U.S. patent application number 13/658873 was filed with the patent office on 2013-07-04 for heat dissipating apparatus.
The applicant listed for this patent is SHUANG FU. Invention is credited to SHUANG FU.
Application Number | 20130168051 13/658873 |
Document ID | / |
Family ID | 48677410 |
Filed Date | 2013-07-04 |
United States Patent
Application |
20130168051 |
Kind Code |
A1 |
FU; SHUANG |
July 4, 2013 |
HEAT DISSIPATING APPARATUS
Abstract
A heat dissipating apparatus includes a base, a first fin
assembly, a second fin assembly, a first heat pipe, and a second
heat pipe. The first fin assembly and the second fin assembly are
disposed on the top surface of the base. The first fin assembly
defines a first through hole. The second fin assembly defines a
second through hole. The second fin assembly is a structural mirror
image of the first fin assembly. The first heat pipe includes a
first contacting portion in contact with the base and a second
contacting portion received in the first through hole of the first
fin assembly. The second heat pipe includes a third contacting
portion in contact with the base and a fourth contacting portion
received in the second through hole of the second fin assembly.
Inventors: |
FU; SHUANG; (Shenzhen City,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
FU; SHUANG |
Shenzhen City |
|
CN |
|
|
Family ID: |
48677410 |
Appl. No.: |
13/658873 |
Filed: |
October 24, 2012 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
G06F 1/20 20130101; H01L
2924/0002 20130101; H01L 2924/0002 20130101; F28D 15/0275 20130101;
H01L 23/427 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 30, 2011 |
CN |
201110452525.5 |
Claims
1. A heat dissipating apparatus, comprising: a base comprising a
top surface and a bottom surface configured for contacting an
electronic heat-generating component; a first fin assembly and a
second fin assembly disposed on the top surface of the base,
wherein the first fin assembly defines a first through hole, the
second fin assembly defines a second through hole, and the second
fin assembly is a structural mirror image of the first fin
assembly; a first heat pipe comprising a first contacting portion
in contact with the base and a second contacting portion received
in the first through hole of the first fin assembly; and a second
heat pipe comprising a third contacting portion in contact with the
base and a fourth contacting portion received in the second through
hole of the second fin assembly.
2. The heat dissipating apparatus of claim 1, wherein the first
heat pipe further comprises a first connecting portion
interconnecting the first contacting portion and the second
contacting portion, and the second heat pipe further comprises a
second connecting portion interconnecting the third contacting
portion and the fourth contacting portion.
3. The heat dissipating apparatus of claim 2, wherein the first
heat pipe and the second heat pipe are U-shaped.
4. The heat dissipating apparatus of claim 1, wherein the first
heat pipe is located in a first plane inclined upward from the top
surface of the base, and the second heat pipe is located in a
second plane inclined upward from the top surface of the base.
5. The heat dissipating apparatus of claim 4, wherein the first
plane and the second plane intersect at the top surface of the
base.
6. The heat dissipating apparatus of claim 1, wherein the first
heat pipe and the second heat pipe have a same structure.
7. The heat dissipating apparatus of claim 1, wherein a first
receiving groove and a second receiving groove are defined in the
top surface of the base, the first contacting portion of the first
heat pipe is received in the first receiving groove, and the third
contacting portion of the second heat pipe is received in the
second receiving groove.
8. The heat dissipating apparatus of claim 7, wherein a first
cutout groove is defined in a lower surface of the first fin
assembly, the first receiving groove together with the first cutout
groove define a first receiving hole, and the first contacting
portion of the first heat pipe is received in the first receiving
hole.
9. The heat dissipating apparatus of claim 7, wherein a second
cutout groove is defined in a lower surface of the second fin
assembly, the second receiving groove together with the second
cutout groove define a second receiving hole, and the third
contacting portion of the second heat pipe is received in the
second receiving hole.
10. The heat dissipating apparatus of claim 7, wherein the first
receiving groove and the second receiving groove are parallel to
each other.
11. The heat dissipating apparatus of claim 7, wherein the first
receiving groove and the second receiving groove extend lengthwise
along the base.
12. The heat dissipating apparatus of claim 1, wherein the first
through hole extends along a longer dimension of the first fin
assembly, and the second through hole extends along a longer
dimension of the second fin assembly.
13. The heat dissipating apparatus of claim 1, wherein a first side
surface of the first fin assembly is attached to a second side
surface of the second fin assembly.
14. The heat dissipating apparatus of claim 10, wherein the first
receiving groove and the second receiving groove are arranged in a
middle of the top surface of the base.
15. The heat dissipating apparatus of claim 1, wherein the first
fin assembly and the second fin assembly comprise a plurality of
parallel fins, and extending directions of the first through hole
and the second through hole are perpendicular to the plurality of
parallel fins.
16. The heat dissipating apparatus of claim 2, wherein the first
connecting portion of the first heat pipe is opposite to the second
connecting portion of the second heat pipe.
Description
REFERENCE TO RELATED APPLICATIONS
[0001] This application claims all benefits accruing under 35
U.S.C. .sctn.119 from China Patent Application No. 201110452525.5,
filed on Dec. 30, 2011 in the State Intellectual Property Office of
China, the contents of the China Application are hereby
incorporated by reference.
BACKGROUND
[0002] 1. Technical Field
[0003] The present disclosure generally relates to heat dissipating
apparatuses, and particularly relates to a heat dissipating
apparatus having two fin assemblies being structural mirror images
of each other.
[0004] 2. Description of Related Art
[0005] Electronic components, such as central processing units
(CPUs) in computers, generate a lot of heat during operations.
Excess heat may cause deterioration in the operational stability of
the electronic components and may damage the electronic components.
Thus, excess heat must be removed quickly to maintain an acceptable
operating temperature of the electronic components in the computer.
One method for removing heat from an electronic component is by
mounting a heat dissipating apparatus on the electronic component.
However, the dissipating apparatus of related art may be inadequate
to satisfy the ever-increasing demand for heat dissipation.
[0006] Therefore, there is room for improvement within the art.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Many aspects of the embodiments can be better understood
with reference to the following drawings. The components in the
drawings are not necessarily drawn to scale, the emphasis instead
being placed upon clearly illustrating the principles of the
embodiments. Moreover, in the drawings, like reference numerals
designate corresponding parts throughout the several views.
[0008] FIG. 1 is an exploded, isometric view of a heat dissipating
apparatus in accordance with an embodiment.
[0009] FIG. 2 is an assembled view of the heat dissipating
apparatus of FIG. 1.
DETAILED DESCRIPTION
[0010] The disclosure is illustrated by way of example and not by
way of limitation in the figures of the accompanying drawings in
which like references indicate similar elements. It should be noted
that references to "an" or "one" embodiment in this disclosure are
not necessarily to the same embodiment, and such references mean
"at least one."
[0011] FIG. 1 shows a heat dissipating apparatus 1 in accordance
with an embodiment. The heat dissipating apparatus 1 includes a
base 10, a first fin assembly 22, a second fin assembly 24, a first
heat pipe 32, and a second heat pipe 34.
[0012] The base 10 includes a top surface 12 and a bottom surface
14. The bottom surface 14 of the base 10 may contact a heat
delivery surface of an electronic heat-generating component (not
shown), such as a central processing unit (CPU) or a graphic
processing unit (GPU), and take heat from the heat-generating
component. The base 10 defines a first receiving groove 122 and a
second receiving groove 124 on the top surface 12. Both the first
receiving groove 122 and the second receiving groove 124 extend
lengthwise along the base 10 and across the top surface 12 of the
base 10. The first receiving groove 122 and the second receiving
groove 124 are arranged in the middle of the top surface 12 of the
base 10 and are parallel to each other.
[0013] The first fin assembly 22 includes a plurality of parallel
fins. The first fin assembly 22 defines a first through hole 222.
The first through hole 222 extends through the first fin assembly
22 and along the longer dimension of the first fin assembly 22. The
first through hole 222 is perpendicular to the fins of the first
fin assembly 22. The first fin assembly 22 defines a first cutout
groove 224 in its bottom surface which matches the internal shape
of the first receiving groove 122 of the base 10. The first cutout
groove 224 extends along a longer side of the first fin assembly 22
and is perpendicular to the fins of the first fin assembly 22. The
first cutout groove 224 is parallel to the first through hole
222.
[0014] The second fin assembly 24 is a structural mirror image of
the first fin assembly 22. The second fin assembly 24 defines a
second through hole 242. The second through hole 242 extends
through the second fin assembly 24 and along the longer dimension
of the second fin assembly 24. The second through hole 242 is
perpendicular to the fins of the second fin assembly 24. The second
fin assembly 24 defines a second cutout groove 244 in its bottom
surface which matches the internal shape of the second receiving
groove 124 of the base 10. The second cutout groove 244 extends
along a longer side of the second fin assembly 24 and is
perpendicular to the fins of the second fin assembly 24. The second
cutout groove 244 is parallel to the second through hole 242.
[0015] The first heat pipe 32 is U-shaped. The first heat pipe 32
includes a first contacting portion 322, a second contacting
portion 324, and a first connecting portion 326. The first
contacting portion 322 and the second contacting portion 324 are
perpendicular to the first connecting portion 326 and extend from
two opposite ends of the first connecting portion 326. The first
contacting portion 322 and the second contacting portion 324 are
parallel to each other. The first contacting portion 322, the
second contacting portion 324, and the first connecting portion 326
are substantially located in a same plane.
[0016] The second heat pipe 34 is the same as the first heat pipe
32. The second heat pipe 34 is also U-shaped. The second heat pipe
34 includes a third contacting portion 342, a fourth contacting
portion 344, and a second connecting portion 346. The third
contacting portion 342 and the fourth contacting portion 344 are
perpendicular to the second connecting portion 346 and extend from
two opposite ends of the second connecting portion 346. The third
contacting portion 342 and the fourth contacting portion 344 are
parallel to each other. The third contacting portion 342, the
fourth contacting portion 344, and the second connecting portion
346 are substantially located in a same plane.
[0017] Referring to FIG. 2, in assembly, the first fin assembly 22
and the second fin assembly 24 are disposed on the top surface 12
of the base 10. The first fin assembly 22 and the second fin
assembly 24 are parallel to each other. A first side surface 226 of
the first fin assembly 22 is attached to a second side surface 246
of the second fin assembly 24.
[0018] The first cutout groove 224 of the first fin assembly 22 is
aligned with the first receiving groove 122 of the base 10. The
first cutout groove 224 and the first receiving groove 122 together
define a first receiving hole (not labeled). The second cutout
groove 244 of the second fin assembly 24 is aligned with the second
receiving groove 124 of the base 10. The second cutout groove 244
and the second receiving groove 124 together define a second
receiving hole (not labeled).
[0019] The second contacting portion 324 the first heat pipe 32 is
inserted into the at first through hole 222 of the first fin
assembly 22. The diameter of the cross section of the second
contacting portion 324 is substantially the same as the diameter of
the first through hole 222, so that the second contacting portion
324 is in contact with the inner surface(s) of the first through
hole 222 when the second contacting portion 324 is received in the
first through hole 222. Similarly, the fourth contacting portion
344 of the second heat pipe 34 is received in the second through
hole 242 of the second fin assembly 24 and is in contact with the
inner surface(s) of the second through hole 242.
[0020] The first contacting portion 322 of the first heat pipe 32
is received in the first receiving hole. The third contacting
portion 342 of the second heat pipe 34 is received in the second
receiving hole. Thus, the first contacting portion 322 of the first
heat pipe 32 is in contact with the base 10 and the second
contacting portion 324 of the first heat pipe 32 is in contact with
the first fin assembly 22. The third contacting portion 342 of the
second heat pipe 34 is in contact with the base 10 and the fourth
contacting portion 344 of the second heat pipe 34 is in contact
with the second fin assembly 24. The first heat pipe 22 is located
in a first plane inclined upward from the top surface 12 of the
base 10. The second heat pipe 34 is located in a second plane
inclined upward from the top surface 12 of the base 10. The first
plane and the second plane intersect at the top surface 12 of the
base 10. The first connecting portion 326 of the first heat pipe 32
is opposite to the second connecting portion 346 of the second heat
pipe 34.
[0021] It is to be understood, however, that even though numerous
characteristics and advantages have been set forth in the foregoing
description of embodiments, together with details of the structures
and functions of the embodiments, the disclosure is illustrative
only and changes may be made in detail, especially in the matters
of shape, size, and arrangement of parts within the principles of
the disclosure to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
* * * * *