U.S. patent application number 13/822275 was filed with the patent office on 2013-08-29 for "cmp pad conditioner and method for manufacturing the same".
This patent application is currently assigned to SHINHAN DIAMOND IND. CO., LTD.. The applicant listed for this patent is Shin Kyung Kim, Young Hwan Kim, Hyun Woo Lee, Mun Seak Park, Jun Ho Song. Invention is credited to Shin Kyung Kim, Young Hwan Kim, Hyun Woo Lee, Mun Seak Park, Jun Ho Song.
Application Number | 20130225052 13/822275 |
Document ID | / |
Family ID | 45811034 |
Filed Date | 2013-08-29 |
United States Patent
Application |
20130225052 |
Kind Code |
A1 |
Song; Jun Ho ; et
al. |
August 29, 2013 |
"CMP PAD CONDITIONER AND METHOD FOR MANUFACTURING THE SAME"
Abstract
Provided is a chemical mechanical polishing pad conditioner
including a substrate including a plurality of protrusions formed
on at least one surface thereof and made of ceramic or hard metal
alloy. The plurality of protrusions may be formed through laser
processing so as not to have angled edges on an upper end and an
inclined side thereof. The chemical mechanical polishing pad
conditioner further includes a diamond thin film deposited so as to
cover the plurality of protrusions, wherein the diamond thin film
includes a rough polishing surface on which micro protrusions
having a size of several .mu.m are formed.
Inventors: |
Song; Jun Ho; (Incheon,
KR) ; Park; Mun Seak; (Incheon, KR) ; Kim;
Shin Kyung; (Seoul, KR) ; Kim; Young Hwan;
(Incheon, KR) ; Lee; Hyun Woo; (Incheon,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Song; Jun Ho
Park; Mun Seak
Kim; Shin Kyung
Kim; Young Hwan
Lee; Hyun Woo |
Incheon
Incheon
Seoul
Incheon
Incheon |
|
KR
KR
KR
KR
KR |
|
|
Assignee: |
SHINHAN DIAMOND IND. CO.,
LTD.
Incheon
KR
|
Family ID: |
45811034 |
Appl. No.: |
13/822275 |
Filed: |
August 11, 2011 |
PCT Filed: |
August 11, 2011 |
PCT NO: |
PCT/KR2011/005871 |
371 Date: |
May 15, 2013 |
Current U.S.
Class: |
451/443 ;
427/555; 427/556 |
Current CPC
Class: |
B24B 53/017
20130101 |
Class at
Publication: |
451/443 ;
427/555; 427/556 |
International
Class: |
B24B 53/017 20060101
B24B053/017 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 10, 2010 |
KR |
10-2010-0088752 |
Claims
1-19. (canceled)
20. A chemical mechanical polishing pad conditioner comprising: a
substrate including a plurality of protrusions formed on at least
one surface thereof and made of ceramic or hard metal alloy, the
plurality of protrusions being formed through laser processing so
as not to have angled edges on an upper end and an inclined side
thereof; and a diamond thin film deposited so as to cover the
plurality of protrusions, wherein the diamond thin film includes a
rough polishing surface on which micro protrusions having a size of
several .mu.m are formed, wherein the diamond thin film is formed
through chemical vapor deposition, and wherein the substrate is
made of ceramic containing Si.sub.3N.sub.4.
21. The chemical mechanical polishing pad conditioner of claim 20,
wherein each of the protrusions has a mountain shape in which an
upper end thereof has an area smaller than that of a lower end
thereof, and the upper end has an area of 100 .mu.m.sup.2 or less,
and wherein each of the protrusions has an angle of 100 degrees or
more between a tangent line of the upper end thereof and a tangent
line of the side thereof.
22. The chemical mechanical polishing pad conditioner of claim 20,
wherein the plurality of protrusions have a height difference of 20
.mu.m or less, and wherein two or more kinds of protrusions having
different heights and sizes are regularly formed.
23. The chemical mechanical polishing pad conditioner of claim 20,
wherein a concave-convex pattern in which ridges and valleys are
repeated is formed in the vicinity of each of the protrusions.
24. The chemical mechanical polishing pad conditioner of claim 20,
wherein the protrusions are grouped into a plurality of groups, and
each of the plurality of groups is spaced apart from each other
while including at least two protrusions.
25. A method for manufacturing a chemical mechanical polishing pad
conditioner, the method comprising: (a) forming a plurality of
protrusions on a surface of a substrate made of ceramic or hard
metal alloy; and (b) depositing a diamond thin film so as to cover
the plurality of protrusions, wherein in step (a), the protrusions
are formed through laser processing so as not to have angled edges
on an upper end and a side thereof.
26. The method of claim 25, wherein in step (a), a concave-convex
pattern is formed in the vicinity of the protrusion by irradiating
a laser beam on the surface of the substrate in an overlapped
scheme.
27. The method of claim 25, wherein in step (a), the protrusions
are formed so that an upper end of each of the protrusions has an
area of 100 .mu.m or less, and wherein in step (a), the protrusions
are formed so that each of the protrusions has an angle of 100
degrees or more between a tangent line of the upper end thereof and
a tangent line of the side thereof.
28. The method of claim 25, wherein in step (b), the diamond thin
film having micro protrusions is deposited on the surface of the
substrate through chemical vapor deposition.
29. The method of claim 25, further comprising machining the
protrusions in order to separate the protrusions before or after
the laser processing in step (a).
30. The method of claim 25, wherein the laser processing is
performed using a CO.sub.2 gas laser beam, an Nd solid laser beam,
or a fiber laser beam.
31. The method of claim 28, wherein in step (b), a hot filament
chemical vapor deposition method is used.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to a chemical mechanical
polishing (CMP) pad conditioner and a method for manufacturing the
same, and more particularly, to a chemical mechanical polishing
(CMP) pad conditioner manufactured by forming protrusions having a
size of several ten to several hundred .mu.m on a surface of a
substrate through laser processing and a diamond thin films
including micro protrusions having a size of several .mu.m on the
protrusions, and a method for manufacturing the same.
[0003] 2. Description of the Related Art
[0004] A chemical mechanical polishing (CMP) process is used to
polish a surface of a specific workpiece in various industries.
Particularly, the CMP process has been mainly used to polish
ceramic, silicon, glass, quartz, metal, and/or a wafer thereof in a
manufacturing field such as a semiconductor device, a micro
electronic device, a computer product, or the like. In the CMP
process, a CMP pad rotating while facing the workpiece such as a
wafer, or the like, is used. In addition, during the CMP process, a
polishing particle and a liquid slurry containing a chemical
material are added to the CMP pad.
[0005] In a manufacturing field of a semiconductor device, yield
and productivity of the semiconductor device is deteriorated due to
a scratch or a defect generated on a wafer during the CMP process.
Particularly, in the CMP process in which a wafer having a
relatively large diameter is planarized using a CMP pad having a
large size corresponding to the diameter of the wafer, impact and
stress applied to the wafer and the CMP pad further increase, and
the frequency of pollution by slurry and foreign material and a
defect such as scratch, or the like, increases.
[0006] In polishing quality by the CMP process, distribution of
polished particles maintained in a state of being widely spread
over the entire CMP pad is particularly important. An upper portion
of the CMP pad generally supports the polished particles by a
mechanism such as a fiber or a small void, which determine
performance of the CMP pad. Therefore, in order to maintain
performance of the CMP pad, an upper fiber structure of the CMP pad
needs to be maintained in an upright state as flexible as possible,
and extra voids capable of receiving new polished particles therein
need to be sufficiently secured. To this end, a conditioning or
dressing process of the CMP pad by a CMP pad conditioner is
required.
[0007] According to the related art, research into technologies for
allowing a polishing pad to effectively perform polishing using
small pressure and preventing surface roughness and separation of
diamond particles has been conducted. As one of the technologies, a
technology of manufacturing a CMP pad conditioner by forming
protrusions having a regular arrangement separated by a ditch
traversing a width/height and an approximately quadrangular pyramid
shape on a substrate such as ceramic, hard metal alloy, or the
like, through mechanical grinding or cutting processing and
depositing a diamond on surfaces of the protrusion has been
suggested (KR 10-0387954). According to a technical feature of the
related art, sharp edges are provided on the protrusions of the
substrate and the CMP pad is dressed using a cutting property by
the edges. Here, in order to enhance a material, diamond thin films
having high strength are deposited.
[0008] However, in the case in which there are angled edges in the
protrusions, the diamond thin films stacked on the protrusion may
be easily separated/delaminated due to the edges. This is the
reason that when the thin films are formed by depositing a diamond
material on a surface of a substrate, the deposition is
satisfactorily performed on a flat surface; however, the deposition
or growth of the diamond is not satisfactorily performed on the
sharp edge. FIG. 10 is a photograph showing a phenomenon in which a
diamond thin film is delaminated at a protrusion formed by
mechanical processing.
[0009] In addition, according to the related art, even though the
protrusion is formed on the surface of the substrate through the
cutting processing, it is substantially impossible to freely adjust
shapes of the protrusions as desired or differently control sizes
of the protrusions.
BRIEF SUMMARY
[0010] Embodiments of the present invention provide a chemical
mechanical polishing (CMP) pad conditioner including protrusions on
a surface of a substrate and diamond thin films deposited thereon
and having an improved structure in which the protrusions are
formed on the surface of the substrate so that they do not have
angled edges to thereby reliably form the diamond thin film
covering the protrusions, and protrusions having a size of several
.mu.m are formed at the time of growth of the diamond thin film are
mainly used for polishing, and a method for manufacturing the
same.
Technical Solution
[0011] According to an exemplary embodiment of the present
invention, there is provided a chemical mechanical polishing (CMP)
pad conditioner including: a substrate including a plurality of
protrusions formed on at least one surface thereof and made of
ceramic or hard metal alloy, the plurality of protrusions being
formed through laser processing so as not to have angled edges on
an upper end and an inclined side thereof and a diamond thin film
deposited so as to cover the plurality of protrusions, wherein the
diamond thin film includes a rough polishing surface on which micro
protrusions having a size of several .mu.m are formed.
[0012] Each of the protrusions may have a mountain shape in which
an upper end thereof has an area smaller than that of a lower end
thereof, and the upper end may have an area of 100 .mu.m.sup.2 or
less.
[0013] The diamond thin film may be formed through chemical vapor
deposition (CVD).
[0014] Each of the protrusions may have an angle of 100 degrees or
more between a tangent line of the upper end thereof and a tangent
line of the side thereof.
[0015] The plurality of protrusions may have a height difference of
20 .mu.m or less.
[0016] A concave-convex pattern in which ridges and valleys are
repeated may be formed in the vicinity of each of the
protrusions.
[0017] The substrate may be made of ceramic containing
Si.sub.3N.sub.4.
[0018] Two or more kinds of protrusions having different heights
and sizes may be formed as a group.
[0019] According to another exemplar embodiment of the present
invention, there is provided a method for manufacturing CMP pad
conditioner, the method including: (a) forming a plurality of
protrusions on a surface of a substrate made of ceramic or hard
metal alloy; and (b) depositing a diamond thin film so as to cover
the plurality of protrusions, wherein in step (a), the protrusions
are formed through laser processing so as not to have angled edges
on an upper end and a side thereof.
[0020] In step (a), the protrusions may be formed by a method for
irradiating a laser beam while changing an overlapped interval at
the time of irradiation of the laser beam on the surface of the
substrate. More specifically, a laser beam spot has strength
distribution having Gaussian distribution, such that when the laser
beam is irradiated on the surface of the substrate, a ditch having
a slope is formed as shown in FIG. 9. Here, a depth and a shape of
the ditch by one-time irradiation are determined according to basic
characteristics, an output, an irradiation time, or the like, of
the laser beam. In FIG. 9, the protrusion is formed by processing a
Si.sub.3N.sub.4 sintered body with a solid laser beam. When the
laser beam is irradiated in the vicinity of the protrusion in an
overlapped scheme, a shape of the protrusions and a concave-convex
pattern (ridge, valley) in the vicinity of the protrusion may be
adjusted according to a condition such as a beam irradiation
interval, or the like.
[0021] In step (a), a concave-convex pattern may be formed in the
vicinity of the protrusion by irradiating a laser beam on the
surface of the substrate in an overlapped scheme.
[0022] In step (a), the protrusions are formed so that an upper end
of each of the protrusions has an area of 100 .mu.m.sup.2 or
less.
[0023] The protrusions may be formed so that each of the
protrusions has an angle of 100 degrees or more between a tangent
line of the upper end thereof and a tangent line of the side
thereof.
[0024] In step (b), the diamond thin film having micro protrusions
may be deposited on the surface of the substrate through CVD.
[0025] The entirety or a portion of the substrate may be processed
by an acid/base solution in order to remove an oxide film or a
residual after the laser processing in step (a).
[0026] The method may further include machining the protrusions in
order to separate the protrusions before or after the laser
processing in step (a).
[0027] The laser processing may be performed using a CO2 gas laser
beam, an Nd solid laser beam, or a fiber laser beam.
[0028] In step (b), a hot filament CVD method may be used.
Advantageous Effects
[0029] As set forth above, according to the exemplary embodiments
of the present invention, the plurality of protrusions that do not
have the angled edge may be formed on the surface of the substrate
through the laser processing, thereby making it possible to
reliably form the diamond thin film on the surface on which the
protrusions are formed. Unlink the CMP pad conditioner according to
the related art in which the edge of the protrusion mainly performs
a polishing function, in the case of the CMP pad conditioner
according to the exemplary embodiments of the present invention,
the micro protrusions having a size of several .mu.m on the diamond
thin film formed on the protrusion that does not have the angled
edge mainly perform the polishing function. Therefore, performance
of the CMP pad conditioner may be improved, and the
separation/delamination of the diamond thin film due to obstruction
of deposition and/or growth of the diamond thin film in the
vicinity of the edge of the existing angled protrusion may be
suppressed. In addition, the CMP pad conditioner according to the
exemplary embodiments of the present invention includes the
concave-convex pattern formed in the vicinity of the protrusions of
the substrate through the laser processing. This concave-convex
pattern satisfactorily mixes the slurry, thereby making it possible
to improve the performance of the CMP pad conditioner.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0030] FIG. 1 is a partially enlarged cross-sectional view of a CMP
pad conditioner according to an exemplary embodiment of the present
invention;
[0031] FIG. 2 is an enlarged cross-sectional view of a substrate of
the CMP pad conditioner shown in FIG. 1;
[0032] FIGS. 3A and 3B are images showing surfaces of substrates on
which protrusions are formed through laser processing according to
an exemplary embodiment of the present invention;
[0033] FIGS. 4A and 4B are views describing a method for forming
protrusions and concave-convex patterns on a surface of a substrate
through laser processing;
[0034] FIGS. 5A and 5B are views describing several exemplary
examples of a protrusion pattern formed on a surface of a
substrate;
[0035] FIG. 6 is a view describing a specific dimension and shape
of a protrusion formed through laser processing according to an
exemplary embodiment of the present invention;
[0036] FIG. 7 is an enlarged image of a protrusion formed through
laser processing;
[0037] FIG. 8 is an image showing a state in which a diamond thin
film is deposited on a surface of a protrusion;
[0038] FIG. 9 is an image describing characteristics of a
protrusion formed by a laser beam; and
[0039] FIG. 10 is an image showing a problem such as a delamination
phenomenon of the related art in which a diamond thin film is
formed on a protrusion including an angled edge.
DETAILED DESCRIPTION
[0040] FIG. 1 is a partially enlarged cross-sectional view of a CMP
pad conditioner according to an exemplary embodiment of the present
invention. Referring to FIG. 1, a CMP pad conditioner 1 according
to the present embodiment includes a plate shaped substrate 10 made
of ceramic or hard metal alloy, for example, cemented carbide and a
diamond thin film 20 deposited on a surface of the substrate 10.
When the substrate 10 is made of a ceramic material, it may be
mainly made of Si.sub.3N.sub.4. A plurality of protrusions 11
having a height difference of approximately 20 .mu.m or less, that
is, a relatively uniform height is formed on one surface of the
substrate 10 through laser processing. The diamond thin film 20 is
formed by depositing a diamond material on the surface of the
substrate 10 using a chemical vapor deposition (CVD) process. The
diamond thin film 20 includes a rough polishing surface on which
micro protrusions 21 having several .mu.m an (approximately 1 .mu.m
or more) are formed.
[0041] FIG. 2 is an enlarged cross-sectional view of a substrate of
the CMP pad conditioner shown in FIG. 1. Referring to FIG. 2, the
protrusion 11 on the surface of the substrate is shown in a state
in which it is enlarged. The protrusion 11 has a mountain shape in
which an upper end thereof has an area smaller than that of a lower
end thereof. The upper end has a significantly small area of 100
.mu.m.sup.2 or less. An angle A between a tangent line L1 of the
upper end and a tangent line L2 of an inclined side of each of the
protrusions 11 is defined as approximately 100 degrees or more.
[0042] Therefore, each of the protrusions 11 may be formed to have
an approximately pointed shape. However, the upper end of the
protrusions 11 may be formed to have a smooth curved surface
without a sharp apex. There are no angled edges on the upper end
and the inclined side of the protrusions 11, which is possible by
forming the protrusion 11 through the laser processing. A method
for forming the protrusions 11 through the laser processing will be
described in detail below.
[0043] In addition, the parent material 10 includes a
concave-convex pattern in which ridges r and valleys v are
continuously formed repeatedly on a surface of the substrate in the
vicinity of the protrusion 11. When a shape, a size, and the like,
of the concave-convex pattern is adjusted, a slurry may be
appropriately mixed during a conditioning process of a CMP pad to
thereby contribute to improving CMP conditioning performance of the
CMP pad conditioner (See FIG. 3B). The repeated pattern of the
ridges r and the valleys v, that is, the concave-convex pattern may
also be easily formed through the laser processing. That is, the
repeated pattern of the ridges r and the valleys may be formed by
continuously irradiating a laser beam on the surface of the
substrate 10 in an overlapped scheme.
[0044] Again referring to FIG. 1, the diamond thin film 20 is
formed to have an approximately uniform thickness so as to cover
all of the protrusions 11, and the protrusions 11 do not have the
angled edges. Therefore, the diamond thin film 20 may be more
reliably deposited on the protrusions 11 by the CVD process. That
is, a concave-convex surface existing in the protrusion 11 in a
concave-convex surface of the diamond thin film 20 or the micro
protrusions mainly perform a polishing function. Therefore, the CMP
pad conditioner 1 according to the present embodiment may
sufficiently improve conditioning performance of the CMP pad
without having a sharp edge in the protrusion 11.
[0045] FIGS. 3A and 3B are images showing surfaces of substrates of
a CMP pad conditioner on which protrusions are formed through laser
processing according to an exemplary embodiment of the present
invention. Referring to FIGS. 3A and 3B, it may appreciated that
there are no angled edges in both of an upper end and a side of a
protrusion shown at the center of an image and protruding to be the
highest from a surface of a substrate. In addition, it may be
appreciated that there is a concave-convex pattern in which ridges
and valleys are repeatedly formed in the vicinity of the protrusion
shown at the center of the image. The protrusion and the
concave-convex pattern are formed by irradiating the laser beam on
the surface of the substrate to cut the surface of the surface of
the substrate, and more specifically, irradiating the laser beam in
an overlapped scheme. In addition, when the laser beam is
irradiated on the concave-convex pattern and the surface of the
substrate in the overlapped scheme, in the case of changing an
output of the laser beam, more shapes may be implemented.
[0046] In order to manufacture the CMP pad conditioner according to
the exemplary embodiment of the present invention, a plate shaped
substrate made of ceramic or hard metal alloy is first prepared.
Then, a plurality of protrusions and a concave-convex pattern are
formed on a surface of the substrate through laser processing.
Next, a diamond thin film is formed to have a thickness in .mu.m on
the surface of the substrate having the protrusions formed thereon
through the CVD.
[0047] FIGS. 4A and 4B are views describing a method for forming
protrusions and concave-convex patterns on a surface of a substrate
through laser processing.
[0048] First, as shown in FIG. 4A, a process of defining regions 2
at which the protrusions is to be formed on the surface of the
substrate 10 is performed. The process of defining the regions may
include inputting the regions as coordinates to a laser processing
device. Furthermore, the process of defining the regions may
further include indicating outlines of the regions by drawing a
line on the surface of the substrate with the laser beam. The
region 2 shown in FIG. 4A is a region of which an outline is
indicated using a laser beam. Although FIG. 4A shows a case in
which the region has a rectangular shape, the region may also have
a circular shape, a triangular shape, a pentagonal shape, or
another geometrical shape. In FIG. 3B, which is a real processing
example, the region has a rectangular outline. It may be
appreciated from FIG. 3B that the protrusion is formed without the
edge according to characteristics of the laser beam.
[0049] As shown in FIG. 4B, the laser beam B is irradiated on the
surface of the substrate 10 in an overlapped scheme, such that the
protrusion 11 and the concave-convex pattern are formed. The
concave-convex pattern has a shape in which the ridges r and
valleys v are continuously repeated as described above. For
convenience of illustration and understanding, only some of the
laser beams B irradiated in an overlapped scheme in order to form
the protrusions 11 and the concave-convex pattern are shown in FIG.
4B. At the time of formation of the protrusions 11, small
protrusions may be additionally formed by slightly differently
changing the outputs of the overlapped laser beams. These
protrusions increase a contact area with a pad at the time of
polishing, thereby improving polishing characteristics of the
pad.
[0050] In the present embodiment, the protrusions and the
concave-convex pattern are formed on the surface of the substrate
using an Nd solid laser beam having a wavelength of 1064 nm as a
laser light source. However, the present invention is not limited
thereto. Other laser light sources such as a CO.sub.2 gas laser
beam, a fiber laser beam, or the like, may be used.
[0051] FIG. 6 shows a specific dimension and shape of a protrusion
formed through laser processing according to an exemplary
embodiment of the present invention. In the Table shown in FIG. 6,
a portion represented by Seg. 3 indicates an upper portion of the
protrusion. Therefore, the upper portion of the protrusion has a
horizontal distance of approximate 15 .mu.m and a height of
approximate 115 .mu.m.
[0052] FIG. 7 is an enlarged image of a protrusion formed through
laser process; and FIG. 8 is an image showing a state in which a
diamond thin film is deposited on a surface of a protrusion.
Referring to FIGS. 7 and 8, the diamond thin film is deposited on a
surface of the protrusion formed without the angled edge so as to
have micro protrusions, which participate in real polishing in the
conditioning process of the CMP pad.
[0053] The entirety or a portion of the substrate may be processed
by an acid/base solution in order to remove an oxide film, a
residual, or the like, existing on the surface of the substrate on
which the protrusions are formed, after the protrusions are formed
on the surface of the substrate through the laser processing and
before the diamond thin film is formed in the CVD scheme. In
addition, as a method for depositing the diamond thin film on the
surface of the substrate on which the protrusions are formed, the
CVD technology as described above, and more preferably, a hot
filament CVD method is used.
[0054] A pattern of the protrusions formed on the substrate may be
variously changed according to a laser processing scheme. FIGS. 5A
and 5B show several examples of patterns of protrusions.
[0055] FIG. 5A shows an example in which protrusions 11a and 11b
are formed to have different heights on the substrate 10. In the
case in which the protrusions 11a and 11b have different heights,
when the diamond thin film 20 (See FIG. 1) formed on the protrusion
11a having a higher height is worn out and thus does not perform a
polishing function, the diamond thin film 20 formed on the
protrusion 11b having a lower height may perform the polishing
function. Although FIG. 5A shows a case in which the protrusions
have a height difference of two stages, the protrusions may also
have a height difference of three or more stages as needed.
[0056] FIG. 5B shows an example of a protrusion pattern in which at
least two protrusions 11 and 11 are formed on the surface of the
substrate 10 in a state in which they are grouped into a plurality
of groups G1, G2, and G3. This protrusion pattern may be obtained
by, for example, defining a plurality of regions 2 on the surface
of the substrate 10 (See FIG. 4A) and forming the plurality of
protrusions 11 and 11 in the respective regions 2 through the laser
processing on the respective regions 2. Although FIG. 5B shows a
case in which two protrusions are continuously disposed, three or
more protrusions may also be continuously disposed as needed.
[0057] The various embodiments described above can be combined to
provide further embodiments. All of the U.S. patents, U.S. patent
application publications, U.S. patent applications, foreign
patents, foreign patent applications and non-patent publications
referred to in this specification and/or listed in the Application
Data Sheet are incorporated herein by reference, in their entirety.
Aspects of the embodiments can be modified, if necessary to employ
concepts of the various patents, applications and publications to
provide yet further embodiments.
[0058] These and other changes can be made to the embodiments in
light of the above-detailed description. In general, in the
following claims, the terms used should not be construed to limit
the claims to the specific embodiments disclosed in the
specification and the claims, but should be construed to include
all possible embodiments along with the full scope of equivalents
to which such claims are entitled. Accordingly, the claims are not
limited by the disclosure.
* * * * *