U.S. patent application number 13/187370 was filed with the patent office on 2013-01-24 for method for manufacturing a magnetic write pole having straight side walls and a well defined track-width.
This patent application is currently assigned to Hitachi Global Storage Technologies Netherlands B.V.. The applicant listed for this patent is Sue Siyang Zhang, Yi Zheng, Qiping Zhong, Honglin Zhu. Invention is credited to Sue Siyang Zhang, Yi Zheng, Qiping Zhong, Honglin Zhu.
Application Number | 20130019467 13/187370 |
Document ID | / |
Family ID | 47554721 |
Filed Date | 2013-01-24 |
United States Patent
Application |
20130019467 |
Kind Code |
A1 |
Zhang; Sue Siyang ; et
al. |
January 24, 2013 |
METHOD FOR MANUFACTURING A MAGNETIC WRITE POLE HAVING STRAIGHT SIDE
WALLS AND A WELL DEFINED TRACK-WIDTH
Abstract
A method for manufacturing a magnetic write head having a write
pole with a very narrow track width, straight well defined sides
and a well defined trailing edge width (e.g. track-width). The
method includes uses two separate chemical mechanical polishing
processes that stop at separate CMP stop layers. The first CMP stop
layer is deposited directly over a RIEable fill layer. A RIE mask,
is formed over the fill layer and first CMP stop layer, the RIE
mask having an opening. A trench then is formed in the RIEable fill
layer. A second CMP stop layer is then deposited into the trench
and over the RIE mask, followed by plating of a magnetic material.
First and second chemical mechanical polishing processes are then
performed, the first stopping at the first CMP stop and the second
stopping at the second CMP stop.
Inventors: |
Zhang; Sue Siyang;
(Saratoga, CA) ; Zheng; Yi; (San Ramon, CA)
; Zhong; Qiping; (San Jose, CA) ; Zhu;
Honglin; (Fremont, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Zhang; Sue Siyang
Zheng; Yi
Zhong; Qiping
Zhu; Honglin |
Saratoga
San Ramon
San Jose
Fremont |
CA
CA
CA
CA |
US
US
US
US |
|
|
Assignee: |
Hitachi Global Storage Technologies
Netherlands B.V.
Amsterdam
NL
|
Family ID: |
47554721 |
Appl. No.: |
13/187370 |
Filed: |
July 20, 2011 |
Current U.S.
Class: |
29/603.07 |
Current CPC
Class: |
G11B 5/3116 20130101;
Y10T 29/49043 20150115; Y10T 29/49041 20150115; Y10T 29/49044
20150115; Y10T 29/49032 20150115; Y10T 29/49046 20150115; Y10T
29/49048 20150115; G11B 5/3169 20130101; G11B 5/3163 20130101; Y10T
29/49052 20150115 |
Class at
Publication: |
29/603.07 |
International
Class: |
G11B 33/00 20060101
G11B033/00 |
Claims
1. A method for manufacturing a magnetic write head, comprising:
forming a substrate; depositing a fill layer over the substrate;
depositing a first CMP stop layer over the fill layer; forming a
mask structure over the substrate; depositing a RIE mask layer over
the CMP stop layer and the mask structure; removing the mask
structure to leave an opening in the RIE mask layer; performing a
first reactive ion etching to remove portions of the CMP stop layer
that are exposed through the opening in the RIE mask to expose a
portion of the fill layer; performing second reactive ion etching
to remove the exposed portion of the fill layer to form a trench in
the fill layer; depositing a second CMP stop layer, a portion of
the second CMP stop layer extending outside of the trench;
electroplating a magnetic material; performing a first chemical
mechanical polishing, the first chemical mechanical polishing
terminating at the second CMP stop layer; performing an ion milling
to remove portions of the second CMP stop layer that that extend
outside of the trench; and performing a second chemical mechanical
polishing to remove the hard mask layer; the second chemical
mechanical polishing terminating at the first CMP stop layer.
2. The method as in claim 1 wherein the second CMP stop layer
comprises an electrically conductive, non-magnetic material.
3. The method as in claim 1 wherein the second CMP stop layer
comprises an electrically conductive material deposited by a
conformal deposition process.
4. The method as in claim 1 wherein the second CMP stop layer
comprises an electrically conductive material deposited by atomic
layer deposition.
5. The method as in claim 1 wherein the second CMP stop layer
comprises Ru.
6. The method as in claim 1 wherein the first CMP stop layer
comprises Ru, diamond like carbon or carbon.
7. The method as in claim 1 wherein the RIE mask layer comprises
NiCr.
8. The method as in claim 1 wherein the fill layer comprises
alumina.
9. The method as in claim 1 wherein the removing the mask structure
further comprises, performing an ion milling at a glancing angle to
remove RIE mask layer from side portions of the mask structure and
performing a chemical liftoff.
10. The method as in claim 1 wherein the first reactive ion etching
is performed using a CF.sub.4/CFH.sub.3 based and a O.sub.2 based
chemistry.
11. The method as in claim 1 wherein the second reactive ion
etching is performed in a BCl.sub.3 based chemistry.
12. The method as in claim 1 wherein the first CMP stop layer is
carbon or DLC, BCl.sub.3 based chemistry reactive ion etching can
be performed as single step RIE to replace both the first and the
second reactive ion etching steps.
13. The method as in claim 1 further comprising, after depositing
the RIE mask layer, depositing a capping layer over the hard mask
layer.
14. The method as in claim 1 further comprising, after depositing
the RIE mask layer depositing a layer of Ta over the hard mask
layer.
15. A method for manufacturing a magnetic write head, comprising:
forming a substrate; depositing a fill layer over the substrate;
depositing a first CMP stop layer over the fill layer; depositing a
capping layer over the first CMP stop layer; forming a mask
structure over the capping layer; depositing a RIE mask layer over
the CMP stop layer and the mask structure; removing the mask
structure to leave an opening in the RIE mask layer; performing a
first reactive ion etching to remove portions of the CMP stop layer
that are exposed through the opening in the RIE mask to expose a
portion of the fill layer; performing second reactive ion etching
to remove the exposed portion of the fill layer to form a trench in
the fill layer; depositing a second CMP stop layer, a portion of
the second CMP stop layer extending outside of the trench;
electroplating a magnetic material; performing a first chemical
mechanical polishing, the first chemical mechanical polishing
terminating at the second CMP stop layer; performing an ion milling
to remove portions of the second CMP stop layer that that extend
outside of the trench; and performing a second chemical mechanical
polishing to remove the hard mask layer; the second chemical
mechanical polishing terminating at the first CMP stop layer.
16. The method as in claim 15 wherein the capping layer comprises
Ta.
17. The method as in claim 15 wherein the first CMP stop layer
comprises Ru, diamond like carbon or carbon and the capping layer
comprises Ta, Ta.sub.2O.sub.3, Ta.sub.2O.sub.5, SiO.sub.2, SiN,
SiO.sub.xN.sub.y, or Al.sub.2O.sub.3.
18. The method as in claim 15 wherein the second CMP stop layer
comprises an electrically conductive, non-magnetic material.
19. The method as in claim 15 wherein the second CMP stop layer
comprises an electrically conductive material deposited by a
conformal deposition process.
20. The method as in claim 15 wherein the second CMP stop layer
comprises Ru.
21. The method as in claim 15 wherein the RIE mask comprises
NiCr.
22. A method for manufacturing a magnetic write head, comprising:
depositing a RIEable fill layer; depositing a first CMP stop layer
over the RIEable fill layer; forming a RIE mask over the RIEable
fill layer and the first CMP stop layer; removing portions of the
first CMP stop layer and the RIAable fill layer to form a trench in
the RIEable fill layer; depositing a second CMP stop layer into the
trench and over the RIE mask; depositing a magnetic material;
performing a first chemical mechanical polishing until the second
CMP stop layer has been reached; removing exposed portions of the
second CMP stop layer; and performing a second chemical mechanical
polishing until the first CMP stop layer has been reached.
23. The method as in claim 22, further comprising, after depositing
the first CMP stop layer and before forming the RIE mask,
depositing a capping layer over the first CMP stop layer.
24. The method as in claim 22 wherein the capping layer comprises
Ta, Ta.sub.2O.sub.3, Ta.sub.2O.sub.5, SiO.sub.2, SiN,
SiO.sub.xN.sub.y, or Al.sub.2O.sub.3.
25. The method as in claim 22 wherein the first CMP stop layer
comprises Ru, carbon or diamond like carbon, and the second CMP
stop layer comprises Ru.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to perpendicular magnetic
write heads and more particularly to a method for manufacturing a
perpendicular magnetic write head having a very narrow write
pole.
BACKGROUND OF THE INVENTION
[0002] The heart of a computer's long term memory is an assembly
that is referred to as a magnetic disk drive. The magnetic disk
drive includes a rotating magnetic disk, write and read heads that
are suspended by a suspension arm adjacent to a surface of the
rotating magnetic disk and an actuator that swings the suspension
arm to place the read and write heads over selected circular tracks
on the rotating disk. The read and write heads are directly located
on a slider that has an air bearing surface (ABS). The suspension
arm biases the slider toward the surface of the disk, and when the
disk rotates air adjacent to the disk moves along with the surface
of the disk. The slider flies over the surface of the disk on a
cushion of this moving air. When the slider rides on the air
bearing, the write and read heads are employed for writing magnetic
transitions to and reading magnetic transitions from the rotating
disk. The read and write heads are connected to processing
circuitry that operates according to a computer program to
implement the writing and reading functions.
[0003] The write head can include a magnetic write pole and a
magnetic return pole, the write pole having a much smaller cross
section at the ABS than the return pole. The magnetic write pole
and return pole are magnetically connected with one another at a
region removed from the ABS. An electrically conductive write coil
induces a magnetic flux through the write coil. This results in a
magnetic write field being emitted toward the adjacent magnetic
medium, the write field being substantially perpendicular to the
surface of the medium (although it can be canted somewhat, such as
by a trailing shield located near the write pole). The magnetic
write field locally magnetizes the medium and then travels through
the medium and returns to the write head at the location of the
return pole where it is sufficiently spread out and weak that it
does not erase previously recorded bits of data.
[0004] A magnetoresistive sensor such as a GMR or TMR sensor can be
employed for sensing magnetic fields from the rotating magnetic
disk. The sensor includes a nonmagnetic conductive layer, or
barrier layer, sandwiched between first and second ferromagnetic
layers, referred to as a pinned layer and a free layer. First and
second leads are connected to the sensor for conducting a sense
current therethrough. The magnetization of the pinned layer is
pinned perpendicular to the air bearing surface (ABS) and the
magnetic moment of the free layer is located parallel to the ABS,
but free to rotate in response to external magnetic fields. The
magnetization of the pinned layer is typically pinned by exchange
coupling with an antiferromagnetic layer.
[0005] The thickness of the spacer layer is chosen to be less than
the mean free path of conduction electrons through the sensor. With
this arrangement, a portion of the conduction electrons is
scattered by the interfaces of the spacer layer with each of the
pinned and free layers. When the magnetizations of the pinned and
free layers are parallel with respect to one another, scattering is
minimal and when the magnetizations of the pinned and free layer
are antiparallel, scattering is maximized. Changes in scattering
alter the resistance of the spin valve sensor in proportion to cos
.theta., where .theta. is the angle between the magnetizations of
the pinned and free layers. In a read mode the resistance of the
spin valve sensor changes proportionally to the magnitudes of the
magnetic fields from the rotating disk. When a sense current is
conducted through the spin valve sensor, resistance changes cause
potential changes that are detected and processed as playback
signals.
[0006] In order to maximize data density, it is necessary to
minimize the track width of the data track written by the write
head. In order to decrease the track width, it is necessary to
minimize the width of the write pole itself. Unfortunately,
limitations in manufacturing processes have limited the amount by
which such write pole width can be minimized. In addition, such
manufacturing processes have lead to write heads being formed with
poorly defined, curved side walls and poorly defined
track-widths.
SUMMARY OF THE INVENTION
[0007] The present invention provides a method for manufacturing a
magnetic write head that includes depositing a RIEable fill layer
and depositing a first CMP stop layer over the RIEable fill layer.
A RIE mask is formed over the RIEable fill layer and the first CMP
stop layer. A portion of the first CMP stop layer and the RIAable
fill layer are removed to form a trench in the RIEable fill layer.
A second CMP stop layer is deposited into the trench and over the
RIE mask and a magnetic material is deposited. A first chemical
mechanical polishing is performed until the second CMP stop layer
has been reached, and then exposed portions of the second CMP stop
layer are removed. A second chemical mechanical polishing process
is then performed until the first CMP stop layer has been
reached.
[0008] The use of two separate CMP processes that stop at two
separate CMP stop layers results in a write pole having straight
sides and a well defined trailing edge for a well controlled track
width. This is a vast improvement over previous manufacturing
processes wherein the trench ended up having a rounded top that
resulted in a write pole having curved sides and a poorly defined
track-width.
[0009] These and other features and advantages of the invention
will be apparent upon reading of the following detailed description
of preferred embodiments taken in conjunction with the Figures in
which like reference numerals indicate like elements
throughout.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] For a fuller understanding of the nature and advantages of
this invention, as well as the preferred mode of use, reference
should be made to the following detailed description read in
conjunction with the accompanying drawings which are not to
scale.
[0011] FIG. 1 is a schematic illustration of a disk drive system in
which the invention might be embodied;
[0012] FIG. 2 is an ABS view of a slider, taken from line 2-2 of
FIG. 1, illustrating the location of a magnetic head thereon;
[0013] FIG. 3 is a cross sectional view of a magnetic head, taken
from line 3-3 of FIG. 2 and rotated 90 degrees counterclockwise, of
a magnetic head according to an embodiment of the present
invention;
[0014] FIG. 4 is an ABS view of a portion of the read head of FIG.
3; and
[0015] FIGS. 5-24 are views in various intermediate stages of
manufacture, illustrating a method of manufacturing a magnetic
write head according to an embodiment of the invention.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0016] The following description is of the best embodiments
presently contemplated for carrying out this invention. This
description is made for the purpose of illustrating the general
principles of this invention and is not meant to limit the
inventive concepts claimed herein.
[0017] Referring now to FIG. 1, there is shown a disk drive 100
embodying this invention. As shown in FIG. 1, at least one
rotatable magnetic disk 112 is supported on a spindle 114 and
rotated by a disk drive motor 118. The magnetic recording on each
disk is in the form of annular patterns of concentric data tracks
(not shown) on the magnetic disk 112.
[0018] At least one slider 113 is positioned near the magnetic disk
112, each slider 113 supporting one or more magnetic head
assemblies 121. As the magnetic disk rotates, slider 113 moves
radially in and out over the disk surface 122 so that the magnetic
head assembly 121 may access different tracks of the magnetic disk
where desired data are written. Each slider 113 is attached to an
actuator arm 119 by way of a suspension 115. The suspension 115
provides a slight spring force which biases slider 113 against the
disk surface 122. Each actuator arm 119 is attached to an actuator
means 127. The actuator means 127 as shown in FIG. 1 may be a voice
coil motor (VCM). The VCM comprises a coil movable within a fixed
magnetic field, the direction and speed of the coil movements being
controlled by the motor current signals supplied by controller
129.
[0019] During operation of the disk storage system, the rotation of
the magnetic disk 112 generates an air bearing between the slider
113 and the disk surface 122 which exerts an upward force or lift
on the slider. The air bearing thus counter-balances the slight
spring force of suspension 115 and supports slider 113 off and
slightly above the disk surface by a small, substantially constant
spacing during normal operation.
[0020] The various components of the disk storage system are
controlled in operation by control signals generated by control
unit 129, such as access control signals and internal clock
signals. Typically, the control unit 129 comprises logic control
circuits, storage means and a microprocessor. The control unit 129
generates control signals to control various system operations such
as drive motor control signals on line 123 and head position and
seek control signals on line 128. The control signals on line 128
provide the desired current profiles to optimally move and position
slider 113 to the desired data track on disk 112. Write and read
signals are communicated to and from write and read heads 121 by
way of recording channel 125.
[0021] With reference to FIG. 2, the orientation of the magnetic
head 121 in a slider 113 can be seen in more detail. FIG. 2 is an
ABS view of the slider 113, and as can be seen the magnetic head
including an inductive write head and a read sensor, is located at
a trailing edge of the slider. The above description of a typical
magnetic disk storage system, and the accompanying illustration of
FIG. 1 are for representation purposes only. It should be apparent
that disk storage systems may contain a large number of disks and
actuators, and each actuator may support a number of sliders.
[0022] FIG. 3 is a side cross sectional view of a magnetic write
head 300 that can be constructed by a method of the present
invention. The write head 300 includes a magnetic write pole 302
and a magnetic return pole 304. The magnetic write pole 302 can be
connected with a magnetic shaping layer 306 that helps to conduct
magnetic flux to the tip of the write pole 302. The write pole 302
and shaping layer 306 can be connected with the magnetic return
pole 304 by a magnetic back gap structure 308. A non-magnetic,
electrically conductive write coil 310 passes between the return
pole 304 and the write pole and shaping layer 302, 306, and may
also pass above the write pole and shaping layer 302, 306. The
write coil can be encased in a non-magnetic, electrically
insulating material 312, which can be a material such as alumina
and/or hard baked photoresist. When an electrical current flows
through the write coil 310 a magnetic field is induced around the
coil 310 that results in a magnetic flux flowing through the return
pole 304, back gap layer 308, shaping layer 306 and write pole 302.
This results in a write field being emitted from the tip of the
write pole 302. This strong, highly concentrated write field
locally magnetizes a magnetic top layer 314 of the magnetic media
112. The magnetic field then travels through a soft magnetic
under-layer 316 of the magnetic media before returning to the
return pole 304, where it is sufficiently spread out and weak that
it does not erase the previously recorded bit of data.
[0023] With continued reference to FIG. 3, a magnetic pedestal
structure 318 may be included at the air bearing surface (ABS) to
prevent magnetic field from the write coil 310 from inadvertently
reaching the magnetic media 112. The pedestal can be connected with
the return pole and stops well short of the write pole 302. In
addition, the write head 300 may include a magnetic trailing shield
320 that is located at the ABS and which is separated from the
write pole 302 by a thin, non-magnetic trailing gap layer 322. The
trailing shield 320 may be magnetically connected with the back
portion of the write head 300 by a trailing return pole 324.
[0024] FIG. 4 shows an ABS view of a portion of the write head 300,
and shows the write pole 302 enlarged for clarity. As can be seen
in FIG. 4, the write pole 302 has a trapezoidal shape, being wider
at the trailing edge 402 than at the leading edge 404. The width of
the trailing edge 402 of the write pole defines the track-width
(TW) of the write pole. The write pole 302 has a very narrow
track-width TW. This narrow track width is made possible by a novel
manufacturing process that will be described in greater detail
herein below. In addition, it can be seen that the write pole 302
has straight, well defined sides. This also is made possible by the
manufacturing process that will be described below.
[0025] Also, as can be seen in FIG. 4, the trailing shield 320 can
be formed so that it wraps around the sides of the write pole 302.
The wrap-around trailing shield 320 is separated from the sides of
the write pole 302 by first and second non-magnetic side gap layers
406 and is separated from the trailing edge of the write pole 302
by the non-magnetic trailing gap layer 322.
[0026] FIGS. 5-24 illustrate a method for manufacturing a magnetic
write head according to an embodiment of the invention. With
particular reference to FIG. 5, a substrate 502 is formed. The
substrate 502 can include the insulation layer 312 and all or a
portion of the shaping layer 306 described above with reference to
FIG. 3, which have been planarized, such as by chemical mechanical
polishing, to form a flat planar upper surface. A RIEable fill
layer 504 is then deposited over the substrate 504. The RIEable
fill layer 504 can be alumina (Al.sub.2O.sub.3) and is deposited to
a thickness that is at least as thick as the thickness (from
trailing edge to leading edge 402, 404) of a write pole 302 as
described above in FIG. 4.
[0027] With continued reference to FIG. 5, a first CMP stop layer
506 is formed over the RIEable fill layer 504. The first CMP stop
layer 506 can be constructed of Ru, diamond like carbon (DLC) or
carbon (preferably Ru) and can be deposited to a thickness of 15-30
nm or about 20 nm. In addition, a capping layer 507 constructed of
a material such as Ta, Ta.sub.2O.sub.3, Ta.sub.2O.sub.5, SiO.sub.2,
SiN, SiO.sub.xN.sub.y, or Al.sub.2O.sub.3, is deposited over the
first CMP stop layer 506. The capping layer 507 protects the CMP
stop layer 506 from breaking down during subsequent reactive ion
etching processes, as will be described above. The capping layer
507 can be deposited to at thickness of 3-7 nm or about 5 nm.
[0028] With reference still to FIG. 5, a mask structure 505 is
deposited over the CMP stop layer 506 and capping layer 507. The
mask structure 505 can include an image transfer layer 508, a hard
mask 510 formed over the image transfer layer 508, a resist layer
512 formed over the hard mask 510. The image transfer layer 508 can
be constricted of a soluble polyimide material such as
DURIMIDE.RTM. and can be deposited to a thickness of 100-300 nm or
about 150 nm. The hard mask 510 is preferably a Si containing hard
mask and can be constructed to a thickness of 30-50 nm or about 40
nm.
[0029] With reference now to FIG. 6, the resist layer 512 is
photolithographically patterned and developed to form the
photoresist mask 512 shown. FIG. 6 shows a cross section of a plane
that is parallel with the air bearing surface (ABS) as viewed in a
constant cross section throat region, but if viewed from above
would include the constant cross section throat region and a flared
region.
[0030] A reactive ion etching RIE can then be performed to transfer
the image of the photoresist mask 512 onto the underlying hard mask
510 and image transfer layer 508, leaving a structure as shown in
FIG. 7. All of a portion of the photoresist 512 may be consumed
during this RIE process. The RIE process is preferably performed in
an oxygen containing atmosphere.
[0031] Then, with reference to FIG. 8 a reactive ion etching mask
(RIE mask) layer 802 is deposited full film over the layers 506,
507 and over the remaining portion of the mask 505. The layer 802
can be NiCr and is deposited thick enough to withstand reactive ion
etching processes used to remove the layer 506, 507 and to etch a
trench into the fill layer 504, but sufficiently thin to be removed
by a glancing angle ion milling as will be seen. To this end, the
layer 802 can be deposited to a thickness of 50-200 nm or about 100
nm. A second capping layer 804 can also be deposited over the layer
802. The second capping layer 804 can be constructed of Ta and can
be deposited to a thickness of 5-15 nm or about 20 nm.
[0032] An ion milling is then performed at a glancing angle to
remove portions of the layers 802, 804 from the sides of the mask
505, leaving a structure as shown in FIG. 9. The "glancing" ion
milling is performed at an angle that is nearly parallel with the
planes of the deposited layers 502, 504, 506, 507 or perpendicular
to normal. The mask 505 can then be lifted off, such as by a
chemical liftoff process, leaving a structure as shown in FIG. 10,
with an opening 1002 formed in the layers 802, 804.
[0033] A reactive ion etching is then performed to remove portions
of the Ta capping layer 507 that are exposed through the opening
1002 in the layers 802, 804. This reactive ion etching is performed
using a CF.sub.4 and CFH.sub.3 based chemistry and leaves a
structure as shown in FIG. 11. Then, another reactive ion etching
is then performed to remove portions of the CMP stop layer 506 that
are exposed through the opening 1002. This reactive ion etching is
preferably performed in a O.sub.2 based chemistry and results in a
structure as shown in FIG. 12. A simpler case could be when CMP
stop layer 506 is carbon or DLC, then only BCl.sub.3 based
chemistry reactive ion etch need be performed to etch through layer
507 (Ta), layer 506 (DLC or C), and layer 504, and form a trench
structure as shown in FIG. 13.
[0034] With reference now to FIG. 13, yet another reactive ion
etching is performed to remove portions of the REIable fill layer
504 that are not protected by the layers 506, 507, 802 to form a
trench 1302 in the fill layer 504. If the fill layer 504 comprises
alumina, then the reactive ion etching can be performed in a
BCl.sub.3 based chemistry to preferentially remove the alumina. The
reactive ion etching conditions are also preferably selected to
form the trench 1302 with tapered side walls as shown. It should be
pointed out at this point that layer 802 protects the underlying
CMP stop layer 506 during this series of RIE processes.
[0035] After the trench 1302 has been formed in the fill layer 504,
a second non-magnetic second CMP stop layer 1402 is deposited as
shown in FIG. 14. The second non-magnetic second CMP stop layer
1402 can be constructed of Ru, preferably deposited by a conformal
deposition process such as atomic layer deposition. The
non-magnetic layer 1402 serves several functions. First it
comprises an electrically conductive metal (such as Ru) so that it
can serve as a seed layer for a future electroplating process (as
will be described below). Second, since it is non-magnetic, it
reduces width of the opening 1302, thereby advantageously reducing
the track width of the write pole that will be formed. Third, the
non-magnetic layer 1402 can provide all or a portion of a
non-magnetic side wall (side wall 406 in FIG. 4) to separate the
sides of the write pole 302 from the shield 320 (FIG. 4). Fourth,
the layer 1402 serves as second chemical mechanical polishing stop
layer (second CMP stop layer), as will be seen.
[0036] With the non-magnetic seed layer/CMP stop layer 1402
deposited, a magnetic material 1502 such as CoNiFe is
electroplated, leaving a structure as shown in FIG. 15. As can be
seen, the magnetic material 1502 completely fills the trench 1302
and preferably extends out of the top of the trench, at least
slightly. A first chemical mechanical polishing process is then
performed to remove portions of the magnetic material 1502 that
extend out the trench 1302. The first chemical mechanical polishing
process stops at the Ru layer 1402 which, as discussed above, acts
as a CMP stop layer. This leaves a structure as shown in FIG. 16
with a planar upper surface 1602. A quick ion milling can then be
performed to remove the exposed portions of the Ru layer 1402,
leaving a structure as shown in FIG. 17. Another chemical
mechanical polishing is then performed to remove the layers 802,
507, stopping at the first CMP stop layer 506. This leaves as
structure s shown in FIG. 18.
[0037] The use of two separate CMP processes stopping at two
separate CMP stop layers, as described above results in a magnetic
write pole having straight, well defined sides and a well defined
trailing edge width (e.g. track-width). Previous processes, which
used only a single CMP step, if any, resulted in a trench having a
rounded top or dished pole top surface which, in turn resulted in a
write pole having sides that round outward toward the trailing
edge. This resulted, not only in poorly defined curved sides, but
worse resulted in a poorly defined track width. Since the width of
the trailing edge of the write pole (e.g. track-width) is one of
the most important parameters of a write head, this imprecision of
the trailing edge width was unacceptable, especially at very small
track-widths.
[0038] At this point a couple of options exist for continued
processing. One possible option is to perform an ion milling on the
structure of FIG. 18 to remove the CMP stop layer 506, leaving a
structure as shown in FIG. 19. At this point, the fill layer 504
could be left in place, and a trailing shield (one that does not
wrap around the sides of the write pole 1502) could be formed by
first depositing a non-magnetic seed layer/trailing gap layer (not
shown) such as Ru and then electroplating a magnetic material (also
not shown) over the non-magnetic seed/trailing gap layer. Or, the
fill material 504 can be removed by common Al.sub.2O.sub.3 wet etch
process with EDTA solution followed by the deposition of a
non-magnetic seed/gap layer and electroplating of a trailing,
wrap-around magnetic shield.
[0039] In another option, starting with a structure such as shown
in FIG. 18, a mask 2004 can be formed over the write pole after
layer 2002 of DLC or C is deposited, as shown in FIG. 20. Then, a
reactive ion etching can be performed to remove portions of the
layer 2002 that are not protected by the mask 2004, leaving a
structure as shown in FIG. 21. This can be followed by an ion
milling or another RIE to remove the layer 506, leaving a structure
as shown in FIG. 22. Common Al.sub.2O.sub.3 wet etch process with
EDTA solution can then be performed to remove the remaining fill
layer 504. The mask 2004 can then be lifted off, leaving a
structure as shown in FIG. 23. Then, with reference to FIG. 24 a
magnetic material 2402 can be electroplated to form a trailing
magnetic shield.
[0040] While various embodiments have been described, it should be
understood that they have been presented by way of example only,
and not limitation. Other embodiments falling within the scope of
the invention may also become apparent to those skilled in the art.
Thus, the breadth and scope of the invention should not be limited
by any of the above-described exemplary embodiments, but should be
defined only in accordance with the following claims and their
equivalents.
* * * * *