U.S. patent application number 13/278170 was filed with the patent office on 2013-02-21 for cooling system for electronic device.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is CHUN-MING CHEN, TSUNG-HAN SU. Invention is credited to CHUN-MING CHEN, TSUNG-HAN SU.
Application Number | 20130043008 13/278170 |
Document ID | / |
Family ID | 47711797 |
Filed Date | 2013-02-21 |
United States Patent
Application |
20130043008 |
Kind Code |
A1 |
SU; TSUNG-HAN ; et
al. |
February 21, 2013 |
COOLING SYSTEM FOR ELECTRONIC DEVICE
Abstract
A cooling system for cooling an electronic device includes a
first heat exchanger, a second heat exchanger, a third heat
exchanger, a first refrigerant pipe, a second refrigerant pipe, and
a pump. The first and second refrigerant pipes receive
refrigerants, which can circulate in the first and second heat
exchangers. The first heat exchanger is arranged in the electronic
device for cooling the electronic device. The pump circulates the
refrigerants. The third heat exchanger heats liquefied gas with sea
water before the sea water enters the second heat exchanger. The
second heat exchanger cools the refrigerants by the cooled sea
water from the third heat exchanger.
Inventors: |
SU; TSUNG-HAN; (Tu-Cheng,
TW) ; CHEN; CHUN-MING; (Tu-Cheng, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SU; TSUNG-HAN
CHEN; CHUN-MING |
Tu-Cheng
Tu-Cheng |
|
TW
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
47711797 |
Appl. No.: |
13/278170 |
Filed: |
October 20, 2011 |
Current U.S.
Class: |
165/104.31 |
Current CPC
Class: |
H05K 7/20709 20130101;
F28D 15/00 20130101; H05K 7/20263 20130101; H05K 7/20218
20130101 |
Class at
Publication: |
165/104.31 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 15, 2011 |
TW |
100129038 |
Claims
1. A cooling system for an electronic device, comprising: a first
heat exchanger for being arranged in the electronic device for
cooling the electronic device; a second heat exchanger; a third
heat exchanger; a pump connected to the second heat exchanger; a
first refrigerant pipe connected between the first heat exchanger
and the pump; and a second refrigerant pipe connected between the
first heat exchanger and the second heat exchanger; wherein the
first heat exchanger, the second refrigerant pipe, the second heat
exchanger, the pump, and the first refrigerant pipe together form a
circulatory system and circulate refrigerants; wherein the first
refrigerant pipe transfers refrigerants cooled by the second heat
exchanger into the first heat exchanger, to cool the electronic
device; wherein the second refrigerant pipe transfers refrigerants
heated by the first heat exchanger into the second heat exchanger;
wherein the pump circulates refrigerants; wherein the third heat
exchanger heats the liquefied gas with sea water, and the sea water
is then cooled before entering the second heat exchanger; and
wherein the second heat exchanger cools the refrigerants flowing
through the second heat exchanger through the cooled sea water
coming from the third heat exchanger.
2. The cooling system of claim 1, wherein the liquefied gas is
liquefied natural gas.
3. The cooling system of claim 1, wherein the liquefied gas is
liquid nitrogen.
4. The cooling system of claim 1, wherein the third heat exchanger
receives heat medium for transferring heat of the sea water to the
liquefied gas.
5. The cooling system of claim 4, wherein the heat medium is
antifreeze.
6. The cooling system of claim 1, wherein the second heat exchanger
is a shell and tube heat exchanger or a plate heat exchanger.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] Relevant subject matter is disclosed in two pending U.S.
patent applications, with Ser. application Nos. 13/235,450 (Docket
No. US41037) and 13/272,238 (Docket No. US41038), respectively,
filed on Sep. 18, 2011 and Oct. 13, 2011, and both entitled
"COOLING SYSTEM FOR ELECTRONIC DEVICE", which are assigned to the
same assignee with this patent application.
BACKGROUND
[0002] 1. Technical Field
[0003] The present disclosure relates to cooling systems, and
particularly, to a cooling system for an electronic device.
[0004] 2. Description of Related Art
[0005] With increasing heavy use of on-line applications, the need
for computer data centers has increased rapidly. Data centers are
centralized computing facilities that include many servers, often
arranged on server racks or shelves, and one rack or shelf with
several servers can be considered a server system. During
operation, server systems generate a lot of heat in the data
centers, and a common method for dissipating the heat is to use air
conditioners, which use a lot of energy. Therefore an energy-saving
cooling system is needed.
BRIEF DESCRIPTION OF THE DRAWING
[0006] Many aspects of the present embodiments can be better
understood with reference to the following drawing. The components
in the drawing are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawing, like reference
numerals designate corresponding parts throughout the several
views.
[0007] The FIGURE is a schematic block diagram of a cooling system
of an electronic device, according to an exemplary embodiment.
DETAILED DESCRIPTION
[0008] The disclosure, including the accompanying drawing, is
illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0009] Referring to the FIGURE, an embodiment of a cooling system
is provided for cooling an electronic device 10. The cooling system
includes a first heat exchanger 20, a second heat exchanger 50, a
first refrigerant pipe 30, a second refrigerant pipe 40, a pump 31,
and a third heat exchanger 60. The first heat exchanger 20, the
second refrigerant pipe 40, the second heat exchanger 50, the pump
31, and the first refrigerant pipe 30 are connected in that order
to form a circulation system and circulate refrigerants. The first
and second refrigerant pipes 30 and 40 receive refrigerants, which
can circulate in the first and second heat exchangers 20 and
50.
[0010] The electronic device 10 may be a container data center,
which can generate a lot of heat.
[0011] The first heat exchanger 20 is arranged in the electronic
device 10 for cooling the electronic device 10.
[0012] The first refrigerant pipe 30 is connected between the first
heat exchanger 20 and the second heat exchanger 50, for
transferring the refrigerants cooled by the second heat exchanger
50 to the first heat exchanger 20, to cool the first heat exchanger
20.
[0013] The second refrigerant pipe 40 is connected between the
first heat exchanger 20 and the second heat exchanger 50, for
transferring the refrigerants heated by the first heat exchanger 20
to the second heat exchanger 50.
[0014] The pump 31 is arranged between the first refrigerant pipe
30 and the second heat exchanger 50, for circulating the
refrigerants. In this embodiment, the pump 31 is used for
transferring the refrigerants cooled by the second heat exchanger
50 to the first refrigerant pipe 30. In another embodiment, the
pump 31 can be arranged between the second refrigerant pipe 40 and
the second heat exchanger 50, or another pump can be arranged
between the second refrigerant pipe 40 and the second heat
exchanger 50.
[0015] The third heat exchanger 60 is connected to liquefied gas 61
and a gas outlet 63. Sea water from a sea water inlet 51 flows into
the third heat exchanger 60 to heat the liquefied gas 61, thereby,
the sea water is cooled. The cooled sea water is then flows into
the second heat exchanger 50.
[0016] The third heat exchanger 60 receives heat medium, which is
used for cooling the sea water from the sea water inlet 51. The
liquefied gas 61 cools the heat medium, and then is exhausted
through the gas outlet 63. In this embodiment, the heat medium is
antifreeze composed of at least one of alcohol, glycol, propylene
glycol, and glycerol.
[0017] The second heat exchanger 50 is used for cooling the
refrigerants flowing through the second heat exchanger 50 by the
cooled sea water coming from the third heat exchanger 60. The sea
water then is exhausted through a sea water outlet 53. The second
heat exchanger 50 may be a shell and tube heat exchanger or a plate
heat exchanger.
[0018] In this embodiment, the liquefied gas 61 is liquefied
natural gas (LNG). In another embodiment, the liquefied gas 61 may
be liquid nitrogen (LN).
[0019] In this embodiment, the cooling system cools the electronic
device 10 by the refrigerant circulated in the first heat exchanger
20, the third heat exchanger 60 heats the liquefied gas 61 with sea
water, and the sea water is then cooled, the second heat exchanger
50 cools refrigerants with the cooled sea water.
[0020] Even though numerous characteristics and advantages of the
embodiments have been set forth in the foregoing description,
together with details of the structure and function of the
embodiments, the disclosure is illustrative only, and changes may
be made in detail, especially in the matters of shape, size, and
arrangement of parts within the principles of the present
disclosure to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
* * * * *