U.S. patent application number 13/645494 was filed with the patent office on 2013-05-16 for light emitting diode package structure.
This patent application is currently assigned to Liang Meng Plastic Share Co., Ltd.. The applicant listed for this patent is Liang Meng Plastic Share Co., Ltd.. Invention is credited to Kuang-Chu LAI.
Application Number | 20130119411 13/645494 |
Document ID | / |
Family ID | 45087889 |
Filed Date | 2013-05-16 |
United States Patent
Application |
20130119411 |
Kind Code |
A1 |
LAI; Kuang-Chu |
May 16, 2013 |
LIGHT EMITTING DIODE PACKAGE STRUCTURE
Abstract
A light emitting diode package structure includes a substrate,
LED bare chips and a lens. The substrate has an upper surface, a
lower surface and a side surface between the upper surface and the
lower surface. The upper surface is provided with a circuit
pattern. The side surface is provided with a groove. The LED bare
chips are fixed on the upper surface and electrically connected
with the circuit pattern. The lens covers the LED bare chips, the
upper surface and the circuit pattern by an injection molding
process so as to be inserted into the groove. With this
arrangement, the connecting strength between the substrate and the
lens can be enhanced, thereby achieving waterproof and
anti-electrostatic effects. Further, material cost of the present
invention is reduced greatly.
Inventors: |
LAI; Kuang-Chu; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Liang Meng Plastic Share Co., Ltd.; |
New Taipei City |
|
TW |
|
|
Assignee: |
Liang Meng Plastic Share Co.,
Ltd.
New Taipei City
TW
|
Family ID: |
45087889 |
Appl. No.: |
13/645494 |
Filed: |
October 4, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13084947 |
Apr 12, 2011 |
|
|
|
13645494 |
|
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|
Current U.S.
Class: |
257/88 ;
257/E33.067 |
Current CPC
Class: |
H01L 33/58 20130101;
B29C 45/14655 20130101; B29C 45/14311 20130101; H01L 2924/00
20130101; H01L 2924/0002 20130101; H01L 25/0753 20130101; B29L
2011/0016 20130101; H01L 33/54 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
257/88 ;
257/E33.067 |
International
Class: |
H01L 33/58 20100101
H01L033/58 |
Claims
1. A light emitting diode package structure, including: a substrate
(10) having an upper surface (11), a lower surface (12) and a side
surface (13) between the upper surface (11) and the lower surface
(12), the upper surface (11) being provided with a circuit pattern
(111), and the side surface (13) being provided with a flange (14);
a plurality of LED bare chips (20) fixed on the upper surface (11)
and electrically connected with the circuit pattern (111); and a
lens (30) covering the LED bare chips (20), the upper surface (11)
and the circuit pattern (111) by means of an injection molding
process so as to be engaged with the flange (14).
2. The light emitting diode package structure according to claim 1,
wherein the substrate (10) is a metallic substrate.
3. The light emitting diode package structure according to claim 2,
wherein the circuit pattern (111) is combined on the upper surface
(11) of the metallic substrate (10) in an electrical insulating
manner.
4. The light emitting diode package structure according to claim 2,
wherein a first and a last ends of the circuit pattern (111) are
formed with an electrical conducting contact (112)
respectively.
5. The light emitting diode package structure according to claim 2,
wherein the flange (14) is an annular flange surrounding a profile
of the substrate (10).
6. The light emitting diode package structure according to claim 1,
wherein a solid light-guiding post (31) is formed in the lens (30)
above a corresponding LED bare chip (20), and the light-guiding
post (31) is formed into a conical shape.
7. The Light emitting diode package structure according to claim 6,
wherein a top of the light-guiding post (31) is formed into a
light-converging protrusion (311), and a periphery of the
light-guiding posts (31) is formed with an annular frame (32).
Description
[0001] This application is a division application (DA) of U.S.
patent application Ser. No. 13/084,947, filed on Apr. 12, 2011.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an illumination device, in
particular to a light emitting diode package structure.
[0004] 2. Description of Prior Art
[0005] Since light emitting diodes (referred to as "LED"
hereinafter) are energy-saving, they have become a new-generation
light source for replacing traditional bulbs. Currently, LEDs have
been widely used in indoor or outdoor illumination.
[0006] A conventional light emitting diode package structure is
proposed, in which an upper surface of a substrate is provided with
an annular groove. A LED chip is mounted on the surface of
substrate on which the annular groove is formed. A binder made of
silicon materials is filled into the groove, and then a lens covers
outside the LED chip. The bottom of the lens is embedded into the
groove and combined therewith.
[0007] However, the conventional light emitting diode package
structure merely allows one LED chip to be mounted thereon. When a
plurality of LED chips are to be mounted on the same substrate, the
steps of forming a groove on the substrate, filling the binder in
the groove and covering the lens have to be performed for the LED
chips respectively. As a result, the manufacturing time and cost
cannot be reduced. On the other hand, in such a package structure,
the binder is used to connect the substrate and the lens. However,
the lens is formed into a thin shell with a less connecting
strength, so that the lens may be disconnected from the substrate
easily. Further, the conventional package structure does not have
waterproof and anti-electrostatic effects, and thus really needs to
be improved.
SUMMARY OF THE INVENTION
[0008] The present invention is to provide a light emitting diode
package structure, in which a lens is inserted into or engaged with
a substrate to thereby enhance the connecting strength
therebetween. Thus, the present invention has waterproof and
anti-electrostatic effects.
[0009] The present invention is to provide a light emitting diode
package structure, including a substrate, a plurality of LED bare
chips and a lens. The substrate has an upper surface, a lower
surface and a side surface between the upper surface and the lower
surface. The upper surface is provided with a circuit pattern, and
the side surface is provided with a groove. The LED bare chips are
fixed on the upper surface and electrically connected with the
circuit pattern. The lens covers the LED bare chips, the upper
surface and the circuit pattern by means of an injection molding
process so as to be inserted into the groove.
[0010] The present invention is to provide a light emitting diode
package structure, including a substrate, a plurality of LED bare
chips and a lens. The substrate has an upper surface, a lower
surface and a side surface between the upper surface and the lower
surface. The upper surface is provided with a circuit pattern, and
the side surface is provided with a flange. The LED bare chips are
fixed on the upper surface and electrically connected with the
circuit pattern. The lens covers the LED bare chips the upper
surface and the circuit pattern by means of an injection molding
process so as to be engaged with the flange.
[0011] The present invention has the following advantageous
features. The first lens covering the surface of the LED bare chip
can be omitted, thereby reducing the material cost greatly.
BRIEF DESCRIPTION OF DRAWING
[0012] FIG. 1 is a perspective view of the present invention
showing respective bare chips being mounted on the substrate;
[0013] FIG. 2 is an assembled cross-sectional view of FIG. 1;
[0014] FIG. 3 is an assembled cross-sectional view of the present
invention showing the lens covering the respective bare chips;
[0015] FIG. 4 is a perspective view showing the external appearance
of the package structure of the present invention; and
[0016] FIG. 5 is an assembled cross-sectional view showing another
embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0017] The detailed description and technical contents of the
present invention will become apparent with the following detailed
description accompanied with related drawings. It is noteworthy to
point out that the drawings is provided for the illustration
purpose only, but not intended for limiting the scope of the
present invention.
[0018] Please refer to FIGS. 1 and 2. The present invention
provides a light emitting diode package structure including a
substrate 10, a plurality of LED bare chips 20 and a lens 30.
[0019] The substrate 10 is made of metallic materials having good
heat conductivity such as aluminum, copper or alloys thereof. The
substrate 10 is formed into a capsule shape and has an upper
surface 11, a lower surface 12 and a side surface 13. The lower
surface 12 is located below the upper surface 11. The side surface
13 is formed vertically between the upper surface 11 and the lower
surface 12. The upper surface 11 is provided with a circuit pattern
111. Copper clad circuit on the circuit pattern 111 is combined
with the upper surface 11 in an electrically insulating manner. The
first and last ends of the circuit pattern 111 are formed with an
electrical conductive contact 112 respectively. Similarly, after
the circuit pattern 111 is made completely, the circuit pattern 111
is fixedly bonded on the upper surface 11. The side surface 13 is
provided with an annular groove 131 surrounding the profile of the
substrate 10. The cross section of the groove 131 may be formed
into any one of a rectangular shape, a trapezoid shape, a V shape,
a semicircular shape, a dovetailed shape, a triangular shape and
other suitable shapes.
[0020] The LED bare chips 20 are respectively arranged on the upper
surface 11 of the substrate 10 at intervals based on the traces of
the circuit pattern 111. The electrodes (not shown) of the LED bare
chip 20 are electrically connected in series with the copper clad
circuit of the circuit pattern 111. In the present embodiment,
although the respective LED bare chips 20 are electrically
connected in series with each other, the electrical connection
between the LED bare chips 20 is not limited to a serial connection
only, but other forms of electrical connections may be used.
[0021] Please refer to FIGS. 3 and 4. After arranging the
respective LED bare chips 20 on the substrate 10, this combination
of the LED bare chips 20 and the substrate 10 are put into a
pre-formed mold (not shown). Then, molten resin is injected into
the mold in such a manner that a portion of the molten resin covers
the LED bare chips 20, the upper surface 11 of the substrate 10 and
the circuit pattern 111, and the other portion of the molten resin
flows along the inner walls of the mold to be filled into the
groove 131. After the molten resin is cured, a lens 30 is formed. A
solid light-guiding post 31 is formed in the lens 30 above a
corresponding LED bare chip 20. The light-guiding post 31 is
substantially formed into a conical shape. The top of the
light-guiding post 31 is formed into a light-converging protrusion
311 for converging the light, thereby increasing the light emitting
efficiency. The outer periphery of the light-guiding posts 31 is
formed with an annular frame 32.
[0022] Please refer to FIG. 5. In addition to the above embodiment,
the light emitting diode package structure of the present invention
can be carried out by another embodiment, in which the side surface
13 of the substrate 10 is formed with an annular flange 14. After
the molten resin is injected to the mold, the molten resin covers
the LED bare chips 20, the upper surface 11 of the substrate 10 and
the circuit pattern 111, and the other portion of the molten resin
flows along the inner walls of the mold to be engaged with the
annular flange 14. After the molten resin is cured, a lens 30 is
formed, and the connecting strength between the lens 30 and the
substrate 10 can be enhanced greatly.
* * * * *