U.S. patent application number 13/235450 was filed with the patent office on 2013-01-31 for cooling system for electronic device.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is CHUN-MING CHEN, TSUNG-HAN SU. Invention is credited to CHUN-MING CHEN, TSUNG-HAN SU.
Application Number | 20130025827 13/235450 |
Document ID | / |
Family ID | 47596268 |
Filed Date | 2013-01-31 |
United States Patent
Application |
20130025827 |
Kind Code |
A1 |
SU; TSUNG-HAN ; et
al. |
January 31, 2013 |
COOLING SYSTEM FOR ELECTRONIC DEVICE
Abstract
A cooling system for cooling an electronic device includes a
first heat exchanger, a second heat exchanger, a first refrigerant
pipe, a second refrigerant pipe, and a pump. The first and second
refrigerant pipes receive refrigerants, which can circulate in the
first and second heat exchangers. The first heat exchanger is
arranged in the electronic device for cooling the electronic
device. The second heat exchanger is used for cooling the
refrigerants by gasifying liquefied gas. The pump is used for
circulating the refrigerants.
Inventors: |
SU; TSUNG-HAN; (Tu-Cheng,
TW) ; CHEN; CHUN-MING; (Tu-Cheng, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SU; TSUNG-HAN
CHEN; CHUN-MING |
Tu-Cheng
Tu-Cheng |
|
TW
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
47596268 |
Appl. No.: |
13/235450 |
Filed: |
September 18, 2011 |
Current U.S.
Class: |
165/104.25 |
Current CPC
Class: |
H05K 7/20745
20130101 |
Class at
Publication: |
165/104.25 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 27, 2011 |
TW |
100126691 |
Claims
1. A cooling system for an electronic device, comprising: a first
heat exchanger for cooling the electronic device; a second heat
exchanger; a pump connected to the second heat exchanger; a first
refrigerant pipe connected between the first heat exchanger and the
pump; and a second refrigerant pipe connected between the first
heat exchanger and the second heat exchanger; wherein the first
heat exchanger, the second refrigerant pipe, the second heat
exchanger, the pump, and the first refrigerant pipe together form a
circulatory system for receiving refrigerants; wherein the first
refrigerant pipe is used for transferring refrigerants cooled by
the second heat exchanger into the first heat exchanger, to cool
the first heat exchanger; wherein the second refrigerant pipe is
used for transferring refrigerants heated by the first heat
exchanger into the second heat exchanger; wherein the pump is used
for circulating refrigerants; and wherein the second heat exchanger
is used for cooling the refrigerants flowing through the second
heat exchanger through gasification of liquefied gas.
2. The cooling system of claim 1, wherein the liquefied gas is
liquefied natural gas.
3. The cooling system of claim 1, wherein the liquefied gas is
liquid nitrogen.
4. The cooling system of claim 1, wherein the second heat exchanger
receives heat medium for transferring heat of the heated
refrigerants to the liquefied gas.
5. The cooling system of claim 4, wherein the heat medium is
antifreeze.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to cooling systems, and
particularly, to a cooling system for an electronic device.
[0003] 2. Description of Related Art
[0004] With increasing heavy use of on-line applications, the need
for computer data centers has increased rapidly. Data centers are
centralized computing facilities that include many servers, often
arranged on server racks or shelves, and one rack or shelf with
several servers can be considered a server system. During
operation, server systems generate a lot of heat in the data
centers, and a common method for dissipating the heat is to use air
conditioners, which are very expensive. Therefore an energy-saving
cooling system is needed.
BRIEF DESCRIPTION OF THE DRAWING
[0005] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0006] The FIGURE is a schematic block diagram of a cooling system
of an electronic device, according to an exemplary embodiment.
DETAILED DESCRIPTION
[0007] The disclosure, including the accompanying drawings, is
illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0008] Referring to the FIGURE, an embodiment of a cooling system
is provided for cooling an electronic device 10. The cooling system
includes a first heat exchanger 20, a second heat exchanger 50, a
first refrigerant pipe 30, a second refrigerant pipe 40, and a pump
31. The first and second refrigerant pipes 30 and 40 receive
refrigerants, which can circulate in the first and second heat
exchangers 20 and 50.
[0009] The electronic device 10 may be a container data center,
which can generate a lot of heat.
[0010] The first heat exchanger 20 is arranged in the electronic
device 10 for cooling the electronic device 10.
[0011] The second heat exchanger 50 is used for cooling the
refrigerants flowing through the second heat exchanger 50 by
gasifying the liquefied gas 51.
[0012] The first refrigerant pipe 30 is connected between the first
heat exchanger 20 and the second heat exchanger 50, for
transferring the refrigerants cooled by the second heat exchanger
50 to the first heat exchanger 20, to cool the first heat exchanger
20.
[0013] The second refrigerant pipe 40 is connected between the
first heat exchanger 20 and the second heat exchanger 50, for
transferring the refrigerants heated by the first heat exchanger 20
to the second heat exchanger 50.
[0014] The pump 31 is arranged between the first refrigerant pipe
30 and the second heat exchanger 50, for circulating the
refrigerants. In this embodiment, the pump 31 is used for
transferring the refrigerants cooled by the second heat exchanger
50 to the first refrigerant pipe 30. In another embodiment, the
pump 31 can be arranged between the second refrigerant pipe 40 and
the second heat exchanger 50.
[0015] In this embodiment, the liquefied gas 51 is liquefied
natural gas (LNG). Commonly, LNG is heated to a gaseous state for
convenient use. In another embodiment, the liquefied gas 51 may be
liquid nitrogen (LN).
[0016] The second heat exchanger 50 receives heat medium, which is
used for cooling the refrigerants flowing through the second heat
exchanger 50. The liquefied gas 51 flows into the second heat
exchanger 50 through a gas inlet 52. The liquefied gas 51 cools the
heat medium, and then is exhausted through a gas outlet 53. In this
embodiment, the heat medium is antifreeze composed of at least one
of alcohol, glycol, propylene glycol, and glycerol.
[0017] In this embodiment, the cooling system cools the electronic
device 10 by gasifying the liquefied gas 51. In other words, the
liquefied gas 51 is gasified by the heat of the electronic device
10, which saves energy.
[0018] Even though numerous characteristics and advantages of the
embodiments have been set forth in the foregoing description,
together with details of the structure and function of the
embodiments, the disclosure is illustrative only, and changes may
be made in detail, especially in the matters of shape, size, and
arrangement of parts within the principles of the present
disclosure to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
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