U.S. patent application number 13/296122 was filed with the patent office on 2012-11-29 for optical semiconductor-based tube type lighting apparatus.
This patent application is currently assigned to POSCO LED COMPANY LTD.. Invention is credited to Jae Young Choi, Kyoung Onn Kim, Kyung Rye Kim.
Application Number | 20120300446 13/296122 |
Document ID | / |
Family ID | 46678900 |
Filed Date | 2012-11-29 |
United States Patent
Application |
20120300446 |
Kind Code |
A1 |
Kim; Kyung Rye ; et
al. |
November 29, 2012 |
Optical Semiconductor-Based Tube Type Lighting Apparatus
Abstract
Embodiments of the invention provide optical semiconductor-based
tube type lighting apparatuses. The optical semiconductor-based
tube type lighting apparatus includes an elongated
light-transmitting tube, and a plurality of optical semiconductor
modules arranged along a circumference of the light-transmitting
tube and separated from each other in a cross-sectional view of the
light-transmitting tube. Here, each of the optical semiconductor
modules is placed so as not to face another optical semiconductor
module at an opposite side thereof.
Inventors: |
Kim; Kyung Rye;
(Seongnam-si, KR) ; Choi; Jae Young; (Seongnam-si,
KR) ; Kim; Kyoung Onn; (Seongnam-si, KR) |
Assignee: |
POSCO LED COMPANY LTD.
Seongnam-si
KR
|
Family ID: |
46678900 |
Appl. No.: |
13/296122 |
Filed: |
November 14, 2011 |
Current U.S.
Class: |
362/218 ;
29/592.1; 362/217.14 |
Current CPC
Class: |
Y10T 29/49002 20150115;
F21K 9/90 20130101; F21V 3/00 20130101; F21V 21/005 20130101; F21Y
2107/10 20160801; F21Y 2115/10 20160801; F21V 19/0045 20130101;
F21V 29/70 20150115; F21K 9/27 20160801 |
Class at
Publication: |
362/218 ;
362/217.14; 29/592.1 |
International
Class: |
F21V 29/00 20060101
F21V029/00; H05K 13/00 20060101 H05K013/00; F21V 21/00 20060101
F21V021/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 23, 2011 |
KR |
10-2011-0048652 |
Aug 8, 2011 |
KR |
10-2011-0078701 |
Claims
1. An optical semiconductor-based lighting apparatus comprising: an
elongated light-transmitting tube; and a plurality of optical
semiconductor modules arranged along a circumference of the
light-transmitting tube and separated from each other in a
cross-sectional view of the light-transmitting tube, each of the
optical semiconductor modules being placed so as not to face
another optical semiconductor module at an opposite side
thereof.
2. The optical semiconductor-based lighting apparatus of claim 1,
wherein the plurality of optical semiconductor modules comprises a
first optical semiconductor module placed at an upper portion of
the light-transmitting tube and emitting light downwards beneath
the light-transmitting tube, and second and third optical
semiconductor modules placed at lower opposite sides of the
light-transmitting tube so as not to face the first optical
semiconductor module and emitting light upwards, in the
cross-sectional view of the light-transmitting tube.
3. The optical semiconductor-based lighting apparatus of claim 1,
wherein the plural optical semiconductor modules are arranged at
equal intervals.
4. The optical semiconductor-based lighting apparatus of claim 2,
wherein the first, second and third optical semiconductor modules
are placed at three vertices of an isosceles or equilateral
triangle, respectively.
5. The optical semiconductor-based lighting apparatus of claim 1,
wherein each of the optical semiconductor modules comprises an
array of semiconductor optical devices arranged in a longitudinal
direction of the light-transmitting tube.
6. The optical semiconductor-based lighting apparatus of claim 1,
wherein the light-transmitting tube comprises at least three slit
pieces separated from one another, and each of the optical
semiconductor modules is assembled to a mounting gap between
adjacent slit pieces.
7. The optical semiconductor-based lighting apparatus of claim 6,
wherein each of the optical semiconductor modules comprises a base
exposed through the mounting gap, a printed circuit board (PCB)
coupled to the base and placed within the light-transmitting tube,
and an array of semiconductor optical devices mounted on the
PCB.
8. The optical semiconductor-based lighting apparatus of claim 1,
wherein the light-transmitting tube comprises a light spreading
material on a surface thereof or therein.
9. The optical semiconductor-based lighting apparatus of claim 1,
wherein the light-transmitting tube comprises a wavelength
converting material on a surface thereof or therein.
10. The optical semiconductor-based lighting apparatus of claim 2,
wherein the first optical semiconductor module has a light output,
which is higher than those of the second and third optical
semiconductor modules, and the light output of the second optical
semiconductor is the same as the light output of the third
semiconductor.
11. The optical semiconductor-based lighting apparatus of claim 2,
wherein the second and third optical semiconductor modules have
different color temperatures from the color temperature of the
first optical semiconductor module.
12. The optical semiconductor-based lighting apparatus of claim 2,
wherein when the lighting apparatus is mounted on a ceiling, the
first optical semiconductor module is placed on a region of the
light-transmitting tube nearer to the ceiling than any other region
thereof.
13. The optical semiconductor-based lighting apparatus of claim 2,
wherein the light-transmitting tube has a hollow circular
cross-section, and the plurality of optical semiconductor modules
are three optical semiconductor modules arranged at equal intervals
of 120 degrees.
14. The optical semiconductor-based lighting apparatus of claim 8,
wherein the light-transmitting tube comprises three slit pieces
having an arcuate cross-section and separated from each other, and
each of the three optical semiconductor modules is assembled to a
mounting gap between adjacent slit pieces.
15. The optical semiconductor-based lighting apparatus of claim 1,
further comprising: a pair of connectors disposed at opposite ends
of the light-transmitting tube, at least one of the pair of the
connectors being a dummy connector which does not act as an
electrical connector.
16. The optical semiconductor-based lighting apparatus of claim 7,
wherein the base is formed at opposite sides thereof with
connection grooves corresponding to edges of each of the slit
pieces such that the edges of each of the slit pieces are
respectively fitted into the connection grooves.
17. The optical semiconductor-based lighting apparatus of claim 1,
wherein the plurality of optical semiconductor modules is mounted
at an equal mounting angle on the light-transmitting tube.
18. The optical semiconductor-based lighting apparatus of claim 17,
wherein the mounting angle is 90 degrees.
19. An optical semiconductor-based tube type lighting apparatus
comprising: an elongated light-transmitting tube; a linear slit
formed on the light-transmitting tube in a longitudinal direction
thereof; and at least one bar-shaped optical semiconductor module
secured to the light-transmitting tube, with edges of the slit
fitted into side surfaces of the bar-shaped optical semiconductor
module, the optical semiconductor module comprising a heat sink, a
PCB attached to the heat sink, and an array of semiconductor
optical devices arranged on the PCB, the heat sink being partially
exposed from the light-transmitting tube through the slit.
20. The optical semiconductor-based lighting apparatus of claim 19,
wherein the light-transmitting tube comprises a pair of hooks
formed on an inner periphery thereof in the longitudinal direction
of the light transmitting tube to face each other, the slit is
formed at a middle between the pair of hooks in the longitudinal
direction of the light transmitting tube, and right and left
protrusions of the optical semiconductor module are respectively
inserted into the pair of hooks in a sliding manner when the slit
is widened by external force.
21. The optical semiconductor-based lighting apparatus of claim 20,
wherein when the slit is widened by external force, a heat
dissipation protrusion at a rear side of the heat sink is inserted
into the slit in a sliding manner and exposed from the
light-transmitting tube.
22. The optical semiconductor-based lighting apparatus of claim 20,
wherein the heat sink is provided with right and left guide wings,
and the right and left guide wings and right and left edges of the
PCB are inserted into the corresponding hooks to form the right and
left protrusions of the optical semiconductor module,
respectively.
23. The optical semiconductor-based lighting apparatus of claim 19,
wherein the PCB is a metal-based MCPCB or MPCB.
24. The optical semiconductor-based lighting apparatus of claim 19,
wherein each of the optical semiconductor modules is disposed so as
not to face another optical semiconductor module at an opposite
side thereof in the light-transmitting tube.
25. The optical semiconductor-based lighting apparatus of claim 19,
wherein the light-transmitting tube has an undulating light
spreading pattern formed on the inner periphery thereof.
26. A method of manufacturing a semiconductor-based tube type
lighting apparatus, comprising: preparing an elongated
light-transmitting tube; forming a linear slit on the
light-transmitting tube in a longitudinal direction of the
light-transmitting tube; and assembling at least one optical
semiconductor module to the light-transmitting tube by widening the
slit and inserting the at least one optical semiconductor module
into the widened slit in a sliding manner.
27. The method of claim 26, wherein the light-transmitting tube
comprises a pair of hooks formed on an inner periphery of the
light-transmitting tube to face each other in a longitudinal
direction.
28. The method of claim 27, wherein the assembling at least one
optical semiconductor module comprises inserting right and left
protrusions formed at opposite sides of the optical semiconductor
module into the respective hooks in a sliding manner, and inserting
a rear protrusion of the optical semiconductor module into the
widened slit in a sliding manner to be exposed from the
light-transmitting tube.
29. The method of claim 26, wherein the forming a linear slit
comprises forming the slit over the entire length of the
light-transmitting tube, and the assembling at least one optical
semiconductor module comprises widening the slit over the entire
length of the light-transmitting tube and inserting the optical
semiconductor module into the slit.
30. The method of claim 26, wherein the forming a linear slit
comprises forming the slit on the light emitting tube except for a
portion near one end of the light-transmitting tube, and the
assembling at least one optical semiconductor module comprises
widening the slit only in a partial length region of the
light-transmitting tube and inserting the optical semiconductor
module into the widened slit.
31. The method of claim 30, further comprising: removing the
portion of the light-transmitting tube where the slit is not
formed, after assembling the at least one optical semiconductor
module.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority from and the benefit of
Korean Patent Application No. 2011-0048652 filed on May 23, 2011;
and Korean Patent Application No. 2011-0078701 filed on Aug. 8,
2011, which are incorporated by reference herein in their
entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to optical semiconductor-based tube
type lighting apparatuses.
[0004] 2. Discussion of the Background
[0005] Generally, fluorescent lamps and incandescent lamps are used
as a light source for lighting. Incandescent lamps have low
economic feasibility due to high power consumption and thus demand
for incandescent lamps continues to decrease. Further, it is
predicted that this trend will continue into the future. On the
contrary, fluorescent lamps have higher economic feasibility due to
low power consumption, which is about 1/3 that of incandescent
lamps. However, fluorescent lamps require application of high
voltage, causing a blackening phenomenon and shortening the
lifespan thereof. Further, mercury injected together with argon gas
into a vacuum glass tube of a fluorescent lamp is toxic and
environmentally unfriendly.
[0006] Recently, demand for light-emitting diode (LED) lighting
apparatuses employing an LED as a light source has rapidly
increased. The LED lighting apparatus has long lifespan and
requires low power for operation. Further, the LED lighting
apparatus does not use a toxic substance such as mercury, thereby
guaranteeing environmental friendliness.
[0007] Various kinds of LED lighting apparatuses having various
structures have been developed. For example, a fluorescent lamp
type or tube type LED lighting apparatus has a similar
configuration as that of a fluorescent lamp.
[0008] FIG. 1 is a cross-sectional view of a conventional tube type
LED lighting apparatus. Referring to FIG. 1, the conventional tube
type LED lighting apparatus includes an elongated
light-transmitting cover 2 having a substantially semi-circular
cross-section and open at an upper side thereof, and an elongated
LED module 4 coupled to the open upper side of the
light-transmitting cover. The LED module 4 includes an elongated
heat sink 4a having a substantially semi-circular cross-section, a
long printed circuit board (PCB) 4b attached to a flat surface of
the heat sink 4a, and LEDs 4c arranged on the PCB 4b in a
longitudinal direction. The LEDs 4c inside the LED module 4 emit
light to the front of the lighting apparatus, that is, in a
downward direction.
[0009] The conventional LED lighting apparatus emits light through
an arcuate area in a predetermined angle range (in the range of
about 120 to 150 degrees) at a lower portion of the
light-transmitting plastic cover 2. Further, since the back of the
conventional tube type LED lighting apparatus is completely blocked
by the heat sink 4a, light is not distributed to rear and lateral
sides of the light-transmitting cover 2.
[0010] Such a conventional tube type LED lighting apparatus has
very unsatisfactory light distribution characteristics as compared
with existing fluorescent lamps. Accordingly, when the conventional
tube type LED lighting apparatus is used in homes or offices
instead of the existing fluorescent lamps, dark areas are generated
at the rear and lateral sides of the lighting apparatus. Such dark
areas cause user dissatisfaction as light coverage is uneven.
[0011] Such a conventional tube type LED lighting apparatus is
configured to allow light to be diffusively emitted only through
the semi-circular light-transmitting cover 2 and thus has lower
light distribution characteristics than existing fluorescent lamps,
which employ a light-transmitting tube. In addition, in the
conventional tube type LED lighting apparatus, the LED 4c or the
LED module including the LED 4c is located at the center of a
tube-shaped cross-section defined by an outer periphery of the
light-transmitting cover 2 and an outer periphery of the heat sink,
thereby causing a short distance between a light emitting plane of
the LED 4c and the light-transmitting cover 2 on a predetermined
cross-sectional area of the tube type LED lighting apparatus. Since
an area of the light-transmitting cover 2 through which light from
the LED 4c passes decreases with decreasing distance between the
light emitting plane of the LED 4c and the light-transmitting cover
2, the conventional tube type LED lighting apparatus has
unsatisfactory light distribution characteristics towards the
lateral and rear sides thereof.
SUMMARY OF THE INVENTION
[0012] An example embodiment of the invention provides a tube type
optical semiconductor-based lighting apparatus which includes a
bar-shaped optical semiconductor module directly mounted on a wall
of a light-transmitting tube to increase a distance between a
semiconductor optical device and the light-transmitting tube in
order to improve light distribution.
[0013] Other example embodiments of the invention provide an
optical semiconductor-based lighting apparatus and a method of
manufacturing the same, which has improved assembling properties
when directly mounting a bar-shaped optical semiconductor module to
a wall of a light-transmitting tube such that the optical
semiconductor module is partially exposed from the
light-transmitting tube.
[0014] An example embodiment of the invention provides an optical
semiconductor-based tube type lighting apparatus, which includes an
elongated light-transmitting tube; and a plurality of optical
semiconductor modules arranged along a circumference of the
light-transmitting tube and separated from each other in a
cross-sectional view of the light-transmitting tube. Each of the
optical semiconductor modules may be placed so as not to face
another optical semiconductor module at an opposite side
thereof.
[0015] The plurality of optical semiconductor modules may include a
first optical semiconductor module placed at an upper portion of
the light-transmitting tube and emitting light downwards beneath
the light-transmitting tube, and second and third optical
semiconductor modules placed at lower opposite sides of the
light-transmitting tube so as not to face the first optical
semiconductor module and emitting light upwards, in the
cross-sectional view of the light-transmitting tube.
[0016] In one embodiment, the plural optical semiconductor modules
may be arranged at equal intervals.
[0017] The first, second and third optical semiconductor modules
may be placed at three vertices of a single isosceles or
equilateral triangle, respectively.
[0018] Each of the optical semiconductor modules may include an
array of semiconductor optical devices arranged in a longitudinal
direction of the light-transmitting tube.
[0019] The light-transmitting tube may include at least three slit
pieces separated from one another, and each of the optical
semiconductor modules may be assembled to a mounting gap between
adjacent slit pieces.
[0020] Each of the optical semiconductor modules may include a base
exposed through the mounting gap, a printed circuit board (PCB)
coupled to the base and placed within the light-transmitting tube,
and an array of semiconductor optical devices mounted on the
PCB.
[0021] The light-transmitting tube may include a light spreading
material on a surface thereof or therein.
[0022] The light-transmitting tube may include a wavelength
converting material on a surface thereof or therein.
[0023] The first optical semiconductor module may have a light
output, which is higher than those of the second and third optical
semiconductor modules. The light output of the second optical
semiconductor may be the same as the light output of the third
semiconductor.
[0024] The second and third optical semiconductor modules may have
different color temperatures from the color temperature of the
first optical semiconductor module.
[0025] When the optical semiconductor-based tube type lighting
apparatus is mounted on a ceiling, the first optical semiconductor
module may be placed on a region of the light-transmitting tube
nearer to the ceiling than any other region thereof.
[0026] The light-transmitting tube may have a hollow circular
cross-section, and the plurality of optical semiconductor modules
may be three optical semiconductor modules arranged at equal
intervals of 120 degrees.
[0027] The light-transmitting tube may include three slit pieces
having an arcuate cross-section and separated from each other, and
each of the three optical semiconductor modules may be assembled to
a mounting gap between adjacent slit pieces.
[0028] The optical semiconductor-based tube type lighting apparatus
may further include a pair of connectors disposed at opposite ends
of the light-transmitting tube, wherein at least one of the pair of
connectors is a dummy connector which does not act as an electrical
connector.
[0029] The base may be formed at opposite sides thereof with
connection grooves corresponding to edges of each of the slit
pieces such that the edges of each of the slit pieces are
respectively fitted into the connection grooves.
[0030] The plurality of optical semiconductor modules may be
mounted at an equal mounting angle on the light-transmitting tube.
Here, the mounting angle may be 90 degrees.
[0031] An example embodiment of the invention provides an optical
semiconductor-based tube type lighting apparatus. The optical
semiconductor-based tube type lighting apparatus includes: an
elongated light-transmitting tube; a linear slit formed on the
light-transmitting tube in a longitudinal direction thereof; and at
least one bar-shaped optical semiconductor module secured to the
light-transmitting tube, with edges of the slit fitted into side
surfaces of the bar-shaped optical semiconductor module. Here, the
optical semiconductor module includes a heat sink, a PCB attached
to the heat sink, and an array of semiconductor optical devices
arranged on the PCB. The heat sink is partially exposed from the
light-transmitting tube through the slit.
[0032] The light-transmitting tube may include a pair of hooks
formed on an inner periphery thereof in the longitudinal direction
of the light transmitting tube to face each other, the slit may be
formed in a middle between the pair of hooks in the longitudinal
direction of the light transmitting tube, and right and left
protrusions of the optical semiconductor module may be respectively
inserted into the pair of hooks in a sliding manner when the slit
is widened by external force.
[0033] When the slit is widened by external force, a heat
dissipation protrusion at a rear side of the heat sink may be
inserted into the slit in a sliding manner and exposed from the
light-transmitting tube.
[0034] The heat sink may be provided with right and left guide
wings, and the right and left guide wings and right and left edges
of the PCB may be inserted into the corresponding hooks to form the
right and left protrusions of the optical semiconductor module,
respectively.
[0035] The PCB may be a metal-based MCPCB or MPCB.
[0036] In the light-transmitting tube, each of the optical
semiconductor modules may be disposed so as not to face another
optical semiconductor module at an opposite side thereof.
[0037] A further example embodiment of the invention provides a
method of manufacturing a semiconductor-based tube type lighting
apparatus, which includes: preparing an elongated
light-transmitting tube; forming a linear slit on the
light-transmitting tube in a longitudinal direction of the
light-transmitting tube; and assembling at least one optical
semiconductor module to the light-transmitting tube by widening the
slit and inserting the at least one optical semiconductor module
into the widened slit in a sliding manner.
[0038] The light-transmitting tube may include a pair of hooks
formed on an inner periphery of the light-transmitting tube to face
each other in a longitudinal direction.
[0039] The assembling at least one optical semiconductor module may
include inserting right and left protrusions formed at opposite
sides of the optical semiconductor module into the respective hooks
in a sliding manner, and inserting a protrusion formed at a rear
side of the optical semiconductor module into the widened slit in a
sliding manner to be exposed from the light-transmitting tube.
[0040] The forming a linear slit may include forming the slit over
the entire length of the light-transmitting tube, and the
assembling at least one optical semiconductor module may include
widening the slit over the entire length of the light-transmitting
tube and inserting the optical semiconductor module into the
slit.
[0041] The forming of a linear slit may include forming the slit on
the light emitting tube except for a portion near one end of the
light-transmitting tube, and the assembling at least one optical
semiconductor module may include widening the slit only in a
partial length region of the light-transmitting tube and inserting
the optical semiconductor module into the widened slit. Here, the
method may further include removing the portion of the
light-transmitting tube where the slit is not formed, after
assembling the at least one optical semiconductor module.
[0042] Herein, the term "semiconductor optical device" refers to a
device including or using an optical semiconductor such as a light
emitting diode chip. Advantageously, the semiconductor optical
device is an LED package including a light emitting diode chip
therein.
[0043] It is to be understood that both the foregoing general
description and the following detailed description are illustrative
and explanatory and are intended to provide further explanation of
the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0044] The accompanying drawings, which are included to provide a
further understanding of the invention and are incorporated in and
constitute a part of this specification, illustrate embodiments of
the invention, and together with the description serve to explain
the principles of the invention.
[0045] FIG. 1 is a cross-sectional view of an LED lighting
apparatus, which is a conventional semiconductor-based lighting
apparatus.
[0046] FIG. 2 is a perspective view of an optical
semiconductor-based tube type lighting apparatus in accordance with
one exemplary embodiment of the invention.
[0047] FIG. 3 is a cross-sectional view taken along line I-I of
FIG. 2.
[0048] FIG. 4 and FIG. 5 are cross-sectional views of optical
semiconductor-based tube type lighting apparatuses in accordance
with example embodiments of the invention.
[0049] FIG. 6 to FIG. 14 are diagrams of optical
semiconductor-based tube type lighting apparatuses in accordance
with other example embodiments of the invention.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0050] The invention is described more fully hereinafter with
reference to the accompanying drawings, in which exemplary
embodiments of the invention are shown. This invention may,
however, be embodied in many different forms and should not be
construed as limited to the embodiments set forth herein. Rather,
these exemplary embodiments are provided so that this disclosure is
thorough, and will fully convey the scope of the invention to those
skilled in the art. In the drawings, the sizes and relative sizes
of layers and regions may be exaggerated for clarity. Like elements
will be denoted by like reference numerals and repeated
descriptions thereof will be omitted herein.
[0051] FIG. 2 is a perspective view of an optical
semiconductor-based tube type lighting apparatus in accordance with
one exemplary embodiment of the invention, and FIG. 3 is a
cross-sectional view taken along line I-I of FIG. 2. Referring to
FIG. 2 and FIG. 3, the optical semiconductor-based tube type
lighting apparatus 1 according to the example embodiment of the
invention is similar to a fluorescent lamp. The optical
semiconductor-based tube type lighting apparatus 1 includes an
elongated hollow light-transmitting tube 20 having a circular
cross-section, and three optical semiconductor modules 40a, 40b,
40c arranged along a circumference of the light-transmitting tube
20.
[0052] In this embodiment, the light-transmitting tube 20 includes
three elongated slit pieces 20a, 20b, 20c. Each of the slit pieces
20a, 20b, 20c is made of a light-transmitting plastic material
exhibiting good impact resistance. Further, all of the slit pieces
20a, 20b, 20c have the same arcuate cross-section. When the three
slit pieces 20a, 20b, 20c are arranged to form a circular
cross-section, three elongated mounting gaps are formed between the
slit pieces 20a, 20b, 20c.
[0053] The three bar-shaped optical semiconductor modules 40a, 40b,
40c are mounted to the three mounting gaps, respectively. As a
result, the three optical semiconductor module 40a, 40b, 40c are
placed at equal intervals of about 120 degrees along the circular
circumference of the light-transmitting tube 20. Accordingly, the
three optical semiconductor modules 40a, 40b, 40c are placed at
three vertices of an imaginary equilateral triangle.
[0054] The light-transmitting tube 20 is provided at opposite sides
thereof with two connectors 60a, 60b. Both of the connectors 60a,
60b may serve as electrical connectors for supplying power to the
optical semiconductor modules 40a, 40b, 40c. Alternatively, only
one of the connectors 60a, 60b, for example, a connector 60a, may
serve as an electrical connector for supplying power to the optical
semiconductor modules 40a, 40b, 40c. In this case, the other
connector 60b may serve only as a mechanical connector for
connecting one end of the light-transmitting tube 20 to one end of
the connector. Furthermore, both of the connectors 60a, 60b may
serve as mechanical connectors instead of electrical connectors. In
this case, a separate electrical connector, which does not provide
a function of a mechanical connector, may be provided to the
light-transmitting tube 20 through an opening of the
light-transmitting tube 20 together with a cable.
[0055] Herein, the connector which does not provide a function of
an electrical connector and serves only as a mechanical connector
will be defined as a "dummy connector".
[0056] The three optical semiconductor modules 40a, 40b, 40c may be
mounted at an equal mounting angle on the light-transmitting tube
20. The mounting angle is defined as an angle between a tangential
line L on the light-transmitting tube 20 at a mounting position of
the corresponding optical semiconductor module and a central axis
line C of light emitted from the corresponding optical
semiconductor module. In this embodiment, the mounting angle is 90
degrees. In this embodiment, since the light-transmitting tube 20
has an arcuate or curved surface at the mounting position of the
optical semiconductor module 40a, 40b or 40c, the angle between the
tangential line L and the central axis line C is defined as the
mounting angle. However, in the case where the light-transmitting
tube has a linear surface at the mounting position of the optical
semiconductor module, an angle between the linear surface and the
central axis line of light emitted from the optical semiconductor
module may be defined as the mounting angle. When the mounting
angles of the optical semiconductor modules differ, design
conditions are complicated, thereby making difficult to obtain a
desired lighting apparatus with desired light distribution
characteristics. Further, when the mounting angles differ, there is
a possibility of light distribution being biased towards one side
in a bisymmetrical light-transmitting tube 20. Therefore, the
optical semiconductor modules 40a, 40b, 40c may be secured at an
equal mounting angle to the light-transmitting tube 20 under
different conditions in order to achieve desired light
distribution.
[0057] As shown in FIG. 3, each of the optical semiconductor
modules 40a, 40b or 40c includes an elongated bar-shaped metal base
42a, 42b or 42c including a heat sink or acting as a heat sink, a
PCB 44a, 44b or 44c mounted on the base 42a, 42b or 42c, and at
least one array of semiconductor optical devices 46a, 46b or 46c
mounted on the PCB 44a, 44b or 44c. On the PCB 44a, 44b or 44c, the
semiconductor optical devices are arranged in at least one row to
constitute the at least one array of semiconductor optical devices.
The semiconductor optical devices 46a, 46b or 46c may be LED
packages including a light emitting diode chip received therein,
and may further include a wavelength converting material, which
converts light emitted from the light emitting diode chip. However,
the semiconductor optical device may be another optical
semiconductor chip or device including or using the optical
semiconductor chip, instead of the light emitting diode chip. Each
of the metal bases 42a, 42b or 42c is partially exposed from the
light-transmitting tube 20 through the mounting gap described
above.
[0058] Each of the bases 42a, 42b or 42c of the optical
semiconductor module 40a, 40b or 40c may be used to connect two
adjacent slit pieces (20a and 20b; 20 and 20c; or 20c and 20a) to
each other. In this embodiment, each of the bases 42a, 42b or 42c
is formed at opposite sides thereof with connection grooves 422
each corresponding to a slit edge of the slit piece 20a, 20b or
20c, and the edges of the slit piece 20a, 20b or 20c, that is,
opposite edges of the corresponding slit (or, cut surfaces), are
fitted into side surfaces of the optical semiconductor module 40a,
40b or 40c, particularly, into the connection grooves 422, so that
the slit pieces 20a, 20b, 20c are assembled to the optical
semiconductor modules 40a, 40b, 40c.
[0059] Among the three optical semiconductor modules 40a, 40b, 40c,
a first optical semiconductor module 40a is placed at an upper
portion of the circumference of the light-transmitting tube 20 and
emits light downwards. Assuming that the optical
semiconductor-based tube type lighting apparatus 1 according to
this embodiment is horizontally mounted on the ceiling, the
semiconductor optical devices 46a of the first optical
semiconductor module 40a are placed near the uppermost end of the
circumference of the light-transmitting tube 20 and act as light
sources for illuminating an indoor space beneath the lighting
apparatus. Herein, the uppermost end of the circumference refers to
a portion nearest to the ceiling.
[0060] Since the optical semiconductor modules 40a, 40b, 40c are
arranged at equal intervals of 120 degrees, the first optical
semiconductor module 40a does not face any other optical
semiconductor module at an opposite side thereof. Although the
semiconductor optical devices 46a of the first optical
semiconductor module 40a emit light at an orientation angle in the
range of about 120 to 150 degrees, a region directly beneath the
first optical semiconductor module 40a has a higher light
distribution amount than other regions, and thus there is
substantially no light loss due to interference with light from the
other optical semiconductor modules 40b, 40c.
[0061] Among the three optical semiconductor modules 40a, 40b, 40c,
second and third optical semiconductor modules 40b, 40c are placed
at opposite sides of a lower portion of the circumference of the
light-transmitting tube 20 and emit light towards upper sides
opposite thereto. Light emitted from the optical semiconductor
devices 46b, 46c of the second and third optical semiconductor
modules 40b, 40c covers regions that are not covered by light
emitted from the first optical semiconductor module 40a, that is,
rear and lateral regions of the lighting apparatus.
[0062] As the optical semiconductor modules 40a, 40b, 40c are
arranged at constant intervals of 120 degrees, the second optical
semiconductor module 40b does not face any other optical
semiconductor module at an opposite side thereof, and the third
optical semiconductor module 40c does not face any other optical
semiconductor module at an opposite side thereof. Thus, light
emitted from the semiconductor optical devices 46b, 46c of the
second and third optical semiconductor modules 40b, 40c may
illuminate the upper portion (or the rear side) of the lighting
apparatus without substantially interfering with light from the
other optical semiconductor modules. When the lighting apparatus is
mounted on the ceiling, the second and third optical semiconductor
modules 40b, 40c illuminate regions near the ceiling.
[0063] As such, the first, second and third optical semiconductor
modules 40a, 40b, 40c are arranged at equal intervals along the
circumference of the light-transmitting tube 20, so that light is
uniformly distributed throughout the overall region of the
light-transmitting tube 20, that is, over an entire region across
360 degrees, thereby providing uniform light distribution
characteristics. Advantageously, power applied to the second and
third optical semiconductor modules 40b, 40c may be lower than
power applied to the first optical semiconductor module 40a to
provide a lower light output at the rear side of the
light-transmitting tube. To this end, the second and third optical
semiconductor modules 40b, 40c may employ semiconductor optical
devices having lower power consumption or may include a smaller
number of semiconductor optical devices than the first optical
semiconductor module. Here, application power and light output of
the second optical semiconductor module 40b may be the same as that
of the third optical semiconductor module 40c.
[0064] The semiconductor optical devices 46a of the first optical
semiconductor module 40a may be configured to emit light having a
desired color temperature, for example, about 5000K, and the second
and third optical semiconductor modules 40b, 40c may include at
least one semiconductor optical device 46b or 46c, which emits
light having a different color temperature from that of the light
emitted from the semiconductor optical device 46a of the first
optical semiconductor module 40a, so that the lighting apparatus
may act as a light source in the form of an indirect lamp having a
color dimming function.
[0065] The optical semiconductor-based tube type lighting apparatus
1 according to this embodiment includes a light spreading layer 21
formed on an inner periphery of the light-transmitting tube 20. The
light-transmitting tube 20 may be formed by coating a light
spreading material on the inner periphery of the light-transmitting
tube 20 or attaching a light spreading sheet thereto. The light
spreading layer 21 widely spreads light passing through the
light-transmitting tube 20, thereby preventing a surrounding region
of the optical semiconductor modules 40a, 40b, 40c from becoming
relatively dark. Alternatively, the light spreading layer may be
formed on the outer periphery of the light-transmitting tube 20, or
a light spreading material may be contained in a light-transmitting
plastic material constituting the light-transmitting tube 20.
Further, the light-transmitting tube 20 may include a wavelength
converting material, preferably, remote phosphors. The remote
phosphors may be formed on the inner periphery and/or outer
periphery of the light-transmitting tube 20, and may be contained
in a resin for the light-transmitting tube 20.
[0066] FIG. 4 and FIG. 5 illustrate various example embodiments of
the invention. In the optical semiconductor-based tube type
lighting apparatus of FIG. 4, three optical semiconductor modules,
that is, a first optical semiconductor module 40a, a second optical
semiconductor module 40b and a third optical semiconductor module
40c, are arranged with an interval of about 120 degrees along the
circumference of a substantially oval light-transmitting tube 20.
The first, second and third optical semiconductor modules 40a, 40b,
40c are placed at three vertices of an isosceles triangle. As in
the embodiment described above, the first optical semiconductor
module 40a illuminates a region beneath the lighting apparatus,
that is, a lower indoor space, and the second and third optical
semiconductor modules 40b, 40c illuminate a region above the
lighting apparatus, that is, a rear region near the ceiling.
[0067] In the optical semiconductor-based tube type lighting
apparatus of FIG. 5, three optical semiconductor modules (i.e., a
first optical semiconductor module 40a, a second optical
semiconductor module 40b and a third optical semiconductor module
40c) are arranged with an interval of about 120 degrees along the
circumference of a light-transmitting tube 20 having a
cross-section of a substantially equilateral triangle, which has a
rounded surface near each vertex. The first optical semiconductor
module 40a is placed on a horizontal upper side of the
light-transmitting tube 20, and the second and third optical
semiconductor modules 40b, 40c are placed on the remaining two side
surfaces of the light-transmitting tube 20 in a cross-sectional
view. The first optical semiconductor module 40a illuminates a
region beneath the lighting apparatus, that is, a lower indoor
space, and the second and third optical semiconductor modules 40b,
40c illuminate a region above the lighting apparatus, that is, a
rear region near the ceiling. When a vertex or a sharp tip is
present at a portion requiring much distribution of light, light
loss can occur at such a portion. Thus, such a portion may have a
rounded surface to prevent light loss as described above. As such,
the light-transmitting tube 20 may be formed to be devoid of a
vertex, sharp tip or other sharp shapes at a portion requiring much
distribution of light.
[0068] Next, a tube type optical semiconductor-based lighting
apparatus according to another example embodiment of the invention
and a method of manufacturing the same will be described. In the
description of the embodiment, repeated description of like
components will be omitted.
[0069] FIG. 6 is a perspective view of an optical
semiconductor-based tube type lighting apparatus according to
another example embodiment of the invention, FIG. 7 is an exploded
perspective view of the optical semiconductor-based tube type
lighting apparatus of FIG. 6, FIGS. 8A and 8B are partially
enlarged perspective views of the semiconductor-based tube type
lighting apparatus according to the example embodiment, from which
a connector is separated, and FIG. 9 is a cross-sectional view of
the optical semiconductor-based tube type lighting apparatus
according to the example embodiment. In the description of this
example embodiment, the same or like components to those of the
above embodiment will be indicated by the same reference numerals
as those of the above embodiment.
[0070] As shown in FIG. 6 to FIG. 9, the optical
semiconductor-based tube type lighting apparatus 1 according to
this embodiment includes an elongated hollow plastic
light-transmitting tube 20 having a substantially circular
cross-section, and a bar-shaped semiconductor module 40 disposed in
a longitudinal direction of the light-transmitting tube 20.
[0071] In this embodiment, the light-transmitting tube 20 has an
elongated mounting gap formed in the longitudinal direction
thereof. The circumference of the light-transmitting tube is
continuously formed except for the mounting gap. The substantially
bar-shaped optical semiconductor module 40 is fitted into the
mounting groove and is thus secured to a circular wall of the
light-transmitting tube 20. Except for the region where the optical
semiconductor module 40 is mounted, no optical semiconductor module
40 is present on the overall wall of the light-transmitting tube
20.
[0072] The light-transmitting tube 20 is provided at opposite ends
thereof with two connectors 60a, 60b. Both of the connectors 60a,
60b serve as electrical connectors for supplying power to the
optical semiconductor module 40. Alternatively, only one of the
connectors 60a, 60b, for example, a connector 60a, may serve as an
electrical connector for supplying power to the optical
semiconductor module 40. In this case, the other connector 60b may
serve only as a mechanical connector for connecting one end of the
light-transmitting tube 20 to one end of the connector.
Furthermore, both of the connectors 60a, 60b may serve as
mechanical connectors instead of electrical connectors. In this
case, a separate electrical connector, which does not provide a
function of a mechanical connector, may be provided to the
light-transmitting tube 20 through an opening of the
light-transmitting tube 20 together with a cable.
[0073] As clearly shown in FIG. 8B and FIG. 9, the optical
semiconductor module 40 includes an elongated heat sink 42, a PCB
44 attached to a flat front side of the heat sink 42, and an array
of semiconductor optical devices 46 mounted on the PCB 44. The
semiconductor optical devices mounted on the PCB 44 are
longitudinally arranged in a single row to constitute an array of
semiconductor optical devices. Here, the PCB 44 may be a
metal-based MCPCB (Metal Core Printed Circuit Board) or MPCB (Metal
Printed Circuit Board) having high thermal conductivity. The heat
sink 42 is partially exposed from the light-transmitting tube 20
through the mounting gap.
[0074] As described in detail below, the optical semiconductor
module 40 is longitudinally inserted into the mounting gap of the
light-transmitting tube 20 in a sliding manner and is firmly
coupled to the light-transmitting tube 20.
[0075] The light-transmitting tube 20 includes a guide structure
that allows sliding insertion of the optical semiconductor module
40 into the light-transmitting tube 20 along the mounting gap, and
the heat sink 42 and the PCB 44 of the optical semiconductor module
40 have shapes to be slid into the light-transmitting tube 20
through the guide structure in a state of being coupled to each
other.
[0076] The mounting gap and the guide structure of the
light-transmitting tube 20 will be described in more detail
hereinafter.
[0077] The light-transmitting tube 20 includes a linear slit 201
longitudinally formed to provide the mounting gap. As described in
detail hereinafter, the slit 201 may be formed by longitudinally
cutting the light-transmitting tube 20 with a laser or a sharp
cutter such as a knife. The light-transmitting tube 20 is formed
with a single guide structure, which includes a pair of hooks 202
facing each other and formed near the slit 201 on the inner
periphery of the light-transmitting tube 20 in the longitudinal
direction thereof, such that the optical semiconductor module 40 is
guided by the hooks 202 in a sliding manner.
[0078] As described below, the hooks 202 may be integrally formed
with the light-transmitting tube 20 when forming the
light-transmitting tube 20. Further, the slit 201 is formed by
longitudinally cutting the light-transmitting tube 20 having the
hooks 202. Here, since the slit 201 is placed between the pair of
hooks 202, the pair of hooks 202 may be widened by forcibly
widening the slit 201.
[0079] As clearly shown in FIG. 9, the heat sink 42 has the flat
front surface to which the PCB 44 is attached. Further, the heat
sink 42 includes a pair of guide wings 422 formed at the right and
left of a rear side thereof, and a heat dissipation protrusion 424
at the center of the rear side. Each of the guide wings 422 has a
flat front surface and a curved rear surface, which is identical or
similar to the inner periphery of the light-transmitting tube 20.
The heat dissipation protrusion 424 extends along the center of the
rear side of the heat sink 42 in the longitudinal direction and has
vertical surfaces at opposite sides thereof. The heat dissipation
protrusion 424 has a curved rear surface, which is identical or
similar to the outer periphery of the light-transmitting tube
20.
[0080] The PCB 44 has right and left edges with respect to the
center thereof on which the semiconductor optical devices 46 are
arranged. The right and left edges of the PCB 44 protrude together
with the guide wings 422 of the heat sink 42 from opposite sides of
the optical semiconductor module 40. The PCB 44 may have a greater
width than the front side of the heat sink 42, so that right and
left edges of the PCB 44 are located farthest from the right and
left of the optical semiconductor module 40.
[0081] When the optical semiconductor module 40 is fitted into the
mounting gap of the light-transmitting tube 20 in a sliding manner,
the left guide wing 422 of the heat sink 42 and the left edge of
the PCB 44 are inserted together into the left hook 202, and the
right guide wing 422 of the heat sink 42 and the right edge of the
PCB 44 are inserted together into the right hook 202 in the
longitudinal direction. That is, each of the hooks 202 holds the
edges of the heat sink 42 and the PCB 44 at the same time. In
addition, since the pair of hooks 202 has the guide structure, the
optical semiconductor module 40 may be inserted into the pair of
hooks 202 in a sliding manner.
[0082] Since the insertion of the optical semiconductor module 40
in the longitudinal direction is carried out after forcibly
widening the slit 201 of the light-transmitting tube 20, the slit
210 is elastically deformed to be narrowed after insertion of the
optical semiconductor module 40, so that the optical semiconductor
module 40 may be firmly secured to the mounting gap.
[0083] When the portions of the optical semiconductor module 40
inserted into the respective hooks 202 are respectively referred to
as left and right protrusions of the optical semiconductor module
40, each of the left and right protrusions includes the guide wing
422 of the heat sink 42 and the edge of the PCB 44 on the guide
wing. A rear protrusion of the optical semiconductor module 20,
that is, the heat dissipation protrusion 424 at the rear side of
the heat sink 42, is exposed from the light-transmitting tube 20
through the widened slit 201 of the light-transmitting tube 20.
Right and left edges of the slit 201 (i.e., right and left cut
surfaces), are inserted into the side surfaces of the optical
semiconductor module to contact side surfaces of the heat
dissipation protrusion 424. At this time, the edges of the slit
201, that is, the cut surfaces, forcibly compress both sides of the
protrusion 424 by elasticity narrowing the slit 201.
[0084] As clearly shown in FIG. 9, an undulating light spreading
pattern 29 for spreading light is formed on the inner periphery of
the light-transmitting tube 20. The light spreading pattern 29 may
be formed on the inner periphery of the light-transmitting tube 20
when forming the light-transmitting tube 20 by, for example,
injection molding.
[0085] Next, a method of manufacturing the optical
semiconductor-based tube type lighting apparatus as described above
according to one exemplary embodiment will be described with
reference to FIG. 10 and FIG. 11.
[0086] Referring to FIG. 10, a light-transmitting tube 20 is
prepared by, for example, injection molding. Here, the
light-transmitting tube 20 has a pair of hooks 202 elongated in the
longitudinal direction of the light-transmitting tube 20 and facing
each other. Then, an elongated linear slit 201 is formed over the
entire length of the light-transmitting tube 20 at the middle
between the pair of hooks 202. The slit 201 is formed by
longitudinally cutting the light-transmitting tube 20 with a laser
or a sharp cutter such as a knife. As the slit 201 is formed, the
light-transmitting tube 20 is formed with a mounting gap, which is
placed between the pair of hooks 202 and is capable of being
widened by external force.
[0087] Then, referring to FIG. 11, the width of slit 201 is widened
by applying force to the light-transmitting tube 20 in a direction
of an arrow. Next, the linear optical semiconductor module 40 is
inserted in a sliding manner into the mounting gap formed by
widening the slit 201. At this time, right and left protrusions of
the linear optical semiconductor module 40 are respectively
inserted into and guided by the pair of hooks 202, and a rear
protrusion of the optical semiconductor module 40 is inserted into
and guided by the widened slit 201 in a sliding manner. As
described above, each of the protrusions of the optical
semiconductor module 40 respectively inserted into the pair of
hooks 202 includes the right or left edge of the PCB and the right
or left guide wing of the heat sink.
[0088] Then, one end or both ends of the light-transmitting tube 20
are finished with a connector, thereby completing the optical
semiconductor-based tube type lighting apparatus.
[0089] Next, a method of manufacturing the optical
semiconductor-based tube type lighting apparatus as described above
according to another exemplary embodiment will be described with
reference to FIG. 12 to FIG. 14.
[0090] As in the embodiment described above, a light-transmitting
tube 20 having a pair of hooks 202 formed on an inner periphery
thereof is prepared. As in the embodiment described above, an
elongated linear slit 201 is formed over the entire length of the
light-transmitting tube 20, except for a portion of the
light-transmitting tube 20 near one end thereof, at the middle
between the pair of hooks 202. In this embodiment, the slit 201 is
formed by longitudinally cutting the light-transmitting tube 20
with a laser or a sharp cutter such as a knife.
[0091] Then, referring to FIG. 12, the width of slit 201 is widened
by applying force to the light-transmitting tube 20 in a direction
of an arrow, except for a portion near one end of the
light-transmitting tube in which a slit is not formed. Next, as in
the embodiment described above, the linear optical semiconductor
module 40 is inserted in a sliding manner into the mounting gap
formed by widening the slit 201.
[0092] Then, referring to FIG. 13, the portion L of the
light-transmitting tube 20 in which the slit 201 is not formed is
cut and removed from the light-transmitting tube 20. As a result,
the slit 201 is formed over the entire length of the
light-transmitting tube 20. After removing the portion of the
light-transmitting tube 20, the optical semiconductor module 40 is
further pushed into the mounting gap in the case where the optical
semiconductor module 40 is not sufficiently inserted into the
mounting gap. The method according to this embodiment has various
advantages. Particularly, this method may provide facilitate the
process by widening one side of the slit 201 of the elongated
light-transmitting tube 20, and a lighting apparatus, for example,
like the lighting apparatus according to the embodiment shown in
FIG. 1 to FIG. 5, by forming a plurality of slits in the
light-transmitting tube 20 and mounting a plurality of optical
semiconductor modules to the plurality of slits.
[0093] In the example embodiments described above, a single optical
semiconductor module 40 is illustrated as being inserted into a
single mounting gap or a single slit 201 of the light-transmitting
tube 20. However, it may be contemplated that two or more optical
semiconductor modules 40 may be inserted together into a single
mounting gap or a single slit 201 in an optical semiconductor-based
tube type lighting apparatus according to another exemplary
embodiment, as shown in FIG. 14.
[0094] Referring to FIG. 14, with adjacent side surfaces of the two
optical semiconductor modules 40 coupled to each other, the two
optical semiconductor modules 40 are inserted into a single slit
201 of a light-transmitting tube 20. At this time, protrusions on
side surfaces of the two semiconductor modules 40, which are not
adjacent each other, may be respectively inserted into a pair of
hooks 202 of the light-transmitting tube 20 in a sliding manner.
The structure wherein the adjacent side surfaces of the two optical
semiconductor modules are coupled to each other may be modified in
various ways, and thus a detailed description thereof will be
omitted herein. Further, the two optical semiconductor modules 40
inserted into a single slit may be collinearly connected to each
other or may be connected to each other to cross at a predetermined
angle.
[0095] As such, according to embodiments of the invention, the
optical semiconductor-based tube type lighting apparatus includes a
first optical semiconductor module emitting light towards a lower
front side of a light-transmitting tube, and second and third
optical semiconductor modules emitting light towards an upper rear
side of the light-transmitting tube. Thus, the optical
semiconductor-based tube type lighting apparatus according to the
exemplary embodiments does not suffer from a problem of
conventional tube type or fluorescent lamp type LED lighting
apparatuses in which the upper rear region of the
light-transmitting tube is relatively dark.
[0096] According to one or more example embodiments, in the optical
semiconductor-based tube type lighting apparatus, some of the
optical semiconductor modules are configured to have different
color temperatures, so that the optical semiconductor-based tube
type lighting apparatus may be used as an indirect lamp. As such,
the optical semiconductor-based tube type lighting apparatus
according to the exemplary embodiments may be suited not only to
general indoor lighting, but also to outdoor lighting.
[0097] According to one or more example embodiments, in the tube
type optical semiconductor-based lighting apparatus, the bar-shaped
optical semiconductor modules are directly mounted on the wall of
the light-transmitting tube to increase the distance between the
semiconductor optical devices and the light-transmitting tube,
thereby increasing light distribution. Further, according to the
exemplary embodiments, when mounting the bar-shaped optical
semiconductor module directly on the wall of the light-transmitting
tube such that the semiconductor module is partially exposed from
the light-transmitting tube, the slit formed on the
light-transmitting tube is widened to allow the optical
semiconductor module to be easily inserted into the widened slit in
a sliding manner, thereby significantly improving assembly
properties of the optical semiconductor-based tube type lighting
apparatus.
[0098] It will be apparent to those skilled in the art that various
modifications and variation can be made in the present invention
without departing from the spirit or scope of the invention. Thus,
it is intended that the present invention cover the modifications
and variations of this invention provided they come within the
scope of the appended claims and their equivalents.
* * * * *