U.S. patent application number 13/763164 was filed with the patent office on 2013-08-15 for heat dissipating module.
This patent application is currently assigned to ASUSTEK COMPUTER INC.. The applicant listed for this patent is ASUSTEK COMPUTER INC.. Invention is credited to Meng-Ping CHEN, Ching HO.
Application Number | 20130206367 13/763164 |
Document ID | / |
Family ID | 47720359 |
Filed Date | 2013-08-15 |
United States Patent
Application |
20130206367 |
Kind Code |
A1 |
CHEN; Meng-Ping ; et
al. |
August 15, 2013 |
HEAT DISSIPATING MODULE
Abstract
A heat dissipating module includes a base, at least one thermal
conductive element, at least one liquid-pipe and a heat sink. The
thermal conductive element is disposed at the base. The liquid-pipe
is disposed adjacent to the thermal conductive element. The
liquid-pipe is disposed at the base. The heat sink covers the
thermal conductive element and the liquid-pipe. A part of the heat
sink is connected to the base. The heat sink includes a plurality
of fins. The heat dissipating module combines air-cooling with
water-cooling so as to enhance thermal conductivity.
Inventors: |
CHEN; Meng-Ping; (Taipei,
TW) ; HO; Ching; (Taipei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASUSTEK COMPUTER INC.; |
|
|
US |
|
|
Assignee: |
ASUSTEK COMPUTER INC.
Taipei
TW
|
Family ID: |
47720359 |
Appl. No.: |
13/763164 |
Filed: |
February 8, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61597844 |
Feb 13, 2012 |
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Current U.S.
Class: |
165/104.19 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; F28D 15/0275 20130101; F28F 1/12 20130101;
H01L 2924/0002 20130101; F28F 3/02 20130101; H01L 23/473 20130101;
H01L 2924/00 20130101 |
Class at
Publication: |
165/104.19 |
International
Class: |
F28F 3/02 20060101
F28F003/02 |
Claims
1. A heat dissipating module disposed at a circuit board,
comprising: a base; at least a thermal conductive element disposed
at the base; at least a liquid-pipe adjacent to the thermal
conductive element and disposed at the base; and a heat sink
covering the thermal conductive element and the liquid-pipe,
wherein at least a part of the heat sink is connected to the base,
and the heat sink includes a plurality of fins.
2. The heat dissipating module according to claim 1, wherein two
ends of the liquid-pipe have a joint, respectively.
3. The heat dissipating module according to claim 1, wherein the
thermal conductive element includes a heat pipe or a thermal
conductive sheet.
4. The heat dissipating module according to claim 1, wherein the
base includes at least two recesses, the recesses contact with and
accommodate the thermal conductive element and the liquid-pipe,
respectively, and the recesses are disposed at a same surface with
the base.
5. The heat dissipating module according to claim 1, wherein the
heat dissipating module further includes: a liquid cooling set
connected to the liquid-pipe.
6. The heat dissipating module according to claim 1, wherein the
fins includes at least two recesses, and the recesses contact with
the thermal conductive element and the liquid-pipe,
respectively.
7. The heat dissipating module according to claim 1, wherein the
liquid-pipe is integrally formed along three directions of an x-y-z
coordinate.
8. A heat dissipating module disposed at a circuit board,
comprising: a base; at least a thermal conductive element disposed
at the base; a heat sink covering the thermal conductive element,
wherein at least a part of the heat sink is connected to the base,
the heat sink includes a plurality of fins, and the fins includes
multiple recesses, respectively; and at least a liquid-pipe
disposed in the recesses of the fins, wherein the recesses of the
heat sink cover the thermal conductive element and the
liquid-pipe.
9. The heat dissipating module according to claim 8, wherein two
ends of the liquid-pipe have a joint, respectively.
10. The heat dissipating module according to claim 8, wherein the
thermal conductive element includes a heat pipe or a thermal
conductive sheet.
11. The heat dissipating module according to claim 8, wherein the
base includes at least a recess, and the recess contacts with and
accommodates the thermal conductive element.
12. The heat dissipating module according to claim 8, wherein the
heat dissipating module further includes: a liquid cooling set
connected to the liquid-pipe.
13. The heat dissipating module according to claim 8, wherein the
recess of the heat sink contacts with the liquid-pipe.
14. The heat dissipating module according to claim 8, wherein the
liquid-pipe is integrally formed along three directions of an x-y-z
coordinate.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of U.S.
provisional patent application Ser. No. 61/597,844, filed on Feb.
13, 2012. The entirety of the above-mentioned patent application is
hereby incorporated by reference herein and made a part of
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a heat dissipating module and, more
particularly, to a heat dissipating module combining air-cooling
and water-cooling.
[0004] 2. Description of the Related Art
[0005] As execution efficiency and functions of a computer are
improved and processing speed enhances, the central processing unit
(CPU) or other electronic elements at a motherboard generates more
heat due to high frequency oscillation and electromagnetic effect
after a long time usage. If the heat is not dissipated instantly,
the electronic elements may be damaged or affected.
[0006] Conventionally, a heat dissipater is disposed at a heat
source to conduct the heat from the heat source to fins of the heat
dissipater, and then cool air is blown to the fins of the heat
dissipater and the heat is brought out via a fan and air
circulation. The heat dissipater includes a base connecting to the
electronic elements and a plurality of the fins disposed at the
base. The base is usually a smooth metal plate which can conduct
heat. The base contacts with the surface of the electronic elements
to absorb the heat from the electronic elements, and the heat is
conducted to the fins for dissipating. However, the heat dissipater
is limited by the inner height and the weight of the system.
Furthermore, when it is applied to a CPU with a high wattage (such
as 130 W or more), a fan with higher rotating speed is needed, the
noise is too loud and the heat dissipating efficiency is poor.
[0007] Furthermore, a water-cooling method cooperating with a pump
for circulating hot and cold water is also used to dissipate heat.
However, in a high-level system or electronic device, the heat
dissipating effect of air-cooling or liquid cooling is limited due
to the device size and the using circumstance.
BRIEF SUMMARY OF THE INVENTION
[0008] A heat dissipating device applied to an electronic device is
disclosed. The heat dissipating device simplifies elements in a
conventional heat dissipating module, and combines air-cooling with
liquid cooling in a limited space to improve the whole heat
dissipating efficiency and maintain the working performance of the
electronic device effectively.
[0009] A heat dissipating module includes a base, at least a
thermal conductive element, at least a liquid-pipe and a heat sink.
The thermal conductive element is disposed at the base. The
liquid-pipe is adjacent to the thermal conductive element and is
disposed at the base. The heat sink covers the thermal conductive
element and the liquid-pipe. At least a part of the heat sink is
connected to the base. The heat sink includes a plurality of fins.
The heat dissipating module is disposed at a circuit board.
[0010] A heat dissipating module includes a base, at least a
thermal conductive element, a heat sink and at least a liquid-pipe.
The thermal conductive element is disposed at the base. The heat
sink covers the thermal conductive element and at least a part of
the heat sink is connected to the base. The heat sink includes a
plurality of fins. The fins include at least a recess,
respectively. The liquid-pipe is disposed in the recess of the
fins. Two sides of the heat sink cover the thermal conductive
element and the liquid-pipe, respectively.
[0011] The heat dissipating module includes the thermal conductive
element and the liquid-pipe in a limited space instead of including
only the air-cooling device or the water-cooling device to increase
heat dissipating speed greatly. Moreover, the heat dissipating
module has more heat dissipating paths, which further improves heat
dissipating efficiency.
[0012] These and other features, aspects and advantages of the
present invention will become better understood with regard to the
following description, appended claims, and accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1A is an exploded diagram showing a heat dissipating
module in a first embodiment;
[0014] FIG. 1B is an schematic diagram showing the assembled heat
dissipating module in FIG. 1A;
[0015] FIG. 1C is a sectional schematic diagram showing the heat
dissipating module in FIG. 1B;
[0016] FIG. 2 is a sectional schematic diagram showing a heat
dissipating module in a second embodiment;
[0017] FIG. 3A is a schematic diagram showing an electronic device
applying a heat dissipating module in an embodiment;;
[0018] FIG. 3B is an exploded diagram showing an electronic device
applying a heat dissipating module in an embodiment;
[0019] FIG. 4A is an exploded diagram showing a heat dissipating
module in a third embodiment;
[0020] FIG. 4B is a schematic diagram showing the assembled heat
dissipating module in FIG. 4A;
[0021] FIG. 5A is an exploded diagram showing a heat dissipating
module in a fourth embodiment; and
[0022] FIG. 5B is a schematic diagram showing the assembled heat
dissipating module in FIG. 5A.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] A heat dissipating module is illustrated with relating
figures, and the same symbols denote the same components.
[0024] FIG. 1A is an exploded diagram showing a heat dissipating
module in a first embodiment, and FIG. 1B is an schematic diagram
showing the assembled heat dissipating module in FIG. 1A. Please
refer to FIG. 1A and FIG. 1B, the heat dissipating module A
includes a base 1, at least a thermal conductive element T. In the
embodiment, the thermal conductive element includes a heat pipe 2,
at least a liquid-pipe 3 and a heat sink 4. The heat pipe 2
including the thermal conductive element T is taken as an example.
The heat dissipating module A is disposed at a circuit board or
other heat sources (such as an electronic element) via the base 1.
The structure and components of the heat dissipating module A are
illustrated first, and practical usage of the heat dissipating
module A with the electronic device would be described later.
[0025] As shown in FIG. 1A and FIG. 1B, the heat pipe 2 and the
liquid-pipe 3 are adjacently disposed at a same surface of the base
1. The base 1 may be made of high thermal conductive material, such
as copper, silver, aluminum or alloy, which is not limited herein.
The bottom of the base 1 contacts with a heat source of the
electronic device, such as a CPU, a chipset or a passive
element.
[0026] The heat from the heat source of the electronic device is
conducted via the base 1, and the base 1 may accommodate the heat
pipe 2 and the liquid-pipe 3 to increase contacting area
therebetween, so that the heat can be conducted and dissipated
evenly and rapidly via the heat pipe 2 and the liquid-pipe 3.
[0027] The base 1 includes two recesses 11, and the two recesses 11
contact with and accommodate the heat pipe 2 and the liquid-pipe 3,
respectively. The two recesses 11 are disposed at a same side of
the base 1, and the heat pipe 2 and the liquid-pipe 3 are disposed
in the two recesses 11 of the base 1, respectively. The side for
the recesses 11 is opposite to that of the heat source. The
recesses 11 of the base 1 accommodate a part of the heat pipe 2 and
the liquid-pipe 3, fix them in the base 1, and increase the
contacting area therebetween, so as to improve the heat conducting
efficiency.
[0028] In the embodiment, the heat pipe 2 is a long, thin, hollow
metal pipe with two closed ends. The shape and size of the heat
pipe 2 are not limited and determined by the circumstance,
disposing space, heat conduction and temperature or others. An
inner wall of the heat pipe 2 includes wick structures which have
liquid inside, and the liquid is called working medium of the heat
pipe.
[0029] The liquid-pipe 3 is also a hollow pipe and has a smooth
inner wall. In the embodiment, the liquid-pipe 3 may also include
wick structures to improve water-cooling effect, which is not
limited herein. Other pipes which have cooling liquid flowing
inside are also within the scope.
[0030] The heat pipe 2 and the liquid-pipe 3 may be welded onto the
base 1. Solder, a tin bar or solder paste may be put in the
recesses 11 of the base 1 first, and then the heat pipe 2 and the
liquid-pipe 3 are put into the recesses 11 of the base 1 for
welding, which is not limited herein. The heat pipe and the
liquid-pipe also may be fixed to the base in other methods.
[0031] In the embodiment, two ends of the liquid-pipe 3 include a
joint 31, respectively. The joint 31 may be welded to the ends of
the liquid-pipe 3, and the liquid-pipe 3 can be connected to a
water-cooling element (such as a water tank or a pump) via the
joint 31. The liquid-pipe is integrally formed along three
directions of an x-y-z coordinate. The joint 31 may also be fixed
at the ends of the liquid-pipe 3 by inserting or locking, which is
not limited herein.
[0032] The heat sink 4 covers the heat pipe 2 and the liquid-pipe
3. The heat sink 4 includes a plurality of fins 41. The fins 41
include at least two recesses 411, respectively. The recesses 411
of the fins 41 cover and contact with the heat pipe 2 and the
liquid-pipe 3, respectively. The recesses 411 of the fins 41
accommodate a part of the heat pipe 2 and the liquid-pipe 3 to
increase the contacting area therebetween and improve the heat
conducting efficiency, which is the same as the recesses 11 of the
base 1. The fins 41 may be made by aluminum extrusion or aluminum
die-casting, which is not limited herein.
[0033] In FIG. 1A and FIG. 1B, the fins 41 are arranged at
intervals obliquely to form the heat sink 4, but the number, the
size and arrangement of the fins 41 are not limited. The fins 41
may be also arranged at intervals horizontally or vertically to
form the heat sink according to the structure of the electronic
device, layout of other elements and the whole heat dissipating
requirements.
[0034] In the embodiment, at least a part of the heat sink 4 is
connected to the base 1, and it may be welded onto the heat pipe 2,
the liquid-pipe 3 and the base 1. The heat sink 4 may also be
disposed at the heat pipe 2, the liquid-pipe 3 and the base 1 via
inserting, locking, fixing or pasting, which is not limited
herein.
[0035] FIG. 1C is a sectional schematic diagram showing the heat
dissipating module in FIG. 1B. The heat dissipating module A with a
heat source S is used to illustrate the heat conducting path. In
the embodiment, the heat pipe 2 does not contact with the
liquid-pipe 3. The heat source S (such as a CPU) gives out heat.
When the base 1 contacts with the heat source S at a higher
temperature, the heat conducting starts. After the heat is
conducted from the heat source S to the base 1, it is conducted to
the heat pipe 2 and the liquid-pipe 3.
[0036] As stated above, the heat is conducted to the heat pipe 2
via a path L1, and transferred to the liquid-pipe 3 via a path L2
at the same time. After the heat is conducted to the heat pipe 2
via the path L1, it can be further conducted to the fins 41 via a
path L3, and it is dissipated via other heat dissipaters (such as a
fan). The heat conducted to the fins 41 can not only be dissipated
via air-cooling, but also conducted to the liquid-pipe 3 via a path
L4 in a water-cooling manner.
[0037] The heat conducting medium for heat transferring through can
be reduced via the structure that the heat pipe 2 adjacent to the
liquid-pipe 3, and the heat dissipating paths are increased to
improve the heat dissipating efficiency. Moreover, the size of the
heat dissipating module can be reduced, and thus the space in the
electronic device for disposing the heat dissipating module is
saved.
[0038] FIG. 2 is a sectional schematic diagram showing a heat
dissipating module in a second embodiment. In the embodiment, the
heat dissipating module A' has similar structures and features with
that of the heat dissipating module A, and the difference is that
the heat pipe 2' disposed at the base 1' contacts with the
liquid-pipe 3'. The heat conducting paths from the heat source S to
the heat dissipating module A' are similar to the paths in the
above embodiment, and they further include a path L5. Moreover, the
heat pipe 2' is taken as an example of the thermal conductive
element T in the embodiment.
[0039] Since the heat pipe 2' contacts with the liquid-pipe 3', the
heat can be conducted from the heat pipe 2' to the liquid-pipe 3'
via the path L5 directly, and it does not need to be conducted from
the fins 41' of the heat sink 4' to the liquid-pipe 3' via the path
L3 and the path L4. Thus, the heat passes through less conducting
medium and the heat dissipating path is further shortened, which
improves the whole heat dissipating efficiency.
[0040] FIG. 3A is a schematic diagram showing an electronic device
applying a heat dissipating module in an embodiment, and FIG. 3B is
an exploded diagram showing an electronic device applying a heat
dissipating module in an embodiment.
[0041] As shown in FIG. 3A and FIG. 3B, the electronic device E at
least includes a circuit board I and at least a heat dissipating
module A. The heat dissipating module A has a similar structure and
features with that of the heat dissipating module in the above
embodiment, which is omitted herein. The heat dissipating module A
is disposed at the electronic elements d at the circuit board I,
and contacts with the electronic elements d. In the embodiment, the
electronic device E may be a motherboard or an electronic device
which includes heat sources, which is not limited herein. Since the
electronic elements d give out heat in operation, the heat
dissipating module A dissipates the heat from the electronic
elements d to maintain normal operation temperature.
[0042] In the embodiment, the heat dissipating module A further
includes a liquid cooling set 5. The liquid cooling set 5 is
connected to the joint 31 of the liquid-pipe 3 via a pipe P. The
liquid cooling set 5 includes a liquid container (such as a water
tank) and a pump. The liquid-pipe 3 is connected to the liquid
cooling set 5, and drives the liquid inside to flow via the pump in
the liquid cooling set 5, so as to form a water-cooling circulation
mechanism.
[0043] In the embodiment, the liquid-pipe 3 is connected to the
liquid cooling set 5 via the joint 31 and the pipe P. Furthermore,
an end of the heat sink 4 has a hole 42. The joint 31 and the hole
42 can fix the heat sink 4 on the heat pipe 2 and the liquid-pipe 3
via locking, so as to increase the contacting area between the fins
41, the heat pipe 2 and the liquid-pipe 3 to improve the heat
dissipating effect. The joint 31 may be combined with the hole 42
via inserting or locking to fix the liquid-pipe and the fins, and
the joint 31 may be a quick-release joint, which is not limited
herein.
[0044] The heat dissipating module A is directly disposed at the
electronic elements d, and connected to the electronic elements d
via the base 1. The connecting method may be locking, inserting or
welding, which is not limited herein. The size, the number of the
heat pipe 2 and the liquid-pipe 3, and the connection therebetween
are determined by heat dissipating requirements and the structure
of the electronic device. The electronic device may further include
other heat dissipating elements, such as a fan.
[0045] FIG. 4A is an exploded diagram showing a heat dissipating
module in a third embodiment, and FIG. 4B is a schematic diagram
showing the assembled heat dissipating module in FIG. 4A. As shown
in FIG. 4A and FIG. 4B, in the embodiment, the heat dissipating
module Al has a similar structure and features with that of the
heat dissipating module A in the above embodiment. The difference
is that the thermal conductive element includes a thermal
conductive sheet 6. The thermal conductive sheet 6 is taken as an
example of the thermal conductive element T. The thermal conductive
sheet 6 is adjacent to the liquid-pipe 3 and disposed at the base
1a. The heat sink 4a includes a recess 411 and the base 1a includes
a recess 11, and the recesses contact with and accommodate the
liquid-pipe 3. The heat from the base 1a can be conducted to the
fins 41a more evenly via the thermal conductive sheet 6, so as to
improve the heat dissipating effect.
[0046] The thermal conductive sheet 6 may be a rectangular sheet
made of heat conductive material (such as metal or alloy), and its
size can be adjusted according to the heat dissipating
requirements. The thermal conductive sheet 6 may be integrally
formed with the base 1a, which is not limited herein, and thus the
heat passes through less medium and the heat dissipating efficiency
is improved.
[0047] FIG. 5A is an exploded diagram showing a heat dissipating
module in a fourth embodiment, and FIG. 5B is a schematic diagram
showing the assembled heat dissipating module in FIG. 5A. In the
embodiment shown in FIG. 5A and FIG. 5B, the heat dissipating
module A2 includes similar elements with those of the heat
dissipating module A in the above embodiment. The difference is
that the base 1b includes at least a recess 11 which contacts with
and accommodates the thermal conductive element T. In the
embodiment, the thermal conductive element T is the heat pipe 2,
and the disposing side of the recess 11 is opposite to that of the
heat source. The heat sink 4b is disposed on the heat pipe 2 and
covers the heat pipe 2. The heat sink 4b includes at least two
recesses 411b and 412b. The recesses 411b and 412b are disposed at
two opposite sides of the heat sink 4b. The recess 411b is disposed
at a first surface of the fins near the heat pipe 2, and the heat
sink 4b at least accommodates a part of the heat pipe 2 via the
recesses 411b. The recess 412b disposed at a second surface of the
heat sink 4b accommodates the liquid-pipe 3, and the heat pipe 2
and the liquid-pipe 3 contact with the fins 41b. Thus, the
contacting area between the heat pipe 2 and the fins 41b, between
the liquid-pipe 3 and the fins 41b is increased, and the heat
conducting efficiency therebetween is improved.
[0048] In the embodiment, the connections between the base 1b and
the heat pipe 2, the heat pipe 2 and the heat sink 4b, the heat
sink 4b and the liquid-pipe 3 may be via welding, pasting or screw
locking, which is not limited herein.
[0049] In sum, the heat dissipating module applied to the
electronic device combines the air-cooling and the water-cooling.
The heat dissipating module conducts heat from the heat source
(such as an electronic element) to a side opposite to that of the
heat source evenly via the thermal conductive sheet, the heat is
further conducted to the fins along the path of the heat pipe via
the structure of the heat pipe and the liquid-pipe, and a heat
dissipater (such as a fan) also may be used to dissipate the heat
in cooperation. The heat dissipating module also includes multiple
heat conducting paths including a path from the base to the
liquid-pipe, a path from the heat pipe to the fins, and a path from
the fins to the liquid-pipe. After the heat is conducted to the
liquid-pipe, the liquid absorbing the heat inside flows to form a
circulation and takes the heat away.
[0050] Although the present invention has been described in
considerable detail with reference to certain preferred embodiments
thereof, the disclosure is not for limiting the scope. Persons
having ordinary skill in the art may make various modifications and
changes without departing from the scope. Therefore, the scope of
the appended claims should not be limited to the description of the
preferred embodiments described above.
* * * * *