U.S. patent application number 13/591453 was filed with the patent office on 2012-12-13 for manufacturing method of semiconductor apparatus.
Invention is credited to Katsuhiko YAMAMOTO.
Application Number | 20120312235 13/591453 |
Document ID | / |
Family ID | 39825857 |
Filed Date | 2012-12-13 |
United States Patent
Application |
20120312235 |
Kind Code |
A1 |
YAMAMOTO; Katsuhiko |
December 13, 2012 |
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS
Abstract
The manufacturing method of a semiconductor apparatus has a step
for carrying in the substrate into the processing chamber; a step
for heating the processing chamber and the substrate to the
predetermined temperature; and a gas supply and exhaust step for
supplying and exhausting desired gas into and from the processing
chamber, wherein the gas supply and exhaust step repeats by the
predetermined times a first supply step for supplying silicon-type
gas and hydrogen gas into the processing chamber; a first exhaust
step for exhausting at least said silicon-type gas from the
processing chamber; a second supply step for supplying chlorine gas
and hydrogen gas into the processing chamber; and a second exhaust
step for exhausting at least the chlorine gas from the processing
chamber.
Inventors: |
YAMAMOTO; Katsuhiko;
(Toyama, JP) |
Family ID: |
39825857 |
Appl. No.: |
13/591453 |
Filed: |
August 22, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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12060511 |
Apr 1, 2008 |
8282733 |
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13591453 |
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Current U.S.
Class: |
118/725 |
Current CPC
Class: |
C23C 16/04 20130101;
C30B 29/06 20130101; C30B 25/14 20130101; C23C 16/24 20130101; C23C
16/45523 20130101 |
Class at
Publication: |
118/725 |
International
Class: |
C23C 16/30 20060101
C23C016/30 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 2, 2007 |
JP |
2007-096059 |
Mar 24, 2008 |
JP |
2008-075763 |
Claims
1. A substrate processing apparatus for selectively growing an
epitaxial film at a surface of a substrate stored in a processing
chamber, by using at least silicon-containing gas and chlorine gas,
and by supplying alternately repeatedly said silicon-containing gas
and said chlorine gas into said processing chamber, comprising: the
processing chamber for storing the substrate; a heating unit for
heating said substrate and the atmosphere of the inside of said
processing chamber, installed at the outside of said processing
chamber; a gas supply unit for supplying desired gas into said
processing chamber; an exhaust port opening at said processing
chamber; and a control part for controlling at least said heating
unit and said gas supply unit, wherein said gas supply unit
comprises; a first gas supply member for supplying
silicon-containing gas; a second gas supply member for supplying
chlorine gas; and a third gas supply member for supplying hydrogen
gas, and said control part controls said gas supply unit so that
hydrogen gas is simultaneously supplied in case of supplying said
silicon-containing gas into the inside of said processing chamber,
and controls said gas supply unit so that hydrogen gas is
simultaneously supplied in case of supplying said chlorine gas into
the inside of said processing chamber.
2. The substrate processing apparatus according to claim 1, wherein
said control part, in case of supplying at least said chlorine gas,
controls said heating unit so that the atmosphere of the inside of
said processing chamber and said substrate is heated at equal to or
lower than 700.degree. C.
Description
CROSS REFERENCED TO RELATED APPLICATIONS
[0001] The present application is a Divisional Application of
application Ser. No. 12/060,511, filed Apr. 1, 2008; which claims
priorities from Japanese applications JP2007-096059 filed on Apr.
2, 2007, JP2008-75763 filed on Mar. 24, 2008, the contents of which
are hereby incorporated by reference into this application.
BACKGROUND OF THE INVENTION
[0002] The present invention relates to a manufacturing method of a
semiconductor apparatus for manufacturing a semiconductor apparatus
by carrying out processing such as thin film formation, impurity
diffusion, annealing processing and etching on a substrate such as
a silicon wafer, a glass substrate.
[0003] As one of semiconductor apparatuses, there is a MOSFET
(Metal Oxide Semiconductor Field Effect Transistor), which is a
polymerized structure of a metal, an oxide film and a
semiconductor, and in recent years, it has been progressing to
attain finer patterning and higher performance of MOSFET.
[0004] As a problem in attaining the finer patterning and higher
performance MOSFET, there is decrease in contact resistance or the
like, and as one method for solving this problem, there is a method
of selectively growing a silicon epitaxial film on a
source/drain.
[0005] Conventionally, growth of a silicon epitaxial film has been
carried out by using SiH.sub.2Cl.sub.2 and HCl and H.sub.2, as
processing gas, and by continuously supplying these processing
gases into a processing chamber at a processing temperature of from
750.degree. C. to 850.degree. C.
[0006] The above processing temperature of 750.degree. C. to
800.degree. C. is high temperature, and accompanying with the finer
patterning and higher performance, influence of thermal damage and
thermal budget on the substrate element increases, which makes a
cause of inhibition of making a higher performance device, or a
cause of lower yield.
[0007] As conventional technology, JP-A-2003-86511 and JP-A-5-21357
are included.
SUMMARY OF THE INVENTION
[0008] It is an object of the present invention, in consideration
of the above situation, to provide a manufacturing method of a
semiconductor apparatus, which is capable of formation of a high
quality film at low temperature, and attains enhancements of device
performance as well as yield.
[0009] The present invention relates to a manufacturing method of a
semiconductor apparatus for selectively growing an epitaxial film
at a silicon surface of a substrate, by storing the substrate
having at least the silicon surface and an insulating surface at
the surface thereof, into a processing chamber, and by using a
substrate processing apparatus for heating an atmosphere of the
inside of the processing chamber and the substrate to a
predetermined temperature by a heating unit installed outside,
comprising a step for carrying in the substrate into the processing
chamber; a step for heating the atmosphere of the inside of the
processing chamber and the substrate to the predetermined
temperature; and a gas supply and exhaust step for supplying and
exhausting desired gas into and from the processing chamber,
wherein the gas supply and exhaust step repeats by the
predetermined times and carries out, a first supply step for
supplying silicon-containing gas and hydrogen gas into the
processing chamber; a first exhaust step for exhausting at least
the silicon-containing gas from the processing chamber; a second
supply step for supplying chlorine gas and hydrogen gas into the
processing chamber; and a second exhaust step for exhausting at
least the chlorine gas from the processing chamber.
[0010] According to the present invention, there is provided a
manufacturing method of a semiconductor apparatus for selectively
growing an epitaxial film at a silicon surface of a substrate, by
storing the substrate having at least the silicon surface and an
insulating surface at the surface thereof into a processing
chamber, and by using a substrate processing apparatus for heating
an atmosphere of the inside of the processing chamber and the
substrate to a predetermined temperature by a heating unit
installed outside, comprising a step for carrying in the substrate
into the processing chamber; a step for heating the atmosphere of
the inside of the processing chamber and the substrate to the
predetermined temperature; and a gas supply and exhaust step for
supplying and exhausting desired gas into and from the processing
chamber, wherein the gas supply and exhaust step repeats by the
predetermined times and carries out, a first supply step for
supplying silicon-containing gas and hydrogen gas into the
processing chamber; a first exhaust step for exhausting at least
the silicon-containing gas from the processing chamber; a second
supply step for supplying chlorine gas and hydrogen gas into the
processing chamber; and a second exhaust step for exhausting at
least the chlorine gas from the processing chamber, therefore,
throughput is enhanced because a gas purge step by inert gas can be
omitted in a step before or after the second supply step, and also,
excellent effect of enhancing processing uniformity is exerted,
because processing by chlorine gas is carried out by supplying
hydrogen gas along with chlorine gas.
[0011] Other objects, features and advantages of the invention will
become apparent from the following description of the embodiments
of the invention taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a perspective view showing an example of a
substrate processing apparatus relevant to an embodiment of the
present invention.
[0013] FIG. 2 is a schematic cross-sectional view of a processing
furnace used in the substrate processing apparatus.
[0014] FIG. 3 is a flowchart of a processing step relevant to the
present invention.
[0015] FIG. 4A is a flowchart showing an example of a first
film-formation step of the present invention.
[0016] FIG. 4B is a flowchart showing an example of a second
film-formation step of the present invention.
[0017] FIG. 5 is an explanation drawing showing a film-formation
state in the present invention.
[0018] FIG. 6 is a drawing showing etching data of a comparative
experiment of the present invention.
DESCRIPTION OF THE EMBODIMENTS
[0019] Explanation will be given below on embodiments for carrying
out the present invention with reference to drawings.
[0020] First, explanation will be given, in FIG. 1, on a substrate
processing apparatus, where the present invention is carried
out.
[0021] In FIG. 1, "1" represents a substrate processing apparatus,
"2" represents a substrate storage container (cassette), and a
substrate (wafer) "3" such as a silicon wafer, which is processed
by the substrate processing apparatus 1, is carried-in or
carried-out in a stored state in the cassette 2 in required pieces,
for example, 25 pieces.
[0022] At the lower part of a front side wall 5 of a housing 4 of
the substrate processing apparatus 1, a front side maintenance port
6 is installed as an opening part for maintenance, and said front
side maintenance port 6 is designed to be capable of opening and
closing by a front side maintenance door (not shown). At the upward
of the front side maintenance port 6, there is installed a
substrate storage container gateway 8 for carrying in and carrying
out the cassette 2, and the substrate storage container gateway 8
is designed to be opened and closed by a gateway opening and
closing facility (a front shutter) (not shown).
[0023] Adjacent to the inside of the housing 4, and the substrate
storage container gateway 8, a substrate storage container
receiving apparatus (a cassette receiving stage) 11 is installed,
and facing the cassette receiving stage 11, there are installed a
lower substrate storage container storage shelf (a cassette shelf)
12, and an upper substrate storage container storage shelf (a
buffer cassette shelf) 13, for storing the required pieces of the
cassettes 2.
[0024] Between the cassette receiving stage 11 and the cassette
shelf 12 and the buffer cassette shelf 13, a substrate storage
container carrying apparatus (a cassette carrying apparatus) 14 is
installed. Said cassette carrying apparatus 14 is provided with a
traverse facility, a hoisting facility and a rotation facility, and
is capable of carrying the cassette 2 in required position, between
the cassette receiving stage 11 and the cassette shelf 12 and the
buffer cassette shelf 13, by a cooperation of the traverse
facility, the hoisting facility and the rotation facility.
[0025] At the backward and the lower part of the inside of the
housing 4, a load lock chamber 15, which is an air-tight container,
is installed, and at the upper side of the load lock chamber 15, a
processing furnace 16 is installed. The processing furnace 16 is
provided with an air-tight processing chamber 17, and the
processing chamber 17 is connected air-tightly to the load lock
chamber 15, and a furnace port part at the lower end of the
processing chamber 17 is designed to be blockable air-tightly by a
furnace port gate valve 20.
[0026] At the inside of the load lock chamber 15, a substrate
holding tool (a boat) 18 can be stored, and said boat 18 is made of
a heat resistant material, for example, quartz or silicon carbide
or the like, which is designed to be capable of holding the wafer 3
in multiple stages, in a horizontal position. In addition, it is
preferable that a shelf for supporting the wafer 3 is casted in a
ring-like shape. It should be noted that at the lower part of the
boat 18, there are installed in multiple stages and in a horizontal
position, multiple pieces of heat insulating plates (not shown) as
a heat insulating member with a circular plate-like shape, made of
a heat resistant material of, for example, quartz or silicon
carbide or the like, so as to inhibit heat radiation downward.
[0027] In addition, there is installed a substrate holding tool
hoisting facility (a boat elevator) 19 for supporting the boat 18,
and for mounting and dismounting said boat 18 to and from the
processing chamber 17, at the load lock chamber 15.
[0028] Said load lock chamber 15 is provided with a substrate
transfer port 21 for transferring the wafer 3 onto the boat 18, and
said substrate transfer port 21 is released and also blocked
air-tightly by a gate valve 25. At the load lock chamber 15, there
is connected a gas supply system 22 for supplying inert gas such as
nitrogen gas, and also connected an exhaust apparatus (not shown)
for exhausting the inside of the load lock chamber 15 to make
negative pressure.
[0029] Between the load lock chamber 15 and the cassette shelf 12,
a substrate transfer apparatus (a substrate transfer machine) 23 is
installed, and said substrate transfer machine 23 is provided with
required pieces (for example, 5 pieces) of substrate holding plate
24 for mounting and holding the wafer 3, as well as provided with
an hoisting facility part for hoisting the substrate holding plates
24, a rotation facility part for rotation thereof, and a forward
and backward movement facility part for making forward and backward
movement thereof.
[0030] The substrate transfer machine 23 is designed so that a
substrate is transferred between the boat 18 in a descending state
and the cassette shelf 12, via the substrate transfer port 21, by
cooperation of the hoisting facility part, the rotation facility
part and the forward and backward movement facility part.
[0031] It should be noted that at a required position of the inside
of the housing 4, for example, a clean unit 26 is installed facing
the buffer cassette shelf 13, and flow of clean atmosphere is
formed in the inside of the housing 4 by said clean unit 26.
[0032] Explanation will be given below on actuation of the
substrate processing apparatus 1.
[0033] The substrate storage container gateway 8 is released by a
front shutter (not shown), and the cassette 2 is carried in from
the substrate storage container gateway 8. The cassette 2 carried
in is mounted so that the wafer 3 takes a vertical position and a
gateway of the wafer 3 faces an upward direction.
[0034] Then, by the cassette carrying apparatus 14, the cassette 2
is carried to a designated shelf position of the cassette shelf 12
or the buffer cassette shelf 13. The cassette 2 stored at the
cassette shelf 12 or the buffer cassette shelf 13 is set to take
horizontal position and the gateway faces the substrate transfer
machine 23. In addition, after being temporarily stored, the
cassette 2 is transferred from the buffer cassette shelf 13 to the
cassette shelf 12 by the cassette carrying apparatus 14.
[0035] Inside of the load lock chamber 15 is made in an atmospheric
pressure state in advance, and the boat 18 is descended to the
inside of the load lock chamber 15 by the boat elevator 19. By the
gate valve 25, the substrate transfer port 21 is released, and by
the substrate transfer machine 23, the wafer 3 is transferred into
the boat 18 from the cassette 2.
[0036] When previously designated pieces of the wafers 3 are
charged onto the boat 18, the substrate transfer port 21 is closed
by the gate valve 25, and a pressure of the load lock chamber 15 is
reduced by vacuuming with an exhaust apparatus. When the pressure
of the load lock chamber 15 is reduced to the same pressure in the
processing chamber 17, the furnace port part of the processing
chamber 17 is released by the furnace port gate valve 20, and the
boat 18 is charged into the processing chamber 17 by the boat
elevator 19.
[0037] The wafer 3 is subjected to predetermined processing by
carrying out the heating of the wafer 3, the introduction of
processing gas into the processing chamber 17 and exhaustion or the
like.
[0038] After processing, the boat 18 is taken out by the boat
elevator 19, and still more, after pressure in the load lock
chamber 15 is restored to atmospheric pressure, the gate valve 25
is opened. After that, the wafer 3 and the cassette 2 are carried
out to the outside of the housing 4 by reversed procedure of the
above.
[0039] Then explanation will be given, in FIG. 2, on the processing
furnace 16 and the boat elevator 19.
[0040] As shown in FIG. 2, the processing furnace 16 has a heater
31 as heating facility. Said heater 31 has a circular cylinder-like
shape and is configured by a heater element line and an insulating
member installed at the circumference thereof, and is installed
vertically by being supported by a holding body not shown.
[0041] At the vicinity of the heater 31, a temperature sensor (not
shown) is installed as a temperature detecting body for detecting
temperature in the processing chamber 17. A temperature control
part 45 is electrically connected to the heater 31 and the
temperature sensor, and it is configured so as to control in
desired timing so that temperature in the processing chamber 17
becomes desired temperature distribution by adjusting a
current-carrying state to the heater 31 based on temperature
information detected by the temperature sensor.
[0042] At the inside of the heater 31, a reaction tube 32 is
installed concentrically with the heater 31. Said reaction tube 32
is made of a heat resistant material such as quartz (SiO.sub.2) or
silicon carbide (SiC), and is formed in a circular cylinder-like
shape with the upper end blocked and the lower end opened. The
reaction tube 32 configures the processing chamber 17, stores the
boat 18, and the wafer 3 is stored in the processing chamber 17 in
a state held in the boat 18.
[0043] At the downward of the reaction tube 32, a manifold 33 is
installed concentrically with the reaction tube 32, and the
reaction tube 32 is installed at the manifold 33. Said manifold 33
is made of, for example, stainless steel or the like, and is formed
in a circular cylinder-like shape with the upper end and the lower
end opened. It should be noted that between the manifold 33 and the
reaction tube 32, an O-ring is installed as a sealing member. The
manifold 33 is supported by a holding body, for example, the load
lock chamber 15, and thereby the reaction tube 32 becomes in a
vertically installed state. A reaction container is formed by said
reaction tube 32 and the manifold 33.
[0044] At said manifold 33, an exhaust pipeline 34 is installed, as
well as a gas supply pipeline 35 is installed so as to pass
through. The gas supply pipeline 35 is branched into three at the
upstream side, and connected to a first gas supply source 42, a
second gas supply source 43 and a third gas supply source 44, via
valves 36, 37 and 38, and MFCs 39, 40 and 41 as gas flow amount
control apparatus, respectively. It is designed that the first gas
supply source 42 supplies, for example, silane-type gas or
halogen-containing silane-type gas as processing gas, the second
gas supply source 43 supplies hydrogen gas as processing gas or
carrier gas, and in addition, the third gas supply source 44
supplies nitrogen gas as carrier gas or purging gas.
[0045] A gas flow amount control part 46 is electrically connected
to the MFCs 39, 40 and 41, and the valves 36, 37 and 38, and said
gas flow amount control part 46 is configured to control in desired
timing so that flow amount of supplying gas becomes desired flow
amount.
[0046] At the lower stream side of the exhaust pipeline 34, a
vacuum exhaustion apparatus 48 such as a vacuum pump is connected,
via a pressure sensor as a pressure detector not shown, and an APC
valve 47 as a pressure regulator. As the vacuum exhaustion
apparatus 48, it is preferable that a ternary vacuum pump system
with high exhaustion capability, for example, a molecular turbo
pump+a machine booth and a pump+a dry pump or the like are
used.
[0047] A pressure control part 49 is electrically connected to the
pressure sensor and the APC valve 47, and said pressure control
part 49 is configured so as to control in desired timing so that
pressure of the processing chamber 17 becomes desired pressure by
adjusting degree of opening of the APC valve 47, based on pressure
detected with the pressure sensor.
[0048] In the configuration of the processing furnace 16, the first
processing gas is supplied from the first gas supply source 42, and
is introduced into the processing chamber 17 by the gas supply
pipeline 35, via the valve 36, after adjustment of flow amount
thereof by the MFC 39. The second processing gas is supplied from
the second gas supply source 43, and is introduced into the
processing chamber 17 by the gas supply pipeline 35, via the valve
37, after adjustment of flow amount thereof by the MFC 40. The
third processing gas is supplied from the third gas supply source
44, and is introduced into the processing chamber 17 by the gas
supply pipeline 35, via the valve 38, after adjustment of flow
amount thereof by the MFC 41. In addition, gas in the processing
chamber 17 is exhausted from the processing chamber 17 by the
vacuum exhaustion apparatus 48 connected to the exhaust pipeline
34.
[0049] Then explanation will be given on the boat elevator 19.
[0050] The drive facility part 51 of said boat elevator 19 is
installed at the side wall of the load lock camber 15.
[0051] The drive facility part 51 is provided with a guide shaft 52
installed in parallel and a ball screw 53, and said ball screw 53
is supported in a free-rotation state, and is designed to be
rotated by a hoisting motor 54. A hoisting platform 55 is engaged
slidably to the guide shaft 52, as well as screwed in to the ball
screw 53, and at the hoisting platform 55, a hollow hoisting shaft
56 is installed vertically in parallel to the guide shaft 52.
[0052] Said hoisting shaft 56 is extended inside by passing
thorough freely a ceiling surface of the load lock chamber 15, and
at the lower end thereof, a hollow drive part storage case 57 is
installed air-tightly. A bellows 58 is installed so as to cover the
hoisting shaft 56 in non-contact state, and the upper end of the
bellows 58 is fixed at the lower surface of the hoisting platform
55, and the lower end of the bellows 58 is fixed at the upper
surface of the load lock chamber 15, each air-tightly, and a free
passing through part of the hoisting shaft 56 and said hoisting
shaft 56 are sealed air-tightly.
[0053] At the ceiling part of the load lock chamber 15, a furnace
port 59 is installed concentrically with the manifold 33, and the
furnace port 59 is designed to be blockable air-tightly by a seal
cap 61. Said seal cap 61 is, for example, made of metal such as
stainless steel, and formed in a circular disk-like shape, and
fixed air-tightly at the upper surface of the drive part storage
case 57.
[0054] The drive part storage case 57 has an air-tight structure,
and the inside thereof is isolated from atmosphere in the load lock
chamber 15. At the inside of the drive part storage case 57, a boat
rotation facility 62 is installed, and the rotation axis of the
boat rotation facility 62 is extended upward by passing through
freely a top panel of the drive part storage case 57 and the seal
cap 61, and at the upper end thereof, a boat mounting platform 63
is fixed, and the boat 18 is mounted on the boat mounting platform
63.
[0055] The seal cap 61 and the boat rotation facility 62 are each
cooled by a water-cooling-type cooling facilities 64 and 65, and a
cooling-water pipeline 66 to the cooling facilities 64 and 65 is
connected to an external cooling water source (not shown) after
passing the hoisting shaft 56. In addition, power supply to the
boat rotation facility 62 is carried out via a power supply cable
67 wired through the hoisting shaft 56.
[0056] A drive control part 68 is electrically connected to the
boat rotation facility 62 and the hoisting motor 54, and it is
configured so as to control in desired timing to perform desired
motion.
[0057] The temperature control part 45, the gas flow amount control
part 46, the pressure control part 49 and the drive control part 68
configure also an operation part and an input-output part, and
electrically connected to a main control part 69 for controlling
whole part of the substrate processing apparatus 1.
[0058] As described above, a drive part of the boat elevator 19,
the boat rotation facility 62, the cooling-water pipeline 66, the
power supply cable 67 and the like are isolated from the inside of
the load lock chamber 15, by the drive part storage case 57 and the
bellows 58, therefore, there is no risk that the wafer 3 is
contaminated by organic substances and particles emitted from a
driving system and a wiring system, by residual heat in vacuuming
of the load lock chamber 15, or in releasing of the furnace port
gate valve 20.
[0059] Then, explanation will be given on a method for carrying out
film-formation processing on a substrate such as the wafer 3, as
one step of production steps of a semiconductor device, by using
the processing furnace 16, with reference to FIG. 3.
[0060] It should be noted that in the following explanation,
movement of each part configuring the substrate processing
apparatus 1 is controlled by the main control part 69.
[0061] First, a naturally oxidized film on the surface of the wafer
3 is removed with diluted hydrofluoric acid, and at the same time,
the surface was subjected to hydrogen termination (STEP: 01).
[0062] The boat 18 is descended by the boat elevator 19, and the
furnace port 59 is blocked air-tightly by the furnace port gate
valve 20. The substrate transfer port 21 is released by the gate
valve 25, in a state that the inside of the load lock chamber 15
becomes a state having the same pressure as that in the outside of
the load lock chamber 15. By the substrate transfer machine 23,
predetermined pieces of the wafers 3 are charged onto the boat 18
(STEP: 02).
[0063] The substrate transfer port 21 is blocked air-tightly by the
gate valve 25, and the inside of the load lock chamber 15 is
subjected to repeated vacuuming and purging by inert gas (for
example, nitrogen gas) to remove oxygen and moisture in the
atmosphere of the inside of the load lock chamber 15.
[0064] Then, the furnace port 59 is released by the furnace port
gate valve 20, and the boat elevator 19 is driven. The ball screw
53 is rotated by the drive of the hoisting motor 54, and the drive
part storage case 57 is ascended via the hoisting platform 55 and
the hoisting shaft 56, and the boat 18 is charged into the
processing chamber 17. In this state, the seal cap 61 blocks the
furnace port 59 air-tightly via an O-ring.
[0065] It should be noted that temperature of the processing
chamber 17 at charging is set at 200.degree. C. or around
200.degree. C., to prevent surface oxidation of the wafer 3 (STEP:
03).
[0066] The inside of the processing chamber 17 is subjected to
vacuum exhausting by the vacuum exhaustion apparatus 48, so as to
become desired pressure (degree of vacuum). In this case, pressure
in the processing chamber 17 is measured with a pressure sensor,
and based on this pressure measured, the APC valve 47 is feed-back
controlled. In addition, the processing chamber 17 is heated by the
heater 31 so that the inside thereof becomes desired temperature
and desired temperature distribution, and the heating state is
feed-back controlled by the temperature control part 45, based on
temperature information detected by the temperature sensor.
Subsequently, the wafer 3 is rotated by rotation of the boat 18, by
the boat rotation facility 62.
[0067] When the boat 18 is charged into the processing chamber 17
and exhaustion is completed, the processing chamber is set at
pre-treatment temperature (it is usually the same as film-formation
temperature, however, in treatment with only H.sub.2 gas, it is
from 750 to 800.degree. C. Treatment under raising temperature
after charging the boat is also possible), and pre-treatment is
carried out. For the pre-treatment, hydrogen gas or silane-type gas
(for example, SiH.sub.4), or halogen-containing silane gas or
hydrogen chloride gas, or combination gas thereof is supplied along
with inert gas or carrier gas such as hydrogen gas, from the first
gas supply source 42, the second gas supply source 43 and the third
gas supply source 44, via the MFCs 39, 40 and 41 (STEP: 04).
[0068] By carrying out the pre-treatment, interface oxygen and
carbon density can be reduced, and high quality interface can be
formed between a semiconductor substrate and a thin film.
[0069] After completion of the pre-treatment, residual gas in the
processing chamber 17 is removed by carrier gas such as
hydrogen.
[0070] Temperature of the processing chamber 17 is adjusted from
pre-treatment temperature to film-formation temperature. In this
time, hydrogen gas is flown to the processing chamber 17, as
carrier gas, to prevent contamination caused by reversed diffusion
from an exhaustion system (STEP: 05).
[0071] When temperature of the processing chamber 17 is stabilized
at film-formation temperature, processing gas is introduced to
carry out film-formation processing. Each processing gas is
supplied from the first gas supply source 42, the second gas supply
source 43 and the third gas supply source 44. In addition, after
adjustment the degree of opening of the MFCs 39, 40 and 41, so as
to attain desired flow amount, the valves 36, 37 and 38 are opened,
and each processing gas is introduced into the processing chamber
17 from the upper part of the processing chamber 17, by flowing
through the gas supply pipeline 35.
[0072] As processing gas to be introduced, silane-type gas
(SiH.sub.4), or halogen gas-containing gas or silane-type gas mixed
with hydrogen gas, or halogen-containing silane-type gas mixed with
hydrogen gas is used. In the case where processing gas is
SiH.sub.4, film-formation temperature in the processing chamber 17
is adjusted at from 500 to 700.degree. C.
[0073] Introduced processing gas passes through the inside of the
processing chamber 17, and is exhausted from the exhaust pipeline
34. Processing gas contacts with the wafer 3 in passing through the
inside of the processing chamber 17, to grow and deposit an EPI
film on the surface of the wafer 3. In addition, unnecessary nuclei
on an insulating film are removed by etching processing. A
predetermined film is formed by repeating by the predetermined
time's film-formation and etching (STEP: 06).
[0074] When previously set time elapsed, inert gas is supplied from
an inert gas supply source not shown, and the inside of the
processing chamber 17 is replaced with inert gas, as well as
pressure in the processing chamber 17 is restored to normal
pressure (so as to be the same pressure as that of the inside of
the load lock chamber 15) (STEP: 07).
[0075] After that, temperature in the processing chamber 17 is
lowered to a temperature of, for example, 200.degree. C., that is,
temperature at which the surface of the wafer 3 is not oxidized
(STEP: 08).
[0076] The seal cap 61 is descended by the boat elevator 19, and
the boat 18 is carried out from the furnace port 59 into the inside
of the load lock chamber 15 with opening of the furnace port 59.
The furnace port 59 is blocked by the furnace port gate valve 20.
After the wafer 3 is cooled to required temperature in the load
lock chamber 15, the substrate transfer port 21 is released to take
out the processed wafer 3 from the boat 18 by the substrate
transfer machine 23 (refer to FIG. 1) (STEP: 09).
[0077] Explanation will be given, in FIGS. 4A and 4B, on an example
of film-formation step of the STEP: 06.
[0078] First, FIG. 4A shows an example of the first film-formation
step, and shows the case where Cl.sub.2 is introduced by using
N.sub.2 as carrier gas, in carrying out etching.
[0079] First, SiH.sub.4 and H.sub.2 are introduced for
film-formation (STEP: 11).
[0080] By simultaneous introduction of SiH.sub.4 and H.sub.2, the
processing chamber 17 is maintained clean, and in addition,
although SiH.sub.4 is decomposed to Si+2 H.sub.2, by presence of
H.sub.2, which was supplied simultaneously, the decomposition
action is inhibited. That is, by simultaneous introduction of
SiH.sub.4 and H.sub.2, decomposition degree of SiH.sub.4 can be
controlled.
[0081] After that, SiH.sub.4 is excluded from the processing
chamber 17 by H.sub.2 purge (STEP: 12). The H.sub.2 purge removes
processing gas, as well as brings the substrate surface
H-termination.
[0082] Then, after introduction of nitrogen gas for N.sub.2 purge
(STEP: 13), Cl.sub.2 and N.sub.2 are introduced to remove (etching)
unnecessary nuclei on the insulating film (STEP: 14). Then,
Cl.sub.2 is excluded from the processing chamber 17, by N.sub.2
purging (STEP: 15), and still more N.sub.2 is excluded by H.sub.2
purging (STEP: 16).
[0083] The STEP: 11 to the STEP: 16 are repeated to form a desired
film.
[0084] Still more, in the case of forming an impurity diffused
film, doping gas such as PH.sub.3, B.sub.2H.sub.6, BCl.sub.3 is
introduced in the midway of the STEP: 11 to the STEP: 16.
[0085] In the present step, because SiH.sub.4 is used as
film-formation gas, film-formation temperature can be set as low as
from 500 to 700.degree. C., and influence of thermal damage or
thermal budget on a substrate element can be alleviated. In
addition, in the case where Si.sub.2H.sub.6 is used as a
film-forming gas, it is possible to set film-formation temperature
as low as from 450 to 700.degree. C. compared with the case where
SiH.sub.4 is used.
[0086] Then, FIG. 4B shows an example of the second film-formation
step, and shows the case where Cl.sub.2 is introduced by using
H.sub.2 as carrier gas, in carrying out etching.
[0087] First, SiH.sub.4 and H.sub.2 are introduced for
film-formation (STEP: 21). In this case, it is preferable that flow
amount of SiH.sub.4 gas is from 100 to 500 sccm, flow amount of
H.sub.2 gas is from 100 to 20000 sccm, processing temperature is
from 500 to 700.degree. C., and processing pressure is equal to or
lower than 1000 Pa.
[0088] The fact that decomposition degree of SiH.sub.4 is
controlled by simultaneous introduction of SiH.sub.4 and H.sub.2,
is similar to explanation in FIG. 4A.
[0089] After that, SiH.sub.4 is excluded from the processing
chamber 17 by H.sub.2 purge (STEP: 22). The H.sub.2 purge removes
processing gas, as well as brings the substrate surface
H-termination.
[0090] Then, Cl.sub.2 and H.sub.2 are introduced to remove (by
etching) unnecessary nuclei on the insulating film (STEP: 23). In
this case, it is preferable that flow amount of Cl.sub.2 gas is
from 50 to 200 sccm, flow amount of H.sub.2 gas is from 100 to
20000 sccm, processing temperature is from 500 to 700.degree. C.,
and processing pressure is equal to or lower than 1000 Pa.
[0091] Then, Cl.sub.2 is excluded by H.sub.2 purge (STEP: 24).
Because Cl.sub.2 is diluted with H.sub.2 in etching, uniformity of
etching is enhanced.
[0092] STEP: 21 to STEP: 24 are repeated to form a desired
film.
[0093] Still more, in the case of forming an impurity diffused
film, doping gas such as PH.sub.3, B.sub.2H.sub.6, BCl.sub.3 is
introduced in the midway of the STEP: 21 to the STEP: 24.
[0094] In addition, depending on film-formation state, a flow
amount of one or more kinds of gas among SiH.sub.4, Cl.sub.2 and
H.sub.2 is changed in the gas introduction step in the STEP: 21 and
the STEP: 23.
[0095] For example, by increasing the flow amount of SiH.sub.4,
film-formation rate is increased, and by increasing the flow amount
of Cl.sub.2, etching amount is increased. Therefore, by changing
the flow amount of gas, the following embodiments become
possible.
[0096] For example, SiN and SiO have characteristics that growth of
an Si nucleus is easy, and growth of an Si nucleus is difficult,
respectively. Therefore, for example, an insulating film SiO is
formed in an overlapped state on an insulating film SiN, and on a
substrate with the end surfaces of both insulating films exposed
(refer to FIG. 5), in the initial film-formation processing,
etching rate is strengthened (film-formation rate is slowed), and
when thickness of the film formed is over thickness of the SiN,
etching rate is weakened to be able to increase film-formation
rate.
[0097] In addition, for example, when impurity is present on an Si
surface, which is a target of film-formation processing, the film
tends to be poly silicon film, therefore, etching rate is
strengthened at the early growth stage to carry out film-formation
while removing the impurity, and when an EPI film is formed in
certain degree, etching rate is weakened to increase film-formation
rate.
[0098] It should be noted that by increasing processing pressure,
etching action and film-formation action are increased, therefore
also by changing processing pressure during the film-formation
processing, the above embodiment can be obtained.
[0099] Also in the second film-formation step, because SiH.sub.4 is
used as film-formation gas, film-formation temperature can be set
as low as from 500 to 700.degree. C., and influence of thermal
damage or thermal budget on a substrate element can be alleviated.
In addition, in the case where Si.sub.2H.sub.6 is used as a
film-forming gas, it is possible to set film-formation temperature
as low as from 450 to 700.degree. C. compared with the case where
SiH.sub.4 is used.
[0100] Still more, in the second film-formation step, because
Cl.sub.2 and H.sub.2 are introduced as processing gas in etching,
purging of N.sub.2 is not necessary before or after the etching
step, and a purge step of N.sub.2 can be omitted, therefore
simplification of the film-formation step and shortening of the
processing time are possible, and throughput is enhanced.
[0101] In addition, uniformity of film-formation in an example of
the first film-formation step is about 20%, and uniformity of
film-formation in an example of the second film-formation step is
from 5 to 10%, therefore enhancement of quality of a film formed
was obtained in the example of the second film-formation step as
compared with the example of the first film-formation step.
[0102] In FIG. 6, when the etching is carried out using Cl.sub.2 to
the monitor wafer formed Poly-Si film, there are shown the
experimental results that the etching rate and the uniformity in
wafer surface of etching amount are compared, respectively, in the
case where N.sub.2 is used and H.sub.2 is used as a carrier
gas.
[0103] In FIG. 6, marks .tangle-solidup. and represent etching
rate, and marks A and o represent uniformity in wafer surface of
etching amount.
[0104] The experiment was carried out under the following
conditions:
[0105] Processing temperature: 620.degree. C.
[0106] Total pressure: 2 Pa
[0107] Cl.sub.2 partial pressure: 0.04 Pa
[0108] N.sub.2 partial pressure: 1.96 Pa
[0109] H.sub.2 partial pressure: 1.96 Pa
[0110] Each value obtained by the experiment carried out under the
above conditions is shown in Table 1. From these results, it is
understood that etching by the case used H.sub.2 as a carrier gas
provides lower etching rate and better uniformity in surface of
etched amount, as compared with etching by the case used N.sub.2 as
a carrier gas. Therefore, it can be said that etching by the case
used H.sub.2 as a carrier gas is capable of enhancing uniformity of
film-formation.
[0111] In addition, from FIG. 6, it is understood that etching by
the case used H.sub.2 as a carrier gas is capable of enhancing also
uniformity between the wafer.
TABLE-US-00001 TABLE 1 N.sub.2 dilution H.sub.2 dilution Etching
rate (.ANG./min) 12 to 16 10 to 12 Uniformity of etching amount
~.+-.10 ~.+-.5 within the surface (%)
[0112] Next, it is described the reason why, when the etching is
carried out using Cl.sub.2 as a carrier gas, the case used H.sub.2
as a carrier gas provides better uniformity of etching, as compared
with the case used N.sub.2 as a carrier gas.
[0113] When the etching is carried out only by Cl.sub.2 without
using carrier gas, and when the etching is carried out using
N.sub.2 as carrier gas, etching of Cl.sub.2 becomes dominant.
Therefore, etching at the edge part of a wafer becomes strong, and
gas is almost consumed at the edge part, resulting in no reaching
of etching gas to the center part of the wafer, which lowers
uniformity. On the other hand, when H.sub.2 is used as a carrier
gas, Cl.sub.2 and H.sub.2 react in the gas phase to form an
intermediate, and then the reaction to form 2HCl occurs partially
resulting in lowering the etching power. Because an intermediate of
HCl is formed during the process thereof, etching gas is capable of
reaching the center part of the wafer, therefore, it is considered
that uniformity is improved.
[0114] In addition, it is considered to be one reason that the
wafer surface is covered with H, which then reduces etching effect
of Cl and increases amount of gas reaching to the center part of
the wafer.
[0115] Further, it is described the reason why, when the etching is
carried out using H.sub.2 as a carrier gas, the case used Cl.sub.2
as an etching gas is effective, as compared with the case used HCl
as an etching gas.
[0116] Because the processing furnace 16 has a hot wall structure,
is subjected to etching with gas decomposed in gas phase. However,
HCl takes a long time to be decomposed at low processing
temperature as in the present application, therefore it is
difficult to secure selectivity. On the other hand, Cl.sub.2
provides rapid progress of thermal decomposition even in low
temperature processing, therefore Cl.sub.2 provides higher etching
rate, and is capable of securing higher selectivity.
[0117] And, the relation of this etching power does not change even
in the case of dilution with H.sub.2, and because the case used
Cl.sub.2 as an etching gas provides stronger etching power than the
case used HCl as an etching gas, the case used Cl.sub.2 as an
etching gas is capable of providing better result in low
temperature processing like in the present application.
[0118] It should be noted that, because of occurrence of a reaction
that an intermediate of HCl is generated in vapor phase by heat,
uniformity of film-formation can be improved by using Cl.sub.2 as
etching gas, using H.sub.2 as carrier gas as above. Therefore,
because of a hot wall structure, where atmosphere in the reaction
tube is heated, effect of the present application invention is
attained.
[0119] It should be noted that explanation has been given on
formation of an EPI-Si film on a substrate in the above
embodiments, however, the present invention is capable of being
carried out also in a single crystal film, a polycrystal film, an
amorphous film or the like, or a doped single crystal film, a doped
polycrystal film, a doped amorphous film or the like.
[0120] Still more, as a substrate processing apparatus where the
present invention is carried out, there can be included a substrate
processing apparatus in general such as a lateral-type substrate
processing apparatus, and for example, also a sheet-type, hot
wall-type substrate processing apparatus.
(Additional Statement)
[0121] In addition, the present invention includes the following
embodiments.
(Additional Statement 1)
[0122] A manufacturing method of a semiconductor apparatus for
selectively forming a thin film on a silicon substrate by a reduced
pressure CVD method (Chemical Vapor Deposition), characterized in
that the thin film with high quality interface is grown by
intermittently supplying, in an alternately repeating state,
silane-type gas such as SiH.sub.4 and halogen-type gas such as
Cl.sub.2, together with hydrogen gas, into a reaction furnace, and
in addition, without making a silicon film or a silicon nucleus
grown on an insulating film such as silicon nitride film, so as to
secure selectivity.
(Additional Statement 2)
[0123] A manufacturing method of a semiconductor apparatus by
changing flow amount of one or more of silane-type gas such as
SiH.sub.4 and halogen-type gas such as Cl.sub.2, and hydrogen gas,
during the repeating cycle shown in the Additional Statement 1.
(Additional Statement 3)
[0124] A manufacturing method of a semiconductor apparatus by
changing pressure in the reaction furnace during the repeating
cycle shown in the Additional Statement 1 and the Additional
Statement 2.
(Additional Statement 4)
[0125] A manufacturing method of a semiconductor apparatus by
introducing doping gas such as PH.sub.3, B.sub.2H.sub.6 and
BCl.sub.3 during the repeating cycle shown in the Additional
Statement 1, the Additional Statement 2 and the Additional
Statement 3.
(Additional Statement 5)
[0126] A manufacturing method of a semiconductor apparatus, in any
of the Additional Statement 1, Additional Statement 2 and
Additional Statement 3, in introducing a silicon substrate and a
tool (boat) for silicon substrate processing from a front chamber
of a reaction furnace into the reaction furnace, where the drive
axis part thereof and a boat rotation facility part and a wiring
part are isolated from the front chamber of the reaction
furnace.
[0127] It should be further understood by those skilled in the art
that although the foregoing description has been made on
embodiments of the invention, the invention is not limited thereto
and various changes and modifications may be made without departing
from the sprit of the invention and the scope of the appended
claims.
* * * * *