperture with conductive material to electrically
connect the power source and the one of the power plane and the
ground plane.
18. The method of claim 14, wherein the shapes are each one of
triangular, rectangular, square, polygonal, and rhomboidal
shape.
19. The method of claim 14, wherein at least two of the shapes are
of different types.
20. The method of claim 14, wherein at least two of the shapes are
of different sizes.
21. A method comprising: providing a power source including a power
supply voltage terminal and a power supply ground terminal;
providing a power plane; providing a ground plane; forming a first
via filled with a conductive material that forms a first conductive
pathway that electrically connects the power plane to the power
supply voltage terminal of the power source, wherein the first via
has a cross-section of at least partially-overlapping circular
shapes, and wherein each one of the circular shapes partially
overlaps at least two of the other circular shapes; and forming a
second via filled with a conductive material that forms a second
conductive pathway that electrically connects the ground plane to
the power supply ground terminal of the power source, wherein the
second via has a cross-section of at least three
partially-overlapping circular shapes, and wherein each of the
circular shapes partially overlaps at least two of the other
circular shapes.
22. The method of claim 21, further comprising: providing first and
second conductive components for electrical connection to an
electronic component; and forming a third via electrically
connecting the power plane and the first conductive component,
wherein the third via has a cross-section of at least
partially-overlapping circular shapes, and wherein each one of the
circular shapes partially overlaps at least two of the other
circular shapes; and forming a fourth via electrically connecting
the ground plane and the second conductive component, wherein the
fourth via has a cross-section of at least three
partially-overlapping circular shapes, and wherein each of the
circular shapes partially overlaps at least two of the other
circular shapes.
23. The method of claim 21, wherein the circular shapes have a
diameter between about 8 mils and about 18 mils.
24. The method of claim 21, wherein at least two of the circular
shapes are of different sizes.
25. The method of claim 21, wherein the shapes are each
circular.
26. The method of claim 21, wherein the shapes are each one of
triangular, rectangular, square, polygonal, and rhomboidal
shape.
28. The method of claim 21, wherein forming the first via
comprises: forming at least-three partially-overlapping circular
holes to define an aperture between the power plane and the power
supply voltage terminal of the power source; and substantially
filling the aperture with conductive material to electrically
connect the power plane and the power supply voltage terminal of
the power source.
29. The method of claim 21, wherein forming the second via
comprises: forming at least-three partially-overlapping circular
holes to define an aperture between the ground plane and the power
supply ground terminal of the power source; and filling the
aperture with conductive material to electrically connect the
ground plane and the power supply ground terminal of the power
source.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This is a divisional application of copending U.S. patent
application Ser. No. 12/776,888, filed May 10, 2010 and titled
POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS, the content
of which is hereby incorporated by reference in its entirety.
BACKGROUND
[0002] 1. Field of the Invention
[0003] The present invention relates to power distribution systems
in microelectronic packages, and more specifically, to power and
ground vias for power distribution systems in microelectronic
packages.
[0004] 2. Description of Related Art
[0005] In many modern electronic systems, printed circuit boards
and various other microelectronic packages are used to connect
electronic components together for communication. A printed circuit
board is typically a flat panel that interconnects electronic
components using a pattern of flat conductive pathways, often
referred to as traces, which are formed on a non-conductive
substrate. A printed circuit board may contain conductive pathway
patterns on the top and bottom surfaces of the printed circuit
board or in layers within the interior of the printed circuit
board. Conductive pathways on different layers of a printed circuit
board may be electrically connected through vias. Vias are
conductive pathways that may plate the walls of holes extending
through the layers of the printed circuit board.
[0006] A single printed circuit board typically includes a power
distribution system for distributing power to one or more
electrical components connected to the printed circuit board. The
power distribution system may include a power source and conductive
pathways electrically connecting the power source and the
electrical components. A conductive pathway may include one or more
traces, vias, or combinations thereof connected together for
allowing the power source to provide power to the electronic
components using electronic conduction.
[0007] In high-speed microelectronic package design, an efficient
power distribution system is critical in achieving desired
performance. As system frequency increases and the signal rise time
reduces, an inefficient power delivery network may lose power
through the power plane, and thereby deliver inadequate power
supply voltage to the electronic components such that system
performance is lowered or the system fails. The power distribution
system must provide sufficient current for meeting high peak
current requirements during output switching. This current
requirement must be met while also maintaining the input supply
voltage needed by electronic components.
[0008] To meet the power demands of electronic components, discrete
capacitors are often utilized. These capacitors may be connected
between power and ground planes to provide the necessary charge
current to the electronic components. For example, these capacitors
discharge their current into the electronic component and quickly
recharge from energy stored in slower discharging capacitors and
power supplies prior to the next required discharge as needed by
the electronic component. Although the provision of power and
ground planes has been beneficial, there is a need for improved
methods for delivering power and signals to electronic components
on a microelectronic package.
BRIEF SUMMARY
[0009] One or more embodiments of the present invention provide a
system for providing power and ground vias for power distributions
systems. The system includes first and second conductive layers on
a microelectronic package such as, but not limited to, a multilayer
printed circuit board. The conductive layers may include one or
more conductive components, such as, but not limited to, power
planes, ground planes, pads, traces, and the like for electrically
connecting to electronic components. A via may electrically connect
the first and second conductive layers. The via may have a
cross-section of at least three partially-overlapping shapes. Each
of the shapes partially overlaps at least two of the other shapes.
The shapes may be, for example, circular, triangular, rectangular,
square, polygonal, rhomboidal shape, or any other shape.
[0010] One or more embodiments of the present invention provide a
method for providing power and ground vias for power distribution
systems. The method includes providing first and second conductive
layers on a microelectronic package. The method includes forming a
via electrically connecting the first and second conductive layers.
The via has a cross-section of at least three partially-overlapping
shapes. Each of the shapes partially overlaps at least two of the
other shapes. One of the conductive layers may include a power
plane or ground plane that is electrically connected to the
via.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0011] FIG. 1 sets forth a cross-sectional side view of a power
distribution system having vias in accordance with embodiments of
the present invention.
[0012] FIG. 2 sets forth a cross-sectional top view of an exemplary
via with a cross-section having a shape of three
partially-overlapping circular shapes in accordance with
embodiments of the present invention.
[0013] FIG. 3 sets forth a cross-sectional top view of an exemplary
via with a cross-section having a shape of four
partially-overlapping circular shapes in accordance with
embodiments of the present invention.
[0014] FIG. 4 sets forth a cross-sectional top view of an exemplary
via with a cross-section having a shape of two
partially-overlapping circular shapes in accordance with
embodiments of the present invention.
[0015] FIG. 5 sets forth a flow chart of an exemplary method for
producing a microelectronic package having one or more vias in
accordance with embodiments of the present invention.
DETAILED DESCRIPTION
[0016] Exemplary power and ground vias and associated methods for
power distribution systems in accordance with embodiments of the
present invention are described herein. Particularly, described
herein are exemplary via structure shapes for improving the
delivery of power and signals to electronic components on
microelectronic packages such as, but not limited to, printed
circuit boards. Via structure shapes in accordance with embodiments
of the present invention can improve the efficiency of power
delivery by power distribution systems to microelectronic
components in a microelectronic package.
[0017] Via structure shapes in accordance with embodiments of the
present invention can be used to improve power delivery systems.
Particularly, via structure shapes as described herein provide
power delivery systems having vias, power planes, and ground planes
with lowered resistance. This is achieved because the vias have a
shape with increased surface area of the via as well as reduced
cross-sectional area, which allows power and ground planes to have
increased surface areas. As a result, resistances at the vias and
the power and ground planes are reduced, thereby reducing loss of
power in the power delivery system.
[0018] In addition, by using via structure shapes in accordance
with embodiments of the present invention to increase surface areas
of the power and ground planes, signal integrity in power
distribution systems may be improved. This is because an increase
in the surface areas of the power and ground planes results in an
increase in the capacitance in the power and ground planes, which
enables better signal integrity.
[0019] It will be recognized by those skilled in the art that the
vias described herein may be used for electrically connecting
between conductive components that are part of different conductive
layers in any type of microelectronic package. A conductive layer
may be one of a plurality of conductive layers in a microelectronic
package, and may include one or more conductive components, such
as, but not limited to, traces, pads, and the like. In the examples
described herein, the vias electrically connect a power or ground
plane in one layer to a conductive component in another layer.
However, it should be noted that vias described herein are not
limited to electrically connecting power and ground planes, but the
vias may also be used for electrically connecting any type of
conductive components between layers of a microelectronic
package.
[0020] FIG. 1 illustrates a cross-sectional side view of a power
distribution system 100 having vias in accordance with embodiments
of the present invention. Referring to FIG. 1, the system 100
includes a power source 102 for providing power to an electrical
component 104. The power source 102 and the electrical component
104 may be suitably mounted on a printed circuit board (PCB) 106 as
understood by those of skill in the art. The electrical component
104 may be one of a plurality of electrical components mounted on
the PCB 106. The electrical component 104 may be, for example, but
not limited to, an integrated circuit (e.g., an operational
amplifier, resistor array, logic gate, and the like), a resistor, a
capacitor, a transistor, a diode, and the like. The power source
and electrical components may be mounted to the printed circuit
board and connected at designated portions of a trace pattern,
often referred to as pads or lands. The power source 102 and the
electrical component 104 may be connected to the printed circuit
board 106 using, for example, surface mount technology,
through-hole mounting technology, or any other suitable technology
as known to those skilled in the art. Surface mount technology
connects electronic components to a printed circuit board by
soldering electronic component leads or terminals to the top
surface of the printed circuit board. Through-hole mount technology
connects electronic components to a printed circuit board by
inserting component leads through holes in the printed circuit
board and then soldering the leads in place on the opposite side of
the printed circuit board.
[0021] The system 100 may distribute power generated by the power
source 102 to the electrical component 104 and any other
electrically-connected components connected to the printed circuit
board 106. Particularly, the power source 102 supplies a positive
voltage (V.sub.dd) and a ground (GND) at power supply voltage
terminals 108 and 110, respectively. The system 100 may include a
conductive layer 112 and vias 114 and 116 for electrically
connecting the power supply voltage terminal 108 to a positive
power terminal 118 of the electrical component 104. The system 100
may include a conductive layer 120 and vias 122 and 124 for
electrically connecting the power supply ground terminal 110 to a
ground terminal 126 of the electrical component 104. By these
electrical connections between the power source 102 and the
electrical component 104, the power source 102 may provide power to
the electrical component 104. The positive power terminal 118 and
the ground terminal 126 of the electrical component 104 may be
connected to the vias 116 and 124, respectively, by way of pads or
other conductive components attached to the same or different
conductive layer as the power supply voltage terminals 108 and
110.
[0022] Conductive layers 112 and 120 may include a power plane and
a ground plane, respectively. However, it should be noted that
these conductive layers are not limited as such, and these
conductive layers may alternatively be any suitable electrically
conductive pathway, such as a trace. The power and ground planes
are spaced-apart conductive plates for serving as a capacitor. The
power and ground planes may substantially cover an area of their
respective planes of the PCB 106. The ground plane may include
apertures through which vias 114 and 116 may extend without
directly contacting the ground plane.
[0023] FIGS. 2, 3, and 4 are various cross-sectional top views of
exemplary vias according to embodiments of the present invention.
Referring to FIG. 2, the cross-sectional shape of a via 200 is
illustrated by the curved solid lines. The via 200 has a
cross-sectional shape of three partially-overlapping circular
shapes 202, 204, and 206. Only a portion of each of the circular
shapes 202, 204, and 206 form the cross-sectional shape of the via
200 as indicated by the solid line portion of each circular shape.
The broken lines of each shape 202, 204, and 206 are not part of
the cross-sectional shape of the via 200, and are meant to show the
other portion of each circular shape for illustrative purposes
only.
[0024] Each of the circular shapes 202, 204, and 206 partially
overlaps two of the other circular shapes, although the shapes may,
for example, partially overlap more than two other shapes. For
example, shape 202 partially overlaps shapes 204 and 206, shape 204
partially overlaps shapes 202 and 206, and shape 206 partially
overlaps shapes 202 and 204. The circular shapes 202, 204, and 206
are each equal in size and may each be sized 10 mils in diameter.
Alternatively, the circular shapes may have different sizes from
each other. Further, in the alternative, the circular shapes may
range in diameter between about 8 mils and about 18 mils. The
shapes may be differently sized or shaped.
[0025] The cross-sectional area of the via 200 is less than the
area of a single circle (where its perimeter is indicated by dotted
line 208) having a diameter approximately equal to a major
dimension of the via 200. The circle 208 represents the
cross-sectional shape of a conventional drilled via. The diameter
of each circular shape 202, 204, and 206 is about half the diameter
of the circle 208. As compared to the area of the circle 208, the
cross-sectional area of the via 200 is about 29% less than the
cross-sectional area of the circle 208. In addition, the length of
the perimeter of the shape of the via 200 is about 12.5% greater
than the circumference of the circle 208. As a result of having
reduced cross-sectional area compared to the conventional
via-shaped circle 208, a power or ground plane electrically
connected thereto may have a greater surface area, thereby reducing
loss of power in the power delivery system. This via may provide
about 22% less DC resistance (R.sub.DC) in the power or ground
plane, and may provide about 11% less DC resistance in the via. In
addition, by allowing for the increased surface areas of the power
and ground planes, signal integrity may be improved due to the
increase in the capacitance in the power and ground planes.
[0026] Referring to FIG. 3, the cross-sectional shape of a via 300
is illustrated by the curved solid lines. The via 300 has a
cross-sectional shape of four partially-overlapping circular shapes
302, 304, 306, and 308. Only a portion of each of the circular
shapes 302, 304, 306, and 308 form the cross-sectional shape of the
via 300 as indicated by the solid line of each circular shape. The
broken lines of each shape 302, 304, 306, and 308 are not part of
the cross-sectional shape of the via 300, and are meant to show the
other portion of each circular shape for illustrative purposes
only.
[0027] Each of the circular shapes 302, 304, 306, and 308 partially
overlaps two of the other circular shapes, although the shapes may,
for example, partially overlap more than two other shapes. For
example, shape 302 partially overlaps shapes 304 and 308, shape 304
partially overlaps shapes 302 and 306, shape 306 partially overlaps
shapes 304 and 306, and shape 308 partially overlaps shapes 302 and
306. The circular shapes 302, 304, 306, and 308 are each equal in
size and may each be sized 10 mils in diameter. Further, in the
alternative, the circular shapes may range in diameter between
about 8 mils and about 18 mils. The shapes may be differently sized
or shaped.
[0028] The cross-sectional area of the via 300 is less than the
area of a single circle (where its perimeter is indicated by dotted
line 310) having a diameter approximately equal to an outside width
of the via 300. The circle 310 represents the cross-sectional shape
of a conventional drilled via. The diameter of each circular shape
302, 304, 306, and 308 is about half the diameter of the circle
310. As compared to the area of the circle 310, the cross-sectional
area of the via 300 is about 18% less than the cross-sectional area
of the circle 310. In addition, the length of the perimeter of the
shape of the via 300 is about the same as the circumference of the
circle 310. As a result of having reduced cross-sectional area
compared to the conventional via-shaped circle 310, a power or
ground plane electrically connected thereto may have a greater
surface area, thereby reducing loss of power through the power or
ground plane. Since the cross-section area is reduced in this
example, the power loss through power and ground planes is
improved. However, because the length of the perimeter of the shape
of the via 300 is about the same as the circumference of the circle
310, the power loss through the vias is the same because the
surface area, which is the via circumference multiplied by the via
height, is the same.
[0029] Referring to FIG. 4, the cross-sectional shape of a via 400
is illustrated by the curved solid lines. The via 400 has a
cross-sectional shape of two partially-overlapping circular shapes
402 and 404. Only a portion of each of the circular shapes 402 and
404 form the shape of the via 400 as indicated by the solid line of
each circular shape. The broken lines of each shape 402 and 404 are
not part of the shape of the via 400, and are meant to show the
other portion of each circular shape for illustrative purposes
only. The circular shapes 402 and 404 are each equal in size and
may each be sized 10 mils in diameter. Further, in the alternative,
the circular shapes may range in diameter between about 8 mils and
about 18 mils. The shapes may be differently sized or shaped.
[0030] The cross-sectional area of the via 400 is less than the
area of a single circle (where its perimeter is indicated by dotted
line 406) having a diameter approximately equal to an outside width
of the via 400. The circle 406 represents the cross-sectional shape
of a conventional drilled via. The diameter of each circular shape
402 and 404 is about half the diameter of the circle 406. As
compared to the area of the circle 406, the cross-sectional area of
the via 400 is about 50% less than the cross-sectional area of the
circle 406. In addition, the length of the perimeter of the shape
of the via 400 is about 25% less than the circumference of the
circle 406. As a result, signal integrity and power loss through
the power and ground planes may be improved by use of this via due
to the increase in the areas of the power and ground planes.
[0031] In accordance with embodiments of the present invention, the
cross-sectional shape of a via may be comprised of multiple
partially-overlapping shapes of any type. For example, the
partially-overlapping shapes may be, but are not limited to,
triangular, rectangular, square, polygonal, or rhomboidal shape.
These shapes may be arranged such that three or more of the shapes
overlap and such that each of the shapes partially overlaps with at
least two of the other shapes. For example, these shapes of the
same type, same size, different type, or different size may be
arranged the same or similar to the circular shapes shown in any of
FIGS. 2-4.
[0032] In another example, a variation to the examples of FIGS. 2-4
may be to overlap the shapes shown in FIGS. 2-4 with another shape
that is centered at the center of the shapes shown in FIGS. 2-4.
Portions of the edges of the centered shape may extend outside of
the areas of the other shapes such that these portions do not
overlap the other shapes. The centered shape may be circular,
triangular, rectangular, square, polygonal, rhomboidal, or other
shape. Also, the centered shape may be of the same type, same size,
different type, and/or different size as any of the other
overlapping shapes.
[0033] As mentioned above, an exemplary method for producing a
microelectronic package having one or more vias in accordance with
embodiments of the present invention is described with reference to
the FIG. 5, which sets forth a flow chart. It should be noted, in
some alternative implementations, the functions noted in the blocks
of the flow chart may occur out of the order noted in the figure.
For example, two blocks shown in succession may, in fact, be
executed substantially concurrently, or the blocks may sometimes be
executed in the reverse order, depending upon the functionality
involved. Referring to FIG. 5, the method includes providing 500 a
blank printed circuit board. For example, the blank printed circuit
board may include a copper layer over an entire surface of a
substrate.
[0034] The method of FIG. 5 may also include providing 502 a power
plane and one or more traces on the printed circuit board. For
example, unwanted copper may be removed from the printed circuit
board after applying a temporary mask (e.g., by etching), leaving
only a desired power plane and traces. Exemplary techniques for
removing copper include, but are not limited to, silk screen
printing, photoengraving, and milling. Alternatively, the power
plane and traces may be added by electroplating techniques or any
other suitable additive technique. One or more layers may be added
to the printed circuit board before providing the power plane.
Alternatively, a ground plane may replace the power plane and may
be provided at the first layer or any other layer of the printed
circuit board.
[0035] The method of FIG. 5 includes providing 504 one or more
additional conductive layers. For example, the additional layers
may be added by bonding together separately etched thin board.
These layers may include either a power plane or a ground plane and
one or more traces.
[0036] The method of FIG. 5 includes forming 506 one or more vias
each with a cross-section of three or more overlapping shapes. Each
of the shapes partially overlaps at least two of the other shapes.
For example, a via in accordance with embodiments of the present
invention may be formed by drilling multiple, partially-overlapping
holes or apertures through the printed circuit board to define an
aperture between the conductive layers. For example, several holes
may be drilled that define a single aperture and that correspond to
the circular shapes of a cross-section of a via, such as the vias
200, 300, and 400 shown in FIGS. 2, 3, and 4, respectively. The
aperture may be substantially filled with conductive material to
electrically connect the conductive layers and to form an
electrically-conductive via, such as the vias 200, 300, and 400
shown in FIGS. 2, 3, and 4, respectively. The partially-overlapping
holes may be filled with a conductive material such as by a
suitable plating technique. The conductive material may be, for
example, but not limited to, a conductive paste, silver epoxy, or
low melt solder paste such as any indium alloy powders suspended in
a flux. Alternatively, vias shaped in accordance with embodiments
of the present invention may be suitably formed by laser
techniques. The vias may be placed to electrically connect
conductive components as described herein.
[0037] The method of FIG. 5 includes attaching 508 electronic
components to form the functional printed circuit assembly. In
through-hole construction, component leads may be inserted in
holes. In surface-mount construction, the components may be placed
on pads or lands on the outer surfaces of the printed circuit
board. The component leads may be electrically and mechanically
fixed to the board with a molten metal solder.
[0038] The resulting printed circuit board can be distributed by
the fabricator in raw wafer form (that is, as a single wafer that
has multiple unpackaged chips), as a bare die, or in a packaged
form. In the latter case the printed circuit board may be mounted
in a single chip package (such as a plastic carrier, with leads
that are affixed to a motherboard or other higher level carrier) or
in a multichip package (such as a ceramic carrier that has either
or both surface interconnections or buried interconnections). In
any case, the chip may then be integrated with chips, discrete
circuit elements, and/or other signal processing devices as part of
either (a) an intermediate product, such as a motherboard, or (b)
an end product. The end product can be any product that includes
printed circuit boards, ranging from toys and other low-end
applications to advanced computer products having a display, a
keyboard or other input device, and a central processor.
[0039] In examples described herein, the power distribution systems
relates to power distribution systems in package level designs.
However, it should be understood that the systems and methods in
accordance with embodiments of the present invention may also be
applied to board level designs.
[0040] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a," "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, elements, components, and/or groups thereof.
[0041] The corresponding structures, materials, acts, and
equivalents of all means or step plus function elements in the
claims below are intended to include any structure, material, or
act for performing the function in combination with other claimed
elements as specifically claimed. The description of the present
invention has been presented for purposes of illustration and
description, but is not intended to be exhaustive or limited to the
invention in the form disclosed. Many modifications and variations
will be apparent to those of ordinary skill in the art without
departing from the scope and spirit of the invention. The
embodiment was chosen and described in order to best explain the
principles of the invention and the practical application, and to
enable others of ordinary skill in the art to understand the
invention for various embodiments with various modifications as are
suited to the particular use contemplated.
* * * * *