U.S. patent application number 13/459095 was filed with the patent office on 2013-06-20 for heat dissipation device with fan.
This patent application is currently assigned to Foxconn Technology Co., Ltd.. The applicant listed for this patent is Wei-Jen HUANG, Jui-Wen HUNG, Ching-Bai HWANG, Shih-Yao LI. Invention is credited to Wei-Jen HUANG, Jui-Wen HUNG, Ching-Bai HWANG, Shih-Yao LI.
Application Number | 20130153178 13/459095 |
Document ID | / |
Family ID | 48608926 |
Filed Date | 2013-06-20 |
United States Patent
Application |
20130153178 |
Kind Code |
A1 |
LI; Shih-Yao ; et
al. |
June 20, 2013 |
HEAT DISSIPATION DEVICE WITH FAN
Abstract
A heat dissipation device includes a bracket, a fan with an air
inlet and an air outlet, and a heat sink mounted on the bracket.
The bracket includes a plurality of rivets and clasps. Each of the
clasps includes a mounting portion, an arm extending upwards from
the mounting portion, and a hook portion extending from a top end
of the arm and towards the mounting portion. The mounting portion
is riveted on the bracket by a corresponding rivet. The fan
includes a plurality of ears corresponding to the clasps. The hook
portions of the clasps abut on top surfaces of the ears to fix the
fan on the bracket. The fan defines a plurality of channels
communicating the outlet of the fan.
Inventors: |
LI; Shih-Yao; (Tu-Cheng,
TW) ; HUNG; Jui-Wen; (Tu-Cheng, TW) ; HWANG;
Ching-Bai; (Tu-Cheng, TW) ; HUANG; Wei-Jen;
(Tu-Cheng, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LI; Shih-Yao
HUNG; Jui-Wen
HWANG; Ching-Bai
HUANG; Wei-Jen |
Tu-Cheng
Tu-Cheng
Tu-Cheng
Tu-Cheng |
|
TW
TW
TW
TW |
|
|
Assignee: |
Foxconn Technology Co.,
Ltd.
Tu-Cheng
TW
|
Family ID: |
48608926 |
Appl. No.: |
13/459095 |
Filed: |
April 28, 2012 |
Current U.S.
Class: |
165/104.34 |
Current CPC
Class: |
H01L 23/4093 20130101;
H01L 2924/0002 20130101; H01L 23/467 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.34 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 14, 2011 |
TW |
100146150 |
Claims
1. A heat dissipation device comprising: a bracket comprising a
plurality of rivets and clasps, each of the clasps comprising a
mounting portion, an arm extending upwards from the mounting
portion, and a hook portion extending from a top end of the arm and
towards the mounting portion, the mounting portion being riveted on
the bracket by the corresponding rivet; a fan having an air inlet
and an air outlet, the fan comprising a plurality of ears
corresponding to the clasps, the hook portions of the clasps
abutting on top surfaces of the ears to fix the fan on the bracket;
and a heat sink mounted on the bracket and having a plurality of
channels communicating the air outlet of the fan.
2. The heat dissipation device of claim 1, wherein each of the ears
defines a through hole, the bracket comprising a plurality of
orientating members each extending in the through hole of a
corresponding ear.
3. The heat dissipation device of claim 2, wherein each of the
orientating members comprising a circular base contacting a bottom
of the corresponding ear and a pin extending from a top end of the
circular base and in a corresponding through hole of the
corresponding ear.
4. The heat dissipation device of claim 2, wherein the bracket
comprises a plurality of position blocks, each of the position
blocks being spaced from the corresponding rivet and abutting
against the arm of the corresponding clasp.
5. The heat dissipation device of claim 4, wherein the bracket, the
rivets, the position blocks and the orientating members are
integrally made of metal.
6. The heat dissipation device of claim 4, wherein the bracket is
made of plastic material, and the rivets, the position blocks and
the orientating members are integrally made of metal with bottoms
embedded in the bracket.
7. The heat dissipation device of claim 1, wherein the bracket
comprises a bottom plate and two side plates extending upwards from
opposite edges of the bottom plate, two air guiding plates inwards
extending from inner sides of the side plates from the fan to the
heat sink.
8. The heat dissipation device of claim 7, wherein the bottom plate
defines an opening communicating the air inlet of the fan and a
window receiving the heat sink, the opening and the window being
defined at two sides of the air guiding plates.
9. A heat dissipation device comprising: a bracket comprising a
plurality of rivets, clasps, and orientating members, each of
orientating member being spaced from and adjoined to one
corresponding rivet, each of the clasps being riveted on the
bracket by the corresponding rivet; and a centrifugal fan having an
air inlet and an air outlet, the fan comprising a plurality of ears
corresponding to the clasps, the clasps abutting on top surfaces of
the ears to fix the fan on the bracket.
10. The heat dissipation device of claim 9, wherein each of the
orientating members comprising a circular base contacting a bottom
of a corresponding ear and a pin extending from a top end of the
circular base and in a corresponding through hole of the
corresponding ear.
11. The heat dissipation device of claim 9, wherein the bracket
comprises a plurality of position blocks, each of the position
blocks being spaced from the corresponding rivet and abutting
against a corresponding clasp.
12. The heat dissipation device of claim 11, wherein the bracket,
the rivets, the position blocks and the orientating members are
integrally made of metal.
13. The heat dissipation device of claim 11, wherein the bracket is
made of plastic material, and the rivets, the position blocks and
the orientating members are integrally made of metal with bottoms
embedded in the bracket.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The disclosure relates to heat dissipation devices in
electronics, and more particularly to a heat dissipation device
with a centrifugal fan capable of being conveniently assembled to
and disassembled from a bracket.
[0003] 2. Description of Related Art
[0004] A heat sink is usually placed in thermal contact with a heat
generating electronic device such as a central processing unit
(CPU), and transfers heat through conduction away from the heat
generating electronic device so as to prevent over-heating of the
heat generating electronic device.
[0005] Typically, a centrifugal fan is mounted on a side of a heat
sink to improve heat dissipation efficiency of the heat sink. In a
conventional assembling method, the fan is locked onto the heat
sink by screws interferentially engaged with fins of the heat sink.
However, the previously mentioned assembling method requires screws
and a screwdriver to perform these procedures. As known by those
skilled persons, the conventional method wastes time and
manpower.
[0006] What is needed, therefore, is a heat dissipation device
which can overcome the limitations described.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0008] FIG. 1 is an assembled, isometric view of a heat dissipation
device in accordance with an embodiment of the disclosure.
[0009] FIG. 2 is an exploded view of the heat dissipation device of
FIG. 1.
[0010] FIG. 3 is an enlarged view of a circle III of FIG. 2.
[0011] FIG. 4 is an exploded view of a clasp from a bracket of the
heat dissipation device of the circle III of FIG. 3.
[0012] FIG. 5 is a side, partial view of the heat dissipation
device of FIG. 1.
DETAILED DESCRIPTION
[0013] Referring to FIG. 1, a heat dissipation device 100 in
accordance with an embodiment of the disclosure is shown. The heat
dissipation device 100 is used to thermally contact an electronic
component (not shown) mounted on a printed circuit board (not
shown) to dissipate heat generated by the electronic component. The
heat dissipation device 100 includes a bracket 10, and a fan 20 and
heat sink 30 mounted on the bracket 10.
[0014] Referring to FIG. 2, the bracket 10 includes a bottom plate
11 and two side plates 12 extending upwards from two opposite edges
of the bottom plate 11. Each of the side plates 12 form an air
guiding plate 13 extending inwards from inner sides thereof. The
bottom plate 11 defines a rectangular window 15 and a circular
opening 14 respectively at two sides of the air guiding plate 13.
The bottom plate 11 forms two steps 151 extending downwards from
opposite sides of the window 15. A plurality of projections 152
extend from bottoms of the side plates 12 and at two ends of the
steps 151.
[0015] The fan 20 is mounted on the bottom plate 11 and covers the
circular opening 14. The fan 20 is a centrifugal fan with an air
outlet 22 facing the heat sink 30 and two air inlets 23 vertical to
the air outlet 22. The fan 20 forms two ears 21 at a periphery
thereof. Each of the ears 21 defines a through hole 211.
[0016] The heat sink 30 includes a heat absorbing plate 31 and a
fin set 32 mounted on the heat absorbing plate 31. The heat
absorbing plate 31 can be a vapor chamber. The heat absorbing plate
31 is received in the window 15, supported by the steps 15 and
blocked by the projections 152. The heat absorbing plate 31 is used
to thermally contact the electronic component to absorb heat
generated by the electronic component. The fin set 32 defines a
plurality of channels (not labeled) communicating the air outlet 22
of the fan 20. The fin set 32 dissipates the heat transferred from
the heat absorbing plate 31 into the channels, the heat then is
brought by airflow generated by the fan 20.
[0017] Referring to FIGS. 3-4, the heat dissipation device 100
includes two clasps 16 and two orientating members 17 mounted
around the circular opening 14. The clasps 16 are made of elastic
metal. Each of the clasps 16 includes a mounting portion 161, an
arm 162 upwards extending from the mounting portion 161, and a hook
portion 163 extending from a top end of the arm 162. The hook
portion 163 is bent towards the mounting portion 161. The mounting
portion 161 defines a rivet hole 164. The bottom plate 11 forms a
rivet 18 relative to the rivet hole 164 of the each clasp 16 and a
position block 19 near and spaced to the rivet 18. The rivet hole
164 of each of the clasps 16 is triangular, and each of the rivets
18 has a corresponding triangular shape. When the clasps 16 are
mounted on the bottom plate 11, each of the rivets 18 extends
through the rivet hole 164 of the corresponding mounting portion
161, and each of the position blocks 19 abuts against a back
surface of the arm 162. Top ends of the rivets 18 are then punched
to be larger to lock the clasps 16 on the bottom plate 11. Each of
the orientating members 17 includes a circular base 171 and a pin
172 extending from a top end of the circular base 171. In this
embodiment, the bracket 10, the rivets 18, the position blocks 19
and the orientating members 17 are integrally made of metal having
good thermal conductivity. In another embodiment, the bracket 10
can be made of plastic material, and the rivets 18, the position
blocks 19 and the orientating members 17 are integrally made of
metal with bottoms embedded in the bracket 10.
[0018] Referring to FIG. 5 also, when the fan 20 is mounted on the
bottom plate 11, the ears 21 of the fan 20 are pressed toward the
clasps 16. The hook portions 163 of the clasps 16 are subjected to
an external force, which makes the hook portion 163 run outwardly.
Thereafter, the fan 20 is pressed towards the bottom plate 11 until
the ears 21 contacts the circular base 171 and the pins 172 extend
in the through holes 211 of the ears 21. Then, the external force
of the hook portions 163 is released; a resilience of the hook
portions 163 impels the arms 162 to move towards the ears 21. As a
result, the hook portions 163 of the clasps 16 press the top
surfaces of the ears 21. Therefore, the fan 20 is clasped on the
bottom plate 11.
[0019] It is to be understood, however, that even though numerous
characteristics and advantages of certain embodiments have been set
forth in the foregoing description, together with details of the
structures and functions of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the disclosure to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *