U.S. patent application number 13/329234 was filed with the patent office on 2013-06-06 for cooling system for electronic device.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is YAO-TING CHANG. Invention is credited to YAO-TING CHANG.
Application Number | 20130140002 13/329234 |
Document ID | / |
Family ID | 48523172 |
Filed Date | 2013-06-06 |
United States Patent
Application |
20130140002 |
Kind Code |
A1 |
CHANG; YAO-TING |
June 6, 2013 |
COOLING SYSTEM FOR ELECTRONIC DEVICE
Abstract
A cooling system for cooling an electronic device includes a
heat exchanger, a first refrigerant pipe, a pump, a second
refrigerant pipe, and a cooling apparatus. The heat exchanger, the
first refrigerant pipe, the pump, and the second refrigerant pipe
are connected in that order to form a first circulation system. The
cooling apparatus is connected between the pump and the second
refrigerant pipe. The cooling apparatus is exposed outside the
electronic device. When the temperature outside the electronic
device is higher than the temperature in the electronic device, the
first circulation system cools the electronic device. When the
temperature outside the electronic device is lower than the
temperature in the electronic device, the refrigerant flows through
the cooling apparatus to be cooled.
Inventors: |
CHANG; YAO-TING; (Tu-Cheng,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CHANG; YAO-TING |
Tu-Cheng |
|
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
48523172 |
Appl. No.: |
13/329234 |
Filed: |
December 17, 2011 |
Current U.S.
Class: |
165/104.11 |
Current CPC
Class: |
H05K 7/20836 20130101;
H05K 7/1497 20130101 |
Class at
Publication: |
165/104.11 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 6, 2011 |
TW |
100144774 |
Claims
1. A cooling system for an electronic device, comprising: a heat
exchanger arranged in the electronic device for cooling the
electronic device; a first refrigerant pipe; a pump; a second
refrigerant pipe, wherein the first and second refrigerant pipes
receive refrigerants, which can circulate in the heat exchanger; a
first valve; a second valve; and a cooling apparatus located
outside the electronic device; wherein the heat exchanger, the
first refrigerant pipe, the pump, the first valve, and the second
refrigerant pipe are connected in that order to form a first
circulation system and circulate refrigerants; the heat exchanger,
the first refrigerant pipe, the pump, the second valve, the cooling
apparatus, and the second refrigerant pipe are connected in that
order to form a second circulation system and circulate
refrigerants; and wherein when the first valve is opened and the
second valve is closed, the refrigerant is circulated in the first
circulation system, to dissipate heat for the electronic device,
when the first valve is closed and the second valve is opened, the
refrigerant is circulated in the second circulation system, the
refrigerant flows through the cooling apparatus and is cooled by
the cooling apparatus.
2. The cooling system of claim 1, wherein the cooling apparatus
comprises a metal pipe in a snake-like pattern.
3. The cooling system of claim 1, wherein the heat exchanger is an
air conditioner.
4. A cooling system for an electronic device, comprising: a heat
exchanger arranged in the electronic device for cooling the
electronic device; a first refrigerant pipe; a pump; a second
refrigerant pipe, wherein the first and second refrigerant pipes
receive refrigerants, which can circulate in the heat exchanger,
the heat exchanger, the first refrigerant pipe, the pump, and the
second refrigerant pipe are connected in that order to form a first
circulation system and circulate refrigerants; and a cooling
apparatus connected between the pump and the second refrigerant
pipe and located outside the electronic device; Wherein when the
temperature outside the electronic device is higher than the
temperature in the electronic device, the first circulation system
cools the electronic device, when the temperature outside the
electronic device is lower than the temperature in the electronic
device, the refrigerant flows through the cooling apparatus to be
cooled.
5. The cooling system of claim 4, wherein the cooling apparatus
comprises a metal pipe in a snake-like pattern.
6. The cooling system of claim 4, wherein the heat exchanger is an
air conditioner.
7. The cooling system of claim 4, wherein a switch apparatus is
connected to the pump, the switch apparatus is operated to control
the refrigerant to flow through the cooling apparatus.
8. The cooling system of claim 7, wherein the switch apparatus
comprises a first valve and a second valve, the first valve is
connected between the pump and the second refrigerant pipe, the
second valve is connected between the pump and the cooling
apparatus.
9. The cooling system of claim 8, wherein when the first valve is
opened and the second valve is closed, the refrigerant is
circulated in the first circulation system, to dissipate heat for
the electronic device, when the first valve is closed and the
second valve is opened, the refrigerant flows through the cooling
apparatus and is cooled by the cooling apparatus.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to cooling systems, and
particularly, to a cooling system for an electronic device.
[0003] 2. Description of Related Art
[0004] With increasing heavy use of on-line applications, the need
for computer data centers has increased rapidly. Data centers are
centralized computing facilities that include many servers, often
arranged on server racks or shelves, and one rack or shelf with
several servers can be considered a server system. During
operation, server systems generate a lot of heat in the data
centers, and a common method for dissipating the heat is to use a
lot of air conditioners, which use a lot of energy, leading to
energy waste.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the present embodiments can be better
understood with reference to the following drawing. The components
in the drawing are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawing, like reference
numerals designate corresponding parts throughout the several
views.
[0006] FIG. 1 is an assembled, isometric view of a cooling system
of an electronic device, according to an exemplary embodiment.
[0007] FIG. 2 is a schematic block diagram of the cooling system of
FIG. 1.
DETAILED DESCRIPTION
[0008] The disclosure, including the accompanying drawing, is
illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0009] Referring to the FIG. 1 and FIG. 2, an embodiment of a
cooling system is provided for cooling an electronic device 100.
The cooling system includes a heat exchanger 10, a first
refrigerant pipe 20, a pump 30, a second refrigerant pipe 40, a
first valve 50, a second valve 60, and a cooling apparatus 70. The
first and second refrigerant pipes 20 and 40 receive refrigerants,
which can circulate in the heat exchanger 10.
[0010] The heat exchanger 10, the first refrigerant pipe 20, the
pump 30, the first valve 50, and the second refrigerant pipe 40 are
connected in that order to form a first circulation system and
circulate refrigerants. The heat exchanger 10, the first
refrigerant pipe 20, the pump 30, the second valve 60, the cooling
apparatus 70, and the second refrigerant pipe 40 are connected in
that order to form a second circulation system and circulate
refrigerants.
[0011] The electronic device 100 may be a container data center,
which can generate a lot of heat.
[0012] The heat exchanger 10 is arranged in the electronic device
100 for cooling the electronic device 100. The heat exchanger 10
may be an air conditioner.
[0013] The first refrigerant pipe 20 and the second refrigerant
pipe 40 are respectively connected to opposite ends of the heat
exchanger 10, for transferring the refrigerants.
[0014] A first end of the pump 30 is connected to the first
refrigerant pipe 20. The first valve 50 and the second valve 60 are
connected to a second end of the pump 30. In this embodiment, the
pump 30 transfers the refrigerants from the first refrigerant pipe
20 to the second refrigerant pipe 40. In another embodiment, the
pump 30 can be directly connected to the second refrigerant pipe
40.
[0015] The cooling apparatus 70 is located on a top of the
electronic device 100 or other positions outside the electronic
device 100. The cooling apparatus 70 includes a metal pipe in a
snake-like pattern.
[0016] When the electronic device 100 operates, if the temperature
outside is higher than the temperature inside, the first valve 50
is opened and the second valve 60 is closed. The refrigerant is
circulated in the first circulation system, to dissipate heat for
the electronic device 100. If the temperature outside is lower than
the temperature inside, the first valve 50 is closed and the second
valve 60 is opened. The refrigerant is circulated in the second
circulation system. The refrigerant can be cooled by the cooling
apparatus 70, which can drop the temperature of the refrigerant, to
reduce refrigerating output of the heat exchanger 10.
[0017] Obviously, functioning as switch apparatuses, the first
valve 50 and the second valve 60 can be replaced by a three-port
valve.
[0018] Even though numerous characteristics and advantages of the
embodiments have been set forth in the foregoing description,
together with details of the structure and function of the
embodiments, the disclosure is illustrative only, and changes may
be made in detail, especially in the matters of shape, size, and
arrangement of parts within the principles of the present
disclosure to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
* * * * *