U.S. patent application number 13/698218 was filed with the patent office on 2013-03-07 for camera module having mems actuator, connecting method for shutter coil of camera module and camera module manufactured by the same method.
This patent application is currently assigned to LG INNOTEK CO., LTD.. The applicant listed for this patent is Chungsang Ryou. Invention is credited to Chungsang Ryou.
Application Number | 20130057757 13/698218 |
Document ID | / |
Family ID | 44992235 |
Filed Date | 2013-03-07 |
United States Patent
Application |
20130057757 |
Kind Code |
A1 |
Ryou; Chungsang |
March 7, 2013 |
CAMERA MODULE HAVING MEMS ACTUATOR, CONNECTING METHOD FOR SHUTTER
COIL OF CAMERA MODULE AND CAMERA MODULE MANUFACTURED BY THE SAME
METHOD
Abstract
Disclosed is a camera module including a substrate which is
provided with an electrode pad and an image sensor; a housing which
is stacked on the substrate and of which an upper portion is opened
so that light is incident to the image sensor; a MEMS actuator
which is installed at the housing and has an electrode terminal at
one side thereof, and a conductive pattern which is formed at the
housing, wherein a lower end of the conductive pattern is connected
with the electrode pad of the substrate, and an upper end thereof
is connected with the electrode terminal of the MEMS actuator,
whereby it is possible to improve electrical reliability between
the electrode terminal of the MEMS actuator and the electrode pad
of the substrate and facilely form the electrical connection
therebetween, thereby reducing the number of processes.
Inventors: |
Ryou; Chungsang; (Seoul,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Ryou; Chungsang |
Seoul |
|
KR |
|
|
Assignee: |
LG INNOTEK CO., LTD.
Seoul
KR
|
Family ID: |
44992235 |
Appl. No.: |
13/698218 |
Filed: |
May 20, 2011 |
PCT Filed: |
May 20, 2011 |
PCT NO: |
PCT/KR11/03728 |
371 Date: |
November 15, 2012 |
Current U.S.
Class: |
348/374 ;
348/E5.028 |
Current CPC
Class: |
G03B 9/08 20130101; B81B
7/02 20130101; H04N 5/2254 20130101; H04N 5/2257 20130101; B81B
7/007 20130101; G02B 7/08 20130101; G03B 3/10 20130101; B81B 7/0006
20130101; G03B 2205/0084 20130101; H04N 5/2253 20130101 |
Class at
Publication: |
348/374 ;
348/E05.028 |
International
Class: |
H04N 5/225 20060101
H04N005/225 |
Foreign Application Data
Date |
Code |
Application Number |
May 20, 2010 |
KR |
10-2010-0047444 |
Oct 8, 2010 |
KR |
10-2010-0098431 |
Claims
1. A camera module comprising: a substrate provided with an
electrode pad and an image sensor; a housing stacked on the
substrate and of which an upper portion is opened so that light is
incident to the image sensor; a MEMS actuator installed at the
housing and has an electrode terminal at one side thereof, and a
conductive pattern formed at the housing, wherein a lower end of
the conductive pattern is connected with the electrode pad of the
substrate, and an upper end thereof is connected with the electrode
terminal of the MEMS actuator.
2. The camera module according to claim 1, wherein a lower end of
the conductive pattern is exposed through a bottom surface of the
housing so as to be connected with the electrode pad of the
substrate, and an upper end of the conductive pattern is exposed
through an upper surface of the housing so as to be connected with
the electrode terminal of the MEMS actuator.
3. The camera module according to claim 1, wherein the electrode
pad of the substrate comprises a plurality of positive terminals
and negative terminals, and a lower end of the conductive pattern
is connected with the plurality of positive terminals and negative
terminals.
4. The camera module according to claim 3, wherein the electrode
pad is formed at a side surface of the substrate, and opposite
terminals has the same polarity.
5. The camera module according to claim 1, wherein the housing
comprises a holder which forms a light running space through light
is incident to the image sensor, and a lens barrel which is
inserted into the light running space of the holder and formed with
a hole so as to fix one or more lenses.
6. The camera module according to claim 5, wherein the conductive
pattern comprises a first conductive pattern and a second
conductive pattern, and the first conductive pattern is formed to
be extended from the electrode pad to an inner surface of the light
running space of the holder, and the second conductive pattern is
formed at an outer surface of the lens barrel so as to be contacted
with the first conductive pattern and also to be extended to an
upper surface.
7. The camera module according to claim 6, wherein an extended
portion is formed at an upper end of the lens barrel so as to be
contacted with the electrode terminal of the MEMS actuator, and the
second conductive pattern is extended to an upper surface of the
extended portion.
8. The camera module according to claim 1, wherein the MEMS
actuator is formed with an opening for fixing a moving lens.
9. The camera module according to claim 1, wherein the lower end of
the conductive pattern is bonded to the electrode pad by a
conductive adhesive.
10. The camera module according to claim 1, wherein the upper end
of the conductive pattern is bonded to the MEMS actuator by a
conductive adhesive.
11. The camera module according to claim 1, further comprising a
shutter which is stacked on the MEMS actuator, wherein a shutter
coil extended from the shutter is welded to an output terminal pad
formed at the substrate in order to transfer a control signal of
the shutter.
12. The camera module according to claim 11, wherein the shutter
coil and the output terminal pad are respectively provided in a
pair so as to be corresponding to a positive pole and a negative
pole.
13. The camera module according to claim 12, wherein the shutter
coil is welded by a welding machine.
14. The camera module according to claim 13, wherein the shutter
coil has a diameter of 0.04.about.0.06 mm, and a voltage at a
welding tip of the welding machine is 1.2.about.1.4V, and welding
time of the welding machine is 5.about.9 ms.
Description
TECHNICAL FIELD
[0001] The present invention relates to a camera module, and
particularly to a camera module which can facilely form an
electrical connection between an MEMS (Micro Electro Mechanical
Systems) actuator and an electrode pad of a substrate, a connecting
method for a shutter coil of the camera module, which can easily
form a connection between the shutter coil and an output terminal
pad of a PCB (Printed Circuit Board) through welding, and a camera
module manufactured by using the same method.
BACKGROUND ART
[0002] Generally, a compact camera module is being applied to
various IT equipment and mobile communication devices such as a
camera phone, a PDA and a smart phone.
[0003] The camera module includes an image sensor such as CCD and
CMOS as a main component, and it is so manufactured as to be
capable of adjusting focus, thereby controlling an image size.
[0004] Herein, the camera module includes a plurality of lenses,
and each lens is movably arranged so that a relative distance can
be changed to control a focal distance.
[0005] Recently, a study on realizing auto-focus using an MEMS
actuator instead of an existing VCM (Voice Coil Motor) has been
actively carried out.
[0006] In the MEMS actuator, a moving lens is fixed to a silicon
wafer instead of the existing VCM. Therefore, when a voltage is
applied, a portion to which the moving lens is fixed is move up and
down by electrostatic force to minutely adjust the moving lens,
thereby performing an auto-focusing function.
[0007] As shown in FIG. 1, an electrode terminal 11 of the MEMS
actuator 10 and an electrode pad 21 of a substrate are soldered
with an FPCB (Flexible Print Circuit Board) 30 so as to be
electrically connected with each other.
[0008] However, in the MEMS actuator, since the electrode terminal
is structurally formed at a lower surface the problems are that it
takes much time to solder the PCB to the electrode terminal and
also troubles occurs frequently after the electrical
connection.
[0009] Further, the camera module may be defective due to high
temperature and thermal shock during the soldering.
[0010] Meanwhile, a camera has a shutter which functions to control
time for transferring light through a lens to an image sensor. The
shutter is opened only for a predetermined time period to allow
light to pass and then closed after the predetermined time period
to block out the light. The shutter takes the shape of a coil to
obtain magnetic field and electromagnetic force for driving the
shutter.
[0011] In order to connect a coil wire terminal of the shutter and
positive and negative pads of a substrate which can perform a
command of a driver IC, a manual soldering method and a method of
coating and hardening conductive Ag-epoxy resin are main used.
However, these methods have some problems in workability and
productivity, and also any connection method applied to a very
small space such as a camera module always has various
problems.
[0012] There are some representative problems in that a terminal of
snubber circuit of the sensitive MEMS actuator is weak in heat,
flux gas of lead generated upon soldering has bad influence on an
image sensor and an IR filter, thereby deteriorating an image
quality, and a short-circuit with respect to a peripheral terminal
such as a grounding portion may be generated, thereby causing a
trouble in the operation of the shutter.
DISCLOSURE OF INVENTION
Technical Problem
[0013] An object of the present invention is to provide a camera
module which can facilely form an electrical connection between an
electrode terminal of an MEMS actuator and an electrode pad of a
substrate.
[0014] Further, another object of the present invention is to a
camera module in which a shutter coil is connected with an output
terminal pad by welding, thereby protecting other components of the
camera module from heat and also preventing performance
deterioration of an image sensor and the like.
Solution to Problem
[0015] To achieve the object of the present invention, the present
invention provides a camera module including a substrate which is
provided with an electrode pad and an image sensor; a housing which
is stacked on the substrate and of which an upper portion is opened
so that light is incident to the image sensor; a MEMS actuator
which is installed at the housing and has an electrode terminal at
one side thereof, and a conductive pattern which is formed at the
housing, wherein a lower end of the conductive pattern is connected
with the electrode pad of the substrate, and an upper end thereof
is connected with the electrode terminal of the MEMS actuator.
[0016] Preferably, a lower end of the conductive pattern is exposed
through a bottom surface of the housing so as to be connected with
the electrode pad of the substrate, and an upper end of the
conductive pattern is exposed through an upper surface of the
housing so as to be connected with the electrode terminal of the
MEMS actuator.
[0017] Preferably, the electrode pad of the substrate comprises a
plurality of positive terminals and negative terminals, and a lower
end of the conductive pattern is connected with the plurality of
positive terminals and negative terminals.
[0018] Preferably, the housing includes a holder which forms a
light running space through light is incident to the image sensor,
and a lens barrel which is inserted into the light running space of
the holder and formed with a hole so as to fix one or more
lenses.
[0019] Preferably, the conductive pattern includes a first
conductive pattern and a second conductive pattern, and the first
conductive pattern is formed to be extended from the electrode pad
to an inner surface of the light running space of the holder, and
the second conductive pattern is formed at an outer surface of the
lens barrel so as to be contacted with the first conductive pattern
and also to be extended to an upper surface.
[0020] Preferably, an extended portion is formed at an upper end of
the lens barrel so as to be contacted with the electrode terminal
of the MEMS actuator, and the second conductive pattern is extended
to an upper surface of the extended portion.
[0021] Further, the present invention provides a shutter coil
connection method of the camera module, which has a shutter and a
MEMS actuator for performing auto-focus, including welding a
shutter coil extended from the shutter to an output terminal pad
formed at a PCB so as to transfer a control signal of the
shutter.
[0022] Preferably, wherein the shutter coil and the output terminal
pad are respectively provided in a pair so as to be corresponding
to a positive pole and a negative pole.
[0023] Preferably, the shutter coil is welded by a welding
machine.
[0024] Preferably, the shutter coil has a diameter of
0.04.about.0.06 mm, and a voltage at a welding tip of the welding
machine is 1.2.about.1.4V, and welding time of the welding machine
is 5.about.9 ms.
Advantageous Effects of Invention
[0025] According to the present invention as described above, it is
possible to improve electrical reliability between the electrode
terminal of the MEMS actuator and the electrode pad of the
substrate and facilely form the electrical connection therebetween,
thereby reducing the number of processes.
[0026] Further, it is additionally possible to form the connection
without the PCB, thereby enhancing price competitiveness.
[0027] Furthermore, according to one embodiment of the present
invention, since the shutter coil is connected with the output
terminal pad by welding, it is possible to protect other components
of the camera module from heat and also prevent the performance
deterioration of the image sensor and the like.
BRIEF DESCRIPTION OF DRAWINGS
[0028] The above and other objects, features and advantages of the
present invention will become apparent from the following
description of preferred embodiments given in conjunction with the
accompanying drawings, in which:
[0029] FIG. 1 is a perspective view of a conventional camera
module.
[0030] FIG. 2 is an exploded perspective view of a camera module
according to an embodiment of the present invention.
[0031] FIG. 3a is a plan view of camera module housing according to
the embodiment of the present invention.
[0032] FIG. 3b is a side view of the camera module housing
according to the embodiment of the present invention.
[0033] FIG. 3c is a bottom view of the camera module housing
according to the embodiment of the present invention.
[0034] FIG. 4 is a perspective view of a lens barrel of the camera
module according to the embodiment of the present invention.
[0035] FIG. 5 is an enlarged view of the lens barrel according to
the embodiment of the present invention.
[0036] FIG. 6 is an exploded perspective view of a camera module
according to another embodiment of the present invention.
[0037] FIG. 7 is an exploded perspective view of the camera module
including an MEMS actuator and a shutter.
[0038] FIG. 8 is a flow chart showing a connection method of a
shutter coil of the camera module according to an embodiment of the
present invention.
[0039] FIGS. 9 to 12 are photographs showing a connecting process
in the connection method of a shutter coil of the camera module
according to the embodiment of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0040] Hereinafter, the embodiments of the present invention will
be described in detail with reference to accompanying drawings.
However, the present invention is not limited to the embodiments,
and it should be understood that the present invention comprises
all of equivalents and substitutes included in the technical scope
and spirit of the invention.
[0041] It is to be noted that, in this specification, the
expression that "a certain construction element is connected to
another construction element" means that the certain construction
element is directly connected to the construction element, and also
means that a third construction element may be interposed
therebetween.
[0042] On the other hand, the expression that "the certain
construction element is directly connected to the construction
element" means that the third construction element is not
interposed therebetween.
[0043] The terms used herein are merely to describe a specific
embodiment, and thus the present invention is not limited to them.
Further, as far as singular expression clearly denotes a different
meaning in context, it includes plural expression.
[0044] It is understood that terms "comprises", "comprising",
"includes" or "has" intend to indicate the existence of features,
numerals, steps, operations, elements and components described in
the specification or the existence of the combination of these, and
do not exclude the existence of one or more other features,
numerals, steps, operations, elements and components or the
existence of the combination of these or additional possibility
beforehand.
[0045] Also, it is understood that accompanying drawings are
enlarged or reduced for the convenience of explanation.
[0046] The same reference numerals are given to the same or
corresponding parts, and the description thereof will not be
repeated.
[0047] Referring to FIG. 2, the camera module according to an
embodiment of the present invention includes a substrate 100 in
which an electrode pad 110 and an image sensor 120 are formed, an
housing 200, 300 which is stacked on the substrate 100 and of which
an upper portion is opened so that light is incident to the image
sensor 120, an MEMs actuator 400 which is installed at the housing
200, 300 and has an electrode terminal 420 at one side thereof, and
a conductive pattern which is formed at the housing 200, 300. A
lower end of the conductive pattern is connected with the electrode
pad 110, and an upper end thereof is connected with the electrode
terminal 420 of the MEMS actuator 400.
[0048] The conductive pattern can be formed by all general methods
of forming a conductive material, and also can be patterned at the
same time of injection molding of the housing.
[0049] A general PCB can be used as the substrate 100. At an upper
surface of the substrate 100, there is formed an electric
wiring.
[0050] In the electrode pad 110 of the substrate 100, a positive
terminal 111 and a negative terminal 112 are formed at a side
surface of the substrate 100, and also another positive terminal
111a and another negative terminal 112a may be formed at an
opposite side surface thereof.
[0051] The image sensor 120 may include a pixel area (not shown)
having a plurality of pixels, and a plurality of electrodes (not
shown). Herein, the pluralities of electrodes are electrically
connected with electrodes (not shown) of the substrate 100 by using
a wire bonding equipment.
[0052] The housing 200, 300 may have any structure, if it can be
stacked on the substrate 100, and its upper portion is opened so
that light is incident to the image sensor 120, and the MEMS
actuator 400 can be fixed thereon.
[0053] In the camera module according to the embodiment of the
present invention, the housing has a structure that a holder 200
and a lens barrel 300 are coupled with each other.
[0054] The holder 200 is formed at the substrate 100 so as to form
a light running space 211 which is opened so that light is incident
to the image sensor 120.
[0055] More detailed, an upper portion of the light running space
211 may be formed into a cylindrical opening so as to receive the
lens barrel 300, and a lower portion thereof may be formed into a
square opening so that light is incident to the image sensor 120.
Therefore, an upper portion 210 of the holder 200 is formed into a
cylindrical shape, and a lower portion 220 thereof is formed into a
square shape.
[0056] However, the holder 200 may have any structure or shape, if
it can form the light running space 211.
[0057] A first conductive pattern 231, 232 is formed at an inner
side surface of the light running space 211. The first conductive
pattern 231, 232 will be described in detail with reference to
FIGS. 3a to 3c.
[0058] As shown in FIGS. 3a and 3b, the first conductive pattern
231, 232 is formed at the inner side surface of the light running
space 211 so as to have a desired thickness and width. Further as
shown in FIG. 3c, the first conductive pattern 231, 232 is exposed
through a side surface of a bottom surface 221 of the holder 200 so
as to be electrically connected with the electrode pad 110 when the
holder 200 is stacked on the substrate 100 of FIG. 2.
[0059] Herein, the first conductive pattern 231, 232 exposed
through the bottom surface 221 of the holder 200 is bonded so as to
be electrically connected by using a conductive adhesive such as
Ag-epoxy.
[0060] In case that the electrode pad 110 of the substrate 100 is
provided in plural number 111a, 112a, another conductive pattern
231a, 232a which is not described is electrically connected with
them.
[0061] The lens barrel 300 is disposed at the upper portion of the
holder 200, and a circular hole 232 is formed at a center portion
of the lens barrel 300 so as to open the lens barrel 300 up and
down. A fixed lens (not shown) is inserted into the circular hole
232, and a second conductive pattern 330, 340 is formed at an outer
surface of the lens barrel 300.
[0062] The lens barrel 300 has a desired size and shape which can
be inserted into the light running space 211.
[0063] Referring to FIGS. 4 and 5, the second conductive pattern
330, 340 includes a lower end 332, 342, an upper end 334, 344, and
a connection wire 331, 341 which electrically connects the lower
end 332, 342 and the upper end 334, 344.
[0064] The lower end 332, 342 of the second conductive pattern 330,
340 is formed at an outer surface of the lower end 310 of the lens
barrel 300 in a height direction thereof so as to be electrically
connected with the first conductive pattern 231, 232 of the holder
200 by contacting each other.
[0065] Another lower end 333, 343 of the second conductive pattern
330, 340 may be additionally formed according to the number of the
electrode pads 110 formed at the substrate 100. If one of the
conductive patterns is defective, the electrical connection can be
maintained by using other conductive patterns, thereby increasing
electrical reliability thereof.
[0066] Hereinafter, construction of forming the electric connection
between the lens barrel 300 and the electrode terminal 420 of the
MEMS actuator 400 will be described.
[0067] An upper portion 320 of the lens barrel 300 is formed into a
plate shape, and protrusions 321 are formed at a side surface
thereof so as to fix the MEMS actuator 400. One of the protrusions
321 is protruded upward in a desired height so as to form an
extended portion 322. As shown in FIG. 4, the upper end 334, 344 of
the second conductive pattern 330, 340 is formed at an upper
surface 322a of the extended portion 322.
[0068] The extended portion 322 has a desired height which can be
contacted with the electrode terminal 420 of the MEMS actuator 400
when the MEMS actuator 400 is installed at the lens barrel 300.
[0069] The MEMS actuator minutely adjusts a moving lens (not shown)
using a silicon wafer instead of an existing voice coil, and the
electrode terminal 420 is formed at an upper surface thereof.
[0070] An opening 412 is formed at a center portion of the MEMS
actuator 400. Although not shown in the drawings, a lens mount pad
(not shown) for supporting the moving lens (not shown) is formed at
a side surface of the opening 412. The lens mount pad is driven up
and down by electrostatic force so as to adjust focus of the moving
lens.
[0071] The electrode terminal 420 of the MEMS actuator 400 includes
a positive electrode 421 and a negative electrode 422 which are
electrically connected by being contacted with. Herein, in order to
secure the electrical reliability, the electrode terminal 420 and
the upper end 334, 344 of the second conductive pattern 330, 340
may be fixed to each other using a conductive adhesive.
[0072] Herein, in order to prevent an electrical short with
adjacent electrodes, the conductive adhesive is an anisotropic
conductive adhesive.
[0073] By such a construction, the electrode pad 110 of the
substrate 100 and the electrode terminal 420 of the MEMS actuator
400 are connected with other through the first and second
conductive patterns 231, 232, 330, 340 so as to be electrically
connected at the same time of assembling the camera module, thereby
simplifying a manufacturing process thereof.
[0074] FIG. 6 shows an exploded perspective view of a camera module
according to another embodiment of the present invention.
[0075] Since a construction of the camera module of the embodiment
is the same as that of the previous embodiment, detailed
description thereof will be omitted.
[0076] In the camera module of the embodiment of the present
invention, the positive terminal 111 and the negative terminal of
the electrode pad 110 are formed at one side of the substrate 100
so as to be electrically connected with the first conductive
pattern 231, 232.
[0077] Further, the first conductive pattern 231, 232 is
electrically connected with the second conductive pattern 330, 340
of the lens barrel 300, and the second conductive pattern 330, 340
is connected with the electrode terminal 410 of the MEMS actuator
400.
[0078] By such a construction, the electrode pad 110 formed at the
substrate 100 can be facilely connected with the electrode terminal
420 of the MEMS actuator 400. Particularly, the electrode pad 110
does not need to change its existing position, and an extra
manufacturing cost is not needed.
[0079] FIG. 7 is an exploded perspective view of the camera module
including an MEMS actuator and a shutter. As shown in FIG. 7, the
camera module manufactured by a shutter coil connection method
according to the present invention includes an MEMS actuator 20 and
a shutter 30 in order to reduce its weight and size. The camera
module may include an electromagnetic shielding box 10, an image
sensor 40 and a PCB 50.
[0080] In the MEMS actuator 20, a comb driver functions to adjust
the focus using electrostatic force and the shutter 30 is operated
at a predetermined speed by magnetic field and electromagnetic
force based on a shutter coil wound on a magnetic body. The image
sensor 40 functions to receive an optical signal from an outside
and convert it into an electric signal, and the PCB 50 is a ceramic
substrate on which a circuit for transferring various electric
signals is printed. The image sensor 40, the electromagnetic
shielding box 10 and the like are may be mounted on an upper pad of
the PCB 50.
[0081] In case of the camera module manufactured by the shutter
coil connection method according to the present invention, since it
has a small size, if each element is mounted on the PCB 50, a
connection space of the shutter coil 32, 34 becomes very narrow.
Particularly, in case of welding, it may exert a bad influence on
other elements.
[0082] FIG. 8 is a flow chart showing a connection method of a
shutter coil of the camera module according to an embodiment of the
present invention. Referring to FIG. 8, in the shutter coil
connection method of the camera module according to the present
invention, the shutter coil 32, 34 extended from the shutter 30 is
welded to an output terminal pad 52, 54 formed at the PCB 50 in
order to transfer a control signal of the shutter 30 (S10).
[0083] Herein, the shutter coil 32, 34 is a wire which is extended
from the coil wound on the magnetic body of the shutter 30 to an
outside. The shutter coil 32, 34 is formed of copper. Further, the
output terminal pad 52, 54 of the PCB 50 is provided in a pair so
as to be welded with the shutter coil 32, 34 having a positive pole
and a negative pole. The output terminal pad 52, 54 is formed by
gold-plating on a copper foil.
[0084] In the welding process, the shutter coil 32, 34 is welded by
a welding machine W. In case that the shutter coil 32, 34 has a
diameter of 0.04.about.0.06 mm, it is preferable that a voltage at
a welding tip of the welding machine W is 1.2.about.1.4V and
welding time of the welding machine W is 5.about.9 ms. In this
case, since heat is generated locally, the heat does not have any
influence on other elements (e.g., the image sensor or the MEMS
actuator).
[0085] FIGS. 9 to 12 are photographs showing a connecting process
in the connection method of a shutter coil of the camera module
according to the embodiment of the present invention. As shown in
FIGS. 9 to 11, each shutter coil 32, 34 is welded to the output
terminal pad 52, 54 so as to be corresponding to a positive pole
and a negative pole suing the welding machine W. Herein, the output
terminal pad 52, 54 and the shutter coil 32, 34 are directly
coupled with each other using the heat which is locally generated
at a contacted point therebetween by a potential difference of the
welding tip without a solder.
[0086] Finally, as shown in FIG. 12, since the connection is not
achieved by a solder, it is not necessary to provide a space for
other material (e.g., solder, Ag-epoxy), and also it is facile to
mount the electromagnetic shielding box 10.
[0087] Although various embodiments are provided herein in order to
explain the principles, the present invention is not limited to
these embodiments.
INDUSTRIAL APPLICABILITY
[0088] According to the present invention as described above, it is
possible to improve electrical reliability between the electrode
terminal of the MEMS actuator and the electrode pad of the
substrate and facilely form the electrical connection therebetween,
thereby reducing the number of processes.
[0089] Further, it is additionally possible to form the connection
without the PCB, thereby enhancing price competitiveness.
[0090] Furthermore, according to one embodiment of the present
invention, since the shutter coil is connected with the output
terminal pad by welding, it is possible to protect other components
of the camera module from heat and also prevent the performance
deterioration of the image sensor and the like.
[0091] While the present invention has been described with respect
to the specific embodiments, it will be apparent to those skilled
in the art that various changes and modifications may be made
without departing from the spirit and scope of the invention as
defined in the following claims.
* * * * *