U.S. patent application number 13/193871 was filed with the patent office on 2013-01-31 for multi-junction photovoltaic device and fabrication method.
This patent application is currently assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION. The applicant listed for this patent is Stephen W. Bedell, Keith E. Fogel, Bahman Hekmatshoar-Tabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi. Invention is credited to Stephen W. Bedell, Keith E. Fogel, Bahman Hekmatshoar-Tabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi.
Application Number | 20130025654 13/193871 |
Document ID | / |
Family ID | 47503292 |
Filed Date | 2013-01-31 |
United States Patent
Application |
20130025654 |
Kind Code |
A1 |
Bedell; Stephen W. ; et
al. |
January 31, 2013 |
MULTI-JUNCTION PHOTOVOLTAIC DEVICE AND FABRICATION METHOD
Abstract
A method of forming a photovoltaic device that includes bonding
a substrate to a germanium-containing semiconductor layer with a
stressor layer, wherein the stressor layer cleaves the
germanium-containing semiconductor layer. At least one
semiconductor layer is formed on a cleaved surface of the
germanium-containing semiconductor layer that is opposite the
conductivity type of the germanium-containing semiconductor layer
to provide a first solar cell. The first solar cell absorbs a first
range of wavelengths. At least one second solar cell may be formed
on the first solar cell, wherein the at least one second solar cell
is composed of at least one semiconductor material to absorb a
second range of wavelengths that is different than the first range
wavelengths absorbed by the first solar cell.
Inventors: |
Bedell; Stephen W.;
(Wappingers Falls, NY) ; Fogel; Keith E.;
(Hopewell Junction, NY) ; Hekmatshoar-Tabari; Bahman;
(Mount Kisco, NY) ; Sadana; Devendra K.;
(Pleasantville, NY) ; Shahidi; Ghavam G.; (Round
Ridge, NY) ; Shahrjerdi; Davood; (Ossining,
NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Bedell; Stephen W.
Fogel; Keith E.
Hekmatshoar-Tabari; Bahman
Sadana; Devendra K.
Shahidi; Ghavam G.
Shahrjerdi; Davood |
Wappingers Falls
Hopewell Junction
Mount Kisco
Pleasantville
Round Ridge
Ossining |
NY
NY
NY
NY
NY
NY |
US
US
US
US
US
US |
|
|
Assignee: |
INTERNATIONAL BUSINESS MACHINES
CORPORATION
Armonk
NY
|
Family ID: |
47503292 |
Appl. No.: |
13/193871 |
Filed: |
July 29, 2011 |
Current U.S.
Class: |
136/255 ;
257/E31.035; 438/68 |
Current CPC
Class: |
H01L 31/0725 20130101;
H01L 31/0687 20130101; H01L 31/1812 20130101; H01L 31/02167
20130101; H01L 31/076 20130101; Y02E 10/548 20130101; Y02P 70/521
20151101; H01L 31/1892 20130101; Y02E 10/544 20130101; H01L 31/0747
20130101; Y02P 70/50 20151101; H01L 31/1808 20130101 |
Class at
Publication: |
136/255 ; 438/68;
257/E31.035 |
International
Class: |
H01L 31/06 20060101
H01L031/06; H01L 31/18 20060101 H01L031/18 |
Claims
1. A method of forming a photovoltaic device comprising: joining a
substrate to a germanium-containing semiconductor layer with a
stressor layer, wherein the stressor layer cleaves the
germanium-containing semiconductor layer; forming at least one
semiconductor layer on a cleaved surface of the
germanium-containing semiconductor layer, wherein the at least one
semiconductor layer has a conductivity type that is opposite the
conductivity type of the germanium-containing semiconductor layer
to provide a first solar cell that absorbs a first range of
wavelengths; and forming at least one second solar cell on the
first solar cell, wherein the at least one second solar cell is
comprised of at least one semiconductor material to absorb a second
range of wavelengths that is different than the first range of
wavelengths absorbed by the first solar cell.
2. The method of claim 1, wherein the stressor layer is a metal
layer, and the substrate is composed of a flexible polymer, a
flexible metal foil, or a thin flexible sheet of glass.
3. The method of claim 2, wherein the bonding of the substrate to
the germanium-containing semiconductor layer comprises depositing
the metal layer on the substrate.
4. The method of claim 1, wherein the stressor layer is heated to
effectuate a cleaving stress on the germanium-containing
semiconductor layer, wherein in response to the cleaving stress the
germanium-containing semiconductor layer is fractured so that a
first portion of the germanium containing semiconductor layer is
connected to the substrate through at least the stressor layer, and
a second portion of the germanium-containing semiconductor layer is
removed.
5. The method of claim 1, wherein the at least one of a passivation
layer, transparent conductivity material layer, n-type conductivity
semiconductor layer, p-type conductivity semiconductor layer and
intrinsic semiconductor layer is present between the
germanium-containing layer and the stressor layer.
6. The method of claim 1, wherein the forming of the at least one
semiconductor layer on a cleaved surface of the
germanium-containing semiconductor layer comprises an epitaxial
growth process.
7. The method of claim 1, wherein the at least one semiconductor
layer comprises Si, SiGe, SiC, SiGeC and a combination thereof.
8. The method of claim 1 further comprising forming a tunneling
layer on the cleaved surface of the germanium-containing
semiconductor layer, wherein the tunneling layer comprises at least
one of a metal layer, transparent conductive material, a
semiconductor junction or a combination thereof.
9. The method of claim 8, wherein prior to forming the tunneling
layer, an intrinsic semiconductor layer is formed on the at least
one semiconductor layer that is present on the cleaved surface of
the germanium containing semiconductor layer.
10. The method of claim 1, wherein the forming of the at least one
second solar cell comprises forming a p-i-n junction of
hydrogenated amorphous silicon, hydrogenated amorphous silicon
carbide, hydrogenated amorphous silicon-germanium, hydrogenated
nano/microcrystalline Si, or a combination thereof.
11. The method of claim 10, wherein the forming of the at least one
second solar cell comprises a first p-i-n junction of hydrogenated
amorphous silicon germanium present on the first solar cell, and a
second p-i-n junction of hydrogenated amorphous silicon comprising
carbon present on the first solar cell.
12. The method of claim 10, wherein the forming of the at least one
second solar cell comprises a first p-i-n junction of hydrogenated
crystalline silicon on the first solar cell, a second p-i-n
junction of hydrogenated amorphous silicon germanium present on the
first solar cell, and a third p-i-n junction of hydrogenated
amorphous silicon comprising carbon present on the second solar
cell.
13. The method of claim 10, wherein the forming of the at least one
second solar cell comprises a first p-i-n junction of hydrogenated
amorphous silicon-germanium on the first solar cell, a second p-i-n
junction of p-i-n junction of hydrogenated amorphous silicon
comprising carbon on the first solar cell, and a third p-i-n
junction of hydrogenated amorphous silicon-carbide present on the
second solar cell.
14. The method of claim 10, wherein the forming of the at least one
second solar cell comprises a first p-i-n junction of hydrogenated
crystalline silicon on the first solar cell, a second p-i-n
junction of hydrogenated amorphous silicon which may contain carbon
on the first solar cell, and a third p-i-n junction of hydrogenated
amorphous silicon-carbide present on the second solar cell.
15-24. (canceled)
Description
BACKGROUND
[0001] The present disclosure relates to photovoltaic devices, and
more particularly to photovoltaic devices such as, for example,
solar cells.
[0002] A photovoltaic device is a device that converts the energy
of incident photons to electromotive force (e.m.f.). Typical
photovoltaic devices include solar cells, which are configured to
convert the energy in the electromagnetic radiation from the Sun to
electric energy. Multi junction solar cells of different
semiconductor compositions may be employed for power generation in
space due to their high efficiency and radiation stability.
Multi-junction solar cells are mainly fabricated on germanium (Ge)
substrates due to the inherently strong (IR) absorption property of
germanium (Ge). Germanium (Ge) also includes a crystal structure
that can be lattice matched to III-V materials, which allows for
integration of III-V sub cells on a germanium (Ge) substrate. The
germanium (Ge) substrate may constitute nearly 50% to 70% of the
final cost of the finished solar cell.
BRIEF SUMMARY
[0003] A method of forming a photovoltaic device is provided that
includes at least two solar cells. In one embodiment, the method of
forming the photovoltaic device includes joining a flexible
substrate to a germanium containing semiconductor layer with a
stressor layer, wherein the stressor layer cleaves the germanium
containing semiconductor layer. At least one semiconductor layer is
formed on the cleaved surface of the germanium-containing
semiconductor layer, wherein at least one semiconductor layer has a
conductivity type that is opposite the conductivity type of the
germanium-containing semiconductor layer to provide a first solar
cell. The first solar cell absorbs a first range of wavelengths. At
least one second solar cell may then be formed on the first solar
cell, wherein the at least one second solar cell is composed of at
least one semiconductor material to absorb a second range of
wavelengths that is different than the first range of wavelengths
absorbed by the first solar cell.
[0004] In another aspect, the present disclosure provides a
photovoltaic cell that is composed of at least two solar cells. In
one embodiment, the photovoltaic device includes a flexible
substrate, and a back contact structure on an upper surface of the
flexible substrate. A first solar cell may be present on the back
contact structure, wherein the first solar cell includes a
germanium-containing crystalline semiconductor layer having a
thickness ranging from 100 nm to 10 .mu.m. The first solar cell
absorbs a first range of wavelengths. At least a second solar cell
may be present on the first solar cell. The second solar cell may
be composed of at least one amorphous or crystalline semiconductor
material that is selected so that the second solar cell absorbs a
second range of wavelengths that is different than the first set of
wavelengths absorbed by the first solar sell. A front contact
structure may be present on the upper surface of the second solar
cell.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The following detailed description, given by way of example
and not intended to limit the disclosure solely thereto, will best
be appreciated in conjunction with the accompanying drawings,
wherein like reference numerals denote like elements and parts, in
which:
[0006] FIG. 1 is a plot of wavelength (nm) vs. absorption
coefficient (cm.sup.-1) for crystalline germanium (c-Ge),
crystalline silicon (c-Si), and hydrogenated amorphous silicon
(a-Si:H), in accordance with the present disclosure.
[0007] FIGS. 2 and 3 are side cross-sectional views depicting a
method of forming a photovoltaic device that includes joining a
flexible substrate to a germanium-containing semiconductor layer
using a stressor layer, wherein the stressor layer cleaves the
germanium containing semiconductor layer, in accordance with one
embodiment of the present disclosure.
[0008] FIGS. 4-8 are side cross-sectional views depicting some
embodiments of forming the bottom solar cell of a multi-junction
photovoltaic device that includes forming at least one
semiconductor layer on a cleaved surface of the
germanium-containing semiconductor layer, in accordance with the
present disclosure.
[0009] FIG. 9 is a side cross-sectional view depicting forming a
second solar cell on the first solar cell, wherein the second solar
cell is composed of at least one semiconductor material having a
band gap to absorb a range of wavelengths that is different than
the range of wavelengths absorbed by the first solar cell, in
accordance with one embodiment of the present disclosure.
[0010] FIG. 10 is a side cross-sectional view of one embodiment of
a photovoltaic device that is formed in accordance with the present
disclosure, wherein the first solar cell includes a crystalline
germanium layer and a semiconductor layer that is formed on a
cleaved surface of the crystalline germanium layer, wherein a
second solar cell is present on the first solar cell and includes a
p-i-n junction that is composed of hydrogenated amorphous
silicon.
[0011] FIG. 11 is a plot of the quantum efficiency as a function of
wavelength (nm) for the photovoltaic device depicted in FIG. 10, in
accordance with one embodiment of the present disclosure.
[0012] FIG. 12 is a plot of the quantum efficiency as a function of
transferred layer thickness (nm) for the photovoltaic device
depicted in FIG. 10, in accordance with one embodiment of the
present disclosure.
[0013] FIG. 13 is a side cross-sectional view of a one embodiment
of a photovoltaic device that is formed in accordance with the
present disclosure, wherein the first solar cell includes a
crystalline germanium layer and a semiconductor layer that is
formed on a cleaved surface of the crystalline germanium layer,
wherein a second solar cell is present on the first solar cell and
includes three p-i-n junctions.
[0014] FIG. 14 is a plot of the quantum efficiency as a function of
wavelength (nm) for the photovoltaic device depicted in FIG. 13, in
accordance with one embodiment of the present disclosure.
[0015] FIG. 15 is a plot of the quantum efficiency as a function of
transferred layer thickness (nm) for the photovoltaic device
depicted in FIG. 13, in accordance with one embodiment of the
present disclosure.
[0016] FIG. 16 is a side cross sectional view of one embodiment of
a photovoltaic device that is formed in accordance with the present
disclosure, wherein the first solar cell includes a crystalline
germanium layer and a semiconductor layer that is formed on a
cleaved surface of the crystalline germanium layer, wherein a
second solar cell is present on the first solar cell and includes a
p-type buffer region on the first solar cell, a layer of
copper-indium-gallium sellenide (CIGS), Cu.sub.2ZnSnS.sub.4 (CZTS),
Cu.sub.2ZnSnSe.sub.4 (CZTSe) or cadmium telluride on the p-type
buffer region, and an n-type cadmium sulfide.
DETAILED DESCRIPTION
[0017] Detailed embodiments of the claimed structures and methods
are disclosed herein; however, it is to be understood that the
disclosed embodiments are merely illustrative of the claimed
structures and methods that may be embodied in various forms. In
addition, each of the examples given in connection with the various
embodiments are intended to be illustrative, and not restrictive.
Further, the figures are not necessarily to scale, some features
may be exaggerated to show details of particular components.
Therefore, specific structural and functional details disclosed
herein are not to be interpreted as limiting, but merely as a
representative basis for teaching one skilled in the art to
variously employ the methods and structures of the present
disclosure.
[0018] References in the specification to "one embodiment", "an
embodiment", "an example embodiment", etc., indicate that the
embodiment described may include a particular feature, structure,
or characteristic, but every embodiment may not necessarily include
the particular feature, structure, or characteristic. Moreover,
such phrases are not necessarily referring to the same embodiment.
Further, when a particular feature, structure, or characteristic is
described in connection with an embodiment, it is submitted that it
is within the knowledge of one skilled in the art to affect such
feature, structure, or characteristic in connection with other
embodiments whether or not explicitly described.
[0019] For purposes of the description hereinafter, the terms
"upper", "lower", "right", "left", "vertical", "horizontal", "top",
"bottom", and derivatives thereof shall relate to the disclosed
structures, as they are oriented in the drawing figures. The terms
"overlying", "atop", "positioned on" or "positioned atop" means
that a first element, such as a first structure, is present on a
second element, such as a second structure, wherein intervening
elements, such as an interface structure, e.g. interface layer, may
be present between the first element and the second element. The
term "direct contact" means that a first element, such as a first
structure, and a second element, such as a second structure, are
connected without any intermediary conducting, insulating or
semiconductor layers at the interface of the two elements.
[0020] In one embodiment, the present disclosure provides a
multi-junction photovoltaic device, and a fabrication method for
forming a multi-junction solar cell, in which the methods and
structures include a semiconductor-containing layer, e.g.,
germanium layer, that is formed using a layer transfer method, such
as spalling. As used herein, a "photovoltaic device" is a device,
such as a solar cell, that produces free electrons and/or
vacancies, i.e., holes, when exposed to radiation, such as light,
and results in the production of an electric current. The
photovoltaic device typically includes layers of p-type
conductivity and n-type conductivity that share an interface to
provide a junction.
[0021] In some embodiments, the disclosed multi-junction
photovoltaic device is composed of a single junction or
multi-junction amorphous, nano-crystalline, micro-crystalline
and/or poly-crystalline top cell, grown on a bottom cell including
a germanium-containing layer that has been transferred using a
layer transfer method, e.g., spalling, and/or fabricated after
layer transfer onto a flexible substrate. In some embodiments, the
spalling method disclosed herein makes it possible to use a thin
layer of semiconductor, e.g., germanium layer, as the substrate,
lowering the substrate cost, as well as allowing the photovoltaic
device to be mechanically flexible. The term "flexible" when
referring to a photovoltaic device means that the photovoltaic
device remains operational under an inward or outward curvature
with a radius of at least 30 cm.
[0022] Referring to FIG. 1, germanium is typically used for the
bottom cell of multi-junction photovoltaic devices due to
germanium's low bandgap. FIG. 1 depicts the higher absorption
coefficient of single crystalline germanium, as indicated by plot
line 1, in comparison to single crystal silicon, as indicated by
plot line 2, and hydrogenated amorphous silicon, as indicated by
plot line 3. In comparison to single crystal silicon, single
crystalline germanium is an expensive material. Therefore, the
disclosed spalling method, which may provide for the transfer of
thin germanium layers, may reduce the cost of photovoltaic device
manufacturing including germanium containing material layers.
Furthermore, in some embodiments, the thickness of the
semiconductor-containing layer, e.g., germanium layer, being
transferred by the disclosed spalling process provides that the
photovoltaic cell including the transferred
semiconductor-containing layer, e.g., germanium layer, is flexible.
For example, the spalling method disclosed herein provides for the
transfer of a semiconductor-containing layer, e.g., germanium
layer, having a thickness ranging from 100 nm to 10 microns, hence
providing a transferred semiconductor-containing layer, e.g.,
germanium layer, that is flexible.
[0023] FIGS. 2 and 3 depict one embodiment of a method of
transferring a semiconductor-containing layer 5a, e.g., germanium
layer, for use in a photovoltaic device. Although the following
description refers to the transferred portion of the
semiconductor-containing layer 5a as a "germanium-containing
layer", such as a single crystal germanium (c-Ge) layer, it is
noted that the present disclosure is equally applicable to the
other semiconductor materials that are suitable for the bottom cell
of a multi junction photovoltaic device. For example, the
transferred portion of the semiconductor-containing layer 5a may
also be composed of a low bandgap material, such as InSb, InAs,
InGaAs, InGaSb and InN, as well as materials with higher bandgaps,
such as Si or GaAs.
[0024] FIG. 2 depicts forming a stressor layer 20 to a
germanium-containing substrate 5. In one embodiment, the method may
include bonding a flexible substrate 25 to a germanium-containing
substrate 5 using a stressor layer 20 and an optional metal
adhesion layer 16, wherein in a subsequent process step the stress
produced by the stressor layer 20 is transmitted to the
germanium-containing substrate 5 to cleave the germanium-containing
substrate 5.
[0025] In one embodiment, the germanium-containing substrate 5 may
have a germanium content that is greater than 50 at. %. In another
embodiment, the germanium-containing substrate 5 may have a
germanium content that is greater than 99 at. %. In one example,
the germanium-containing substrate 5 may have a germanium content
that is 100 at. %. The germanium-containing substrate 5 may be
formed using a single crystal (monocrystalline) method. One example
of a single crystal method for forming the germanium-containing
substrate 5 is the Czochralsky (CZ) method. The Czochralsky (CZ)
method includes taking a seed of single-crystal germanium and
placing it in contact with the top surface of molten germanium. As
the seed is slowly raised (or pulled), atoms of the molten
germanium solidify in the pattern of the seed and extend the
single-crystal structure. The single-crystal structure is then sawn
into wafers, i.e., substrates, that can provide the
germanium-containing substrate 5. As indicated above, although the
substrate is described as being composed of germanium, other
materials may also be employed for the substrate. For example, the
substrate may be composed of a low bandgap material, such as InSb,
InAs, InGaAs, InGaSb and InN, as well as materials with higher
bandgaps, such as Si or GaAs.
[0026] The germanium-containing substrate 5 may be doped to an
n-type or p-type conductivity or may be an intrinsic semiconductor
layer. As used herein, "p-type" refers to the addition of
impurities to an intrinsic semiconductor that creates deficiencies
of valence electrons (i.e. holes). As used herein, "n-type" refers
to the addition of impurities that contributes free electrons to an
intrinsic semiconductor. The dopant that provides the conductivity
type of the germanium-containing substrate may be introduced by an
in-situ doping process. The term "conductivity type" denotes a
p-type or n-type dopant. By "in-situ" it is meant that the dopant
that provides the conductivity type of the material layer is
introduced as the material layer is being formed or deposited. The
p-type and/or n-type dopant for the germanium-containing substrate
5 may also be introduced following the deposition of the
germanium-containing substrate 5 using at least one of plasma
doping, ion implantation, and/or outdiffusion from a disposable
diffusion source (e.g., borosilicate glass).
[0027] When employed in the lower cell of a photovoltaic device and
doped to a p-type conductivity, the concentration of the p-type
dopant in the germanium-containing substrate 5 ranges from
10.sup.14 atoms/cm.sup.3 to 10.sup.18 atoms/cm.sup.3. When employed
in the lower cell of a photovoltaic device and doped to an n-type
conductivity, the concentration of the n-type dopant in the
germanium-containing substrate 5 ranges from 10.sup.14
atoms/cm.sup.3 to 10.sup.18 atoms/cm.sup.3.
[0028] In one embodiment, the thickness of the germanium-containing
substrate 5 prior to spalling may range from 10 .mu.m to 1 mm. In
another embodiment, the thickness of the germanium-containing
substrate 5 prior to spalling may range from 150 .mu.m to 700
.mu.m. It is noted that the above thicknesses for the
germanium-containing substrate 5 have been provided for
illustrative purposes only, and are not intended to limit the
present disclosure. For example, other thicknesses of the
germanium-containing substrate 5 may be employed, so long as the
thickness of the germanium-containing substrate 5 provides that at
least a residual portion of the germanium-containing substrate 5
remains connected to the handling substrate 25 through at least the
stressor layer 20.
[0029] FIG. 2 depicts one embodiment of bonding a stressor layer 20
to a bonding surface that is present on the germanium-containing
substrate 5. The bonding surface that is present on the
germanium-containing substrate 5 may be a surface of the
germanium-containing substrate 5, or may be the surface of a
material layer that is formed on the surface of the
germanium-containing substrate 5. In one embodiment, the material
layer that is formed on the germanium-containing substrate 5 that
provides the bonding surface of the germanium-containing substrate
5 may be at least one of a back surface field layer, a back surface
passivation layer, a localized back surface field region, or a
combination thereof.
[0030] In one embodiment, a back surface field region (not shown)
may be formed on a surface of the germanium-containing substrate 5
that is connected to the stressor layer 20. A "back surface field
(BSF) region" is a doped region having a higher dopant
concentration than the germanium-containing substrate 5 and/or a
lower electron affinity (.chi..sub.e) than the germanium-containing
substrate 5 (in case of n-type doping), and/or a larger sum of
electron affinity and bandgap (E.sub.g), i.e. .chi..sub.e+E.sub.g
than the germanium containing substrate 5 (in case of p-type
doping). The back surface field region and the germanium-containing
substrate 5 typically have the same conductivity type, e.g., p-type
or n-type conductivity. The junction between the back surface field
(BSF) region and the germanium-containing substrate 5 creates an
electric field which introduces a barrier to minority carrier flow
to the rear surface. The back surface field (BSF) region therefore
reduces the rate of carrier recombination at the rear surface, and
as such has a net effect of passivating the rear surface of the
solar cell. A "localized back surface region" is similar to a back
surface field region with the exception that a back surface field
region is typically a continuous region that extends across the
entire width of the germanium-containing substrate 5, whereas a
"localized back surface field region" is present in discontinuous
islands along the width of the germanium-containing substrate
5.
[0031] In one embodiment, a passivation layer (not shown) may be
present between the back surface field region of the
germanium-containing substrate 5 and the stressor layer 20. The
passivation layer is a material layer that is formed on the back
surface of the germanium-containing substrate 5, which provides the
lower cell of the subsequently formed photovoltaic cell, wherein
the passivation layer reduces the concentration of dangling bonds
at the back surface of the bottom cell of the photovoltaic device,
and therefore reduces the rate of carrier recombination at the back
surface. In one embodiment, the passivation layer is composed of a
hydrogenated amorphous silicon and/or germanium containing material
is selected from the group consisting of hydrogenated amorphous
silicon (a-Si:H), hydrogenated amorphous germanium (a-Ge:H),
hydrogenated amorphous silicon germanium (a-SiGe:H) and a
combination thereof. The passivation layer may contain carbon,
nitrogen, oxygen, fluorine or deuterium. Typically, the passivation
layer is an intrinsic semiconductor layer. Deposition of the
hydrogenated amorphous silicon and/or germanium containing material
by PECVD includes at least one semiconductor material containing
reactant gas and at least one hydrogen containing reactant gas. In
one embodiment, the semiconductor material containing reactant gas
for producing the hydrogenated amorphous silicon containing
material includes at least one atom of silicon. For example, to
provide the silicon component of the hydrogenated amorphous
silicon, the semiconductor material containing reactant gas can
include at least one of SiH.sub.4, Si.sub.2H.sub.6,
SiH.sub.2Cl.sub.2, SiHCl.sub.3, and SiCl.sub.4. For example, the
germanium component may be provided by GeH.sub.4. The hydrogen
containing reactant gas for depositing the hydrogenated amorphous
silicon containing material by PECVD may be hydrogen gas
(H.sub.2).
[0032] Still referring to FIG. 2, a stressor layer 20 may be formed
on the germanium containing substrate 5 or may be formed on a
material layer, such as a passivation layer, that is present on the
germanium-containing substrate 5. In one embodiment, the stressor
layer 20 is composed of a metal containing layer, a polymer layer,
an adhesive tape or a combination thereof. In some embodiments of
the present disclosure, the surface that the stressor layer 20 is
formed on can be cleaned prior to remove surface oxides and/or
other contaminants therefrom. In one embodiment, the surface that
the stressor layer 20 is formed on may be cleaned by applying a
solvent, such as, e.g., acetone and isopropanol, which is capable
of removing contaminates and/or surface oxides from the bonding
surface of the germanium-containing substrate 5.
[0033] In some embodiments, an optional metal-containing adhesion
layer 16 is formed on the bonding surface of the
germanium-containing substrate 5. The optional metal-containing
adhesion layer 16 is employed in embodiments in which the stressor
layer 20 to be subsequently formed has poor adhesion to bonding
surface of the germanium-containing substrate 5. Typically, the
metal-containing adhesion layer 16 is employed when a stressor
layer 20 comprised of a metal is employed.
[0034] The optional metal-containing adhesion layer 16 employed in
the present disclosure includes any metal adhesion material such
as, but not limited to, Ti/W, Ti, Cr, Ni or any combination
thereof. The optional metal-containing adhesion layer 16 may
comprise a single layer or it may include a multilayered structure
comprising at least two layers of different metal adhesion
materials.
[0035] The metal-containing adhesion layer 16 may be formed at room
temperature (15.degree. C.-40.degree. C.) or above. In one
embodiment, the optional metal-containing adhesion layer 16 is
formed at a temperature ranging from 20.degree. C. to 180.degree.
C. In another embodiment, the optional metal-containing adhesion
layer 16 is formed at a temperature that ranges from 20.degree. C.
to 60.degree. C.
[0036] The metal-containing adhesion layer 16, which may be
optionally employed, can be formed utilizing deposition techniques
that are well known to those skilled in the art. For example, the
optional metal-containing adhesion layer 16 can be formed by
sputtering, chemical vapor deposition, plasma enhanced chemical
vapor deposition, chemical solution deposition, physical vapor
deposition, and plating. When sputter deposition is employed, the
sputter deposition process may further include an in-situ sputter
clean process before the deposition.
[0037] When employed, the optional metal-containing adhesion layer
16 typically has a thickness of from 5 nm to 200 nm, with a
thickness of from 100 nm to 150 nm being more typical. Other
thicknesses for the optional metal-containing adhesion layer 16
that are below and/or above the aforementioned thickness ranges can
also be employed in the present disclosure.
[0038] In some embodiment, the stressor layer 20 is formed on an
exposed surface of the optional metal-containing adhesion layer 16.
In some embodiments in which the optional metal-containing adhesion
layer 16 is not present, the stressor layer 20 is formed directly
on the germanium containing substrate; this particular embodiment
is not shown in the drawings, but can readily be deduced from the
drawings illustrated in the present application.
[0039] The stressor layer 20 that is employed in the present
disclosure includes any material that is under tensile stress on
base substrate, e.g., germanium-containing substrate 5, at the
spalling temperature. Illustrative examples of such materials that
are under tensile stress when applied atop the germanium-containing
substrate 5 include, but are not limited to, a metal, a polymer,
such as a spall inducing tape layer, or any combination thereof.
The stressor layer 20 that may comprise a single stressor layer, or
a multilayered stressor structure including at least two layers of
different stressor material can be employed.
[0040] In one embodiment, the stressor layer 20 is a metal, and the
metal is formed on an upper surface of the optional
metal-containing adhesion layer 16. In another embodiment, the
stressor layer 20 is a spall inducing tape, and the spall inducing
tape is applied directly to the bonding surface of the
germanium-containing substrate 5. In another embodiment, for
example, the stressor layer 20 may comprise a two-part stressor
layer including a lower part and an upper part. The upper part of
the two-part stressor layer can be comprised of a spall inducing
tape layer.
[0041] When a metal is employed as the stressor layer 20, the metal
can include, for example, Ni, Cr, Fe or W. Alloys of these metals
can also be employed. In one embodiment, the stressor layer 20
includes at least one layer consisting of Ni. When a polymer is
employed as the stressor layer 20, the polymer is a large
macromolecule composed of repeating structural units. These
subunits are typically connected by covalent chemical bonds.
Illustrative examples of polymers that can be employed as the
stressor layer 20 include, but are not limited to, polyimides
polyesters, polyolefins, polyacrylates, polyurethane, polyvinyl
acetate, and polyvinyl chloride.
[0042] When a spall inducing tape layer is employed as the stressor
layer 20, the spall inducing tape layer includes any pressure
sensitive tape that is flexible, soft, and stress free at the first
temperature used to form the tape, yet strong, ductile and tensile
at the second temperature used during removal of the upper portion
of the base substrate. By "pressure sensitive tape," it is meant an
adhesive tape that will stick with application of pressure, without
the need for solvent, heat, or water for activation. Tensile stress
in the tape is primarily due to thermal expansion mismatch between
the germanium-containing substrate 5 (with a lower thermal
coefficient of expansion) and the tape (with a higher thermal
expansion coefficient).
[0043] Typically, the pressure sensitive tape that is employed in
the present disclosure as the stressor layer 20 includes at least
an adhesive layer and a base layer. Materials for the adhesive
layer and the base layer of the pressure sensitive tape include
polymeric materials such as, for example, acrylics, polyesters,
olefins, and vinyls, with or without suitable plasticizers.
Plasticizers are additives that can increase the plasticity of the
polymeric material to which they are added.
[0044] In one embodiment, the stressor layer 20 that is employed in
the present disclosure is formed at room temperature (15.degree.
C.-40.degree. C.). In another embodiment, when a tape layer is
employed, the tape layer can be formed at temperature ranging from
15.degree. C. to 60.degree. C.
[0045] When the stressor layer 20 is a metal or polymer, the
stressor layer 20 can be formed utilizing deposition techniques
that are well known to those skilled in the art including, for
example, dip coating, spin-coating, brush coating, sputtering,
chemical vapor deposition, plasma enhanced chemical vapor
deposition, chemical solution deposition, physical vapor
deposition, and plating.
[0046] When the stressor layer 20 is a spall inducing tape layer,
the tape layer can be applied by hand or by mechanical means to the
structure. The spall inducing tape can be formed utilizing
techniques well known in the art or they can be commercially
purchased from any well known adhesive tape manufacturer. Some
examples of spall inducing tapes that can be used in the present
disclosure as stressor layer 20 include, for example, Nitto Denko
3193MS thermal release tape, Kapton KPT-1, and Diversified
Biotech's CLEAR-170 (acrylic adhesive, vinyl base).
[0047] In one embodiment, a two-part stressor layer 20 can be
formed on a bonding surface of the germanium containing substrate
5, wherein a lower part of the two-part stressor layer 20 is formed
at a first temperature, which is at room temperature or slight
above (e.g., from 15.degree. C. to 60.degree. C.), wherein an upper
part of the two-part stressor layer 20 comprises a spall inducing
tape layer at an auxiliary temperature which is at room
temperature. In this embodiment, the germanium-containing substrate
5 including the two-part stressor layer is brought to a second
temperature that is less than room temperature to initiate
spalling.
[0048] If the stressor layer 20 is of a metallic nature, it
typically has a thickness of from 3 .mu.m to 50 .mu.m, with a
thickness of from 4 .mu.m to 7 .mu.m being more typical. Other
thicknesses for the stressor layer 20 that are below and/or above
the aforementioned thickness ranges can also be employed in the
present disclosure.
[0049] If the stressor layer 20 is of a polymeric nature, it
typically has a thickness of from 10 .mu.m to 200 .mu.m, with a
thickness of from 50 .mu.m to 100 .mu.m being more typical. Other
thicknesses for the stressor layer 20 that are below and/or above
the aforementioned thickness ranges can also be employed in the
present disclosure. In the following description, the stressor
layer 20 is described as being composed of a metallic, and may also
provide the back contact of the photovoltaic device. As indicated
above, the stressor layer 20 is not limited to a metallic
structure. In these embodiments, a back contact structure may be
formed after spalling.
[0050] In one embodiment, a handling substrate 25 can be formed
atop the stressor layer 20. The handling substrate 25 employed in
the present disclosure may comprise any flexible material that has
a minimum radius of curvature of less than 30 cm. Illustrative
examples of flexible materials that can be employed as the handling
substrate 25 include a metal foil, a polyimide foil, or a thin
flexible sheet of glass. The handling substrate 25 can be used to
provide better fracture control and more versatility handling the
spalled portion of the germanium-containing substrate 5. Moreover,
the handling substrate 25 can be used to guide the crack
propagation during the spontaneous spalling process of the present
disclosure. The handling substrate 25 of the present disclosure is
typically, but not necessarily, formed at room temperature
(15.degree. C.-40.degree. C.). The handling substrate 25 can be
formed utilizing deposition techniques that are well known to those
skilled in the art including, for example, dip coating,
spin-coating, brush coating, sputtering, chemical vapor deposition,
plasma enhanced chemical vapor deposition, chemical solution
deposition, physical vapor deposition, and plating. The handling
substrate 25 typical has a thickness of from 1 .mu.m to few mm,
with a thickness of from 70 .mu.m to 120 .mu.m being more typical.
Other thicknesses for the handling substrate 25 that are below
and/or above the aforementioned thickness ranges can also be
employed in the present disclosure. It is noted that the handling
substrate 35 may also be composed of a rigid material.
[0051] FIG. 3 depicts one embodiment of cleaving the
germanium-containing substrate, wherein a transferred portion of
the germanium-containing substrate 5a remains connected to the
stressor layer 20 and the handling substrate 25. By "cleaving" it
is meant that a transferred portion of the germanium-containing
substrate 5a that is connected to the stressor layer 20 and the
handling substrate 25 is separated from a separated portion of the
germanium-containing substrate 5b that is not connected to the
stressor layer 20 and the handling substrate 25, so that the
transferred portion of the germanium-containing substrate 5a has a
thickness T1 that is less than the original thickness of the
germanium-containing substrate.
[0052] FIG. 3 depicts one embodiment, of applying a stress from the
stressor layer 20 to the germanium-containing substrate, in which
the stress cleaves the germanium-containing substrate to provide a
cleaved surface 4 on the transferred portion of the
germanium-containing substrate 5a. The condition that results in
spalling of the germanium-containing substrate may be related to
the combination of the stressor layer 20 thickness value and the
stress value for the stressor layer 20, as well as the mechanical
properties of the germanium-containing substrate. At a given
stressor layer 20 thickness value, there will be a stress value
above which spalling will occur spontaneously. Likewise, at a given
stressor layer 20 stress value, there will be a thickness value
above which spalling will occur spontaneously.
[0053] An approximate guide for the stressor layer 20 thickness
value at which spalling becomes possible for the case where the
stressor layer 20 is substantially comprised of tensile stressed Ni
is given by the relation
t*=[(2.5.times.10.sup.6)(K.sub.IC.sup.3/2)]/.sigma..sup.2, where t*
is the thickness value (in units of microns) of the stressor layer
20 at which controlled spalling becomes possible, K.sub.IC is the
fracture toughness value of the germanium-containing substrate (in
units of MPa*m.sup.1/2), e.g., fracture toughness value of the
germanium-containing substrate, and .sigma. is the magnitude of the
stress value in the stressor layer 20 (in units of MPa, or
megapascals). If the stressor layer 20 thickness is greater than
the value given by t* by approximately 50%, then spontaneous
spalling may occur. In another aspect, the thickness of the
stressor layer 20 may be anywhere from about 1 um to about 50 um,
or from about 3 um to about 30 um, or about 4 um to about 20 um
thick.
[0054] Selection of the stressor layer 20 does not have to be based
on the difference between the coefficient of thermal expansion of
the stressor layer 20 and the coefficient of thermal expansion of
the germanium-containing substrate for promoting spontaneous
spalling as in the prior art, where spalling is effected by cooling
the structure from an elevated temperature (about 900.degree. C.)
to a lower temperature. In one embodiment, the present disclosure
does not rely on spontaneous spalling, but rather the use of
mechanical force, and controlled fracture at substantially room
temperature (about 20.degree. C.) to separate layers or layers from
the germanium-containing substrate 5, e.g., separate a transferred
portion of the germanium-containing substrate 5a from a separated
portion of the germanium-containing substrate 5b that is not
connected to the stressor layer 20 and the handling substrate 25.
The thickness of the transferred portion of the
germanium-containing substrate 5a that is attached to the stressor
layer 20 from the germanium-containing substrate is roughly twice
the thickness value of stressor layer 20. By controlling the amount
of stress in the stressor layer 20, the operable thickness value of
the stressor layer 20 (t*) can be chosen to remove a controlled
thickness of the transferred portion of the germanium-containing
substrate 5a.
[0055] Although the origin of the stress in the stressor layer 20
is intrinsic (originating from microstructure), and not due to
coefficient of thermal expansion (CTE) stress, heating the stressor
layer 20 often has the effect of increasing the stress value. This
is due to microstructural changes within the stressor layer 20 that
occur upon annealing and is irreversible. Localized heating is
therefore contemplated to initiate fracture in the periphery of the
area to be layer transferred. In other words, spontaneous spalling
can be made to occur in small, selected regions to help initiate
fracture, e.g., by increasing the thickness of the stress layer in
these small selected regions. Localized heating can be performed
using a laser, remote induction heating, or direct contact
heating.
[0056] The transferred portion of the germanium-containing
substrate 5a having the cleaved surface 4 that is formed by the
spontaneous spalling process mentioned above typically has a
thickness T1 of from 100 nm to tens of .mu.m, with a thickness T1
of from 3 .mu.m to 20 .mu.m being more typical. The above-mentioned
thicknesses for the transferred portion of the germanium-containing
substrate 5a provide a flexible material layer.
[0057] FIGS. 4-8 depict some embodiments of forming the bottom
solar cell 50a, 50b, 50c, 50d, 50e of a multi-junction photovoltaic
device that includes forming at least one semiconductor layer 6 on
the cleaved surface 4 of the transferred portion of the
germanium-containing substrate 5a. In each of the embodiments
depicted in FIGS. 4-8, the layers/regions below the cleaved surface
4, as orientated in the figures, are formed before spalling,
interchangeably referred to as cleaving, and the layers/regions
above the cleaved are formed after spalling. The cleaved surface
and/or the bottom surface of the bottom cell, e.g., transferred
portion of the germanium-containing substrate 5a, of the
photovoltaic device may or may not be textured. The texturing may
be done by selective and/or random wet and/or dry etching.
[0058] FIG. 4 depicts one embodiment of a bottom solar cell 50a of
a multi junction photovoltaic device in which the layers/regions
formed prior to cleaving of the germanium-containing substrate
include a passivation layer 8 and a localized back surface field
region 7. The passivation layer 8 may be composed of hydrogenated
amorphous silicon and is typically an intrinsic semiconductor
material. The passivation layer 8 may be formed in direct contact
with the surface of the transferred portion 5a of the
germanium-containing substrate that is opposite the cleaved surface
4 of the germanium-containing substrate. One embodiment of a method
for forming the passivation layer 8 that is depicted in FIG. 4 has
been described above with reference to FIG. 2. In another
embodiment, the passivation layer 8 may be composed of a
dielectric, such as an oxide, e.g., silicon oxide, or a nitride,
e.g., silicon nitride. Typically, following formation, the
passivation layer 8 is patterned and etched to provide openings
there through to expose the portions of the transferred portion of
the germanium-containing substrate 5a in which the localized back
surface field region 7 is formed. The localized back surface region
7 may be formed through the openings in the passivation layer 8
using at least one of plasma doping, ion implantation, and/or
outdiffusion from a disposable diffusion source (e.g., borosilicate
glass). The localized back surface field region 7 is typically
doped to the same conductivity type as the transferred portion of
the germanium-containing substrate 5a, but the concentration of the
dopant that provides the conductivity type in the localized back
surface field region 7 is greater than the concentration of the
dopant that provides the conductivity type in the transferred
portion of the germanium-containing substrate 5a.
[0059] Still referring to FIG. 4, in some embodiments, the bottom
solar cell 50a of a multi-junction photovoltaic device further
includes a transparent conductive oxide material (not shown). In
one embodiment, the transparent conductive material layer can
include a transparent conductive oxide (TCO) such as, but not
limited to, a fluorine-doped tin oxide (SnO.sub.2:F), an
aluminum-doped zinc oxide (ZnO:Al), tin oxide (SnO) and indium tin
oxide (InSnO.sub.2, or ITO for short). The thickness of the
transparent conductive material layer may vary depending on the
type of transparent conductive material employed, as well as the
technique that was used in forming the transparent conductive
material. Typically, and in one embodiment, the thickness of the
transparent conductive material layer ranges from 10 nm to 3
microns. In some embodiments, in which the stressor layer 20 and/or
optional metal-containing adhesion layer (not depicted in FIG. 4)
is a conductive element, the stressor layer 20 may function as the
back contact of the bottom solar cell 50a. The handling substrate
25, which may be flexible, may be present at the back surface of
the bottom solar cell 50a.
[0060] A semiconductor layer 6 may be epitaxially grown on the
cleaved surface 4 of the transferred portion of the
germanium-containing substrate 5a. In the embodiment that is
depicted in FIG. 4, the transferred portion 5a of the
germanium-containing substrate may function as the absorption layer
of the solar cell, and the semiconductor layer 6 may function as
the emitter layer of the solar cell. The semiconductor layer 6 is
hereafter referred to as a "first emitter region 6" when describing
the structure depicted in FIG. 4. The "absorption layer" is the
material that readily absorbs photons to generate charge carriers,
i.e., free electrons or holes. A portion of the photovoltaic
device, between the front side and the absorption layer is referred
to as the "emitter layer", and the junction with the absorption
layer is referred to as the "emitter junction". The emitter layer
may be present atop the absorption layer, in which the emitter
layer has a conductivity type that is opposite the conductivity
type of the absorption layer. In one example, when the Sun's energy
in the form of photons collects in the cell layers, electron-hole
pairs are generated in the material within the photovoltaic device.
The emitter junction provides the required electric field for the
separation of the photo-generated electrons and holes on the
n-doped and p-doped sides of the emitter junction, respectively.
For this reason, and in this example, at least one p-type layer of
the photovoltaic device may provide the absorption layer, and at
least one adjacent n-type layer may provide the emitter layer.
[0061] In the embodiment depicted in FIG. 4, the bottom solar cell
50a includes a double emitter structure composed of a first emitter
region 6 and a second emitter region 9. Typically, in a double
emitter structure the first and second emitter regions 6, 9 have
the same conductivity type, e.g., n-type or p-type conductivity.
The concentration of dopant that provides the conductivity of the
first emitter region 6 and the second emitter region 9 it typically
greater in the second conductivity region 9. In one embodiment, the
first emitter region 6 and the second emitter region 9 having a
p-type conductivity type are formed on an n-type conductivity
single crystalline germanium (c-Si) absorption layer, e.g.,
transferred portion of the germanium-containing substrate 5a. In
another embodiment, the first emitter region 6 and the second
emitter region 9 having an n-type conductivity type are formed on a
p-type conductivity single crystalline germanium (c-Si) absorption
layer, e.g., transferred portion of the germanium-containing
substrate 5a.
[0062] The first emitter region 6 may be an amorphous material, a
nanocrystalline material, a microcrystalline material, a
polycrystalline material, or a single crystalline material of
silicon, germanium, or silicon-germanium alloys that may or may not
include hydrogen. The term "crystalline" includes nanocrystalline,
polycrystalline or microcrystalline. The term "single crystalline"
denotes a crystalline solid, in which the crystal lattice of the
entire sample is substantially continuous and substantially
unbroken to the edges of the sample, with substantially no grain
boundaries. In another embodiment, the crystalline semiconductor
material of the absorption layer is of a multi-crystalline or
polycrystalline structure. Contrary to a single crystal crystalline
structure, a polycrystalline structure is a form of semiconductor
material made up of randomly oriented crystallites and containing
large-angle grain boundaries, twin boundaries or both.
Multi-crystalline is widely referred to a polycrystalline material
with large grains (of the order of millimeters to centimeters).
Other terms used are large-grain polycrystalline, or large-grain
multi-crystalline. The term polycrystalline typically refers to
small grains (hundreds of nanometers, to hundreds of microns).
[0063] Still referring to FIG. 4, the first emitter region 6 may be
a material layer that is present on, and in direct contact with,
the entire width of the absorption layer, i.e., transferred portion
of the germanium-containing substrate 5a. In one embodiment, the
first emitter region 6 is a continuous layer that is present across
the entire width of the absorption layer, and the second emitter
region 9 is composed of islands of discontinuous material that are
positioned to be contacted by the subsequently formed tunneling
layer 11.
[0064] In some embodiments, the first emitter region 6 may be
composed of a crystalline semiconductor layer may be composed of a
silicon-containing material or a germanium-containing material.
Some examples of materials suitable for the first emitter region 6
include silicon, germanium, silicon germanium, silicon alloyed with
carbon, silicon germanium alloyed with carbon and combinations
thereof. The first emitter region 6 may also be a compound
semiconductor, such as type semiconductors. A "III-V semiconductor
material" is an alloy composed of elements from group III and group
V of the Periodic Table of Elements. In one embodiment, the first
emitter region 6 is comprised of at least one III-V semiconductor
material selected from the group consisting of aluminum antimonide
(AlSb), aluminum arsenide (AlAs), aluminum nitride (AlN), aluminum
phosphide (AlP), gallium arsenide (GaAs), gallium phosphide (GaP),
indium antimonide (InSb), indium arsenic (InAs), indium nitride
(InN), indium phosphide (InP), aluminum gallium arsenide (AlGaAs),
indium gallium phosphide (InGaP), aluminum indium arsenic (AlInAs),
aluminum indium antimonide (AlInSb), gallium arsenide nitride
(GaAsN), gallium arsenide antimonide (GaAsSb), aluminum gallium
nitride (AlGaN), aluminum gallium phosphide (AlGaP), indium gallium
nitride (InGaN), indium arsenide antimonide (InAsSb), indium
gallium antimonide (InGaSb), aluminum gallium indium phosphide
(AlGaInP), aluminum gallium arsenide phosphide (AlGaAsP), indium
gallium arsenide phosphide (InGaAsP), indium arsenide antimonide
phosphide (InArSbP), aluminum indium arsenide phosphide (AlInAsP),
aluminum gallium arsenide nitride (AlGaAsN), indium gallium
arsenide nitride (InGaAsN), indium aluminum arsenide nitride
(InAlAsN), gallium arsenide antimonide nitride (GaAsSbN), gallium
indium nitride arsenide aluminum antimonide (GaInNAsSb), gallium
indium arsenide antimonide phosphide (GaInAsSbP), and combinations
thereof. The first emitter region 6 may further include fluorine,
deuterium, oxygen and/or nitrogen.
[0065] The first emitter region 6 may be formed on the transferred
portion of the germanium-containing substrate 5a using chemical
vapor deposition (CVD). CVD is a deposition process in which a
deposited species is formed as a result of chemical reaction
between gaseous reactants, wherein the solid product of the
reaction is deposited on the surface on which a film, coating, or
layer of the solid product is to be formed. Variations of CVD
processes suitable include, but are not limited to, Atmospheric
Pressure CVD (APCVD), Low Pressure CVD (LPCVD) and Plasma Enhanced
CVD (PECVD), Metal-Organic CVD (MOCVD), molecular beam epitaxy
(MBE) and combinations thereof.
[0066] In one embodiment, the first emitter region 6 is formed
using an epitaxial deposition process. The terms "epitaxially
formed", "epitaxial growth" and/or "epitaxial deposition" means the
growth of a semiconductor material on a deposition surface of a
semiconductor material, in which the semiconductor material being
grown has the same crystalline characteristics as the semiconductor
material of the deposition surface. Therefore, in the embodiments
in which the transferred portion of the germanium-containing
substrate 5a that provides the bottom cell of bottom solar cell 50a
has a single crystal crystalline structure, the epitaxially grown
first emitter region 6 also has a single crystal crystalline
structure. Further, in the embodiments in which the transferred
portion of the germanium-containing substrate 5a has a
polycrystalline structure, a first emitter region 6 that is
epitaxially grown on the transferred portion 5a of the
germanium-containing substrate will also have a polycrystalline
structure.
[0067] The first emitter region 6 may be doped with an in-situ
doping process or may be doped following deposition of the material
layer for the first emitter region using at least one of plasma
doping, ion implantation, and/or outdiffusion from a disposable
diffusion source (e.g., borosilicate glass). By in-situ it is meant
that the dopant that provides the conductivity type of the material
layer, e.g., first emitter region 6, is introduced as the material
layer is being formed or deposited.
[0068] Still referring to FIG. 4, an upper dielectric layer 12 may
be present on the upper surface of the first emitter region 6, in
which openings are formed through the upper dielectric layer 12 to
expose the portion of the first emitter region 6 in which the
second emitter region 9 is formed. The upper dielectric layer 12
may be composed of silicon oxide, silicon nitride or a combination
thereof. In another embodiment, the upper dielectric layer 12 may
be composed of intrinsic hydrogenated amorphous silicon,
hydrogenated amorphous germanium, hydrogenated amorphous silicon
germanium or a combination thereof. The openings that are formed
through the upper dielectric layer 12 that correspond to the second
emitter region 9 of the emitter structure are formed using
photolithography and etch processes. Once the portion of the first
emitter region 6 is exposed, in which the second emitter region 9
is to be positioned, the exposed portions of the first emitter
region 6 are implanted with the dopant that provides the second
emitter region 9 using at least one of plasma doping, ion
implantation, and/or outdiffusion from a disposable diffusion
source (e.g., borosilicate glass). The dopant for the second
emitter region 9 is typically the same conductivity as the first
emitter region 6, and the dopant concentration in the second
emitter region 9 is typically greater than the dopant concentration
of the first emitter region 6.
[0069] In another embodiment that is not depicted in FIG. 4,
instead of the first emitter region being provided by a deposited
material layer, such as an epitaxially formed semiconductor layer,
the first emitter region may be formed in the transferred portion
of the germanium-containing substrate by counter doping the cleaved
surface of the transferred portion of the germanium-containing
substrate. By "counter doping" it is meant that the dopant that
provides the first emitter region has an opposite conductivity type
than the conductivity type of the transferred portion of the
germanium containing substrate that provides the absorption layer.
The second emitter region may be formed in the counter doped first
emitter region using the method for forming the second emitter
region that is described above with reference to FIG. 4.
[0070] Referring to FIG. 4, in one embodiment, a tunneling layer 11
is formed on the upper dielectric layer 12, and includes a portion
that is in direct contact with the second emitter region 9. The
tunneling layer 11 may be composed of a metal layer or a
transparent conductivity material. In one embodiment, the tunneling
layer 11 may be composed of a transparent conductive material, such
as the transparent conductive oxide (TCO). The role of the optional
tunneling layer is to enhance the tunneling of the carriers at the
p.sup.+/n.sup.+ tunneling junction formed at the interface between
the top cell and the bottom cell. In one embodiment, the tunneling
layer 11 may have a thickness ranging from 5 nm to 15 nm, although
larger and lesser thicknesses may be also used. The thickness of
the tunneling layer is typically adjusted to optimize the tunneling
of carriers, as well as the optical coupling between the top cell
and the bottom cell.
[0071] FIG. 5 depicts another embodiment of a bottom solar cell
50b. In the embodiment depicted in FIG. 5, the double emitter
structure that is depicted in FIG. 4 is replaced with a single
emitter structure identified by reference number 13. The single
emitter structure 13 may be provided by a semiconductor layer
similar to the first emitter region 6 that is described above with
reference to FIG. 4.
[0072] Referring to FIG. 5, the handling substrate 25, the stressor
layer 20, the passivation layer 8, the localized back surface
region 7 and the transferred portion of the germanium containing
substrate 5a that is depicted in FIG. 5 are similar to the handling
substrate 25, the stressor layer 20, the passivation layer 8, the
localized back surface region 7 and the transferred portion of the
germanium containing substrate 5a that is depicted in FIG. 4. The
single emitter structure 13 that is depicted in FIG. 5 is similar
to the first emitter region 6 that is described above with
reference to FIG. 4. Therefore, the description of the first
emitter region 6 that is depicted in FIG. 4 is suitable to describe
the composition and method of making the single emitter structure
13 that is depicted in FIG. 5. Similar to the first emitter region
6 that is depicted in FIG. 4, the single emitter structure 13 may
be composed of a doped material layer that is deposited on the
transferred portion of the germanium-containing substrate 5a that
provides the absorption layer, or may be a counter doped region
that is formed into the cleaved surface 4 of the transferred
portion of the germanium-containing substrate 5a that provides the
absorption layer.
[0073] Still referring to FIG. 5, an intrinsic hydrogenated
amorphous semiconductor layer 14 may be formed on the upper surface
of the single emitter structure 13. The intrinsic hydrogenated
amorphous silicon layer 14 may function as a passivation layer. The
intrinsic hydrogenated amorphous semiconductor layer 14 may be
formed using the method of forming the intrinsic hydrogenated
amorphous silicon layer that is described above with reference to
FIG. 2. Alternatively, the intrinsic hydrogenated amorphous
semiconductor layer 14 may be composed of intrinsic hydrogenated
amorphous germanium or intrinsic hydrogenated amorphous silicon
germanium. A tunneling layer 11 may be formed on the intrinsic
hydrogenated amorphous semiconductor layer 14. The tunneling layer
11 that is depicted in FIG. 5 is similar to the tunneling layer 11
that is described above with reference to FIG. 4.
[0074] FIG. 6 depicts another embodiment of a bottom solar cell
50c. The embodiment depicted in FIG. 6 is similar to the bottom
solar cell 50a that is depicted in FIG. 4, with the exception that
the localized back surface field region 7 that is depicted in FIG.
4 is substituted with a back surface field region 15 that extends
across the entire width of the transferred portion of the
germanium-containing substrate 5a that provides the absorption
layer of the bottom solar cell 50c. The back surface field region
15 is similar to the back surface field region that is described
above with reference to FIG. 2. In one embodiment, the back surface
field region 15 may be a doped region that is implanted into the
surface of the transferred portion of the germanium-containing
substrate 5a that is opposite the cleaved surface 4 of the
transferred portion of the germanium-containing substrate 5a, or
the back surface field region 15 may be provided by a deposited
layer that is formed on the surface of the transferred portion of
the germanium-containing substrate 5a that is opposite the cleaved
surface 4 of the transferred portion of the germanium-containing
substrate 5a. The back surface field region 15 is doped to the same
conductivity type as the transferred portion of the
germanium-containing substrate 5a that provides the absorption
layer of the bottom solar cell 50c, wherein the dopant
concentration in the back surface field region 15 is greater than
the dopant concentration in the transferred portion of the
germanium-containing substrate 5a.
[0075] In one embodiment, an intrinsic hydrogenated amorphous
semiconductor layer 17 may be formed in direct contact with the
back surface field region 15. The intrinsic hydrogenated amorphous
semiconductor 17 may function as a passivation layer. The intrinsic
hydrogenated amorphous semiconductor layer 17 may be formed using
the method of forming the intrinsic hydrogenated amorphous silicon
layer that is described above with reference to FIG. 2.
Alternatively, the intrinsic hydrogenated amorphous silicon layer
may be composed of hydrogenated amorphous germanium or hydrogenated
amorphous silicon germanium.
[0076] Although not depicted in FIG. 6, a semiconductor material
having the same conductivity type as the transferred portion of the
germanium-containing substrate 5a may be present between a stressor
layer 20 and the back surface filed region 15. The semiconductor
material may be an amorphous material, a nanocrystalline material,
microcrystalline material, polycrystalline material, or single
crystal material of silicon, germanium, or silicon-germanium alloys
that may or may not include hydrogen. This layer may serve to
further enhance the electric field at the back surface for
repelling the minority carriers. This semiconductor layer is
typically chosen to be have a higher doping level than that of the
back surface field region 15, and/or a lower electron affinity
(.chi..sub.e) than the germanium-containing substrate 5 (in case of
n-type doping), and/or a larger sum of electron affinity and
bandgap (E.sub.g), i.e. .chi..sub.e+E.sub.g than the germanium
containing substrate 5 (in case of p-type doping). In one example,
where the germanium containing substrate is single-crystalline and
n-type, the back surface field region 15 is formed by diffusion of
phosphorous into the substrate, the passivation layer 17 is
intrinsic hydrogenated amorphous silicon deposited by PECVD, and
the optional semiconductor layer mentioned above is n.sup.+ doped
hydrogenated amorphous Si deposited also by PECVD. Since
hydrogenated amorphous Si has a lower electron affinity than the
substrate 5, the n+ doped hydrogenated amorphous Si layer mentioned
above (not shown) improves the electric field that repels the
minority carriers (holes) from the back surface. In another example
the same as the aforementioned example with the exception that the
back-surface-field layer 15 is formed by deposition of n.sup.+
doped poly-silicon by a CVD technique, or by deposition of n.sup.+
doped amorphous Si by a CVD or PVD technique followed by
solid-phase-crystallization (e.g. by rapid thermal annealing at
temperatures >600.degree. C.) to form n.sup.+ doped poly-Si;
since hydrogenated amorphous Si has a lower electron affinity than
the substrate 5, and poly-Si layer 15, the n.sup.+ doped
hydrogenated amorphous Si layer mentioned above (not shown)
improves the electric field that repels the minority carriers
(holes) from the back surface of the substrate. In another example
where the germanium containing substrate is single-crystalline and
p-type, the back surface field region 15 is formed by diffusion of
aluminum into the substrate, the passivation layer 17 is intrinsic
hydrogenated amorphous silicon-germanium deposited by PECVD, and
the optional semiconductor layer mentioned above is p.sup.+ doped
hydrogenated amorphous silicon-germanium deposited also by PECVD.
Since hydrogenated amorphous SiGe has a larger sum of electron
affinity and bandgap (.chi..sub.e+E.sub.g) than the substrate 5,
the p.sup.+ doped hydrogenated amorphous SiGe layer mentioned above
(not shown) improves the electric field that repels the minority
carriers (electrons) from the back surface of the germanium
containing substrate 5. In another example, the same as the
aforementioned embodiment except in that the back-surface-field
layer 15 is formed by deposition of p.sup.+ doped poly-silicon (or
poly-SiGe) by a CVD technique, or by deposition of p.sup.+ doped
amorphous Si (or amorphous SiGe) by a CVD or PVD technique followed
by solid-phase-crystallization to form p.sup.+ doped poly-Si (or
poly-SiGe); since hydrogenated amorphous Si (or SiGe) has a larger
sum of electron affinity and bandgap (.chi..sub.e+E.sub.g) than the
substrate 5, and poly-Si (or poly-SiGe) layer 15, the p.sup.+ doped
hydrogenated amorphous Si layer mentioned above (not shown)
improves the electric field that repels the minority carriers
(electrons) from the back surface of the substrate 5. In the
embodiment depicted in FIG. 6, the back surface field region 15,
the intrinsic hydrogenated amorphous silicon layer 17, and the
semiconductor material (not shown) having the same conductivity
type as the transferred portion of the germanium-containing
substrate 5a are optional, and may be omitted.
[0077] The handling substrate 25, the stressor layer 20, the
transferred portion 5a of the germanium containing substrate, the
first emitter region 6, the second emitter region 9, the upper
dielectric layer 12, and the tunneling layer 11 that are depicted
in FIG. 6 are similar to handling substrate 25, the stressor layer
20, the transferred portion 5a of the germanium containing
substrate, the first emitter region 6, the second emitter region 9,
the upper dielectric layer 12, and the tunneling layer 11 that are
depicted in FIG. 4. Therefore, the above description of the
handling substrate 25, stressor layer 20, the transferred portion
5a of the germanium containing substrate, the first emitter region
6, the second emitter region 9, the upper dielectric layer 12, and
the tunneling layer 11 with reference to FIG. 4 is suitable for the
structures identified by the same reference numbers in FIG. 6.
[0078] FIG. 7 depicts another embodiment of a bottom solar cell
50d. In the embodiment, depicted in FIG. 7, single emitter
structure 13 is in direct contact with a transferred portion 5a of
the germanium-containing substrate, a hydrogenated amorphous
silicon layer 14 is present on the upper surface of the single
emitter structure 13 and a tunneling layer is present on the
hydrogenated amorphous silicon layer. The single emitter structure
13, and the hydrogenated amorphous silicon layer 14 have been
described above with reference to FIG. 5. The transferred portion
of the germanium-containing substrate 5a and the tunneling layer 11
have been described above with reference to FIG. 4. The bottom
solar cell 50d that is depicted in FIG. 7 further includes a back
surface field region 15 that is in direct contact with, or formed
within, the transferred portion of the germanium-containing
substrate 5a, and an intrinsic hydrogenated amorphous silicon layer
17 that is in direct contact with the back surface filed region 15.
The back surface field region 15 and the intrinsic hydrogenated
amorphous silicon layer 17 have been described above with reference
to FIG. 6. The bottom solar cell 50d that is depicted in FIG. 7 may
further include an intrinsic hydrogenated amorphous silicon layer
17, and a semiconductor material 19 having the same conductivity
type as the transferred portion 5a of the germanium-containing
substrate. Similar to the back surface field region 15 and the
intrinsic hydrogenated amorphous silicon layer 17, the stressor
layer 20 and the semiconductor material 19 have been described
above with reference to FIG. 6. The bottom solar cell 50e that is
depicted in FIG. 8 is similar to the bottom solar cell 50d that is
depicted in FIG. 7 with the exception that the bottom solar cell
50e that is depicted in FIG. 8 further includes a semiconductor
material 19 having the same conductivity type as the single emitter
structure 13. The semiconductor material 19 may be an amorphous
material, a nanocrystalline material, microcrystalline material,
polycrystalline material, or single crystal material of silicon,
germanium, or silicon-germanium alloys that may or may not include
hydrogen.
[0079] In each of the embodiments that are depicted in FIGS. 4-8,
the transferred portion 5a of the germanium containing substrate
may be chosen to have a thickness that allows for the bottom solar
cell 50a, 50b, 50c, 50d, 50e to be flexible. By "flexible" it is
meant that the bottom solar cell 50a, 50b, 50c, 50d, 50e including
the germanium-containing substrate 5 remains operational under and
inward or outward curvature of radius of at least 30 cm. The bottom
solar cells 50a, 50b, 50c, 50d, 50e that are depicted in FIGS. 4-8
may be employed in any type multi junction photovoltaic device.
[0080] FIG. 9 depicts forming at least a second solar cell 35 on a
first solar cell 30, wherein the at least one second solar cell 35
is composed of at least one semiconductor material having a wider
band gap than that of the first solar cell 30. In a typical
semiconductor, the majority of incident protons having energies
smaller than the bandgap of the semiconductor are not absorbed in
the semiconductor. In contrast, a portion of photons with energies
larger than that of the bandgap of the semiconductor may be
absorbed and converted to electron-hole pairs. The portion of the
photon energy consumed for the electron-hole generation is
proximate to the bandgap energy of the semiconductor, while the
excess photon energy (approximately equal to the difference between
the photon energy and bandgap energy) is dissipated as heat.
Therefore, the conversion of light into electricity is typically
most efficient for photons having energies close to that of the
bandgap energy. The combination of a wide bandgap top cell 35 and a
narrow band gap bottom cell 30 may allow for a more efficient
conversion of photons with higher energies in the top cell 35
(which would otherwise be less efficiently converted in the bottom
cell 30 due to a high thermal loss) and a more efficient conversion
of photons with lower energies (the majority of which absorbed in
the top cell 35) in the bottom cell 30.
[0081] The first solar cell 30 may absorb a first range of
wavelengths, and the second solar cell 35 may absorb a second range
a wavelengths, wherein they may be a small overlap between the
first and second range of wavelengths.
[0082] In one example, the materials of at least the second solar
cell 35 are selected to have a bandgap ranging from 0.7 eV to 4.5
eV, and the materials of the first solar cell 30 are selected to
have a bandgap ranging from 0.1 eV to 2.0 eV. In another example,
the materials of at least the second solar cell 35 are selected to
have a bandgap ranging from 1.5 eV to 3.0 eV, and the materials of
the first solar cell 30 are selected to have a bandgap in the range
of 0.6 eV to 1.8 eV. The energy of a photon (hv) and the wavelength
of a photon (.lamda.) are related through the well-known relation
hv=hc/.lamda., where h is the Plank's constant, and c is the speed
of light (the value of he is approximately equal to 1239 eV/nm).
For example, the energy of a photon of a wavelength of 450 nm is
approximately 2.8 eV.
[0083] Referring to FIG. 9, the bottom cell, i.e., first solar cell
30, may be single-crystalline, microcrystalline or polycrystalline.
In one embodiment, single-crystalline Ge (c-Ge) is the material
employed in the first solar cell 30, however, other low bandgap
materials such as InSb, InAs, InGaAs, InGaSb and InN, as well as
materials with higher bandgaps such as Si or GaAs are also within
the scopes of this disclosure. The first solar cell 30 may have
homojunction, heterojunction or hybrid (combination of homojunction
and heterojunction) contacts. It is noted that any of the bottom
cell structures 50a, 50b, 50c, 50d, 50e that are depicted in FIGS.
4-8 may be employed as the first solar cell 30 that is depicted in
FIG. 9. A transparent conductive material layer 29, such as a
transparent conductive oxide (TCO), may be present underlying the
first solar cell 30, wherein the transparent conductive material
layer 29 is present between the first solar cell 30 and the
handling substrate 25. In some embodiments, the transparent
conductive material layer 29 may be substituted with a stressor
layer, or the transparent conductive material layer 29 may be
employed in combination with a stressor layer. The handling
substrate 25 that is depicted in FIG. 9 has been described above
with reference to FIGS. 1-8.
[0084] The first solar cell 30 may be separated from the second
solar cell 35 by a tunneling layer 29. The tunneling layer 31 that
is depicted in FIG. 9 may be provided by the tunneling layer 11
that is depicted in FIGS. 4-8.
[0085] The at least one second solar cell 35, i.e., top cell, that
is depicted in FIG. 9 may be composed of single-crystalline,
microcrystalline, polycrystalline or amorphous semiconductor
materials. It is noted that the at least one second solar cell 35
may be composed of any number of p-n (or p-i-n) junctions, and
therefore may be any number of solar cells. In one embodiment, the
at least one second solar cell 35 may be composed of
silicon-containing and/or germanium-containing semiconductor
material, or the second solar cell 35 may be composed of compound
semiconductor materials.
[0086] Examples of silicon-containing semiconductor materials that
are suitable for the second solar cell 35 include single crystal
silicon, polycrystalline silicon, silicon alloyed with carbon,
amorphous silicon, amorphous hydrogenated silicon, amorphous
hydrogenated silicon alloyed with carbon, and combination thereof.
Examples of germanium-containing semiconductor materials include
single crystal germanium, polycrystalline germanium, amorphous
germanium, amorphous hydrogenated germanium, amorphous hydrogenated
germanium which may contain carbon. In some examples, the second
solar cell 35 may be composed of material layers that include both
germanium and silicon, such as single crystal silicon germanium,
polycrystalline silicon germanium, amorphous silicon germanium,
hydrogenated amorphous silicon germanium and hydrogenated amorphous
silicon germanium which may contain carbon. Examples of compound
semiconductor materials that are suitable for the second solar cell
35 include aluminum antimonide (AlSb), aluminum arsenide (AlAs),
aluminum nitride (MN), aluminum phosphide (AlP), gallium arsenide
(GaAs), gallium phosphide (GaP), indium antimonide (InSb), indium
arsenic (InAs), indium nitride (InN), indium phosphide (InP),
aluminum gallium arsenide (AlGaAs), indium gallium phosphide
(InGaP), aluminum indium arsenic (AlInAs), aluminum indium
antimonide (AlInSb), gallium arsenide nitride (GaAsN), gallium
arsenide antimonide (GaAsSb), aluminum gallium nitride (AlGaN),
aluminum gallium phosphide (AlGaP), indium gallium nitride (InGaN),
indium arsenide antimonide (InAsSb), indium gallium antimonide
(InGaSb), aluminum gallium indium phosphide (AlGaInP), aluminum
gallium arsenide phosphide (AlGaAsP), indium gallium arsenide
phosphide (InGaAsP), indium arsenide antimonide phosphide
(InArSbP), aluminum indium arsenide phosphide (AlInAsP), aluminum
gallium arsenide nitride (AlGaAsN), indium gallium arsenide nitride
(InGaAsN), indium aluminum arsenide nitride (InAlAsN), gallium
arsenide antimonide nitride (GaAsSbN), gallium indium nitride
arsenide aluminum antimonide (GaInNAsSb), gallium indium arsenide
antimonide phosphide (GaInAsSbP), or combinations thereof.
[0087] Referring to FIG. 9, a transparent conductive material layer
36 may be present on the upper surface of the second solar cell 35.
The transparent conductive material layer 36 can include a
transparent conductive oxide (TCO) such as, but not limited to, a
fluorine-doped tin oxide (SnO.sub.2:F), an aluminum-doped zinc
oxide (ZnO:Al), tin oxide (SnO) and indium tin oxide (InSnO.sub.2,
or ITO for short). The thickness of the transparent conductive
material layer 36 may vary depending on the type of transparent
conductive material employed, as well as the technique that was
used in forming the transparent conductive material. Typically, and
in one embodiment, the thickness of the transparent conductive
material layer 36 ranges from 10 nm to 3 microns.
[0088] At least one front contact 37 may be atop the transparent
conductive oxide (TCO). The front contact 50 of the photovoltaic
device may include a set of parallel narrow finger lines and wide
37 lines deposited essentially at a right angle to the finger
lines. The front contact 37 may be deposited with a screen printing
technique or photolithography or some other techniques. In another
embodiment, the front contact 37 is provided by the application of
an etched or electroformed metal pattern. The metallic material
used in forming the metal pattern for the front contact 37 may also
be deposited using sputtering or plating. The thickness of the
front contact 37 can range from 100 nm to 10 .mu.m, although lesser
and greater thicknesses can also be employed. In some embodiments,
forming the front contact 50 may include applying an antireflection
(ARC) coating. The antireflection coating (ARC) may be composed of
silicon nitride (SiN.sub.x) or silicon oxide (SiO.sub.x) grown by
PECVD at temperatures as low as 200.degree. C. In another example,
the antireflective coating (ARC) may be a dual layer structure
composed of zinc-sulfide (ZnS) and magnesium fluoride (MgF.sub.2).
Other embodiments have been contemplated that do not include the
above compositions for the antireflection coating (ARC) and the
front contact 37.
[0089] The photovoltaic device that is depicted in FIG. 9 is
provided for illustrative purposes only and is not intended to
limit the present disclosure. It is noted that any number of solar
cells and contact structures may be present atop the first solar
cell 30 that is depicted in FIG. 9.
[0090] FIG. 10 depicts one embodiment of a tandem photovoltaic
device in which the first solar cell 30a includes a transferred
portion of the germanium-containing substrate 5a, e.g., a
crystalline germanium layer, and a semiconductor layer that is
formed on a cleaved surface 4 of the transferred portion 5a of the
germanium-containing substrate. The photovoltaic device that is
depicted in FIG. 10 is a tandem device comprised of first solar
cell 30a of a heterojunction (HJ) single crystal germanium cell and
at least a second solar cell 35a composed of p-type conductivity
hydrogenated amorphous silicon, intrinsic hydrogenated amorphous
silicon, and n-type conductivity hydrogenated amorphous
silicon.
[0091] In one embodiment, the transferred portion 5a of the
germanium-containing substrate is composed of single crystal
germanium that is doped to a n-type conductivity. An intrinsic
semiconductor layer 38, 39 may be present on the upper and lower
surface of the transferred portion 5a of the germanium-containing
substrate. The intrinsic semiconductor layer 38, 39 may be composed
of hydrogenated amorphous silicon. In one embodiment, an upper
p-type conductivity hydrogenated amorphous silicon layer 40 may be
present on the intrinsic semiconductor layer 38 that is presented
on the cleaved surface 4 of the transferred portion of the
germanium-containing substrate 5a that is doped to an n-type
conductivity. A lower n-type conductivity hydrogenated silicon
layer 41 is typically underlying the intrinsic semiconductor layer
39 that is present on the back surface of the transferred portion
of the germanium-containing substrate 5a. The lower n-type
conductivity hydrogenated silicon layer 41 may be present on an
upper surface of a stressor layer 20 composed of a metal. A
handling substrate 25, which may be flexible, is present under the
stressor layer 20.
[0092] Still referring to FIG. 10, the first solar cell 30a is
separated from at least a second solar cell 35a by a tunneling
layer 31a. The tunneling layer 31a that is depicted in FIG. 10 is
similar to the tunneling layer 31 that is depicted in FIG. 9.
Therefore, the description of the tunneling layer 31 that is
depicted in FIG. 9 is suitable for the tunneling layer 31a that is
depicted in FIG. 10. The at least one second solar cell 35a may
include a p-i-n junction that is provided by a material stack that
includes, from top to bottom, a p-type hydrogenated amorphous
silicon layer 44, intrinsic amorphous silicon layer 43, and an
n-type hydrogenated amorphous silicon layer 42. A transparent
conductive material layer 36a may be present on the upper surface
of the at least one second solar cell 35a. A front contact 37a may
be present on the transparent conductive material layer 36a. The
transparent conductive material layer 36a and the front contact 37a
that are depicted in FIG. 10 are similar to the transparent
conductive material layer 36 and the front contact 37 that are
depicted in FIG. 9.
[0093] In one embodiment, to form the structure depicted in FIG. 9,
the intrinsic semiconductor layer 39 of hydrogenated amorphous
silicon and the lower n-type conductivity hydrogenated amorphous
silicon layer 41 may be formed on a germanium containing substrate
prior to spalling. The stressor layer 20 may then be deposited on
the n-type conductivity hydrogenated amorphous silicon layer,
wherein stress from the stressor layer 41 induces spalling of the
germanium containing substrate. The transferred portion 5a of the
germanium containing substrate remains attached to the intrinsic
semiconductor layer 39, wherein the transferred portion 5a of the
germanium containing substrate has a thickness ranging from 500 nm
to 10 microns, although thinner or thicker layers may be
transferred as well. Following spalling, the intrinsic
semiconductor layer 38 is formed on the cleaved surface 4 of the
transferred portion of the germanium containing substrate 5a, and
the upper p-type conductivity hydrogenated amorphous silicon layer
40 is formed on the intrinsic semiconductor layer 38. The tunneling
layer 31a, the at least one second solar cell 35a, the transparent
conductive material layer 36a, and the front contact 37a may then
be formed.
[0094] The calculated quantum efficiency of the tandem photovoltaic
device that is depicted in FIG. 10 based on the quantum
efficiencies of the first and at least the second solar cells 30a,
35a is plotted in FIG. 11, as identified by reference number 45a,
and the predicted efficiency of the tandem photovoltaic device that
is depicted in FIG. 10 as a function of the thickness of the
transferred portion 5a of the crystalline germanium substrate is
plotted in FIG. 12, as identified by reference number 45b.
Comparative examples are provide in FIGS. 11 and 12 by plots of the
efficiencies of a homo-junction single crystalline germanium bottom
cell identified by reference number 46a, 46b, identified by
reference numbers 46a, 46b, and a hetero junction single crystal
silicon cell with contacts of amorphous hydrogenated silicon,
identified by reference numbers 47a, 47b. Referring to FIGS. 11 and
12, the higher efficiency in the case of the tandem photovoltaic
device including the transferred portion 5a of the germanium
containing substrate (single crystal germanium) compared to a
similarly prepared device having a bottom cell composed of silicon
is due to the lower bandgap and smaller spectral overlap of single
crystal germanium with the adjacent material layers of hydrogenated
amorphous silicon, as employed in the tandem photovoltaic device
that is depicted in FIG. 10.
[0095] FIG. 13 depicts another embodiment of a tandem photovoltaic
device that includes a second solar cell 35b that is composed of a
triple junction. The first solar cell 30b of the tandem
photovoltaic device that is depicted in FIG. 13 is similar to the
first solar cell 30a that is depicted in FIG. 10. Therefore, the
description of the first solar cell 30a, and the material layers
included therein, that are depicted in FIG. 10 is suitable for the
first solar cell 30b, and the materials included therein, that are
depicted in FIG. 13. Similarly, the description of the stressor
layer 20 and the handling substrate 25, which may be flexible, that
are depicted in FIG. 10 are suitable for the stressor layer 20 and
the handling substrate 25 that are depicted in FIG. 13.
[0096] In one embodiment, the second solar cell 35 is composed of a
material stack that includes, from top to bottom, a first p-i-n
junction 48, a first tunneling layer 49, a second p-i-n junction
54, a second tunneling layer 52 and a third p-i-n junction 53. In
one embodiment, the first p-i-n junction 48 is composed of a p-type
conductivity hydrogenated amorphous silicon layer, an intrinsic
hydrogenated amorphous silicon layer, and an n-type conductivity
hydrogenated amorphous silicon layer. In one embodiment, the second
p-i-n junction 54 is composed of a p-type conductivity hydrogenated
amorphous silicon germanium layer, an intrinsic hydrogenated
amorphous silicon germanium layer, and an n-type conductivity
hydrogenated amorphous silicon germanium layer. In one embodiment,
the third p-i-n junction 52 is composed of a p-type conductivity
hydrogenated crystalline silicon layer, an intrinsic hydrogenated
crystalline silicon layer, and an n-type conductivity hydrogenated
crystalline silicon layer.
[0097] In one embodiment, to form the structure depicted in FIG.
13, the intrinsic semiconductor layer 39 of hydrogenated amorphous
silicon and the lower n-type conductivity hydrogenated amorphous
silicon layer 41 may be formed on a germanium containing substrate
prior to spalling. The stressor layer 20 may then be deposited on
the n-type conductivity hydrogenated amorphous silicon layer 41,
wherein stress from the stressor layer 20 induces spalling of the
germanium containing substrate. The transferred portion 5a of the
germanium containing substrate remains attached to the intrinsic
semiconductor layer 39, wherein the transferred portion 5a of the
germanium containing substrate has a thickness ranging from 500 nm
to 10 microns, although thinner or thicker layers may be also
transferred. Following spalling, the intrinsic semiconductor layer
38 is formed on the cleaved surface 4 of the transferred portion 5a
of the germanium containing substrate, and the upper p-type
conductivity hydrogenated amorphous silicon layer 40 is formed on
the intrinsic semiconductor layer 38. The at least one second cell
35b, the transparent conductive material layer 36b, and the front
contact 37b may then be formed.
[0098] The calculated quantum efficiency of the tandem photovoltaic
device depicted in FIG. 13 based on the quantum efficiencies of the
top and bottom cells 30b, 35b is plotted in FIG. 14, and the
predicted efficiency of the tandem photovoltaic device as a
function of the thickness of the transferred portion of the
germanium 5a containing substrate is plotted in FIG. 15, as
identified by reference number 45c. Comparative examples are
provide in FIGS. 14 and 15 by plots of the efficiencies of a
homo-junction single crystalline germanium bottom cell identified
by reference number 46a, 46b, identified by reference numbers 46a,
46b, and a hetero-junction single crystal silicon cell with
contacts of amorphous hydrogenated silicon, identified by reference
numbers 47a, 47b. Referring to FIGS. 14 and 15, the higher
efficiency in the case of the tandem photovoltaic device depicted
in FIG. 13 including the transferred portion of the germanium
containing substrate 5a (single crystal germanium) compared to a
similarly prepared device having a bottom cell composed of silicon
is due to the lower bandgap and smaller spectral overlap of single
crystal germanium with the adjacent material layers of hydrogenated
amorphous silicon, as employed in the tandem photovoltaic device
that is depicted in FIG. 13.
[0099] FIG. 16 depicts another embodiment of a tandem photovoltaic
device, wherein the first solar cell 30c includes p-type
conductivity crystalline germanium layer, which may be provided
from a transferred portion of a germanium containing substrate 5a,
and at least one semiconductor layer that is formed on a cleaved
surface of the transferred portion of a germanium containing
substrate 5a. In one embodiment, the at least one semiconductor
layer is composed of an upper intrinsic hydrogenated amorphous
silicon layer 61 that is present on the cleaved surface of the
transferred portion of the germanium containing substrate 5a. An
n-type conductivity hydrogenated amorphous silicon layer 61 is then
formed on the intrinsic hydrogenated amorphous silicon layer 61. An
epitaxial silicon layer 63 may be formed on the back surface of the
transferred portion of the germanium containing substrate 5a that
is opposite the cleaved surface 4 of the transferred portion of
germanium containing substrate 5a. The epitaxial silicon layer 63
typically has the same conductivity type as the transferred portion
of the germanium containing substrate 5a. Therefore, if the
transferred portion of the germanium containing substrate 5a has a
p-type conductivity, the epitaxial silicon layer 63 has a p-type
conductivity. The dopant concentration of the epitaxial silicon
layer 63 is typically greater than the dopant concentration in the
transferred portion of germanium containing substrate 5a. A lower
intrinsic hydrogenated amorphous silicon layer 63 may be in contact
with the epitaxial silicon layer 63, and a p-type conductivity
hydrogenated amorphous silicon layer 65 may be underlying the
epitaxial silicon layer 63. The description of the stressor layer
20 and the handling substrate 25, which may be flexible, that are
depicted in FIG. 10 are suitable for the stressor layer 20 and the
handling substrate 25 that are depicted in FIG. 16.
[0100] Still referring to FIG. 16, the first solar cell 30c is
separated from at least a second solar cell 35c by a tunneling
layer 31c. The tunneling layer 31c that is depicted in FIG. 16 is
similar to the tunneling layer 31 that is depicted in FIG. 9. The
at least one second solar cell 35c may include a p-type buffer
region 66 on the tunneling layer 31c, a layer of p-type
copper-indium-gallium sellenide, p-type cadmium telluride, p-type
CZTS or p-type CZTSe on the p-type buffer region 67, and an n-type
cadmium sulfide layer 68. A transparent conductive material layer
36c may be present on the upper surface of the at least one second
solar cell 35c. A front contact 37c may be present on the
transparent conductive material layer 36c.
[0101] While the present disclosure has been particularly shown and
described with respect to preferred embodiments thereof, it will be
understood by those skilled in the art that the foregoing and other
changes in fauns and details can be made without departing from the
spirit and scope of the present disclosure. It is therefore
intended that the present disclosure not be limited to the exact
forms and details described and illustrated, but fall within the
scope of the appended claims.
* * * * *