U.S. patent application number 13/719573 was filed with the patent office on 2013-06-20 for fluid temperature adjusting device.
This patent application is currently assigned to KELK LTD.. The applicant listed for this patent is Kelk Ltd.. Invention is credited to Koji Maeda, Mitsuru Mimata.
Application Number | 20130152605 13/719573 |
Document ID | / |
Family ID | 48608740 |
Filed Date | 2013-06-20 |
United States Patent
Application |
20130152605 |
Kind Code |
A1 |
Mimata; Mitsuru ; et
al. |
June 20, 2013 |
FLUID TEMPERATURE ADJUSTING DEVICE
Abstract
A fluid temperature adjusting device includes: a heater
configured to heat a fluid passing through a fluid passageway; a
peltier module including a plurality of peltier elements, the
peltier module being configured to heat or cool the fluid passing
through the fluid passageway; and a controller configured to divide
a total thermal energy for keeping the fluid at a target
temperature into a thermal energy to be supplied from the heater
and a thermal energy to be supplied from the peltier module to give
the total thermal energy from both the heater and the peltier
module to the fluid.
Inventors: |
Mimata; Mitsuru;
(Hiratsuka-shi, JP) ; Maeda; Koji; (Hiratsuka-shi,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kelk Ltd.; |
Hiratsuka-shi |
|
JP |
|
|
Assignee: |
KELK LTD.
Hiratsuka-shi
JP
|
Family ID: |
48608740 |
Appl. No.: |
13/719573 |
Filed: |
December 19, 2012 |
Current U.S.
Class: |
62/3.3 |
Current CPC
Class: |
H01L 21/67248 20130101;
F25B 21/04 20130101; F25B 2321/021 20130101; H01L 21/67109
20130101 |
Class at
Publication: |
62/3.3 |
International
Class: |
F25B 21/04 20060101
F25B021/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 20, 2011 |
JP |
2011-278981 |
Claims
1. A fluid temperature adjusting device comprising: a heater
configured to heat a fluid passing through a fluid passageway; a
peltier module including a plurality of peltier elements, the
peltier module being configured to heat or cool the fluid passing
through the fluid passageway; and a controller configured to divide
a total thermal energy for keeping the fluid at a target
temperature into a thermal energy to be supplied from the heater
and a thermal energy to be supplied from the peltier module to give
the total thermal energy from both the heater and the peltier
module to the fluid.
2. The fluid temperature adjusting device according to claim 1,
wherein the controller is configured to change a ratio between an
operation amount of the heater and an operation amount of the
peltier module depending on a magnitude of the thermal energy to be
supplied to the fluid.
3. The fluid temperature adjusting device according to claim 2,
wherein the controller is configured to control the heater and the
peltier module so that the operation amount of the peltier module
becomes larger than the operation amount of the heater when the
total thermal energy to be supplied to the fluid is smaller than a
predetermined value.
4. The fluid temperature adjusting device according to claim 1,
wherein the controller is configured to supply power to the heater
by a cycle control or a duty control.
5. The fluid temperature adjusting device according to claim 1,
wherein the controller is configured to change the thermal energy
to be supplied by each of the peltier module and the heater while
keeping a ratio between an operation amount of the peltier module
and an operation amount of the heater at a constant value when the
thermal energy to be supplied to the fluid changes.
6. The fluid temperature adjusting device according to claim 1,
wherein the controller is configured to monotonously increase a
supply amount of the heater and a supply amount of the peltier
module.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is based upon and claims the benefit of
priority from Japanese Patent Application No. 2011-278981, filed
Dec. 20, 2011, the entire contents of which are incorporated herein
by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a fluid temperature
adjusting device.
[0004] 2. Description of the Related Art
[0005] The semiconductor manufacture and the like have a process of
cleaning a semiconductor such as a semiconductor wafer using a
heated liquid. In the process of cleaning the semiconductor, the
semiconductor is cleaned by a liquid of which the temperature is
adjusted to a predetermined temperature in response to each
process. The temperature of the liquid is different for each
process, and may be a temperature (for example, 15.degree. C.)
lower than a room temperature or a temperature (for example,
50.degree. C.) higher than a room temperature. Since the adjustment
in the temperature of the liquid is handled by the same temperature
control device, there is a demand that a temperature adjusting
device needs to be equipped with both heating and cooling
functions. As a device for satisfying such a demand, a peltier
module is widely used.
[0006] Since the cleaning liquid is degraded when the cleaning
liquid is used for a long period of time, the cleaning liquid is
replaced when the cleaning liquid is degraded to some extent. When
replacing the cleaning liquid, there is a need to increase the
temperature of the liquid at a room temperature to, for example,
50.degree. C., but it takes a time until the temperature of the
liquid increases to some extent. Recently, there is an increasing
demand for the improvement in the wafer processing speed per unit
time, and hence the temperature increasing time needs to be
shortened. Here, since the process of cooling the chemical liquid
(the cleaning liquid) occupies a small time compared to the process
of heating the liquid to a high temperature, the shortening of the
cooling time is not strongly demanded. Therefore, a temperature
control device has been developed which shortens a temperature
increasing time by adding a heater to a temperature control device
equipped with a peltier module. For example, Japanese Laid-open
Patent Publication No. 2007-87774 discloses a method of controlling
a liquid temperature adjusting device that uses a peltier module
with a plurality of peltier elements and a heater.
[0007] In Japanese Laid-open Patent Publication No. 2007-87774, the
amount of the power supplied to the peltier module is decreased or
the supply of the power is stopped while using the heater together
simultaneously when starting a new liquid injecting process. Thus,
in a normal state, the liquid is kept at a target temperature by
controlling the temperature of the liquid through the control of
the supply of the power to the peltier module.
[0008] In the technique disclosed in Japanese Laid-open Patent
Publication No. 2007-87774, the amount of the power supplied to the
peltier module is decreased or the supply of the power is stopped
simultaneously when starting the new liquid injecting process, but
only the peltier module is used in the control of keeping the
liquid at the target temperature. For this reason, in the technique
disclosed in Japanese Laid-open Patent Publication No., although
the heater is provided, its usage is limited. Accordingly, in the
control for keeping the fluid at the target temperature, the
capability of the heater is not used. As a result, the fluid may
not be promptly adjusted to the target temperature.
[0009] When the fluid is heated by both the peltier module and the
heater, the maximum heating capability may be increased, so that
the temperature increasing time (the time until the liquid becomes
the target temperature) may be shortened. Here, when the fluid is
simultaneously heated by both the peltier module and the heater,
the inside of the device is overheated, and hence there is a
possibility that the durability may be degraded. When there is a
possibility that the overheating may occur, the operation amount
(the supplied thermal energy) is limited. In this way, it is
possible to shorten a temperature increasing time while suppressing
degradation in the durability. In general, the heater uses a cycle
control or a duty control through an AC power supply, but has a
limitation in the output resolution of the thermal energy. In a
region where the thermal energy output resolution of the heater
influences the temperature control result, the temperature control
performance is improved by mainly using the heating of the peltier
module, and hence the temperature increasing time may be
shortened.
SUMMARY OF THE INVENTION
[0010] It is an object of the present invention to at least
partially solve the problems in the conventional technology. A
fluid temperature adjusting device comprises: a heater configured
to heat a fluid passing through a fluid passageway; a peltier
module including a plurality of peltier elements, the peltier
module being configured to heat or cool the fluid passing through
the fluid passageway; and a controller configured to divide a total
thermal energy for keeping the fluid at a target temperature into a
thermal energy to be supplied from the heater and a thermal energy
to be supplied from the peltier module to give the total thermal
energy from both the heater and the peltier module to the
fluid.
[0011] The above and other objects, features, advantages and
technical and industrial significance of this invention will be
better understood by reading the following detailed description of
presently preferred embodiments of the invention, when considered
in connection with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a schematic diagram illustrating an example of a
semiconductor wafer processing device that includes a fluid
temperature adjusting device according to the embodiment;
[0013] FIG. 2 is a diagram of a cooling and heating device that is
included in the fluid temperature adjusting device according to the
embodiment;
[0014] FIG. 3 is a control block diagram of a controller that is
included in the fluid temperature adjusting device according to the
embodiment;
[0015] FIG. 4 is a diagram illustrating a change in the upper limit
value of an operation amount;
[0016] FIG. 5 is a diagram illustrating a change in the upper limit
value of the operation amount; and
[0017] FIG. 6 is a diagram illustrating an example of an operation
amount of a peltier module and an operation amount of a heater.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] A mode for carrying out the invention (hereinafter, referred
to as an embodiment) will be described in detail by referring to
the drawings. The invention is not limited to the content to be
described in the embodiment below. Further, configurations
described below include a configuration which may be easily
supposed by the person skilled in the art, a substantially same
configuration, and an equivalent configuration. Furthermore, the
configurations described below may be appropriately combined with
each other. Further, the configurations may be omitted, replaced,
or modified without departing from the spirit of the invention.
[0019] FIG. 1 is a schematic diagram illustrating an example of a
semiconductor wafer processing device that includes a fluid
temperature adjusting device according to the embodiment. FIG. 2 is
a diagram of a cooling and heating device that is included in the
fluid temperature adjusting device according to the embodiment. A
semiconductor wafer processing device 100 illustrated in FIG. 1 is
a device that cleans a semiconductor wafer W of silicon or the like
using a fluid L such as heated pure water in a manufacturing
process of a semiconductor device. The semiconductor wafer
processing device 100 includes a fluid temperature adjusting device
1, a control device 2, a liquid tank 3, fluid pipes 4A to 4G, a
pump 5, valves 6A to 6C, and a cleaning unit 7.
[0020] The fluid temperature adjusting device 1 is a device that
heats or cools a fluid L for cleaning the semiconductor wafer W so
as to adjust the temperature thereof. In the embodiment, the fluid
L is a liquid such as pure water, but the fluid L is not limited to
the liquid and may be a gas. Regardless of the type of the fluid L,
the fluid may be other than pure water.
[0021] Liquid temperature adjusting device A fluid temperature
control device 10 includes a controller 11, a heater driving unit
12, and a peltier driving unit 13. The controller 11 is, for
example, a microcomputer, and includes a calculation device of a
CPU (Central Processing Unit) and a storage device such as a
memory. The heater driving unit 12 and the peltier driving unit 13
are, for example, driver circuits that include a switching
element.
[0022] The controller 11 controls an operation of at least one of
the heater driving unit 12 and the peltier driving unit 13 based
on, for example, the operation amount which is input from the
control device 2 or the operator's manual operation. Further, since
the controller 11 protects a cooling and heating device 20, the
controller performs a control in which an upper limit value is set
in the operation amount. The controller 11 realizes such a control
in a manner such that the calculation device executes a command of
a computer program stored in the storage device.
[0023] At least one of the heater driving unit 12 and the peltier
driving unit 13 drives at least one of a heater 22 and a peltier
module 23 included in the cooling and heating device 20 based on
the instruction value transmitted from the controller 11. The
above-described operation amount is an index which corresponds to
the amount of the thermal energy that is exchanged between the
cooling and heating device 20 and the fluid L. The operation amount
is obtained, for example, based on the target temperature of the
fluid L by the control device 2.
[0024] In the embodiment, the controller 11 divides the total
thermal energy for keeping the fluid L at the target temperature by
heating the fluid L into the supply amount of the heater 22 and the
supply amount of the peltier module 23, and gives the thermal
energies from both the heater 22 and the peltier module 23 to the
fluid L. The supply amount of the heater 22 is a ratio of a heating
output of the heater 22 with respect to the maximum heating
capability of the heater 22, and the supply amount of the peltier
module 23 is a ratio of a heating output of the peltier module 23
with respect to the maximum heating capability of the peltier
module 23. The supply amount corresponds to a so-called operation
amount. With such a configuration, it is possible to shorten a time
until the fluid L becomes the target temperature in the fluid
temperature adjusting device 1 which includes the peltier module 23
and the heater 22. Further, when cooling the fluid L, the
controller 11 drives only the peltier module 23 so as to remove the
thermal energy from the fluid L and hence cools the fluid L.
Furthermore, not only in a case where the fluid L is kept at the
target temperature, but also, for example, in a case where the
temperature of the new fluid L is increased by heating the fluid L
when the new fluid is supplied thereto, the controller 11 may
divide the thermal energy into the supply amount of the heater 22
and the supply amount of the peltier module 23 and give the thermal
energies from both the heater 22 and the peltier module 23 to the
fluid L.
[0025] As illustrated in FIGS. 1 and 2, the cooling and heating
device 20 includes a heater 22 which heats the fluid L passing
through a fluid passageway 21 and a peltier module 23 which is a
module of a peltier element for heating or cooling the fluid L
passing through the fluid passageway 21. The peltier module 23
includes a plurality of peltier elements. The fluid passageway 21
is formed inside a body 20B. The body 20B is formed of a material
which does not easily generate impurities when contacting the fluid
L and is not easily affected by acid or alkali. As such a material,
for example, fluorine resin is known. In the embodiment, the body
20B is formed of fluorine resin. Since the fluid passageway 21 is
formed inside the body 20B, the fluid L which passes through the
fluid passageway 21 contacts the fluorine resin. Since the fluorine
resin does not easily generate impurities as described above, the
fluorine resin is particularly suitable for the case where the
cooling and heating device 20 is applied to the semiconductor
manufacturing process in which impurities need to be removed as
much as possible.
[0026] The heater 22 is attached to the inside of a heat transfer
member (a heat transfer plate) 24 provided in the fluid passageway
21. The peltier module 23 is attached on the surface of the heat
transfer member 24, and is disposed at a position away from the
fluid passageway 21 in relation to the heat transfer member 24.
That is, the cooling and heating device 20 is provided with the
heater 22 and the peltier module 23 which are disposed in an order
from the fluid passageway 21.
[0027] The fluid L which flows from a fluid inlet 211 of the fluid
passageway 21 is heated by the heater 22 and the peltier module 23
while passing through the fluid passageway 21 so as to increase in
temperature. Further, the fluid L which passes through the fluid
passageway 21 is cooled by the peltier module 23. The peltier
module 23 is used both to cool and heat the fluid L. The heater 22
is used only to heat the fluid L.
[0028] The fluid L of which the temperature is adjusted by at least
one of the heater 22 and the peltier module 23 flows out of a fluid
outlet 21E. An outlet temperature sensor 31 which measures the
temperature of the fluid L of which the temperature has been
adjusted is provided at the downstream side (at the downstream side
in the circulation direction of the fluid L) of the fluid outlet
21E. Further, the heat transfer member 24 is provided with a heat
transfer member temperature sensor 32 which measures the
temperature of the heat transfer member 24.
[0029] In the embodiment, as illustrated in FIG. 2, the outside of
the peltier module 23 is provided with a heat absorbing and
radiating device 25 which cools the peltier module 23. The heat
absorbing and radiating device 25 promotes an operation of
absorbing and radiating the heat of the peltier module 23. As
illustrated in FIG. 2, two heat transfer members 24, two peltier
modules 23, and two heat absorbing and radiating devices 25 are
disposed at each of both sides of the fluid passageway 21. That is,
the cooling and heating device 20 includes four heat transfer
members 24, four peltier modules 23, and four heat absorbing and
radiating devices 25. In the embodiment, one heat transfer member
24 includes three heaters 22.
[0030] Next, the fluid passageway 21 will be described in detail.
As illustrated in FIG. 2, the fluid passageway 21 includes a
branched passageway 21M, a plurality of heat exchange portions
21EX, and a collecting passageway 21C. The branched passageway 21M
which is introduced from the outside of the body 20B thereinto is
branched inside the body 20B, and the branched portions are
respectively connected to the plurality of (in the embodiment,
four) heat exchange portions 21EX. Further, the respective heat
exchange portions 21EX are connected to the collecting passageway
21C inside the body 20B. The respective heat exchange portions 21EX
are arranged so as to face the heat transfer member 24. In each
heat exchange portion 21EX, for example, a liquid contact member
which has high corrosion resistance and generates a small amount of
impurities is disposed in the heat transfer member 24. The
collecting passageway 21C is integrated with the inside of the body
20B, and is drawn to the outside of the body 20B. The
above-described outlet temperature sensor 31 may be provided at the
downstream side in the circulation direction of the fluid L in
relation to the heat exchange portion 21EX and may be provided at
the collecting passageway 21C.
[0031] The fluid L which flows from the fluid inlet 211 of the
fluid passageway 21 into the branched passageway 21M is introduced
from the branched passageways 21M to the respective heat exchange
portions 21EX. The fluid L inside the heat exchange portion 21EX
performs a heat exchange operation with respect to the heat
transfer member 24. The fluid L of which the temperature increases
or decreases in the heat exchange portion 21EX flows into the
collecting passageway 21C, and flows to the outside of the body 20B
from the fluid outlet 21E of the fluid passageway 21. In this way,
the cooling and heating device 20 heats or cools the fluid L.
[0032] In the embodiment, it is desirable that the heating
capabilities (the rated heating outputs) of the heater 22 and the
peltier module 23 be not extremely different from each other and it
is more desirable that the heating capabilities be equal to each
other. In the embodiment, the controller 11 gives the total energy
supplied to the fluid L while the energy is divided into the supply
amount of the heater 22 and the supply amount of the peltier module
23 when heating the fluid L so as to keep the fluid L at the target
temperature. Since the heating capabilities of the heater 22 and
the peltier module 23 are not extremely different from each other,
it is possible to easily perform a control in which the total
energy supplied to the fluid L is divided. Further, it is possible
to effectively use the heating capabilities of the heater 22 and
the peltier module 23 without any waste.
[0033] The semiconductor wafer processing device 100 illustrated in
FIG. 1 is a device which is called a sheet cleaning device that
includes a plurality of cleaning units 7 for cleaning the
semiconductor wafer W one by one. In the semiconductor wafer
processing device 100, the fluid temperature adjusting device 1
increases the temperature of the fluid L when cleaning the
semiconductor wafer W. For this reason, the fluid temperature
adjusting device 1 needs to have a function of promptly increasing
the temperature of the fluid L to the necessary temperature. Since
the fluid temperature adjusting device 1 may heat the fluid L by
using both the peltier module 23 and the heater 22, it is possible
to promptly increase the temperature of the fluid L. As a result,
in the semiconductor wafer processing device 100 which increases
the temperature of the fluid L by the fluid temperature adjusting
device 1, it is possible to shorten the time from the cleaning
start time of the semiconductor wafer W to the cleaning end time
thereof.
[0034] The fluid temperature adjusting device 1 heats the fluid L
by using both the peltier module 23 and the heater 22, but the
heater 22 may be provided in a compact size at a comparatively low
cost. For this reason, the size of the cooling and heating device
20 may be decreased, and the manufacture cost may be decreased.
Further, since the fluid temperature adjusting device 1 exhibits
the same heating capability in both the peltier module 23 and the
heater 22, there is no need to increase one-side heating
capability. For this reason, it is possible to suppress an increase
in cost caused when increasing any heating performance of the
peltier module 23 or the heater 22. Further, since the peltier
module 23 may control the heating amount or the cooling amount with
high precision, it is possible to suppress degradation in the
stability of the temperature of the fluid L in a region where the
heating amount is particularly small.
[0035] Control Device
[0036] The control device 2 is a device which controls the entire
operation of the semiconductor wafer processing device 100. The
control device 2 is, for example, a microcomputer, and includes a
calculation device of a CPU (Central Processing Unit) and a storage
device such as a memory. The control device 2 obtains the operation
amount of the cooling and heating device 20 in a manner such that
the calculation device executes a command or a computer program
stored in, for example, the storage device, and transmits the
operation amount to the controller 11 of the fluid temperature
adjusting device 1. The operation amount is defined based on, for
example, a difference between the temperature (the target
temperature) of the fluid L suitable for cleaning the semiconductor
wafer W and the temperature of the fluid L after adjusting the
temperature thereof by the cooling and heating device 20. In a case
where the control device 2 obtains the operation amount, for
example, the control device 2 obtains a difference between the
target temperature of the fluid L and the temperature of the fluid
L obtained from the outlet temperature sensor 31 provided at the
downstream side of the fluid outlet 21E of the cooling and heating
device 20, and obtains the operation amount so that the difference
becomes 0.
[0037] In addition, the control device 2 controls the operations of
the pump 5 and the valves 6A to 6C included in the semiconductor
wafer processing device 100. Further, the control device 2 controls
the temperature of the fluid L inside the liquid tank 3 based on
the temperature of the fluid L accumulated in the liquid tank 3 and
obtained from a liquid tank temperature sensor 33 provided in the
liquid tank 3.
[0038] Liquid Tank, Pipe, Pump, Valve, and Cleaning Unit
[0039] The liquid tank 3 is a device which accumulates the fluid L
for cleaning the semiconductor wafer. The liquid tank 3 and the
fluid inlet 21I of the cooling and heating device 20 are connected
to each other by the pipe 4A. The pipe 4A sends the fluid L inside
the liquid tank 3 to the cooling and heating device 20. The pipe 4B
is connected to the fluid outlet 21E of the cooling and heating
device 20. The pump 5 is provided in the course of the pipe 4B. The
pipe 4B at the discharge port side of the pump 5 is connected to
the pipe 4C. As for the pipe 4C, one side thereof is connected to
the liquid tank 3, and the other side thereof is branched to the
plurality of pipes 4D. Each pipe 4D is provided with the valve
6.
[0040] The semiconductor wafer W to be cleaned is cleaned at the
outlet side of each pipe 4D. The portion is the cleaning unit 7.
The fluid L having been used for cleaning the semiconductor wafer W
is collected in the pipe 4F through the pipe 4E. One end side of
the pipe 4F is connected to the liquid tank 3. The valve 6B is
provided at the side of the liquid tank 3 of the pipe 4F in
relation to the cleaning unit 7 closest to the liquid tank 3.
Further, the other end side of the pipe 4F is connected to the pipe
4G. The pipe 4G is provided with the valve 6C.
[0041] When the semiconductor wafer W is not cleaned, the control
device 2 drives the pump 5 in a state where all valves 6A are
closed and the fluid L is not supplied to each of the cleaning
units 7. At this time, the control device 2 controls the fluid
temperature adjusting device 1 so that the temperature of the fluid
L accumulated in the liquid tank 3 becomes a predetermined
temperature. With such a configuration, the fluid L circulates
between the fluid temperature adjusting device 1 and the liquid
tank 3, so that the temperature of the fluid L inside the liquid
tank 3 is adjusted to a predetermined temperature.
[0042] When the semiconductor wafer W is cleaned, the control
device 2 drives the pump 5 and opens the valve 6A of the cleaning
unit 7 for cleaning the semiconductor wafer W. At this time, the
control device 2 controls the fluid temperature adjusting device 1
so that the temperature of the fluid L becomes a temperature
suitable for cleaning the semiconductor wafer W. With such a
configuration, the fluid L of which the temperature is adjusted to
a temperature suitable for cleaning the semiconductor wafer W is
supplied from the fluid temperature adjusting device 1 to the
semiconductor wafer W to be cleaned.
[0043] When the fluid L having been used for the cleaning operation
may be used, the fluid L is returned to the liquid tank 3 after it
is filtrated through the pipe 4F and the valve 6B. When the amount
of impurities contained in the fluid L having been used for the
cleaning operation increases, the control device 2 closes the valve
6B and opens the valve 6C so that the fluid L is discharged to the
outside of the semiconductor wafer processing device 100. Next, a
control of controlling the temperature of the fluid L using the
fluid temperature adjusting device 1 will be described.
[0044] Fluid Temperature Control
[0045] FIG. 3 is a control block diagram of the controller included
in the fluid temperature adjusting device according to the
embodiment. FIGS. 4 and 5 are diagrams illustrating a change in the
upper limit value of the operation amount. FIG. 6 is a diagram
illustrating an example of the operation amount of the peltier
module and the operation amount of the heater.
[0046] When the fluid temperature adjusting device 1 illustrated in
FIG. 1 adjusts the temperature of the fluid L to a temperature
suitable of cleaning the semiconductor wafer W, the controller 11
receives an input of an operation amount MV illustrated in a
control block B1. As the operation amount MV, it is possible to
use, for example, an operation amount of a PID control using the
control device 2 illustrated in FIG. 1, that is, an operation
amount which is defined based on a difference between the target
temperature of the fluid L suitable for cleaning the semiconductor
wafer W and the temperature of the fluid L of which the temperature
is adjusted by the cooling and heating device 20. Further, the
operation amount MV may be an operation amount (an external
operation amount input) which is input from the outside to the
controller 11 through a communication line and the like.
[0047] When the seal portion of the cooling and heating device 20
is overheated, there is a concern that the durability of the seal
portion may be degraded and the sealing performance may be
degraded. For this reason, a limit value (a seal portion protection
upper limit value) is defined from the temperature of the seal
portion. The seal portion protection upper limit value is provided
so as to protect the seal portion of the cooling and heating device
20 illustrated in FIGS. 1 and 2 from overheating. The seal portion
of the cooling and heating device 20 is a portion which is
necessary to realize the seal function, and is, for example, an
O-ring, a backup ring, an adhesive, or a liquid contact member
which is interposed between the heat transfer member 24 and the
fluid passageway 21 illustrated in FIGS. 1 and 2. In general, since
it is difficult to measure the temperature of the seal portion, the
temperature may be estimated from the temperature of the heat
transfer member 24.
[0048] In the embodiment, the controller 11 sets a seal portion
protection upper limit value MVsl illustrated in FIG. 4 based on a
heat transfer member temperature PV3. The controller 11 compares
the set seal portion protection upper limit value MVsl with the
output (operation amount) MV of the control block B1, and sets the
small one as an output MVs. Accordingly, the output MVs of a
control block B2 becomes a small one of the outputs MV and MVsl of
the control block B1.
[0049] As illustrated in FIG. 4, the seal portion protection upper
limit value MVsl changes from -1 to 1. Further, the seal portion
protection upper limit value MVsl changes based on the temperature
(heat transfer member temperature) PV3 of the heat transfer member
24. The heat transfer member temperature PV3 is measured by the
heat transfer member temperature sensor 32 which is provided in the
heat transfer member 24.
[0050] In the embodiment, the seal portion protection upper limit
value MVsl is 1 until the heat transfer member temperature PV3 is a
predetermined temperature T4. At this time, the output MVs of the
control block B2 becomes MVs=MV. When the heat transfer member
temperature PV3 becomes higher than the temperature T4, the seal
portion protection upper limit value MVsl decreases with an
increase in the heat transfer member temperature PV3. The output
MVs of the control block B2 becomes a small one of MVsl and MV. In
a region where the heat transfer member temperature PV3 is equal to
or higher than T4, the output MVs of the control block B2 becomes
smaller than the operation amount MV as a result in which the upper
limit value is set in the operation amount MV.
[0051] In a region where the heat transfer member temperature PV3
is equal to or higher than T4, the seal portion protection upper
limit value MVsl linearly and continuously decreases according to a
linear function with an increase in the heat transfer member
temperature PV3. In this example, when the heat transfer member
temperature PV3 is equal to T5 (>T4), the seal portion
protection upper limit value MVsl is 0. That is, since the output
MVs of the control block B2 becomes 0, the operation amount MV of
the heater 22 and the peltier module 23 becomes 0.
[0052] When the heat transfer member temperature PV3 becomes higher
than T5, the seal portion protection upper limit value MVsl
linearly and continuously decreases according to a linear function
with an increase in the heat transfer member temperature PV3, and
hence becomes a negative value. When the seal portion protection
upper limit value MVsl becomes a negative value, the output MVs of
the control block B2 becomes a negative value. This means that the
cooling and heating device 20 is cooled. The controller 11 performs
a control so that the peltier module 23 is cooled based on the
output MVs. When the heat transfer member temperature PV3 becomes
T6, the seal portion protection upper limit value MVsl becomes -1,
that is, the negative maximum value. At this time, the peltier
module 23 exhibits the maximum cooling capability. Further, when
the temperature of the seal portion increases due to a disturbance
or the like, the seal portion is promptly cooled by driving the
peltier module 23 in the cooling direction, so that the seal
portion may be protected.
[0053] As described above, the seal portion protection upper limit
value is provided so as to protect the seal portion of the cooling
and heating device 20. In order to protect the seal portion, it is
desirable to directly measure the temperature of the seal portion.
However, since it is difficult to attach the thermometer, it is
difficult to directly measure the temperature of the seal portion.
For this reason, in the embodiment, the seal portion protection
upper limit value is set based on the heat transfer member
temperature PV3 which is highly involved with the temperature of
the seal portion.
[0054] In this way, since it is possible to more accurately detect
the temperature of the seal portion by using the heat transfer
member temperature PV3 which is highly involved with the
temperature of the seal portion, it is possible to more reliably
protect the seal portion. Further, since it is possible to more
reliably detect the temperature of the seal portion, it is possible
to maximally exhibit the capability of the cooling and heating
device 20 by increasing the seal portion protection upper limit
value when there is an allowance in the temperature of the seal
portion. Further, the heat may not be easily transferred depending
on the type of the fluid L (for example, sulfate or ethylene
glycol). When heating the fluid L to which the heat is not easily
transmitted, the heat transfer member temperature PV3 may high even
when the outlet temperature PV1 is low. In the embodiment, since
the seal portion protection upper limit value based on the heat
transfer member temperature PV3 is used in addition to the module
protection upper limit value based on the outlet temperature PV1,
it is possible to more reliably protect the seal portion even when
heating the fluid L to which the heat is not easily transmitted.
That is, in the embodiment, it is possible to reliably protect the
seal portion even when heating a plurality of types of fluids L
having different heat transfer degrees.
[0055] When the output MVs in which the seal portion protection
upper limit value is set in the operation amount MV may be
obtained, in the control block B3, the controller 11 sets an upper
limit value (module protection upper limit value) MVjl of the
thermal energy supplied to the fluid L based on the temperature
(the outlet temperature) PV1 of the fluid L which is adjusted by
the heat transfer member 24 of the cooling and heating device 20
illustrated in FIGS. 1 and 2.
[0056] The junction temperature of the peltier module 23 may be
overheated even when adopting the seal portion protection upper
limit value depending on the temperature or the flow rate of the
fluid L. For this reason, in the embodiment, the module protection
upper limit value (the limit value) is defined by measuring the
temperature of the junction. The junction indicates the bonding
portion between the peltier element and the electrode. The
controller 11 which receives the input of the operation amount MV
sets the upper limit value (the module protection upper limit
value) MVjl of the thermal energy supplied to the fluid L so as to
protect the junction of the peltier module 23 illustrated in FIGS.
1 and 2 in the control block B3. In the embodiment, the controller
11 sets the module protection upper limit value MVjl based on the
relation between the temperature (the outlet temperature) PV1 of
the fluid L and the module protection upper limit value MVjl
illustrated in FIG. 5. Then, the controller 11 compares the set
module protection upper limit value MVjl with the output MVs of the
control block B2 and sets the small one as the output MVj.
Accordingly, the output MVj of the control block B3 becomes the
small one between the module protection upper limit value MVjl and
the output MVs of the control block B2.
[0057] As illustrated in FIG. 5, the module protection upper limit
value MVjl changes from 0 to 1. Further, the module protection
upper limit value MVjl changes based on the temperature (the outlet
temperature) PV1 of the fluid L of which the temperature is
adjusted by the cooling and heating device 20. Accordingly, the
module protection upper limit value also changes based on the
outlet temperature PV1 (after the heating in the heating) after the
adjustment of the temperature by the cooling and heating device 20.
The outlet temperature PV1 is measured by the outlet temperature
sensor 31 which is provided at the downstream side of the fluid
outlet 21E of the cooling and heating device 20. The reason why the
outlet temperature PV1 is used is generally because it is difficult
to directly measure the temperature of the junction. Accordingly,
the temperature of the junction is estimated from the outlet
temperature PV1.
[0058] In the embodiment, the module protection upper limit value
MVjl is 1 until the outlet temperature PV1 is a predetermined
temperature T1. At this time, the output MVj of the control block
B3 becomes MVj=MVs. Until the outlet temperature PV1 becomes higher
than the temperature T1 and becomes the temperature T2, the outlet
temperature PV1 increases and the module protection upper limit
value MVjl decreases. As the output MVj of the control block B3, a
small one is selected from the operation amount MVs and the module
protection upper limit value MVjl in a region where the outlet
temperature PV1 is equal to or higher than T1.
[0059] In a region where the outlet temperature PV1 is equal to or
higher than T1, the module protection upper limit value MVjl
linearly and continuously decreases according to a linear function
with an increase in the outlet temperature PV1. In this example,
the module protection upper limit value MVjl is 0.15 when the
outlet temperature PV1=T2 (>T1). When the outlet temperature PV1
becomes higher than T2, the module protection upper limit value
MVjl rapidly decreases compared to the case where the outlet
temperature PV1 does not become higher than T2, and becomes 0 when
the outlet temperature PV1=T3 (>T3). Here, the limitation value
(the module protection upper limit value MVjl) linearly decreases,
but since the limitation value is provided for the purpose of
limiting the junction temperature at a predetermined temperature or
less, the limitation value may partially increase or decrease the
module protection upper limit value MVjl according to the allowance
degree of the junction temperature (the same applies to the
following description).
[0060] The junction temperature is set to a predetermined
temperature or less so as to protect the peltier module 23. In
order to protect the junction, it is desirable to directly measure
the temperature of the junction. However, it is difficult to
directly measure the temperature of the junction due to the
difficulty in the attachment of the thermometer and the influence
of the heater 22. Here, the junction is largely influenced by the
heater 22, but the limitation value (the module protection upper
limit value) for protecting the peltier module 23 is defined from
the outlet temperature PV1 which is involved with the junction
temperature to some extent. Since a constant relation is
established between the operation amount of the peltier module 23
and the operation amount of the heater 22, the limitation value,
that is, the module protection upper limit value of the operation
amount of the peltier module 23 in consideration of the influence
of the temperature of the heater 22 may be defined.
[0061] In this way, since it is possible to more accurately detect
the temperature of the junction by using the outlet temperature PV1
which is highly involved with the temperature of the junction, it
is possible to more reliably protect the junction. Further, since
it is possible to more accurately detect the temperature of the
junction, when there is an allowance in the temperature of the
junction, the module protection upper limit value is increased so
as to exhibit the capability of the peltier module 23 as much as
possible.
[0062] When the heat generation amount of the peltier module 23
increases due to the use for the heating, the temperature of the
junction also increases. In the embodiment, the module protection
upper limit value MVjl decreases with an increase in the outlet
temperature PV1. That is, the output MVj of the control block B3
decreases with an increase in the outlet temperature PV1. Since the
outlet temperature PV1 increases with an increase in the heat
generation amount of the peltier module 23, it is possible to more
reliably protect the junction by decreasing the module protection
upper limit value with an increase in the outlet temperature PV1 as
described above.
[0063] In this way, in the embodiment, the smallest value of the
operation amount MV, the seal portion protection upper limit value
MVsl, and the module protection upper limit value MVjl is set as
the operation amount MVj of the heater 22 and the peltier module
23. In the above-described example, the seal portion protection
upper limit value MVsl and the module protection upper limit value
MVjl are set in this order, but the order of obtaining these values
may be reversed.
[0064] In the embodiment, the controller 11 feed-backs the output
of the control block B3, that is, the operation amount MVj to the
PID control using the control device 2 in the control block B1. In
this way, since the operation amount MVj with the set upper limit
value is fed-back to the PID control, the unnecessary integration
in the PID control is stopped, thereby suppressing the overshoot or
the undershoot.
[0065] When the process of setting the upper limit value in the
operation amount MV (the processes of the control blocks B2 and B3)
ends, in the control block B4, the controller 11 divides the
operation amount MV with the set upper limit value in the control
block B2 and the control block B3, that is, the operation amount
MVj (hereinafter, referred to as MVc) as the output of the control
block B3 into an operation amount (heater operation amount) MVh of
the heater 22 and an operation amount (module operation amount) MVm
of the peltier module 23 (the division of the operation amount).
The operation amount MVj as the output of the control block B3
corresponds to the thermal energy for heating the fluid L. Since
the operation amount is divided, particularly when heating the
fluid L so as to be kept at the target temperature, the thermal
energy may be given from both the heater 22 and the peltier module
23 to the fluid L. As a result, it is possible to shorten a time
until the temperature of the fluid L becomes the target temperature
by effectively using both heating capabilities.
[0066] In the division of the operation amount, a module operation
amount dividing coefficient MVmk illustrated in FIG. 6 is used.
Before dividing the operation amount, the maximum and minimum
operation amounts of the fluid temperature adjusting device 1 are
expressed by .+-.1. Further, after dividing the operation amount,
the maximum and minimum operation amounts of the peltier module 23
are expressed by .+-.1. The maximum operation amount of the heater
is expressed by +1. The module operation amount dividing
coefficient MVmk is a coefficient which corresponds to the module
operation amount MVm (corresponding to the supply amount of the
peltier module 23 in the thermal energy for heating the fluid L) in
the output MVc. The module operation amount dividing coefficient
MVmk is equal to or larger than 0 and equal to or smaller than
1.
[0067] When the range of the output MVc is from 0 to 1, the ranges
of the module operation amount MVm and the heater operation amount
MVh are also from 0 to 1. When the module operation amount dividing
coefficient MVmk is used, the module operation amount MVm becomes
2.times.MVc.times.MVmk (here, 0.ltoreq.MVm.ltoreq.1). Further, in
the output MVc, the heater operation amount MVh (corresponding to
the supply amount of the heater 22 in the thermal energy for
heating the fluid L) becomes 2.times.MVc.times.(1-MVmk) (here,
0.ltoreq.MVc.ltoreq.1).
[0068] Here, the module operation amount dividing coefficient MVmk
is equal to or larger than 1-1/(2.times.MVc) and equal to or
smaller than 1/(2.times.MVc) and is equal to or larger than 0 and
equal to or smaller than 1. The dashed line illustrated in FIG. 6
indicates the upper and lower limits of the module operation amount
dividing coefficient MVmk. Furthermore, the range of the
above-described module operation amount dividing coefficient MVmk
corresponds to the case where the rated heating output of the
peltier module 23 and the rated heating output of the heater 22 are
equal to each other. When both outputs are different from each
other, there is a need to consider the ratio between the respective
heating capabilities.
[0069] When the module operation amount dividing coefficient MVmk
is set to the range from 1-1/(2.times.MVc) to 1/(2.times.MVc) and
from 0 to 1, the module operation amount MVm and the heater
operation amount MVh may be set to the range from 0 to 1. When the
module operation amount dividing coefficient MVmk becomes constant
with respect to a change in the output MVc, the ratio between the
module operation amount MVm and the heater operation amount MVh is
also constant with respect to a change in the output MVc. That is,
in the thermal energy for heating the fluid L, the ratio between
the supply amount of the heater 22 and the supply amount of the
peltier module 23 does not change by the magnitude of the thermal
energy supplied to the fluid L.
[0070] In the embodiment, the controller 11 changes the ratio
between the supply amount of the heater 22 and the supply amount of
the peltier module 23 in the total thermal energy for heating the
fluid L based on the magnitude of the thermal energy supplied to
the fluid L. For this reason, the ratio between the module
operation amount MVm and the heater operation amount MVh is changed
with respect to a change in the output MVc by changing the module
operation amount dividing coefficient MVmk with respect to a change
in the output MVc. As a result, the ratio between the supply amount
of the heater 22 and the supply amount of the peltier module 23 of
the thermal energy for heating the fluid L changes with a change in
the magnitude of the thermal energy supplied to the fluid L. The
above-described ratio is a ratio between the heater 22 and the
peltier module 23 with respect to the thermal energy supplied to
heat the fluid L.
[0071] In the embodiment, the module operation amount MVm and the
heater operation amount MVh are divided by setting the module
operation amount dividing coefficient MVmk in consideration of the
following points (1) to (5).
[0072] (1) While the output MVc changes from 0 to 1, the module
operation amount MVm and the heater operation amount MVh are also
monotonously increased in the above-described range so that a
monotonous increase in the total thermal energy given to the fluid
L is kept. In a region where the total thermal energy given to the
fluid L decreases, the total thermal energy given to the fluid L
may decrease regardless of an increase in the output MVc (the
operation amount). As a result, there is a concern that hunting in
the temperature of the fluid L may occur. With the above-described
configuration, it is possible to reduce a concern that hunting in
the temperature of the fluid L may occur by monotonously increasing
the total thermal energy given to the fluid L.
[0073] (2) The module operation amount MVm is smoothly changed.
With such a configuration, it is possible to prevent an excessive
change in the temperature of the junction of the peltier module 23.
As a result, when a change in the output MVc (the operation amount)
is small, an abrupt change in the temperature of the peltier module
23, and particularly, the temperature of the junction may be
suppressed, and hence degradation in the durability of the peltier
module 23 may be suppressed.
[0074] (3) When the total thermal energy given to the fluid L is
smaller than a predetermined value, in the total thermal energy for
heating the fluid L, the supply amount of the peltier module 23 is
made to be larger than the supply amount of the heater 22.
Specifically, in a region where the output MVc (the operation
amount) is smaller than a predetermined value (for example, a
region where the output MVc is smaller than 0.5 to 0.6), the module
operation amount MVm is made to be larger than the heater operation
amount MVh.
[0075] When the peltier module 23 is used for heating, the heating
efficiency becomes higher than that of the heater 22 due to the
peltier effect. For this reason, when the module operation amount
MVm is made to be larger than the heater operation amount MVh, the
heating efficiency of the fluid L is improved. As a result, the
power consumption may be suppressed. Particularly, in a region
where the output MVc (the operation amount) is small, a difference
in the heating efficiency increases. Accordingly, in such a region,
it is desirable to heat the fluid L only by the peltier module
23.
[0076] Furthermore, when a switching power supply is used as the
power supply of the peltier module 23, the efficiency is degraded
in a region where the load with respect to the power supply is
small. For this reason, the efficiency of the switching power
supply is degraded in a region where the output MVc (the operation
amount) is extremely small (for example, the module operation
amount MVm is 0.2 or less). In the embodiment, the fluid L is
heated only by the peltier module 23 in a region where the output
MVc (the operation amount) is extremely small. With such a
configuration, since the amount of heating the fluid L by the
heater 22 is obtained from the peltier module 23, the load of the
switching power supply increases by the amount, the region where
the efficiency of the switching power supply is low may not be used
as much as possible. In the embodiment, for example, when the
output MVc (the operation amount) is 0.1 or less (the module
operation amount MVm corresponds to 0.2 or less), the use of the
region where the efficiency of the switching power supply is low
may be suppressed only by the heating of the peltier module 23.
[0077] Further, since the module operation amount MVm is made to be
larger than the heater operation amount MVh, the control when
heating the fluid L may be improved. For example, when the heater
22 is controlled by a power control method such as a cycle control
in which the output changes step-wisely, the output resolution of
the peltier module 23 is smaller than that of the heater 22, and it
is possible to effectively suppress degradation in the control
precision of the temperature of the fluid L due to the heating of
the heater 22 having a low output resolution.
[0078] (4) When the total thermal energy given to the fluid L
becomes a predetermined value or more, in the total thermal energy
for heating the fluid L, the supply amount of the heater 22 is made
to be larger than the supply amount of the peltier module 23.
Specifically, in a region where the output MVc (the operation
amount) is a predetermined value or more (for example, a region
where the output MVc is 0.5 to 0.6 or more), the heater operation
amount MVh is made to be larger than the module operation amount
MVm. As a result, according to an increase in the total thermal
energy supplied to the fluid L, a state where the thermal energy
supplied from the peltier module 23 to the fluid L is larger than
the thermal energy supplied from the heater 22 to the fluid L
changes to a state where the thermal energy supplied from the
heater 22 to the fluid L is larger than the thermal energy supplied
from the peltier module 23 to the fluid L. That is, the maximum
heating capability of the heater 22 becomes larger than the maximum
heating capability of the peltier module 23 with an increase in the
total thermal energy supplied to the fluid L. In this way, in the
embodiment, the small and large degrees of the thermal energy
supplied from the heater 22 to the fluid L and the thermal energy
supplied from the peltier module 23 to the fluid L are switched.
That is, the small and large degrees of the operation amount of the
heater 22 and the operation amount of the peltier module 23 are
switched.
[0079] With such a configuration, in a region where the output MVc
(the operation amount) is a predetermined value or more, the load
on the peltier module 23 may be reduced by further sharing the
energy using the heater 22 in the total thermal energy supplied to
the fluid L. As a result, it is possible to effectively suppress
degradation in the durability of the peltier module 23, and more
specifically, the junction by suppressing an increase in the
temperature of the junction of the peltier module 23.
[0080] (5) The module operation amount dividing coefficient MVmk is
continuously changed. With such a configuration, the module
operation amount MVm and the heater operation amount MVh may be
continuously changed. Then, even when the module operation amount
MVm and the heater operation amount MVh change, the thermal energy
supplied from the peltier module 23 to the fluid L and the thermal
energy supplied from the heater 22 to the fluid L smoothly change.
As a result, since an abrupt change in the temperature of the fluid
L is suppressed even when the module operation amount MVm and the
heater operation amount MVh are changed, it is possible to decrease
an influence on the quality of the semiconductor wafer W which is
cleaned by the fluid L.
[0081] FIG. 6 illustrates an example in which the module operation
amount dividing coefficient MVmk is set according to (1) to (4).
For example, in a region where the output MVc (the operation
amount) is about 0.1, the module operation amount MVm is larger
than 0, and the heater operation amount MVh becomes 0. For this
reason, the fluid L is heated only by the peltier module 23. In a
region where the output MVc (the operation amount) is from about
0.1 to 0.8, the module operation amount dividing coefficient MVmk
monotonously decreases. In this region, the module operation amount
MVm and the heater operation amount MVh both become larger than 0.
For this reason, the fluid L is heated by both the heater 22 and
the peltier module 23.
[0082] When the output MVc (the operation amount) is about 0.53,
the module operation amount dividing coefficient MVmk becomes 0.5.
At this time, the module operation amount MVm and the heater
operation amount MVh both become 0.5. For this reason, the fluid L
is heated by both the heater 22 and the peltier module 23, and the
thermal energies given to the fluid L therefrom become equal to
each other.
[0083] When the output MVc (the operation amount) becomes larger
than about 0.8, the module operation amount dividing coefficient
MVmk monotonously increases and becomes 0.5 when the output MVc
(the operation amount) is 1. In this region, the module operation
amount MVm and the heater operation amount MVh monotonously
increase, but the increase rate of the heater operation amount MVh
becomes smaller in a region where MVmk is smaller than 0.8. At
MVc=1, the heater 22 and the peltier module 23 both give the
thermal energy to the fluid L at the maximum output so as to heat
the fluid L when the module operation amount dividing coefficient
MVmk=0.5.
[0084] Furthermore, when the thermal energy supplied to the fluid L
changes, the controller 11 may change the respectively supplied
thermal energies while keeping the ratio between the ratio (the
operation amount) of the heating output with respect to the maximum
heating capability of the peltier module 23 and the ratio (the
operation amount) of the heating output with respect to the maximum
heating capability of the heater 22. With such a configuration, a
relation of MVm=MVh=MVc is established as illustrated in FIG.
6.
[0085] In this way, when the module operation amount dividing
coefficient MVmk is set, the controller 11 may switch the operation
amount of the peltier module 23 and the operation amount of the
heater 22, and may control the cooling and heating device 20 so
that a state where the thermal energy supplied from the peltier
module 23 to the fluid L is larger than the thermal energy supplied
from the heater 22 to the fluid L becomes a state where the thermal
energy supplied from the heater 22 to the fluid L is larger than
the thermal energy supplied from the peltier module 23 to the fluid
L with an increase in the total thermal energy supplied to the
fluid L. As a result, it is possible to effectively obtain an
effect that the control is improved and an increase in the
temperature of the junction of the peltier module 23 is suppressed.
Further, since the controller 11 adjusts the temperature of the
fluid L to the target temperature when the operation amount in the
control block B1 is defined, the operation may be easily performed.
As a result, the fluid temperature adjusting device 1 does not
easily cause a problem due to an erroneous operation, and there is
an extremely low possibility that the cleaning failure of the
semiconductor wafer W may occur. The description above corresponds
to a case where the heating capabilities of the peltier module 23
and the heater 22 are equal to each other. When the heating
capabilities of the peltier module 23 and the heater 22 are
different from each other, the ratio between each supply heating
capability with respect to each maximum heating capability may be
used.
[0086] The controller 11 sets the module operation amount MVm and
the heater operation amount MVh by dividing the output MVc into the
operation amounts based on the module operation amount dividing
coefficient MVmk. Subsequently, the controller 11 performs a cycle
control or a duty control of the power supplied to the heater 22
based on the heater operation amount MVh. It is possible to easily
control the heating amount of the heater 22 by performing a cycle
control or a duty control on the power supplied to the heater
22.
[0087] The cycle control is a method of controlling the power
supplied to the heater 22 by turning on or off an AC power supply
by the unit of a half wave or a cycle of the AC power supply. The
duty control is a method of controlling the power supplied to the
heater 22 by changing the time in which the AC power supply is
turned on for a predetermined time (for example, one second). Since
the cycle control or the duty control may control the power
supplied to the heater 22 with high precision compared to the
simple ON and OFF control, the heating amount of the heater 22 may
be controlled with high precision.
[0088] According to the invention, it is possible to shorten a time
until a temperature of a fluid becomes a target temperature in a
fluid temperature adjusting device including a peltier module and a
heater.
[0089] Although the invention has been described with respect to
specific embodiments for a complete and clear disclosure, the
appended claims are not to be thus limited but are to be construed
as embodying all modifications and alternative constructions that
may occur to one skilled in the art that fairly fall within the
basic teaching herein set forth.
* * * * *