U.S. patent application number 13/704529 was filed with the patent office on 2013-05-30 for temperature adjusting device, and imprinting device using same.
The applicant listed for this patent is Hirosuke Kawaguchi, Satoru Tanaka. Invention is credited to Hirosuke Kawaguchi, Satoru Tanaka.
Application Number | 20130136817 13/704529 |
Document ID | / |
Family ID | 46506938 |
Filed Date | 2013-05-30 |
United States Patent
Application |
20130136817 |
Kind Code |
A1 |
Kawaguchi; Hirosuke ; et
al. |
May 30, 2013 |
TEMPERATURE ADJUSTING DEVICE, AND IMPRINTING DEVICE USING SAME
Abstract
A temperature adjusting device that can heat and cool an object
like a mold or a molding target uniformly and quickly, and an
imprinting device using the same are provided. The temperature
adjusting device is for adjusting a temperature of the object like
a mold 100 or a molding target 200, and includes fluid supplying
means 1 for supplying a fluid at a predetermined temperature from a
plurality of supply openings 11, holding means 2 including a
holding face 21 that holds the object, and a fluid receiving face
22 that receives the fluid supplied from the supply openings 11, a
temperature adjusting housing 3 that constructs, together with the
holding means 2, a temperature adjusting chamber 31 which retains
thereinside the supply openings 11, and a discharging channel 4
that discharges the fluid in the temperature adjusting chamber
31.
Inventors: |
Kawaguchi; Hirosuke;
(Kanagawa, JP) ; Tanaka; Satoru; (Tokyo,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kawaguchi; Hirosuke
Tanaka; Satoru |
Kanagawa
Tokyo |
|
JP
JP |
|
|
Family ID: |
46506938 |
Appl. No.: |
13/704529 |
Filed: |
July 20, 2011 |
PCT Filed: |
July 20, 2011 |
PCT NO: |
PCT/JP2011/066500 |
371 Date: |
December 14, 2012 |
Current U.S.
Class: |
425/385 ;
165/104.28 |
Current CPC
Class: |
B82Y 40/00 20130101;
H01L 21/67109 20130101; B29C 33/424 20130101; B29C 33/04 20130101;
B82Y 10/00 20130101; G03F 7/0002 20130101; F28D 1/06 20130101 |
Class at
Publication: |
425/385 ;
165/104.28 |
International
Class: |
F28D 1/06 20060101
F28D001/06 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 10, 2011 |
JP |
2011-002613 |
Claims
1. A temperature adjusting device for adjusting a temperature of an
object, the device comprising: fluid supplying means for supplying
a fluid at a predetermined temperature from a plurality of supply
openings; holding means, the holding means comprising: a holding
face that holds the object; and a fluid receiving face that
receives the fluid supplied from the supply openings; a temperature
adjusting housing that constructs, together with the holding means,
a temperature adjusting chamber which retains thereinside the
supply openings; and a discharging channel that discharges the
fluid in the temperature adjusting chamber.
2. The temperature adjusting device according to claim 1, wherein
the fluid receiving face comprises a plurality of concavities or
convexities arranged in accordance with respective positions of the
supply openings.
3. The temperature adjusting device according to claim 1, wherein
the fluid supplying means comprises: a first heating tank and a
second heating tank that heat the fluid to a predetermined
temperature; a supply channel that selectively connects the first
heating tank or the second heating tank with the supply openings;
and the discharging channel that selectively connects the
temperature adjusting chamber with the first heating tank or the
second heating tank.
4. The temperature adjusting device according to claim 1, wherein
the fluid supplying means comprises: a heating tank that heats the
fluid to a predetermined temperature; a supply channel that
connects the heating tank with the supply openings; supply channel
opening/closing means for opening and closing the supply channel; a
collecting tank connected to the discharging channel; a circulation
flow channel that connects the collecting tank with the heating
tank; and circulation flow channel opening/closing means for
opening and closing the circulation flow channel.
5. The temperature adjusting device according to claim 1, wherein
the fluid supplying means comprises: a cooling tank that reserves a
cooling fluid; a cooling fluid supply channel that connects the
cooling tank with the supply openings; and a pump for letting the
fluid in the cooling tank to flow from the supply openings.
6. The temperature adjusting device according to claim 2, wherein
respective shapes of the concavities or the convexities are a
square pyramid.
7. An imprinting device for transferring a molding pattern of a
mold on a molding target, the imprinting device comprising: fluid
supplying means for supplying a fluid at a predetermined
temperature from a plurality of supply openings; holding means, the
holding means comprising: a holding face that holds the mold or the
molding target; and a fluid receiving face that receives the fluid
supplied from the supply openings; a temperature adjusting housing
that constructs, together with the holding means, a temperature
adjusting chamber which retains thereinside the supply openings;
and a discharging channel that discharges the fluid in the
temperature adjusting chamber.
8. The temperature adjusting device according to claim 2, wherein
the fluid supplying means comprises: a cooling tank that reserves a
cooling fluid; a cooling fluid supply channel that connects the
cooling tank with the supply openings; and a pump for letting the
fluid in the cooling tank to flow from the supply openings.
9. The temperature adjusting device according to claim 3, wherein
the fluid supplying means comprises: a cooling tank that reserves a
cooling fluid; a cooling fluid supply channel that connects the
cooling tank with the supply openings; and a pump for letting the
fluid in the cooling tank to flow from the supply openings.
10. The temperature adjusting device according to claim 4, wherein
the fluid supplying means comprises: a cooling tank that reserves a
cooling fluid; a cooling fluid supply channel that connects the
cooling tank with the supply openings; and a pump for letting the
fluid in the cooling tank to flow from the supply openings.
Description
TECHNICAL FIELD
[0001] The present invention relates to a temperature adjusting
device for adjusting a temperature of an object uniformly and
quickly, and an imprinting device using the same.
BACKGROUND ART
[0002] In recent years, a nanoimprinting technology is getting
attention which depresses a mold against a molding target like a
resin, thereby transferring a minute molding pattern in a
micrometer or nanometer order. A thermal imprinting method and a
photo imprinting method are known as the nanoimprinting
technology.
[0003] In the case of the thermal imprinting method, a
thermoplastic resin is used as a molding target, such a
thermoplastic resin is heated to a temperature equal to or higher
than a glass transition temperature, a mold is depressed at
predetermined pressure, and the molding target is cooled to a
temperature lower than the glass transition temperature to transfer
a molding pattern of the mold on the thermoplastic resin. In this
case, the heating is performed by a heater, etc., while the cooling
is performed by letting a cooling water to flow through a cooling
channel (see, for example, Patent Literature 1).
[0004] In the case of the photo imprinting method, a photo-curable
resin is used as a molding target, a mold is depressed against the
photo-curable resin at predetermined pressure, and the
photo-curable resin is irradiated with light in this condition to
transfer a molding pattern of the mold on the photo-curable resin.
In this case, also, since a curing speed of the photo-curable resin
and a cure shrinkage thereof differ depending on a temperature at
the time of curing, a curing operation at a uniform temperature is
necessary, and it is essential to perform a temperature adjustment
especially in the case of a large area. [0005] Patent Literature 1:
International Publication No. WO 2004/062886
DISCLOSURE OF INVENTION
Problem to be Solved by the Invention
[0006] According to the conventional methods, however, a
temperature difference occurs between a portion where a heater or a
cooling channel passes through and a portion where no heater or
cooling channel passes through. Moreover, the cooling channel has a
temperature difference that occurs between the upstream side of the
channel and the downstream side thereof. When a temperature
difference occurs as explained above in a molding face, there is a
disadvantage that a transfer unevenness of a pattern occurs
depending on a difference in a thermal expansion with a resin, etc.
Furthermore, since the heater and the cooling channel cannot be
provided in the same portion at the same time, there is also a
disadvantage that either one of the heater and the cooling channel
is distant from the mold and the molding target, and a temperature
adjustment and a quick temperature rise/drop are difficult.
[0007] Hence, it is an object of the present invention to provide a
temperature adjusting device that can heat and cool an object like
a mold or a molding target uniformly and quickly, and an imprinting
device using the same.
Means for Solving the Problem
[0008] In order to accomplish the above object, a temperature
adjusting device of the present invention is for adjusting a
temperature of an object, and includes: fluid supplying means for
supplying a fluid at a predetermined temperature from a plurality
of supply openings; holding means, the holding means comprising: a
holding face that holds the object; and a fluid receiving face that
receives the fluid supplied from the supply openings; a temperature
adjusting housing that constructs, together with the holding means,
a temperature adjusting chamber which retains thereinside the
supply openings; and a discharging channel that discharges the
fluid in the temperature adjusting chamber.
[0009] In this case, it is preferable that the fluid receiving face
should include a plurality of concavities or convexities arranged
in accordance with respective positions of the supply openings in
order to increase a heat-transfer area.
[0010] When the object needs heating, the fluid supplying means may
be include: a first heating tank and a second heating tank that
heat the fluid to a predetermined temperature; a supply channel
that selectively connects the first heating tank or the second
heating tank with the supply openings; and the discharging channel
that selectively connects the temperature adjusting chamber with
the first heating tank or the second heating tank, or may include:
a heating tank that heats the fluid to a predetermined temperature;
a supply channel that connects the heating tank with the supply
openings; supply channel opening/closing means for opening and
closing the supply channel; a collecting tank connected to the
discharging channel; a circulation flow channel that connects the
collecting tank with the heating tank; and circulation flow channel
opening/closing means for opening and closing the circulation flow
channel.
[0011] When the object needs cooling, the fluid supplying means may
include: a cooling tank that reserves a cooling fluid; a cooling
fluid supply channel that connects the cooling tank with the supply
openings; and a pump for letting the fluid in the cooling tank to
flow from the supply openings.
[0012] An imprinting device of the present invention is for
transferring a molding pattern of a mold on a molding target, and
includes: fluid supplying means for supplying a fluid at a
predetermined temperature from a plurality of supply openings;
holding means, the holding means comprising: a holding face that
holds the mold or the molding target; and a fluid receiving face
that receives the fluid supplied from the supply openings; a
temperature adjusting housing that constructs, together with the
holding means, a temperature adjusting chamber which retains
thereinside the supply openings; and a discharging channel that
discharges the fluid in the temperature adjusting chamber.
Effect of the Invention
[0013] The temperature adjusting device of the present invention
can uniformly heat or cool the whole surface of an object.
Moreover, heating and cooling can be performed through the same
mechanism. Since a heat-transfer area can be increased and a heat
transfer fluid is sprayed to increase a film heat-transfer
coefficient, fast temperature raise and cooling are enabled.
Furthermore, since a fluid at a predetermined temperature is used,
an overshoot can be reduced even if a fast temperature rise/drop is
carried out.
BRIEF DESCRIPTION OF DRAWINGS
[0014] FIG. 1 is a cross-sectional view illustrating a temperature
adjusting device according to the present invention;
[0015] FIG. 2 is a cross-sectional view illustrating a temperature
adjusting device according to the present invention;
[0016] FIG. 3 is a cross-sectional view illustrating a temperature
adjusting device according to the present invention; and
[0017] FIG. 4 is a cross-sectional view illustrating a temperature
adjusting device according to the present invention;
DESCRIPTION OF REFERENCE NUMERALS
[0018] 1 Fluid supplying means [0019] 2 Holding means [0020] 3
Temperature adjusting housing [0021] 4 Discharging channel [0022]
11 Supply opening [0023] 12 Heating tank [0024] 13 Supply channel
[0025] 14 Supply channel opening/closing means [0026] 15 Collecting
tank [0027] 16 Circulation flow channel [0028] 17 Circulation flow
channel opening/closing means [0029] 19 Pump [0030] 21 Holding face
[0031] 22a Concavity [0032] 22b Convexity [0033] 22 Fluid receiving
face [0034] 31 Temperature adjusting chamber [0035] 41 Discharging
channel [0036] 100 Mold [0037] 121 First heating tank [0038] 122
Second heating tank [0039] 123 Cooling tank [0040] 124 Cooling
fluid supply channel [0041] 131 Supply channel [0042] 200 Molding
target
BEST MODE FOR CARRYING OUT THE INVENTION
[0043] A temperature adjusting device of the present invention is
for adjusting a temperature of an object, and mainly includes fluid
supplying means 1 which supplies a fluid at a predetermined
temperature from a plurality of supply openings 11 evenly disposed
at a predetermined pitch, holding means 2 that has a holding face
21 holding an object and a fluid receiving face 22 receiving the
fluid supplied from the supply openings 11, a temperature adjusting
housing 3 which constructs, together with the holding means 2, a
temperature adjusting chamber 31 that retains thereinside the
supply openings 11, and a discharging channel 4 that discharges the
fluid in the temperature adjusting chamber 31.
[0044] The object means an object subjected to a temperature
adjustment by the temperature adjusting device of the present
invention, and corresponds to, in the case of the imprinting
molding, a mold 100 having a predetermined molding pattern or a
molding target 200.
[0045] The mold 100 is formed of, for example, a "metal like
nickel", "ceramics", a "carbon material like glass-like carbon", or
"silicon", and has a predetermined pattern at an end face (a
molding-target face). This pattern can be formed by performing
precise machining on the molding-target face of the mold. Moreover,
the molding pattern can be formed by a semiconductor
microfabrication technology like etching on a silicon substrate, or
by forming a metal plating on the surface of the silicon substrate,
etc., through an electrical casting (electroforming) technique,
e.g., nickel plating, and by peeling off the metal plating layer.
Furthermore, it is possible to use a resin-made mold prepared by an
imprint technology. In this case, the mold may be formed as a film
having flexibility with respect to the molding-target face of the
molding target 200. Needless to say, the material and production
method of the mold 100 are not limited to any particular ones as
long as a minute pattern can be formed.
[0046] A molding pattern formed on the mold 100 includes not only a
pattern in a geometrical shape formed of a concavo-convex
structure, but also, for example, a pattern for transferring a
predetermined surface condition like a transfer of a mirror
condition with a predetermined surface roughness, and a pattern for
transferring an optical element like a lens with a predetermined
curved face. The molding pattern is formed in such a way that the
minimum dimension of a width of the convexity and that of the
concavity in a planar direction is formed in various sizes, such as
equal to or smaller than 100 .mu.m, equal to or smaller than 10
.mu.m, equal to or smaller than 2 .mu.m, equal to or smaller than 1
.mu.m, equal to or smaller than 100 nm, and equal to or smaller
than 10 nm. Moreover, a dimension in the depth direction is also
formed in various sizes, such as equal to or larger than 10 nm,
equal to or larger than 100 nm, equal to or larger than 200 nm,
equal to or larger than 500 nm, equal to or larger than 1 .mu.m,
equal to or larger than 10 .mu.m, and equal to or larger than 100
.mu.m.
[0047] The molding target 200 is for example, a thermoplastic resin
or a resin that is produced through a polymerization reaction
(thermal curing or photo curing) of polymerization-reactive-group
containing compounds.
[0048] Examples of a thermoplastic resin available are a
cyclic-olefin-based resin, such as a cyclic olefin ring-opening
polymer/hydrogenation (COP) or a cyclic olefin copolymer (COC), an
acrylic resin, polycarbonate, a vinyl-ether resin, a fluororesin,
such as perfluoro-alkoxy-alkane (PFA) or poly-tetra-fluoro-ethylene
(PTFE), polystyrene, a polyimide resin, and a polyester resin.
[0049] Example resins produced through a polymerization reaction
(thermal curing or photo curing) of polymerization-reactive-group
containing compounds are compounds containing unsaturated
hydrocarbon group like vinyl group or allyl group, such as
epoxide-containing compounds, (metha)acrylic-ester compounds,
vinyl-ether compounds, and bisallylnadiimide compounds. In this
case, a polymerization-reactive-group containing compound can be
used solely in order to let it thermally polymerized, or can be
used in combination with a thermal-reactive initiator in order to
improve a thermal curing property. Moreover, a
polymerization-reactive-group containing compound which can form a
molding pattern by proceeding a polymerization reaction through
irradiation with light when a photoreactive initiator is added can
be used. Example heat-reactive radical initiators suitably
available are organic peroxide and azo compound, and example
photoreactive radical initiators suitably available are an
acetophenone derivative, a benzophenone derivative, a benzoin ether
derivative, and a xanthone derivative. Moreover, a reactive monomer
can be used without a solvent, or can be used in a condition
dissolved in a solvent and desolvated after it is applied.
[0050] As the molding target 200, ones formed as a flexible film or
formed as a layer on a substrate formed of an inorganic compound
like silicon or a metal can be used.
[0051] In FIGS. 1 to 3, the mold 100 is disposed at the
holding-means-2 side, but the molding target 200 may be disposed at
the holding-means-2 side.
[0052] The explanation below will be given of a case in which the
temperature adjusting device of the present invention is applied to
an imprinting device, but can be applied to other devices.
[0053] An example fluid is a liquid having a higher boiling point
than a heating temperature of an object and having a lower melting
point than a cooling temperature of the object. For example, a
liquid, such as water or oil, can be used. A gas like a saturated
water vapor can be also used.
[0054] The holding face 21 of the holding means 2 is for holding an
object like the mold 100 or the molding target 200, and is formed
in a predetermined shape in accordance with the shape of the
object. When, for example, an object is a flat substrate or mold in
the case of the imprinting molding, in order to enable uniform
pressurization, one having a flatness as high as possible is used.
Moreover, in order to fasten the object, such as the mold 100 or
the molding target 200, fastening means (unillustrated) like a
vacuum chuck may be provided.
[0055] The material of the holding means 2 is not limited to any
particular one as long as it has a good thermal conductivity, and
has a heat resistance and a pressure resistance with respect to a
molding condition in an imprinting process, and for example, a
steel material like carbon steel or a metal like SUS can be
used.
[0056] The fluid receiving face 22 of the holding means 2 is not
limited to any particular shape as long as it can receive a fluid
supplied from the supply openings 11, but in order to enable an
efficient heat exchange with the fluids, it is preferable that the
fluid receiving surface should have a plurality of concavities 22a
or convexities 22b which increase a surface area. Moreover, in
order to let a temperature of the holding-face-21 side to be
uniform, the concavities 22a or the convexities 22b may be evenly
arranged in accordance with the positions of the supply openings
11. The concavities 22a or the convexities 22b may be in any
shapes, but those can be formed in, for example, a square pyramid
which can be disposed evenly. As an example, ones each having a
height of 2.5 mm and an angle of 45 degrees and arranged evenly at
a pitch of 5 mm can be used.
[0057] The temperature adjusting housing 3 is disposed at the
fluid-receiving-face side of the holding means 2, and constructs,
together with the holding means 2, the temperature adjusting
chamber 31 that retains thereinside the supply openings 11.
Moreover, the discharging channel 4 for discharging the fluid
supplied to the fluid receiving face 22 of the holding means 2 is
connected to the bottom of the temperature adjusting housing 3. The
temperature adjusting housing 3 is not limited to any particular
one as long as it has a pressure resistance good enough to
withstand an internal pressure at the time of temperature
adjustment, but it is preferable that the temperature adjusting
housing should have a heat insulation property as high as possible.
Moreover, the holding means 2 and a temperature adjusting housing
may be formed together.
[0058] The discharging channel 4 may be constructed so as to
discharge the fluid in the temperature adjusting chamber 31, or may
be constructed so as to reuse the fluid by returning it to the
fluid supplying means 1.
[0059] The fluid supplying means 1 is not limited to any particular
one as long as it can supply a fluid at a predetermined
temperature, but, for example, as illustrated in FIG. 1, when the
object like the mold 100 or the molding target 200 is heated, the
fluid supplying means including a heating tank 12 which heats the
fluid to a predetermined temperature, a supply channel 13 which
connects the heating tank 12 with the supply openings 11, and a
pump 19 for letting the fluid in the heating tank 12 to flow from
the supply openings 11 may be used.
[0060] The supply openings 11 are arranged appropriately at
respective positions where the object held by the holding means 2
can be heated uniformly. Moreover, the supply openings 11 are
constructed to supply or to spray the fluid to the fluid receiving
face 22 at the right angle.
[0061] The heating tank 12 includes heating means 12a like an
electric heater for heating the fluid, and temperature detecting
means (unillustrated) like a thermocouple for detecting the
temperature of the fluid, thereby heating the fluid to a
predetermined temperature.
[0062] This fluid supplying means 1 heats the fluid in the heating
tank 12 to a predetermined temperature in advance, and when heating
the object (mold 100 and molding target 200), actuates the pump 19
and supplies the fluid from the supply openings 11 to the fluid
receiving face 22 of the holding means 2. This causes the holding
means 2 to be heated, and the object held by the holding means 2
can be heated uniformly. The fluid supplied to the fluid receiving
face 22 is discharged from the temperature adjusting chamber 31
through the discharging channel 4.
[0063] When a liquid is used as the fluid, a liquid which is heated
under a pressure equal to or higher than the atmospheric pressure
to a temperature higher than a boiling point at the atmospheric
pressure can be used. In this case, as illustrated in FIG. 2, for
example, the fluid supplying means 1 includes the heating tank 12
which heats the fluid to a predetermined temperature, the supply
channel 13 which connects the heating tank 12 with the supply
openings 11, supply channel opening/closing means 14 for opening
and closing the supply channel 13, a collecting tank 15 connected
to the discharging channel 4, a circulation flow channel 16 which
connects the collecting tank 15 with the heating tank 12, and
circulation flow channel opening/closing means 17 for opening and
closing the circulation flow channel 16.
[0064] The heating tank 12 includes the heating means 12a like an
electric heater for heating the fluid, and the temperature
detecting means (unillustrated) like a thermocouple for detecting
the temperature of the fluid, thereby heating the fluid to a
predetermined temperature. Moreover, pressure detecting means
(unillustrated) for detecting an internal pressure of the heating
tank 12 may be disposed. Note that the heating tank 12 needs a
pressure resistance equal to or higher than a vapor pressure of the
heated fluid. Moreover, the supply channel 13 is connected to the
bottom of the heating tank 12.
[0065] In order to let the fluid to be flown by the gravity, it is
preferable that the collecting tank 15 should be disposed
downwardly of the temperature adjusting chamber 31 and upwardly of
the heating tank 12. This enables the fluid supplying means 1 to
circulate the fluid without a pump. Moreover, as a preparation for
the next heating, pre-heating means (unillustrated) like an
electric heater may be provided which heats the fluid in the
collecting tank 15 in advance.
[0066] This fluid supplying means 1 lets the supply channel
opening/closing means 14 and the circulation flow channel
opening/closing means 17 to be closed, and heats the liquid (fluid)
in the heating tank 12 to a predetermined temperature having a
higher vapor pressure than an internal pressure of the temperature
adjusting chamber 31. Next, when the supply channel opening/closing
means 14 is opened, since the vapor pressure in the heating tank 12
is higher than the internal pressure of the temperature adjusting
chamber 31, the liquid in the heating tank 12 is supplied to the
fluid receiving face 22 of the holding means 2 through the supply
openings 11. This causes the holding means 2 to be heated, and the
object (mold 100 and molding target 200) held by the holding means
2 can be heated uniformly. The liquid supplied to the fluid
receiving face 22 is discharged from the temperature adjusting
chamber 31 to the collecting tank 15 through the discharging
channel 4. When heating of the object completes, the supply channel
opening/closing means 14 is closed and the circulation flow channel
opening/closing means 17 is opened, and thus the liquid in the
collecting tank 15 is returned to the heating tank 12, and is
reused for the next heating.
[0067] As illustrated in FIG. 3, the fluid supplying means 1 may be
constructed so as to include a first heating tank 121 and a second
heating tank 122 that heat the fluid to a predetermined
temperature, a supply channel 131 that selectively connects the
first heating tank 121 or the second heating tank 122 with the
supply openings 11, and a discharging channel 41 that selectively
connects the temperature adjusting chamber 31 with the first
heating tank 121 or the second heating tank 122.
[0068] The supply channel 131 is provided with supply channel
changing means 131a, e.g., a three-way valve which selectively
changes the first heating tank 121 or the second heating tank 122
with the supply openings 11.
[0069] The first heating tank 121 and the second heating tank 122
each include the heating means 12a like an electric heater for
heating the fluid, and the temperature detecting means
(unillustrated) like a thermocouple for detecting the temperature
of the fluid, thereby heating the fluid to a predetermined
temperature. Moreover, the pressure detecting means (unillustrated)
for detecting an internal pressure of the heating tank 12 may be
disposed. Note that the first heating tank 121 and the second
heating tank 122 need to have a pressure resistance equal to or
higher than a vapor pressure of the heated fluid. Furthermore, the
supply channels 131 are connected to the bottoms of the first
heating tank 121 and the second heating tank 122, respectively.
[0070] In order to let the fluid to be flown by the gravity, it is
preferable that the first heating tank 121 and the second heating
tank 122 should be disposed downwardly of the temperature adjusting
chamber 31. This enables the fluid supplying means 1 to circulate
the fluid without a pump.
[0071] The discharging channel 41 is provided with discharging
channel changing means 41a, e.g., a three-way valve which
selectively connects the temperature adjusting 31 with the first
heating tank 121 or the second heating tank 122.
[0072] This fluid supplying means 1 causes the first heating tank
121 to be changed to a closed condition by the supply channel
changing means 131a and the discharging channel changing means 41a,
and heats the liquid (fluid) in the first heating tank 121 to a
predetermined temperature having a higher vapor pressure than an
internal pressure of the temperature adjusting chamber 31. Next,
when the supply channel changing means 131a is changed to the side
where the first heating tank 121 is in communication with the
supply openings 11, since the vapor pressure in the first heating
tank 121 is higher than the internal pressure of the temperature
adjusting chamber 31, the liquid in the first heating tank 121 is
supplied to the fluid receiving face 22 of the holding means 2
through the supply openings 11. This causes the holding means 2 to
be heated, and the object (mold 100 and molding target 200) held by
the holding means 2 can be heated uniformly. At this time, the
liquid supplied to the fluid receiving face 22 is discharged from
the temperature adjusting chamber 31 to the second heating tank 122
through the discharging channel 41. In the second heating tank 122,
the liquid is heated beforehand within a range where a vapor
pressure does not become higher than the internal pressure of the
temperature adjusting chamber 31. When heating of the object
completes, the fluid supplying means changes the second heating
tank 122 to be in a closed condition by the discharging channel
changing means 41a. After the liquid in the second heating tank 122
is heated to a predetermined temperature having a higher vapor
pressure than the internal pressure of the temperature adjusting
chamber 31, the supply channel changing means 131a is changed to
the side where the second heating tank 122 is in communication with
the supply openings 11. This causes the liquid in the second
heating tank 122 to be supplied to the fluid receiving face 22 of
the holding means 2 through the supply openings 11 since the vapor
pressure in the second heating tank 122 is higher than the internal
pressure of the temperature adjusting chamber 31. At this time, the
liquid supplied to the fluid receiving face 22 is discharged from
the temperature adjusting chamber 31 to the first heating tank 121
through the discharging channel 41.
[0073] By employing the above-explained structures, the object can
be heated quickly, and the throughput can be improved.
[0074] When the object (mold 100 and molding target 200) is cooled,
as illustrated in FIG. 4, the fluid supplying means may be
configured by a cooling tank 123 which reserves a cooling fluid, a
cooling fluid supply channel 124 which connects the cooling tank
123 with the supply openings 11, and the pump 19 for flowing the
fluid in the cooling tank 123 through the supply openings 11.
[0075] The cooling fluid is not limited to any particular one as
long as it can be a lower temperature than that of the object, but
for example, water can be used.
[0076] Hence, the mold 100 or the molding target 200 heated in
imprint molding can be cooled uniformly.
[0077] When heating and cooling are performed through the common
supply openings 11, as illustrated in FIG. 4, the cooling fluid
supply channel 124 may be connected to the supply channel 13
through changing means 125 like a three-way valve. Moreover, a
discarding channel 126 for discarding the cooling fluid may be
provided, and connected to the discharging channel 4 through
changing means 127 like a three-way valve.
* * * * *