U.S. patent application number 13/419429 was filed with the patent office on 2012-11-29 for fan module.
This patent application is currently assigned to COMPAL ELECTRONICS, INC.. Invention is credited to Hsuan-Cheng Wang.
Application Number | 20120301281 13/419429 |
Document ID | / |
Family ID | 47201305 |
Filed Date | 2012-11-29 |
United States Patent
Application |
20120301281 |
Kind Code |
A1 |
Wang; Hsuan-Cheng |
November 29, 2012 |
FAN MODULE
Abstract
A fan module suitable for an electronic apparatus is provided.
The fan module includes a bottom plate, a top cover. a sidewall, a
heat-dissipating fan and a housing. The sidewall is assembled
between the top cover and the bottom plate. The sidewall, the top
cover and the bottom plate together form an accommodating space.
The heat-dissipating fan is disposed on the bottom plate and
located in the accommodating space. The housing is stacked on the
top cover.
Inventors: |
Wang; Hsuan-Cheng; (Taipei
City, TW) |
Assignee: |
COMPAL ELECTRONICS, INC.
Taipei City
TW
|
Family ID: |
47201305 |
Appl. No.: |
13/419429 |
Filed: |
March 13, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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61489672 |
May 24, 2011 |
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Current U.S.
Class: |
415/182.1 |
Current CPC
Class: |
F04D 29/601 20130101;
G06F 1/203 20130101; F04D 29/4226 20130101 |
Class at
Publication: |
415/182.1 |
International
Class: |
F04D 1/00 20060101
F04D001/00; F04D 29/40 20060101 F04D029/40 |
Claims
1. A fan module, suitable for an electronic apparatus and
comprising: a bottom plate; a top cover; a sidewall, assembled
between the top cover and the bottom plate, wherein the sidewall,
the top cover and the bottom plate together form an accommodating
space; a heat-dissipating fan, disposed on the bottom plate and
located in the accommodating space; and a housing, stacked on the
top cover.
2. The fan module as claimed in claim 1, wherein the housing and
the sidewall are integrally formed.
3. The fan module as claimed in claim 1, wherein the housing covers
a first portion of the top cover and exposes a second portion of
the top cover, a structure part of the electronic apparatus
contacts the housing, the structure part and the second portion
have a gap therebetween to form an inlet and the inlet is
communicated with the accommodating space.
4. The fan module as claimed in claim 3, wherein the top cover has
an opening, the opening exposes the accommodating space and the
inlet is communicated with the accommodating space through the
opening.
5. The fan module as claimed in claim 1, wherein the housing and
the bottom plate have an interval therebetween to form an outlet
and the outlet is communicated with the accommodating space.
6. The fan module as claimed in claim 5, further comprising a
supporting pillar, wherein the supporting pillar is located at the
outlet and supported between the bottom plate and the housing.
7. The fan module as claimed in claim 6, wherein the housing has an
extension portion, the extension portion is connected to an edge of
the housing and the supporting pillar is supported between the
bottom plate and the extension portion.
8. The fan module as claimed in claim 6, wherein the housing and
the supporting pillar are integrally formed.
9. The fan module as claimed in claim 1, wherein the materials of
the top cover and the bottom plate are metal.
10. The fan module as claimed in claim 1, wherein the material of
the housing is plastic.
11. The fan module as claimed in claim 1, wherein the top cover and
the housing are integrally formed.
12. A fan module, suitable for an electronic apparatus and
comprising: a bottom plate; a top cover, the thickness of a first
portion of the top cover is greater than the thickness of a second
portion of the top cover; a sidewall, assembled between the top
cover and the bottom plate, wherein the sidewall, the top cover and
the bottom plate together form an accommodating space; and a
heat-dissipating fan, disposed on the bottom plate and located in
the accommodating space.
13. The fan module as claimed in claim 12, wherein the top cover
and the sidewall are integrally formed.
14. The fan module as claimed in claim 12, wherein a structure part
of the electronic apparatus contacts the first portion, the
structure part and the second portion have a gap therebetween to
form an inlet and the inlet is communicated with the accommodating
space.
15. The fan module as claimed in claim 14, wherein the top cover
has an opening, the opening exposes the accommodating space and the
inlet is communicated with the accommodating space through the
opening.
16. The fan module as claimed in claim 12, wherein the top cover
and the bottom plate have an interval therebetween to form an
outlet and the outlet is communicated with the accommodating
space.
17. The fan module as claimed in claim 16, further comprising a
supporting pillar, wherein the supporting pillar is located at the
outlet and supported between the bottom plate and the top
cover.
18. The fan module as claimed in claim 17, wherein the top cover
and the supporting pillar are integrally formed.
19. The fan module as claimed in claim 12, wherein the materials of
the top cover and the bottom plate are metal.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefits of U.S.
provisional application Ser. No. 61/489,672, filed on May 24, 2011.
The entirety of the above-mentioned patent applications is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention generally relates to a fan module, and more
particularly, to a fan module suitable for an electronic
apparatus.
[0004] 2. Description of Related Art
[0005] In order to meet the requirements of high speed, high
performance, light-weight, small-size and low-profile of current
electronic products, various portable electronic products have
become the main stream in the market. As far as a notebook computer
is concerned, because the notebook computer has only a limited
space for receiving a heat dissipating system, how to enhance the
heat dissipating efficiency in the limited space has become one of
the research focuses in the electronics industry.
[0006] In general, a notebook computer is normally equipped with a
fan module to dissipate heat on the heat-generating components
inside a notebook computer. To reduce the weight and the thickness
of the integrated structure, the top cover and the bottom plate for
the fan module to accommodate the heat-dissipating fan have thinner
thicknesses by design, and the distance between the
heat-dissipating fan and the top cover and the distances between
the top cover and other structure parts inside the notebook
computer are also smaller by design. Such design can be, in
particular, suitable for an ultra-thin type notebook computer where
light-thin-portable features are dominated design
consideration.
[0007] However, a thinner top cover has accordingly a lower
structure strength. When the distance between the heat-dissipating
fan and the top cover and the distances between the top cover and
other structure parts inside the notebook computer are smaller, the
top cover is easily deformed by the pressing of the above-mentioned
structure parts so that the normal operation of the fan module is
affected by the pressing of the top cover on the heat-dissipating
fan.
SUMMARY OF THE INVENTION
[0008] Accordingly, the invention is directed to a fan module with
better structure strength.
[0009] The invention provides a fan module suitable for an
electronic apparatus. The fan module includes a bottom plate, a top
cover. a sidewall, a heat-dissipating fan and a housing. The
sidewall is assembled between the top cover and the bottom plate,
in which the sidewall, the top cover and the bottom plate together
form an accommodating space. The heat-dissipating fan is disposed
on the bottom plate and located in the accommodating space. The
housing is stacked on the top cover.
[0010] In an embodiment of the present invention, the
above-mentioned housing and sidewall are integrally formed.
[0011] In an embodiment of the present invention, the
above-mentioned housing covers a first portion of the top cover and
exposes a second portion of the top cover, a structure part of the
electronic apparatus contacts the housing, the structure part and
the second portion have a gap therebetween to form an inlet and the
inlet is communicated with the accommodating space.
[0012] In an embodiment of the present invention, the
above-mentioned top cover has an opening, the opening exposes the
accommodating space and the inlet is communicated with the
accommodating space through the opening.
[0013] In an embodiment of the present invention, the
above-mentioned housing and bottom plate have an interval
therebetween to form an outlet and the outlet is communicated with
the accommodating space.
[0014] In an embodiment of the present invention, the
above-mentioned fan module further includes a supporting pillar, in
which the supporting pillar is located at the outlet and supported
between the bottom plate and the housing.
[0015] In an embodiment of the present invention, the
above-mentioned housing has an extension portion, the extension
portion is connected to an edge of the housing and the supporting
pillar is supported between the bottom plate and the extension
portion.
[0016] In an embodiment of the present invention, the
above-mentioned housing and supporting pillar are integrally
formed.
[0017] In an embodiment of the present invention, the materials of
the above-mentioned top cover and bottom plate are metal.
[0018] In an embodiment of the present invention, the material of
the above-mentioned housing is plastic.
[0019] In an embodiment of the present invention, the
above-mentioned top cover and housing are integrally formed.
[0020] The invention also provides a fan module suitable for an
electronic apparatus and the fan module includes a bottom plate, a
top cover, a sidewall and a heat-dissipating fan. The thickness of
a first portion of the top cover is greater than the thickness of a
second portion of the top cover. The sidewall is assembled between
the top cover and the bottom plate, in which the sidewall, the top
cover and the bottom plate together form an accommodating space.
The heat-dissipating fan is disposed on the bottom plate and
located in the accommodating space.
[0021] In an embodiment of the present invention, the
above-mentioned top cover and sidewall are integrally formed.
[0022] In an embodiment of the present invention, a structure part
of the above-mentioned electronic apparatus contacts the first
portion, the structure part and the second portion have a gap
therebetween to form an inlet and the inlet is communicated with
the accommodating space.
[0023] In an embodiment of the present invention, the
above-mentioned top cover has an opening, the opening exposes the
accommodating space and the inlet is communicated with the
accommodating space through the opening.
[0024] In an embodiment of the present invention, the
above-mentioned top cover and bottom plate have an interval
therebetween to form an outlet and the outlet is communicated with
the accommodating space.
[0025] In an embodiment of the present invention, the
above-mentioned fan module further includes a supporting pillar, in
which the supporting pillar is located at the outlet and supported
between the bottom plate and the top cover.
[0026] In an embodiment of the present invention, the
above-mentioned top cover and supporting pillar are integrally
formed.
[0027] In an embodiment of the present invention, the materials of
the above-mentioned top cover and bottom plate are metal.
[0028] Based on the description above, in the fan module of the
invention, the housing stacked on the top cover can improve the
whole structure strength, so that when the top cover is pressed,
the top cover is unlikely deformed. In this way, the
heat-dissipating fan is prevented from being pressed by the top
cover to maintain the normal operation of the fan module.
[0029] Other objectives, features and advantages of the present
invention will be further understood from the further technological
features disclosed by the embodiments of the present invention
wherein there are shown and described preferred embodiments of this
invention, simply by way of illustration of modes best suited to
carry out the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] FIG. 1 is a schematic three-dimensional diagram of a fan
module according to an embodiment of the invention.
[0031] FIG. 2 is an exploded diagram of the fan module of FIG.
1.
[0032] FIG. 3 is a partial side-view diagram for the fan module of
FIG. 1 used in an electronic apparatus.
[0033] FIG. 4 is a schematic three-dimensional diagram of a fan
module according to another embodiment of the invention.
[0034] FIG. 5 is an exploded diagram of the fan module of FIG.
4.
[0035] FIG. 6 is a partial side-view diagram for the fan module of
FIG. 4 used in an electronic apparatus.
DESCRIPTION OF THE EMBODIMENTS
[0036] FIG. 1 is a schematic three-dimensional diagram of a fan
module according to an embodiment of the invention and FIG. 2 is an
exploded diagram of the fan module of FIG. 1. Referring to FIG. 1,
a fan module 100 of the embodiment includes a bottom plate 110, a
top cover 120, a sidewall 130, a heat-dissipating fan 140 and a
housing 150. The sidewall 130 is assembled between the top cover
120 and the bottom plate 110, and the sidewall 130, the top cover
120 and the bottom plate 110 together form an accommodating space
160. The heat-dissipating fan 140 is disposed on the bottom plate
110 and located in the accommodating space 160. The housing 150 is
stacked on the top cover 120, and the top cover 120 is located
between the housing 150 and the bottom plate 110, in which the
housing 150 and the top cover 120 can be assembled together through
adhering, fastening or coating-injection. In other embodiments, the
housing 150 can be assembled at the top cover 120 through other
processes, which the invention is not limited to.
[0037] Under the above-mentioned layout, the housing 150 stacked on
the top cover 120 can improve the entire structure strength so that
the top cover 120 is unlikely to deform under pressing force. In
this way, the design can prevent the heat-dissipating fan 140 from
being pressed by the top cover 120 to maintain the normal operation
of the fan module 100.
[0038] The fan module 100 of the embodiment is used, for example,
in a notebook computer to dissipate heat on the heat-generating
components inside a notebook computer. In other embodiments, the
fan module 100 can be used in other kinds of electronic apparatus,
which the invention is not limited to.
[0039] FIG. 3 is a partial side-view diagram for the fan module of
FIG. 1 used in an electronic apparatus. For description simplicity,
in FIG. 3, only a structure part 50 of the electronic apparatus is
shown. The structure part 50 is, for example, a casing or a
component adjacent to the fan module 100 inside an electronic
apparatus, which the invention is not limited to. Referring to
FIGS. 1-3, in the embodiment, the housing 150 covers a first
portion 122 of the top cover 120 and exposes a second portion 124
of the top cover 120, and the top cover 120 has an opening 126 to
expose the accommodating space 160. The structure part 50 contacts
the housing 150, the structure part 50 and the second portion 124
have a gap therebetween to form an inlet 170, and the inlet 170 is
communicated with the accommodating space 160 through the opening
126. In addition, as shown by FIG. 1, the housing 150 and the
bottom plate 110 have an interval therebetween to form an outlet
180 and the outlet 180 is communicated with the accommodating space
160. In this way, when the fan module 100 is running, the cooling
air-current can enter the fan module 100 through the inlet 170 and
can be expelled from the fan module 100 through the outlet 180 to
make the cooling easier.
[0040] In a slim electronic apparatus, the fan module 100 and the
structure part 50 are disposed very closely. By stacking the
housing 150 on the top cover 120, the structure strength of the fan
module 100 is enhanced, which limits the possibility of the top
cover 120 and the heat-dissipating fan 140 being pressed by the
structure part 50 due to the slimming design of the electronic
apparatus. In addition, the above-mentioned design that the housing
150 only covers the first portion 122 of the top cover 120 and
exposes the second portion 124 of the top cover 120 and that the
top cover 120 and the structure part 50 together form the inlet 170
therebetween can prevent the structure part 50 adjacent to the fan
module 100 from blocking the flowing of the cooling
air-current.
[0041] In the embodiment, the fan module 100 further includes a
supporting pillar 190. The supporting pillar 190 is located at the
outlet 180 and supported between the bottom plate 110 and the
housing 150 to further enhance the structure strength of the fan
module 100. In more details, the housing 150 of the embodiment has
an extension portion 152, the extension portion 152 is connected at
an edge of the housing 150 and the supporting pillar 190 is
supported between the bottom plate 110 and the extension portion
152.
[0042] In the embodiment, the materials of the bottom plate 110 and
the top cover 120 are a metallic material with light weight and
better structure strength, for example, aluminium or magnesium. The
materials of the housing 150, the supporting pillar 190 and the
sidewall 130 are, for example, plastic, which enables the housing
150, the supporting pillar 190 and the sidewall 130 to be
simultaneously fabricated by injection moulding. In other
embodiments, the housing 150, the supporting pillar 190 and the
sidewall 130 can be made of other appropriate materials, which the
invention is not limited to.
[0043] In other embodiments, the top cover 120 can be integrally
formed with the housing 150. When the top cover 120 and the housing
150 are integrally formed, the housing 150 can be treated as a
portion of the top cover 120, so that the portion of top cover 120
has a larger thickness, which would be explained in following
through some figures.
[0044] FIG. 4 is a schematic three-dimensional diagram of a fan
module according to another embodiment of the invention and FIG. 5
is an exploded diagram of the fan module of FIG. 4. Referring to
FIG. 4, a fan module 200 of the embodiment includes a bottom plate
210, a top cover 220, a sidewall 230 and a heat-dissipating fan
240. The thickness of a first portion 222 of the top cover 220 is
greater than the thickness of a second portion 224 of the top cover
220. The sidewall 230 is assembled between the top cover 220 and
the bottom plate 210, and the sidewall 230, the top cover 220 and
the bottom plate 210 together form an accommodating space 260.
[0045] Under the above-mentioned layout, the first portion 222 of
the top cover 220 is able to improve the entire structure strength
so that the top cover 220 is unlikely to deform by pressing force,
which can accordingly prevent the heat-dissipating fan 240 from
being pressed by the top cover 220 to maintain the normal operation
of the fan module 200.
[0046] FIG. 6 is a partial side-view diagram for the fan module of
FIG. 4 used in an electronic apparatus. For description simplicity,
in FIG. 6, only a structure part 50 of the electronic apparatus is
shown. The structure part 50 is, for example, a casing or a
component adjacent, to the fan module 200 inside an electronic
apparatus, which the invention is not limited to. Referring to
FIGS. 4-6, in the embodiment, the structure part 50 contacts the
first portion 222, the structure part 50 and the second portion 224
have a gap therebetween to form an inlet 270, and the inlet 270 is
communicated with the accommodating space 260. In addition, the top
cover 220 has an opening 226, in which the opening 226 exposes the
accommodating space 260 and the inlet 270 is communicated with the
accommodating space 260 through the opening 226. As shown by FIG.
4, the top cover 220 and the bottom plate 210 have an interval
therebetween to form an outlet 280 and the outlet 280 is
communicated with the accommodating space 260. In this way, when
the fan module 200 is running, the cooling air-current can enter
the fan module 200 through the inlet 270 and can be expelled from
the fan module 200 through the outlet 280 to make the cooling
easier.
[0047] In a slim electronic apparatus, the positions where the fan
module 200 and the structure part 50 are disposed are very close.
By increasing the thickness of the top cover 220, the structure
strength of the fan module 200 is advanced, and so that the top
cover 220 and the heat-dissipating fan 240 will not be pressed by
the structure part 50 due to the slimming design of the electronic
apparatus. In addition, the above-mentioned design that the
thickness of the first portion 222 of the top cover 220 is greater
than the thickness of the second portion 224 and there is an inlet
270 between the top cover 220 and the structure part 50 can prevent
the structure part 50 adjacent to the fan module 200 from blocking
the flowing of the cooling air-current.
[0048] In the embodiment, the fan module 200 further includes a
supporting pillar 290. The supporting pillar 290 is located at the
outlet 280 and supported between the bottom plate 210 and the top
cover 220 to further advance the structure strength of the fan
module 200.
[0049] In the embodiment, the materials of the bottom plate 210 and
the top cover 220 are a metallic material with light weight and
better structure strength, for example, aluminium or magnesium. In
other embodiments, the bottom plate 210 and the top cover 220 can
be made of other appropriate materials, which the invention is not
limited to. In addition, the supporting pillar 290 and the top
cover 220 can be integrally formed.
[0050] In summary, in the fan module of the invention, the housing
stacked on the top cover can improve the whole structure strength,
so that when the top cover is pressed, the top cover is unlikely to
deform. In this way, the heat-dissipating fan is prevented from
being pressed by the top cover to maintain the normal operation of
the fan module. In addition, the invention disposes a supporting
pillar at the outlet and supported between the bottom plate and the
housing to further advance the structure strength of the fan
module.
[0051] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *