U.S. patent application number 13/478328 was filed with the patent office on 2013-02-07 for thermal solution with spring-loaded interface.
The applicant listed for this patent is Russell W. Aldridge, Richard G. Baldwin, JR., Nathan G. Coon, Jeremy P. O'Rarden, Dennis Vance Toth. Invention is credited to Russell W. Aldridge, Richard G. Baldwin, JR., Nathan G. Coon, Jeremy P. O'Rarden, Dennis Vance Toth.
Application Number | 20130032324 13/478328 |
Document ID | / |
Family ID | 47626205 |
Filed Date | 2013-02-07 |
United States Patent
Application |
20130032324 |
Kind Code |
A1 |
Aldridge; Russell W. ; et
al. |
February 7, 2013 |
THERMAL SOLUTION WITH SPRING-LOADED INTERFACE
Abstract
Thermal solution systems including a heat sink and a spreader
plate mounted to the heat sink via one or more springs. Thermal gap
filler provides a thermal interface between the heat sink and the
spreader plate. The one or more springs provide contact force
between the heat spreader plate and a component to be cooled, while
accommodating dimensional variation, such as manufacturing
tolerance or assembly tolerance related variation.
Inventors: |
Aldridge; Russell W.;
(Austin, TX) ; Baldwin, JR.; Richard G.; (Austin,
TX) ; O'Rarden; Jeremy P.; (Cedar Park, TX) ;
Coon; Nathan G.; (Georgetown, TX) ; Toth; Dennis
Vance; (Austin, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Aldridge; Russell W.
Baldwin, JR.; Richard G.
O'Rarden; Jeremy P.
Coon; Nathan G.
Toth; Dennis Vance |
Austin
Austin
Cedar Park
Georgetown
Austin |
TX
TX
TX
TX
TX |
US
US
US
US
US |
|
|
Family ID: |
47626205 |
Appl. No.: |
13/478328 |
Filed: |
May 23, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61514610 |
Aug 3, 2011 |
|
|
|
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H01L 23/42 20130101;
H01L 23/4338 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; F28F 3/02 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. An apparatus, comprising: a heat sink; a heat spreader plate
mounted to the heat sink using one or more springs; and a first
thermally conductive filler material disposed between the heat sink
and the heat spreader plate; wherein the apparatus is configured to
transfer heat from a component to be cooled, wherein transferring
the heat includes interfacing with the component to be cooled via
the heat spreader plate, and wherein the interfacing includes the
heat spreader plate receiving force via the component to be cooled,
wherein the received force causes compression of the one or more
springs.
2. The apparatus of claim 1, wherein the receiving the force from
the component includes receiving the force from the component via a
second thermally conductive filler material disposed between the
component and the heat spreader plate.
3. The apparatus of claim 2, wherein the second thermally
conductive filler material includes a thermal gap pad.
4. The apparatus of claim 1, wherein the first thermally conductive
filler material includes a thermally conductive liquid gap filling
material.
5. The apparatus of claim 1, wherein the first thermally conductive
filler material includes a thermal gap pad.
6. The apparatus of claim 1, wherein the one or more springs
includes a wave spring.
7. The apparatus of claim 6, wherein the wave spring has an inner
circumference and an outer circumference, and wherein the first
thermally conductive filler material disposed between the heat sink
and the heat spreader plate is disposed within the inner
circumference of the wave spring.
8. The apparatus of claim 1, wherein the one or more springs
includes one or more coil springs.
9. The apparatus of claim 1, wherein the one or more springs
includes one or more leaf springs.
10. A thermal solution device, comprising: a main body; an
interface plate; one or more springs mounting the interface plate
to the main body; and a thermally conductive filler material
disposed between the main body and the interface plate; wherein the
thermal solution device is configured to transfer heat from a
component to be cooled by interfacing, using the interface plate,
with the component to be cooled, and wherein the interfacing causes
compression of the one or more springs.
11. The thermal solution device of claim 10, wherein the thermally
conductive filler material includes a thermal gap pad.
12. The thermal solution device of claim 10, wherein the thermally
conductive filler material includes a thermally conductive liquid
gap filling material.
13. The thermal solution device of claim 10, wherein the one or
more springs includes a wave spring.
14. The thermal solution device of claim 10, further comprising: an
additional thermally conductive filler material disposed between
the component and the heat spreader plate.
15. The thermal solution device of claim 14, wherein the additional
thermally conductive filler material includes a thermal gap
pad.
16. A thermal solution device, comprising: a heat sink; a plurality
of heat spreader plates mounted to the heat sink respectively using
one or more springs; and one or more thermally conductive filler
materials disposed between the heat sink and individual ones of the
plurality of heat spreader plates; wherein the thermal solution
device is configured to mount to a system that includes a plurality
of components to be cooled, wherein mounting to the system causes
the individual ones of the plurality of heat spreader plates to
respectively interface with individual ones of the plurality of
component to be cooled.
17. The thermal solution device of claim 16, wherein the
interfacing includes the individual ones of the plurality of heat
spreader plates respectively receiving pressure from the individual
ones of the plurality of components to be cooled to cause
compression of the respective one or more springs.
18. The thermal solution device of claim 17, wherein the individual
ones of the plurality of components to be cooled include a
processor.
19. The thermal solution device of claim 17, wherein the individual
ones of the plurality of components to be cooled include a printed
circuit board.
20. The thermal solution device of claim 19, wherein a particular
one of the plurality of heat spreader plates is configured to
interface with a first side of the printed circuit board; wherein
the first side is opposite of a second side of the printed circuit
board, the second side having a processor mounted thereon; and
wherein the particular one of the plurality of heat spreader plates
is configured to remove heat generated by the processor.
Description
[0001] This application claims benefit of priority to U.S.
Provisional Patent Application No. 61/514,610, filed Aug. 3, 2011.
The preceding provisional application is incorporated herein by
reference in its entirety.
BACKGROUND
[0002] 1. Technical Field
[0003] This disclosure relates to the field of thermal solutions,
and more particularly to heat sinks for use in cooling high energy
density, thermally sensitive components.
[0004] 2. Description of the Related Art
[0005] Heat sinks may be used for cooling thermally-sensitive, high
energy density components by providing a means for transferring
generated heat away from those components. Examples of high energy
density components include processors, chipsets, and
field-programmable-gate-arrays (FPGAs).
[0006] A thermal solution system may include a gap pad disposed
between a heat sink and a heat-generating component to facilitate
heat transfer between the heat-generating component and the heat
sink. Reducing the thickness of the gap pad, and/or increasing
compression that the gap pad experiences may reduce the thermal
resistance within the thermal solution system.
[0007] High energy density components may be connected to printed
circuit boards (PCBs) using solder connections. Applying excessive
pressures to such PCB-mounted components (e.g., to compress a gap
pad disposed between a heat sink and a PCB-mounted component) may
damage the PCB and/or the solder joints used to mount the component
to the PCB.
SUMMARY
[0008] Various embodiments of a thermal solution are presented
below.
[0009] In one embodiment, an apparatus may include a heat sink,
heat sink spreader plate, and a first thermally conductive filler
material. The heat spreader plate may be mounted to the heat sink
using one or more springs, and the first thermally conductive
filler material may be disposed between the heat sink and the heat
spreader plate. Some embodiments of the apparatus may be configured
to transfer heat from a component to be cooled, where transferring
the heat includes interfacing with the component to be cooled via
the heat spreader plate, and where the interfacing includes the
heat spreader plate receiving force via the component to be cooled,
where the received force causes compression of the one or more
springs.
[0010] In some embodiments, receiving the force from the component
includes receiving the force from the component via a second
thermally conductive filler material that is disposed between the
component and the heat spreader plate. Various embodiments may have
a second thermally conductive filler material that includes a
thermal gap pad.
[0011] Particular embodiments of the present disclosure may include
a first thermally conductive filler material that includes a
thermally conductive liquid gap filling material. In other
exemplary embodiments, the first thermally conductive filler
material may include a thermal gap pad.
[0012] In some embodiments, the one or more springs may include one
or more wave springs. In various embodiments, the one or more the
wave springs may have an inner circumference and an outer
circumference, and the first thermally conductive filler material
may be disposed between the heat sink and the heat spreader plate,
within the inner circumferences of the one or more wave
springs.
[0013] In some embodiments, the one or more springs may include one
or more coil springs. Some embodiments may include one or more leaf
springs as part of the one or more springs.
[0014] In one embodiment, a thermal solution device may include a
main body, an interface plate, one or more springs mounting the
interface plate to the main body, and a thermally conductive filler
material disposed between the main body and the interface plate. In
some cases, the thermal solution device may be configured to
transfer heat from a component to be cooled by interfacing, using
the interface plate, with the component to be cooled. Such
interfacing may cause compression of the one or more springs.
[0015] One embodiment of a thermal solution device may include a
heat sink, a plurality of heat spreader plates mounted to the heat
sink respectively using one or more springs, one or more thermally
conductive filler materials disposed between the heat sink and
individual ones of the plurality of heat spreader plates. In some
cases, the thermal solution device may be configured to mount to a
system that includes a plurality of components to be cooled.
Mounting to the system may cause the individual ones of the
plurality of heat spreader plates to respectively interface with
individual ones of the plurality of component to be cooled.
[0016] In some embodiments, the interfacing may include individual
ones of the plurality of heat spreader plates respectively
receiving pressure from the individual ones of the plurality of
components to be cooled. Such receiving of pressure may cause
compression of the respective one or more springs.
[0017] In various embodiments, the individual ones of the plurality
of components to be cooled may include a processor. In some
embodiments, the individual ones of the plurality of components to
be cooled include a printed circuit board.
[0018] Some embodiments of the present disclosure may include a
particular one of the plurality of heat spreader plates that is
configured to remove heat generated by processors by interfacing
with a first side of the printed circuit board. The first side may
be opposite of a second side of the printed circuit board, where
the second side may have the processor mounted thereon.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The following detailed description makes reference to the
accompanying drawings, which are now briefly described.
[0020] FIG. 1 illustrates one embodiment of the present disclosure.
In the depicted embodiment, a spring-mounted heat spreader plate is
used in providing an interface between a heat sink and a component
to be cooled. The depicted heat sink includes fins for dissipating
heat.
[0021] FIG. 2 illustrates an exemplary embodiment of the present
thermal solution. In the depicted embodiment, an interface between
a heat sink and a component to be cooled is implemented using a
plurality of springs and shoulder screws. As shown, a system back
panel may be used as a heat sink for dissipating heat.
[0022] FIG. 3 depicts an embodiment of the present disclosure in
which a wave spring is used in mounting a heat spreader plate. The
heat spreader plate is used in providing an interface between a
heat sink and a processor.
[0023] FIG. 4 illustrates the heat spreader plate, wave spring, and
heat sink of the embodiment depicted in FIG. 3. Components to be
cooled (e.g., processor, PCB) are not depicted in this figure.
[0024] FIG. 5 shows a thermal solution that includes several heat
spreader plates that may be used for providing interfaces between
one heat sink and several components to be cooled.
[0025] FIG. 6 illustrates an exemplary embodiment in which a heat
spreader plate includes features that may interface with a PCB, as
well as with a processor mounted on the PCB.
[0026] FIG. 7 depicts one embodiment of the present disclosure
configured such that the heat spreader plate may interface with a
printed circuit board having a processor (or other heat-generating
component) mounted on an opposite side of the PCB. Such
configurations may be useful in cases where it is not feasible to
interface directly to the heat-generating component.
[0027] Specific embodiments are shown by way of example in the
drawings, and will be described herein in detail. It should be
understood, however, that the drawings and detailed description are
not intended to limit the claims to the particular embodiments
disclosed, even where only a single embodiment is described with
respect to a particular feature. On the contrary, the intention is
to cover all modifications, equivalents and alternatives that would
be apparent to a person skilled in the art having the benefit of
this disclosure. Examples of features provided in the disclosure
are intended to be illustrative rather than restrictive unless
stated otherwise.
[0028] The headings used herein are for organizational purposes
only and are not meant to be used to limit the scope of the
description. As used throughout this application, the word "may" is
used in a permissive sense (i.e., meaning having the potential to),
rather than the mandatory sense (i.e., meaning must). The words
"include," "including," and "includes" indicate open-ended
relationships and therefore mean including, but not limited to.
Similarly, the words "have," "having," and "has" also indicated
open-ended relationships, and thus mean having, but not limited to.
The terms "first," "second," "third," and so forth as used herein
are used as labels for nouns that they precede, and do not imply
any type of ordering (e.g., spatial, temporal, logical, etc.)
unless such an ordering is otherwise explicitly indicated. For
example, a "third heat spreader plate" receiving force does not
preclude scenarios in which a "fourth heat spreader plate" receives
force prior to, or simultaneously to, the third heat spreader
plate, unless otherwise specified. Similarly, a "second" feature
does not require that a "first" feature be implemented prior to the
"second" feature, unless otherwise specified.
[0029] Various components may be described as "configured to"
perform a task or tasks. In such contexts, "configured to" is a
broad recitation generally meaning "having structure that" performs
the task or tasks during operation. As such, the component can be
configured to perform the task even when the component is not
currently performing that task (e.g., a spring may be configured to
compress due to received force, even when that force is not being
received). In some contexts, "configured to" may be a broad
recitation of structure generally meaning "having circuitry that"
performs the task or tasks during operation. As such, the component
can be configured to perform the task even when the component is
not currently on. In general, the circuitry that forms the
structure corresponding to "configured to" may include hardware
circuits.
[0030] Various components may be described as performing a task or
tasks, for convenience in the description. Such descriptions should
be interpreted as including the phrase "configured to." Reciting a
component that is configured to perform one or more tasks is
expressly intended not to invoke 35 U.S.C. .sctn.112, paragraph
six, interpretation for that component.
[0031] The scope of the present disclosure includes any feature or
combination of features disclosed herein (either explicitly or
implicitly), or any generalization thereof, whether or not it
mitigates any or all of the problems addressed herein. Accordingly,
new claims may be formulated during prosecution of this application
(or an application claiming priority thereto) to any such
combination of features. In particular, with reference to the
appended claims, features from dependent claims may be combined
with those of the independent claims and features from respective
independent claims may be combined in any appropriate manner and
not merely in the specific combinations enumerated in the appended
claims.
DETAILED DESCRIPTION OF EMBODIMENTS
[0032] This specification includes references to "one embodiment"
or "an embodiment." The appearances of the phrases "in one
embodiment" or "in an embodiment" do not necessarily refer to the
same embodiment. Particular features, structures, or
characteristics may be combined in any suitable manner consistent
with this disclosure.
[0033] Turning to FIGS. 1-7, some embodiments of the present
disclosure may include heat spreader plate 130 that may be mounted
to heat sink 110 using one or more springs. The one or more springs
(spring 120) may in some cases include a wave spring (see FIGS.
3-5). In some embodiments, the one or more springs may additionally
or alternately include other types of springs, or combinations of
springs (e.g. coil springs, leaf springs, cantilever springs, foam,
formed sheet metal structures, molded plastic structures). As
illustrated in FIG. 2, in some cases, spring 120 may be configured
to be disposed over fastener 125 that couples heat spreader plate
130 to heat sink 110 (which in the depicted embodiment is a back
panel). In various embodiments, spring 120 may include any
structure and/or material that outputs force in response to
compression and/or elongation.
[0034] Spring 120 may serve to apply force against heat spreader
plate 130, holding heat spreader plate 130 against component to be
cooled 210 (e.g., CPU, GPU, FPGA, portion of PCB) at an optimal
minimum bond line thickness, between heat spreader plate 130 and
the component 210, for thermally conductive filler material
150.
[0035] Thermally-conductive gap filler material 140 may in some
cases be used between heat sink 110 and heat spreader plate 130 to
provide desirable thermal conductivity, while providing for
adjustment in location of heat spreader plate 130 relative to heat
sink 110 and/or relative to component 210 (e.g., via variation in
compression of spring 120). Such adjustability in the heat spreader
plate location may accommodate dimensional variations, such as
variations resulting from manufacturing tolerance and/or assembly
tolerance stack up.
[0036] In some embodiments, a thermally conductive liquid-dispensed
gap filling material may be used as the gap filler material 140
between heat sink 110 and heat spreader plate 130. In some
embodiments, high thermal performance liquid-dispensed gap filling
materials that cure to a low modulus elastomer may be used as gap
filler material 140. In some embodiments, a thermal gap filler that
includes a silicone gel may be used as gap filler material 140. In
various embodiments, a high thermal-performance gap-filling pad or
putty may be used as gap filler material 140.
[0037] For example, a particular embodiment may include gap filler
material 140 comprising and/or formed from a thermally-conductive
liquid gap filler having a relatively low viscosity (100,000 to
200,000 cps) prior to curing. Subsequent to curing, a compliant
material may be formed for gap filler material 140 that is similar
to typical gap pad, but having a higher thermal conductivity. Such
a liquid gap filler that flows during assembly may provide for
desirable thermal conductivity, while avoiding excessive contact
force on the component 210's die, and/or strain in surrounding and
supporting structures, such as a printed circuit board (PCB 220).
Once cured, the compliant thermal material in this embodiment of
gap filler material 140 may in some cases further act as a damper
to restrain movement of heat spreader plate 130 during possible
vibration on the system.
[0038] A same or different thermally-conductive filler material may
be used as filler 150 between heat spreader plate 130 and the
component to be cooled 210 (e.g., at a side or surface of heat
spreader plate 130 that is opposite of heat sink 110) in various
embodiments of the present disclosure. For example, filler 150 may
include thermal grease or phase change materials to improve the
thermal interface between heat spreader plate 130 and component
210. In some embodiments, filler 150 may include a thermal gap pad,
epoxy, or liquid gap filler. In particular embodiments, various
thermally-conductive materials that may be implemented with a thin
bond line may be well-suited for use as, or as part of, filler
150.
[0039] In some embodiments, the one or more springs (spring 120)
may be selected or designed to provide sufficient contact force to
maintain heat spreader plate 130 in contact with component 210 at
design shock levels, without exceeding maximum allowable forces
applied to component 210 (e.g., forces at the component's die or
solder joints).
[0040] The heat spreader plate 130 may be fabricated using various
materials that are suitable for providing thermal conductivity
(e.g., aluminum, copper). In some embodiments, heat spreader plate
130 may include various thermal solution features, such as, for
example, integrated heat pipe, vapor chamber, etc. Some embodiments
may include heat spreader plates 130 that are configured to
interface with printed circuit board (e.g., PCB 220) for purposes
of cooling an area of the printed circuit board that is near a
heat-generating component, or other component to be cooled. For
example, FIG. 7 depicts an embodiment in which heat spreader plate
130 interfaces with PCB 220 via filler 150, thereby removing heat
from PCB 220 in an area that may otherwise experience elevated
temperatures due to heat generated by component 210 (e.g., a
processor) that is mounted on the opposite side of PCB 220 from
heat spreader plate 130. Particular embodiments may also include
heat spreader plates 130 that are configured to interface with a
system board to provide proper orientation (e.g., gap spacing) with
respect to a component 210 (e.g., CPU, GPU) mounted on the system
board. See FIG. 6.
[0041] The heat sink 110 may also be fabricated using various
materials that are suitable for providing thermal conductivity
(e.g., aluminum, copper). The heat sink material may in some
instances be the same as the heat spreader plate material. In other
cases, the heat sink 110 and the heat spreader plate 130 may be of
differing materials. Various embodiments of heat sink 110 may
include various thermal solution features, such as, for example,
fins, integrated heat pipe, vapor chamber, water cooling, etc.
[0042] Various embodiments of the present disclosure may include a
heat sink 110 configured with a plurality of heat spreader plates
130 for interfacing with a plurality of components to be cooled.
Such an embodiment may provide a single thermal solution for a
plurality of components that are mounted on a single board or
system, without requiring individual mounting locations on the
board or system corresponding to each component to be cooled. For
example, a system board may have heat-generating components
including a CPU, GPU, and FPGA that each require cooling. In the
exemplary system, compact design requirements may preclude
providing mounting locations (e.g., locations for screws, clips, or
standoffs) at the system board near the three components, thereby
preventing the mounting of individual heat sinks to each of the
three components and applying contact force to each. Various ones
of the present embodiments may include a single, common heat sink
110 that mounts to the system board, and that also interfaces and
provides contact force to each of the three components. In such a
way, the need for individual heat sink mounting locations near the
components to be cooled may be removed in favor of common heat sink
mounting locations that may be located distant from the particular
components to be cooled. For example, FIG. 5 depicts fastener
locations 510 at the periphery of heat sink 110. These fastener
locations 510 may be used to mount heat sink 110 to a system board
or other structure, at locations that are relatively distant to the
locations of the components to be cooled. In the depicted
embodiments, heat spreader plates 130 may be mounted to heat sink
110 using fasteners 125 at fastener locations 520, which are
relatively near to the components to be cooled.
[0043] FIG. 5 further illustrates an embodiment that includes
springs 120 that are wave springs disposed between the heat
spreader plates and the heat sink. As depicted, a single wave
spring may correspond to the size of the heat spreader plate, and
gap filler material 140 may be disposed within an inner
circumference of the wave spring 120. Gap filler material 140 may
in some cases also be disposed exterior to an outer circumference
of the wave spring 120 (e.g., between wave spring 120 and features
corresponding to a profile for the heat spreader plate). For
example, FIGS. 3 and 4 illustrate embodiments in which heat sink
110 includes locating and retaining features, where gap filler
material 140 is disposed within an inner circumference of wave
spring 120, as well as outside of the outer circumference of wave
spring 120. Other embodiments may include springs 120 comprising
more than one wave spring, or one or more other types of springs,
with gap filler material 140 appropriately disposed to provide
thermal conductivity between the heat sink 110 and the spreader
plate(s) 130.
[0044] Although the embodiments above have been described in
considerable detail, numerous variations and modifications will
become apparent to those skilled in the art once the above
disclosure is fully appreciated. It is intended that the following
claims be interpreted to embrace all such variations and
modifications.
* * * * *