U.S. patent application number 13/221987 was filed with the patent office on 2012-11-29 for heat sink device and air flow adjusting frame for the same.
This patent application is currently assigned to MICRO-STAR INT'L CO., LTD.. Invention is credited to Yi-Chieh Lin, Yu-Jing Lin.
Application Number | 20120298329 13/221987 |
Document ID | / |
Family ID | 45522714 |
Filed Date | 2012-11-29 |
United States Patent
Application |
20120298329 |
Kind Code |
A1 |
Lin; Yi-Chieh ; et
al. |
November 29, 2012 |
HEAT SINK DEVICE AND AIR FLOW ADJUSTING FRAME FOR THE SAME
Abstract
An air flow adjusting frame for a heat sink device which
includes a first fixing plate and a second fixing plate is
disclosed. The first fixing plate is fixed to a heat dissipation
fin with the second fixing plate pivoted to the first fixing plate.
Besides, the second fixing plate is for being fixed to a fan. An
air flow angle of the fan is adjusted through the air flow
adjusting frame.
Inventors: |
Lin; Yi-Chieh; (New Taipei,
TW) ; Lin; Yu-Jing; (Taoyuan County, TW) |
Assignee: |
MICRO-STAR INT'L CO., LTD.
New Taipei
TW
|
Family ID: |
45522714 |
Appl. No.: |
13/221987 |
Filed: |
August 31, 2011 |
Current U.S.
Class: |
165/96 |
Current CPC
Class: |
G06F 1/20 20130101 |
Class at
Publication: |
165/96 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 27, 2011 |
TW |
100209674 |
Claims
1. A heat sink device, comprising: a heat dissipation fin; an air
flow adjusting frame, comprising: a first fixing plate, fixed to
the heat dissipation fin; and a second fixing plate, pivoted to the
first fixing plate; and a fan, fixed to the second fixing plate,
wherein an air flow angle of the fan is adjusted through the air
flow adjusting frame.
2. The heat sink device according to claim 1, wherein the air flow
adjusting frame further comprises a holding plate having a body and
at least one fixing portion, wherein the fixing portion is disposed
on body, the body and the second fixing plate are combined
together, and the fan is fixed to the fixing portion.
3. The heat sink device according to claim 2, wherein the air flow
adjusting frame further comprises two locking members, the number
of the at least one fixing portion is two, the body has two slots,
the fixing portions each have a fixing hole corresponding to one of
the slots, each of the locking members penetrates the corresponding
slot and the corresponding fixing hole, and a position of each of
the fixing portions relative to the body is changed along the
corresponding slot.
4. The heat sink device according to claim 2, wherein the air flow
adjusting frame further comprises at least one locking member, the
body further has at least one slot, the second fixing plate has at
least one fixing hole, the locking member penetrates the slot and
the fixing hole, and a position of the second fixing plate relative
to the body is changed along the slot.
5. The heat sink device according to claim 1, wherein the air flow
adjusting frame further comprises a damping pivot, and the first
fixing plate and the second fixing plate are pivoted to each other
through the damping pivot.
6. An air flow adjusting frame, for connecting a heat dissipation
fin and a fan for changing an air flow angle of the fan to the heat
dissipation fin, and the air flow adjusting frame comprising: a
first fixing plate for being fixed to the heat dissipation fin; and
a second fixing plate, pivoted to the first fixing plate, and for
fixing the fan.
7. The air flow adjusting frame according to claim 6, further
comprising a holding plate, wherein the holding plate has a body
and at least one fixing portion, the fixing portion is disposed on
the body, the body and the second fixing plate are combined
together, and the fan is fixed to the fixing portion.
8. The air flow adjusting frame according to claim 7, wherein the
number of the at least one fixing portion is two, the body has two
slots, the two fixing portions each have a fixing hole
corresponding to one of the slots, each of the locking members
penetrates the corresponding slot and the corresponding fixing
hole, and a position of each of the fixing portions relative to the
body is changed along the corresponding slot.
9. The air flow adjusting frame according to claim 7, further
comprising at least one locking member, wherein the body further
has at least one slot, the second fixing plate has at least one
fixing hole, the locking member penetrates the slot and the fixing
hole, and a position of the second fixing plate relative to the
body is changed along the slot.
10. The air flow adjusting frame according to claim 6, further
comprising a damping pivot, and the first fixing plate and the
second fixing plate pivoted to each other through the damping
pivot.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This non-provisional application claims priority under 35
U.S.C. .sctn.119(a) on Patent Application No(s). 100209674 filed in
Taiwan, R.O.C. on May 27, 2011, the entire contents of which are
hereby incorporated by reference.
BACKGROUND
[0002] 1. Technical Field
[0003] The disclosure relates to a heat sink device and an air flow
adjusting frame thereof, and more particularly to a heat sink
device for computer and an air flow adjusting frame thereof.
[0004] 2. Related Art
[0005] In recent years, with the advanced technology, the method of
developing and manufacturing electronic devices is well enhanced.
Electronic devices is not only heading to the direction of being
light in weight and small in size, but also to the direction of
having the finest functionality at the same time.
[0006] Using computers as an example, with the advanced technology
of semiconductors, the volume of the integrated circuit inside the
computers is miniaturized. For the purpose of obtaining an
integrated circuit capable of dealing with more data, the
integrated circuit today is able to contain multiple times more of
computing elements than the past integrated circuit with the same
size. When the integrated circuit contains more computing elements
inside, more thermal energy will be generated during the
operation.
[0007] Thus, the heat sink modules for removing the heat generated
by the computing elements are important. Taking the heat sink
modules on display cards as an example, most of the heat sink
modules are heat dissipation fins made of metal having high thermal
conductivity. The heat dissipation fins are disposed on a computing
chip on the display card, to absorb the heat generated by the
computing chip. In order to improve the heat dissipation ability of
the heat sink module, a fan is further installed on the heat
dissipation fins for fan generating forced convection to dissipate
the heat of the heat dissipation fin.
[0008] However, the fan is generally stacked on the heat
dissipation fins, and an air exhaust direction of the fan is always
vertical to a circuit board of the display card. Thus, when the air
flow generated by the fan blows to the circuit board, the air flow
is rebounded back due to the obstruction of the circuit board. The
rebounded air flow and the air flow generated by the fan interfere
with each other, so that a turbulent flow is generated between the
fan and the circuit board. Thus, the heat dissipation ability of
the heat sink module is greatly reduced and the operation load of
the fan increases. With the increasing operation load, the service
life of the fan is shortened.
SUMMARY
[0009] The disclosure is a heat sink device and an air flow
adjusting frame thereof for preventing the problem that when a
conventional fan blows, a turbulent flow is easily generated
between the fan and the circuit board resulting in decrease of heat
dissipation ability and increase of the load of the fan.
[0010] An embodiment discloses a heat sink device, which comprises
a heat dissipation fin, an air flow adjusting frame, and a fan. The
air flow adjusting frame comprises a first fixing plate and a
second fixing plate. The first fixing plate is fixed to the heat
dissipation fin, and the second fixing plate is pivoted to the
first fixing plate. The fan is fixed to the second fixing plate,
and an air flow angle of the fan is adjusted through the air flow
adjusting frame.
[0011] Another embodiment discloses an air flow adjusting frame for
connecting a heat dissipation fin with a fan to change an air flow
angle of fan relative to the heat dissipation fin. The air flow
adjusting frame comprises a first fixing plate and a second fixing
plate. The first fixing plate is fixed to the heat dissipation fin,
and the second fixing plate is pivoted to the first fixing plate
and is used for fixing the fan.
[0012] According to the above heat sink device and the air flow
adjusting frame for the same, the fan is enabled to pivot relative
to the heat dissipation fin due to the air flow adjusting frame, so
as to adjust the air flow angle of the fan. Consequently, the
vertical interference of the air flow generated by the fan and the
circuit board can be prevented, and the turbulent flow between the
fan and the circuit board may also be reduced. Also, the heat
dissipation ability of the heat sink is enhanced with the work load
of the fan being reduced.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The disclosure will become more fully understood from the
detailed description given herein below for illustration only, and
thus are not limitative of the disclosure, and wherein:
[0014] FIG. 1 is a schematic structural view of a heat sink device
according to an embodiment of the disclosure;
[0015] FIG. 2 is a schematic exploded structural view of a heat
sink device according to an embodiment of the disclosure;
[0016] FIG. 3 is a schematic exploded structural view of an air
flow adjusting frame according to an embodiment of the
disclosure;
[0017] FIG. 4 is a schematic view of an air flow of a heat sink
device according to an embodiment of the disclosure;
[0018] FIG. 5 is a schematic exploded structural view of an air
flow adjusting frame according to another embodiment of the
disclosure;
[0019] FIG. 6 is a schematic exploded structural view of an air
flow adjusting frame according to another embodiment of the
disclosure;
[0020] FIG. 7 is a schematic exploded structural view of an air
flow adjusting frame according to another embodiment of the
disclosure; and
[0021] FIG. 8 is a schematic structural view of a heat sink device
according to anther embodiment of the disclosure.
DETAILED DESCRIPTION
[0022] FIG. 1 is a schematic structural view of a heat sink device
according to an embodiment of the disclosure, and FIG. 2 is a
schematic exploded structural view of a heat sink device according
to an embodiment of the disclosure.
[0023] As shown in FIG. 1 and FIG. 2, the heat sink device 10 of
this embodiment is used to dissipate heat generated from an
electronic device 20. The electronic device 20 is, but not limited
to, a graphics card used inside a computer. For example, the
electronic device 20 may also be a main board inside the computer.
The electronic device 20 comprises a circuit board 22 and a heat
source 21 located on the circuit board 22. The heat source 21 may
be a computing chip, for example, a central processing unit (CPU)
or graphics chip.
[0024] The heat sink device 10 of this embodiment comprises a heat
dissipation fin 200, two air flow adjusting frames 100 and a fan
300. The heat dissipation fin 200 has a first side 201 facing the
heat source 21 and a second side 202 opposite to the first side
201. The fan 300 is disposed on the second side 202 of the heat
dissipation fin 200, and the fan 300 has an air outlet 310 and an
air inlet 320 opposite to the air outlet 310. In this embodiment,
the air outlet 310 faces the heat dissipation fin 200, and the air
inlet 320 is opposite to the heat dissipation fin 200. It should be
noted that, the position of the air outlet 310 and the air inlet
320 relative to the heat dissipation fin 200 is not intended to
limit the disclosure. In some embodiments, the air outlet 310 may
be opposite to the heat dissipation fin 200, and the air inlet 320
may face the heat dissipation fin 200.
[0025] The air flow adjusting frame 100 of this embodiment is fixed
to the heat dissipation fin 200 and the fan 300 respectively for
changing an air flow angle of the fan 300 relative to the heat
dissipation fin 200. The fan 300 may be pivoted relative to the
heat dissipation fin 200 due to the air flow adjusting frame 100,
so as to adjust an angle of the air outlet 310 of the fan 300 to
the heat dissipation fin 200. Moreover, the pivoting direction of
the fan 300 relative to the heat sink fin 200 is parallel to the
long side of the electronic device 20, but above pivoting direction
of the fan 300 is not intended to limit this disclosure. People
skilled in the art can adjust the pivoting direction of the fan 300
relative to the heat dissipation fin 200 according to actual
requirements. For example, in embodiments, the pivoting direction
of the fan 300 relative to the heat dissipation fin 200 may be
parallel to the short side of the electronic device 20, as shown in
FIG. 8.
[0026] The second side 202 of the heat dissipation fin 200 has a
cone-like protruding structure, and the central portion of the
second side 202 is higher than two opposite ends of the second side
202. Thus, when the fan 300 pivots an angle relative to the heat
dissipation fin 200, the collision and interference of the fan 300
and the heat dissipation fin 200 are avoided.
[0027] It should be noted that, in the heat sink device 10 of this
embodiment, the heat dissipation fin 200 is connected to the fan
300 through two air flow adjusting frames 100, but the number of
the air flow adjusting frame 100 is not intended to limit the
disclosure. In another embodiment of the disclosure, the heat sink
device 10 may also have only one air flow adjusting frame 100 to
connect the heat dissipation fin 200 with the fan 300.
[0028] FIG. 3 is a schematic exploded structural view of an air
flow adjusting frame according to an embodiment of the
disclosure.
[0029] As shown in FIG. 3 and FIG. 2, the air flow adjusting frame
100 of this embodiment comprises a first fixing plate 110 and a
second fixing plate 120. The air flow adjusting frame 100 further
comprises a pivot 140 and a holding plate 130. The first fixing
plate 110 and the second fixing plate 120 are pivoted to each other
through the pivot 140. The first fixing plate 110 is fixed to the
heat dissipation fin 200, and the second fixing plate 120 and the
holding plate 130 are combined together. The pivot 140 may be a
damping pivot, so that the second fixing plate 120 is able to pivot
relative to the first fixing plate 110 to a position desirable for
a user and remain in such position.
[0030] The first fixing plate 110 of this embodiment has two fixing
holes 112, and the first fixing plate 110 is fastened on the heat
dissipation fin 200 through two locking members 111 penetrating the
two fixing holes 112. The fixing hole 112 may be, but not limited
to, a screw hole, and the locking member 111 may be, but not
limited to, a screw.
[0031] The holding plate 130 comprises a body 1301 and two fixing
portions 134 located at two opposite ends of the body 1301. The
body 1301 has two fixing holes 133 thereon, and the second fixing
plate 120 has two fixing holes 122. In the air flow adjusting frame
100, holding plate 130 and the second fixing plate 120 are combined
together through two locking members 121 penetrating the fixing
hole 133 and the fixing hole 122. The fixing hole 122 and the
fixing holes 133 may be, but not limited to, a through hole, and
the locking member 121 may be, but not limited to, a rivet. The two
fixing portions 134 of the holding plate 130 each have a fixing
hole 132, and the air flow adjusting frame 100 is fastened on the
fan 300 through the two locking members 131 penetrating the fixing
hole 132 so that the fan 300 and the air flow adjusting frame 100
are combined together.
[0032] The distance between the two fixing portions 134 of the
holding plate 130 is designed according to the size of the fan 300.
A holding plate 130 with greater interval between the two fixing
portions 134 will be used, when the fan 300 is big. On the other
hand, another holding plate 130 with smaller interval between the
two fixing portions 134 will be used, when the fan 300 is small.
That is, the holding plates 130 having different intervals between
the two fixing portions 134 may be prepared to cooperate with fans
300 of various sizes.
[0033] It should be noted that, the above air flow adjusting frame
100 having the holding plate 130 is not intended to limit the
disclosure. In some embodiments, the air flow adjusting frame 100
does not have any holding plate 130, and the second fixing plate
120 are directly combined to the fan 300.
[0034] FIG. 4 is a schematic view of an air flow of a heat sink
device according to an embodiment of the disclosure. As shown in
FIG. 4, in this embodiment, the circuit board 22 is horizontally
disposed. The fan 300 of this embodiment is able to pivot relative
to the heat dissipation fin 200 due to the air flow adjusting frame
100, so that an angle .theta. is formed between a side face of the
fan 300 having the air outlet 310 and a horizontal plane.
Furthermore, the angle .theta. is an acute angle. In other words,
an acute angle is formed between the side of the fan 300 having the
air outlet 310 and the circuit board 22, so that an incident angle
from the air flow path, generated by the fan 300, to the circuit
board 22 is an acute angle rather than a right angle. When the air
flow blows from the air outlet 310 to the heat source 21 and hits
the circuit board 22, the air flow rebounds off the circuit board
22 at an acute emergent angle because of the acute incident angle
from the air flow path to the circuit board 22. Thus, the
interference between the air flow rebounded by the circuit board 22
and the air flow generated by the fan 300 is avoided. The turbulent
flow between the fan 300 and the circuit board 22 is then reduced,
thereby the heat dissipation ability is improved. Therefore,
according to the heat sink device 100 of this embodiment, the
pivoting angle of the fan 300 relative to the heat dissipation fin
200 may be adjusted according to various heat sink conditions, so
as to enable the heat sink device 100 to achieve the optimal heat
dissipation ability.
[0035] The heat-dissipation structure 10 of this embodiment further
has a heat conducting plate 210 and a plurality of heat conducting
pipes 220, such as heat pipes. The heat conducting plate 210 is
thermally contacted with the heat source 21, and the heat
conducting pipe 220 is connected to the heat conducting plate 210
and the heat dissipation fin 200. The heat conducting plate 210
absorbs the heat from the heat source 21 and transfers the heat to
the heat dissipation fin 200 through the heat conducting pipes 220.
It should be noted that, in some embodiments, the heat dissipation
fin 200 may also be directly formed on the heat conducting plate
210.
[0036] FIG. 5 is a schematic exploded structural view of an air
flow adjusting frame according to another embodiment of the
disclosure. As this embodiment has the similar structure of the
embodiment in FIG. 3, the same parts will not be repeated
herein.
[0037] As shown in FIG. 5 together with FIG. 2, the holding plate
130 comprises a body 1301 and two fixing portions 134 located at
two opposite ends of the body 1301. The fixing portions 134 and the
body 1301 are independent members. The body 1301 has two slots 137,
and each fixing portion 134 further has a fixing hole 1341
corresponding to one slot 137. The fixing portion 134 is fastened
to the body 1301 through a locking member 135 penetrating the slot
137 and the fixing hole 1341. Furthermore, the slot 137 is an
elongated slot, and the position of the fixing portion 134 relative
to the body 1301 may be changed with the displacement of fixing
portion 134 along the slot 137. Therefore, by changing the
positions of the two fixing portion 134 fixed to the body 1301 to
adjust the distance between the two fixing portions 134, the
distance between the two fixing portions 134 may be adjusted so
that the holding plate 130 can cooperate with various sizes of fans
300.
[0038] FIG. 6 is a schematic exploded structural view of an air
flow adjusting frame according to another embodiment of the present
disclosure. As this embodiment has the similar structure of the
embodiment in FIG. 3, the same parts will not be repeated
herein.
[0039] As shown in FIG. 6 and FIG. 2, the air flow adjusting frame
100 of this embodiment comprises a first fixing plate 110 and a
second fixing plate 120. The air flow adjusting frame 100 further
comprises a pivot 140 and a holding plate 130.
[0040] The holding plate 130 comprises a body 1301 and two fixing
portions 134 located at two opposite ends of the body 1301. The
body 1301 has two slots 138, and two fixing holes 122 of the second
fixing plate 120 correspond to the slots 138. The holding plate 130
is fastened on the second fixing plate 120 through the locking
member 121 penetrating the slot 138 and the fixing hole 122.
Furthermore, the slot 138 is an elongated slot in the horizontal
direction, and the position of second fixing plate 120 relative to
the slot 138 may be changed with the displacement of the holding
plate 130. Therefore, by changing the relative position of the
second fixing plate 120 with respect to the holding plate 130, the
displacement of the fan 300 relative to the heat dissipation fin
200 in the horizontal direction is adjusted to achieve the optimal
heat dissipation effect of the heat sink device 10.
[0041] FIG. 7 is a schematic exploded structural view of an air
flow adjusting frame according to another embodiment of the
disclosure. As this embodiment has the similar structure of the
embodiment in FIG. 3, the same parts will not be repeated
herein.
[0042] As shown in FIG. 7 and FIG. 2, the air flow adjusting frame
100 of this embodiment comprises a first fixing plate 110 and a
second fixing plate 120. The air flow adjusting frame 100 further
comprises a pivot 140 and a holding plate 130.
[0043] The holding plate 130 comprises a body 1301 and two fixing
portions 134 located at two opposite ends of the body 1301. The
body 1301 has two slots 139, and the two fixing holes 122 of the
second fixing plate 120 correspond to the slots 139. The holding
plate 130 is fastened to the second fixing plate 120 by the locking
members 121 penetrating the slots 139 and the fixing holes 122.
Furthermore, the slot 139 is an elongated slot in the vertical
direction, and the position of the second fixing plate 120 relative
to the holding plate 130 may be changed with the displacement of
the second fixing plate 120 along the slot 139. Therefore, by
changing the relative position of the second fixing plate 120 and
the holding plate 130, the displacement of the fan 300 relative to
the heat dissipation fin 200 in the vertical direction is adjusted
achieve the optimal heat dissipation effect of the heat sink device
10.
[0044] According to the heat sink device and the air flow adjusting
frame for the heat sink device of above embodiments, the fan is
enabled to pivot relative to the heat dissipation fin to adjust the
air flow angle of the fan due to the air flow adjusting frame.
Thus, the problems including the air flow path generated by the fan
being perpendicular to the circuit board, the collision of the air
flow generated by the fan and the air flow rebounded off the
circuit board, and the turbulent flow generated between the fan and
the circuit board may be prevented. Therefore, due to the design of
the air flow adjusting frame of above embodiments, the turbulent
flow between the fan and the circuit board can be reduced, thereby
the heat dissipation effect of the heat sink device is improved and
the work load of the fan is reduced.
* * * * *