U.S. patent application number 13/600145 was filed with the patent office on 2013-02-28 for semiconductor light emitting device including metal reflecting layer.
This patent application is currently assigned to NICHIA CORPORATION. The applicant listed for this patent is Naoki Azuma, Hisashi Kasai, Takeshi KUSUSE, Toshiaki Ogawa. Invention is credited to Naoki Azuma, Hisashi Kasai, Takeshi KUSUSE, Toshiaki Ogawa.
Application Number | 20130049053 13/600145 |
Document ID | / |
Family ID | 46762923 |
Filed Date | 2013-02-28 |
United States Patent
Application |
20130049053 |
Kind Code |
A1 |
KUSUSE; Takeshi ; et
al. |
February 28, 2013 |
SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING METAL REFLECTING
LAYER
Abstract
A semiconductor light emitting device includes a semiconductor
structure, a transparent electrically-conducting layer, a
dielectric film, and a metal reflecting layer. The semiconductor
structure includes an active region. The transparent
electrically-conducting layer is formed on the upper surface of the
semiconductor structure. The dielectric film is formed on the upper
surface of the transparent electrically-conducting layer. The metal
reflecting layer is formed on the upper surface of the dielectric
film. The dielectric film has at least one opening whereby
partially exposing the transparent electrically-conducting layer.
The transparent electrically-conducting layer is electrically
connected to the metal reflecting layer through the opening. A
barrier layer is partially formed and covers the opening so that
the barrier layer is interposed between the transparent
electrically-conducting layer and the metal reflecting layer.
Inventors: |
KUSUSE; Takeshi;
(Tokushima-shi, JP) ; Azuma; Naoki; (Katsuura-gun,
JP) ; Ogawa; Toshiaki; (Anan-shi, JP) ; Kasai;
Hisashi; (Anan-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
KUSUSE; Takeshi
Azuma; Naoki
Ogawa; Toshiaki
Kasai; Hisashi |
Tokushima-shi
Katsuura-gun
Anan-shi
Anan-shi |
|
JP
JP
JP
JP |
|
|
Assignee: |
NICHIA CORPORATION
Anan-shi
JP
|
Family ID: |
46762923 |
Appl. No.: |
13/600145 |
Filed: |
August 30, 2012 |
Current U.S.
Class: |
257/98 ;
257/E33.072 |
Current CPC
Class: |
H01L 33/405 20130101;
H01L 33/42 20130101; H01L 33/44 20130101; H01L 2224/16145 20130101;
H01L 33/38 20130101; H01L 2224/48091 20130101; H01L 2224/73265
20130101; H01L 2224/48091 20130101; H01L 2924/00014 20130101 |
Class at
Publication: |
257/98 ;
257/E33.072 |
International
Class: |
H01L 33/60 20100101
H01L033/60 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 31, 2011 |
JP |
2011-189889 |
Jul 30, 2012 |
JP |
2012-168944 |
Claims
1. A semiconductor light emitting device comprising: a
semiconductor structure that includes an active region; a
transparent electrically-conducting layer that is formed on or
above the upper surface of said semiconductor structure; a
dielectric film that is formed on or above the upper surface of
said transparent electrically-conducting layer; and a metal
reflecting layer that is formed on or above the upper surface of
said dielectric film, wherein said dielectric film has at least one
opening whereby partially exposing said transparent
electrically-conducting layer, wherein said transparent
electrically-conducting layer is electrically connected to said
metal reflecting layer through said opening, wherein a barrier
layer is partially formed whereby covering said opening so that the
barrier layer is interposed between said transparent
electrically-conducting layer and the metal reflecting layer.
2. The semiconductor light emitting device according to claim 1,
wherein said dielectric film is constructed of multilayers.
3. The semiconductor light emitting device according to claim 1,
wherein said metal reflecting layer is formed of aluminum or
aluminum alloy.
4. The semiconductor light emitting device according to claim 1,
wherein said barrier layer is formed of at least one element, or an
alloy of at least one element selected from the group consisting of
Au, Ag, Pt, Pd, Rh, Ir, Ru and Os.
5. The semiconductor light emitting device according to claim 1,
further comprising an adhesive layer that is arranged between said
barrier layer and said transparent electrically-conducting layer,
and is formed of at least one metal or an alloy of at least one
metal selected from the group consisting of Ti, Ni, Cr and Mo.
6. The semiconductor light emitting device according to claim 1,
wherein said transparent electrically-conducting layer is formed of
ITO.
7. The semiconductor light emitting device according to claim 1,
wherein the film thickness of said barrier layer is thinner than
said dielectric film.
8. The semiconductor light emitting device according to claim 1,
wherein said barrier layer is formed only in said opening.
9. The semiconductor light emitting device according to claim 1,
wherein said dielectric film is substantially entirely formed on or
above the surface of said semiconductor structure.
10. The semiconductor light emitting device according to claim 1,
wherein said transparent electrically-conducting layer is
substantially entirely formed on or above the surface of said
semiconductor structure.
11. The semiconductor light emitting device according to claim 1,
wherein said dielectric film covers the side surfaces of said
semiconductor structure.
12. The semiconductor light emitting device according to claim 1
further comprising a pad electrode is formed on or above the upper
surface of said metal reflecting layer, wherein said pad electrode
includes a plurality of smaller n-side electrodes that are
dispersedly arranged.
13. The semiconductor light emitting device according to claim 12,
wherein said metal reflecting layer covers the side surfaces of
said semiconductor structure.
14. The semiconductor light emitting device according to claim 13,
wherein said semiconductor structure includes n-type and p-type
semiconductor layers, wherein said metal reflecting layer, which
covers the side surfaces of said semiconductor structure, covers
the n-type semiconductor layer, wherein said metal reflecting layer
is spaced away from a second metal reflecting layer that covers the
p-type semiconductor layer.
15. The semiconductor light emitting device according to claim 14
further comprising an electrode-insulating film that is arranged on
or above the upper surface of said metal reflecting layer, which
covers the side surfaces of said semiconductor structure, wherein
said electrode-insulating film extends and covers a spaced part
between said metal reflecting layer and the second metal reflecting
layer, wherein n-side and p-side pad electrodes are arranged on or
above the upper surface of said electrode-insulating film as pad
electrode, and are spaced away from each other.
16. The semiconductor light emitting device according to claim 1,
wherein the thickness of said barrier layer that is arranged on the
side surface of said dielectric film is smaller in the upper part
of said opening than the lower part of said opening.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a semiconductor light
emitting device.
[0003] 2. Description of the Related Art
[0004] Semiconductor light emitting devices can be small and highly
effective in power consumption, and can emit vivid color light. In
addition, in the case of light emitting devices of semiconductor
elements, there are no concerns about bulb burnout and the like. In
addition, semiconductor light emitting devices have features such
as excellent driven characteristics, resistance to vibration or
ON/OFF repeats. Since semiconductor light emitting devices have
these excellent features, semiconductor light emitting devices such
as light emitting diode (hereinafter, occasionally referred to as
"LED") and laser diode (hereinafter, occasionally referred to as
"LD") have been used as various types of light sources. In
particular, in recent years, light emitting diodes receive
attention as light source for lighting replacement of fluorescent
lamps, in other words, as next-generation lighting having long life
and low power consumption. From this viewpoint, further improvement
is required in light output and light emission efficiency.
[0005] GaN group light emitting devices include a reflecting
electrode that has a transparent electrode such as ITO and a
dielectric reflecting film. Particularly, in the case of a
flip-chip type LED, since wire is not used in assembling, the
package of a light emitting device can be small. Accordingly, it
can be expected that the packaging density of LED dices is
increased, which in turn increases the light intensity of the
package. In addition, cost reduction, and the like can be expected.
Also, there are no concerns about wire disconnection. Additionally,
heat can be easily dissipated from the light emitting surface. As a
result, the reliability of the light emitting device can be high
even in the case where large current is applied. For this reason,
the light emitting device has been used for cars.
[0006] Recently, structures for increasing light extraction
efficiency have been studied. For example, in order to improve
reflection efficiency, structures have been proposed which include
combination of ITO and metal electrode, combination of dielectric
reflecting film, or combination of dielectric material and the
metal reflecting layer. In addition, it can be expected that the
light emitting devices are widely used in lighting in the near
future. To address this, further improvement of light extraction
efficiency, and cost reduction are required.
[0007] See Japanese Patent Laid-Open Publications Nos.
JP2009-164,423 A, JP2005-197,289 A, JP2005-45,038 A, and
JP2005-191,326 A.
[0008] To address this issue, a light emitting device has been
proposed which has combination of ITO as transparent electrode, and
DBR (Distributed Bragg Reflector) as dielectric multilayers. The
dielectric multilayer has an angular dependence of reflection. For
this reason, in order to improve the extraction efficiency, the
dielectric multilayer and metal reflecting film such as Al film are
combined.
[0009] On the other hand, in order that a semiconductor element
itself can efficiently emit light, it is necessary to entirely
diffuse current on the surface of a p-type layer. As a suitable
material for the current diffusion, as discussed above, ITO is
generally used which has good ohmic contact characteristics and
high transmittance. The inventors have developed a flip-chip type
light emitting device having a reflection type electrode structure
that has combination of ITO and dielectric film (JP2009-164,423 A).
FIGS. 29A and 29B are cross-sectional views showing a light
emitting device disclosed in JP2009-164,423 A. In this light
emitting device, a dielectric film 294 that is constructed of three
pairs of Nb.sub.2O.sub.5/SiO.sub.2 is interposed between an ITO
film 2913 and a metal electrode layer 2923. The dielectric film 294
has a plurality of openings 2921 so that the dielectric film 294
can be surely electrically connected to the metal electrode layer
2923 through the openings 2921. The dielectric film 294 has the
angular dependence as discussed above. A reflecting layer 2916 is
arranged on the lower surface of the dielectric film 294, in other
words, between the dielectric films 294 and the ITO films 2913. The
reflecting layer 2916 is also constructed of a dielectric film such
as SiO.sub.2 and Al.sub.2O.sub.3, and can provide total reflection
effect. Since a reflecting structure 2920 is constructed of
combination of the reflecting layer 2916 with the dielectric film
294, the reflecting structure 2920 can have high reflectivity even
when a part of light that is emitted from a light-emitting layer
298 is incident on the reflecting structure 2920 at a slanting
angle. Accordingly, it is possible to provide high extraction
efficiency of light that outgoes through a light extraction surface
2918. In the case where bonding pad electrodes are further provided
to this light emitting device, the pad electrodes allow this light
emitting device to be mounted on a mount board in a flip-chip
mounting manner by eutectic bonding using Au--Sn, or the like.
[0010] In addition, FIG. 30 is a cross-sectional view showing
another light emitting device that has been developed by the
applicant. In this light emitting device, a metal reflecting layer
3022 such as Al and an electrically insulating dielectric film 3028
are laminated on a dielectric film 304 that is arranged on the
upper surface of an ITO film 3013 so that the vertical reflection
efficiency can be improved. Also, FIG. 31 is a cross-sectional view
showing the construction of the light emitting device shown in FIG.
30 that includes bonding pad electrodes 303 arranged on metal
electrode layers 3023, and a protection film 3014 for covering the
periphery of the light emitting device. However, in this
construction, since a reflecting structure 3020 is used which
includes the dielectric film 304 made from metal, (i.e.,
electrically-conductive reflecting layer), the electrically
conductive reflecting structure may cause undesirable electrical
connection in a part where electrical insulation is poor, for
example, in an exposed part on the end surface, or in a part where
the electrically insulating film is poorly formed. For this reason,
it is necessary to prevent undesirable short circuit in a PN gap.
Accordingly, the reflecting structure 3020 cannot lie astride P and
N layers, and cannot entirely cover the surface of the light
emitting element. As a result, the reflecting structures 3020 are
formed in film formation areas on the P and N layers that are
spaced away from each other. Consequently, it is unavoidable that a
non-covered part that is not covered by the reflecting structure
3020 is formed in the light emitting device.
[0011] Generally, in flip-chip type light emitting device, the back
side of a sapphire growth substrate 305 serves as a light emitting
surface (i.e., light extraction surface) 3018. Semiconductor layers
of the semiconductor light emitting element are grown on a growth
surface of the growth substrate 305, which is formed of sapphire.
The back side of the growth substrate 305 is opposed to the growth
surface. For this reason, in the case where the non-covered part
that is not covered by the reflecting structure 3020 is formed on
the growth surface side, light will leak through the non-covered
part, and may be reflected between the package and the die of the
light emitting device, for example. In this case, there is a
problem that light cannot effectively extract. FIG. 32 shows
reflection of light from a light-emitting layer 308 in the light
emitting device shown in FIG. 31 that is mounted onto a mount board
309 in a flip-chip mounting manner. After light is emitted from the
light-emitting layer 308, a reflected part of the light that is
reflected by the reflecting structure 3020 (shown by arrows on
right side in FIG. 32) can effectively extract though the light
extraction surface 3018. Contrary to this, a non-reflected part of
the light that is not reflected by the reflecting structure 3020
(shown by arrows on left side in FIG. 32) may be reflected by the
surface of the mount board 309, and absorbed by a metal layer or
the like in the light emitting device.
[0012] To address this issue, the inventor studies the construction
where a dielectric film 334 is arranged on the ITO film 3313, and a
metal reflecting layer 3322 is directly arranged on the dielectric
film 334 and the ITO film 3313 so that a pad electrode 333 is
connected to a p-side electrode by a metal reflecting film that has
high reflectivity as shown in a cross-sectional view of FIG. 33.
However, the inventors find that, in the case where Al is used for
the metal reflecting layer 3322, the contact potential difference
may cause corrosion in the contact surface between Al and the ITO
film 3313 when current flow, which in turn oxidizes Al and reduces
the reflectivity. Also, the inventors find that, in the case where
Ag is used for the metal reflecting layer, ion migration may occur,
and cause deterioration. Since the metal reflecting layers having
the high reflectivity will deteriorate, it is difficult to use the
metal reflecting layers in application such as lighting application
where high reliability is required.
[0013] The present invention is aimed at solving the problem. It is
a main object of the present invention to provide a semiconductor
light emitting device that can increase the extraction efficiency,
and have high reliability.
SUMMARY OF THE INVENTION
[0014] To solve the above object, a semiconductor light emitting
device according to a first aspect of the present invention
includes a semiconductor structure 11, a transparent
electrically-conducting layer 13, a dielectric film 4, and a metal
reflecting layer 22. The semiconductor structure 11 includes an
active region 8. The transparent electrically-conducting layer 13
is formed on or above the upper surface of the semiconductor
structure 11. The dielectric film 4 is formed on or above the upper
surface of the transparent electrically-conducting layer 13. The
metal reflecting layer 22 is formed on or above the upper surface
of the dielectric film 4. The dielectric film 4 has at least one
opening 21 whereby partially exposing the transparent
electrically-conducting layer 13. The transparent
electrically-conducting layer 13 is electrically connected to the
metal reflecting layer 22 through the opening 21. The barrier layer
24 is partially formed whereby covering the opening 21 so that the
barrier layer 24 is interposed between the transparent
electrically-conducting layer 13 and the metal reflecting layer 22.
According to this construction, the barrier layer that is
interposed between the transparent electrically-conducting layer
and the metal reflecting layer can prevent direct contact between
the transparent electrically-conducting layer and the metal
reflecting layer. As a result, the deterioration of the metal
reflecting layer can be prevented. Therefore, it is possible to
increase the reliability of the nitride group compound
semiconductor light emitting device. In addition, according to this
construction, the metal reflecting layer can serve as an
electrically conductive member and a reflection member that
reflects emitted light. Therefore, it is possible to provide high
light output power.
[0015] In a semiconductor light emitting device according to a
second aspect of the present invention, the dielectric film 4 is
preferably constructed of multilayers. According to this
construction, although the dielectric multilayer has angular
dependence, the combination of the dielectric multilayer and the
metal reflecting layer can provide high reflectivity even when a
part of light is incident on the dielectric multilayer at a
slanting angle. Therefore, it is possible to provide high
extraction efficiency.
[0016] In a semiconductor light emitting device according to a
third aspect of the present invention, the metal reflecting layer
22 can be formed of aluminum or aluminum alloy. According to this
construction, the metal reflecting layer with high reflectivity is
used, while the barrier layer can suppress deterioration of the
metal reflecting layer caused by contact of the metal reflecting
layer with the transparent electrically-conducting layer.
[0017] In a semiconductor light emitting device according to a
fourth aspect of the present invention, the barrier layer 24 can be
formed of at least one element, or an alloy of at least one element
selected from the group consisting of Au, Ag, Pt, Pd, Rh, Ir, Ru
and Os.
[0018] In a semiconductor light emitting device according to a
fifth aspect of the present invention, an adhesive layer can be
further provided. The adhesive layer is arranged between the
barrier layer 24 and the transparent electrically-conducting layer
13, and is formed of at least one metal or an alloy of at least one
metal selected from the group consisting of Ti, Ni, Cr and Mo.
[0019] In a semiconductor light emitting device according to a
sixth aspect of the present invention, the transparent
electrically-conducting layer 13 can be formed of ITO.
[0020] In a semiconductor light emitting device according to a
seventh aspect of the present invention, the film thickness of the
barrier layer 24 can be thinner than the dielectric film 4.
[0021] In a semiconductor light emitting device according to an
eighth aspect of the present invention, the barrier layer 24 can be
formed only in the opening 21.
[0022] In a semiconductor light emitting device according to a
ninth aspect of the present invention, the dielectric film 4 can be
substantially entirely formed on the surface of the semiconductor
structure 11.
[0023] In a semiconductor light emitting device according to a
tenth aspect of the present invention, the transparent
electrically-conducting layer 13 can be substantially entirely
formed on the surface of the semiconductor structure 11. According
to this construction, current can be uniformly diffused in the
whole surface of the semiconductor structure.
[0024] In a semiconductor light emitting device according to an
eleventh aspect of the present invention, the dielectric film 4 can
cover the side surfaces of the semiconductor structure 11.
According to this construction, the light that travels in the
transverse direction from an active layer can efficiently outgo
through a sapphire surface.
[0025] In a semiconductor light emitting device according to a
twelfth aspect of the present invention, a pad electrode 3 can be
further provided which is formed on or above the upper surface of
the metal reflecting layer 22. The pad electrode 3 can include a
plurality of smaller n-side electrodes 3a that are dispersedly
arranged. According to this construction, since the n-side
electrodes 3a are constructed small, it is possible to reduce
absorption of light. Therefore, it is possible to increase the
extraction efficiency. In addition, since the n-side electrodes 3a
are dispersedly arranged, the distribution of light emission can be
even. Additionally, the forward voltage can be reduced.
Accordingly, the linearity can be also improved.
[0026] In a semiconductor light emitting device according to a
thirteenth aspect of the present invention, the metal reflecting
layer 22 can cover the side surfaces of the semiconductor structure
11.
[0027] In a semiconductor light emitting device according to a
fourteenth aspect of the present invention, the semiconductor
structure 11 can include n-type and p-type semiconductor layers 6,
7. The metal reflecting layer 22, which covers the side surfaces of
the semiconductor structure 11, can cover the n-type semiconductor
layer 6. The metal reflecting layer 22 can be spaced away from a
second metal reflecting layer 22n that covers the p-type
semiconductor layer 7.
[0028] In a semiconductor light emitting device according to a
fifteenth aspect of the present invention, an electrode-insulating
film 26 can be further provided which is arranged on or above the
upper surface of the metal reflecting layer 22, which covers the
side surfaces of the semiconductor structure 11. The
electrode-insulating film 26 can extend and cover a spaced part
between the metal reflecting layer 22 and the second metal
reflecting layer 22n. N-side and p-side pad electrodes 3A and 3B
can be arranged on or above the upper surface of this
electrode-insulating film 26, and be spaced away from each other.
According to this construction, since the n-side and p-side pad
electrodes can be arranged in a multilevel structure, the areas of
pad electrodes can be larger. In addition, eutectic bonding can
provide a large bonding area. Therefore, the semiconductor light
emitting device is advantageous in heat dissipation.
[0029] In a semiconductor light emitting device according to a
sixteenth aspect of the present invention, the thickness of the
barrier layer 24 that is arranged on the side surface of the
dielectric film 4 can be smaller in the upper part of the opening
21 than the lower part of the opening 21.
[0030] The above and further objects of the present invention as
well as the features thereof will become more apparent from the
following detailed description to be made in conjunction with the
accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1 is a cross-sectional view schematically showing a
light emitting apparatus according to a first embodiment;
[0032] FIG. 2 is a cross-sectional view showing a semiconductor
light emitting device shown in FIG. 1;
[0033] FIG. 3 is an enlarged cross-sectional view showing the
lamination structure of a dielectric film shown in FIG. 2;
[0034] FIG. 4 is a schematic cross-sectional view showing a
semiconductor light emitting device according to a second
embodiment;
[0035] FIG. 5 is a plan view showing the semiconductor light
emitting device according to the second embodiment;
[0036] FIG. 6A is a cross-sectional view of the semiconductor light
emitting device shown in FIG. 5 taken along the line VI-VI;
[0037] FIG. 6B is a schematic cross-sectional view showing an
exemplary metal reflecting layer that is grown in an opening
directly on a barrier layer;
[0038] FIG. 7 is a cross-sectional view of the semiconductor light
emitting device shown in FIG. 5 taken along the line VII-VII;
[0039] FIG. 8 is a graph showing the comparison of light output
power and forward voltage between semiconductor light emitting
devices according to the second embodiment and a comparative
example;
[0040] FIG. 9 is a cross-sectional view showing a semiconductor
light emitting device according to a third embodiment;
[0041] FIG. 10 is a flowchart showing the production method of the
semiconductor light emitting device shown in FIG. 9;
[0042] FIGS. 11A to 11E are cross-sectional views showing the
production processes of the semiconductor light emitting device
shown in FIG. 9;
[0043] FIGS. 12F to 12I are cross-sectional views showing the
production processes of the semiconductor light emitting device
shown in FIG. 9;
[0044] FIG. 13 is a cross-sectional view showing a semiconductor
light emitting device according to a fourth embodiment;
[0045] FIG. 14 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0046] FIG. 15 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0047] FIG. 16 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0048] FIG. 17 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0049] FIG. 18 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0050] FIG. 19 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0051] FIG. 20 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0052] FIG. 21 is a cross-sectional view showing the semiconductor
light emitting device according to the fourth embodiment;
[0053] FIG. 22 is a cross-sectional view showing a semiconductor
light emitting device according to a fifth embodiment;
[0054] FIG. 23 is a cross-sectional view showing a semiconductor
light emitting device according to a sixth embodiment;
[0055] FIG. 24 is a horizontal cross-sectional view of the light
emitting device shown in FIG. 23 taken along the line
XXIV-XXIV;
[0056] FIG. 25 is a plan view schematically showing a light
emitting device according to a seventh embodiment;
[0057] FIG. 26 is a vertical cross-sectional view of the light
emitting device shown in FIG. 25 taken along the line
XXVI-XXVI;
[0058] FIG. 27 is a plan view schematically showing a light
emitting device according to an eighth embodiment;
[0059] FIG. 28 is a cross-sectional view of the light emitting
device shown in FIG. 27 taken along the line XXVIII-XXVIII;
[0060] FIG. 29A is a cross-sectional view showing a known
semiconductor light emitting device;
[0061] FIG. 29B is an enlarged cross-sectional view showing a part
of the semiconductor light emitting device enclosed by the circle
in FIG. 29A;
[0062] FIG. 30 is a cross-sectional view showing a semiconductor
light emitting device that has been developed by the applicant, and
includes a reflecting film constructed of a dielectric member and a
metal reflecting layer on a transparent electrode;
[0063] FIG. 31 is a cross-sectional view showing another
semiconductor light emitting device that has been developed by the
applicant;
[0064] FIG. 32 is a vertical cross-sectional view showing light
loss caused by leakage of light through a PN gap in the
semiconductor light emitting device shown in FIG. 31; and
[0065] FIG. 33 is a vertical sectional view showing the
construction of a prototype semiconductor light emitting device
that has been constructed by these inventors, and includes a
reflecting film directly arranged on ITO.
DETAILED DESCRIPTION OF THE EMBODIMENT(S)
[0066] The following description will describe embodiments
according to the present invention with reference to the drawings.
It should be appreciated, however, that the embodiments described
below are illustrations of a semiconductor light emitting device
used therein to give a concrete form to technical ideas of the
invention, and a semiconductor light emitting device of the
invention is not specifically limited to description below.
However, it should be appreciated that the members shown in claims
attached hereto are not specifically limited to members in the
embodiments. Unless otherwise specified, any dimensions, materials,
shapes and relative arrangements of the parts described in the
embodiments are given as an example and not as a limitation.
Additionally, the sizes and the positional relationships of the
members in each of drawings are occasionally shown larger
exaggeratingly for ease of explanation. Members same as or similar
to those of this invention are attached with the same designation
and the same reference signs, and their description is omitted. In
addition, a plurality of structural elements of the present
invention may be configured as a single part that serves the
purpose of a plurality of elements, on the other hand, a single
structural element may be configured as a plurality of parts that
serve the purpose of a single element. Also, the term "on or above"
(e.g., on or above a layer) used in the specification is not
limited to the state where a member is formed in direct contact
with a layer but occasionally includes the state where a member is
formed upward relative to a layer to be spaced away from the layer,
in other words, the state where a member is formed to interpose an
intermediate member between the member and the layer in an
inclusive sense. Also, the description of some of examples or
embodiments may be applied to other examples, embodiments or the
like.
First Embodiment
[0067] FIG. 1 is a cross-sectional view showing a light emitting
apparatus 1 according to a first embodiment of the present
invention. This illustrated light emitting apparatus 1 includes a
light emitting device 10 of an LED chip as an exemplary nitride
semiconductor device. This LED chip is mounted onto a wiring board
9, which is a sort of submount, in a flip-chip mounting manner. The
flip-chip mounting manner refers to a mounting manner where a
growth substrate 5 serves as a main light extraction surface
through which light outgoes. Semiconductor layers are deposited on
the growth substrate. The growth substrate 5 is opposed to an
electrode formation surface on which an electrode is formed. The
flip-chip mounting manner is also referred to as facedown mounting
manner. The light emitting device 10 is shown upside down in FIG. 1
for illustrating the flip-chip mounting manner.
[0068] FIG. 2 is a cross-sectional view schematically showing the
light emitting device 10 shown in FIG. 1 before the light emitting
device is mounted to the wiring board, in other words, with the
growth substrate 5 facing downward and a semiconductor structure 11
being arranged on the growth substrate. In the production processes
of this light emitting apparatus, practically, the nitride
semiconductor device is mounted with the layers on the upper
surface of the growth substrate 5 being orientated upside down as
shown in FIG. 1. The following description will schematically
describe the light emitting device 10 with reference to FIG. 2.
Members that are configured similarly to the members of the light
emitting device 10 shown in FIG. 1 are attached with the same
reference signs as the corresponding members of the light emitting
device 10 shown in FIG. 2, and their description is omitted for
sake of brevity.
[0069] The semiconductor light emitting device 10 shown in FIG. 2
includes the growth substrate 5, the semiconductor structure 11
that is grown on the upper surface of the growth substrate 5, and
electrodes that are electrically connected to the semiconductor
structure 11. The semiconductor structure 11 includes a first
semiconductor layer, an active region 8, and a second semiconductor
layer. For example, the first semiconductor layer is an n-type
semiconductor layer 6, while the second semiconductor layer is a
p-type semiconductor layer 7. The active region 8 serve as a light
emitting layer. The center wavelength of the light emitted by the
active region 8 can fall within the range of 360 to 650 nm, for
example.
[0070] The light emitting device 10 includes the semiconductor
structure 11, which has the active region 8. In the light emitting
device 10 shown in FIG. 2, nitride semiconductor layers are
laminated on one of a pair of main surfaces of the growth substrate
5, which are opposed to each other. The nitride semiconductor
layers compose the semiconductor structure 11. Specifically, the
nitride semiconductor structure 11 of the light emitting device 10
includes the n-type semiconductor layer 6 as first semiconductor
layer, the active region layer 8, and the p-type nitride
semiconductor layer 7 as second semiconductor layer, which are
laminated on the upper surface side of the growth substrate 5, in
this order. N-side and p-side pad electrodes 3A and 3B as first and
second electrodes are arranged on, and electrically connected to
the n-type and p-type semiconductor layers 6 and 7, respectively.
When electric power is supplied to the light emitting device 10
from an external source through the n-side and p-side electrodes 3A
and 3B, the active region 8 emits light so that the light outgoes
mainly through the bottom surface side of the growth substrate 5 as
viewed in FIG. 2. That is, in the case of the light emitting device
10 shown in FIG. 2, the other (bottom side in FIG. 2) of the main
surfaces of the growth substrate 5 serves as a main light
extraction surface 18 through which the light mainly outgoes. The
other of main surfaces is opposed to a mount surface (top side in
FIG. 2) where the electrodes 3A and 3B are formed.
(Dielectric Film 4)
[0071] Each of a pair of electrodes 3, which are the n-side and
p-side pad electrodes 3A and 3B, includes a dielectric film 4. FIG.
3 is an enlarged cross-sectional view showing a part of the light
emitting device 10 enclosed by the thick circle in FIG. 2 in
proximity to the dielectric film 4. As shown in FIG. 3, the
dielectric film 4 has the multilayer structure including a
plurality of dielectric members 4a. Each of the dielectric members
4a is composed of a set of two or more material layers 4n and 4m
the refractive indices of which are different from each other.
Thus, a plurality of sets of material layers 4n and 4m are
laminated on one after another. The dielectric film 4 is arranged
at least partially in a part between the semiconductor structure 11
and each of the electrodes 3. The dielectric film 4 can selectively
reflect light with a desired wavelength. The specific structure of
the dielectric film 4 will be described later. The dielectric film
4 may be divided into parts, which are spaced away from each other.
The dielectric film 4 may be a single-layer film formed of
SiO.sub.2, Al.sub.2O.sub.3, or the like. The single-layer film will
not reflect light but allow light to pass through the single-layer
film. For this reason, particularly, in a face-up type
semiconductor device as a non-flip-chip type mounting manner, the
extraction efficiency of light can be improved which outgoes
through the dielectric film 4 formation surface.
(Light Emitting Device 10)
[0072] For example, in the case where the light emitting device 10
is a nitride semiconductor device such as LED shown in FIG. 2, the
light emitting device includes a sapphire substrate as the growth
substrate 5, the nitride semiconductor structure 11, and a
transparent electrically-conducting layer 13 that is formed on or
above the nitride semiconductor structure 11. The nitride
semiconductor structure 11 includes the n-type semiconductor layer
6 as the first nitride semiconductor layer, and the light emitting
layer as the active layer 8, and the p-type semiconductor layer as
the second nitride semiconductor layer 7, which are epitaxially
grown on or above the sapphire substrate in this order. A
reflecting layer 16 is arranged between the dielectric layer 4 and
the transparent electrically-conducting layer 13. The reflecting
layer 16 is constructed of dielectric films of SiO.sub.2,
Al.sub.2O.sub.3, or the like, and can provide total reflection
effect. According to the reflecting structure that has combination
of the reflective layer 16 to the dielectric film 4, even a part of
light that is incident on the reflecting structure at a slanting
angle can be reflected at high reflectivity by the metal reflective
layer. Therefore, it is possible to provide high extraction
efficiency.
[0073] Subsequently, the active region 8 and the p-type
semiconductor layer 7 are selectively partially removed by etching
so that the n-type semiconductor layer 6 is partially exposed. The
n-type pad electrode 3A is formed on the partially exposed part of
the n-type semiconductor layer. The p-type pad electrode 3B is
formed on the same surface side as the n-type electrode 3A on or
above the transparent electrically-conducting layer 13. In
addition, only predetermined areas of the n-side and p-side pad
electrode 3A and 3B are selectively exposed so that the areas other
than the predetermined areas are covered by an
electrically-insulating protection film 14. The n-side pad
electrode 3A may be formed in the partially exposed part of the
n-type semiconductor layer 6 with the transparent
electrically-conducting layer 13 being interposed between the
n-side pad electrode and the n-type semiconductor layer. The
following description will specifically describe components of the
semiconductor light emitting device 10.
(Growth Substrate 5)
[0074] The growth substrate 5 is a substrate on which the
semiconductor structure 11 can be grown. The size, thickness, and
the like of the growth substrate are not specifically limited. The
substrate for nitride semiconductor can be electrically-insulating
substrates (e.g., sapphire having C-facet, R-facet or A-facet as
primary surface and spinel (MgAl.sub.2O.sub.4)), silicon carbide
(6H, 4H, 3C), silicon, ZnS, ZnO, GaAs, diamond, oxide substrates
(for example, lithium niobate and neodymium gallate, which are
bondable with nitride semiconductor in a lattice-matching manner),
and nitride semiconductor substrates (e.g., GaN and AlN). Also, the
substrate for nitride semiconductor may be off-angled nitride
semiconductor substrates (for example, off-angled 0.01.degree. to
3.0.degree. relative to the C-facet of sapphire). In addition, the
growth substrate can be removed to form a substrate-less
semiconductor structure after the semiconductor structure is formed
on the growth substrate. Also, the thus-formed substrate-less
semiconductor structure can be bonded onto a support substrate
(e.g., electrically-conductive substrate) or bonded onto a support
substrate in a flip-chip manner. Also, the thus-formed
substrate-less semiconductor structure can be bonded onto other
transparent members/transparent substrates. Specifically, in the
case where the growth substrate and the bonded member/substrate are
arranged on the light emitting main surface side of the
semiconductor structure, they are required to be transparent. In
this case, if the growth substrate is not transparent, or cuts off
or absorbs light, it is necessarily removed. If the semiconductor
structure is bonded onto the bonded component/substrate that is not
transparent, or cuts off or absorbs light, the bonded
member/substrate is necessarily arranged on the light reflection
main surface side of the semiconductor structure. In the case where
electric power is supplied to the semiconductor structure through
the transparent substrate/member on the light extraction side, the
transparent substrate/member is required to be electrically
conductive. In addition to this, the semiconductor structure may be
bonded onto and covered by a transparent member such as glass and
resin so that the semiconductor structure is supported by the
transparent member. For example, the growth substrate can be
removed by grinding or LLO (Laser Lift Off) with the semiconductor
light emitting device being fixed by a fixing device or on the chip
mount part of the submount. Even in the case the growth substrate
is transparent but a type different from the semiconductor layer
structure, it is preferable that the substrate is removed. The
reason is that the substrate removal can improve the light
extraction efficiency and the output power of the light.
(Semiconductor Structure 11)
[0075] A nitride semiconductor is suitable for the semiconductor
structure 11, and will be discussed later and in examples. The
nitride semiconductor can emit short-wavelength visible light,
near-ultraviolet light or light with wavelength shorter than them.
Particularly, in the case where the light emitting device includes
the semiconductor layers and a light conversion member (phosphor
etc.) used together. A nitride semiconductor is suitable for the
semiconductor structure 11. The semiconductor layer structure is
not limited to this. The semiconductor structure may be formed of
other semiconductors such as InGaAs group semiconductor and GaP
group semiconductor.
(Light Emitting Device Construction)
[0076] The light emitting device construction of the semiconductor
structure preferably has the active region 8 between the first
electrically-conductive type (n-type) layer and the second
electrically-conductive type (p-type) layer discussed later from
viewpoint of output power and efficiency. However, the light
emitting device construction is not limited to this, and can be the
construction discussed later or other types of light emitting
device construction. Each electrically-conductive type layer may
partially include an electrically-insulating structure, a
semi-electrically-insulating structure or an opposite
electrically-conductive type structure. Also, the first
electrically-conductive type layer and the second
electrically-conductive type layer may be additionally provided
with an electrically-insulating structure, a
semi-electrically-insulating structure or an opposite
electrically-conductive type structure. Also, the first
electrically-conductive type layer and the second
electrically-conductive type layer may be additionally provided
with other circuit structure such as protection structure. The
aforementioned substrate may serve as a part of an
electrically-conductive type layer.
[0077] The electrodes for the first electrically-conductive type
(n-type) layer and the second electrically-conductive type (p-type)
layer are preferably arranged on one of the main surface sides of
the semiconductor structure 11 as discussed later in the example.
However, the electrodes are not limited to this arrangement. The
electrodes may be arranged on the both main surface sides of the
semiconductor structure so that the electrodes are opposed to each
other. For example, one of the electrodes may be arranged on the
removal side of the aforementioned substrate-removed structure.
[0078] The semiconductor structure 11 can include homo junction
structure, hetero junction structure, or double-hetero junction
structure having MIS junction, PIN junction or PN junction. The
layer can have a super-lattice structure. Also, the active region 8
as light emitting layer can have a quantum well structure including
thin layers for quantum effect.
(Nitride Semiconductor Structure)
[0079] The nitride semiconductors are formed of general formula
In.sub.xAl.sub.yGa.sub.1-x-yN (0.ltoreq.x, 0.ltoreq.y,
x+y.ltoreq.1). B, P, or As can be added to the nitride
semiconductors. The n-type semiconductor layer 6 and the p-type
semiconductor layer 7 are not specifically limited to a single
layer or multilayer structure. The nitride semiconductor structure
11 includes the active region 8 as light emitting layer. The active
region 8 has a single quantum well (SQW) or multi-quantum well
structure (MQW). The nitride semiconductor structure 11 is now
described in detail.
[0080] The n-type nitride semiconductor layer and the p-type
nitride semiconductor layer are formed on or above the growth
substrate 5 with the active region 8 being interposed between the
p-type and n-type layers. A primary layer such as buffer layer of
nitride semiconductor is interposed between the growth substrate 5
and the nitride semiconductor layer. For example, the primary layer
can be formed of a low-temperature grown thin layer GaN and a GaN
layer. The n-type nitride semiconductor layer can be formed of an
n-type contact layer of Si-doped GaN, and an n-type multilayer film
of GaN/InGaN, for example. The p-type nitride semiconductor layer
can be formed of an Mg-doped p-type multilayer film of InGaN/AlGaN
and a p-type contact layer of Mg-doped GaN.
[0081] For example, the active region (light emitting layer) 8 of
the nitride semiconductor has a quantum well structure that
includes well layers of Al.sub.aIn.sub.bGa.sub.1-a-bN
(0.ltoreq.a.ltoreq.1, 0.ltoreq.b.ltoreq.1, a+b.ltoreq.1) and
barrier semiconductor layers of Al.sub.cIn.sub.dGa.sub.1-c-dN
(0.ltoreq.c.ltoreq.1, 0.ltoreq.d.ltoreq.1, c+d.ltoreq.1). The
nitride semiconductor used for the active region 8 can be
non-doped, n-type-impurity doped, or p-type-impurity doped. It is
preferable that non-doped or n-type-impurity doped nitride
semiconductor be used for the active region 8. The reason is that
non-doped or n-type-impurity doped nitride semiconductor can
increase the output power of the light emitting device. The barrier
semiconductor layer is formed of a nitride semiconductor having
larger band gap energy than the well layer. In the case where the
well layer contains aluminum, it is possible to emit light with
wavelength shorter than 365 nm corresponding to the band gap energy
of GaN. The light emitted from the active region 8 can be designed
to emit light with wavelength of about 360 to 650 nm, preferably
380 to 560 nm depending on the application of the light emitting
device.
[0082] It is suitable that the well layer be formed of composition
InGaN, which is suitable for visible or near-ultraviolet light
emission. In this case, it is suitable the barrier semiconductor
layer be formed of composition GaN or InGaN. The well layer
preferably has a thickness not less than 1 nm and not more than 30
nm, more preferably not less than 2 nm and not more than 20 nm.
[0083] A mask with a predetermined shape is formed on the surface
of the p-type semiconductor layer 7. The p-type semiconductor layer
7 and the active region 8 as light-emitting layer are partially
removed by etching. Thus, a predetermined part of the n-type
contact layer of the n-type semiconductor layer 6 is exposed.
(Transparent Electrically-Conducting Layer 13)
[0084] The transparent electrically-conducting layers 13 are formed
on or above the n-type and p-type semiconductor layers 6 and 7. In
the light emitting device according to this embodiment shown in
FIG. 2, the transparent electrically-conducting layers 13 are
formed on substantially the whole surfaces of the p-type
semiconductor layer 7 and the exposed n-type semiconductor layer 6.
Thus, current can be uniformly diffused in the whole surface of the
p-type semiconductor layer 7. Since the electrically-conducting
layer has transparency, the dielectric film 4 can be arranged on
the transparent electrically-conducting layer. It should be noted
that "form[ed] on substantially the whole surfaces" referred in
this specification means form[ed] above the semiconductor
structure.
[0085] Although sorts of transparent electrodes are known, the
transparent electrically-conducting layer 13 is preferably formed
of an oxide containing at least one element selected from the group
consisting of Zn, In and Sn. Specifically, it is preferable that
the transparent electrically-conducting layer 13 is formed of an
oxide containing Zn, In or Sn such as ITO, ZnO, In.sub.2O.sub.3,
SnO.sub.2. In particular, the transparent electrically-conducting
layer 13 is more preferably formed of ITO. In this case, the
transparent electrically-conducting layer can be in good ohmic
contact characteristics with the member to be contacted.
Alternatively, the transparent electrically-conducting layer may be
a metal thin film of Ni, Au, Pt, or the like, with thickness 3 nm.
Also, the transparent electrically-conducting layer may be a thin
film of oxide or nitride of other metal, or compound of them. Also,
the transparent electrically-conducting layer may be a
light-transmissible structure. Also, the transparent
electrically-conducting layer may be a combination structure which
combines these features with each other. Thus, the transparent
electrically-conducting layer 13 is formed substantially on the
whole electrically-conductive layer, for example, the p-type
semiconductor layer, so that current can be uniformly diffused in
the whole surface of the layer.
[0086] The thickness of the transparent electrically-conducting
layer 13 can be determined in consideration of the light absorption
and electrical/sheet resistance of the semiconductor layer, in
other words, the dielectric film 4 and current spread of the
semiconductor layer. For example, the thickness of the transparent
electrically-conducting layer 13 can be not more than 1 .mu.m,
specifically, 10 to 500 nm. In addition, it is preferable that the
thickness of the transparent electrically-conducting layer be an
integral multiple of .lamda./4 (.lamda. is the wavelength of light
emitted from the active region 8). In this case, the light
extraction efficiency can be increased.
[0087] ITO as the transparent electrically-conducting layer 13
according to this embodiment has thickness of 700 A. It is
preferable that, after a thick film of SiO.sub.2, Al.sub.2O.sub.3,
Nb.sub.2O.sub.5, or the like be formed as the reflecting layer 16
on the ITO film, the dielectric film 4 be formed of three pairs of
Nb.sub.2O.sub.5/SiO.sub.2, in other words, of
Nb.sub.2O.sub.5/SiO.sub.2/Nb.sub.2O.sub.5/SiO.sub.2/Nb.sub.2O.sub.5/SiO.s-
ub.2 as shown in the enlarged cross-sectional view of FIG. 3. The
thickness of each of the Nb.sub.2O.sub.5 and SiO.sub.2 layer are
adjusted in accordance with the wavelength of emitted light. An Rh
layer with thickness of 100 A is formed as the barrier layer 24. A
lamination structure of a metal reflecting layer 22 and the pad
electrode 3 is constructed of (Al--Cu alloy)/Ti/Pt/Au. In the case
where Ag is used for the barrier layer 24, light absorption will be
reduced. As a result, it is possible to increase the extraction
efficiency.
(Dielectric Film 4)
[0088] The dielectric film 4 is formed on the reflecting layer 16.
The dielectric film 4 can be constructed of two to five pairs of,
more preferably three to four pairs of, different-refractive-index
dielectric layers. The pairs of different-refractive-index
dielectric layers are arranged on each other. It is preferable that
the total film thickness of the dielectric multilayer 4 fall within
the range of 0.2 to 1 .mu.m, more preferably, 0.3 to 0.6 .mu.m.
According to this construction, it is possible to suppress that the
dielectric film 4 interferential action causes sharp drop in light
transmittance. As a result, high reflectivity can be continuously
provided in a wide wavelength range. As a result, even if the
center wavelength of the dielectric film 4 is larger than the light
emission peak wavelength of a light source, it is possible to
suppress reduction of the reflectivity of perpendicularly-incident
light. That is, it is possible to reflect not only light from the
light source incident on the dielectric film 4 at a certain
incidence angle but also light incident on the reflecting structure
at a small incidence angle. Therefore, it is possible to relatively
increase the light output power of light emitting device. Pairs of
SiO.sub.2 and Nb.sub.2O.sub.5 are suitable for the dielectric film
4. The dielectric film 4 has wavelength-dependent and
direction-dependent reflection effect. It is preferable that the
dielectric film 4 be formed on substantially the whole
electrode-formation-side surface of the semiconductor light
emitting device 10.
[0089] It is preferable that the dielectric film 4 cover the side
surfaces of the semiconductor structure 11, and a part of the
semiconductor structure 11 between the n-side and p-electrodes.
According to this construction, it is possible to suppress leakage
of light through a PN gap between the n-side and p-side
electrodes.
(Opening 21)
[0090] The dielectric film 4 has openings 21. The openings 21 are
formed so that the transparent electrically-conducting layer 13 is
partially exposed as shown in the cross-sectional view of FIG. 2.
As a result, the transparent electrically-conducting layer 13 can
be electrically connected to the metal reflecting layer 22 and the
pad electrode 3 through the openings 21.
(Barrier Layer 24)
[0091] The barrier layer 24 is arranged in the openings 21 in the
dielectric film 4 where the dielectric film 4 is not arranged in
the openings 21. The barrier layer 24 covers the exposed part of
the transparent electrically-conducting layer 13 that is exposed in
the opening 21. The metal reflecting layer 22 covers the upper
surface of the barrier layer. Thus, the barrier layer 24 is
interposed between the transparent electrically-conducting layer 13
and the metal reflecting layer 22. It is possible to avoid that the
metal reflecting layer 22 comes in direct contact with the
transparent electrically-conducting layer 13. As a result, it is
possible to prevent that the contact potential difference may cause
deterioration of the surface of the metal reflecting layer 22 if
the metal reflecting layer is in contact with the transparent
electrically-conducting layer 13. The barrier layer 24 can be
formed of at least one element, or an alloy of at least one element
selected from the group consisting of Au, Ag, Pt, Pd, Rh, Ir, Ru
and Os. Rh is suitable for the barrier layer. It is preferable that
the thickness of the barrier layer 24 be thinner than the
dielectric film 4.
[0092] The barrier layer 24 can be formed by sputtering,
electroless plating, vapor deposition, or the like. In the case of
sputtering, the barrier layer will be formed in a U shape as viewed
in section. In the case of electroless plating, the barrier layer
will be formed flat.
[0093] An adhesive layer may be arranged between the barrier layer
24 and said transparent electrically-conducting layer 13. The
adhesive layer can be formed of at least one metal or an alloy of
at least one metal selected from the group consisting of Ti, Ni, Cr
and Mo. The adhesive layer serves to bring the barrier layer 24
into adhesive with the transparent electrically-conducting layer
13. The adhesive layer has thickness of 0.3 to 50 nm, preferably
0.3 to 3 nm. In the case where the adhesive layer is thin, the
light from the active region 8 can pass through the adhesive layer,
and be reflected by the barrier layer 24. Thus, the high
reflectivity of the barrier layer 24 can be effectively used. As a
result, it is possible to provide high output power. In particular,
for this purpose, Rh is suitable for the barrier layer.
(Metal Reflecting Layer 22)
[0094] The metal reflecting layer 22 is electrically connected
through the barrier layer 24 and the transparent
electrically-conducting layer 13 to the n-type and p-type layers of
the semiconductor structure 11. The metal reflecting layer 22 can
serve as an electrically conductive member and a reflection member
that reflects emitted light. According to this construction, the
semiconductor light emitting device 10 can increase its extraction
efficiency, and can improve its reliability. The metal reflecting
layer 22 can be formed of at least one selected from the group
consisting of Al, Cu, Au, Pt, Pd, Rh, Ni, W, Mo, Cr, and Ti.
Aluminum or an alloy of aluminum is suitable for the metal
reflecting layer.
[0095] The metal reflecting layer 22 can be formed separately from
the pad electrode 3. The metal reflecting layer can be formed of
aluminum or an alloy of aluminum. The metal reflecting layer 22 is
formed on substantially the whole surface of the light emitting
area. In the case where the pad electrode 3 can have a pattern
different from the metal reflecting layer 22, the pad electrode 3
can be designed in accordance with the wiring pattern of a board
onto which the light emitting device is mounted in a flip-chip
mounting manner. In this case, in order to reliably electrically
insulate areas of the light emitting device where the pad electrode
3 is not formed, the protection film 14 of SiO.sub.2 is arranged on
the areas other than the pad electrode 3.
[0096] The barrier layer 24 is formed in each of the openings 21.
The barrier layer 24 is formed only in the openings 21. The number
of barrier layer 24 parts equals to the number of the openings 21.
In the light emitting device according to this embodiment shown in
FIG. 2, the dielectric film 4 pattern and the barrier layer 24
pattern are formed by using a common mask, while the pad electrode
3 pattern and the metal reflecting layer 22 pattern are formed by
another common mask. As a result, the barrier layer 24 can be
accurately formed in the opening 21 of the dielectric film 4. Also,
the common mask can be used for formation of the dielectric film 4
pattern and the barrier layer 24 pattern, which in turn can reduce
the cost. In addition, only a single mask positioning process is
required for formation of the dielectric film 4 pattern and the
barrier layer 24 pattern, which in turn can reduce the cost.
Particularly, since the barrier layer 24 pattern is formed by using
the common mask, which is also used for formation of the dielectric
film 4 pattern, positional deviation will not be produced.
Accordingly, it is possible to improve yields. As a result, it is
possible to provide high quality light emitting devices. Also,
since formation processes of the dielectric film 4 pattern and the
barrier layer 24 pattern can be continuously performed, the
production method can be simple. Also, since it is not necessary to
take the margin prepared for positional deviation into
consideration when the barrier layer is designed, the effective
area of the metal reflecting layer can be increased. As a result,
it is possible to improve the extraction efficiency.
[0097] As discussed above, since the barrier layer 24 can be formed
in the opening 21, which is formed in the dielectric film 4, so
that the barrier layer 24 fits with the diameter of the opening 21,
it is possible to avoid direct contact between the transparent
electrically-conducting layer 13 and the metal reflecting layer 22,
and to employ a metal with high reflectivity as the metal
reflecting layer 22. Also, since the dielectric film 4 is provided
separately from the metal reflecting layer 22, the dielectric film
4 can be formed on the whole surface of the semiconductor light
emitting device 10. As a result, it is possible to reduce leakage
of light through the PN gap. In the case where an Ag group material
that has high reflectivity is used as the barrier layer 24, it is
possible to further increase the extraction efficiency. Since the
barrier layer 24 is formed on the semiconductor structure side
relative to the metal reflecting layer, it is possible to prevent
ion migration of the metal reflecting layer.
[0098] The aforementioned semiconductor light emitting device 10 is
mounted in a flip-chip (facedown) mounting manner. However, the
mounting manner according to the present invention is not limited
to the flip-chip mounting manner. The semiconductor light emitting
device according to the present invention may be mounted in a
face-up mounting manner.
Second Embodiment
[0099] An eutectic-bonding pad electrode can be additionally
arranged on the pad electrode. FIGS. 4 to 7 show a light emitting
device 10' according to a second embodiment that includes the
eutectic-bonding pad electrode. FIG. 4 is a schematic
cross-sectional view showing the light emitting device 10'. FIGS. 5
to 7 show exemplary construction of the light emitting device 10'
according to the second embodiment. FIG. 5 is a plan view showing
the light emitting device 10'. FIG. 6A is a cross-sectional view of
the light emitting device 10' shown in FIG. 5 taken along the line
VI-VI. FIG. 7 is a cross-sectional view of the light emitting
device 10' shown in FIG. 5 taken along the line VII-VII. The
illustrated semiconductor light emitting device 10' has
substantially the same construction as the light emitting device
shown in FIG. 2. Components of semiconductor light emitting device
10' same as those of the light emitting device shown in FIG. 2 are
attached with the same reference signs, and their description is
omitted. The electrically-insulating protection film 14 covers the
surface of the semiconductor light emitting device 10' shown in
FIG. 4 except the pad electrode formation parts. In the light
emitting device shown in FIG. 4, the barrier layer 24 is formed
flat in the opening 21 only on the bottom surface of the opening
21. The barrier layer 24 can be formed in a recessed shape so that
the barrier layer 24 arranged on the bottom surface and the
peripheral wall part of the opening 21 as shown in FIG. 6A. In this
case, light can be reflected by the side surface of the dielectric
film 4 that is in contact with the barrier layer 24. In the light
emitting device shown in FIG. 6A, eutectic-bonding pad electrodes
27 are arranged on the upper surfaces of the pad electrodes 3.
[0100] Since the barrier layer is arranged in the opening, it is
possible to provide an advantage that disconnection of the metal
reflecting layer that is arranged on the barrier layer is
prevented. The advantage is described with reference to FIG. 6B.
FIG. 6B is a schematic cross-sectional view showing an example of
the metal reflecting layer 22 that is grown in the opening 21
directly on the barrier layer 24. If the metal reflecting layer 22
is grown directly on the transparent electrically-conducting layer
without the barrier layer in the opening 21, the metal reflecting
layer 22 can be grown easily in the vertical direction but is less
prone to being grown in the transverse direction. As a result, the
metal reflecting layer 22 may be partially thin in particular in
the edge part, which is the boundary between the side surface and
the upper surface of the dielectric film 4 in the opening. For this
reason, the electrical resistance value of the thin part of the
metal reflecting layer 22 will be high so that current cannot
smoothly flow through the thin part. Also, a burr may be produced
in the thin part of the metal reflecting layer 22. This may cause
physical poor contact or disconnection. In particular, the thin
part of the metal reflecting layer 22 will be more likely to be
produced as the side surface of the dielectric film 4 becomes
closer to the vertical direction. For this reason, the side surface
of the dielectric film 4 can be inclined as shown in FIG. 6A so
that the edge part of the dielectric film 4 can be an obtuse angle,
in other words, the wall part of the opening 21 is sloped.
According to this construction, it is possible to suppress that
sharp growth direction change makes the metal reflecting layer 22
thin in the edge part. As a result, the metal reflecting layer 22
can be formed in a good film. In addition, since the barrier layer
24 is arranged on the bottom surface of the opening 21 so that the
depth of the opening 21 becomes small, it is possible to suppress
that the metal reflecting layer 22 becomes thinner in the edge
part.
[0101] In the case where the side surface of the dielectric film 4
is inclined so that the edge part of the dielectric film 4 is an
obtuse angle, when the barrier layer 24 is arranged on the side
surface of the dielectric film 4 in the opening, the obtuse angle
can be larger. Since the obtuse angle can be larger, the slope of
the opening 21 can be gentle. As a result, it is possible to
further improve the reliability of the metal reflecting layer 22.
However, the side surface of the dielectric film according to the
present invention is not limited to an inclined surface. Even in
the case where the side surface of the dielectric film is the
vertical direction or a direction close to the vertical direction,
when the barrier layer is arranged on the dielectric film side
surface, the slope of the opening can be gentler.
[0102] In the case where the barrier layer 24 is arranged not only
on the bottom surface of the opening 21 but also on the peripheral
wall of the opening 21 as shown in FIG. 6A, it is also possible to
suppress that the metal reflecting layer 22 becomes thinner in the
edge part of the dielectric film 4. That is, in the case where the
barrier layer 24 is inclined from the edge part of the dielectric
film 4 toward the bottom surface of the opening 21, the edge part
can be an obtuse angle as shown in FIG. 6B. Accordingly, it is
possible to suppress that the metal reflecting layer 22 becomes
partially thin. As a result, the metal reflecting layer 22 can be
formed in a good film.
[0103] Specifically, it is preferable that the angle .alpha. of the
inclined surface of the barrier layer 24 that is arranged on the
side surface of the dielectric film 4 be larger than the
inclination angle .beta. of the side surface of the dielectric film
4 as shown in FIG. 6B. Also, it is preferable that the thickness in
the upper part of the opening 21 (thickness c) of the barrier layer
24 that is arranged on the side surface of the dielectric film 4 be
smaller than the thickness in the lower part of the opening 21
(thickness d) of the barrier layer 24 that is arranged on the side
surface of the dielectric film 4. The thickness d in the lower part
of the opening of the barrier layer can be defined as the distance
between the dielectric film 4 and the intersection that is formed
by the bottom surface of the opening 21 and the extension line of
the inclined surface of the barrier layer 24 that extends toward
the bottom surface of the opening 21, for example.
[0104] The characteristics of the semiconductor light emitting
device shown in FIG. 5 are compared with a light emitting device as
a comparative example that has a structure shown in FIG. 31. FIG. 8
is a graph showing the comparison between the semiconductor light
emitting device shown in FIG. 5 and the light emitting device
according to the comparative example in light output power and
forward voltage. According to this graph, it can be seen that the
light output power of the semiconductor light emitting device shown
in FIG. 5 is increased, while the forward voltage of the
semiconductor light emitting device shown in FIG. 5 is reduced.
From this comparison, it can be found that the construction of the
semiconductor light emitting device according to the second
embodiment has advantages.
Third Embodiment
[0105] The semiconductor light emitting device can have a gap
between the pad electrodes, which are provided for external
connection. FIG. 9 shows this type of semiconductor light emitting
device 10'' according to a third embodiment. The production method
of the semiconductor light emitting device according to the third
embodiment is now described with reference to a flowchart of FIG.
10, and cross-sectional views of FIGS. 11A to 11E and 12F to 12I.
The cross-sectional views show a die for ease of illustration.
Illustration of the dividing process is omitted which divides a
wafer into chips after wafer processes for the sake of brevity.
Main processes can be shown as follows:
Step S1: Epitaxial Growth
Step S2: Exposure of N-Type Layer
Step S3: Formation of ITO Ohmic Electrode
Step S4: Formation of DBR Film on Whole Surface
Step S5: Formation of Resist Mask for Forming Openings
Step S6: DBR Film Dry Etching
Step S7: Formation of Barrier Metal Film
Step S8: Liftoff
Step S7: Formation of Pad Electrodes
[0106] A GaN layer is first grown as shown in FIG. 11A. A mask such
as SiO.sub.2 and resist is formed on the GaN layer, and the n-type
semiconductor layer 6 as n-type contact layer is exposed by RIE, or
the like, as shown in FIG. 11B. After removing the RIE mask, the
ITO electrode film as the transparent electrically-conducting layer
13 is formed into a pattern as shown in FIG. 11C. The ITO electrode
film can be formed by vapor deposition, sputtering, or the like.
Etching or liftoff can be suitably selected in the patterning.
Subsequently, the dielectric film 4 is formed on the whole surface
(including both upper and side surfaces of the semiconductor
structure 11) as shown in FIG. 11D. The dielectric film 4 can be
formed by sputtering, vapor deposition, or the like. After the
dielectric film 4 is formed, a mask MK that has the openings 21
corresponding to electrical connection parts is formed by using a
photoresist as shown in FIG. 11E. The dielectric film 4 is etched
as shown in FIG. 12F. Wet etching, and RIE, which is dry etching,
can be suitably selected in in the dielectric film etching. In the
case where the dielectric film 4 is tapered in the etching, the
mask can be easily lifted off in the later process. After dry
etching, the mask MK is not removed but remains so that the barrier
layer 24 is formed by liftoff as shown in FIG. 12G. It is
preferable that the barrier layer 24 be formed of a metal that has
a high work function (e.g., Au, Rh, Pt, Pd, Au, Ag, etc.). The
reason is to prevent reaction of the barrier layer with the ITO
electrode. After the barrier layer 24 is formed in the openings 21,
the mask MK is removed as shown in FIG. 12H. Subsequently, the
metal reflecting layer 22 formed of Al or an alloy of Al, and the
pad electrodes 3A and 3B for external connection are formed as
shown in FIG. 12I.
[0107] According to the above processes, since the mask MK for
forming the barrier layer 24 can be also used as the mask MK for
forming the openings 21 in the dielectric film 4, the number of
production processes can be reduced. Also, since a process for
positioning the barrier layer 24 in the opening 21 is not required
in the formation of barrier layer 24, the barrier layer 24 can be
accurately arranged in the opening 21.
Fourth Embodiment
[0108] FIGS. 13 to 21 are cross-sectional views showing production
processes of a semiconductor light emitting device (shown in the
cross-sectional view of FIG. 21) according to a fourth embodiment.
After the semiconductor structure 11 is first epitaxially grown,
the GaN layer in the n-type semiconductor layer 6 is etched, and
exposed as shown in FIG. 13. Subsequently, the ITO film is formed
as the transparent electrically-conducting layer 13. Subsequently,
the dielectric film 4 (DBR) is formed, and an Al layer is formed as
the metal reflecting layer 22 as shown in FIG. 14. Subsequently, a
resist layer is formed as the mask MK by photolithography or the
like so that the surface of the metal reflecting layer 22 is
covered, and the metal reflecting layer 22 is etched as shown in
FIG. 15. The resist layer is removed in FIG. 16. The electrically
insulating film is formed as shown in FIG. 17. After a resist layer
is formed by photolithography or the like, the electrically
insulating film and the dielectric film 4 are etched as shown in
FIG. 18. The barrier layer 24 is formed as shown in FIG. 19. The
resist layer is removed (lifted off) as shown in FIG. 20. Finally,
an Al layer is formed as the pad electrodes on the upper surfaces
of the barrier layer 24, and the resist layer is removed (lifted
off) as shown in FIG. 21. Thus, the semiconductor light emitting
device according to the fourth embodiment is produced.
Fifth Embodiment
[0109] An Al reflecting film with larger area can be arranged. FIG.
22 is a cross-sectional view showing this type of semiconductor
light emitting device according to a fifth embodiment. According to
the construction shown in FIG. 22, the Al reflecting film has a
multilevel structure so that the gap between Al reflecting film
parts is eliminated. Accordingly, it is possible to suppress
leakage of light. Therefore, the semiconductor light emitting
device according to a fifth embodiment is advantageous in light
output power.
Sixth Embodiment
(Eutectic Bonding)
[0110] Eutectic bonding can be applied to the semiconductor light
emitting device according to the present invention. FIG. 23 is a
cross-sectional view showing this type of semiconductor light
emitting device according to a sixth embodiment. In this
illustrated light emitting device, after the n-type layer is formed
on the growth substrate 5, the n-type layer is partially etched and
exposed. Subsequently, the ITO layer is formed as the transparent
electrically-conducting layer 13. After that, the DBR and the
barrier layer 24 are formed. After the metal reflecting layer 22 is
formed, the electrode-insulating film 26 is formed. Finally, the
eutectic-bonding pad electrodes are formed.
(N-Side Electrode 3a)
[0111] It is preferable that the n-side electrodes 3a be small and
be dispersedly arranged. The n-side electrodes 3a are connected to
the n-side pad electrode 3A. Accordingly, the area of the electrode
can be large. As a result, it is possible to provide a device that
has good heat dissipating performance and can be easily mounted.
FIG. 24 is a horizontal cross-sectional view showing the light
emitting device that has exemplary dispersed n-side electrodes.
Since the illustrated n-side electrode 3a is small, it is possible
to suppress that emitted light is absorbed by the n-side electrode
3a. As a result, it is possible to increase the light extraction
efficiency. Since the small n-side electrodes 3a are dispersedly
arranged (distributed), the electrical resistance is reduced so
that Vf can be reduced. Additionally, the linearity can be also
improved. In addition, since the n-side electrodes 3a, which absorb
emitted light, are dispersedly arranged, the distribution of light
emission can be even. The term "n-side electrodes 3a are
dispersedly arranged" includes that a plurality of n-side
electrodes 3a are dispersedly arranged in a cluster, and that a
plurality of n-side electrodes 3a are dispersedly arranged and but
does not compose a cluster.
Seventh Embodiment
(Multilevel Structure)
(Electrode-Insulating Film 26)
[0112] A multilevel structure can be applied to the semiconductor
light emitting device according to the present invention. FIGS. 25
and 26 show this type of light emitting device according to a
seventh embodiment that includes the multilevel structure. FIG. 25
is a plan view showing this light emitting device. FIG. 26 is a
vertical cross-sectional view showing this light emitting device
taken along the line XXVI-XXVI in FIG. 25. In the multilevel
structure, after the p-side electrode 3b and the n-side electrode
3a are covered by the electrode-insulating film 26, the p-side pad
electrode 3B and the n-side pad electrode 3A are formed so that the
p-side pad electrode 3B and the n-side pad electrode 3A can be
connected through electrical connection windows that are opened in
this electrode covering film to the p-side electrode 3b and the
n-side electrode 3a, respectively. According to this construction,
even in the case where the pad electrodes are formed large, since
the lower surfaces of the pad electrodes are electrically insulated
by the electrode-insulating film 26, a short circuit will not
occur. For this reason, the area of the pad electrode can be large.
Also, it is possible to surely provide an enough area for eutectic
bonding to fix and electrically connect the pad electrode. For
example, in the light emitting device shown in the cross-sectional
view of FIG. 26, the n-side electrodes 3a can be connected to the
large n-side pad electrode through the openings in the
electrode-insulating film 26. Accordingly, it is possible to
provide a large area for eutectic bonding. As a result, it is
possible to improve the reliability of eutectic bonding. Therefore,
the light emitting device can be stably mounted. Mounting manner
other than the eutectic boding can be used. For example, in the
case of ultrasonic bonding using Au stud bumps, the number of the
bumps can be increased so that heat dissipation can be improved. As
a result, a large current can be applied. Current tends to locally
flow through the PN gap. For this reason, when stud bumps are
formed on the n-side pad electrode 3A, the stud bumps are
surrounded by a plurality of n-side electrodes 3a. In this case,
heat dissipation can be further improved.
[0113] In this illustrated light emitting device, after the n-type
layer is formed on the growth substrate 5, the n-type layer is
partially etched and exposed. Subsequently, the ITO layer is
formed. After that, similar to the light emitting device shown in
FIG. 23, the DBR and the barrier layer 24 are formed. After the
metal reflecting layer 22 is formed, the electrode-insulating film
26 is formed. Finally, the eutectic pad electrodes are formed.
According to this embodiment, since the multilevel structure is
adopted so that the n-side electrode overlaps the p-side electrode,
the area of the n-side pad electrode 3A can be large as shown in
FIG. 25. If the n-side pad electrode does not overlap the p-side
electrode, the n-side electrode will be small, in other words, the
area of the n-side pad electrode will correspond to the n-side
electrode 3a. In this embodiment, since the area of the electrode
can be large, the light emitting device according to this
embodiment is advantageous in eutectic bonding.
[0114] In addition, since the multilevel structure is adopted so
that the dielectric film 4 serves as a film for electrically
insulating layers from each other, it is possible to minimize the
exposed area of the n-type contact layer, which does not correspond
the light emission are, and to surely provide a bonding area
required for the flip-chip mounting process.
Eighth Embodiment
[0115] FIGS. 27 and 28 show a semiconductor light emitting device
according to an eighth embodiment. FIG. 27 is a plan view showing
this light emitting device. FIG. 28 is a cross-sectional view
showing this light emitting device taken along the line
XXVIII-XXVIII in FIG. 27. Although the light emitting device has
not a square shape but a rectangular shape as shown this plan view,
the multilevel structure can provide a large area of the electrode.
As a result, the light emitting device according to this embodiment
can be advantageous in eutectic bonding.
(Electrode-Insulating Film 26)
[0116] The side surface of the semiconductor structure 11 is
covered by the metal reflecting layer 22. The metal reflecting
layer 22, which covers the side surface of the semiconductor
structure 11, covers the n-type semiconductor layer 6. The metal
reflecting layer 22 is separated from the second metal reflecting
layer 22n that covers the p-type semiconductor layer 7. In other
words, the metal reflecting layer 22 is disconnected from the
second metal reflecting layer 22n. The electrode-insulating film 26
is arranged on the upper surface of the metal reflecting layer 22,
which covers the side surface of the semiconductor structure 11.
The electrode-insulating film 26 extends and covers a spaced part
between the metal reflecting layer 22 and the second metal
reflecting layer 22n. The n-side and p-side pad electrodes are
arranged on the upper surface of this electrode-insulating film 26,
and are spaced away from each other. According to this
construction, since the n-side and p-side electrodes 3a and 3b are
connected to the n-side and p-side pad electrodes in the multilevel
structure, the area of the pad electrode can be larger. As a
result, the light emitting device according to this embodiment can
be advantageous in eutectic bonding. Since the multilevel structure
is adopted so that the dielectric film 4 serves as a film for
electrically insulating layers from each other, it is possible to
prevent that the electrode cuts off light. As a result, it is
possible to further increase the light extraction efficiency.
INDUSTRIAL APPLICABILITY
[0117] A light emitting device according to the present invention
can be applied to a lighting light source, an LED display, a back
light source, a signal light, an illuminated switch, various types
of sensors and indicators, and the like.
[0118] It should be apparent to those with an ordinary skill in the
art that while various preferred embodiments of the invention have
been shown and described, it is contemplated that the invention is
not limited to the particular embodiments disclosed, which are
deemed to be merely illustrative of the inventive concepts and
should not be interpreted as limiting the scope of the invention,
and which are suitable for all modifications and changes falling
within the scope of the invention as defined in the appended
claims. The present application is based on Application No.
2011-189,889 filed in Japan on Aug. 31, 2011 and Application No.
2012-168,944 filed in Japan on Jul. 30, 2012, the contents of which
are incorporated herein by references.
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