U.S. patent application number 13/518689 was filed with the patent office on 2012-11-29 for bent-type heat dissipater.
This patent application is currently assigned to CEDIC CO., LTD.. Invention is credited to Jang-Hyung Cho.
Application Number | 20120298346 13/518689 |
Document ID | / |
Family ID | 42645700 |
Filed Date | 2012-11-29 |
United States Patent
Application |
20120298346 |
Kind Code |
A1 |
Cho; Jang-Hyung |
November 29, 2012 |
BENT-TYPE HEAT DISSIPATER
Abstract
Disclosed is a bent-type dissipater, including one or a
plurality of heat sinks which are adapted with cooling apertures;
one or a plurality of cooling pins which are bent in structure, and
which are integrated to the heat sinks, and a central heat passage
for combining heat moving in one direction with ambient air, and
discharging the heat in the opposite direction.
Inventors: |
Cho; Jang-Hyung; (Seoul,
KR) |
Assignee: |
CEDIC CO., LTD.
Seoul
KR
|
Family ID: |
42645700 |
Appl. No.: |
13/518689 |
Filed: |
December 13, 2010 |
PCT Filed: |
December 13, 2010 |
PCT NO: |
PCT/KR2010/008878 |
371 Date: |
June 22, 2012 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
F21V 29/83 20150115;
F21V 29/74 20150115; F21Y 2115/10 20160801; F21K 9/00 20130101;
F21V 29/713 20150115; F21K 9/23 20160801 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 3/04 20060101
F28F003/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 24, 2009 |
KR |
10-2009-0130385 |
Claims
1. A bent-type heat dissipater comprising: a heat dissipation plate
having one or a plurality of cooling holes that form passages to
discharge heat, which transfers in one direction, together with
external air in the opposite direction; and one or a plurality of
heat dissipation fins integrally bending from the heat dissipation
plate.
2. The bent-type heat dissipater of claim 1, wherein the cooling
hole is formed at the center of the heat dissipation plate.
3. The bent-type heat dissipater of claim of claim 1, wherein the
cooling hole is shaped in any one of a circle, an ellipse, and a
polygon.
4. The bent-type heat dissipater of claim 1, wherein the inner
diameter of the cooling hole is 6.5 to 80% of the outer diameter of
the heat dissipation plate.
5. The bent-type heat dissipater of claim 1, wherein the cooling
hole further has a plurality of sub-cooling grooves along the inner
circumference.
6. The bent-type heat dissipater of claim 1, wherein the heat
dissipation fins are integrally bent up along the edge of the heat
dissipation plate and have a predetermined length upward.
7. The bent-type heat dissipater of claim 6, wherein the heat
dissipation fins are inclined at a predetermined angle toward the
center with respect to the top of the heat dissipation plate.
8. The bent-type heat dissipater of claim 7, wherein the
inclination angle of the heat dissipation fins is changed by
selectively bending.
9. The bent-type heat dissipater of claim 1, wherein the heat
dissipation fins further have one or a plurality of sub-holes to
pass heat, which flows inside from the cooling hole, to the
outside.
10. The bent-type heat dissipater of claim 1, wherein the heat
dissipation fins are formed at regular intervals, and a plurality
of sub-heat dissipation fins is further disposed at the gaps
between the heat dissipation fins, along the regular edge of the
heat dissipation plate in order to increase a heat dissipation
area.
11. The bent-type heat dissipater of claim 10, wherein the sub-heat
dissipation fins are formed in any one of a shape bent in one
direction to have a plurality of steps and a zigzag shape
alternately bent in two directions to have a plurality of steps.
Description
TECHNICAL FIELD
[0001] The present invention relates to a bent-type heat
dissipater, particularly a bent-type heat dissipater that can
improve easiness of manufacturing, weight reduction, and heat
transfer performance by integrally forming a plurality of heat
dissipation fins to be bent, and improve the operational
performance of a device with a heat-generating unit by ensuring
paths through which heat can flow.
BACKGROUND ART
[0002] In general, light emitting diode lamps (hereafter, referred
to as `LED lighting device`) have the advantage in that economical
efficiency is excellent because the efficiency of light to unit
power is remarkably high in comparison to incandescent lamps and
fluorescent lamps that are presently used.
[0003] That is, LEDs have the advantage in that they are
eco-friendly and have a long life span because they generate a
small amount of carbon and a small amount of heat, in addition to
obtaining a desired amount of light from low voltage. Therefore,
LEDs have been widely used for lighting devices, which can replace
incandescent lamps and fluorescent lamps.
[0004] LED lighting devices have a problem in that it is difficult
to obtain a desired amount of light due to heat from a plurality of
LEDs when being used for a predetermined period of time due to the
features and the life span of the LEDs rapidly decreases due to a
gradual increase in the amount of generated heat when being
continuously used.
[0005] In order to solve the problem, LED lighting devices have
been configured to dissipate heat to the outside by attaching a
heat sink made of metal (for example, aluminum) to the rear side of
a substrate equipped with LEDs, in the related art. In this
configuration, a plurality of heat dissipation fins for dissipating
heat and a plurality of holes (also called discharge holes or
convection holes) for passing external air and internal heat are
formed at the outer side of the heat sink.
[0006] However, since the heat sink of the related art is made of
not a single material, but a mixture of several materials, and is
manufactured by die casting, performance of heat transfer is not
good. Further, there is a problem in that the heat sink is heavy
and this makes it difficult to reduce the weight of the device, and
the cost increases due to a complicate manufacturing process.
[0007] Further, the heat sink has a structure in which the heat
generated by the heat-generating unit transfers to the heat sink
simply through only a contact type, without an inpassage, that is a
passage, for external air which connects the heat-generating unit
with the heat sink.
[0008] According to the structure, natural convection becomes slow
locally only around the holes of the heat sink and the heat
generated from the heat-generating units stops and cannot be
quickly discharged.
[0009] Therefore, the heat generated from the heat-generating unit
is not quickly discharged to the outside, such that it is
impossible to prevent the heat-generating unit from continuously
increasing in temperature, and accordingly, the life span or the
function of the LEDs and the parts around are decreased, thus
deteriorating the operational performance of the device.
DISCLOSURE
Technical Problem
[0010] Therefore, the present invention has been made in an effort
to solve the problems in the related art and the first object of
the present invention is to provide a bent-type heat dissipater
that can be more easily manufactured and can improve heat transfer
performance, by forming integral heat dissipation fins by machining
one thin metal plate from a single material, and by bending up the
integral heat dissipation fins to make the heat dissipater in one
structure.
[0011] Further, the second object of the present invention is to
provide a bent-type heat dissipater that allows heat generated from
a heat-generating unit to be quickly discharged to the outside by
ensuring a passage through which the heat generated from the
heat-generating unit can be discharged outside together with
external air.
Technical Solution
[0012] In order to achieve the object, a bent-type heat dissipater
of the present invention includes: a heat dissipation plate having
one or a plurality of cooling holes that form passages to discharge
heat, which transfers in one direction, together with external air
in the opposite direction; and one or a plurality of heat
dissipation fins integrally bent from the heat dissipation
plate.
[0013] The cooling hole is preferably formed at the center of the
heat dissipation plate. Further, it is preferable that the cooling
hole is formed in a size of 20 to 80% of the size of the heat
dissipation plate. Further, it is preferable that the cooling hole
further has a plurality of sub-cooling grooves along the inner
circumference.
[0014] In this configuration, it is preferable that the heat
dissipation fins are inclined at a predetermined angle toward the
center with respect to the top of the heat dissipation plate. It is
preferable that the inclination angles of the heat dissipation fins
are changed by selectively bending.
[0015] Further, it is preferable that the heat dissipation fins
further have one or a plurality of sub-holes to pass heat, which
flows inside from the cooling hole, to the outside.
[0016] It is preferable that the heat dissipation fins are
integrally bent up along the edge of the heat dissipation plate and
have a predetermined length upward.
[0017] Meanwhile, it is preferable that the heat dissipation fins
are formed at regular intervals, and a plurality of sub-heat
dissipation fins is further disposed at the regular gaps between
the heat dissipation fins, along the edge of the heat dissipation
plate in order to increase a heat dissipation area.
[0018] In this configuration, it is preferable that the sub-heat
dissipation fins are formed in any one of a shape bent in one
direction to have a plurality of steps and a zigzag shape
alternately bent in two directions to have a plurality of
steps.
Advantageous Effects
[0019] As described above, according to the present invention,
since the heat dissipation fins are implemented by one thin metal
plate made of one material, it is possible to easily manufacture
the heat dissipater, reduce the weight, and improve heat transfer
performance.
[0020] Further, as the sub-heat dissipation fins are further
provided, the area coming in contact with air increases, such that
the cooling performance can be further improved, and the heat
dissipater can function as a main body simultaneously with cooling,
such that it is possible to simplify the structure of the LED
lighting device. Further, as passages through which the heat
generated from the heat-generating unit can be discharged together
with the external air to the outside are ensured, the discharge
speed of heat is high in a device including a heat-generating unit,
such that the performance of the device can be improved.
DESCRIPTION OF DRAWINGS
[0021] FIG. 1 is a perspective view showing a bent-type heat
dissipater according to the present invention.
[0022] FIG. 2 is a perspective view showing when heat dissipation
fins of the bent-type heat dissipater according to the present
invention are deployed.
[0023] FIG. 3 is a bottom view showing sub-cooling grooves formed
around a cooling hole of the bent-type heat dissipater according to
the present invention.
[0024] FIG. 4A is a perspective view showing when the heat
dissipation plate of the bent-type heat dissipater according to the
present invention is further provided with sub-heat dissipation
fins.
[0025] FIG. 4B is a perspective view showing the shapes of the
sub-heat dissipation fins of FIG. 4A bent in one direction to have
a plurality of steps.
[0026] FIG. 4C is a perspective view showing the shapes of the
sub-heat dissipation fins of FIG. 4A alternately bent in two
directions to have a plurality of steps.
[0027] FIG. 5 is a disassembly view showing the installation state
of the bent-type heat dissipater according to the present
invention.
[0028] FIG. 6 is a plan view showing the installation state of the
bent-type heat dissipater according to the present invention.
[0029] FIG. 7 is a front cross-sectional view showing the
installation state of the bent-type heat dissipater according to
the present invention, taken along line A-A.
[0030] FIG. 8A is a view schematically showing temperature
distribution according to the diameter of the cooling hole when
heat is discharged by the bent-type heat dissipater according to
the present invention.
[0031] FIG. 8B is a view schematically showing velocity
distribution according to the diameter of the cooling hole when
heat is discharged by the bent-type heat dissipater according to
the present invention.
BEST MODE
[0032] Preferred embodiments of the present invention will be
described hereafter in detail with reference to the accompanying
drawings.
[0033] Terminologies defined in description of the present
invention are defined in consideration of the functions in the
present invention and should not be construed as limiting the
technical components of the present invention.
[0034] FIG. 1 is a perspective view showing a bent-type heat
dissipater according to the present invention. FIG. 2 is a
perspective view showing when heat dissipation fins of the
bent-type heat dissipater according to the present invention are
deployed. FIG. 3 is a bottom view showing sub-cooling grooves
formed around a cooling hole of the bent-type heat dissipater
according to the present invention. FIG. 4A is a perspective view
showing when the heat dissipation plate of the bent-type heat
dissipater according to the present invention is further provided
with sub-heat dissipation fins. FIG. 4B is a perspective view
showing the shapes of the sub-heat dissipation fins of FIG. 4A bent
in one direction to have a plurality of steps. FIG. 4C is a
perspective view showing the shapes of the sub-heat dissipation
fins of FIG. 4A alternately bent in two directions to have a
plurality of steps. FIG. 5 is a disassembly view showing the
installation state of the bent-type heat dissipater according to
the present invention. FIG. 6 is a plan view showing the
installation state of the bent-type heat dissipater according to
the present invention. FIG. 7 is a front cross-sectional view
showing the installation state of the bent-type heat dissipater
according to the present invention, taken along line A-A.
[0035] FIG. 8A is a view schematically showing temperature
distribution according to the diameter of the cooling hole when
heat is discharged by the bent-type heat dissipater according to
the present invention. FIG. 8B is a view schematically showing
velocity distribution according to the diameter of the cooling hole
when heat is discharged by the bent-type heat dissipater according
to the present invention.
[0036] As shown in FIGS. 1 and 2, a bent-type heat dissipater 100
of the present invention includes a heat dissipation plate 110
having one or a plurality of cooling holes 111 that form passages
to discharge heat, which is generated in one direction, together
with external air in the opposite direction, and a plurality of
heat dissipation fins 120 integrally bending up along the edge of
the heat dissipation plate 110 and having a predetermined length
upward. It is preferable to use aluminum for the material of the
heat dissipater of the present invention.
[0037] It is preferable that the cooling holes 111 are disposed at
the center of the heat dissipation plate. Further, the heat
dissipation fins 120 may be arranged at predetermined distances or
in contact with each other.
[0038] That is, when the heat dissipation fins 120 may be arranged
at predetermined distances, the air and heat flowing inside from
the outside can be discharged through the upper portions and sides
of the heat dissipation fins 120. On the contrary, when the heat
dissipation fins 120 are in contact with each other, only the heat
can be discharged through the sides of the heat dissipation fins
120.
[0039] In this case, one or a plurality of sub-holes 123 may be
further formed at the heat dissipation fins 120 to pass the heat,
which flows inside through the cooling hole, to the outside. That
is, the sub-holes 123 allow the heat and the external air flowing
upward through the cooling hole 111 to be easily discharged
outside.
[0040] Further, insertion holes 121 are vertically formed through
the tops of the heat dissipation fins 120 such that a power module
300 (described below) can be combined. Preferably, it may be
possible to bend the upper ends of the heat dissipation fins 120
toward the center of the heat dissipation plate 110 to form flat
surfaces and then vertically form the insertion holes 121 through
the flat surfaces.
[0041] Meanwhile, it is preferable to form the cooling hole 111 at
the center of the heat dissipation plate 110. Further, the cooling
hole 111 may be shaped in any one of a circle, an ellipse, and a
polygon. Further, it is preferable to size the cooling hole 111 to
be 20 to 80% of the size of the heat dissipation plate 110.
[0042] Meanwhile, as shown in FIG. 3, a plurality of sub-cooling
grooves 111a may be formed along the circumference of the cooling
hole 111.
[0043] The sub-cooling grooves 111a may be selectively arranged in
accordance with the installation direction of LEDs 211, and the
length and width of the sub-cooling grooves 111a may depend on the
amount of heat generated by the LEDs 211. That is, the sub-cooling
grooves 111a have orientation to the portions where the LEDs 211
are disposed, such that they have an effect of intensively cooling
the portions where a large amount of heat is generated.
[0044] It is preferable that the heat dissipation fins 120 are
inclined at a predetermined angle toward the center with respect to
the top of the heat dissipation plate 110. Further, it is
preferable to selectively change the inclination angles of the heat
dissipation fins 120 by bending.
[0045] The reason of inclining the heat dissipation fins 120 is for
further improving heat dissipation performance by concentrating the
heat to the upper portion, simultaneously with increasing the
contact areas between air and the heat dissipation fins 120 while
the air flows upward through the cooling hole 111.
[0046] Meanwhile, the heat dissipation fins 120 are formed at
regular intervals and a plurality of sub-heat dissipation fins 122
are further disposed at the regular gaps between the heat
dissipation fins 120 along the edge of the heat dissipation plate
110 to increase the heat dissipation area.
[0047] As shown in FIGS. 4A to 4C, the sub-heat dissipation fins
122 may be formed in any one of a shape bent in one direction to
have a plurality of steps and a zigzag shape alternately bent in
two directions to have a plurality of steps.
[0048] The bent-type heat dissipater 100 is formed in a single
structure by integrally forming the heat dissipation fins 120 by
machining one plate member, and then bending up the heat
dissipation fins 120, as shown in FIG. 2. That is, since the heat
dissipater 100 is formed in one integral body, heat easily
transfers and the heat dissipation performance is improved.
[0049] Further, it is preferable that the inner diameter of the
cooling hole 111 is 6.5% to 80% of the outer diameter of the heat
dissipation plate 110.
[0050] For example, FIGS. 8A and 8B show when the inner diameters
of three cooling holes 112, 122, and 131 are set at 6.5%, 22%, 37%,
52%, and 80% of the outer diameter of the heat dissipation plate
110 and then external air flowing inside through the cooling holes
and heat generated from a heat-generating unit are discharged
upward.
[0051] The red parts are where temperature is the highest and
velocity is the highest and the blue parts are where temperature is
the lowest and velocity is the lowest.
[0052] That is, referring to FIG. 8A, it can be seen that as the
external air flows inside through the cooling hole formed at the
center while air and heat is discharged, the temperature rapidly
decreases toward the upper portion. Further, referring to FIG. 8B,
it can be seen that the velocity increases toward the upper
portion.
[0053] The bent-type heat dissipater 100 described above, in
accordance with the present invention, can be formed into one
lighting device by organically combining an LED module 200 equipped
with a plurality of LEDs 211 with a power module 300 supplying
power to the LED module 200.
[0054] Obviously, the configurations described herein are only
examples of preferable installation states of the bent-type heat
dissipater 100 and it should be understood that the present
invention may be achieved in various ways without being limited
thereto.
[0055] First, the LED module 200 includes an LED substrate 210
equipped with a plurality of LEDs 211 arranged on the underside and
having a first lower cooling hole 212 vertically formed through the
center, and a condensing lens unit 220 coupled to the underside of
the LED substrate 210, diffusing light generated from the LEDs 211
through lenses 221, and having a second lower cooling hole 222
vertically formed to be connected with the first lower cooling hole
212.
[0056] Further, a lens cover 230 may be further disposed under the
condensing lens unit 220. On the other hand, as shown in FIG. 10,
it should be understood that the condensing lens unit 220 may
function as both a lens and a cover by being coupled to the
underside of the LED substrate 210 by a cover-fastening member 232
which is described below.
[0057] The lens cover 230 has seating holes 233 vertically formed
to seat the lenses 221 through the seating holes 233, and a third
lower cooling hole 231 vertically formed to be connected
(communicate) with the second lower cooling hole 222 of the
condensing lens unit 220. That is, the first, second, and third
lower cooling holes 212, 222, and 231 and the cooling hole 111
formed at the heat dissipation plate 110 form one vertical passage
such that external air can flow inside from below and be discharged
upward.
[0058] The seating holes 233 may be formed to have a diameter the
same or larger than the circumferences of the lenses 21 such that
the lenses 21 can pass through them.
[0059] Further, the cover-fastening member 232 extending upward and
surrounding the third lower cooling hole 231 may be formed on the
top of the lens cover 230. A plurality of first locking protrusions
232a is formed along the circumference at the upper end of the
cover-fastening member 232 to protrude outward.
[0060] The first locking protrusions 232a are locked on the cooling
hole 111 formed at the heat dissipation plate 110, through the
second lower cooling hole 222 and the first lower cooling hole 212.
Accordingly, the LED substrate 210, the condensing lens unit 220,
and the lens cover 230 can be integrally fixed to the underside of
the heat dissipation plate 110.
[0061] Further, the lens cover 230, the condensing lens unit 220,
and the LED substrate 210 may be fastened to the heat dissipation
plate 110 by several fasteners B. That is, when the cover-fastening
member 232 is mounted on the lens cover 230, the space inside the
cover-fastening member 232 becomes the third lower cooling hole 231
and the space inside the third lower cooling hole 231 forms one
vertical passage for taking external air inside and discharging
heat.
[0062] For this configuration, it is preferable that the outer
diameter of the cover-fastening member 232 is the same as the
diameters of the first, second, and third lower cooling holes 212,
222, and 231 and the cooling hole 111 formed at the heat
dissipation plate 110, which are described above.
[0063] The power module 300 includes an upper holder 310 having
terminal holes 311 at the upper portion and seated on the upper
ends of the heat dissipation fins 120, a power substrate 320 fitted
in the upper holder 310 from below such that connection terminals
321 disposed at the upper portion are inserted in the terminal
holes 311 to be exposed upward, and a lower holder 330 fitted on
the lower portion of the upper holder 310 and supporting and
preventing the power substrate 320 from being separated
outward.
[0064] In this structure, a plurality of second locking protrusions
330 protrudes outward from the sides of the upper holder 310.
Further, inclined surfaces (not given a reference number) that are
inclined upward and outward from the ends connected to the upper
holder 310 may be formed on the undersides of the second locking
protrusions 312.
[0065] Further, a plurality of locking holes 331 is horizontally
formed through the upper portion of the lower holder 330 that is
fitted on the upper holder 310 to fit the second locking
protrusions 312 therein.
[0066] Further, a plurality of insertion protrusions 313, which
protrude outward above and adjacent to the second locking
protrusions 312 and then extend downward, is further formed on the
sides of the upper holder 310.
[0067] That is, the upper ends with the locking holes 331 of the
lower holder 330 open outward while sliding on the inclined
surfaces formed on the undersides of the second locking protrusions
312 and are restored by elastic restoring force at the ends of the
inclined surfaces, such that the second locking protrusions 312 are
fitted. Therefore, the upper holder 310 and the lower holder 330
can be firmly combined.
[0068] Further, when the power module 300 is fixed on the upper
portions of the heat dissipation fins 120, the insertion
protrusions 313 of the upper holder 310 are inserted into the
insertion holes 121 formed at the tops of the heat dissipation fins
120.
[0069] Meanwhile, at least one or more cable holes 332 may be
formed through bottom of the lower holder 330 to pass cables (not
shown). That is, cables (not shown) extending from the power
substrate 320 are electrically connected to the LED substrate 210
through the cable holes 332.
[0070] Guide surfaces 333 narrowing downward may be formed on the
underside of the lower holder 330 to guide the flow of air. That
is, the guide surfaces 333 are narrow at the lower ends, such that
the air flowing from below can be guided to quickly flow upward
without stopping.
[0071] As a result, according to the present invention, since the
heat dissipation fins are implemented by one thin metal plate made
of one material, it is possible to easily manufacture the heat
dissipater, reduce the weight, and improve heat transfer
performance. Further, as the sub-heat dissipation fins are further
provided, the area coming in contact with air increases, such that
the cooling performance can be further improved, and the heat
dissipater 100 can function as a main body simultaneously with
cooling, such that it is possible to simplify the structure of the
LED lighting device. Further, as passages through which the heat
generated from the heat-generating unit can be discharged together
with the external air to the outside are ensured, the discharge
speed of heat is high in a device including a heat-generating unit,
such that the performance of the device can be improved.
[0072] Although the spirit of the bent-type heat dissipater 100
according to the present invention is described above with
reference to the accompanying drawings, this is an example for
describing the most preferable embodiment of the present invention
and does not limit the present invention.
[0073] Therefore, it is apparent that the present invention may be
modified and copied in dimensions, shape, and structure by those
skilled in the art without departing from the scope of the present
invention and those modifications and copies are included in the
scope of the present invention.
* * * * *