U.S. patent application number 13/610550 was filed with the patent office on 2013-01-03 for endothermic reaction apparatus for removing excess heat in a datacenter.
This patent application is currently assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Cary M. Huettner, Joseph Kuczynski, Robert E. Meyer, III, Timothy J. Tofil.
Application Number | 20130003296 13/610550 |
Document ID | / |
Family ID | 43730345 |
Filed Date | 2013-01-03 |
United States Patent
Application |
20130003296 |
Kind Code |
A1 |
Huettner; Cary M. ; et
al. |
January 3, 2013 |
Endothermic Reaction Apparatus for Removing Excess Heat in a
Datacenter
Abstract
Embodiments of the present invention generally provide for a
system that removes excess thermal energy from a datacenter. In one
embodiment, the system includes a holding container with highly
thermally conductive surfaces installed in the warmest area(s) of
the datacenter. Two substances are released into the holding
container and are mixed creating a liquid solution and causing an
endothermic reaction. The resulting reaction transfers thermal
energy from the datacenter air to the new solution. The liquid
solution is then pumped out of the datacenter, where it can be
passed through a dialyzing membrane or an evaporation chamber,
which separates the liquid solution into its two original
substances.
Inventors: |
Huettner; Cary M.;
(Rochester, MN) ; Kuczynski; Joseph; (Rochester,
MN) ; Meyer, III; Robert E.; (Rochester, MN) ;
Tofil; Timothy J.; (Rochester, MN) |
Assignee: |
INTERNATIONAL BUSINESS MACHINES
CORPORATION
Armonk
NY
|
Family ID: |
43730345 |
Appl. No.: |
13/610550 |
Filed: |
September 11, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12560497 |
Sep 16, 2009 |
|
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|
13610550 |
|
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Current U.S.
Class: |
361/679.52 ;
361/679.53 |
Current CPC
Class: |
H05K 7/20827
20130101 |
Class at
Publication: |
361/679.52 ;
361/679.53 |
International
Class: |
G06F 1/20 20060101
G06F001/20 |
Claims
1. A datacenter system comprising: a cooling solution further
comprising a first substance and a second substance, wherein the
combination of the first substance and the second substance create
an endothermic reaction; a holding container positioned above a
floor of said datacenter system and configured to mix said first
substance and said second substance to form said cooling solution;
and a separation unit configured to separate the cooling solution
into the first substance and the second substance; wherein said
holding container is coupled to a first substance transport and a
second substance transport, the first and second substance
transports transporting said first and second substance,
respectively, through the floor from said separation unit to said
holding container, and wherein said holding container is further
coupled to a cooling solution transport, the cooling solution
transport transporting said cooling solution through the floor from
said holding container to said separation unit.
2. The datacenter system of claim 1, wherein said holding container
is positioned in an area of said datacenter prone to
overheating.
3. The datacenter system of claim 1, wherein said holding container
is positioned between a first computer system and a second computer
system of said datacenter.
4. The datacenter system of claim 1, wherein the separation unit
comprises a dialyzing membrane configured to separate the cooling
solution into the first substance and the second substance.
5. The datacenter system of claim 1, wherein said first substance
is water and said separation unit comprises an evaporation chamber
for evaporating said first substance.
6. The datacenter system of claim 1, wherein the holding container
is designed to maximize surface area.
7. The datacenter system of claim 1, wherein the holding container
is composed of a thermally conductive material selected from a
group consisting of copper and aluminum.
8. The datacenter system of claim 1, further comprising: a
computer: wherein the computer is coupled to one or more CRAC units
cooling a datacenter including the datacenter system; wherein the
computer is coupled to one or more pumps configured to circulate
the cooling solution; and wherein the computer is configured to
control cooling solution circulation via the one or more pumps
based on CRAC status data received from the one or more CRAC
units.
9. The datacenter system of claim 8, wherein the computer is
further configured to initiate cooling solution circulation if the
CRAC status data indicates that CRAC usage is above a predefined
threshold.
10. The datacenter system of claim 8, wherein the computer is
further configured to initiate cooling solution circulation if CRAC
status data indicates that at least one of the one or more CRAC
units has failed.
11. The datacenter system of claim 1, further comprising: a
plurality of temperature sensors; wherein the plurality of
temperature sensors are configured to collect temperature data from
a datacenter including the datacenter system; and a flow controller
coupled to the plurality of temperature sensors and to one or more
holding containers; wherein the flow controller is configured to
receive temperature data from the plurality of temperatures
sensors; and wherein the flow controller is configured to direct
the flow of the first substance and the second substance to the one
or more holding containers based on the received temperature
data.
12. The data center system of claim 11, wherein the flow controller
is configured to increase the flow of the first substance and the
second substance to holding containers located in warmer areas of
the data center.
13. The datacenter system of claim 1, wherein the holding container
is a detachable modular unit.
14. A datacenter system comprising: a holding container positioned
above a floor of said datacenter system; wherein the holding
container is composed of a thermally conductive material selected
from a group consisting of copper and aluminum; wherein the holding
container is configured to configured to mix a first substance and
a second substance to form a cooling solution, the first substance
and second substance creating an endothermic reaction when mixed;
and a separation unit configured to separate the cooling solution
into the first substance and the second substance; wherein the
separation unit (1) receives the cooling solution from the holding
container, (2) separates the cooling solution into the first
substance and the second substance, and (3) circulates the first
substance and the second substance to the holding container;
wherein said holding container is coupled to a first substance
transport and a second substance transport, the first and second
substance transports transporting said first and second substance,
respectively, through the floor from said separation unit to said
holding container, and wherein said holding container is further
coupled to a cooling solution transport, the cooling solution
transport transporting said cooling solution through the floor from
said holding container to said separation unit.
15. The datacenter system of claim 14, wherein said holding
container is positioned in an area of said datacenter prone to
overheating.
16. A datacenter system comprising: a cooling solution further
comprising a first substance and a second substance, wherein the
combination of the first substance and the second substance create
an endothermic reaction; a holding container positioned above a
floor of said datacenter system and configured to mix said first
substance and said second substance to form said cooling solution;
a separation unit configured to separate the cooling solution into
the first substance and the second substance; wherein said holding
container is coupled to a first substance transport and a second
substance transport, the first and second substance transports
transporting said first and second substance, respectively, through
the floor from said separation unit to said holding container, and
wherein said holding container is further coupled to a cooling
solution transport, the cooling solution transport transporting
said cooling solution through the floor from said holding container
to said separation unit; and a computer; wherein the computer is
coupled to one or more CRAC units cooling a datacenter including
the datacenter system; wherein the computer is coupled to one or
more pumps configured to circulate the cooling solution; wherein
the computer is configured to control cooling solution circulation
via the one or more pumps based on CRAC status data received from
the one or more CRAC units; and wherein the computer is further
configured to initiate cooling solution circulation upon
identifying from the CRAC status data a CRAC unit failure or a CRAC
unit fault.
17. The datacenter system of claim 16, wherein said holding
container is positioned in an area of said datacenter prone to
overheating.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This is a divisional application of pending U.S. patent
application Ser. No. 12/560,497, filed Sep. 16, 2009, entitled
"Endothermic Reaction Apparatus for Removing Excess Heat in a
Datacenter", which is herein incorporated by reference. This
application claims priority under 35 U.S.C. .sctn.120 of U.S.
patent application Ser. No. 12/560,497, filed Sep. 16, 2009.
[0002] This application is also related to the following U.S.
patent applications, filed on the same date as this application:
Ser. No. ______, entitled "Endothermic Reaction Apparatus for
Removing Excess Heat in a Datacenter" (Assignee's docket
ROC920080370US2); Ser. No. ______, entitled "Endothermic Reaction
Apparatus for Removing Excess Heat in a Datacenter" (Assignee's
docket ROC920080370US4); Ser. No. ______, entitled "Endothermic
Reaction Apparatus for Removing Excess Heat in a Datacenter"
(Assignee's docket ROC920080370US5); and Ser. No. ______, entitled
"Endothermic Reaction Apparatus for Removing Excess Heat in a
Datacenter" (Assignee's docket ROC920080370US6).
BACKGROUND
[0003] 1. Field of the Invention
[0004] The field of invention relates to datacenter cooling. In
particular, the field of invention relates to removing excess heat
from a datacenter.
[0005] 2. Description of the Related Art
[0006] During the normal operation of a datacenter, a significant
amount of thermal energy is dissipated into the operating
environment, often resulting in an increase of temperature and in
increased demands on the cooling infrastructure. This in turn
results in increased utility costs. At present, there are no known
solutions to this problem other than to increase the cooling
capacity of the on-site computer room air conditioning (CRAC)
units.
SUMMARY OF THE DISCLOSURE
[0007] In general, embodiments of the invention described herein
leverage the endothermic properties of mixing chemical substances
(hereinafter "substance") to absorb datacenter thermal energy. The
thermal energy can then be transported away from the datacenter and
dissipated elsewhere.
[0008] One embodiment of the invention includes a datacenter system
comprising a cooling solution further comprising a first substance
and a second substance, wherein the combination of the first
substance and the second substance create an endothermic reaction;
a holding container configured to circulate the cooling solution;
and a separation unit coupled to the holding container configured
to separate the cooling solution into the first substance and the
second substance.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] So that the manner in which the above recited features,
advantages and objects of the present invention are attained and
can be understood in detail, a more particular description of the
invention, briefly summarized above, may be had by reference to the
embodiments thereof which are illustrated in the appended
drawings.
[0010] It is to be noted, however, that the appended drawings
illustrate only typical embodiments of this invention and are
therefore not to be considered limiting of its scope, for the
invention may admit to other equally effective embodiments.
[0011] FIG. 1 is a block diagram of a datacenter system that
removes excess thermal energy from a datacenter, according to one
embodiment of the invention.
[0012] FIGS. 2A-2C provide detailed illustrations of the holding
container of FIG. 1, according to one embodiment of the
invention.
[0013] FIG. 3A is a cross section view of a datacenter system,
wherein the separation facility is below the datacenter, according
to one embodiment of the invention.
[0014] FIG. 3B is a close-up cross section view of an alternative
embodiment of the datacenter system of FIG. 3A.
[0015] FIG. 4 is an illustration of a datacenter system that
includes temperature sensors and a flow controller, according to
one embodiment of the invention.
[0016] FIG. 5 is a flow chart illustrating, in general, the
operation of the flow controller, according to one embodiment of
the invention.
[0017] FIGS. 6A-6B illustrates a modular datacenter system,
according to one embodiment of the invention.
[0018] FIGS. 7A-7B illustrates the operation of a datacenter system
coupled to a CRAC unit.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Embodiments of the present invention generally provide for a
system that removes excess thermal energy from a datacenter. In one
embodiment, the system includes a holding container with a highly
thermally conductive surface installed in the warmest area(s) of
the datacenter. Two substances are released into the holding
container and are mixed causing an endothermic reaction
(hereinafter "cooling solution"). The resulting reaction transfers
thermal energy from the datacenter air to the cooling solution. The
cooling solution is then pumped out of the datacenter, where it can
be passed through a dialyzing membrane or an evaporation chamber,
which separates the cooling solution into its two original
substances (either both liquids or a salt slurry and water). The
process can then begin anew, continuously drawing waste heat from
the datacenter and reducing the overall cooling demands on the CRAC
infrastructure.
[0020] In addition, an alternative embodiment of the present
invention may include a system configured to perform as a backup to
rooftop CRAC systems. Current rooftop CRAC systems, like glycol
cooled systems for example, have an inherent problem on warm days
and in hot climates. The pump package and the fluid cooler in the
rooftop CRAC systems become so hot that the systems overheat and
the CRAC systems shut down. An embodiment of the present invention
reduces the dependence on this flawed system by cooling a
datacenter after a rooftop CRAC unit failure.
[0021] FIG. 1 is a block diagram of an embodiment of a system that
removes excess thermal energy from a datacenter. A datacenter
system 102 includes a holding container 104, wherein the holding
container 104 functions as a cooling unit and is configured to
circulate a cooling solution 116 and wherein the holding container
104 is designed to maximize surface area. Further, the holding
container 104 is composed of a highly thermally conductive
material, such as copper or aluminum for example. Those skilled in
the art will appreciate that the datacenter system 102 may include
more than one holding container 104 to expedite thermal energy
transfer and reduce demand on the CRAC cooling infrastructure.
[0022] The holding container 104 is connected to a first substance
transport carrying a first substance 110 and a second substance
transport carrying a second substance 112 that when mixed cause an
endothermic reaction and create the cooling solution 116 circulated
by the holding container 104. Examples of such mixtures include
water and ammonium nitrate; water and potassium chloride; water and
methanol; and water and calcium chloride. Additional solutions are
detailed in Table 1.
TABLE-US-00001 TABLE 1 Solution Heat Removal Capacity Compound Heat
of Solution (kcal/mole) NH.sub.4Cl 3.533 NH.sub.4ClO.sub.4 8.000
N(CH.sub.3).sub.4I 10.055 KNO.sub.3 8.340 KClO.sub.4 12.200
CsClO.sub.4 13.250 RbClO.sub.4 13.560
[0023] As shown in Table 1, the above compounds which represent
various mixed cooling solutions have an associated "Heat of
Solution", wherein the greater the heat of solution, the greater
the heat removal capacity of the cooling solution.
[0024] The datacenter system 102 is configured to release the first
substance 110 and the second substance 112 into the holding
container 104 where it is mixed to create the cooling solution 116.
The endothermic reaction initiated by the combination of substances
draws thermal energy out of the warm air in the datacenter, cooling
the air and transferring the thermal energy to the cooling
solution.
[0025] The holding container 104 is also coupled to a separation
facility 106, wherein the separation facility 106 includes a
separation unit 114. The thermal energy stored in the cooling
solution 116 is dissipated as the cooling solution 116 is passed
through the separation unit 114, wherein the separation unit 114
may be a dialyzing membrane useful for separating mixtures such as
water/methanol, for example. In particular, the membrane may be a
hydrophilic, semi-permeable polyamide, for example. Further, the
membrane may be composed, for example, of polymer compounds and
dimethyl sulfoxide useful for separating chemicals from their
mixtures, as is known in the art.
[0026] Alternatively, the separation unit 114 may be an evaporation
chamber for water/salt slurry mixtures for example. The membrane or
chamber effectively separates the cooling solution 116 into the
first substance 110 and the second substance 112.
[0027] In an alternative embodiment, the separation facility 106 is
designed to test the purity of the separated substances and is
designed to alert an operator that the separation unit 114 must be
replaced if purity is below a predefined threshold. In yet another
embodiment, if the purity is below a predefined threshold and the
separation unit 114 is a dialyzing membrane with improved
performance characteristics after exposure to high heat, the
separation facility 106 is designed to treat the separation unit
114 under high heat.
[0028] The separation facility 106 is coupled to the datacenter and
pumps the first substance 110 and the second substance 112
separately back to the datacenter system 102 and into the holding
container 104 to repeat the process.
[0029] FIGS. 2A-2C provide detailed illustrations of the holding
container 104 of FIG. 1, according to one embodiment of the
invention.
[0030] FIG. 2A shows a detailed view of the holding container 104,
wherein the cooling solution 116 is circulated via a coiled pipe
202 affixed to an array of thin planar members 204 so as to
increase the surface area of the holding container 104 as described
in further detail in FIG. 2B.
[0031] In FIG. 2A, the first substance 110 and the second substance
112 mix in the holding container 104 to cause an endothermic
reaction, creating the cooling solution 116. The cooling solution
116 is circulated via a coiled pipe 202 and stores the thermal
energy transferred from the air in the datacenter to the cooling
solution 116. In an alternative embodiment, the interior of the
coiled pipe includes turbulence generating elements designed to
enhance turbulence through the coiled pipes 202 and improve the
thermal energy transfer from the datacenter air to the cooling
solution 116.
[0032] FIG. 2B shows a cross section of the coiled pipe 202 and a
segment of the array of thin planar members 204A, wherein each thin
planar member in the array of thin planar members 204A adjoins with
the coiled pipe 202 along the thinnest edge of the planar member
and wherein each planar member is adjacently spaced along the
length of the coiled pipe so as to create adjacent air
passages.
[0033] FIG. 2C shows an alternative view of an individual thin
planar member 204B, wherein the individual thin planar member 204B
includes adjacently separated recesses designed to connect to the
length of the coiled pipe. A plurality of the thin planar members
204B creates the array of thin planar members of FIG. 2B.
[0034] FIG. 3A is a vertical cross section view of a datacenter
system, wherein the separation facility is below the datacenter,
according to one embodiment of the invention. As shown, the holding
container 104 may be positioned between server 302 and server 304.
In an alternative embodiment, the holding container 104 may be
positioned in an area of the datacenter prone to overheating.
Further, the holding container 104 may pump the cooling solution
116 and may receive the first substance 110 and the second
substance 112 through a datacenter floor panel 306. Similar to FIG.
1, the separation unit 114 in the separation facility 106 in FIG. 3
is designed to separate the first substance 110 and the second
substance 112.
[0035] FIG. 3B is a close-up cross section view of an alternative
embodiment of the datacenter system of FIG. 3A. As shown, the floor
below the holding container may be adapted to include a fan 308
that forces air through the array of thin planar members in the
holding container 104 so as to increase thermal energy transfer. In
one embodiment, the fan 308 is connected to a datacenter vent
system configured to circulate datacenter air, wherein the fan
pulls higher temperature air from the datacenter via the vent
system and forces the air through the array of thin planar
members.
[0036] In an alternative embodiment, the fan 308 blows air directly
from the cavity below the floor to the datacenter. The fan is
further coupled to a hinged flap member that prevents air transfer
between the space under the floor and the datacenter when the
blades of the fan 308 are not rotating. The hinged flap member
disengages and allows air transfer when the blades of the fan 308
rotate. In an alternative embodiment, the fan may be configured to
force air through the array of thin planar members only after the
datacenter temperature is above a predefined threshold.
[0037] FIG. 4 is an illustration of a datacenter system that
includes temperature sensors and a flow controller, according to
one embodiment of the invention. As shown, the datacenter includes
a first holding container 104A and a second holding container 104B,
wherein each holding container is connected to a flow controller
402. The flow controller 402 is configured to receive temperature
sensor data from a plurality of temperature sensor devices
404A-404D located throughout the datacenter, wherein the
temperature sensor data may be communicated wirelessly or
alternatively over wires. If the temperature sensor data indicates
that the temperature in an identified area of the datacenter is
above a predefined threshold, the flow controller 402 is configured
to direct the flow of the first substance 110 and the second
substance 112 to the identified area as described in further detail
in FIG. 5 and associated descriptions.
[0038] For example, if the continued operation of server 302 and
server 304 increase the temperature of a first datacenter area 406
and a second datacenter area 408, the plurality of temperature
sensor devices 404A-404D communicate that increase in temperature
to the flow controller 204. Thus, if temperature sensor device 404C
and temperature sensor device 404D send temperature sensor data
that signals to the flow controller 402 an increase in temperature
in the second datacenter area 408 above a predefined temperature
threshold, the flow controller is configured to direct the flow of
the first substance 110 and the second substance 112 to holding
container 104B.
[0039] Alternatively, if, for example, temperature sensor device
404A and temperature sensor device 404B send temperature sensor
data that indicates to the flow controller 402 an increase in
temperature in the first datacenter area 406 that is insufficient
to meet the predefined temperature threshold, the flow controller
maintains its current state.
[0040] FIG. 5 is a flow chart illustrating, in general, the
operation of the flow controller 402 in FIG. 4, according to one
embodiment of the invention. As shown, the process starts at block
502. At block 504, the flow controller receives temperature sensor
data. At block 506, the flow controller determines if the
temperature is above the predefined temperature threshold based on
the temperature sensor data. If YES, control passes to block 508.
If NO, control passes to block 518 the end of process 500.
[0041] At block 508, the flow controller determines if the
temperature is above the predefined temperature threshold in areas
surrounding both holding containers. If YES, the flow controller
distributes the cooling solution evenly to both holding containers
at block 510 and control passes to block 518, the end of process
500. If NO, control passes to block 512.
[0042] At block 512, the flow controller determines if the
temperatures is above the predefined temperature threshold in an
area surrounding the first holding container. IF YES, the flow
controller diverts the cooling solution to the first holding
container at block 514 and control passes to block 518, the end of
process 500. IF NO, the flow controller diverts the cooling
solution to the second holding container at block 516 and control
passes to block 518, the end of process 500. Those skilled in the
art will appreciate that the process could similarly be configured
to operate with three or more holding containers.
[0043] FIGS. 6A-6B illustrates a modular datacenter system,
according to one embodiment of the invention. A benefit of such an
embodiment is that such systems can be designed to be small enough
to provide targeted cooling to problem areas within the datacenter
and can also be designed to fit in smaller datacenters or
rooms.
[0044] FIG. 6A is a datacenter system 608 adapted to include a
plurality of holding container receiving points 602A-602G, wherein
each holding container receiving point is configured to connect to
a modular holding container 104C as detailed further in FIG. 6B.
Similar to FIG. 1, the datacenter system 608 is configured to
release the first substance 110 and the second substance 112 into
the modular holding container 104C where it is mixed to create the
cooling solution 116. In an alternative embodiment, a pump,
separate from the datacenter system 608, is configured to maintain
cooling solution 116 circulation and pressure throughout the
datacenter system 608.
[0045] In addition, the datacenter system 608 may include a
separation facility receiving point 606 for connecting to a modular
separation facility 106A, wherein the separation receiving point
606 is coupled to a cooling solution transport piping system
included in the datacenter system 608 and wherein the cooling
solution transport piping system is coupled to the plurality of
holding container receiving points 602A-602G as further described
in FIG. 6B.
[0046] Similar to FIG. 1, the modular separation facility 608 in
FIG. 6A separates the cooling solution 116 into the first substance
110 and the second substance 112. In addition, the modular
separation facility 106A may be adapted to connect and disconnect,
via a detachable set of hoses for example, to the datacenter system
608 as necessary to minimize demand on the cooling infrastructure.
The modular separation facility 106A may include a storage tank for
storing each of the first substance 110 and the second substance
112, a pump, and a separation unit as described in FIG. 1. The
housing structure of the modular separation facility 106A,
containing the storage tanks, the pump, and the separate unit, may
be in the form of a shipping container, semi-trailer, or
full-trailer for example for convenient transport by truck, train,
or cargo ship.
[0047] In one embodiment, the datacenter system 608 may include
temperature sensors that provide temperature data indicating areas
of the datacenter that continue to operate at higher temperatures
compared with other areas, thus enabling an operator to
strategically position one or more modular holding containers 104C
in the datacenter.
[0048] In an alternative embodiment, a computer may be coupled to
the datacenter system 608, wherein the computer is configured to
provide a graphical display including a datacenter heat map and
wherein the datacenter heat map indicates through the use of color
the range of temperatures within the datacenter. The computer may
be further configured to recommend one or more holding container
receiving points for connecting one or more modular holding
containers 104C based on high temperature areas on the datacenter
heat map. Those skilled in the art will appreciate that the
datacenter system may be a facility at a fixed location or
alternatively may be a mobile datacenter stored in a cargo
container for example.
[0049] FIG. 6B is a close-up cross section view of FIG. 6A showing
the modular holding container 104C, a holding container receiving
point 602, and a segment of the solution transport piping system
610. As shown, the holding container receiving point 602 includes
three sockets 604, wherein the three sockets 604 are designed to
receive three connectors extending from the body of the modular
holding container 104C. Each of the three sockets 604 is coupled to
a pipe in the solution transport piping system 610 and is designed
to transport the cooling solution and the two substances to the
modular holding container 104C via the solution transport piping
system 610.
[0050] The solution transport piping system 610 includes a
dedicated first substance transport 110A, a dedicated second
substance transport 112A, and a dedicated cooling solution
transport 116A, facilitating substance and solution transport
between the datacenter and the modular separation facility.
[0051] In one embodiment, the three sockets 604 in the holding
container receiving point 602 include a redundant seal that
prevents solution from exiting the solution transport piping system
610 when the modular holding container 104C is disengaged. Those
skilled in the art will appreciate alternative embodiments for
preventing leakage.
[0052] Although the above described embodiments may be configured
to operate independently from CRAC units servicing the datacenter
that includes the datacenter system, the datacenter system may, in
an alternative embodiment, be coupled to the CRAC units and may be
configured to receive periodic status data relating to the
operation of the CRAC unit. In particular, the status data may
include, for example, CRAC unit usage data or CRAC unit failure
data, or both. In particular, the datacenter system may receive
temperature and pressure based fault detection of the vapor
compression cycle of the rooftop cooling equipment. Alternatively,
the datacenter system may be configured to receive power signature
analysis (PSA) data relating to CRAC unit performance and possible
CRAC unit degradation. Specifically, the datacenter system may use
power signature analysis (PSA) data, as is known in the art, to
detect, among other things, condenser or evaporator fouling, bypass
leakage, fan rotor faults, and/or internal compressor damage, for
example. Such an embodiment is described in further detail in FIGS.
7A-7B and associated descriptions.
[0053] FIGS. 7A and 7B illustrate the operation of a datacenter
system coupled to a CRAC unit. In particular, FIG. 7A illustrates a
datacenter system configured to detect CRAC unit failure and usage
based on received data. As shown, the process starts at block 702.
At block 704, the datacenter system receives CRAC status data. At
block 706, the datacenter system determines, based on the received
CRAC status data, if CRAC usage is above a predefined threshold,
wherein usage is defined as a percentage of the number of hours the
CRAC unit operates within a defined period of time. If YES, the
datacenter system initiates solution circulation at block 710.
Thus, if the received CRAC usage data indicated that a CRAC unit
was running at peak (100%) usage above a predefined threshold of
90%, for example, the datacenter system would initiate solution
circulation. If NO, control passes to block 708.
[0054] At block 708, the datacenter system determines, based on the
CRAC status data, if there has been a CRAC failure. If NO, control
passes to block 712 the end of process 700A. If YES, the datacenter
system initiates solution circulation at block 710 and control
passes to block 712, the end of process 700A.
[0055] FIG. 7B illustrates a datacenter system configured to detect
CRAC unit degradation and faults based on received data. As shown
the process starts at block 750. At block 752, the datacenter
system receives CRAC status data. At block 754, the datacenter
system determines, based on received CRAC status data, if
compressor pressure is above a predefined threshold, wherein the
compressor pressure is an indication of a properly functioning CRAC
unit. If YES, the datacenter system initiates solution circulation
at block 760 and control passes to block 762, the end of process
700B. If NO, control passes to block 756.
[0056] At block 756, the datacenter system determines, based on a
power signature analysis in the CRAC status data, if there has been
a change in the mean power associated with the CRAC unit, wherein
variation in mean power is an indication of an air-side
restriction. If YES, the datacenter system initiates solution
circulation at block 760 and control passes to block 762, the end
of process 700B. If NO, control passes to block 758.
[0057] At block 758, the datacenter system determines, based on a
power signature analysis in the CRAC status data, if there has been
a change in the start transient, wherein variation in the start
transient is an indication of compressor leakage, flood, or liquid
ingestion. If YES, the datacenter system initiates solution
circulation at block 760 and control passes to block 762, the end
of process 700B. If NO, control passes to block 762, the end of
process 700B.
[0058] Embodiments of the present invention also provide power
saving benefits over compressor driven CRAC units by eliminating
the compressor and the associated power demands that come with the
compressor. In contrast, embodiments of the present invention do
not require a compressor, thus reducing the power per cooling unit
as compared with the typical compressor driven CRAC unit. In
addition, as described above, the datacenter system may be run
intermittently based on temperature and/or CRAC usage feedback, in
contrast to air handlers units in CRAC systems that run twenty-four
hours per day, thus providing additional power savings.
[0059] In the above, reference is made to embodiments of the
invention. However, it should be understood that the invention is
not limited to specific described embodiments. Instead, any
combination of the following features and elements, whether related
to different embodiments or not, is contemplated to implement and
practice the invention. Furthermore, although embodiments of the
invention may achieve advantages over other possible solutions
and/or over the prior art, whether or not a particular advantage is
achieved by a given embodiment is not limiting of the invention.
Thus, the following aspects, features, embodiments and advantages
are merely illustrative and are not considered elements or
limitations of the appended claims except where explicitly recited
in a claim(s). Likewise, reference to "the invention" shall not be
construed as a generalization of any inventive subject matter
disclosed herein and shall not be considered to be an element or
limitation of the appended claims except where explicitly recited
in a claim(s).
[0060] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a", "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, elements, components, and/or groups thereof.
[0061] The corresponding structures, materials, acts, and
equivalents of all means or step plus function elements in the
claims below are intended to include any structure, material, or
act for performing the function in combination with other claimed
elements as specifically claimed. The description of the present
invention has been presented for purposes of illustration and
description, but is not intended to be exhaustive or limited to the
invention in the form disclosed. Many modifications and variations
will be apparent to those of ordinary skill in the art without
departing from the scope and spirit of the invention. The
embodiment was chosen and described in order to best explain the
principles of the invention and the practical application, and to
enable others of ordinary skill in the art to understand the
invention for various embodiments with various modifications as are
suited to the particular use contemplated.
* * * * *