U.S. patent application number 13/683067 was filed with the patent office on 2013-03-28 for holding apparatus, exposure apparatus, exposure metod, and device manufacturing method.
This patent application is currently assigned to NIKON CORPORATION. The applicant listed for this patent is Nikon Corporation. Invention is credited to Hajime Yamamoto.
Application Number | 20130077080 13/683067 |
Document ID | / |
Family ID | 39511696 |
Filed Date | 2013-03-28 |
United States Patent
Application |
20130077080 |
Kind Code |
A1 |
Yamamoto; Hajime |
March 28, 2013 |
HOLDING APPARATUS, EXPOSURE APPARATUS, EXPOSURE METOD, AND DEVICE
MANUFACTURING METHOD
Abstract
A holding apparatus is provided with a holding member that has a
holding surface that holds a substrate on which a pattern is to be
formed, a plurality of first electrode members that are provided on
the holding member and that generate electrostatic force in
accordance with supplied voltage in order to attract the substrate
to the holding surface, and a power supply device that is able to
supply voltage to the first electrode members. The first electrode
members are positioned in accordance with pattern information.
Inventors: |
Yamamoto; Hajime; (Tokyo,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Nikon Corporation; |
Tokyo |
|
JP |
|
|
Assignee: |
NIKON CORPORATION
Tokyo
JP
|
Family ID: |
39511696 |
Appl. No.: |
13/683067 |
Filed: |
November 21, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12049973 |
Mar 17, 2008 |
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13683067 |
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60907051 |
Mar 19, 2007 |
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Current U.S.
Class: |
355/72 ;
355/77 |
Current CPC
Class: |
G03F 7/70733 20130101;
G03F 7/707 20130101; G03F 7/70875 20130101; G03F 7/70783 20130101;
G03F 7/70708 20130101 |
Class at
Publication: |
355/72 ;
355/77 |
International
Class: |
G03F 7/20 20060101
G03F007/20 |
Claims
1-19. (canceled)
20. A holding apparatus comprising: a holding member that has a
holding surface, the holding surface holding a substrate on which a
pattern is to be formed; a plurality of first electrode members
that are provided on the holding member and that are arranged in
accordance with pattern information relating to the pattern, and
that generate electrostatic force in accordance with supply of a
voltage in order to attract the substrate to the holding surface;
and a moving mechanism that, after a pattern has been formed on the
substrate, moves the holding member and the substrate relative to
each other such that the holding surface and the substrate are
separated from each other.
21. The holding apparatus according to claim 20, wherein the moving
mechanism starts a relative movement between the holding member and
the substrate such that one portion of the substrate becomes
separated first from the holding surface before other portions of
the substrate.
22. The holding apparatus according to claim 20, wherein after
voltage has been supplied to the plurality of first electrode
members and the substrate has been made to attract to the holding
surface, the stopping of the supply of voltage to the plurality of
first electrode members is carried out in a predetermined sequence,
and the moving mechanism starts a relative movement between the
holding member and the substrate such that a portion of the
substrate that corresponds to the first electrode members where the
supplying of voltage was stopped first becomes separated first from
the holding surface.
23. The holding apparatus according to claim 20, wherein after
voltage has been supplied to the plurality of first electrode
members and the substrate has been made to attract to the holding
surface, the value of the voltage that is supplied to each one of
the first electrode members is sequentially reduced, and the moving
mechanism starts a relative movement between the holding member and
the substrate such that a portion of the substrate that corresponds
to the first electrode members where the voltage value was reduced
first among the plurality of the first members becomes separated
first from the holding surface.
24. The holding apparatus according to claim 20, wherein the moving
mechanism comprises a supporting member that is capable of moving
while supporting a predetermined area of a rear surface of the
substrate.
25. The holding apparatus according to claim 23, further comprising
a second electrode member that is provided on the supporting
member, and that generates electrostatic field in accordance with
supply of a voltage in order to attract the substrate to the
holding surface.
26. The holding apparatus according to claim 20, wherein the moving
mechanism comprises a transporting member that transports the
substrate away from the holding member.
27. The holding apparatus according to claim 20, further comprising
an antistatic device that removes electrostatic charge on the
substrate when the holding member and the substrate are being
separated from each other.
28. The holding apparatus according to claim 27, wherein the moving
mechanism comprises a grounded conductive member that is capable of
moving while supporting the substrate, and the antistatic device
comprises the conductive member.
29. The holding apparatus according to claim 28, wherein the moving
mechanism starts a movement of the substrate relative to the
holding member such that one portion of the substrate becomes
separated first from the holding surface before other portions of
the substrate, and the conductive member supports the one portion
of the substrate.
30. A holding apparatus comprising: a holding member that has a
holding surface that holds a substrate; at least one first
electrode member that is provided on the holding member, and that
generates electrostatic field in accordance with supply of a
voltage in order to attract the substrate to the holding surface;
and a moving mechanism that has a supporting surface that supports
the substrate and that comprises a moving member that moves the
substrate relative to the holding member while supporting a
predetermined area of the substrate such that the holding surface
and the substrate are separated from each other, and a second
electrode member that is provided on the moving member, and that
generates electrostatic field in accordance with supply of a
voltage in order to attract the substrate to the supporting
surface.
31. The holding apparatus according to claim 30, wherein, after the
supply of voltage has been stopped to at least the one first
electrode member, the moving mechanism starts the movement of the
substrate.
32. The holding apparatus according to claim 30, wherein the
holding member comprises a plurality of the first electrode
members, and after voltage has been supplied to the plurality of
first electrode members and the substrate has been made to attract
to the holding surface, the stopping of the supply of voltage to
the plurality of the first electrode members is carried out in a
predetermined sequence, and the moving mechanism starts a movement
of the substrate relative to the holding member such that a portion
of the substrate that corresponds to the first electrode members
where the supplying of voltage was stopped first among the
plurality of the first electrode members becomes separated first
from the holding surface.
33. The holding apparatus according to claim 30, wherein the
holding member comprises a plurality of the first electrode
members, and after voltage has been supplied to the plurality of
first electrode members and the substrate has been made to attract
to the holding surface, the value of the voltage that is supplied
to each one of the first electrode members is sequentially reduced,
and the moving mechanism starts a movement of the substrate
relative to the holding member such that one portion of the
substrate that corresponds to the first electrode members where the
voltage value was reduced first among the plurality of the first
members becomes separated first from the holding surface.
34. The holding apparatus according to claim 30, wherein the moving
mechanism comprises a plurality of the moving members, and the
second electrode member is provided on at least one of the
plurality of the moving members.
35. The holding apparatus according to claim 34, further comprising
a grounded conductive member that is provided on the moving member,
which is different from the moving member on which the second
electrode member is provided, and that removes electrostatic charge
on the substrate when the holding member and the substrate are
being separated from each other.
36. A holding apparatus comprising: a holding member that has a
holding surface that holds a substrate; an electrode member that is
provided on the holding member and generate electrostatic force in
order to attract the substrate to the holding surface; a moving
mechanism that moves the substrate and the holding member
relatively to each other such that the holding surface and the
substrate are separated from each other; and an antistatic device
that removes electrostatic charge on the substrate when the holding
member and the substrate are being separated from each other.
37. The holding apparatus according to claim 36, wherein the moving
mechanism comprises a plurality of supporting members that are
provided on the holding portion and that are capable of moving
while supporting predetermined areas of the rear surface of the
substrate, and at least one of the supporting members comprises a
grounded conductive member, and the antistatic device comprises the
conductive member.
38. The holding apparatus according to claim 37, wherein the moving
mechanism starts a movement of the substrate relative to the
holding member such that one portion of the substrate becomes
separated first from the holding surface before other portions of
the substrate, and the conductive member supports the one portion
of the substrate.
39-49. (canceled)
50. An exposure method for exposing a substrate with exposure light
from a pattern, the method comprising: mounting the substrate on a
holding surface of a holding member on which a plurality of first
electrode members are provided; supplying voltage to the first
electrode members in order to attract the substrate to the holding
surface by electrostatic force sequentially irradiating shot areas
on the substrate with exposure light from the pattern, separating
the substrate on which the pattern has been formed from the holding
surface, wherein the value of a first voltage that is supplied to
the first electrode members, which correspond to shot areas where
the irradiation of the exposure light has not yet been formed and
where the irradiation of the exposure light is currently underway,
is higher than the value of a second voltage that is supplied to
the first electrode members, which are different from the first
electrode members to which the first voltage is supplied; and
separating the substrate on which the pattern has been formed from
the holding surface, wherein a relative movement between the
holding member and the substrate is started such that one portion
of the substrate becomes separated first from the holding surface
before other portions of the substrate.
51. The exposure method according to claim 50, wherein after
voltage has been supplied to the plurality of first electrode
members and the substrate has been made to attract to the holding
surface, the stopping of the supply of voltage to the plurality of
first electrode members is carried out in a predetermined sequence,
and a relative movement between the holding member and the
substrate is started such that a portion of the substrate that
corresponds to the first electrode members where the supplying of
voltage was stopped first among the plurality of first electrode
members becomes separated first from the holding surface.
52. The exposure method according to claim 50, wherein after
voltage has been supplied to the plurality of first electrode
members and the substrate has been made to attract to the holding
surface, the value of the voltage that is supplied to each one of
the plurality of first electrode members is sequentially reduced,
and a relative movement between the holding member and the
substrate is started such that a portion of the substrate that
corresponds to the first electrode members where the voltage value
was reduced first among the plurality of the first electrode
members becomes separated first from the holding surface.
53. The exposure method according to claim 50, wherein
electrostatic charge on the substrate is removed when the holding
member and the substrate are being separated from each other.
54. An exposure method for exposing a substrate with exposure
light, the method comprising: mounting the substrate on a holding
surface of a holding member on which a first electrode member is
provided; supplying voltage to the first electrode member in order
to attract the substrate to the holding surface by electrostatic
force; exposing the substrate by irradiating exposure light onto
the substrate while the substrate is being held on the holding
surface; and separating the exposed substrate and the holding
surface, wherein voltage is supplied to a second electrode member
that is provided on a moving member which has a supporting surface
which is capable of supporting the substrate in order to attract
the substrate to the supporting surface by means of electrostatic
force, and, when the supporting surface and the substrate are
attracted together by electrostatic force, the substrate and the
holding surface are separated by moving the moving member.
55. The exposure method according to claim 54, wherein the moving
member is moved such that one portion of the substrate becomes
separated first from the holding surface before other portions of
the substrate.
56. An exposure method for exposing a substrate with exposure
light, the method comprising: mounting the substrate on a holding
surface of a holding member on which a first electrode member is
provided; supplying voltage to the first electrode member in order
to attract the substrate to the holding surface by means of
electrostatic force; exposing the substrate by irradiating exposure
light onto the substrate while the substrate is being held on the
holding surface; and separating the exposed substrate and the
holding surface, wherein electrostatic charge on the substrate is
removed when the holding member and the substrate are being
separated from each other.
57. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is non-provisional application claiming
benefit of provisional application No. 60/907,051, filed Mar. 19,
2007, the contents of which are incorporated herein by
reference.
BACKGROUND
[0002] 1. Field of the Invention
[0003] The present invention relates to a holding apparatus that
holds a substrate, an exposure apparatus that exposes a substrate,
an exposure method, and a device manufacturing method.
[0004] 2. Description of Related Art
[0005] A semiconductor device manufacturing apparatus is provided
with a holding apparatus that holds a substrate on which a device
is being manufactured. For example, EUV apparatuses and CVD
apparatuses are provided with a holding apparatus that holds a
substrate using static electricity such as that disclosed in U.S.
Pat. No. 5,708,856.
[0006] In a manufacturing apparatus, an operation to transport a
substrate onto a holding apparatus, an operation to hold the
transported substrate on the holding apparatus, and an operation to
transport the substrate away from the holding apparatus are
executed. In order to manufacture a superior device with excellent
productivity, it is desirable for the holding apparatus to be able
to execute the above described operations rapidly and efficiently.
In a holding apparatus that uses static electricity, if, for
example, there are delays in an operation to transport a substrate
away which are caused by static electricity, there is a possibility
that there will be a deterioration in device productivity.
Moreover, when a substrate is being transported onto the holding
apparatus, if the substrate shifts from a desired position, or when
the substrate is being transported away from the holding apparatus,
if a load is applied to the substrate, there is a possibility that
the performance of the device being manufactured will
deteriorate.
[0007] A purpose of some aspects illustrating the present invention
is to provide a holding apparatus that is capable of rapidly
executing at least one of an operation to transport in a substrate,
an operation to hold a substrate, and an operation to transport a
substrate away, and that is capable of contributing to an
improvement in device productivity. Another purpose is to provide
an exposure apparatus and an exposure method that are capable of
contributing to an improvement in productivity using this holding
apparatus. Further another purpose is to provide a device
manufacturing method that uses this exposure apparatus and exposure
method.
SUMMARY
[0008] In accordance with a first aspect illustrating the present
invention, there is provided a holding apparatus that includes: a
holding member that has a holding surface, the holding surface
holding a substrate on which a pattern is to be formed; a plurality
of first electrode members that are provided on the holding member
and that are arranged in accordance with pattern information
relating to the pattern, and that generate electrostatic force in
accordance with supply of a voltage in order to attract the
substrate to the holding surface.
[0009] According to the first aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0010] In accordance with a second aspect illustrating the present
invention, there is provided a holding apparatus that includes: a
holding member that has a holding surface, the holding surface
holding a substrate on which a pattern is to be formed; a plurality
of first electrode members that are provided on the holding member,
and that generate electrostatic field in accordance with supply of
a voltage in order to attract the substrate to the holding surface;
and a power supply device that is capable of regulating the voltage
in accordance with pattern information relating to the pattern.
[0011] According to the second aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0012] In accordance with a third aspect illustrating the present
invention, there is provided a holding apparatus that includes: a
holding member that has a holding surface that holds a substrate;
at least one first electrode member that is provided on the holding
member, and that generates electrostatic field in accordance with
supply of a voltage in order to attract the substrate to the
holding surface; and a moving mechanism that has a supporting
surface that supports the substrate and that comprises a moving
member that moves the substrate relative to the holding member
while supporting a predetermined area of the substrate such that
the holding surface and the substrate are separated from each
other, and a second electrode member that is provided on the moving
member, and that generates electrostatic field in accordance with
supply of a voltage in order to attract the substrate to the
supporting surface.
[0013] According to the third aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0014] In accordance with a fourth aspect illustrating the present
invention, there is provided a holding apparatus that includes: a
holding member that has a holding surface that holds a substrate;
an electrode member that is provided on the holding member and
generate electrostatic force in order to cause the substrate to
adhere to the holding surface; a moving mechanism that moves the
substrate and the holding member relatively to each other such that
the holding surface and the substrate are separated from each
other; and an antistatic device that removes electrostatic charge
on the substrate when the holding member and the substrate are
being separated from each other.
[0015] According to the fourth aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0016] In accordance with a fifth aspect illustrating the present
invention, there is provided an exposure apparatus that exposes a
substrate with exposure light from a pattern, wherein, in order to
hold a substrate onto which the exposure light has been irradiated,
there is provided the holding apparatus according to the above
described aspects.
[0017] According to the fifth aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0018] In accordance with a sixth aspect illustrating the present
invention, there is provided a device manufacturing method that
includes exposing a substrate using the exposure apparatus
according to the above described aspects, and developing the
exposed substrate.
[0019] According to the sixth aspect, it is possible to manufacture
a device using an exposure apparatus that is able to contribute to
an improvement in device productivity while preventing any
deterioration in the device performance.
[0020] In accordance with a seventh aspect illustrating the present
invention, there is provided an exposure method for exposing a
substrate with exposure light from a pattern, the method includes:
mounting the substrate on a holding surface of a holding member on
which a plurality of first electrode members are provided;
supplying voltage to the first electrode members in order to cause
the substrate to adhere to the holding surface by means of
electrostatic force; and irradiating the substrate with the
exposure light from the pattern, wherein the value of a first
voltage that is supplied to the first electrode members, which
correspond to an area on the substrate where the irradiation of the
exposure light is currently underway, is higher than the value of a
second voltage that is supplied to at least a part of remaining
portion of the first electrode members.
[0021] According to the seventh aspect, it is possible to
contribute to an improvement in device productivity while
preventing any deterioration in the device performance.
[0022] In accordance with an eighth aspect illustrating the present
invention, there is provided an exposure method for exposing a
substrate with exposure light from a pattern, the method includes:
mounting the substrate on a holding surface of a holding member on
which a plurality of first electrode members are provided;
supplying voltage to the first electrode members in order to cause
the substrate to adhere to the holding surface by means of
electrostatic force; and sequentially irradiating shot areas on the
substrate with exposure light from the pattern, wherein the value
of a first voltage that is supplied to the first electrode members,
which correspond to shot areas where the irradiation of the
exposure light has not yet been formed and where the irradiation of
the exposure light is currently underway, is higher than the value
of a second voltage that is supplied to the first electrode
members, which are different from the first electrode members to
which the first voltage is supplied.
[0023] According to the eighth aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0024] In accordance with a ninth aspect illustrating the present
invention, there is provided an exposure method for exposing a
substrate with exposure light which includes: mounting the
substrate on a holding surface of a holding member on which a first
electrode member is provided; supplying voltage to the first
electrode member in order to cause the substrate to adhere to the
holding surface by means of electrostatic force; exposing the
substrate by irradiating exposure light onto the substrate while it
is being held on the holding surface; and separating the exposed
substrate and the holding surface, wherein voltage is supplied to a
second electrode member that is provided on a moving member which
has a supporting surface which is able to support the substrate in
order to cause the substrate to adhere to the supporting surface by
means of electrostatic force, and, when the supporting surface and
the substrate are adhered together by means of electrostatic force,
the substrate and the holding surface are separated by moving the
moving members.
[0025] According to the ninth aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0026] In accordance with a tenth aspect illustrating the present
invention, there is provided an exposure method for exposing a
substrate with exposure light which includes: mounting the
substrate on a holding surface of a holding member on which a first
electrode member is provided; supplying voltage to the first
electrode member in order to cause the substrate to adhere to the
holding surface by means of electrostatic force; exposing the
substrate by irradiating exposure light onto the substrate while it
is being held on the holding surface; and separating the exposed
substrate and the holding surface, wherein electrostatic charge on
the substrate is removed when the holding member and the substrate
are being separated from each other.
[0027] According to the tenth aspect, it is possible to contribute
to an improvement in device productivity while preventing any
deterioration in the device performance.
[0028] In accordance with an eleventh aspect illustrating the
present invention, there is provided a device manufacturing method
that includes exposing a substrate using the exposure method
according to the above described aspects, and developing the
exposed substrate.
[0029] According to the eleventh aspect, it is possible to
manufacture a device using an exposure apparatus that is able to
contribute to an improvement in device productivity while
preventing any deterioration in the device performance.
[0030] According to some aspects illustrating the present
invention, it is possible to execute at least one of an operation
to transport in a substrate, an operation to hold a substrate, and
an operation to transport a substrate away and the like, so that it
is possible to manufacture a device with excellent
productivity.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1 is a typical view showing an example of an exposure
apparatus according to a first embodiment.
[0032] FIG. 2 is a plan view showing a portion of a substrate stage
according to the first embodiment.
[0033] FIG. 3 is a side view showing a portion of the substrate
stage according to the first embodiment.
[0034] FIG. 4 is a side cross-sectional view showing a portion of
the substrate stage according to the first embodiment.
[0035] FIG. 5 is a plan view in order to illustrate a first and
second supporting member according to the first embodiment.
[0036] FIG. 6 is a typical view showing a relationship between a
holding member and shot areas on a substrate.
[0037] FIG. 7A is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0038] FIG. 7B is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0039] FIG. 7C is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0040] FIG. 8 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0041] FIG. 9 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0042] FIG. 10 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0043] FIG. 11 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0044] FIG. 12A is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0045] FIG. 12B is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0046] FIG. 12C is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0047] FIG. 13 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the first
embodiment.
[0048] FIG. 14 is a view in order to illustrate an example of an
operation of an exposure apparatus according to a second
embodiment.
[0049] FIG. 15 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the second
embodiment.
[0050] FIG. 16 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the second
embodiment.
[0051] FIG. 17 is a view in order to illustrate an example of an
operation of an exposure apparatus according to a third
embodiment.
[0052] FIG. 18 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the third
embodiment.
[0053] FIG. 19 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the third
embodiment.
[0054] FIG. 20 is a view in order to illustrate an example of an
operation of an exposure apparatus according to a fourth
embodiment.
[0055] FIG. 21 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the fourth
embodiment.
[0056] FIG. 22 is a view in order to illustrate an example of an
operation of the exposure apparatus according to the fourth
embodiment.
[0057] FIG. 23 is a plan view showing a portion of a substrate
stage according to a fifth embodiment 1.
[0058] FIG. 24 is a view in order to illustrate an example of an
operation of an exposure apparatus according to the fifth
embodiment.
[0059] FIG. 25 is a view in order to illustrate an example of an
operation of an exposure apparatus according to the fifth
embodiment.
[0060] FIG. 26 is a view in order to illustrate an example of an
operation of an exposure apparatus according to a sixth
embodiment.
[0061] FIG. 27 is a view in order to illustrate an example of an
operation of an exposure apparatus according to the sixth
embodiment.
[0062] FIG. 28 is a perspective view showing an example of a moving
mechanism according to a seventh embodiment.
[0063] FIG. 29 is a view in order to illustrate an example of an
operation of the moving mechanism according to the seventh
embodiment.
[0064] FIG. 30 is a flowchart showing an example of a micro device
manufacturing processes.
DESCRIPTION OF EMBODIMENTS
[0065] Embodiments of the present invention are described by
providing examples with reference made to the drawings, however,
the present invention is not limited to these embodiments. Note
that in the description below, an XYZ rectangular coordinate system
is set, and positional relationships between respective components
are described with reference made to this XYZ rectangular
coordinate system. A predetermined direction within a horizontal
plane is taken as an X axial direction, a direction which is
orthogonal to the X axial direction within the horizontal plane is
taken as a Y axial direction, while a direction which is orthogonal
to both the X axial direction and the Y axial direction (namely, a
vertical direction) is taken as a Z axial direction. Moreover,
rotation (i.e., tilt) directions around the X axis, the Y axis, and
the Z axis are taken respectively as .theta.X, .theta.Y, and
.theta.Z directions.
First Embodiment
[0066] A first embodiment will now be described. FIG. 1 is a
schematic structural view showing an exposure apparatus EX
according to the first embodiment. In FIG. 1, the exposure
apparatus EX is provided with a mask stage 1 that is capable of
moving while holding a mask M on which a predetermined pattern has
been formed, a substrate stage 2 which is capable of moving while
holding a substrate P on which a pattern has been formed, an
interferometric system 16 which measures positional information of
the respective stages, an illumination optical system IL which
illuminates the mask M held on the mask stage 1 with exposure light
EL, a projection optical system PL which projects an image of the
pattern on the mask M which is being illuminated by the exposure
light EL onto the substrate P, a chamber apparatus (a vacuum
chamber) 6 which has a vacuum system which maintains in a vacuum
state at least a predetermined space through which the exposure
light EL is transmitted, and a control unit 5 which controls the
overall operations of the exposure apparatus EX. The vacuum system
maintains a vacuum in internal space of the chamber apparatus 6. An
input device 7 which is capable of inputting various signals and
information relating to exposure, and a storage device 8 which
stores various information relating to exposure are connected to
the control unit 5. The input device 7 may be, for example, a
keyboard, a touch panel, a mouse, or the like. The substrate P may
be a substrate which has a film of photosensitive material (i.e.,
resist) or the like formed on one surface of a base material such
as a semiconductor wafer. The mask M may be a reticle on which a
device pattern which is to be projected onto the substrate P is
formed.
[0067] The exposure apparatus EX of the present embodiment is an
EUV exposure apparatus that exposes the substrate P using extreme
ultraviolet light. Extreme ultraviolet light is formed by
electromagnetic waves of, for example, approximately 5 to 50 nm in
the soft X-ray region. In the description below, extreme
ultraviolet light is referred to as EUV light where this is
appropriate.
[0068] In the present embodiment, the mask is a reflective mask
having a multilayer film that is capable of reflecting EUV light.
The exposure apparatus EX illuminates a surface (i.e., a reflective
surface) of a mask M on which a pattern has been formed in the
multilayer film using exposure light (i.e., EUV light) EL, so as to
expose the photosensitive substrate P with the exposure light EL
reflected by the mask M. The exposure light (i.e., EUV light) EL is
irradiated in a vacuum state (for example, in a reduced pressure
atmosphere of approximately 10.sup.-4 Pa) onto each optical element
of the mask M, the substrate P, and the illumination optical system
IL, and onto each optical element of the projection optical system
PL.
[0069] The exposure apparatus EX of the present embodiment is what
is known as a scanning stepper which is a scanning type of exposure
apparatus that projects an image of the pattern on the mask M onto
the substrate P while moving the mask M and the substrate P in
synchronization in a predetermined direction. In the present
embodiment, the scanning direction of the substrate P (i.e., the
direction of the synchronized movement) is set to the Y axial
direction, while the scanning direction of the mask M (i.e., the
direction of the synchronized movement) is also set to the Y axial
direction. At the same time as the exposure apparatus EX moves the
substrate P in the Y axial direction relative to a projection
region PR of the projection optical system PL and, in
synchronization with this movement of the substrate P in the Y
axial direction, moves the mask M in the Y axial direction relative
to the illumination region IR of the illumination optical system
IL, it also illuminates the mask M with the exposure light EL, and
irradiates the exposure light EL from the mask M onto the substrate
P so as to expose the substrate P.
[0070] The illumination optical system IL includes a plurality of
optical elements IR.sub.1 to IR.sub.4, and illuminates a
predetermined illumination region IR on the mask M with exposure
light EL which has a uniform illuminance distribution. The optical
elements IR.sub.1 to IR.sub.4 may be multilayer film reflecting
mirrors which are provided with a multilayer film capable of
reflecting EUV light. The multilayer film of the optical elements
IR.sub.1 to IR.sub.4 may be, for example, a Mo/Si multilayer film.
The respective optical elements IR.sub.1 to IR.sub.4 are held in a
lens barrel (not shown).
[0071] The illumination optical system IL illuminates the mask M
with exposure light EL from a light source 4. The light source 4 of
the present embodiment is a laser excitation type of plasma light
source, and includes a housing 9, a laser device 10 that irradiates
laser light, and a supply component 11 that supplies a target
material such as xenon gas or the like to the interior of the
housing 9. Laser light that is irradiated from the laser device 10
and condensed by a condensing optical system 12 is irradiated onto
the target material that is discharged from a distal end of the
supply component 11. The target material onto which the laser light
is irradiated changes into plasma and generates light (i.e., the
exposure light EL) that includes EUV light. The light that is
generated at the distal end of the supply component 11 is condensed
by a condenser 13. Light that has passed through the condenser 13
enters into a collimator mirror 14 that is placed on the outer side
of the housing 9. Note that the light source 4 may be an electrical
discharge type of plasma light source or maybe another type of
light source.
[0072] The mask stage 1 is a six degrees of freedom stage which is
capable of moving in six directions, namely, in the X axial
direction, the Y axial direction, the Z axial direction, the
.theta.X direction, the .theta.Y direction, and the .theta.Z
direction while holding the mask M. In the present embodiment, the
mask stage 1 holds a mask M such that the reflective surface of the
mask M is substantially parallel with the XY plane. Moreover, in
the present embodiment, the mask stage 1 holds the mask M such that
the reflective surface of the mask M faces in the -Z direction.
Positional information of the mask stage 1 (i.e., the mask M) is
measured by a laser interferometer 16M of the interferometric
system 16. The laser interferometer 16M measures positional
information for the mask stage 1 in the X axial, Y axial, and
.theta.Z directions using a measuring mirror 1R which is provided
on the mask stage 1. Moreover, surface position information (i.e.,
position information relating to the Z axial, the .theta.X, and the
.theta.Y directions) for the reflective surface of the mask M which
is held on the mask stage 1 is detected by a focusing and leveling
detection system (not shown). The control unit 5 controls the
position of the mask M which is held on the mask stage 1 based on
measurement results from the laser interferometer 16M and on
detection results from the focusing and leveling detection
system.
[0073] The projection optical system PL includes a plurality of
optical elements PR.sub.1 to PR.sub.4, and projects an image of the
pattern on the mask M onto the substrate P at a predetermined
projection magnification. The optical elements PR.sub.1 to PR.sub.4
may be multilayer film reflecting mirrors that are provided with a
multilayer film capable of reflecting EUV light. The multilayer
film of the optical elements PR.sub.1 to PR.sub.4 may be, for
example, a Mo/Si multilayer film. The respective optical elements
PR.sub.1 to PR.sub.4 are held in a lens barrel (not shown).
Moreover, in the present embodiment, the respective optical
elements PR.sub.1 to PR.sub.4 of the projection optical system PL
are housed in a dedicated vacuum chamber (lens barrel) 15. Note
that it is not necessary for this dedicated vacuum chamber to be
provided.
[0074] The substrate stage 2 includes a holding member 20 that has
a holding surface 19 that holds a substrate P on which a pattern is
formed as a result of exposure light EL from the pattern on the
mask M being irradiated thereon, and a stage body 21 that supports
the holding member 20. The substrate stage 2 is able to move in the
X axial direction, the Y axial direction, the Z axial direction,
the .theta.X direction, the .theta.Y direction, and the AZ
direction while holding a substrate P by means of the holding
member 20. In the present embodiment, the substrate stage 2 holds
the substrate P such that a surface of the substrate (i.e., an
exposure surface) is substantially parallel with the XY plane.
Moreover, in the present embodiment, the substrate stage 2 holds
the substrate P such that the surface of the substrate P faces in
the +Z direction. Positional information of the substrate stage 2
(i.e., the substrate P) is measured by a laser interferometer 16P
of the interferometric system 16. The laser interferometer 16P
measures positional information for the substrate stage 2 in the X
axial, Y axial, and .theta.Z directions using a measuring mirror
21R which is provided on the substrate stage 2. Moreover, surface
position information (i.e., position information relating to the Z
axial, the .theta.X, and the .theta.Y directions) for the surface
of the substrate P which is held on the substrate stage 2 is
detected by a focusing and leveling detection system (not shown).
The control unit 5 controls the position of the substrate P which
is held on the substrate stage 2 based on measurement results from
the laser interferometer 16P and on detection results from the
focusing and leveling detection system.
[0075] In the present embodiment, in order to expose the substrate
P with exposure light EL from the pattern on the mask M, as is
shown in FIG. 1, the mask M is held on the mask stage 1, and the
substrate P is held on the holding member 20 of the substrate stage
2. The mask M that is held on the mask stage 1 is illuminated by
exposure light (i.e., EUV light) EL that has been emitted from the
light source 4 and has passed through the illumination optical
system IL. The exposure light EL emitted from the illumination
optical system IL is incident on the reflective surface of the mask
M. Exposure light EL that is irradiated onto the reflective surface
of the mask M and is then reflected by this reflective surface is
incident on the projection optical system PL from the object
surface side of the projection optical system PL. Exposure light EL
that is incident on the projection optical system PL via the object
surface side of the projection optical system PL is emitted onto
the image surface side of the projection optical system PL, and is
then irradiated onto the surface (i.e., the exposure surface) of
the substrate P. As a result, the image of the pattern on the mask
M that has been illuminated by the exposure light EL is projected
via the projection optical system PL onto the photosensitive
substrate P, thereby exposing the substrate P. In this manner, as a
result of exposure light EL from the pattern on the mask M being
irradiated onto the substrate P via the projection optical system
PL, a pattern is formed on the substrate P.
[0076] FIG. 2 is a plan view showing a portion of the substrate
stage 2, while FIG. 3 is a side view showing a portion of the
substrate stage 2. In FIG. 2 and FIG. 3, the substrate stage 2 has
the holding member 20 which has the holding surface 19 that holds
the substrate P on which a pattern is formed. In the present
embodiment, the holding surface 19 is placed so as to be
substantially parallel with the XY plane. Moreover, the holding
surface 19 is placed so as to face in the +Z direction.
[0077] The substrate P has a rear surface that faces the holding
surface 19, and the holding surface 19 holds the rear surface of
the substrate P. The rear surface of the substrate P is the surface
on the opposite side from the surface where the exposure light EL
is irradiated. As is described above, the substrate P may be one in
which a film of a photosensitive material (i.e., resist) or the
like is formed on one surface (i.e., a surface onto which the
exposure light is irradiated) of a base material such as a
semiconductor wafer and the like. In the present embodiment, the
outer shape of the holding surface 19 is substantially the same as
the outer shape of the rear surface of the substrate P.
[0078] The holding member 20 of the present embodiment includes an
electrostatic chuck mechanism, and the holding surface 19 holds the
rear surface of the substrate P using electrostatic force. For
example, a dual stage formed by a coarse movement stage and a fine
movement stage can be used for the substrate stage 2. In the
present embodiment, the holding member 20 is mounted on top of the
fine movement stage (not shown). A plurality of electrode members 3
are provided on the holding member 20. The electrode members 3
generate electrostatic force that is used to suction a substrate P
onto the holding surface 19 in accordance with voltage which is
applied thereto. That is, the voltage applied electrode members 3
generate electrostatic field under which the substrate P can be
attracted to the holding surface 19. In the present embodiment, a
power supply device 22 that is capable of applying a predetermined
voltage to the electrode members 3 is provided on the substrate
stage 2. The power supply device 22 may be placed at the outer side
of the vacuum chamber 6, or a different position from the substrate
stage 2 on the inner side of the vacuum chamber 6. The power supply
device 22 is electrically connected by electrical wiring to the
electrode members 3. Each of the plurality of electrode members 3
has a predetermined shape and is placed in a predetermined position
on the holding member 20.
[0079] The holding member 20 of the present embodiment is formed
from an insulating material such as low-expansion ceramics. At
least a portion of the holding member 20 functions as a dielectric
substance for the electrostatic chuck mechanism. The electrode
members 3 are placed inside the holding member 20. The holding
surface 19 is formed from an insulating material such as the
aforementioned low-expansion ceramics.
[0080] Because the holding member 20 is a low-expansion material,
thermal deformation of the holding member 20, and consequent
deformation of the held substrate P is restricted. Moreover, when
measurement marks or measurement components or the like are
provided on the holding member 20, deformation all of these
measurement marks and measurement components is restricted.
[0081] The electrostatic chuck mechanism of the present embodiment
has what is known as a bipolar system, and includes electrode
members 3 to which a positive potential is applied by the power
supply device 22 and electrode members 3 to which a negative
potential is applied by the power supply device 22.
[0082] In the description below, of the plurality of electrode
members 3, the electrode members 3 to which a positive potential is
applied are suitably referred to as positive electrodes 31, while
the electrode members 3 to which a negative potential is applied
are suitably referred to as negative electrodes 32.
[0083] A plurality of the positive electrodes 31 are provided, and
a plurality of negative electrodes 32 are provided so as to
correspond to the positive electrodes 31. As is shown in FIG. 2 and
FIG. 3, in the present embodiment, nine positive electrodes 31 (31A
to 31I) and nine negative electrodes 32 (32A to 32I), which
correspond respectively to the nine positive electrodes 31 (31A to
31I), are provided on the holding member 20.
[0084] As is shown in FIG. 2, in the present embodiment, the
plurality of positive electrodes 31 are located in an area on the
-X side of the center of the holding surface 19, while the
plurality of negative electrodes 32 are located in an area on the
+X side thereof.
[0085] In addition, the plurality of positive electrodes 31 extend
in the Y axial direction in the area on the -X side of the center
of the holding surface 19. The plurality of negative electrodes 32
extend in the Y axial direction in the area on the +X side of the
center of the holding surface 19.
[0086] In the description given below, of the plurality of positive
electrodes 31 that extend in the Y axial direction, the positive
electrode 31 that is closest to the edge on the -Y side of the
holding surface 19 is suitably referred to as a first positive
electrode 31A, while the positive electrode 31 that is the next
closest to the edge on the -Y side of the holding surface 19 after
the first positive electrode 31A is referred to as a second
positive electrode 31B. In addition, of the plurality of positive
electrodes 31, the third, fourth, . . . , up to the eighth positive
electrode in sequence in the +Y direction from the second positive
electrode 31B are referred to as a third positive electrode 31C, a
fourth positive electrode 31D, . . . , up to an eighth positive
electrode 31H, while the positive electrode 31 that is closest to
the edge on the +Y side of the holding surface 19 is suitably
referred to as a ninth positive electrode 31I.
[0087] In the description given below, of the plurality of negative
electrodes 32 that extend in the Y axial direction, the negative
electrode 32 that is closest to the edge on the -Y side of the
holding surface 19 is suitably referred to as a first negative
electrode 32A, while the negative electrode 32 that is the next
closest to the edge on the -Y side of the holding surface 19 after
the first negative electrode 32A is referred to as a second
negative electrode 32B. In addition, of the plurality of negative
electrodes 32, the third, fourth, . . . , up to the eighth negative
electrode in sequence in the +Y direction from the second negative
electrode 32B are referred to as a third negative electrode 32C, a
fourth negative electrode 32D, . . . , up to an eighth negative
electrode 32H, while the negative electrode 32 that is closest to
the edge on the +Y side of the holding surface 19 is suitably
referred to as a ninth negative electrode 32I.
[0088] The first positive electrode 31A and the first negative
electrode 32A are positioned facing each other in the X axial
direction on the XY plane. Moreover, in the present embodiment, the
size of the first positive electrode 31A is substantially the same
as the size of the first negative electrode 32A. Furthermore, the
shape of the first positive electrode 31A is substantially the same
as the shape of the first negative electrode 32A. In the present
embodiment, the first positive electrode 31 and the first negative
electrode 32 are line symmetry with respect to the Y axis.
[0089] In the same way, each of the second, third, . . . , and
ninth positive electrodes 31B, 31C, . . . , and 31I correspond
respectively to each of the second, third, . . . , and ninth
negative electrodes 32B, 32C, . . . , and 32I. Each of the second,
third, . . . , and ninth positive electrodes 31B, 31C, . . . , and
31I and each of the second, third, . . . , and ninth negative
electrodes 32B, 32C, . . . , and 32I are positioned facing each
other in the X axial direction on the XY plane. Each of the second,
third, . . . , and ninth positive electrodes 31B, 31C, . . . , and
31I and each of the second, third, . . . , and ninth negative
electrodes 32B, 32C, . . . , and 32I are line symmetry with respect
to the Y axis.
[0090] In the description given below, the first positive electrode
31A to which a positive potential is applied and the first negative
electrode 32A to which a negative potential is applied are suitably
referred to in combination as a first electrode pattern 3A. In the
same way, the second positive electrode 31B and the second negative
electrode 32B are suitably referred to in combination as a second
electrode pattern 3B. The third positive electrode 31C and the
third negative electrode 32C are suitably referred to in
combination as a third electrode pattern 3C. The fourth positive
electrode 31D and the fourth negative electrode 32D are suitably
referred to in combination as a fourth electrode pattern 3D. The
fifth positive electrode 31E and the fifth negative electrode 32E
are suitably referred to in combination as a fifth electrode
pattern 3E. The sixth positive electrode 31F and the sixth negative
electrode 32F are suitably referred to in combination as a sixth
electrode pattern 3F. The seventh positive electrode 31G and the
seventh negative electrode 32G are suitably referred to in
combination as a seventh electrode pattern 3G. The eighth positive
electrode 31H and the eighth negative electrode 32H are suitably
referred to in combination as an eighth electrode pattern 3H. The
ninth positive electrode 31I and the ninth negative electrode 32I
are suitably referred to in combination as a ninth electrode
pattern 3I.
[0091] In the present embodiment, each electrode member 3 has a
shape which is elongated in the X axial direction. The shape within
the XY plane of the edge of each electrode member 3 that faces the
edge of the holding member 20 is a curved shape that corresponds to
the outer shape of the holding surface 19. Moreover, the shape
within the XY plane of the edges of the respective positive
electrodes 31 that face the negative electrodes 32 is a straight
line which is substantially parallel with the Y axis, while the
shape within the XY plane of the edges of the respective negative
electrodes 32 that face the positive electrodes 31 is a straight
line which is substantially parallel with the Y axis.
[0092] Moreover, the shape within the XY plane of the edges on the
+Y side and of the edges on the -Y side of each positive electrode
31B to 31H (i.e., excluding the first and ninth positive electrodes
31A and 31H) are straight lines which are substantially parallel
with the X axis. In addition, the size of each positive electrode
31 in the Y axial direction is substantially the same. The shape
within the XY plane of the edge on the +Y side of the first
positive electrode 31A is a straight line which is substantially
parallel with the X axis, while the shape within the XY plane of
the edge on the -Y side of the ninth positive electrode 31I is a
straight line which is substantially parallel with the X axis.
[0093] Moreover, the shape within the XY plane of the edges on the
+Y side and of the edges on the -Y side of each negative electrode
32B to 32H (i.e., excluding the first and ninth negative electrodes
32A and 32H) are straight lines which are substantially parallel
with the X axis. In addition, the size of each negative electrode
32 in the Y axial direction is substantially the same. The shape
within the XY plane of the edge on the +Y side of the first
negative electrode 32A is a straight line which is substantially
parallel with the X axis, while the shape within the XY plane of
the edge on the -Y side of the ninth negative electrode 32I is a
straight line which is substantially parallel with the X axis.
[0094] In addition, in the present embodiment, the plurality of
electrode members 3 that include the respective positive electrodes
31 and negative electrodes 32 are positioned so as to match
substantially the entire area of the holding surface 19.
[0095] As is shown in FIG. 3, the substrate stage 2 is provided
with a power supply device 22 which is capable of supplying a
predetermined voltage to the plurality of electrode members 3. The
power supply device 22 is provided with wires 23 that are connected
to the respective electrode members 3, a voltage generator 24 that
generates voltage to be supplied to the respective electrode
members 3 via the wires 23, switches 25 that are located on the
wires 23 and that switch between supplying voltage and stopping the
supply of voltage to the electrode members 3, and a voltage
regulator 26 that is capable of regulating the value of the voltage
supplied to the respective electrode members 3. A plurality of the
switches 25 are provided so as to correspond to the plurality of
electrode members 3 (i.e., the electrode patterns 3A to 3I). The
voltage regulator 26 is able to individually regulate the value of
each voltage that is supplied to each one of the plurality of
electrode members 3. The power supply device 22 is controlled by
the control unit 5. Note that if the voltage values are not
regulated, then it is not necessary to supply the voltage regulator
26.
[0096] The control unit 5 generates Coulomb force and/or
Johnsen-Rahbek force between the holding surface 19 of the holding
member 20 and a rear surface of the substrate P by supplying a
predetermined voltage to the positive electrode 31 and negative
electrode 32 of the electrostatic chuck mechanism. As a result, the
substrate P attracts to the holding surface 19 of the holding
member 20 by electrostatic force and is held thereon.
[0097] FIG. 4 is a side cross-sectional view of the holding member
20. In FIG. 2 and FIG. 4, the substrate stage 2 is provided with a
moving mechanism 44 that moves the substrate P relative to the
holding member 20. The moving mechanism 44 moves the substrate P
relative to the holding surface 19 of the holding member 20 mainly
in the Z axial direction. If the moving mechanism 44 is provided,
for example, on a coarse movement stage (not shown), then it is
possible to lighten the weight of the fine movement stage (not
shown) and the holding member 20. As a result, it is possible to
improve the accuracy which with the substrate P is positioned. In
the present embodiment, the movement mechanism 44 is placed on the
coarse movement stage, however, it can also be provided in another
location such as on the fine movement stage or the holding member
20.
[0098] The moving mechanism 44 is provided with a plurality of
supporting members 41A, 41B, and 41C that respectively have
supporting surfaces 40A, 40B, and 40C that are capable of
supporting the rear surface of the substrate P, and with drive
apparatuses 45 that are capable of moving the respective supporting
members 41A, 41B, and 41C in a direction which is perpendicular to
the holding surface 19 (i.e., the Z axial direction). Each
supporting member 41A, 41B, and 41C is a rod shaped component. In
the present embodiment, the first supporting member 41A and the
second supporting member 41B have substantially the same structure,
while the third supporting member 41C has a different structure
from that of the first and second supporting members 41A and
41B.
[0099] The holding member 20 has a plurality of holes 43A, 43B, and
43C that are formed such that they extend the interior of the
holding member 20 in the Z axial direction correspondingly to the
supporting members 41A, 41B, and 41C. In the present embodiment, at
least a portion of each supporting member 41A, 41B, and 41C is
placed in the respective holes 43A, 43B, and 43C, however,
normally, it is not necessary for the respective supporting members
41A, 41B, and 41C to be placed inside the holes 43A, 43B, and 43C.
For example, it is also possible to employ a structure in which the
respective supporting members 41A, 41B, and 41C pass through the
holes 43A, 43B, and 43C and thereby push up the substrate P only
when the substrate P needs to be pushed up in the Z axial
direction. In the present embodiment, top ends of the holes 43A,
43B, and 43C are placed at substantially equal intervals so as to
encircle the center of the holding surface 19.
[0100] The supporting members 41A, 41B, and 41C are capable of
moving in the Z axial direction through the holes 43A, 43B, and
43C. The drive apparatuses 45 are able to move each supporting
member 41A, 41B, and 41C independently. The moving mechanism 44 is
able to move the supporting members 41A, 41B, and 41C using the
drive apparatuses 45 such that the supporting surfaces 40A, 40B,
and 40C of the supporting members 41A, 41B, and 41C are located on
the +Z side of the holding surface 19. In addition, the moving
mechanism 44 is able to move the supporting members 41A, 41B, and
41C using the drive apparatuses 45 such that the supporting
surfaces 40A, 40B, and 40C of the supporting members 41A, 41B, and
41C are located on the -Z side of the holding surface 19. Various
types of actuator such as electromagnetic actuators and actuators
that use piezoelectric elements can be used for the drive
apparatuses 45.
[0101] The supporting members 41A, 41B, and 41C are capable of
moving relative to the holding surface 19 of the holding member 20
by means of the drive apparatuses 45 while supporting predetermined
areas of the rear surface of the substrate P which is facing the
holding surface 19. Namely, when the substrate P is supported on
the supporting surfaces 40A, 40B, and 40C of the supporting members
41A, 41B, and 41C, the moving mechanism 44 is able to move the
substrate P in a direction in which the holding surface 19 of the
holding member 20 and the rear surface of the substrate P move
towards each other or move away from each other by moving the
supporting members 41A, 41B, and 41C by means of the drive
apparatuses 45.
[0102] In the present embodiment, the first and second supporting
members 41A and 41B include an electrostatic chuck mechanism, and
the supporting surfaces 40A and 40B are able to hold the rear
surface of the substrate P by means of electrostatic force. As is
shown in FIG. 4, the substrate stage 2 is provided with a plurality
of electrode members 46 that are provided on the first and second
supporting members 41A and 41B, and that generate electrostatic
force that attracts the substrate P to the supporting surfaces 40A
and 40B, and with a power supply device 22B that is capable of
supplying voltage to the plurality of electrode members 46. Note
that it is also possible to not provide the power supply device 22B
on the substrate stage, and to instead place it in another position
inside the vacuum chamber 6 or in another position outside the
vacuum chamber 6.
[0103] FIG. 5 is a plan view showing an electrode member 46
provided in the first supporting member 41A. The electrode member
56 is placed inside the first supporting member 41A. The
electrostatic chuck mechanism of the present embodiment is what is
known as a bipolar system, and includes electrode members 46A to
which a positive potential is applied by the power supply device
22B and electrode members 46B to which a negative potential is
applied by the power supply device 22B. In the description below,
the electrode members 46 to which a positive potential is applied
are suitably referred to as positive electrodes 46A, while the
electrode members 46 to which a negative potential is applied are
suitably referred to as negative electrodes 46B.
[0104] As is shown in FIG. 4, the power supply device 22B is
provided with wires 23B that are connected to the respective
electrode members 46, a voltage generator 24B that generates
voltage to be supplied to the respective electrode members 46 via
the wires 23B, switches 25B that are located on the wires 23B and
that switch between supplying voltage and stopping the supply of
voltage to the electrode members 46, and a voltage regulator 26B
that is able to regulate the value of the voltage supplied to the
respective electrode members 46. Note that for reasons of
convenience in the description below, only one wire 23B and switch
25B are described, however, a wire 23B and switch 25B are provided
for each one of the electrode members 46.
[0105] The control unit 5 generates Coulomb force and/or
Johnsen-Rahbek force between the supporting surface 40A and a rear
surface of the substrate P by supplying a predetermined voltage to
the positive electrodes 46A and negative electrodes 46B of the
electrostatic chuck mechanism. As a result, the substrate P becomes
attracted to the supporting surface 40A of the first supporting
member 41A by electrostatic force and is held thereon.
[0106] In the same way, the second supporting member 41B has an
electrostatic chuck mechanism which includes positive electrodes
46A and negative electrodes 46B in the same way as the first
supporting member 41A, and predetermined voltage is supplied to the
positive electrodes 46A and negative electrodes 46B by the power
supply device 22B. The structure of the second supporting member
41B is substantially the same as the structure of the first
supporting member 41A and a description of the second supporting
member 41B is therefore omitted.
[0107] Note that, in the present embodiment, both positive
electrodes and negative electrodes are placed in each of the
supporting members 41A and 41B, however, it is also possible for
only one electrode to be placed in each of the supporting members
41A and 41B such as, for example, placing a positive electrode on
the supporting member 41A side and a negative electrode on the
supporting member 41B side. Moreover, the number of supporting
members 41 is not limited to two, and one supporting member 41 or
three or more supporting members 41 may be provided.
[0108] Moreover, in the present embodiment, the substrate stage 2
is also provided with an antistatic device 47 that removes
electrostatic charge on the substrate P held on the holding member
20. In the present embodiment, the antistatic device 47 includes a
third supporting member 41C of the moving mechanism 44.
[0109] The third supporting member 41C of the present embodiment
includes a conductive member 48 which has conductivity. In the
present embodiment, the conductive member 48 is formed at least on
a supporting surface 40C of the third supporting member 41C.
Moreover, as is shown in FIG. 4, the conductive member 48 of the
third supporting member 41C is grounded (i.e. is earthed). As a
result of the grounded conductive member 48 coming into contact
with the substrate P, electricity (i.e., any electric charge) which
is electrifying the substrate P is removed from that substrate
P.
[0110] As is shown in FIG. 2, in the present embodiment, an
aperture 42C through which the third supporting member 41C is able
to move is positioned on the -Y side (i.e., on the first electrode
pattern 3A side) of the center of the holding surface 19. Apertures
42A and 42B through which the first and second supporting members
41A and 41B are able to move are positioned on the +Y side (i.e.,
on the ninth electrode pattern 3I side) of the center of the
holding surface 19.
[0111] FIG. 6 is a typical view showing a relationship between shot
areas S on the substrate P on which a pattern has been formed by
the irradiation of exposure light EL, and the holding member 20.
Note that in FIG. 6 the supporting members 41A, 41B, and 41C and
the like have been omitted from the drawing. As is shown in FIG. 6,
shot areas S which are exposure subject areas are set on the
substrate P. The mask M has a pattern formation area MR (see FIG.
1) on which a pattern that is to be projected onto the shot areas S
is placed. In the present embodiment, an image of the pattern that
is placed on the pattern formation area MR of the mask M is
projected onto a single shot area S. Namely, a pattern is formed on
a single shot area S in accordance with the pattern that is placed
on the pattern formation area MR of the mask M. For example, when a
pattern for one chip (i.e., a device pattern) is formed on the
pattern formation area MR of the mask M, the pattern for one chip
is formed on a single shot area S. When a pattern (i.e., a device
pattern) for a plurality of chips (for example, for two chips) is
formed on the pattern formation area MR of the mask M, a pattern
for the plurality of chips is formed on the single shot area S.
[0112] Exposure light EL is irradiated from the pattern within the
illumination area IR of the mask M onto the projection area PR of
the projection optical system PL. As is shown in FIG. 6, in the
present embodiment, the projection area PR is a rectangular shape
(i.e., slit shape) which is elongated in the X axial direction. The
projection optical system PL irradiates the projection area PR with
the exposure light from the pattern on the mask M which corresponds
to the illumination area IR, and exposes a portion of the shot
areas S on the substrate P with the irradiated exposure light onto
the projection area PR.
[0113] When a single shot area S is being exposed, the control unit
5 irradiates the exposure light EL onto the projection area PR
while moving the shot area S on the substrate P in the Y axial
direction relative to the projection area PR in synchronization
with the movement in the Y axial direction of the pattern formation
area MR on the mask M relative to the illumination area IR. As a
result, an image of the pattern placed on the pattern formation
area MR on the mask M is projected onto the shot area S.
[0114] A plurality of shot areas S are set in a matrix layout on
the substrate P, and this plurality of shot areas S are exposed in
sequence. Namely, the pattern that is placed on the pattern
formation area MR of the mask M is formed in sequence on each of
the plurality of shot areas S on the substrate P. The control unit
5 sequentially exposes the plurality of shot areas S while
repeatedly performing an operation to irradiate the exposure light
EL onto the substrate P while moving the mask M and the substrate P
in synchronization in the Y axial direction in order to expose a
predetermined shot area S, and an operation to move the substrate P
in a stepping motion in the X axial direction in order to expose
the next shot area S. In the present embodiment, as an example, the
control unit 5 sequentially exposes the plurality of shot areas S
on the substrate P while moving the substrate stage 2 such that the
projection area PR of the projection optical system PL and the
substrate P are moved relatively following the arrow R1 shown in
FIG. 6.
[0115] As is shown in FIG. 6, in the present embodiment, nine shot
area groups, which are made up of a plurality of shot areas S
aligned in the X axial direction, are aligned in the Y axial
direction on the substrate P.
[0116] In the description given below, of the plurality of shot
area groups that are aligned in the Y axial direction, the shot
area group that is closest to the edge on the -Y side of the
holding surface 19 is called a first shot area group S1 when
appropriate, the shot area group that is next closest to the edge
on the -Y side of the holding surface 19 after the first shot area
group S1 is called a second shot area group S2 when appropriate. In
addition, of the plurality of shot area groups, the third, fourth,
etc. up to the eighth shot area group in sequence in the +Y
direction from the second shot area group S2 are referred to as a
third shot area group S3, a fourth shot area group S4, . . . , up
to an eighth shot area group S8, while the shot area group that is
closest to the edge on the +Y side of the holding surface 19 is
referred to as a ninth shot area group S9 when appropriate.
[0117] As is shown in FIG. 6, in the present embodiment, each of
the electrode members 3 has a size and shape that corresponds to
the pattern information, and is positioned on the holding member 20
in accordance with the pattern information. The pattern information
includes at least one of information relating to the size of the
pattern and pattern layout information. In the present embodiment,
the pattern information includes information about the pattern
formed on the substrate P.
[0118] Information relating to the size of the pattern includes
information relating to the size of the pattern formed on the
substrate P, and includes information relating to the size of the
pattern that is formed on the substrate P as a result of an image
of the pattern which is placed on the pattern formation area MR of
the mask M being projected thereon. Namely, in the present
embodiment, information relating to the size of the pattern
includes information relating to the size of the shot areas S on
the substrate P, and consequently information relating to the size
of the chips that are to be formed on the substrate P.
[0119] The pattern layout information includes layout information
for the pattern that is formed on the substrate P, and includes
information relating to the layout of the pattern that is formed on
the substrate P as a result of an image of the pattern which is
placed on the pattern formation area MR of the mask M being
projected thereon. Namely, in the present embodiment, information
relating to the layout of the pattern includes information relating
to the layout of the plurality of shot areas S on the substrate P,
and consequently information relating to the layout of the chips
that are formed on the substrate P.
[0120] In the present embodiment, the plurality of electrode
members 3 are arranged in accordance with information relating to
the pattern that is formed on the substrate P, specifically, in
accordance with information relating to the shot areas S that are
set on the substrate P. As is shown in FIG. 6, in the present
embodiment, the size in the Y axial direction of the respective
electrode members 3 is set so as to substantially match the size in
the Y axial direction of the shot areas S. When a single chip is to
be formed on a single shot area S, the size in the Y axial
direction of each electrode member 3 is set so as to substantially
match the size in the Y axial direction of a single chip. Moreover,
the sizes in the X axial direction of each of the first through
ninth electrode patterns 3A to 3I that are formed by the electrode
members 3 are set so as to substantially match the sizes in the X
axial direction of each of the first through ninth shot area groups
S1 to S9 that are formed by the shot areas S.
[0121] Moreover, each electrode member 3 is arranged so as to
correspond to the plurality of shot areas S. In the present
embodiment, each of the first through ninth electrode patterns 3A
to 3I is arranged so as to correspond respectively to each of the
first through ninth shot area groups S1 to S9.
[0122] As an example, the diameters of the circular substrate P and
the holding surface 19 which is substantially the same as the outer
configuration of this substrate P are 300 mm, the size in the Y
axial direction of each electrode member 3 (i.e., the size in the Y
axial direction of a single chip) is approximately 33 mm, and the
distance between adjacent electrode members 3 is approximately 5
mm.
[0123] Next, an example of a method of exposing a substrate P using
the exposure apparatus EX having the above described structure will
be described.
[0124] In the present embodiment, the power supply device 22
regulates the voltage that is supplied to each electrode member 3
in accordance with pattern information. As is described above,
pattern information includes at least one of information relating
to the size of the pattern that is formed on the substrate P, and
pattern layout information, and includes information relating to
the shot areas S on the substrate P, and information on the chips
that are to be formed on the substrate P.
[0125] Moreover, in the present embodiment, the pattern information
includes the pattern formation sequence. The sequence in which the
pattern is to be formed includes the sequence in which the pattern
is to be formed on the substrate P. In the present embodiment, the
sequence in which the pattern is to be formed on the substrate P
includes the sequence in which the operation to form patterns on
each of the plurality of shot areas S that are set on the substrate
P is to be executed, in other words, the sequence in which the
exposure light EL is irradiated from the pattern of the mask M in
order to form a pattern on each of the shot areas S.
[0126] At a predetermined timing prior to the commencement of the
exposure of the substrate P, exposure conditions which include
pattern information (i.e., pattern formation conditions) are input
into the control unit 5 by means of the input device 7. Based on
the exposure conditions including the pattern information that has
been input by means of the input device 7, the control unit 5
controls at the least the operation of the power supply device 22
when the substrate P is being exposed. The control unit 5 controls
the power supply device 22 in accordance with the pattern
information input by means of the input device 7, and regulates the
voltage supplied to each electrode member 3 by this power supply
device 22. Note that the exposure conditions including the pattern
information (i.e., the pattern formation conditions) may be stored
in advance in the storage device 8. In this case, the control unit
5 controls the power supply device 22 in accordance with pattern
information that is stored in this storage device 8, so as to
enable the voltage that is supplied to each electrode member 3 to
be regulated by this power supply device 22.
[0127] In the present embodiment, a description is given of when
the control unit 5 firstly exposes the shot areas S of the first
shot area group S1, and then sequentially exposes the shot areas S
of the second, third, . . . , up to the eighth shot area groups S2,
S3, . . . , up to S8, and then finally exposes the shot areas S of
the ninth shot area group S9.
[0128] Firstly, as is shown in FIG. 7A, an unexposed substrate P is
transported to (i.e., loaded onto) the holding member 20 of the
substrate stage 2 by a predetermined transporting apparatus 50.
When loading the substrate P onto the holding member 20, the
control unit 5 moves the supporting members 41A to 41C using the
drive apparatuses 45 of the moving mechanism 44 such that the
supporting surfaces 40A to 40C of the supporting members 41A to 41C
are located above (i.e., on the +Z side) of the holding surface 19
of the holding member 20. As is shown in FIG. 7B, the transporting
apparatus 50 loads the substrate P onto the supporting surfaces 40A
to 40C of the supporting members 41A to 41C that are positioned on
the +Z side of the holding surface 19.
[0129] In the present embodiment, the first and second supporting
members 41A and 41B have electrostatic chuck mechanisms that
include positive electrodes 46A and negative electrodes 46B, and a
substrate P that has been delivered by the transporting apparatus
50 is held thereon by electrostatic force. As a result, it is
possible to limit any shifting in the position of the substrate P
or the like. After the rear surface of the substrate P has been
attracted to the supporting surfaces 40A and 40B of the first and
second supporting members 41A and 41B by electrostatic force, the
control unit 5 moves the supporting members 41A to 41B that support
the rear surface of the substrate P downwards (i.e., in the -Z
direction). Namely, the control unit 5 moves the supporting members
41A to 41B that support the rear surface of the substrate P such
that the rear surface of the substrate P and the holding surface 19
of the holding member 20 come closer together. As a result, as is
shown in FIG. 7C, the substrate P is placed on the holding surface
19 of the holding member 20. After the substrate P has been placed
on the holding surface 19 of the holding member 20, the control
unit 5 stops the supply of voltage by the power supply device 22B
to the electrode members 46. In addition, the control unit 5 moves
the supporting members 41A to 41B in the -Z direction until the
rear surface of the substrate P and the supporting surfaces 40A to
40B of the supporting members 41A to 41B are separated. As a
result, the holding surface 19 of the holding member 20 is placed
in a state in which it is capable of holding a substrate P, and the
supporting of the substrate P by the supporting members 41A to 41C
is terminated.
[0130] After the substrate P has been placed on the holding surface
19 of the holding member 20 that is provided with the electrode
members 3, in order to attract the substrate P to the holding
surface 19 by electrostatic force, the control unit 5 supplies a
predetermined voltage to the electrode members 3 using the power
supply device 22. In the present embodiment, after the substrate P
has been placed on the holding surface 19 but prior to the exposure
of the substrate P, a predetermined voltage is applied to each one
of the respective positive electrodes 31A to 31I and each one of
the respective negative electrodes 32A to 32I of all of the
electrode patterns 3A to 3I. As a result, the substrate P is held
by attracting to the holding surface 19 of the holding member 20 by
electrostatic force.
[0131] After the substrate P has been held by electrostatic force
on the holding surface 19 of the holding member 20, the control
unit 5 positions the substrate P using an alignment device such as
an FIA or the like, and commences the exposure processing for the
substrate P. A plurality of shot areas S are set on the substrate
P, and an operation is executed in which this plurality of shot
areas S are sequentially exposed, and the pattern that is placed on
the pattern formation area MR of the mask M is formed on each one
of the shot areas S on the substrate P.
[0132] Hereinafter, a description will be given while referring to
the typical views in FIG. 8 through FIG. 11 of an operation to
regulate the voltages supplied by the power supply device 22 to the
plurality of electrode members 3 in accordance with the information
relating to the pattern that is formed on the substrate P.
Specifically, a description of an operation to select predetermined
electrode members 3 among the plurality of electrode members 3 in
accordance with the information of the pattern being to be formed
on the substrate P, and to regulate the voltage applied to the
predetermined electrode members 3. Note that, in FIG. 8 through
FIG. 11, the supporting members 41A, 41B, and 41C and the like have
been omitted from the drawings.
[0133] In the present embodiment, the power supply device 22 sets
at least the absolute value of the voltage value that is supplied
to the positive electrodes 31 and the negative electrodes 32 that
correspond to the shot areas S on the substrate P where an
operation to form a pattern is currently underway to a larger value
than the absolute value of the voltage value supplied to the
positive electrodes 31 and the negative electrodes 32 that
correspond to the other shot areas S.
[0134] In the present embodiment, the power supply device 22
supplies voltages of a predetermined value to at least the
electrode members 3 that correspond to the shot areas S on the
substrate P where an operation to form a pattern is underway, and
sets the absolute value of the voltage value that is supplied to
the electrode members 3 that correspond to at least a portion of
the shot areas S where no operation to form a pattern is currently
underway to a smaller value than the absolute value of the
predetermined value.
[0135] In the present embodiment, the power supply device 22 sets
the absolute value of the voltage value that is supplied to the
positive electrodes 31 and the negative electrodes 32 that
correspond to the shot areas S on the substrate P where a pattern
has not yet been formed and where an operation to form a pattern is
currently underway to a larger value than the absolute value of the
voltage value that is supplied to the positive electrodes 31 and
the negative electrodes 32 that correspond to the shot areas S on
the substrate P after a pattern has been formed. In the present
embodiment, the voltage value that is supplied to the positive
electrodes 31 and the negative electrodes 32 that correspond to the
shot areas S on the substrate P after a pattern has been formed is
set to `OFF`. In order to set the voltage to `OFF` in the present
embodiment, the electrode members 3 are grounded by the switches
25, however, it is also possible to set the value of the voltage
supplied from the power supply to 0. This also applies in the other
embodiments.
[0136] In the present embodiment, the pattern formation operation
includes an operation to irradiate exposure light EL onto the
substrate P from the pattern on the mask M in order to form the
pattern on the substrate P. Accordingly, when a pattern formation
operation is referred to as being `currently underway`, this
includes a state in which the substrate P is currently being
irradiated with exposure light EL from the pattern on the mask M,
namely, includes a state in which the substrate P is currently
being exposed. Moreover, the term `where a pattern has not yet been
formed` includes a state prior to a pattern formation operation
being executed, and includes a state prior to the substrate P being
irradiated with exposure light EL from the pattern on the mask M,
namely, a state prior to exposure of the substrate P being
executed. Moreover, the term `after a pattern has been formed`
includes a state after a pattern formation operation has been
executed, and includes a state after the exposure light EL has been
irradiated from the pattern on the mask M, namely, a state after
exposure has been executed.
[0137] In FIG. 8 through FIG. 11, of the plurality of shot areas S,
the shot areas S where a pattern formation operation is currently
underway and where a pattern formation operation has already been
executed are shown by a solid line, while the shot areas S where a
pattern has not yet been formed are shown by a broken line.
Moreover, the electrode members 3 to which voltage is being
supplied by the power supply device 22 are shown by oblique
lines.
[0138] Firstly, as is shown in FIG. 8, of the plurality of shot
areas S that are set on the substrate P, exposure of the shot areas
S of the first shot area group S1 is executed. While the pattern
formation operation for the shot areas S of the first shot area
group S1 is currently underway, namely, while the shot areas S of
the first shot area group S1 are being exposed, the power supply
device 22 supplies voltage (i.e., sets the voltage to ON) of a
predetermined value to all of the electrode members 3 (i.e., the
positive electrodes 31 and the negative electrodes 32) of the first
through ninth electrode patterns 3A to 3I. As a result, in a state
in which the substrate P is being properly held by the holding
member 20, exposure of the shot areas S of the first shot area
group S1 is properly executed.
[0139] As is shown by the typical view in FIG. 9, when the pattern
formation operation for each shot area S of the first shot area
group S1 is ended, and a pattern formation operation for each shot
area S of the second shot area group S2 commences, the power supply
device 22 stops (i.e., sets to OFF) the supply of voltage to the
electrode members 3 of the first electrode pattern 3A that
corresponds to the shot areas S of the first shot area group S1 on
the substrate P after the pattern has been formed. Namely, the
power supply device 22 grounds the electrode members 3 of the first
electrode pattern 3A that corresponds to the shot areas S of the
first shot area group S1 on the substrate P after a pattern has
already been formed thereon (i.e., after the exposure thereof) and
where a pattern formation operation is not currently underway. The
power supply device 22 electrically grounds the electrode members 3
of the first electrode pattern 3A using, for example, the switches
25. Moreover, in the present embodiment, the power supply device 22
maintains at a predetermined value the voltage value that is being
supplied by the power supply device 22 to the second through ninth
electrode patterns 3B through 3I that correspond to the shot areas
S of the second through ninth shot area groups S2 through S9 on the
substrate P where a pattern has not yet been formed, and also where
a pattern formation operation is currently underway. As a result,
the electrostatic force per unit area that is generated between the
rear surface of the substrate P and the area of the portion of the
holding surface 19 that corresponds to the first electrode pattern
3A can be made weaker than the electrostatic force per unit area
that is generated between the rear surface of the substrate P and
the areas of the portions of the holding surface 19 that correspond
to the second through ninth electrode patterns 3B through 3I. In
addition, because voltage of a predetermined value is supplied to
the second through ninth electrode patterns 3B through 3I that
correspond to the shot areas S on the substrate P where a pattern
has not yet been formed and also where a pattern formation
operation is currently underway, in a state in which the substrate
P is being properly held by the holding member 20, exposure of the
shot areas S of the second shot area group S2 is properly executed.
Specifically, even if, for example, the temperature of the
substrate P in those areas that correspond to the second through
ninth electrode patterns rises because of the exposure, by securely
holding the substrate P using the holding member 20, it is possible
to prevent any shift in the position of the areas of the substrate
that have not yet been exposed. Accordingly, because it is possible
to expose all the shot areas based on alignments that were made
prior to the exposure commencing, it is possible to prevent any
exposure malfunctions.
[0140] In this manner, by supplying voltage of a predetermined
value to the positive electrodes 31 and the negative electrodes 32
that correspond to the shot areas S on the substrate P where a
pattern has not yet been formed and also where a pattern formation
operation is currently underway, it is possible to generate a
predetermined electrostatic force per unit area between the rear
surface of the substrate P and the holding surface 19 that
corresponds to these positive electrodes 31 and negative electrodes
32. Moreover, by supplying voltage of a value that is smaller
(including 0) than the predetermined value to the positive
electrodes 31 and the negative electrodes 32 that correspond to the
shot areas S on the substrate P after a pattern has been formed
thereon, it is possible to make the electrostatic force per unit
area between the rear surface of the substrate P and the holding
surface 19 that corresponds to these positive electrodes 31 and
negative electrodes 32 weaker than the former predetermined
electrostatic force per unit area.
[0141] When the exposure of the plurality of shot areas S is
underway and, as is shown in typical view in FIG. 10, the pattern
formation operation for each shot area S of the first through third
shot area groups S1 through S3 has ended, and the pattern formation
operation for the shot areas S of the fourth shot area group S4 has
commenced, the power supply device 22 stops the supply of voltage
to the electrode members 3 of the first through third electrode
patterns 3A through 3C that correspond to the shot areas S of the
first through third shot area groups S1 through S3 on the substrate
P after the pattern has been formed thereon. Namely, the power
supply device 22 sets to OFF the value of the voltage that is
supplied to the electrode members 3 of the first through third
electrode patterns 3A through 3C that correspond to the shot areas
S of the first through third shot area groups S1 through S3 on the
substrate P after a pattern has already been formed thereon (i.e.,
after the exposure thereof) and where a pattern formation operation
is not currently underway. Moreover, in the present embodiment, the
power supply device 22 maintains at a predetermined value the
voltage value that is being supplied by the power supply device 22
to the fourth through ninth electrode patterns 3B through 3I that
correspond to the shot areas S of the fourth through ninth shot
area groups S4 through S9 on the substrate P where a pattern has
not yet been formed, and also where a pattern formation operation
is currently underway. As a result, the electrostatic force per
unit area that is generated between the rear surface of the
substrate P and the areas of the portions of the holding surface 19
that correspond to the first through third electrode patterns
electrode pattern 3A through 3C can be made weaker than the
electrostatic force per unit area that is generated between the
rear surface of the substrate P and the areas of the portions of
the holding surface 19 that correspond to the fourth through ninth
electrode patterns 3D through 3I. In addition, because voltage of a
predetermined value is supplied to the fourth through ninth
electrode patterns 3D through 3I that correspond to the shot areas
S on the substrate P where a pattern has not yet been formed and
also where a pattern formation operation is currently underway, in
a state in which the substrate P is being properly held by the
holding member 20, exposure of the shot areas S of the fourth shot
area group S4 is properly executed.
[0142] When the exposure of the plurality of shot areas S is
underway and, as is shown in typical view in FIG. 11, the pattern
formation operation for each shot area S of the first through
eighth shot area groups S1 through S8 has ended, and the pattern
formation operation for the shot areas S of the ninth shot area
group S9 has commenced, the power supply device 22 stops the supply
of voltage to the electrode members 3 of the first through eighth
electrode patterns 3A through 3H that correspond to the shot areas
S of the first through eighth shot area groups S1 through S8 on the
substrate P after the pattern has been formed thereon. Namely, the
power supply device 22 sets to OFF the value of the voltage that is
supplied to the electrode members 3 of the first through eighth
electrode patterns 3A through 3H that correspond to the shot areas
S of the first through eighth shot area groups S1 through S8 on the
substrate P after a pattern has already been formed thereon (i.e.,
after the exposure thereof) and where a pattern formation operation
is not currently underway. Moreover, in the present embodiment, the
power supply device 22 maintains at a predetermined value the
voltage value that is being supplied by the power supply device 22
to the ninth electrode pattern 3I that corresponds to the shot
areas S of the ninth shot area group S9 on the substrate P where a
pattern has not yet been formed, and also where a pattern formation
operation is currently underway. As a result, the electrostatic
force per unit area that is generated between the rear surface of
the substrate P and the areas of the portions of the holding
surface 19 that correspond to the first through eighth electrode
patterns electrode pattern 3A through 3H can be made weaker than
the electrostatic force per unit area that is generated between the
rear surface of the substrate P and the area of the portion of the
holding surface 19 that corresponds to the ninth electrode pattern
3I. In addition, because voltage of a predetermined value is
supplied to the ninth electrode pattern 3I that corresponds to the
shot areas S on the substrate P where a pattern has not yet been
formed and also where a pattern formation operation is currently
underway, in a state in which the substrate P is being properly
held by the holding member 20, exposure of the shot areas S of the
ninth shot area group S9 is properly executed.
[0143] In this manner, in the present embodiment, the control unit
5 selects predetermined electrode members 3 from among the
plurality of electrode members 3 in accordance with information
relating to the pattern that is being formed on the substrate P,
and supplies predetermined voltage to these selected electrode
members 3.
[0144] After a pattern has been formed on all of the shot areas S
on the substrate P, namely, after exposure of all of the shot areas
S has ended, the power supply device 22 stops the supply of voltage
to all of the plurality of electrode members 3. In addition, the
control unit 5 starts operations to transport (i.e., unload) the
exposed substrate P away from the holding member 20.
[0145] FIG. 12A is a view showing a state of the holding member 20
after a pattern has been formed on all of the shot areas S on the
substrate P. In order to unload the substrate P from the holding
member 20, the control unit 5 moves the supporting members 41A
through 41C using the drive apparatuses 45 of the moving mechanism
44 such that the supporting surfaces 40A to 40C of the supporting
members 41A to 41C is placed above (i.e., in the +Z direction) the
holding surface 19 of the holding member 20. Namely, after a
pattern has been formed on all of the shot areas S on the substrate
P, the control unit 5 starts to move the substrate P relative to
the holding member 20 using the moving mechanism 44 such that the
rear surface of the substrate P and the holding surface 19 of the
holding member 20 move away from each other. As a result, as is
shown in FIG. 12B, the supporting surfaces 40A to 40C of the
supporting members 41A to 41C are placed above (i.e., in the +Z
direction) the holding surface 19, and the rear surface of the
substrate P that is being supported by the supporting surfaces 40A
to 40C of the supporting members 41A to 41C and the holding surface
19 of the holding member 20 move away from each other in the Z
axial direction.
[0146] When the rear surface of the substrate P is supported by the
supporting members 41A to 41C, and the rear surface of the
substrate P and the holding surface 19 of the holding member 20 are
to be separated from each other, the control unit 5 supplies
predetermined voltages to the positive electrodes 46A and the
negative electrodes 46B that are provided on the first and second
supporting members 41A and 41B using the power supply device 22B in
order to attract the substrate P by electrostatic force to the
supporting surface 40A and 40B. Consequently, the rear surface of
the substrate P is held by attracting by electrostatic force to the
supporting surfaces 40A and 40B of the first and second supporting
members 41A and 41B. When the supporting surfaces 40A and 40B and
the substrate P are attracted together by electrostatic force, the
control unit 5 moves the supporting members 41A through 41C upwards
(i.e., in the +Z direction), and thereby separates the rear surface
of the substrate P from the holding surface 19 of the holding
member 20. As a result, it is possible to limit any shifting in the
position of the substrate P or the like.
[0147] Moreover, in the present embodiment, the third supporting
member 41C includes the grounded conductive member 48 and is in
contact with the rear surface of the substrate P when the holding
surface 19 of the holding member 20 separates from the rear surface
of the substrate P. As a result of the third supporting member 41C
that includes the conductive member 48 coming into contact with the
substrate P, electricity (i.e., an electric charge) that is
electrifying the substrate P can be removed. In this manner, when
the holding member 20 is separated from the substrate P, the
antistatic device 47 that includes the conductive member 48 of the
third supporting member 41C is able to remove electrostatic charge
on the substrate P using the third supporting member 41C (i.e., the
conductive member 48).
[0148] In addition, as is shown in FIG. 12C, the exposed substrate
P is transported away (i.e., unloaded) from the holding member 20
of the substrate stage 2 by a predetermined transporting apparatus
50. When the substrate P that is being supported on the supporting
members 41A to 41C is transferred to the transporting apparatus 50,
the control unit 5 stops the supply of voltage to the electrode
members 46 by the power supply device 22B. Consequently, the hold
by the electrostatic chuck mechanisms of the first and second
supporting members 41A and 41B is released, and the substrate P is
smoothly transported away by the transporting apparatus 50.
Moreover, when the surface areas of the supporting surfaces 40A and
40B are sufficiently small, and the supply of voltage to the
electrode members 46 by the power supply device 22B has been
stopped, even if residual electrostatic force (i.e., adhesive
force) is generated, this residual electrostatic force is
satisfactorily small. Accordingly, the rear surface of the
substrate P can be smoothly separated from the supporting surfaces
40A and 40B.
[0149] In an electrostatic chuck mechanism, even when the supply of
voltage to the electrode members 3 has been stopped, there is a
possibility that, immediately after the supply of voltage to the
electrode members 3 has been stopped, it will be difficult to
smoothly separate the substrate P from the holding surface 19 due,
for example, to residual electrostatic force. When the residual
electrostatic force gradually reduces over time, in order to
separate (i.e., in order to unload) the substrate P smoothly from
the holding surface 19, within a range that still enables the hold
of the substrate P to be smoothly maintained, it is desirable to
stop the supply of voltage to the electrode members 3 at the
earliest possible timing, and lengthen the period between the point
when the supply of voltage to the electrode members 3 is stopped
and the point when the operation to separate the holding surface 19
and the substrate P (i.e., the unloading operation) is
executed.
[0150] In the present embodiment, because a plurality of electrode
members 3 are provided in accordance with information relating to
the pattern being formed on the substrate P, and the stopping of
the voltage to the plurality of electrode members 3 is executed in
a predetermined sequence in accordance with this pattern
information, it is possible, for example, to sufficiently reduce
the electrostatic force that is residual based on the electrode
members 3 of the first electrode pattern 3A to which the supply of
voltage is first stopped by the time the operation to separate the
substrate P from the holding surface 19 is executed (i.e., until
the substrate P is unloaded). In the same way, it is also possible
to sufficiently reduce the electrostatic force that is residual
based on the electrode members 3 of the second, third, . . . , and
up to the eighth electrode patterns 3B, 3C, . . . , and 31I by the
time the substrate P is unloaded from the holding surface 19.
Moreover, if the electrostatic force that is residual based on the
electrode members 3 of the ninth electrode pattern 3I is
sufficiently reduced by the time the operation to unload the
substrate P from the holding surface 19 is executed, then the
unloading of the substrate P from the holding member 20 can be
smoothly executed. Furthermore, even if the electrostatic force
that is residual based on the electrode members 3 of the ninth
electrode pattern 3I is not sufficiently reduced by the time the
substrate P is unloaded from the holding surface 19, the area of
the holding surface 19 that corresponds to the ninth electrode
pattern 3I is small so that the size of the electrostatic force is
sufficiently small within a range that allows the hold of the
substrate P to be properly executed. Consequently, the unloading of
the substrate P from the holding member 20 can be smoothly
executed.
[0151] In the present embodiment, the values of the voltages that
are supplied to each electrode member 3 are optimized in advance
such that the hold of the substrate P can be properly executed in
accordance with the weight of the substrate P, the coefficient of
friction between the holding surface 19 of the holding member 20
and the rear surface of the substrate P, and the rate of
acceleration when the substrate stage 2 is being moved, and the
like. Because of this, when the shot areas S of the ninth shot area
group S9 are being exposed, by supplying a predetermined voltage
only to the positive electrodes 31I and the negative electrodes 321
of the ninth electrode pattern 3I, the hold of the substrate P can
be suitably maintained by means of the electrostatic force that is
generated based on this ninth electrode pattern 3I. Moreover, the
unloading of the substrate P from the holding member 20 can be
smoothly executed.
[0152] FIG. 13 is a typical view showing an example of an operation
when the holding member 20 and the substrate P are separated by the
moving mechanism 44 that includes the supporting members 41A to
41C. As is shown in FIG. 13, the moving mechanism 44 starts to move
the substrate P relative to the holding member 20 such that a
portion of the rear surface of the substrate P moves away from the
holding surface 19 before other portions thereof. In the present
embodiment, the third supporting member 41C which includes the
conductive member 48 supports the portion of the rear surface of
the substrate P that moves away first from the holding surface 19.
In other words, the drive apparatuses 45 of the moving mechanism 44
are controlled such that, of the three supporting members 41A to
41C, the supporting surface 40C of the third supporting member 41C
starts to move in the +Z direction from the holding surface 19
earlier than the supporting surfaces 40A and 40B of the other
supporting members 41A and 41B.
[0153] As is described above, in the present embodiment, after
voltages has been supplied to each of the electrode members 3 of
the plurality of electrode patterns 3A to 3I so as to cause the
substrate P to be attracted to the holding surface 19, the stopping
of the supplying of the voltages to the plurality of electrode
members 3 is executed in a predetermined sequence in accordance
with the sequence in which the patterns are formed (i.e., the
sequence in which the shot areas S are exposed). Namely, as was
described with reference to FIG. 9 and the like, firstly, the
supplying of voltage to the electrode members 3 of the first
electrode pattern 3A is stopped, and thereafter the supplying of
voltages to the electrode members 3 is stopped in the sequence of
the second, the third, . . . , and up to the ninth electrode
patterns 3B, 3C, . . . , 3I. The moving mechanism 44 starts the
movement of the substrate P relative to the holding member 20 such
that the portion of the rear surface of the substrate P that
corresponds to the electrode members 3 of the first electrode
pattern 3A to which the supplying of voltage was stopped first,
namely, the portion adjacent to the edge of the substrate P on the
-Y side moves away first from the holding surface 19 of the holding
member 20.
[0154] In the present embodiment, of the plurality of supporting
members 41A to 41C, the third supporting member 41C which includes
the conductive member 48 is placed adjacent to the edge of the
substrate P on the -Y side. The control unit 5 controls the drive
apparatuses 45 of the moving mechanism 44 such that the supporting
surface 40C of the third supporting member 41C starts to move in
the +Z direction from the holding surface 19 earlier than the
supporting surfaces 40A and 40B of the other supporting members 41A
and 41B. As a result, the substrate P can be moved such that the
portion in the vicinity of the edge on the -Y side of the substrate
P that is supported by the supporting surface 40C of the third
supporting member 41C moves away first from the holding surface 19
of the holding member 20.
[0155] By executing the operation to move the holding surface 19
and the rear surface of the substrate P away from each other such
that the portion of the substrate P that corresponds to the first
electrode pattern 3A to which the supply of voltage was stopped
first moves away from the holding surface 19 before the other
portions of the substrate P, the operation to move the holding
surface 19 and the rear surface of the substrate P away from each
other can be smoothly executed. After the supply of voltage to the
electrode members 3 has been stopped, even if residual
electrostatic force is still present, there is a strong possibility
that the electrostatic force that is residual based on the
electrode members 3 of the first electrode pattern 3A to which the
supply of voltage was stopped first will be sufficiently reduced by
the time the substrate P is unloaded from the holding surface 19.
Because of this, by moving the substrate P such that the portion of
the rear surface of the substrate P where there is a strong
possibility that the residual electrostatic force will be
sufficiently reduced moves away from the holding surface 19 before
the other portions of the substrate P, it is possibly to smoothly
separate the substrate P and the holding surface 19.
[0156] As has been described above, according to the present
embodiment, because the electrode members 3 are arranged in
accordance with information relating to the pattern that is to be
formed on the substrate P, and because the power supply device 22
regulates the voltage that is supplied to the respective electrode
members 3 in accordance with this information relating to the
pattern that is to be formed on the substrate P, an operation to
transport (i.e., unload) the substrate P away can be executed
rapidly at the same time as the operation to hold the substrate P
is being properly executed. Accordingly, in a state in which the
substrate P is being properly held, the operation to form a pattern
on the substrate P can be properly executed, and it is possible to
manufacture a device which has a desired performance. Moreover,
throughput can be improved and this can contribute to an
improvement in device productivity.
[0157] Moreover, according to the present embodiment, because an
electrostatic chuck mechanism which includes the electrode members
46 is provided in the supporting members 41A and 41B, the substrate
P can be properly supported using these supporting members 41A and
41B. Accordingly, using these supporting members 41A and 41B, it is
possible to prevent any shift in the position of the substrate P,
and the operation to transport the substrate P onto the holding
member 20 and the operation to transport the substrate P away from
the holding member 20 can be properly executed. Accordingly, it is
possible to prevent any deterioration in the device performance and
contribute to an improvement in device productivity.
[0158] Moreover, according to the present embodiment, when the
holding member and the substrate P are separated from each other,
because electrostatic charge on the substrate P is removed by the
third supporting member 41C of the antistatic device 47 (i.e., the
conductive member 48), it is possible to prevent the occurrence of
a phenomenon in which it becomes difficult to separate the holding
member 20 and the substrate P because of residual electrostatic
force. It is thus possible to prevent any large load from acting on
the substrate P, and the holding member 20 and the substrate P can
be smoothly separated from each other.
[0159] Note that, in the present embodiment, when, for example,
voltage of a predetermined value is supplied to the electrode
members 3 that correspond to the shot areas S of the first shot
area group S1 where a pattern formation operation is currently
underway, and when, once the pattern formation operation for the
shot areas S of this first shot area group S1 has been completed, a
pattern formation operation for the shot areas S for the subsequent
second shot area group S2 is starting, the value of the voltage
that is supplied to the electrode members 3 that correspond to the
first shot area group S1 is set to OFF, however, the timing at
which the value of the voltage that is supplied to the electrode
members 3 that correspond to the first shot area group S1 is set to
OFF can be set to any desired timing provided that it is after the
operation to form a pattern on the shot areas S of the first shot
area group S1 has been executed. For example, the value of the
voltage that is supplied to the electrode members 3 that correspond
to the first shot area group S1 can also be set to OFF after the
operation to form a pattern on the shot areas S of the first shot
area group S1 has been executed, and after an operation to form a
pattern on the shot areas S of the subsequent second shot area
group S2 has also been executed.
[0160] Note also that, in the present embodiment, voltage of a
predetermined polarity is supplied to the electrode members 3 that
correspond to the shot areas S where a pattern formation operation
is currently underway, and, once the operation to form a pattern on
these shot areas S has been executed, the value of the voltage that
is supplied to the electrode members 3 that correspond to these
shot areas S after this pattern formation operation has been
executed is set to OFF, however, for example, it is also possible
to apply a voltage of the reverse polarity for a predetermined time
prior to setting this voltage value to OFF. For example, in FIG. 9,
when the pattern formation operation for each shot area S of the
first shot area group S1 has ended, and the pattern formation
operation for the shot areas S of the second shot area group S2 is
starting, the value of the voltage that is supplied, for example,
to those electrode members 3 to which a positive potential had been
supplied until that point (i.e., the positive electrodes 31A) can
be changed to a negative potential for a predetermined time. By
employing this method, it is possible to prevent the occurrence of
residual electrostatic force (i.e., adhesive force). In the same
way, the value of the voltage that is supplied to those electrode
members 3 to which a negative potential had been supplied until
that point (i.e., the negative electrodes 32A) can be changed to a
positive potential for a predetermined time. After this, the
voltage for the electrode members 3 can be set to OFF.
[0161] Moreover, in the present embodiment, all the voltage is set
to OFF for electrodes that correspond to areas where exposure has
finished, however, it is also possible to not set the voltage to
OFF until all the exposure has ended for the electrodes that
correspond to a portion of the shot areas, for example, the shot
areas S7, S8, and S9, and set the voltage to OFF at the point when
exposure of only the electrodes that correspond to the shot areas
S1 to S6 has ended.
Second Embodiment
[0162] Next, a description will be given of a second embodiment. In
the description given below, component elements that are identical
or equivalent to those in the above described embodiment are given
the same symbols and any description thereof is simplified or
omitted.
[0163] In the above described first embodiment, the value of the
voltage that is supplied to the electrode members 3 that correspond
to the shot areas S after a pattern formation operation has been
executed is set to OFF, however, the characteristic portion of the
second embodiment lies in the fact that the voltage value is not
set to OFF, but instead the absolute value of the supplied voltage
value is minimized.
[0164] FIG. 14, FIG. 15, and FIG. 16 are typical views used to
illustrate an example of an operation of the power supply device 22
according to the second embodiment. In the same way as in the above
described first embodiment, in the second embodiment as well,
patterns are formed sequentially on a plurality of shot areas S on
a substrate P. In the present embodiment, the power supply device
22 sets the value of the voltage that is supplied to the electrode
members 3 that correspond to the shot areas S on a substrate P
where a pattern has not yet been formed or where a pattern
formation operation is currently under way to a first voltage
value, and sets the value of the voltage that is supplied to the
electrode members 3 that correspond to the shot areas S where a
pattern formation operation has already been executed and where no
pattern formation operation is currently being performed to a
second voltage value that is smaller than the first voltage value.
Note that the first voltage value and second voltage value are
absolute values.
[0165] For example, when a pattern formation operation is currently
being performed on the shot areas S of the first shot area group
S1, namely, when exposure of the shot areas S of the first shot
area group S1 is being performed, the power supply device 22
supplies voltage of the first predetermined value to all of the
electrode members 3 (i.e., the positive electrodes 31 and the
negative electrodes 32) of the first through ninth electrode
patterns 3A through 3I. As a result, the substrate P is attracted
to the holding surface 19 by electrostatic force and is held
thereon.
[0166] In addition, as is shown, for example, in typical view in
FIG. 14, when the pattern formation operation for each shot area S
of the first shot area group S1 has ended, and a pattern formation
operation for the shot areas S of the second shot area group S2 is
starting, the power supply device 22 sets the value of the voltage
that is supplied to the electrode members 3 of the first electrode
pattern 3A, which corresponds to the shot areas S of the first shot
area group S1 on the substrate P where a pattern has already been
formed, to the second voltage value which is smaller than the first
voltage value. The power supply device 22 sets the value of the
voltage that is supplied to the electrode members 3 of the first
electrode pattern 3A to the second voltage value using, for
example, the voltage regulator 26. Moreover, in the present
embodiment, the power supply device 22 maintains the value of the
voltage that is being supplied via the power supply device 22 to
the second through ninth electrode patterns 3B through 3I, which
correspond to the shot areas S of the second through ninth shot
area groups S2 through S9 on the substrate P where a pattern has
not yet been formed or where a pattern formation operation is
currently underway, at the first voltage value.
[0167] When the exposure of the plurality of shot areas S is
underway and, as is shown in typical view in FIG. 15, the pattern
formation operation for each shot area S of the first through third
shot area groups S1 through S3 has ended, and a pattern formation
operation for the shot areas S of the fourth shot area group S4 is
starting, the power supply device 22 sets the value of the voltage
that is supplied to the electrode members 3 of the first through
third electrode patterns 3A through 3C, which correspond to the
shot areas S of the first through third shot area groups S1 through
S3 on the substrate P where a pattern has already been formed, to
the second voltage value which is smaller than the first voltage
value. Moreover, in the present embodiment, the power supply device
22 maintains the value of the voltage that is being supplied via
the power supply device 22 to the fourth through ninth electrode
patterns 3B through 3I, which correspond to the shot areas S of the
fourth through ninth shot area groups S4 through S9 on the
substrate P where a pattern has not yet been formed or where a
pattern formation operation is currently underway, at the first
voltage value.
[0168] When the exposure of the plurality of shot areas S is
underway and, as is shown in the typical view in FIG. 16, the
pattern formation operation for each shot area S of the first
through eighth shot area groups S1 through S8 has ended, and a
pattern formation operation for the shot areas S of the ninth shot
area group S9 is starting, the power supply device 22 sets the
value of the voltage that is supplied to the electrode members 3 of
the first through eighth electrode patterns 3A through 3H, which
correspond to the shot areas S of the first through eighth shot
area groups S1 through S8 on the substrate P where a pattern has
already been formed, to the second voltage value which is smaller
than the first voltage value. Moreover, in the present embodiment,
the power supply device 22 maintains the value of the voltage that
is being supplied via the power supply device 22 to the ninth
electrode pattern 3I, which corresponds to the shot areas S of the
ninth shot area group S9 on the substrate P where a pattern has not
yet been formed or where a pattern formation operation is currently
underway, at the first voltage value.
[0169] After a pattern has been formed on all of the shot areas S
on the substrate P, namely, when exposure of all of the shot areas
S has ended, the power supply device 22 stops the supply of voltage
to all of the plurality of electrode members 3. The control unit 5
then begins an operation to transport (i.e., unload) the exposed
substrate P away from the holding member 20.
[0170] In this manner, in the present embodiment, after voltage has
been supplied to the plurality of electrode members 3 and the
substrate P has been made to attract to the holding surface 19, the
value of the voltage that is supplied to each of the plurality of
electrodes 3 is gradually reduced in the sequence of the first,
second, . . . , and up to the ninth electrode patterns 3A, 3B, . .
. , 3I. When the holding surface 19 and the substrate P are to be
separated using the moving mechanism 44 after a pattern has been
formed on all of the shot areas S on the substrate P, the moving
mechanism 44 starts moving the substrate P relative to the holding
surface 19 such that the portion of the substrate P that
corresponds to the electrode members 3 of the first electrode
pattern 3A where the voltage value was reduced first moves away
first from the holding surface 19.
[0171] As has been described above, in the present embodiment as
well, because the power supply device 22 regulates the voltage that
is supplied to the respective electrode members 3 in accordance
with the information relating to the pattern that is to be formed
on the substrate P, an operation to transport (i.e., unload) the
substrate P away can be executed rapidly at the same time as the
operation to hold the substrate P is being properly executed.
Accordingly, in a state in which the substrate P is being properly
held, the operation to form a pattern on the substrate P can be
properly executed, and it is possible to manufacture a device which
has a desired performance. Moreover, throughput can be improved and
this can contribute to an improvement in device productivity.
Third Embodiment
[0172] Next, a description will be given of a third embodiment. In
the description given below, component elements that are identical
or equivalent to those in the above described embodiments are given
the same symbols and any description thereof is simplified or
omitted.
[0173] In the present embodiment, voltage of a predetermined value
(i.e., the first voltage value) is supplied to the electrode
members 3 that correspond to the shot area groups on a substrate P
where a pattern has not yet been formed or where a pattern
formation operation is currently under way, and the value of the
voltage that is supplied to the electrode members 3 that correspond
to the shot area groups on the substrate P where a pattern has
already been formed is set to a value that is smaller (i.e., 0 or
the second voltage value) than the predetermined value (i.e., the
first voltage value). The characteristic portion of the third
embodiment lies in the fact that voltage of a predetermined value
is supplied to the electrode members 3 that correspond to the shot
area groups on a substrate P where a pattern formation operation is
currently underway, while the value of the voltage that is supplied
to the electrode members 3 that correspond to the other shot area
groups, namely, those shot area groups where a pattern has not yet
been formed or where a pattern has already been formed is set to a
value that is smaller than the predetermined value.
[0174] FIG. 17, FIG. 18, and FIG. 19 are typical views used to
illustrate an example of an operation of the power supply device 22
according to the third embodiment. In the same way as in the above
described embodiments, in the third embodiment as well, patterns
are formed sequentially on a plurality of shot areas S on a
substrate P.
[0175] As is shown, for example, in typical view in FIG. 17, when a
pattern formation operation for the shot areas S of the third shot
area group S3 is started, the power supply device 22 supplies
voltage of a predetermined value to (i.e., sets to ON) the
electrode members 3 of the third electrode pattern 3C which
corresponds to the shot areas S of the third shot area group S3 on
the substrate P where a pattern formation operation is currently
under way, and sets to OFF the value of the voltage that is
supplied to the electrode members 3 of the first and second
electrode patterns 3A and 3B which correspond to the shot areas S
of the first and second shot area groups S1 and S2 on the substrate
P where a pattern has already been formed, and also sets to OFF the
value of the voltage that is supplied to the electrode members 3 of
the fourth through ninth electrode patterns 3D through 3I which
correspond to the shot areas S of the fourth through ninth shot
area groups S4 through S9 on the substrate P where a pattern has
not yet been formed.
[0176] As is shown in typical view in FIG. 18, when the pattern
formation operation for each shot area S of the first through third
shot area groups S1 through S3 has ended, and a pattern formation
operation for the shot areas S of the fourth shot area group S4 is
starting, the power supply device 22 supplies voltage of a
predetermined value to (i.e., sets to ON) the electrode members 3
of the fourth electrode pattern 3D which corresponds to the shot
areas S of the fourth shot area group S4 on the substrate P where a
pattern formation operation is currently under way, and sets to OFF
the value of the voltage that is supplied to the electrode members
3 of the first through third electrode patterns 3A through 3C which
correspond to the shot areas S of the first through third shot area
groups S1 through S3 on the substrate P where a pattern has already
been formed, and also sets to OFF the value of the voltage that is
supplied to the electrode members 3 of the fifth through ninth
electrode patterns 3E through 3I which correspond to the shot areas
S of the fifth through ninth shot area groups S5 through S9 on the
substrate P where a pattern has not yet been formed.
[0177] As is shown in typical view in FIG. 19, when the pattern
formation operation for each shot area S of the first through
fourth shot area groups S1 through S4 has ended, and a pattern
formation operation for the shot areas S of the fifth shot area
group S5 is starting, the power supply device 22 supplies voltage
of a predetermined value to (i.e., sets to ON) the electrode
members 3 of the fifth electrode pattern 3E which corresponds to
the shot areas S of the fifth shot area group S5 on the substrate P
where a pattern formation operation is currently underway, and sets
to OFF the value of the voltage that is supplied to the electrode
members 3 of the first through fourth electrode patterns 3A through
3D which correspond to the shot areas S of the first through fourth
shot area groups S1 through S43 on the substrate P where a pattern
has already been formed, and also sets to OFF the value of the
voltage that is supplied to the electrode members 3 of the sixth
through ninth electrode patterns 3F through 3I which correspond to
the shot areas S of the sixth through ninth shot area groups S6
through S9 on the substrate P where a pattern has not yet been
formed.
[0178] Thereafter, in the same manner, pattern formation operations
are executed for each shot area S with voltage of a predetermined
value being supplied only to the electrode members of the electrode
patterns which correspond to the shot area groups where a pattern
formation operation is currently underway, and with the value of
the voltage that is supplied to the electrode members 3 of
electrode patterns which correspond to the other shot area groups
being set to OFF.
[0179] After a pattern has been formed on all of the shot areas S
of the substrate P, namely, when exposure of all of the shot areas
S has ended, the power supply device 22 stops the supply of voltage
to all of the plurality of electrode members 3. The control unit 5
then begins an operation to transport (i.e., unload) the exposed
substrate P away from the holding member 20.
[0180] In the present embodiment as well, because the power supply
device 22 regulates the voltage that is supplied to the respective
electrode members 3 in accordance with the information relating to
the pattern that is to be formed on the substrate P, an operation
to transport (i.e., unload) the substrate P away can be executed
rapidly at the same time as the operation to hold the substrate P
is being properly executed. Accordingly, in a state in which the
substrate P is being properly held, the operation to form a pattern
on the substrate P can be properly executed, and it is possible to
manufacture a device which has a desired performance. Moreover,
throughput can be improved and this can contribute to an
improvement in device productivity.
Fourth Embodiment
[0181] Next, a description will be given of a fourth embodiment. In
the description given below, component elements that are identical
or equivalent to those in the above described embodiments are given
the same symbols and any description thereof is simplified or
omitted.
[0182] FIG. 20, FIG. 21, and FIG. 22 are typical views used to
illustrate an example of an operation of the power supply device 22
according to the fourth embodiment. In the same way as in the above
described embodiments, in the fourth embodiment as well, patterns
are formed sequentially on a plurality of shot areas S on a
substrate P.
[0183] For example, when a pattern formation operation has begun
for the shot areas S of the third shot area group S3, the power
supply device 22 sets the value of the voltage that is supplied to
the electrode members 3 of the third electrode pattern 3C, which
corresponds to the shot areas S of the third shot area group S3 on
the substrate P where a pattern formation operation is currently
underway, to a first voltage value, and sets both the value of the
voltage that is supplied to the electrode members 3 of the first
and second electrode patterns 3A and 3B, which correspond to the
shot areas S of the first and second shot area groups S1 and S2 on
the substrate P where a pattern has already been formed, and the
value of the voltage that is supplied to the electrode members 3 of
the fourth through ninth electrode patterns 3D through 3I, which
correspond to the shot areas S of the fourth through ninth shot
area groups S4 through S9 on the substrate P where a pattern has
not yet been formed, to a second voltage value that is smaller than
the first voltage value.
[0184] As is shown in typical view in FIG. 21, when the pattern
formation operation for each shot area S of the first through third
shot area groups S1 through S3 has ended, and a pattern formation
operation for the shot areas S of the fourth shot area group S4 is
starting, the power supply device 22 sets the value of the voltage
that is supplied to the electrode members 3 of the fourth electrode
pattern 3D, which correspond to the shot areas S of the fourth shot
area group S4 on the substrate P where a pattern formation
operation is currently underway, to the first voltage value, and
sets both the value of the voltage that is supplied to the
electrode members 3 of the first through third electrode patterns
3A through 3C, which correspond to the shot areas S of the first
through third shot area groups S1 through S3 on the substrate P
where a pattern has already been formed, and the value of the
voltage that is supplied to the electrode members 3 of the fifth
through ninth electrode patterns 3E through 3I, which correspond to
the shot areas S of the fifth through ninth shot area groups S5
through S9 on the substrate P where a pattern has not yet been
formed to the second voltage value which is smaller than the first
voltage value.
[0185] As is shown in typical view in FIG. 22, when the pattern
formation operation for each shot area S of the first through
fourth shot area groups S1 through S4 has ended, and a pattern
formation operation for the shot areas S of the fifth shot area
group S5 is starting, the power supply device 22 sets the value of
the voltage that is supplied to the electrode members 3 of the
fifth electrode pattern 3E, which correspond to the shot areas S of
the fifth shot area group S5 on the substrate P where a pattern
formation operation is currently underway, to the first voltage
value, and sets both the value of the voltage that is supplied to
the electrode members 3 of the first through fourth electrode
patterns 3A through 3D, which correspond to the shot areas S of the
first through fourth shot area groups S1 through S4 on the
substrate P where a pattern has already been formed, and the value
of the voltage that is supplied to the electrode members 3 of the
sixth through ninth electrode patterns 3F through 3I, which
correspond to the shot areas S of the sixth through ninth shot area
groups S6 through S9 on the substrate P where a pattern has not yet
been formed to the second voltage value which is smaller than the
first voltage value.
[0186] Thereafter, in the same manner, pattern formation operations
are executed for each shot area S with the value of the voltage
that is supplied to the electrode members of the electrode patterns
which correspond to the shot area groups where a pattern formation
operation is currently underway set to the first voltage value, and
with the value of the voltage that is supplied to the electrode
members 3 of electrode patterns which correspond to the other shot
area groups being set to the second voltage value.
[0187] After a pattern has been formed on all of the shot areas S
of the substrate P, namely, when exposure of all of the shot areas
S has ended, the power supply device 22 stops the supply of voltage
to all of the plurality of electrode members 3. The control unit 5
then begins an operation to transport (i.e., unload) the exposed
substrate P away from the holding member 20.
[0188] In the present embodiment as well, because the power supply
device 22 regulates the voltage that is supplied to the respective
electrode members 3 in accordance with the information relating to
the pattern that is to be formed on the substrate P, an operation
to transport (i.e., unload) the substrate P away can be executed
rapidly at the same time as the operation to hold the substrate P
is being properly executed. Accordingly, in a state in which the
substrate P is being properly held, the operation to form a pattern
on the substrate P can be properly executed, and it is possible to
manufacture a device which has a desired performance. Moreover,
throughput can be improved and this can contribute to an
improvement in device productivity.
Fifth Embodiment
[0189] Next, a description will be given of a fifth embodiment. In
the description given below, component elements that are identical
or equivalent to those in the above described embodiments are given
the same symbols and any description thereof is simplified or
omitted.
[0190] FIG. 23 is a view showing a holding member 20B according to
the fifth embodiment. In the present embodiment, 18 positive
electrodes 31 (31A to 31R) and 18 negative electrodes 32 (32A to
32R), which correspond respectively to the 18 positive electrodes
31 (31A to 31R), are provided on a holding member 20B. The first,
second, . . . , up to the eighteenth positive electrodes 31A, 31B,
. . . , 31R correspond respectively to the first, second, . . . ,
up to the eighteenth negative electrodes 32A, 32B, . . . , 32R.
Note that, in FIG. 23, the supporting members 41A, 41B, and 41C are
omitted from the drawings.
[0191] A first, second, . . . , up to an eighteenth electrode
pattern 3A, 3B, . . . , 3R are formed by each of the first, second,
. . . , up to the eighteenth positive electrodes 31A, 31B, . . . ,
31R and the first, second, . . . , up to the eighteenth negative
electrodes 32A, 32B, . . . , 32R.
[0192] FIG. 24 is a view showing a relationship between the
electrode members 3 according to the present embodiment and the
shot areas S that are set on the substrate P. In the same way as in
the above described embodiments, a first, second, . . . , up to a
ninth shot area group S1, S2, . . . , S9 are set on the substrate
P.
[0193] As is shown in FIG. 24, each of the plurality of electrode
members 3 has a size and shape that corresponds to the pattern
information, and is positioned on the holding member 20 in
accordance with the pattern information. As is described above, the
pattern information includes at least one of information relating
to the shot areas S on the substrate P and, consequently,
information relating to the chips that are to be formed on the
substrate P.
[0194] As is shown in FIG. 24, the plurality of electrode members 3
are arranged in accordance with information relating to the shot
areas S that are set on the substrate P. In the present embodiment,
the size in the Y axial direction of the respective electrode
members 3 is set so as to substantially match half the size in the
Y axial direction of the shot areas S. Namely, the size in the Y
axial direction of one shot area S is set so as to substantially
match the size in the Y axial direction of two electrode members 3.
Moreover, the size in the X axial direction of each of the first
through eighteenth electrode patterns 3A through 3R that are formed
by the electrode members 3 is set so as to correspond to the size
in the X axial direction of each of the first through ninth shot
area groups S1 through S9 that are formed by the shot areas S.
[0195] Namely, the respective electrode members 3 are arranged so
as to correspond to the plurality of shot areas S. In the present
embodiment, the first and second electrode patterns 3A and 3B are
arranged so as to correspond to the first shot area group S1, and
the third and fourth electrode patterns 3C and 3D are arranged so
as to correspond to the second shot area group S2. In the same way,
the fifth and sixth electrode patterns 3E and 3F are arranged so as
to correspond to the third shot area group S3, the seventh and
eighth electrode patterns 3G and 3H are arranged so as to
correspond to the fourth shot area group S4, the ninth and tenth
electrode patterns 3I and 3J are arranged so as to correspond to
the fifth shot area group S5, the eleventh and twelfth electrode
patterns 3K and 3L are arranged so as to correspond to the sixth
shot area group S6, the thirteenth and fourteenth electrode
patterns 3M and 3N are arranged so as to correspond to the seventh
shot area group S7, the fifteenth and sixteenth electrode patterns
3O and 3P are arranged so as to correspond to the eighth shot area
group S8, and the seventeenth and eighteenth electrode patterns 3Q
and 3R are arranged so as to correspond to the ninth shot area
group S9.
[0196] Next, an example of an operation of the holding member 20B
according to the present embodiment will be described. At a
predetermined timing prior to the commencement of the exposure of
the substrate P, exposure conditions which include pattern
information (i.e., pattern formation conditions) are input by means
of the input device 7. The voltage that is supplied to each
electrode member 3 is regulated by the power supply device 22 in
accordance with the pattern information that has been input by
means of the input device 7. Note that the exposure conditions
including the pattern information (i.e., the pattern formation
conditions) may be stored in advance in the storage device 8, and
the voltage that is supplied to each electrode member 3 may be
regulated by the power supply device 22 in accordance with pattern
information that is stored in this storage device 8.
[0197] In the present embodiment, a description is given of an
example in which the control unit 5 firstly exposes the shot areas
S of the first shot area group S1, and then sequentially exposes
the shot areas S of the second, third, . . . , up to the eighth
shot area groups S2, S3, . . . , S8, and then finally exposes the
shot areas S of the ninth shot area group S9.
[0198] After a substrate P has been placed on the holding surface
19 of the holding member 20 that is provided with the electrode
members 3, in order to attract the substrate P to the holding
surface 19 by electrostatic force, the control unit 5 supplies a
predetermined voltage to the electrode members 3 using the power
supply device 22. In the present embodiment, the power supply
device 22 supplies voltage of a predetermined value to the
electrode members 3 that correspond to shot area groups on the
substrate P where a pattern formation operation is currently
underway, and sets the value of the voltage that is supplied to
electrode members that correspond to the other shot area groups to
OFF.
[0199] For example, as is shown in typical view in FIG. 24, when a
pattern formation operation is started for the shot areas S of the
third shot area group S3, the power supply device 22 supplies
voltage of a predetermined value to (i.e., sets to ON) the
electrode members 3 of the fifth and sixth electrode patterns 3E
and 3F which correspond to the shot areas S of the third shot area
group S3 on the substrate P where a pattern formation operation is
currently underway, and sets to OFF both the value of the voltage
that is supplied to the electrode members 3 of the first through
fourth electrode patterns 3A through 3D which correspond to the
shot areas S of the first and second shot area groups S1 and S2 on
the substrate P where a pattern has already been formed, and the
value of the voltage that is supplied to the electrode members 3 of
the seventh through 18th electrode patterns 3G through 3R which
correspond to the shot areas S of the fourth through ninth shot
area groups S4 through S9 on the substrate P where a pattern has
not yet been formed.
[0200] As is shown in typical view in FIG. 25, when the pattern
formation operation for each shot area S of the first through third
shot area groups S1 through S3 has ended, and a pattern formation
operation for the shot areas S of the fourth shot area group S4 is
starting, the power supply device 22 supplies voltage of a
predetermined value to (i.e., sets to ON) the electrode members 3
of the seventh and eighth electrode patterns 3G and 3H which
correspond to the shot areas S of the fourth shot area group S4 on
the substrate P where a pattern formation operation is currently
underway, and sets to OFF both the value of the voltage that is
supplied to the electrode members 3 of the first through sixth
electrode patterns 3A through 3F which correspond to the shot areas
S of the first through third shot area groups S1 through S3 on the
substrate P where a pattern has already been formed, and the value
of the voltage that is supplied to the electrode members 3 of the
ninth through eighteenth electrode patterns 31 through 3R which
correspond to the shot areas S of the fifth through ninth shot area
groups S5 through S9 on the substrate P where a pattern has not yet
been formed.
[0201] Thereafter, in the same manner, pattern formation operations
are executed for each shot area S with voltage of a predetermined
value being supplied only to the electrode members of the electrode
patterns which correspond to the shot area groups where a pattern
formation operation is currently underway, and with the value of
the voltage that is supplied to the electrode members 3 of
electrode patterns which correspond to the other shot area groups
being set to OFF.
[0202] After a pattern has been formed on all of the shot areas S
of the substrate P, namely, when exposure of all of the shot areas
S has ended, the power supply device 22 stops the supply of voltage
to all of the plurality of electrode members 3. The control unit 5
then begins an operation to transport (i.e., unload) the exposed
substrate P away from the holding member 20.
[0203] In the present embodiment as well, because the power supply
device 22 regulates the voltage that is supplied to the respective
electrode members 3 in accordance with the information relating to
the pattern that is to be formed on the substrate P, an operation
to transport away (i.e., unload) the substrate P can be executed
rapidly at the same time as the operation to hold the substrate P
is being properly executed. Accordingly, in a state in which the
substrate P is being properly held, the operation to form a pattern
on the substrate P can be properly executed, and it is possible to
manufacture a device which has a desired performance. Moreover,
throughput can be improved and this can contribute to an
improvement in device productivity.
Sixth Embodiment
[0204] Next, a description will be given of a sixth embodiment. In
the description given below, component elements that are identical
or equivalent to those in the above described embodiments are given
the same symbols and any description thereof is simplified or
omitted.
[0205] FIG. 26 is a view showing a relationship between the
electrode members 3 according to the present embodiment and the
shot areas S that are set on the substrate P. In the same way as in
the above described fifth embodiment, the holding member 2013 is
provided with 18 positive electrodes 31 (31A to 31R) and 18
negative electrodes 32 (32A to 32R) which correspond respectively
to the 18 positive electrodes 31 (31A to 31R). A first, second, . .
. , up to an eighteenth electrode pattern 3A, 3B, . . . , 3R are
Ruined by each of the first, second, . . . , up to the eighteenth
positive electrodes 31A, 31B, . . . , 31R and the first, second, .
. . , up to the eighteenth negative electrodes 32A, 32B, . . . ,
32R.
[0206] In the present embodiment, a first, second, . . . , up to a
sixth shot area group S1, S2, . . . , S6 are formed on the
substrate P. As is shown in FIG. 26, the plurality of electrode
members 3 are arranged in accordance with information relating to
the shot areas S that are set on the substrate P. In the present
embodiment, the size in the Y axial direction of the respective
electrode members 3 is set so as to be substantially one third the
size of the shot areas S in the Y axial direction. Namely, the size
in the Y axial direction of one shot area S is set so as to
substantially match the size in the Y axial direction of three
electrode members 3. Moreover, the size in the X axial direction of
each of the first through eighteenth electrode patterns 3A through
3R that are formed by the electrode members 3 is set so as to
correspond to the size in the X axial direction of each of the
first through sixth shot area groups S1 through S9 that are formed
by the shot areas S.
[0207] Namely, in the present embodiment as well, the respective
electrode members 3 are arranged so as to correspond to the
plurality of shot areas S. In the present embodiment, the first
through third electrode patterns 3A through 3C are arranged so as
to correspond to the first shot area group S1, and the fourth
through sixth electrode patterns 3D through 3F are arranged so as
to correspond to the second shot area group S2. In the same way,
the seventh through ninth electrode patterns 3G through 3I are
arranged so as to correspond to the third shot area group S3, the
tenth through eleventh electrode patterns 3J through 3L are
arranged so as to correspond to the fourth shot area group S4, the
thirteenth through fifteenth electrode patterns 3M through 3O are
arranged so as to correspond to the fifth shot area group S5, and
the sixteenth through eighteenth electrode patterns 3P through 3R
are arranged so as to correspond to the sixth shot area group
S6.
[0208] Next, an example of an operation of the holding member 20B
according to the present embodiment will be described. At a
predetermined timing prior to the commencement of the exposure of
the substrate P, exposure conditions which include pattern
information (i.e., pattern formation conditions) are input by means
of the input device 7. The voltage that is supplied to each
electrode member 3 is regulated by the power supply device 22 in
accordance with the pattern information that has been input by
means of the input device 7. Note that the exposure conditions
including the pattern information (i.e., the pattern formation
conditions) may be stored in advance in the storage device 8, and
the voltage that is supplied to each electrode member 3 may be
regulated by the power supply device 22 in accordance with pattern
information that is stored in this storage device 8.
[0209] In the present embodiment, a description is given of an
example in which the control unit 5 firstly exposes the shot areas
S of the first shot area group S1, and then sequentially exposes
the shot areas S of the second, third, . . . , up to the fifth shot
area groups S2, S3, . . . , S5, and then finally exposes the shot
areas S of the sixth shot area group S6.
[0210] After a substrate P has been placed on the holding surface
19 of the holding member 20 that is provided with the electrode
members 3, in order to attract the substrate P to the holding
surface 19 by electrostatic force, the control unit 5 supplies a
predetermined voltage to the electrode members 3 using the power
supply device 22. In the present embodiment, the power supply
device 22 supplies voltage of a predetermined value to the
electrode members 3 that correspond to shot area groups on the
substrate P where a pattern formation operation is currently
underway, and sets the value of the voltage that is supplied to
electrode members that correspond to the other shot area groups to
OFF.
[0211] For example, as is shown in typical view in FIG. 26, when a
pattern formation operation is started for the shot areas S of the
second shot area group S2, the power supply device 22 supplies
voltage of a predetermined value to (i.e., sets to ON) the
electrode members 3 of the fourth through sixth electrode patterns
3D through 3F which correspond to the shot areas S of the second
shot area group S2 on the substrate P where a pattern formation
operation is currently underway, and sets to OFF both the value of
the voltage that is supplied to the electrode members 3 of the
first through third electrode patterns 3A through 3C which
correspond to the shot areas S of the first shot area group S1 on
the substrate P where a pattern has already been formed, and the
value of the voltage that is supplied to the electrode members 3 of
the seventh through 18th electrode patterns 3G through 3R which
correspond to the shot areas S of the third through sixth shot area
groups S3 through S6 on the substrate P where a pattern has not yet
been formed.
[0212] As is shown in typical view in FIG. 27, when the pattern
formation operation for each shot area S of the first and second
shot area groups S1 and S2 has ended, and a pattern formation
operation for the shot areas S of the third shot area group S43 is
starting, the power supply device 22 supplies voltage of a
predetermined value to (i.e., sets to ON) the electrode members 3
of the seventh through ninth electrode patterns 3G through 3I which
correspond to the shot areas S of the third shot area group S3 on
the substrate P where a pattern formation operation is currently
underway, and sets to OFF both the value of the voltage that is
supplied to the electrode members 3 of the first through sixth
electrode patterns 3A through 3F which correspond to the shot areas
S of the first and second shot area groups S1 and S2 on the
substrate P where a pattern has already been formed, and the value
of the voltage that is supplied to the electrode members 3 of the
tenth through eighteenth electrode patterns 3J through 3R which
correspond to the shot areas S of the fourth through sixth shot
area groups S4 through S6 on the substrate P where a pattern has
not yet been formed.
[0213] Thereafter, in the same manner, pattern formation operations
are executed for each shot area S with voltage of a predetermined
value being supplied only to the electrode members of the electrode
patterns which correspond to the shot area groups where a pattern
formation operation is currently underway, and with the value of
the voltage that is supplied to the electrode members 3 of
electrode patterns which correspond to the other shot area groups
being set to OFF.
[0214] After a pattern has been formed on all of the shot areas S
of the substrate P, namely, when exposure of all of the shot areas
S has ended, the power supply device 22 stops the supply of voltage
to all of the plurality of electrode members 3. The control unit 5
then begins an operation to transport (i.e., unload) the exposed
substrate P away from the holding member 20.
[0215] In the present embodiment as well, because the power supply
device 22 regulates the voltage that is supplied to the respective
electrode members 3 in accordance with the information relating to
the pattern that is to be formed on the substrate P, an operation
to transport away (i.e., unload) the substrate P can be executed
rapidly at the same time as the operation to hold the substrate P
is being properly executed. Accordingly, in a state in which the
substrate P is being properly held, the operation to form a pattern
on the substrate P can be properly executed, and it is possible to
manufacture a device which has a desired performance. Moreover,
throughput can be improved and this can contribute to an
improvement in device productivity.
[0216] Note that in the above described fifth and sixth
embodiments, examples are given of cases in which the value of the
voltage that is supplied to the electrode members 3 which
correspond to shot area groups other than the shot area groups
where a pattern formation operation is currently underway is set to
OFF, however, it is also possible for the value of the voltage that
is supplied to the electrode members 3 which correspond to shot
area groups where a pattern formation operation is currently
underway to be set to a first voltage value, and for the value of
the voltage that is supplied to the electrode members 3 which
correspond to shot area groups other than the shot area groups
where a pattern formation operation is currently underway to be set
to a second voltage value (excluding 0) that is smaller than the
first voltage value.
[0217] Moreover, in the above described fifth and sixth
embodiments, examples are given of cases in which the value of the
voltage that is supplied to the electrode members 3 which
correspond to shot area groups where a pattern has not yet been
formed is smaller than the value of the voltage that is supplied to
the electrode members 3 which correspond to shot area groups where
a pattern formation operation is currently underway, however, it is
also possible for the value of the voltage that is supplied to the
electrode members 3 which correspond to shot area groups where a
pattern has not yet been formed to be the same as the value of the
voltage that is supplied to the electrode members 3 which
correspond to shot area groups where a pattern formation operation
is currently underway.
[0218] In the above described embodiment, even when the width of
the shot areas is altered it is still possible to execute voltage
control for each shot area simply by altering the number of
electrodes which are controlled simultaneously. Note that, in the
above described embodiment, the width of the electrodes is set to
half the width of the shot areas, however, it is also possible to
provide an even larger number of electrodes within the width of
each shot area.
Seventh Embodiment
[0219] Next, a description will be given of a seventh embodiment.
In the description given below, component elements that are
identical or equivalent to those in the above described embodiments
are given the same symbols and any description thereof is
simplified or omitted.
[0220] In the above described first through sixth embodiments, the
moving mechanism 44 that moves the substrate P relative to the
holding member 20 is provided with supporting members 41A through
41C that are provided on the holding member 20, however, the
characteristic portion of the seventh embodiment lies in the fact
that the moving mechanism is provided with a transporting member
which transports a substrate P onto and away from the holding
member.
[0221] FIG. 28 is a perspective view showing a moving mechanism 44B
according to the seventh embodiment. The moving mechanism 44B of
the present embodiment is provided with a transporting member 51
that transports a substrate P onto and away from a holding member
20C. The moving mechanism 44B moves the substrate P both in a
direction in which it approaches and a direction in which it moves
away from the holding surface 19 of the holding member 20 using the
transporting member 51.
[0222] As is shown in FIG. 28, the transporting member 51 of the
present embodiment is provided with an arm portion 52, and a
plurality of supporting portions 53A, 53B, and 53C that are
provided on the arm portion 52 and support a predetermined area of
the rear surface of the substrate P (i.e., the rear surface of the
peripheral portion of the substrate P, in this embodiment). In the
present embodiment, the transporting member 51 is provided with the
three supporting portions 53A, 53B, and 53C.
[0223] The arm portion 52 is a circular arc-shaped component whose
are lies within the XY plane, and is shaped so as to conform to a
side surface of the holding member 20C. The arm portion 52 can be
positioned so as to encircle the side surface of the holding member
20C. The arm portion 52 also has a first protruding portion 52A and
a second protruding portion 52B that protrude inwardly (i.e.,
towards the center of the circular arc-shaped arm portion 52)
provided respectively on its two distal ends. In addition, the arm
portion 52 has a third protruding portion 52C that protrudes
inwardly substantially in the center between the two distal ends.
First, second, and third supporting portions 53A, 53B, and 53C are
provided respectively on the first, the second, and the third
protruding portions 52A, 52B, and 52C of the arm portion 52. The
first, second, and third supporting portions 53A, 53B, and 53C are
each shaped so as to protrude upwardly (i.e., in the +Z direction)
from the arm portion 52.
[0224] The holding member 20C is provided with first through ninth
electrode patterns 3A through 3I. In addition, grooves 54A and 54B
that extend in the Y axial direction are formed respectively on the
side surface on the -X side and the side surface on the +X side of
the holding member 20C. Moreover, the holding member 20C is
provided with first, second, and third recessed portions 55A, 55B,
and 55C that are shaped so as to correspond respectively to the
first, second, and third protruding portions 52A, 52B, and 52C.
Each of the first, second, and third recessed portions 55A, 55B,
and 55C is formed in the side surface of the holding member 20C,
and these recessed portions are able to house respectively the
first, second, and third protruding portions 52A, 52B, and 52C. In
the present embodiment, the third recessed portion 55C which
corresponds to the third protruding portion 52C is positioned on
the -Y side (i.e., on the first electrode pattern 3A side) relative
to the center of the holding surface 19. The first and second
recessed portions 55A and 55B which correspond to the first and
second protruding portions 52A and 52B are positioned on the +Y
side (i.e., on the ninth electrode pattern 3I side) relative to the
center of the holding surface 19.
[0225] Each of the first, second, and third recessed portions 55A,
55B, and 55C are formed so as to extend in the Z axial direction,
and each one is formed such that a notch is cut in a portion of the
holding surface 19. Moreover, the first, second, and third recessed
portions 55A, 55B, and 55C are also formed so as to join together
the holding surface 19 and the grooves 54. The first, second, and
third protruding portions 52A, 52B, and 52C are each able to move
in the Z axial direction, in the first, second, and third recessed
portions 55A, 55B, and 55C, and along the first, second, and third
recessed portions 55A, 55B, and 55C.
[0226] Each of the first, second, and third recessed portions 55A,
55B, and 55C is formed such that a notch is cut in a portion of the
holding surface 19, and then portions of the rear surface of a
substrate P that is mounted on the holding surface 19 are exposed
at the first, second, and third recessed portions 55A, 55B, and
55C.
[0227] When the first, second, and third protruding portions 52A,
52B, and 52C of the transporting member 51 are placed in the first,
second, and third recessed portions 55A, 55B, and 55C of the
holding member 20C, the moving mechanism 44B is able to move the
transporting member 51 such that top ends of the first, second, and
third supporting portions 53A, 53B, and 53C are positioned on the
+Z side of the holding surface 19, and is also able to move the
transporting member 51 such that top ends of the first, second, and
third supporting portions 53A, 53B, and 53C are positioned on the
-Z side of the holding surface 19.
[0228] Because portions of the rear surface of the substrate P that
has been mounted on the holding surface 19 are exposed at the
first, second, and third recessed portions 55A, 55B, and 55C, the
transporting member 51 is able to move the substrate P in the Z
axial direction relative to the holding surface 19 of the holding
member 20 at the same time as it is supporting the portions of the
rear surface of the substrate P that are exposed at the first,
second, and third recessed portions 55A, 55B, and 55C using the
supporting portions 53. Namely, when a substrate P is being
supported by the first, second, and third supporting portions 53A,
53B, and 53C of the transporting member 51, by moving this
transporting member 51 in the Z axial direction, the moving
mechanism 44 is able to move the substrate P in a direction in
which the holding surface 19 of the holding member 20 and the rear
surface of the substrate P approach each other and in a direction
in which they move away from each other.
[0229] When transporting (i.e., loading) a substrate P onto the
holding member 20C using the transporting member 51, the moving
mechanism 44B positions the transporting member 51, which is
supporting the substrate P by means of the respective supporting
portions 53A, 53B, and 53C, above the holding surface 19 of the
holding member 20, and, when the top ends of the respective
recessed portions 55A, 55B, and 55C have been positioned together
with the respective protruding portions 52A, 52B, and 52C, moves
the transporting member 51 in the -Z direction. The respective
protruding portions 52A, 52B, and 52C of the transporting member 51
are able to move in the -Z direction along the respective recessed
portions 55A, 55B, and 55C, and, in conjunction with the movement
of the transporting member 51 in the -Z direction, the rear surface
of the substrate P which is supported by the supporting portions
53A, 53B, and 53C comes into contact with the holding surface 19 of
the holding member 20. In addition, after the transporting member
51 has been moved further in the -Z direction, and the first and
second protruding portions 52A and 52B have been placed in the
grooves 54A and 54B, the moving mechanism 44B moves the
transporting member 51 in the -Y direction. The first and second
protruding portions 52A and 52B of the transporting member 51 are
able to move in the -Y direction on the inner side of the grooves
54A and 54B. Because of this, the transporting member 51 is able to
move in the -Y direction and move away from the holding member 20C
while contact between the transporting member 51 and the holding
member 20C is limited.
[0230] Moreover, when transporting (i.e., unloading) the substrate
P away from the top of the holding member 20 using the transporting
member 51, the moving mechanism 44B positions the transporting
member 51 on the -Y side of the holding member 20C, and, when the
positions of the first and second protruding portions 52A and 52B
have been matched to those of the grooves 54A and 54B, moves the
transporting member 51 in the +Y direction. The first and second
protruding portions 52A and 52B of the transporting member 51 are
able to move in the +Y direction in the grooves 54A and 54B along
the grooves 54A and 54B, and, in conjunction with the movement of
the transporting member 51 in the +Y direction, the positions of
the first and second protruding portions 52A and 52B are matched to
those of the first and second recessed portions 55A and 55B. In
addition, the position of the third protruding portion 52C is
matched to that of the third recessed portion 55C. When bottom ends
of the respective recessed portions 55A, 55B, and 55C of the
holding member 20C have been positioned together with the
respective protruding portions 52A, 52B, and 52C of the
transporting member 51, the transporting mechanism 44B moves the
transporting member 51 in the +Z direction. The respective
protruding portions 52A, 52B, and 52C of the transporting member 51
are able to move in the +Z direction on the inner side of the
respective recessed portions 55A, 55B, and 55C, and, in conjunction
with the movement of the transporting member 51 in the +Z
direction, portions of the rear surface of the substrate P which is
mounted on the holding surface 19 come into contact with the
supporting portions 53A, 53B, and 53C. If the transporting member
51 is then moved further in the +Z direction, the substrate P
becomes supported on the supporting portions 53A, 53B, and 53C, and
the rear surface of the substrate P is separated from the holding
surface 19. After the transporting member 51 is then moved further
in the +Z direction, so that the holding member 20 is sufficiently
separated from the transporting member 51 which is supporting the
substrate P, the moving mechanism 44B moves the transporting member
51 in a predetermined direction. As a result, the substrate P is
transported away from the holding member 20C by the transporting
member 51.
[0231] FIG. 29 is a typical view showing an example of an operation
when the holding member 20C is separated from the substrate P by
the moving mechanism 44B according to the present embodiment. As is
shown in FIG. 29, the moving mechanism 44B starts to move the
substrate P relative to the holding member 20C such that one
portion of the rear surface of the substrate P moves away first
from the holding surface 19 before other portions thereof move
away. In the present embodiment, the third supporting portion 53C
supports the portion of the rear surface of the substrate P that
moves away first from the holding surface 19. In other words, the
driving of the moving mechanism 44B is controlled such that, of the
three supporting portions 53A, 53B, and 53C, the third supporting
portion 53C starts to move away first from the holding surface 19
in the +Z direction before the other supporting portions 53A and
53B.
[0232] In the same way as in the above described embodiments, after
voltage has been supplied to the respective electrode members 3 of
the plurality of electrode patterns 3A through 3I so as to attract
the substrate P to the holding surface 19, the supply of voltage to
the plurality of electrode members 3 is stopped in a predetermined
sequence which corresponds to the sequence in which a pattern is to
be formed (i.e., a sequence in which the shot areas S are to be
exposed). Namely, firstly, the supply of voltage to the electrode
members 3 of the first electrode pattern 3A is stopped, and
thereafter the supply of voltages to the electrode members 3 is
stopped in the sequence of the second, the third, . . . , and up to
the ninth electrode patterns 3B, 3C, . . . , 3I. The moving
mechanism 44B starts the movement of the substrate P relative to
the holding member 20C such that the portion of the rear surface of
the substrate P that corresponds to the electrode members 3 of the
first electrode pattern 3A to which the supply of voltage was
stopped first, namely, the portion adjacent to the edge of the
substrate P on the -Y side is separated first from the holding
surface 19 of the holding member 20.
[0233] In the present embodiment, of the plurality of supporting
portions 53A, 53B, and 53C, the third supporting member 53C is
placed adjacent to the edge of the substrate P on the -Y side. The
control unit 5 controls the moving mechanism 44B such that the
third supporting member 53C starts to move in the +Z direction from
the holding surface 19 earlier than the other supporting members
53A and 53B. As a result, the substrate P can be moved such that
the portion in the vicinity of the edge on the -Y side of the
substrate P that is supported by the third supporting member 53C
moves away first from the holding surface 19 of the holding member
20.
[0234] Moreover, by providing a grounded conductive member in the
third supporting S portion 53C, electricity (i.e., any electric
charge) which is electrifying the substrate P is properly
removed.
[0235] Moreover, in the present embodiment, it is possible to
provide, for example, in the supporting portions 53A and 53B, an
electrostatic chuck mechanism that includes electrode members that
generate electrostatic force in order to attract the substrate P to
the supporting portions 53A and 53B.
[0236] Note that in the above described embodiment the moving
mechanism 44B moves the substrate P relatively to a substantially
static holding member 20, however, it is also possible to move the
holding member 20 relatively to a substantially static substrate P,
or to move both the holding member 20 and the substrate P.
[0237] Note also that in each of the above described embodiments,
the moving mechanisms 44, 44B are applied to the holding members
20, 20C which include a plurality of electrode members, however,
the moving mechanisms 44, 44B can be applied to holding members
each of which includes one or two electrode member(s).
[0238] Note also that in each of the above described embodiments,
the holding members 20, 20C can alternatively support the rear
surface of the substrate P with multiple pin members (convex
portions or protruding portions) the distal ends of which are
disposed on a plane. In the case in which the holding members 20,
20C include the multiple pin members, the plane comprising the
distal ends of the multiple pin members can be applied as the
holding surface.
[0239] Note also that in each of the above described embodiments,
the antistatic device 47 that removes electrostatic charge on the
substrate P is provided with a grounded conductive member 48 that
touches the holding surface 19 of the holding member 20, however,
it may also be provided with a grounded conductive member that
touches a portion of the side surface or front surface of the
substrate P. Moreover, provided that electrostatic charge on the
substrate P can be removed, then it is not essential for the
conductive member to be grounded.
[0240] In addition, in each of the above described embodiments, a
description is given of an example in which the electrostatic chuck
mechanism is what is known as a bipolar type of mechanism, however,
it is also possible for a unipolar type of mechanism to be
used.
[0241] Furthermore, in each of the above described embodiments, the
electrode members are divided only in the Y axial direction, and
pairs of positive electrodes and negative electrodes are only
created in the X axial direction, however, it is also possible to
also divide the electrode members in the X axial direction, and set
the voltage supplied to those electrode members that correspond to
areas where exposure in the X axial direction has ended to OFF. For
example, it is also possible to position a plurality of electrode
members such that positive electrodes and negative electrodes are
placed at intervals relating to the chip width, or at intervals
relating to the width of the slit (i.e., the projection area) where
scanning exposure is performed, and to sequentially set to OFF the
voltage of electrode members that correspond to the width of the
slit or of chips where exposure has ended.
[0242] Furthermore, in a case in which the electrode members are
divided in both the X axial direction and the Y axial direction,
predetermined numbers of the electrode members can be selected from
among the plurality of the electrode members, in accordance with
the information of the pattern formed on the substrate P (e.g., the
size of the shot area S). That is, the predetermined numbers of the
electrode members are assigned to each of the shot areas S. In this
case, the power supply device regulates the voltage supplied to the
numbers of the electrode members, which are assigned to the every
shot areas S.
[0243] Moreover, in each of the above described embodiments, the
voltages of a positive electrode and negative electric pair which
are positioned in the X axial direction are changed simultaneously,
however, it is also possible to change the voltage of only one
electrode member.
[0244] Note also that not only can a semiconductor wafer which is
used to manufacture a semiconductor device be used as the substrate
P of the above described embodiments, but it is also possible to
use a glass substrate which is used for a display device, a ceramic
wafer which is used for a thin-film magnetic head, an original
plate (i.e., synthetic quartz or silicon wafer) of a mask or
reticle which is used in an exposure apparatus, film member, or the
like. Moreover, the substrate is not limited to round shape, but
may be rectangular or other shapes.
[0245] As the exposure apparatus EX, in addition to a step-and-scan
type of scanning exposure apparatus (i.e., a scanning stepper)
which makes a scanning exposure of a pattern on a mask M while
moving the mask M and a substrate P in synchronization, it is also
possible to use a step-and-repeat type of projection scanning
device (i.e., a stepper) that collectively exposes the pattern on a
mask M while the mask M and substrate P are static, and moves the
substrate P in sequential steps.
[0246] Furthermore, in a step-and-repeat type of exposure, it is
also possible to transfer to a contracted image of a first pattern
onto a substrate P using a projection optical system while the
first pattern and the substrate P are substantially stationary, and
to then superimpose a reduced image of a second pattern partially
onto the first pattern using the projection optical system while
the second pattern and the substrate P are substantially
stationary, and then collectively expose it onto the substrate P
(i.e., using a stitch type of collective exposure apparatus).
Moreover, as a stitch type of collective exposure apparatus, it is
also possible to use a step-and-stitch type of exposure apparatus
that partially superimposes and then transfers at least two
patterns onto a substrate P, and moves the substrate P
sequentially.
[0247] Moreover, as is disclosed, for example, in U.S. Pat. No.
6,611,316, the present invention can also be applied to an exposure
apparatus that synthesizes two mask patterns on a substrate via a
projection optical system, and performs a double exposure
substantially simultaneously of a single shot area on the substrate
by means of a single scan exposure.
[0248] Moreover, the present invention can also be applied to a
twin stage type of exposure apparatus that is provided with a
plurality of substrate stages such as is described in U.S. Pat.
Nos. 6,341,007, 6,400,441, 6,549,269, 6,590,634, 6,208,407, and
6,262,796.
[0249] Furthermore, as is described in, for example, Japanese
Patent Application Publication No. H11-135400 A (corresponding to
PCT International Publication No. 1999/23692) and U.S. Pat. No.
6,897,963, the present invention can also be applied to an exposure
apparatus that is provided with a substrate stage that holds a
substrate, and a measurement stage on which are mounted reference
components on which reference marks are formed and/or various types
of photoelectric sensors. The present invention can also be applied
to an exposure apparatus that is provided with a plurality of
substrate stages and measurement stages.
[0250] The type of exposure apparatus EX that is used is not
limited to an exposure apparatus for manufacturing a semiconductor
device that exposes a semiconductor device pattern onto a substrate
P, and the present invention may also be broadly applied to
exposure apparatuses for manufacturing liquid crystal display
elements or manufacturing displays and the like, and to exposure
apparatuses for manufacturing thin-film magnetic heads, image
pickup elements (CCD), micro machines, MEMS, DNA chips, or reticles
and masks, and the like.
[0251] As has been described above, the exposure apparatus EX
according to the embodiments is manufactured by assembling various
subsystems that include the respective component elements such that
they have predetermined levels of mechanical accuracy, electrical
accuracy, and optical accuracy. In order to secure these levels of
accuracy, various adjustments are made before and after the
assembly step, including adjustments to achieve optical accuracy in
the various optical systems, adjustments to achieve mechanical
accuracy n the various mechanical systems, and adjustments to
achieve electrical accuracy in the various electrical systems. The
assembly step to assemble an exposure apparatus from the various
subsystems includes making mechanical connections, electrical
circuit wiring connections, and air pressure circuit tube
connections and the like between the various subsystems. Prior to
the assembly step to assemble an exposure apparatus from the
various subsystems, it is of course necessary to perform assembly
steps to assemble the respective individual subsystems. Once the
assembly step to assemble an exposure apparatus from the various
subsystems has ended, comprehensive adjustments are made so as to
secure various levels of accuracy in the exposure apparatus as a
whole. Note that it is desirable for the manufacturing of the
exposure apparatus to be conducted in a clean room in which
temperature and cleanliness and the like are controlled.
[0252] As is shown in FIG. 30, a micro device such as a
semiconductor device is manufactured via a step 201 in which the
functions and performance of the micro device are designed, a step
202 in which a mask (i.e., a reticle) that is based on the design
step is manufactured, a step 203 in which a substrate that forms
the base material of the device is manufactured, a substrate
processing step 204 that includes substrate processing (i.e.,
exposure processing) in which a substrate is exposed using an image
of a pattern on a mask and the exposed substrate is then developed,
a device assembly step 205 (including working processes such as a
dicing step, a bonding step, a packaging step and the like), and an
inspection step 206.
[0253] Note that in the above described embodiments, descriptions
are given of examples in which the device that is used to form a
pattern on a substrate P is an exposure apparatus that forms a
pattern on a photosensitive substrate P by irradiating exposure
light EL onto the substrate P, however, the holding apparatus of
the present invention can also be applied to various pattern
forming devices that form a pattern on a substrate P. Examples of
this type of pattern forming device include inkjet devices that
form a pattern on a substrate by discharging ink droplets, for
example, onto the substrate, and nanoimprint devices that press
together an original plate on which a concavo-convex pattern has
been formed and a substrate on which an organic material has been
coated while heating the two to more than the glass transition
temperature of the substrate, and then separate the original plate
from the substrate and cool the substrate so as to transfer the
pattern on the original plate onto the substrate. When a holding
apparatus that holds the substrate is provided in these
apparatuses, if the substrate is held using the holding apparatus
of the present invention, then the substrate can be held in a
desired state. For example, if the surface of a substrate P is
divided into a plurality of micro areas, and an operation to form a
pattern on each of these micro areas (i.e., an operation to
discharge droplets of ink) is executed by an inkjet device, then
the electrode members of the holding member are positioned in
accordance with the micro areas, and the power supply device of the
holding apparatus regulates the voltage that is supplied to each of
the plurality of the electrode members that are provided in the
holding apparatus in accordance with the sequence in which the
pattern is to be formed.
[0254] The holding apparatus according to the present invention is
not limited to the pattern forming apparatus, and can alternatively
be applied to, for example, a holding apparatus provided in a
substrate processing apparatus such as an apparatus for coating a
resist onto the substrate P, an apparatus for developing the
pattern formed on the substrate P, or the like. In a case in which
an aspect of the present invention is applied to this holding
apparatus, the power supply device 22 can regulate the voltage
supplied to the electrode members with disregard to the pattern
information.
[0255] As far as is permitted, the disclosures in all of the
Japanese Patent Publications and U.S. Patents related to exposure
apparatuses and the like cited in the above respective embodiments
and modified examples are incorporated herein by reference.
[0256] Note that embodiments of the present invention have been
described above, however, the present invention can be used by
appropriately combining all of the above described component
elements, or, in some cases, a portion of the component elements
may not be used.
* * * * *