U.S. patent application number 13/653588 was filed with the patent office on 2013-05-02 for heat dissipation device.
The applicant listed for this patent is CHUN-CHI CHEN, WEI LI, HAO-XIA LIU, XUE-WEN PENG. Invention is credited to CHUN-CHI CHEN, WEI LI, HAO-XIA LIU, XUE-WEN PENG.
Application Number | 20130105123 13/653588 |
Document ID | / |
Family ID | 48171216 |
Filed Date | 2013-05-02 |
United States Patent
Application |
20130105123 |
Kind Code |
A1 |
CHEN; CHUN-CHI ; et
al. |
May 2, 2013 |
HEAT DISSIPATION DEVICE
Abstract
An exemplary heat dissipation device is adapted for dissipating
heat generated from electronic components having different heights.
The heat dissipation device includes a base plate and a first heat
absorbing member and a second heat absorbing member extending from
a top side of the base plate and having different heights for
contacting the electronic components having different heights.
Inventors: |
CHEN; CHUN-CHI; (Tu-Cheng,
TW) ; PENG; XUE-WEN; (Foshan City, CN) ; LI;
WEI; (Foshan City, CN) ; LIU; HAO-XIA; (Foshan
City, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CHEN; CHUN-CHI
PENG; XUE-WEN
LI; WEI
LIU; HAO-XIA |
Tu-Cheng
Foshan City
Foshan City
Foshan City |
|
TW
CN
CN
CN |
|
|
Family ID: |
48171216 |
Appl. No.: |
13/653588 |
Filed: |
October 17, 2012 |
Current U.S.
Class: |
165/104.26 ;
165/185 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/36 20130101; H01L 23/427 20130101; H01L 2924/0002 20130101;
H01L 23/3672 20130101; H01L 23/3675 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/104.26 ;
165/185 |
International
Class: |
F28D 15/04 20060101
F28D015/04; F28F 3/02 20060101 F28F003/02; F28D 1/03 20060101
F28D001/03 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 27, 2011 |
CN |
201110331491.4 |
Claims
1. A heat dissipation device adapted for dissipating heat generated
from electronic components having different heights, the heat
dissipation device comprising: a base plate; and a first heat
absorbing member and a second heat absorbing member extending from
the base plate and having different heights for thermally
contacting the electronic components having different heights.
2. The heat dissipation device of claim 1, wherein the first heat
absorbing member comprises a first connecting plate extending from
a first side of the base plate and a first heat absorbing plate
bent from the first connecting plate, the second heat absorbing
member comprises a second connecting plate extending from the first
side of the base plate and a second heat absorbing plate bent from
the second connecting plate, the first and second heat absorbing
plates are spaced from the base plate and respectively contact
different electronic components, and a height of the first
connecting plate away from the first side of the base plate is
different from that of the second connecting plate.
3. The heat dissipation device of claim 2, wherein the first
connecting plate and the second connecting plate are perpendicular
to the base plate and the first and second heat absorbing
plates.
4. The heat dissipation device of claim 2, wherein the first and
second connecting plates are aligned with and parallel to each
other, and the first and second heat absorbing plates are aligned
with and parallel to each other.
5. The heat dissipation device of claim 2, wherein each of the
first heat absorbing member and the second heat absorbing member is
an elastic sheet and has an L-shaped configuration.
6. The heat dissipation device of claim 1, wherein the first and
second heat absorbing members are integrally formed with the base
plate as a single piece.
7. The heat dissipation device of claim 1, wherein a heat absorbing
block is embedded in the base plate, and one end of the heat
absorbing block is beyond the base plate adapted for thermally
connecting another electronic component and absorbing heat from the
another electronic component.
8. The heat dissipation device of claim 7, wherein a height of the
end of the heat absorbing block away from the base plate is
different from that of the first heat absorbing member or the
second heat absorbing member.
9. The heat dissipation device of claim 7, wherein the heat
absorbing block is a solid metal block or a vapor chamber.
10. The heat dissipation device of claim 1, wherein a plurality of
heat pipes are arranged on the base plate to transfer heat absorbed
by the first and second heat absorbing members.
11. The heat dissipation device of claim 10, wherein each of the
heat pipes comprises an evaporator section and two arc-shaped
condenser sections extending from opposite ends of the evaporator
section, the evaporator sections are aligned with each other and
located at a central portion of the base plate, and the condenser
sections are located at opposite ends of the base plate.
12. The heat dissipation device of claim 11, wherein the evaporator
sections intimately contact each other.
13. The heat dissipation device of claim 10, wherein a covering
plate covers the base plate, and opposite surfaces of the heat
pipes respectively abut the covering plate and the base plate.
14. The heat dissipation device of claim 13, wherein a plurality of
fins is formed on the covering plate.
15. The heat dissipation device of claim 13, wherein two supporting
members are located at lateral sides of the heat pipes and opposite
surfaces thereof abut the covering plate and the base plate.
16. A heat dissipation device comprising: a base plate; a first
heat absorbing member extending from the base plate; and a heat
absorbing block extending through the base plate, one end of the
heat absorbing block exceeding the base plate, a height of the heat
absorbing block exceeding the base plate being different from a
height of the first heat absorbing member away from the base plate,
the heat absorbing block and the first heat absorbing member being
adapted for thermally contacting different electronic components
respectively.
17. The heat dissipation device of claim 16, further comprising a
second heat absorbing member extending from the base plate, wherein
a height of the second heat absorbing member away from the base
plate is different from the height of the heat absorbing block
exceeding the base plate, and thermally contacts another electronic
component.
18. The heat dissipation device of claim 16, wherein a plurality of
heat pipes are arranged on the base plate to transfer heat absorbed
by the first heat absorbing member and the heat absorbing
block.
19. The heat dissipation device of claim 18, wherein each of the
heat pipes comprises an evaporator section and two arc-shaped
condenser sections extending from opposite ends of the evaporator
section, the evaporator sections are aligned with each other and
located at a central portion of the base plate, and the condenser
sections are located at opposite ends of the base plate.
20. The heat dissipation device of claim 19, wherein a covering
plate covers the base plate, and opposite surfaces of the heat
pipes respectively abut the covering plate and the base plate.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The disclosure generally relates to heat dissipation
devices, and more particularly to a heat dissipation device for
dissipating heat from heat generating components which having
different heights.
[0003] 2. Description of Related Art
[0004] As electronic products continue to develop, heat generated
from electronic components of the electronic products become more
and more. If the heat can not be removed rapidly, the electronic
components are prone to be overheated. Generally, a metallic base
plate is mounted on the electronic components to absorb heat
generated therefrom. However, if one electronic component has a
height different from that of an adjacent electronic component, the
base plate is not able to tightly contacting all of the electronic
components with different heights; as a result, a larger heat
resistance will exist between the electronic components and the
base plate, which will adversely affect the heat dissipation of the
electronic components.
[0005] What is needed, therefore, is an improved heat dissipation
device which overcomes the above described shortcomings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is an isometric, assembled view of a heat dissipation
device according to an embodiment of the present disclosure.
[0007] FIG. 2 is an isometric, exploded view of the heat
dissipation device of FIG. 1.
[0008] FIG. 3 is an inverted view of the heat dissipation device of
FIG. 2.
[0009] FIG. 4 is a partly assembled view of the heat dissipation
device of FIG. 3.
DETAILED DESCRIPTION
[0010] Embodiments of heat dissipation devices will now be
described in detail below and with reference to the drawings.
[0011] Referring to FIGS. 1-2, a heat dissipation device 1 in
accordance with an embodiment of the disclosure is shown. The heat
dissipation device 1 includes a base plate 10 and a first heat
absorbing member 11 and a second heat absorbing member 12 extending
outwardly from the base plate 10. The first heat absorbing member
11 and the second heat absorbing member 12 have different heights
and are adapted for thermally contacting electronic components with
different heights.
[0012] Referring also to FIG. 3, the base plate 10 is a metallic
plate having good heat conductive efficiency. In this embodiment,
the base plate 10 is a rectangular aluminum plate. Four sidewalls
13 extend downwardly from edges of the base plate 10. The sidewalls
13 and the base plate 10 cooperatively define a receiving chamber
14 therebetween. A rectangular opening 101 is defined in a central
of the base plate 10.
[0013] The first heat absorbing member 11, the second heat
absorbing member 12 and the base plate 10 are formed by a single
piece. The first heat absorbing member 11 and the second heat
absorbing member 12 are punched from an end of the base plate 10
and each thereof is an elastic L-shaped sheet. The first heat
absorbing member 11 includes a first connecting plate 112 bended
from the base plate 10 and a first heat absorbing plate 114 bended
from a top end of the first connecting plate 112. The second heat
absorbing member 12 includes a second connecting plate 122 bended
from the base plate 10 and a second heat absorbing plate 124 bended
from a top end of the second connecting plate 122. The first
connecting plate 112 and the second connecting plate 122 are
aligned with and parallel to each other and perpendicular to the
base plate 10. The first heat absorbing plate 114 and the second
heat absorbing plate 124 are aligned with and parallel to each
other. The first heat absorbing plate 114 and the second heat
absorbing plate 124 are parallel to and spaced from the base plate
10. When the first heat absorbing member 11 and the second heat
absorbing member 12 are compressed, the first heat absorbing plate
114 and the second heat absorbing plate 124 can elastically move
toward the base plate 10. A size of the first heat absorbing plate
114 is equal to that of the second heat absorbing plate 124. A
height of the first connecting plate 112 is different from that of
the second connecting plate 122.
[0014] The heat dissipation device 1 includes a covering plate 40
having good heat conductive efficiency. The covering plate 40 is
rectangular and a size thereof is equal to that of the base plate
10. A periphery of a side of the covering plate 40 is sealed to the
bottom ends of the sidewalls 13. Thus, the covering plate 40 and
the base plate 10 are assembled together. A plurality of spaced
fins 41 is mounted on the other side of the covering plate 40 to
dissipate heat thereof. The fins 41 are parallel to each other. In
this embodiment, the fins 41 and the covering plate 40 each are an
aluminum plate.
[0015] A heat absorbing block 50 is embedded in the opening 101 of
the base plate 10 and a top portion thereof is beyond to the base
plate 10. A top surface of the heat absorbing block 50 is used to
contact a required electronic component. A height of the top
portion of the absorbing block 50 is different from that of the
first connecting plate 112 and the second connecting plate 122.
Thus, the heat absorbing block 50, the first heat absorbing member
11, and the second heat absorbing member 12 can contact electronic
components with different heights. In other embodiment, the height
of the top portion of the heat absorbing block 50 may be equal to
that of the first connecting plate 112 or the second connecting
plate 122, as long as the absorbing block 50 contacts the required
electronic component. In this embodiment, the heat absorbing block
50 is a solid metallic block. In other embodiment, the heat
absorbing block 50 may be a vapor chamber.
[0016] Referring also to FIG. 4, the heat dissipation device 1
further comprises four heat pipes 20 received in the receiving
chamber 14. Each heat pipe 20 has a C-shaped configuration and
includes a flatted top surface and a flatted bottom surface
opposite to the top surface. The top surface and the bottom
surfaces of each heat pipe 20 respectively abut against the
covering plate 10 and the base plate 10. Each heat pipe 20 includes
a straight evaporator section 21 and two arc-shaped condenser
sections 22 bended from opposite ends of the evaporator section 21.
The evaporator sections 21 of the heat pipes 20 are aligned and
parallel to each other. The evaporator sections 21 are intimately
contact each other and are located at a center of the receiving
chamber 14. The condenser sections 22 are located at opposite ends
of the receiving chamber 14.
[0017] Two supporting members 30 are received in the receiving
chamber 14 and located at lateral sides of the evaporator sections
21 of the heat pipes 20. Each supporting member 30 is rectangular,
and top and bottom surfaces thereof respectively abut the covering
plate 40 and the base plate 10 to enhance an intensity of lateral
sides of the covering plate 40 and the base plate 10. The top
surface of each supporting member 30 is coplanar to the top surface
of each heat pipe 20. The bottom surface of each supporting member
30 is coplanar to the bottom surface of each heat pipe 20. Each
supporting member 30 has good heat conductive efficiency and can
rapidly transfers heat thereof to the fins 41 to dissipate.
[0018] In use, the first heat absorbing member 11, the second heat
absorbing member 12 and the heat absorbing block 50 respectively
contact the electronic components having different heights and
absorb heat generated from the electronic components. The heat
rapidly transfers to the fins 41 to dissipate by the heat pipes 20
and the supporting members 30.
[0019] It is to be further understood that even though numerous
characteristics and advantages of the present embodiments have been
set forth in the foregoing description, together with details of
the structures and functions of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the disclosure to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *