U.S. patent application number 13/319451 was filed with the patent office on 2013-04-18 for liquid crystal display panel module packaging box and packaging method of liquid crystal display panel module.
This patent application is currently assigned to Shenzhen China Star Optoelectronics Technology Co., Ltd.. The applicant listed for this patent is Qinjun Shi. Invention is credited to Qinjun Shi.
Application Number | 20130091809 13/319451 |
Document ID | / |
Family ID | 46105931 |
Filed Date | 2013-04-18 |
United States Patent
Application |
20130091809 |
Kind Code |
A1 |
Shi; Qinjun |
April 18, 2013 |
Liquid Crystal Display Panel Module Packaging Box and Packaging
Method of Liquid Crystal Display Panel Module
Abstract
The present invention discloses a liquid crystal display (LCD)
panel module packaging box and a packaging method of LCD panel
module, wherein the LCD panel module packaging box comprises a
buffer structure; the buffer structure is provided with multiple
slot groups which are used to insert LCD panel modules, and the
slot group comprises a pair of slots adjacent to each other. The
distance between two adjacent slots of the slot groups is smaller
than the distance between two slot groups; the distance between the
slot groups corresponds to the total height on backplanes of the
two backlight modules. When packaging the LCD panel modules, the
relatively more fragile display panel of LCD panel module is
inserted in opposite pairs into two slots of a slot group of the
packaging box of the present invention. Because the display surface
of the LCD panel is a smooth surface, the distance between two
adjacent slots of a slot group can be further reduced without
worrying about that the display panels are damaged by the impact
from backplane with bumps of higher intensity.
Inventors: |
Shi; Qinjun; (Shenzhen,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Shi; Qinjun |
Shenzhen |
|
CN |
|
|
Assignee: |
Shenzhen China Star Optoelectronics
Technology Co., Ltd.
Shenzhen, Guangdong
CN
|
Family ID: |
46105931 |
Appl. No.: |
13/319451 |
Filed: |
October 17, 2011 |
PCT Filed: |
October 17, 2011 |
PCT NO: |
PCT/CN2011/080867 |
371 Date: |
November 8, 2011 |
Current U.S.
Class: |
53/475 ;
206/725 |
Current CPC
Class: |
B65D 2585/6837 20130101;
B65D 81/113 20130101; B65D 81/057 20130101; B65D 85/30
20130101 |
Class at
Publication: |
53/475 ;
206/725 |
International
Class: |
B65D 85/86 20060101
B65D085/86; B65B 5/10 20060101 B65B005/10; B65D 81/05 20060101
B65D081/05 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 12, 2011 |
CN |
201120387217.4 |
Claims
1. A liquid crystal display (LCD) panel module packaging box,
comprising: a buffer structure; said buffer structure is provided
with multiple slot groups for inserting LCD panel modules, and each
of said slot group comprises a pair of slots adjacent to each
other; the distance between the two adjacent slots in one slot
group is less than the distance between two slot groups; the
distance between said slot groups corresponds to the total height
of bumps of backplanes of two backlight modules.
2. The LCD panel module packaging box of claim 1, wherein said
buffer structure is provided with an independent slot at the outer
edge of all slot groups; the distance between said independent slot
and an adjacent slot group thereof corresponds to the total height
of the bumps of the backplanes of the two backlight modules.
3. The LCD panel module packaging box of claim 1, wherein adjacent
slots of said two slot groups are juxtaposed with a displacement on
their slot planes; the distance between said slot groups is less
than the total height of the bump of the backplanes of the two
backlight modules and more than the height of the bump of a single
backplane.
4. The LCD panel module packaging box of claim 3, wherein said
displacement is in a horizontal direction.
5. The LCD panel module packaging box of claim 1, wherein the
distance between said slot groups is not less than the total height
of the bumps of the backplanes of the two backlight modules.
6. The LCD panel module packaging box of claim 1, wherein said
buffer structure comprises a lower buffer structure provided with
said slot groups and two side buffer structures disposed on both
sides of the lower buffer structure; slots of said slot groups are
staggeringly arranged on the two side buffer structures.
7. The LCD panel module packaging box of claim 6, wherein said
lower buffer structure and said two side buffer structures on both
sides thereof are integrally formed.
8. The LCD panel module packaging box of claim 6, wherein said
buffer structure is a U-shaped structure.
9. The LCD panel module packaging box of claim 6, wherein at least
one said buffer structure is needed for packaging said LCD panel
modules.
10. The LCD panel module packaging box of claim 1, wherein said
buffer structure comprises a lower buffer structure provided with
the slot groups and a side buffer structure.
11. The LCD panel module packaging box of claim 10, wherein said
buffer structure is an L-shaped structure.
12. The LCD panel module packaging box of claim 10, wherein at
least two said buffer structures are needed for packaging said LCD
panel module.
13. The LCD panel module packaging box of claim 1, wherein an edge
lug boss is provided at the outer edge of said slot groups of said
buffer structure; the distance between said edge lug bosses is not
less than the height of bump of said backplane.
14. A packaging method of LCD panel modules comprises the following
steps: A: inserting LCD panel modules in a packaging box in such a
way that two display surfaces thereof are opposite to each other,
so that backplane surfaces of the LCD panel modules are opposite;
the distance between said display surfaces is less than the
distance between said back planes.
15. The packaging method of LCD panel modules of claim 14, wherein
in said step A, said LCD panel modules in opposite pairs are
inserted by juxtaposing with a displacement from each other.
Description
TECHNICAL FIELD
[0001] The present invention relates to the field of the liquid
crystal display (LCD) device, and more particularly to an LCD panel
module and a packaging method of LCD panel module.
BACKGROUND
[0002] An LCD panel module is an intermediate product of an LCD
device, with a display surface at one side and a backplane surface
at the other side. The display surface of the LCD panel is
relatively fragile while the intensity of the backplane surface is
high and the backplane of the backplane surface often have a bump
structure as a result of functional requirements. Therefore, it is
necessary to design a certain thickness of space to avoid damages
of the display surface caused in case the bump structure of the
backplane contacts with the display surface of the LCD panel module
when the module is being packed. If the thickness of the space is
thin, it is possible that the display surface collides with the
high intensity of backplane having a bump structure, thereby
resulting in damages during transportation.
SUMMARY
[0003] One aim of the present invention is to provide an LCD panel
module packaging box with a high packing rate and a packaging
method for the LCD panel module. The aim of the present invention
is achieved by the following technical schemes.
[0004] An LCD panel module packaging box comprises a buffer
structure, wherein the buffer structure is provided with multiple
slot groups for inserting LCD panel modules; each of the slot
groups comprises a pair of adjacent slots, and the distance between
two adjacent slots in one slot group is less than the distance
between the slot groups, and the distance between the slot groups
corresponds to the total height of the bumps of the backplanes of
the two backlight modules.
[0005] Preferably, the buffer structure is provided with an
independent slot located at the edge of the buffer structure
outside all the slot groups, wherein the distance between the
independent slot and an adjacent slot group thereof corresponds to
the total height of the bumps of the backplanes of the two
backlight modules. This is another distribution manner of
slots.
[0006] Preferably, adjacent slots of the two slot groups are
juxtaposed mutually with a displacement on their slot planes,
wherein the distance between the two slot groups is less than the
total height of the bumps of the backplanes of the two backlight
modules and greater than the height of the bump of a single
backplane. The displacement can be designed in accordance with
specific conditions so that the bumps of the corresponding
backplanes of the two LCD panel modules can be mutually staggered,
and the space formed by the corresponding backplane surface has the
same height as the bump of the backplane surface, so that the bumps
of the backplane surface of two adjacent LCD panel modules can
share the space. Thus, the gap between LCD panel modules is
reduced, so that more LCD panel modules can be loaded into the
packaging box and the packing rate of LCD panel module is
increased.
[0007] Preferably, the displacement is in a horizontal direction.
Such design satisfies people's packaging habits and facilitates
packaging.
[0008] The distance between the slot groups is not less than the
total height of bumps of backplanes of two backlight modules. If
the bumps of two adjacent backplanes are opposite, the distance
between two slot groups should be not less than the total height of
the bumps of the backplanes of two backlight modules so as to
protect the slot groups from being collided mutually.
[0009] Preferably, the buffer structure of packaging box comprises
a lower buffer structure provided with the slot groups and two side
buffer structures which are located on both sides of the lower
buffer structure. The slots of the slot group are alternately
arranged on the two side buffer structures. The design is simple,
convenient to process and easy to package the LCD panel
modules.
[0010] Preferably, the lower buffer structure and two side buffer
structures on both sides are integrally formed. The structure is
simple, convenient to process and more convenient to package
compared with a separated buffer structure.
[0011] Preferably, the buffer structure is a U-shaped
structure.
[0012] Preferably, at least one buffer structure is required for
packaging the LCD panel modules.
[0013] Preferably, the buffer structure comprises a lower buffer
structure provided with above-mentioned slot groups and a side
buffer structure.
[0014] Preferably, the buffer structure is an L-shaped
structure.
[0015] Preferably, at least two of the buffer structures are
required for packaging the LCD panel module.
[0016] Preferably, an edge lug boss is provided at the outer edge
of the slot groups of the buffer structure, and the distance
between the edge lug boss is not less than the height of the bump
of the backplane. The design of the edge lug boss not only
increases the intensity of packaging box but also can better
protect the outermost LCD panel module.
[0017] A packaging method of LCD panel modules comprises the
following steps:
[0018] A: Inserting the LCD panel modules in a packaging box in the
mode that two display surfaces are opposite to each other, so that
the backplane surfaces of the LCD panel modules are opposite; the
distance between the display surfaces is less than the distance
between the backplane surfaces.
[0019] Preferably, in the step A, the LCD panel modules inserted in
opposite pairs are inserted by juxtaposing mutually with a
displacement on their planes.
[0020] When packaging the LCD panel modules, the relatively more
fragile display panels of the LCD panel modules are inserted into
two slots of a slot group in opposite pairs of the packaging box of
the present invention. Because the display surface of the LCD panel
is a smooth surface, the distance between two adjacent slots of a
slot group can be further reduced without worrying about that the
display panels are damaged by the impact from high intensity of
backplane with bumps.
BRIEF DESCRIPTION OF FIGURES
[0021] FIG. 1 is a structural diagram of a lower buffer module of
an LCD panel module packaging box of the present invention.
[0022] FIG. 2 is a structural diagram of an upper buffer module of
an LCD panel module packaging box of the present invention;
[0023] FIG. 3 is a structural diagram of an LCD panel module of the
present invention arranged in a lower buffer structure of a
packaging box;
[0024] FIG. 4 is a structural diagram of an assembly structure of a
packaging box of one embodiment of the present invention;
[0025] FIG. 5 is a structural diagram of an assembly structure of a
packaging box of another embodiment of the present invention;
[0026] FIG. 6 is a structural diagram of an assembly structure of
an L-shaped packaging box of one embodiment of the present
invention;
[0027] Wherein: 10. Lower buffer module; 20. Upper buffer module;
30. LCD panel module; 1. Positive slot; 2. Opposite slot; 3. Lug
boss; 5. Edge lug boss; 6. Backplane surface; 7. Display surface;
11. Lower buffer structure; 12. Side buffer structure; 13. Upper
buffer structure.
DETAILED DESCRIPTION
[0028] The present invention will further be described in detail in
accordance with the figures and the preferred embodiments.
[0029] An LCD panel module packaging box of one embodiment of the
present invention comprises a whole buffer structure or multiple
separated buffer structures. Multiple slot groups for inserting the
LCD panel modules are provided on the buffer structure. Each of the
slot groups comprises a pair of adjacent slots. The distance
between the two adjacent slots of each of the slot group is less
than the distance between the slot groups. The distance between the
slot groups corresponds to the total height of the bumps of the
backplanes of two LCD panel modules. The "corresponds to" refers to
that there is small but enough space to place the backplane between
adjacent slot groups so that the mutual collision of backplanes can
be avoided. An independent slot can be provided on the outside of
all slot groups located at the edge of the buffer structure. The
distance between the independent slot and an adjacent slot group
thereof corresponds to the total height of the bumps of the
backplanes of two LCD panel modules. This is another distribution
manner of the slots. When packaging the LCD panel modules, the
relatively more fragile display panels of the LCD panel module are
inserted in opposite pairs into two slots of a slot group of the
packaging box of the present invention. Because the display surface
of the LCD panel is a smooth surface, the distance between two
adjacent slots of a slot group can be further reduced without
worrying about that the display panels are damaged due to the
impact from the high intensity of backplanes with bumps during
transportation.
[0030] A method for packaging LCD panel modules using the packaging
box comprises the following steps: inserting the LCD panel modules
in the packaging box in the mode that two display surfaces are
opposite to each other, so that the backplane surfaces of the LCD
panel modules are opposite; the distance between the display
surfaces is less than the distance between the backplane
surfaces.
[0031] The adjacent slots of the two slot groups are juxtaposed
mutually with a displacement on their slot planes in groove
direction. The distance between the slot groups is less than the
total height of the bumps of the backplanes of the two LCD panel
modules and more than the height of the bump of a single backplane.
The displacement can be designed in accordance with specific
conditions of the bumps of the backplanes, so that the bumps of
corresponding backplanes of two LCD panel modules can be mutually
staggered, and the space formed by the corresponding backplane
surface has the same height as the bump of the backplane surface,
so that the bumps of the backplane surface of two adjacent LCD
panel modules can share the space. Thus, the gap between the LCD
panel modules is reduced, so that more LCD panel modules can be
arranged into the packaging box, and the packing rate of LCD panel
module is increased. Conventional mass-produced LCD panel modules
packaged in packaging boxes are neatly arranged in the same
direction, and the adjacent LCD panel modules cannot share the
space occupied by the bumps of the backplanes. If the bump of the
module backplane is apparently higher than the backplane surface,
the occupied space will be large accordingly and the packing rate
is low. If the backplane surfaces or the display surfaces of two
adjacent LCD panel modules are arranged oppositely so that the
space between two LCD panel modules is shared by the bumps of the
LCD panel modules, the distance between the two adjacent LCD panel
modules can be reduced. If two adjacent LCD panel modules are
staggered at a distance which equals to or is more than the width
of the bumps of the LCD panel modules, the distance between the LCD
panel modules can be further reduced. The slots of the buffer
structure of the LCD panel module packaging box are provided based
on the position arrangement of the LCD panel modules so that the
packing rate of the LCD panel module can be increased. However, if
the bumps of two adjacent backplanes are opposite, the distance
between the slot groups should be not less than the total height of
the bumps of the backplanes of two backlight modules so as to
protect the slot groups from being collided mutually.
[0032] The packaging box comprises a lower buffer structure and two
side buffer structures which are located on the two sides of the
lower buffer structure. The two side buffer structures are
respectively provided with side slots for receiving only one slot
of a slot group which is juxtaposed toward the side buffer
structure. This structure design is simple, convenient to process
and easy to package the LCD panel modules. The depth of the side
slots corresponds to the shifted distance of the slot on the lower
buffer structure. For the LCD panel modules which are inserted into
the packaging boxes in opposite pairs, they are inserted by
juxtaposing mutually with a displacement on their planes. In
addition, the packaging box can further comprise an upper buffer
structure.
[0033] FIGS. 1-3 show a preferred embodiment of the present
invention. FIG. 1 shows a lower buffer module 10 of an LCD panel
module 30 packaging box and FIG. 2 shows an upper buffer module 20
of the LCD panel module 30 packaging box (only one upper buffer
module 20 is shown in the figure, and the present invention
comprises two upper buffer modules 20; the other upper buffer
module 20 corresponds to the upper buffer module 20 shown in the
figure). The lower buffer module 10 comprises a lower buffer
structure 11 and two side buffer structures 12 arranged on the
lower buffer structure 11, and is concave as a whole. The upper
buffer module 20 comprises an upper buffer structure 13 and a side
buffer structure 12 which are integrally formed in an L-shaped
structure. The lower buffer structure 11 is provided with multiple
slot groups. As shown in the figure, a positive slot 1 and an
opposite slot 2 constitute a slot group. Slots corresponding to
those on the lower buffer structure 11 are arranged on the side
buffer structure 12; and the upper buffer module 20 is also
provided with slots corresponding to the slots. The slots are used
to fix the LCD panel module 30 in the packaging box. When two LCD
panel modules 30 are respectively inserted into the positive slot 1
and the opposite slot 2, the display surfaces 7 of the two LCD
panel modules 30 are opposite (as shown in FIG. 3).
[0034] Adjacent slots of the two slot groups are juxtaposed with a
displacement from each other in the slotted direction. The distance
between the slot groups is less than the total height of bump of
backplanes of the two LCD panel modules 30. The two side buffer
structures are respectively provided with side slots for receiving
only one slot of a slot group which is juxtaposed toward the side
buffer structure. The depth of the side slots corresponds to the
shifted distance of the slot on the lower buffer structure.
[0035] To save materials and facilitate the insertion of the LCD
panel module 30, partial materials on the slotted surface of the
lower buffer structure 11 can be removed, and the height of the
removed materials is at least lower than the slotted depth. So do
the side buffer structure 12 and upper buffer structure 13. As
shown in FIG. 1 and FIG. 2, partial materials are removed
vertically in the slotted direction to break up the slots.
[0036] A positive slot 1 and an opposite slot 2 adjacent thereto
form a slot group. The LCD panel module 30 packaging box comprises
multiple slot groups. Take the LCD panel module 30 packaging box as
shown in FIG. 1 to FIG. 4 as an example, totally four slot groups
are arranged on the LCD panel module 30 packaging box (the number
of the slot group can be adjusted in accordance with actual
demand). In the lower buffer structure as shown in FIG. 1, the
beginning end of the positive slot 1 starts at the interior of the
side buffer structure 12; and the beginning end of the opposite
slot 2 starts at the inner side of the side buffer structure 12.
There is a certain distance between the two beginning ends in the
slotted direction of slots. Correspondingly, there is also a
certain distance between the tail ends. The distance between the
beginning ends or tail ends of the positive slot 1 and opposite
slot 2 is more than the width of bump of the backplane 6 of LCD
panel module 30. Simultaneously, the distance between two adjacent
slot groups is more than the height of bump of backplane 6 of the
LCD panel module 30. As shown in FIG. 1, the width of a lug boss 3
between two adjacent slots in one slot group is less than that of
the lug boss 3 between two adjacent slot groups. The width of the
lug boss 3 between two adjacent slot groups is more than the height
of bump of backplane 6 of the LCD panel module 30 and less than the
total height of bumps of backplanes of the two LCD panel modules
30.
[0037] An edge lug boss 5 is arranged at edge of the slot groups of
the buffer structure. The distance between the edge lug boss 5 and
the outermost slot of the buffer structure is more than the height
of bump of the backplane. The design of the edge lug boss 5
increases the intensity of the packaging box and preferably
protects the outermost LCD panel module 30. Alternatively, an
independent slot (not shown in figures) can also be provided
outside the slot groups of LCD panel module 30 packaging box. The
distance between the independent slot and an adjacent slot group
thereof corresponds to the total height of bumps of backplanes of
two LCD panel modules 30, so that the display surface 7 of the LCD
panel module 30 is directed toward the outer side of the LCD panel
module 30 packaging box, and thus the width of the edge lug boss 5
can be reduced at discretion.
[0038] As shown in FIG. 3, a lower buffer module 10 of the LCD
panel module 30 packaging box comprises four slot groups with four
positive slots 1 and four positive slots 2 in total. When the LCD
panel module 30 is arranged, the display surface 7 of the LCD panel
module 30 of positive slot 1 is opposite to that of opposite slot 2
and the positions are mutually staggered at a certain distance. The
staggered distance is equal to the slotted depth of the positive
slot 1 on the side buffer structure 12. The slotted depth is more
than the width of the bump of the backplane 6 of the LCD panel
module 30, which staggers the bumps of corresponding backplanes of
two LCD panel modules 30. After LCD panel modules 30 are fully
provided with the lower buffer modules 10, as shown in FIG. 4, the
upper buffer modules 20 are inserted into corresponding positions
to completely protect LCD panel modules 30.
[0039] In addition, the upper buffer structure and the side buffer
structure can be integrally formed. As shown in FIG. 4, a packaging
box comprises the lower buffer module 10 and the upper buffer
module 20. The lower buffer module 10 is integrally formed by the
lower buffer structure 11 and the side buffer structure 12. The
upper buffer module 20 is integrally formed by the side buffer
structure 12 and the upper buffer structure 13. The packaging box
may not be provided with the upper buffer structure, as shown in
FIG. 5. The lower buffer module can be integrally formed by the
lower buffer structure 11 and the side buffer structure 12, and the
height of the side buffer structure 12 corresponds to that of the
built-in LCD panel modules 30.
[0040] The present invention is described in detail in accordance
with the above contents with the specific preferred embodiments.
However, this invention is not limited to the specific embodiments.
The LCD panel modules 30 packaging box only need to provide a space
for accommodating and fixing the LCD panel modules 30. Thus, the
lower buffer structure 11 and the two side buffer structures 12 on
both sides thereof can be integrally formed, or be mutually
separated, or be two separated L-shaped structures, or one L-shaped
(as shown in FIG. 6) structure. The lower buffer structure 11 and
the side buffer structures 12 which are correspondingly arranged on
both sides of the lower buffer structure 11 are integrally formed.
To protect the upper end of LCD panel modules 30, an upper buffer
structure 13 can be disposed. Slots of the upper buffer structure
13 are arranged corresponding to slots of the lower buffer
structure 11. The upper buffer structure 13 and two side buffer
structures 12 on both sides thereof can be integrally formed, or be
mutually separated, or be two separated L-shaped upper buffer
modules. Each upper buffer structure 13 and side buffer structures
correspondingly provided on both sides thereof are integrally
formed. For the ordinary technical personnel of the technical field
of the present invention, on the premise of keeping the conception
of the present invention, the technical personnel can also make
simple deductions or replacements, and all of which should be
considered to belong to the protection scope of the present
invention.
* * * * *