U.S. patent application number 13/197775 was filed with the patent office on 2012-12-20 for heat dissipation device.
This patent application is currently assigned to FOXCONN TECHNOLOGY CO., LTD.. Invention is credited to MENG FU, MIN LI, YUAN YUAN.
Application Number | 20120318481 13/197775 |
Document ID | / |
Family ID | 47333942 |
Filed Date | 2012-12-20 |
United States Patent
Application |
20120318481 |
Kind Code |
A1 |
YUAN; YUAN ; et al. |
December 20, 2012 |
HEAT DISSIPATION DEVICE
Abstract
An exemplary heat dissipation device is adapted for dissipating
heat generated by an electronic component mounted on a printed
circuit board. The heat dissipation device includes a first base, a
second base placed on the first base, a fin set placed on the
second base, a first heat pipe and a second heat pipe. The first
heat pipe includes a first evaporating section sandwiched between
the first base and the second base, a first condensing section
sandwiched between the second base and the fin set, and a first
connecting section interconnecting the first evaporating section
and the first condensing section. The second heat pipe includes a
second evaporating section located adjacent to a bottom end of the
fin set, a second condensing section located adjacent to a top end
of the fin set, and a second connecting section interconnecting the
second evaporating section and the second condensing section.
Inventors: |
YUAN; YUAN; (Shenzhen City,
CN) ; LI; MIN; (Shenzhen City, CN) ; FU;
MENG; (Shenzhen City, CN) |
Assignee: |
FOXCONN TECHNOLOGY CO.,
LTD.
Tu-Cheng
TW
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
Shenzhen City
CN
|
Family ID: |
47333942 |
Appl. No.: |
13/197775 |
Filed: |
August 4, 2011 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
G06F 1/20 20130101; H01L
2924/0002 20130101; F28D 15/0275 20130101; H01L 23/467 20130101;
H01L 23/427 20130101; F28D 15/0233 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; H01L 23/3672 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 15, 2011 |
CN |
201110159778.3 |
Claims
1. A heat dissipation device comprising: a first base; a second
base attached on the first base; a fin set attached on the second
base; a first heat pipe comprising a first evaporating section
sandwiched between the first base and the second base, two first
condensing sections sandwiched between the second base and the fin
set, and two first connecting sections respectively interconnecting
the first evaporating section and the first condensing sections;
and a second heat pipe comprising a second evaporating section
sandwiched between the first base and the second base, a second
condensing section inserted into the fin set, and a second
connecting section interconnecting the second evaporating section
and the second condensing section.
2. The heat dissipation device of claim 1, wherein a plurality of
first receiving grooves are defined in a top face of the first
base, and the first evaporating section and the second evaporating
section are respectively received in the first receiving
grooves.
3. The heat dissipation device of claim 2, wherein a top face of
the first evaporating section is coplanar with a top face of the
second evaporating section and the top face of the first base.
4. The heat dissipation device of claim 1, wherein two second
receiving grooves are defined in a bottom face of the fin set, and
the first condensing sections are respectively received in the
second receiving grooves.
5. The heat dissipation device of claim 4, wherein bottom faces of
the condensing sections are coplanar with a bottom face of the fin
set.
6. The heat dissipation device of claim 1, wherein two first
recessed portions are defined in a top face of the first base, two
first cutouts are defined in the second base, two second recessed
portions are defined in a bottom face of the fin set, and the first
recessed portions correspondingly communicated with the first
cutouts and the second recessed portions, thereby forming two
receiving space.
7. The heat dissipation device of claim 6, wherein each first
connecting section is accommodated in a corresponding receiving
space.
8. The heat dissipation device of claim 1, wherein a through hole
is defined in the fin set for receiving the second condensing
section therein, and the through hole extends transversely through
the fin set.
9. The heat dissipation device of claim 8, wherein the through hole
is located adjacent a top end of the fin set.
10. The heat dissipation device of claim 8, wherein a receiving
slot is defined at a lateral side of the fin set for accommodating
the second connecting section therein, and the receiving slot
extends from a bottom face of the fin set to the through hole
11. The heat dissipation device of claim 1, wherein an area of the
second base is larger than that of the first base.
12. The heat dissipation device of claim 11, wherein the first base
and the second base are both rectangular, and a width of the second
base is equal to a length of the first base.
13. The heat dissipation device of claim 1, wherein the first heat
pipe is S-shaped, the first evaporating section is parallel to the
first condensing sections, and the two first condensing sections
are respectively located at two opposite lateral sides of the first
evaporating section.
14. The heat dissipation device of claim 1, wherein the second heat
pipe is U-shaped, and the second evaporating section is parallel to
the second condensing section.
15. The heat dissipation device of claim 1, wherein the fin set
comprises a plurality of parallel fins engaging with each
other.
16. A heat dissipation device comprising: a first base; a second
base attached on the first base; a fin set attached on the second
base; a first heat pipe comprising a first evaporating section
sandwiched between the first base and the second base, a first
condensing section sandwiched between the second base and the fin
set, and a first connecting section interconnecting the first
evaporating section and the first condensing section; and a second
heat pipe comprising a second evaporating section located adjacent
to a bottom end of the fin set, a second condensing section located
adjacent to a top end of the fin set, and a second connecting
section interconnecting the second evaporating section and the
second condensing section.
17. The heat dissipation device of claim 16, wherein the second
evaporating section is sandwiched between the first base and the
second base.
18. The heat dissipation device of claim 17, wherein a plurality of
first receiving grooves are defined in a top face of the first
base, and the first evaporating section and the second evaporating
section are respectively received in the first receiving
grooves.
19. The heat dissipation device of claim 16, wherein a second
receiving groove is defined in a bottom face of the fin set, and
the first condensing section is received in the second receiving
groove.
20. The heat dissipation device of claim 16, wherein a through hole
is defined in the fin set for receiving the second condensing
section therein, and the through hole extends transversely through
the fin set.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to heat dissipation devices,
and more particularly to a heat dissipation device incorporating
heat pipes.
[0003] 2. Description of Related Art
[0004] Some electronic components, such as central processing units
(CPUs) and integrated circuit (IC) packages, comprise numerous
circuits operating at high speed and generating substantial heat.
Under most circumstances, it is necessary to cool the electronic
components in order to maintain safe operating conditions and
assure that the electronic components function properly and
reliably. Typically, a finned metal heat dissipation device is
attached to an outer surface of the electronic component to remove
the heat therefrom. The heat absorbed by the heat dissipation
device is then dissipated to ambient air.
[0005] However, as the operating speed of electronic components has
been continually upgraded, these kinds of conventional heat sinks
are increasingly no longer able to meet the heat dissipation
requirements of modern electronic components.
[0006] What is needed, therefore, is a heat dissipation device
which can overcome the above-described problems.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Many aspects of the present heat dissipation device can be
better understood with reference to the following drawings. The
components in the drawings are not necessarily drawn to scale, the
emphasis instead being placed upon clearly illustrating the
principles of the present heat dissipation device. Moreover, in the
drawings, like reference numerals designate corresponding parts
throughout the several views.
[0008] FIG. 1 is an assembled, isometric view of a heat dissipation
device in accordance with an exemplary embodiment of the
disclosure.
[0009] FIG. 2 is an exploded view of the heat dissipation device of
FIG. 1.
[0010] FIG. 3 is an inverted, exploded view of the heat dissipation
device of FIG. 1.
[0011] FIG. 4 is a front plan view of the heat dissipation device
of FIG. 1.
DETAILED DESCRIPTION
[0012] Referring to FIGS. 1 and 2, a heat dissipation device in
accordance with an exemplary embodiment of the disclosure is used
for dissipating heat generated by an electronic component (not
shown) mounted on a printed circuit board (not shown). The heat
dissipation device comprises a first base 10 for thermally
contacting the electronic component, a second base 20 disposed on
the first base 10, a fin set 30 disposed on the second base 20, and
a first heat pipe 40 and two second heat pipes 50 thermally
connecting the first base 10 and the second base 20 with the fin
set 30.
[0013] The first base 10 is made of metal with good heat
conductivity, such as aluminum, copper, or alloys thereof. The
first base 10 has a rectangular profile. A plurality of elongated
first receiving grooves 12 are defined in a top face of the first
base 10. In this embodiment, there are three first receiving
grooves 12. The first receiving grooves 12 are spaced from and
parallel to each other. Two first recessed portions 14 are defined
in the top face of the first base 10. The two first recessed
portions 14 are located at two opposite lateral sides of the first
base 10. In this embodiment, the first receiving grooves 12 extend
along a lengthwise direction of the first base 10.
[0014] The second base 20 is made of metal with good heat
conductivity, such as aluminum, copper, or alloys thereof. The
second base 20 has a rectangular profile. Two first cutouts 22 are
defined at two opposite lateral sides of the second base 20,
respectively. The first cutouts 22 are located corresponding to the
recessed portions 14 of the first base 10. In other words, the
first cutouts 22 correspondingly face the recessed portions 14. Two
second cutouts 24 are defined at the two opposite lateral sides of
the second base 20, respectively. The second cutouts 24 are spaced
from the first cutouts 22. The two second cutouts 24 are located
corresponding to two opposite outmost first receiving grooves 12 of
the first base 10. A bottom face of the second base 20 thermally
contacts the top face of the first base 10. An area of the second
base 20 is larger than that of the first base 10. In this
embodiment, a width of the second base 20 is equal to a length of
the first base 10.
[0015] Referring to FIGS. 3 and 4 also, the fin set 30 comprises a
plurality of parallel fins 31. A passage (not labeled) is defined
between every two adjacent fins 31 to allow airflow therethrough.
Each of the fins 31 comprises an upright sheet body and a pair of
flanges bent horizontally from a top of the sheet body and engaging
the sheet body of an adjacent fin 31. A bottom face of the fin set
30 thermally contacts a top face of the second base 20. Two
elongated second receiving grooves 32 are defined in the bottom
face of the fin set 30. The two second receiving grooves 32 are
spaced from and parallel to each other. Two second recessed
portions 34 are defined in the bottom face of the fin set 30. The
two second recessed portions 34 are located at two opposite lateral
sides of the fin set 30. The two second recessed portions 34 are
correspondingly located adjacent to ends of the two second
receiving grooves 32. The two second recessed portions 34 are
correspondingly communicated with the two first cutouts 22 of the
second base 20 and the two first recessed portions 14 of the first
base 10. Each second recessed portion 34 cooperates with a
corresponding first cutout 22 and a corresponding first recessed
portion 14 to form a receiving space.
[0016] Two elongated through holes 36 are defined in the fin set
30. The through holes 36 extend transversely through the fin set
30. The through holes 36 are located adjacent a top end of the fin
set 30. Two receiving slots 38 are respectively defined at two
opposite lateral sides of the fin set 30. Each receiving slot 38
extends from the bottom face of the fin set 30 to a corresponding
through hole 36, whereby the receiving slot 38 defines two openings
(not labeled) respectively in the bottom face of the fin set 30 and
a corresponding lateral side of the fine set 30. The openings
defined in the bottom face of the fin set 30 are correspondingly
communicated with the two second cutouts 24 of the second base
20.
[0017] The first heat pipe 40 comprises a first evaporating section
42, two first condensing sections 44 spaced from the first
evaporating section 42, and two first connecting sections 46
respectively interconnecting the first evaporating section 42 and
the first condensing sections 44. The first evaporating section 42
is S-shaped. The first evaporating section 42 is parallel to the
first condensing sections 44. The first evaporating section 42 and
the first condensing sections 44 each have a semicircular cross
section. The two first condensing sections 44 are respectively
located at two lateral sides of the first evaporating section 42.
The first evaporating section 42 of the first heat pipe 40 is
received in a corresponding first receiving groove 12 of the first
base 10. The first evaporating section 42 of the first heat pipe 40
is sandwiched between the first base 10 and the second base 20. A
top face of the first evaporating section 42 is coplanar with the
top face of the first base 10. The first condensing sections 44 of
the first heat pipe 40 are respectively received in the two second
receiving grooves 32 of the fin set 30. The first condensing
sections 44 of the first heat pipe 40 are sandwiched between the
second base 20 and the fin set 30. Bottom faces of the first
condensing sections 44 of the first heat pipe 40 are coplanar with
the bottom face of the fin set 30. The first condensing sections 44
of the first heat pipe 40 are spaced from the top face of the first
base 10. Each first connecting section 46 of the first heat pipe 40
is accommodated in a corresponding receiving space.
[0018] Each of the second heat pipes 50 comprises a second
evaporating section 52, a second condensing section 54 spaced from
the second evaporating section 52, and a second connecting section
56 interconnecting the second evaporating section 52 and the second
condensing section 54. Each second heat pipe 50 is U-shaped. The
second evaporating section 52 is parallel to the second condensing
section 54 of each second heat pipe 50. In this embodiment, there
are two second heat pipes 50 juxtaposed with each other. The second
evaporating section 52 of each second heat pipe 50 is received in a
corresponding first receiving groove 12 of the first base 10. The
second evaporating sections 52 of the second heat pipes 50 are
sandwiched between the first base 10 and the second base 20. Top
faces of the second evaporating sections 52 of the second heat
pipes 50 are coplanar with the top face of the first base 10. The
second condensing section 54 of each second heat pipe 50 is
fittedly received in a corresponding through hole 36 of the fin set
30. The second connecting section 56 of each second heat pipe 50 is
accommodated in a corresponding receiving slot 38.
[0019] In use of the heat dissipation device, heat absorbed by the
first base 10 is transferred to the second base 20 and then
distributed to the fin set 30. The heat dissipates into the ambient
from the fin set 30. A thermal conductive capability between the
first base 10 and the fin set 30 is enhanced via the first heat
pipe 40 and the second heat pipes 50. The first evaporating section
42 of the first heat pipe 40 is sandwiched between the first base
10 and the second base 20, and the first condensing sections 44 of
the first heat pipe 40 are sandwiched between the second base 20
and the fin set 30. The second evaporating section 52 of the second
heat pipe 50 is sandwiched between the first base 10 and the second
base 20, and the second condensing section 54 of the second heat
pipe 50 is inserted into the through hole 36 of the fin set 30 and
located adjacent to the top end of the fin set 30. Thus, heat
accumulated in the first base 10 is more quickly conducted to the
fin set 30, and the heat dissipation efficiency of the heat
dissipation device is thus greatly improved.
[0020] Additionally, besides the electronic component mounted on
the printed circuit board, there may be other electronic components
nearby. In a typical application, the area of the first base 10 is
limited to a certain extent, in order to avoid interference with
such other electronic components. However, as the first base 10,
the second base 20 and the fin set 30 are separate components, the
area of the second base 20 positioned on the first base 10 is
adaptable, and the size of the fin set 30 positioned on the second
base 20 is likewise adaptable. Hence, the area of the second base
20 can be configured to be quite large, and the size of the fin set
30 can be configured to be correspondingly large. Thus the heat
dissipation device can provide a large heat dissipation area for
efficient heat dissipation, without interfering with the other
electronic components mounted on the printed circuit board.
[0021] It is to be understood, however, that even though numerous
characteristics and advantages of the present embodiment(s) have
been set forth in the foregoing description, together with details
of the structures and functions of the embodiment(s), the
disclosure is illustrative only, and changes may be made in detail,
especially in matters of shape, size, and arrangement of parts
within the principles of the invention to the full extent indicated
by the broad general meaning of the terms in which the appended
claims are expressed.
* * * * *