U.S. patent application number 13/859520 was filed with the patent office on 2013-08-29 for miniature shredding tool for use in medical applications and methods for making.
The applicant listed for this patent is Richard T. Chen, Adam L. Cohen, Pedro J. Del Nido, Pierre E. Dupont, Uri Frodis, Michael S. Lockard, Nikolay V. Vasilyev. Invention is credited to Richard T. Chen, Adam L. Cohen, Pedro J. Del Nido, Pierre E. Dupont, Uri Frodis, Michael S. Lockard, Nikolay V. Vasilyev.
Application Number | 20130226209 13/859520 |
Document ID | / |
Family ID | 47999181 |
Filed Date | 2013-08-29 |
United States Patent
Application |
20130226209 |
Kind Code |
A1 |
Lockard; Michael S. ; et
al. |
August 29, 2013 |
MINIATURE SHREDDING TOOL FOR USE IN MEDICAL APPLICATIONS AND
METHODS FOR MAKING
Abstract
The present invention relates generally to the field of
micro-scale or millimeter scale devices and to the use of
multi-layer multi-material electrochemical fabrication methods for
producing such devices with particular embodiments relate to
shredding devices and more particularly to shredding devices for
use in medical applications. In some embodiments, tissue removal
devices include tissue anchoring projections, improved blade
configurations, and/or shields or shrouds around the cutting blades
to inhibit outflow of tissue that has been brought into the
device.
Inventors: |
Lockard; Michael S.; (Lake
Elizabeth, CA) ; Frodis; Uri; (Los Angeles, CA)
; Cohen; Adam L.; (Los Angeles, CA) ; Chen;
Richard T.; (Woodland Hills, CA) ; Dupont; Pierre
E.; (Wellesley, MA) ; Del Nido; Pedro J.;
(Lexington, MA) ; Vasilyev; Nikolay V.; (Belmont,
MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Lockard; Michael S.
Frodis; Uri
Cohen; Adam L.
Chen; Richard T.
Dupont; Pierre E.
Del Nido; Pedro J.
Vasilyev; Nikolay V. |
Lake Elizabeth
Los Angeles
Los Angeles
Woodland Hills
Wellesley
Lexington
Belmont |
CA
CA
CA
CA
MA
MA
MA |
US
US
US
US
US
US
US |
|
|
Family ID: |
47999181 |
Appl. No.: |
13/859520 |
Filed: |
April 9, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12491220 |
Jun 24, 2009 |
8414607 |
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13859520 |
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12490295 |
Jun 23, 2009 |
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12491220 |
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61075007 |
Jun 24, 2008 |
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61075006 |
Jun 23, 2008 |
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61164864 |
Mar 30, 2009 |
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61164883 |
Mar 30, 2009 |
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Current U.S.
Class: |
606/179 |
Current CPC
Class: |
A61B 17/1671 20130101;
A61B 2017/00539 20130101; A61B 10/02 20130101; A61B 17/14 20130101;
A61B 17/320725 20130101; A61B 2017/00526 20130101; A61B 17/32002
20130101; A61B 2017/320048 20130101; A61B 2017/2212 20130101; A61B
2017/320775 20130101; A61B 17/221 20130101; A61B 17/320758
20130101; A61B 90/361 20160201; A61B 2017/320064 20130101; A61B
2017/00327 20130101; A61B 2017/003 20130101; A61B 2017/00553
20130101; A61B 2017/2215 20130101 |
Class at
Publication: |
606/179 |
International
Class: |
A61B 17/14 20060101
A61B017/14 |
Goverment Interests
U.S. GOVERNMENT RIGHTS
[0002] At least a portions of the inventions disclosed and claimed
herein were made with government support under Grant No. R01
HL087797 awarded by the National Institute of Health. The
Government has certain rights in these inventions.
Claims
1. A microscale or millimeter scale shredding tool for use in a
medical procedure comprising: a. a housing having a distal end and
a proximal end; b. a first multi-blade blade stack mounted for
rotational motion about a first axis relative to the housing and
extending in part from the housing, wherein at least one of the
blades of the first stack comprises a first and second side and a
plurality of cutting tips wherein the maximum radial extension of
the at least some of the tips are located on the first side of the
blade while the maximum radial extension of the at least some other
tips are located on the second side of the blade; and c. a drive
mechanism for rotating the blades of the first stack; wherein the
shredding tool provides for intake and shredding of material
encountered during the medical procedure
2. The tool of claim 1 additionally comprising: d. a second
multi-blade blade stack mounted for rotational motion, about a
second axis which is parallel to the first axis, relative to the
housing and extending in part from the housing, wherein a least a
portion of the blades of the second blade stack have interlaced
positions with blades of the first stack in a plane perpendicular
to the first and second axes of rotation but which are offset in
the direction of the first and second axes so that the blades of
first stack do not interfere with the blades of the second stack;
and e. a drive mechanism for rotating the blades of the second
stack in an opposite direction relative to the rotation of the
blades of the first stack.
3. The tool of claim 1 wherein the tips of the at least one blade
of the first stack alternate between the first and the second side
around a circumference of the at least one blade.
4. The tool of claim 2 wherein the first multi-blade blade stack
comprises a plurality of first circular blades with first cutting
elements extending from circumferences of the first circular
blades, wherein the second multi-blade blade stack comprises a
plurality of second circular blades with second cutting elements
extending from circumferences of the second circular blades,
wherein each of the first circular blades rotates about a first
common axis, wherein each of the second circular blades rotates
about a second common axis, wherein the first circular blades each
have a first thickness and a first gap relative to an immediate
neighboring first circular blade, wherein the second circular
blades, each have a second thickness and a second gap relative to
an immediate neighboring second circular blade, wherein the first
thickness relative to the second gap and the second thickness
relative to the first gap, allows interlacing and movement of the
first and second blades while providing for intake and shredding of
material encountered by the blades during the medical
procedure.
5. The tool of claim 1 wherein the tool comprises a plurality of
stacked and adhered layers of deposited material.
6. The tool of claim 5 wherein the plurality of stacked and adhered
layers of deposited material comprise electrodeposited
material.
7. A microscale or millimeter scale shredding tool for use in a
medical procedure comprising: a. a housing having a distal end and
a proximal end; b. a first multi-blade blade stack mounted for
rotational motion about a first axis relative to the housing and
extending in part from the housing, wherein the housing includes a
shroud that result in the first blade stacks being shielded around
at least one half of its periphery to provide for reduced outflow
of shredded material than if the shielding extended around less
than one half their periphery; and c. a drive mechanism for
rotating the blades of the first stack; and wherein the shredding
tool provides for intake and shredding of material encountered
during the medical procedure.
8. The tool of claim 7 wherein the tool additionally comprising: d.
a second multi-blade blade stack mounted for rotational motion,
about a second axis which is parallel to the first axis, relative
to the housing and extending in part from the housing, wherein a
least a portion of the blades of the second blade stack have
interlaced positions with blades of the first stack in a plane
perpendicular to the first and second axes of rotation but which
are offset in the direction of the first and second axes so that
the blades of first stack do not interfere with the blades of the
second stack; and e. a drive mechanism for rotating the blades of
the second stack in an opposite direction to that of the rotation
of the blades of the first stack; and wherein the shroud includes a
plurality of shrouds that result in the first and second blades
stacks being shielded around at least one half of their periphery
to provide for reduced outflow of shredded material than if the
shielding extended around less than one half their periphery.
9. The tool of claim 8, wherein the first multi-blade blade stack
comprises a plurality of first circular blades with first cutting
elements extending from circumferences of the first circular
blades, wherein the second multi-blade blade stack comprises a
plurality of second circular blades with second cutting elements
extending from circumferences of the second circular blades,
wherein each of the first circular blades rotates about a first
common axis, wherein each of the second circular blades rotates
about a second common axis, wherein the first circular blades each
have a first thickness and a first gap relative to an immediate
neighboring first circular blade, wherein the second circular
blades each have a second thickness and a second gap relative to an
immediate neighboring second circular blade, wherein the first
thickness relative to the second gap and the second thickness
relative to the first gap, allows interlacing and movement of the
first and second blades while providing for intake and shredding of
material encountered by the blades during the medical
procedure.
10. The tool of claim 7 wherein the tool comprises a plurality of
stacked and adhered layers of deposited material.
11. The tool of claim 10 wherein the plurality of stacked and
adhered layers of deposited material comprise electrodeposited
material.
12. A microscale or millimeter scale shredding tool for use in a
medical procedure comprising: a. a housing having a distal end and
a proximal end wherein at least one position stabilizing mechanism
extends from housing so to interact with tissue within a body of a
patient to stabilize the position of the tool during shredding
operations; b. a first multi-blade blade stack mounted for
rotational motion about a first axis relative to the housing and
extending in part from the housing; and c. a drive mechanism for
rotating the blades of the first stack; and wherein the shredding
tool provides for intake and shredding of material encountered
during the medical procedure.
13. The tool of claim 12 wherein the tool additionally comprises:
d. a second multi-blade blade stack mounted for rotational motion,
about a second axis which is parallel to the first axis, relative
to the housing and extending in part from the housing, wherein a
least a portion of the blades of the second blade stack have
interlaced positions with blades of the first stack in a plane
perpendicular to the first and second axes of rotation but which
are offset in the direction of the first and second axes so that
the blades of first stack do not interfere with the blades of the
second stack; and e. a drive mechanism for rotating the blades of
the second stack in an opposite direction relative to the rotation
of the first stack of blades.
14. The tool of claim 12 wherein the stabilizing mechanism
comprises a spike.
15. The tool of claim 14 wherein the spike comprises a plurality of
spikes.
16. The tool of claim 13 wherein the first multi-blade blade stack
comprises a plurality of first circular blades with first cutting
elements extending from circumferences of the first circular
blades, wherein the second multi-blade blade stack comprises a
plurality of second circular blades with second cutting elements
extending from circumferences of the second circular blades,
wherein each of the first circular blades rotates about a first
common axis, wherein each of the second circular blades rotates
about a second common axis, wherein the first circular blades each
have a first thickness and a first gap relative to an immediate
neighboring first circular blade, wherein the second circular
blades each have a second thickness and a second gap relative to an
immediate neighboring second circular blade, wherein the first
thickness relative to the second gap and the second thickness
relative to the first gap, allows interlacing and movement of the
first and second blades while providing for intake and shredding of
material encountered by the blades during the medical
procedure.
17. The tool of claim 12 wherein the tool comprises a plurality of
stacked and adhered layers of deposited material.
18. The tool of claim 17 wherein the plurality of stacked and
adhered layers comprise electrodeposited material.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of U.S. application Ser.
No. 12/491,220 filed on Jun. 24, 2009 which claims benefit of U.S.
Provisional Patent Application No. 61/075,007 filed Jun. 24, 2008;
U.S. application Ser. No. 12/491,220 filed on Jun. 24, 2009 is a
continuation-in-part of U.S. patent application Ser. No. 12/490,295
filed Jun. 23, 2009; the '295 application in turn claims benefit of
U.S. Provisional Application Nos. 61/075,006, filed Jun. 23, 2008;
61/164,864, filed Mar. 30, 2009; and 61/164,883, filed Mar. 30,
2009. Each of these applications is incorporated herein by
reference as if set forth in full herein.
INCORPORATION BY REFERENCE
[0003] All publications and patent applications mentioned in this
specification are herein incorporated by reference to the same
extent as if each individual publication or patent application was
specifically and individually indicated to be incorporated by
reference.
FIELD
[0004] Embodiments of the present invention relate to micro-scale
and millimeter-scale shredding devices that may, for example, be
used to remove unwanted tissue or other material from selected
locations within a body of a patient during a surgical or other
medical procedure (e.g. a percutaneous or minimally invasive
procedure) while other embodiments are related to such procedures
and still others are related to making such devices using
multi-layer, multi-material electrochemical fabrication
methods.
BACKGROUND
Electrochemical Fabrication
[0005] An electrochemical fabrication technique for forming
three-dimensional structures from a plurality of adhered layers is
being commercially pursued by Microfabrica.RTM. Inc. (formerly
MEMGen Corporation) of Van Nuys, Calif. under the name
EFAB.RTM..
[0006] Various electrochemical fabrication techniques were
described in U.S. Pat. No. 6,027,630, issued on Feb. 22, 2000 to
Adam Cohen. Some embodiments of this electrochemical fabrication
technique allow the selective deposition of a material using a mask
that includes a patterned conformable material on a support
structure that is independent of the substrate onto which plating
will occur. When desiring to perform an electrodeposition using the
mask, the conformable portion of the mask is brought into contact
with a substrate, but not adhered or bonded to the substrate, while
in the presence of a plating solution such that the contact of the
conformable portion of the mask to the substrate inhibits
deposition at selected locations. For convenience, these masks
might be generically called conformable contact masks; the masking
technique may be generically called a conformable contact mask
plating process. More specifically, in the terminology of
Microfabrica Inc. such masks have come to be known as INSTANT
MASKS.TM. and the process known as INSTANT MASKING.TM. or INSTANT
MASK.TM. plating. Selective depositions using conformable contact
mask plating may be used to form single selective deposits of
material or may be used in a process to form multi-layer
structures. The teachings of the '630 patent are hereby
incorporated herein by reference as if set forth in full herein.
Since the filing of the patent application that led to the above
noted patent, various papers about conformable contact mask plating
(i.e. INSTANT MASKING) and electrochemical fabrication have been
published: [0007] (1) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U.
Frodis and P. Will, "EFAB: Batch production of functional,
fully-dense metal parts with micro-scale features", Proc. 9th Solid
Freeform Fabrication, The University of Texas at Austin, p 161,
August 1998. [0008] (2) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld,
U. Frodis and P. Will, "EFAB: Rapid, Low-Cost Desktop
Micromachining of High Aspect Ratio True 3-D MEMS", Proc. 12th IEEE
Micro Electro Mechanical Systems Workshop, IEEE, p 244, January
1999. [0009] (3) A. Cohen, "3-D Micromachining by Electrochemical
Fabrication", Micromachine Devices, March 1999. [0010] (4) G.
Zhang, A. Cohen, U. Frodis, F. Tseng, F. Mansfeld, and P. Will,
"EFAB: Rapid Desktop Manufacturing of True 3-D Microstructures",
Proc. 2nd International Conference on Integrated
MicroNanotechnology for Space Applications, The Aerospace Co.,
April 1999. [0011] (5) F. Tseng, U. Frodis, G. Zhang, A. Cohen, F.
Mansfeld, and P. Will, "EFAB: High Aspect Ratio, Arbitrary 3-D
Metal Microstructures using a Low-Cost Automated Batch Process",
3rd International Workshop on High Aspect Ratio MicroStructure
Technology (HARMST '99), June 1999. [0012] (6) A. Cohen, U. Frodis,
F. Tseng, G. Zhang, F. Mansfeld, and P. Will, "EFAB: Low-Cost,
Automated Electrochemical Batch Fabrication of Arbitrary 3-D
Microstructures", Micromachining and Microfabrication Process
Technology, SPIE 1999 Symposium on Micromachining and
Microfabrication, September 1999. [0013] (7) F. Tseng, G. Zhang, U.
Frodis, A. Cohen, F. Mansfeld, and P. Will, "EFAB: High Aspect
Ratio, Arbitrary 3-D Metal Microstructures using a Low-Cost
Automated Batch Process", MEMS Symposium, ASME 1999 International
Mechanical Engineering Congress and Exposition, November, 1999.
[0014] (8) A. Cohen, "Electrochemical Fabrication (EFAB.TM.)",
Chapter 19 of The MEMS Handbook, edited by Mohamed Gad-El-Hak, CRC
Press, 2002. [0015] (9) Microfabrication--Rapid Prototyping's
Killer Application", pages 1-5 of the Rapid Prototyping Report,
CAD/CAM Publishing, Inc., June 1999.
[0016] The disclosures of these nine publications are hereby
incorporated herein by reference as if set forth in full
herein.
[0017] An electrochemical deposition for forming multilayer
structures may be carried out in a number of different ways as set
forth in the above patent and publications. In one form, this
process involves the execution of three separate operations during
the formation of each layer of the structure that is to be
formed:
[0018] 1. Selectively depositing at least one material by
electrodeposition upon one or more desired regions of a substrate.
Typically this material is either a structural material or a
sacrificial material.
[0019] 2. Then, blanket depositing at least one additional material
by electrodeposition so that the additional deposit covers both the
regions that were previously selectively deposited onto, and the
regions of the substrate that did not receive any previously
applied selective depositions. Typically this material is the other
of a structural material or a sacrificial material.
[0020] 3. Finally, planarizing the materials deposited during the
first and second operations to produce a smoothed surface of a
first layer of desired thickness having at least one region
containing the at least one material and at least one region
containing at least the one additional material.
[0021] After formation of the first layer, one or more additional
layers may be formed adjacent to an immediately preceding layer and
adhered to the smoothed surface of that preceding layer. These
additional layers are formed by repeating the first through third
operations one or more times wherein the formation of each
subsequent layer treats the previously formed layers and the
initial substrate as a new and thickening substrate.
[0022] Once the formation of all layers has been completed, at
least a portion of at least one of the materials deposited is
generally removed by an etching process to expose or release the
three-dimensional structure that was intended to be formed. The
removed material is a sacrificial material while the material that
forms part of the desired structure is a structural material.
[0023] The preferred method of performing the selective
electrodeposition involved in the first operation is by conformable
contact mask plating. In this type of plating, one or more
conformable contact (CC) masks are first formed. The CC masks
include a support structure onto which a patterned conformable
dielectric material is adhered or formed. The conformable material
for each mask is shaped in accordance with a particular
cross-section of material to be plated (the pattern of conformable
material is complementary to the pattern of material to be
deposited). At least one CC mask is used for each unique
cross-sectional pattern that is to be plated.
[0024] The support for a CC mask is typically a plate-like
structure formed of a metal that is to be selectively electroplated
and from which material to be plated will be dissolved. In this
typical approach, the support will act as an anode in an
electroplating process. In an alternative approach, the support may
instead be a porous or otherwise perforated material through which
deposition material will pass during an electroplating operation on
its way from a distal anode to a deposition surface. In either
approach, it is possible for multiple CC masks to share a common
support, i.e. the patterns of conformable dielectric material for
plating multiple layers of material may be located in different
areas of a single support structure. When a single support
structure contains multiple plating patterns, the entire structure
is referred to as the CC mask while the individual plating masks
may be referred to as "submasks". In the present application such a
distinction will be made only when relevant to a specific point
being made.
[0025] In preparation for performing the selective deposition of
the first operation, the conformable portion of the CC mask is
placed in registration with and pressed against a selected portion
of (1) the substrate, (2) a previously formed layer, or (3) a
previously deposited portion of a layer on which deposition is to
occur. The pressing together of the CC mask and relevant substrate
occur in such a way that all openings, in the conformable portions
of the CC mask contain plating solution. The conformable material
of the CC mask that contacts the substrate acts as a barrier to
electrodeposition while the openings in the CC mask that are filled
with electroplating solution act as pathways for transferring
material from an anode (e.g. the CC mask support) to the
non-contacted portions of the substrate (which act as a cathode
during the plating operation) when an appropriate potential and/or
current are supplied.
[0026] An example of a CC mask and CC mask plating are shown in
FIGS. 1A-1C. FIG. 1A shows a side view of a CC mask 8 consisting of
a conformable or deformable (e.g. elastomeric) insulator 10
patterned on an anode 12. The anode has two functions. One is as a
supporting material for the patterned insulator 10 to maintain its
integrity and alignment since the pattern may be topologically
complex (e.g., involving isolated "islands" of insulator material).
The other function is as an anode for the electroplating operation.
FIG. 1A also depicts a substrate 6, separated from mask 8, onto
which material will be deposited during the process of forming a
layer. CC mask plating selectively deposits material 22 onto
substrate 6 by simply pressing the insulator against the substrate
then electrodepositing material through apertures 26a and 26b in
the insulator as shown in FIG. 1B. After deposition, the CC mask is
separated, preferably non-destructively, from the substrate 6 as
shown in FIG. 1C.
[0027] The CC mask plating process is distinct from a
"through-mask" plating process in that in a through-mask plating
process the separation of the masking material from the substrate
would occur destructively. Furthermore in a through mask plating
process, opening in the masking material are typically formed while
the masking material is in contact with and adhered to the
substrate. As with through-mask plating, CC mask plating deposits
material selectively and simultaneously over the entire layer. The
plated region may consist of one or more isolated plating regions
where these isolated plating regions may belong to a single
structure that is being formed or may belong to multiple structures
that are being formed simultaneously. In CC mask plating as
individual masks are not intentionally destroyed in the removal
process, they may be usable in multiple plating operations.
[0028] Another example of a CC mask and CC mask plating is shown in
FIGS. 1D-1G. FIG. 1D shows an anode 12' separated from a mask 8'
that includes a patterned conformable material 10' and a support
structure 20. FIG. 1D also depicts substrate 6 separated from the
mask 8'. FIG. 1E illustrates the mask 8' being brought into contact
with the substrate 6. FIG. 1F illustrates the deposit 22' that
results from conducting a current from the anode 12' to the
substrate 6. FIG. 1G illustrates the deposit 22' on substrate 6
after separation from mask 8'. In this example, an appropriate
electrolyte is located between the substrate 6 and the anode 12'
and a current of ions coming from one or both of the solution and
the anode are conducted through the opening in the mask to the
substrate where material is deposited. This type of mask may be
referred to as an anodeless INSTANT MASK.TM. (AIM) or as an
anodeless conformable contact (ACC) mask.
[0029] Unlike through-mask plating, CC mask plating allows CC masks
to be formed completely separate from the substrate on which
plating is to occur (e.g. separate from a three-dimensional (3D)
structure that is being formed). CC masks may be formed in a
variety of ways, for example, using a photolithographic process.
All masks can be generated simultaneously, e.g. prior to structure
fabrication rather than during it. This separation makes possible a
simple, low-cost, automated, self-contained, and internally-clean
"desktop factory" that can be installed almost anywhere to
fabricate 3D structures, leaving any required clean room processes,
such as photolithography to be performed by service bureaus or the
like.
[0030] An example of the electrochemical fabrication process
discussed above is illustrated in FIGS. 2A-2F. These figures show
that the process involves deposition of a first material 2 which is
a sacrificial material and a second material 4 which is a
structural material. The CC mask 8, in this example, includes a
patterned conformable material (e.g. an elastomeric dielectric
material) 10 and a support 12 which is made from deposition
material 2. The conformal portion of the CC mask is pressed against
substrate 6 with a plating solution 14 located within the openings
16 in the conformable material 10. An electric current, from power
supply 18, is then passed through the plating solution 14 via (a)
support 12 which doubles as an anode and (b) substrate 6 which
doubles as a cathode. FIG. 2A illustrates that the passing of
current causes material 2 within the plating solution and material
2 from the anode 12 to be selectively transferred to and plated on
the substrate 6. After electroplating the first deposition material
2 onto the substrate 6 using CC mask 8, the CC mask 8 is removed as
shown in FIG. 2B. FIG. 2C depicts the second deposition material 4
as having been blanket-deposited (i.e. non-selectively deposited)
over the previously deposited first deposition material 2 as well
as over the other portions of the substrate 6. The blanket
deposition occurs by electroplating from an anode (not shown),
composed of the second material, through an appropriate plating
solution (not shown), and to the cathode/substrate 6. The entire
two-material layer is then planarized to achieve precise thickness
and flatness as shown in FIG. 2D. After repetition of this process
for all layers, the multi-layer structure 20 formed of the second
material 4 (i.e. structural material) is embedded in first material
2 (i.e. sacrificial material) as shown in FIG. 2E. The embedded
structure is etched to yield the desired device, i.e. structure 20,
as shown in FIG. 2F.
[0031] Various components of an exemplary manual electrochemical
fabrication system 32 are shown in FIGS. 3A-3C. The system 32
consists of several subsystems 34, 36, 38, and 40. The substrate
holding subsystem 34 is depicted in the upper portions of each of
FIGS. 3A-3C and includes several components: (1) a carrier 48, (2)
a metal substrate 6 onto which the layers are deposited, and (3) a
linear slide 42 capable of moving the substrate 6 up and down
relative to the carrier 48 in response to drive force from actuator
44. Subsystem 34 also includes an indicator 46 for measuring
differences in vertical position of the substrate which may be used
in setting or determining layer thicknesses and/or deposition
thicknesses. The subsystem 34 further includes feet 68 for carrier
48 which can be precisely mounted on subsystem 36.
[0032] The CC mask subsystem 36 shown in the lower portion of FIG.
3A includes several components: (1) a CC mask 8 that is actually
made up of a number of CC masks (i.e. submasks) that share a common
support/anode 12, (2) precision X-stage 54, (3) precision Y-stage
56, (4) frame 72 on which the feet 68 of subsystem 34 can mount,
and (5) a tank 58 for containing the electrolyte 16. Subsystems 34
and 36 also include appropriate electrical connections (not shown)
for connecting to an appropriate power source (not shown) for
driving the CC masking process.
[0033] The blanket deposition subsystem 38 is shown in the lower
portion of FIG. 3B and includes several components: (1) an anode
62, (2) an electrolyte tank 64 for holding plating solution 66, and
(3) frame 74 on which feet 68 of subsystem 34 may sit. Subsystem 38
also includes appropriate electrical connections (not shown) for
connecting the anode to an appropriate power supply (not shown) for
driving the blanket deposition process.
[0034] The planarization subsystem 40 is shown in the lower portion
of FIG. 3C and includes a lapping plate 52 and associated motion
and control systems (not shown) for planarizing the
depositions.
[0035] In addition to teaching the use of CC masks for
electrodeposition purposes, the '630 patent also teaches that the
CC masks may be placed against a substrate with the polarity of the
voltage reversed and material may thereby be selectively removed
from the substrate. It indicates that such removal processes can be
used to selectively etch, engrave, and polish a substrate, e.g., a
plaque.
[0036] The '630 patent further indicates that the electroplating
methods and articles disclosed therein allow fabrication of devices
from thin layers of materials such as, e.g., metals, polymers,
ceramics, and semiconductor materials. It further indicates that
although the electroplating embodiments described therein have been
described with respect to the use of two metals, a variety of
materials, e.g., polymers, ceramics and semiconductor materials,
and any number of metals can be deposited either by the
electroplating methods therein, or in separate processes that occur
throughout the electroplating method. It indicates that a thin
plating base can be deposited, e.g., by sputtering, over a deposit
that is insufficiently conductive (e.g., an insulating layer) so as
to enable subsequent electroplating. It also indicates that
multiple support materials (i.e. sacrificial materials) can be
included in the electroplated element allowing selective removal of
the support materials.
[0037] The '630 patent additionally teaches that the electroplating
methods disclosed therein can be used to manufacture elements
having complex microstructure and close tolerances between parts.
An example is given with the aid of FIGS. 14A-14E of that patent.
In the example, elements having parts that fit with close
tolerances, e.g., having gaps between about 1-5 um, including
electroplating the parts of the device in an unassembled,
preferably pre-aligned, state and once fabricated. In such
embodiments, the individual parts can be moved into operational
relation with each other or they can simply fall together. Once
together the separate parts may be retained by clips or the
like.
[0038] Another method for forming microstructures from
electroplated metals (i.e. using electrochemical fabrication
techniques) is taught in U.S. Pat. No. 5,190,637 to Henry Guckel,
entitled "Formation of Microstructures by Multiple Level Deep X-ray
Lithography with Sacrificial Metal layers". This patent teaches the
formation of metal structure utilizing through mask exposures. A
first layer of a primary metal is electroplated onto an exposed
plating base to fill a void in a photoresist (the photoresist
forming a through mask having a desired pattern of openings), the
photoresist is then removed and a secondary metal is electroplated
over the first layer and over the plating base. The exposed surface
of the secondary metal is then machined down to a height which
exposes the first metal to produce a flat uniform surface extending
across both the primary and secondary metals. Formation of a second
layer may then begin by applying a photoresist over the first layer
and patterning it (i.e. to form a second through mask) and then
repeating the process that was used to produce the first layer to
produce a second layer of desired configuration. The process is
repeated until the entire structure is formed and the secondary
metal is removed by etching. The photoresist is formed over the
plating base or previous layer by casting and patterning of the
photoresist (i.e. voids formed in the photoresist) are formed by
exposure of the photoresist through a patterned mask via X-rays or
UV radiation and development of the exposed or unexposed areas.
[0039] The '637 patent teaches the locating of a plating base onto
a substrate in preparation for electroplating materials onto the
substrate. The plating base is indicated as typically involving the
use of a sputtered film of an adhesive metal, such as chromium or
titanium, and then a sputtered film of the metal that is to be
plated. It is also taught that the plating base may be applied over
an initial layer of sacrificial material (i.e. a layer or coating
of a single material) on the substrate so that the structure and
substrate may be detached if desired. In such cases after formation
of the structure the sacrificial material forming part of each
layer of the structure may be removed along the initial sacrificial
layer to free the structure. Substrate materials mentioned in the
'637 patent include silicon, glass, metals, and silicon with
protected semiconductor devices. A specific example of a plating
base includes about 150 angstroms of titanium and about 300
angstroms of nickel, both of which are sputtered at a temperature
of 160.degree. C. In another example it is indicated that the
plating base may consist of 150 angstroms of titanium and 150
angstroms of nickel where both are applied by sputtering.
[0040] A need exists in various fields for miniature devices having
improved characteristics, reduced fabrication times, reduced
fabrication costs, simplified fabrication processes, greater
versatility in device design, improved selection of materials,
improved material properties, more cost effective and less risky
production of such devices, and/or more independence between
geometric configuration and the selected fabrication process.
[0041] Applications and Uses
[0042] Electrochemical Fabrication provides the ability to form
prototypes and commercial quantities of miniature objects, parts,
structures, devices, and the like at reasonable costs and in
reasonable times. In fact, Electrochemical Fabrication is an
enabler for the formation of many structures that were hitherto
impossible to produce. Electrochemical Fabrication opens the
spectrum for new designs and products in many industrial fields.
Even though Electrochemical Fabrication offers this new capability
and it is understood that Electrochemical Fabrication techniques
can be combined with designs and structures known within these
various fields to produce new structures, certain uses for
Electrochemical Fabrication provide designs, structures,
capabilities and/or features not known or obvious in view of the
states of the art in these various fields.
SUMMARY OF THE DISCLOSURE
[0043] It is an object of some embodiments of the invention to
provide an improved micro-scale or millimeter scale shredding
device for use in medical procedures.
[0044] It is an object of some embodiments of the invention to
provide an improved micro-scale or millimeter scale shredding
device for use in medical procedures with (1) improved positional
stabilization while operating in a working region, (2) improved
blades for disrupting or shredding a material that is to be
removed; and/or (3) reduced unintended outflow of shredded material
from the shredding device back into the working region outside of
the shredding device.
[0045] It is an object of some embodiments of the invention to
provide improved medical procedures (e.g. minimally invasive
procedures) for removing tissue or other material from the body of
a patient.
[0046] It is an object of some embodiments of the invention to
provide an improved medical procedures (e.g. minimally invasive
procedures) involving use of a microscale or millimeter scale
shredding device having (1) improved positional stabilization while
operating in a working region, (2) improved blades for disrupting
or shredding a material that is to be removed; and/or (3) reduced
unintended outflow of shredded material from the shredding device
back into the working region outside of the shredding device.
[0047] Other objects and advantages of various embodiments of the
invention will be apparent to those of skill in the art upon review
of the teachings herein. The various embodiments of the invention,
set forth explicitly herein or otherwise ascertained from the
teachings herein, may address one or more of the above objects
alone or in combination, or alternatively may address some other
object ascertained from the teachings herein. It is not necessarily
intended that all objects be addressed by any single aspect of the
invention even though that may be the case with regard to some
aspects.
[0048] A first aspect of the invention provides a microscale or
millimeter scale shredding tool for use in a medical procedure,
including: (a) a housing having a distal end and a proximal end;
(b) a first multi-blade blade stack mounted for rotational motion
about a first axis relative to the housing and extending in part
from the housing; (c) a second multi-blade blade stack mounted for
rotational motion, about a second axis which is parallel to the
first axis, relative to the housing and extending in part from the
housing, wherein a least a portion of the blades of the second
blade stack have interlaced positions with blades of the first
stack in a plane perpendicular to the first and second axes of
rotation but which are offset in the direction of the first and
second axes so that the blades of first stack do not interfere with
the blade of the second stack; and (d) a drive mechanism for
rotating the blades of the first stack and the blades of the second
stack in opposite directions; wherein at least one of the blades of
the first or second multi-blade stack comprises a first and second
side and a plurality of cutting tips wherein the maximum radial
extension of the at least some of the tips are located on the first
side of the blade while the maximum radial extension of the at
least some other tips are located on the second side of the blade,
and wherein the shredding tool provides for intake and shredding of
material encountered during the medical procedure.
[0049] Numerous variations of the first aspect of the invention
exist and include for example: at least some of the tips
alternating around a circumference of the blade with the at least
some other tips.
[0050] A second aspect of the invention provides a microscale or
millimeter scale shredding tool for use in a medical procedure,
including: (a) housing having a distal end and a proximal end; (b)
a first multi-blade blade stack mounted for rotational motion about
a first axis relative to the housing and extending in part from the
housing; (c) a second multi-blade blade stack mounted for
rotational motion, about a second axis which is parallel to the
first axis, relative to the housing and extending in part from the
housing, wherein a least a portion of the blades of the second
blade stack have interlaced positions with blades of the first
stack in a plane perpendicular to the first and second axes of
rotation but which are offset along in the direction of the first
and second axis so that the blades of first stack do not interfere
with the blade of the second stack; and (d) a drive mechanism for
rotating the blades of the first stack and the blades of the second
stack in opposite directions; wherein the housing includes shrouds
that result in the first and second blades stacks being shielded
around at least one half of their periphery to provide for reduced
outflow of shredded material than if the shielding extended around
less than one half their periphery.
[0051] A third aspect of the invention provides a microscale or
millimeter scale shredding tool for use in a medical application,
including: (a) a housing having a distal end and a proximal end;
(b) a first multi-blade blade stack mounted for rotational motion
about a first axis relative to the housing and extending in part
from the housing; (c) a second multi-blade blade stack mounted for
rotational motion, about a second axis which is parallel to the
first axis, relative to the housing and extending in part from the
housing, wherein a least a portion of the blades of the second
blade stack have interlaced positions with blades of the first
stack in a plane perpendicular to the first and second axes of
rotation but which are offset along in the direction of the first
and second axis so that the blades of first stack do not interfere
with the blade of the second stack; and (d) a drive mechanism for
rotating the blades of the first stack and the blades of the second
stack in opposite directions; wherein at least one position
stabilizing mechanism extends from housing so to interact with
tissue within a body of a patient to stabilize the position of the
tool during shredding operations, wherein the shredding tool
provides for intake and shredding of material encountered during
the medical procedure.
[0052] Numerous variations of the third aspect of the invention
exist and include for example: (1) the stabilizing mechanism
comprises a spike and (2) the spike comprises a plurality of
spikes.
[0053] Another variation of the first-third aspects of the
invention include: (i) the first multi-blade blade stack comprising
a plurality of first circular blades with first cutting elements
extending from circumferences of the first circular blades, (ii)
the second multi-blade blade stack comprising a plurality of second
circular blades with second cutting elements extending from
circumferences of the second circular blades, (iii) each of the
first circular blades rotating about a first common axis, (iv) each
of the first circular blades rotating about a second common axis,
(v) the first circular blades each having a first thickness and a
first gap relative to an immediate neighboring first circular
blade, (vi) the second circular blades each having a second
thickness and a second gap relative to an immediate neighboring
second circular blade, and (vii) the first thickness relative to
the second gap and the second thickness relative to the first gap
allowing interlacing and movement of the first and second blades
while providing for intake and shredding of material encountered by
the blades during the medical procedure.
[0054] Additional variations of the first-third aspects of the
invention and their variations, include, for example: (1) The
tools, at least in part, being formed from a plurality of stacked
layers of deposited material wherein the deposited material may be
electrodeposited material; (2) the procedure is a minimally
invasive procedure; and/or (3) the material being tissue.
[0055] A fourth aspect of the invention provides a microscale or
millimeter scale shredding tool for use in a medical procedure,
including (a) a housing having a distal end and a proximal end; (b)
a first multi-blade blade stack mounted for rotational motion about
a first axis relative to the housing and extending in part from the
housing; and (c) a drive mechanism for rotating the blades of the
first stack; wherein at least one of the blades of the first stack
comprises a first and second side and a plurality of cutting tips
wherein the maximum radial extension of the at least some of the
tips are located on the first side of the blade while the maximum
radial extension of the at least some other tips are located on the
second side of the blade, wherein the shredding tool provides for
intake and shredding of material encountered during the medical
procedure.
[0056] A first variation of the fourth aspect of the invention
additionally provides: (d) a second multi-blade blade stack mounted
for rotational motion, about a second axis which is parallel to the
first axis, relative to the housing and extending in part from the
housing, wherein a least a portion of the blades of the second
blade stack have interlaced positions with blades of the first
stack in a plane perpendicular to the first and second axes of
rotation but which are offset in the direction of the first and
second axes so that the blades of first stack do not interfere with
the blade of the second stack; and (e) a drive mechanism for
rotating the blades of the second stack in an opposite direction
relative to the rotation of the blades of the first stack.
[0057] Another variation of the fourth aspect of the invention
includes at least some of the tips alternate around a circumference
of the blade with the at least some other tips.
[0058] A fifth aspect of the invention provides a microscale or
millimeter scale shredding tool for use in a medical procedure,
including: (a) a housing having a distal end and a proximal end;
(b) a first multi-blade blade stack mounted for rotational motion
about a first axis relative to the housing and extending in part
from the housing; wherein the housing includes a shroud that result
in the first blade stacks being shielded around at least one half
of its periphery to provide for reduced outflow of shredded
material than if the shielding extended around less than one half
their periphery, wherein the shredding tool provides for intake and
shredding of material encountered during the medical procedure.
[0059] A first variation of the fifth aspect of the invention
additionally provides: (c) a second multi-blade blade stack mounted
for rotational motion, about a second axis which is parallel to the
first axis, relative to the housing and extending in part from the
housing, wherein a least a portion of the blades of the second
blade stack have interlaced positions with blades of the first
stack in a plane perpendicular to the first and second axes of
rotation but which are offset along in the direction of the first
and second axis so that the blades of first stack do not interfere
with the blade of the second stack; and (d) a drive mechanism for
rotating the blades of the second stack in an opposite direction to
that of the rotation of the blades of the first stack; wherein the
shroud includes a plurality of shrouds that result in the first and
second blades stacks being shielded around at least one half of
their periphery to provide for reduced outflow of shredded material
than if the shielding extended around less than one half their
periphery.
[0060] A sixth aspect of the invention provides, a microscale or
millimeter-scale shredding tool for use in a medical application,
including: (a) a housing having a distal end and a proximal end;
(b) a first multi-blade blade stack mounted for rotational motion
about a first axis relative to the housing and extending in part
from the housing; and (c) a drive mechanism for rotating the blades
of the first stack; wherein at least one position stabilizing
mechanism extends from housing so to interact with tissue within a
body of a patient to stabilize the position of the tool during
shredding operations, wherein the shredding tool provides for
intake and shredding of material encountered during the medical
procedure.
[0061] A first variation of the sixth aspect of the invention
provides: (d) a second multi-blade blade stack mounted for
rotational motion, about a second axis which is parallel to the
first axis, relative to the housing and extending in part from the
housing, wherein a least a portion of the blades of the second
blade stack have interlaced positions with blades of the first
stack in a plane perpendicular to the first and second axes of
rotation but which are offset along in the direction of the first
and second axis so that the blades of first stack do not interfere
with the blade of the second stack; and (e) a drive mechanism for
rotating the blades of the second stack in an opposite direction
relative to the rotation of the first stack of blades;
[0062] Further example variations of the sixth aspect of the
invention include the stabilizing mechanism comprising a spike, and
possibly the spike comprising a plurality of spikes.
[0063] Another variation of the first variations of the
fourth-sixth aspects of the invention include: (i) the first
multi-blade blade stack comprising a plurality of first circular
blades with first cutting elements extending from circumferences of
the first circular blades, (ii) the second multi-blade blade stack
comprising a plurality of second circular blades with second
cutting elements extending from circumferences of the second
circular blades, (iii) each of the first circular blades rotating
about a first common axis, (iv) each of the first circular blades
rotating about a second common axis, (v) the first circular blades
each having a first thickness and a first gap relative to an
immediate neighboring first circular blade, (vi) the second
circular blades each having a second thickness and a second gap
relative to an immediate neighboring second circular blade, and
(vii) the first thickness relative to the second gap and the second
thickness relative to the first gap allowing interlacing and
movement of the first and second blades while providing for intake
and shredding of material encountered by the blades during the
medical procedure.
[0064] Additional variations of the fourth-sixth aspects of the
invention and their variations, include, for example: (1) The
tools, at least in part, being formed from a plurality of stacked
layers of deposited material wherein the deposited material may be
electrodeposited material; (2) the procedure is a minimally
invasive procedure; and/or (3) the material being tissue.
[0065] A seventh aspect of the invention provides a medical
procedure including: (a) insertion of a microscale or millimeter
scale shredding tool into a working area with a body of a patient,
comprising: (i) a housing having a distal end and a proximal end;
(ii) a first multi-blade blade stack mounted for rotational motion
about a first axis relative to the housing and extending in part
from the housing, wherein at least one of the blades of the first
stack comprises a first and second side and a plurality of cutting
tips wherein the maximum radial extension of the at least some of
the tips are located on the first side of the blade while the
maximum radial extension of the at least some other tips are
located on the second side of the blade, and (iii) a drive
mechanism for rotating the blades of the first stack; and (b)
powering the drive mechanism and moving the shredding tool to
desired locations within the working area to intake and shred
selected material; and (c) extracting the shredding tool from the
working area and from the body of the patient.
[0066] A first variation of the seventh aspect of the invention
adds the following features to the tool: (d) a second multi-blade
blade stack mounted for rotational motion, about a second axis
which is parallel to the first axis, relative to the housing and
extending in part from the housing, wherein a least a portion of
the blades of the second blade stack have interlaced positions with
blades of the first stack in a plane perpendicular to the first and
second axes of rotation but which are offset in the direction of
the first and second axes so that the blades of first stack do not
interfere with the blade of the second stack; and (e) a drive
mechanism for rotating the blades of the second stack in an
opposite direction relative to the rotation of the blades of the
first stack;
[0067] A second variation of the seventh aspect of the invention
provides for at least some of the tips of the tool alternating
around a circumference of the blade with the at least some other
tips.
[0068] An eighth aspect of the invention provides a medical
procedure including: (a) insertion of a microscale or millimeter
scale shredding tool into a working area with a body of a patient,
comprising: (i) a housing having a distal end and a proximal end;
and (ii) a first multi-blade blade stack mounted for rotational
motion about a first axis relative to the housing and extending in
part from the housing, wherein the housing includes a shroud that
result in the first blade stacks being shielded around at least one
half of its periphery to provide for reduced outflow of shredded
material than if the shielding extended around less than one half
their periphery, (b) powering on the drive mechanism and moving the
shredding tool to desired locations within the working area to
intake and shred selected material; and (c) extracting the
shredding tool from the working area and from the body of the
patient.
[0069] A first variation of the eighth aspect of the invention adds
the following features to the tool: (iii) a second multi-blade
blade stack mounted for rotational motion, about a second axis
which is parallel to the first axis, relative to the housing and
extending in part from the housing, wherein a least a portion of
the blades of the second blade stack have interlaced positions with
blades of the first stack in a plane perpendicular to the first and
second axes of rotation but which are offset along in the direction
of the first and second axis so that the blades of first stack do
not interfere with the blade of the second stack; and (iv) a drive
mechanism for rotating the blades of the second stack in an
opposite direction to that of the rotation of the blades of the
first stack; and wherein the shroud includes a plurality of shrouds
that result in the first and second blades stacks being shielded
around at least one half of their periphery to provide for reduced
outflow of shredded material than if the shielding extended around
less than one half their periphery.
[0070] A ninth aspect of the invention provides a medical procedure
including: (a) insertion of a microscale or millimeter scale
shredding tool into a working area with a body of a patient,
comprising: (i) housing having a distal end and a proximal end
wherein at least one position stabilizing mechanism extends from
housing so to interact with tissue within a body of a patient to
stabilize the position of the tool during shredding operations;
(ii) a first multi-blade blade stack mounted for rotational motion
about a first axis relative to the housing and extending in part
from the housing; (iii) a drive mechanism for rotating the blades
of the first stack; (b) powering on the drive mechanism and moving
the shredding tool to desired locations within the working area to
intake and shred selected material; and (c) extracting the
shredding tool from the working area and from the body of the
patient.
[0071] A first variation of the ninth aspect of the invention adds
the following features to the tool (iv) a second multi-blade blade
stack mounted for rotational motion, about a second axis which is
parallel to the first axis, relative to the housing and extending
in part from the housing, wherein a least a portion of the blades
of the second blade stack have interlaced positions with blades of
the first stack in a plane perpendicular to the first and second
axes of rotation but which are offset along in the direction of the
first and second axis so that the blades of first stack do not
interfere with the blade of the second stack; and (v) a drive
mechanism for rotating the blades of the second stack in an
opposite direction relative to the rotation of the first stack of
blades.
[0072] Additional variations of the ninth aspect of the invention
provide for the stabilizing mechanism to include a spike and
possible the spike to include a plurality of spikes.
[0073] Another variation of the first variations of the
seventh-ninth aspects of the invention provide: (i) the first
multi-blade blade stack comprising a plurality of first circular
blades with first cutting elements extending from circumferences of
the first circular blades, (ii) the second multi-blade blade stack
comprising a plurality of second circular blades with second
cutting elements extending from circumferences of the second
circular blades, (iii) each of the first circular blades rotating
about a first common axis, (iv) each of the first circular blades
rotating about a second common axis, (v) the first circular blades
each having a first thickness and a first gap relative to an
immediate neighboring first circular blade, (vi) the second
circular blades each having a second thickness and a second gap
relative to an immediate neighboring second circular blade, and
(vii) the first thickness relative to the second gap and the second
thickness relative to the first gap allowing interlacing and
movement of the first and second blades while providing for intake
and shredding of material encountered by the blades during the
medical procedure.
[0074] Additional variations of the seventh-ninth aspects of the
invention and their variations, include, for example: (1) The
tools, at least in part, being formed from a plurality of stacked
layers of deposited material wherein the deposited material may be
electrodeposited material; (2) the procedure is a minimally
invasive procedure; and/or (3) the material being tissue.
[0075] The disclosure of the present invention provides a number of
device embodiments which may be formed from a plurality of formed
and adhered layers with each successive layer including at least
two materials, one of which is a structural material and the other
of which is a sacrificial material, and wherein each successive
layer defines a successive cross-section of the three-dimensional
structure, and wherein the forming of each of the plurality of
successive layers includes: (i) depositing a first of the at least
two materials; (ii) depositing a second of the at least two
materials; and (B) after the forming of the plurality of successive
layers, separating at least a portion of the sacrificial material
from the structural material to reveal the three-dimensional
structure. In some embodiments, the device may include a plurality
of components movable relative to one another which contain etching
holes which may be aligned during fabrication and during release
from at least a portion of the sacrificial material.
[0076] Other aspects of the invention will be understood by those
of skill in the art upon review of the teachings herein. Other
aspects of the invention may involve combinations of the above
noted aspects of the invention. Other aspects of the invention may
involve apparatus that can be used in implementing one or more of
the above method aspects of the invention. These other aspects of
the invention may provide various combinations of the aspects
presented above as well as provide other configurations,
structures, functional relationships, and processes that have not
been specifically set forth above.
BRIEF DESCRIPTION OF THE DRAWINGS
[0077] FIGS. 1A-1C schematically depict side views of various
stages of a CC mask plating process, while FIGS. 1D-G schematically
depict a side views of various stages of a CC mask plating process
using a different type of CC mask.
[0078] FIGS. 2A-2F schematically depict side views of various
stages of an electrochemical fabrication process as applied to the
formation of a particular structure where a sacrificial material is
selectively deposited while a structural material is blanket
deposited.
[0079] FIGS. 3A-3C schematically depict side views of various
example subassemblies that may be used in manually implementing the
electrochemical fabrication method depicted in FIGS. 2A-2F.
[0080] FIGS. 4A-4F schematically depict the formation of a first
layer of a structure using adhered mask plating where the blanket
deposition of a second material overlays both the openings between
deposition locations of a first material and the first material
itself
[0081] FIG. 4G depicts the completion of formation of the first
layer resulting from planarizing the deposited materials to a
desired level.
[0082] FIGS. 4H and 4I respectively depict the state of the process
after formation of the multiple layers of the structure and after
release of the structure from the sacrificial material.
[0083] FIG. 5 provides an upper perspective view of a basic
shredding device according to a first embodiment of the
invention.
[0084] FIG. 6 provides a lower perspective view of a basic
shredding device of according to the first embodiment where
optional indentations have been provided in the housing surface for
location of identification information or to acts as external
interface elements.
[0085] FIG. 7 provides a perspective view of a back end (i.e.
proximal side) of the device of the first embodiment.
[0086] FIG. 8 provides a perspective view of the distal end of the
device of the first embodiment.
[0087] FIG. 9 provides a perspective side view of the gear train of
the device of the first embodiment.
[0088] FIG. 10 provides an alternative perspective side view of the
gear train of the device of the first embodiment.
[0089] FIG. 11 provides a perspective side view of the upper gear
train of the device of the first embodiment along with an enclosure
that shields the lower gear train from an interior cavity of the
device wherein an upper portion of the outer housing is removed to
enable viewing of the gear train.
[0090] FIG. 12 provides a perspective cross-sectional view of the
rear portion of the device of the first embodiment with the back
shielding and a portion of the gears cut away so that the
relationship between the gears, the upper and lower gear
enclosures, and outer housing of the device can be seen.
[0091] FIG. 13 provides a close up perspective view of the proximal
gears in the drive chain and the drive coupler (that couples
rotational force with the upper and lower drive chain) of the first
embodiment.
[0092] FIG. 14 provides a close up perspective view of a distal
portion of the upper gear train and the cutting blades (which are
driven thereby) according to the first embodiment.
[0093] FIG. 15 provides a perspective view of two gears of the gear
train of the first embodiment of the invention wherein each of two
gears includes a multi-tier gear (i.e. three tiers in this example,
lower gear tear, spacing tier, and upper gear tier) having
different teeth orientations on different tiers to provide tighter
gear meshing while maintaining desired single layer minimum feature
size spacing.
[0094] FIGS. 16A and 16B provide a perspective view of a device
according to a second embodiment of the invention wherein an
alternative drive mechanism is used which includes a pulley and a
belt to provide rotational force to the gear train.
[0095] FIG. 17 provides a perspective view of a device according to
a third embodiment of the invention wherein a different alternative
drive mechanism is used which includes a fan or turbine blade which
may be spun by liquid or gas via appropriate channels, inlets, and
outlets (not shown).
[0096] FIGS. 18A and 18B provide perspective views of a device
according to a fourth embodiment of the invention and of a blade of
that device which distinguishes the device from the device of the
first embodiment wherein each blade is made from three levels of
structure (e.g. layers) wherein the blades may be considered hybrid
blades wherein the second level is shifted to place the phase of
its teeth ahead of those of the first and third levels where the
shift in phase is less than 1/2 the distance between consecutive
teeth.
[0097] FIG. 19 shows an overview of an embodiment of the invention
comprising distal spikes.
[0098] FIGS. 20A and 20B shows an overview of an embodiment of the
invention comprising cutting/piercing teeth.
[0099] FIG. 21 shows an embodiment of the invention comprising
shrouded blades.
DETAILED DESCRIPTION
[0100] Electrochemical Fabrication in General
[0101] FIGS. 1A-1G, 2A-2F, and 3A-3C illustrate various features of
one form of electrochemical fabrication. Other electrochemical
fabrication techniques are set forth in the '630 patent referenced
above, in the various previously incorporated publications, in
various other patents and patent applications incorporated herein
by reference. Still others may be derived from combinations of
various approaches described in these publications, patents, and
applications, or are otherwise known or ascertainable by those of
skill in the art from the teachings set forth herein. All of these
techniques may be combined with those of the various embodiments of
various aspects of the invention to yield enhanced embodiments.
Still other embodiments may be derived from combinations of the
various embodiments explicitly set forth herein.
[0102] FIGS. 4A-4I illustrate various stages in the formation of a
single layer of a multi-layer fabrication process where a second
metal is deposited on a first metal as well as in openings in the
first metal so that the first and second metal form part of the
layer. In FIG. 4A a side view of a substrate 82 is shown, onto
which patternable photoresist 84 is cast as shown in FIG. 4B. In
FIG. 4C, a pattern of resist is shown that results from the curing,
exposing, and developing of the resist. The patterning of the
photoresist 84 results in openings or apertures 92(a)-92(c)
extending from a surface 86 of the photoresist through the
thickness of the photoresist to surface 88 of the substrate 82. In
FIG. 4D a metal 94 (e.g. nickel) is shown as having been
electroplated into the openings 92(a)-92(c). In FIG. 4E the
photoresist has been removed (i.e. chemically stripped) from the
substrate to expose regions of the substrate 82 which are not
covered with the first metal 94. In FIG. 4F a second metal 96 (e.g.
silver) is shown as having been blanket electroplated over the
entire exposed portions of the substrate 82 (which is conductive)
and over the first metal 94 (which is also conductive). FIG. 4G
depicts the completed first layer of the structure which has
resulted from the planarization of the first and second metals down
to a height that exposes the first metal and sets a thickness for
the first layer. In FIG. 4H the result of repeating the process
steps shown in FIGS. 4B-4G several times to form a multi-layer
structure are shown where each layer consists of two materials. For
most applications, one of these materials is removed as shown in
FIG. 4I to yield a desired 3-D structure 98 (e.g. component or
device).
[0103] Various embodiments of various aspects of the invention are
directed to formation of three-dimensional structures from
materials some of which may be electrodeposited or electroless
deposited. Some of these structures may be formed form a single
build level formed from one or more deposited materials while
others are formed from a plurality of build layers each including
at least two materials (e.g. two or more layers, more preferably
five or more layers, and most preferably ten or more layers). In
some embodiments, layer thicknesses may be as small as one micron
or as large as fifty microns. In other embodiments, thinner layers
may be used while in other embodiments, thicker layers may be used.
In some embodiments structures having features positioned with
micron level precision and minimum features size on the order of
tens of microns are to be formed. In other embodiments structures
with less precise feature placement and/or larger minimum features
may be formed. In still other embodiments, higher precision and
smaller minimum feature sizes may be desirable. In the present
application meso-scale and millimeter scale have the same meaning
and refer to devices that may have one or more dimensions extending
into the 0.5-20 millimeter range, or somewhat larger and with
features positioned with precision in the 10-100 micron range and
with minimum features sizes on the order of 100 microns.
[0104] The various embodiments, alternatives, and techniques
disclosed herein may form multi-layer structures using a single
patterning technique on all layers or using different patterning
techniques on different layers. For example, various embodiments of
the invention may perform selective patterning operations using
conformable contact masks and masking operations (i.e. operations
that use masks which are contacted to but not adhered to a
substrate), proximity masks and masking operations (i.e. operations
that use masks that at least partially selectively shield a
substrate by their proximity to the substrate even if contact is
not made), non-conformable masks and masking operations (i.e. masks
and operations based on masks whose contact surfaces are not
significantly conformable), and/or adhered masks and masking
operations (masks and operations that use masks that are adhered to
a substrate onto which selective deposition or etching is to occur
as opposed to only being contacted to it). Conformable contact
masks, proximity masks, and non-conformable contact masks share the
property that they are preformed and brought to, or in proximity
to, a surface which is to be treated (i.e. the exposed portions of
the surface are to be treated). These masks can generally be
removed without damaging the mask or the surface that received
treatment to which they were contacted, or located in proximity to.
Adhered masks are generally formed on the surface to be treated
(i.e. the portion of that surface that is to be masked) and bonded
to that surface such that they cannot be separated from that
surface without being completely destroyed damaged beyond any point
of reuse. Adhered masks may be formed in a number of ways including
(1) by application of a photoresist, selective exposure of the
photoresist, and then development of the photoresist, (2) selective
transfer of pre-patterned masking material, and/or (3) direct
formation of masks from computer controlled depositions of
material.
[0105] Patterning operations may be used in selectively depositing
material and/or may be used in the selective etching of material.
Selectively etched regions may be selectively filled in or filled
in via blanket deposition, or the like, with a different desired
material. In some embodiments, the layer-by-layer build up may
involve the simultaneous formation of portions of multiple layers.
In some embodiments, depositions made in association with some
layer levels may result in depositions to regions associated with
other layer levels (i.e. regions that lie within the top and bottom
boundary levels that define a different layer's geometric
configuration). Such use of selective etching and interlaced
material deposition in association with multiple layers is
described in U.S. patent application Ser. No. 10/434,519, by
Smalley, now U.S. Pat. No. 7,252,861, and entitled "Methods of and
Apparatus for Electrochemically Fabricating Structures Via
Interlaced Layers or Via Selective Etching and Filling of Voids
layer elements" which is hereby incorporated herein by reference as
if set forth in full.
[0106] Temporary substrates on which structures may be formed may
be of the sacrificial-type (i.e. destroyed or damaged during
separation of deposited materials to the extent they can not be
reused), non-sacrificial-type (i.e. not destroyed or excessively
damaged, i.e. not damaged to the extent they may not be reused,
e.g. with a sacrificial or release layer located between the
substrate and the initial layers of a structure that is formed).
Non-sacrificial substrates may be considered reusable, with little
or no rework (e.g. replanarizing one or more selected surfaces or
applying a release layer, and the like) though they may or may not
be reused for a variety of reasons.
DEFINITIONS
[0107] This section of the specification is intended to set forth
definitions for a number of specific terms that may be useful in
describing the subject matter of the various embodiments of the
invention. It is believed that the meanings of most if not all of
these terms is clear from their general use in the specification
but they are set forth hereinafter to remove any ambiguity that may
exist. It is intended that these definitions be used in
understanding the scope and limits of any claims that use these
specific terms. As far as interpretation of the claims of this
patent disclosure are concerned, it is intended that these
definitions take presence over any contradictory definitions or
allusions found in any materials which are incorporated herein by
reference.
[0108] "Build" as used herein refers, as a verb, to the process of
building a desired structure or plurality of structures from a
plurality of applied or deposited materials which are stacked and
adhered upon application or deposition or, as a noun, to the
physical structure or structures formed from such a process.
Depending on the context in which the term is used, such physical
structures may include a desired structure embedded within a
sacrificial material or may include only desired physical
structures which may be separated from one another or may require
dicing and/or slicing to cause separation.
[0109] "Build axis" or "build orientation" is the axis or
orientation that is substantially perpendicular to substantially
planar levels of deposited or applied materials that are used in
building up a structure. The planar levels of deposited or applied
materials may be or may not be completely planar but are
substantially so in that the overall extent of their
cross-sectional dimensions are significantly greater than the
height of any individual deposit or application of material (e.g.
100, 500, 1000, 5000, or more times greater). The planar nature of
the deposited or applied materials may come about from use of a
process that leads to planar deposits or it may result from a
planarization process (e.g. a process that includes mechanical
abrasion, e.g. lapping, fly cutting, grinding, or the like) that is
used to remove material regions of excess height. Unless explicitly
noted otherwise, "vertical" as used herein refers to the build axis
or nominal build axis (if the layers are not stacking with perfect
registration) while "horizontal" refers to a direction within the
plane of the layers (i.e. the plane that is substantially
perpendicular to the build axis).
[0110] "Build layer" or "layer of structure" as used herein does
not refer to a deposit of a specific material but instead refers to
a region of a build located between a lower boundary level and an
upper boundary level which generally defines a single cross-section
of a structure being formed or structures which are being formed in
parallel. Depending on the details of the actual process used to
form the structure, build layers are generally formed on and
adhered to previously formed build layers. In some processes the
boundaries between build layers are defined by planarization
operations which result in successive build layers being formed on
substantially planar upper surfaces of previously formed build
layers. In some embodiments, the substantially planar upper surface
of the preceding build layer may be textured to improve adhesion
between the layers. In other build processes, openings may exist in
or be formed in the upper surface of a previous but only partially
formed build layers such that the openings in the previous build
layers are filled with materials deposited in association with
current build layers which will cause interlacing of build layers
and material deposits. Such interlacing is described in U.S. patent
application Ser. No. 10/434,519, now U.S. Pat. No. 7,252,861. This
referenced application is incorporated herein by reference as if
set forth in full. In most embodiments, a build layer includes at
least one primary structural material and at least one primary
sacrificial material. However, in some embodiments, two or more
primary structural materials may used without a primary sacrificial
material (e.g. when one primary structural material is a dielectric
and the other is a conductive material). In some embodiments, build
layers are distinguishable from each other by the source of the
data that is used to yield patterns of the deposits, applications,
and/or etchings of material that form the respective build layers.
For example, data descriptive of a structure to be formed which is
derived from data extracted from different vertical levels of a
data representation of the structure define different build layers
of the structure. The vertical separation of successive pairs of
such descriptive data may define the thickness of build layers
associated with the data. As used herein, at times, "build layer"
may be loosely referred simply as "layer". In many embodiments,
deposition thickness of primary structural or sacrificial materials
(i.e. the thickness of any particular material after it is
deposited) is generally greater than the layer thickness and a net
deposit thickness is set via one or more planarization processes
which may include, for example, mechanical abrasion (e.g. lapping,
fly cutting, polishing, and the like) and/or chemical etching (e.g.
using selective or non-selective etchants). The lower boundary and
upper boundary for a build layer may be set and defined in
different ways. From a design point of view they may be set based
on a desired vertical resolution of the structure (which may vary
with height). From a data manipulation point of view, the vertical
layer boundaries may be defined as the vertical levels at which
data descriptive of the structure is processed or the layer
thickness may be defined as the height separating successive levels
of cross-sectional data that dictate how the structure will be
formed. From a fabrication point of view, depending on the exact
fabrication process used, the upper and lower layer boundaries may
be defined in a variety of different ways. For example by
planarization levels or effective planarization levels (e.g.
lapping levels, fly cutting levels, chemical mechanical polishing
levels, mechanical polishing levels, vertical positions of
structural and/or sacrificial materials after relatively uniform
etch back following a mechanical or chemical mechanical
planarization process). For example, by levels at which process
steps or operations are repeated. At levels at which, at least
theoretically, lateral extends of structural material can be
changed to define new cross-sectional features of a structure.
[0111] "Layer thickness" is the height along the build axis between
a lower boundary of a build layer and an upper boundary of that
build layer.
[0112] "Planarization" is a process that tends to remove materials,
above a desired plane, in a substantially non-selective manner such
that all deposited materials are brought to a substantially common
height or desired level (e.g. within 20%, 10%, 5%, or even 1% of a
desired layer boundary level). For example, lapping removes
material in a substantially non-selective manner though some amount
of recession one material or another may occur (e.g. copper may
recess relative to nickel). Planarization may occur primarily via
mechanical means, e.g. lapping, grinding, fly cutting, milling,
sanding, abrasive polishing, frictionally induced melting, other
machining operations, or the like (i.e. mechanical planarization).
Mechanical planarization maybe followed or proceeded by thermally
induced planarization (e.g. melting) or chemically induced
planarization (e.g. etching). Planarization may occur primarily via
a chemical and/or electrical means (e.g. chemical etching,
electrochemical etching, or the like). Planarization may occur via
a simultaneous combination of mechanical and chemical etching (e.g.
chemical mechanical polishing (CMP)).
[0113] "Structural material" as used herein refers to a material
that remains part of the structure when put into use.
[0114] "Supplemental structural material" as used herein refers to
a material that forms part of the structure when the structure is
put to use but is not added as part of the build layers but instead
is added to a plurality of layers simultaneously (e.g. via one or
more coating operations that applies the material, selectively or
in a blanket fashion, to a one or more surfaces of a desired build
structure that has been released from a sacrificial material.
[0115] "Primary structural material" as used herein is a structural
material that forms part of a given build layer and which is
typically deposited or applied during the formation of that build
layer and which makes up more than 20% of the structural material
volume of the given build layer. In some embodiments, the primary
structural material may be the same on each of a plurality of build
layers or it may be different on different build layers. In some
embodiments, a given primary structural material may be formed from
two or more materials by the alloying or diffusion of two or more
materials to form a single material.
[0116] "Secondary structural material" as used herein is a
structural material that forms part of a given build layer and is
typically deposited or applied during the formation of the given
build layer but is not a primary structural material as it
individually accounts for only a small volume of the structural
material associated with the given layer. A secondary structural
material will account for less than 20% of the volume of the
structural material associated with the given layer. In some
preferred embodiments, each secondary structural material may
account for less than 10%, 5%, or even 2% of the volume of the
structural material associated with the given layer. Examples of
secondary structural materials may include seed layer materials,
adhesion layer materials, barrier layer materials (e.g. diffusion
barrier material), and the like. These secondary structural
materials are typically applied to form coatings having thicknesses
less than 2 microns, 1 micron, 0.5 microns, or even 0.2 microns).
The coatings may be applied in a conformal or directional manner
(e.g. via CVD, PVD, electroless deposition, or the like). Such
coatings may be applied in a blanket manner or in a selective
manner. Such coatings may be applied in a planar manner (e.g. over
previously planarized layers of material) as taught in U.S. patent
application Ser. No. 10/607,931. In other embodiments, such
coatings may be applied in a non-planar manner, for example, in
openings in and over a patterned masking material that has been
applied to previously planarized layers of material as taught in
U.S. patent application Ser. No. 10/841,383. These referenced
applications are incorporated herein by reference as if set forth
in full herein.
[0117] "Functional structural material" as used herein is a
structural material that would have been removed as a sacrificial
material but for its actual or effective encapsulation by other
structural materials. Effective encapsulation refers, for example,
to the inability of an etchant to attack the functional structural
material due to inaccessibility that results from a very small area
of exposure and/or due to an elongated or tortuous exposure path.
For example, large (10,000 .mu.m2) but thin (e.g. less than 0.5
microns) regions of sacrificial copper sandwiched between deposits
of nickel may define regions of functional structural material
depending on ability of a release etchant to remove the sandwiched
copper.
[0118] "Sacrificial material" is material that forms part of a
build layer but is not a structural material. Sacrificial material
on a given build layer is separated from structural material on
that build layer after formation of that build layer is completed
and more generally is removed from a plurality of layers after
completion of the formation of the plurality of layers during a
"release" process that removes the bulk of the sacrificial material
or materials. In general sacrificial material is located on a build
layer during the formation of one, two, or more subsequent build
layers and is thereafter removed in a manner that does not lead to
a planarized surface. Materials that are applied primarily for
masking purposes, i.e. to allow subsequent selective deposition or
etching of a material, e.g. photoresist that is used in forming a
build layer but does not form part of the build layer) or that
exist as part of a build for less than one or two complete build
layer formation cycles are not considered sacrificial materials as
the term is used herein but instead shall be referred as masking
materials or as temporary materials. These separation processes are
sometimes referred to as a release process and may or may not
involve the separation of structural material from a build
substrate. In many embodiments, sacrificial material within a given
build layer is not removed until all build layers making up the
three-dimensional structure have been formed. Of course sacrificial
material may be, and typically is, removed from above the upper
level of a current build layer during planarization operations
during the formation of the current build layer. Sacrificial
material is typically removed via a chemical etching operation but
in some embodiments may be removed via a melting operation or
electrochemical etching operation. In typical structures, the
removal of the sacrificial material (i.e. release of the structural
material from the sacrificial material) does not result in
planarized surfaces but instead results in surfaces that are
dictated by the boundaries of structural materials located on each
build layer. Sacrificial materials are typically distinct from
structural materials by having different properties therefrom (e.g.
chemical etchability, hardness, melting point, etc.) but in some
cases, as noted previously, what would have been a sacrificial
material may become a structural material by its actual or
effective encapsulation by other structural materials. Similarly,
structural materials may be used to form sacrificial structures
that are separated from a desired structure during a release
process via the sacrificial structures being only attached to
sacrificial material or potentially by dissolution of the
sacrificial structures themselves using a process that is
insufficient to reach structural material that is intended to form
part of a desired structure. It should be understood that in some
embodiments, small amounts of structural material may be removed,
after or during release of sacrificial material. Such small amounts
of structural material may have been inadvertently formed due to
imperfections in the fabrication process or may result from the
proper application of the process but may result in features that
are less than optimal (e.g. layers with stairs steps in regions
where smooth sloped surfaces are desired. In such cases the volume
of structural material removed is typically minuscule compared to
the amount that is retained and thus such removal is ignored when
labeling materials as sacrificial or structural. Sacrificial
materials are typically removed by a dissolution process, or the
like, that destroys the geometric configuration of the sacrificial
material as it existed on the build layers. In many embodiments,
the sacrificial material is a conductive material such as a metal.
As will be discussed hereafter, masking materials though typically
sacrificial in nature are not termed sacrificial materials herein
unless they meet the required definition of sacrificial
material.
[0119] "Supplemental sacrificial material" as used herein refers to
a material that does not form part of the structure when the
structure is put to use and is not added as part of the build
layers but instead is added to a plurality of layers simultaneously
(e.g. via one or more coating operations that applies the material,
selectively or in a blanket fashion, to a one or more surfaces of a
desired build structure that has been released from an initial
sacrificial material. This supplemental sacrificial material will
remain in place for a period of time and/or during the performance
of certain post layer formation operations, e.g. to protect the
structure that was released from a primary sacrificial material,
but will be removed prior to putting the structure to use.
[0120] "Primary sacrificial material" as used herein is a
sacrificial material that is located on a given build layer and
which is typically deposited or applied during the formation of
that build layer and which makes up more than 20% of the
sacrificial material volume of the given build layer. In some
embodiments, the primary sacrificial material may be the same on
each of a plurality of build layers or may be different on
different build layers. In some embodiments, a given primary
sacrificial material may be formed from two or more materials by
the alloying or diffusion of two or more materials to form a single
material.
[0121] "Secondary sacrificial material" as used herein is a
sacrificial material that is located on a given build layer and is
typically deposited or applied during the formation of the build
layer but is not a primary sacrificial materials as it individually
accounts for only a small volume of the sacrificial material
associated with the given layer. A secondary sacrificial material
will account for less than 20% of the volume of the sacrificial
material associated with the given layer. In some preferred
embodiments, each secondary sacrificial material may account for
less than 10%, 5%, or even 2% of the volume of the sacrificial
material associated with the given layer. Examples of secondary
structural materials may include seed layer materials, adhesion
layer materials, barrier layer materials (e.g. diffusion barrier
material), and the like. These secondary sacrificial materials are
typically applied to form coatings having thicknesses less than 2
microns, 1 micron, 0.5 microns, or even 0.2 microns). The coatings
may be applied in a conformal or directional manner (e.g. via CVD,
PVD, electroless deposition, or the like). Such coatings may be
applied in a blanket manner or in a selective manner. Such coatings
may be applied in a planar manner (e.g. over previously planarized
layers of material) as taught in U.S. patent application Ser. No.
10/607,931, now U.S. Pat. No. 7,239,219. In other embodiments, such
coatings may be applied in a non-planar manner, for example, in
openings in and over a patterned masking material that has been
applied to previously planarized layers of material as taught in
U.S. patent application Ser. No. 10/841,383, now U.S. Pat. No.
7,195,989. These referenced applications are incorporated herein by
reference as if set forth in full herein.
[0122] "Adhesion layer", "seed layer", "barrier layer", and the
like refer to coatings of material that are thin in comparison to
the layer thickness and thus generally form secondary structural
material portions or sacrificial material portions of some layers.
Such coatings may be applied uniformly over a previously formed
build layer, they may be applied over a portion of a previously
formed build layer and over patterned structural or sacrificial
material existing on a current (i.e. partially formed) build layer
so that a non-planar seed layer results, or they may be selectively
applied to only certain locations on a previously formed build
layer. In the event such coatings are non-selectively applied,
selected portions may be removed (1) prior to depositing either a
sacrificial material or structural material as part of a current
layer or (2) prior to beginning formation of the next layer or they
may remain in place through the layer build up process and then
etched away after formation of a plurality of build layers.
[0123] "Masking material" is a material that may be used as a tool
in the process of forming a build layer but does not form part of
that build layer. Masking material is typically a photopolymer or
photoresist material or other material that may be readily
patterned. Masking material is typically a dielectric. Masking
material, though typically sacrificial in nature, is not a
sacrificial material as the term is used herein. Masking material
is typically applied to a surface during the formation of a build
layer for the purpose of allowing selective deposition, etching, or
other treatment and is removed either during the process of forming
that build layer or immediately after the formation of that build
layer.
[0124] "Multilayer structures" are structures formed from multiple
build layers of deposited or applied materials.
[0125] "Multilayer three-dimensional (or 3D or 3-D) structures" are
Multilayer Structures that meet at least one of two criteria: (1)
the structural material portion of at least two layers of which one
has structural material portions that do not overlap structural
material portions of the other.
[0126] "Complex multilayer three-dimensional (or 3D or 3-D)
structures" are multilayer three-dimensional structures formed from
at least three layers where a line may be defined that
hypothetically extends vertically through at least some portion of
the build layers of the structure will extend from structural
material through sacrificial material and back through structural
material or will extend from sacrificial material through
structural material and back through sacrificial material (these
might be termed vertically complex multilayer three-dimensional
structures). Alternatively, complex multilayer three-dimensional
structures may be defined as multilayer three-dimensional
structures formed from at least two layers where a line may be
defined that hypothetically extends horizontally through at least
some portion of a build layer of the structure that will extend
from structural material through sacrificial material and back
through structural material or will extend from sacrificial
material through structural material and back through sacrificial
material (these might be termed horizontally complex multilayer
three-dimensional structures). Worded another way, in complex
multilayer three-dimensional structures, a vertically or
horizontally extending hypothetical line will extend from one or
structural material or void (when the sacrificial material is
removed) to the other of void or structural material and then back
to structural material or void as the line is traversed along at
least a portion of the line.
[0127] "Moderately complex multilayer three-dimensional (or 3D or
3-D) structures" are complex multilayer 3D structures for which the
alternating of void and structure or structure and void not only
exists along one of a vertically or horizontally extending line but
along lines extending both vertically and horizontally.
[0128] "Highly complex multilayer (or 3D or 3-D) structures" are
complex multilayer 3D structures for which the
structure-to-void-to-structure or void-to-structure-to-void
alternating occurs once along the line but occurs a plurality of
times along a definable horizontally or vertically extending
line.
[0129] "Up-facing feature" is an element dictated by the
cross-sectional data for a given build layer "n" and a next build
layer "n+1" that is to be formed from a given material that exists
on the build layer "n" but does not exist on the immediately
succeeding build layer "n+1". For convenience the term "up-facing
feature" will apply to such features regardless of the build
orientation.
[0130] "Down-facing feature" is an element dictated by the
cross-sectional data for a given build layer "n" and a preceding
build layer "n-1" that is to be formed from a given material that
exists on build layer "n" but does not exist on the immediately
preceding build layer "n-1". As with up-facing features, the term
"down-facing feature" shall apply to such features regardless of
the actual build orientation.
[0131] "Continuing region" is the portion of a given build layer
"n" that is dictated by the cross-sectional data for the given
build layer "n", a next build layer "n+1" and a preceding build
layer "n-1" that is neither up-facing nor down-facing for the build
layer "n".
[0132] "Minimum feature size" refers to a necessary or desirable
spacing between structural material elements on a given layer that
are to remain distinct in the final device configuration. If the
minimum feature size is not maintained on a given layer, the
fabrication process may result in structural material inadvertently
bridging the two structural elements due to masking material
failure or failure to appropriately fill voids with sacrificial
material during formation of the given layer such that during
formation of a subsequent layer structural material inadvertently
fills the void. More care during fabrication can lead to a
reduction in minimum feature size or a willingness to accept
greater losses in productivity can result in a decrease in the
minimum feature size. However, during fabrication for a given set
of process parameters, inspection diligence, and yield (successful
level of production) a minimum design feature size is set in one
way or another. The above described minimum feature size may more
appropriately be termed minimum feature size of sacrificial
material regions. Conversely a minimum feature size for structure
material regions (minimum width or length of structural material
elements) may be specified. Depending on the fabrication method and
order of deposition of structural material and sacrificial
material, the two types of minimum feature sizes may be different.
In practice, for example, using electrochemical fabrication methods
and described herein, the minimum features size on a given layer
may be roughly set to a value that approximates the layer thickness
used to form the layer and it may be considered the same for both
structural and sacrificial material widths and lengths. In some
more rigorously implemented processes, examination regiments, and
rework requirements, it may be set to an amount that is 80%, 50%,
or even 30% of the layer thickness. Other values or methods of
setting minimum feature sizes may be set.
[0133] "Sublayer" as used herein refers to a portion of a build
layer that typically includes the full lateral extents of that
build layer but only a portion of its height. A sublayer is usually
a vertical portion of build layer that undergoes independent
processing compared to another sublayer of that build layer.
[0134] A Shredding Device According to First-Fourth Embodiments of
the Invention
[0135] FIGS. 5-15 provide various perspective views of a basic
configuration of the device, tool, or instrument according to a
first embodiment. The instrument 100 includes a housing 101, a
plurality of blade stacks 102 and 104, each including a plurality
of blades 102-A-102-C and 104-A-104-C, respectively, and two gear
trains 131 and 141, including gears 131-A-131-D and 141-A-141-D,
respectively (visible in FIG. 9). The gear trains are preferably
covered by external housing 101 and internal enclosures 121 and 123
(e.g. as shown in FIG. 12. Gear trains 131 and 141 are used to
transfer drive force to blade stacks 102 and 104 respectively. The
proximal end of the gear trains 131 and 141 includes a drive shaft
coupler 105 to allow actuation of the gear train 131 via upper
drive gear 131-A and actuation of gear train 141 via lower drive
gear 141-A, via a rotational force applied to the coupler via a
rotating drive shaft (not shown). The instrument of this embodiment
would be combined with other elements, such as motors, vacuum
sources, irrigation sources, push tubes, pull wires, lumens, guide
wires, and other navigation, control or visualization elements to
provide complete instrument solution for performing medical
procedures or other desired actions.
[0136] According to some embodiments of the invention the drive
shaft may be powered by an electric motor located in proximity to
the device, an electric motor located at the end of a flexible
shaft drive wherein the motor is remote from the device (e.g.
outside the body when the device is used at the end a catheter or
other delivery lumen in a minimally invasive procedure. In other
embodiments, e.g. the second embodiment, the device may be powered
by a pulley and belt as shown in the FIGS. 16A and 16B. In an
alternative to the second embodiment the device may be powered by a
sprocket and chain (not shown). In still other embodiments, e.g.
the third embodiment, the device may be powered via flow of a
pneumatic fluid or a hydraulic fluid via one or more inlets,
channels and outlets past an impeller as shown in FIG. 17. In some
variations of the first-third embodiments, the impeller or drive
shaft may be coupled to the coupler or gear trains via a plurality
of additional gears or other elements that provide gear reduction
to increase torque or to provide increased speed. In some
embodiments, the drive shaft, not shown, may be furnished with a
square distal end to engage the coupler, causing it to turn with
the shaft. In some embodiments, the drive shaft may be surrounded
by a sheath which may be affixed to the housing of the
instrument.
[0137] In some alternative embodiments the drive shaft may extend a
significant distant from the drive shaft coupler (e.g.
perpendicular to the plane of the upper or lower faces of the
housing, i.e. in the Z-direction or vertical direction relative to
the planes of the layers (e.g. horizontal planes) used in forming
the device via multi-layer, multi-material electrochemical
fabrication methods. In other alternative embodiments the drive
shaft may be coupled to a secondary shaft or flexible lead which
extends in a direction parallel to the planes of the faces of the
housing (e.g. proximally along the longitudinal axis of the device
or radially relative to the longitudinal axis of the device).
[0138] FIGS. 5-6 provide general views showing opposite primary
housing surfaces (e.g., top and bottom) of the instrument. In the
proximal view of FIG. 7, the tissue storage chamber 103 is clearly
visible. In the distal view of FIG. 8, the interdigitated blades of
the instrument are clearly visible along with some star-stepping
108 and 109 of the left upper and right lower portions of the
housing to minimize the height profile of the device.
[0139] In the various embodiments of the invention, the cutting
blades serve one or more purposes including, for example, tissue
cutting, tissue tearing and tissue entrainment. Tissue entrainment
may be provided to capture the tissue and convey it into a tissue
storage chamber 103 within the body of the instrument or to an
external storage chamber that may be accessed through the body of
the instrument via a vacuum line or other extraction mechanism
(e.g. Archimedes screw or other mechanical conveyor). In some
embodiments, the blades are configured to optimize one or more of
the above functions. In some embodiments, the blades may be
configured to address the characteristics of a particular tissue
type. The blades in each stack, as shown in FIG. 9 have their teeth
staggered relative to neighboring blades by a fractional amount of
the angular spacing of the successive teeth. For example the
stagger between the teeth of blade 104-C and 104-B is 124(A-B)
while that between 104-B and 104-A is 124(B-C). Though shown as a
length portion of the blade circumference it could alternatively be
expressed as an angular portion.
[0140] In some embodiments the blade tips, gear pins and other high
wear surfaces may be formed from a wear resistant material while
other portions of the device may be formed from another material
that is more suited to the functionality of the device as a whole
(e.g. a more resilient or less brittle material).
[0141] FIGS. 9-10 provide perspective views of the entire gear
trains 131 and 141 such that their relationship may be understood.
The gear trains serve at least two functions. A first function is
to allow the drive shaft to be at a distance from the blades such
that the instrument can plunge into the tissue in an unobstructed
manner. A second function of the gear trains is to produce the
opposing motion of the two blade stacks 102 and 104 such that they
may be turned towards one another (i.e. centrally inward) when
grinding and away from one another (i.e. centrally outward) if a
jam should occur. During normal operation stack 102 turns
counterclockwise and stack 104 turns clockwise as shown in FIG. 9,
to create an inward-directed flow of tissue. In some variations of
this embodiment, the blade stacks may be made to rotate at
different rates to provide enhanced longitudinal shredding of
tissue.
[0142] In FIGS. 9-10 the instrument or device housing 101 has been
hidden from view. In the figures, it can be seen that the drive
shaft coupler engages upper and lower sets of gears 131-A and
141-A. The upper set, including gears 131-A to 131-D which
ultimately drive blade stack 102, while the lower set, including
gears 141-A to 141-E ultimately driving blade stack 104. In FIG. 9,
the drive shaft coupler is shown as being driven clockwise via
arrow 171 which causes the stack of blades 102 driven by the upper
gears 131 to be driven counterclockwise as shown by arrow 130.
Meanwhile, the same rotation of the coupler 105 causes the stack of
blades 104 driven by the lower gears 141 to be driven clockwise as
shown by arrow 140. There are two gears in the upper set--not
including gears that are attached to the coupler or the blade
stacks--but three gears in the lower set. The extra gear in the
lower set reverses the direction of rotation of one set of stacked
blades with respect to the other. In alternative embodiments a all
or a portion of the gears of the upper and/or lower sets may be
replaced by chain or other flexible coupling elements and gears by
sprockets or the like.
[0143] FIG. 11 shows the upper gear train 131, with gear 131-B
labeled, but shows the lower gear train as being located below its
shield or enclosure 121. This shielding serves to minimize exposure
of the gear train to tissue and other contaminants which might
impede operation of the gears. Similarly, the upper set of gears is
also shielded within an enclosure 123 (see FIG. 12) which forms
part of the housing. The tissue storage chamber is located between
the two sets of gears and their enclosures. The shafts on which the
gears, coupler, and blades turn are preferably integral with the
housing. FIG. 12 also illustrates the section of gear 141-C exposes
shaft 142-C around which gear 141-C rotates via a circular gaps
(e.g. having an intralayer radial width greater than the minimum
feature size). Also FIG. 12 illustrates that when gears 131B and
141C are in their as formed positions, they have etching holes
112-B and 114-B, respectively, that are aligned with etching holes
112-A and 114-A in housing 101 that allow more direct entry of
etchant into the gear movement cavities defined by covers 122 and
121 in conjunction with housing 101 so that post-layer formation
etching of sacrificial material can more readily occur from these
cavities. In some embodiments partial alignment would be better
than no alignment and offset of etching holes by no more than 2 mm
or even 5 mm would be beneficial as compared to offsets which are
significantly greater. FIG. 12 also shows a portion of blade shaft
103 around which blade stack 104 rotates. FIG. 12 along with FIG. 5
also shows interdigitated fingers 107 which are located between
successive blade levels to inhibit the outflow of tissue drawing
into cavity 103 as the blades tips rotate out of and then back into
the housing. Such fingers, vacuum (i.e. suction applied to the
proximal end of the working end), irrigation directed onto the
blades within the housing (e.g. vertically downward or downward and
proximally), or a combination of two or more of these elements may
be useful in removing tissue from the blade and inhibiting its
distal exit from the working end back into working area within the
body of a patient. In some embodiments, it is desired to define a
shearing thickness as the gap between elements has they move past
one another. Such gaps may be defined by layer thickness
increments, or multiple such increments, or by the intralayer
spacing of elements as they move past one another. In some
embodiments, shearing thickness of blades passing blades or blades
moving past interdigitated fingers, or the like may be optimally
set in the range of 2-100 microns or some other amount depending on
the viscosity or other parameters of the materials being encounter
and what the interaction is to be (e.g. tearing, shredding,
transporting, or the like). For example for shredding or tearing
the gap may be in the range of 2-10 microns and more preferably in
the range of 4-6 microns.
[0144] The gears (most clearly from FIGS. 13-15) in the gear trains
(131-B to 131C and 141-B to 141-D) as well as those attached to the
coupler and the blades (131-A, 141-A, 131-D, and 141-E) have teeth
on multiple tiers. This design enables fabrication of
tightly-meshed gears while providing a minimum gap between elements
on a single layer. In some embodiments, each tier is formed from a
single multi-material layer while in other embodiments each tier is
formed from multiple layers. In some embodiments, more than three
tiers may be provided. In some embodiments, the relative thickness
of teeth in each tier may vary. In the embodiment shown in the
figures, each of the first and third tiers has half the number of
teeth of the entire gear. When driven in one direction (e.g., as
shown in FIG. 15), the gear still meshes properly and behaves as an
involute spur gear. In operation, a tooth on tier 1 of the driving
gear engages a tooth on tier 1 of the driven gear. This alternates,
as the gears turn, with a tooth on tier 3 of the driving gear
engaging a tooth on tier 3 of the driven gear. In some embodiments,
the design of the teeth allows two teeth (one on tier 1 and one on
tier 3) on the driving gear to always remain in contact with two
teeth (one on tier 1 and one on tier 3) on the driven gear.
As-fabricated, the gears are rotated such that distance between
teeth is maximized, as in FIGS. 9-10. See FIG. 3. It is possible to
drive the gear train in both directions; however, there is
considerable backlash due to the distance between teeth on any
given tier. In some embodiments, additional tiers may be added so
that gear interfaces do not occur on only two levels but occur on
three or more levels.
[0145] In forming the device of the first embodiment not only is it
necessary to maintain horizontal spacing and dimensions of
components above the minimum feature size, it is important that
vertical gaps be formed between various components that overlap in
XY space (assuming layers are being stacked along the Z axis) so
that they do not inadvertently bond together and also ensure that
adequate pathways are provided to allow etching solution to access
and remove sacrificial material. In particular, it is important
that gaps between the lower tier and upper tier gear exist so that
upper and lower tiers of adjacent gears do not bond together. It is
also important to place vertical gaps (e.g. via thin layers, e.g.
2-8 .mu.m each) between moving components and the housing and
enclosure elements.
[0146] In some embodiments where additional tiers are provided, it
may be possible to remove one or more of the immediate tiers (i.e.
those that do not have gear teeth) as it may be possible to form
gear teeth on multiple levels without any two consecutive levels
having teeth that overlap in the XY plane in the as formed
position.
[0147] FIGS. 16A and 16B a tool 200 of an alternative embodiment is
depicted including a housing 200, blades 202-C and 204-C in
separated blade stacks and a pulley 271 which may be powered by a
belt 272 to drive the gear train.
[0148] FIG. 17 depicts an tool 300 of an alternative embodiment
including a housing 300, blades 302-C and 304-C in separated blade
stacks and an alternative drive mechanism in the form of fan blade
271 coupled to the gear chain (which may be spun by liquid or gas
via appropriate inlet and outlet channels and paths.
[0149] In some alternative embodiments, it is possible to form
portions of the device of the first embodiment separately and then
assemble them but it is preferred to form the device as a whole in
a fully assembled state. In some embodiments to improve etching of
sacrificial material from components that move relative to each
other they may be formed with fully or partially overlapping
etching holes so that improved flow paths are created for removing
sacrificial material.
[0150] In some embodiments the device of the first embodiment may
formed with a length of about 4 mm, a width of about 2.5 mm and a
height of about 0.75 to 1.0 mm. In other embodiments the height may
be increased to several millimeters or decreased further, the
length and width may be increased many times (3-5 to even 10 times)
or even decreased.
[0151] In some embodiments gap layers (i.e. intermediate tiers) may
be as little as 2 microns or as much as 10 microns with 4-6 microns
being generally preferred while non-gap layers may be as large as
20-50 micron or more.
[0152] In using the device of the first embodiment, numerous
alternative configurations and processes are possible, for example,
the device may be combined in various ways with one or more push
tubes, it may be feed down a lumen, it may be feed out the end of a
lumen to a working area, it may be used in combination with
expanders and/or distal protection devices, it may be used with
only axial movement occurring during shredding, it may undergo
rotational motion during shredding, it may undergo radial motion
during shredding, it may be used in combination with forceps or
claws to pull or push tissue toward the blades.
[0153] The drive mechanism may use universal joints, crown gears,
or bevel gears coupled to drive gears and oriented so the drive
train axis may be rotated to become parallel to the longitudinal
axis of the device, or to otherwise lie perpendicular to the height
of the device. Additional gears may be formed in the same
orientation as those in the first embodiment and then rotated on
bendable supports or pivotable supports to take on a desired
orientation. In some embodiments the device may be part of a larger
tool or instrument which includes a delivery mechanism and/or a
lumen through which power can be transferred and/or which may
include lumens for delivering irrigation fluid and or suction to
remove entrained material or tissue that has been brought into the
device.
[0154] In some uses of the device, the storage cavity may remain
open while in other embodiments it may be closed while in still
other embodiments it may pass items smaller than a given size (e.g.
via a filter or the like). After removal of the device from a
working area, the device may be emptied of collected tissue via a
door or other release mechanism.
[0155] In some embodiments, etching holes may be sealed after
release of sacrificial material. In some embodiments, blades may be
tapered to drive material toward the central blade of a gear
stack.
[0156] In some embodiments a fluid inlet and exit ports may exist
for flushing out material which entered the device during
operation.
[0157] In some embodiments, blade stacks may rotate at different
rates or blades within a single stack may rotate at different
rates.
[0158] FIGS. 18-21 depict a number of additional embodiments in
which single modifications have been made to the basic
configuration shown in FIG. 5. In some further embodiments,
combinations of these and related modifications would be used.
[0159] In some embodiments, as in the device, tool, or instrument
400 of FIGS. 18A and 18B, including housing 401 and blades 404, the
instrument comprises `hybrid` blades with teeth that are capable of
both piercing and cutting into tissue to entrain it. The outer
portions of the teeth or more simply the outer teeth 404-1 and
404-2 are intended to cut the tissue, while the inner or middle
portion 404-2 are intended to entrain the cut tissue and convey it
into the instrument. In some embodiments, the outer portions 404-1
and 404-2 are thinner (e.g., formed from a single thin layer in a
multi-material, multi-layer electrochemical fabrication process)
and the inner portion 404-2 is thicker (e.g., formed from one or
more thicker layers). In some alternative embodiments the blade may
have a non-symmetric shape based on the intended directions of
motion and use.
[0160] In some embodiments, as in the device, tool, or instrument
500 of FIG. 19, the instrument may include at least one spike (e.g.
one of spikes 584-A, 584-B, 582-A, and 582-B) to stabilize its
position during use. The spikes pierce the tissue prior to the
blades engaging the tissue, resisting any tendency of the
instrument to be pushed, e.g. by the interaction of the blades with
the tissue, in a direction different from that desired (e.g.,
directly into the tissue).
[0161] In some embodiments, as in the device, tool, or instrument
600 of FIGS. 20A and 20B having a housing 601 and blades 604 with
teeth 591 that have a sharpened point. In some embodiments as
shown, the point alternates from one surface of the blade to the
other (i.e. on the back side or plane of the blade teeth designated
by 591-A having edge points 604-3 and on the front side or plane of
the blade teeth designated 591-B and having edge points 604-1. In
some embodiments, the alternation period is one tooth, while in
other embodiments, it is more than one tooth or is even aperiodic.
Blades with such points may be advantageous in cutting into or
piercing tissue that would otherwise resist cutting, although their
ability to entrain tissue may be inferior to blades with flat teeth
such as those of FIG. 5. In FIGS. 20A and 20B, the teeth are shown
with stair steps as they would normally be if fabricated using a
multi-layer multi-material electrochemical fabrication process.
However, in some embodiments, the edge of the teeth does not have
such stair steps.
[0162] In some embodiments, such as that of the device, tool, or
instrument 700 as shown in FIG. 21, the instrument includes shrouds
701-E on the sides of the housing 701. These serve at least two
purposes. A primary purpose is to minimize the release of tissue or
other material (i.e. out flow of tissue or other material that has
been brought into the housing of the tool) from the side of the
blades, since release during a surgical procedure is in many cases
undesirable. A secondary purpose is to limit the tissue that is
processed by the instrument to the region directly in front of the
instrument. The tissue to the side of the instrument is pushed
aside rather than interacting with the blades (i.e. being cut or
shredded by the blades, being pulled into the housing, and/or being
otherwise disrupted by the blades).
[0163] In some embodiments of the instrument, holes, textures,
grooves, or other features are added to the rotating elements or
the shafts on which they rotate, or to the surfaces surrounding the
rotating elements. Such features may serve to create aerodynamic or
hydrodynamic bearing surfaces that reduce friction during rotation
of the elements.
FURTHER COMMENTS AND CONCLUSIONS
[0164] Structural or sacrificial dielectric materials may be
incorporated into embodiments of the present invention in a variety
of different ways. Such materials may form a third material or
higher deposited on selected layers or may form one of the first
two materials deposited on some layers. Additional teachings
concerning the formation of structures on dielectric substrates
and/or the formation of structures that incorporate dielectric
materials into the formation process and possibility into the final
structures as formed are set forth in a number of patent
applications filed Dec. 31, 2003. The first of these filings is
U.S. Patent Application No. 60/534,184 which is entitled
"Electrochemical Fabrication Methods Incorporating Dielectric
Materials and/or Using Dielectric Substrates". The second of these
filings is U.S. Patent Application No. 60/533,932, which is
entitled "Electrochemical Fabrication Methods Using Dielectric
Substrates". The third of these filings is U.S. Patent Application
No. 60/534,157, which is entitled "Electrochemical Fabrication
Methods Incorporating Dielectric Materials". The fourth of these
filings is U.S. Patent Application No. 60/533,891, which is
entitled "Methods for Electrochemically Fabricating Structures
Incorporating Dielectric Sheets and/or Seed layers That Are
Partially Removed Via Planarization". A fifth such filing is U.S.
Patent Application No. 60/533,895, which is entitled
"Electrochemical Fabrication Method for Producing Multi-layer
Three-Dimensional Structures on a Porous Dielectric". Additional
patent filings that provide teachings concerning incorporation of
dielectrics into the EFAB process include U.S. patent application
Ser. No. 11/139,262, filed May 26, 2005 by Lockard, et al., and
which is entitled "Methods for Electrochemically Fabricating
Structures Using Adhered Masks, Incorporating Dielectric Sheets,
and/or Seed Layers that are Partially Removed Via Planarization";
and U.S. patent application Ser. No. 11/029,216, filed Jan. 3, 2005
by Cohen, et al., now abandoned, and which is entitled
"Electrochemical Fabrication Methods Incorporating Dielectric
Materials and/or Using Dielectric Substrates". These patent filings
are each hereby incorporated herein by reference as if set forth in
full herein.
[0165] Some embodiments may employ diffusion bonding or the like to
enhance adhesion between successive layers of material. Various
teachings concerning the use of diffusion bonding in
electrochemical fabrication processes are set forth in U.S. patent
application Ser. No. 10/841,384 which was filed May 7, 2004 by
Cohen et al. which is entitled "Method of Electrochemically
Fabricating Multilayer Structures Having Improved Interlayer
Adhesion" and which is hereby incorporated herein by reference as
if set forth in full. This application is hereby incorporated
herein by reference as if set forth in full.
[0166] Some embodiments may incorporate elements taught in
conjunction with other medical devices as set forth in various U.S.
patent applications filed by the owner of the present application
and/or may benefit from combined use with these other medical
devices: Some of these alternative devices have been described in
the following previously filed patent applications: (1) U.S. patent
application Ser. No. 11/478,934, by Cohen et al., and entitled
"Electrochemical Fabrication Processes Incorporating Non-Platable
Materials and/or Metals that are Difficult to Plate On"; (2) U.S.
patent application Ser. No. 11/582,049, by Cohen, and entitled
"Discrete or Continuous Tissue Capture Device and Method for
Making"; (3) U.S. patent application Ser. No. 11/625,807, by Cohen,
and entitled "Microdevices for Tissue Approximation and Retention,
Methods for Using, and Methods for Making"; (4) U.S. patent
application Ser. No. 11/696,722, by Cohen, and entitled "Biopsy
Devices, Methods for Using, and Methods for Making"; (5) U.S.
patent application Ser. No. 11/734,273, by Cohen, and entitled
"Thrombectomy Devices and Methods for Making"; (6) U.S. Patent
Application No. 60/942,200, by Cohen, and entitled "Micro-Umbrella
Devices for Use in Medical Applications and Methods for Making Such
Devices"; and (7) U.S. patent application Ser. No. 11/444,999, by
Cohen, and entitled "Microtools and Methods for Fabricating Such
Tools". Each of these applications is incorporated herein by
reference as if set forth in full herein.
[0167] Though the embodiments explicitly set forth herein have
considered multi-material layers to be formed one after another. In
some embodiments, it is possible to form structures on a
layer-by-layer basis but to deviate from a strict planar layer on
planar layer build up process in favor of a process that interlaces
material between the layers. Such alternative build processes are
disclosed in U.S. application Ser. No. 10/434,519, filed on May 7,
2003, entitled Methods of and Apparatus for Electrochemically
Fabricating Structures Via Interlaced Layers or Via Selective
Etching and Filling of Voids, now abandoned. The techniques
disclosed in this referenced application may be combined with the
techniques and alternatives set forth explicitly herein to derive
additional alternative embodiments. In particular, the structural
features are still defined on a planar-layer-by-planar-layer basis
but material associated with some layers are formed along with
material for other layers such that interlacing of deposited
material occurs. Such interlacing may lead to reduced structural
distortion during formation or improved interlayer adhesion. This
patent application is herein incorporated by reference as if set
forth in full.
[0168] The patent applications and patents set forth below are
hereby incorporated by reference herein as if set forth in full.
The teachings in these incorporated applications can be combined
with the teachings of the instant application in many ways: For
example, enhanced methods of producing structures may be derived
from some combinations of teachings, enhanced structures may be
obtainable, enhanced apparatus may be derived, and the like.
TABLE-US-00001 US Pat App No, Filing Date US App Pub No, Pub Date
US Patent No, Issue Date Inventor, Title 09/493,496 - Jan. 28, 2000
Cohen, "Method For Electrochemical Fabrication" -- PAT 6,790,377 -
Sep. 14, 2004 10/677,556 - Oct. 1, 2003 Cohen, "Monolithic
Structures Including Alignment 2004-0134772 - Jul. 15, 2004 and/or
Retention Fixtures for Accepting Components" 10/830,262 - Apr. 21,
2004 Cohen, "Methods of Reducing Interlayer 2004-0251142A - Dec.
16, 2004 Discontinuities in Electrochemically Fabricated Three- PAT
7,198,704 - Apr. 3, 2007 Dimensional Structures" 10/271,574 - Oct.
15, 2002 Cohen, "Methods of and Apparatus for Making High
2003-0127336A - Jul. 10, 2003 Aspect Ratio Microelectromechanical
Structures" PAT 7,288,178 - Oct. 30, 2007 10/697,597 - Dec. 20,
2002 Lockard, "EFAB Methods and Apparatus Including 2004-0146650A -
Jul. 29, 2004 Spray Metal or Powder Coating Processes" 10/677,498 -
Oct. 1, 2003 Cohen, "Multi-cell Masks and Methods and Apparatus
2004-0134788 - Jul. 15, 2004 for Using Such Masks To Form
Three-Dimensional PAT 7,235,166 - Jun. 26, 2007 Structures"
10/724,513 - Nov. 26, 2003 Cohen, "Non-Conformable Masks and
Methods and 2004-0147124 - Jul. 29, 2004 Apparatus for Forming
Three-Dimensional Structures" PAT 7,368,044 - May 6, 2008
10/607,931 - Jun. 27, 2003 Brown, "Miniature RF and Microwave
Components 2004-0140862 - Jul. 22, 2004 and Methods for Fabricating
Such Components" PAT 7,239,219 - Jul. 3, 2007 10/841,100 - May 7,
2004 Cohen, "Electrochemical Fabrication Methods 2005-0032362 -
Feb. 10, 2005 Including Use of Surface Treatments to Reduce PAT
7,109,118 - Sep. 19, 2006 Overplating and/or Planarization During
Formation of Multi-layer Three-Dimensional Structures" 10/387,958 -
Mar. 13, 2003 Cohen, "Electrochemical Fabrication Method and
2003-022168A - Dec. 4, 2003 Application for Producing
Three-Dimensional Structures Having Improved Surface Finish"
10/434,494 - May 7, 2003 Zhang, "Methods and Apparatus for
Monitoring 2004-0000489A - Jan. 1, 2004 Deposition Quality During
Conformable Contact Mask Plating Operations" 10/434,289 - May 7,
2003 Zhang, "Conformable Contact Masking Methods and 2004-0065555A
- Apr. 8, 2004 Apparatus Utilizing In Situ Cathodic Activation of a
Substrate" 10/434,294 - May 7, 2003 Zhang, "Electrochemical
Fabrication Methods With 2004-0065550A - Apr. 8, 2004 Enhanced Post
Deposition Processing" 10/434,295 - May 7, 2003 Cohen, "Method of
and Apparatus for Forming Three- 2004-0004001A - Jan. 8, 2004
Dimensional Structures Integral With Semiconductor Based Circuitry"
10/434,315 - May 7, 2003 Bang, "Methods of and Apparatus for
Molding 2003-0234179 A - Dec. 25, 2003 Structures Using Sacrificial
Metal Patterns" PAT 7,229,542 - Jun. 12, 2007 10/434,103 - May 7,
2004 Cohen, "Electrochemically Fabricated Hermetically
2004-0020782A - Feb. 5, 2004 Sealed Microstructures and Methods of
and Apparatus PAT 7,160,429 - Jan. 9, 2007 for Producing Such
Structures" 10/841,006 - May 7, 2004 Thompson, "Electrochemically
Fabricated Structures 2005-0067292 - May 31, 2005 Having Dielectric
or Active Bases and Methods of and Apparatus for Producing Such
Structures" 10/434,519 - May 7, 2003 Smalley, "Methods of and
Apparatus for 2004-0007470A - Jan. 15, 2004 Electrochemically
Fabricating Structures Via Interlaced PAT 7,252,861 - Aug. 7, 2007
Layers or Via Selective Etching and Filling of Voids" 10/724,515 -
Nov. 26, 2003 Cohen, "Method for Electrochemically Forming
2004-0182716 - Sep. 23, 2004 Structures Including Non-Parallel
Mating of Contact PAT 7,291,254 - Nov. 6, 2007 Masks and
Substrates" 10/841,347 - May 7, 2004 Cohen, "Multi-step Release
Method for 2005-0072681 - Apr. 7, 2005 Electrochemically Fabricated
Structures" 60/533,947 - Dec. 31, 2003 Kumar, "Probe Arrays and
Method for Making" 60/534,183 - Dec. 31, 2003 Cohen, "Method and
Apparatus for Maintaining Parallelism of Layers and/or Achieving
Desired Thicknesses of Layers During the Electrochemical
Fabrication of Structures" 11/733,195 - Apr. 9, 2007 Kumar,
"Methods of Forming Three-Dimensional 2008-0050524 - Feb. 28, 2008
Structures Having Reduced Stress and/or Curvature" 11/506,586 -
Aug. 8, 2006 Cohen, "Mesoscale and Microscale Device Fabrication
2007-0039828 - Feb. 22, 2007 Methods Using Split Structures and
Alignment Elements" 10/949,744 - Sep. 24, 2004 Lockard,
"Three-Dimensional Structures Having 2005-0126916 - Jun. 16, 2005
Feature Sizes Smaller Than a Minimum Feature Size PAT 7,498,714 -
Mar. 3, 2009 and Methods for Fabricating"
[0169] Though various portions of this specification have been
provided with headers, it is not intended that the headers be used
to limit the application of teachings found in one portion of the
specification from applying to other portions of the specification.
For example, it should be understood that alternatives acknowledged
in association with one embodiment, are intended to apply to all
embodiments to the extent that the features of the different
embodiments make such application functional and do not otherwise
contradict or remove all benefits of the adopted embodiment.
Various other embodiments of the present invention exist. Some of
these embodiments may be based on a combination of the teachings
herein with various teachings incorporated herein by reference.
[0170] In view of the teachings herein, many further embodiments,
alternatives in design and uses of the embodiments of the instant
invention will be apparent to those of skill in the art. As such,
it is not intended that the invention be limited to the particular
illustrative embodiments, alternatives, and uses described above
but instead that it be solely limited by the claims presented
hereafter.
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