U.S. patent application number 13/633878 was filed with the patent office on 2013-07-04 for light emitting diode package structure.
The applicant listed for this patent is Hung-Lieh Hu, Chao-Wei Li. Invention is credited to Hung-Lieh Hu, Chao-Wei Li.
Application Number | 20130168714 13/633878 |
Document ID | / |
Family ID | 47223300 |
Filed Date | 2013-07-04 |
United States Patent
Application |
20130168714 |
Kind Code |
A1 |
Li; Chao-Wei ; et
al. |
July 4, 2013 |
LIGHT EMITTING DIODE PACKAGE STRUCTURE
Abstract
A light emitting diode package structure is provided, including
a substrate, a seal assembly, an optical element, at least one
light emitting diode chip, and a packaging material layer. The seal
assembly is disposed on the substrate. The optical element is
disposed on the seal assembly, and an enclosed space is formed
between the optical element, the seal assembly, and the substrate.
The light emitting diode chip is disposed on the substrate and
located in the enclosed space. The packaging material layer is
located in the enclosed space and at least disposed on an upper
surface of the light emitting diode chip, wherein the packaging
material layer includes a liquid with high viscosity and a
plurality of solid particles, and the viscosity of the liquid with
high viscosity is more than 3000 mPas.
Inventors: |
Li; Chao-Wei; (Hsinchu City,
TW) ; Hu; Hung-Lieh; (Hsinchu City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Li; Chao-Wei
Hu; Hung-Lieh |
Hsinchu City
Hsinchu City |
|
TW
TW |
|
|
Family ID: |
47223300 |
Appl. No.: |
13/633878 |
Filed: |
October 3, 2012 |
Current U.S.
Class: |
257/98 ;
257/E33.06 |
Current CPC
Class: |
H01L 33/505 20130101;
H01L 33/54 20130101; H01L 33/501 20130101; H01L 33/648
20130101 |
Class at
Publication: |
257/98 ;
257/E33.06 |
International
Class: |
H01L 33/52 20100101
H01L033/52; H01L 33/50 20100101 H01L033/50 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 30, 2011 |
TW |
100149880 |
Claims
1. A light emitting diode package structure, comprising: a
substrate; a seal assembly disposed on the substrate; an optical
element disposed on the seal assembly, wherein an enclosed space is
formed between the optical element, the seal assembly, and the
substrate; at least one light emitting diode chip disposed on the
substrate and located in the enclosed space; and a packaging
material layer located in the enclosed space and at least disposed
on an upper surface of the light emitting diode chip, wherein the
packaging material layer comprises a liquid with high viscosity and
a plurality of solid particles, and the viscosity of the liquid
with high viscosity is more than 3000 mPas.
2. The light emitting diode package structure of claim 1, wherein
the solid particles comprise phosphor, TiO.sub.2, ZrO.sub.2, or
Quantum Dot (QD).
3. The light emitting diode package structure of claim 1, wherein
the liquid with high viscosity is at least one selected from
silicon oil, paraffin oil, olive oil, propylene carbonate, and
perfluoropolyether solution.
4. The light emitting diode package structure of claim 1, wherein
the packaging material layer covers the light emitting diode chip
and fills the enclosed space.
5. The light emitting diode package structure of claim 1, further
comprising a filling material disposed in the enclosed space,
wherein the viscosity of the filling material is less than the
viscosity of the packaging material layer.
6. The light emitting diode package structure of claim 5, wherein
the packaging material layer covers all exposed surfaces of the
light emitting diode chip, and the filling material fills the
enclosed space.
7. The light emitting diode package structure of claim 5, wherein
the packaging material layer is disposed on a plane of the optical
element, and the filling material is disposed between the packaging
material layer and the light emitting diode chip.
8. The light emitting diode package structure of claim 5, wherein
the packaging material layer covers only the upper surface of the
light emitting diode chip, and the filling material fills the
enclosed space.
9. The light emitting diode package structure of claim 5, wherein
the thermal conductivity of the filling material is more than 0.55
W/mK.
10. The light emitting diode package structure of claim 5, wherein
the filling material comprises deionized water, electrolyzed water,
Fluorinert, air, silicone, or epoxy resin.
11. The light emitting diode package structure of claim 1, further
comprising a diffusion layer disposed in the enclosed space and
located on a light emitting path of the light emitting diode
chip.
12. The light emitting diode package structure of claim 11, wherein
a material of the diffusion layer comprises nanoparticles of
TiO.sub.2.
13. The light emitting diode package structure of claim 1, wherein
the optical element comprises a curved convex surface and a plane,
and the plane is disposed on the seal assembly and faces the
substrate.
14. The light emitting diode package structure of claim 1, wherein
the optical element is in a planar plate shape.
15. The light emitting diode package structure of claim 1, further
comprising two electrodes disposed on the substrate and located in
the enclosed space.
16. The light emitting diode package structure of claim 1, wherein
the substrate comprises a groove, and the light emitting diode chip
is disposed in the groove, wherein the length and width of the
groove are 1-1.5 times the length and width of the light emitting
diode chip respectively.
17. The light emitting diode package structure of claim 16, wherein
the packaging material layer is disposed in the groove.
18. The light emitting diode package structure of claim 17, further
comprising a filling material disposed in the enclosed space,
wherein the viscosity of the filling material is less than the
viscosity of the packaging material layer.
19. The light emitting diode package structure of claim 17, wherein
the filling material fills the enclosed space.
20. A light emitting diode package structure, comprising: a
substrate comprising a groove; at least one light emitting diode
chip disposed on the substrate and located in the groove; an
optical element disposed on the substrate and enclosing the groove
to form an enclosed space between the optical element and the
substrate; and a packaging material layer located in the enclosed
space and at least disposed on an upper surface of the light
emitting diode chip, wherein the packaging material layer comprises
a liquid with high viscosity and a plurality of solid particles,
and the viscosity of the liquid with high viscosity is more than
3000 mPas.
21. The light emitting diode package structure of claim 20, wherein
the solid particles comprise phosphor, TiO.sub.2, ZrO.sub.2, or
Quantum Dot (QD).
22. The light emitting diode package structure of claim 20, wherein
the liquid with high viscosity is at least one selected from
silicon oil, paraffin oil, olive oil, propylene carbonate, and
perfluoropolyether solution.
23. The light emitting diode package structure of claim 20, wherein
the groove comprises a recess, and the light emitting diode chip is
located in the recess, wherein the length and width of the recess
are 1-1.5 times the length and width of the light emitting diode
chip respectively.
24. The light emitting diode package structure of claim 20, wherein
the packaging material layer is disposed in the recess.
25. The light emitting diode package structure of claim 20, further
comprising a filling material disposed in the enclosed space,
wherein the viscosity of the filling material is less than the
viscosity of the packaging material layer.
26. The light emitting diode package structure of claim 23, wherein
the filling material fills the enclosed space.
27. The light emitting diode package structure of claim 25, wherein
the thermal conductivity of the filling material is more than 0.55
W/mK.
28. The light emitting diode package structure of claim 25, wherein
the filling material comprises deionized water, electrolyzed water,
Fluorinert, air, silicone, or epoxy resin.
29. The light emitting diode package structure of claim 20, further
comprising a diffusion layer disposed in the enclosed space and
located on a light emitting path of the light emitting diode
chip.
30. The light emitting diode package structure of claim 20, wherein
a material of the diffusion layer comprises nanoparticles of
TiO.sub.2.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 100149880, filed on Dec. 30, 2011. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
TECHNICAL FIELD
[0002] The disclosure relates to a package structure, and
particularly relates to a light emitting diode (LED) package
structure.
BACKGROUND
[0003] A light emitting diode (LED) is a light emitting device
fabricated by using a compound semiconductor. When a current is
applied to the LED, energy mat be released in the form of light
through the combination of electron and electron hole, such that
the LED can emit light. Since the light emitting phenomenon of LED
is not caused by heating or discharging, the lifespan of LED may be
more than 100,000 hours, and idling time is saved. In addition, LED
has the advantages of high response speed, low power consumption,
low pollution, high reliability, being suitable for mass production
and so on. Accordingly, LED is widely applied in many fields. In
recent years, luminescence efficiency of LED has been constantly
improved. Consequently, fluorescent lamps and incandescent bulbs
are gradually replaced with LED in some areas, such as scanner
light source which requires high speed response, back or front
light source of liquid crystal display (LCD), automobile dashboard
illumination, traffic signs, and general illumination devices.
[0004] Generally, the color of the light emitted by the
conventional LED is changed through conversion of the phosphor
mixed with silicone (for example, the light generated by blue light
LED irradiates yellow phosphor to generate white light). Silicone
has favorable heat resistance and reliability when not mixed with
phosphor. However, when silicone is mixed with phosphor to form a
phosphor glue, the poor heat resistance of phosphor glue may
seriously affect the reliability of the LED package structure.
Therefore, it is a very important issue to develop a more suitable
LED package material and structure for improving the reliability of
LED light source module.
SUMMARY
[0005] Accordingly, the disclosure provides a light emitting diode
package structure, which may improve the poor heat resistance of
the phosphor glue material used in the conventional light emitting
diode package structure and may enhance the reliability of a light
emitting diode light source module.
[0006] The disclosure provides a light emitting diode package
structure, including a substrate, a seal assembly, an optical
element, at least one light emitting diode chip, and a packaging
material layer. The seal assembly is disposed on the substrate. The
optical element is disposed on the seal assembly, and an enclosed
space is formed between the optical element, the seal assembly, and
the substrate. The light emitting diode chip is disposed on the
substrate and located in the enclosed space. The packaging material
layer is located in the enclosed space and at least disposed on an
upper surface of the light emitting diode chip, wherein the
packaging material layer includes a liquid with high viscosity and
a plurality of solid particles, and the viscosity of the liquid
with high viscosity is more than 3000 mPas.
[0007] The disclosure further provides a light emitting diode
package structure, which includes a substrate, an optical element,
at least one light emitting diode chip, and a packaging material
layer. The substrate has a groove, and the light emitting diode
chip is disposed on the substrate and located in the groove. The
optical element is disposed on the substrate and encloses the
groove, so as to form an enclosed space between the optical element
and the substrate. The packaging material layer is located in the
enclosed space and at least disposed on an upper surface of the
light emitting diode chip, wherein the packaging material layer
includes a liquid with high viscosity and a plurality of solid
particles, and the viscosity of the liquid with high viscosity is
more than 3000 mPas.
[0008] Several exemplary embodiments accompanied with figures are
described in detail below to further describe the disclosure.
BRIEF DESCRIPTION OF DRAWINGS
[0009] The accompanying drawings are included to provide further
understanding, and are incorporated in and constitute a part of
this specification. The drawings illustrate embodiments and,
together with the description, serve to explain the principles of
the disclosure.
[0010] FIG. 1 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure.
[0011] FIG. 2 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure.
[0012] FIG. 3 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure.
[0013] FIG. 4 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure.
[0014] FIG. 5 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure.
[0015] FIG. 6A illustrates a schematic cross-sectional view and a
partial top view of a light emitting diode package structure
according to an embodiment of the disclosure.
[0016] FIG. 6B is a schematic cross-sectional view of a light
emitting diode package structure according to another embodiment of
the disclosure.
[0017] FIG. 7 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure.
[0018] FIG. 8 illustrates a schematic cross-sectional view and a
partial top view of a light emitting diode package structure
according to an embodiment of the disclosure.
[0019] FIG. 9 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure.
DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS
[0020] Embodiments of the disclosure will be fully described with
reference to the accompanying drawings below. Nevertheless, the
disclosure may be embodied in many different forms and should not
be construed as limited to the embodiments set forth herein. The
language used to describe the directions, such as "up" or the like,
in the following embodiments simply refers to the directions of the
drawings and is regarded in an illustrative rather than in a
restrictive sense. It should be understood that, when a layer or
component is described as being on another layer or component, it
may mean that the layer or component is directly disposed on
another layer or component or above another layer or component with
a middle layer or component therebetween.
[0021] FIG. 1 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure. Referring to FIG. 1, a light emitting diode package
structure 10 of the disclosure includes a substrate 100, a seal
assembly 102, an optical element 104, at least one light emitting
diode chip 106, a packaging material layer 108, and a filling
material 110.
[0022] The substrate 100 is a Al.sub.2O.sub.3 substrate, a AlN
substrate, a copper substrate, an aluminum substrate, a ceramic
substrate, etc., for example.
[0023] The seal assembly 102 is disposed on the substrate 100. In
an embodiment, the seal assembly 102 may be connected to a surface
of the substrate 100 in the form of a barricade. A material of the
seal assembly 102 is metal, plastic, alloy, wherein the alloy is
kovar, for example.
[0024] The optical element 104 is disposed on the seal assembly
102, and an enclosed space S is formed between the optical element
104, the seal assembly 102, and the substrate 100. The optical
element 104 has a curved convex surface 104a and a plane 104b, and
the plane 104b is disposed on the seal assembly 102 and faces the
substrate 100, so as to form the enclosed space S. However, the
disclosure is not limited thereto. The optical element 104 may have
other shapes, such as a planar plate shape. The optical element 104
is a lens, for example. Moreover, the optical element 104 is formed
of a material with favorable light transmittance, such as glass,
epoxy resin, or transparent plastic. Specifically, the transparent
plastic is polypropylene, polyethylene, cyclic olefin copolymer,
polymethylpentenes, hydrogenated cyclo-olefin polymers, or
amorphous cyclo-olefin copolymers, for example.
[0025] The light emitting diode chip 106 is disposed on the
substrate 100 and located in the enclosed space S. According to an
embodiment, the light emitting diode chip 106 may be a high-power
light emitting diode chip, which has a light emitting power more
than 1 W.
[0026] The packaging material layer 108 is located in the enclosed
space S. In this embodiment, the packaging material layer 108 is
disposed on an upper surface 106a of the light emitting diode chip
106 and covers all exposed surfaces of the light emitting diode
chip 106. More specifically, the packaging material layer 108
includes a liquid with high viscosity and a plurality of solid
particles, and the viscosity of the liquid with high viscosity is
more than 3000 mPas. The liquid with high viscosity is for example
at least one selected from silicon oil, paraffin oil, olive oil,
propylene carbonate, and perfluoropolyether solution. However, the
disclosure is not limited thereto. Moreover, the solid particles
are phosphor, TiO.sub.2, ZrO.sub.2, or Quantum Dot (QD), for
example. Herein, the phosphor can be a single phosphor or a mixture
of multiple phosphors. To be more specific, the Quantum Dot is a
particle, such as ZnCdS QD or ZnCdSe QD, which has the
characteristic of electroluminescence or light-luminescence and can
be applied in the light emitting diode to achieve the properties of
nearly continuous spectrum and high color rendering, etc.
[0027] It is noted that the disclosure is not limited to any
particular combination of the liquid with high viscosity and the
solid particles. For instance, when using phosphor as the solid
particles, phosphor may be mixed with silicon oil and applied onto
the light emitting diode chip 106 to cover the light emitting diode
chip 106 by screen printing or barricade. Based on the above, a
color of the light emitted by the light emitting diode chip 106 can
be converted through the selected phosphor. Since the phosphor is
mixed with the liquid with high viscosity, not with silicone, the
use of phosphor glue does not cause poor heat resistance even when
applied to the high-power light emitting diode chip.
[0028] The filling material 110 fills the enclosed space S. The
filling material 110 is a liquid with favorable thermal
conductivity, which is more than 0.55 W/mK, for example. In
addition, the filling material 110 is preferably fluid at room
temperature, and the viscosity of the filling material 110 is less
than the viscosity of the packaging material layer 108. More
specifically, the filling material 110 is deionized water,
electrolyzed water, or Fluorinert, for example. It is noted that,
since the materials used for the filling material 110 and the
packaging material layer 108 may be hydrophilic and lipophilic
respectively, the filling material 110 and the packaging material
layer 108 are not dissolvable to each other and can achieve liquid
packaging.
[0029] Nevertheless, the filling material 110 of the disclosure is
not limited to a liquid filling material. In other embodiments, the
filling material 110 can be air, silicone, or epoxy resin, for
example. For example, when using air as the filling material 110
(i.e. so-called hermetic packaging), because a mixture of the
liquid with high viscosity and the solid particles in the packaging
material layer 108 is not dissolvable to air, the packaging
material layer 108 may remain in liquid state so as to form a
liquid package structure.
[0030] Furthermore, in another embodiment, silicone or epoxy resin
may be for example used as the filling material 110 to fill the
enclosed space S and cover the packaging material layer 108. After
the silicone or epoxy resin is baked, the mixture of the liquid
with high viscosity and the solid particles in the packaging
material layer 108 may remain in liquid state so as to form the
light emitting diode package structure in an embodiment of the
disclosure.
[0031] As described above, in this embodiment, the light emitting
diode package structure is formed with better stability and heat
resistance by mixing the stable and heat-resistant liquid with high
viscosity and solid particles in the packaging material layer and
selectively using the filling material that is not dissolvable to
the packaging material layer. Accordingly, the problem of poor heat
resistance of the phosphor glue used in the conventional package
structure is improved, and the reliability of the light emitting
diode light source module may be further enhanced. Moreover, since
the disclosure uses the liquid with higher viscosity in the
packaging material layer, the solid particles are uniformly
distributed in the liquid with high viscosity, which prevents the
problem that the solid particles having larger weight may deposit
or be non-uniformly distributed due to a shake. Because the filling
material 110 and the packaging material layer 108 are not
dissolvable to each other, when the light emitting diode package
structure 10 is shaken or vibrated, the packaging material layer
108 does not shift in position and provides better stability.
[0032] FIG. 2 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure. In FIG. 2, identical reference numerals are used for
the same elements as those in FIG. 1, and descriptions of those
elements are omitted.
[0033] Referring to FIG. 2, a light emitting diode package
structure 20 of the disclosure includes a substrate 100, a seal
assembly 102, an optical element 104, at least one light emitting
diode chip 106, and a packaging material layer 108. Herein, the
optical element 104 is disposed on the seal assembly 102, and an
enclosed space S is formed between the optical element 104, the
seal assembly 102, and the substrate 100. The light emitting diode
chip 106 is disposed on the substrate 100 and located in the
enclosed space S. The packaging material layer 108 is located in
the enclosed space S, covers the light emitting diode chip 106, and
fills the enclosed space S.
[0034] It should be noted that, the light emitting diode package
structure 20 of this embodiment is similar to the light emitting
diode package structure 10 of FIG. 1, and a difference lies in
that: the light emitting diode package structure 20 of this
embodiment does not include the filling material 110. In addition,
the packaging material layer 108 is located in the enclosed space S
and disposed on the upper surface 106a of the light emitting diode
chip 106. The packaging material layer 108 covers the light
emitting diode chip 106 and fills the enclosed space S.
[0035] In this embodiment, the packaging material layer 108 fills
the enclosed space S, and thereby achieves liquid packaging.
Herein, since the packaging material layer 108 includes the stable
and heat-resistant liquid with high viscosity and solid particles,
the light emitting diode package structure formed based on the
above has better stability and heat resistance, and thus the
reliability of the light emitting diode light source module may be
improved.
[0036] FIG. 3 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure. In FIG. 3, identical reference numerals are used for
the same elements as those in FIG. 1, and descriptions of those
elements are omitted.
[0037] Referring to FIG. 3, a light emitting diode package
structure 30 of the disclosure includes a substrate 100, a seal
assembly 102, an optical element 104, at least one light emitting
diode chip 106, a packaging material layer 108, and a filling
material 110. Herein, the optical element 104 is disposed on the
seal assembly 102, and an enclosed space S is formed between the
optical element 104, the seal assembly 102, and the substrate 100.
The light emitting diode chip 106 is disposed on the substrate 100
and located in the enclosed space S.
[0038] It should be noted that, the light emitting diode package
structure 30 of this embodiment is similar to the light emitting
diode package structure 10 of FIG. 1, and a difference lies in
that: although the packaging material layer 108 of this embodiment
is disposed on the upper surface 106a of the light emitting diode
chip 106, the packaging material layer 108 does not directly
contact the light emitting diode chip 106. More specifically, as
shown in FIG. 3, the packaging material layer 108 is disposed on a
plane 104b of the optical element 104 and located in the enclosed
space S. Moreover, the packaging material layer 108 is not in
direct contact with the light emitting diode chip 106. The filling
material 110 is for example disposed between the packaging material
layer 108 and the light emitting diode chip 106, and fills the
enclosed space S.
[0039] In this embodiment, the light emitting diode package
structure of the disclosure is completed by disposing the packaging
material layer 108 and the filling material 110, which are not
dissolvable to each other, to fill the enclosed space S. Herein,
since the packaging material layer 108 includes the stable and
heat-resistant liquid with high viscosity and solid particles, the
light emitting diode package structure formed based on the above
has better stability and heat resistance, and thus the reliability
of the light emitting diode light source module may be
improved.
[0040] FIG. 4 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure. In FIG. 4, identical reference numerals are used for
the same elements as those in FIG. 1, and descriptions of those
elements are omitted.
[0041] Referring to FIG. 4, a light emitting diode package
structure 40 of the disclosure includes a substrate 100, a seal
assembly 102, an optical element 104, at least one light emitting
diode chip 106, a packaging material layer 108, and a filling
material 110. Herein, the optical element 104 is disposed on the
seal assembly 102, and an enclosed space S is formed between the
optical element 104, the seal assembly 102, and the substrate 100.
The light emitting diode chip 106 is disposed on the substrate 100
and located in the enclosed space S.
[0042] The light emitting diode package structure 40 of this
embodiment is similar to the light emitting diode package structure
10 of FIG. 1. However, in this embodiment, the light emitting diode
chip 106 is for example a light emitting diode chip that has very
good forward-direction luminescence efficiency (such as a
vertically oriented light emitting diode chip), and the upper
surface 106a is a main light emitting surface of the light emitting
diode chip 106. In this case, the packaging material layer 108 may
cover only the upper surface 106a and does not cover other surfaces
of the light emitting diode chip 106. Besides, the filling material
110 fills the enclosed space S. Accordingly, the light generated by
the light emitting diode chip 106 can still be emitted from the
optical element through the packaging material layer 108 and the
filling material 110.
[0043] Therefore, persons having ordinary skill in the art should
know that, in the disclosure, the packaging material layer 108 and
the filling material 110 can be disposed according to the light
emitting properties of different light emitting diode chips, so as
to form the light emitting diode package structure.
[0044] In this embodiment, the light emitting diode package
structure of the disclosure is completed by disposing the packaging
material layer 108 and the filling material 110, which are not
dissolvable to each other, to fill the enclosed space S. Herein,
since the packaging material layer 108 includes the stable and
heat-resistant liquid with high viscosity and solid particles, the
light emitting diode package structure formed based on the above
has better stability and heat resistance, and thus the reliability
of the light source module may be improved.
[0045] FIG. 5 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure. In FIG. 5, identical reference numerals are used for
the same elements as those in FIG. 1, and descriptions of those
elements are omitted.
[0046] Referring to FIG. 5, a light emitting diode package
structure 50 of the disclosure includes a substrate 100, a seal
assembly 102, an optical element 104, at least one light emitting
diode chip 106, a packaging material layer 108, and a filling
material 110. Herein, the optical element 104 is disposed on the
seal assembly 102, and an enclosed space S is formed between the
optical element 104, the seal assembly 102, and the substrate 100.
The light emitting diode chip 106 is disposed on the substrate 100
and located in the enclosed space S. The packaging material layer
108 is disposed on the upper surface 106a of the light emitting
diode chip 106 and located in the enclosed space S. Moreover, the
packaging material layer 108 covers all exposed surfaces of the
light emitting diode chip 106. Besides, the filling material 110
fills the enclosed space S.
[0047] It should be noted that, the light emitting diode package
structure 50 of this embodiment is similar to the light emitting
diode package structure 10 of FIG. 1, and a difference lies in
that: the light emitting diode package structure 50 of this
embodiment further includes a diffusion layer 112 disposed in the
enclosed space S and located on a light emitting path of the light
emitting diode chip 106. With reference to FIG. 5, specifically,
the diffusion layer 112 is disposed on the plane 104b of the
optical element 104, for example. However, the disclosure is not
limited thereto. Persons with ordinary skill in the art should know
that, in fact, the diffusion layer 112 may have various
configurations.
[0048] The diffusion layer 112 is formed on the plane 104b of the
optical element 104 by dispensing or spraying, for example. A
material of the diffusion layer 112 includes nanoparticles of
TiO.sub.2, for example, but the disclosure is not limited thereto.
In this embodiment, the diffusion layer 112 may be disposed to
diffuse the light emitted from the light emitting diode chip 106 to
pass through the optical element 104 more uniformly, so as to
improve the uniformity of the light of the light emitting diode
chip 106. Other technical content, materials, and features of the
light emitting diode package structure of the embodiment are
described in detail in the above embodiments. Hence, a detailed
description thereof is omitted hereinafter.
[0049] As described above, in this embodiment, the liquid light
emitting diode package structure mat be formed by combining the
packaging material layer with the filling material not dissolvable
to the packaging material layer, wherein the packaging material
layer is formed by mixing the stable and heat-resistant liquid with
high viscosity with solid particles, so as to improve the problem
of poor heat resistance that occurs in the conventional packaging
material and further enhance the reliability of the light emitting
diode light source module.
[0050] FIGS. 6A and 6B illustrate a schematic cross-sectional view
and a partial top view of a light emitting diode package structure
according to an embodiment of the disclosure. In FIGS. 6A and 6B,
identical reference numerals are used for the same elements as
those in FIG. 1, and descriptions of those elements are
omitted.
[0051] Referring to FIGS. 6A and 6B, a light emitting diode package
structure 60 includes a substrate 210, a seal assembly 202, an
optical element 234, at least one light emitting diode chip 106, a
packaging material layer 108, and a filling material 110. Herein,
the optical element 234 is disposed on the seal assembly 202, and
an enclosed space S is formed between the optical element 234, the
seal assembly 202, and the substrate 210.
[0052] In this embodiment, the substrate 210 is a heat dissipation
substrate, and a material thereof is copper, for example. However,
the disclosure is not limited thereto. In addition, a shape of the
substrate 210 shown in FIG. 6A is merely an example; in fact, the
shape of the substrate 210 is not particularly limited.
[0053] As shown in FIG. 6A, the optical element 234 is a curved
convex concave lens, for example. However, persons having ordinary
skill in the art should know that the disclosure is not limited
thereto, and the optical element 234 may have other shapes.
[0054] Moreover, the seal assembly 202 of this embodiment is a
mechanism formed by plastic injection. For example, the seal
assembly 202 may be consisted of an L-shaped positioning mechanism
202a and a covering mechanism 202b. The L-shaped positioning
mechanism 202a is for mechanically positioning the optical element
234 and the seal assembly 202. The covering mechanism 202b covers a
sidewall of the substrate 210 during the plastic injection and is
combined with the substrate 210. However, the seal assembly 202 may
be one single component or be composed of multiple components as
required, as long as the optical element 234, the seal assembly
202, and the substrate 210 form the enclosed space S. The
disclosure does not limit the number of the components that form
the seal assembly 202.
[0055] It should be noted that, in this embodiment, the substrate
210 has a groove 210a, and the light emitting diode chip 106 is
disposed in the groove 210a. Moreover, the packaging material layer
108 is disposed in the groove 210a and fills the groove 210a. The
filling material 110 is disposed in the enclosed space S and fills
the enclosed space S.
[0056] Herein, the length WA and width WB of the groove 210a are
1-1.5 times the length Wa and width Wb of the light emitting diode
chip 106. For example, the length Wa and width Wb of the light
emitting diode chip 106 are 1 mm respectively, and the length WA
and width WB of the groove 210a are 1-1.5 mm respectively.
[0057] Furthermore, as shown in FIG. 6B, the filling material 110
and the optical element 234 of the light emitting diode package
structure in this embodiment may also be formed of the same
material (such as silicone), and the light emitting diode package
structure may be an integral structure formed by mold injection
(not shown). That is, in this embodiment, silicone is used as the
material of the optical element 234 and the filling material 110 in
the enclosed space S, so as to form the light emitting diode
package structure. In addition, as described above, the heat
dissipation substrate may have various shapes, such as the
substrate 230 shown in FIG. 6B.
[0058] According to this embodiment, the heat dissipation substrate
may be used to improve heat dissipation efficiency, so as to
further enhance the reliability of the light emitting diode light
source module. Other technical content, materials, and features of
the light emitting diode package structure of the disclosure are
described in detail in the above embodiments. Hence, a detailed
description thereof is omitted hereinafter.
[0059] FIG. 7 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure. In FIG. 7, identical reference numerals are used for
the same elements as those in FIG. 1, and descriptions of those
elements are omitted.
[0060] Referring to FIG. 7, a light emitting diode package
structure 70 of the disclosure includes a substrate 200, an optical
element 204, at least one light emitting diode chip 106, a
packaging material layer 108, and a filling material 110.
[0061] The substrate 200 has a groove 200a, and the light emitting
diode chip 106 is disposed on the substrate 200 and located in the
groove 200a. The optical element 204 is disposed on the substrate
200 and encloses the groove 200a, so as to form an enclosed space C
between the optical element 204 and the substrate 200. The optical
element 204 shown in FIG. 7 is for example in a planar plate shape
and is disposed on the seal assembly 102 to form the enclosed space
C. However, the disclosure is not limited thereto. In other
embodiments, the optical element 204 may have other shapes, such as
the optical element 104 with the curved convex surface 104a in FIG.
1.
[0062] The packaging material layer 108 is located in the enclosed
space C and disposed on the upper surface 106a of the light
emitting diode chip 106 to cover all exposed surfaces of the light
emitting diode chip 106. Specifically, the packaging material layer
108 includes a liquid with high viscosity and a plurality of solid
particles, and the viscosity of the liquid with high viscosity is
more than 3000 mPas. Herein, the solid particles are phosphor,
TiO.sub.2, ZrO.sub.2, or Quantum Dot (QD), for example. The liquid
with high viscosity is for example at least one selected from
silicon oil, paraffin oil, olive oil, propylene carbonate, and
perfluoropolyether solution.
[0063] In addition, the light emitting diode package structure of
this embodiment further includes a filling material 110 that fills
the enclosed space C. The filling material 110 is a liquid with
favorable thermal conductivity, which is more than 0.55 W/mK, for
example. Moreover, the filling material 110 is preferably fluid at
room temperature, and the viscosity of the filling material 110 is
less than the viscosity of the packaging material layer 108.
Specifically, the filling material 110 is deionized water,
electrolyzed water, or Fluorinert, for example. However, the
disclosure is not limited thereto, and the filling material 110 can
be silicone or epoxy resin, for example.
[0064] The light emitting diode package structure of this
embodiment may selectively include a diffusion layer (not shown)
disposed in the enclosed space C and located on a light emitting
path of the light emitting diode chip 106. A material of the
diffusion layer 112 is nanoparticles of TiO.sub.2, for example, but
the disclosure is not limited thereto. The diffusion layer 112 may
be disposed to diffuse the light emitted from the light emitting
diode chip 106 to pass through the optical element 204 more
uniformly, so as to improve the uniformity of the light of the
light emitting diode chip 106.
[0065] FIG. 8 illustrates a schematic cross-sectional view and a
partial top view of a light emitting diode package structure
according to an embodiment of the disclosure. In FIG. 8, identical
reference numerals are used for the same elements as those in FIG.
7, and descriptions of those elements are omitted.
[0066] Referring to FIG. 8, a light emitting diode package
structure 80 of the disclosure includes a substrate 200, an optical
element 204, at least one light emitting diode chip 106, a
packaging material layer 108, and a filling material 110.
[0067] A difference between the light emitting diode package
structure 80 of this embodiment and the light emitting diode
package structure 70 of FIG. 7 lies in that: the groove 200a has a
recess 200b, and the light emitting diode chip 106 is disposed in
the recess 200b, wherein the length WC and width WD of the recess
200b are 1-1.5 times the length Wa and width Wb of the light
emitting diode chip 106 respectively.
[0068] For example, the length WC and width WD of the recess 200b
are 1 mm respectively, and the length Wa and width Wb of the light
emitting diode chip 106 are 1-1.5 mm respectively. In addition, the
packaging material layer is disposed in the recess 200b and fills
the recess 200b. The filling material 110 is disposed in the
enclosed space C and fills the enclosed space C.
[0069] Other technical content, materials, and features of the
light emitting diode package structure of this embodiment are
described in detail in the above embodiments.
[0070] It is worth mentioning that, although in the embodiments of
FIGS. 7-8, the packaging material layer 108 is used to cover all
exposed surfaces of the light emitting diode chip 106, and the
filling material 110 is used to fill the enclosed space C, for
example, the disclosure is not limited thereto. In other
embodiments, the substrate 200 with the groove 200a depicted in
FIG. 7 or the substrate 200 with the recess 200b depicted in FIG. 8
may be combined with any of the liquid packaging methods described
in the above embodiments (shown in FIGS. 1-6B) to complete the
light emitting diode package structure of the disclosure. Persons
with ordinary skill in the art are able to understand application
and variation of the disclosure based on the above embodiments, and
thus relevant descriptions will be omitted hereinafter.
[0071] FIG. 9 is a schematic cross-sectional view of a light
emitting diode package structure according to an embodiment of the
disclosure. In FIG. 9, identical reference numerals are used for
the same elements as those in FIG. 1, and descriptions of those
elements are omitted.
[0072] Referring to FIG. 9, a light emitting diode package
structure 90 of the disclosure includes a substrate 100, an optical
element 104, at least one light emitting diode chip 106, a
packaging material layer 108, and a filling material 110.
[0073] It should be noted that, the light emitting diode package
structure 90 of this embodiment is similar to the light emitting
diode package structure 10 of FIG. 1, and a difference lies in
that: the light emitting diode package structure 90 of this
embodiment further includes an electrode 114a and an electrode 114b
which are for example disposed on the substrate 100 and located in
the enclosed space S, as shown in FIG. 9. It is worth noting that,
in this embodiment, a voltage may be applied to the electrodes 114a
and 114b from outside of the light emitting diode package structure
through an electrowetting technique, so as to form an electric
field, thereby changing a contact angle of the packaging material
layer 108 and the filling material 110 to control a light emitting
angle of the light emitting diode and achieve a variable lighting
pattern light emitting diode.
[0074] Furthermore, although in the embodiment of FIG. 9, two
independent electrodes are added to the light emitting diode
package structure 10 of FIG. 1, for example; the disclosure,
however, is not limited thereto. The independent electrodes may be
added to any of the configurations of the above embodiments (e.g.
FIGS. 1-8) for carrying out the electrowetting technique, so as to
complete the light emitting diode package structure of the
disclosure. Persons with ordinary skill in the art are able to
understand application and variation of the disclosure based on the
above embodiments, and thus relevant descriptions will be omitted
hereinafter.
[0075] To conclude the above, by mixing the stable and
heat-resistant liquid with high viscosity and solid particles in
the packaging material layer and selectively using the filling
material that is not dissolvable to the packaging material layer,
the light emitting diode package structure of the disclosure may be
formed with better stability and heat resistance. More
specifically, the packaging material layer used in the light
emitting diode package structure of the disclosure is not cured
when heated and provides better stability that increases the
stability of the light source module. Therefore, even if the
packaging material layer is applied to a high-power light emitting
diode chip, the conventional problem of poor heat resistance that
occurs when phosphor is used as the packaging material can be
prevented, and accordingly the reliability of the light emitting
diode light source module is further enhanced.
[0076] It will be apparent to those skilled in the art that various
modifications and variations can be made to the disclosed
embodiments without departing from the scope or spirit of the
disclosure. In view of the foregoing, it is intended that the
disclosure covers modifications and variations of this disclosure
provided that they fall within the scope of the following claims
and their equivalents.
* * * * *