U.S. patent application number 13/206383 was filed with the patent office on 2013-02-14 for thin-type heat pipe structure.
This patent application is currently assigned to COOLER MASTER CO., LTD.. The applicant listed for this patent is Chang-Yin CHEN, Lei-Lei Liu. Invention is credited to Chang-Yin CHEN, Lei-Lei Liu.
Application Number | 20130037242 13/206383 |
Document ID | / |
Family ID | 47676787 |
Filed Date | 2013-02-14 |
United States Patent
Application |
20130037242 |
Kind Code |
A1 |
CHEN; Chang-Yin ; et
al. |
February 14, 2013 |
THIN-TYPE HEAT PIPE STRUCTURE
Abstract
A thin-type heat pipe structure includes a flat pipe, a second
capillary structure, a third capillary structure, and a working
fluid. The flat pipe has two boards and a containing chamber. A
first capillary structure is set on the inner surface of the
boards. The second capillary structure is contained in the
containing chamber and covers a part of the first capillary
structure. The third capillary structure is a stripe, contained in
the containing chamber and clipped between the second capillary
structure and another part of the first capillary structure. The
working fluid is filled in the containing chamber. The overall
design speeds up inner air's outflow and inner liquid's
backflow.
Inventors: |
CHEN; Chang-Yin; (New Taipei
City, TW) ; Liu; Lei-Lei; (Hui Zhou City,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CHEN; Chang-Yin
Liu; Lei-Lei |
New Taipei City
Hui Zhou City |
|
TW
CN |
|
|
Assignee: |
COOLER MASTER CO., LTD.
|
Family ID: |
47676787 |
Appl. No.: |
13/206383 |
Filed: |
August 9, 2011 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0233 20130101;
F28D 15/046 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. A thin-type heat pipe structure, comprising: a flat pipe, having
two boards corresponding to each other and a containing chamber
surrounded by the two boards, a first capillary structure being set
up on the inner surface of the boards; a second capillary
structure, contained inside the containing chamber and covering a
part of the first capillary structure; a third capillary structure,
being a stripe, contained inside the containing chamber and clipped
in between the second capillary structure and another part of the
first capillary structure; and a working fluid, filled in the
containing chamber.
2. The structure of claim 1, wherein the first capillary structure
is a plurality of furrows, a plurality of smooth surfaces, or a
combination of a plurality of furrows and a plurality of smooth
surfaces formed on the boards.
3. The structure of claim 1, wherein the second capillary structure
is a metal mesh.
4. The structure of claim 1, wherein the third capillary structure
is a sintered metal powder component or a fiber bundle.
5. The structure of claim 1, wherein the first capillary structure
is a plurality of furrows formed on the boards, the second
capillary structure is a metal mesh, and the density of the second
capillary structure is higher than the density of the first
capillary structure.
6. The structure of claim 5, wherein the third capillary structure
is a sintered metal powder component, and the density of the third
capillary structure is higher than the density of the second
capillary structure.
7. The structure of claim 1, wherein two sides of the third
capillary structure and the two boards surround two air
passages.
8. The structure of claim 1, wherein the flat pipe is formed
through pressing a round pipe.
9. A thin-type heat pipe structure, comprising: a flat pipe, having
two boards corresponding to each other and a containing chamber
formed between the two boards, the height of the two boards and the
containing chamber being below 1.5 millimeters, a first capillary
structure being set on the inner surface of the boards; a second
capillary structure, contained inside the containing chamber and
covering a part of the first capillary structure; a third capillary
structure, being a stripe, contained inside the containing chamber
and clipped in between the second capillary structure and another
part of the first capillary structure; and a working fluid, filled
in the containing chamber.
10. The structure of claim 9, wherein the first capillary structure
is a plurality of furrows, a plurality of smooth surfaces, or a
combination of a plurality of furrows and a plurality of smooth
surfaces, formed on the boards.
11. The structure of claim 9, wherein the second capillary
structure is a metal mesh.
12. The structure of claim 9, wherein the third capillary structure
is a sintered metal powder component or a fiber bundle.
13. The structure of claim 9, wherein the first capillary structure
is a plurality of furrows formed on the boards, the second
capillary structure is a metal mesh, and the density of the second
capillary structure is higher than the density of the first
capillary structure.
14. The structure of claim 13, wherein the third capillary
structure is a sintered metal powder component, and the density of
the third capillary structure is higher than the density of the
second capillary structure.
15. The structure of claim 9, wherein two sides of the third
capillary structure and the two boards surround two air
passages.
16. The structure of claim 9, wherein the flat pipe is formed
through pressing a round pipe.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present invention generally relates to a heat pipe, and
more particularly, to a thin-type heat pipe structure that is used
to guide heat generated by an electronic heat source.
[0003] 2. Related Art
[0004] The exacerbating problems caused by electronic heat sources
can be resolved by using heat pipes to conduct or dissipate heat
generated by electronic products. Replacing cooling structures
formed by cooling fins with heat pipes seems to be the future
development trend. However, because electronic products generally
have to be light, thin, short, and small, only a small space can be
provided to heat pipes. As a result, the industry desires to have
new heat pipe designs to resolve the problem.
[0005] A conventional heat pipe generally includes a round pipe, a
capillary structure, and a working fluid. Inside the round pipe
there is a containing chamber. The capillary structure is set
inside the containing chamber and stuck to the inner surface of the
pipe. The working fluid is filled in the containing chamber and
accumulated in the capillary structure. As a whole, these parts
form a conventional heat pipe structure.
[0006] However, conventional heat pipes are round and hence are not
suitable for electronic products that should be as thin as
possible. Furthermore, the capillary structure is a
single-configuration structure. If the density of the capillary
structure is high, the inner air will flow out swiftly when
receiving heat, causing the heat receiving area to dry out quickly.
If the density of the capillary structure is low, the heat pipe
will be inefficient in conducting heat, and resulting in some
problems that must be resolved.
BRIEF SUMMARY
[0007] The present invention provides a thin-type heat pipe
structure. By staking and arranging several capillary structures,
the present invention speeds up inner air's outflow and inner
liquid's backflow.
[0008] In one aspect, the thin-type heat pipe structure of the
present invention comprises a flat pipe, having two boards
corresponding to each other and a containing chamber surrounded by
the two boards, a first capillary structure being set up on the
inner surface of the boards; a second capillary structure,
contained inside the containing chamber and covering a part of the
first capillary structure; a third capillary structure, being a
stripe, contained inside the containing chamber and clipped in
between the second capillary structure and another part of the
first capillary structure; and a working fluid, filled in the
containing chamber.
[0009] In another aspect, the thin-type heat pipe structure of the
present invention comprises a flat pipe, having two boards
corresponding to each other and a containing chamber formed between
the two boards, the height of the two boards and the containing
chamber being below 1.5 millimeters, a first capillary structure
being set on the inner surface of the boards; a second capillary
structure, contained inside the containing chamber and covering a
part of the first capillary structure; a third capillary structure,
being a stripe, contained inside the containing chamber and clipped
in between the second capillary structure and another part of the
first capillary structure; and a working fluid, filled in the
containing chamber.
[0010] The present invention stakes capillary structures of
different densities and segments some air passages. A first
capillary structure has a low density and hence allows evaporated
air to flow out quickly. A second capillary structure has a medium
density and hence can accumulate inner liquid and prevent dry out.
The third capillary structure has a high density and hence can
facilitate inner air's flow. The third capillary structure further
accumulates much liquid to supply for the second capillary
structure's need. The staking of the capillary structures enhances
the overall capillary absorption force.
[0011] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory only and are not restrictive of the invention, as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 illustrates a thin-type heat pipe of the present
invention in a three-dimensional diagram;
[0013] FIG. 2 illustrates the thin-type heat pipe of the present
invention in a breakdown diagram;
[0014] FIG. 3 illustrates the thin-type heat pipe of the present
invention in combination; and
[0015] FIG. 4 illustrates the thin-type heat pipe of the present
invention in combination in a sectional diagram.
DETAILED DESCRIPTION
[0016] Please refer to FIG. 1 to FIG. 4. The present invention
provides a thin-type heat pipe structure. The thin-type heat pipe 1
mainly includes a flat pipe 10, a second capillary structure 20, a
third capillary structure 30, and a working fluid 40.
[0017] The flat pipe 10 is made up of materials with good heat
conductivity and good ductility, such as copper or copper alloy. It
is formed by pressing a round pipe and hence has a flat shape. In
this embodiment, the pipe 10 is a stripe formed by an upper board
11 and a lower board 12 that correspond to each other. Each of the
upper and lower boards 11 and 12 is formed by a lateral flat
section and a longitudinal curved section that extends from the
lateral flat section. As shown in FIG. 2, the lateral flat section
and the longitudinal curved section form a shape that is similar to
the letter `J,` and are sealed up on an end of the pipe 10 through
soldering. A hollow containing chamber 13 exists in between the
upper and lower boards 11 and 12. The overall height H1 between the
outer surface of the upper and lower boards 11 and 12 is less than
1.5 millimeters. On the inner surface of the upper and lower boards
11 and 12 there is a first capillary structure 14 that is circular
in shape. In this embodiment the first capillary structure 14
includes a plurality of furrows 141. These furrows 141 can speed up
air's outflow and liquid's backflow. Furthermore, the first
capillary structure 14 can also be made up of a plurality of smooth
surfaces, or a combination of a plurality of furrows and a
plurality of smooth surfaces, formed on the upper and lower boards
11 and 12.
[0018] The second capillary structure 20 is a mesh structure formed
by a plurality of metal lines. This mesh structure has single or
multiple layers. The directions of the metal lines can be parallel
and perpendicular to the direction of the third capillary structure
30, or be diagonal. This feature is not shown in the figures. The
mesh-shaped second capillary structure 20 is contained in the
containing chamber 13, and a face of the second capillary structure
20 covers the underneath first capillary structure 14. The second
capillary structure 20 provides internal liquid accumulation to
avoid the dry out situation. Furthermore, the interior of the
second capillary structure 20 has a plurality of holes. The
interval between these holes is smaller than the interval between
the furrows 141 of the first capillary structure 14. As a result,
the density of the second capillary structure 20 is higher than
that of the first capillary structure 14.
[0019] The third capillary structure 30 is a rectangular stripe. It
is a component formed by sintered metal powder. In this embodiment
there are two stripes of third capillary structures 30. In another
embodiment, there can be only one or multiple third capillary
structures 30. The third capillary structures 30 are contained in
the containing chamber 13, and clipped between another face of the
second capillary structure 20 and the above first capillary
structure 14. As shown in
[0020] FIG. 4, the two sides of the two third capillary structures
30 and the upper and lower boards 11 and 12 surrounds three air
passages 50. Furthermore, the interior of the third capillary
structures 30 also has a plurality of pores. The interval between
these pores is smaller than the interval between the holes of the
second capillary structure 20. As a result, the density of the
third capillary structure 30 is higher than the density of the
second capillary structure 20. This allows the third capillary
structures 30 to form a plurality of air-guiding bags. For the same
reason, the third capillary structures 30 can be other kind of
capillary, such as a fiber bundle.
[0021] The working fluid 40, as shown in FIG. 4 can be pure water
or other kind of liquid. It is filled into the interior of the
containing chamber 13. Under room temperature the working fluid 40
is in its liquid form and be absorbed by the capillary structures
14, 20, and 30. After receiving heat, some or all of the working
fluid 40 will evaporate and become air, which will then bring out a
lot of heat towards a low temperature area in the containing
chamber 13.
[0022] The above description is given by way of example, and not
limitation. Given the above disclosure, one skilled in the art
could devise variations that are within the scope and spirit of the
invention disclosed herein, including configurations ways of the
recessed portions and materials and/or designs of the attaching
structures. Further, the various features of the embodiments
disclosed herein can be used alone, or in varying combinations with
each other and are not intended to be limited to the specific
combination described herein. Thus, the scope of the claims is not
to be limited by the illustrated embodiments.
* * * * *