U.S. patent application number 13/440876 was filed with the patent office on 2013-03-28 for method of manufacturing touch panel.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. The applicant listed for this patent is Youn Soo Kim, Young Jae Kim, Seung Min Lee, Ho Joon Park, Ha Yoon Song. Invention is credited to Youn Soo Kim, Young Jae Kim, Seung Min Lee, Ho Joon Park, Ha Yoon Song.
Application Number | 20130075266 13/440876 |
Document ID | / |
Family ID | 47910053 |
Filed Date | 2013-03-28 |
United States Patent
Application |
20130075266 |
Kind Code |
A1 |
Kim; Youn Soo ; et
al. |
March 28, 2013 |
METHOD OF MANUFACTURING TOUCH PANEL
Abstract
Disclosed herein is a method of manufacturing a sensing
electrode of a touch panel according to a preferred embodiment of
the present invention including: forming a non-conductive mesh
skeleton on a transparent substrate using an electrospinning
solution by an electrospinning method; and forming an electrode
layer on the non-conductive mesh skeleton by performing electroless
plating processing. The preferred embodiments of the present
invention can implement uniform conductivity for all the electrode
layers by preventing irregular conductivity between the mesh
skeletons by forming a non-conductive mesh skeleton using the
electrospinning method and then, forming the electrode layers using
the electroless plating.
Inventors: |
Kim; Youn Soo; (Seoul,
KR) ; Park; Ho Joon; (Seoul, KR) ; Lee; Seung
Min; (Gyunggi-do, KR) ; Song; Ha Yoon;
(Gyunggi-do, KR) ; Kim; Young Jae; (Gyunggi-do,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kim; Youn Soo
Park; Ho Joon
Lee; Seung Min
Song; Ha Yoon
Kim; Young Jae |
Seoul
Seoul
Gyunggi-do
Gyunggi-do
Gyunggi-do |
|
KR
KR
KR
KR
KR |
|
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Gyunggi-do
KR
|
Family ID: |
47910053 |
Appl. No.: |
13/440876 |
Filed: |
April 5, 2012 |
Current U.S.
Class: |
205/122 |
Current CPC
Class: |
C23C 18/1608 20130101;
C23C 18/1893 20130101; C23C 18/2086 20130101; C23C 18/30 20130101;
C23C 18/208 20130101; C23C 18/1603 20130101; C23C 18/1889 20130101;
D01D 5/0084 20130101; C23C 18/1689 20130101 |
Class at
Publication: |
205/122 |
International
Class: |
C25D 5/02 20060101
C25D005/02 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 27, 2011 |
KR |
1020110097497 |
Claims
1. A method of manufacturing a touch panel, comprising: forming a
non-conductive mesh skeleton on a transparent substrate using an
electrospinning solution by an electrospinning method; and forming
an electrode layer on the non-conductive mesh skeleton by
performing electroless plating processing.
2. The method as set forth in claim 1, further comprising after the
performing of the electroless plating processing, patterning the
electrode layer.
3. The method as set forth in claim 2, wherein the patterning of
the electrode layer includes: disposing a patterned mask on the
electrode layer; and forming the sensing electrode by patterning
the electrode layer by irradiating a laser thereto so as to
correspond to the patterned mask.
4. The method as set forth in claim 1, wherein the forming of the
non-conductive mesh skeleton by the electrospinning method
includes: providing the electrospinning solution to a capillary
tube; disposing a current collector on the other surface of the
transparent substrate; and forming the electrode layer by applying
the spinning solution to one surface of the transparent substrate
from the capillary tube by applying voltage between the spinning
solution and the current collector.
5. The method as set forth in claim 1, wherein the electrospinning
solution is a non-conductive polymer material and includes at least
one selected from silicon resin, phenol resin, natural modified
phenol resin, epoxy resin, polyvinyl alcohol-based resin, and
cellulose-based resin.
6. The method as set forth in claim 1, wherein the electrospinning
solution includes at least one selected from polyolefin-based
resin, styrene-based resin, and acrylic resin.
7. The method as set forth in claim 1, wherein the electrospinning
solution includes a seed material using at least one selected from
tin (Sn), gold (Au), silver (Ag), copper (Cu), nickel (Ni), iron
(Fe), cadmium (Cd), lead (Pb), rhodium (Rd), palladium (Pd), and
rubidium (Ru) as a plating nucleus.
8. A method of manufacturing a touch panel, comprising: applying a
photoresist to one surface of a transparent substrate; patterning
the photoresist through an exposure process and a developing
process so that an opening part is formed; forming a non-conductive
mesh skeleton by applying an electrospinning solution to the
transparent substrate exposed from the opening part; forming an
electrode layer by performing an electroless plating processing on
the non-conductive mesh skeleton; and removing the photoresist.
9. The method as set forth in claim 8, wherein the forming of the
non-conductive mesh skeleton on the transparent substrate exposed
from the opening part using the electrospinning solution by the
electrospinning method includes: providing the electrospinning
solution to a capillary tube; disposing a current collector on the
other surface of the transparent substrate; and forming the mesh
skeleton by applying the spinning solution to one surface of the
transparent substrate from the capillary tube by applying voltage
between the spinning solution and the current collector.
10. The method as set forth in claim 8, wherein the electrospinning
solution is a non-conductive polymer material and includes at least
one selected from silicon resin, phenol resin, natural modified
phenol resin, epoxy resin, polyvinyl alcohol-based resin, and
cellulose-based resin.
11. The method as set forth in claim 8, wherein the electrospinning
solution includes at least one selected from polyolefin-based
resin, styrene-based resin, and acrylic resin.
12. The method as set forth in claim 8, wherein the electrospinning
solution includes a seed material using at least one selected from
tin (Sn), gold (Au), silver (Ag), copper (Cu), nickel (Ni), iron
(Fe), cadmium (Cd), lead (Pb), rhodium (Rd), palladium (Pd), and
rubidium (Ru) as a plating nucleus.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of Korean Patent
Application No. 10-2011-0097497, filed on Sep. 27, 2011, entitled
"Method of Manufacturing Touch Panel," which is hereby incorporated
by reference in its entirety into this application.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to a method of manufacturing a
touch panel.
[0004] 2. Description of the Related Art
[0005] With the development of computers using a digital
technology, devices assisting computers have also been developed,
and personal computers, portable transmitters and other personal
information processors execute processing of text and graphics
using a variety of input devices such as a keyboard and a
mouse.
[0006] While the rapid advancement of an information-oriented
society has been widening the use of computers more and more, it is
difficult to efficiently operate products using only a keyboard and
mouse currently serving as an input device. Therefore, the
necessity for a device that is simple, has minimum malfunction, and
is capable of easily inputting information has increased.
[0007] In addition, current techniques for input devices have
progressed toward techniques related to high reliability,
durability, innovation, designing and processing beyond the level
of satisfying general functions. To this end, a touch panel has
been developed as an input device capable of inputting information
such as text, graphics, or the like.
[0008] This touch panel is mounted on a display surface of an image
display device such as an electronic organizer, a flat panel
display device including a liquid crystal display (LCD) device, a
plasma display panel (PDP), an electroluminescence (El) element, or
the like, or a cathode ray tube
[0009] (CRT) to thereby be used to allow a user to select desired
information while viewing the image display device.
[0010] Meanwhile, the touch panel is classified into a resistive
type touch panel, a capacitive type touch panel, an electromagnetic
type touch panel, a surface acoustic wave (SAW) type touch panel,
and an infrared type touch panel. These various types of touch
panels are adapted for electronic products in consideration of a
signal amplification problem, a resolution difference, a level of
difficulty of designing and processing technologies, optical
characteristics, electrical characteristics, mechanical
characteristics, resistance to an environment, input
characteristics, durability, and economic efficiency. Currently,
the resistive type touch panel and the capacitive type touch panel
have been prominently used in a wide range of fields.
[0011] ITO as the transparent electrode according to the prior art
has been the most widely used for a plasma display panel (PDP), a
liquid crystal display (LCD) device, a light emitting diode (LED)
device, an organic light emitting display (OLED) device, a touch
panel, a solar cell, or the like.
[0012] However, since indium oxide (In.sub.2O.sub.3) of the ITO is
generated as by-product in a zinc (Zn) mine, the supply and demand
thereof is unstable and the flexibility thereof lacks. Therefore,
there is a problem in that the ITO is not used for a flexible
material such as a polymer substrate, or the like. Further, there
is a problem in that the ITO is manufactured only under a high
temperature and high pressure environment to increase manufacturing
costs. To solve the problems, many attempts to replace the ITO have
been conducted. An electrode using CNT, grapheme, metal grid, metal
wire, and conductive polymer is a result of these attempts. ITO
substitute electrodes have various problems in terms of dispersion,
filtering, printing line width, coating, or the like. In
particular, when a mixture of metal and an organic-binder material
is used, the metals are enclosed with organic materials, such that
it is difficult to contact metals to each other. As a result, it is
difficult to obtain uniform conductivity and to form fine
patterning.
SUMMARY OF THE INVENTION
[0013] The present invention has been made in an effort to provide
a method of manufacturing a transparent electrode capable of
improving visibility of a touch panel and conductivity of a sensing
electrode forming the touch panel and facilitating patterning by
forming a mesh skeleton of a fabric-type non-conductive material by
an electrospinning method and then, coating a surface of the touch
panel by electroless plating, and a sensing electrode using the
same.
[0014] According to a first preferred embodiment of the present
invention, there is provided a method of manufacturing a touch
panel, including: forming a non-conductive mesh skeleton on a
transparent substrate using an electrospinning solution by an
electrospinning method ; and forming an electrode layer on the
non-conductive mesh skeleton by performing electroless plating
processing.
[0015] The method of manufacturing a touch panel may further
include after the performing of the electroless plating processing,
patterning the electrode layer.
[0016] The patterning of the electrode layer may include: disposing
a patterned mask on the electrode layer; and forming the sensing
electrode by patterning the electrode layer by irradiating a laser
thereto so as to correspond to the patterned mask.
[0017] The forming of the non-conductive mesh skeleton by the
electrospinning method may include: providing the electrospinning
solution to a capillary tube; disposing a current collector on the
other surface of the transparent substrate; and forming the
electrode layer by applying the spinning solution to one surface of
the transparent substrate from the capillary tube by applying
voltage between the spinning solution and the current
collector.
[0018] The electrospinning solution may be a non-conductive polymer
material and may include at least one selected from silicon resin,
phenol resin, natural modified phenol resin, epoxy resin, polyvinyl
alcohol-based resin, and cellulose-based resin.
[0019] The electrospinning solution may include at least one
selected from polyolefin-based resin, styrene-based resin, and
acrylic resin.
[0020] The electrospinning solution may include a seed material
using at least one selected from tin (Sn), gold (Au), silver (Ag),
copper (Cu), nickel (Ni), iron (Fe), cadmium (Cd), lead (Pb),
rhodium (Rd), palladium (Pd), and rubidium (Ru) as a plating
nucleus.
[0021] According to a second preferred embodiment of the present
invention, there is provided a method of manufacturing a touch
panel, including: applying a photoresist to one surface of a
transparent substrate; patterning the photoresist by an exposure
process and a developing process so that an opening part is formed;
forming a non-conductive mesh skeleton by applying an
electrospinning solution to the transparent substrate exposed from
the opening part; forming an electrode layer by performing an
electroless plating processing on the non-conductive mesh skeleton;
and removing the photoresist.
[0022] The forming of the non-conductive mesh skeleton by the
electrospinning method may include: providing the electrospinning
solution to a capillary tube; disposing a current collector on the
other surface of the transparent substrate; and forming the mesh
skeleton by applying the spinning solution to one surface of the
transparent substrate from the capillary tube by applying voltage
between the spinning solution and the current collector.
[0023] The electrospinning solution may be a non-conductive polymer
material and may include at least one selected from silicon resin,
phenol resin, natural modified phenol resin, epoxy resin, polyvinyl
alcohol-based resin, and cellulose-based resin.
[0024] The electrospinning solution may include at least one
selected from polyolefin-based resin, styrene-based resin, and
acrylic resin.
[0025] The electrospinning solution may include a seed material
using at least one selected from tin (Sn), gold (Au), silver (Ag),
copper (Cu), nickel (Ni), iron (Fe), cadmium (Cd), lead (Pb),
rhodium (Rd), palladium (Pd), and rubidium (Ru) as a plating
nucleus.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] FIG. 1 is a flow chart sequentially showing a process of
manufacturing a sensing electrode of a touch panel according to a
preferred embodiment of the present invention;
[0027] FIGS. 2 to 5 are diagrams showing a process of manufacturing
a sensing electrode of a touch panel according to a first preferred
embodiment of the present invention;
[0028] FIGS. 6 to 11 are diagrams showing a process of
manufacturing a sensing electrode of a touch panel according to a
second preferred embodiment of the present invention; and
[0029] FIGS. 12 to 14 are cross-sectional views of the touch panel
including the sensing electrode according to the preferred
embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0030] Various features and advantages of the present invention
will be more obvious from the following description with reference
to the accompanying drawings.
[0031] The terms and words used in the present specification and
claims should not be interpreted as being limited to typical
meanings or dictionary definitions, but should be interpreted as
having meanings and concepts relevant to the technical scope of the
present invention based on the rule according to which an inventor
can appropriately define the concept of the term to describe most
appropriately the best method he or she knows for carrying out the
invention.
[0032] The above and other objects, features and advantages of the
present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings. In the specification, in adding reference
numerals to components throughout the drawings, it is to be noted
that like reference numerals designate like components even though
components are shown in different drawings. In addition, the terms
"first," "second," "one surface," "the other surface" and so on are
used to distinguish one element from another element, and the
elements are not defined by the above terms. In describing the
present invention, a detailed description of related known
functions or configurations will be omitted so as not to obscure
the gist of the present invention.
[0033] Hereinafter, preferred embodiments of the present invention
will be described in detail with reference to the accompanying
drawings.
[0034] FIG. 1 is a flow chart sequentially showing a process of
manufacturing a sensing electrode of a touch panel according to a
preferred embodiment of the present invention.
[0035] A method of manufacturing a sensing electrode 125 of a touch
panel according to a first preferred embodiment of the present
invention includes forming a non-conductive mesh skeleton 121 on a
transparent substrate 110 using an electrospinning solution by an
electrospinning method (S10); and forming an electrode layer 120 on
the non-conductive mesh skeleton 121 by performing electroless
plating processing (S20).
[0036] The method of manufacturing a sensing electrode 125 further
includes patterning the electrode layer 120 subjected to the
electroless plating processing so as to be used as the sensing
electrode 125 of the touch panel (S30). The patterning of the
electrode layer 120 (S30) includes disposing a patterned mask 165
on the electrode layer 120; and forming the sensing electrode 125
by patterning the electrode layer 120 by irradiating a laser 160
thereto so as to correspond to the patterned mask 165. The
preferred embodiment of the present invention shows the patterning
by irradiating the laser 160. However, in this case, various
patterning methods, such as a patterning method using chemical
etching, or the like, in addition to the laser, may be selectively
applied.
[0037] The forming of the non-conductive mesh skeleton 121 by the
electrospinning method (S10) is performed including providing an
electrospinning solution 130 to a capillary tube 140; disposing a
current collector 150 on the other surface of the transparent
substrate 110; and forming the electrode layer 120 by applying the
spinning solution 130 to one surface of the transparent substrate
110 from the capillary tube 140 by applying voltage between the
spinning solution 130 and the current collector 150.
[0038] FIGS. 2 to 4 are diagrams showing a process of manufacturing
a sensing electrode of a touch panel according to a first preferred
embodiment of the present invention.
[0039] As shown in FIGS. 2 to 4, the process of forming the
electrode layer 120 on one surface of the transparent substrate 110
is performed. In this case, the electrode layer 120 is formed using
the spinning solution 130, wherein the spinning solution 130 is
formed including at least one of a polymer, a coupling agent, and a
seed material for electroless plating.
[0040] In detail, an example of a non-conductive material (polymer)
may include silicon resin, phenol resin, natural modified phenol
resin, epoxy resin, polyvinyl alcohol-based resin, cellulose-based
resin, or the like, or modified materials such as polyolefin-based
resin, styrene-based resin, acrylic resin, or the like, or surface
treating materials by corona discharge, or the like.
[0041] A silane coupling agent as the coupling agent may be used.
The silane coupling agent has a hydrolysable functional group
generating a silanol group by hydrolysis. An example of the
hydrolysable functional group may include alkoxy (--OR) group that
is directly coupled with Si atom. R forming the alkoxy group is any
one of linear, branched, and cyclic alkyl groups and may have a
carbon number of 1 to 6. In detail, an example of the alkoxy group
may include a methyl group, an ethyl group, an n-propyl group, an
isopropyl group, an n-butyl group, an iso-butyl group, sec-butyl
group, a tert-butyl group, a pentyl group, a hexyl group, a cyclo
pentyl group, a cyclo hexyl group, or the like.
[0042] The seed material for electroless plating may use at least
one selected from tin (Sn), gold (Au), silver (Ag), copper (Cu),
nickel (Ni), iron (Fe), cadmium (Cd), lead (Pb), rhodium (Rd),
palladium (Pd), and rubidium (Ru) as a plating nucleus.
[0043] As the electrospinning process, a process of forming the
non-conductive mesh skeleton 121 will be described in detail below.
First, the spinning solution 130 is provided to the capillary tube
140 and the current collector 150 is disposed on the other surface
(a surface opposite to one surface of the transparent substrate 110
to which the spinning solution 130 is applied) of the transparent
substrate 110. Thereafter, 10 kV to 20 kV of voltage is supplied to
the spinning solution 130 by a voltage supplier 155 and a
predetermined voltage is applied between the spinning solution 130
and the current collector 150 by grounding the current collector
150. When the predetermined voltage is applied between the spinning
solution 130 and the current collector 150, electric field is
applied to fine drops of the spinning solution 130 hung to a distal
end of the capillary tube 140 due to a surface tension, such that
charges are induced to the surface of the fine drop. In this case,
the mutual repulsive force of the induced charge is generated in an
opposite direction to a surface tension of a fine drop. The fine
drop of the spinning solution 130 hung to the distal end of the
capillary tube 140 is modified to a Taylor cone 133 due to the
mutual repulsive force of the charge and when the mutual repulsive
force of the charge is stronger than the surface tension, a jet 135
of the spinning solution 130 with charges is discharged from the
capillary tube 140. A solvent is volatized while the jet 135 of the
spinning solution 130 goes into the air and the jet 135 of the
spinning solution 130 is applied to one surface of the transparent
substrate 110 in a web type to form the non-conductive mesh
skeleton 121 on the entire surface of the transparent substrate
110. In this configuration, the non-conductive mesh skeleton 121 is
formed in a web type through the electrospinning process and thus,
may be implemented in a mesh type having a line width in a
nanometer (nm) unit. Therefore, when the electrode layer 120 using
the non-conductive mesh skeleton 121 is formed, it is difficult for
a user to recognize the electrode layer 120 and the mesh type is
irregularly formed to prevent the moire phenomenon from occurring.
Finally, the visibility of the touch panel 100 may be improved.
[0044] In addition, the process of forming the non-conductive mesh
skeleton 121 by the electrospinning process does not necessarily
use the single capillary tube 140 and provides different spinning
solutions 130 to each capillary tube 140 by using the plurality of
capillary tubes, thereby forming the electrode layer 120 by mixing
several materials.
[0045] Meanwhile, the reason why the current collector 150 is
disposed on the other surface of the transparent substrate 110
while performing the electrospinning process is that the current
collector 150 cannot be grounded, since the transparent substrate
110 is an insulator. In this case, the material of the transparent
substrate 110 may be made of polyethylene terephthalate (PET),
polycarbonate (PC), poly methyl methacrylate (PMMA), polyethylene
naphthalate (PEN), polyethersulpon (PES), cyclic olefin polymer
(COC), triacetylcellulose (TAC) film, polyvinyl alcohol (PVA)
polyimide (PI) film, polystyrene (PS), biaxially stretched
polystyrene (K resin containing biaxially oriented PS; BOPS),
glass, tempered glass, or the like, but is not particularly limited
thereto. For example, when the transparent substrate 110 is a
flexible substrate such as polyethylene terephthalate (PET), the
efficiency of the manufacturing process may be improved by a roll
to roll process. In addition, when the transparent substrate 110 is
a substrate having excellent support force such as glass or
tempered glass, a large-area transparent substrate 110 is provided
with the electrode layer 120 and then, may be cut into a cell unit.
However, when the transparent substrate 110 is made of glass or
tempered glass, the transparent substrate 110 is necessarily cut in
a cell unit by using the large-area transparent substrate 110 and
the transparent substrate 110 in the cell unit may be formed with
the electrode layer 120, if necessary.
[0046] Next, as shown in FIG. 3, the process of forming the
non-conductive mesh skeleton 121 by the electrospinning method and
then, forming the electrode layer 120 by the electroless plating is
performed. The electroless plating is called chemical plating or
autocatalyst plating. The electroless plating is a method of
autocatalytically reducing metal ions in a metal salt aqueous
solution without being supplied with electrical energy from the
outside to precipitate metals on a surface of an object to be
treated and is used when the plating is performed on the surface of
the non-conductive material such as plastic, or the like, that
cannot supply electricity or is difficult to supply
electricity.
[0047] In the preferred embodiment of the present invention, the
method of forming the electrode layer 120 using the electroless
plating layer 122 attaches the seed material used as the plating
nucleus to the surface of the non-conductive mesh skeleton 121 by
attaching a treating solution including the silane coupling agent,
a hydrolysis catalyst, and a metal salt to the non-conductive mesh
skeleton 121 and then, precipitating the metal of the metal salt by
a reducing agent. Thereafter, the electrode layer 120 may be formed
by a method of precipitating metals on the surface of the mesh
skeleton 121 by putting the mesh skeleton 121 into a plating bath.
The silane coupling agent used in a method of forming a metal thin
film according to the preferred embodiment of the present invention
has a functional group forming chelate for the metal of the metal
salt. An example of the functional group forming the chelate for
the metal of the metal salt may include a polar group or a
hydrophilic group. In detail, it is preferable that the functional
group includes at least one selected from a nitrogen atom, a sulfur
atom, and an oxygen atom. An example of the functional group may
include at least one selected from a group consisting of --SH,
--CN, --NH2, --SO2OH, --SOOH, --OPO (OH)2, and --COOH. The
functional group may be one forming a salt. When the functional
group is an acid group, such as --OH, --SH, --SO2OH, --SOOH,
--OPO(OH)2, --COOH, or the like, an example of the salt may include
alkali metal salt such as sodium, potassium, lithium, or the like,
or an ammonium salt, or the like. Meanwhile, when the functional
group is a base group such as --NH2, or the like, an example of the
salt may include an inorganic acid salt such as hydrochloric acid,
sulfuric acid, nitric acid, or the like, and an organic acid salt
such as formic acid, acetic acid, propionic acid, trifluoro acetic
acid, or the like. In addition, the seed material may use at least
one selected from tin (Sn), gold (Au), silver (Ag), copper (Cu),
nickel (Ni), iron (Fe), cadmium (Cd), lead (Pb), rhodium (Rd),
palladium (Pd), and rubidium (Ru) used as the plating nucleus.
[0048] Alternatively, the electrode layer 120 may be formed by
mixing the seed material for forming the electroless plating layer
122 with the electrospinning solution 130 for forming the
non-conductive mesh skeleton 121, the mesh skeleton 121 using the
electrospinning solution 130 by the electrospinning method, and
then, immersing the mesh skeleton 121 in the plating bath to
precipitate metals.
[0049] Next, as shown in FIG. 4, the sensing electrode 125 is
formed by patterning the electrode layer 120 by the laser 160. At
the above-mentioned step, the electrode layer 120 is formed on the
entire surface of the transparent substrate 110 and therefore, the
present process forms the sensing electrode 125 by performing the
patterning of selectively removing the electrode layer 120. In this
case, the electrode layer 120 is patterned in various shapes such
as diamond, quadrangle, triangle, circle, or the like, by using the
laser 160 to form the sensing electrode 125.
[0050] In addition, as the laser 160 patterning the electrode layer
120, a CO.sub.2 laser, a YAG laser, an excimer laser, a fiber
laser, or the like, may be used, but is not limited thereto.
Therefore, all the types of processing lasers known to the art may
be used.
[0051] Meanwhile, as shown in FIGS. 5A to 5C, the electrode layer
120 may be precisely patterned by accurately controlling the laser
160, but a mask 165 is disposed, if necessary and then, the
electrode layer 120 may be patterned by irradiating the laser 160
thereto. In detail, when the patterned mask 165 is disposed on the
electrode layer 120 (see FIG. 3A) and then, the laser 160 is
irradiated to the electrode layer 120 (see FIG. 5B), a portion of
the electrode layer 120 in which the patterned mask 165 is disposed
is not removed and therefore, the electrode layer 120 is patterned
to correspond to the patterned mask 165 and the mask 165 is
removed, thereby forming the sensing electrode 125. As described
above, the electrode layer 120 may be very accurately patterned by
patterning the electrode layer 120 by the laser 160 by adopting the
mask 165. In addition, since there is no need to precisely control
the laser 160 by using the patterned mask 165, a speed of forming
the sensing electrode 125 by patterning the electrode layer 120 may
be improved.
[0052] The sensing electrode 125 formed through the above-mentioned
process generates signals when being touched by the input unit to
allow the controller to serve to recognize touch coordinates.
[0053] Next, as shown in FIG. 5C, a process of forming an electrode
wiring 170 at the edge of the sensing electrode 125 is performed.
In this configuration, the electrode wiring 170 receives the
electrical signal from the sensing electrode 125 and may be formed
using the screen printing method, the gravure printing method, the
inkjet printing method, or the like. However, the electrode wiring
170 is not necessarily formed separately from the sensing electrode
125. When the sensing electrode 125 is formed through the
patterning using the electrospinning process and the laser 160, the
electrode wiring 170 may also be formed through the patterning
using the electrospinning process and the laser 160.
[0054] FIGS. 6 to 11 are diagrams showing a process of
manufacturing a sensing electrode of a touch panel according to a
second preferred embodiment of the present invention.
[0055] The method of manufacturing a touch panel according to a
second preferred embodiment of the present invention includes
applying a photoresist 180 to one surface of the transparent
substrate, patterning the photoresist 180 through an exposure
process and a developing process so that an opening part 185 is
formed, forming the non-conductive mesh skeleton 121 by applying
the electrospinning solution 130 to the transparent substrate 110
exposed from the opening part 185; and forming the electrode layer
120 by performing the electroless plating processing on the
non-conductive mesh skeleton 121.
[0056] The difference from the first preferred embodiment of the
present invention is that the sensing electrode 125 of the touch
panel is formed by performing the patterning using the
photolithography process using the photoresist 180 and then,
forming the non-conductive mesh skeleton 121 by the electrospinning
method and forming the electroless plating layer 122, before the
non-conductive mesh skeleton 121 is formed by the electrospinning
method.
[0057] First, as shown in FIG. 6, a process of applying the
photoresist 180 to one surface of the transparent substrate 110 is
performed. In this case, the photoresist 180 may use a dry film, a
liquid photoresist, or the like. For example, when the dry film is
used as the photoresist 180, the photoresist 180 may be applied to
the transparent substrate 110 using a laminator. In addition, when
the liquid photoresist is used as the photoresist 180, the
photoresist may be applied to the transparent substrate 110 through
the screen coating, the dip coating, the roll coating, or the like.
In addition, after the photoresist 180 is applied to the
transparent substrate 110, a prebake process may be performed.
[0058] Next, as shown in FIG. 7, after an artwork film 183 is
disposed on the photoresist 180 and is then hardened by the
exposure process irradiating light (arrow) except for a portion in
which the opening part 185 is formed. In detail, when the
photoresist 180 is a positive type, light is irradiated only to a
portion of the photoresist 180 in which the opening part 185 is
formed and when the photoresist 180 is a negative type, light is
irradiated except for a portion of the photoresist 180 in which the
opening part 185 is formed.
[0059] Next, as shown in FIG. 8, the photoresist 180 is patterned
by the developing process so that the opening part 185 is formed.
In detail, since the portion of the photoresist 180 in which the
opening part 185 is formed is not hardened, the photoresist 180 is
removed by dissolving a portion in which the opening part 185 is
formed with a developer (sodium carbonate or potassium carbonate).
As a result, the opening part 185 is formed on the photoresist 180
by the developing process and the transparent substrate 110 is
exposed through the opening part 185.
[0060] Next, as shown in FIGS. 9A and 9B, a process of forming the
sensing electrode 125 on the transparent substrate 110 exposed from
the opening part 185 is performed. In this case, the patterned
sensing electrode 125 may be formed by forming the non-conductive
mesh skeleton 121 by the electrospinning method (see FIG. 9A) and
forming the electroless plating layer 122 on the mesh skeleton 121
(se FIG. 9B). The detailed description thereof is the same as the
first preferred embodiment of the present invention and therefore,
the description thereof will be omitted herein.
[0061] Next, as shown in FIG. 10, a process of removing the
photoresist 180 is performed. After the sensing electrode 125 is
formed on the transparent substrate 110 exposed from the opening
part 185 through the electrospinning process, the photoresist 180
is removed since the role thereof is completed. Herein, the
photoresist 180 may be removed by a stripping liquid such as sodium
hydroxide, potassium hydroxide, or the like.
[0062] Next, as shown in FIG. 11, a process of forming the
electrode wiring 170 at the edge of the sensing electrode 125 is
performed. In this configuration, the electrode wiring 170 receives
the electrical signal from the sensing electrode 125 and may be
formed using the screen printing method, the gravure printing
method, the inkjet printing method, or the like. However, the
electrode wiring 170 is not necessarily formed separately from the
sensing electrode 125. When the sensing electrode 125 is formed
through a lithography process and the electrospinning process using
the photoresist 180, the electrode wiring 170 may also be formed
through a lithography process and the electrospinning process using
the photoresist 180.
[0063] In the case of the touch panel 100 according to the
preferred embodiment of the present invention, a self capacitive
type touch panel or a mutual capacitive type touch panel may be
manufactured using the sensing electrode 125 having 1-layer
structure. However, the touch panel according to the preferred
embodiment of the present invention is not limited thereto but may
be manufactured in various types having the configurations, as
described below.
[0064] FIGS. 12 to 14 are cross-sectional views of a touch panel
manufactured using the preferred embodiment of the present
invention.
[0065] As shown in FIG. 12, the mutual capacitive type touch panel
200 (see FIG. 12) may be manufactured by forming the sensing
electrodes 125 on both surfaces of the transparent substrate 110,
respectively. In addition, as shown in FIGS. 13 and 14, a mutual
capacitive type touch panel 300 (see FIG. 13) or a digital
resistive type touch panel 400 (see FIG. 14) may be manufactured by
preparing two transparent substrates 110 including the sensing
electrodes 125 formed on one surface thereof and bonding the two
transparent substrates 125 to each other using an adhesive layer
190 so that the sensing electrodes 125 face each other. Herein, in
the case of the mutual capacitive type touch panel 300 (see FIG.
13), the adhesive layer 190 is bonded to the entire surface of the
transparent substrate 110 so that the two facing sensing electrodes
125 are insulated from each other. On the other hand, in the case
of the digital resistive type touch panel 400 (see FIG. 14), the
adhesive layer 190 is bonded only to the edge of the transparent
substrate 110 so that the two facing sensing electrodes 125 are in
contact with each other when pressure of an input unit is operated
and dot spacers 195 are provided on the exposed surfaces of the
sensing electrode 125, the dot spacer providing repulsive force so
that the sensing electrode 125 is returned to its original position
when the pressure of the input unit is removed.
[0066] As set forth above, the preferred embodiments of the present
invention can easily form the sensing electrodes of the touch panel
using the flexible material by forming the mesh skeletons using the
non-conductive electrospinning solution by the electrospinning
method and forming the electrode layers on the mesh skeletons by
the electroless plating.
[0067] In addition, the preferred embodiments of the present
invention can implement the irregular mesh electrodes by forming
the sensing electrodes having the mesh skeletons by the
electrospinning method to prevent the moire phenomenon while
improving the visibility of the touch panel.
[0068] Further, the preferred embodiments of the present invention
can improve the production and reduce the production lead time
without performing the processes such as the deposition for forming
the separate electrodes, or the like, by forming the non-conductive
mesh skeletons by the electrospinning method and then, forming the
electrode layers by the electroless plating.
[0069] Further, the preferred embodiments of the present invention
can implement the uniform conductivity for all the electrode layers
by preventing the irregular conductivity between the mesh skeletons
by forming the non-conductive mesh skeletons by the electrospinning
method and then, forming the electrode layers by the electroless
plating.
[0070] Further, the preferred embodiments of the present invention
can easily implement the fine patterning of the sensing electrodes
by forming the non-conductive mesh skeleton by the electrospinning
method and then, forming the electrode layers by the electroless
plating.
[0071] Although the preferred embodiments of the present invention
have been disclosed for illustrative purposes, they are for
specifically explaining the present invention and thus a method of
manufacturing a touch panel according to the present invention is
not limited thereto, but those skilled in the art will appreciate
that various modifications, additions and substitutions are
possible, without departing from the scope and spirit of the
invention as disclosed in the accompanying claims.
[0072] Accordingly, any and all modifications, variations or
equivalent arrangements should be considered to be within the scope
of the invention, and the detailed scope of the invention will be
disclosed by the accompanying claims.
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