U.S. patent application number 13/537064 was filed with the patent office on 2013-05-30 for heat dissipation device with fixing member for heat pipe thereof.
This patent application is currently assigned to FOXCONN TECHNOLOGY CO., LTD.. The applicant listed for this patent is JUI-WEN HUNG, SHIH-YAO LI. Invention is credited to JUI-WEN HUNG, SHIH-YAO LI.
Application Number | 20130133862 13/537064 |
Document ID | / |
Family ID | 48465756 |
Filed Date | 2013-05-30 |
United States Patent
Application |
20130133862 |
Kind Code |
A1 |
LI; SHIH-YAO ; et
al. |
May 30, 2013 |
HEAT DISSIPATION DEVICE WITH FIXING MEMBER FOR HEAT PIPE
THEREOF
Abstract
An exemplary heat dissipation device includes a heat absorbing
base, a heat pipe thermally connected to the heat absorbing base,
and a fixing member including a main body abutting to the heat
absorbing base and two clamps extending from the main body, the
heat pipe is sandwiched between the main body and the heat
absorbing base, each of the clamps includes an arm portion and a
curved portion extending from the arm portion toward the heat
absorbing base, the arm portions of the two clamps clamp two
opposite lateral sides of the heat absorbing base, the curved
portions of the two clamps elastically clamp edges of the heat
absorbing base away from the main body.
Inventors: |
LI; SHIH-YAO; (Tu-Cheng,
TW) ; HUNG; JUI-WEN; (Tu-Cheng, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LI; SHIH-YAO
HUNG; JUI-WEN |
Tu-Cheng
Tu-Cheng |
|
TW
TW |
|
|
Assignee: |
FOXCONN TECHNOLOGY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
48465756 |
Appl. No.: |
13/537064 |
Filed: |
June 29, 2012 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
F28D 15/0275 20130101;
H01L 2924/0002 20130101; H01L 23/3672 20130101; H01L 23/427
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 25, 2011 |
TW |
100143237 |
Claims
1. A heat dissipation device comprising: a heat absorbing base; a
heat pipe thermally connected to the heat absorbing base; and a
fixing member comprising a main body abutting the heat absorbing
base and two clamps extending from the main body, the heat pipe
being sandwiched between the main body and the heat absorbing base,
each of the clamps comprising an arm portion and a curved portion
extending from the arm portion generally toward the heat absorbing
base, the arm portions of the clamps clamping two opposite lateral
sides of the heat absorbing base, the curved portions of the clamps
elastically clamping edges of the heat absorbing base away from the
main body.
2. The heat dissipation device according to claim 1, wherein the
heat absorbing base comprises an approximately semicylindrical
first groove, and the heat pipe comprises an evaporating section
partly received in the first groove.
3. The heat dissipation device according to claim 2, wherein the
heat absorbing base further comprises a first surface and a second
surface at opposite sides thereof, the first groove is provided in
the second surface, the first surface is adapted to be attached to
a heat generating electronic component, and the second surface is
adapted to be attached to the main body.
4. The heat dissipation device according to claim 3, wherein the
main body defines an approximately semicylindrical second groove
corresponding to the first groove, and the first groove and the
second groove cooperatively receive the evaporating section of the
heat pipe therein.
5. The heat dissipation device according to claim 2, wherein the
heat pipe further comprises a pair of condensing sections parallel
to each other, and two connecting sections respectively
interconnecting the evaporating section and the pair of condensing
sections.
6. The heat dissipation device according to claim 4, wherein the
two connecting sections are both curved, and the curvature of the
first connecting section is greater than that of the second
connecting section.
7. The heat dissipation device according to claim 4, wherein the
evaporating section and one of the condensing sections form an
acute angle therebetween, and the evaporating section and the other
one of the condensing sections form an obtuse angle
therebetween.
8. The heat dissipation device according to claim 1, further
comprising a heat sink, wherein the heat sink comprises a plurality
of fins parallel to each other, and every two neighboring fins are
spaced apart from each other with a passage defined
therebetween.
9. The heat dissipation device according to claim 1, wherein each
of the clamps further comprises a securing portion extending from
the curved portion in a direction generally away from the heat
absorbing base.
10. The heat dissipation device according to claim 9, wherein the
securing portion is substantially perpendicular to the arm portion
of the clamp.
11. A heat dissipation device comprising: a heat absorbing base; a
heat pipe thermally connected to the heat absorbing base; and a
fixing member comprising: a main body abutting the heat absorbing
base; and two clamps extending from opposite sides of the main
body, each of the clamps comprising: an arm portion; and a curved
portion extending from the arm portion generally toward the heat
absorbing base; the arm portions of the clamps clamping two
opposite lateral sides of the heat absorbing base, and the curved
portions of the clamps elastically clamping edges of the heat
absorbing base away from the main body such that the heat pipe is
interferingly engaged between the main body and the heat absorbing
base.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure generally relates to heat dissipation
devices such as those used in electronic apparatuses, and more
particularly to a heat dissipation device with a fixing member
which secures a heat pipe of the heat dissipation device to a heat
absorbing base of the heat dissipation device.
[0003] 2. Description of Related Art
[0004] It is well known that heat is generated by many kinds of
electronic components, such as central processing units (CPUs),
integrated circuit chips and memory cards, during their operation.
If the heat is not efficiently removed, the electronic components
may malfunction or suffer damage. Typically, a heat dissipation
device is provided to cool such electronic components.
[0005] The heat dissipation device typically includes a heat
absorbing base, a heat sink and a heat pipe. The heat absorbing
base is attached to a heat generating electronic component such as
a CPU, and absorbs heat from the heat generating electronic
component. The heat pipe thermally connects the heat absorbing base
with the heat sink, to transfer the heat from the heat absorbing
base to the heat sink. The heat pipe is generally soldered to the
heat absorbing base with tin. However, if in operation the
temperature of the heat dissipation device is too high, the tin is
liable to melt. This may cause the heat pipe to loosen from the
heat absorbing base or even separate from the heat absorbing base.
As a result, the heat generated by the heat generating electronic
component can not be taken away efficiently, and the heat
generating electronic component may malfunction or suffer
damage.
[0006] What is needed, therefore, is a heat dissipation device
which can overcome the described limitations.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Many aspects of the disclosure can be better understood with
reference to the following drawings. The components in the drawings
are not necessarily drawn to scale, the emphasis instead being
placed upon clearly illustrating the principles of the
disclosure.
[0008] FIG. 1 is an assembled, isometric view of a heat dissipation
device in accordance with an embodiment of the disclosure.
[0009] FIG. 2 is an exploded view of the heat dissipation device of
FIG. 1.
[0010] FIG. 3 is similar to FIG. 2, but viewed from another
aspect.
[0011] FIG. 4 is an enlarged view of a fixing member of the heat
dissipation device of FIG. 2.
DETAILED DESCRIPTION
[0012] Reference will now be made to the drawings to describe one
or more embodiments of the present heat dissipation device, in
detail.
[0013] Referring to FIG. 1, a heat dissipation device 100 in
accordance with an embodiment of the disclosure is shown. The heat
dissipation device 100 includes a heat sink 10, a heat absorbing
base 30, a heat pipe 20 thermally connecting the heat sink 10 with
the heat absorbing base 30, and a fixing member 40 for fixing the
heat absorbing base 30 on a heat generating electronic component
(not shown) such as a CPU.
[0014] Referring also to FIGS. 2 and 3, the heat sink 10 includes a
top plate 11, a bottom plate 12, and a plurality of fins 13 between
the top plate 11 and the bottom plate 12. The top plate 11 and the
bottom plate 12 are planar and parallel to each other. Each of the
fins 13 is perpendicular to the top plate 11 and the bottom plate
12. Every two neighboring fins 13 are spaced apart from each other,
and cooperatively define a passage 14 therebetween. Each fin 13
defines two receiving holes 16 in a middle thereof. Each fin 13
also comprises two annular flanges 15 extending perpendicularly
from a main body thereof around the receiving holes 16,
respectively. When the fins 13 are assembled together, the flanges
15 of each fin 13 abut a neighboring fin 13, and the corresponding
receiving holes 16 and flanges 15 of the fins 13 align with each
other, respectively.
[0015] The heat pipe 20 includes an evaporating section 22, a pair
of condensing sections 21, and a pair of connecting sections 23
interconnecting the evaporating section 22 and the condensing
sections 21. The condensing sections 21 are a first condensing
section 211 and a second condensing section 212, which are parallel
to each other. The first condensing section 211 and the second
condensing section 212 are received in the two channels 16. The
evaporating section 22 is cylindrical. The evaporating section 22
and the first condensing section 211 form an acute angle
therebetween, and the evaporating section 22 and the second
condensing section 212 form an obtuse angle therebetween. The
connecting sections 23 are a first connecting section 231
interconnecting the first condensing portion 211 and one end of the
evaporating section 22, and a second connecting section 232
interconnecting the second condensing section 212 and another end
of the evaporating section 22. The two connecting sections 231, 232
are curved, and the curvature of the first connecting section 231
is greater than that of the second connecting section 232.
[0016] The heat absorbing base 30 includes a first surface 31 and a
second surface 32 at opposite sides thereof. The first surface 31
is for contacting the heat generating component. The heat absorbing
base 30 defines an approximately semicylindrical first groove 33 in
the second surface 32.
[0017] The fixing member 40 includes a main body 41, and four
clamps 42 extending correspondingly from four corner edges of the
main body 41 generally toward the heat absorbing base 30. The main
body 41 is plate shaped and defines an approximately
semicylindrical second groove 411 corresponding to the first groove
33. The second groove 411 and the first groove 33 cooperatively
receive the evaporating section 22 of the heat pipe 20 therein.
[0018] Referring also to FIG. 4, the four clamps 42 are
substantially L-shaped. Each clamps 42 includes an arm portion 421
for clamping a lateral side of the heat absorbing base 30, a curved
portion 422 extending from the arm portion 421 generally toward the
heat absorbing base 30, and a securing portion 423 extending from
the curved portion 422 in a direction generally away from the heat
absorbing base 30 and perpendicular to the arm portion 421. The
securing portion 423 is used for securing the heat dissipation
device 100 more firmly in position when the heat dissipation device
100 is applied in, e.g., an electronic device. For example, the
securing portion 423 can be engaged with a corresponding component
(not shown) of the electronic device, such as a clip on a circuit
board on which the heat generating electronic component is
mounted.
[0019] When the heat dissipation device 100 is assembled, the two
condensing sections 211, 212 of the heat pipe 20 are respectively
received in the corresponding receiving holes 16 of the heat sink
10. The evaporating section 22 of the heat pipe 20 is
pre-positioned in the first groove 33 of the heat absorbing base
30, for example by being soldered in the first groove 33 with tin.
Then the fixing member 40 is locked on the heat absorbing base 30,
with one semicylindrical portion of the evaporating section 22 away
from the first groove 33 received in the second groove 411. The
main body 41 and the four clamps 42 are pressed onto the heat
absorbing base 30, until the curved portions 422 of the clamps 42
elastically clamp edges of the first surface 31 of the heat
absorbing base 30. In this position, the arm portions 421 of the
clamps 42 clamp two opposite lateral sides of the heat absorbing
base 30, and the main body 41 is firmly attached to the second
surface 32 of the heat absorbing base 30. Finally, the securing
portions 423 of the fixing member 40 are engaged with other
components (such as clips, not shown), and the first surface 31 of
the heat absorbing base 30 is attached to the heat generating
electronic component.
[0020] In use of the heat dissipation device 100, the heat
absorbing base 30 absorbs the heat generated by the heat generating
electronic component quickly. The heat is transferred to the heat
sink 10 via the heat pipe 20, and then dissipated into ambient air
efficiently.
[0021] In summary, the heat dissipation device 100 includes the
first groove 33 and the second groove 411, which cooperatively
receive the evaporating section 22 of the heat pipe 20. In
addition, the fixing member 40 includes the clamps 42, which have
the arm portions 421 and the curved portions 422. The arm portions
421 clamp lateral sides of the heat absorbing base 30, and the
curved portions 422 elastically clamp the edges of the first
surface 31 of the heat absorbing base 30. Thereby, the heat pipe 20
can be fixed to the heat absorbing base 30 firmly. Furthermore, if
solder is applied between the fixing member 40 and the heat
absorbing base 30, the strength and reliability of the connection
between the heat pipe 20 and the heat absorbing base 30 are further
enhanced.
[0022] It is to be understood that the above-described embodiments
are intended to illustrate rather than limit the disclosure.
Variations may be made to the embodiments without departing from
the spirit of the disclosure as claimed. The above-described
embodiments illustrate the scope of the disclosure but do not
restrict the scope of the disclosure.
* * * * *