U.S. patent application number 13/721170 was filed with the patent office on 2013-06-27 for substrate plating apparatus and substrate plating control method.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Jae Chan Lee.
Application Number | 20130161197 13/721170 |
Document ID | / |
Family ID | 48633998 |
Filed Date | 2013-06-27 |
United States Patent
Application |
20130161197 |
Kind Code |
A1 |
Lee; Jae Chan |
June 27, 2013 |
SUBSTRATE PLATING APPARATUS AND SUBSTRATE PLATING CONTROL
METHOD
Abstract
Disclosed herein is a substrate plating apparatus, including: a
constant current device supplying power; cathode hangers that
includes a plurality of clamps holding substrates, hall current
sensors mounted on each of the clamps to detect current
information, and wireless communication modules connected with the
hall current sensors to wirelessly transmit the current information
to the outside; a current rail mounted with the plurality of
cathode hangers above a plating bath and connected with the
constant current device; and an anode unit extending from the
constant current device and dipped in a plating solution of the
plating bath.
Inventors: |
Lee; Jae Chan; (Suwon,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD.; |
Suwon |
|
KR |
|
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Suwon
KR
|
Family ID: |
48633998 |
Appl. No.: |
13/721170 |
Filed: |
December 20, 2012 |
Current U.S.
Class: |
205/96 ; 204/198;
204/228.1 |
Current CPC
Class: |
C25D 17/005 20130101;
C25D 17/06 20130101; C25D 21/12 20130101 |
Class at
Publication: |
205/96 ;
204/228.1; 204/198 |
International
Class: |
C25D 17/06 20060101
C25D017/06 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 21, 2011 |
KR |
10-2011-0139323 |
Claims
1. A substrate plating apparatus, comprising: a constant current
device supplying power; cathode hangers that includes a plurality
of clamps holding substrates, hall current sensors mounted on each
of the clamps to detect current information, and wireless
communication modules connected with the hall current sensors to
wirelessly transmit the current information to the outside; a
current rail mounted with the plurality of cathode hangers above a
plating bath and connected with the constant current device; and an
anode unit extending from the constant current device and dipped in
a plating solution of the plating bath.
2. The substrate plating apparatus as set forth in claim 1, wherein
the cathode hanger includes: a horizontal support and a suspending
support slidably supported to the current rail; a feeding unit
disposed above the horizontal support; a conduction base coupled
with the feeding unit; a rail guide provided below the suspending
support; and a variable slide disposed on the rail guide, wherein
the plurality of clamps fixing the substrates are mounted on the
variable slide.
3. The substrate plating apparatus as set forth in claim 2, wherein
the wireless communication module is mounted at one side of the
suspending support.
4. The substrate plating apparatus as set forth in claim 1, wherein
the wireless communication module uses a local area wireless
communication scheme of any one of zigbee, blue tooth, radio
frequency identification (RFID), and WiFi.
5. The substrate plating apparatus as set forth in claim 1, wherein
the wireless communication module includes: a wireless
communication processing unit connected with the hall current
sensor to receive current information on each of the clamps and
converting the current information into information in a local area
wireless communication scheme; and a local area wireless
transceiver wirelessly transmitting the converted current
information to the outside.
6. The substrate plating apparatus as set forth in claim 1, wherein
the hall current sensor is provided using a ring type hall device
surrounding one side of the clamp.
7. A substrate plating control method, comprising: mounting a
substrate to be plated using a plurality of clamps mounted on
hangers; detecting current information flowing in each of the
clamps by using wireless communication modules mounted on the
hangers and hall current sensor mounted of each of the clamps;
determining, by an external control unit, whether the current
information wirelessly received in real time from the wireless
communication module satisfies preset current reference information
for good plating; and if it is determined that the current
information satisfies the current reference information,
processing, by the control unit, the substrate mounted on the
corresponding hanger or the clamp as a substrate having a good
plating film.
8. The subs ate plating control method as set forth in claim 7,
wherein the mounting of the substrate includes: mounting the
substrates to be engaged between conduction contacts of the clamps;
and applying current through the clamp in a state in which the
substrate is dipped in a plating solution.
9. The substrate plating control method as set forth in claim 7,
wherein the detecting of the current information in real time
includes: detecting, by the hall current sensor, the current
applied to each of the clamps in real time and transferring the
detected current to the wireless communication module; wirelessly
transmitting, by the wireless communication module, the current
information to the control unit; and displaying, by the control
unit, the current information by an accumulated average current
value summing real time current values or average current values
for each of the hangers or the clamps.
10. The substrate plating control method as set forth in claim 7,
wherein at the determining, the current reference information
includes an applied current range, a current deviation range, and a
current density range.
11. The substrate plating control method as set forth in claim 7,
wherein the wireless communication module wirelessly transmits the
current information by a local area wireless communication scheme
of any one of zigbee, blue tooth, radio frequency identification
(RFID), and WiFi.
12. The substrate plating control method as set forth in claim 7,
wherein the hall current sensor detects the current applied to the
clamp in real time by using a ring type hall device surrounding one
side of the clamp.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of Korean Patent
Application No. 10-2011-0139323, filed on Dec. 21, 2011, entitled
"Substrate Plating Apparatus and Substrate Plating Control Method",
which is hereby incorporated by reference in its entirety into this
application.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to a substrate plating
apparatus and a substrate plating control.
[0004] 2. Description of the Related Art
[0005] In the prior art, in order to form metal wirings on a
printed circuit board, wirings are formed on the board by
patterning a metal film. In this case, the metal film formed on a
front of the substrate is formed by using aluminum or copper.
Meanwhile, copper can have large resistance force against
electrical mobility while improving reliability of a semiconductor
device due to a high melting point and increase a signal transfer
speed due to low specific resistance. Therefore, a copper metal
film has been mainly used.
[0006] As a method for forming a metal film, physical vapor
deposition (PVD) using a physical conflict and chemical vapor
deposition (CVD) using chemical reaction have been used. An example
of the PVD may include sputtering and an example of the CVD may
include thermal CVD using heat and plasma enhanced CVD (PECVD)
using plasma.
[0007] However, in order to pattern the metal film on the
substrate, an electroplating method having more excellent tolerance
against electrical mobility and more inexpensive manufacturing
costs than the deposition method has been used.
[0008] As described in Korean Patent Laid-Open Publication No.
2010-0034318 (laid-open published on Apr. 1, 2010), a principle of
the electroplating according to the prior art dips a copper plate
forming an anode and a substrate forming a cathode in a plating
bath including an electrolyte to move copper ions Cu2+ separated
from a cooper plate to the substrate so as to form a metal
film.
[0009] As a general example of an electroplating method, an
electroplating method using a wick hanger moves a wick hanger in
which an object to be plated is mounted along a vertical or
horizontal rail and dips the object to be plated in a plating
solution included in a plating bath, wherein a plating object is a
cathode and metal to be plated or insoluble metal is an anode.
[0010] Thereafter, the electroplating method uses a principle of
attaching the plating solution to a surface of the plating object
that is the cathode while separating metal ions included in the
plating solution due to the electrolysis of the plating solution
when current is applied to an electrode through a rectifier and
performing the plating while forming a metal film when a
predetermined time lapses.
[0011] The electroplating method needs to control a current
density, a distribution of a plating thickness, or the like, for
uniformly forming a thickness of the metal film as the printed
circuit board becomes thinner.
[0012] In detail, a throwing power method issued in the prior art
is described as an example. The throwing power method moves current
by connecting a plurality of cathode hangers to one rectifier and
holding the substrate with tongs in which clamps on the cathode
hanger is divided into several branches.
[0013] However, the throwing power method is difficult to uniformly
form the copper metal film on the substrate. That is, the plating
area of the substrate is large, the current start varies in the
hanger, and the distribution of plating current occurs on the
substrate due to clamp pollution, difference in strength of clamp
tongs, or the like.
[0014] The current density of the substrate is varied due to the
difference in the plating current and thus, the distribution of the
plating thickness is non-uniform.
[0015] Therefore, the copper metal film of the printed circuit
board generally has the non-uniform distribution of the plating
thickness to degrade the surface quality, thereby degrading the
reliability of the printed circuit board.
SUMMARY OF THE INVENTION
[0016] The present invention has been made in an effort to provide
a substrate plating apparatus capable of detecting and controlling
current information for plating in real time.
[0017] Further, the present invention has been made in an effort to
provide a substrate plating control method.
[0018] According to a preferred embodiment of the present
invention, there is provided a substrate plating apparatus,
including: a constant current device supplying power; cathode
hangers that includes a plurality of clamps holding substrates,
hall current sensors mounted on each of the clamps to detect
current information, and wireless communication modules connected
with the hall current sensors to wirelessly transmit the current
information to the outside; a current rail mounted with the
plurality of cathode hangers above a plating bath and connected
with the constant current device; and an anode unit extending from
the constant current device and dipped in a plating solution of the
plating bath.
[0019] The cathode hanger may include: a horizontal support and a
suspending support slidably supported to the current rail; a
feeding unit disposed above the horizontal support; a conduction
base coupled with the feeding unit; a rail guide provided below the
suspending support; and a variable slide disposed on the rail
guide, wherein the plurality of clamps fixing the substrates are
mounted on the variable slide.
[0020] The wireless communication module may be mounted at one side
of the suspending support.
[0021] The wireless communication module may use a local area
wireless communication scheme of any one of zigbee, blue tooth,
radio frequency identification (RFID), and WiFi.
[0022] The wireless communication module may include: a wireless
communication processing unit connected with the hall current
sensor to receive current information on each of the clamps and
converting the current information into information in a local area
wireless communication scheme; and a local area wireless
transceiver wirelessly transmitting the converted current
information to the outside.
[0023] The hall current sensor may be provided using a ring type
hall device surrounding one side of the clamp.
[0024] According to another preferred embodiment of the present
invention, there is provided a substrate plating control method,
including: mounting a substrate to be plated using a plurality of
clamps mounted on hangers; detecting current information flowing in
each of the clamps by using wireless communication modules mounted
on the hangers and hall current sensor mounted of each of the
clamps; determining, by an external control unit, whether the
current information wirelessly received in real time from the
wireless communication module satisfies preset current reference
information for good plating; and if it is determined that the
current information satisfies the current reference information,
processing, by the control unit, the substrate mounted on the
corresponding hanger or the clamp as a substrate having a good
plating film.
[0025] The mounting of the substrate may include: mounting the
substrates to be engaged between conduction contacts of the clamps;
and applying current through the clamp in a state in which the
substrate is dipped in a plating solution.
[0026] The detecting of the current information in real time may
include: detecting, by the hall current sensor, the current applied
to each of the clamps in real time and transferring the detected
current to the wireless communication module; wirelessly
transmitting, by the wireless communication module, the current
information to the control unit; and displaying, by the control
unit, the current information by an accumulated average current
value summing real time current values or average current values
for each of the hangers or the clamps.
[0027] At the determining, the current reference information may
include an applied current range, a current deviation range, and a
current density range.
[0028] The wireless communication module may wirelessly transmit
the current information by a local area wireless communication
scheme of any one of zigbee, blue tooth, radio frequency
identification (RFID), and WiFi.
[0029] The hall current sensor may detect the current applied to
the clamp in real time by using a ring type hall device surrounding
one side of the clamp.
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] FIG. 1 is an exemplified diagram showing a substrate plating
apparatus according to a preferred embodiment of the present
invention;
[0031] FIG. 2 is an exemplified diagram showing a hanger of the
substrate plating apparatus according to the preferred embodiment
of the present invention;
[0032] FIG. 3 is an exemplified diagram showing a clamp mounted
with a sensor according to a preferred embodiment of the present
invention;
[0033] FIG. 4 is a block diagram of the substrate plating apparatus
according to the preferred embodiment of the present invention;
[0034] FIG. 5 is a circuit diagram showing a current sensor of the
substrate plating apparatus according to the preferred embodiment
of the present invention;
[0035] FIG. 6 is a flow chart showing a plating control method
using the substrate plating apparatus according to the preferred
embodiment of the present invention;
[0036] FIG. 7 is an exemplified diagram for explaining a process of
detecting current information in real time depending on the plating
control method according to the preferred embodiment of the present
invention; and
[0037] FIG. 8 is an exemplified diagram for explaining a process of
determining plating defects depending on the plating control method
according to the preferred embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0038] Various objects, advantages and features of the invention
will become apparent from the following description of embodiments
with reference to the accompanying drawings.
[0039] The terms and words used in the present specification and
claims should not be interpreted as being limited to typical
meanings or dictionary definitions, but should be interpreted as
having meanings and concepts relevant to the technical scope of the
present invention based on the rule according to which an inventor
can appropriately define the concept of the term to describe most
appropriately the best method he or she knows for carrying out the
invention.
[0040] The above and other objects, features and advantages of the
present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings. In the specification, in adding reference
numerals to components throughout the drawings, it is to be noted
that like reference numerals designate like components even though
components are shown in different drawings. In the description, the
terms "first", "second", and so on are used to distinguish one
element from another element, and the elements are not defined by
the above terms. In describing the present invention, a detailed
description of related known functions or configurations will be
omitted so as not to obscure the gist of the present invention.
[0041] Hereinafter, preferred embodiments of the present invention
will be described in detail with reference to the accompanying
drawings. FIG. 1 is an exemplified diagram showing a substrate
plating apparatus according to a preferred embodiment of the
present invention, FIG. 2 is an exemplified diagram showing a
hanger of the substrate plating apparatus according to the
preferred embodiment of the present invention, FIG. 3 is an
exemplified diagram showing a clamp mounted with a sensor according
to a preferred embodiment of the present invention, FIG. 4 is a
block diagram of the substrate plating apparatus according to the
preferred embodiment of the present invention, and FIG. 5 is a
circuit diagram showing a current sensor of the substrate plating
apparatus according to the preferred embodiment of the present
invention.
[0042] As shown in FIG. 1, a substrate plating apparatus according
to a preferred embodiment of the present invention may include a
constant current device 10 supplying power; cathode hangers 200
that include a plurality of clamps 210 holding substrates 100, hall
current sensors 212 mounted on each clamp, and wireless
communication modules 220 connected with the hall current sensor
212; a current rail 20 slidably mounted with the cathode hangers
200 above a plating bath 50 and connected with the constant current
device 10; and an anode unit 30 extending from the constant current
device 10 and dipped in a plating solution 55 of the plating bath
50.
[0043] The substrate plating apparatus to the preferred embodiment
of the present invention has a structure in which a current pass is
formed of an anode unit 30 dipped in the plating solution and a
current rail 20 and metal anions of the anode unit 30 move toward
the substrates 100 of the cathode hangers 200 via the plating
solution 55 to perform plating.
[0044] The constant current device 10 includes a plurality of anode
lines and cathode lines such that the anode lines are connected
with the anode unit 30 and the cathode lines are connected with the
current rail 20.
[0045] The current rail 20 is provided above the plating bath 50
and the plurality of cathode hangers 200 on which the substrates
100 to be plated are mounted are slidably fastened.
[0046] As shown in FIG. 2, the cathode hanger 200 may include a
horizontal support 201 and a suspending support 202 slidably
supported to the current rail 20; a conduction base 204 coupled
with a feeding unit 203 above the horizontal support 201; a rail
guide 205 provided below the suspending support 202; a plurality of
clamps 201 mounted on a variable slide 206 disposed on the rail
guide 205 and fixing the substrates 100; hall current sensors 212
and 212' mounted at one side of each clamp 210; and wireless
communication modules 220 connected with hall current sensors 212
in a wired manner.
[0047] The cathode hanger 200 slidably moves on the current rail 20
by using the horizontal support 201 and the suspending support 202
to move the mounted substrate 100 in a predetermined direction and
at a predetermined speed. The cathode hangers 200 may be disposed
on the current rail 20 at a predetermined distance to current the
same current to the substrate 100.
[0048] The clamp 210 is disposed in number set in proportion to the
area or the length of the substrate 100 at a predetermined distance
in a line and is used as a method for the cathode conduction while
fixing the substrate 100 to be plated. As shown in FIG. 3, the
conduction contact 211 of the clamp 210 is dipped in the plating
solution to implement the cathode conduction for the substrate
100.
[0049] In this case, the hall current sensor 212 mounted on one
side of the clamp 210 detects in real time the current information
flowing in the substrate 100 through the clamp 210 and transfers
the detected information to the wireless communication module 220
mounted on the suspending support 202.
[0050] The hall current sensor 212 may be formed using a ring type
hall device surrounding one side of the clamp 210. As shown in FIG.
5, the hall current sensor 212 measures magnetic field for current
(shown by +) flowing at a right angle by penetrating through the
hall current sensor 212 to detect the current applied to the clamp
210 in real time and transfers the detected current to the wireless
communication module 220 provided on the suspending support 202 in
a wired manner.
[0051] The wireless communication module 220 is a module to which
local area wireless communication schemes such as Zigbee, blue
tooth, radio frequency identification (RFID), WiFi, or the like,
are applied. The wireless communication module 220 is configured to
include a local area wireless communication processing unit 221 and
a local area wireless transceiver 222 as shown in FIG. 4.
[0052] The local area wireless communication processing unit 221
converts the current information transferred through wires (not
shown) connected with each of the hall current sensors 212 into
information in the local area wireless communication schemes and
the local area wireless transceiver 222 wirelessly transfers the
converted current information to a control unit (not shown) mounted
on the outside. In this case, the control unit may be represented
by a computer processor unit included in a PC, a PDA, a notebook, a
smart phone, or the like.
[0053] The external control unit analyzes the wirelessly received
current information to be display on a display device (not shown)
such as a monitor, or the like as current information applied to
each of the clamps 210 such as current amount flowing in each clamp
210, current density, and accumulated current amount.
[0054] Further, the control unit may compare the current
information with current reference information to determine the
plating defects of the plating film formed on the substrates 100
mounted on each clamp 210 and display the determined results on the
display device.
[0055] Therefore, the substrate plating apparatus according to the
preferred embodiment of the present invention detects the current
flowing in each clamp 210 in real time by using the hall current
sensor 212, thereby knowing the current information flowing in each
clamp 210 and knowing the position of the clamp at which problems
such as short occur.
[0056] Hereinafter, the plating control method using the substrate
plating apparatus according to the preferred embodiment of the
present invention will be described with reference to FIGS. 6 to 8.
FIG. 6 is a flow chart showing a plating control method using the
substrate plating apparatus according to the preferred embodiment
of the present invention, FIG. 7 is an exemplified diagram for
explaining a process of detecting current information in real time
depending on the plating control method according to the preferred
embodiment of the present invention, and FIG. 8 is an exemplified
diagram for explaining a process of determining plating defects
depending on the plating control method according to the preferred
embodiment of the present invention.
[0057] The plating control method using the substrate plating
apparatus according to the preferred embodiment of the present
invention first mounts the substrate 100 to be plated on the
cathode hanger 200 (S610).
[0058] In detail, the plating control method using the substrate
plating apparatus according to the preferred embodiment of the
present invention mounts the substrates 100 on the plurality of
cathode hangers 200 spaced away from each other at a predetermined
distance as shown in FIG. 2. In particular, the substrates 100 are
mounted so as to be engaged between the conduction contacts 211 of
the clamps 210.
[0059] After the substrates 100 are mounted on the plurality of
clamps 210, the substrates 100 mounted on the clamps 210 vertically
drops into the plating bath 50 including the plating solution to
apply external power to the constant current device 10 in a state
in which the substrates 100 are dipped in the plating solution
55.
[0060] When the external power is applied to the constant current
device 10, the plating current performs electroplating on the
substrate 100 by moving the cathode hanger 200 in one direction
along the current rail 20 while supplying cathode current and anode
current to the substrate 100 and the plating solution 55,
respectively, through the cathode hanger 200 and the anode unit
30.
[0061] In this case, the information on current flowing in each
clamp 210 is detected in real time by using the wireless
communication module 220 mounted on the cathode hanger 200 and the
hall current sensor 212 mounted on each clamp 210 (S620).
[0062] That is, the hall current sensor 212 detects the current
applied to the clamp 210 in real time and transfers the detected
current information to the wireless communication module 220
mounted on the suspending support 202 in a wired manner. The
wireless communication module 220 converts the received current
information into a signal pattern of the local area wireless
communication scheme in the local area wireless communication
processing unit 221 and wirelessly transfers the current
information converted in the local area wireless transceiver 222 to
the outside.
[0063] When the wirelessly transferred current information is
received in the control unit mounted at the outside, the control
unit may display the current information through the display device
as shown in FIG. 7. That is, the control unit may display in real
time a detected current value detected like a graph shown in FIG. 7
according to the wirelessly transferred current information.
[0064] Further, the control unit may display an accumulated average
current value summing the average current value for each clamp as
shown in FIG. 7. That is, the information that the accumulated
average current summing the average current values of the current
values detected for a predetermined time for each clamp from No. 1
to No. 4 of No. 96 hanger shown in FIG. 7 is 73.5 A and the
accumulated average current summing the average current values
detected for a predetermined time for each clamp from No. 1 to No.
4 of No. 67 hanger is 94.5 A may be displayed in real time.
[0065] As shown in FIG. 8, the control unit may represent five
clamps selectively provided in No. 1 hanger by CT1 to CT5 and may
display the current value detected in real time and a graph thereof
Although FIG. 8 shows only No. 1 hanger, the preferred embodiment
of the present invention is not limited thereto. Therefore, FIG. 8
shows the clamps for each of the plurality of hangers on which the
substrates are mounted and may display the current value detected
in real time and the graph thereof
[0066] In this case, the control unit determines whether the
current information wirelessly transferred in real time satisfies
the current reference information preset for good plating
(S630).
[0067] In this case, the current reference information preset for
good plating may include an applied current range, a current
deviation range, a current density range, or the like. For example,
when the reference input current for forming the plating thickness
of 60 .mu.m.+-.5 .mu.m as the determination reference is set to be
100 A, the applied current range of 90 A to 110 A that is an error
range of .+-.10% for a 100 A value may be used as the current
reference information for good plating. Therefore, the accumulated
average current of No. 96 hanger shown in FIG. 7 is 73.5 A and
therefore, cannot satisfy the applied current range. As a result,
the control unit determines No. 96 hanger as a defective hanger and
a substrate mounted on No. 96 hanger may be represented as a
defective substrate.
[0068] On the other hand, the accumulated average current of No. 67
hanger is 94.5 A and therefore, satisfies the applied current
range. Therefore, the control unit determines No. 67 hanger as a
good hanger and may represent a substrate mounted on No. 67 hanger
as a good substrate.
[0069] In addition, in FIG. 8, for the current value detected in
real time and the graph thereof, the control unit may represent the
hanger or the clamp by defects and the mounted substrate by
defects, based on portion "A" of the graph in which the current
value suddenly falls and portions "B" and "C" of the graph in which
the current deviation is more serious than other clamps.
[0070] As the determination results at the determining (S630), when
the wirelessly transferred current information satisfies the preset
current reference information, the control unit processes the
substrate mounted on the corresponding hanger or the clamp as the
substrate having the good plating film (S640).
[0071] Therefore, the user may end the process of plating the
processed substrate as the substrate having the good plating film
and separate and finish the substrate mounted on the corresponding
hanger or the clamp.
[0072] On the other hand, as the determination results at the
determining (S630), when the wirelessly transferred current
information does not satisfy the preset current reference
information, the control unit processes the substrate mounted on
the corresponding hanger or the clamp as the defective substrate
and performs the discard processing (S650).
[0073] The plating control method using the substrate plating
apparatus according to the preferred embodiment of the present
invention including the above-mentioned process detects the
information on the current applied to the clamp in real time by
using the hall current sensor 212 during the electroplating.
[0074] In addition, the plating control method according to the
preferred embodiment of the present invention receives in real time
the current information through the local area wireless
communication by the wireless communication module 220 connected
with the hall current sensor 210 and displays the received current
information, thereby previously preventing the non-plating defects
due to current non-application and current deviation and improving
the reliability of the distribution of the plating film
thickness.
[0075] The plating control method using the substrate plating
apparatus according to the preferred embodiments of the present
invention can detect the information on the current applied to the
clamp in real time by using the hall current sensor during the
electroplating process.
[0076] Further, the plating control method using the substrate
plating apparatus according to the preferred embodiments of the
present invention can previously prevent the plating defects and
can improve the reliability of the distribution of the plating film
thickness by receiving in real time the current information using
local area wireless communication by the wireless communication
module connected with the hall current sensor and displaying the
received information.
[0077] Although the preferred embodiments of the present invention
have been disclosed for illustrative purposes, they are for
specifically explaining the present invention and thus a substrate
plating apparatus and a substrate plating control method according
to the present invention are not limited thereto, but those skilled
in the art will appreciate that various modifications, additions
and substitutions are possible, without departing from the scope
and spirit of the invention as disclosed in the accompanying
claims.
[0078] In addition, any and all modifications, variations or
equivalent arrangements should be considered to be within the scope
of the invention, and the detailed scope of the invention will be
disclosed by the accompanying claims.
* * * * *