U.S. patent application number 13/472974 was filed with the patent office on 2012-11-22 for heat dissipation apparatus and outdoor communication device.
This patent application is currently assigned to Huawei Technologies Co., Ltd.. Invention is credited to Taqing Feng, Hui Lin.
Application Number | 20120291990 13/472974 |
Document ID | / |
Family ID | 44662853 |
Filed Date | 2012-11-22 |
United States Patent
Application |
20120291990 |
Kind Code |
A1 |
Lin; Hui ; et al. |
November 22, 2012 |
HEAT DISSIPATION APPARATUS AND OUTDOOR COMMUNICATION DEVICE
Abstract
A heat dissipation apparatus comprises: one or more thermosiphon
heat exchange units, one or more first partitions, and a frame
having at least two lattices; wherein, each of the one or more
thermosiphon heat exchange units is embedded in one lattice of the
at least two lattices; each lattice of the at least two lattices
having no thermosiphon heat exchange unit embedded is disposed with
the first partition to partition the lattice into an upper portion
and a lower portion, where the first partition is detachable. The
outdoor communication device comprises the heat dissipation
apparatus and one or more service board. Through a modular design,
the number of the embedded thermosiphon heat exchange units can be
increased or decreased at any time depending on heat dissipation
performance that is required.
Inventors: |
Lin; Hui; (Shenzhen, CN)
; Feng; Taqing; (Shenzhen, CN) |
Assignee: |
Huawei Technologies Co.,
Ltd.
Shenzhen
CN
|
Family ID: |
44662853 |
Appl. No.: |
13/472974 |
Filed: |
May 16, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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PCT/CN2011/074103 |
May 16, 2011 |
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13472974 |
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Current U.S.
Class: |
165/67 |
Current CPC
Class: |
F28D 15/0266 20130101;
H05K 7/206 20130101 |
Class at
Publication: |
165/67 |
International
Class: |
F28F 9/007 20060101
F28F009/007 |
Claims
1. A heat dissipation apparatus, comprising: one or more
thermosiphon heat exchange units; one or more first partitions; and
a frame having at least two lattices; wherein each of the one or
more thermosiphon heat exchange units is embedded in one lattice of
the at least two lattices, and wherein each lattice of the at least
two lattices having no thermosiphon heat exchange unit embedded
therein is disposed with one of the one or more first partitions to
partition the lattice into an upper portion and a lower portion,
wherein the first partition is detachable.
2. The heat dissipation apparatus according to claim 1, wherein the
upper portion of the lattice is a first half lattice, and the lower
portion is a second half lattice; and where in the heat dissipation
apparatus further comprises: one or more fan units; wherein, each
fan unit of the one or more fan units is embedded in the first half
lattice or the second half lattice.
3. The heat dissipation apparatus according to claim 1, wherein the
thermosiphon heat exchange unit comprises: a condensation end
collection pipe in the upper portion of the thermosiphon heat
exchange unit; a vapor end collection pipe in the lower portion of
the thermosiphon heat exchange unit; at least two cooling tubules,
which are connected to the vapor end collection pipe and the
condensation end collection pipe; cooling fins evenly distributed
between alternating cooling tubules; and a second partition that
partitions the thermosiphon heat exchange unit into an upper
portion and a lower portion; wherein refrigerant is accommodated in
the vapor end collection pipe, the condensation end collection
pipe, and the cooling tubules.
4. The heat dissipation apparatus according to claim 3, wherein the
refrigerant comprises at least one of: ammonia, acetone, and R134A
type refrigerant.
5. The heat dissipation apparatus according to claim 1, wherein the
lattices and the thermosiphon heat exchange units have a same
shape.
6. The heat dissipation apparatus according to claim 2, wherein the
lattices and the thermosiphon heat exchange units have a same
shape.
7. The heat dissipation apparatus according to claim 3, wherein the
lattices and the thermosiphon heat exchange units have a same
shape.
8. The heat dissipation apparatus according to claim 4, wherein the
lattices and the thermosiphon heat exchange units have a same
shape.
9. The heat dissipation apparatus according to claim 2, wherein:
the lattices, the thermosiphon heat exchange units, and the fan
units are all rectangular in shape, a width of the fan units is
equal to a width of the lattices and the thermosiphon heat exchange
units, a height of the fan units is half of a height of the
lattices and the thermosiphon heat exchange units.
10. An outdoor communication device comprising: a heat dissipation
apparatus; and one or more service boards; wherein, the heat
dissipation apparatus further comprises: one or more thermosiphon
heat exchange units, one or more first partitions, and a frame
having at least two lattices; wherein: each of the one or more
thermosiphon heat exchange units is embedded in one lattice of the
at least two lattices, each lattice of the at least two lattices
having no thermosiphon h eat exchange unit embedded is disposed
with the first partition to partition the lattice into an upper
portion and a lower portion, the first partition is detachable, and
a number of the thermosiphon heat exchange units is determined
according to a number of the one or more service boards.
11. The outdoor communication device according to claim 10, wherein
the upper portion of the lattice is a first half lattice, and the
lower portion is a second half lattice; wherein the outdoor
communication device further comprises: one or more fan units;
wherein each fan unit of the one or more fan units is embedded in
the first half lattice or the second half lattice.
12. The outdoor communication device according to claim 10, wherein
the thermosiphon heat exchange unit comprises: a condensation end
collection pipe in the upper portion of the thermosiphon heat
exchange unit; a vapor end collection pipe in the lower portion of
the thermosiphon heat exchange unit; at least two cooling tubules,
which are connected to the vapor end collection pipe and the
condensation end collection pipe; cooling fins evenly distributed
between alternating cooling tubules; and a second partition
partitioning the thermosiphon heat exchange unit into an upper
portion and a lower portion; wherein refrigerant is accommodated in
the vapor end collection pipe, the condensation end collection
pipe, and the cooling tubules.
13. The outdoor communication device according to claim 12, wherein
the refrigerant comprises at least on of: ammonia, acetone, or
R134A type refrigerant.
14. The outdoor communication device according to claim 10, wherein
the lattices and the thermosiphon heat exchange units have a same
shape.
15. The outdoor communication device according to claim 11, wherein
the lattices and the thermosiphon heat exchange units have a same
shape.
16. The outdoor communication device according to claim 12, wherein
the lattices and the thermosiphon heat exchange units have a same
shape.
17. The outdoor communication device according to claim 13, wherein
the lattices and the thermosiphon heat exchange units have a same
shape.
18. The outdoor communication device according to claim 11,
wherein: the lattices, the thermosiphon heat exchange units, and
the fan units are all rectangular in shape; a width of the fan
units is equal to a width of the lattices and the thermosiphon heat
exchange units; and a height of the fan units is half of a height
of the lattices and the thermosiphon heat exchange units.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of International
Application No. PCT/CN2011/074103, filed on May 16, 2011, which is
hereby incorporated by reference in its entirety.
TECHNICAL FIELD
[0002] The present application relates to heat exchange techniques,
and more specifically, to a heat dissipation apparatus and an
outdoor communication device.
DESCRIPTION OF THE RELATED ART
[0003] In communication networks, there are a large number of
outdoor communication devices arranged in open fields, for example,
large power cabinets of communication base stations. Because these
outdoor communication devices produce heat in their operation, and
they can only operate appropriately in a certain range of
temperatures, heat dissipation apparatus must be disposed for these
outdoor communication devices.
[0004] FIG. 1 is a schematic structure diagram of a heat
dissipation apparatus in the prior art. As shown in FIG. 1, the
heat dissipation apparatus comprises: an internal circulation heat
exchange unit, an external circulation heat exchange unit, a vapor
rising pipe, a liquid dropping pipe, an internal circulation fan,
an external circulation fan, and air passage partitions. Wherein
the internal circulation heat exchange unit, the external
circulation heat exchange unit, the vapor rising pipe, and the
liquid dropping pipe are communicated internally and accommodate
refrigerant therein. In the design of the heat dissipation
apparatus described above, it is needed to design the heat
dissipation performance of the internal circulation heat exchange
unit and the external circulation heat exchange unit and the
performance of the internal circulation fan and the external
circulation fan according to the working powers and operation
conditions of the outdoor communication device. After the
development of a heat dissipation apparatus has been completed, its
heat dissipation performance is fixed.
[0005] When constructing communication networks, operators provide
corresponding numbers of service boards in their outdoor
communication devices according to their service demands, and
always preserve some spare slots for service board arrangement.
After the original construction of communication networks, dilation
in communication networks is needed with the increase of service
demands, thus, additional service boards may be inserted in the
above spare slots to realize update of outdoor communication
devices. After update, there may be a change in the working power
of an outdoor communication device, as a result, a heat dissipation
apparatus provided in the original construction of a communication
network may be no longer suitable for the updated outdoor
communication device. Presently, in the design of a heat
dissipation apparatus, if the probability of sequential updates of
an outdoor communication device is considered, the heat dissipation
apparatus has to be designed according to the working power when a
maximum number of service boards are provided for the outdoor
communication device, thereby, manufacturing cost may increase, and
there may be a waste in cost if the outdoor communication device is
not provided with a maximum number of service boards. However, if a
heat dissipation apparatus is provided only according to the
working power of an outdoor communication device specified in the
original communication network construction, if a update is needed
for the outdoor communication device later, the outdoor
communication device must be replaced as a whole, leading to a
larger waste in cost. In summary, the existing heat dissipation
apparatus can not be updated synchronization with outdoor
communication devices, leading to waste in production cost of
outdoor communication devices.
SUMMARY OF THE APPLICATION
[0006] A heat dissipation apparatus is provided in one embodiment
for addressing defects in the prior art and lowering manufacturing
cost.
[0007] An outdoor communication device is provided in one
embodiment for addressing defects in the prior art and lowering
manufacturing cost.
[0008] A heat dissipation device is further provided in one
embodiment and comprises: one or more thermosiphon heat exchange
units, one or more first partitions, and a frame having at least
two lattices; wherein
[0009] each of the one or more thermosiphon heat exchange units is
embedded in one lattice of the at least two lattices;
[0010] each lattice of the at least two lattices having no
thermosiphon heat exchange unit embedded is disposed with the first
partition to partition the lattice into an upper portion and a
lower portion, wherein the first partition is detachable.
[0011] An outdoor communication device comprising the above heat
dissipation apparatus is further provided in one embodiment and the
outdoor communication device comprises: one or more service boards;
wherein,
[0012] the number of the thermosiphon heat exchange units is
determined according to the number of the service boards.
[0013] From the above technical solution, it can be seen that, in
embodiments, through modular design, the frame of a heat
dissipation apparatus may have a plurality of lattices in each of
which a thermosiphon heat exchange unit can be embedded, the number
of the embedded thermosiphon heat exchange units can be increased
or decreased at any time depending on heat dissipation performance
that is required, the synchronized update of the heat dissipation
apparatus with the device where the heat dissipation apparatus is
disposed can be implemented, a waste in cost caused when the heat
dissipation apparatus is designed according to its maximum required
heat dissipation performance can be avoided, and manufacturing cost
can be saved. Furthermore, the heat dissipation apparatus is
plug-and-play, which may facilitate mount and maintenance, and the
update requirement of devices can be met.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] For a more explicit description of technical solutions of
embodiments or the prior art, a brief introduction of accompanying
drawings to be used in the description of these embodiments and the
prior art will be given below. Obviously, accompanying drawings
described below are merely some embodiments, for those skilled in
the art, other accompanying drawings can be derived from these ones
without any creative efforts.
[0015] FIG. 1 is a schematic structural diagram of an existing heat
dissipation apparatus;
[0016] FIG. 2 is a schematic structural diagram of an unassembled
heat dissipation apparatus according to Embodiment 1;
[0017] FIG. 3 is a schematic structural diagram of a thermosiphon
heat exchange unit according to Embodiment 2;
[0018] FIG. 4 is a schematic structural diagram of an assembled
heat dissipation apparatus according to Embodiment 3.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0019] For a better clarity of objects, technical solutions, and
advantages of the embodiments, a clear and complete description of
technical solutions of embodiments will be given in connection with
accompanying drawings of those embodiments. Obviously, embodiments
described herein are merely some embodiments, but not all of them.
Based on those embodiments, other embodiments can occur to those
skilled in the art without any creative efforts, all of which fall
within the scope claims.
[0020] FIG. 2 is a schematic structural diagram of an unassembled
heat dissipation apparatus according to Embodiment 1. As shown in
FIG. 2, the heat dissipation apparatus at least comprises: one or
more thermosiphon heat exchange units 1, one or more first
partitions 2, and a frame 3 having at least two lattices.
Particularly, each of the one or more thermosiphon heat exchange
units 1 is embedded in one lattice of the at least two lattices.
Each lattice of the at least two lattices having no thermosiphon
heat exchange unit 1 embedded is disposed with the first partition
2 to partition the lattice into an upper portion and a lower
portion, where the first partition 2 is detachable.
[0021] Based on the above technical solution, the heat dissipation
apparatus may further comprise: at least a fan unit 4.
Particularly, each fan unit 4 is embedded in a half lattice
constructed by the frame 3 and a first partition 2.
[0022] Hereinafter, through Embodiment 2, a detail description will
be given for the thermosiphon heat exchange unit 1 of the above
technical solution.
[0023] FIG. 3 is a schematic structural diagram of a thermosiphon
heat exchange unit according to Embodiment 2. In the Embodiment 2,
the thermosiphon heat exchange unit 1 is an enhanced heat exchange
fin type thermosiphon tube. As shown in FIG. 3, each of the one or
more thermosiphon heat exchange units 1 comprises: a condensation
end collection pipe 11 in the upper portion of the thermosiphon
heat exchange unit, a vapor end collection pipe 12 in the lower
portion of the thermosiphon heat exchange unit, at least two
cooling tubules 13 which are connected to the vapor end collection
pipe 12 and the condensation end collection pipe 11, cooling fins
14 evenly distributed between every two cooling tubules 13, and a
second partition 15 partitioning the thermosiphon heat exchange
unit 1 into an upper portion and a lower portion.
[0024] The cooling fins 14 described above may have various shapes,
preferably, the cooling fins 14 described above are ripple-shaped
cooling fins.
[0025] Refrigerant is accommodated in the vapor end collection pipe
12, condensation end collection pipe 11, and cooling tubules 13.
Particularly, the refrigerant may be, but not limit to, any one of
the following materials: ammonia, acetone, or R134A type
refrigerant.
[0026] The thermosiphon heat exchange unit 1 is portioned by the
second partition 15. The lower portion of the partitioned
thermosiphon heat exchange unit 1 comprises the vapor end
collection pipe 12 and the lower portion of each cooling tubule 13,
which is arranged in an internal circulation air passage to contact
with the heat air produced by a device where the heat dissipation
apparatus is provided. In the cooling tubules 13 at the lower
portion, liquid refrigerant makes heat exchange with heat air, the
refrigerant absorbing heat and then turning into vapor through
vaporization. The vapor rises into the upper portion of the
thermosiphon heat exchange unit 1 that is portioned along the
cooling tubules 13. The portioned upper portion of the thermosiphon
heat exchange unit 1 comprises the condensation end collection pipe
11 and the upper portion of each cooling tubule 13, which is
arranged in an external circulation air passage to contact with the
cool air outside of the heat dissipation apparatus. In the cooling
tubules 13 at the upper portion, refrigerant vapor makes heat
exchange with the cool air to disperse heat, and then returns into
liquid state through condensation. Liquid refrigerant flows
downward along the cooling tubules 13 due to gravity, returning to
the lower portion of the thermosiphon heat exchange unit 1 that is
portioned. Through such an interchanging circulation, heat in the
interior of the heat dissipation apparatus can be transmitted to
the outside to realize heat dissipation.
[0027] FIG. 4 is a schematic structural diagram of an assembled
heat dissipation apparatus according to Embodiment 3. In Embodiment
3, taking the assembly of a heat dissipation apparatus as an
example, the heat dissipation apparatus of Embodiment 1 is
assembled. As shown in FIG. 4, the heat dissipation apparatus
comprises: a frame 3 having 8 lattices, 2 thermosiphon heat
exchange units 1 and 6 first partitions 2. Wherein, the 2
thermosiphon heat exchange units 1 are embedded in a second and a
third lattices respectively. For each of other lattices having no
thermosiphon heat exchange units 1 embedded, a first partition 2 is
disposed therein to partition the lattice where the partition is
disposed into upper and lower portions. Furthermore, those first
partitions 2 are detachable.
[0028] In the assembled heat dissipation apparatus, a plurality of
lattices each are partitioned into upper and lower portions with a
plurality of first partitions 2. Wherein, the lower portion of all
of the lattices is arranged in an internal circulation air passage
to contact with heat air produced by a device where the heat
dissipation apparatus is located. The upper portion of all of the
lattices is arranged in an external circulation air passage to
contact cool air outside the heat dissipation apparatus. The
internal circulation air passage is isolated from the external
circulation air passage by a plurality of first partitions 2.
[0029] In practical applications, the number of the thermosiphon
heat exchange units 1 is determined according to required heat
dissipation performance. W hen the outdoor communication device
where the heat dissipation apparatus is located is updated, first
partitions 2 in lattices having no thermosiphon heat exchange units
1 embedded currently can be removed to embed new thermosiphon heat
exchange units 1, so that heat dissipation performance of the heat
dissipation apparatus can be improved. In Embodiment 3, only 2
thermosiphon heat exchange units 1 are provided as an example.
[0030] Furthermore, the number of fan units 4 also can be
determined according to required heat dissipation performance. When
it is required to improve heat dissipation performance, newly added
fan units 4 can be embedded in half lattices constructed by the
frame 3 and first partitions 2. Also, according to the strength of
air flow in the internal circulation air passage and the external
circulation air passage, the same number or different numbers of
fan units 4 can be disposed in the internal circulation air passage
and the external circulation air passage. When adding new fan units
4, it is possible to add new fan units 4 in merely one of the
internal circulation air passage and the external circulation air
passage if necessary. In Embodiment 3, only one fan unit 4 is
disposed in each of the internal circulation air passage and the
external circulation air passage as an exemple.
[0031] In Embodiment 3, preferably, the lattice, the thermosiphon
heat exchange unit 1 and the fan unit 4 are all rectangular.
Particularly, the lattice and the thermosiphon heat exchange unit
may have the same shape. The width of the fan unit 4 is equal to
the width of the lattice and the thermosiphon heat exchange unit 1,
the height of the fan unit 4 is half of the height of the lattice
and the thermosiphon heat exchange unit 1. In other embodiments,
the lattice, the thermosiphon heat exchange unit 1, and the fan
unit 4 may have other shapes.
[0032] The heat dissipation apparatus of any one of Embodiment 1 to
Embodiment 3 can be applied to an outdoor communication device.
Particularly, the outdoor communication device comprises the heat
dissipation apparatus and one or more service boards, the heat
dissipation apparatus being one mentioned in any one of Embodiment
1 to Embodiment 3. The number of the thermosiphon heat exchange
units in the heat dissipation apparatus can be determined according
to the number of the service boards. When the outdoor communication
device is updated, the number of the service boards may increase,
and additional heat dissipation apparatus may be added in the heat
dissipation apparatus correspondingly. Further, the number of the
fan units in the heat dissipation apparatus also can be determined
based on the number of the service boards. When the outdoor
communication device is updated, the number of the service boards
may increase, fan units may be added in the heat dissipation
apparatus correspondingly.
[0033] In Embodiment 1 to Embodiment 3, a modular design is
adopted, the frame of the heat dissipation apparatus has a
plurality of lattices in which a plurality of thermosiphon heat
exchange units can be embedded, the number of the embedded
thermosiphon heat exchange units can be increased or decreased at
any time depending on heat dissipation performance that is required
currently, the synchronized update of the heat dissipation
apparatus with the device where the heat dissipation apparatus is
disposed can be implemented, a waste in cost caused when the heat
dissipation apparatus is designed according to its maximum required
heat dissipation performance can be avoided, and manufacturing cost
can be saved. In addition, the heat dissipation apparatus is
plug-and-play, which may facilitate mount and maintenance, and the
update requirement of devices can be met.
[0034] Note that every method embodiment described above is
described with a combination of a series of actions, however, it
will be appreciated by those skilled in the art that this invention
do not limit to the action sequence described herein, as according
to this invention some steps can be carried out in other orders or
simultaneously. Secondly, those skilled in the art should
understand that the embodiments described in this specification are
all preferable embodiments, and actions or modules involved in
these embodiments are not necessarily needed by this invention.
[0035] In the above embodiments, each of them is emphasized
differently, so parts that are not detailed in one embodiment can
be found in the relative description of other embodiments.
[0036] Those ordinary skilled in the art may understand that all or
part steps of the above method embodiments can be implemented by
program instructions relevant hardware, the program described above
can be stored in a computer readable storage medium, which when
executed may perform steps contained in the above method
embodiments. The storage medium described above may comprise: ROM,
RAM, magnetic disks, optical disks and various mediums capable of
storing program codes.
[0037] At last, it should be noted that the above embodiments are
merely given to illustrate a technical solution that falls within
the scope of the claims and are not intended as limitations. Those
skilled in the art may appreciate that modifications to the
technical solution described in various embodiment or alternations
of its some parts can be made. Such modifications and alternations
are understood to fall within the scope of the claims.
* * * * *