U.S. patent application number 13/444088 was filed with the patent office on 2013-01-17 for heat sink assembly.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is CHIH-HANG CHAO, WEI-CHENG CHENG, CHIH-HSIANG CHIANG. Invention is credited to CHIH-HANG CHAO, WEI-CHENG CHENG, CHIH-HSIANG CHIANG.
Application Number | 20130014920 13/444088 |
Document ID | / |
Family ID | 47518255 |
Filed Date | 2013-01-17 |
United States Patent
Application |
20130014920 |
Kind Code |
A1 |
CHAO; CHIH-HANG ; et
al. |
January 17, 2013 |
HEAT SINK ASSEMBLY
Abstract
A heat sink assembly includes a heat sink, a first fan, and a
second fan. The heat sink includes a first base contacting a first
heat generating element, a first heat pipe connected to the first
base, and a fin assembly. The first heat pipe is located in the fin
assembly. The first fan defines a first input opening and a first
output opening substantially perpendicular to the first input
opening. The second fan defines a second input opening and a second
output opening substantially parallel to the second input opening.
The first and second input openings correspond to the fin
assembly.
Inventors: |
CHAO; CHIH-HANG; (Tu-Cheng,
TW) ; CHENG; WEI-CHENG; (Tu-Cheng, TW) ;
CHIANG; CHIH-HSIANG; (Tu-Cheng, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CHAO; CHIH-HANG
CHENG; WEI-CHENG
CHIANG; CHIH-HSIANG |
Tu-Cheng
Tu-Cheng
Tu-Cheng |
|
TW
TW
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
47518255 |
Appl. No.: |
13/444088 |
Filed: |
April 11, 2012 |
Current U.S.
Class: |
165/104.26 ;
165/121; 165/185 |
Current CPC
Class: |
H01L 23/427 20130101;
F28D 15/0275 20130101; H01L 23/467 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; F28F 1/32 20130101; H01L 23/3672
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.26 ;
165/185; 165/121 |
International
Class: |
F28D 15/04 20060101
F28D015/04; F28D 1/03 20060101 F28D001/03; F28F 3/00 20060101
F28F003/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 13, 2011 |
TW |
100124703 |
Claims
1. A heat sink assembly, comprising: a heat sink, the heat sink
comprising a first base configured to contact a first heat
generating element, a first heat pipe connected to the first base,
and a fin assembly; and the first heat pipe located in the fin
assembly; a first fan, the first fan defining a first input opening
and a first output opening that is substantially perpendicular to
the first input opening; and the first input opening corresponds to
the fin assembly; and a second fan, the second fan defining a
second input opening and a second output opening substantially
parallel to the second input opening; the second input opening
corresponding to the fin assembly.
2. The heat sink assembly of claim 1, wherein the fin assembly
comprises a first fin module and a second fin module; the first fin
module comprises a plurality of first fins; the second fin module
comprises a plurality of second fins; an area of each first fin is
greater than an area of each second fin; the first fan corresponds
to the first fin module; and the second fan corresponds to the
second fin module.
3. The heat sink assembly of claim 2, wherein the fin assembly
defines a first through hole extending through the first fin module
and the second fin module, and the first heat pipe is located in
the first through hole.
4. The heat sink assembly of claim 3, wherein the heat sink further
comprises a second base configured to contact a second heat
generating element and a second heat pipe connected to the second
base; the fin assembly defines a second through hole only extending
through the second fin module; and the second heat pipe is located
in the second through hole.
5. The heat sink assembly of claim 4, wherein the first through
hole defines a first extending direction; the second through hole
defines a second extending direction; the first extending direction
is substantially parallel to the second extending direction.
6. The heat sink assembly of claim 2, wherein the fin assembly is
L-shaped.
7. The heat sink assembly of claim 1, wherein the first base
comprises a first base body and four first securing portions
extending from four corners of the first base body.
8. The heat sink assembly of claim 7, wherein each first securing
portion comprises a fastener configured to mount the first base to
a panel.
9. A heat sink assembly, comprising: a heat sink, the heat sink
comprising a first base configured to contact a first heat
generating element, a first heat pipe connected to the first base,
a second base, a second heat pipe connected to the second base, and
a fin assembly; the fin assembly comprising a first fin module and
a second fin module aligned with the first fin module; the first
heat pipe located in the first fin module and the second fin
module; the second heat pipe located in the second fin module; the
second heat pipe located above the first heat pipe; a first fan,
the first fan defining a first input opening and a first output
opening that is substantially perpendicular to the first input
opening; and the first input opening that corresponds to the first
fin module; and a second fan, the second fan defining a second
input opening and a second output opening substantially parallel to
the second input opening; and the second input opening
corresponding to the second fin module; wherein the first fan and
the second fan are located on the same side of the fin
assembly.
10. The heat sink assembly of claim 9, wherein the first fin module
comprises a plurality of first fins; the second fin module
comprises a plurality of second fins; and an area of each first fin
is greater than an area of each second fin.
11. The heat sink assembly of claim 10, wherein the fin assembly
defines a first through hole extending through the first fin module
and the second fin module, and the first heat pipe is located in
the first through hole.
12. The heat sink assembly of claim 11, wherein the fin assembly
defines a second through hole only extending through the second fin
module; and the second heat pipe is located in the second through
hole.
13. The heat sink assembly of claim 12, wherein the first through
hole defines a first extending direction; the second through hole
defines a second extending direction; the first extending direction
is substantially parallel to the second extending direction.
14. The heat sink assembly of claim 9, wherein the fin assembly is
L-shaped.
15. The heat sink assembly of claim 9, wherein the first base
comprises a first base body and four first securing portions
extending from four corners of the first base body.
16. The heat sink assembly of claim 15, wherein each first securing
portion comprises a fastener configured to mount the first base to
a panel.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The disclosure generally relates to heat sink assemblies,
especially to a heat sink assembly with a fan.
[0003] 2. Description of Related Art
[0004] Electronic components, such as central processing units
(CPUs), in computers generate a lot of heat that can affect
operation and may be prone to damage if the heat is not dissipated
from the electronic components efficiently.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the embodiments can be better understood
with references to the following drawings. The components in the
drawings are not necessarily drawn to scale, the emphasis instead
being placed upon clearly illustrating the principles of the
embodiments. Moreover, in the drawings, like reference numerals
designate corresponding parts throughout the several views.
[0006] FIG. 1 is an exploded, isometric view of a heat sink
assembly of one embodiment.
[0007] FIG. 2 is similar to FIG. 1, but viewed from another
aspect.
[0008] FIG. 3 is an assembly view of FIG. 1.
DETAILED DESCRIPTION
[0009] The disclosure is illustrated by way of example and not by
way of limitation in the figures of the accompanying drawings in
which like references indicate similar elements. It should be noted
that references to "an" or "one" embodiment in this disclosure are
not necessarily to the same embodiment, and such references mean at
least one.
[0010] FIGS. 1 and 2, is a heat sink assembly including a heat sink
10, a first fan 30, and a second fan 50.
[0011] The heat sink 10 includes a first base 11, two first heat
pipes 12 mounted to the first base 11, a second base 13, a second
heat pipe 14 mounted to the second base 13, and a fin assembly
15.
[0012] The first base 11 includes a first base body 111 and four
first securing portions 113, extending from four corners of the
first base body 111. Each first securing portion 113 includes a
first fastener 115. The first base body 111 is mounted to a heat
generating element (not shown).
[0013] The second base 13 includes a second base body 131 and four
second securing portions 133, extending from four corners of the
second base body 131. Each second securing portion 133 includes a
second fastener 135. The second base body 131 is mounted on a
second heat generating element (not shown).
[0014] The fin assembly 15 includes a first fin module 151 and a
second fin module 153. The area of each fin of the first fin module
151 is less than the area of each fin of the second fin module 153.
The fin assembly 15 defines a first through hole 155 extending
through the first fin module 151 and the second fin module 153. The
first through hole 155 corresponds to the first heat pipe 12. The
second fin module 153 defines a second through hole 157. The second
through hole 157 corresponds to the second heat pipe 14. The
extending direction of the first through hole 155 is substantially
parallel to the extending direction of the second through hole 157.
The second through hole 157 is located above the first through hole
155, and does not extend through the first fin module 151. The fin
assembly 15 is L-shaped.
[0015] The first fan 30 defines a first input opening 31 and a
first output opening 33. The first input opening 31 corresponds to
the first fin module 151. The first input opening 31 is
substantially perpendicular to the first output opening 33.
[0016] The second fan 50 defines a second input opening 51 and a
second output opening 53. The second input opening 51 corresponds
to the second fin module 153. The second input opening 51 is
substantially parallel to the second output opening 53.
[0017] FIGS. 1 to 3, show in assembly, the first heat pipe 12 and
the second heat pipe 14 are inserted into the first through hole
155 and the second through hole 157. The first fan 30 is mounted to
a panel (not shown) to enable the first input opening 31 of the
first fan 30 to align with the first fin module 151. The second fan
50 is mounted to the panel to enable the second input opening 51 of
the second fan 50 to align with the second fin module 153.
[0018] The heat sink assembly has a high efficiency for heat
dissipation in an enclosure with little space.
[0019] It is to be understood, however, that even though numerous
characteristics and advantages have been set forth in the foregoing
description of preferred embodiments, together with details of the
structures and functions of the preferred embodiments, the
disclosure is illustrative only, and changes may be made in detail,
especially in matters of shape, size, and arrangement of parts
within the principles of the disclosure to the full extent
indicated by the broad general meaning of the terms in which the
appended claims are expressed.
* * * * *