U.S. patent application number 13/492513 was filed with the patent office on 2013-02-14 for abrasive article.
The applicant listed for this patent is Karl Schwappach. Invention is credited to Zine-Eddine Boutaghou, Karl Schwappach.
Application Number | 20130040542 13/492513 |
Document ID | / |
Family ID | 43030742 |
Filed Date | 2013-02-14 |
United States Patent
Application |
20130040542 |
Kind Code |
A1 |
Schwappach; Karl ; et
al. |
February 14, 2013 |
ABRASIVE ARTICLE
Abstract
An abrasive article including a flexible backing having opposing
first and second surfaces. The first surface of the flexible
backing includes abrasive features. An adhesive layer including
load bearing particles and an adhesive matrix is disposed on the
second surface of the flexible backing. At least a portion of the
load bearing particles is substantially enveloped in the adhesive
matrix and is in contact with the second surface of the polymer
substrate. A rigid support is preferably attached to the adhesive
layer including the load bearing particles. At least a portion of
the load bearing particles is preferably in contact with the rigid
support.
Inventors: |
Schwappach; Karl; (North
Oaks, MN) ; Boutaghou; Zine-Eddine; (North Oaks,
MN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Schwappach; Karl |
North Oaks |
MN |
US |
|
|
Family ID: |
43030742 |
Appl. No.: |
13/492513 |
Filed: |
June 8, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12784908 |
May 21, 2010 |
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13492513 |
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12766473 |
Apr 23, 2010 |
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12784908 |
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61174472 |
Apr 30, 2009 |
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61187658 |
Jun 16, 2009 |
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61220149 |
Jun 24, 2009 |
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61221554 |
Jun 30, 2009 |
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61232425 |
Aug 8, 2009 |
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61232525 |
Aug 10, 2009 |
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61248194 |
Oct 2, 2009 |
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61267031 |
Dec 5, 2009 |
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61267030 |
Dec 5, 2009 |
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Current U.S.
Class: |
451/490 ;
451/532; 451/539; 451/540; 51/297 |
Current CPC
Class: |
Y10T 29/5397 20150115;
B24D 11/00 20130101 |
Class at
Publication: |
451/490 ;
451/539; 451/532; 451/540; 51/297 |
International
Class: |
B24D 11/02 20060101
B24D011/02; B24D 18/00 20060101 B24D018/00; B24D 3/00 20060101
B24D003/00 |
Claims
1. An abrasive article comprising: a flexible backing having
opposing first and second surfaces; abrasive features on the first
surface of the flexible backing; and an adhesive layer comprising
load bearing particles and an adhesive matrix, the adhesive layer
disposed on the second surface of the flexible backing, wherein at
least a portion of the load bearing particles is substantially
enveloped in the adhesive matrix and is in contact with the second
surface of the polymer substrate.
2. The abrasive article of claim 1 further comprising a rigid
support attached to the adhesive layer comprising the load bearing
particles.
3. The abrasive article of claim 2, wherein at least a portion of
the load bearing particles is in contact with the rigid
support.
4. The abrasive article of claim 1, wherein the flexible backing is
selected from the group consisting of metal foil, cloth, paper,
vulcanized fiber, non-woven materials, polymeric materials,
ceramics, or composites thereof.
5. The abrasive article of claim 4, wherein the polymeric substrate
is selected from the group consisting of polyester, polypropylene,
polyethylene, polyamide, polyimide.
6. The abrasive article of claim 1, wherein the load bearing
particle has an average diameter that is substantially equal to the
thickness of the adhesive layer.
7. An abrasive article comprising: a backing having opposing first
and second surfaces; abrasive features on the first surface of the
backing; and an adhesive layer comprising load bearing particles
and an adhesive matrix, the adhesive layer disposed on the second
surface of the backing, wherein at least a portion of the load
bearing particles is substantially enveloped in the adhesive matrix
and is in contact with the second surface of the polymer
substrate.
8. The abrasive article of claim 1 wherein the backing is one of
rigid or flexible.
9. A polishing pad comprising: a flexible backing having opposing
first and second surfaces; an adhesive layer comprising load
bearing particles and an adhesive matrix, the adhesive layer
disposed on the second surface of the flexible backing, wherein at
least a portion of the load bearing particles is substantially
enveloped in the adhesive matrix and is in contact with the second
surface of the polymer substrate; and abrasive features located at
an interface of the first surface of the flexible backing with a
substrate, the abrasive features polishing the substrate during
motion of the polishing pad relative to the substrate.
10. The polishing pad of claim 9 wherein the abrasive features
comprise one or more of an abrasive material attached to the first
surface, a slurry of free abrasive particles located at the
interface with the substrate, or a combination thereof.
11. The polishing pad of claim 9 comprising one or more fluid
bearing features on the first surface configured to generate lift
forces during motion of the polishing pad relative to the
substrate.
12. The polishing pad of claim 9 wherein the first surface comprise
at least one of topography following or topography removing
feature.
13. The polishing pad of claim 9 wherein at least a portion of the
load bearing particles is in contact with a rigid support.
14. A method of making an abrasive article comprising the steps of
locating an adhesive layer comprising load bearing particles and an
adhesive matrix between a second surface of the flexible backing
and rigid support, wherein at least a portion of the load bearing
particles is substantially enveloped in the adhesive matrix and is
in contact with the second surface of the polymer substrate.
15. The method of claim 14 wherein a least a portion of the load
bearing particles is in contact with the rigid support.
Description
RELATED APPLICATIONS
[0001] The present application is a continuation of U.S.
application Ser. No. 12/784,908, entitled Array of Abrasive Members
with Resilient Support, filed May 21, 2010, which is a
continuation-in-part of U.S. application Ser. No. 12/766,473,
entitled Abrasive Article with Array of Gimballed Abrasive Members
and Method of Use, filed Apr. 23, 2010, which claims the benefit of
U.S. Provisional Patent Application Nos. 61/174,472 entitled Method
and Apparatus for Atomic Level Lapping, filed Apr. 30, 2009;
61/187,658 entitled Abrasive Member with Uniform Height Abrasive
Particles, filed Jun. 16, 2009; 61/220,149 entitled Constant
Clearance Plate for Embedding Diamonds into Lapping Plates, filed
Jun. 24, 2009; 61/221,554 entitled Abrasive Article with Array of
Gimballed Abrasive Members and Method of Use, filed Jun. 30, 2009;
61/232,425 entitled Constant Clearance Plate for Embedding Abrasive
Particles into Substrates, filed Aug. 8, 2009; 61/232,525 entitled
Method and Apparatus for Ultrasonic Polishing, filed Aug. 10, 2009;
61/248,194 entitled Method and Apparatus for Nano-Scale Cleaning,
filed Oct. 2, 2009; 61/267,031 entitled Abrasive Article with Array
of Gimballed Abrasive Members and Method of Use, entitled Dec. 5,
2009; and 61/267,030 entitled Dressing Bar for Embedding Abrasive
Particles into Substrates, filed Dec. 5, 2009, all of which are
hereby incorporated by reference.
FIELD OF THE INVENTION
[0002] The present disclosure is directed to an abrasive article
including a flexible backing supported by an adhesive layer
including load bearing particles and an adhesive matrix. At least a
portion of the load bearing particles is substantially enveloped in
the adhesive matrix and is in contact with the flexible
backing.
BACKGROUND OF THE INVENTION
[0003] Semiconductor wafers are typically fabricated using
photolithography, which is adversely affected by inconsistencies or
unevenness in the wafer surface. This sensitivity is accentuated
with the current drive toward smaller, more highly integrated
circuit designs. After each layer of the circuit is etched on the
wafer, an oxide layer is put down as the base for the next layer.
Each layer of the circuit can create roughness and waviness to the
wafer that is preferably removed before depositing the next circuit
layer. For many semiconductor applications the chemical mechanical
processing ("CMP") is customized for each layer. A change in a
single processing parameter, such as for example, pad design,
slurry formulation, or pressure applied by the pad, can require the
entire CMP process to be redesigned and recertified.
[0004] Magnetic media have similarly stringent planarization
requirements as data densities approach 1 Terabyte/inch.sup.2 (1
Tbit/in.sup.2) and beyond, especially on bit patterned media and
discrete track media, such as illustrated in U.S. Pat. Publication
2009/0067082. FIGS. 1 and 2 illustrate the shape of bits formed by
etching, such as ion milling or reactive etching. Note that the
tops of the bits are rounded, leading to head media spacing loss,
roughness at the rounded areas, and magnetic damage due to etching
of magnetic materials. Such bits are not viable for magnetic
recording. The uneven material increases head media spacing and
potential damage to the diamond-like-carbon overcoats. CMP
processes have proven inadequate to achieving smooth and flat tops
both before and after magnetic material deposition.
[0005] CMP is currently the primary approach to planarizing wafers,
semiconductors, optical components, magnetic media for hard disk
drives, and bit patterned or discrete track media (collectively
"substrates"). CMP uses pads to press sub-micron sized particles
suspended in the slurry against the surface of the substrate. The
nature of the material removal varies with the hardness of the CMP
pad. Soft CMP pads conform to the nanotopography and tend to remove
material generally uniformly from the entire surface. Hard CMP pads
conform less to the nanotopography and therefore remove more
material from the peaks or high spots on the surface and less
material from low spots.
[0006] Traditionally, soft CMP pads have been used to remove a
uniform surface layer, such as removing a uniform oxide layer on a
semiconductor device. Polishing a substrate with a soft pad also
transfers various features from the polishing pad to the substrate.
Roughness and waviness is typically caused by uneven pressure
applied by the pad during the polishing process. The uneven
pressure can be caused by the soft pad topography, the run out of
the moving components, or the machined imperfections transferred to
the pads. Run-out is the result of larger pressures at the edges of
the substrate due to deformation of the soft pad. Soft pad
polishing of heterogeneous layered materials, such as semiconductor
devices, causes differential removal and damage to the electrical
devices.
[0007] A CMP pad is generally of a polyurethane or other flexible
organic polymer. The particular characteristics of the CMP pad such
as hardness, porosity, and rigidity, must be taken into account
when developing a particular CMP process for processing of a
particular substrate. Unfortunately, wear, hardness, uneven
distribution of abrasive particles, and other characteristics of
the CMP pad may change over the course of a given CMP process. This
is due in part to water absorption as the CMP pad takes up some of
the aqueous slurry when encountered at the wafer surface during
CMP. This sponge-like behavior of the CMP pad leads to alteration
of CMP pad characteristics, notably at the surface of the CMP pad.
Debris coming from the substrate and abrasive particles can also
accumulate in the pad surface. This accumulation causes a "glazing"
or hardening of the top of the pad, thus making the pad less able
to hold the abrasive particles of the slurry and decreasing the
pad's overall polishing performance. Further, with many pads the
pores used to hold the slurry become clogged, and the overall
asperity of the pad's polishing surface becomes depressed and
matted.
[0008] Shortcomings of current CMP processes affect other aspects
of substrate processing as well. The sub-micron particles used in
CMP tend to agglomerate and strongly adhere to each other and to
the substrate, resulting in nano-scale surface defects. Van der
Waals forces create a very strong bond between these surface debris
and the substrate. Once surface debris form on a substrate it is
very difficult to effectively remove them using conventional
cleaning methods. Various methods are known in the art for removing
surface debris from substrates after CMP, such as disclosed in U.S.
Pat. Nos. 4,980,536; 5,099,557; 5,024,968; 6,805,137 (Bailey);
5,849,135 (Selwyn); 7,469,443 (Liou); 6,092,253 (Moinpour et al.);
6,334,229 (Moinpour et al.); 6,875,086 (Golzarian et al.);
7,185,384 (Sun et al.); and U.S. Patent Publication Nos.
2004/0040575 (Tregub et al.); and 2005/0287032 (Tregub et al.), all
of which are incorporated by reference, but have proven inadequate
for the next generation semiconductors and magnetic media.
[0009] Current processing of substrates for semiconductor devices
and magnetic media treats uniform surface layer reduction,
planarization to remove waviness, and cleaning as three separate
disciplines. The incremental improvements in each of these
disciplines have not kept pace with the shrinking feature size of
features demanded by the electronics industry.
BRIEF SUMMARY OF THE INVENTION
[0010] The present disclosure is directed to an abrasive article
including a flexible backing having opposing first and second
surfaces. The first surface of the flexible backing includes
abrasive features. An adhesive layer including load bearing
particles and an adhesive matrix is disposed on the second surface
of the flexible backing. At least a portion of the load bearing
particles is substantially enveloped in the adhesive matrix and is
in contact with the second surface of the polymer substrate.
[0011] The flexible backing is selected from the group consisting
of metal foil, cloth, paper, vulcanized fiber, non-woven materials,
polymeric materials, ceramics, or composites thereof. The polymeric
substrate is selected from the group consisting of polyester,
polypropylene, polyethylene, polyamide, polyimide. The load bearing
particles have an average diameter that is substantially equal to
the thickness of the adhesive layer. Examples of suitable particles
include fused aluminum oxide, heat treated aluminum oxide, white
fused aluminum oxide, porous aluminas, transition aluminas,
zirconia, tin oxide, ceria, fused alumina zirconia, or
alumina-based sol gel derived abrasive particles.
[0012] The present disclosure is directed to an abrasive article
including a rigid backing having opposing first and second
surfaces. The first surface of the rigid backing includes abrasive
features. An adhesive layer including load bearing particles and an
adhesive matrix is disposed on the second surface of the rigid
backing. At least a portion of the load bearing particles is
substantially enveloped in the adhesive matrix and is in contact
with the second surface of the polymer substrate.
[0013] The present disclosure is also directed to a polishing pad
including a flexible backing having opposing first and second
surfaces. An adhesive layer including load bearing particles and an
adhesive matrix is disposed on the second surface of the flexible
backing. At least a portion of the load bearing particles is
substantially enveloped in the adhesive matrix and is in contact
with the second surface of the polymer substrate. Abrasive features
are located at an interface of the first surface of the flexible
backing with a substrate. The abrasive features polish the
substrate during motion of the polishing pad relative to the
substrate.
[0014] The abrasive features can be one or more of an abrasive
material attached to the first surface, a slurry of free abrasive
particles located at the interface with the substrate, or a
combination thereof. One or more fluid bearing features is
optionally on the first surface configured to generate lift forces
during motion of the polishing pad relative to the substrate. The
first surface of the flexible backing can include at least one of
topography following or topography removing feature. At least a
portion of the load bearing particles is preferably in contact with
a rigid support.
[0015] The present disclosure is also directed to a method of
making an abrasive article including the step of locating an
adhesive layer including load bearing particles and an adhesive
matrix between a surface of the flexible backing and rigid support.
At least a portion of the load bearing particles is substantially
enveloped in the adhesive matrix and is in contact with the second
surface of the polymer substrate. At least a portion of the load
bearing particles is preferably in contact with the rigid
support.
[0016] While the abrasive features generally have a hardness
greater than the substrate, this property is not required for every
embodiment since any two solid materials that repeatedly rub
against each other will tend to wear each other away. For example,
relatively soft polymeric abrasive features molded on the abrasive
members can be used to remove surface contaminants or can interact
with free abrasive particles to remove material from the surface of
a harder substrate. As used herein, "abrasive feature" refers to a
portion of an abrasive member that comes in physical contact with a
substrate or a contaminant on a substrate, independent of the
relative hardness of the respective materials and the resulting cut
rate.
[0017] FIG. 3A is a schematic illustration of a topography
following abrasive member 1000 in accordance with an embodiment of
the present invention. The abrasive member 1000 is typically
designed to follow the topography by assuring that the trailing
edge area has the largest pressure peak. For example, the fluid
bearing can be pitched to ensure that the leading edge is spaced
substantially higher above the substrate than the trailing edge.
The trailing edge 1006 of the abrasive member 1000 applies a
cutting force to nanometer-scale and/or micron-scale height
variations 1008 on the surface 1004, while following the
millimeter-scale and/or micrometer-scale wavelengths in the
waviness 1010 on the substrate. Consequently, the abrasive member
1000 removes a generally uniform layer of material 1012 from peaks
1014 as well as valleys 1016 on the surface 1004, such as for
example, removing or controlling the thickness of an oxide layer.
As used herein, "topography following" refers to an individually
gimbaled abrasive member that generally follows millimeter-scale
and/or micrometer-scale wavelengths of waviness on a substrate,
while engaging with nanometer-scale height variations to primarily
remove a generally uniform amount of material from the surface.
[0018] FIG. 3B is a schematic illustration of a topography removing
abrasive member 1050 in accordance with an embodiment of the
present invention. The leading edge 1056 and/or trailing edge 1058
of the abrasive member 1050 applies a cutting force to peaks 1060
of millimeter-scale and/or micrometer-scale wavelengths of the
waviness 1062 on the surface 1054 of the substrate, with minimal
engagement with the valleys 1064. Consequently, the abrasive member
1050 removes more material from the peaks 1060 than the valleys
1064. As used herein, "topography removing" refers to an
individually gimbaled abrasive member that primarily removes
nanometer-scale and/or micrometer-scale height variations from
peaks of millimeter-scale and/or micrometer-scale wavelengths in
the waviness on a substrate.
[0019] FIG. 3C is a schematic illustration of a cleaning abrasive
member 1100 in accordance with an embodiment of the present
invention. The leading edge 1114 and/or the trailing edge 1106 of
the abrasive member 1100 follows the millimeter-scale and/or
micrometer-scale wavelengths in the waviness 1108 on the substrate,
while applying a cutting force to nanometer-scale and/or
micron-scale contaminants 1110. The abrasive member 1100 preferably
has a spacing 1112 such that little or no material is removed from
the surface 1104 of the substrate other than the contaminants 1110.
As used herein, "cleaning" refers to an individually gimbaled
abrasive member that generally follows millimeter-scale and/or
micrometer-scale wavelengths in the waviness of a substrate, while
primarily engaging with nanometer-scale and/or micrometer-scale
height contaminant on the surface, with little or no material
removal from the surface.
[0020] Since the abrasive members engage with nanometer-scale and
micrometer-scale structures, it is unlikely that any particular
embodiment will perform one of the topography following, topography
removing, or cleaning functions to the exclusion of the other two.
Rather, the present application adopts a probabilistic approach
that a particular embodiment is more likely to perform one
function, recognizing that the other two functions are also likely
being performed in varying degrees.
[0021] For example, the topography following abrasive member 1000
of FIG. 3A can also remove some or all of the surface contaminants
1110 of FIG. 3C. In another example, the pressure applied to peaks
1014 in FIG. 3A may be greater than in the valleys 1016, resulting
in more material removal from the peaks 1014, such as illustrated
in FIG. 3B. The topography removing abrasive member 1050 may engage
sidewalls 1066 of the peaks 1060 or the valley 1064, such as
illustrated in FIG. 3A. The cleaning abrasive member 1100 may
contact the surface 1104 and remove a generally uniform layer of
material from the substrate, along with the contaminants 1110.
Therefore, the definitions of "topography following", "topography
removing", and "cleaning" should not be read as mutually exclusive.
It should be assumed that the design parameters of the abrasive
members can be modified to emphasize more of one function than the
others.
[0022] Various abrasive features are available for the present
abrasive members, such as for example, a surface roughness formed
on the leading and/or trailing edges of the abrasive members. That
surface roughness may include a hard coat, such as for example,
diamond-like-carbon. In another embodiment, the abrasive features
may be discrete abrasive particles, such as for example, fixed
diamonds. In yet another embodiment, the abrasive features may be
structured abrasives, discussed further below.
[0023] For example, to remove all the wavelengths smaller than a
desired value, the dimensions of the abrasive members can be
greater than the target wavelengths. The wavelengths are determined
by the gas pressure profile generated by the abrasive member and
the size of the abrasive member. As a rule of thumb, the smallest
circumferential wavelength is about one-fourth the length of the
abrasive members.
[0024] The dimensions of the abrasive members and the pressure
profile due to the hydrostatic and/or hydrodynamic lift (gas and/or
liquid) determine the ability of the abrasive member to follow the
waviness of the substrate. Assuming that the abrasive members can
follow 1/4 of its size, then all wavelengths smaller than the 1/4
will cause interference with the abrasive members and material
removal will ensue due to the interactions. Portions of the
abrasive members generate a hydrodynamic lift causing predictable
waviness following capability and stabilizing force countering the
cutting forces.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0025] FIG. 1 is the configuration of a single bit on a bit
patterned media for a hard disk drive.
[0026] FIG. 2 is a perspective view of an array of bits on a bit
patterned media.
[0027] FIG. 3A is a schematic illustration of a topography
following abrasive member in accordance with an embodiment of the
present disclosure.
[0028] FIG. 3B is a schematic illustration of a topography removing
abrasive member in accordance with an embodiment of the present
disclosure.
[0029] FIG. 3C is a schematic illustration of a cleaning abrasive
member in accordance with an embodiment of the present
disclosure.
[0030] FIG. 4 is a schematic illustration of an idealized bit for
bit patterned media in accordance with an embodiment of the present
disclosure.
[0031] FIG. 5 is an exploded view of an abrasive article with
gimbaled abrasive members in accordance with an embodiment of the
present disclosure.
[0032] FIG. 6 is a perspective view of a preload mechanism for the
abrasive article of FIG. 5.
[0033] FIG. 7 is a perspective view of a gimbal structure for the
abrasive article of FIG. 5.
[0034] FIG. 8 is a detailed perspective view of a gimbal structure
for the abrasive article of FIG. 5.
[0035] FIG. 9 is a perspective view of the abrasive members for the
abrasive article of FIG. 5.
[0036] FIG. 10 is another perspective view of the abrasive members
for the abrasive article of FIG. 5.
[0037] FIG. 11 is a perspective view of the abrasive article of
FIG. 5 polishing a substrate in accordance with an embodiment of
the present disclosure.
[0038] FIG. 12 is a perspective view of the fluid bearing surface
on the abrasive members of FIG. 5.
[0039] FIG. 13 is a detailed perspective view of the fluid bearing
surface on the abrasive members of FIG. 5.
[0040] FIG. 14 is a conceptual view of an abrasive member
interacting with a substrate in a topography following mode in
accordance with an embodiment of the present disclosure.
[0041] FIG. 15 is a conceptual view of an abrasive member
interacting with a substrate in a topography removing mode in
accordance with an embodiment of the present disclosure.
[0042] FIG. 16 is a conceptual drawing of a roughened abrasive
surface in accordance with an embodiment of the present
disclosure.
[0043] FIG. 17 is a side sectional view of an abrasive surface with
nano-scale diamonds attached to a polymeric backing in accordance
with an embodiment of the present disclosure.
[0044] FIGS. 18A and 18B are conceptual illustrations of a
structured abrasive surface in accordance with an embodiment of the
present disclosure.
[0045] FIG. 19 is a perspective view of a unitary abrasive article
in accordance with an embodiment of the present disclosure.
[0046] FIG. 20 is a perspective view of the gimbal assemblies of
the abrasive article of FIG. 19.
[0047] FIG. 21 is a perspective view of the fluid bearing surfaces
of the abrasive article of FIG. 19.
[0048] FIG. 22 is an exploded view of an abrasive article with an
integral hydrostatic bearing structure in accordance with an
embodiment of the present disclosure.
[0049] FIG. 23 is a top view of the abrasive article of FIG. 22
with the membrane removed.
[0050] FIG. 24 is a detailed top view of the abrasive article of
FIG. 22 with the membrane removed.
[0051] FIG. 25 illustrates the fluid bearing surfaces of the
abrasive article of FIG. 22.
[0052] FIG. 26 is a perspective view of an alternate abrasive
article with fluid bearing surfaces that comprise abrasive
composites in accordance with an embodiment of the present
disclosure.
[0053] FIGS. 27A and 27B are side schematic illustrations of
abrasive members with various abrasive composite structures at the
fluid bearing surfaces in accordance with an embodiment of the
present disclosure.
[0054] FIGS. 28 and 29 illustrate an alternate abrasive article
with grooved fluid bearing surface in accordance with an embodiment
of the present disclosure.
[0055] FIGS. 30A and 30B are schematic illustrations of double
sided substrate processing using an abrasive article in accordance
with an embodiment of the present disclosure.
[0056] FIG. 31 is a perspective view of a hydrostatic abrasive
member assembly in accordance with an embodiment of the present
disclosure.
[0057] FIG. 32 is a bottom perspective view of an abrasive member
in accordance with an embodiment of the present disclosure.
[0058] FIG. 33 is a bottom perspective view of the abrasive member
of FIG. 32.
[0059] FIG. 34 is a bottom perspective view of a gimbal mechanism
in accordance with an embodiment of the present disclosure.
[0060] FIG. 35 is an exploded view of the hydrostatic abrasive
member assembly of FIG. 31.
[0061] FIGS. 36 and 37 are perspective views of the hydrostatic
abrasive member assembly of FIG. 31.
[0062] FIG. 38 is a bottom perspective view of the hydrostatic
abrasive member assembly of FIG. 31.
[0063] FIG. 39A is a perspective view of an annular fluid bearing
surface in accordance with an embodiment of the present
disclosure.
[0064] FIG. 39B is a pressure profile graph of the fluid bearing of
FIG. 39A.
[0065] FIG. 40 is a perspective view of a hydrodynamic abrasive
member in accordance with an embodiment of the present
disclosure.
[0066] FIG. 41 is a pressure profile graph for the abrasive member
of FIG. 40.
[0067] FIG. 42 is an exploded view of a hydrodynamic abrasive
member assembly in accordance with an embodiment of the present
disclosure.
[0068] FIG. 43 is a perspective view of the hydrodynamic abrasive
member assembly of FIG. 42.
[0069] FIGS. 44A-44C are various views of a cylindrical array of
abrasive members in accordance with an embodiment of the present
disclosure.
[0070] FIG. 45 is an exploded view of the cylindrical array of
abrasive members of FIGS. 44A-44C.
[0071] FIG. 46 is a plurality of the cylindrical array abrasive
member assemblies of FIGS. 44A-44C in accordance with an embodiment
of the present disclosure.
[0072] FIG. 47A is a schematic illustration of an abrasive member
for topography following applications in accordance with an
embodiment of the present disclosure.
[0073] FIG. 47B is a pressure profile for the abrasive member of
FIG. 47A.
[0074] FIG. 48A is a schematic illustration of an abrasive member
for topography following applications in accordance with an
embodiment of the present disclosure.
[0075] FIG. 48B is a pressure profile for the abrasive member of
FIG. 48A.
[0076] FIG. 49A is a schematic illustration of an abrasive member
for topography removing applications in accordance with an
embodiment of the present disclosure.
[0077] FIG. 49B is a pressure profile for the abrasive member of
FIG. 49A.
[0078] FIGS. 50A and 50B illustrate a hydrodynamic abrasive member
for use in CMP in accordance with an embodiment of the present
disclosure.
[0079] FIG. 51 illustrates a hydrostatic abrasive member for use in
CMP in accordance with an embodiment of the present disclosure.
[0080] FIGS. 52A and 52B illustrate an alternate abrasive article
with curve fluid bearing surfaces in accordance with an embodiment
of the present disclosure.
[0081] FIGS. 53A and 53B illustrate a hydrostatic version of the
abrasive article of FIGS. 52A and 52B in accordance with an
embodiment of the present disclosure.
[0082] FIG. 54 is a schematic illustration an abrasive article with
a resilient polymeric support in accordance with an embodiment of
the present disclosure.
[0083] FIG. 55 is an exploded view of the abrasive article of FIG.
54.
[0084] FIG. 56 is a schematic illustration of the abrasive article
of FIG. 54 subject to hydrodynamic forces in accordance with an
embodiment of the present disclosure.
[0085] FIG. 57 is a perspective view of the abrasive member of FIG.
54.
[0086] FIG. 58 is a schematic illustration of an array of abrasive
members preconfigured with a pitch angle in accordance with an
embodiment of the present disclosure.
[0087] FIG. 59 is a schematic illustration of an array of abrasive
members with embedded sensors in accordance with an embodiment of
the present disclosure.
[0088] FIG. 60 is a schematic illustration of a method of making an
array of cantilevered abrasive members in accordance with an
embodiment of the present disclosure.
[0089] FIG. 61A is the array of cantilevered abrasive members of
FIG. 60 with the sacrificial layer removed in accordance with an
embodiment of the present disclosure.
[0090] FIG. 61B is the array of alternate cantilevered abrasive
members with the sacrificial layer removed in accordance with an
embodiment of the present disclosure.
[0091] FIG. 62 is a schematic illustration of the array of
cantilevered abrasive members of FIG. 60 subject to hydrodynamic
forces in accordance with an embodiment of the present
disclosure.
[0092] FIG. 63 is the array of alternate cantilevered abrasive
members in accordance with an embodiment of the present
disclosure.
[0093] FIG. 64 is an alternate abrasive article in accordance with
an embodiment of the present disclosure.
[0094] FIG. 65 is an abrasive article with a discontinuous
resilient polymeric support in accordance with an embodiment of the
present disclosure.
[0095] FIG. 66 is an abrasive article with a non-woven resilient
polymeric support in accordance with an embodiment of the present
disclosure.
[0096] FIG. 67 is an alternate abrasive article with a
discontinuous resilient polymeric support in accordance with an
embodiment of the present disclosure.
[0097] FIG. 68 is another alternate abrasive article with a
discontinuous resilient polymeric support in accordance with an
embodiment of the present disclosure.
[0098] FIG. 69 is an abrasive article with pressure ports in
accordance with an embodiment of the present disclosure.
[0099] FIG. 70 is an alternate abrasive article with pressure ports
in accordance with an embodiment of the present disclosure.
[0100] FIG. 71 is an alternate abrasive article with a structured
elastomeric support in accordance with an embodiment of the present
disclosure.
[0101] FIG. 72 is a schematic side sectional view of a fixture for
making an abrasive article in accordance with an embodiment of the
present invention.
[0102] FIG. 73 illustrates an abrasive slurry deposited on the
fixture of FIG. 72 in accordance with an embodiment of the present
invention.
[0103] FIG. 74 illustrates a substrate engaged with the abrasive
slurry FIG. 73 in accordance with an embodiment of the present
invention.
[0104] FIG. 75 illustrates the abrasive particles embedded in the
substrate and the spacer layer of FIG. 74 in accordance with an
embodiment of the present invention.
[0105] FIG. 76A is a schematic sectional view of an abrasive
article in accordance with an embodiment of the present
invention.
[0106] FIG. 76B is a schematic sectional view of an alternate
abrasive article without the adhesive layer in accordance with an
embodiment of the present invention.
[0107] FIG. 77 is a schematic side sectional view of an alternate
fixture with a structured surface for making an abrasive article in
accordance with an embodiment of the present invention.
[0108] FIG. 78 illustrates a substrate engaged with the abrasive
slurry of FIG. 77 in accordance with an embodiment of the present
invention.
[0109] FIG. 79 is a schematic sectional view of an abrasive article
with a structure surface in accordance with an embodiment of the
present invention.
[0110] FIG. 80 is a schematic sectional view of an abrasive article
with a convex surface in accordance with an embodiment of the
present invention.
[0111] FIG. 81 is a schematic sectional view of an abrasive article
with a concave surface in accordance with an embodiment of the
present invention.
[0112] FIG. 82 is a schematic sectional view of an abrasive article
with a cylindrical or spherical surface in accordance with an
embodiment of the present invention.
[0113] FIG. 83 is a schematic sectional view of an abrasive article
with abrasive particles sintered to a substrate in accordance with
an embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0114] FIG. 4 is a conceptual illustration of bit 20 showing an
ideal form for bit pattern bit. Top 22 of the bit 20 is flat
promoting constant head media spacing during read and write
operations. An abrasive article with an array of gimballed abrasive
members in accordance with an embodiment of the present disclosure
will permit the bit 20 of FIG. 4 to be manufactured in a production
setting.
[0115] FIG. 5 is an exploded view of an abrasive article 50 with an
array of gimballed abrasive members 52 in accordance with an
embodiment of the present disclosure. The abrasive article 50
includes gimbal structure 54, preload mechanism 56, and the
abrasive members 52. The abrasive article 50 can be manufactured in
circular and non-circular shapes. The abrasive members 52 can be
arranged in a regular pattern a random configuration, an off-set
pattern or a variety of other configurations.
[0116] FIG. 6 provides a detailed view of the preload mechanism 56
of FIG. 5. The preload mechanism 56 includes a series of outer
rings 58 each with a plurality of preload beams 60 configured to
apply a preload on each of the abrasive members 52 (see e.g., FIG.
11). The preload applied by the beams 60 is preferably concentrated
toward the center of the abrasive members 52 so as to not interfere
with pitch and roll motions during polishing. Alternatively, the
preload beams 60 are positioned to promote topography following or
topography removing behavior in the abrasive members 52.
[0117] FIGS. 7 and 8 illustrate the gimbal structure 54 of FIG. 5.
Framework 62 supports an array of gimbal assemblies 64. In the
illustrated embodiment, each gimbal assembly 64 includes one or
more arms 66, a cross member 68 and spring members 70 with
attachment features 72. The gimbal assemblies 64 allow each of the
abrasive members 52 to independently follow millimeter-scale and
micrometer-scale waviness of the substrate during polishing.
[0118] The gimbal assemblies 64 control the static attitude or
pitch of each abrasive member 52. The arms 66, cross members 68,
and spring member 70 permit the abrasive members 52 to move through
at least pitch and roll, while assuring adequate torque is applied
to the abrasive members 52. The members 66, 68, and 70 can be
configured to promote topography following or topography removing
behavior in the abrasive members 52. Various alternate gimbal
assemblies are disclosed in U.S. Pat. Nos. 5,774,305; 5,856,896;
6,069,771; 6,459,260; 6,493,192; 6,714,386; 6,744,602; 6,952,330;
7,057,856; and 7,203,033, which are hereby incorporated by
reference.
[0119] FIG. 9 illustrates the array of abrasive members 52 prior to
assembly onto the gimbal assemblies 64. The abrasive members 52 can
be made from a variety of materials, such as for example, metal,
ceramic, polymers, or composites thereof. The abrasive members 52
are preferably arranged in a random or off-set pattern to impart a
uniform polishing pattern onto the substrate.
[0120] The abrasive members 52 can be fabricated individually as
discrete structures or ganged together such as illustrated in FIG.
10. For example, the abrasive members 52 can be fabricated using a
mold injection process. In the embodiment of FIG. 10, spacing
structures 80 are molded between the abrasive members 52. The
spacing structures 80 position the abrasive members 52 during
assembly with the gimbal structure 54. The spacing structures 80
can be maintained or removed after assembly is completed.
[0121] FIG. 11 illustrates the assembled abrasive article 50
positioned to lap substrate 106. The substrate 106 can be a wafer,
a wafer-scale semiconductor, magnetic media for hard disk drives,
bit patterned or discrete track media, a convention disk for a hard
disk drive, or any other substrate. The preload beams 60 on the
preload mechanism 56 apply preload 82 to the abrasive members 52.
In the illustrated embodiment, the preload beams 60 apply the
preload 82 directly to the respective attachment features 72 on the
gimbal assemblies 64.
[0122] As illustrated in FIG. 11, air shearing forces between the
rotating substrate 106 and the abrasive article 50 entrain an air
cushion that applies fluid dynamic lift 108 (referred to
hereinafter as "lift" or "dynamic lift") on fluid bearing surfaces
90 on the abrasive member 52. The lift 108 can be located at the
leading edge 94 and/or the trailing edge 98, although in the
illustrated embodiment the lift 108 is concentrated at the leading
edge 94 to each abrasive member 52. In an alternate embodiment, the
substrate 106 is stationary and the abrasive article 50 rotates.
Although the most common fluid used to generate the fluid dynamic
lift 108 is air, it is also possible that the lift 108 is generated
by a liquid, such as a lubricant. As used herein, the phrase "fluid
bearing" refers generically to a fluid (i.e., liquid or gas)
present at an interface between an abrasive member and a substrate
that applies a lift force on the abrasive member. Fluid bearings
can be generated hydrostatically, hydrodynamically, or a
combination thereof.
[0123] The dynamic lift 108 causes the abrasive members 52 to
assume an attitude or pitch during the relative rotation of a
substrate 106. The gimbal assemblies 64 allow the abrasive members
52 to follow the micrometer-scale and/or millimeter-scale
wavelengths of waviness ("waviness") on the substrate 106, while
removing nanometer-scale and/or micrometer-scale height variations.
Typically, the leading edges 94 of the abrasive members 52 generate
a hydrostatic lift countering the forces generated at the
interference 104 between the trailing edge 98 and the substrate
106.
[0124] Since each of the abrasive members 52 can independently
adjust to the waviness of the substrate 106 and maintain a constant
cutting force/pressure, the amount of material removed across the
substrate 106 is substantially uniform. The present embodiment is
particularly well suited to remove a uniform amount of an oxide
layer on a semiconductor. The ability of the abrasive members 52 to
follow the waviness enables uniform material removal at a level not
attainable by conventional CMP processes. In the case of an air
bearing, it is desirable to have a boundary layer of lubricant
between the abrasive members 52 and the substrate 106.
[0125] The preload force 82 is preferably a fraction of the amount
used during conventional lapping. The present system and method
typically reduces the preload force 82 by an order of magnitude or
more. In one embodiment, the preload 82 is in the range of about
0.1 grams/millimeter.sup.2 to about 10 grams/millimeter.sup.2 of
surface being lapped, compared to about 1 kg/millimeter.sup.2 for
conventional lapping using an oil flooded lapping media.
[0126] FIGS. 12 and 13 illustrate one possible geometry of the
fluid bearing surface 90 of the abrasive members 52. The fluid
bearing surfaces 90 include various fluid bearing features 92 that
promote the creation of a fluid bearing with the substrate 106. In
the illustrated embodiment, leading edge 94 of the fluid bearing
surface 90 includes a pair of pressure pads 96A, 96B (collectively
"96") separated by gap 97. The trailing edge 98 includes pressure
pad 100. A discussion of the lift created by rotating rigid disks
is provided in U.S. Pat. No. 7,218,478, which is hereby
incorporated by reference.
[0127] In one embodiment, the pads 96, 100 can be formed with a
crown and cross-curve. The leading edges 94 of the pressure pads
96A, 96B are optionally tapered or stepped to help initiate
aerodynamic lift (see, e.g., FIG. 47A). Negative suction force
areas can be fabricated in the fluid bearing surface 90 to
stabilize the abrasive members 52 during the flying. The fluid
bearing surface 90 can also include trenches to enable higher
pressurization during the flying.
[0128] FIG. 14 is a schematic illustration of the engagement
between the abrasive members 52 with the substrate 106 in the
topography following mode in accordance with an embodiment of the
present disclosure. The peaks 83 and valleys 81 are intended to
illustrate nanometer-scale and/or micrometer-scale height
variations, although their size relative to the abrasive member 52
is greatly exaggerated. The micrometer-scale and/or
millimeter-scale waviness is not illustrated for the sake of
simplicity.
[0129] The valleys 81 between the peaks 83 entrain sufficient air
to permit the abrasive members 52 to "fly" over the substrate 106,
even while the trailing edge 98 is in contact with general texture
level 105 of the substrate 106.
[0130] The leading edges 94 of the abrasive members 52 are raised
above the substrate 106 due to lift 108 acting on fluid bearing
surface 86. Engagement of the abrasive members 52 with the
substrate 106 is defined by pitch angle 79A and roll angle 79B of
the abrasive members 52, and clearance 101 with the substrate
106.
[0131] The gimbal assembly 56 (see FIG. 11) provides the abrasive
members 52 with roll and pitch stiffness that balance by the roll
and pitch moments 74 generated by the lift force 108. The
frictional forces 76 generated during lapping cause a tipping
moment 78 opposite to the moment 74, causing the leading edges 94
of the abrasive members 52 to move toward the substrate 106.
[0132] In some embodiments, the lift 108 may be purely aerodynamic,
creating a stable, uniform fluid bearing. In some embodiments, the
lift 108 may be caused, in part, by lubricant 84 on the substrate
106. Abrasive members 52 in full contact with the substrate 106
experience a large amount of forces and vibrations during the
polishing process. The cutting forces and moments tend to cause
vibrations and bouncing. The preload and gimbal stiffness need to
balance the cutting forces. A lubricant 84 is desirable to keep the
frictional forces and cutting forces low enough to prevent
chattering and the like.
[0133] A boundary layer lubrication regime of a thin film a few
atoms thick adhered to the surface of the substrate 106 can be
used. Alternatively, the lapping can occur in a fully flood
environment. Consequently, the fluid dynamic lift 108 according to
the present disclosure may be aerodynamic and/or hydrodynamic in
nature. Discussion of the lift created by rotating rigid disks is
provided in U.S. Pat. Nos. 7,193,805 and 7,218,478, which are
hereby incorporated by reference.
[0134] The moment 74 generated by the lift 108 is preferably
greater than the moment 78 generated by frictional forces 76 at the
interface of the pad 100 with the surface of the substrate 106. The
trailing edge 98 is located below the general texture level 105 of
the substrate 106 during interference lapping. In operation, the
interference between the abrasive members 52 and the substrate 106
is essentially continuous. As used herein, "interference lapping"
refers to a clearance with an abrasive member that is less than
about half a peak-to-valley roughness of a substrate.
[0135] In one embodiment, trailing edge 98 is located at about
mid-plane 103 of the peak-to-valley roughness 109. Clearance 101
between the mid-plane 103 and the trailing edge 98 is preferably
less than half the peak-to-valley roughness 109 of the substrate
106. For example, if the peak-to-valley roughness 109 is about 50
nanometers, the clearance 101 of the abrasive members 52 is less
than about 25 nanometers. As used herein, "clearance" refers to a
distance between an abrasive member and a mid-plane of a
peak-to-valley roughness of a substrate.
[0136] In one embodiment, actuators 120 are provided to thermally
expand portions of the abrasive member 52 to perform contact
detection with the substrate 106. Contact detection refers to
bringing an actuated portion of a fluid bearing surface into
contact with a substrate, and then decreasing the actuation to
establish a desired level of interference with nanometer-scale
and/or micrometer-scale height variations on a surface of a
substrate. Contact detection between the abrasive member and the
substrate can be performed with a variety of methods including,
position signal disturbance stemming from fluid bearing modulation,
amplitude ratio and harmonic ratio calculations based on Wallace
equations, and piezoelectric based acoustic emission sensors.
Various actuators and contact detection systems are disclosed in
commonly assigned U.S. patent application Ser. No. 12/424,441
(Boutaghou, et al.), filed Apr. 15, 2009, which is hereby
incorporated by reference.
[0137] FIG. 15 is a schematic illustration of the engagement
between the abrasive members 52 with the substrate 106 in the
topography removing mode in accordance with an embodiment of the
present disclosure. The nanometer-scale and/or micrometer-scale
height variations is not illustrated for the sake of
simplicity.
[0138] The abrasive members 52 have a length 52A measured relative
to the motion 107 with substrate 106 that is greater than an
approximate wavelength 85 of the peaks 83. The spaces 81 between
the peaks 83 entrain sufficient air to permit the abrasive members
52 to "fly" over the substrate 106 at fly height 89 so the trailing
edge 98, and in some embodiments the leading edge 94, impacts the
peaks 83 or debris 87 located above the fly height 89. The
lubricant 84 can be a mono-layer or a flooded environment.
[0139] As with the topography following embodiment, the gimbal
assembly 56 (see FIG. 11) and the lift force 108 provide the
abrasive members 52 with sufficient pitch and roll stiffness to
counteract the tipping moment 78 caused by collisions with the
peaks 83 or surface debris 87. The interference between the
abrasive members 52 and the substrate 106 may be continuous or
intermittent. In the illustrated embodiment, the peaks 83A have
been removed by the abrasive member 52.
[0140] The abrasive members 52 may include abrasive features at the
leading edges 94 and/or trailing edges 98, abrasive particles are
interposed between the abrasive members 52 and the substrate 106,
or a combination thereof.
[0141] As illustrated in FIG. 13, the pads 96, 100 may include
abrasive features 110 that cause interference with the substrate
106 in order to remove material at the desired rate. In one
embodiment, the abrasive features 110 are texture or patterns on
the pads 96, 100, such as illustrated in FIG. 16. The abrasive
features 110 are preferably in the nanometer range to allow for
fluid bearings to be formed. In one embodiment, the abrasive
features 110 have a peak-to-peak roughness of about 20 nanometers
to about 100 nanometers. The texture 110 can be formed on the pads
96, 100 or transferred from the mold used to manufacture the
abrasive members 52.
[0142] The abrasive features 110 are preferably covered with a hard
coat, such as for example, diamond-like-carbon or other hard
overcoats depending on the application. The desired peak-to-peak
roughness after application of the hard coat varies from about 10
nanometers to about 30 nanometers to provide effective cutting. The
peak-to-valley roughness is preferably about 25 nanometers to about
50 nanometers.
[0143] Abrasive members 52 constructed from polymers are compatible
with diamond-like-carbons. Diamond-like-carbon ("DLC") thickness
varies from about 50 nanometers to about 200 nanometers to provide
a hard surface capable of burnishing the substrate. It is highly
desirable to generate DLC hardness in the range of 70-90 GPa
(Giga-Pascals) to further improve the burnishing process.
[0144] In one embodiment the DLC is applied by chemical vapor
deposition. As used herein, the term "chemically vapor deposited"
and "CVD" refer to materials deposited by vacuum deposition
processes, including, but not limited to, thermally activated
deposition from reactive gaseous precursor materials, as well as
plasma, microwave, DC, or RF plasma arc-jet deposition from gaseous
precursor materials. Various methods of applying a hard coat to a
substrate are disclosed in U.S. Pat. Nos. 6,821,189 (Coad et al.);
6,872,127 (Lin et al.); 7,367,875 (Slutz et al.); and 7,189,333
(Henderson), which are hereby incorporated by reference.
[0145] In another embodiment, nano-diamonds (i.e., with a major
diameter less than 1 micrometer) are attached to the pads 96, 100
via existing processes (CVD encapsulation, brazing, adhesives,
embedding, etc.). Methods of uniformly dispersing nanometer size
abrasive grains are disclosed in U.S. Pat. Pub. No. 2007/0107317
(Takahagi et al.), which is hereby incorporated by reference.
Various geometrical features and arrangement of abrasive particles
on abrasive articles are disclosed in U.S. Pat. Nos. 4,821,461
(Holmstrand), 3,921,342 (Day), and 3,683,562 (Day), and U.S. Pat.
Pub. No. 2004/0072510 (Kinoshita et al), which are hereby
incorporated by reference. A two-step adhesion process for
attaching diamonds to the pads 96, 100 is disclosed in U.S. Pat.
Nos. 7,198,553 and 6,123,612, which are hereby incorporated by
reference.
[0146] FIG. 17 illustrates abrasive particles 340, such as
nano-scale diamonds, attached to a polyamide backing layer 342
located on the pads 96, 100 that act as the abrasive features 110
in accordance with an embodiment of the present disclosure. In
another embodiment, a slurry of nano-scale diamonds and adhesive
are spin coated, sprayed coated, or otherwise deposited directly
onto the pads 96, 100. A method and system for fabricating the
nano-scale diamond abrasive is disclosed in U.S. Provisional Patent
Application No. 61/187,658 entitled Abrasive Member with Uniform
Height Abrasive Particles, filed on Jun. 16, 2009, which is hereby
incorporated by reference.
[0147] FIGS. 18A and 18B illustrate perspective and side views of
an engineered surface 130 imparted to the pads 96, 100 that act as
abrasive features 110 in accordance with an embodiment of the
present disclosure. The engineered surface 130 is preferably
nanometer-scale or micrometer-scale. The depth of the grooves 132
with respect to the peaks 134 must be controlled to within less
than about 100 nanometers to promote the formation of a fluid
bearing with the substrate 106. The peaks 134 can be textured to
promote interference and polishing while the grooves 132 contribute
to the fluid bearing lift. If the grooves 132 are too deep
(microns), the fluid bearing generation will not be possible and
the entire system will be in contact with uncontrolled gas film
thickness. A hard coat, such as DLC, is preferably applied to the
engineered surface 130.
[0148] The engineered surface 130 allows for precise stress
management between the polished substrate and the nano-features.
Such precise stress management yields a predictable surface finish
and the gap allows for residual material to be removed. Various
engineered surfaces 130 are disclosed in U.S. Pat. Nos. 6,194,317
(Kaisaki et al); 6,612,917 (Bruxvoort); 7,160,178 (Gagliardi et
al.); 7,404,756 (Ouderkirk et al.); and U.S. Publication No.
2008/0053000 (Palmgren et al.), which are hereby incorporated by
reference.
[0149] In another embodiment, a slurry of abrasive particles is
located at the interface 104 (see, e.g., FIGS. 11, 50A, 50B, and
51), such as for example, in a standard chemical-mechanical
polishing process. The abrasive members 52 with or without abrasive
features can be used with the abrasive slurry. Various methods of
chemical-mechanical processing are disclosed in U.S. Pat. No.
6,811,467 (Beresford et al.) and U.S. Pat. Publication Nos.
2004/0072510 (Kinoshita et al.) and 2008/0004743 (Goers et al.),
which are hereby incorporated by reference.
[0150] As noted above, the abrasive features 110 generally have a
hardness greater than the substrate 106, but this property is not
required since any two solid materials that repeatedly rub against
each other will tend to wear each other away. The abrasive features
can be any portion of an abrasive member 52 that forms an interface
with a substrate 106 or a contaminant 87 on a substrate 106,
independent of the relative hardness of the respective materials
and the resulting cut rate.
[0151] In some embodiments, the abrasive members 52 are
manufactured with one or more sensors to monitor the polishing
process, such as for example, acoustic emission or friction sensor.
The present interference lapping preferably results in a surface
finish or roughness (Ra) of less than about 20 Angstrom, and more
preferably less than about 0.2 Angstrom.
[0152] In applications using full oil lubrication an interface can
be designed to form an oil hydrodynamic film. Typically, the oil
film thickness is substantially thicker than an air film thickness
due to the viscosity of the lubricant. The height or roughness of
the abrasive features on the pads 96, 100 need to be higher than
the film thickness to guarantee interference with the substrate
106. Various hydrodynamic features are disclosed in U.S. Pat. No.
6,157,515 (Boutaghou), which is hereby incorporated by reference.
Oil hydrodynamic formation requires larger pressures and preloads
82 to be applied to overcome the lift 108 generated by the oil
viscosity. Pressure relief features are preferably formed in the
pads 96, 100.
[0153] In yet another embodiment, a hydrodynamic bearing is not
(fully) formed between the abrasive members 52 and the substrate
106. The abrasive members 52 are in full contact with the substrate
106. The gimballing structure 54 allows the abrasive members 52 to
follow the waviness of the substrate 106 during polishing, but not
the nanometer-scale or micrometer-scale height variations. In the
case of a full contacting abrasive members 52, nanometer-scale or
micrometer-scale height variations is defined with respect to the
length 52A of the abrasive members 52 (see FIG. 11). Since no gas
bearing features are fabricated on this embodiment, no hydrostatic
bearing is formed and the abrasive members 52 will not be able to
follow the nanometer-scale or micrometer-scale height variations,
and these features are removed. The following characteristic of
this structure is controlled by the friction forces and the cutting
forces emanating from the interface. The friction forces can be
minimized by fabricating contacting pads (not shown) to lower the
contact area while providing a low friction interface especially in
the presence of a lubricant.
[0154] FIGS. 19-21 illustrate a fully integrated gimbaled abrasive
article 150 in accordance with an embodiment of the present
disclosure. Preload structure 152 includes circumferential ribs 154
and radial ribs 156 to impart a desired preload onto abrasive
members 158. Gimbal assemblies 160 include a collection of flexible
ribs 162, 164 connecting the preload structure 152 to the abrasive
members 158. The abrasive article 150 is preferably fabricated as a
single unit, such as by injection molding. The fabrication process
can include multiple mold injection steps to meet the system
requirements.
[0155] Instead of applying the preload directly to the abrasive
members 158, the preload is applied by the preload structure 152
through the gimbal assemblies 160. This configuration is ideal for
low preload applications. Care must be taken not to cause excessive
deformation of the gimbal assemblies 160 during preload
applications. FIG. 21 illustrates fluid bearing features 164
fabricated on the abrasive members 158, such as discussed above.
The fluid bearing surfaces 164 can include any of the abrasive
features discussed herein.
[0156] FIGS. 22-25 illustrate an alternate abrasive article 200
with an array of abrasive members 212 having an integrated
hydrostatic bearing structure 202 in accordance with an embodiment
of the present disclosure. Membrane 216 seals gas conduits 204 in
the bearing structure 202.
[0157] FIGS. 23 and 24 illustrate the integrated hydrostatic
bearing structure 202 without sealing membrane 216 shown. Gas
conduits 204 are fabricated in gimbal assembly 206 and along
preload ribs 208. Holes 210 extending through the abrasive members
212 to fluid bearing surfaces 214 (see FIG. 25). The gas conduits
204 are externally pressurized to provide a hydrostatic bearing on
each abrasive member 212. The fluid bearing surfaces 214 can
include any of the abrasive features discussed herein.
[0158] As best illustrated in FIG. 25, fluid bearing surfaces 214
of the abrasive members 212 are fabricated with button pressure
ports 218 to form a hydrostatic bearing on each abrasive member
212. The hydrostatic bearing generated at each fluid bearing
surface 214 is designed to counter the cutting forces during the
polishing process. For illustrative purposes, a button bearing
design is shown. See also, FIG. 39A. Additional configurations can
easily be adapted such as multiple ports onto each abrasive member
212 to enable the abrasive member to form a pitch and roll
moment.
[0159] In one preferred embodiment, a pressure port 218 is located
near the leading edges 220 to increase the pitch of the abrasive
members 212 for topography following applications. In another
embodiment, pressure ports 218 are located at both the leading
edges 220 and trailing edges 222 of the abrasive members 212 to
configure the pitch for topography removing applications.
[0160] The abrasive article 200 is particularly useful when the
relative speed between the substrate and the abrasive members 212
is not high enough to form a fluid bearing or hydrodynamic film.
The external pressure applied to the abrasive members 212 forms a
hydrostatic film capable of following the substrate waviness and
countering the cutting forces emanating from the interference
between the peaks of the abrasive member 200 and the substrate.
[0161] The hydrostatic fluid bearing may be used in combination
with a hydrodynamic fluid bearing. In one embodiment, the
hydrostatic fluid bearing is used during start-up rotation and/or
ramp-down of the abrasive article 200 relative to a substrate.
[0162] In another embodiment, the hydrostatic fluid bearing is used
simultaneously with a hydrodynamic fluid bearing. The pressure
ports 218 located near the inner edge 224 and outer edge 226 of the
abrasive article 200 can be pressurized to offset loss of pressure
at the fluid bearing in those locations. Consequently, the pressure
of the fluid bearing surfaces 214 across width 228 of the abrasive
article 200 can be precisely controlled to reduce run out.
[0163] FIG. 26 illustrates an alternate abrasive article 300 in
which the fluid bearing features 302A, 302B, 302C ("302") comprise
abrasive particles 304 dispersed within a binder 306 in accordance
with an embodiment of the present disclosure. The abrasive
composites 312 act as the abrasive features in the illustrated
embodiment.
[0164] In the illustrated embodiment, the fluid bearing features
302 are coextensive with abrasive members 308. The abrasive members
308 are also preferably coextensive with the backing layer 310. The
term "coextensive" refers to attachment, bonding, or permeation of
the materials comprising the various components 302, 308, and 310.
Additional details concerning the general characteristics of the
abrasive composites and methods of manufacture can be found in U.S.
Pat. Nos. 5,152,917 (Pieper et al.); 5,958,794 (Bruxvoort),
6,121,143 (Messner et al.) and U.S. Patent Publication Nos.
2005/0032462 (Gagliardi et al.) and 2007/0093181 (Lugg et al.), all
of which are hereby incorporated by reference.
[0165] The abrasive particles 304 are optionally located only at
the fluid bearing feature 302A at the trailing edge 316, but can
optionally be provided at the fluid bearing features 302B, 302C at
the leading edge 318 of the abrasive members 308. The abrasive
particles 304 may be non-homogeneously dispersed in a binder 306,
but it is generally preferred that the abrasive particles 304 are
homogeneously dispersed in the binder.
[0166] The abrasive particles 304 may be associated with at least
one fluorochemical agent. The fluorochemical agent may be applied
to the surface of the abrasive particles 304 by mixing the
particles in a fluid containing one or more fluorochemical agents,
or by spraying the one or more fluorochemical agents onto the
particles. The fluorochemical agents associated with abrasive
particles may be reactive or unreactive.
[0167] Fine abrasive particles 304 are preferred for the
construction of the fluid bearing features 302. The size of the
abrasive particles are preferably less than about 1 micrometer and
typically between about 10 nanometers to about 200 nanometers. The
size of the abrasive particle 304 is typically specified to be the
longest dimension. In almost all cases there will be a range or
distribution of particle sizes. In some instances, it is preferred
that the particle size distribution be tightly controlled such that
the resulting fixed abrasive article provides a consistent surface
finish on the wafer. The abrasive particles may also be present in
the form of an abrasive agglomerate. The abrasive particles in each
agglomeration may be held together by an agglomerate binder.
Alternatively, the abrasive particles may bond together by
inter-particle attraction forces. Examples of suitable abrasive
particles 304 include fused aluminum oxide, heat treated aluminum
oxide, white fused aluminum oxide, porous aluminas, transition
aluminas, zirconia, tin oxide, ceria, fused alumina zirconia, or
alumina-based sol gel derived abrasive particles.
[0168] The backing layer 310 preferably includes a plurality of
areas of weakness 314 that permit the abrasive members 308 to
gimbal (i.e., pitch, roll, and yaw) with respect to the backing
layer 310. The areas of weakness 314 can be perforations, slits,
grooves, and/or slots formed in the backing layer 310. The areas of
weakness 314 also permit the passage of the liquid medium before,
during, or after use.
[0169] The backing layer 310 is preferably uniform in thickness. A
variety of backing materials are suitable for this purpose,
including both flexible backings and backings that are more rigid.
Examples of typical flexible abrasive backings include polymeric
film, primed polymeric film, metal foil, cloth, paper, vulcanized
fiber, nonwovens and treated versions thereof and combinations
thereof. One preferred type of backing is a polymeric film.
Examples of such films include polyester films, polyester and
co-polyester films, microvoided polyester films, polyimide films,
polyamide films, polyvinyl alcohol films, polypropylene film,
polyethylene film, and the like. The thickness of the polymeric
film backing generally ranges between about 20 to about 1000
micrometers, preferably between about 50 to about 500
micrometers.
[0170] A preferred method for making the abrasive composites 312
having precisely shaped abrasive composites 312 is described in
U.S. Pat. No. 5,152,917 (Pieper et al) and U.S. Pat. No. 5,435,816
(Spurgeon et al.), both incorporated herein by reference. Other
descriptions of suitable methods are reported in U.S. Pat. Nos.
5,437,754; 5,454,844 (Hibbard et al.); U.S. Pat. No. 5,437,754
(Calhoun); and U.S. Pat. No. 5,304,223 (Pieper et al.), all
incorporated herein by reference.
[0171] Production tools for making the abrasive members 308 may be
in the form of a belt, a sheet, a continuous sheet or web, a
coating roll such as a rotogravure roll, a sleeve mounted on a
coating roll, or die. The production tool may be made of metal,
(e.g., nickel), metal alloys, or plastic. The production tool is
fabricated by conventional techniques, including photolithography,
knurling, engraving, hobbing, electroforming, or diamond turning.
For example, a copper tool may be diamond turned and then a nickel
metal tool may be electroplated off of the copper tool.
Preparations of production tools are reported in U.S. Pat. No.
5,152,917 (Pieper et al.); U.S. Pat. No. 5,489,235 (Gagliardi et
al.); U.S. Pat. No. 5,454,844 (Hibbard et al.); U.S. Pat. No.
5,435,816 (Spurgeon et al.); PCT WO 95/07797 (Hoopman et al.); and
PCT WO 95/22436 (Hoopman et al.), all incorporated herein by
reference. In an alternate embodiment, the abrasive members 308 are
used in combination with the gimbal mechanism such as disclosed in
FIG. 5.
[0172] FIG. 27A is a side view of the abrasive members 308 of FIG.
26 in which the abrasive particles 304 do not extend above surface
320 of the fluid bearing features 302. FIG. 27B illustrates an
alternate embodiment in which some of the abrasive particles 304
extend above the surface 320 of the fluid bearing features 302. A
hard coat, such as diamond-like-carbon is optionally applied to the
protruding abrasive particles 304 of FIG. 27B. In both embodiments,
the backing layer 310 includes a plurality of areas of weakness
314.
[0173] Due to the rigidity of the abrasive members 308, a preload
322 can be applied directly to rear surfaces 324 of the backing
layer 310 opposite the abrasive members 308, such as for example,
the preload mechanism 56 illustrated in FIG. 5. The areas of
weakness 314 permit the abrasive members 308 to gimbal relative to
the backing layer 310. In another embodiment, the abrasive members
308 are combined with the gimbal structure 54 and the preload
mechanism 56 of FIG. 5 so that the backing layer 310 does not
provide the gimbal function.
[0174] In one embodiment, one or more protrusions 326 are
optionally located near leading edge 318 to prevent the fluid
bearing surfaces 302B, 302C from impacting the substrate. The
protrusions 326 can be created from a variety of materials, such as
for example, diamond-like-carbon.
[0175] FIGS. 28 and 29 are perspective views of an alternate
abrasive article 350 in which the fluid bearing features 352A,
352B, 352C ("352") include a plurality of grooves 354 oriented
generally parallel to the direction of travel 356 of the abrasive
members 358 relative to the substrate. The grooves 354 release
fluid located at the interface between the fluid bearing features
352, reducing the lift on the abrasive members 358.
[0176] The grooves 354 reduce the fly height of the abrasive
members 358. In applications where the fluid is a liquid, the
grooves 354 permit a low fly height and/or a low preload. The
grooved abrasive members 358 are particularly well suited to fully
flooded applications.
[0177] The depth of the grooves 354 must be sufficient to reduce
hydrodynamic pressure between the abrasive members 358 and the
substrate. In most cases, the grooves 354 have a depth of greater
than about 20 micrometers.
[0178] By reducing the hydrodynamic film, it is possible to use
lubricants with a higher viscosity and/or maintain a low preload on
each abrasive member 358, while still achieving interference with
the substrate. In some applications, the grooves 354 allow a
reduction in the hydrodynamic film while allowing the use of
nano-scale diamonds attached to the fluid bearing features 352.
[0179] In one embodiment, nano-scale diamonds attached to a
polymeric film, such as illustrated in FIG. 14B, are attached to
the fluid bearing features 352. The grooves 354 permit the load on
the abrasive members 358 to be sufficiently low so as to not
substantially deform the polymeric film 342. In another embodiment,
the fluid bearing features 352 are grooved abrasive composites.
[0180] Designing length 360 of the abrasive members 358 to be
greater than the target wavelength permits the abrasive members 358
to interact with the peaks of the waviness for topography removing
applications. Alternatively, reducing the length 360 will cause the
abrasive members 358 to follow the contour of the waviness and
provide more uniform material removal for topography following
applications.
[0181] The grooves 354 also permit the fly height to be engineered
for particular applications. Assuming all other processing
variables are held constant, increasing the size or number of
grooves 354 reduces fly height, and hence, increases interference
between the substrate.
[0182] The fly height of the abrasive members 358 above the
substrate can also be engineered, such as by changing the size and
shape of the fluid bearing features 352. Some variables critical to
fly height include the size and shape of gap 362 between the fluid
bearing features 352A, 352B, the length 364 and width 366 of the
fluid bearing features 352A, 352B, and the length 368 and width 370
of the fluid bearing features 352C.
[0183] In one embodiment, a series of different abrasive articles
350 are designed with different sized abrasive members 358 and/or
fluid bearing features 352 used to polish a substrate. For example,
the abrasive article 350 may initially target peaks only, followed
by an abrasive article 350 designed to follow the contour.
[0184] FIGS. 30A and 30B are schematic illustrations of a pair of
abrasive articles 400, 402 simultaneously lapping opposite surfaces
404, 406 of substrate 408 in accordance with an embodiment of the
present disclosure. The fixing process used to mount substrates
(e.g., wax mounting, vacuum chucking, etc.) causes topology from
the backside of the substrate to be transmitted to the front side
and causes nanotopography. While free mounting of substrates does
not transmit nanotopography, substrate flatness is not guaranteed.
The best flatness and nanotopography is obtained using double-sided
polishing. Since the substrate is polished in a free state,
nanotopography is minimized and good flatness is achieved. The
substrate 408 is preferably gripped by its edges 410 by mechanism
411 and rotated about axis 412, such as disclosed in U.S. Pat. Nos.
7,185,384 (Sun et al.); 6,334,229 (Moinpour et al.); and 6,092,253
(Moinpour et al.), all of which are incorporated by reference.
[0185] In the embodiment of FIG. 30A, leading edges 414 of the
individual abrasive members 416 are illustrated below the axis 412,
and trailing edges 418 above the axis 412. The fluid bearings
generated by the opposing abrasive articles 400, 402 generate
opposing forces 420, 422 that permit simultaneous lapping of both
surfaces 404, 406 with minimum deformation of the substrate 408.
Simultaneously lapping both surfaces 404, 406 of a substrate 406
held between opposing fluid bearings provides superior results over
current lapping techniques. In another embodiment, the abrasive
articles 400, 402 are rotated relative to the substrate 408.
[0186] In the embodiment of FIG. 30B, leading edges 414 of the
abrasive articles 402 are illustrated above the axis 412 permitting
the abrasive articles to be counter rotated. Counter rotating the
abrasive articles 400, 402 may permit the substrate 408 to be free
floating. In this embodiment, the mechanism 411 acts as a barrier
to the edges 410 to maintain the substrate 408 generally concentric
with the abrasive articles 400, 402, but does not otherwise
restrain the substrate 408.
[0187] FIG. 31 is a bottom perspective view of hydrostatic abrasive
article 550 with an array of hydrostatic abrasive members 552 in
accordance with an embodiment of the present disclosure. External
pressure source 554 is applied to each of the abrasive members 552
to control clearance 556 with the substrate 558. Preload 612 biases
the abrasive members 552 toward the substrate 558. Polishing is
accomplished by relative motion between the hydrostatic abrasive
article 550 and the substrate 558, such as linear, rotational,
orbital, ultrasonic, and the like. In one embodiment, that relative
motion is accomplished with an ultrasonic actuator such as
disclosed in commonly assigned U.S. Provisional Patent Application
Ser. No. 61/232,525, entitled Method and Apparatus for Ultrasonic
Polishing, filed Aug. 10, 2009, which is hereby incorporated by
reference.
[0188] FIG. 32 illustrates an embodiment of an individual abrasive
member 552 with both hydrostatic and hydrodynamic fluid bearing
capabilities designed into bottom surface 560 in accordance with an
embodiment of the present disclosure. The bottom surface 560 of the
abrasive member 552 includes both air bearing features 564 and
pressure ports 566.
[0189] Leading edge 562 of the abrasive member 552 includes a pair
of fluid bearing pads 564A, 564B (collectively "564") each with at
least one associated pressure port 566A, 566B. Trailing edge 570
also includes a pair of fluid bearing pads 572A, 572B (collectively
"572") and associated pressure ports 566C, 566D. The fluid bearing
surfaces 574 on the trailing edge 570 enhance the stability of the
abrasive member 552 at the interface with a surface defect.
[0190] The fluid bearing pads 572 on the trailing edge 570 have
less surface area than the fluid bearing pads 564 at the leading
edge 562. Consequently, the leading edge 562 typically flies higher
than the trailing edge 570, which sets the pitch of the abrasive
member 552 relative to the substrate 558 (see, e.g., FIG. 14). The
trailing edge 570 is typically designed to be in interference with
the surface defects on the substrate 558. Both leading edge and
trailing edge structures 564, 572 contribute to holding the
abrasive member 552 at a desired clearance 556 from the substrate
558 and controlling the amount of interference with surface
defects. It is also possible to control the pressure applied to the
pressure ports 566A, 566B at the leading edge 562 to increase or
decrease the pitch of the abrasive member 552.
[0191] The hybrid abrasive member 552 can operate with a
hydrostatic fluid bearing and/or a hydrodynamic fluid bearing. The
hydrostatic pressure ports 566 apply lift to the abrasive member
552 prior to movement of the substrate 558. The lift permits
clearance 556 to be set before the substrate 558 starts to move.
Consequently, preload 612 does not damage the substrate 558 during
start-up. Once the substrate 558 reaches its safe speed and the
hydrodynamic fluid bearing is fully formed, the hydrostatic fluid
bearing can be reduced or terminated. The procedure can also be
reversed at the end of the polishing process.
[0192] In another embodiment, both the hydrostatic and hydrodynamic
fluid bearings are maintained during at least a portion of the
polishing process. The pressure ports 566 can be used to supplement
the hydrodynamic bearing during the polishing process. For example,
the pressure ports 566 may be activated to add stiffness to the
fluid bearing during initial passes over the substrate 558. The
hydrostatic portion of the fluid bearing is then reduced or
terminated part way through the polishing process. The pressure
ports 566 can also be used to adjust or fine tune the attitude
and/or clearance of the abrasive members 552 relative to the
substrate 558.
[0193] As best illustrated in FIG. 35, the abrasive members 552 are
preferably formed in an array with a spacing structure 576. In one
embodiment, the abrasive members 552 and spacing structure 576 are
injection molded from a polymeric material to form an integral
structure. Alternatively, discrete abrasive members 552 can be
bonded or attached to the gimbal mechanisms 590. The bottom surface
560 optionally includes intermediate pad 574 to increase the
cutting surfaces to remove surface defects. To enhance the cutting
action abrasive features are optionally fabricated onto the pads
564, 572, 574, as discussed above.
[0194] FIG. 33 illustrates a top view of the abrasive member 552 of
FIG. 32. Pressure cavity 580 is fabricated on the back surface 582
of the abrasive member 552 that acts as a plenum for the delivery
of pressurized gas out through the pressure ports 566.
[0195] FIG. 34 illustrates a gimbal assembly 588 that contains an
array of gimbal mechanisms 590 of FIG. 31. Each gimbal mechanism
590 includes four L-shaped springs 592A, 592B, 592C, 592D
(collectively "592") that suspend the abrasive members 552 above
the substrate 558 in accordance with an embodiment of the present
disclosure. Box-like structure 594 is optionally fabricated on each
gimbal structure 590 to help align the abrasive members 552. The
box-like structure 594 also includes a port 596 that delivers the
pressurized gas to the backs of the abrasive members 552 and out
the pressure ports 566.
[0196] FIG. 35 is an exploded view of the hydrostatic abrasive
article 550 of FIG. 31. External pressure source 554 delivers
pressurized gas (e.g., air) to plenum 600 in preload structure 602.
Cover 604 is provided to enclose the plenum 600. A plurality of
pressure ports 606 in the plenum 600 are fluidly coupled to the
pressure ports on the gimbal mechanism 590 by bellows couplings
608.
[0197] Springs 610 transfer the preload 612 from the preload
structure 602 to each of the gimbal mechanisms 590. The externally
applied load 612, the geometry of the hydrostatic bearing 564, 572,
and the external pressure control the desired spacing 556 between
the abrasive members 552 and the substrate 558.
[0198] Holder structure 620 is attached to the preload structure
602 by stand-offs 622. The holder structure 620 sets the preload
624 applied on each abrasive member 552 and limits the deformation
of the gimbal mechanisms 590 in order to avoid damage while the
individual preload 624 is applied. An adhesive layer (not shown)
attaches the abrasive members 552 to the gimbal box-like structure
594. The external preload 612 applied to the array of abrasive
members 552 is greater than or equal to the preloads 624 generated
by the independently suspended abrasive members 552 in order to
allow the gimbal mechanisms 590 to comply with the substrate 558
and not interfere with the holder structure 620.
[0199] FIGS. 36 and 37 illustrates dimple structure 630 interposed
between the springs 610 and the gimbal mechanism 590. The dimple
structure 630 delivers the preload as a point source. Offset from
the springs 610 and the dimple 630 is a flexible bellow 608 that
delivers the external pressure to each individual abrasive member
552 via the gimbal mechanisms 590. The gimbal mechanisms 590,
preload structure 602, and holder structure 620 can also be used in
a hydrodynamic application without the pressure ports 566 and
bellows couplings 608.
[0200] FIG. 38 is a bottom view of the hydrostatic abrasive article
550 with the individual abrasive members 552 organized in a serial
fashion. Note that other configurations can easily be accommodated,
such as for example an off-set or random pattern.
[0201] Alternate hydrostatic slider height control devices are
disclosed in commonly assigned U.S. Provisional Patent Application
Ser. No. 61/220,149 entitled Constant Clearance Plate for Embedding
Diamonds into Lapping Plates, filed Jun. 24, 2009 and Ser. No.
61/232,425 entitled Dressing Bar for Embedding Abrasive Particles
into Substrates, which are hereby incorporated by reference. A
mechanism for creating a hydrostatic fluid bearing for a single
abrasive member attached to a head gimbal assembly is disclosed in
commonly assigned U.S. Provisional Patent Application Ser. No.
61/172,685 entitled Plasmon Head with Hydrostatic Gas Bearing for
Near Field Photolithography, filed Apr. 24, 2009, which is hereby
incorporated by reference.
[0202] Controlling the magnitude of the pressure applied to the
abrasive members changes the clearance between the substrate and
the abrasive members. The frequency response of the system is
independent of the compliance of the material selected for the
abrasive member but can be engineered by the selection of the
gimballing mechanism, including the hydrostatic bearing design. The
pressure generated by the hydrostatic bearing contributes to
forming pitch, z-height, and roll forces that counter the cutting
forces emanating from surface defects interaction and potential
contact with the substrate.
[0203] FIG. 39A illustrates a circular hydrostatic abrasive member
640 in accordance with an embodiment of the present disclosure. The
cylindrical shaped recess 642 and pressure port 644 create a
generally constant pressure at center, with a logarithmical
decaying pressure radially outward.
[0204] FIG. 39B is a graphical illustration of the pressure profile
for the circular abrasive member of FIG. 39A. The circular abrasive
member has a generally constant pressure profile 646 in center
region 642 adjacent to the pressure port 644. The pressure at the
outer edges 648 of the abrasive member matches ambient pressure.
This pressure profile operates similar to a spring. One embodiment
envisions a cylindrical shaped recess, such as 642, at each corner
of the abrasive member of FIG. 31.
[0205] FIG. 40 illustrates a hydrodynamic abrasive member 650 in
accordance with an embodiment of the present disclosure. The
abrasive member 650 is generally the same as discussed above,
except that no pressure ports are required. Fluid bearing surfaces
652A, 652B, 652C, 652D, 652E (collectively "652") located along the
leading edge 654 and trailing edge 656 create hydrodynamic lift
between the abrasive member 650 and the substrate 658 (see FIG.
43). The air for the fluid bearing enters along the leading edge
654 and exits along the trailing edge 656. The fluid bearing
surfaces 652 also enhance the stability at the interface and a
cutting surface to remove surface defects from the substrate
658.
[0206] The conditions promoting hydrodynamic lift are bearing
design, gas/liquid shearing, and linear velocity of the abrasive
member 650 relative to the substrate 658. Such conditions can
promote the formation of a fluid film (oil, water, gas) between the
abrasive member and the substrate. The relative velocity is
obtained by rotating the substrate 658 and/or the abrasive members
650.
[0207] Hydrodynamic abrasive article 670 of the present embodiment
is best illustrated in FIGS. 42 and 43. An array of abrasive
members 650 is attached to preload structure 660 by an array of
gimbal mechanisms 662. Preload 664 is transmitted to the gimbal
mechanisms 662 by dimpled springs 666, generally as discussed
above. The suspended abrasive members 650 have a static pitch and
roll stiffness through the hydrodynamic fluid bearing and a
z-stiffness through the gimbal mechanisms 662. The fluid bearing
surfaces 652 can include any of the abrasive features discussed
herein.
[0208] The hydrodynamic fluid film formed at each abrasive member
650 controls the dynamic response of the structure. The frequency
response of such system can be designed to be in the 10-100 kHz
range, which is sufficient to comply with the substrate surface 668
and to interact with surface debris. The spacing between the
polishing surfaces 652C, 652D, 652E can be controlled to cause
interaction with surface defects with little to no material removal
from the substrate 658. In order for the fluid bearing surfaces 652
to develop a stable interface, the hydrodynamic forces must be
greater than external disturbances caused by the interference or
contact between the polishing surfaces 652C, 652D, 652E and the
surface defects.
[0209] FIG. 41 illustrates a pressure curve generate by the
abrasive member 650 of FIG. 40. Note that the pressure vanishes to
atmospheric pressure at the edges of the fluid bearing surfaces and
builds-up to a maximum 672 at the trailing edge fluid bearing
surfaces 652C, 652D, 652E. Each of the fluid bearing surfaces
pressurizes under the shear force of the lubricating fluid (air or
liquid) to generate a force contributing to counter the preload 664
and the cutting forces emanating from the polishing or polishing
operation. The pressure formed under the fluid bearing surfaces
maintains a certain clearance between the substrate 658 and the
abrasive members 650.
[0210] FIGS. 44A-44C illustrate an abrasive member assembly 750
with an array of abrasive members 768 arranged in a cylindrical
array in accordance with an embodiment of the present disclosure.
FIG. 45 is an exploded view of the abrasive member assembly 750 of
FIG. 44A-44C.
[0211] The abrasive member 750 preferably forms a contact interface
with the substrate, although this embodiment may be used with a
hydrodynamic or hydrostatic bearing. Cylinder preload fixture 752
includes a plurality of dimpled spring members 754 that apply an
outward radial preload 756 on each gimbal mechanism 758. The
preload 756 is transferred by dimple member 760 acting on rear
surface 762 of the gimbal mechanisms 758. The gimbal mechanisms 758
are interconnected into a gimbal assembly 764 by support structure
766. The individual abrasive members 768 are attached to the gimbal
mechanisms 758.
[0212] FIG. 46 illustrates a plurality of the abrasive member
assemblies 750 of FIG. 45 arranged in a stack configuration 782.
The cylindrical structure can be used to clean planar or non-planar
substrates. In one embodiment, axis of rotation 780 is oriented
parallel to the surface 784 of the substrate 786. The stacked
configuration 782 is optionally rotated while engaged with the
substrate 786. The substrate 786 can be stationary or moving.
[0213] A hydrostatic bearing can optionally be generated at the
interface of the abrasive members 768 and the substrate via
external pressurization means, as discussed above. The hydrostatic
approach permits the abrasive members 768 to hover over the
substrate surface at any desired clearance while still being able
to interact and remove surface defects. A stable contacting
interface can also be used with the abrasive members 768. The
abrasive members 768 can either be a porous sponge-like material or
a hard coated slider. The gimbal mechanisms 758 and preload
mechanisms 754 permit the abrasive members 768 to follow the
run-out and waviness of the substrate while the abrasive members
768 intimately contact and clean the substrate.
[0214] Alternate methods of controlling the height of the abrasive
members above the substrate are disclosed in commonly assigned U.S.
Provisional Patent Application Ser. No. 61/220,149 entitled
Constant Clearance Plate for Embedding Diamonds into Lapping
Plates, filed Jun. 24, 2009 and Ser. No. 61/232,425 entitled
Dressing Bar for Embedding Abrasive Particles into Substrates,
which are hereby incorporated by reference. A mechanism for
creating a hydrostatic fluid bearing for a single abrasive member
attached to a head gimbal assembly is disclosed in commonly
assigned U.S. Provisional Patent Application Ser. No. 61/172,685
entitled Plasmon Head with Hydrostatic Gas Bearing for Near Field
Photolithography, filed Apr. 24, 2009, which is hereby incorporated
by reference.
[0215] Controlling the magnitude of the pressure applied to the
abrasive members changes the clearance between the substrate and
the abrasive members. The frequency response of the system is
independent of the compliance of the material selected for the
abrasive members but can be engineered by the selection of the
gimballing mechanism, including the hydrostatic bearing design. The
pressure generated by the hydrostatic bearing contributes to
forming pitch, z-height and roll forces that counter the cutting
forces emanating from surface defects interaction and potential
contact with the substrate.
Example 1
[0216] FIG. 47A illustrates an abrasive member 800 modeled for
topography following applications. The leading edge 802 includes a
plurality of discrete features 804 separated by cavities 806 that
permit air flow and particles to enter. The cavity depth 812 is
about 2 micrometers to about 3 micrometers to promote a negative
suction force.
[0217] The leading edge pads 804 are formed with rounded surfaces
816 to promote the redistribution of debris and lubricant. This
example of a low contact force abrasive member 800 includes leading
edge step 818 that increases lift at the leading edge 802.
[0218] FIG. 47B is a graphical illustration of the contact pressure
of the abrasive member 800 with the substrate. The leading edge
pressure 802A is preferably zero. Trailing edge pressure 810A shows
a minor negative suction force. Upon application of large loads
(e.g., up to 12 grams) the leading edge 802 does not contact the
substrate, while the trailing edge 810 follows the topography of
the substrate.
[0219] Table 1 shows that the leading edge 802 clears the
substrate, while the trailing edge 810 is in contact. This approach
permits the trailing edge 810 to follow the substrate waviness. The
leading and trailing edge pressurization contribute to the
stability of the design during asperity interactions and debris
removal. This design is ideal for cleaning debris and removing nano
level amounts of material in the presence of a thin film
lubricant.
TABLE-US-00001 TABLE 1 Negative Positive Pitch (micro Preload
pressure pressure Contact force radians)/Fly (grams) (grams)
(grams) (grams) height (nm) 3 -0.89 3.88 0 318/24 5 -1.03 6.02 0.01
233/10 8 -1.18 8.93 0.24 163/4.2 10 -1.27 10.72 0.54 130/2.5 12
-1.31 12.47 0.83 113/1.7 indicates data missing or illegible when
filed
Example 2
[0220] FIG. 48A illustrates an abrasive member 820 modeled for
topography following applications. The leading edge 822 includes a
plurality of discrete features 824 separated by slots 826 that
permit air flow and particles to enter. This example of a low
contact force abrasive member 820 includes leading edge step 828
and extended sides 830 to increase the negative pressure force
(suction force). The leading edge step 828 has a depth of about 0.1
micrometers to about 0.5 micrometers to promote the formation of
higher pressure at the leading edge 822. Note that the trailing
edge 832 is formed of discrete pads 834 to reduce the spacing
between the substrate and the abrasive member, and to allow for
circulation of lubricant and debris.
[0221] FIG. 48B is a graphical illustration of the contact pressure
for the abrasive member 820 against the substrate. The contact
forces are concentrated at the pads 834 located at trailing edge
832. The negative pressure saturates around 3.5 grams while the
positive pressure increases to balance the applied load while
keeping a pitch angle causing the spacing between the leading edge
822 and the substrate. The design provides very good contact
stiffness contributing to the stability of the abrasive member. The
abrasive member 820 has a pitch that permits the leading edge 822
to remain above the substrate. This design transmits about 15
percent of the applied load to the substrate, which is greater than
the force in Example 1. This design is ideal for cleaning and
removing debris from wafers in the presence of a thin film
lubricant. Nanometer-level removal from this design is
expected.
[0222] Table 2 provides a summary of various performance parameters
for the abrasive member as a function of preload.
TABLE-US-00002 TABLE 2 Negative Positive Pitch (micro Preload
pressure pressure Contact force radians)/Fly (grams) (grams)
(grams) (grams) height (nm) 3 -2.9 5.7 0.26 200/3.3 5 -3.18 7.5
0.6314 159/1.4 8 -3.4 10.2 1.14 118/0.5 11 -3.5 13.0 1.6 91/0.18 12
CRASH indicates data missing or illegible when filed
Example 3
[0223] FIG. 49A illustrates an abrasive member 840 modeled for
topography removing applications. The leading edge 842 includes a
plurality of discrete features 844 separated by slots 846 that
permit air flow and particles to enter. The trailing edge 848
similarly includes a plurality of discrete features 850 separated
by slots 852. The features 844, 850 have a height 854 of about 2
micrometers and are formed with rounded leading edge surfaces to
distribute both lubricant and wear debris.
[0224] The height 854 is sufficient to create a positive pressure
profile at the top of the pads 844, 850 and a negative suction
force at the trailing side 845 of the features 844 in cases of air
as a lubricant. The proper selection of the pressure distributions
controls the pitch angle of the abrasive member 840 and the minimum
spacing above the substrate.
[0225] In the case of topography removing, the abrasive member 840
does not follow certain target wavelengths of waviness. The pitch
angle of the abrasive member 840 is therefore substantially reduced
to cause both the leading edges 842 and the trailing edges 848 to
not follow the target wavelengths of waviness and to cause wear of
the interacting surfaces.
[0226] A simple exercise demonstrates the capability of this design
given in Table 3. By varying the externally applied preloads from
about 0.1 grams to about 10 grams, a reduction in the pitch angle
and spacing is attained, causing a higher level of wear and
interactions between both the leading and trailing edges 842, 848
and the substrate. The low pitch angle also inhibits follow of the
target wavelengths.
[0227] Note that at 5 grams of preload a negative suction force and
a total positive pressure is generated to counter the contact force
of 2.56 grams and the 5 grams of preload. An increase in preload as
shown causes a substantially linear increase in contact force
responsible for the removal of material at the substrate. FIG. 49B
is a graphical illustration of the contact pressure of the abrasive
member 840 with the substrate. Note the negative pressure at the
leading edge 842.
[0228] Table 3 provides a summary of various performance parameters
for the abrasive member as a function of preload.
TABLE-US-00003 TABLE 3 Negative Positive Pitch (micro- Preload
Pressure Pressure Contact force radians)/fly (grams) (grams)
(grams) (grams) height (nm) .1 -2.33 2.43 0 31/21 1 -2.39 3.31
0.075 12/14 5 -2.4 4.91 2.56 4/4.8 7 -2.48 5.35 4.13 2.6/3.2 10
-2.50 5.97 6.53 8/1.5 indicates data missing or illegible when
filed
Example 4
[0229] FIGS. 50A and 50B illustrate an abrasive member 870 for use
with free abrasive particles, such as in CMP. Leading edge
pressurization causes the abrasive member 870 to pitch upward so
leading edge 872 does not contact the substrate. The pitch also
contributes to the ability of the abrasive member 870 to follow the
topography of the substrate.
[0230] Rails 876 at trailing edge 874 help pressurize the bearing
and cause the trailing edge 874 to contact the substrate. Top
surfaces 878 of the rails 876 are in direct contact with the
substrate if desired. These surfaces 878 can be textured and coated
with hard coatings to cause defect removal and burnishing. The
rails 876 control the spacing between the abrasive member 870 and
the substrate and provide a predictable interference between the
trapped free abrasive particles and the substrate.
[0231] A series of shaped recessed pads 880 are fabricated at the
trailing edge 874 between the rails 876 to interact with the free
abrasive particles present in the chemical mechanical polishing
slurry. The recesses have a depth 882 of about 10 nanometers to
about 50 nanometers relative to rails 876, which is smaller than
the diameter of the free abrasive particles. The leading edges 884
of the recessed pads 880 are shaped to allow progressive entrance
of the free abrasive particles to the interface of the abrasive
member 870 with the substrate.
[0232] The design presents a leading edge 884 pressurized zone and
a trailing edge 874 pressurized zone. The trailing edge 874 is able
to both follow the topography while the recessed pads 880 cause the
free abrasive particles to be in intimate contact with the
substrate. The resulting contact pressure is substantially uniform
and independent of the substrate topography.
Example 5
[0233] FIG. 51 illustrates abrasive member 900 for use with free
abrasive particles, similar to CMP. In the case of conditions where
a hydrodynamic film is difficult to establish, such as for example
in the case of slow spinning plates and the presence of large
amount of debris interfering with the formation of a hydrodynamic
film, it is desirable to switch to a hydrostatic bearing
concept.
[0234] One or more button bearings 902, 904 are fabricated at the
leading edge 906, such as illustrated in FIGS. 39A and 39B. Pad 908
is formed at the trailing edge 910. The pad 908 includes ramp 912
that promotes movement of the free abrasive particles into the
interface with the substrate. The trailing edge 910 is in contact
with the slurry, causing the free abrasive particles to contact the
surface and remove material. The hydrostatic bearing establishes a
stable bearing and assures topography following. The hydrostatic
bearing provides a substantially constant polishing pressure across
the substrate.
[0235] Additional button bearings 914, 916 are optionally located
on the pad 908 to establish a desired spacing profile with the
substrate, including pitch, nominal spacing (minimum), and a roll
attitude of the abrasive member 900.
Example 6
[0236] FIGS. 52A and 52B illustrates an abrasive article 1150 with
an array of abrasive member 1152 with integrated preload 1154 and
gimbal structure 1156 in accordance with an embodiment of the
present disclosure. The illustrated abrasive members 1152 includes
spherical fluid bearing structures 1158 each with crown 1160
(curvature in the direction of travel) and camber 1162 (curvature
perpendicular to the crown) 1160. The illustrated curvature is
substantially exaggerated to illustrate the concept. The abrasive
members 1152 can be cylindrical or spherical in form.
[0237] The height differential from center 1164 of the fluid
bearing structure 1158 to the edge 1166 is preferably about 10
nanometers to about 100 nanometers to permit the fluid bearing to
form. The spherical nature of the fluid bearing surface 1158 is
desirable for interacting with free abrasive particles contained in
slurry for chemical mechanical polishing.
[0238] Each abrasive member 1152 includes a plurality of extensions
1168 that form the individual gimbal assemblies 1170. As best
illustrated in FIG. 52B, the extensions 1168 are mounted to tabs
1172 on preload pad 1174, such as for example, by an adhesive,
solvent bonding, ultrasonic welding, and the like. The extensions
1168 can flex and twist on either side of the tabs 1172 so the
abrasive members 1152 can be independently displace vertically, and
in pitch and roll. For ease of manufacturing the abrasive members
1152 and extension 1168 are molded as a unitary structure.
[0239] Preload members 1176 are positioned between the preload pad
1174 and rear surfaces 1159 of the abrasive members 1152. The
preload members 1176 are preferably resilient to permit deflection
of the abrasive members 1152 in the vertical direction. The preload
members 1176 are preferably attached to either the preload pad 1174
or the abrasive members 1152. In an alternate embodiment, the
preload pad 1174 is made of a resilient material. The preload 1184
is applied simply by pushing the entire assembly 1150 against the
substrate.
[0240] The abrasive members 1152 optionally include one or more
cavities or steps 1180 near leading edge 1182 to promote formation
of a fluid bearing. By changing the curvature of the fluid bearing
surface 1158, the shape or location of the cavities 1180, or a
variety of other variables, the abrasive members can be either
topography following or topography removing. If the curvature of
the fluid bearing surface 1158 is increased above about 100
nanometers, the maximum pressure tends to form at the center 1164.
The spherical configuration permits a progressive interactions with
free abrasives. The spherical shape also allows for a point like
contact with desirable topography following properties.
Example 7
[0241] FIGS. 53A and 53B illustrates an abrasive article 1200 with
an array of abrasive member 1202 substantially as shown in FIGS.
52A and 52B with hydrostatic ports 1204 in accordance with an
embodiment of the present disclosure. The hydrostatic ports 1204
are preferably button bearings, such as disclosed in FIG. 39A,
located at leading edges 1206 of the abrasive members 1202.
[0242] Rear surfaces 1208 of each abrasive member 1202 includes
channels 1210 that fluidly communicate with opening 1212 in sealing
layer 1214. As best illustrated in FIG. 53A, the openings 1212
fluidly communicate with holes 1216 in preload members 1226. Rear
surface 1220 of preload pad 1218 includes a series of channels 1222
and backing layer 1224. As a result, a pressurized gas delivered to
the channels 1222 flows through the backing layer, to the channels
1210 in the abrasive members 1202 and out the pressure ports
1204.
Resilient Support
[0243] FIGS. 54 and 55 illustrate abrasive article 1300 with an
array of abrasive members 1302 coupled to resilient support 1304 in
accordance with an embodiment of the present disclosure. Resilience
refers to a property of a material to absorb energy when it is
deformed elastically and then, upon unloading, to have this energy
recovered. The resilient support is preferably an elastomer (e.g.,
a polymer with viscoelastic properties).
[0244] In the illustrated embodiment, resilient support 1304 is a
layer of resilient material and the abrasive members 1302 are
discrete structures arranged in a circular array. Each abrasive
member 1302 can articulate independently in at least pitch 1336 and
roll 1338 (see FIG. 57).
[0245] The resilient supports of the embodiments discussed herein
are a lower cost alternative to mechanical gimbal mechanisms. While
some embodiments the resilient supports may lack the frequency
response of a mechanical gimbal, the resilient supports are more
resistant to vibration or chatter. By modifying the resilient
support, pitch and roll stiffness can be engineered for the
particular application. The resilient supports can be made using a
wide variety of techniques, such as for example, molding, stamping,
laser cutting, and can be constructed from one or more layers.
[0246] The stiffness of the air bearing is preferably greater than
the stiffness of the resilient support 1304, so the dominant factor
effecting the engagement of the abrasive members 1302 with
substrate 1314 is the air bearing. Once the air bearing is formed
the frequency response is typically comparable to that of
mechanical gimbals, with greater resistance to harmonic vibration
and chatter. Additionally, frequency response is typically less
important for some topography removing applications.
[0247] In the illustrate embodiment, resilient layer 1304 does not
completely decouple pitch and roll displacement of a single
abrasive member 1302, as can be done with a mechanical gimbal. The
ability to use low-cost molding techniques to make the abrasive
article 1300, however, outweighs this limitation for some
embodiments.
[0248] In one embodiment, the resilient support 1304 is bonded to
the abrasive member 1302. As used herein, "bond" or "bonding"
refers to, for example, adhesive bonding, solvent bonding,
ultrasonic welding, thermal bonding, and the like. In another
embodiment, the resilient support 1304 and the abrasive members
1302 are fused together during the molding process.
[0249] Preload structures 1306 biases preload member 1308 to
transmit preload 1310 to rear surface 1312 of the abrasive members
1302. In the preferred embodiment, each abrasive member 1302 has
one or more discrete preload members. The preload members 1308 are
preferably embedded or molded in the resilient layer 1304. The
stiffness of the air bearing is preferably balanced with the
stiffness of preload structure 1306.
[0250] The abrasive members 1302 are preferably rigid so that they
pivot around distal end 1308A of the preload member 1308. In the
illustrated embodiment, the preload member 1308 is a metallic
spring member that permits Z-axis 1334 displacement of the abrasive
members 1302, although a rigid preload member can also be used (see
FIG. 57). As used herein, "spring members" refers to a wide variety
of spring structures, such as for example, coil springs, leaf
springs, flat springs, cantilever springs, and the like.
[0251] As illustrated in FIG. 56, air shearing forces generated by
relative motion 1330 of the abrasive article 1300 relative to
substrate 1314 to entrain an air cushion that interacts with air
bearing features 1316 to create hydrodynamic forces 1318. The air
bearing features 1316 are preferably configured so generate greater
lift 1318 at leading edge 1320 then at trailing edge 1322. As a
result, the abrasive members 1302 assume an attitude or pitch angle
1332. Resilient layer 1304 compresses at location 1324 and
stretches at location 1326 to accommodate the pitch angle 1332.
[0252] The hydrodynamic forces 1318 are preferably substantially
greater than the stiffness of the resilient layer 1304. The pitch
angle 1332 is preferably controlled by other factors, such as for
example, the configuration of the air bearing features 1316, the
speed of the abrasive article 1300 relative to the substrate 1314,
and the like. FIG. 57 illustrates one possible embodiment of the
air bearing features 1316. The resilient layer 1304 allows the
abrasive member 1302 to articulate in all six degrees of freedom
X-axis 1330, Y-axis 1332, Z-axis 1334, pitch 1336, roll 1338, and
yaw 1340.
[0253] As discussed herein, the trailing edge 1322 preferably
includes abrasive features. The abrasive features can be one or
more of an abrasive material attached to the air bearing features
1316, a slurry of free abrasive particles located at the interface
of the air bearing features 1316 and the substrate 1314, air
bearing features 1316 made from abrasive particles disbursed in a
binder, nano-scale roughened surface of the air bearing features
1316 coated with a hard coat, or nano-scale diamonds attached to
the air bearing features 1316 at trailing edges 1322 of the
abrasive members 1302, or a combination thereof. The substrate 1314
can be a wafer, a wafer-scale semiconductor, magnetic media for
hard disk drives, bit patterned or discrete track media, a
convention disk for a hard disk drive, or any other substrate.
[0254] FIG. 58 illustrates an alternate abrasive article 1350 with
abrasive members 1352 pre-configured with pitch angle 1354 in
accordance with an embodiment of the present disclosure. The
pre-configured pitch attitude 1354 reduces the amount of
deformation of the resilient backing 1356 required to establish the
desired flying attitude of the abrasive members 1352 relative to
substrate 1358. The pre-configured pitch angle 1354 is preferably
established during the molding process.
[0255] FIG. 59 illustrates an alternate abrasive article 1370 with
one or more sensors 1372A, 1372B (collectively "1372") located in
abrasive members 1374 in accordance with an embodiment of the
present disclosure. Sensor 1372 can be used to perform contact
detection in order to establish gap 1376 between the abrasive
member 1374 and substrate 1378, to monitor material removal from
the substrate 1378, and/or to monitor surface roughness of the
substrate 1378. The sensors 1372 can be a shear based transducer
such as disclosed in U.S. Pat. No. 6,568,992 (Angelo et al.); a
lapping sensor such as disclosed in U.S. Pat. No. 5,494,473 (Dupuis
et al.) and U.S. Publication No. 2005/0071986 (Lackey et al.); a
piezoelectric sensors disclosed in U.S. Pat. No. 6,543,299
(Taylor); and the like, all of which are hereby incorporated by
reference.
[0256] In another embodiment, one or more heaters 1392 can be
included to thermally expand the abrasive members 1374 as a
mechanism of controlling the gap 1376 and/or to shape the contact
surface 1394. Various arrangements of heaters are disclosed in U.S.
Pat. Nos. 7,428,124 and 7,430,098 (Song, et al.); 7,388,726
(McKenzie et al.); and U.S. Pat. Publication No. 2007/0035881
(Burbank et al.), which are hereby incorporated by reference.
[0257] In the illustrated embodiment, circuit layer 1380 is located
between the preload structure 1382 and the resilient layer 1384.
The electrical connection between the circuit layer 1380 and the
sensors 1372 can be made using a separate electrical conductor 1386
embedded in the resilient layer 1384. In another embodiment,
preload member 1388 acts as the electrical conductor 1386.
[0258] Additional circuitry or electrical devices 1390 can be
located in the circuit layer 1380 or in the abrasive members 1374,
such as for example, ground planes, power planes, transistors,
capacitors, resistors, RF antennae, shielding, filters, memory
devices, embedded IC, and the like. In one embodiment, the
electrical devices 1390 can be formed using printing technology,
adding intelligence to the abrasive members 1374. The availability
of printable silicon inks provides the ability to print electrical
devices 1390, such as disclosed in U.S. Pat. No. 7,485,345 (Renn et
al.); 7,382,363 (Albert et al.); 7,148,128 (Jacobson); 6,967,640
(Albert et al.); 6,825,829 (Albert et al.); 6,750,473 (Amundson et
al.); 6,652,075 (Jacobson); 6,639,578 (Comiskey et al.); 6,545,291
(Amundson et al.); 6,521,489 (Duthaler et al.); 6,459,418 (Comiskey
et al.); 6,422,687 (Jacobson); 6,413,790 (Duthaler et al.);
6,312,971 (Amundson et al.); 6,252,564 (Albert et al.); 6,177,921
(Comiskey et al.); 6,120,588 (Jacobson); 6,118,426 (Albert et al.);
and U.S. Pat. Publication No. 2008/0008822 (Kowalski et al.), which
are hereby incorporated by reference.
[0259] FIGS. 60 and 61 illustrate an alternate abrasive article
1400 with an array of cantilevered abrasive members 1402 in which
preload member 1404 combines the preload function with the
articulation function in accordance with an embodiment of the
present disclosure. The embodiment of FIG. 61 substantially
decouples pitch and roll displacement of the abrasive members 1402.
The preload member 1404 is preferably embedded in abrasive members
1402, such as during the molding process. In one embodiment,
preload member 1404 is molded into resilient support 1406.
[0260] In one embodiment, sacrificial layer 1408, such as for
example a photo mask, is then applied to surface 1410 of the
resilient support 1406. The abrasive members 1402 are then molded
over the preload member 1404 protruding from the sacrificial layer
1408. Thickness 1412 of the sacrificial layer 1408 determines gap
1414 (see FIG. 61) between the abrasive members 1402 and the
resilient support 1406.
[0261] As illustrated in FIG. 61A, once the sacrificial layer 1408
is removed, the abrasive member 1402 is retained in cantilevered
configuration 1415 relative to the resilient support 1406 by
preload member 1404. The preload member 1404 also applies preload
1422 to the abrasive members 1402, as discussed above. The preload
member 1404 retains the abrasive members 1402 in a cantilevered
relationship with resilient support 1406, and determines pitch and
roll stiffness. The stiffness of the resilient support 1406 is
optionally increased to create a stop on deflection of the abrasive
member 1402.
[0262] In an alternate embodiment illustrated in FIG. 61B, preload
member 1404 is retained in a less resilient or rigid material 1405
surrounded by resilient support 1406. Consequently, resistance to
displacement of the abrasive members 1402 is concentrated in distal
portion 1407 of the preload member 1404.
[0263] In one embodiment, the thickness 1412 is selected to permit
the abrasive members 1402 to assume a desired pitch angle 1420
relative to substrate 1416. As illustrated in FIG. 62, leading edge
1418 contacts, or is adjacent to, the layer 1406 after formation of
an air bearing. The layer 1406 acts to limit or resist further
increases in the pitch angle 1420. The interaction of the leading
edge 1418 with the layer 1406 attenuates vibration of the abrasive
member 1402.
[0264] As illustrated in FIG. 62, the preload member 1404 flexes to
permit the abrasive member 1402 to move in all six degrees of
freedom. In the preferred embodiment, the preload member 1404 is
constructed from metal to provide high frequency response during
interaction with substrate 1416. The preload member 1404 can be
supplemented with any of the resilient or spring structures
disclosed herein.
[0265] FIG. 63 illustrates an alternate abrasive article 1430 with
an array of cantilevered abrasive members 1432 in accordance with
an embodiment of the present disclosure. In the illustrated
embodiment, resilient support 1434 is a coiled spring structure
embedded in the abrasive members 1432 and the resilient support
1436. Resilient support 1436 optionally has greater stiffness to
limit articulation of the abrasive members 1432.
[0266] FIG. 64 illustrates an alternate abrasive article 1450 with
an array of abrasive members 1452 in accordance with an embodiment
of the present disclosure. Abrasive members 1452 are retained to
resilient support 1454 by tension member 1456 that extends through
pivot structure 1458. The pivot structure 1458 is preferably
constructed from a resilient material that permits some Z-axis
displacement.
[0267] In the illustrated embodiment, the tension member 1456 is
highly flexible and provide minimal resistance to the abrasive
members 1452 pivoting on pivot structure 1458. In one embodiment,
the tension member 1456 is an extension of pivot structure 1458,
instead of a separate structure. In another embodiment, tension
member 1456 is a polymeric structure, such as a monofilament.
[0268] In the preferred embodiment, a plurality of spring
structures 1460 are embedded in resilient support layer 1454. The
spring structures 1460 are preferably located along centerline of
the abrasive members 1452 (x-axis) so as to reduce resistance to
roll 1462. Although the spring structures 1460 are illustrated as
coil springs, a variety of other spring structures may be used,
such as for example, leaf springs, flat springs, cantilever
springs, and the like.
[0269] Alternatively, the resilient supports 1460 can be embedded
in the abrasive members 1452 and/or the resilient support layer
1454. In yet another embodiment, the spring structures 1460 are
elastomeric members.
[0270] FIG. 65 illustrates an alternate abrasive article 1470 with
an array of abrasive members 1472 with textured resilient support
1474 in accordance with an embodiment of the present disclosure.
Altering the texture permits the pitch and roll stiffness to be
adjusted. The abrasive members 1472 are preferably bonded to peaks
1476 of the textured support structure 1474. The textured resilient
support 1474 has reduced stiffness relative to a continuous layer.
Preload member 1478 applies preload 1480 to the abrasive members
1472. Preload member 1478 can be embedded in the textured resilient
support 1474 and/or layer 1482.
[0271] FIG. 66 illustrates an alternate abrasive article 1490 with
an array of abrasive members 1492 with non-woven resilient support
1494 in accordance with an embodiment of the present disclosure.
The non-woven resilient support 1494 preferably includes spring
metal and polymeric fibers 1496 in a non-woven configuration to
increase frequency response.
[0272] In the illustrate embodiment, the non-woven resilient
support 1494 is non-planar. Resilient protrusion 1498 is preferably
embedded in the abrasive members 1492, such as by overmolding, to
create gap 1500 to facilitate pivoting. Preload member 1502 is
optionally embedded in layer 1504 for greater stability. In one
embodiment, layer 1504 includes a plurality of openings 1506
through which debris abraded from substrate 1508 is removed from
interface 1510 by force of vacuum.
[0273] FIG. 67 illustrates an alternate abrasive article 1520 with
an array of abrasive members 1522 on discontinuous resilient
support 1524 in accordance with an embodiment of the present
disclosure. Resilient support 1524 is molded with a plurality of
cantilevered projections 1526 extending into openings or recesses
1528. The abrasive members 1522 are bonded to the cantilevered
projections 1526 at interfaces 1530.
[0274] Changing the geometry of the projections 1526 permits the
pitch and roll stiffness to be modified for the particular
application. In particular, increase the width of the projections
1526 increases roll stiffness. In one embodiment, additional
projections 1526 are formed in the resilient support 1524 that
engage with side edges of the abrasive members 1522 to enhance roll
stiffness.
[0275] The abrasive members 1522 preferably have dimension 1532 in
at least one direction that is less then corresponding dimension
1534 of the recess 1528. Consequently, during engagement with
substrate 1536, only the resilience of the cantilevered projections
1526 resist displacement of the abrasive members 1522. Preload
member 1538 is preferably embedded in layer 1540.
[0276] FIG. 68 illustrates an abrasive article 1550 with an array
of abrasive members 1552 on an alternate discontinuous resilient
support 1554 in accordance with an embodiment of the present
disclosure. In the illustrated embodiment, only leading and
trailing edges 1556, 1558 of the abrasive members 1552 are bonded
to the resilient support 1554. Side edges of the abrasive members
1552 are preferably free floating over recess 1562. Tapers 1560
formed in openings 1556 result in a steep increase in stiffness of
the resilient support 1554 as a function of displacement of the
abrasive members 1552.
[0277] FIG. 69 illustrates abrasive article 1570 having an array of
abrasive members 1572 with hydrostatic pressure ports 1574A, 1574B
(collectively "1574") in accordance with an embodiment of the
present disclosure. Plenum 1576 is fluidly coupled by conduit 1578
that extends through resilient support 1580. The pressure generated
by the hydrostatic pressure port 1574 contributes to forming pitch
angle, z-height, and roll forces that counter the cutting forces
emanating from surface defects interaction and potential contact
with the substrate 1582.
[0278] A hydrostatic bearing may be used in combination with a
hydrodynamic fluid bearing, such as during start-up rotation and/or
ramp-down of the abrasive article 1570 relative to a substrate. The
hydrostatic bearing controls the interface with the substrate 1582
until hydrodynamic air bearing is at least partially formed, as
discussed above. Thereafter, the hydrostatic bearing is preferably
reduced or terminated.
[0279] FIG. 70 illustrates abrasive article 1600 having an array of
cantilevered abrasive members 1602 with hydrostatic pressure ports
1604A, 1604B (collectively "1604") in accordance with an embodiment
of the present disclosure. Conduit 1606 extends above resilient
support 1608 and into the abrasive members 1602, creating gap 1610.
The conduit 1606 is preferably sufficiently resilient to permit the
abrasive member 1602 to move through at least pitch and roll, but
also acts as the preload member. In an alternate embodiment,
separate preload member 1612 extends through conduit 1606 to
provide the preload 1614, without interfering with the flow of
pressurized air to the pressure ports 1604. In one embodiment,
resilient support 1608 has increased stiffness to limit
displacement of the abrasive members 1602. In alternate embodiment,
layer 1608 is made from a resilient material to supplement the
resilient of the conduit 1606.
[0280] FIG. 71 illustrates an alternate abrasive article 1630 with
structured elastomeric support 1632 in accordance with an
embodiment of the present disclosure. Recesses 1634 surround and
mechanically isolate abrasive members 1636 to facilitate
articulation when subject to hydrodynamic forces and/or engagement
with substrate 1638. In the illustrated embodiment, protrusions
1640 have generally the same dimensions as the second surface 1642
of the abrasive members 1636. In alternate embodiments, the
protrusions 1640 can have cross sectional dimensions greater than
or less then the second surface 1642 of the abrasive members
1636.
[0281] FIG. 72 illustrates fixture 2100 for making an abrasive
article in accordance with a method of the present invention.
Master plate 2102 is machined and polished to a substantially flat
surface 2104.
[0282] Roughness of a surface can be measured in a number of
different ways, including peak-to-valley roughness, average
roughness, and RMS roughness. Peak-to-valley roughness (Rt) is a
measure of the difference in height between the highest point and
lowest point of a surface. Average roughness (Ra) is a measure of
the relative degree of coarse, ragged, pointed, or bristle-like
projections on a surface, and is defined as the average of the
absolute values of the differences between the peaks and their mean
line.
[0283] The master plate 2102 is preferably silicon, silicon
carbide, or silicon nitride, since wafer planarization
infrastructure is capable of achieving a roughness (Ra) of about
0.5 Angstroms. The fine finish requirements for the surface 2104
includes peak-to-peak short length waviness of about 10 nanometers
to about 40 nanometers, peak-to-peak long waviness of less than
about 5 microns, and surface finish quality with an Ra of 0.5
Angstroms. Planarization of silicon is disclosed in U.S. Pat. Nos.
6,135,856 (Tjaden et al.) and 6,194,317 (Kaisaki et al.) are hereby
incorporated by reference.
[0284] Once the master plate 2102 is machined, a hard coat 2106 is
preferably applied to protect the surface 2104. Surface 2107 of the
hard coat 2106 generally tracks the surface 2104 of the master
plate 2102. The desired thickness 2108 of the hard coat 2106 can be
in the range of about 100 nanometers or greater. In one embodiment,
the hard coat 2106 is diamond-like carbon ("DLC") with a thickness
2108 of about 100 nanometers to about 200 nanometers. DLC hardness
is preferably more than about 5 GPa to adequately protect the
surface 2104. It is highly desirable to generate DLC hardness in
the range of 70-90 GPa.
[0285] In one embodiment the DLC is applied by chemical vapor
deposition. As used herein, the term "chemically vapor deposited"
or "CVD" refers to materials deposited by vacuum deposition
processes, including, but not limited to, thermally activated
deposition from reactive gaseous precursor materials, as well as
plasma, microwave, DC, or RF plasma arc-jet deposition from gaseous
precursor materials. Various methods of applying a hard coat to a
substrate are disclosed in U.S. Pat. Nos. 6,821,189 (Coad et al.);
6,872,127 (Lin et al.); 7,367,875 (Slutz et al.); and 7,189,333
(Henderson), which are hereby incorporated by reference.
[0286] The next step is to apply a spacer layer 2110. The spacer
layer 2110 is preferably a low surface energy coating, such as for
example Teflon. The spacer layer 2110 acts as a spacer to set
height 2112 of particles 2114 protrude above reference surface 2116
on the abrasive article 2118 (see FIG. 76A). Consequently, by
varying the thickness 2112' of the spacer layer 2110, the height
2112 of the particles 2114 can be controlled.
[0287] In some embodiments, the thickness 2112' may be different
than the height 2112 of the particles 2114 to compensate for
deformation of the spacer layer 2110 during impregnation of the
substrate (see FIG. 75) and other manufacturing variability. As a
result, the thickness 2112' of the spacer layer 2110 corresponds to
the desired height the particles 2114 protrude above the reference
surface 2116, but there is not necessarily a one-to-one
correlation.
[0288] In one embodiment the spacer layer 2110 is a preformed sheet
bonded or adhered to the surface 2107 of the hard coat 2106. In
another embodiment, the spacer layer 2110 is sprayed or printed
onto the surface 2107, such as disclosed in U.S. Pat. No. 7,485,345
(Renn et al.) and U.S. Pat. Publication No. 2008/0008822 (Kowalski
et al.), which are hereby incorporated by reference.
[0289] As illustrated in FIG. 73 adhesive slurry 2120 of adhesive
2122 containing particles 2114 is distributed evenly over surface
2124 of the spacer layer 2110. Using a spacer layer 2110 made from
a low surface tension material aids in wetting the adhesive 2122.
Methods of uniformly dispersing nanometer size abrasive grains are
disclosed in U.S. Pat. Pub. No. 2007/0107317 (Takahagi et al.),
which is hereby incorporated by reference.
[0290] Particle of any composition and size can be used with the
method and apparatus of the present invention. The preferred
particles 2114 are diamonds with primary diameters less than about
1 micrometer, also referred to as nano-scale. For some
applications, however, the diamonds can have a primary diameter of
about 100 nanometers to about 20 micrometers.
[0291] Substrate 2126 illustrated in FIG. 74 is then pressed
against the adhesive slurry 2120. In the illustrated embodiment,
the substrate 2126 is a tin plate. Note that surface 2128 of the
substrate 2126 has some waviness, which will be covered by adhesive
2122 in the abrasive article 2118 according to the present
invention. The substrate 2126 can be manufactured from a variety of
metals, polymeric materials, ceramics, or composites thereof. The
substrate 2126 can also be flexible, rigid, or semi-rigid.
[0292] As illustrated in FIG. 75, the substrate 2126 is applied
with a sufficient force F to cause the particles 2114 to
substantially penetrate the spacer layer 2110, without substantial
penetration or indentations in the hard coat 2106. The particles
2114 are also embedded in surface 2128 of the substrate 2126. The
particles 2114 typically penetrate the relatively softer spacer
layer 2110 until they contact the hard coat 2106 before penetrating
the substrate 2126. The adhesive 2122 preferably fills gaps 2130
between the surface 2128 of the substrate 2126 and the surface 2124
of the spacer layer 2110. The adhesive 2122 also follows the
contour of the surface 2124 of the spacer layer 2110, as will be
discussed below.
[0293] The spacer layer 2110 permits the particles 2114 to contact
the surface 2107 of the hard coat 2106 and limits the amount of
penetration into the substrate 2126. Depending on the material
selected, the thickness of the spacer layer 2110 may be increased
to compensate for deformation during the impregnating step of FIG.
75.
[0294] The surface 2128 of the substrate 2126 preferably has a
flatness that is less than about the height of the particles 2114,
so the particles 2114 are sufficiently embedded in the surface
2128. If the particles 2114 are not sufficiently embedded into the
substrate 2126, the adhesive 2122 may be the primary mode of
attachment, leading to release during lapping.
[0295] FIG. 76A illustrates the abrasive article 2118, with the
sacrificial spacer layer 2110 removed in accordance with an
embodiment of the present invention. Using a spacer layer 2110 made
from a low surface tension material facilitates removal of the
master plate 2102. The at least partially cured adhesive 2122 forms
a reference surface 2116 from which height 2112 of the particles
2114 can be measured. The reference surface 2116 corresponds to the
shape of the surface 2124 of the spacer layer 2110.
[0296] The waviness of the surface 2128 on the substrate is not
reflected in the uniform height 2112 of the particles 2114 or the
reference surface 2116. The uniform distance 2112 between the peaks
2115 of the particles 2114 and the reference surface 2116 permits
formation of a substantially uniform hydrodynamic film relative to
the height 2112 of the particles 2114. As used herein,
"substantially uniformly" and "substantially flat" refers to both
an entire surface of a substrate or an abrasive article and to
selected portions of the substrate or abrasive article. For
example, localized uniformity or flatness may be sufficient for
some applications.
[0297] Various processes can be used to activate and/or cure the
adhesive 2122 to bond the diamonds 2114 to the substrate 2126 and
create the reference surface 2116, such as for example ultraviolet
or infrared RF energy, chemical reactions, heat, and the like. As
used herein, "cure" or "activate" refers to any chemical
transformation (e.g., reacting or cross-linking), physical
transformation (e.g., hardening or setting), and/or mechanical
transformation (e.g., drying or evaporating) that allows an
adhesive to change or progress from a first physical state
(generally liquid or flowable) into a more permanent second
physical state or form (generally solid).
[0298] FIG. 76B illustrates an alternate abrasive article 2118'
without an adhesive in accordance with an embodiment of the present
invention. The particles 2114 are embedded in the substrate 2126,
so an adhesive is not required. The peaks 2115 of the particles
2114 are substantially coplanar 2117. In embodiments where the
abrasive article is not planar, the peaks of the particles
correspond to the contour of the surface of the master plate. Any
of the embodiments disclosed herein can be created without the
adhesive in the slurry of particles.
[0299] The present methods provide a number of benefits over prior
art diamond charged lapping plates. The present abrasive article
2118 provides a uniform height 2112 of the diamonds 2114 ("dh")
with respect to a substantially flat reference surface 2116. There
is no need to condition the present abrasive article 2118.
Knowledge of the lapping conditions, lubricant type, and the lapped
bar can be used to calculate the hydrodynamic film thickness ("hf")
relative to the reference surface 2116 formed by the cured adhesive
2122. Once the hydrodynamic film thickness is known, the
interference ("I") can be calculated from the uniform height 2112
of the diamonds 2114 from the hydrodynamic film (I=dh-hf). The
substantially flat reference surface 2116 provides a generally
uniform hydrodynamic film, which translates into uniform forces at
the slider bar/abrasive article interface. Constant interference
(I) of the abrasive diamonds 2114 during the lapping process leads
to a notable reduction in occurring of scratches, a substantial
improvement in pole tip recession critical to the performance of
magnetic recording heads, and a substantial improvement in surface
roughness.
[0300] Note that the substrate 2126 has historically been a tin
plate because of ease of charging the diamonds 2114 and dressing
the plate. Since the height 2112 of the protruding diamonds 2114 is
controlled by the thickness of the spacer layer 2110, however,
other relatively harder materials are also good candidates for this
application, such as for example soft steels, copper, aluminum, and
the like.
[0301] While the application discussed above is lapping slider bars
for disk drives, for the present abrasive article 2118 has a wide
range of other industrial applications, such as for example lapping
semiconductor wafers and polishing metals.
[0302] FIG. 77 illustrates a fixture 2150 for manufacturing an
abrasive article 2152 with a structured substrate 2154 (see FIG.
79) in accordance with an embodiment of the present invention. The
desired structures 2156 are machined in the master plate 2158. The
structures 2156 can be linear, curvilinear, regular, irregular,
continuous, discontinuous, or a variety of other configurations.
Various structured substrates and adhesives suitable for use in the
present invention are disclosed in U.S. Pat. Nos. 6,194,317
(Kaisaki et al); 6,612,917 (Bruxvoort); 7,160,178 (Gagliardi et
al.); 7,404,756 (Ouderkirk et al.); and U.S. Publication No.
2008/0053000 (Palmgren et al.), which are hereby incorporated by
reference.
[0303] In the illustrated embodiment, the structures 2156 are a
series of grooves. The surfaces 2160 of the grooves 2156 can be
machined with a continuous curvilinear shape, a series of discrete
curvilinear or flat shapes with transition locations, or a
combination thereof. In the illustrated embodiment, the grooves
2156 include valleys 2160A, peaks 2160B, and side surfaces 2160C
(collectively "2160"). The peaks 2160B have substantially uniform
peak height 2168.
[0304] In the illustrated embodiment, the master plate 2158 is
machined with a hard ceramic material such as TiC or TiN. The hard
coat is optional and is not shown in the embodiment of FIG. 77.
Spacer layer 2162 is then deposited on the surface 2160 of the
grooved master plate 2158 with a thickness 2164 corresponding the
desired protruding height of particles 2166. An adhesive slurry
2170 including adhesive 2172 and particles 2166 is distributed
evenly over the grooved surface 2174 of the spacer layer 2162.
[0305] As illustrated in FIG. 78, the substrate 2154 with features
2182 generally corresponding to grooves 2156 is then pressed
against the adhesive slurry 2170 with a sufficient force to cause
the particles 2166 to substantially penetrate the spacer layer
2162, without substantial penetration into the master plate 2158.
The particles 2166 also penetrate into the substrate 2154,
primarily at peaks 2184.
[0306] The grooves 2182 in the substrate 2154 are preferably
fabricated with a peak height 2180 greater than peak height 2168 of
the grooves 2156 machined in the grooved master plate 2158. The
greater peak height 2180 on the substrate 2154 permits the
particles 2166 located along critical peaks 2184 to be firmly
embedded in the substrate 2154. Any inaccuracy in the machining of
the heights 2168, 2180 of the grooves 2156, 2182 is preferably
located in the non-critical valleys 2190 on the abrasive article
2152. Note that portion of the particles 2166' located in the
valleys 2190 are not embedded in the substrate 2154, but are
secured to the substrate 2154 by the adhesive 2172.
[0307] The spacer layer 2162 controls the depth of penetration of
the particles 2166 into the substrate 2154. The adhesive 2172 fills
any gaps 2192 between the surface 2186 of the substrate 2154 and
the surface 2174 of the spacer layer 2162. The flatness requirement
of the substrate 2154 is less than about the height of the
abrasives particles 2166 so as to be embedded a sufficient amount
in the surface 2186 of the substrate 2154.
[0308] FIG. 79 illustrates the abrasive article 2152, with the
sacrificial spacer layer 2162 removed. The at least partially cured
adhesive 2172 forms a substantially flat reference surface 2194
from which height 2196 of the particles 2166 can be measured. The
reference surface 2194 also provides a substantially uniform
hydrodynamic film relative to the height 2196 of the particles
2166.
[0309] The grooves 2198 in the abrasive article 2152 are designed
to promote lubricant transfer from inner diameter to outer diameter
under centrifugal forces to carry the wear by-products and reduce
the height of the hydrodynamic film to promote aggressive material
removal. Various geometrical features and arrangement of particles
on abrasive articles are disclosed in U.S. Pat. Nos. 4,821,461
(Holmstrand), 3,921,342 (Day), and 3,683,562 (Day), and U.S. Pat.
Pub. No. 2004/0072510 (Kinoshita et al), which are hereby
incorporated by reference.
[0310] The present method of manufacturing abrasive articles
includes preparing a master plate with a shape that is generally a
mirror image of the desired uniform height fixed abrasive article.
A hard coat is optionally applied protect the surface of the master
plate. A spacer layer is deposited on the master plate or hard
coat. Adhesive slurry containing adhesive and particles is
distributed evenly over surface of the spacer layer. A substrate
with a surface that is generally a mirror image of the master plate
is then pressed against the adhesive slurry to embed the particles
into the substrate. The spacer layer controls the penetration of
the particles into the substrate. The adhesive fills gaps between
the surface of the substrate and the surface of the spacer layer.
The substrate containing the embedded particles is separated from
the master plate and the sacrificial spacer layer is removed. The
at least partially cured adhesive forms a substantially flat
reference surface between the protruding particles.
[0311] It will be appreciated that the present method of
manufacturing abrasive articles can be used with a variety of
shaped substrates, such as for example concave surfaces, convex
surfaces, cylindrical surfaces, spherical surfaces, and the like.
The present method is not dependent on the size or composition of
the particles.
[0312] FIG. 80 is a side sectional view of a uniform height fixed
abrasive article 2250 with a convex surface 2252 in accordance with
an embodiment of the present invention. The convex surface 2252 can
be circular, curvilinear, and a variety of other regular and
irregular curved shapes. As with the embodiments discussed above,
adhesive 2254 provides a uniform reference surface 2256. The
particles 2258 extend a substantially uniform amount above the
reference surface 2256. The reference surface 2256 is also smooth
so as to promote a substantially uniform hydrodynamic film.
[0313] FIG. 81 is a side sectional view of a fixed abrasive article
2260 with a concave surface 2262 in accordance with an embodiment
of the present invention. The concave surface 2262 can be circular,
curvilinear, and a variety of other regular and irregular curved
shapes. As with the embodiments discussed above, adhesive 2264
provides a uniform reference surface 2266. The particles 2268
extend a substantially uniform amount above the reference surface
2266.
[0314] FIG. 82 is a top view of a fixed abrasive article 2270 with
a cylindrical surface 2272 and the associated master plates 2274 in
accordance with an embodiment of the present invention. The
particles 2276 extends a substantially uniform amount above the
reference surface 2278 created by the cured adhesive 2280.
[0315] The curved abrasive articles of FIGS. 80-82 are particularly
suited for polishing machined metal parts, such as for example
components for engines and transmissions, where a significant
reduction in friction will translate into greater fuel
efficiency.
[0316] FIG. 83 illustrates a fixed abrasive article 2300 in
accordance with any of the embodiments disclosed above, that uses
the two step adhesion process disclosed in U.S. Pat. Nos. 7,198,553
and 6,123,612, which are hereby incorporated by reference. The
particles 2304 are embedded in the substrate 2306 using sacrificial
layer 2308 as discussed herein. Elevated heat and pressure are
applied to a sintered powder matrix material and a brazing alloy
2302 to create a chemical bond between the particles 2304 and
surface 2314 of the substrate 2306. The sacrificial spacer 2308
(shown in phantom) is preferably a soft metal to avoid excessive
deformation during heating of the matrix 2302.
[0317] The matrix 2302 lacks the ability to fill the spaces 2310
between the sintered material 2302 and the spacer 2308. A low
viscosity curable material 2314, such as for example a thermo-set
adhesive, is optionally provided to fill the spaces 2310 and to
provide the reference surface 2312 between the particles 2304. The
curable material 2314 also acts as a corrosion barrier to protect
the sintered material 2302 from corrosion and other interaction in
chemical mechanical polishing applications. In an alternate
embodiment, the curable material 2314 is omitted.
[0318] Where a range of values is provided, it is understood that
each intervening value, to the tenth of the unit of the lower limit
unless the context clearly dictates otherwise, between the upper
and lower limit of that range and any other stated or intervening
value in that stated range is encompassed within the present
embodiments. The upper and lower limits of these smaller ranges
which may independently be included in the smaller ranges is also
encompassed within the disclosure, subject to any specifically
excluded limit in the stated range. Where the stated range includes
one or both of the limits, ranges excluding either both of those
included limits are also included in this disclosure.
[0319] Unless defined otherwise, all technical and scientific terms
used herein have the same meaning as commonly understood by one of
ordinary skill in the art to which these inventions belong.
Although any methods and materials similar or equivalent to those
described herein can also be used in the practice or testing of the
present inventions, the preferred methods and materials are now
described. All patents and publications mentioned herein, including
those cited in the Background of the application, are hereby
incorporated by reference to disclose and describe the methods
and/or materials in connection with which the publications are
cited.
[0320] The publications discussed herein are provided solely for
their disclosure prior to the filing date of the present
application. Nothing herein is to be construed as an admission that
the present inventions are not entitled to antedate such
publication by virtue of prior invention. Further, the dates of
publication provided may be different from the actual publication
dates which may need to be independently confirmed.
[0321] Other embodiments of the invention are possible. Although
the description above contains much specificity, these should not
be construed as limiting the scope of the invention, but as merely
providing illustrations of some of the presently preferred
embodiments of this invention. It is also contemplated that various
combinations or sub-combinations of the specific features and
aspects of the embodiments may be made and still fall within the
scope of the inventions. It should be understood that various
features and aspects of the disclosed embodiments can be combined
with or substituted for one another in order to form varying modes
of the disclosed inventions. Thus, it is intended that the scope of
at least some of the present inventions herein disclosed should not
be limited by the particular disclosed embodiments described
above.
[0322] Thus the scope of this invention should be determined by the
appended claims and their legal equivalents. Therefore, it will be
appreciated that the scope of the present invention fully
encompasses other embodiments which may become obvious to those
skilled in the art, and that the scope of the present invention is
accordingly to be limited by nothing other than the appended
claims, in which reference to an element in the singular is not
intended to mean "one and only one" unless explicitly so stated,
but rather "one or more." All structural, chemical, and functional
equivalents to the elements of the above-described preferred
embodiment that are known to those of ordinary skill in the art are
expressly incorporated herein by reference and are intended to be
encompassed by the present claims. Moreover, it is not necessary
for a device or method to address each and every problem sought to
be solved by the present invention, for it to be encompassed by the
present claims. Furthermore, no element, component, or method step
in the present disclosure is intended to be dedicated to the public
regardless of whether the element, component, or method step is
explicitly recited in the claims.
* * * * *