U.S. patent application number 13/794822 was filed with the patent office on 2013-08-01 for thermal module with airflow guiding function.
This patent application is currently assigned to WISTRON CORPORATION. The applicant listed for this patent is WISTRON CORPORATION. Invention is credited to Wei-Cheng Chou.
Application Number | 20130192802 13/794822 |
Document ID | / |
Family ID | 42353222 |
Filed Date | 2013-08-01 |
United States Patent
Application |
20130192802 |
Kind Code |
A1 |
Chou; Wei-Cheng |
August 1, 2013 |
THERMAL MODULE WITH AIRFLOW GUIDING FUNCTION
Abstract
A thermal module includes a fan device having a fan and a fan
housing for covering the fan. A vent is disposed on the fan
housing. The thermal module further includes an airflow guiding
device attached to the fan housing and disposed on a side of the
vent for guiding airflow into the vent.
Inventors: |
Chou; Wei-Cheng; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
WISTRON CORPORATION; |
New Taipei City |
|
TW |
|
|
Assignee: |
WISTRON CORPORATION
New Taipei City
TW
|
Family ID: |
42353222 |
Appl. No.: |
13/794822 |
Filed: |
March 12, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12638989 |
Dec 16, 2009 |
8439632 |
|
|
13794822 |
|
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Current U.S.
Class: |
165/122 |
Current CPC
Class: |
H05K 7/20181 20130101;
H05K 7/20145 20130101; G06F 1/203 20130101; F28F 13/12
20130101 |
Class at
Publication: |
165/122 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 23, 2009 |
TW |
098201537 |
Claims
1. A thermal module comprising: a fan device comprising: a fan; and
a fan housing for covering the fan, a vent being disposed on the
fan housing; and an airflow guiding device attached to the fan
housing and disposed on a side of the vent for guiding airflow into
the vent.
2. The thermal module of claim 1, wherein the airflow guiding
device is an arc structure.
3. The thermal module of claim 1, wherein the airflow guiding
device is glued to the fan housing.
4. The thermal module of claim 1, further comprising an elastic pad
installed on a side of the airflow guiding device.
5. The thermal module of claim 3, wherein the elastic pad is made
of rubber material.
6. The thermal module of claim 1, wherein the airflow guiding
device is a baffle.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a division of application Ser. No.
12/638,989 filed on Dec. 16, 2009, and the entire contents of which
are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a thermal module, and more
particularly, to a thermal module with airflow guiding
function.
[0004] 2. Description of the Prior Art
[0005] Consumer electronic products have more and more functions
with progress of technology. Hence the demand for performance
increases accordingly. The high performance brings high energy
consumption resulting in resonance, noise, thermal problems, and so
on. For example, the reliability and stability of electronic
products reduce if heat generated by internal electronic components
can not be dissipated effectively. The conventional solution of
thermal problem is utilizing a thermal system, such as a fan, a
heat sink, a heat pipe, or a cooling chip for reducing temperature
of the electronic components so that the electronic products can
operate normally.
[0006] For instance, heat transmitted from electronic components on
the mother board to a housing made of plastic or metal material, so
that a palm rest on a notebook computer often has high temperature
causing uncomfortable feeling of a user. However, the thermal
module, such as thermal fins and the heat pipe, cannot be disposed
in a small gap between the mother board and the housing. For
solving this problem, the temperature of the heat source can be
reduced by airflow passing therethrough. For example, a guiding
channel formed by sponge or plastic baffle for guiding airflow from
the fan to the heat source can dissipate hot air around the heat
source. However there is no airflow guiding structure applied for
the fan, and the fan inhales surrounding cold air at lower flow
resistance more easily than the hot air passing through the guiding
channel in the system. It is disadvantageous to reduce surface
temperature of the palm rest due to poor heat-dissipating
efficiency.
SUMMARY OF THE INVENTION
[0007] The present invention discloses a thermal module including a
fan device having a fan and a fan housing for covering the fan. A
vent is disposed on the fan housing. The thermal module further
includes an airflow guiding device attached to the fan housing and
disposed on a side of the vent for guiding airflow into the
vent.
[0008] According to the claimed invention, the airflow guiding
device is an arc structure.
[0009] According to the claimed invention, the airflow guiding
device is glued to the fan housing.
[0010] According to the claimed invention, the thermal module
further includes an elastic pad installed on a side of the airflow
guiding device.
[0011] According to the claimed invention, the elastic pad is made
of rubber material.
[0012] According to the claimed invention, the airflow guiding
device is a baffle.
[0013] These and other objectives of the present invention will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the preferred
embodiment that is illustrated in the various figures and
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is a perspective drawing of a thermal module
installed inside a housing according to a first embodiment of the
present invention.
[0015] FIG. 2 is an exploded diagram of the thermal module
installed inside the housing according to the first embodiment of
the present invention.
[0016] FIG. 3 is a sectional view of the thermal module installed
inside the housing according to the first embodiment of the present
invention.
[0017] FIG. 4 is a diagram of the thermal module according to the
first embodiment of the present invention.
[0018] FIG. 5 is a perspective drawing of a thermal module
according to a second embodiment of the present invention.
[0019] FIG. 6 is an exploded diagram of the thermal module
according to the second embodiment of the present invention.
[0020] FIG. 7 is a diagram of the airflow guiding device according
to the second embodiment of the present invention.
[0021] FIG. 8 is a diagram of a thermal module in a guiding
condition according to a third embodiment of the present
invention.
[0022] FIG. 9 is a sectional view of the thermal module in the
guiding condition according to the third embodiment of the present
invention.
[0023] FIG. 10 is a diagram of the thermal module in a non-guiding
condition according to the third embodiment of the present
invention.
[0024] FIG. 11 is a sectional view of the thermal module in the
non-guiding condition according to the third embodiment of the
present invention.
[0025] FIG. 12 is an exploded drawing of the thermal module
according to the third embodiment of the present invention.
[0026] FIG. 13 is a diagram of the airflow guiding device according
to the third embodiment of the present invention.
[0027] FIG. 14 is a diagram of a thermal module according to a
fourth embodiment of the present invention.
[0028] FIG. 15 is an exploded drawing of the thermal module
according to the fourth embodiment of the present invention.
DETAILED DESCRIPTION
[0029] Please refer to FIG. 1 to FIG. 4. FIG. 1 is a perspective
drawing of a thermal module 50 installed inside a housing according
to a first embodiment of the present invention. FIG. 2 is an
exploded diagram of the thermal module 50 installed inside the
housing according to the first embodiment of the present invention.
FIG. 3 is a sectional view of the thermal module 50 installed
inside the housing according to the first embodiment of the present
invention. FIG. 4 is a diagram of the thermal module 50 according
to the first embodiment of the present invention. The thermal
module 50 can be installed inside a computer system, such as a
notebook computer, and fixed on a substrate 52 which can be a
thermal conductive substrate or a circuit board. The substrate 52
can be disposed selectively. The thermal module 50 is installed
between a first casing 54 and a second casing 56. The first casing
54 and the second casing 56 cover internal components together. For
example, the first casing 54 can be a bottom casing, and the second
casing 56 can be an upper casing. A first opening 541 and a second
opening 542 are disposed on the first casing 54. The thermal module
50 inhales cold air via the first opening 541 and exhausts hot air
via the second opening 542. For showing the disposition of the
thermal module 50, the first opening 541, and the second opening
542 clearly, the second casing 56 is omitted to display in FIG. 1.
As shown in FIG. 2, the thermal module 50 includes a fan device 58
for inhaling the cold air via the first opening 541 and exhausts
the hot air via the second opening 542. The fan device 58 includes
a fan 60 and a fan housing 62 for covering the fan 60. A first vent
621, a second vent 622, and an outlet 623 are disposed on the fan
housing 62. The fan 60 inhales the cold air via the first vent 621
and the second vent 622 and exhausts the hot air via the outlet
623. The first vent 621 is located in a position corresponding to
the first opening 541 on the first casing 54. Most airflow enters
into the fan 60 via the first opening 541 on the first casing 54
with higher porosity and the first vent 621 perpendicularly. The
second vent 622 often faces the motherboard or the upper casing
with lower porosity so that airflow has to enter into the fan 60
through a gap between the fan device 58 and the second casing 56.
Furthermore, the fan device 58 can be connected to other
heat-dissipating components, such as a heat pipe or thermal fins,
for dissipating heat transmitted from the other heat-dissipating
components with forced convection method.
[0030] The thermal module 50 further includes an airflow guiding
device 64 installed on the fan housing 62 and disposed on a side of
the first vent 621 for guiding airflow into the first vent 621. In
this embodiment, the airflow guiding device 64 can be an arc
structure and a baffle. The airflow guiding device 64 can be
integrated with the fan housing 62 monolithically or be glued to
the fan housing 62. The airflow guiding device 64 can be made of
plastic, sponge, or metal material. As shown in FIG. 3, when the
airflow enters the second vent 622 through the gap around the
second vent 622, the airflow guiding device 64 can guide the
airflow around the fan device 58, that is, the airflow guiding
device 64 can block the airflow passing through the second vent 622
laterally so as to guide the airflow to flow downward into the
second vent 622. Furthermore, the airflow guiding device 64 can
increase the gap of airflow inhalation for preventing other objects
from contacting with the fan device 58 directly so as to reduce the
gap of airflow inhalation. The airflow can be guided to flow into
the second vent 622 in a predetermined direction by disposition of
the airflow guiding device 64. For example, the airflow guiding
device 64 can be orientated to face the heat source with high
temperature so that the airflow guiding device 64 can guide the hot
airflow from the heat source with high temperature into the second
vent 622 for increasing heat-dissipating efficiency. The airflow
guiding device 64 also can be disposed to guide the airflow to flow
through electronic components with heat below the palm rest first
and then enter into the fan device 58 so as to reduce the
temperature of the palm rest and provide comfortable feeling for
the user. The arc structure of the airflow guiding device 64 can be
oriented according to disposition of the heat source and cooperates
with conventional airflow guiding mechanism together for
dissipating heat outside smoothly.
[0031] Please refer FIG. 5 and FIG. 6. FIG. 5 is a perspective
drawing of a thermal module 80 according to a second embodiment of
the present invention. FIG. 6 is an exploded diagram of the thermal
module 80 according to the second embodiment of the present
invention. The thermal module 80 includes a fan device 82 having a
fan housing 84 for covering a fan, which is not shown in figures
for displaying other components clearly. A groove 841 is formed on
the fan housing 84, and the groove 841 can be an arc groove. A
first ratchet structure 86 is disposed on a side of the groove 841,
and an opening 88 is disposed within the first ratchet structure
86. The thermal module 80 further includes an airflow guiding
device 90. The difference between the first embodiment and the
second embodiment is that the airflow guiding device 90 is
installed on the fan housing 84 in a slidable manner for adjusting
inhaling direction of the fan device 82 conveniently. Please refer
to FIG. 5 to FIG. 7. FIG. 7 is a diagram of the airflow guiding
device 90 according to the second embodiment of the present
invention. The airflow guiding device 90 includes a sliding
component 92 installed inside the groove 841 in a slidable manner.
The sliding component 92 can be an arc structure and a baffle. The
airflow guiding device 90 further includes a fixing component 94
connected to the sliding component 92 for fixing the sliding
component 92 inside the groove 841. A second ratchet structure 96
is disposed on the fixing component 94 for engaging with the first
ratchet structure 86. For assembling the airflow guiding device 90
on the fan housing 84, the fixing component 94 is aimed at the
opening 88 first so that the fixing component 94 can pass through
the opening 88 for disposing the sliding component 92 inside the
groove 841. The engagement of the first ratchet structure 86 and
the second ratchet structure 96 can fix the sliding component 92
inside the groove 841 tightly. The sliding component 92 can rotate
in the groove 841 to orientate at a specific angle. The principle
of guiding airflow of the second embodiment is the same as the one
of the first embodiment, and the detailed description is omitted
herein.
[0032] Please refer FIG. 8 to FIG. 12. FIG. 8 is a diagram of a
thermal module 100 in an airflow guiding condition according to a
third embodiment of the present invention. FIG. 9 is a sectional
view of the thermal module 100 in the airflow guiding condition
according to the third embodiment of the present invention. FIG. 10
is a diagram of the thermal module 100 in a non airflow guiding
condition according to the third embodiment of the present
invention. FIG. 11 is a sectional view of the thermal module 100 in
the non airflow guiding condition according to the third embodiment
of the present invention. FIG. 12 is an exploded drawing of the
thermal module 100 according to the third embodiment of the present
invention. The thermal module 100 includes a fan device 102 having
a fan housing 104 for covering a fan, which is not shown in figures
for displaying other components clearly. A slot 1041 is formed on
the fan housing 104, and the slot 1041 can be an arc groove. Two
positioning holes 106 are formed on both sides of the slot 1041
respectively. The thermal module 100 further includes an airflow
guiding device 108. The difference between the third embodiment,
the first embodiment, and the second embodiment is that the airflow
guiding device 108 is installed on the fan housing 104 in a
protrudable manner. When there is a need to utilize the airflow
guiding device 108, the airflow guiding device 108 can protrude
from the fan housing 104; and when there is no need to utilize the
airflow guiding device 108, the airflow guiding device 108 can be
contained in the fan housing 104. Please refer to FIG. 8 to FIG.
13. FIG. 13 is a diagram of the airflow guiding device 108
according to the third embodiment of the present invention. The
airflow guiding device 108 includes a protruding component 110
installed inside the slot 1041 in a protrudable manner. The
protruding component 110 can be an arc structure and a baffle. Two
positioning components 112 are disposed on both sides of the
protruding component 110 respectively corresponding to the
positioning holes 106 for inserting into the positioning holes 106
so as to fix the protruding component 110 in the slot 1041. A
plurality of pins 114 is formed on the slot 1041, and a plurality
of pillars 116 is disposed on the protruding component 110
corresponding to the plurality of pins 114 respectively. The
airflow guiding device 108 further includes a plurality of elastic
components 118 for sheathing the pins 114 and installed inside the
pillars 116 respectively. The elastic component 118 is for
providing elastic force to the protruding component 110. The
elastic component 118 can be a spring. The amount and the
disposition of the positioning holes 106, the positioning
components 112, the pins 114, the pillars 116, and the elastic
components 118 are not limited to this embodiment and can be
designed according actual demand.
[0033] When the user presses the protruding component 110 downward
from the position as shown in FIG. 8 and FIG. 9 to the position as
shown in FIG. 10 and FIG. 11, the positioning components 112 on the
protruding component 110 insert into the lower positioning holes
106 and the elastic components 118 are compressed. As shown in FIG.
10, the protruding component 110 is contained in the fan housing
104, and the thermal module 100 can not provide airflow guiding
function. When the user pulls the protruding component 110 upward
from the position as shown in FIG. 10 and FIG. 11 to the position
as shown in FIG. 8 and FIG. 9, the elastic components 118 are not
compressed anymore and provide elastic force to the protruding
component 110 for lifting the protruding component 110 so that the
positioning components 112 on the protruding component 110 insert
into the higher positioning holes 106 respectively. As shown in
FIG. 8, the protruding component 110 protrudes from the fan housing
104 so that the thermal module 100 can provide airflow guiding
function. The principle of guiding airflow of the third embodiment
is the same as the one of the previous embodiment, and the detailed
description is omitted herein.
[0034] Please refer to FIG. 14 and FIG. 15. FIG. 14 is a diagram of
a thermal module 120 according to a fourth embodiment of the
present invention. FIG. 15 is an exploded drawing of the thermal
module 120 according to the fourth embodiment of the present
invention. The thermal module 120 includes a fan device 122 having
a fan housing 124 for covering a fan, which is not shown in figures
for displaying other components clearly. The thermal module 120
further includes an airflow guiding device 126 installed on the fan
housing 124. The airflow guiding device 126 can be an arc structure
and a baffle. The airflow guiding device 126 can be integrated with
the fan housing 124 monolithically or be glued to the fan housing
124. The difference between the fourth embodiment and the first
embodiment is that the thermal module 120 further includes an
elastic pad 128 installed on a side of the airflow guiding device
126, such as being glued to the airflow guiding device 126. The
elastic pad 128 can be made of rubber material. The interference of
the elastic pad 128 and the second casing in FIG. 2 can make the
thermal module 120 contact with the motherboard or the upper casing
more tightly for preventing the airflow from passing through the
airflow guiding device 126. The elastic pad 128 also can be applied
for the previous embodiments, and the detailed description is
omitted herein.
[0035] In contrast with the prior art, the present invention
provides the thermal module with airflow guiding function for
guiding the hot air from the heat source into the fan so as to
increase heat-dissipating efficiency. The arc structure of the
airflow guiding device can be oriented according to the position of
the heat source and cooperates with conventional airflow guiding
mechanism together for dissipating heat outside smoothly.
[0036] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the invention. Accordingly, the
above disclosure should be construed as limited only by the metes
and bounds of the appended claims.
* * * * *