U.S. patent application number 13/753090 was filed with the patent office on 2013-08-29 for heat-exchanged cabinet structure.
This patent application is currently assigned to DELTA ELECTRONICS, INC.. The applicant listed for this patent is DELTA ELECTRONICS, INC.. Invention is credited to Shen-Feng CHAN, Pi-Chen LIU, Ta-Jung YANG.
Application Number | 20130219947 13/753090 |
Document ID | / |
Family ID | 49001358 |
Filed Date | 2013-08-29 |
United States Patent
Application |
20130219947 |
Kind Code |
A1 |
YANG; Ta-Jung ; et
al. |
August 29, 2013 |
HEAT-EXCHANGED CABINET STRUCTURE
Abstract
A heat-exchanged cabinet structure is used to accommodate an
electronic equipment. The heat-exchanged cabinet structure includes
a main body, a first heat exchanger device and a second heat
exchanger device. The main body has an accommodated space and a
first housing. The electronic equipment is disposed in the
accommodated space. The first heat exchanger device which has a
condenser is disposed on the first housing and placed in the
accommodated space. The second heat exchanger device which has an
evaporator is placed in the accommodated space and is adjacent the
first heat exchanger.
Inventors: |
YANG; Ta-Jung; (Taoyuan
Hsien, TW) ; LIU; Pi-Chen; (Taoyuan Hsien, TW)
; CHAN; Shen-Feng; (Taoyuan Hsien, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
DELTA ELECTRONICS, INC.; |
|
|
US |
|
|
Assignee: |
DELTA ELECTRONICS, INC.
Taoyuan Hsien
TW
|
Family ID: |
49001358 |
Appl. No.: |
13/753090 |
Filed: |
January 29, 2013 |
Current U.S.
Class: |
62/426 ;
62/513 |
Current CPC
Class: |
H05K 7/20609 20130101;
F25D 31/00 20130101 |
Class at
Publication: |
62/426 ;
62/513 |
International
Class: |
F25D 31/00 20060101
F25D031/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 24, 2012 |
TW |
101106204 |
Claims
1. A heat-exchanged cabinet structure, which is used to accommodate
an electronic equipment, comprising: a main body having an
accommodated space and a first housing, wherein the electronic
equipment is disposed in the accommodated space; a first heat
exchanger device disposed on the first housing and placed in the
accommodated space, wherein the first heat exchanger device has a
condenser; and a second heat exchanger device placed in the
accommodated space and adjacent the first heat exchanger, wherein
the second heat exchanger device has an evaporator.
2. The heat-exchanged cabinet structure of claim 1, wherein the
first heat exchanger device further has a pipe and a fan, and the
pipe connects the condenser and the evaporator for transmitting a
fluid from the condenser to the evaporator.
3. The heat-exchanged cabinet structure of claim 1, wherein the
second heat exchanger device further has a pipe and a fan, and the
pipe connects the condenser and the evaporator for transmitting a
fluid from the evaporator to the condenser.
4. The heat-exchanged cabinet structure of claim 2, wherein the fan
is a centrifugal fan.
5. The heat-exchanged cabinet structure of claim 3, wherein the fan
is a centrifugal fan.
6. The heat-exchanged cabinet structure of claim 1, further
comprising: a heating device connecting to the first heat exchanger
device or the second heat exchanger device; and a control device
connecting to and controlling the heating device.
7. The heat-exchanged cabinet structure of claim 1, wherein the
first housing is a cap, a rear plate, a side plate, a top plate, or
a bottom plate.
8. A heat-exchanged cabinet structure, which is used to accommodate
an electronic equipment, comprising: a main body having an
accommodated space, a first housing and a second housing, wherein
the first housing is disposed opposite to the second housing, and
the electronic equipment is disposed in the accommodated space; a
first heat exchanger device disposed on the first housing and
placed in the accommodated space, wherein the first heat exchanger
device has a condenser; and a second heat exchanger device disposed
on the second housing and placed in the accommodated space, wherein
the second heat exchanger device has an evaporator.
9. The heat-exchanged cabinet structure of claim 8, wherein the
first heat exchanger device further has a pipe and a fan, and the
pipe connects the condenser and the evaporator for transmitting a
fluid from the condenser to the evaporator.
10. The heat-exchanged cabinet structure of claim 8, wherein the
second heat exchanger device further has a pipe and a fan, and the
pipe connects the condenser and the evaporator for transmitting a
fluid from the evaporator to the condenser.
11. The heat-exchanged cabinet structure of claim 9, wherein the
fan is a centrifugal fan.
12. The heat-exchanged cabinet structure of claim 10, wherein the
fan is a centrifugal fan.
13. The heat-exchanged cabinet structure of claim 8, further
comprising: a heating device connecting to the first heat exchanger
device or the second heat exchanger device; and a control device
connecting to and controlling the heating device.
14. The heat-exchanged cabinet structure of claim 8, wherein the
first housing is a cap, a rear plate, a side plate, a top plate, or
a bottom plate.
15. A heat-exchanged cabinet structure, which is used to
accommodate an electronic equipment, comprising: a main body having
an accommodated space, a first housing and a second housing,
wherein the first housing is connected to the second housing, and
the electronic equipment is disposed in the accommodated space; a
first heat exchanger device disposed on the first housing and
placed in the accommodated space, wherein the first heat exchanger
device has a condenser; and a second heat exchanger device disposed
on the second housing and placed in the accommodated space, wherein
the second heat exchanger device has an evaporator.
16. The heat-exchanged cabinet structure of claim 15, wherein the
first heat exchanger device further has a pipe and a fan, and the
pipe connects the condenser and the evaporator for transmitting a
fluid from the condenser to the evaporator.
17. The heat-exchanged cabinet structure of claim 15, wherein the
second heat exchanger device further has a pipe and a fan, and the
pipe connects the condenser and the evaporator for transmitting a
fluid from the evaporator to the condenser.
18. The heat-exchanged cabinet structure of claim 17, wherein the
fan is a centrifugal fan.
19. The heat-exchanged cabinet structure of claim 15, further
comprising: a heating device connecting to the first heat exchanger
device or the second heat exchanger device; and a control device
connecting to and controlling the heating device.
20. The heat-exchanged cabinet structure of claim 15, wherein the
first housing is a cap, a rear plate, a side plate, a top plate, or
a bottom plate.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This Non-provisional application claims priority under 35
U.S.C. .sctn.119(a) on Patent Application No(s). 101106204 filed in
Taiwan, Republic of China on Feb. 24, 2012, the entire contents of
which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of Invention
[0003] The present invention relates to a heat-exchanged cabinet
structure and, in particular, to a heat-exchanged cabinet structure
with heat exchanger devices.
[0004] 2. Related Art
[0005] Heat-exchanged cabinet structures have been widely applied
to outdoor communication stations or telecommunication power
equipment. FIG. 1 is a schematic diagram showing a conventional
heat-exchanged cabinet structure 1, which includes a main body 11
and a heat exchanger device 12. The heat-exchanged cabinet
structure 1 is used to carry an electronic equipment A. The main
body 11 has an accommodating space 111, and the electronic
equipment A is placed in the accommodating space 111. The heat
exchanger device 12 is installed on the outer surface 112 of the
main body 11 and connected to the main body 11.
[0006] Since the heat exchanger device 12 of the heat-exchanged
cabinet structure 1 is installed on the outer surface 112 of the
main body 11, and it can directly contact the exterior environment,
the heat exchanger device 12 fails to provide good heat dissipation
and air cycling. Besides, the heat exchanger device 12 is easily
interfered by the climatic and environmental factors, thereby
resulting bad heat dissipation and thus causing the overheating and
malfunction of the electronic equipment A. In addition, this
configuration not only sufficiently enlarges the total size of the
heat-exchanged cabinet structure 1 but also increases the
manufacturing cost and time.
[0007] Therefore, it is an important subject to provide a
heat-exchanged cabinet structure that can improve the air cycling
so as to enhance the heat-dissipating performance and reduce the
configuration space and manufacturing cost.
SUMMARY OF THE INVENTION
[0008] In view of the foregoing subject, an objective of the
present invention is to provide a heat-exchanged cabinet structure
that can improve the air cycling so as to enhance the
heat-dissipating performance and reduce the configuration
space/size and manufacturing cost.
[0009] To achieve the above objective, the present invention
discloses a heat-exchanged cabinet structure, which is used to
accommodate an electronic equipment. The heat-exchanged cabinet
structure includes a main body, a first heat exchanger device and a
second heat exchanger device. The main body has an accommodated
space and a first housing, and the electronic equipment is disposed
in the accommodated space. The first heat exchanger device has a
condenser and is disposed on the first housing and placed in the
accommodated space. The second heat exchanger device has an
evaporator and is placed in the accommodated space and adjacent the
first heat exchanger.
[0010] To achieve the above objective, the present invention also
discloses a heat-exchanged cabinet structure, which is used to
accommodate an electronic equipment. The heat-exchanged cabinet
structure includes a main body, a first heat exchanger device and a
second heat exchanger device. The main body has an accommodated
space, a first housing and a second housing. The first housing is
disposed opposite to the second housing, and the electronic
equipment is disposed in the accommodated space. The first heat
exchanger device has a condenser and is disposed on the first
housing and placed in the accommodated space. The second heat
exchanger device has an evaporator and is disposed on the second
housing and placed in the accommodated space.
[0011] To achieve the above objective, the present invention also
discloses a heat-exchanged cabinet structure, which is used to
accommodate an electronic equipment. The main body has an
accommodated space, a first housing and a second housing. The first
housing is connected to the second housing, and the electronic
equipment is disposed in the accommodated space. The first heat
exchanger device has a condenser and is disposed on the first
housing and placed in the accommodated space. The second heat
exchanger device has an evaporator, and is disposed on the second
housing and placed in the accommodated space.
[0012] As mentioned above, the first and second heat exchanger
devices of the heat-exchanged cabinet structure are disposed in the
accommodating space of the main body, and located corresponding to
the electronic equipment. The first and second heat exchanger
devices have a condenser and an evaporator, respectively, for
dissipating the heat generated by the electronic equipment, thereby
enhancing the heat-dissipation performance of the heat-exchanged
cabinet structure. In addition, the installation positions of the
first and second exchanger devices can be flexibly modified
according to the dimension of the electronic equipment or the
heat-exchanged cabinet structure. For example, the first and second
exchanger devices are disposed on two opposite or connected
housings of the heat-exchanged cabinet structure, respectively.
These configurations can also increase the air cycling performance
and thus improve the heat-dissipation performance.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The present invention will become more fully understood from
the subsequent detailed description and accompanying drawings,
which are given by way of illustration only, and thus are not
limitative of the present invention, and wherein:
[0014] FIG. 1 is a schematic diagram showing a conventional
heat-exchanged cabinet structure;
[0015] FIG. 2 is a schematic diagram showing a heat-exchanged
cabinet structure according to a first embodiment of the present
invention;
[0016] FIG. 3 is a sectional side view of the heat-exchanged
cabinet structure of FIG. 2;
[0017] FIG. 4 is a sectional side view of a heat-exchanged cabinet
structure according to a second embodiment of the present
invention; and
[0018] FIG. 5 is a sectional side view of a heat-exchanged cabinet
structure according to a third embodiment of the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0019] The present invention will be apparent from the following
detailed description, which proceeds with reference to the
accompanying drawings, wherein the same references relate to the
same elements.
First Embodiment
[0020] FIG. 2 is a schematic diagram showing a heat-exchanged
cabinet structure 2 according to a first embodiment of the present
invention. The heat-exchanged cabinet structure 2 is installed at
outdoor or in the equipment room for carrying an electronic
equipment A. In this case, the electronic equipment A is, for
example, an electronic communication equipment, a communication
station or the likes. The heat-exchanged cabinet structure 2
includes a main body 21, a first heat exchanger device 22, and a
second heat exchanger device 23. The first heat exchanger device
22, the second heat exchanger device 23 and the electronic
equipment A are disposed in the main body 21. In addition, the
heat-exchanged cabinet structure 2 may further include a heating
device 24 and a control device 25. The heating device 24 is
installed on the main body 21 and connected to the first exchanger
device 22 or the second heat exchanger device 23. The control
device 25 is connected to the heating device 24 for controlling the
operation of the heating device 24 so as to adjust the
temperature.
[0021] The main body 21 has an accommodated space 211 and a first
housing 212. For example, the first housing 212 can be a cap, a
rear plate, a side plate, a top plate, or a bottom plate. In this
embodiment, the first housing 212 is, for example but not limited
to, a cap. The electronic equipment A is disposed in the
accommodated space 211, so that the main body 21 can protect the
electronic equipment A as well as the components thereof from being
damped or damaged by the environment, corrosive gas or external
force.
[0022] The first heat exchanger device 22 is disposed on the first
housing 212 and placed in the accommodated space 211, and the
second heat exchanger device 23 is disposed adjacent to (stacked
on) the first heat exchanger device 22 and also disposed in the
accommodated space 211. In this embodiment, the first heat
exchanger device 22 and the second heat exchanger device 23 are all
installed inside the main body 21, so that they can directly
perform the heat dissipation of the electronic equipment A. This
configuration can reduce the environmental interference, enhance
the air cycling and heat-dissipating performance, minimize the
assembling dimension of the heat-exchanged cabinet structure 2, and
decrease the manufacturing cost.
[0023] FIG. 3 is a sectional side view of the heat-exchanged
cabinet structure 2 of FIG. 2. To be noted, the heating device 24
and the control device 25 are not shown in FIG. 3 for clearly
illustrating other components, and the shown components may be not
shown in the actual dimensions and are for illustrations only. The
first heat exchanger device 22 includes a condenser 221, a pipe 222
and a fan 223, and the second heat exchanger device 23 includes an
evaporator 231, a pipe 232 and a fan 233. The pipes 222 and 232 are
connected to the condenser 221 and the evaporator 231,
respectively. In more specific, the pipe 222 is configured to
transfer a fluid (e.g. a liquid) from the condenser 221 to the
evaporator 231, and the pipe 232 is configured to transfer a fluid
(e.g. a gas) from the evaporator 231 to the condenser 221. To be
noted, the lengths of the pipes 222 and 232 are not limited to this
invention, and they can be adjusted based on the distance between
the condenser 221 and the evaporator 231. In the heat-exchanged
cabinet structure 2 of this embodiment, the first heat exchanger
device 22 has two pipes 222, and the second heat exchanger device
23 has two pipes 232. The configurations of the pipes 222 and 232
are to improve the transmission efficiency of the fluid (liquid or
gas) between the condenser 221 and the evaporator 231. To be noted,
the numbers of the pipes 222 and 232 are not limited to this
invention, and they can be adjusted according to the dimensions of
the first heat exchanger device 22 or the second heat exchanger
device 23.
[0024] In other embodiments, it is possible to configure additional
condenser and/or evaporator in the in the first heat exchanger
device 22 and/or the second heat exchanger device 23. For example,
the first heat exchanger device 22 includes two condensers, and the
second heat exchanger device 23 includes two evaporators, thereby
enhancing the performance of heat dissipation and air cycling.
Herein, the numbers of the condensers and evaporators are not
limited in the invention.
[0025] The fans 223 and 233 of this embodiment are centrifugal
fans. In other embodiments, the fans 223 and 233 can be selected
from other types of fans (e.g. axial flow fans, oblique flow fans,
or cross flow fans) based on the positions thereof or the shapes
and volumes of the heat-exchanged cabinet structure 2. To be noted,
the first heat exchanger device 22 and the second heat exchanger
device 23 are individually configured, and they are separated by,
for example, at least one partition and connected only through the
pipes 222 and 232, which connect the condenser 221 and the
evaporator 231. In the heat-exchanged cabinet structure 2 of this
embodiment, the first heat exchanger device 22 and the second heat
exchanger device 23 respectively include two fans 223 and two fans
233 for increasing the air input quantity. Herein, the numbers of
the fans 223 and 233 are not limited in this invention.
[0026] The heating device 24 is connected to at least one of the
first heat exchanger device 22 and the second heat exchanger device
23, and the control device 25 is connected to the heating device
24. In this embodiment, the heating device 24 and the control
device 25 are disposed in the first housing 212. Of course, the
configurations and positions of the heating device 24 and the
control device 25 are not limited in this invention. In other
embodiments, the heating device 24 and the control device 25 may be
disposed in the same housing or different housings. The control
device 25 can control the heating device 24 according to the
climate or environmental temperature so as to adjust the
temperatures of the first heat exchanger device 22 and the second
heat exchanger device 23. Accordingly, the second heat exchanger
device 23 can output cold air to cool down the electronic equipment
A.
[0027] The operation of the first heat exchanger device 22 and the
second heat exchanger device 23 and the heat-dissipating process of
the electronic equipment A will be described hereinafter with
reference to FIG. 3. The fan 223 sucks the cold air C1 from the
outside into the first heat exchanger device 22. The cold air C1
flows to the condenser 221 along the path P1 in the first heat
exchanger device 22, and then the cold air C1 carries the heat out
from the condenser 221 to form a warm air W1, which is outputted
through the output side S1. In more specific, the first housing 212
has an opening (not shown) disposed corresponding to the condenser
221, so that the warm air W1 can be outputted through the output
side S1. Besides, the condenser 221 can condense the fluid to
liquid, and the liquid then flows to the evaporator 231 through the
pipe 222.
[0028] On the contrary, the fan 233 sucks the warm air W2 generated
by the electronic equipment A into the second heat exchanger device
23. The warm air W2 flows to the evaporator 231 along the path P2
in the second heat exchanger device 23, and then the evaporator 231
can carry the heat from the warm air W2 to form a cold air C2,
which is outputted through the output side S2 along a path P2. The
cold air C2 is sent to the electronic equipment A for dissipating
the heat generated by the electronic equipment A. Herein, the
liquid fluid flowing to the evaporator 231 is evaporated into gas
fluid, which then flows to the condenser 221 through the pipe 232.
The established gas cycling can dissipate the heat (generated by
the electronic equipment A or the main body 21) carried by the warm
air W2 to the outside, thereby enhancing the heat-dissipation
efficiency of the main body 21.
[0029] To be noted, the temperatures of the cold airs C1 and C2 and
the warm airs W1 and W2 are not limited to this embodiment. The
most important condition is to keep the temperature of the warm air
W1 from the first heat exchanger device 22 to be higher than the
temperature of the cold air C1 flowing into the first heat
exchanger device 22. Similarly, the temperature of the warm air W2
flowing into the second heat exchanger device 23 to be higher than
the temperature of the cold air C2 from the second heat exchanger
device 23.
Second Embodiment
[0030] FIG. 4 is a sectional side view of a heat-exchanged cabinet
structure 3 according to a second embodiment of the present
invention. The heat-exchanged cabinet structure 3 is installed at
outdoor or in the equipment room for carrying an electronic
equipment A. In this case, the electronic equipment A is, for
example, an electronic communication equipment, a network exchanger
or a transformer apparatus. The heat-exchanged cabinet structure 3
includes a main body 31, a first heat exchanger device 32, and a
second heat exchanger device 33. The first heat exchanger device
32, the second heat exchanger device 33, and the electronic
equipment A are disposed in the main body 31. In addition, the
heat-exchanged cabinet structure 3 may further include a heating
device and a control device (not shown). The heating device is
installed on the main body 31 and connected to the first exchanger
device 32 or the second heat exchanger device 33. The control
device is connected to the heating device for controlling the
operation of the heating device so as to adjust the temperature
inside the heat-exchanged cabinet structure 3.
[0031] The main body 31 has an accommodated space 311, a first
housing 312 and a second housing 313. The first housing 312 and the
second housing 313 are disposed opposite to each other. For
example, each of the first housing 312 and the second housing 313
can be a cap, a rear plate, a side plate, a top plate, or a bottom
plate. In this embodiment, the first housing 312 is, for example
but not limited to, a cap, and the second housing 313 is
correspondingly a rear plate.
[0032] The electronic equipment A is disposed in the accommodated
space 311. The first heat exchanger device 32 is disposed on the
first housing 312, and the second heat exchanger device 33 is
disposed on the second housing 313 and located opposite to the
first heat exchanger device 32. In this embodiment, the first heat
exchanger device 32 is disposed on the first housing 312 and the
second heat exchanger device 33 is disposed on the second housing
313, which are all installed inside the main body 31, so that they
can directly perform the heat dissipation of the electronic
equipment A. This configuration can enhance the air cycling and
heat-dissipating performance and prevent the interference of
external environmental factors, which can affect the normal
operation of the heat exchanger devices. In addition, the positions
of the first heat exchanger device 32 and the second heat exchanger
device 33 can be flexibly changed based on the heat-dissipation
requirement of the electronic equipment A. Furthermore, this
configuration can minimize the assembling dimension of the
heat-exchanged cabinet structure 3 and decrease the manufacturing
cost.
[0033] The first heat exchanger device 32 includes a condenser 321,
a pipe 322 and a fan 323. The condenser 321 is connected to the
pipe 322, and the pipe 322 is configured to transfer a fluid (e.g.
a liquid) from the condenser 321 to an evaporator 331. The fan 323
and the condenser 321 are disposed in the first housing 312. The
second heat exchanger device 33 includes the evaporator 331, a pipe
332 and a fan 333. The evaporator 331 is connected to the pipe 332,
and the pipe 332 is configured to transfer a fluid (e.g. a gas)
from the evaporator 331 to the condenser 321. The fan 333 and the
evaporator 331 are disposed in the second housing 313. In this
embodiment, the fans 323 and 333 are, for example but not limited
to, centrifugal fans. Of course, the fans 323 and 333 can be any
applicable fan such as axial flow fans or oblique flow fans.
[0034] To be noted, the first heat exchanger device 32 and the
second heat exchanger device 33 are individually configured, and
they are connected only through the pipes 322 and 332, which
connect the condenser 321 and the evaporator 331. Besides, the
technical features of the evaporator 331, the condenser 321, the
pipes 322 and 332, and the fans 323 and 333 are the same as those
of the evaporator 231, the condenser 221, the pipes 222 and 232,
and the fans 223 and 233 of the first embodiment, so the detailed
descriptions thereof will be omitted.
Third Embodiment
[0035] FIG. 5 is a sectional side view of a heat-exchanged cabinet
structure 4 according to a third embodiment of the present
invention. The heat-exchanged cabinet structure 4 is used to carry
an electronic equipment A. The heat-exchanged cabinet structure 4
includes a main body 41, a first heat exchanger device 42, and a
second heat exchanger device 43. In addition, the heat-exchanged
cabinet structure 4 may further include a heating device and a
control device (not shown). The technical features of the
electronic equipment A, heating device and control device of the
third embodiment are the same as those of the electronic equipment
A, the heating device 24 and the control device 25 of the first
embodiment, so the detailed descriptions thereof will be
omitted.
[0036] The main body 41 has an accommodated space 411, a first
housing 412 and a second housing 413. The first housing 412 and the
second housing 413 are connected to each other. For example, each
of the first housing 412 and the second housing 413 can be a cap, a
rear plate, a side plate, a top plate, or a bottom plate. In this
embodiment, the first housing 412 is disposed adjacent to and
connected to the second housing 413. Besides, the first housing 412
is, for example but not limited to, a cap, and the second housing
413 is correspondingly a top plate. Otherwise, in another aspect,
the first housing 412 is a side plate, and the second housing 413
is a bottom plate connected to the side plate. Alternatively, in
still another aspect, the first housing 412 is a top plate, and the
second housing 413 is a side plate connected to the top plate.
[0037] The electronic equipment A is disposed in the accommodated
space 411. The first heat exchanger device 42 is disposed on the
second housing 413, and the second heat exchanger device 43 is
disposed on the first housing 412 and located adjacent to the first
heat exchanger device 42. In this embodiment, the positions of the
first heat exchanger device 42 and the second heat exchanger device
43 can be flexibly changed based on the heat-dissipation
requirement of the electronic equipment A. Furthermore, since the
first heat exchanger device 42 and the second heat exchanger device
43 are both disposed inside the main body, the assembling dimension
and volume of the heat-exchanged cabinet structure 4 can minimized,
thereby decreasing the manufacturing cost.
[0038] The first heat exchanger device 42 includes a condenser 421,
a pipe 422 and a fan 423. The condenser 421 is connected to the
pipe 422, and the pipe 422 is configured to transfer a fluid (e.g.
a liquid) from the condenser 421 to an evaporator 431. The fan 423
and the condenser 421 are disposed in the second housing 413. The
second heat exchanger device 43 includes the evaporator 431, a pipe
432 and a fan 433. The evaporator 431 is connected to the pipe 432,
and the pipe 432 is configured to transfer a fluid (e.g. a gas)
from the evaporator 431 to the condenser 421. The fan 433 and the
evaporator 431 are disposed in the first housing 412. In this
embodiment, the fans 423 and 433 are, for example, centrifugal
fans. Of course, based on the heat-dissipation requirement of the
electronic equipment A or the positions of the fans 423 and 433,
the fans 423 and 433 can be any applicable fan such as axial flow
fans or oblique flow fans.
[0039] To be noted, the first heat exchanger device 42 and the
second heat exchanger device 43 are individually configured, and
they are connected only through the pipes 422 and 432, which
connect the condenser 421 and the evaporator 431. Besides, the
technical features of the evaporator 431, the condenser 421, the
pipes 422 and 432, and the fans 423 and 433 are the same as those
of the evaporator 231, the condenser 221, the pipes 222 and 232,
and the fans 223 and 233 of the first embodiment, so the detailed
descriptions thereof will be omitted.
[0040] In summary, the first and second heat exchanger devices of
the heat-exchanged cabinet structure are disposed in the
accommodating space of the main body, and located corresponding to
the electronic equipment. The first and second heat exchanger
devices have a condenser and an evaporator, respectively, for
dissipating the heat generated by the electronic equipment, thereby
enhancing the heat-dissipation performance of the heat-exchanged
cabinet structure. Compared with the conventional art, the
heat-exchanged cabinet structure of the invention can improve the
issues of poor heat-dissipation performance and interference of
external environmental factors, and minimize the installation
volume and space so as to decrease the manufacturing cost. In
addition, the installation positions of the first and second
exchanger devices can be flexibly modified according to the
dimension of the electronic equipment or the heat-exchanged cabinet
structure. For example, the first and second exchanger devices are
disposed on two opposite or connected housings of the
heat-exchanged cabinet structure, respectively. These
configurations can also increase the air cycling performance and
thus improve the heat-dissipation performance.
[0041] Although the present invention has been described with
reference to specific embodiments, this description is not meant to
be construed in a limiting sense. Various modifications of the
disclosed embodiments, as well as alternative embodiments, will be
apparent to persons skilled in the art. It is, therefore,
contemplated that the appended claims will cover all modifications
that fall within the true scope of the present invention.
* * * * *