U.S. patent application number 13/272238 was filed with the patent office on 2013-02-07 for cooling system for electronic device.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is Chun-Ming CHEN, Tsung-Han SU. Invention is credited to Chun-Ming CHEN, Tsung-Han SU.
Application Number | 20130031924 13/272238 |
Document ID | / |
Family ID | 47626065 |
Filed Date | 2013-02-07 |
United States Patent
Application |
20130031924 |
Kind Code |
A1 |
SU; Tsung-Han ; et
al. |
February 7, 2013 |
COOLING SYSTEM FOR ELECTRONIC DEVICE
Abstract
A cooling system for cooling an electronic device includes a
first heat exchanger, a second heat exchanger, a first refrigerant
pipe, a second refrigerant pipe, and a pump. The first and second
refrigerant pipes receive refrigerants, which can circulate in the
first and second heat exchangers. The first heat exchanger is
arranged in the electronic device for cooling the electronic
device. The second heat exchanger cools the refrigerants by
gasifying liquefied gas. The pump circulates the refrigerants. The
third heat exchanger heats the liquefied gas with sea water before
the liquefied gas enters the second heat exchanger.
Inventors: |
SU; Tsung-Han; (Tu-Cheng,
TW) ; CHEN; Chun-Ming; (Tu-Cheng, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SU; Tsung-Han
CHEN; Chun-Ming |
Tu-Cheng
Tu-Cheng |
|
TW
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
47626065 |
Appl. No.: |
13/272238 |
Filed: |
October 13, 2011 |
Current U.S.
Class: |
62/259.2 |
Current CPC
Class: |
H05K 7/2079
20130101 |
Class at
Publication: |
62/259.2 |
International
Class: |
F25D 31/00 20060101
F25D031/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 1, 2011 |
TW |
100127283 |
Claims
1. A cooling system for an electronic device, the cooling system
comprising: a first heat exchanger for being arranged in the
electronic device for cooling the electronic device; a second heat
exchanger; a third heat exchanger; a pump connected to the second
heat exchanger; a first refrigerant pipe connected between the
first heat exchanger and the pump; and a second refrigerant pipe
connected between the first heat exchanger and the second heat
exchanger; wherein the first heat exchanger, the second refrigerant
pipe, the second heat exchanger, the pump, and the first
refrigerant pipe together form a circulatory system and circulates
refrigerants; wherein the first refrigerant pipe transfers
refrigerants cooled by the second heat exchanger into the first
heat exchanger, to cool the first heat exchanger; wherein the
second refrigerant pipe transfers refrigerants heated by the first
heat exchanger into the second heat exchanger; wherein the pump
circulates refrigerants; wherein the second heat exchanger cools
the refrigerants flowing through the second heat exchanger through
gasification of liquefied gas; and wherein the third heat exchanger
heats the liquefied gas with sea water before the liquefied gas
enters the second heat exchanger.
2. The cooling system of claim 1, wherein the liquefied gas is
liquefied natural gas.
3. The cooling system of claim 1, wherein the liquefied gas is
liquid nitrogen.
4. The cooling system of claim 1, wherein the second heat exchanger
receives heat medium for transferring heat of the heated
refrigerants to the liquefied gas.
5. The cooling system of claim 4, wherein the heat medium is
antifreeze.
6. The cooling system of claim 1, wherein the second heat exchanger
is a shell and tube heat exchanger or a plate heat exchanger.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] Relevant subject matter is disclosed in a pending U.S.
patent application with application Ser. No. 13/235450 (Docket No.
US41037), filed on Sep. 18, 2011 and entitled "COOLING SYSTEM FOR
ELECTRONIC DEVICE", which is assigned to the same assignee as this
patent application.
BACKGROUND
[0002] 1. Technical Field
[0003] The present disclosure relates to cooling systems, and
particularly, to a cooling system for an electronic device.
[0004] 2. Description of Related Art
[0005] With increasing heavy use of on-line applications, the need
for computer data centers has increased rapidly. Data centers are
centralized computing facilities that include many servers, often
arranged on server racks or shelves, and one rack or shelf with
several servers can be considered a server system. During
operation, server systems generate a lot of heat in the data
centers, and a common method for dissipating the heat is to use air
conditioners, which is waste of energy. Therefore an energy-saving
cooling system is needed.
BRIEF DESCRIPTION OF THE DRAWING
[0006] Many aspects of the present embodiments can be better
understood with reference to the following drawing. The components
in the drawing are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawing, like reference
numerals designate corresponding parts throughout the several
views.
[0007] The figure is a schematic block diagram of a cooling system
of an electronic device, according to an exemplary embodiment.
DETAILED DESCRIPTION
[0008] The disclosure, including the accompanying drawing, is
illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0009] Referring to the figure, an embodiment of a cooling system
is provided for cooling an electronic device 10. The cooling system
includes a first heat exchanger 20, a second heat exchanger 50, a
first refrigerant pipe 30, a second refrigerant pipe 40, a pump 31,
and a third heat exchanger 60. The first heat exchanger 20, the
second refrigerant pipe 40, the second heat exchanger 50, the pump
31, and the first refrigerant pipe 30 are connected in that order
to form a circulation system and circulates refrigerants. The first
and second refrigerant pipes 30 and 40 receive refrigerants, which
can circulate in the first and second heat exchangers 20 and
50.
[0010] The electronic device 10 may be a container data center,
which can generate a lot of heat.
[0011] The first heat exchanger 20 is arranged in the electronic
device 10 for cooling the electronic device 10.
[0012] The second heat exchanger 50 is used for cooling the
refrigerants flowing through the second heat exchanger 50 by
gasifying the liquefied gas 51.
[0013] The first refrigerant pipe 30 is connected between the first
heat exchanger 20 and the second heat exchanger 50, for
transferring the refrigerants cooled by the second heat exchanger
50 to the first heat exchanger 20, to cool the first heat exchanger
20.
[0014] The second refrigerant pipe 40 is connected between the
first heat exchanger 20 and the second heat exchanger 50, for
transferring the refrigerants heated by the first heat exchanger 20
to the second heat exchanger 50.
[0015] The pump 31 is arranged between the first refrigerant pipe
30 and the second heat exchanger 50, for circulating the
refrigerants. In this embodiment, the pump 31 is used for
transferring the refrigerants cooled by the second heat exchanger
50 to the first refrigerant pipe 30. In another embodiment, the
pump 31 can be arranged between the second refrigerant pipe 40 and
the second heat exchanger 50, or another pump can be arranged
between the second refrigerant pipe 40 and the second heat
exchanger 50.
[0016] In this embodiment, the liquefied gas 51 is liquefied
natural gas (LNG). Commonly, LNG is heated through sea water to a
gaseous state for convenience of use or to be higher temperature
LNG. The heated gas is still cool, which can be used for cooling
the electronic device 10. In this embodiment, the liquefied gas 51
is heated in the third heat exchanger 60 by sea water. In another
embodiment, the liquefied gas 51 may be liquid nitrogen (LN).
[0017] The second heat exchanger 50 receives heat medium, which is
used for cooling the refrigerants flowing through the second heat
exchanger 50. The liquefied gas 51 cools the heat medium, and then
is exhausted through a gas outlet 53. In this embodiment, the heat
medium is antifreeze composed of at least one of alcohol, glycol,
propylene glycol, and glycerol.
[0018] Sea water flows into the third heat exchanger 60 to heat the
liquefied gas 51 to avoid the temperature of the heated liquefied
gas 51 being too cold to impede circulating the heat medium in the
second heat exchanger 50. The third heat exchanger 60 is connected
to a sea water inlet 61 and a sea water outlet 63. Sea water flows
into the third heat exchanger 60 through the sea water inlet 61 to
heat the liquefied gas 51. The cooled sea water is then flowed out
through the sea water outlet 63.
[0019] In other embodiments, if the liquefied gas 51 is heated to a
gaseous state through the third heat exchanger 60, the second heat
exchanger 50 does not need to receive heat medium. The second heat
exchanger 50 may be a shell and tube heat exchanger or a plate heat
exchanger.
[0020] In this embodiment, the cooling system cools the electronic
device 10 by the refrigerant circulated in first heat exchanger 20,
the third heat exchanger 60 heats the liquefied gas 51 with sea
water, the second heat exchanger 50 cools refrigerants with the
liquefied gas 51. In other words, the liquefied gas 51 heated by
the sea water is heated by the heat of the electronic device 10,
which saves energy.
[0021] Even though numerous characteristics and advantages of the
embodiments have been set forth in the foregoing description,
together with details of the structure and function of the
embodiments, the disclosure is illustrative only, and changes may
be made in detail, especially in the matters of shape, size, and
arrangement of parts within the principles of the present
disclosure to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
* * * * *