U.S. patent application number 13/342321 was filed with the patent office on 2013-07-04 for led backlight module structure for increasing process yield.
This patent application is currently assigned to KOCAM INTERNATIONAL CO., LTD.. The applicant listed for this patent is Tsan-Jung Chen. Invention is credited to Tsan-Jung Chen.
Application Number | 20130170249 13/342321 |
Document ID | / |
Family ID | 48671127 |
Filed Date | 2013-07-04 |
United States Patent
Application |
20130170249 |
Kind Code |
A1 |
Chen; Tsan-Jung |
July 4, 2013 |
LED Backlight Module Structure for Increasing Process Yield
Abstract
LED backlight module structure for increasing process yield
comprises a housing, a copper circuit layer, a plurality of LED
chips, a plurality of solder paste overflow prevention members, a
light guide plate, and a bottom reflector. In the present
invention, it mainly disposed the solder paste overflow prevention
members between the LED chips and the copper circuit layer,
therefore, the solder paste overflow phenomenon is prevented when
using a pressing fixture to assist in executing the welding process
of LED chips, and it ensures that the soldering pins of the LED
chips would not electrically connect to each other due to the
solder paste overflow phenomenon. Moreover, a position limiting
band can be further disposed on the copper circuit layer for
receiving and fixing the LED chips, in addition, the position
limiting band is helpful to the LED chips in heat dissipation when
the LED chips emit light.
Inventors: |
Chen; Tsan-Jung; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Chen; Tsan-Jung |
New Taipei City |
|
TW |
|
|
Assignee: |
KOCAM INTERNATIONAL CO.,
LTD.
New Taipei City
TW
|
Family ID: |
48671127 |
Appl. No.: |
13/342321 |
Filed: |
January 3, 2012 |
Current U.S.
Class: |
362/609 |
Current CPC
Class: |
G02B 6/0085 20130101;
G02B 6/0083 20130101; G02B 6/009 20130101; G02B 6/0055
20130101 |
Class at
Publication: |
362/609 |
International
Class: |
F21V 7/04 20060101
F21V007/04 |
Claims
1. An Light-emitting diode (LED) backlight module structure for
increasing process yield, comprising: a housing; a copper circuit
layer, being disposed on the surface of a circuit-disposing portion
of the housing through a thermally conductive insulating layer,
wherein the copper circuit layer has at least one main circuit and
a plurality of soldering point; a plurality of LED chips, having a
plurality of soldering pins and a light-emitting surface on the
bottoms and the tops thereof, wherein the plurality of LED chips
are disposed on the copper circuit layer, and the soldering pins
being welded to the soldering points; a plurality of solder paste
overflow prevention members, being disposed between the LED chips
and the copper circuit layer; a light guide plate, being disposed
in the housing, and a light-receiving surface of the light guide
plate being opposite to the light-emitting surfaces of the LED
chips; and a bottom reflector, being disposed on the bottom of the
light guide plate for preventing light leakage.
2. The LED backlight module structure for increasing process yield
of claim 1, further comprising: a reflector, being disposed on the
surface of the copper circuit layer and having a plurality of LED
through holes for pass of the LED chips.
3. The LED backlight module structure for increasing process yield
of claim 1, wherein the solder paste overflow prevention member
comprises a bar-shaped solder paste overflow prevention member and
four block-shaped solder paste overflow prevention members.
4. The LED backlight module structure for increasing process yield
of claim 1, further comprising: a position limiting band, being
disposed on the solder paste overflow prevention members and
comprising: a plurality of position limiting holes, for receiving
and fixing the LED chips; and a plurality of avoiding recesses,
being formed on the bottom of the inner wall of each position
limiting hole pairwise.
5. The LED backlight module structure for increasing process yield
of claim 3, wherein the one bar-shaped solder paste overflow
prevention member and the four block-shaped solder paste overflow
prevention members may be integratedly formed to one H-shaped
solder paste overflow prevention member.
6. The LED backlight module structure for increasing process yield
of claim 1, wherein the housing is selected from the group
consisting of: sheet metal housing and extrusion housing.
7. The LED backlight module structure for increasing process yield
of claim 6, wherein the appearance of the said sheet metal housing
is selected from the group consisting of: "" shape and "L"
shape.
8. The LED backlight module structure for increasing process yield
of claim 1, wherein the material for making the solder paste
overflow prevention member is selected from the group consisting
of: heat-resistant adhesive tape, acrylic, silicone, and epoxy
resin.
9. The LED backlight module structure for increasing process yield
of claim 1, further comprising: a circuit substrate, being disposed
on the circuit-disposing portion of the housing for bearing and
carrying the thermally conductive insulating layer and the copper
circuit layer.
10. The LED backlight module structure for increasing process yield
of claim 9, wherein the material for making the circuit substrate
is selected from the group consisting of: aluminum and
fiberglass.
11. An Light-emitting diode (LED) backlight module structure for
increasing process yield, comprising: a housing, having at least
one circuit-disposing portion, and the circuit-disposing portion
having a plurality of disposing holes; a circuit substrate; a
copper circuit layer, being disposed on the surface of the circuit
substrate through a thermally conductive insulating layer, wherein
the copper circuit layer has at least one main circuit and a
plurality of soldering point; a plurality of LED chips, having a
plurality of soldering pins and a light-emitting surface on the
bottoms and the tops thereof, wherein the plurality of LED chips
are disposed on the copper circuit layer, and the soldering pins
being welded to the soldering points; moreover, the circuit
substrate being attached to the outer surface of the
circuit-disposing portion via another thermally conductive
insulating layer, such that the LED chips respectively pass through
the disposing holes and enter the interior of the housing from the
outer surface of the circuit-disposing portion; a plurality of
solder paste overflow prevention members, being disposed between
the LED chips and the copper circuit layer; a light guide plate,
being disposed in the housing, and a light-receiving surface of the
light guide plate being opposite to the light-emitting surfaces of
the LED chips; and a bottom reflector, being disposed on the bottom
of the light guide plate for preventing light leakage.
12. The LED backlight module structure for increasing process yield
of claim 11, further comprising: a reflector, being disposed on the
surface of the copper circuit layer and having a plurality of LED
through holes for pass of the LED chips.
13. The LED backlight module structure for increasing process yield
of claim 11, wherein the solder paste overflow prevention member
comprises a bar-shaped solder paste overflow prevention member and
four block-shaped solder paste overflow prevention members.
14. The LED backlight module structure for increasing process yield
of claim 11, further comprising: a position limiting band, being
disposed on the solder paste overflow prevention members and
comprising: a plurality of position limiting holes, for receiving
and fixing the LED chips; and a plurality of avoiding recesses,
being formed on the bottom of the inner wall of each position
limiting hole pairwise.
15. The LED backlight module structure for increasing process yield
of claim 13, wherein the one bar-shaped solder paste overflow
prevention member and the four block-shaped solder paste overflow
prevention members may be integratedly formed to one H-shaped
solder paste overflow prevention member.
16. The LED backlight module structure for increasing process yield
of claim 1, wherein the housing is selected from the group
consisting of: sheet metal housing and extrusion housing.
17. The LED backlight module structure for increasing process yield
of claim 16, wherein the appearance of the said sheet metal housing
is selected from the group consisting of: "" shape and "L"
shape.
18. The LED backlight module structure for increasing process yield
of claim 11, wherein the material for making the solder paste
overflow prevention member is selected from the group consisting
of: heat-resistant adhesive tape, acrylic, silicone, and epoxy
resin.
19. The LED backlight module structure for increasing process yield
of claim 11, wherein the material for making the circuit substrate
is selected from the group consisting of: aluminum and
fiberglass.
20. An Light-emitting diode (LED) backlight module structure for
increasing process yield, comprising: a housing; a copper circuit
layer, being disposed on the surface of a circuit-disposing portion
of the housing through a thermally conductive insulating layer,
wherein the copper circuit layer has at least one main circuit and
a plurality of soldering point; a plurality of LED chips, having a
plurality of soldering pins and a light-emitting surface on the
bottoms and the tops thereof, wherein the plurality of LED chips
are disposed on the copper circuit layer, and the soldering pins
being welded to the soldering points; a position limiting band,
being disposed on the copper circuit layer via another thermally
conductive insulating layer, wherein the another thermally
conductive insulating layer has a plurality of openings for
exposing the soldering points of the copper circuit layer, and the
position limiting band comprising: a plurality of position limiting
holes, for receiving and fixing the LED chips; and a plurality of
avoiding recesses, being formed on the bottom of the inner wall of
each position limiting hole pairwise; a light guide plate, being
disposed in the housing, and a light-receiving surface of the light
guide plate being opposite to the light-emitting surfaces of the
LED chips; and a bottom reflector, being disposed on the bottom of
the light guide plate for preventing light leakage.
21. The LED backlight module structure for increasing process yield
of claim 20, further comprising: a reflector, being disposed on the
surface of the copper circuit layer and having a plurality of LED
through holes for pass of the LED chips.
22. The LED backlight module structure for increasing process yield
of claim 20, further comprising: a plurality of solder paste
overflow prevention members, being disposed between the LED chips
and the copper circuit layer.
23. The LED backlight module structure for increasing process yield
of claim 22, wherein the solder paste overflow prevention member
comprises a bar-shaped solder paste overflow prevention member and
four block-shaped solder paste overflow prevention members.
24. The LED backlight module structure for increasing process yield
of claim 23, wherein the one bar-shaped solder paste overflow
prevention member and the four block-shaped solder paste overflow
prevention members may be integratedly formed to one H-shaped
solder paste overflow prevention member.
25. The LED backlight module structure for increasing process yield
of claim 1, wherein the housing is selected from the group
consisting of: sheet metal housing and extrusion housing.
26. The LED backlight module structure for increasing process yield
of claim 25, wherein the appearance of the said sheet metal housing
is selected from the group consisting of: "" shape and "L"
shape.
27. The LED backlight module structure for increasing process yield
of claim 22, wherein the material for making the solder paste
overflow prevention member is selected from the group consisting
of: heat-resistant adhesive tape, acrylic, silicone, and epoxy
resin.
28. The LED backlight module structure for increasing process yield
of claim 20, further comprising: a circuit substrate, being
disposed on the circuit-disposing portion of the housing for
bearing and carrying the thermally conductive insulating layer and
the copper circuit layer.
29. The LED backlight module structure for increasing process yield
of claim 28, wherein the material for making the circuit substrate
is selected from the group consisting of: aluminum and
fiberglass.
30. An Light-emitting diode (LED) backlight module structure for
increasing process yield, comprising: a housing, having at least
one circuit-disposing portion, and the circuit-disposing portion
having a plurality of disposing holes; a circuit substrate; a
copper circuit layer, being disposed on the surface of the circuit
substrate through a thermally conductive insulating layer, wherein
the copper circuit layer has at least one main circuit and a
plurality of soldering point; a plurality of LED chips, having a
plurality of soldering pins and a light-emitting surface on the
bottoms and the tops thereof, wherein the plurality of LED chips
are disposed on the copper circuit layer, and the soldering pins
being welded to the soldering points; moreover, the circuit
substrate being attached to the outer surface of the
circuit-disposing portion via another thermally conductive
insulating layer, such that the LED chips respectively pass through
the disposing holes and enter the interior of the housing from the
outer surface of the circuit-disposing portion; a position limiting
band, being disposed on the copper circuit layer via another
thermally conductive insulating layer, wherein the another
thermally conductive insulating layer has a plurality of openings
for exposing the soldering points of the copper circuit layer, and
the position limiting band comprising: a plurality of position
limiting holes, for receiving and fixing the LED chips; and a
plurality of avoiding recesses, being formed on the bottom of the
inner wall of each position limiting hole pairwise; a light guide
plate, being disposed in the housing, and a light-receiving surface
of the light guide plate being opposite to the light-emitting
surfaces of the LED chips; and a bottom reflector, being disposed
on the bottom of the light guide plate for preventing light
leakage.
31. The LED backlight module structure for increasing process yield
of claim 30, further comprising: a reflector, being disposed on the
surface of the copper circuit layer and having a plurality of LED
through holes for pass of the LED chips.
32. The LED backlight module structure for increasing process yield
of claim 30, further comprising: a plurality of solder paste
overflow prevention members, being disposed between the LED chips
and the copper circuit layer.
33. The LED backlight module structure for increasing process yield
of claim 32, wherein the solder paste overflow prevention member 17
comprises a bar-shaped solder paste overflow prevention member and
four block-shaped solder paste overflow prevention members.
34. The LED backlight module structure for increasing process yield
of claim 33, wherein the one bar-shaped solder paste overflow
prevention member and the four block-shaped solder paste overflow
prevention members may be integratedly formed to one H-shaped
solder paste overflow prevention member.
35. The LED backlight module structure for increasing process yield
of claim 30, wherein the housing is selected from the group
consisting of: sheet metal housing and extrusion housing.
36. The LED backlight module structure for increasing process yield
of claim 35, wherein the appearance of the said sheet metal housing
is selected from the group consisting of: "" shape and "L"
shape.
37. The LED backlight module structure for increasing process yield
of claim 32, wherein the material for making the solder paste
overflow prevention member is selected from the group consisting
of: heat-resistant adhesive tape, acrylic, silicone, and epoxy
resin.
38. The LED backlight module structure for increasing process yield
of claim 30, wherein the material for making the circuit substrate
is selected from the group consisting of: aluminum and fiberglass.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Technical Field
[0002] The present invention relates to a backlight module
structure, and more particularly, to an LED backlight module
structure for increasing process yield.
[0003] 2. Description of Related Art
[0004] Light-emitting diodes (LEDs) are the widely used
light-emitting devices. The LED has the advantages of small volume
and lone lifetime, so that it is widely used in human life.
[0005] Recently, LEDs are also applied in backlight module. Please
refer to FIG. 1, which illustrates a stereo diagram of a
conventional LED backlight module. As shown in FIG. 1, the
conventional LED backlight module 1' includes: a housing 11', a
copper circuit layer 12', a plurality of LED chips 13', a reflector
14, a light guide plate 15, and a bottom reflector 16', wherein the
housing 11' includes a housing bottom 111', and the copper circuit
layer 12' is disposed on the housing bottom 111' through a
thermally conductive insulating layer. Please refer to FIG. 2,
there is shown a stereo diagram of the LED chip. As shown in FIG.
2, a plurality of welding pins are exposed out of the package 130'
of the LED chip 13', including positive welding pins 131' and
negative welding pins 132'; and LED chip 13' has a light-emitting
surface 134' in the top thereof.
[0006] Referring to FIG. 2 again, and please simultaneously refer
to FIG. 3A, FIG. 3B and FIG. 3C, there are shown schematic welding
processes diagram of the LED chips. As shown in FIG. 3A, when
executing the welding process of the LED chips 13', an LED carrier
3' is general used for carrying the LED chips 13' and putting the
LED chips 13' on the surface of the copper circuit layer 12', and
then, as shown in FIG. 3B, the positive welding pins 131' and the
negative welding pins 132' contact with the welding points 122' of
the copper circuit layer 12', wherein the solder is disposed on the
welding points 122' in advance. Continuously, as shown in FIG. 3C,
a pressing fixture 2' is used for pressing the LED chips 13', and
then the housing 11' is heat for melting the solder on the welding
points 122', so as to weld the positive welding pins 131' and the
negative welding pins 132' on the welding points 122'.
[0007] The aforesaid LED backlight module 1' is widely used in
liquid crystal display, in addition, the pressing fixture 2' levels
all the LED chips 13' on the copper circuit layer 12' when the
welding process is executed, such that the backlight quality of the
LED backlight module 1' is good. Even so, the LED backlight module
1' still includes the drawbacks and the shortcomings as follows:
[0008] 1. When executing the welding process of the LED chips 13',
the solder paste overflow phenomenon may occur between the bottoms
of the LED chips 13' and the copper circuit layer 12', and cause
the positive welding pins 131' electrically connect to the negative
welding pins 132', such that some LED chips 13' may fail to
normally work. [0009] 2. Inheriting to above point 1, furthermore,
the solder paste overflow phenomenon may directly influence the
process yield of the LED backlight module 1'.
[0010] Accordingly, in view of the conventional LED backlight
module still has shortcomings and drawbacks, the inventor of the
present application has made great efforts to make inventive
research thereon and eventually provided an LED backlight module
structure for increasing process yield.
BRIEF SUMMARY OF THE INVENTION
[0011] The first objective of the present invention is to provide
an LED backlight module structure for increasing process yield, in
which a plurality of solder paste overflow prevention members is
disposed between the LED chips and the copper circuit layer,
therefore, the solder paste overflow phenomenon can be prevented
when using a pressing fixture to assist in executing the welding
process of LED chips, and then it can make sure that the soldering
pins of the LED chips would not electrically connect to each other
due to the solder paste overflow phenomenon.
[0012] Accordingly, to achieve the first objective of the present
invention, the inventor proposes an LED backlight module structure
for increasing process yield, comprising:
[0013] a housing;
[0014] a copper circuit layer, disposed on the surface of a
circuit-disposing portion of the housing through a thermally
conductive insulating layer, wherein the copper circuit layer has
at least one main circuit and a plurality of soldering point;
[0015] a plurality of LED chips, having a plurality of soldering
pins and a light-emitting surface on the bottoms and the tops
thereof, wherein the plurality of LED chips are disposed on the
copper circuit layer, and the soldering pins being welded to the
soldering points;
[0016] a plurality of solder paste overflow prevention members,
disposed between the LED chips and the copper circuit layer;
[0017] a light guide plate, disposed in the housing, and a
light-receiving surface of the light guide plate is opposite to the
light-emitting surfaces of the LED chips; and
[0018] a bottom reflector, disposed on the bottom of the light
guide plate for preventing light leakage.
[0019] The second objective of the present invention is to provide
an LED backlight module structure for increasing process yield, in
which a plurality of solder paste overflow prevention members is
disposed between the LED chips and the copper circuit layer,
moreover, the copper circuit layer and the solder paste overflow
prevention members are disposed on the outer surface of the housing
for meeting the demands from different structure design of LED
backlight module.
[0020] So that, to achieve the second objective of the present
invention, the inventor proposes an LED backlight module structure
for increasing process yield, comprising:
[0021] a housing, having at least one circuit-disposing portion,
and the circuit-disposing portion has a plurality of disposing
holes;
[0022] a circuit substrate;
[0023] a copper circuit layer, disposed on the surface of the
circuit substrate through a thermally conductive insulating layer,
wherein the copper circuit layer has at least one main circuit and
a plurality of soldering point;
[0024] a plurality of LED chips, having a plurality of soldering
pins and a light-emitting surface on the bottoms and the tops
thereof, wherein the plurality of LED chips are disposed on the
copper circuit layer, and the soldering pins are welded to the
soldering points; moreover, the circuit substrate is attached to
the outer surface of the circuit-disposing portion via another
thermally conductive insulating layer, such that the LED chips can
respectively pass through the disposing holes and enter the
interior of the housing from the outer surface of the
circuit-disposing portion;
[0025] a plurality of solder paste overflow prevention members,
disposed between the LED chips and the copper circuit layer;
[0026] a light guide plate, disposed in the housing, and a
light-receiving surface of the light guide plate being opposite to
the light-emitting surfaces of the LED chips; and
[0027] a bottom reflector, disposed on the bottom of the light
guide plate for preventing light leakage.
[0028] The third objective of the present invention is to provide
an LED backlight module structure for increasing process yield, in
which a position limiting band is disposed on the copper circuit
layer for receiving and fixing the LED chips, such that the
position limiting band can assist the LED chips in heat dissipation
when the LED chips emit light.
[0029] Thus, to achieve the third objective of the present
invention, the inventor proposes an LED backlight module structure
for increasing process yield, comprising:
[0030] a housing;
[0031] a copper circuit layer, disposed on the surface of a
circuit-disposing portion of the housing through a thermally
conductive insulating layer, wherein the copper circuit layer has
at least one main circuit and a plurality of soldering point;
[0032] a plurality of LED chips, having a plurality of soldering
pins and a light-emitting surface on the bottoms and the tops
thereof, wherein the plurality of LED chips are disposed on the
copper circuit layer, and the soldering pins are welded to the
soldering points;
[0033] a position limiting band, disposed on the copper circuit
layer via another thermally conductive insulating layer, wherein
the another thermally conductive insulating layer has a plurality
of openings for exposing the soldering points of the copper circuit
layer, and the position limiting band comprises: a plurality of
position limiting holes, for receiving and fixing the LED chips;
and a plurality of avoiding recesses, formed on the bottom of the
inner wall of each position limiting hole pairwise;
[0034] a light guide plate, disposed in the housing, and a
light-receiving surface of the light guide plate is opposite to the
light-emitting surfaces of the LED chips; and
[0035] a bottom reflector, disposed on the bottom of the light
guide plate for preventing light leakage.
[0036] The fourth objective of the present invention is to provide
an LED backlight module structure for increasing process yield, in
which a position limiting band is disposed on the copper circuit
layer for receiving and fixing the LED chips, moreover, the copper
circuit layer and the position limiting band are disposed on the
outer surface of the housing for meeting the demands from different
structure design of LED backlight module
[0037] Therefore, to achieve the fourth objective of the present
invention, the inventor proposes an LED backlight module structure
for increasing process yield, comprising:
[0038] a housing, having at least one circuit-disposing portion,
and the circuit-disposing portion has a plurality of disposing
holes;
[0039] a circuit substrate;
[0040] a copper circuit layer, disposed on the surface of the
circuit substrate through a thermally conductive insulating layer,
wherein the copper circuit layer has at least one main circuit and
a plurality of soldering point;
[0041] a plurality of LED chips, having a plurality of soldering
pins and a light-emitting surface on the bottoms and the tops
thereof, wherein the plurality of LED chips are disposed on the
copper circuit layer, and the soldering pins are welded to the
soldering points; moreover, the circuit substrate is attached to
the outer surface of the circuit-disposing portion via another
thermally conductive insulating layer, such that the LED chips can
respectively pass through the disposing holes and enter the
interior of the housing from the outer surface of the
circuit-disposing portion;
[0042] a position limiting band, disposed on the copper circuit
layer via another thermally conductive insulating layer, wherein
the another thermally conductive insulating layer has a plurality
of openings for exposing the soldering points of the copper circuit
layer, and the position limiting band comprising:
[0043] a plurality of position limiting holes, for receiving and
fixing the LED chips; and
[0044] a plurality of avoiding recesses, being formed on the bottom
of the inner wall of each position limiting hole pairwise;
[0045] a light guide plate, disposed in the housing, and a
light-receiving surface of the light guide plate is opposite to the
light-emitting surfaces of the LED chips; and
[0046] a bottom reflector, disposed on the bottom of the light
guide plate for preventing light leakage.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0047] The invention as well as a preferred mode of use and
advantages thereof will be best understood by referring to the
following detailed description of an illustrative embodiment in
conjunction with the accompanying drawings, wherein:
[0048] FIG. 1 is a stereo diagram of a conventional LED backlight
module;
[0049] FIG. 2 is stereo diagram of an LED chip;
[0050] FIG. 3A to FIG. 3C are schematic welding processes diagram
of the LED chips;
[0051] FIG. 4 is a side view of a first embodiment of an LED
backlight module structure for increasing process yield according
to the present invention;
[0052] FIG. 5 is a stereo exploded view of the first embodiment of
the LED backlight module structure for increasing process yield
according to the present invention;
[0053] FIG. 6 is a stereo diagram of a copper circuit layer, a
circuit substrate and a housing of the LED backlight module
structure for increasing process yield;
[0054] FIG. 7 is a side view of the housing, the copper circuit
layer, a thermally conductive insulating layer, and a solder paste
overflow prevention member of the LED backlight module structure
for increasing process yield;
[0055] FIG. 8 is a stereo exploded view of a second embodiment of
the LED backlight module structure for increasing process yield
according to the present invention;
[0056] FIG. 9 is a side view of the housing, the copper circuit
layer, the thermally conductive insulating layer, and a position
limiting band of the LED backlight module structure for increasing
process yield;
[0057] FIG. 10 is a stereo diagram of the housing, the copper
circuit layer, the thermally conductive insulating layer, and the
position limiting band of the LED backlight module structure for
increasing process yield;
[0058] FIG. 11 is a stereo diagram of the first embodiment of the
LED backlight module structure for increasing process yield having
a reflector;
[0059] FIG. 12 is a stereo diagram of the second embodiment of the
LED backlight module structure for increasing process yield having
the reflector;
[0060] FIG. 13A and FIG. 13B are stereo diagrams of a L-shaped
housing and a -shaped housing;
[0061] FIG. 14 is a stereo diagram of an extrusion housing;
[0062] FIG. 15 is a side view of a third embodiment of an LED
backlight module structure for increasing process yield according
to the present invention;
[0063] FIG. 16 is a stereo exploded view of the third embodiment of
the LED backlight module structure for increasing process yield
according to the present invention;
[0064] FIG. 17 is a stereo exploded view of a fourth embodiment of
the LED backlight module structure for increasing process yield
according to the present invention;
[0065] FIG. 18 is a stereo diagram of the housing, the copper
circuit layer, the thermally conductive insulating layer, the
position limiting band, the solder paste overflow prevention
member, and the circuit substrate of the LED backlight module
structure for increasing process yield;
[0066] FIG. 19 is a side view of a fifth embodiment of an LED
backlight module structure for increasing process yield according
to the present invention;
[0067] FIG. 20 is a stereo exploded view of the fifth embodiment of
the LED backlight module structure for increasing process yield
according to the present invention;
[0068] FIG. 21 is a side view of a sixth embodiment of an LED
backlight module structure for increasing process yield according
to the present invention; and
[0069] FIG. 22 is a stereo exploded view of the sixth embodiment of
the LED backlight module structure for increasing process yield
according to the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0070] To more clearly describe an LED backlight module structure
for increasing process yield according to the present invention,
embodiments of the present invention will be described in detail
with reference to the attached drawings hereinafter.
[0071] The LED backlight module structure for increasing process
yield provided in the present invention includes many embodiments,
please refer to FIG. 4 and FIG. 5, there are shown a side view and
a stereo exploded view of a first embodiment of an LED backlight
module structure for increasing process yield according to the
present invention. As shown in FIG. 4 and FIG. 5, the first
embodiment of the LED backlight module 1 for increasing process
yield includes: a housing 11, a copper circuit layer 12, a
plurality of LED chips 13, a plurality of solder paste overflow
prevention members 17, a light guide plate 15, and a bottom
reflector 16.
[0072] Continuously referring to FIG. 5, and please simultaneously
refer to FIG. 6, which illustrates a stereo diagram of a copper
circuit layer, a circuit substrate and a housing of the LED
backlight module structure for increasing process yield. As shown
in FIG. 5, in the present invention, the copper circuit layer 12 is
disposed on the surface of a circuit-disposing portion 111 of the
housing 11 through a thermally conductive insulating layer 18, and
the copper circuit layer 12 has at least one main circuit 121 and a
plurality of soldering point 122. However, as shown in FIG. 6, the
copper circuit layer 12 can also be disposed on a circuit substrate
12S, and then the circuit substrate 12S is disposed on the surface
of the circuit-disposing portion 111 through the thermally
conductive insulating layer 18. In which, the material of the
circuit substrate 12S may be aluminum or fiberglass.
[0073] Referring to FIG. 4 and FIG. 5 again, each LED chip 13 has a
plurality of soldering pins and a light-emitting surface on the
bottom and the top thereof. In the present invention, the plurality
of LED chips 13 are disposed on the copper circuit layer 12 and the
soldering pins of the LED chips 13 are welded to the soldering
points 122 of the copper circuit layer 12. The plurality of solder
paste overflow prevention members 17 are disposed between the LED
chips 13 and the copper circuit layer 12, wherein each solder paste
overflow prevention member 17 consists of a bar-shaped solder paste
overflow prevention member and a block-shaped solder paste overflow
prevention member, and the material of the solder paste overflow
prevention member 17 can be heat-resistant adhesive tape, acrylic,
silicone, and epoxy resin.
[0074] Continuously referring to FIG. 5, and please refer to FIG.
7, which illustrates a side view of the housing, the copper circuit
layer, the thermally conductive insulating layer, and the solder
paste overflow prevention member of the LED backlight module
structure for increasing process yield. As shown in FIG. 7, in the
present invention, it mainly respectively disposed the solder paste
overflow prevention members 17 between the LED chips 13 and the
copper circuit layer 12, therefore, the solder paste overflow
phenomenon can be prevented when using a pressing fixture 2 to
assist in executing the welding process of the LED chips 13, and
then it can make sure that the soldering pins of the LED chips 13
would not electrically connect to each other due to the solder
paste overflow phenomenon.
[0075] The structure of aforesaid first embodiment is the simplest
structure of the LED backlight module structure 1 for increasing
process yield; However, for meeting the demands from different
structure design of LED backlight module, it can also add some
constituting elements or members into the simplest structure of the
LED backlight module structure, such that the LED backlight module
structure may performs more functionality.
[0076] Please refer to FIG. 8, there is shown a stereo exploded
view of a second embodiment of the LED backlight module structure
for increasing process yield according to the present invention; in
addition, please simultaneously refer to FIG. 9, which illustrates
a side view of the housing, the copper circuit layer, the thermally
conductive insulating layer, and a position limiting band of the
LED backlight module structure for increasing process yield. As
shown in FIG. 8, the second embodiment of the LED backlight module
structure for increasing process yield is completed after a
position limiting band 19 is added into the structure of aforesaid
first embodiment. As shown in FIG. 9, in the second embodiment, the
position limiting band 19 is disposed on the copper circuit layer
12 through a thermally conductive insulating layer 18a, and the
thermally conductive insulating layer 18a includes a plurality of
openings 181a for exposing the soldering points 122 of the copper
circuit layer 12.
[0077] Continuously refer to FIG. 8 and FIG. 9, in the second
embodiment, the position limiting band 19 consists of a plurality
of position limiting holes 19 and a plurality of avoiding recesses
192, wherein the position limiting holes 191 is used for receiving
and fixing the LED chips 13, and the avoiding recesses 192 are
formed on the bottom of the inner wall of each position limiting
hole 191 pairwise. Thus, when using the pressing fixture 2 to
assist in executing the welding process of LED chips 13, it is able
to avoid the solder paste overflow cause by the pressing fixture 2
from attaching to the position limiting band 19 and extendedly
getting into the position limiting holes 191 of the position
limiting band 19. Moreover, in the second embodiment, each LED chip
13 is limited and fixed in the position limiting hole 191, and LED
chip 13 clings to the inner walls of the position limiting hole
191. So that, because the materials of the position limiting band
19 and the housing 11 are metal, the position limiting band 19 is
helpful to the LED chips 13 in heat dissipation when the LED chips
13 emit light.
[0078] Referring to FIG. 8 again, and please refer to FIG. 10,
there is shown a stereo diagram of the housing, the copper circuit
layer, the thermally conductive insulating layer, and the position
limiting band of the LED backlight module structure for increasing
process yield. As shown in FIG. 10, for the second embodiment of
the LED backlight module structure 1, the one bar-shaped solder
paste overflow prevention member and the four block-shaped solder
paste overflow prevention members may be integratedly formed to one
H-shaped solder paste overflow prevention member.
[0079] Furthermore, for the aforesaid first embodiment of the LED
backlight module structure 1, it is able to increase the backlight
efficiency thereof by being added a reflector. Please refer to FIG.
11, which illustrates a stereo diagram of the first embodiment of
the LED backlight module structure for increasing process yield
having a reflector. As shown in FIG. 11, the reflector 14 is added
into the aforesaid first embodiment of the LED backlight module
structure 1, wherein the reflector 14 is disposed on the surface of
the copper circuit layer 12 and has a plurality of LED through
holes (not shown in FIG. 11) for pass of the LED chips 13.
Moreover, please refer to FIG. 12, there is shown a stereo diagram
of the second embodiment of the LED backlight module structure for
increasing process yield having the reflector. As shown in FIG. 12,
the reflector 14 can also be added into the second embodiment of
the LED backlight module structure 1, in which, the reflector 14 is
disposed on the position limiting band 19 and has a plurality of
LED through holes 141 for pass of the LED chips 13.
[0080] Please refer to FIG. 13A and FIG. 13B, there are shown
stereo diagrams of a L-shaped housing and a -shaped housing. For
the aforesaid first embodiment and second embodiment of the LED
backlight module structure 1, the housing 11 can be a sheet metal
housing; as shown in FIG. 13A and FIG. 13B, the sheet metal housing
may be formed to a L-shaped housing or a -shaped housing. Besides,
please refer to FIG. 14, which illustrates a stereo diagram of an
extrusion housing. Of course, it is not limited the housing 11 to
the sheet metal housing; As shown in FIG. 14, in the present
invention, the housing 11 can also be an extrusion housing.
[0081] The present invention further provides a third embodiment of
the LED backlight module structure 1. Please refer to FIG. 15 and
FIG. 16, there are shown a side view and a stereo exploded view of
the third embodiment of the LED backlight module structure for
increasing process yield according to the present invention. As
shown in FIG. 15 and FIG. 16, the third embodiment of the LED
backlight module structure 1 includes: a housing 11, a circuit
substrate 12S, a copper circuit layer 12, a plurality of LED chips
13, a plurality of solder paste overflow prevention members 17, a
light guide plate 15, and a bottom reflector 16. In which, the
aforesaid constituting elements of the third embodiment are all the
same to the constituting elements of the first embodiment; However,
differing from the first embodiment, the circuit substrate 12S, the
copper circuit layer 12, the plurality of LED chips 13, and the
plurality of solder paste overflow prevention members 17 are
disposed in the exterior of the housing 11.
[0082] In the third embodiment, the housing 11 includes a
circuit-disposing portion 111, and the circuit-disposing portion
111 having a plurality of disposing holes 111. The copper circuit
layer 12 is disposed on the surface of the circuit substrate 12S
through a thermally conductive insulating layer 18, wherein the
copper circuit layer 12 has at least one main circuit 121 and a
plurality of soldering point 122 (the main circuit 121 and the
soldering points 122 are not shown in FIG. 15 and FIG. 16). The LED
chips 13 are disposed on the copper circuit layer 12, and each LED
chips 13 has a plurality of soldering pins and a light-emitting
surface on the bottom and the top thereof, wherein the LED chips 13
are welded to the soldering points 122 by a solder 4. The circuit
substrate 12S is attached to the outer surface of the
circuit-disposing portion 111 via another thermally conductive
insulating layer 18a, such that the LED chips 13 can respectively
pass through the disposing holes 1111 and enter the interior of the
housing 11 from the outer surface of the circuit-disposing portion
111.
[0083] For aforesaid third embodiment, it is not limited to use the
disposed the copper circuit layer 12 on the surface of the circuit
substrate 12S. In the third embodiment, it can also directly
attached the copper circuit layer 12 to the outer surface of the
circuit-disposing portion 111 through the thermally conductive
insulating layer 18, such that the LED chips 13 also respectively
pass through the disposing holes 1111 and enter the interior of the
housing 11 from the outer surface of the circuit-disposing portion
111. Thus, by this way, it can also finish the third embodiment of
the LED backlight module structure without using the circuit
substrate 12S and the another thermally conductive insulating layer
18a.
[0084] In addition, in the third embodiment, the plurality of
solder paste overflow prevention members 17 are disposed between
the LED chips 13 and the copper circuit layer 12, wherein each
solder paste overflow prevention member 17 consists of a bar-shaped
solder paste overflow prevention member and a block-shaped solder
paste overflow prevention member, and the material of the solder
paste overflow prevention member 17 can be heat-resistant adhesive
tape, acrylic, silicone, and epoxy resin.
[0085] Similarly, for meeting the demands from different structure
design of LED backlight module, it can also add some constituting
elements or members into the third embodiment of the LED backlight
module structure 1, such that the LED backlight module structure
may performs more functionality. Please refer to FIG. 17, there is
shown a stereo exploded view of a fourth embodiment of the LED
backlight module structure for increasing process yield according
to the present invention. As shown in FIG. 17, the fourth
embodiment of the LED backlight module structure for increasing
process yield is completed after a position limiting band 19 is
added into the structure of aforesaid third embodiment. In the
fourth embodiment, the position limiting band 19 is disposed on the
copper circuit layer 12 through a thermally conductive insulating
layer 18a, and the thermally conductive insulating layer 18a
includes a plurality of openings 181a (FIG. 17 does not shown the
openings 181a) for exposing the soldering points 122 of the copper
circuit layer 12.
[0086] Referring to FIG. 17 again, and please simultaneously refer
to FIG. 18, which illustrates a stereo diagram of the housing, the
copper circuit layer, the thermally conductive insulating layer,
the position limiting band, the solder paste overflow prevention
member, and the circuit substrate of the LED backlight module
structure for increasing process yield. As shown in FIG. 18, for
the fourth embodiment of the LED backlight module structure 1, the
one bar-shaped solder paste overflow prevention member and the four
block-shaped solder paste overflow prevention members may be
integratedly formed to one H-shaped solder paste overflow
prevention member.
[0087] Furthermore, similarly, for the aforesaid third embodiment
and fourth embodiment of the LED backlight module structure 1, it
is able to increase the backlight efficiency thereof by being added
a reflector 14, wherein the diagram and structure are according to
FIG. 11 and FIG. 12. Besides, the same to the first embodiment and
the second embodiment, the housing 11 used in the third embodiment
and fourth embodiment of the LED backlight module structure 1 can
not only be a sheet metal housing formed to a L-shaped housing or a
-shaped housing, but also be an extrusion housing.
[0088] The present invention further provides a fifth embodiment of
the LED backlight module structure 1. Please refer to FIG. 19 and
FIG. 20, there are shown a side view and a stereo exploded view of
the fifth embodiment of the LED backlight module structure for
increasing process yield according to the present invention. As
shown in FIG. 19 and FIG. 20, the fifth embodiment of the LED
backlight module structure 1 includes: a housing 11, a copper
circuit layer 12, a plurality of LED chips 13, a position limiting
band 19, a light guide plate 15, and a bottom reflector 16, wherein
the copper circuit layer 12 is disposed on the surface of a
circuit-disposing portion 111 of the housing 11 through a thermally
conductive insulating layer 18, wherein the copper circuit layer 12
has at least one main circuit 121 and a plurality of soldering
point 122 (the main circuit 121 and the soldering points 122 are
not shown in FIG. 19 and FIG. 20). Herein, the same to aforesaid
first embodiment, for the fifth embodiment, the copper circuit
layer 12 can also be disposed on a circuit substrate 12S, and then
the circuit substrate 12S is disposed on the surface of the
circuit-disposing portion 111 through the thermally conductive
insulating layer 18.
[0089] The plurality of LED chips 13 are disposed on the copper
circuit layer 12, and each LED chips 13 has a plurality of
soldering pins and a light-emitting surface on the bottom and the
top thereof, wherein the plurality of LED chips 13 are welded to
the soldering points 122 by a solder 4. The position limiting band
19 is disposed on the copper circuit layer 12 via another thermally
conductive insulating layer 18a, wherein the another thermally
conductive insulating layer 18a has a plurality of openings 181a
for exposing the soldering points 122 of the copper circuit layer
12. The position limiting band 19 includes: a plurality of position
limiting holes 191, for receiving and fixing the LED chips 13, and
a plurality of avoiding recesses 192, formed on the bottom of the
inner wall of each position limiting hole 191 pairwise. In
addition, for meeting the demands from different structure design
of LED backlight module, it can also add some constituting elements
or members into the fifth embodiment of the LED backlight module
structure, such that the LED backlight module structure may
performs more functionality. As shown in FIG. 8, the solder paste
overflow prevention members 17 are added into the fifth embodiment,
and each solder paste overflow prevention member 17 consists of a
bar-shaped solder paste overflow prevention member and a
block-shaped solder paste overflow prevention member. Therefore,
the solder paste overflow phenomenon can be prevented when using a
pressing fixture 2 to assist in executing the welding process of
the LED chips 13, and then it can make sure that the soldering pins
of the LED chips 13 would not electrically connect to each other
due to the solder paste overflow phenomenon. Besides, as shown in
FIG. 10, the one bar-shaped solder paste overflow prevention member
and the four block-shaped solder paste overflow prevention members
may be integratedly formed to one H-shaped solder paste overflow
prevention member. Furthermore, it can also add a reflector into
the fifth embodiment for increasing the backlight efficiency.
[0090] Finally, the present invention further provides a sixth
embodiment of the LED backlight module structure 1. Please refer to
FIG. 21 and FIG. 22, there are shown a side view and a stereo
exploded view of the sixth embodiment of the LED backlight module
structure for increasing process yield according to the present
invention. As shown in FIG. 21 and FIG. 22, the sixth embodiment of
the LED backlight module structure 1 includes: a housing 11, a
circuit substrate 12S, a copper circuit layer 12, a plurality of
LED chips 13, a position limiting band 19, a light guide plate 15,
and a bottom reflector 16, In which, the aforesaid constituting
elements of the sixth embodiment are all the same to the
constituting elements of the fifth embodiment; However, differing
from the fifth embodiment, the circuit substrate 12S, the copper
circuit layer 12, the plurality of LED chips 13, and the position
limiting band 19 are disposed in the exterior of the housing
11.
[0091] In the sixth embodiment, the housing 11 includes a
circuit-disposing portion 111, and the circuit-disposing portion
111 having a plurality of disposing holes 111. The copper circuit
layer 12 is disposed on the surface of the circuit substrate 12S
through a thermally conductive insulating layer 18, wherein the
copper circuit layer 12 has at least one main circuit 121 and a
plurality of soldering point 122 (the main circuit 121 and the
soldering points 122 are not shown in FIG. 21 and FIG. 22). The LED
chips 13 are disposed on the copper circuit layer 12, and each LED
chips 13 has a plurality of soldering pins and a light-emitting
surface on the bottom and the top thereof, wherein the LED chips 13
are welded to the soldering points 122 by a solder 4.
[0092] Differing from the fifth embodiment, in the sixth
embodiment, the circuit substrate 12S is attached to the outer
surface of the circuit-disposing portion 111 via another thermally
conductive insulating layer 18a, such that the LED chips 13 can
respectively pass through the disposing holes 1111 and enter the
interior of the housing 11 from the outer surface of the
circuit-disposing portion 111. Besides, the position limiting band
19 includes: a plurality of position limiting holes 191, for
receiving and fixing the LED chips 13, and a plurality of avoiding
recesses 192, formed on the bottom of the inner wall of each
position limiting hole 191 pairwise. Moreover, For aforesaid sixth
embodiment, it is not limited to use the disposed the copper
circuit layer 12 on the surface of the circuit substrate 12S. In
the sixth embodiment, it can also directly attached the copper
circuit layer 12 to the outer surface of the circuit-disposing
portion 111 through the thermally conductive insulating layer 18,
such that the LED chips 13 also respectively pass through the
disposing holes 1111 and enter the interior of the housing 11 from
the outer surface of the circuit-disposing portion 111. Thus, by
this way, it can also finish the third embodiment of the LED
backlight module structure without using the circuit substrate 12S
and the another thermally conductive insulating layer 18a.
[0093] Similarly, for meeting the demands from different structure
design of LED backlight module, it can also add some constituting
elements or members into the fifth embodiment of the LED backlight
module structure, such that the LED backlight module structure may
performs more functionality. As shown in FIG. 17, the solder paste
overflow prevention members 17 are added into the sixth embodiment,
and each solder paste overflow prevention member 17 consists of a
bar-shaped solder paste overflow prevention member and a
block-shaped solder paste overflow prevention member. Therefore,
the solder paste overflow phenomenon can be prevented when using a
pressing fixture 2 to assist in executing the welding process of
the LED chips 13, and then it can make sure that the soldering pins
of the LED chips 13 would not electrically connect to each other
due to the solder paste overflow phenomenon. Besides, as shown in
FIG. 18, the one bar-shaped solder paste overflow prevention member
and the four block-shaped solder paste overflow prevention members
may be integratedly formed to one H-shaped solder paste overflow
prevention member. Furthermore, it can also add a reflector into
the sixth embodiment for increasing the backlight efficiency.
[0094] Therefore, the above descriptions have been clearly and
completely introduced all of the embodiments of the LED backlight
module structure for increasing process yield; in summary, the
present invention has the following advantages: [0095] 1. In the
first embodiment of the LED backlight module structure for
increasing process yield according the present invention, a
plurality of solder paste overflow prevention members 17 is
disposed between the LED chips 13 and the copper circuit layer 12,
therefore, the solder paste overflow phenomenon can be prevented
when using a pressing fixture 2 to assist in executing the welding
process of LED chips 13, and then it can make sure that the
soldering pins of the LED chips 13 would not electrically connect
to each other due to the solder paste overflow phenomenon. [0096]
2. In addition, for the second embodiment of the LED backlight
module structure, it is completed by adding a position limiting
band 19 into the first embodiment for receiving and fixing the LED
chips 13, the position limiting band 19 is helpful to the LED chips
13 in heat dissipation when the LED chips 13 emit light. [0097] 3.
Inheriting to above point 2, moreover, the position limiting band
19 further includes the avoiding recesses 192 formed on the bottom
of the inner wall of each position limiting hole 191 pairwise;
thus, when using the pressing fixture 2 to assist in executing the
welding process of LED chips 13, it is able to avoid the solder
paste overflow cause by the pressing fixture 2 from attaching to
the position limiting band 19 and extendedly getting into the
position limiting holes 191 of the position limiting band 19.
[0098] 4. Moreover, for the demands from different structure design
of LED backlight module, in the present invention, the third
embodiment and the fourth embodiment are provided. In which, the
constituting elements of the third embodiment and the fourth
embodiment are all the same to the constituting elements of the
first embodiment and the second embodiment; However, differing from
the first embodiment and the second embodiment, the circuit
substrate 12S, the copper circuit layer 12, the plurality of LED
chips 13, the solder paste overflow prevention members 17, and the
position limiting band 19 in the third embodiment and the fourth
embodiment are disposed in the exterior of the housing 11. [0099]
5. Moreover, for the demands from different structure design of LED
backlight module, in the present invention, the fifth embodiment is
also provided. In which, a position limiting band 19 is disposed on
the copper circuit layer 12 for receiving and fixing the LED chips
13, in addition, because the LED chips 13 clings to the inner walls
of the position limiting hole 191 of the position limiting band 19,
the position limiting band 19 is helpful to the LED chips 13 in
heat dissipation when the LED chips 13 emit light. [0100] 6.
Furthermore, in the present invention, the sixth embodiment is
provided. In which, the aforesaid constituting elements of the
sixth embodiment are all the same to the constituting elements of
the fifth embodiment; However, differing from the fifth embodiment,
the circuit substrate 12S, the copper circuit layer 12, the
plurality of LED chips 13, and the position limiting band 19 are
disposed in the exterior of the housing 11.
[0101] The above description is made on embodiments of the present
invention. However, the embodiments are not intended to limit scope
of the present invention, and all equivalent implementations or
alterations within the spirit of the present invention still fall
within the scope of the present invention.
* * * * *