U.S. patent application number 13/447308 was filed with the patent office on 2013-08-15 for heat sink assembly.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is YAO-TING CHANG. Invention is credited to YAO-TING CHANG.
Application Number | 20130206380 13/447308 |
Document ID | / |
Family ID | 48944646 |
Filed Date | 2013-08-15 |
United States Patent
Application |
20130206380 |
Kind Code |
A1 |
CHANG; YAO-TING |
August 15, 2013 |
HEAT SINK ASSEMBLY
Abstract
A heat sink assembly includes a heat sink, a base, and a number
of fasteners. The heat sink includes a bottom plate defining a
number of holes. The base is mounted to a bottom of the bottom
plate. A number of through holes aligning with the holes of the
bottom plate are defined in the base. A number of tapered guiding
surfaces is formed on a bottom of the base. Each guiding surface
bounds a corresponding one of the through holes. A diameter of each
guiding surface gradually increases in a downward direction,
facilitates the entry of securing screws. The fasteners are mounted
to the heat sink. Bottoms of the fasteners are respectively
extended through the holes of the heat sink and received in the
through holes of the base. An internally-threaded hole is defined
in a bottom of each fastener.
Inventors: |
CHANG; YAO-TING; (Tu-Cheng,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CHANG; YAO-TING |
Tu-Cheng |
|
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
48944646 |
Appl. No.: |
13/447308 |
Filed: |
April 16, 2012 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H01L 23/4093 20130101;
H01L 23/4006 20130101; H01L 2924/0002 20130101; H01L 23/3672
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 9, 2012 |
TW |
101104147 |
Claims
1. A heat sink assembly, comprising: a heat sink comprising a
bottom plate defining a plurality of holes; a base mounted to a
bottom of the bottom plate, wherein a plurality of through holes is
defined in the base respectively aligning with the holes of the
bottom plate, a plurality of tapered guiding surfaces is formed on
a bottom of the base, each guiding surface bounds a corresponding
one of the through holes, and a diameter of each guiding surface
gradually increases in a downward direction; and a plurality of
fasteners mounted to the heat sink, wherein bottoms of the
fasteners are respectively extended through the holes of the heat
sink and received in the through holes of the base, and an
internally-threaded hole is defined in a bottom of each
fastener.
2. The heat sink assembly of claim 1, wherein the base comprises
two opposite ends, a inward-pointing hook extends up from each end,
the hooks of the base engage with tops of opposite ends of the
bottom plate.
3. The heat sink assembly of claim 1, wherein each fastener
comprises a head, and a pole perpendicularly extending down from a
middle of a bottom of the head, the threaded hole of the fastener
is defined in a bottom end of the pole.
4. The heat sink assembly of claim 3, further comprising a
plurality of springs and a plurality of snap rings, wherein a
circumferential groove is defined in each pole adjacent to the
bottom end of the pole, the springs are respectively placed around
the poles on the bottom plate, and the snap rings are respectively
engaged in the circumferential grooves of the poles and abut
against a bottom surface of the bottom plate.
5. The heat sink assembly of claim 4, wherein a plurality of
recesses is defined in a top of the base to respectively receive
the snap rings, the through holes respectively extend through
middles of the recesses.
6. The heat sink assembly of claim 3, further comprising a
plurality of springs, a plurality of ring-shaped gaskets, and a
plurality of snap rings, wherein a circumferential groove is
defined in each pole adjacent to the bottom end of the pole, the
springs are respectively placed around the poles over the bottom
plate, the gaskets are respectively placed around the poles and
sandwiched between the springs and a top of the bottom plate, the
snap rings are respectively engaged in the circumferential grooves
of the poles and abut against a bottom surface of the bottom
plate.
7. The heat sink assembly of claim 6, wherein a plurality of
recesses is defined in a top of the base to respectively receive
the snap rings, the through holes respectively extend through
middles of the recesses.
8. The heat sink assembly of claim 3, wherein a plurality of posts
are perpendicularly formed on the bottom of the base respectively
aligning with the through holes, the through holes respectively
extend through the posts, and the guiding surfaces are respectively
formed on bottom ends of the posts, bounding the corresponding
through holes.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to a heat sink assembly.
[0003] 2. Description of Related Art
[0004] A motherboard may include a number of screws to facilitate
the attachment of a heat sink. To fix the heat sink to the
motherboard, a number of fasteners each defining a threaded hole
are extended through the heat sink and engage with the screws.
However, in assembly, the fasteners must first be aligned with the
corresponding screws, which may involve some wasted time and is
troublesome.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, all the views
are schematic, and like reference numerals designate corresponding
parts throughout the several views.
[0006] FIG. 1 is an exploded, isometric view of an exemplary
embodiment of a heat sink assembly.
[0007] FIG. 2 is a partially assembled, isometric view of the heat
sink assembly of FIG. 1 from another perspective.
[0008] FIG. 3 is an assembled, isometric view of the heat sink
assembly of FIG. 2.
[0009] FIG. 4 is similar to FIG. 3, but viewed from another
perspective.
DETAILED DESCRIPTION
[0010] The disclosure, including the accompanying drawings, is
illustrated by way of example and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0011] FIGS. 1 and 2 show an exemplary embodiment of a heat sink
assembly including a heat sink 10, a hollow base 20, four fasteners
30, four springs 40, four ring-shaped gaskets 50, and four snap
rings 60.
[0012] The heat sink 10 includes a bottom plate 12, and a plurality
of fins 14 formed on the bottom plate 12. The bottom plate 12
includes four corners, and a hole 121 is defined in each of the
four corners of the bottom plate 12.
[0013] The base 20 includes four corners, and a circular recess 21
is defined in each of the tops of the four corners of the base 20.
Four posts 23 are perpendicularly formed on the bottom of the base
20, respectively under the recesses 21. A through hole 231 is
defined in each post 23 extending in an axial direction of the post
23 through a middle of the corresponding recess 21. A tapered
guiding surface 233 is formed on the bottom of each post bounding
the bottom end of the corresponding through hole 231. A diameter of
each tapered guiding surface 233 gradually increases in a downward
direction. The base 20 includes two opposite ends 25. Two
inward-pointing hooks 26 extend up from each end 25.
[0014] Each fastener 30 includes a head 31, and a pole 32
perpendicularly extending down from a middle of the bottom of the
head 31. A circumferential groove 321 is defined in the pole 32
adjacent to the bottom end of the pole 32. A internally-threaded
hole 324 is defined in a middle of the bottom end of the pole
32.
[0015] In assembly, the springs 40 are placed around the poles 32.
The gaskets 50 are placed around the poles 32, abutting against the
springs 40 and holding them captive. The fasteners 30 are placed in
the holes 121 and the poles 32 extend through the holes 121. The
snap rings 60 are snapped into the circumferential grooves 321 to
hold the fasteners 30 captive in the bottom plate 12. Thereby, the
fasteners 30 are fixed to the heat sink 10. Each spring 40 is
sandwiched between a head 31 and a gasket 50. Under the resilient
force of the springs 40, the gaskets 50 press against the top
surface of the bottom plate 12, and the fasteners 30 are pulled up
until the snap rings 60 abut the bottom surface of the bottom plate
12.
[0016] Referring to FIGS. 3 and 4, the base 20 is placed under the
heat sink 10 and the poles 32 aligned with the through holes 231.
The base 20 and bottom plate 12 are manipulated to engage the hooks
26 with the tops of opposite ends of the bottom plate 12, and to
locate the poles 32 in the through holes 231. The snap rings 60 are
received in the recesses 21. Thereby, the heat sink assembly is
assembled.
[0017] In mounting the heat sink assembly to a motherboard using
four screws (not shown), the tapered guiding surfaces 233 functions
as a guide whereby the four screws automatically enter the through
holes 231 to engage in the threaded holes 324, which will make the
installation of the heat sink 10 significantly more convenient.
[0018] The posts 23 are not a fundamental requirement in other
embodiments, the through holes 231 and the tapered guiding surfaces
233 may be directly defined in the bottom of the base 20.
[0019] Even though numerous characteristics and advantages of the
embodiments have been set forth in the foregoing description,
together with details of the structure and the functions of the
embodiments, the disclosure is illustrative only, and changes may
be made in details, especially in the matters of shape, size, and
arrangement of parts within the principles of the embodiments to
the full extent indicated by the broad general meaning of the terms
in which the appended claims are expressed.
* * * * *