U.S. patent application number 13/553034 was filed with the patent office on 2013-08-08 for test system with test trays and automated test tray flipper.
The applicant listed for this patent is Peter G. Panagas. Invention is credited to Peter G. Panagas.
Application Number | 20130200912 13/553034 |
Document ID | / |
Family ID | 47891914 |
Filed Date | 2013-08-08 |
United States Patent
Application |
20130200912 |
Kind Code |
A1 |
Panagas; Peter G. |
August 8, 2013 |
Test System With Test Trays and Automated Test Tray Flipper
Abstract
A test system may be provided in which devices under test (DUTs)
are loaded into test trays. Test trays may be moved between test
stations using a conveyor belt. The test system may include loading
equipment for placing test trays on the conveyor belt at desired
intervals. Each test tray may be tested using test stations
positioned along the conveyor belt. A first group of test stations
may be configured to test DUTs in their upright orientation,
whereas a second group of test stations may be configured to test
DUTs in their inverted orientation. Test tray flipping equipment
may be interposed between the first and second groups of test
stations. The flipping equipment may include a movable arm
configured to receive an incoming tray, grab the tray, lift the
tray from the conveyor belt, rotate the tray, and drop off the tray
back onto the conveyor belt.
Inventors: |
Panagas; Peter G.; (Santa
Clara, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Panagas; Peter G. |
Santa Clara |
CA |
US |
|
|
Family ID: |
47891914 |
Appl. No.: |
13/553034 |
Filed: |
July 19, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61595572 |
Feb 6, 2012 |
|
|
|
Current U.S.
Class: |
324/756.01 |
Current CPC
Class: |
G01R 1/0441 20130101;
G06F 2203/04103 20130101; H01L 2924/0002 20130101; G06F 3/044
20130101; G01R 31/2893 20130101; H01L 21/67727 20130101; H04M 1/24
20130101; G01R 31/01 20130101; H01L 2924/0002 20130101; H01L
2924/00 20130101 |
Class at
Publication: |
324/756.01 |
International
Class: |
G01R 31/02 20060101
G01R031/02 |
Claims
1. A method for using a test system to test a device under test,
wherein the test system includes a conveyor belt, the method
comprising: with a flipper arm, picking up the device under test
from the conveyor belt; while the flipper arm is holding the device
under test, inverting device under test by rotating the flipper
arm; and with the flipper arm, dropping off the inverted device
under test onto the conveyor belt.
2. The method defined in claim 1, wherein the device under test
comprises a handheld electronic device.
3. The method defined in claim 1, further comprising: while the
flipper arm is holding the device under test, raising the device
under test to a predetermined height above the conveyor belt before
inverting the device under test.
4. The method defined in claim 1, wherein the device under test is
placed within a test tray, and wherein picking up the device under
test comprises picking up the test tray from the conveyor belt with
the flipper arm.
5. The method defined in claim 1, wherein the device under test is
placed within a test tray having test tray engagement features,
wherein the flipper arm includes flipper arm engagement features,
and wherein picking up the device under test comprises mating the
flipper arm engagement features with the test tray engagement
features to hold the test tray within the flipper arm.
6. The method defined in claim 5, wherein the flipper arm
engagement features comprises pins, wherein the test tray
engagement features comprise holes, and wherein mating the flipper
arm engagement features with the test tray engagement features
comprises inserting the pins in the flipper arm into corresponding
holes in the test tray.
7. The method defined in claim 1, further comprising: detecting the
device under test on the conveyor belt with a sensor, wherein
picking up the device under test from the conveyor belt comprises
lowering the flipper arm to receive the device under test in
response to detection of the device under test using the
sensor.
8. The method defined in claim 7, wherein the device under test is
placed within a test tray, wherein the sensor comprises a
radio-frequency identification sensor, and wherein detecting the
incoming device under test on the conveyor belt comprises
identifying a serial number associated with the test tray with the
radio-frequency identification sensor.
9. The method defined in claim 1, wherein the device under test is
placed within a test tray, wherein the flipper arm includes flipper
arm engagement features, and wherein the test tray includes test
tray engagement features, the method comprising: detecting whether
the device under test has been successfully received by the flipper
arm with a sensor, wherein picking up the device under test from
the conveyor belt comprises engaging the flipper arm engagement
features with the test tray engagement features in response to
detecting that the device under test has been successfully received
by the flipper arm.
10. The method defined in claim 1, wherein the test system further
includes a computer-controlled actuator, and wherein inverting
device under test comprises rotating the flipper arm with the
computer-controlled actuator while the flipper arm is holding the
device under test.
11. A method for using a test system to test a device under test,
wherein the test system includes a conveyor belt, the method
comprising: with a first group of test equipment stationed along
the conveyor belt, testing the device under test when the device
under test is oriented in an upright position on the conveyor belt;
with a second group of test equipment stationed along the conveyor
belt, testing the device under test when the device under test is
oriented in an inverted position on the conveyor belt; and with
flipper equipment interposed between the first and second groups of
test equipment along the conveyor belt, flipping the device under
test from the upright position to the inverted position.
12. The method defined in claim 11, wherein the device under test
comprises a handheld electronic device.
13. The method defined in claim 11, further comprising: installing
the device under test within a test tray.
14. The method defined in claim 13, wherein the flipper equipment
includes a flipper arm, and wherein flipping the device under test
comprises: with the flipper arm, receiving the test tray; with the
flipper arm, latching onto the received test tray; and while the
test tray is latched to the flipper arm, inverting the test tray by
rotating the flipper arm so that the device is under test is
flipped from its upright position to its inverted position.
15. The method defined in claim 14, further comprising: with a
first sensor associated with the flipper equipment, detecting the
test tray on the conveyor belt; in response to detection of the
test tray with the first sensor, lowering the flipper arm to
receive the test tray; and with a second sensor associated with the
flipper equipment, detecting whether the device under test has been
successfully received by the flipper arm, wherein latching onto the
received test tray comprises latching onto the received test tray
in response to detecting that the test tray has been successfully
received by the flipper arm.
16. Apparatus configured to flip a test tray containing a device
under test on a conveyor belt, comprising: a flipper arm configured
to pick up the test tray from the conveyor belt; a pivot about
which the flipper arm is configured to rotate and invert the test
tray; and an actuator configured to lower the flipper arm and the
inverted test tray to the conveyor belt.
17. The apparatus defined in claim 16, wherein the device under
test comprises a handheld electronic device.
18. The apparatus defined in claim 16, wherein the test tray
includes test tray engagement features, and wherein the flipper arm
includes flipper arm engagements features configured to mate with
test tray engagement features.
19. The apparatus defined in claim 16, further comprising: a
radio-frequency identification sensor configured to identify a
serial number associated with the test tray.
20. The apparatus defined in claim 16, further comprising: an
optical sensor configured to detect whether the device under test
has been successfully received by the flipper arm.
Description
[0001] This application claims the benefit of provisional patent
application No. 61/595,572, filed Feb. 6, 2012, which is hereby
incorporated by reference herein in its entirety.
BACKGROUND
[0002] This relates generally to automation, and more particularly,
to automated equipment for use in manufacturing operations such as
testing.
[0003] Electronic devices are often tested following assembly to
ensure that device performance meets design specifications. For
example, a device may be tested at a series of test stations to
ensure that components and software in the device are operating
satisfactorily. At each test station, an operator may couple a
device to test equipment using a cable. Following successful
testing at all test stations, a device may be shipped to an end
user.
[0004] The process of attaching and detaching test cable connectors
and the manual operations associated with performing tests at test
stations can be cumbersome and burdensome to test system operators.
If care is not taken, tests may be less accurate and more time
consuming than desired.
[0005] It would therefore be desirable to be able to provide
improved ways of performing manufacturing operations such as
testing operations on electronic devices.
SUMMARY
[0006] A test system may be provided in which devices under test
are loaded into test trays. Test trays in the test system may be
tested at test stations. A conveyor belt may be used to move test
trays from one test station to another. Each test station may
include test equipment for performing desired tests on the devices
under test.
[0007] The test system may include a first group of test stations
configured to test devices oriented in an upright position, a
second group of test stations configured to test devices oriented
in an inverted position, and test tray flipping equipment
interposed between the first and second groups of test stations
along the conveyor belt.
[0008] The test tray flipping equipment may include a first sensor
(e.g., a radio-frequency identification sensor), a second sensor
(e.g., a light-based sensor), a flipper arm, and associated
computer-controlled positioned for moving the flipper arm. The
first sensor may be used to detect a serial number associated with
the test trays, whereas the second sensor may be used to determine
whether an incoming test tray has been successfully received by the
flipper arm.
[0009] In response to detecting an incoming test tray that needs to
be flipped using the first sensor, the flipper arm may be lowered
towards the surface of the conveyor belt to receive the incoming
test tray. When the second sensor detects that the test tray has
been successfully received within the flipper arm, the flipper arm
may latch onto the test tray (e.g., by engaging flipper arm
engagement features with corresponding test tray engagement
features in the received test tray). While the test tray is latched
within the flipper arm, the test tray may be raised to a
predetermined height above the conveyor belt. The test tray may
then be inverted by rotating the flipper arm about a pivot axis.
The test tray may be rotated by 180.degree., 90.degree.,
270.degree., 120.degree., 135.degree., or by other suitable number
of degrees to change the orientation of the test tray under test.
The flipper arm may then drop off the inverted test tray onto the
conveyor belt and return to a standby position above the conveyor
belt.
[0010] Further features of the present invention, its nature and
various advantages will be more apparent from the accompanying
drawings and the following detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1A is a front perspective view of an illustrative
electronic device such as a handheld device of the type that may be
manufactured using automated equipment in accordance with an
embodiment of the present invention.
[0012] FIG. 1B is a rear perspective view of an illustrative
electronic device such as a handheld device of the type that may be
manufactured using automated equipment in accordance with an
embodiment of the present invention.
[0013] FIG. 2 is a schematic diagram of an illustrative electronic
device with input/output devices and wireless communications
circuitry in accordance with an embodiment of the present
invention.
[0014] FIG. 3 is a diagram of manufacturing equipment of the type
that may be used in manufacturing an electronic device in
accordance with an embodiment of the present invention.
[0015] FIG. 4A is an exploded perspective view of an illustrative
device under test, pad extender, and test tray in accordance with
an embodiment of the present invention.
[0016] FIG. 4B is a perspective view of an illustrative device
under test, pad extender, and test tray in accordance with an
embodiment of the present invention.
[0017] FIG. 5A is a top perspective view of an illustrative test
tray in accordance with an embodiment of the present invention.
[0018] FIG. 5B is a bottom perspective view of an illustrative test
tray in accordance with an embodiment of the present invention.
[0019] FIG. 5C is a bottom perspective view of an illustrative test
tray with an opening to accommodate tests in accordance with an
embodiment of the present invention.
[0020] FIG. 5D is a perspective view of an illustrative test tray
in which a device under test has been mounted in accordance with an
embodiment of the present invention.
[0021] FIG. 6 is a diagram of test tray flipping equipment in
accordance with an embodiment of the present invention.
[0022] FIG. 7 is a cross-sectional end view of a device under test
grabber arm that has engaged a mating test tray in accordance with
an embodiment of the present invention.
[0023] FIG. 8 is a diagram showing an incoming test tray that is
detected using a radio-frequency identification sensor in
accordance with an embodiment of the present invention.
[0024] FIG. 9 is a diagram showing an incoming test tray that is
detected using a light-based sensor in accordance with an
embodiment of the present invention.
[0025] FIG. 10 is a diagram showing an incoming test tray being
received by a movable arm in accordance with an embodiment of the
present invention.
[0026] FIG. 11 is a diagram showing a test tray being raised by a
movable arm in accordance with an embodiment of the present
invention.
[0027] FIG. 12 is a diagram showing a test tray being flipped by
rotating a movable arm in accordance with an embodiment of the
present invention.
[0028] FIG. 13 is a diagram showing a test tray that has been
flipped by a movable arm in accordance with an embodiment of the
present invention.
[0029] FIG. 14 is a diagram showing a test tray being dropped off
by a movable arm in accordance with an embodiment of the present
invention.
[0030] FIG. 15 is a diagram showing a movable arm being returned to
a standby position after dropping off a flipped test tray in
accordance with an embodiment of the present invention.
[0031] FIG. 16 is a flow chart of illustrative steps for operating
a test system of the type shown in FIGS. 3 and 6 in accordance with
an embodiment of the present invention.
[0032] FIGS. 17 and 18 are diagrams of suitable movable arm
configurations that can be used to flip a test tray in accordance
with an embodiment of the present invention.
DETAILED DESCRIPTION
[0033] Electronic devices such as electronic device 10 of FIG. 1A
may be manufactured using automated manufacturing equipment. The
automated manufacturing equipment may include equipment for
assembling device components together to form an electronic device.
The automated manufacturing equipment may also include testing
systems for evaluating whether devices have been properly assembled
and are functioning properly.
[0034] Devices such as device 10 of FIG. 1A may be assembled and
tested using an automated manufacturing system. The manufacturing
system may include one or more stations such as one or more test
stations for performing testing operations.
[0035] Devices that are being tested in a test system may sometimes
be referred to as devices under test (DUTs). Devices under test may
be provided to the test stations using a conveyor belt, using
robotic arms, or using other loading equipment.
[0036] Any suitable device may be tested using test equipment. As
an example, device 10 of FIG. 1A may be tested. Device 10 may be a
computer monitor with an integrated computer, a desktop computer, a
television, a notebook computer, other portable electronic
equipment such as a cellular telephone, a tablet computer, a media
player, a wrist-watch device, a pendant device, an earpiece device,
other compact portable devices, or other electronic equipment. In
the configuration shown in FIG. 1A, device 10 is a handheld
electronic device such as a cellular telephone, media player,
navigation system device, or gaming device.
[0037] As shown in FIG. 1A, device 10 may include a housing such as
housing 12. Housing 12, which may sometimes be referred to as a
case, may be formed of plastic, glass, ceramics, fiber composites,
metal (e.g., stainless steel, aluminum, etc.), other suitable
materials, or a combination of these materials. In some situations,
parts of housing 12 may be formed from dielectric or other
low-conductivity material. In other situations, housing 12 or at
least some of the structures that make up housing 12 may be formed
from metal elements.
[0038] Device 10 may, if desired, have a display such as display
14. Display 14 may be a touch screen that incorporates capacitive
touch electrodes or may be insensitive to touch. Display 14 may
include image pixels formed from light-emitting diodes (LEDs),
organic LEDs (OLEDs), plasma cells, electrophoretic display
elements, electrowetting display elements, liquid crystal display
(LCD) components, or other suitable image pixel structures. A cover
glass layer may cover the surface of display 14. Openings for
buttons such as button 20, openings for speaker ports such as
speaker port 22, and other openings may be formed in the cover
layer of display 14, if desired.
[0039] The central portion of display 14 (i.e., active region 16)
may include active image pixel structures. The surrounding
rectangular ring-shaped inactive region (region 18) may be devoid
of active image pixel structures. If desired, the width of inactive
region 18 may be minimized (e.g., to produce a borderless
display).
[0040] Device 10 may include components such as front-facing camera
24. Camera 24 may be oriented to acquire images of a user during
operation of device 10. If desired, a rear-facing camera such as
camera 24' may be formed on the rear surface of housing 12 (as
shown in the rear perspective view of device 10 in FIG. 1B). A
light source such as light source 25 may also be formed in the rear
surface of device 10 and may be used in combination with camera 24'
when capturing images with device 10.
[0041] Device 10 may include sensors in portion 26 of inactive
region 18. These sensors may include, for example, an
infrared-light-based proximity sensor that includes an
infrared-light emitter and a corresponding light detector to emit
and detect reflected light from nearby objects. The sensors in
portion 26 may also include an ambient light sensor for detecting
the amount of light that is in the ambient environment for device
10. Other types of sensors may be used in device 10 if desired. The
example of FIG. 1A is merely illustrative.
[0042] Device 10 may include input-output ports such as port 28.
Port 28 may include audio input-output ports, analog input-output
ports, digital data input-output ports, or other ports.
[0043] Sensors such as the sensors associated with region 26 of
FIG. 1A, cameras such as camera 24, buttons such as button 20, and
ports such as port 28 may be located on any suitable portion of
device housing 12 (e.g., a front housing face such as a display
cover glass portion, a rear housing face such as a rear planar
housing wall, sidewall structures, etc.).
[0044] A schematic diagram of an electronic device such as
electronic device 10 is shown in FIG. 2. As shown in FIG. 2,
electronic device 10 may include storage and processing circuitry
27. Storage and processing circuitry 27 may include storage such as
hard disk drive storage, nonvolatile memory (e.g., flash memory or
other electrically-programmable-read-only memory configured to form
a solid state drive), volatile memory (e.g., static or dynamic
random-access-memory), etc. Processing circuitry may be based on
one or more microprocessors, microcontrollers, digital signal
processors, baseband processors, power management units, audio
codec chips, application specific integrated circuits, etc.
[0045] Storage and processing circuitry 27 may be used to run
software on device 10, such as internet browsing applications,
voice-over-internet-protocol (VOIP) telephone call applications,
email applications, media playback applications, operating system
functions, etc. To support interactions with external equipment,
storage and processing circuitry 27 may be used in implementing
communications protocols. Communications protocols that may be
implemented using storage and processing circuitry 27 include
internet protocols, wireless local area network (WLAN) protocols
(e.g., IEEE 802.11 protocols--sometimes referred to as WiFi.RTM.),
protocols for other short-range wireless communications links such
as the Bluetooth.RTM. protocol, cellular telephone protocols,
etc.
[0046] Circuitry 27 may be configured to implement control
algorithms that control the use of antennas in device 10. For
example, to support antenna diversity schemes and MIMO schemes or
beam forming or other multi-antenna schemes, circuitry 27 may
perform signal quality monitoring operations, sensor monitoring
operations, and other data gathering operations and may, in
response to the gathered data, control which antenna structures
within device 10 are being used to receive and process data. As an
example, circuitry 27 may control which of two or more antennas is
being used to receive incoming radio-frequency signals, may control
which of two or more antennas is being used to transmit
radio-frequency signals, may control the process of routing
incoming data streams over two or more antennas in device 10 in
parallel, etc.
[0047] Input/output circuitry 29 may be used to allow data to be
supplied to device 10 and to allow data to be provided from device
10 to external devices. Input/output circuitry 29 may include
input/output devices 31. Input/output devices 31 may include touch
screens, displays without touch sensor capabilities, buttons,
joysticks, click wheels, scrolling wheels, touch pads, key pads,
keyboards, microphones, speakers, tone generators, vibrators,
cameras, sensors, light-emitting diodes and other status
indicators, light sources, audio jacks and other audio port
components, data ports, light sensors, motion sensors
(accelerometers), capacitance sensors, proximity sensors, etc. A
user can control the operation of device 10 by supplying commands
through input/output devices 31 and may receive status information
and other output from device 10 using the output resources of
input/output devices 31.
[0048] Wireless communications circuitry 33 may include
radio-frequency (RF) transceiver circuitry formed from one or more
integrated circuits, power amplifier circuitry, low-noise input
amplifiers, passive RF components, one or more antennas,
transmission lines, and other circuitry for handling RF wireless
signals. Wireless signals can also be sent using light (e.g., using
infrared communications).
[0049] Wireless communications circuitry 33 may include satellite
navigation system receiver circuitry 35, transceiver circuitry such
as transceiver circuitry 37 and 39, and antenna circuitry such as
antenna circuitry 41. Satellite navigation system receiver
circuitry 35 may be used to support satellite navigation services
such as United States' Global Positioning System (GPS) (e.g., for
receiving satellite positioning signals at 1575 MHz) and/or other
satellite navigation systems.
[0050] Transceiver circuitry 37 may handle 2.4 GHz and 5 GHz bands
for WiFi.RTM. (IEEE 802.11) communications and may handle the 2.4
Bluetooth.RTM. communications band. Circuitry 37 may sometimes be
referred to as wireless local area network (WLAN) transceiver
circuitry (to support WiFi.RTM. communications) and Bluetooth.RTM.
transceiver circuitry. Circuitry 33 may use cellular telephone
transceiver circuitry (sometimes referred to as cellular radio) 39
for handling wireless communications in cellular telephone bands
such as bands at 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, and 2100 MHz
or other cellular telephone bands of interest.
[0051] Examples of cellular telephone standards that may be
supported by wireless circuitry 33 and device 10 include: the
Global System for Mobile Communications (GSM) "2G" cellular
telephone standard, the Evolution-Data Optimized (EVDO) cellular
telephone standard, the "3G" Universal Mobile Telecommunications
System (UMTS) cellular telephone standard, the "3G" Code Division
Multiple Access 2000 (CDMA 2000) cellular telephone standard, and
the "4G" Long Term Evolution (LTE) cellular telephone standard.
Other cellular telephone standards may be used if desired. These
cellular telephone standards are merely illustrative.
[0052] Wireless communications circuitry 33 may include circuitry
for other short-range and long-range wireless links if desired. For
example, wireless communications circuitry 33 may include wireless
circuitry for receiving radio and television signals, paging
circuits, etc. In WiFi.RTM. and Bluetooth.RTM. links and other
short-range wireless links, wireless signals are typically used to
convey data over tens of hundreds of feet. In cellular telephone
links and other long-range links, wireless signals are typically
used to convey data over thousands of feet or miles.
[0053] Wireless communications circuitry 33 may include one or more
antennas 41. Antennas 41 may be formed using any suitable antenna
type. For example, antennas 41 may include antennas with resonating
elements that are formed from loop antenna structures, patch
antenna structures, inverted-F antenna structures, slot antenna
structures, planar inverted-F antenna structures, helical antenna
structures, hybrids of these designs, etc. Different types of
antennas may be used for different bands and combinations of bands.
For example, one type of antenna may be used in forming a local
wireless link antenna and another type of antenna may be used in
forming a remote wireless link antenna.
[0054] FIG. 3 is a diagram of an illustrative system of the type
that may be used for manufacturing operations such as device
testing. As shown in FIG. 3, system 30 may include one or more
stations such as test stations 36. In general, test system 30 may
include automated equipment that is used in loading and unloading
devices under test, in conveying devices under test between test
stations, and in performing tests and maintaining a database of
test results.
[0055] Device under test 10 may, if desired, be installed in a test
tray such as tray 32. Tray 32 may be configured to receive one or
more devices under test. For example, tray 32 may have multiple
slots, each of which is configured to receive a corresponding
device under test. If desired, tray 32 may be configured to receive
only a single device under test.
[0056] Device 10 may be installed in test tray 32 manually or using
automated equipment. To facilitate manual installation, test tray
32 may include features to facilitate human manipulation. For
example, test tray 32 may include features that help an operator
open and close clamps or other device holding features in test tray
32. Device under test 10 that is mounted in test tray 32 may be
conveyed between test stations 36 using a conveyor belt such as
conveyor belt 38 (e.g., a belt that moves in direction 40). DUT 10
may be tested using at least some of test stations 36 as DUT 10
travels down conveyor belt 38.
[0057] It may be desirable to regulate the rate at which devices
under test are placed on conveyor 38 in system 30. Test system 30
may include loading equipment such as loading equipment 200
configured to place test trays 32 on conveyor belt 38 so that test
trays 32 are not spaced too closely or too far apart from one
another. With this type of arrangement, test tray 32 may serve as
an interface between DUT 10 and loading equipment 200. Test tray 32
may, for example, be more robust than DUT 10, may have engagement
features that are configured to mate with loading equipment 200,
may have an identification number that facilitates tracking, and
may have other features that facilitate loading of DUT 10 onto
conveyor belt 38.
[0058] Each test station 36 may, for example, include test
equipment for performing one or more tests on device under test 10.
For example, a first type of test station 36 may have equipment for
testing a display in DUT 10. A second type of test station 36 may
have equipment for testing an audio component in DUT 10. Yet
another type of test station 36 may have equipment for testing
light sensors in DUT 10. Yet another type of test station 36 may
have equipment for testing wireless communications circuitry in DUT
10. If desired, test system 30 may include more than one test
station of the same type arranged along conveyor belt 38 so that
multiple DUTs can be tested in parallel.
[0059] In the example of FIG. 3, test system 30 may include a first
group of test stations 50 that are positioned along a first portion
of conveyor 38 and a second group of test stations 52 that are
positioned along a second portion of conveyor 38. The first group
of test stations may include test stations 36 with equipment for
testing DUT 10 that is mounted in test tray 32 in an upright
orientation (i.e., for testing input-output devices and/or user
interface components accessible from the front face of DUT 10). The
second group of test stations may include test stations 36 with
equipment for testing DUT 10 that is mounted in test tray 32 in an
inverted (or flipped) orientation (i.e., for testing input-output
devices and/or user interface components accessible from the rear
face of DUT 10).
[0060] Test system 30 may include test tray flipping equipment such
as test tray flipping equipment 202 interposed between the first
group of test stations (i.e., test stations for testing DUT 10 in
test tray 32 in the upright position) and the second group of test
stations (i.e., test stations for testing DUT 10 in test tray 32 in
the flipped position) along conveyor 38. When a test tray 32 passes
test tray flipping equipment 202, equipment 202 may use a
computer-controlled movable arm to pick up the test tray from
conveyor belt 38 (as indicated by arrow 204), may flip the test
tray by rotating the movable arm 180.degree., and may drop off the
inverted test tray back onto conveyor belt (as indicated by arrow
206). This example is merely illustrative. If desired, the test
tray may be rotated by less than or more than 180.degree.. Test
tray flipping equipment 202 may therefore sometimes be referred to
as a test tray rotator, a test tray flipper, or a test tray
inverter. Test trays 32 that are flipped using equipment 202 may
proceed down the conveyor belt to be tested using test stations 36
in the second group of test stations. If desired, test system 30
may include more than one flipper 202 for inverting the orientation
of devices under test installed within respective test trays.
[0061] Test stations 36 may provide test results to computing
equipment such as test host 42 (e.g., one or more networked
computers) for processing. Test host 42 may maintain a database of
test results, may be used in controlling the rate at which loading
equipment 200 loads test trays onto conveyor belt 38 (e.g., by
sending commands via path 41), may be used in sending test commands
to test stations 36 (e.g., by sending commands via path 43), may
track individual trays and devices under test as the trays and
devices pass through system 30, and may perform other control
operations.
[0062] FIG. 4A is a diagram showing how device under test 10 may be
received within test tray 32. As shown in FIG. 4A, test tray 32 may
have sidewalls 100 that are configured to receive a device under
test such as DUT 10. Device under test 10 may have one or more
connector ports such as port 28 (see, e.g., FIG. 1).
[0063] A pad extender such as pad extender 144 may have a mating
connector such as plug 146. Plug 146 may be configured to mate with
a connector in port 28 when DUT 10 has been mounted in test tray 32
and when pad extender 144 has been moved towards DUT 10 in
direction 148.
[0064] Following insertion of DUT 10 into test tray 32 and
following insertion of plug connector 146 of pad extender 144 into
connector 28 of DUT 10, test tray 32 of FIG. 4A may appear as shown
in FIG. 4B. Pad extender 144 may contain signal paths that connect
pins in connector 28 to corresponding contacts 62 on pad extender
144. Contacts 62 may be configured to mate with corresponding
contacts coupled to tester 44 and/or test host 42 during testing in
system 30.
[0065] Because DUT 10 is connected to test contacts 62 in test tray
32 using pad extender 144 associated with test tray 32, it is not
necessary to repeatedly connect and disconnect device under test 10
from cabling at each test station 36. Rather, connections between
DUT 10 and the test equipment at each test station 36 by may be
formed by coupling contacts 62 in test tray 32 to corresponding
contacts (e.g., spring-loaded pins) in each test station 36. By
minimizing the number of times that cables need to be connected and
disconnected from each device under test, the life of tester cables
and connectors may be extended.
[0066] The use of test tray 32 and loader 46 may allow DUT 10 to be
placed accurately within test stations 36 (e.g., with an accuracy
of +/-0.1 mm or better, as an example). Test tray 32 may shield
device under test 10 from scratches and other damage during
testing. In general, DUT 10 may be received within test tray 32 in
either an upwards facing configuration in which display 14 faces
outwards away from tray 32 or a downwards facing configuration in
which display 14 faces downwards onto the base of test tray 32.
[0067] FIG. 5A is a perspective view of one suitable embodiment of
test tray 32. As shown in FIG. 5A, tray 32 may be provided with
engagement features such as holes 160. Engagement features such as
holes 160 may be formed on one, two, three, or all four sides of
test tray 32 and may be configured to mate with corresponding
engagement features on automated test equipment such as loader 200
and flipper 202 (FIG. 3). For example, holes 160 may be formed on
opposing ends of test tray 32 such as ends 32A and 32B of test tray
32. The example of FIG. 5A in which engagement features 160 have
been implemented in the form of holes is merely illustrative.
Engagement features 160 may be implemented in the form of slots,
notches, dimples, openings, recesses, protrusions, or other
features that allow test equipment to engage with test tray 32.
[0068] As an example, automated flipper 202 may include a
computer-controlled arm (sometimes referred to as a test tray
grabber) having engagement pins that are configured to engage
simultaneously with ends 32A and 32B, allowing flipper 202 to pick
up, hold, rotate, and/or transport device 10 to a desired location.
In the example of FIG. 5A, test tray 32 is shown with four
engagement holes on each end. This is, however, merely
illustrative. If desired, tray 32 may include less than four
engagement holes, more than four engagement holes, more than six
engagement holes, more than 10 engagement holes, etc.
[0069] Tray 32 may be formed using non-marring material such as
acetyl plastic, Delrin.RTM. (a polyoxymethylene plastic), other
plastics, or other suitable non-marring materials. The use of
non-marring materials may help avoid scratches or other damage to
device under test 10 when device under test 10 is placed within
test tray 32. If desired, a layer of material 156 may be formed on
portions of test tray 32 such base portion 48. As an example,
material 156 may be formed using the same material that is used to
form tray 32. As another example, material 156 may be formed using
elastomeric material such as rubberized foam. Material 156 may, in
general, be formed using any suitable non-marring material.
[0070] Test tray 32 may be provided with guide structures
configured to accurately position device under test 10 in a desired
location within recessed portion 154 of tray 32. As shown in FIG.
5A, guide structures such as guide surfaces 150 may be used as
reference points for determining the location of a device under
test relative to test tray 32 and/or test station 36. For example,
a device under test may be positioned in a known location relative
to test tray 32 by registering the device under test against guide
surfaces 150. A guide structure on the end of tray 32 may have an
exposed end guide surface such as guide surface 150A. Guide
structures on the side of tray 32 may have exposed side guide
surfaces such as guide surfaces 150B. Guide surfaces such as guide
surfaces 150A and 150B may sometimes be referred to as datums.
[0071] FIG. 5B is a bottom perspective view of one suitable
embodiment of test tray 32. As shown in FIG. 5B, holes, openings,
or gaps such as gaps 80 may be formed in sidewalls 100 of test tray
32. Gaps 80 in sidewalls 100 may allow portions of device 10 to be
exposed by test tray 32. For example, structures such as buttons,
switches, ports (e.g., a subscriber identity module (SIM) card port
to authorize cellular telephone service), and other input-output
devices may be formed in a housing sidewall of device 10. If
desired, gaps 80 may be formed in portions of sidewalls 100 that
are adjacent to (e.g., aligned with) these structures. This type of
configuration may ensure that structures such as buttons or
switches in device 10 are not unintentionally actuated or otherwise
unnecessarily obstructed by test tray 32. This is, however, merely
illustrative. If desired, sidewalls 100 of test tray 32 may be free
of gaps.
[0072] Test tray 32 may have one or more openings in base 48 to
facilitate test measurements on the rear face of DUT 10. For
example, as shown in the bottom perspective view of FIG. 5C,
openings such as opening 82 may be formed in base 48 and may be
configured to align with one or more input-output devices in device
under test 10 when device 10 is installed in tray 32. Test
equipment at a test station may communicate with a component in
device 10 via opening 82. In the example of FIG. 5C, opening 82 has
an inverted cone shape to facilitate testing of rear-face camera
24' and light source 25 in device 10 (FIG. 1). During testing, a
light signal from a test light source may be transmitted through
opening 82 to reach camera 24' in DUT 10, and/or a light-emitting
diode flash from light source 25 in device 10 may emit light
through opening 82 to reach a light sensor at a test station. Other
examples of components in device 10 that may be tested using
openings such as opening 82 in test tray 32 include ambient light
sensors, light-based proximity sensors, capacitive sensors,
light-emitting diodes (e.g., for status indicators), display
components, magnetic sensors, or other electrical components.
[0073] When device 10 is installed in test tray 32, some components
in device 10 may face away from test tray 32 (e.g., components
formed on a front side of device 10) and some components in device
10 may face towards test tray 32 (e.g., components formed on a back
side of device 10). If desired, openings such as openings 82 may
only be formed in portions of base 48 that are aligned with
components in device 10 that face towards test tray 32.
[0074] FIG. 5D is a perspective view of test tray 32 after device
under test 10 has been inserted into test tray 32. As shown in FIG.
5D, test tray 32 may have clamps 164 for holding device under test
10 within test tray 32. The inner surfaces of clamps 164 may serve
as guide surfaces 150 (FIG. 5A) or, if desired, may be separate
structures adjacent to guide surfaces 150.
[0075] Test tray 32 may have one or more notches or slots such as
slot 170. Slot 170 may be configured to receive pad extender 144.
If desired, pad extender 144 may be retained within slot 170 when
device 10 is installed in test tray 32 (e.g., when connector 146 of
pad extender 144 is connected to connector port 28 in device 10)
and when device 10 is not installed in test tray 32 (e.g., when
test tray 32 is empty).
[0076] FIG. 6 is a diagram showing how flipper 202 may include a
movable arm for inverting an incoming test tray 32. As shown in
FIG. 6, flipper 202 may include a test tray flipper fixture such as
fixture 210, device under test sensors such as sensors 212 and 214
that are attached to fixture 210, and a movable arm 218 (sometimes
referred to herein as a flipper arm). Sensor 212 may be a
radio-frequency identification (RFID) sensor configured to identify
a serial number associated with an incoming tray 32. Based on the
identified serial number, test host 42 may be used to determine
whether DUT 10 that is mounted within the incoming tray needs to be
flipped.
[0077] Sensor 214 may (as an example) be a laser-based distance
sensor or other types of optical sensor that is used to detect
whether an incoming tray 32 has been successfully received within
arm 218. For example, sensor 214 may detect that a tray 32 is being
conveyed towards arm 218 passing detection plane 216. If sensor 214
detects that tray 32 has completely moved past sensor detection
plane 216 at a later point in time, DUT 10 has successfully been
received within arm 218. If sensor 214 detects that tray 32 has not
yet completely moved past detection plane 216, arm 218 will remain
in a receiving position until DUT 10 is successfully received
within arm 218.
[0078] Flipper 202 may have computer-controlled positioners for
moving arm 18. Arm 218 may be moved vertically to pick up test
trays 32. For example, arm 218 of may be lowered in direction 240
when it is desired to use arm 218 to pick up a new test tray 32
from conveyor belt 38. In the example of FIG. 6, flipper 202 may
use a screw-based lifting mechanism or other lifting mechanisms to
vertically lift and lower arm 218. Flipping equipment 202 may have
an arm extender plate such as plate 226. Plate 226 may have a
threaded hole such as hole 225. Computer-controlled motor 230 may
be used to rotate screw 228 about rotational axis 234 in direction
232. By rotating screw 228, motor 230 may be used to raise and
lower plate 226 and therefore arm 218 vertically towards or away
from the surface of conveyor belt 38.
[0079] Arm 218 may include a contractible member such as arm member
220 and associated computer-controlled air-driven or motor-driven
actuators such as actuators 242 (see, e.g., FIG. 7). Member 220 of
arm 218 may have engagement features such as pins 160'. Actuators
242 may be used to extend and retract pins 160' in member 220. As
shown in the cross-sectional end view of FIG. 7, actuators 242 may
insert pins 160' into holes 160 in test tray 32 so that test tray
32 may be picked up from conveyor belt 38.
[0080] Arm 218 may also include air-driven or motor-driven
actuators for rotating arm member 220. For example, when a test
tray is received within arm 218 and when arm is raised to a
sufficient height above conveyor belt 38, arm member 220 may be
rotated about axis 224 (sometimes referred to as a pivot axis) in
direction 222 so that the test tray is flipped from its upright
orientation to an inverted orientation (see, FIG. 6).
[0081] FIGS. 8-15 show different snapshots in time illustrating
operations involved in flipping an incoming test tray 32. An
incoming test tray may initially be detected using radio-frequency
identification sensor 212 (e.g., sensor 212 may identify a serial
number associated with the incoming test tray), as shown in FIG. 8.
Arm 218 may initially be configured in a raised standby
position.
[0082] Based on the serial number of the incoming test tray, test
host 42 may determine whether the test tray needs to be flipped
using flipper 202. If test host 42 determines that the test tray
needs to be flipped, arm 218 may be lowered towards the surface of
conveyor 38 to a receiving position using computer-controlled
position 300 (e.g., using the screw-based lifting mechanism
described in connection with FIG. 6). Meanwhile, sensor 214 may be
used to detect for the presence of test tray 32 (see, FIG. 9).
[0083] Sensor 214 may be used to detect whether the test tray has
been successfully received by arm 218. For example, if sensor 214
detects that test tray has moved entirely past plane 216, the test
tray has been successfully received within arm 218 (see, FIG. 10).
If, however, sensor 214 detects that the test tray has yet to clear
plane 216, then arm 218 may remain in the lowered receiving
position until the test tray moves completely past plane 216.
[0084] When the test tray is successfully received within arm 218,
arm engagement features such as pins 160' may be inserted into
corresponding test tray engagement features such as holes 160 (FIG.
7) so that the test tray is securely latched within arm 218. In
this engaged state, arm 218 may be raised vertically to a
predetermined height H above the surface of conveyor belt 38 using
positioner 300 (see, FIG. 11). The height H to which the test tray
is raised may be sufficiently high so that the test tray can be
freely rotated about axis 224 without contacting the surface of
conveyor belt 38.
[0085] When the test tray is raised to predetermined height H above
conveyor belt 38 with arm 218, member 220 may be rotated about axis
224 in the direction of arrow 302 (see, FIG. 12). The test tray may
be rotated by 180.degree. so that DUT 10 is in an inverted (or
flipped) orientation (see, FIG. 13).
[0086] The test tray may then be lowered down to the surface of
conveyor belt 38 for drop-off (see, FIG. 14). In particular, the
flipper arm engagement structures (e.g., pins 160') may disengage
from the test tray engagement structures (e.g., holes 160) to
release test tray from arm 218. After drop-off, the flipped test
tray may proceed down conveyor belt 38 for testing with the second
group of test stations 52, and arm 218 may return to its standby
position in anticipation for another incoming test tray (see, FIG.
15).
[0087] FIG. 16 shows illustrative steps involved in operating test
tray flipping equipment 202 of FIG. 6. At step 400, a
radio-frequency identification (RFID) reader (e.g., sensor 212 in
FIG. 6) that is built into flipper 202 may be used to monitor
incoming test trays 32 for RFIDs. Each test tray 32 may contain an
RFID tag (e.g., a tag that wirelessly transmits a corresponding
tray identifier to RFID reading equipment in system 30). If the
RFID reader determines that the tray ID for a test tray matches
previously received instructions (e.g., if test host 42 determines
that incoming test tray 32 needs to be flipped), flipper arm 218
may be lowered down to the surface of conveyor 38 to receive test
tray 32 (step 402). Other ways of uniquely identifying each
incoming test tray may be used, if desired.
[0088] At step 404, light sensors (e.g., sensor 214 of FIG. 6) that
are configured to monitor the entrance to arm 218 may detect the
presence of test tray 32 and may then, as tray 32 moves along
conveyor 38, detect the absence of test tray 32. This indicates
that tray 32 has entered arm 218 (sometimes referred to as a test
tray grabber), so the pins on arm 218 (i.e., the grabber mechanism
formed by pins 160' and actuators 242 of FIG. 7) may be extended
into mating holes 160 in test tray 32 to grab test tray 32 (step
406). Additional light sensors built into arm 218 may be used to
confirm that test tray 32 has been satisfactorily grabbed by arm
218. Pins 160' may extend into two or more holes 160 in test tray
32, four or more holes 160 in test tray 32, or any other suitable
number of holes 160.
[0089] At step 408, arm 218 may be raised to a predetermined height
above the surface of conveyor belt 38. At step 410, arm member 220
may be rotated by 180.degree. so that the test tray is flipped from
an upright orientation to a capsized orientation. This is merely
illustrative. If desired, the test tray may be rotated by
90.degree., 120.degree., 135.degree., 223.degree., 270.degree., or
by other suitable amounts to change the orientation of the test
tray under test. If desired, light sensors associated with arm 218
may confirm whether arm 218 has been fully rotated.
[0090] At step 412, arm 218 may be lowered down to the surface of
conveyor belt 38. At step 414, arm 218 may release test tray 32
(e.g., by disengaging pins 160' from holes 160 in tray 32) to drop
off test tray 32 onto conveyor belt 38. Additional light sensors
built into arm 218 may be used to confirm that test tray 32 has
been satisfactorily released from arm 218.
[0091] At step 416, arm 218 may return to its raised standby
position in anticipation for flipping another incoming test tray
(see, e.g., FIG. 15). The steps of FIG. 16 are merely illustrative
and do not serve to limit the scope of the present invention. If
desired, other steps may be performed when inverting the
orientation of test tray 32, flipper 202 may include other suitable
equipment for handling and rotating test tray 32, etc.
[0092] In another suitable arrangement (see, e.g., FIG. 17),
flipper 202 may include arm 218 configured to flip test tray 32
about rotational axis 500 in the direction of arrow 502 without
having to raise arm 218 above the surface of conveyor belt 38. This
configuration may require sufficient clearance within flipper arm
218 to provide free space for test tray 32 to be rotated without
being obstructed by peripheral test structures.
[0093] In another suitable arrangement (see, e.g., FIG. 18),
flipper may include arm 218 configured to rotate test tray 32 about
a rotational axis 510 that is aligned with the center of test tray
32. In the example of FIG. 18, arm member 220 may be raised to a
height H' above the surface of conveyor 38 prior to and after
rotating test tray 32, where height H' is at least greater than
half the width W of test tray 32. Height H' may be substantially
less than the predetermined height H as described in connection
with FIGS. 11-13.
[0094] The foregoing is merely illustrative of the principles of
this invention and various modifications can be made by those
skilled in the art without departing from the scope and spirit of
the invention. The foregoing embodiments may be implemented
individually or in any combination.
* * * * *