U.S. patent application number 13/362398 was filed with the patent office on 2013-08-01 for methods of epitaxial finfet.
This patent application is currently assigned to GLOBALFOUNDRIES Inc.. The applicant listed for this patent is Nicholas LiCausi, Jeremy Wahl. Invention is credited to Nicholas LiCausi, Jeremy Wahl.
Application Number | 20130196485 13/362398 |
Document ID | / |
Family ID | 48701376 |
Filed Date | 2013-08-01 |
United States Patent
Application |
20130196485 |
Kind Code |
A1 |
LiCausi; Nicholas ; et
al. |
August 1, 2013 |
METHODS OF EPITAXIAL FINFET
Abstract
Disclosed herein are various methods for better height control
of the finFET patterned fins. In one example, this invention begins
by depositing or growing an oxide material, for example, silicon
dioxide. This oxide material is then patterned and etched to open
windows or trenches to the substrate where fins will be grown. If a
common channel material is desired, it is epitaxially grown in the
windows. Then, some windows are covered and one pole of fins (for
example nFET) are epitaxially grown in the exposed windows. The
previously masked windows are opened and the newly formed fins are
masked. The alternate channel material is then grown. The masked
fins are then un-masked and the oxide is recessed to allow the fins
to protrude from the oxide. This invention also allows for
different channel materials for NMOS and PMOS.
Inventors: |
LiCausi; Nicholas;
(Watervilet, NY) ; Wahl; Jeremy; (Delmar,
NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LiCausi; Nicholas
Wahl; Jeremy |
Watervilet
Delmar |
NY
NY |
US
US |
|
|
Assignee: |
GLOBALFOUNDRIES Inc.
Grand Cayman
KY
|
Family ID: |
48701376 |
Appl. No.: |
13/362398 |
Filed: |
January 31, 2012 |
Current U.S.
Class: |
438/478 ;
257/E21.09 |
Current CPC
Class: |
H01L 27/0924 20130101;
H01L 27/1211 20130101; H01L 21/823821 20130101; H01L 21/845
20130101 |
Class at
Publication: |
438/478 ;
257/E21.09 |
International
Class: |
H01L 21/20 20060101
H01L021/20 |
Claims
1. A method, comprising: providing a substrate, the substrate
having a top surface; forming material layer 1 on the substrate top
surface; patterning of the material layer 1 thereby defining a
plurality of trenches and a plurality of patterned material
structures; forming a common stack material in the plurality of
trenches on the substrate top surface; masking a first masking
material in a first portion of the plurality of trenches and on a
first portion of the plurality of patterned material structures
proximate the first portion of the plurality of trenches; forming a
first channel material in a second portion of the plurality of
trenches; removing the first masking material; masking a second
masking material in a second portion of the plurality of trenches
and on a second portion of the plurality of patterned material
structures proximate the second portion of the plurality of
trenches; forming a second channel material in the first portion of
the plurality of trenches; removing the second masking material;
and recessing the plurality of patterned material structures.
2. A method, comprising: providing a substrate, the substrate
having a top surface; forming a common stack material on the
substrate top surface; forming a material layer 1 on the common
stack material; patterning of the material layer 1 thereby defining
a plurality of trenches and a plurality of patterned material
structures; masking a first masking material in a first portion of
the plurality of trenches and on a first portion of the plurality
of patterned material structures proximate the first portion of the
plurality of trenches; forming a first channel material in a second
portion of the plurality of trenches; removing the first masking
material; masking a second masking material on a second portion of
the plurality of trenches and on a second portion of the plurality
of patterned material structures proximate the second portion of
the plurality of trenches; forming a second channel material in the
first portion of the plurality of trenches; removing the second
masking material; and recessing the plurality of patterned material
structures.
3. The method of claim 1, wherein forming the first channel
material in a second portion of the plurality of trenches leaves
the first channel material protruding above the height of the
plurality of patterned material structures and forming the second
channel material in a first portion of the plurality of trenches
leaves the second channel material protruding above the height of
the plurality of patterned material structures.
4. The method of claim 2, wherein forming the first channel
material in a second portion of the plurality of trenches leaves
the first channel material protruding above the height of the
plurality of patterned material structures and forming the second
channel material in a first portion of the plurality of trenches
leaves the second channel material protruding above the height of
the plurality of patterned material structures.
5. The method of claim 3, further comprising, prior to recessing
the plurality of patterned material structures, performing a
planarization process to define the plurality of patterned material
structures, the first channel material and the second channel
material as having a flush top surface.
6. The method of claim 4, further comprising, prior to recessing
the plurality of patterned material structures, performing a
planarization process to define the plurality of patterned material
structures, the first channel material and the second channel
material as having a flush top surface.
7. The method of claim 1, wherein the first masking material is a
pFET masking material, the second masking material is an nFET
masking material, the first channel material is an nFET channel
material and the second channel material is a pFET channel
material.
8. The method of claim 2, wherein the first masking material is a
pFET masking material, the second masking material is an nFET
masking material, the first channel material is an nFET channel
material and the second channel material is a pFET channel
material.
9. The method of claim 7, wherein the method of forming the first
channel material comprises epitaxially growing the first channel
material, and the method of forming the second channel material
comprises epitaxially growing the second channel material.
10. The method of claim 8, wherein the method of forming the first
channel material comprises epitaxially growing the first channel
material, and the method of forming the second channel material
comprises epitaxially growing the second channel material.
11. The method of claim 7, wherein the pFET masking material and
the nFET masking material are selected from the group consisting of
Si.sub.3N.sub.4, TiN, or SiO.sub.2, the nFET channel material is
selected from the group consisting of Si or group III-V
semiconductor materials, and the pFET channel material has a Ge
content ranging from 25-100%.
12. The method of claim 8, wherein the pFET masking material and
the nFET masking material are selected from the group consisting of
Si.sub.3N.sub.4, TiN, or SiO.sub.2, the nFET channel material is
selected from the group consisting of Si or group III-V
semiconductor materials, and the pFET channel material has a Ge
content ranging from 25-100%.
13. The method of claim 1, wherein material layer 1 is an oxide,
such as SiO.sub.2, and is formed by PEALD, LPCVD, CVD, thermally
grown or deposited with other methods.
14. The method of claim 1, wherein recessing the plurality of
patterned material structures comprises plasma-based processing,
sublimation-based processing or wet chemical etching the plurality
of patterned material structures to a depth of about 15-30 nm.
15. The method of claim 2, wherein recessing the plurality of
patterned material structures comprises plasma-based processing,
sublimation-based processing or wet chemical etching the plurality
of patterned material structures to a depth of about 15-30 nm.
16. The method of claim 12, wherein recessing the plurality of
patterned material structures allows the first channel material and
the second channel material to protrude above the plurality of
patterned material structures.
17. The method of claim 13, wherein recessing the plurality of
patterned material structures allows the first channel material and
the second channel material to protrude above the plurality of
patterned material structures.
18. The method of claim 1, wherein the plurality of trenches have a
width of about 5-25 nm.
19. The method of claim 1, wherein the common stack material has a
thickness of about 5-20 nm.
20. The method of claim 1, wherein the first channel material and
the second channel material are different.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] Generally, the present invention relates to the
manufacturing of sophisticated semiconductor devices, and, more
specifically, to various methods of improved fabrication and height
control of structures used in integrated circuit devices.
[0003] 2. Description of the Related Art
[0004] The fabrication of advanced integrated circuits, such as
CPU's, storage devices, ASIC's (application specific integrated
circuits) and the like, requires the formation of a large number of
circuit elements in a given chip area according to a specified
circuit layout, wherein field effect transistors (NMOS and PMOS
transistors) represent one important type of circuit element used
in manufacturing such integrated circuit devices. A field effect
transistor, irrespective of whether an NMOS transistor or a PMOS
transistor is considered, typically comprises doped source and
drain regions that are formed in a semiconducting substrate that
are separated by a channel region. A gate insulation layer is
positioned above the channel region and a conductive gate electrode
is positioned above the gate insulation layer. By applying an
appropriate voltage to the gate electrode, the channel region
becomes conductive and current is allowed to flow from the source
region to the drain region.
[0005] Numerous processing operations are performed in a very
detailed sequence, or process flow, to form such integrated circuit
devices, e.g., deposition processes, etching processes, heating
processes, masking operations, etc. In general, the formation of
integrated circuit devices involves, among other things, the
formation of various layers of material and patterning or removing
portions of those layers of material to define a desired structure,
such as a gate electrode, a sidewall spacer, etc. Device designers
have been very successful in improving the electrical performance
capabilities of transistor devices, primarily by reducing the size
of or "scaling" various components of the transistor, such as the
gate length of the transistors. As size is reduced, the control of
the height of fin structures on bulk substrates is difficult.
Furthermore, existing methods make a CMOS flow difficult when
attempting to use alternative channel materials for nFET and pFET.
Conventional finFET fin formation utilizes a hard-mask and etching
to etch away surrounding area, creating the fin. The trenches on
each side of the fin are then filled with oxide, and excess oxide
is removed with chemical mechanical planarization (CMP) and/or
oxide etching. This can lead to non-uniform fin height. Also, the
fins are sometimes clad with epitaxially grown silicon/germanium
(SiGe) or germanium (Ge) to enhance nFET and pFET performance,
respectively. Critical dimension (CD) and profile matching is
difficult for differing nFET and pFET channel materials with
separate etching. Common etching may not be possible for potential
channel materials of silicon (Si) or group III-V semiconductor
materials for nFET, and SiGE or Ge for pFET.
[0006] The present disclosure is directed to various methods of
fabricating features in an integrated circuit structure, using an
improved fin height control technique. These techniques can be used
in CMOS circuits with alternative channel materials or traditional
materials.
SUMMARY OF THE INVENTION
[0007] The following presents a simplified summary of the invention
in order to provide a basic understanding of some aspects of the
invention. This summary is not an exhaustive overview of the
invention. It is not intended to identify key or critical elements
of the invention or to delineate the scope of the invention. Its
sole purpose is to present some concepts in a simplified form as a
prelude to the more detailed description that is discussed
later.
[0008] Generally, the present disclosure is directed to various
methods for better height control of the finFET patterned fins. In
one example, the method includes forming a layer on a substrate,
patterning that layer to create trenches, then depositing or
growing a common stack material in the trenches. Next, a pFET
masking material is formed over a portion of the structure, and
then an nFET channel material is formed in the unmasked trenches.
The pFET masking material is then removed and an nFET masking
material is formed over the portion of the structure that includes
the nFET channel material. Next a pFET channel material is formed
in the unmasked trenches. Finally the nFET masking material is
removed and the patterned layer is recessed to expose pFET channel
material and nFET channel material fin structures.
[0009] In other illustrative examples, the common stack material is
formed on the substrate prior to forming the layer used to create
trenches. In other embodiments, the method includes the additional
step of providing a planarization method to create a flush surface
prior to the last recessing step.
[0010] One embodiment of this invention begins by depositing or
growing an oxide material, for example, silicon dioxide. This oxide
material is then patterned and etched to open windows or trenches
to the substrate where fins will be grown. If a common channel
material (for example Si:2% C) is desired, it is epitaxially grown
in the windows. Then, some windows are covered and one pole of fins
(for example nFET) are epitaxially grown in the exposed windows
(with Si as an example). The previously masked windows are opened
and the newly formed fins are masked. The alternate channel
material is then grown (i.e., Ge for pFETs). The masked fins are
then un-masked and the silicon dioxide is recessed to allow the
fins to protrude from the oxide. The existing fin formation flow
requires approximately 17 steps. This flow could require less than
14 steps. It also offers a solution for improved fin height control
and improved sidewall profile control. This invention also allows
for different channel materials for NMOS and PMOS.
[0011] Various embodiments of this invention allow for CMOS flow
with epitaxially grown finFETs for height control and channel
enhancement. This invention can be performed without using CMP and
with common channel material in the fin (using 10 steps), without
using CMP and with common channel material throughout (using 10
steps), using CMP and with common channel material in the fin
(using 11 steps), and using CMP and with common channel material
throughout (using 11 steps).
[0012] This invention also allows the finFET channels to be
produced using different channel material (for example, Ge for pFET
and Si for nFET). This invention is extendable to group III-V
semiconductor materials. Instead of a Si substrate, an InP buffer
could be used as the "substrate." This flow does not need a
hard-mask to etch the fins and makes removal of the hard-mask
unnecessary. Initial oxide patterning can be done using various
methods, such as conventional lithography, extreme ultraviolet
lithography (EUV), or sidewall image transfer (SIT). Use of the
tight pitch trenches allows for the incorporation of either
strained or relaxed channels.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The disclosure may be understood by reference to the
following description taken in conjunction with the accompanying
drawings, in which like reference numerals identify like elements,
and in which:
[0014] In general, FIGS. 1-46 show cross-section views of a
structure going through various illustrative examples of
fabrication steps of an improved process used in forming integrated
circuit device structures, in accordance with embodiments of the
present invention.
[0015] While the subject matter disclosed herein is susceptible to
various modifications and alternative forms, specific embodiments
thereof have been shown by way of example in the drawings and are
herein described in detail. It should be understood, however, that
the description herein of specific embodiments is not intended to
limit the invention to the particular forms disclosed, but on the
contrary, the intention is to cover all modifications, equivalents,
and alternatives falling within the spirit and scope of the
invention as defined by the appended claims.
DETAILED DESCRIPTION
[0016] Various illustrative embodiments of the invention are
described below. In the interest of clarity, not all features of an
actual implementation are described in this specification. It will
of course be appreciated that in the development of any such actual
embodiment, numerous implementation-specific decisions must be made
to achieve the developers' specific goals, such as compliance with
system-related and business-related constraints, which will vary
from one implementation to another. Moreover, it will be
appreciated that such a development effort might be complex and
time-consuming, but would nevertheless be a routine undertaking for
those of ordinary skill in the art having the benefit of this
disclosure.
[0017] The present subject matter will be described with reference
to the attached figures. Various structures, systems and devices
are schematically depicted in the drawings for purposes of
explanation only and so as to not obscure the present disclosure
with details that are well known to those skilled in the art.
Nevertheless, the attached drawings are included to describe and
explain illustrative examples of the present disclosure. The words
and phrases used herein should be understood and interpreted to
have a meaning consistent with the understanding of those words and
phrases by those skilled in the relevant art. No special definition
of a term or phrase, i.e., a definition that is different from the
ordinary and customary meaning as understood by those skilled in
the art, is intended to be implied by consistent usage of the term
or phrase herein. To the extent that a term or phrase is intended
to have a special meaning, i.e., a meaning other than that
understood by skilled artisans, such a special definition will be
expressly set forth in the specification in a definitional manner
that directly and unequivocally provides the special definition for
the term or phrase.
[0018] The present disclosure is directed to various methods of
controlling the height of a structure used in forming integrated
circuit devices or in a semiconducting substrate. As will be
readily apparent to those skilled in the art upon a complete
reading of the present application, the present method is
applicable to a variety of devices, including, but not limited to,
ASICs, logic devices, memory devices, etc. Moreover, the present
invention may be employed in forming any of a variety of different
types of features formed on an integrated circuit product, such as
lines, trenches, gate electrode structures, fins for finFET
devices, contact structures, back-end-of-line (BEOL) structures,
etc.
[0019] Portions of the finFET device structure are formed using
well-known techniques and process steps (e.g., techniques and steps
related to doping, photolithography and patterning, etching,
material growth, material deposition, surface planarization, and
the like) that will not be described in detail here. Moreover, the
various tasks and process steps described herein may be
incorporated into a more comprehensive procedure or process having
additional steps or functionality not described in detail herein.
In particular, various steps in the manufacture of semiconductor
based transistors are well known and so, in the interest of
brevity, many conventional steps will only be mentioned briefly
herein or will be omitted entirely without providing the well-known
process details.
[0020] The techniques and technologies described herein may be
utilized to fabricate MOS transistor devices, including NMOS
transistor devices, PMOS transistor devices, and CMOS transistor
devices. In particular, the process steps described herein can be
utilized in conjunction with any semiconductor device fabrication
process that forms gate structures for transistors. Although the
term "MOS device" properly refers to a device having a metal gate
electrode and an oxide gate insulator, that term may be used to
refer to any semiconductor device that includes a conductive gate
electrode (whether metal or other conductive material) that is
positioned over a gate insulator (whether oxide or other insulator)
which, in turn, is positioned over a semiconductor substrate.
[0021] Certain terminology may also be used in the following
description for the purpose of reference only, and thus are not
intended to be limiting. For example, terms such as "upper,"
"lower," "above" and "below" refer to directions in the drawings to
which reference is made. Terms such as "front," "back," "rear,"
"side," "outboard" and "inboard" describe the orientation and/or
location of portions of a feature or element within a consistent
but arbitrary frame of reference which is made clear by reference
to the text and the associated drawings describing the item under
discussion. Such terminology may include the words specifically
mentioned above, derivatives thereof, and words of similar import.
Similarly, the terms "first," "second" and other such numerical
terms referring to structures do not imply a sequence or order
unless clearly indicated by the context. With reference to the
attached drawings, various illustrative embodiments of the methods
and devices disclosed herein will now be described in more
detail.
[0022] The figures illustrate versions using CMP and not using CMP.
They also depict the use of a continuous common channel material
and isolated common channel material. The present disclosure is
directed to various methods of finFET fabrication and to finFET
devices. As will be readily apparent to those skilled in the art
upon a complete reading of the present application, the present
method is applicable to a variety of technologies, e.g., NMOS,
PMOS, CMOS, etc., and is readily applicable to a variety of
devices, including, but not limited to, logic devices, memory
devices, etc. With reference to FIGS. 1-46, various illustrative
embodiments of the methods disclosed herein will now be described
in more detail. Additionally, the term "substrate" as used herein
is intended to be very broad in nature and cover any type or
structure or form of a channel region of a transistor that is
commonly in contact with or positioned below a gate insulation
layer, such as a layer of silicon-germanium that is commonly found
in PMOS devices. The term "substrate" should also be understood to
cover any of a variety of different semiconductor materials, such
as silicon, silicon germanium, gallium arsenide, etc. Instead of a
silicon substrate, an InP buffer could be used as the
substrate.
[0023] FIGS. 1-11 show cross-section views of a structure 100 going
through fabrication steps of an improved finFET fabrication
process, in accordance with embodiments of the present invention.
More specifically, FIG. 1, in one embodiment, shows a
cross-sectional view of a semiconductor device 100 in an early
manufacturing stage. With reference to FIG. 1, the improved finFET
process may start out with providing a semiconductor substrate 106.
The substrate 106 may have a variety of configurations, such as the
depicted bulk silicon configuration. The substrate may also have a
silicon-on-insulator (SOI) configuration that includes a bulk
silicon layer, a buried insulation layer and an active layer,
wherein semiconductor devices are formed in and above the active
layer. Thus, the terms substrate or semiconductor substrate should
be understood to cover all forms of semiconductor structures. The
substrate may also be made of materials other than silicon. The
substrate material 106 is preferably a silicon material as
typically used in the semiconductor industry, e.g., relatively pure
silicon as well as silicon admixed with other elements such as
germanium, carbon, and the like.
[0024] Next with reference to FIG. 2, a material layer 108 is
formed over the top of the substrate 106. In one embodiment, the
material layer 108 is an insulator. The material layer 108 may be
an oxide, such as SiO.sub.2, and may be formed by plasma enhanced
atomic layer deposition (PEALD), low pressure chemical vapor
deposition (LPCVD), chemical vapor deposition (CVD), thermally
grown or deposited with other methods.
[0025] Next with reference to FIG. 3, the material layer 108 is
patterned into at least one patterned material structure 110. The
material layer 108 may be patterned by etching material layer 108
to define a trench 114 and a substrate top surface 112. In one
embodiment, the material layer 108 etching may be performed by
plasma-based etching, leaving the at least one patterned material
structure 110, defining a trench width from 5-25 nm.
[0026] Next with reference to FIG. 4, the common stack material 118
is formed over the substrate top surface 112. In one embodiment,
the common stack material 118 may be formed by epitaxially growing
the common stack material 118. The common stack material 118 may be
Si--C, in the case of Si or SiGe channels, or could be InP in the
case of group III-V semiconductor material channels. In one
embodiment, the common stack material 118 may be 5-20 nm thick.
[0027] Next with reference to FIG. 5, a pFET masking material 120
is masked on a first portion of the common stack material 118 and a
first portion of the at least one patterned material structure 110
proximate to the first portion of the common stack 118. In one
embodiment, the masking of the pFET masking material 120 may
include depositing and patterning the pFET masking material 120.
The pFET masking material 120 may be Si.sub.3N.sub.4, TiN,
SiO.sub.2, etc.
[0028] Next with reference to FIG. 6, an nFET channel material 122
is formed on a second portion of the common stack material 118. In
one embodiment, the nFET channel material 122 may be formed by
epitaxially growing the nFET channel material 122. The nFET channel
material 122 may be Si or group III-V semiconductor material. In
one embodiment, the nFET channel material 122 may be 20-100 nm
thick.
[0029] Next with reference to FIG. 7, the pFET masking material 120
is removed. In one embodiment, the pFET masking material 120
removal may be performed by plasma-based processing or "wet"
chemical methods.
[0030] Next with reference to FIG. 8, an nFET masking material 124
is masked on the nFET channel material 122 and a portion of the at
least one patterned material structure 110 proximate to the nFET
channel material 122. In one embodiment, the masking may be
performed by depositing and patterning the nFET masking material
124. In one embodiment, the nFET masking material 124 may be
Si.sub.3N.sub.4, TiN, SiO.sub.2, etc.
[0031] Next with reference to FIG. 9, a pFET channel material 126
is formed on the first portion of the common stack material 118. In
one embodiment, the pFET channel material 126 may be epitaxially
grown. The pFET channel material 126 may have a Ge content, ranging
from 25-100%, and may be from 20-100 nm thick.
[0032] Next with reference to FIG. 10, the nFET masking material
124 is removed. In one embodiment, the nFET masking material 124
removal may be performed by plasma-based processing or "wet"
chemical methods.
[0033] Next with reference to FIG. 11, the at least one patterned
material structure 110 is recessed to recessed structure 130. In
one embodiment, the recessing may be performed by plasma-based
processing, sublimation-based processing, or "wet" chemical
processing. In one embodiment, the patterned material 110 may be
recessed to a depth range of 15-30 nm.
[0034] FIGS. 12-22 show cross-section views of a structure 200
going through fabrication steps of an improved finFET fabrication
process, in accordance with embodiments of the present invention.
More specifically, FIG. 12, in one embodiment, shows a
cross-sectional view of a semiconductor device 200 in an early
manufacturing stage. With reference to FIG. 12, the improved finFET
process may start out with providing a semiconductor substrate
206.
[0035] Next with reference to FIG. 13, a common stack layer 204 is
formed over the substrate 206. In one embodiment, the common stack
layer 204 may be SiC in the case of Si or SiGe channels or could be
InP in the case of group III-V material channels and may be formed
by epitaxial growth or other deposition methods. In one embodiment,
the common stack layer 204 may be 5-20 nm thick.
[0036] Next with reference to FIG. 14, a material layer 208 is
formed over the common stack layer 204. In one embodiment, the
material layer 208 may be silicon oxide or silicon nitride and may
be formed by various depositing or growth methods.
[0037] Next with reference to FIG. 15, the material layer 208 is
patterned into at least one patterned material structure 210. The
material layer 208 may be patterned by etching material layer 208
to define a trench 214 and a channel layer top surface 212. In one
embodiment, the material layer 208 etching may be performed by
plasma-based processing, leaving the patterned material 210.
[0038] Next with reference to FIG. 16, a pFET masking material 220
is masked on a first portion of the channel layer 204 and a first
portion of the at least one patterned material structure 210. In
one embodiment, the masking of the pFET masking material 220 may
include depositing and patterning the pFET masking material 220.
The pFET masking material 220 can be Si.sub.3N.sub.4, TiN,
SiO.sub.2, etc.
[0039] Next with reference to FIG. 17, an nFET channel material 222
is formed on a second portion of the common stack layer 204. In one
embodiment, the nFET channel material 222 may be formed by
epitaxially growing the nFET channel material 222. The nFET channel
material 222 may be Si or group III-V semiconductor material. In
one embodiment, the nFET channel material 222 may be 20-100 nm
thick.
[0040] Next with reference to FIG. 18, the pFET masking material
220 is removed. In one embodiment, removal of the pFET masking
material 220 may be performed by "wet" chemical removal.
[0041] Next with reference to FIG. 19, an nFET masking material 224
is masked on the nFET channel material 222 and a second portion of
the at least one patterned material structure 210 proximate to the
nFET channel material 222. In one embodiment, the masking may be
performed by depositing and patterning the nFET masking material
224. In one embodiment, the nFET masking material 224 may be
Si.sub.3N.sub.4, TiN, SiO.sub.2, etc.
[0042] Next with reference to FIG. 20, a pFET channel material 226
is formed on the first portion of the common stack layer 204. In
one embodiment, the pFET channel material 226 may be epitaxially
grown. The pFET channel material 226 may have a Ge content ranging
between 25-100%. In one embodiment, the pFET channel material 226
may be 20-100 nm thick.
[0043] Next with reference to FIG. 21, the nFET masking material
224 is removed. In one embodiment, the nFET masking material 224
removal may be performed by "wet" chemical removal.
[0044] Next with reference to FIG. 22, at least one patterned
material structure 210 is recessed to recessed structure 230. In
one embodiment, the recessing may be performed by plasma-based
processing, sublimation techniques or "wet" chemical based methods.
In one embodiment, the at least one patterned material structure
210 may be recessed to a depth range of 15-35 nm.
[0045] FIGS. 23-34 show cross-section views of a structure 300
going through fabrication steps of an improved finFET fabrication
process, in accordance with embodiments of the present invention.
More specifically, FIG. 23, in one embodiment, shows a
cross-sectional view of a semiconductor device 300 in an early
manufacturing stage. With reference to FIG. 23, the improved finFET
process may start out with providing a semiconductor substrate
306.
[0046] Next with reference to FIG. 24, a material layer 308 is
formed over the substrate 306. In one embodiment, the material
layer 308 is an insulator. The material layer 308 may be oxide,
such as SiO.sub.2, and may be formed by deposition or thermal
oxidation methods.
[0047] Next with reference to FIG. 25, the material layer 308 is
patterned into at least one patterned material structure 310. The
material layer 308 may be patterned by etching material layer 308
to define a trench 314 and a substrate top surface 312. In one
embodiment, the material layer 308 etching may be performed by
plasma-based processing, leaving the at least one patterned
material structure 310.
[0048] Next with reference to FIG. 26, the common stack material
318 is formed over the substrate top surface 312. In one
embodiment, the common stack material 318 may be formed by
epitaxially growing the common stack material 318. The common stack
material 318 may be Si-C, uniquely doped Si, etc. In one
embodiment, the common stack material 318 may be 5-15 nm thick.
[0049] Next with reference to FIG. 27, a pFET masking material 320
is masked on a first portion of the common stack material 318 and
the at least one patterned material structure 310 proximate to the
first portion of the common stack 318. In one embodiment, the
masking of the pFET masking material 320 may include depositing and
patterning the pFET masking material 320. The pFET masking material
320 may be Si.sub.3N.sub.4, Tin, SiO.sub.2, etc.
[0050] Next with reference to FIG. 28, an nFET channel material 322
is formed on a second portion of the common stack 318 and may be
formed to a height above a height of a proximate patterned material
structure 310. In one embodiment, the nFET channel material 322 may
be formed by epitaxially growing the nFET channel material 322. The
nFET channel material 322 may be Si, uniquely doped Si, etc. In one
embodiment, the nFET channel material 322 may be 40-60 nm
thick.
[0051] Next with reference to FIG. 29, the pFET masking material
320 is removed. In one embodiment, the pFET masking material
removal 320 may be performed by "wet" chemical etching.
[0052] Next with reference to FIG. 30, an nFET masking material 324
is masked on the nFET channel material 322 and a portion of the at
least one patterned material structure 310 proximate to the nFET
channel material 322. In one embodiment, the masking may be
performed by depositing and patterning the nFET masking material
324. In one embodiment, the nFET masking material 324 may be
Si.sub.3N.sub.4, TiN, SiO.sub.2, etc.
[0053] Next with reference to FIG. 31, a pFET channel material 326
is formed on the first portion of the common stack material 318 and
may be formed to a height above a height of a proximate patterned
material structure 310. In one embodiment, the pFET channel
material 326 may be epitaxially grown. The pFET channel material
326 may have a Ge content ranging between 25-100%. In one
embodiment, the pFET channel material 326 has a range of 40-60 nm
thick.
[0054] Next with reference to FIG. 32, the nFET masking material
324 is removed. In one embodiment, the nFET masking material 324
removal may be performed by "wet" chemical removal.
[0055] Next with reference to FIG. 33, the pFET channel material
326 and the nFET channel material 322 are made flush with the at
least one patterned material structure 310. In one embodiment, this
may be performed by CMP.
[0056] Next with reference to FIG. 34, the at least one patterned
material structure 310 is recessed to recessed structure 330. In
one embodiment, the recessing may be performed by "wet" chemical
removal, sublimation-based methods or plasma-based processing. In
one embodiment, the patterned material 310 may be recessed to a
depth range of 25-35 nm.
[0057] FIGS. 35-46 show cross-section views of a structure 400
going through fabrication steps of an improved finFET fabrication
process, in accordance with embodiments of the present invention.
More specifically, FIG. 35, in one embodiment, shows a
cross-sectional view of a semiconductor device 400 in an early
manufacturing stage. With reference to FIG. 35, the improved finFET
process may start out with providing a semiconductor substrate
406.
[0058] Next with reference to FIG. 36, a common stack layer 404 is
formed over the substrate 406. In one embodiment, the common stack
layer 404 may be SiC, uniquely doped Si, etc, and may be formed by
deposition techniques or epitaxially grown. In one embodiment, the
common stack layer 404 may be 5-20 nm thick.
[0059] Next with reference to FIG. 37, a material layer 408 is
formed over the common stack layer 404. In one embodiment, the
material layer 408 may be oxide, nitride, etc., and may be formed
by typical deposition methods.
[0060] Next with reference to FIG. 38, the material layer 408 is
patterned into at least one patterned material structure 410. The
material layer 408 may be patterned by etching material layer 408
to define a trench 414 and a channel layer top surface 412. In one
embodiment, the material layer 408 etching may be performed by
plasma-based processing, leaving the at least one patterned
material structure 410.
[0061] Next with reference to FIG. 39, a pFET masking material 420
is masked on a first portion of the channel layer 404 and a first
portion of the at least one patterned material structure 410. In
one embodiment, the masking of the pFET masking material 420 may
include depositing and patterning the pFET masking material 420.
The pFET masking material 420 can be Si.sub.3N.sub.4, TiN,
SiO.sub.2, etc.
[0062] Next with reference to FIG. 40, an nFET channel material 422
is formed on a second portion of the common stack layer 404 and may
be formed to a height above a height of a proximate patterned
material structure 410. In one embodiment, the nFET channel
material 422 may be formed by epitaxially growing the nFET channel
material 422. The nFET channel material 422 may be Si, uniquely
doped Si, etc. In one embodiment, the nFET channel material 422 may
be 40-60 nm thick.
[0063] Next with reference to FIG. 41, the pFET masking material
420 is removed. In one embodiment, removal of the pFET masking
material 420 may be performed by "wet" chemical removal.
[0064] Next with reference to FIG. 42, an nFET masking material 424
is masked on the nFET channel material 422 and a second portion of
the at least one patterned material structure 410 proximate to the
nFET channel material 422. In one embodiment, the masking may be
performed by depositing and patterning the nFET masking material
424. In one embodiment, the nFET masking material 424 may be
Si.sub.3N.sub.4, TiN, SiO.sub.2, etc.
[0065] Next with reference to FIG. 43, a pFET channel material 426
is formed on the first portion of the common stack layer 404 and
may be formed to a height above a height of a proximate patterned
material structure 410. In one embodiment, the pFET channel
material 426 may be epitaxially grown. The pFET channel material
426 may have a Ge content in the range of 25-100%. In one
embodiment, the pFET channel material 426 may be 40-60 nm
thick.
[0066] Next with reference to FIG. 44, the nFET masking material
424 is removed. In one embodiment, the nFET masking material 424
removal may be performed by "wet" chemical etching.
[0067] Next with reference to FIG. 45, the pFET channel material
426 and the nFET channel material 422 are made flush with the at
least one patterned material structure 410. In one embodiment, this
may be performed by CMP.
[0068] Next with reference to FIG. 46, the at least one patterned
material structure 410 is recessed to recessed structure 430. In
one embodiment, the recessing may be performed by plasma-based
processing, sublimation-based methods or "wet" chemical etching. In
one embodiment, the at least one patterned material structure 410
may be recessed to a depth range of 25-40 nm.
[0069] The particular embodiments disclosed above are illustrative
only, as the invention may be modified and practiced in different
but equivalent manners apparent to those skilled in the art having
the benefit of the teachings herein. For example, the process steps
set forth above may be performed in a different order. Furthermore,
no limitations are intended to the details of construction or
design herein shown, other than as described in the claims below.
It is, therefore, evident that the particular embodiments disclosed
above may be altered or modified and all such variations are
considered within the scope and spirit of the invention.
[0070] While at least one exemplary embodiment has been presented
in the foregoing detailed description, it should be appreciated
that a vast number of variations exist. It should also be
appreciated that the exemplary embodiment or embodiments described
herein are not intended to limit the scope, applicability or
configuration of the claimed subject matter in any way. Rather, the
foregoing detailed description will provide those skilled in the
art with a convenient road map for implementing the described
embodiment or embodiments. It should be understood that various
changes can be made in the function and arrangement of elements
without departing from the scope defined by the claims, which
includes known equivalents and foreseeable equivalents at the time
of filing this patent application. Accordingly, the protection
sought herein is as set forth in the claims below.
* * * * *